2) United States Patent oy os) 3) wo ay @ 6s) @) (6) on (2) O'Dell et al AUTOMATED WAFER DE ‘STEM AND A PROCESS SUCT INSPECTION Inventors: Jeffrey O'Dell, Deephavea, MN (US): ‘Thomas Verburgt, Fen Prairie, MN (US); Mark Harless, New Hope, MN (US); Cory Watkins, Ramsey, MN (US) Assignee: Rudolph Technologies, Ine, Flanders, NUS) Notice: Subject to any disclaimer, the term ofthis pateat is extended or adjusted under 35 USC. 154(b) by 1451 days This patent is subject to a terminal dis- claims. Appl. Now 10915,666 Filed: Aug, 10,2004 Prior Publication Data US 200510008218 AI Jan, 13,2008 Related U.S. Application Data Continuation of application No, 09/562,273, filed on Apt. 29, 2000, now Pat, No. 6,826,298 Provisional application No. 601092,923, filed on Ju 1998, provisional application No. 60092,701, filed on Jal 14, 1998, Int. Cl. G06K 9700 (2006.01) GIN 21786 (200601), Gory 800 2006.01), us.cl. ‘382/149; 250/559.39 US00: y7729828B2, (10) Patent No. 4s) Date of Patent: US 7,729,528 B2 jun. 1, 2010 (58) Fleld of Classification Search 382/141, 382/145, 147, 148, 149, 181: 348/87, 126: 356/237, 237.4, 297.5; 438/16, 250/559.39 ‘See application ile for complete search history 66) References Cited US. PATENT DOCUMENTS 3963351 A 1976 Feldimanet a 4098 71977 Belleson st al SIBLS03 A 1197S Takemats ta (Continved) FOREIGN PATENT DOCUMENTS (Continved) OTHER PUBLICATIONS “NSA Markt Specifications and Top Pten- 5.1996), (Continved) August Technology tl Customers? 5 pas (S Primary Exaniner—loba B Stroge (74) Attorney, Agent, or Firm—Dicke, Billig & Czaja, PLLC on ABSTRACT Anautomated defect inspection systembasbeeninventedand js used on pattemed wafers, whole wafers, broken wales, partial wafers, sawn wafers such as on film frames, IEDEC trays, Auer boas, die in gel or walle packs, MCMSs, et. and ‘specifically intended and designed for second optical wafer inspection for such defects a8 metalzation defoets (such as scratches, voids, cormsion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation Sefects, chips and cracks from sawing, solder bump defects, ‘nd bond pad area defects, 53 Claims, 19 Drawing Sheets tUS 7,729,528 B2 Page? US. PATENT DOCUMENTS 5200.98. 31904 wane SBS A Yt Mime A tom Satine dt SON A 308s Seine ‘isco Tow ltea Satouns A Mowe tenet $2538 4 Sion Sr Sings A Sins ONS Ghigo A tibet Kon Seas 4 ile ee 4 ise Sere se eas Sans Aber seat seman A Sui SBI A TRE eta eeaaalA fee Sees 4h 18s sacle psa 8 — $S5tui0 A ‘Spne Strane sa a in Seige A gions Stes ssn A eran Sega A ‘Tipe Chaiikcal ee ence Sete A iow Santina Seime A farad $800 Aiba Eau eee aoe SG A Biber eal soos 4 Sa tg 4 ise Same on ected Shaao A Sipe omcnbecal Sons A Nae tami Ade teat fe sme Sie A Sib boas i cane GSI A Abe Bann SIS by ‘hee $3980 4 Lipp Sarat Sot BE cae Gaomant a 21900 Stnesvom ea oa Sanka (elo 4 ibe Baeie san Bt Palencia Stones Hoot See voRHIG parts DOCUMENTS $5,088,178 A 10/1991 Ray i aes oe 5,076,692 A 12/1991 Neukermans et al. PR CMOSRIIS Sloss 5.085.517 A 2/1992 Chadwick et al PR 04104043 411992 Bios dig Geet : Cie i882 $Beon A TBE AS ®nois— ibee Stine 2 Tp. Bachdere a ois puntacations Ss Sie) wena! gut Techy S440 tomer lef pe Sines a “inbos Goa sarin! Epa tar STUS 7,729,528 B2 Page 3 Photonics. Systems Group Automation ‘Technology Division ‘SIMTeh Technical Report (ADOUOSSPS) “Development of Auto ‘mated Wafer Bump Inspection Technolog” 7 