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16A TRIACS
MAIN FEATURES:
Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 16 600, 700 and 800 10 to 50 Unit A V
G
A2
A1
A2
mA
A1 A2 G
DESCRIPTION Available either in through-hole or surface-mount packages, the BTA/BTB16 and T16 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers, ... The snubberless versions (BTA/BTB...W and T16 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734). ABSOLUTE MAXIMUM RATINGS
Symbol IT(RMS) RMS on-state current (full sine wave) Parameter
D2PAK (T16-G)
A2
A1 A2 G
A1 A2 G
TO-220AB (BTB16)
Value D2PAK TO-220AB Tc = 100C Tc = 85C t = 16.7 ms t = 20 ms 168 160 144 Tj = 125C Tj = 25C Tj = 125C Tj = 125C 50 VDRM/VRRM
+ 100
Unit A
16 A A s A/s V A W C 1/7
TO-220AB Ins. ITSM I t dI/dt Non repetitive surge peak on-state current (full cycle, Tj initial = 25C) It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns F = 60 Hz F = 50 Hz tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 s
VDSM/VRSM Non repetitive surge peak off-state voltage IGM PG(AV) Tstg Tj Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range
4 1 - 40 to + 150 - 40 to + 125
STANDARD (4 Quadrants)
Symbol Test Conditions Quadrant BTA/BTB16 C IGT (1) VD = 12 V VGT VGD IH (2) IL dV/dt (2) VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM gate open Tj = 125C Tj = 125C I - III - IV II MIN. MIN. RL = 3.3 k Tj = 125C RL = 33 I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. 25 40 80 200 5 25 50 1.3 0.2 50 60 120 400 10 V/s V/s B 50 100 mA V V mA mA Unit
STATIC CHARACTERISTICS
Symbol VTM (2) Vto (2) Rd (2) IDRM IRRM
Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1
Test Conditions ITM = 22.5 A tp = 380 s Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C MAX. MAX. MAX. MAX.
Unit V V m A mA
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Unit C/W
C/W
PRODUCT SELECTOR
Voltage(xxx) Part Number 600 V BTA/BTB16-xxxB BTA/BTB16-xxxBW BTA/BTB16-xxxC BTA/BTB16-xxxCW BTA/BTB16-xxxSW T1635-xxxG X X X X X X 700 V X X X X X 800 V X X X X X X 50 mA 50 mA 25 mA 35 mA 10 mA 35 mA Standard Snubberless Standard Snubberless Logic level Snubberless TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB DPAK Sensitivity Type Package
ORDERING INFORMATION
600
BW
(RG)
PACKING MODE Blank: Bulk RG: Tube
SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS C: 25mA STANDARD CW: 35mA SNUBBERLESS SW: 10mA LOGIC LEVEL
T 16 35
TRIAC SERIES CURRENT: 16A
600 G
PACKAGE: G: D2PAK
(-TR)
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OTHER INFORMATION
Part Number BTA/BTB16-xxxyz BTA/BTB16-xxxyzRG T1635-xxxG T1635-xxxG-TR Marking BTA/BTB16xxxyz BTA/BTB16-xxxyz T1635xxxG T1635xxxG Weight 2.3 g 2.3 g 1.5 g 1.5 g Base quantity 250 50 50 1000 Packing mode Bulk Tube Tube Tape & reel
Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle).
P (W)
Fig. 2-1: RMS on-state current versus case temperature (full cycle).
IT(RMS) (A) 18 16 14 12 10 8 6 4 2 0
BTB/T16
20 18 16 14 12 10 8 6 4 2 0
BTA
IT(RMS) (A)
0 2 4 6 8 10 12 14 16
Fig. 2-2: DPAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35 m), full cycle.
IT(RMS) (A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 Tamb(C) 50 75 100 125
D PAK 2 (S=1cm )
2
K=[Zth/Rth] 1E+0
Zth(j-c)
1E-1
Zth(j-a)
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Fig. 4: values)
ITM (A) 200
On-state
characteristics
(maximum
Tj max
100
10
Tj=25C
4.0
4.5
5.0
t=20ms
One cycle
Repetitive Tc=85C
Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of It.
ITSM (A), It (As) 3000
Tj initial=25C dI/dt limitation: 50A/s
Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C] 2.5 2.0
IGT
1000
1.5
IH & IL
ITSM
1.0 0.5
It
Fig. 8: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values).
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.1 1.0 (dV/dt)c (V/s) 10.0 100.0
B C SW
Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4
BW/CW/T1635
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Fig. 10:DPAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 m).
Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 16 S(cm) 20 24 28 32 36 40
D PAK
2
REF.
b2
L F I A
l4
a1
c2
l3
l2 a2
b1 e
M c1
A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M
15.20
15.90 0.598
13.00 14.00 0.511 0.551 10.00 10.40 0.393 0.409 0.61 0.88 0.024 0.034 1.23 1.32 0.048 0.051 4.40 4.60 0.173 0.181 0.49 0.70 0.019 0.027 2.40 2.72 0.094 0.107 2.40 2.70 0.094 0.106 6.20 6.60 0.244 0.259 3.75 3.85 0.147 0.151 15.80 16.40 16.80 0.622 0.646 0.661 2.65 2.95 0.104 0.116 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 2.60 0.102
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REF.
A A1 A2 B B2 C C2 D E G L L2 L3 R V2
4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0
1.40
0.40
0.169 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.048 0.055 0.60 0.017 0.024 1.36 0.047 0.054 9.35 0.352 0.368 10.28 0.393 0.405 5.28 0.192 0.208 15.85 0.590 0.624 1.40 0.050 0.055 1.75 0.055 0.069 0.016 8 0 8
10.30 1.30
5.08
3.70 8.90
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