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Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through-hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Printed circuit boards are used in virtually all but the simplest commercially-produced electronic devices. PCBs are inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire wrap or point-to-point construction, but are much cheaper and faster for high-volume production; the production and soldering of PCBs can be done by totally automated equipment. Much of the electronics industry's PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.

Contents
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1 History 2 Manufacturing o 2.1 Materials o 2.2 Patterning (etching) 2.2.1 Large volume 2.2.2 Small volume 2.2.3 Hobbyist o 2.3 Chemical etching o 2.4 Lamination o 2.5 Drilling o 2.6 Exposed conductor plating and coating o 2.7 Solder resist o 2.8 Screen printing o 2.9 Test

2.10 Printed circuit assembly 2.11 Protection and packaging 3 Design 4 Safety certification (US) 5 "Cordwood" construction 6 Multiwire boards 7 Surface-mount technology 8 See also 9 References
o o

10 External links

[edit] History
Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors on linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent[1] to flame-spray metal onto a board through a patterned mask. Charles Durcase in 1927 patented a method of electroplating circuit patterns. [2] The inventor of the printed circuit was the Austrian engineer Paul Eisler who, while working in England, made one circa 1936 as part of a radio set. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II [2]. After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid1950s, after the Auto-Sembly process was developed by the United States Army. Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove's 19361947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce 3 radios per minute. During World War II, the development of the anti-aircraft proximity fuse required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place.[3] Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army

Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wavesoldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off. In recent years, the use of surface mount parts has gained popularity as the demand for smaller electronics packaging and greater functionality has grown.

[edit] Manufacturing
[edit] Materials

A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist, and white silkscreen printing. Both surface mount and through-hole components have been used.

A PCB in a computer mouse. The Component Side (left) and the printed side (right).

The Component Side of a PCB in a computer mouse; some examples for common components and their reference designations on the silk screen. Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red. There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. FR-4 is by far the most common material used today. The board with copper on it is called "copper-clad laminate". Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce per square foot is 1.344 mils or 34 micrometres.

[edit] Patterning (etching)

The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a "blank PCB") then removing unwanted copper after applying a temporary mask (e.g. by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. The PCB manufacturing method primarily depends on whether it is for production volume or sample/prototype quantities. Double-sided boards or multi-layer boards use plated-through holes to connect traces on either side of the substrate.

[edit] Large volume

silk screen printingthe main commercial method. Photographic methodsused when fine linewidths are required.

[edit] Small volume

Print onto transparent film and use as photomask along with photo-sensitized boards. (i.e. pre-sensitized boards), Then etch. (Alternatively, use a film photoplotter). Laser resist ablation: Spray black paint onto copper clad laminate, place into CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. Etch. (Note: laser copper ablation is rarely used and is considered experimental.) Use a CNC-mill with a spade-shaped (i.e. 45-degree) cutter or miniature end-mill to route away the undesired copper, leaving only the traces.

[edit] Hobbyist

Laser-printed resist: Laser-print onto transparency film, heat-transfer with an iron or modified laminator onto bare laminate, touch up with a marker, then etch. Other labor-intensive techniques exist, only suitable for one-off boards (vinyl film and resist, non-washable marker, and others).

There are three common "subtractive" methods (methods that remove copper) used for the production of printed circuit boards: 1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank (non-conductive) board. The latter technique is also used in the manufacture of hybrid circuits. 2. Photoengraving uses a photomask and developer to selectively remove a photoresist coating. The remaining photoresist protects the copper foil. Subsequent etching removes the unwanted copper. The photomask is usually prepared with a photoplotter from data produced by a technician using CAM, or computer-aided manufacturing software. Laser-printed transparencies are typically employed for phototools; however, direct laser imaging techniques are being employed to replace phototools for high-resolution requirements. 3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is extracted from files generated in PCB design software and stored in HPGL or Gerber file format.

"Additive" processes also exist. The most common is the "semi-additive" process. In this version, the unpatterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a subtractive process mask, this mask exposes those parts of the substrate that will eventually become the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be plated to any desired weight. Tin-lead or other surface platings are then applied. The mask is stripped away and a brief etching step removes the now-exposed original copper laminate from the board, isolating the individual traces. Some boards with plated through holes but still single sided were made with a process like this. General Electric made consumer radio sets in the late 1960s using boards like these. The additive process is commonly used for multi-layer boards as it facilitates the platingthrough of the holes (to produce conductive vias) in the circuit board.

PCB copper electroplating machine for adding copper to the in-process PCB

PCBs in process of adding copper via electroplating The dimensions of the copper conductors of the printed circuit board is related to the amount of current the conductor must carry. Each trace consists of a flat, narrow part of the copper foil that remains after etching. Signal traces are usually narrower than power or ground traces because their current carrying requirements are usually much less. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For printed circuit boards that contain microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency circuits the inductance and capacitance of the printed circuit board conductors can be used as a delibrate part of the circuit design, obviating the need for additional discrete components.

[edit] Chemical etching

Chemical etching is done with ferric chloride, ammonium persulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the

thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away. The simplest method, used for small scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to splash boards with etchant; the process has become commercially obsolete since it is not as fast as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles, and recirculated by pumps. Adjustment of the nozzle pattern, flow rate, temperature, and etchant composition gives predictable control of etching rates and high production rates. [4] As more copper is consumed from the boards, the etchant becomes saturated and less effective; different etchants have different capacities for copper, with some as high as 150 grams of copper per litre of solution. In commercial use, etchants can be regenrated to restore their activity, and the dissolved copper recovered and sold. Small-scale etching requires attention to disposal of used etchant, which is corrosive and toxic due to its metal content. The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurs when etchant attacks the thin edge of copper under the resist; this can reduce conductor widths and cause open-circuits. Careful control of etch time is required to prevent undercut. Where metallic plating is used as a resist, it can "overhang" which can cause short-circuits between adjacent traces when closely spaced. Overhang can be removed by wire-brushing the board after etching. [4]

[edit] Lamination
Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards.

[edit] Drilling
Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp to not mar or tear the traces. Drilling with high-speed-steel is simply not feasible since the drill bits will dull quickly and thus tear the copper and ruin the boards. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or "Excellon files". The drill file describes the location and size of each drilled hole. These holes are often filled with

annular rings (hollow rivets) to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB. When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laserdrilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias. It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers. The walls of the holes, for boards with 2 or more layers, are made conductive then plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch. Removing (etching back) the smear also reveals the interior conductors as well.

[edit] Exposed conductor plating and coating

PCBs[5] are plated with solder, tin, or gold over nickel as a resist for etching away the unneeded underlying copper.[6] After PCBs are etched and then rinsed with water, the soldermask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating.[7][8] Matte solder is usually fused to provide a better bonding surface or stripped to bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface.[9] This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU and US, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60ppm germanium. It is important to use solder compatible with both the PCB and the parts used. An example is Ball Grid Array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.

Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating and/or leaving voids. Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias.[10][11] Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow "whiskers" due to tension in the plated surface. Tin-Lead or Solder plating also grows whiskers, only reduced by the percentage Tin replaced. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.[12]

[edit] Solder resist

Areas that should not be soldered may be covered with a polymer solder resist (solder mask) coating. The solder resist prevents solder from bridging between conductors and creating short circuits. Solder resist also provides some protection from the environment. Solder resist is typically 2030 micrometres thick.

[edit] Screen printing

Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space permits, the screen print text can indicate component designators, switch setting requirements, test points, and other features helpful in assembling, testing, and servicing the circuit board. Screen print is also known as the silk screen, or, in one sided PCBs, the red print. Lately some digital printing solutions have been developed to substitute the traditional screen printing process. This technology allows printing variable data onto the PCB, including serialization and barcode information for traceability purposes.

[edit] Test
Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined in a netlist) is verified as correct on the finished board. For high-volume production, a Bed of nails tester, a fixture or a Rigid needle adapter is used to make contact with copper lands or holes on one or both sides of the board to facilitate testing. A computer will instruct the electrical test unit to apply a small voltage to each contact point on the bed-of-nails as required, and verify that such voltage appears at other appropriate contact points. A "short" on a board would be a connection where there

should not be one; an "open" is between two points that should be connected but are not. For small- or medium-volume boards, flying probe and flying-grid testers use moving test heads to make contact with the copper/silver/gold/solder lands or holes to verify the electrical connectivity of the board under test. Another method for testing is industrial CT scanning, which can generate a 3D rendering of the board along with 2D image slices and can show details such a soldered paths and connections.

[edit] Printed circuit assembly

PCB with test connection pads After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly,[13][14] or PCA (sometimes called a "printed circuit board assembly" PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder. There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with machine placement and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)[15] by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages. Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques. After the board has been populated it may be tested in a variety of ways:

While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.

While the power is off, analog signature analysis, power-off testing. While the power is on, in-circuit test, where physical measurements (i.e. voltage, frequency) can be done. While the power is on, functional test, just checking if the PCB does what it had been designed for.

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board. In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.[16] When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

[edit] Protection and packaging

PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult.[17] Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare boards are sometimes static sensitive. Traces have become so fine that it's quite possible to blow an etch off the board (or change its characteristics) with a static charge. This is especially true on nontraditional PCBs such as MCMs and microwave PCBs.

[edit] Design

Schematic capture or schematic entry is done through an EDA tool. Card dimensions and template are decided based on required circuitry and case of the PCB. Determine the fixed components and heat sinks if required. Deciding stack layers of the PCB. 4 to 12 layers or more depending on design complexity. Ground plane and Power plane are decided. Signal planes where signals are routed are in top layer as well as internal layers.[18] Line impedance determination using dielectric layer thickness, routing copper thickness and trace-width. Trace separation also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals. Placement of the components. Thermal considerations and geometry are taken into account. Vias and lands are marked. Routing the signal trace. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes as power plane behaves as ground for AC. Gerber file generation for manufacturing.

[edit] Safety certification (US)

Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.

[edit] "Cordwood" construction

A cordwood module. Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as missile guidance and telemetry systems) and in high-speed computers, where short traces were important. In "cordwood" construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire, or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads. To avoid shorting together different interconnection layers, thin insulating cards were placed between them. Perforations or holes in the cards allowed

component leads to project through to the next interconnection layer. One disadvantage of this system was that special nickel leaded components had to be used to allow the interconnecting welds to be made. Some versions of cordwood construction used single sided PCBs as the interconnection method (as pictured). This meant that normal leaded components could be used. Another disadvantage of this system is that components located in the interior are difficult to replace. Before the advent of integrated circuits, this method allowed the highest possible component packing density; because of this, it was used by a number of computer vendors including Control Data Corporation. The cordwood method of construction now appears to have fallen into disuse, probably because high packing densities can be more easily achieved using surface mount techniques and integrated circuits.

[edit] Multiwire boards

Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin). It was used during the 1980s and 1990s. (Kollmorgen Technologies Corp., U.S. Patent 4,175,816) Multiwire is still available in 2010 through Hitachi. There are other competitive discrete wiring technologies that have been developed (Jumatech [2]). Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each otherwhich almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.

[edit] Surface-mount technology

Main article: Surface-mount technology

Surface mount components, including resistors, transistors and an integrated circuit

Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labour costs and greatly increasing production and quality rates. Carrier Tapes provide a stable and protective environment for Surface mount devices (SMDs) which can be onequarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts. However, integrated circuits are often priced the same regardless of the package type, because the chip itself is the most expensive part. As of 2006, some wire-ended components, such as small-signal switch diodes, e.g. 1N4148, are actually significantly cheaper than corresponding SMD versions.

[edit] See also

Electronics portal

Schematic Capture. (KiCAD)

PCB layout. (KiCAD)

3D View. (KiCAD)

Breadboard C.I.D.+ Design for manufacturability (PCB) Electronic packaging Electronic waste Multi-Chip Module Occam Process another process for the manufacturing of PCBs

PCB Materials

Conductive ink Heavy copper Laminate materials: o BT-Epoxy o Composite epoxy material, CEM-1,5 o Cyanate Ester o FR-2 o FR-4, the most common PCB material o Polyimide o PTFE, Polytetrafluoroethylene (Teflon)

PCB layout software

List of EDA companies Comparison of EDA software

[edit] References
1. ^ US 1256599 2. ^ a b Charles A. Harper, Electronic materials and processes handbook, Mc Graw-Hill ,2003 ISBN 0071402144, pages 7.3 and 7.4 3. ^ Brunetti, Cledo (22 November 1948). New Advances in Printed Circuits. Washington DC: National Bureau of Standards. 4. ^ a b R. S. Khandpur ,Printed circuit boards: design, fabrication, assembly and testing, Tata-McGraw Hill, 2005 ISBN 0070588147, pages 373-378 5. ^ Appendix F Sample Fabrication Sequence for a Standard Printed Circuit Board, Linkages: Manufacturing Trends in Electronics Interconnection Technology, National Academy of Sciences 6. ^ Production Methods and Materials 3.1 General Printed Wiring Board Project Report- Table of Contents, Design for the Environment (DfE), US EPA 7. ^ George Milad and Don Gudeczauskas. "Solder Joint Reliability of Gold Surface Finishes (ENIG, ENEPIG and DIG) for PWB Assembled with Lead Free SAC Alloy." [1] 8. ^ "Nickel/Gold tab plating line" 9. ^ Soldering 101 A Basic Overview 10. ^ IPC Publication IPC-TR-476A, Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies, Northbrook, IL, May 1997. 11. ^ S.Zhan, M. H. Azarian and M. Pecht, "Reliability Issues of No-Clean Flux Technology with Lead-free Solder Alloy for High Density Printed Circuit Boards", 38th International Symposium on Microelectronics, pp. 367375, Philadelphia, PA, September 2529, 2005. 12. ^ Clyde F. Coombs Printed Circuits Handbook McGraw-Hill Professional, 2007 ISBN 0-07-146734-3, page 45-19 13. ^ Ayob M. and Kendall G. (2008) A Survey of Surface Mount Device Placement Machine Optimisation: Machine Classification. European Journal of