pgs. (200). BB. Weiner etal. “Tnprovemont in Accuracy and Speed Using the Time-of- Transition Method and Dynamic Image Anal stsfor Parte Sing” 1 ps (198). Inspection, Metrology and Data Analysis Sluis for Wafer Mami- ‘curing and Final Processing. "august Technolo) Inraduces Ao ‘mated 2 Opslal Wafer & Die Inspection Syste.” Lp, San Jose CA (sl 16,1997. Yasuyuki Wakisaka etal, "Speci! Inrodueton of New Proce and ‘New Materials nd Semiconductor Manufacturing Desice Wer Pat tern Inspection Device Tnspectra™ pp 10-110 (Mar 1996). Sold State Techwology, "Sold State'Workwide Semiconductor Production, A Penal Publication, & x, (i. 1993) IECON'91, 1991 Intemational Cofereneon Industrial Electronics Control and Instunentation, “Computer Bosed Wafer Inspection System 9 pgs. Oct. 28Now | 1991). Sold Stte Technology, “Solid Sot, Automated Optical Inypection and Test of Aerie Matrix Liguid Crystal Arays"6 pas. (ABS 1995) (Camis Li's Prior Ax Statement US. Dstt Court, Distt of Minnesota, Case No.08-C 1396 (MU AJB) 48 ps7, 2008) Pang Inventory for Case No, 05-CV-1396 a8 OF Aug 1%, 2006, Pleading Index No. I Uyough Pleading Index No.1 Using items 241 Drala, tha, “ae inspecton past presen and fre” Elston fey Manufacture & Test pp. 21-24 (Ma 1990), Drala John and Hof, John, “Auomatic clascation of defect in semiconductor devees® SPIE vel 1261 Iterated Cuct Metol- ‘gy. Inspection, and Process Control IV. 173-182 (199), ‘Complain led inthe United Stats Distrito for the Distrito Minnesota on ul 13, 2008, Civil Action No. 0.08<¥-01396. August Technolog Corporation ¥. Camtek Li, Plaats Com Plait, ls Fl 18, 2005 5 pax August Tectnologs Corporation v. Camo Lud. Exhibit A to Com- att, fil ul. 14, 2005, ps “August Tedbolog Corporation. Comet Lid. Canek L's Responses and Objections to August Technology Coyp's Fist Set of Requests for Production of Documents and Thingy fied Oct. 28, 2005513 pa August Tctnology Corporation v. Comte Ld. fondant Carte ts Responves aed Objections to Aust Techaslgy Corp's Fis Set of Incrogatories le Oct. 28,2005, [4 ps. August Tecnology Corporation x: Canick Fi. Memorandum & ‘Oates, fled Dow 2.2008 pe Auguct Technology Conporation v. Camk Ltd. Defendant's Responses to Piss Fit Set of Inlerogtoie, led De. 19. 2008.0 pas gas ‘Technology Conporation \. Camel Lid, Defendant's Responses to Plas Fst Set of Requests forthe Production of| Documents and Things, Hed Dec. 1, 2008; 14 pes “Agu Technology Corporation v Came Lid, Answer and Coin tela of Camisk Lid in Response to Complaint of August Tech- nology Corporation, Hd Dee. 222005: 9 ps. “august Technolog Corporaiion x. Camtek Li Pils Responses to Defendant's Fst Request forthe Prodtion of Doct ments ad Things led Jan 6, 2006, 20 pas August Tecbnology Corporion v. Camtek Lad, Plants Responses fo Defendant's Fist Set of Introgatores, filed Jan. 6, 2006: 6 pss “Augie Technolog Corporation w. Cane 1 iis Reply 10 ‘Counterclaim, fied an, 2006: 3 pas August ecology Corporation CamtekLid Canis’ s Responses “ant Objection to August's Second st of Requests for Production (Sos. 18.3) file Apr 3, 2006 16 ps. “August Technology Corporation Cams id, Crte&' Opposi tion t August's Motion to Compel Discovery ed Ape 6, 2006, 15 es Agus Technolog Corporation Camiek Lid. Amented Complaint “ant ry Deman and Exhibit fe Ape 12,2006; 37 pas August Technolog Corporation v. Camtok Lud Aner and Coun terlaim