IC

IC .

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.

IC 30
.

:

Board mounting methods > construction form > power handling capability
> >

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IC .

HCPGA

CDIL

CPGA
DBS

THROUGH
HOLE
PACKAGES

HDIP
RBS

RDBS
SIL

TBS
DIP
SDIP

SIL
CLLCC

HSOP

HTSSOP

CWQCCN

PMFP

SO

SSOP
TSSOP
VSO
HBCC

IC
HLQFP

HQFP
HSQFP

SURFACE MOUNT
PACKAGES

HTQFP

BCC
LQFP
PLCC

QFP
SQFP
TQFP
VQFN

BGA

HBGA

LFBGA
MSQFP

TFBGA

CONTACTLESS
PACKAGES

PLLMC
VFBGA

 TROUGH-HOLE
MOUNT :

 SURFACE MOUNT
:

 IC

 ) IC (
 ) (SOC
o ) 15*15 (
.
o 32 CPU 1
.
 IC :
IC
10000 o
1000 o ) -40
200 (
 IC
o > 200
o < 1000 ) Xilinx FF1704: :
( 1704-ball flip-chip BGA
 IC :
o ) (

 IC :
 )PTH (pin-through-hole

.
o
o P&P
)P&P (Pick and Place in surface-mount technology machines

 )SMT (surface-mount-technology
SMT
.
o
o ) P&P (
o
) (PCB
o
o
o
SMT
.

 IC :

o
o :
 )
(



o ) Al2O3
(Alumina .
o

o

o
o

o )( r=10
:
o

 IC

:(SOIC) Small Outline Integrated Circuit

 SO14
SO8 SO28

 8.6mm x 3.9mm x 1.75mm :
 1.27mm (50mil) :

:(TSSOP) Thin Shrink Small Outline

 TSSOP14 TSSOP64


 5.0mm x 4.4mm x 1.2mm :
 0.65mm (25mil) :

: (BGA) Ball Grid Arrays

 BGA54

 8.0mm x 5.5mm x 1.4mm :
 0.8mm :


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