Operational Research, 186(3), pp 893914 (http://dx.doi.org/10.1016/j.ejor.2007.03.042) 14. ^ Ayob M. and Kendall G. (2005) A Triple Objective Function with a Chebychev Dynamic Pick-and-place Point Specification Approach to Optimise the Surface Mount Placement Machine. European Journal of Operational Research, 164(3), pp 609626 (http://dx.doi.org/10.1016/j.ejor.2003.09.034) 15. ^ Borkes, Tom. "SMTA TechScan Compendium: 0201 Design, Assembly and Process". Surface Mount Technology Association. Retrieved 2010-01-11. 16. ^ JTAG Tutorial (http://www.corelis.com/education/JTAG_Tutorial.htm#History) 17. ^ Shibu. Intro To Embedded Systems 1E. Tata McGraw-Hill. p. 293. ISBN 9780070145894. 18. ^ See appendix D of IPC-2251

[edit] External links

The Wikibook Practical Electronics has a page on the topic of PCB Layout Wikimedia Commons has media related to: Printed circuit board Design guidelines

PWB/PCB Design Analog, RF & EMC Considerations in Printed Wiring Board Design EMC Design Guideline Collection on the Clemson Vehicular Electronics Laboratory web site PCB Design/Layout Tutorial (PDF) Chapter excerpt (166 page PDF) from Analog Devices Op Amp Handbook: Hardware and Housekeeping Techniques. Includes PCB design tips. [3]

Standards and specifications

MIL-PRF-31032, Performance Specification Printed Circuit Board/Printed Wiring Board MIL-PRF-55110, Performance Specification for Rigid Printed Circuit Board/Printed Wiring Board MIL-PRF-50884, Performance Specification for Flexible and Rigid-Flexible Printed Circuit Board/Printed Wiring Board RS-274X Extended Gerber Format Specification (Revision G), Ucamco December 2010

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Wikipedia, bch khoa ton th min ph Mt phn ca mt hi ng qun tr 1983 ZX Sinclair Spectrum my tnh, mt PCB dn c, cho thy cc du vt dn in, vias (nhng con ng xuyn qua l b mt khc), v mt s gn kt cc thnh phn in Mt bng mch in, hoc PCB, c s dng h tr my mc v in kt ni cc linh kin in t bng cch s dng cc ng dn, theo di hoc cc du vt tn hiu t cc tm ng khc p vo mt cht nn khng dn in. N cng c gi hi ng qun tr dy in (PWB) hoc Ban dy khc. Mt PCB dn c vi cc thnh phn in t l mt mch in lp rp (PCA), cng c bit n nh l mt bng mch in lp rp (PCBA). Bng mch in c s dng trong hu nh tt c, nhng n gin thng mi-sn xut cc thit b in t. PCBs l khng tn km, v c th c tin cy cao. H i hi n lc b tr nhiu hn na v chi ph ban u cao hn so vi qun dy hoc xy dng im-im, nhng r hn nhiu v nhanh hn cho khi lng sn xut cao, sn xut v hn ca PCBs c th c thc hin bi thit b hon ton t ng. Phn ln ca ngnh cng nghip in t PCB thit k, lp rp, v nhu cu kim sot cht lng c thit lp bi cc tiu chun c cng b bi t chc IPC. Ni dung [n] 1 Lch s 2 Sn xut 2,1 Vt liu 2,2 khun mu (khc) 2.2.1 ln khi lng 2.2.2 nh khi lng 2.2.3 ngi nui c 2.3 Ha cht khc 2,4 Lamination 2,5 khoan 2,6 xc dn m v lp ph 2,7 Hn chng li 2,8 mn hnh in n 2,9 Kim tra 2,10 mch in lp rp

2,11 Bo v v ng gi 3 Thit k 4 giy chng nhn an ton (M) 5 "Cordwood" xy dng 6 Multiwire bng 7 b mt gn kt cng ngh 8 Xem 9 Ti liu tham kho 10 Lin kt ngoi [Sa] Lch s Pht trin cc phng php c s dng trong cc bng mch in hin i bt u sm trong th k 20. Nm 1903, mt nh pht minh ngi c, Albert Hanson, m t dn l phng p mt hi ng cch in, nhiu lp. Thomas Edison th nghim vi cc phng php ha hc m dn trn giy lanh vo nm 1904. Arthur Berry vo nm 1913 c cp bng sng ch mt phng php in-v-etch Anh, v ti Hoa K Max Schoop thu c mt bng sng ch [1] ngn la phun kim loi vo hi ng qun tr thng qua mt mt n hoa vn. Charles Durcase vo nm 1927 c cp bng sng ch mt phng php ca m hnh mch in. [2] Nh pht minh ca cc mch in l cc k s ngi o Paul Eisler, trong khi lm vic Anh, mt trong khong nm 1936 nh l mt phn ca mt thit lp i pht thanh. Khong 1943, M bt u s dng cng ngh ny trn mt quy m ln lm cho cu ch khong cch s dng trong chin tranh th gii th II [2]. Sau chin tranh, nm 1948, M a ra pht minh s dng thng mi. Mch in khng tr thnh ph bin trong ngnh in t tiu dng cho n khi gia nhng nm 1950, sau khi qu trnh t ng-Sembly c pht trin bi qun i Hoa K. Trc khi mch in (v trong mt thi gian sau khi pht minh ca h), xy dng imim c s dng. i vi nguyn mu, hoc chy sn xut nh, qun dy hoc hi ng qun tr thp pho c th c hiu qu hn. Trc thi pht minh ra mch in, v tinh thn tng t, 1936-1947 ca John Sargrove in t Circuit Trang thit b (ECME) kim loi phun ln mt bng nha Bakelite. ECME c th sn xut 3 radio mi pht. Trong chin tranh th gii th II, s pht trin ca cc cu ch gn chng my bay yu cu mt mch in t c th chu ng c bn t mt khu sng, v c th c sn xut vi s lng. Phng Centralab ca Globe Union a ra mt ngh p ng cc yu cu: mt a gm c screenprinted sn kim loi dn v cc vt liu carbon cho in tr, t a gm v ng chn khng subminiature hn ti ch [3] Ban u, mi thnh phn in t dn dy in, v PCB c l khoan cho mi dy ca mi thnh phn. Cc thnh phn dn sau c truyn thng qua cc l v hn cc du vt PCB. Phng php lp rp ny c gi l xy dng thng qua cc l. Nm 1949, Moe Abramson v Stanislaus F. Danko ca tn hiu Qun on Qun i Hoa K pht trin qu trnh Auto-Sembly dn thnh phn c a vo m hnh ng mt l

