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TH97/2478
www.eicsemi.com
KBPC5000 - KBPC5010
IATF 0113686
SGS TH07/1033
0.728(18.50)
0.688(17.40)
FEATURES :
*
*
*
*
*
*
*
0.570 (14.50)
0.530(13.40)
0.210(5.30)
0.200(5.10)
0.658(16.70)
0.618(15.70)
0.256(6.50)
0.248(6.30)
0.032(0.81)
0.028(0.71)
0.100(2.50)
0.090(2.30)
1.011 (25.7)
0.893 (22.7)
MECHANICAL DATA :
*
*
*
*
*
1.130(28.70)
1.120(28.40)
0.685(16.70)
0.618(15.70)
0.443 (11.25)
0.431 (10.95)
RATING
SYMBOL
KBPC
KBPC
KBPC
KBPC
KBPC
KBPC
KBPC
5000
5001
5002
5004
5006
5008
5010
UNIT
VRRM
50
100
200
400
600
800
1000
VRMS
35
70
140
280
420
560
700
VDC
50
100
200
400
600
800
1000
IF(AV)
50
IFSM
400
It
660
AS
VF
1.1
Ta = 25 C
IR
10
Ta = 100 C
IR(H)
500
RJC
2.0
C/W
TJ
- 40 to + 150
TSTG
- 40 to + 150
Note :
( 1 ) Thermal resistance from Junction to Case with units mounted on a 9"x5"x4.6" (22.9x12.7x11.7 cm) Al-Finned Heatsink.
Page 1 of 2
TH09/2479
TH97/2478
www.eicsemi.com
IATF 0113686
SGS TH07/1033
60
HEAT-SINK MOUNTING, Tc
9" x 5" x 4.6" THK.
5 (22.9 x 12.75x 11.7cm)
5
50
Al.-Finned .
40
30
20
10
600
TJ = 50 C
500
400
300
8.3 ms SINGLE HALF SINE WAVE
JEDEC METHOD
200
100
0
0
25
50
75
100
125
150
175
10
20
40
60 100
CASE TEMPERATURE, ( C)
PER DIODE
PER DIODE
10
100
REVERSE CURRENT,
MICROAMPERES
TJ = 100 C
10
Pulse Width = 300 s
1 % Duty Cycle
1.0
1.0
0.1
TJ = 25 C
TJ = 25 C
0.1
0.01
0
20
40
60
80
100
120
140
0.6
0.8
1.0
1.2
1.4
1.6
1.8
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