of Camick Luin Response to Amended Complaint of ‘August Techaology Compoation and Rudolph Techalogies, In Sie May 12006511 pes August Teknolo Corporation. Camtek Lud, Piatt Reply to Defendant's Counterclaim led May 24,2006; pe August Technology Corporation v.Comtek Ld, Ags Responses to Defendant's Second Request to August Testnologies forthe Pro- ‘lution of Documents and Things (Nos 41-93) le un. 14,2006, 22 pgs. “August Technology Corporation. Camtek Ltd, Rudolph’ Responses to Defendants Fst Request o Rup Txholo gies for the Prdetion of Documents and Things (Nos. 190) fied an 2006; 35 pee Agu Technology Corporation . Comte. Ltd, Deeoiant Camis ‘ids Response and Objections fo Plas Third Set of Requests ‘the Pradction of Document ed Things (Nos. M8) ed Jun 26,2006: ps. August Tolle Corporation v. Camtok Lad Defeeant Canto ‘Lul"s Response and Objections to Paints First Set of Admissions (1:66) ile fn. 30, 2006; 57 ps Amgant Technology Corporation » Camtek Lid, Piiniff August, Technology Corporation's Amended Respons to Defendants nr sogatory No. | fled Ju 13,2006: 4 ps. August Technology Corporation». Comiek Li, Disputed Clim Tees and Phrases filed Aug. 2006 10 ps. August Technology Coxporation v. Com Lid, iat Claim Con ‘anton Statement filed Aug 2006.4 ps, August Technolog Corporation v:Cantel Lid, Plitif' Prior A Statement ed Aus 4, 2006:24 pas. Agua Technolog Corporations Camtek Lt, Ont filed. ug 24 2006.6 pas mast Teolog Corporation ¥. Camel Lid. Carick Lids “Opening Claim Constraction Be led So. 12,2006 29 pes August Tetnology Corporation \. Cate Lut Pails Opeaiog ‘iat Construction Bre le Sop. 12,2006 34 pes. August Technology Corporation v.Cantet Lid. Supplemental Joint, iain Construction Statens filed Sep 12,2006: 12 pas August Technology Corporation. Came Ll, Cartck Li's Amended Response to Plainf’s Requests for Admission Nos 35637 fled Sep. 26.2006, 7 pus August Technology Corporation .Camtek Ld, Psinfs Reba iain Construction Bre let Oct. 6 2006; 10 pas. August Tecnology Corporation v. Camiok Lid. Amended Answer ‘and Counterclaim of Came Lid in Response to Amended Comm lit of August Technology Corporation and Ralph Technologies, Ine ld Now. 17,2006, 14 pas Aust Technology Corporation ¥- Camtok Lid, Pini Responses to Canck Lids First Set of Interogstores for Ami sion fo Pails (Nos 1-4) fied Nov 17,2006: 23 pas. August Teco Corporation Camtek Lid Mais [Responses to Delendan’s Imerropatories Nos. 7-17 filed Nov. 20, 2006.9 pas, Aut Technology Corporsionv. Como Li, Deena Carte, {ds Response nd Objections to Plain’ Filth Set of Requests forthe Production of Documents and Things (Nos. 90-110) fied Dee 42006. 19 pas. “August Technology Corporation v. Comte Lid, Defeoiant Camis ‘d's Response and Objections to Pains Siath Set of Requests forthe Production of Documents aod Things (Nos, 111-116) ed Dee 11, 2006; 10 pas. August Technology Corporation v. Camtok Lid. Second Amends ‘Answer and Counerlaim of Cantok Lid in Response to Amended Complaint of August Technology Corporation att Rudiph Tesh oles, Ine led Des 15, 2006; 4 pax August Technol Corporation v. Camtok Ld, Deeoiant Camtck Tus Response and Objections to Plas Thind Set of Requests Tor Admission 115161) le Dee. 18, 2006; 23 ps. August Tecnology Corporation. Cant Lid, Pini’ Amend. Response to Cates id's Ft Set of Requcat for Adaston to Plas ie Dee. 18, 2006; 18 pes