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Physical Origins
and
Rate Equations
Chapter One
Sections 1.1 and 1.2
Meaning
Symbol
Units
Thermal Energy+
U or u
J or J/kg
Temperature
K or C
Heat Transfer
Heat
Heat Rate
Heat Flux
W/m 2
+
U Thermal energy of system
u Thermal energy per unit mass of system
q k T
Heat flux
W/m
Thermal conductivity
W/m K
Temperature gradient
C/m or K/m
qx k
qx k
T T
dT
k 2 1
dx
L
T1 T2
L
(1.2)
q h Ts T
h : Convection heat transfer coefficient (W/m 2 K)
(1.3a)
(1.5)
: Surface absorptivity 0 1
G : Irradiation W/m 2
(1.7)
h r Ts Tsur
qrad
qrad
h Ts T hr Ts Tsur
q qconv
(1.8)
(1.9)
(1.10)
Process Identification
Schematic:
qconv ,1
qrad ,1
qcond ,1
qconv ,s
qrad ,s
qcond ,2
qconv ,2
qrad ,2
qs
sur
= 25oC
A ir
S u b s tra te
q
ra d
C h ip , P e le c
o
T s = 8 5 C , = 0 . 6 0
= 25 C
h = 4 . 2 ( T s - )1 / 4
or
W /m 2 -K
L = 15 m m
conv
Assumptions: (1) Steady-state conditions, (2) Radiation exchange between a small surface and a large enclosure, (3)
Negligible heat transfer from sides of chip or from back of chip by conduction through the substrate.
Analysis:
A L2 = 0.015m =2.2510-4 m 2
2
60K
358 -298 K
4
5/4
=0.158W
=0.065W
Pelec 0.158W+0.065W=0.223W
(b) If heat transfer is by forced convection,