kim loi kt ni v nhng hn. Vi s pht trin ca cn hi ng qun tr v cc k thut khc axit, khi nim ny pht trin thnh mch in qu trnh tiu chun ch to hi ng qun tr s dng ngy nay. Hn c th c thc hin t ng bng cch i qua hi ng qun tr v mt gn sng, hn nng chy trong mt my hn sng. Tuy nhin, cc dy v l lng ph t cc l khoan l tn km v cc dy nh ra ch n thun l ct t. Trong nhng nm gn y, vic s dng ca b mt cc b phn gn kt tr nn ph bin nh cc nhu cu v bao b thit b in t nh hn v chc nng ln hn pht trin. [Sa] Sn xut [Sa] Vt liu PCB l mt thit k trn mt my tnh (bn tri) v thc hin nh l mt hi ban dn c vi cc thnh phn (bn phi). Hi ng qun tr l hai mt, thng qua cc l m, hn mu xanh l cy chng li, v in la trng. C hai b mt gn kt v cc thnh phn l thng qua c s dng. PCB trong mt con chut my tnh. Cc phn ph (tri) v pha in (bn phi). Side phn ca mt PCB trong mt con chut my tnh, mt s v d cho cc thnh phn ph bin v s ch nh tham chiu trn mn hnh la. Lp tin hnh thng c lm bng l ng mng. Cch in lp lng cc in thng c p vi nhau bng nha epoxy prepreg. Hi ng qun tr thng c ph mt mt n hn l mu xanh l cy trong mu sc. Mu sc khc thng c mu xanh, en, trng v . C kh mt cht in mi khc nhau c th c la chn cung cp cc gi tr cch nhit khc nhau ty thuc vo yu cu ca mch. Mt s cc cht in mi polytetrafluoroethylene (Teflon), FR-4, FR-1, U ban Dn tc-1 hoc U ban Dn tc-3. Vt liu prepreg ni ting c s dng trong ngnh cng nghip PCB FR-2 (Phenolic bng giy), FR-3 (bng giy v epoxy), FR-4 (dt thoi t si thy tinh v epoxy), FR-5 (dt thoi t si thy tinh v epoxy), FR -6 (Matte knh v polyester), G-10 (dt thoi t si thy tinh v epoxy), U ban Dn tc-1 (bng giy v epoxy), U ban Dn tc-2 (bng giy v epoxy), U ban Dn tc-3 (dt thoi t si thy tinh v epoxy), U ban Dn tc -4 (dt thoi t si thy tinh v epoxy), U ban Dn tc-5 (dt thoi t si thy tinh v polyester). M rng nhit l mt yu t quan trng, c bit l vi mng li bng (BGA) v cng ngh cht trn trung, v si thy tinh cung cp s n nh tt nht chiu. FR-4 l vt liu ph bin nht c s dng ngy nay. Hi ng qun tr vi ng trn n c gi l "ng bc g". ng dy l c th c quy nh ti ounces mi foot vung hoc micromet. Mt ounce mi foot vung l 1,344 mils hoc 34 micromet. [Sa] khun mu (khc) Phn ln cc bng mch in c thc hin bng cch bc mt lp ng trn ton b b mt, i khi c hai bn, to ra mt "trng PCB" sau loi b ng khng mong mun sau khi p dng mt mt n tm thi (v d bng cch khc), li ch mong mun ng du vt. Mt PCBs c thc hin bng cch thm du vt cht nn trn (hoc mt cht

nn vi mt lp rt mng ng) thng l mt qu trnh phc tp nhiu bc m in. Phng php sn xut PCB ch yu ph thuc vo vic n l dnh cho khi lng sn xut, s lng mu / mu. Hai mt bng hoc nhiu bng lp s dng thng qua cc l m kt ni cc du vt trn hai bn b mt. [Sa] khi lng ln la mn hnh in-phng php thng mi chnh. Chp nh cc phng php c s dng khi linewidths tt c yu cu. [Sa] khi lng nh In trn phim minh bch v s dng nh photomask cng vi bng hnh nh nhy. (Ngha l bng nhy cm trc), Sau etch. (Ngoi ra, s dng mt photoplotter phim). Laser chng ct b: Phun sn mu en ph ln g ng, din ra vo decal CNC tia laser. Laser raster qut PCB v ablates (bc hi) sn khng cng li c mong mun. Etch. (Lu : tia laser ct b ng l him khi c s dng v c coi l th nghim) S dng mt CNC-nh my vi mt my ct hnh con t bch (tc l 45 ) hoc thu nh cui cng nh my ng i ng khng mong mun, ch li cc du vt. [Sa] hobbyist Laser-in chng li: Laser-in vo b phim minh bch, chuyn nhit vi st hoc p thay i ln trn g, chm vi mt nh du, sau etch. Nhiu lao ng k thut khc tn ti, ch thch hp cho mt bng (phim nha vinyl v chng li, nh du khng th git c, v nhng ngi khc). C ba chung "tr" phng php (phng php loi b ng) c s dng sn xut bng mch in: In la mn hnh s dng loi mc etch-khng bo v l ng. Khc sau loi b ng khng mong mun. Ngoi ra, mc in c th dn in, c in trn mt bng trng (khng dn in). K thut ny cng c s dng trong sn xut cc mch lai. Photoengraving s dng mt photomask v pht trin c chn lc loi b mt lp ph cn quang. Cn quang cn li bo v cc l ng. Khc sau loi b ng khng mong mun. Photomask thng c chun b vi mt photoplotter t d liu c sn xut bi mt k thut vin s dng CAM, hoc sn xut phn mm my tnh h tr. Laser-in trong sut thng c s dng PhotoTools, tuy nhin, k thut hnh nh tia laser trc tip ang c s dng thay th cc PhotoTools yu cu phn gii cao. PCB phay s dng mt h thng hai hoc ba trc phay c kh nh my i nhng l ng t b mt. Mt my xay xt PCB (gi tt l PCB Prototyper) hot ng trong mt cch tng t nh mt my v th, nhn c lnh t cc phn mm my ch kim sot v tr ca ngi ng u phay trc z x, y, v (nu c lin quan) . D liu vo a Prototyper c chit xut t cc tp tin c to ra trong phn mm thit k PCB v c lu tr trong HPGL hoc nh dng tp tin Gerber. Qu trnh "Ph gia" cng tn ti. Ph bin nht l qu trnh "bn ph gia". Trong phin

