Copper Etching Mechanisms

Prashant Reddy
TaµFL
Wet etching mechanism
 Method
•Depth and width of the micro-channels
depend on
-Width of opening
-Etching time.
• Micro-channels of various widths on
photoresist layers obtained by photolithography.
•Wet-etched by FeCl2 with increasing periods of
time
•Widths of openings set at 10, 20, 30, 40 and 50
um and etching time for 5, 10, 15 and 20 min
Process Parameters
Etch Temp: 25 C

The width and the

depth of the micro-channels
increase with the etching time,
but do not depend on the
patterned width.

The etched groove is a hemi-

spherical shape due to isotropic
etching of the copper.
What is Feasible at SMFL?
Wet Etch techniques:
-FeCl2, CuCl2 (chemistry needs to be
altered)
Dry Etch techniques:
- Plasma DRIE (cumbersome and
difficult)