Escolar Documentos
Profissional Documentos
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SECTION 1. SUMMARY
SERVICING PRECAUTIONS .......................................................................................................... 1-2 ESD PRECAUTIONS....................................................................................................................... 1-3 SPECIFICATIONS ........................................................................................................................... 1-4
SECTION 2. ELECTRICAL
ELECTRICAL TROUBLESHOOTING GUIDE ................................................................................. 2-1 WAVEFORMS OF MAJOR CHECK POINT .................................................................................... 2-6 INTERNAL BLOCK DIAGRAM of ICs .............................................................................................. 2-7 BLOCK DIAGRAM ......................................................................................................................... 2-19 SCHEMATIC DIAGRAM ................................................................................................................ 2-21 PRINTED CIRCUIT DIAGRAM ...................................................................................................... 2-27
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SECTION 1. SUMMARY
SERVICING PRECAUTIONS
Always disconnect the power source before:
1) Removing or reinstalling any component, circuit board, module or any other instrument assembly. 2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection. 3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service
manual might be equipped.
Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state
device heat sinks are correctly installed.
Always connect a test instruments ground lead to the instrument chassis ground before
connecting the test instrument positive lead. Always remove the test instrument ground lead last. 1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials. 2) The Components used in the unit have a specified conflammability and dielectric strength. When replacing any components, use components which have the same ratings. Components marked in the circuit diagram are important for safety or for the characteristics of the unit. Always replace with the exact components. 3) An insulation tube or tape is sometimes used and some components are raised above the printed writing board for safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install them as they were. 4) After servicing always check that the removed screws, components and wiring have been installed correctly and that the portion around the service part has not been damaged. Further check the insulation between the blades of attachment plug and accessible conductive parts.
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ESD PRECAUTIONS
[Electrostatically Sensitive Devices (ESD)]
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices. 4) Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static can generate electrical charges sufficient to damage ESD devices. 5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices. 6) Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7) Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).
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SPECIFICATIONS
1. GENERAL Power requirements ..................................................................................................................... DC12V~15V Ground system ................................................................................................................................... Negative Dimensions(W x H x D) ...................................................................................................... 188 x 58 x 166mm Weight .............................................................................................................................................. Net: 1.3kg 2. RADIO SECTION Frequency range Intermediate frequency Usable sensitivity Signal to noise ratio 3. COMPACT DISC SECTION Frequency response ..................................................................................................................... 40Hz~20kHz Channel separation ...................................................................................................................... 50dB(1kHz) Signal to noise ratio .................................................................................................................................. 60dB 4. AUDIO SECTION Maximum output power ....................................................................................................................... 50W x 4 Speaker impedance ............................................................................................................... 4 x 4 or 8 x 4 NOTE: The design and specifications are subject to change without notice in the sourse of product improvement. FM 65.0~74.0MHz(Optional), 87.5~108MHz 10.8MHz 10dBV 55dB AM(MW) 522~1,620kHz (Optional:530~1,710kHz/ 520~1,620kHz) 450kHz 28dBV 45dB
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SECTION 2. ELECTRICAL
ELECTRICAL TROUBLESHOOTING GUIDE
(1) No Power.
Any Key power on. YES NO Is power turnd on? YES NO DISC loading? YES NO Check laser circuitry. Q501, IC502 Check focusing circuitry. Q501,IC501. Check DISC.
Check loading supply circuitry. Check power supply circuitry.
YES
NO
NO
OK
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NO
YES
Is u-com IC401 reset circuit normal? Pin88
NO
Reset circuit defective. IC201 Surrounding circuit defective. IC401 pin89 defective.
YES
NO
YES NO
Q260, PN401 front PCB pattern defective.
YES
Is u-com IC401 Pin 66,67,87 output waveform normal?
NO
YES
Is IC901 Com1, Com2, Com3 output waveform normal?
NO
YES
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NO
Check the Voltage change of CN503 Pin10(6.4~6.8V) YES Check the Voltage IC501 Pin31 (1.4V~1.8V) YES Check the Data transmission from CN503(18,20,21) to CD DSP WAVEFORM #5 YES
NO
NO
NO
NO
NO
Check the Data transmission from CN503 Pin19 to MICOM WAVEFORM #5 YES Check the TRVP Voltage IC501 Pin31 YES
1.4~1.8V
NO
NO Defective IC501
YES
3~4V
NO
Defective IC504
Does FA+ waveform appear at IC501 Pin31? WAVEFORM #3 focus coil drive wareform. YES Does TE waveform appear at IC502 Pin21? WAVEFORM #4 TRACKING ERROR wareform YES Is rotation normal?