bn ny, Ban unpatterned c mt lp ng mng trn n. Mt mt n ngc li sau c p dng. (Khng ging nh mt mt n qu trnh tr, mt n ny l ra nhng phn b mt m cui cng s tr thnh cc du vt.) ng thm sau m vo hi ng qun tr trong cc lnh vc lt mt n, ng c th c m bt c trng lng mong mun. Platings b mt Tin-ch hoc sau c p dng. Cc mt n l tc i mt bc khc ngn gn loi b g ng ti tip xc ban u t hi ng qun tr, cch ly cc du vt c nhn. Mt s hi ng vi m qua l nhng vn cn mt mt c thc hin vi mt quy trnh nh th ny. General Electric b i pht thanh ca ngi tiu dng trong cui nhng nm 1960 bng cch s dng bng nh th ny. Cc qu trnh ph gia thng c s dng cho nhiu bng lp v n to iu kin cho m thng qua cc l (sn xut vias dn) trong cc bng mch. PCB ng m in my cho thm ng PCB trong qu trnh PCBs trong qu trnh b sung thm ng thng qua m in Cc kch thc ca cc dy dn ng ca cc bng mch in c lin quan n s lng hin ti dn phi thc hin. Mi du vt bao gm mt phn hp v bng phng, l ng cn li sau khi khc. Du vt tn hiu thng hp hn so vi cc du vt in hoc mt t v yu cu thc hin ca h thng t hn nhiu. Trong mt hi ng qun tr a lp, mt lp ton b c th c ch yu l rn ng hot ng nh mt my bay mt t cho che chn v tr li quyn lc. i vi cc bo mch in c cha cc mch vi sng, ng dy truyn ti c th c t ra trong cc hnh thc ca stripline v microstrip vi kch thc kim sot cn thn m bo mt tr khng ph hp. Trong cc mch tn s v tuyn in cm v in dung ca dy dn bng mch in c th c s dng nh l mt phn ca cc thit k mch delibrate, obviating s cn thit cho cc thnh phn b sung ring bit. [Sa] Ha cht khc Ha cht khc c thc hin vi st clorua, amoni persulfate, hoc axit i khi hydrochloric. i vi PTH (m qua l), cc bc b sung lng ng Electroless c thc hin sau khi cc l khoan, sau ng m in xy dng dy, Ban c kim tra, v m thic / ch. Cc tin / dn s tr thnh s chng li li ng trn c khc. Phng php n gin nht, c s dng cho sn xut quy m nh v thng l do ngi c s thch, l ngm khc, trong hi ng qun tr l ngp nc trong gii php khc nh st clorua. So vi cc phng php c s dng sn xut hng lot, thi gian khc di. Nhit v kch ng c th c p dng cho phng tm tng tc t l khc. Trong bong bng khc, khng kh c truyn qua bn tm etchant khuy ng cc gii php v tng tc khc. Splash khc s dng mt paddle chy bng m t git gn Hi ng qun tr vi etchant, qu trnh thng mi tr thnh li thi v n khng phi l nhanh nh khc phun. Trong khc phun, gii php etchant c phn phi trn cc bng vi phun v ti tun hon bng my bm. iu chnh m hnh vi phun, tc dng chy, nhit , v etchant thnh phn cho php kim sot d on t l khc v t l sn xut cao. [4]

Nh ng c tiu th t cc Ban, etchant tr nn bo ha v km hiu qu; etchants khc nhau c nhng kh nng khc nhau cho cc ng, vi mt s cao l 150 gram ng mi lt dung dch. Trong vic s dng thng mi, etchants c th c regenrated khi phc li hot ng ca h, v cc ng b gii th hi phc v bn. Khc quy m nh i hi s ch x l c s dng etchant, n mn v c hi do ni dung kim loi ca n. Etchant loi b ng trn tt c cc b mt tip xc bi cc chng. "Ct xn" xy ra khi etchant tn cng cnh mng ng theo chng li, iu ny c th lm gim rng dn v gy ra m mch. Hy cn thn kim sot ca thi gian etch l cn thit ngn chn ct xn. Trng hp m kim loi c s dng nh mt chng li, n c th "nh ra" c th gy ra ngn mch gia cc du vt lin k khi gn nhau. Nh ra c th c g b bi dy nh hi ng qun tr sau khi khc. [4] [Sa] Lamination Mt s PCBs c lp du vt bn trong PCB v c gi l nhiu lp PCBs. y l nhng hnh thnh bng cch lin kt vi nhau mt cch ring bit khc bng mng. [Sa] Khoan L thng qua mt PCB thng c khoan vi mi khoan ng knh nh ca cacbua vonfram trng rn. Coated vonfram cacbua l v nhng ti liu hi ng qun tr c mi mn v khoan phi c RPM cao v thc n chn nui cao c hiu qu chi ph. Mi khoan cng phi duy tr sc bn khng mar hoc rch cc du vt. Khoan vi thp tc cao ch n gin l khng kh thi v cc mi khoan ngu si n n mt cch nhanh chng v do s x ng v hy hoi Ban. Khoan c thc hin bng my khoan t ng vi v tr iu khin bi mt bng khoan hoc tp tin khoan. Nhng tp tin ny to ra my tnh cn c gi l s kim sot khoan (NCD) cc tp tin hoc "Excellon tp tin". Cc tp tin khoan m t v tr v kch thc ca mi l khoan. Cc l ny thng c lm y vi vng hnh khuyn (inh tn rng) to ra vias. Vias cho php kt ni in v nhit in ca dy dn trn cc cnh i din ca PCB. Khi vias rt nh c yu cu, khoan vi bit c kh l tn km v t l cao mi mn v v. Trong trng hp ny, vias c th c bc hi bng tia laser. Vias Laser-khoan thng c mt kt thc b mt km bn trong cc l. Cc l ny c gi l vi vias. N cng c th kim sot chuyn su khoan, khoan laser, hoc bng cch khoan cc t c nhn ca PCB trc khi ghp, sn xut cc l kt ni ch c mt s ca cc lp ng, ch khng phi i qua ton b hi ng qun tr. Cc l ny gi l vias m khi h kt ni mt lp ng bn trong mt lp bn ngoi, hoc chn vias khi h kt ni hai hoc nhiu lp ng bn trong v khng c lp bn ngoi. Cc bc tng ca cc l, Hi ng qun tr vi 2 hoc nhiu lp, c thc hin dn sau c m ng hnh thnh thng qua cc l m in kt ni cc lp tin hnh ca PCB. i vi cc bng nhiu lp, nhng ngi vi 4 lp tr ln, khoan thng to ra mt