NO
NO
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YES
NO NO NO
Defective MICOM or CN503.
YES
YES
NO
Defective IC501,IC502
YES
YES
NO
OPEN
CLOSE YES
Defective MICOM.
YES NO
Is power supplied to laser Q501? (Q 501 collector: about 1.8V) Defective IC502
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Laser lights
YES NO
Defective IC501
YES
Check the signal of IC504 Pin 15, 16 WAVEFORM #3
NO
Defective IC501
YES
NO
Defective IC501
NO
Defective IC504
YES
Defective contact CN502 or Defective PICK-UP
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#3. FOCUS DRIVE AND MOTOR WAVEFORM IC501(37), IC504(15) When focus search failed or there is no disc on tray
#4. TRACK DRIVE AND MOTOR WAVEFORM IC504(35), IC504(17) during TOC Reading
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2) PORT DESCRIPTION
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- 2-9 -
I IC501 MN6627933CG
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1) BLOCK DIAGRAM
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FWD 1
REV
LDCONT 3
PS 4
IN 5
IN2
PR EVCC 7
AM5810
POWVCC12
VOL ( - )
VOL ( + ) 10
VO2 ( - ) 11
VO2 ( + ) 12
VO1 ( - )
13
VO1 ( + ) 14
2) PIN CONFIGURATION
1) BLOCK DIAGRAM
I IC504 AM5810
- 2-12 28
BIAS
27
OPIN4 ( + )
26
OPIN4 ( - )
25
OP OUT4
24
OPIN3 ( + )
23
OPIN3 ( - )
22
OPOUT3
21
MUTE
20
POWVCC34
19
GND
18
VO3 ( - )
17
VO3 ( + )
16
VO4 ( - )
15
VO4 ( + )
3) PIN DESCRIPTIONS
PIN No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin Name FWD REV LDCONT PS IN1 IN2 PREVCC POWVCC12 VOL ( - ) VOL ( + ) VO2 ( - ) VO2 ( + ) VO1 ( - ) VO1 ( + ) VO4 ( + ) VO4 ( - ) VO3 ( + ) VO3 ( - ) GND POWVCC34 MUTE OPOUT3 OPIN3 ( - ) OPIN3 ( + ) OPOUT4 OPIN4 ( - ) OPIN4 ( + ) BIAS Description Input for loading forward Input for loading reverse Output control terminal for loading Control terminal for power saving mode Input 1 of CH1 Input 2 of CH2 Pre and loading unit power supply input terminal Power unit power supply input terminal (CH1, CH2) Inverted output of loading Not inverted output of loading Inverted output of CH2 Not inverted output of CH2 Inverted output of CH1 Not inverted output of CH1 Not inverted output of CH4 Inverted output of CH4 Not inverted output of CH3 Inverted output of CH3 Substrate ground Power unit power supply input terminal (CH3, CH4) Input for mute control Output of CH3 OP-ANP Inverting input of CH3 OP-ANP Not inverting input of CH3 OP-ANP Output of CH4 OP-ANP Inverting input of CH4 OP-ANP Not inverting input of CH4 OP-ANP Input of Bias-Amplifier
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I IC505 AMC1117
1) BLOCK DIAGRAM
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I IC601TDA7348D
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I IC801 TA8275H
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2) PIN CONFIGURATION
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- 2-18 -
BLOCK DIAGRAM
2(FL,FR)
IC601 TDA7438D
10,14 16 27 17 28
25,26
11,15
LINE SW/E.VOLUME
2
12,14
TDA8275HQ
21,23
8,12
22
6,20
3,5
MUTE CCNTROL
Q720,721,722,723 4-CH (FL,FR,RL,RR)
LINE-OUT (OPTION)
CDC SIGNAL
9.4V 14V
POWER ON Q380,381
PN801 #6 REMOTE
PICK-UP
RESET IC201
58, 60
PN801 #5 PHONE
DSP IC (MN6627933)
REG 9V IC403
54 68,69,70,71
55 10 24 3 11
90 6
91 4 43
15,16,17,18
56,57 30,31,32,36
56~60 1~50
LCD DISPLAY
CD MECHA (CD303-C004A)
7,8,20 1,2
14,19
66,67 47,48
2-19
2-20
SCHEMATIC DIAGRAM
1. MAIN SCHEMATIC DIAGRAM
2-21
2-22
2-23
2-24
2-25
2-26
2-27
2-28
2-29
2-30
2-31
2-32
2-33
2-34
2-35
2-36
330
A50 281 283 280 A40 257 252 261 250 A49 282 255 267 263 269 294 296 251
276 272
295 A42
291
256
A43
A26 301
253
A41
A46
277
290
A45
302
3-1
3-2