smear ca cc sn phm phn hy nhit cao ca i l lin kt trong h thng g. Trc khi cc l hng c th c m, bi nh ny phi c loi b mt qu trnh desmear ha cht, hoc do huyt tng-etch. Loi b (khc tr li) smear cng cho thy nhng dy dn bn trong cng. [Sa] xc dn m v lp ph PCBs [5] c m hn, thic, vng trn niken l mt chng li khc i ng khng cn thit c bn [6] Sau khi PCBs c khc v sau ra sch vi nc, soldermask c p dng, v sau bt k ng tip xc c ph mt lp niken, hn / vng, hoc mt s lp ph chng n mn khc [7] [8] Matte hn thng l hp nht cung cp mt b mt lin kt tt hn hoc tc ng trn. Phng php iu tr, chng hn nh benzimidazolethiol, ngn chn qu trnh oxy ha b mt ca ng trn. Nhng ni m cc thnh phn s c gn kt thng c m, bi v ng trn khng c iu tr oxy ha nhanh chng, v do khng phi l d dng hn. Theo truyn thng, bt k ng tip xc c ph mt lp hn kh nng hn san lp mt bng (HASL). Kt thc HASL ngn chn qu trnh oxy ha t cc ng c bn, do m bo mt b mt hn. [9] hn ny l mt hp kim thic-ch, tuy nhin hp cht hn mi hin ang c s dng t c ph hp vi ch th RoHS ca EU v M, trong hn ch vic s dng ch. Mt trong nhng hp cht ch l SN100CL, tin 99,3%, 0,7% ng, niken 0,05%, v mt danh ngha ca 60ppm germanium. iu quan trng l s dng hn tng thch vi c PCB v cc b phn s dng. Mt v d l bng li Array (BGA) bng cch s dng qu bng ch thic hn cho cc kt ni b mt bng ca h trn cc du vt ng trn hoc bng cch s dng dn hn ch. Platings khc c s dng l OSP (hu c loi bo v b mt), ngm bc (IAG), thic ngm, niken Electroless vi lp ph vng ngm (ENIG), v m vng trc tip (trn niken). Kt ni Edge, t dc theo mt cnh ca mt s hi ng, thng c m niken m vng. Mt xem xt lp ph l nhanh chng khuch tn ca cc lp ph kim loi vo hn Tin. Hnh thc Tin intermetallics nh Cu5Sn6 v Ag3Cu ha tan vo liquidus Tin solidus (50C), tc lp ph b mt v / hoc khong trng li. in di c (ECM) l s pht trin ca cc si kim loi dn in trn mt mch in (PCB) di nh hng ca mt s thin v in p DC [10] [11] bc, km, v nhm c bit l pht trin ru theo nh hng ca mt in trng. Bc cng tng tin hnh cc ng dn b mt trong s hin din ca cc ion halogen v cc, lm cho n mt s la chn cho ngi ngho s dng in t. Tin s tng trng "ru" do cng thng trong cc b mt m. Tin-Lead hoc Hn m cng mc ru, ch gim Tn t l phn trm thay th. Reflow lm tan chy hn hoc tm thic gim bt cng thng b mt lm gim t l mc ru ria. Mt vn khc lp ph l tin su bnh, vic chuyn i tin mt allotrope bt nhit thp. [12] [Sa] Hn chng li

Cc khu vc khng nn c hn c th c ph bng mt hn polymer chng li (hn mt n) lp ph. Hn chng li ngn nga hn t cu ni gia cc dy dn v to ra cc mch ngn. Hn chng li cng cung cp mt s bo v t mi trng. Hn chng li thng dy 20-30 micromet. [Sa] in mn hnh Dng ngh thut v vn bn c th c in ln b mt bn ngoi ca mt PCB bng cch in mn hnh. Khi khng gian cho php, cc vn bn in mn hnh c th ch nh danh thnh phn, chuyn i cc yu cu thit lp, cc im th nghim, v cc tnh nng khc hu ch trong vic lp rp, th nghim, v phc v cc bng mch. In mn hnh cng c gi l la, hoc trong mt PCBs mt, in mu . Gn y mt s gii php in n k thut s c pht trin thay th qu trnh in n mn hnh truyn thng. Cng ngh ny cho php in d liu bin ln PCB, trong c tun t v thng tin m vch cho cc mc ch truy xut ngun gc. [Sa] Kim tra Hi ng khng c dn c th phi chu mt th nghim trn hi ng qun tr trong mi kt ni mch (theo quy nh ti netlist mt) c xc minh l chnh xc trn bng hon thnh. i vi sn xut s lng ln, mt ging ca mng tay th nghim, trn u hay mt b iu hp kim cng c s dng lin lc vi cc vng t ng hoc cc l trn mt hoc c hai bn ca hi ng qun tr to iu kin th nghim. Mt my tnh s hng dn cc n v kim tra in p dng mt in th nh cho mi im lin lc trn ging ca mng tay theo yu cu, v xc minh c rng in p xut hin ti cc im lin h thch hp khc. A "ngn" trn tu s l mt kt ni, ni c khng phi l mt trong mt "m" gia hai im phi c kt ni nhng khng. i vi cc bng nh hoc trung bnh khi lng, thm d bay v bay li th nghim s dng di chuyn ngi ng u th nghim lm cho lin h vi cc vng t ng / bc / vng / hn hoc l xc minh cc kt ni in ca hi ng qun tr theo th nghim. Mt phng php th nghim l qut CT cng nghip, m c th to ra mt 3D ca hi ng qun tr cng vi hnh nh lt 2D v c th hin th chi tit mt con ng hn v cc kt ni. [Sa] mch in lp rp PCB vi ming m kt ni th nghim Sau khi bng mch in (PCB) c hon thnh, cc thnh phn in t phi c gn lin vi hnh thc lp rp mch in chc nng, [13] [14] hoc PCA (i khi c gi l "in bng mch lp rp" PCBA). Trong xy dng thng qua cc l, dn thnh phn c chn vo trong l. Trong xy dng b mt gn kt, cc thnh phn c t trn ming m hoc cc vng t trn b mt ngoi ca cc PCB. Trong c hai loi xy dng, thnh phn dn in v my mc c nh vo hi ng qun tr vi mt hn kim loi nng chy. C rt nhiu k thut hn s dng gn cc thnh phn mt PCB. Sn lng cao thng c thc hin vi v tr ln sng hn reflow l my v s lng ln, nhng k thut vin c tay ngh cao c th cc b phn hn rt nh (v d 0201 gi l 0,02.

0,01.) [15] bng tay di knh hin vi , s dng nhp v tip hn st pht tin cho cc mu khi lng nh. Mt s phn c th rt kh khn hn bng tay, chng hn nh gi BGA. Thng thng, thng qua cc l v xy dng b mt gn kt phi c kt hp trong mt hi duy nht bi v mt s thnh phn cn thit ch c trong gi b mt lp t, trong khi nhng ngi khc ch c trong cc gi thng qua cc l. Mt l do khc s dng c hai phng php l gn thng qua cc l c th cung cp sc mnh cn thit cho cc thnh phn c kh nng chu ng cng thng v th cht, trong khi cc thnh phn d kin s i hoang s s chim t khng gian s dng cc k thut b mt lp t. Sau khi hi ng qun tr c dn c, n c th c kim tra trong nhiu cch khc nhau: Trong khi in tt, hnh nh kim tra, t ng kim tra quang hc. Hng dn JEDEC cho v tr thnh phn PCB, hn, v kim tra thng c s dng duy tr kim sot cht lng trong giai on ny ca sn xut PCB. Trong khi sc mnh, tng t ch k phn tch, th nghim in-off. Trong khi quyn lc c, trong mch kim tra, cc php o vt l (tc l in p, tn s) c th c thc hin. Trong khi in c bt, chc nng kim tra, ch cn kim tra nu PCB nhng g n c thit k cho. to iu kin thun li cho cc xt nghim ny, PCBs c th c thit k vi cc ming m thm lm cho cc kt ni tm thi. i khi nhng ming m phi c cch ly vi in tr. Cc th nghim trong mch cng c th thc hin cc tnh nng qut kim tra ranh gii ca mt s thnh phn. Trong mch h thng th nghim cng c th c s dng chng trnh thnh phn b nh khng bay hi trn din n. Trong th nghim qut ranh gii, mch kim tra tch hp vo cc IC khc nhau v hnh thc hi ng qun tr kt ni tm thi gia cc du vt PCB kim tra cc IC c gn mt cch chnh xc. Ranh gii th nghim qut i hi rng tt c cc IC c th nghim s dng mt th tc kim tra cu hnh tiu chun, mt trong nhng ph bin nht l hnh ng th nghim phn Group (JTAG) tiu chun. Cc kin trc kim tra JTAG cung cp mt phng tin kim tra kt ni gia cc mch tch hp trn mt m khng cn s dng u d kim tra vt l. JTAG cc nh cung cp cng c cung cp cc loi kch thch v cc thut ton phc tp, khng ch pht hin cc mng li khng, nhng cng c lp cc li mng li c th, thit b, v chn. [16] Khi bng khng cc kim tra, k thut vin c th desolder v thay th cc thnh phn tht bi, mt nhim v c gi l lm li. [Sa] Bo v v ng gi

PCBs dnh cho cc mi trng khc nghit thng c mt lp ph bo gic, c p dng bng cch nhng hoc phun sau khi cc thnh phn c hn. B lng ngn nga n mn v dng r r hoc shorting do ngng t. o khoc gic u tin c sp, o khoc hin i gic thng xung cc gii php pha long ca cao su silicone, polyurethane, acrylic, hoc epoxy. Mt k thut p dng mt lp ph bo gic l nha c sputtered vo PCB trong mt bung chn khng. Nhng bt li chnh ca lp ph bo gic rng phc v ca hi ng qun tr l ra v cng kh khn [17]. PCBs Nhiu lp rp l tnh nhy cm, v do phi c t trong ti chng tnh in trong qu trnh vn chuyn. Khi x l cc bng ny, ngi s dng phi c ni t (ni t). K thut x l khng ng cch c th truyn mt khon ph tch ly tnh thng qua hi ng qun tr, lm h hng hoc ph hy cc thnh phn. Ngay c cc hi ng trn i khi nhy cm tnh. Du vt tr thnh tt l n hon ton c th thi mt etch ra khi hi ng qun tr (hoc thay i c im ca n) vi mt khon ph tnh. iu ny c bit ng PCBs phi truyn thng nh MCMs v PCBs vi sng. [Sa] Thit k Nm bt s mch hoc s mch nhp cnh c thc hin thng qua mt cng c thit k vi mch. Kch thc th v mu c quyt nh da trn mch cn thit v trng hp ca PCB. Xc nh cc thnh phn c nh v b tn nhit nu cn thit. Quyt nh cc lp ngn xp ca PCB. 4-12 lp hoc hn ty thuc vo phc tp thit k. My bay mt t v my bay in quyt nh. My bay tn hiu tn hiu c nh tuyn lp trn cng nh cc lp ni b. [18] Xc nh dng tr khng bng cch s dng dy lp in mi, nh tuyn c dy ng v theo di chiu rng. Du vt tch cng c a vo ti khon trong trng hp cc tn hiu phn. Microstrip, stripline hoc stripline kp c th c s dng tn hiu ca tuyn ng. V tr ca cc thnh phn. Cn nhc nhit v hnh hc c a vo ti khon. Vias v t c nh du. nh tuyn cc du vt tn hiu. i vi hiu sut ti u EMI tn hiu tn s cao c nh tuyn trong ni b gia cc lp in hoc my bay mt t nh nng lng my bay hot ng lm mt bng cho AC. Gerber tp tin th h sn xut. [Sa] An ton xc nhn (US) Tiu chun an ton UL 796 bao gm cc yu cu an ton thnh phn ban dy in s dng nh l cc thnh phn trong cc thit b hoc cc thit b. Kim tra phn tch cc c im nh tnh d chy, nhit hot ng ti a, theo di in, nhit vng, v h tr trc tip cc b phn trc tip in. [Sa] "Cordwood" xy dng Mt module cordwood. Cordwood xy dng c th tit kim khng gian ng k v thng c s dng vi dy kt thc cc thnh phn trong cc ng dng, ni khng gian ti mt ph bo him (chng

hn nh tn la hng dn v cc h thng t xa) v my tnh tc cao, ni m du vt ngn l quan trng. Trong xy dng "cordwood", cc thnh phn ca trc pha ch c gn kt gia hai mt phng song song. Cc thnh phn hoc hn li vi nhau vi dy nhy, hoc h c kt ni vi cc thnh phn khc ca ribbon niken mng hn vung gc ln dn thnh phn. trnh shorting cng lp kt ni khc nhau, th mng cch in c t gia chng. L hoc l trong th cho php thnh phn dn n d n thng qua cc lp kt ni tip theo. Mt im bt li ca h thng ny l thnh phn niken pha ch, loi c bit phi c s dng cho php cc mi hn kt ni c thc hin. Mt s phin bn ca xy dng cordwood s dng PCBs mt l phng php kt ni (nh hnh). iu ny c ngha rng cc thnh phn pha ch, loi bnh thng c th c s dng. Mt bt li ca h thng ny l thnh phn nm trong ni a rt kh thay th. Trc khi s ra i ca mch tch hp, phng php ny cho php cc thnh phn mt cao nht c th ng gi, v iu ny, n c s dng bi mt s nh cung cp my tnh bao gm c Tng cng ty d liu iu khin. Phng php cordwood xy dng hin nay dng nh gim xung b b i, c l bi v mt cao ng gi c th d dng t c bng cch s dng cc k thut gn kt b mt v cc mch tch hp. [Sa] Multiwire bng Multiwire l mt k thut c cp bng sng ch kt ni m s dng my nh tuyn dy bc cch in c nhng trong mt ma trn khng dn in (thng bng nha nha). N c s dng trong nhng nm 1980 v 1990. (Kollmorgen Technologies Corp, US Patent 4.175.816) Multiwire vn cn trong nm 2010 thng qua Hitachi. C cnh tranh khc cng ngh h thng dy in ring bit c pht trin (Jumatech [2]). K t khi n c kh d dng ngn xp cc mi lin kt (dy) bn trong ma trn nhng, cc nh thit k tip cn cho php qun hon ton v nh tuyn dy (thng l mt hot ng tn thi gian ca PCB thit k): bt c ni no thit k cn mt kt ni, my s v mt si dy trong ng thng t mt a im / pin khc. iu ny dn n thi gian thit k rt ngn (khng c thut ton phc tp s dng ngay c i vi thit k mt cao) cng nh gim nhiu xuyn m (l ti t hn khi dy in chy song song vi nhau hu nh khng bao gi xy ra trong Multiwire), mc d chi ph qu cao cnh tranh vi cc cng ngh PCB r hn khi s lng ln l cn thit. [Sa] b mt gn kt cng ngh Bi: b mt gn kt cng ngh B mt gn kt cc thnh phn, bao gm in tr, bng bn dn v mch tch hp B mt gn kt cng ngh ni ln trong nhng nm 1960, t c trong u nhng nm 1980 v tr thnh s dng rng ri gia nhng nm 1990. Thnh phn c hc c thit k li c cc th nh bng kim loi hoc m cui cng c th c hn trc tip trn b mt PCB. Cc thnh phn tr thnh nh hn nhiu v thnh phn v tr trn c hai mt ca hi ng qun tr tr nn ph bin hn so vi thng qua cc l lp t, cho php mt mch cao hn nhiu. B mt gn vay cng chnh n n mt mc cao ca t ng ha, gim chi ph lao ng v sn xut tng ng k v t l cht lng. Bng

nh cung cp cung cp mt mi trng n nh v bo v cho b mt thit b gn kt (SMDs) c th c mt phn t ti mt phn mi ca cc kch thc v trng lng, v thnh phn th ng c th c mt na n mt phn t chi ph tng ng thng qua l cc b phn. Tuy nhin, mch tch hp thng l gi bt k cng mt loi gi, bi v cc chip chnh n l mt phn t tin nht. n nm 2006, mt s dy chm dt cc thnh phn, chng hn nh it chuyn i tn hiu nh, v d nh 1N4148, thc s r hn ng k so vi cc phin bn tng ng SMD. [Sa] Nuvola ng dng cng thng tin in t ksim.png Schematic Capture. (KiCAD) PCB b tr. (KiCAD) Xem 3D. (KiCAD) Breadboard C.I.D. + Thit k cho sn xut c (PCB) in t bao b in t cht thi Multi-Chip M-un Occam Quy trnh - mt qu trnh cho vic sn xut ca PCBs PCB Vt liu Conductive mc Nng ng G cng nghip vt liu: BT-Epoxy Tng hp epoxy cc ti liu, U ban Dn tc-1, 5 Cyanate Ester FR-2 FR-4, vt liu ph bin nht PCB Polyimide PTFE, Polytetrafluoroethylene (Teflon) PCB b tr phn mm Danh sch cc cng ty thit k vi mch So snh cc phn mm thit k vi mch [Sa] ^ M 1256599 ^ Ab Charles A. Harper, vt liu in t v quy trnh cun s tay, Mc Graw-Hill, 2003 ISBN 0071402144, cc trang 7.3 v 7.4 ^ Brunetti, Cledo (22 thng 11 nm 1948). Nhng tin b trong mch in. Washington DC: Phng tiu chun quc gia.

^ Ab RS Khandpur, bng mch in: thit k, ch to, lp rp v th nghim, TataMcGraw Hill, 2005 ISBN 0070588147, trang 373-378 ^ Ph lc F trnh t ch to mu mt bng mch in chun, mi lin kt: Sn xut cc xu hng trong cng ngh kt ni in t, Vin Hn lm Khoa hc Quc gia ^ Cc phng php sn xut v Vt liu 3,1 Tng Dy in Ban d n Bo co Mc lc, Thit k cho mi trng (DFE), M EPA ^ George Milad v Don Gudeczauskas. " tin cy ca Hn phn th hon tt b mt vng (ENIG, ENEPIG v DIG) PWB lp rp vi hp kim ch SAC." [1] ^ "Nickel / dng tab m vng" ^ Hn 101 - Tng quan c bn ^ IPC Xut bn IPC-TR-476A, in ha di c: Tht bi in cm ng trong hi Dy in, "Northbrook, IL, thng 5 nm 1997. ^ S. Zhan, MH Azarian v M. Pecht, "Nhng vn tin cy ca No-Cng ngh Flux sch vi hp kim hn ch min ph cho Ban High Density mch in", 38 Hi tho quc t v vi in t, trang 367-375, Philadelphia, PA , 25-29 thng Chn, nm 2005. ^ Clyde F. Coombs in Mch S tay McGraw-Hill, 2007 ISBN 0-07-146734-3, trang 45-19 ^ Ayob M. v Kendall G. (2008) Kho st Ti u ho b mt ni my thit b V tr: My phn loi. Chu u Tp ch Nghin cu hot ng, 186 (3), pp 893-914 (http://dx.doi.org/10.1016/j.ejor.2007.03.042) ^ Ayob M. v Kendall G. (2005) Chc nng Mc tiu ba vi mt ng Chebychev Pick-v-ni Phng php tip cn k thut im Ti u ha my V tr b mt ni. Chu u Tp ch Nghin cu hot ng, 164 (3), pp 609-626 (http://dx.doi.org/10.1016/j.ejor.2003.09.034) ^ Borkes, Tom. "SMTA TechScan Compendium: 0201 Thit k, hi v qu trnh". Hip hi Cng ngh Surface Mount. Ly 2010/01/11. ^ JTAG Tutorial (http://www.corelis.com/education/JTAG_Tutorial.htm # Lch s) ^ Shibu. Gii thiu H thng nhng 1E. Tata McGraw-Hill. p. 293. ISBN 9780070145894. ^ Xem ph lc D ca IPC-2251 [Sa] Lin kt ngoi Wikibook thc t Electronics c mt trang v ch PCB Layout Wikimedia Commons c thm phng tin truyn thng lin quan n: bng mch in Thit k hng dn PWB / PCB Thit k - Analog, RF EMC cn nhc trong thit k in Ban Dy EMC B su tp Hng dn thit k trn trang web ca Phng th nghim Electronics xe Clemson Hng dn PCB / Thit K Giao din (PDF) Chng trch on (166 trang PDF) t Analog Devices Op Amp S tay: K thut phn cng v Housekeeping. Bao gm cc li khuyn thit k PCB. [3] Tiu chun v thng s k thut

MIL-PRF-31032, Hiu sut Thng s k thut mch in / Board Dy in MIL-PRF-55110, Hiu sut k thut i vi mch in Rigid Hi ng qun tr / tm dy in MIL-PRF-50884, Hiu sut c tnh k thut cho Hi ng qun tr linh hot v cng nhc, linh hot mch in / Board Dy in M rng RS-274X Gerber nh dng c im k thut (sa i G), Ucamco Thng 12 nm 2010 Mi! Nhp vo cc t bn trn xem cc bn dch thay th. Loi b Google Dch cho:Tm kimVideoEmailin thoiTr chuyn Doanh nghip:B cng c DchGlobal Market FinderWebsite Translator Gii thiu v Google DchTt dch nhanhBo mtTr giup