Accelerometers

Chang Liu

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Definition

An accelerometer measures the magnitude of linear acceleration, a. Types:

By number of axis: 1, 2, 3 By sensitivity range: from navigation grade (high) to smart phones to kids toys (very low) By pricing: $20,000/each to less than $1/each By frequency: equilibrium(very low frequency), earth quake detection (low frequency), missile intelligence (very high frequency)

Applications:

Chang Liu

Game playing, consumer electronics, digital cameras Military missile and projectiles Position sensitive security locks Vibration alerts Pedometers Automobile vibration and collision Smart pen for hand writing recognition Condition based maintenance Smart hospital beds

Why put a $1 accelerometer in a digital camera that costs only $25 to build?

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Chang Liu

Vitality Glow Cap

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Trends
Circuit integration
Signal condition Analog-digital conversion Decision making Clocks

MEMS and circuits are merging Improvement of performances, e.g., noise Integration with other sensors sensor fusion
Gyros Bearing sensors GPS Temperature

Price drop
Extremely high function for $1
Chang Liu

Chang Liu

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Applications at Macroscale
Spot-weldable strain gauges are used with strain gauge sensors and a vibrating wire indicator or data logger to monitor strain in steel members. Typical applications include:
Monitoring structural members of buildings and bridges during and after construction. Determining load changes on ground anchors and other post-tensioned support systems. Monitoring load in strutting systems for deep excavations. Measuring strain in tunnel linings and supports. Monitoring areas of concentrated stress in pipelines. Monitoring distribution of load in pile tests.

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Metal Strain Gauge

For metals, the resistivity is not changed significantly by the stress. The gauge factor is believed to be contributed by the change of dimensions. These may be made from thin wires or metal films that may be directly fabricated on top of micro structures. Typical strain gauge pattern is shown in the following figure. Thin film strain gauges are typically fabricated on top of flexible plastic substrates and glued to surfaces. etched foil gauges
These strain gauges consist of a conduction path etched onto metal clad plastic film. The strain gauges are designed to be glued, using very special procedures onto the component to be tested. When the component stretches, the strain gauge will also stretch as will the etched conduction path.

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An interactive guide can be found at http://www.measurementsgroup.com/guide/index.htm

Basic Formula for Describing Piezoresistivity

G is called Gauge Factor of a piezoresistor. It determines the amplification factor between strain and resistance change.
R L =G R L

R R G= R = l R l
Material Metal foil Semiconductor (crystal) Diffused semiconductor 1-5 80-150 10-200

stress = sE

Gauge factor

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Why the big difference between materials?

Two Primary Classes of Piezo-resistor Configuration

(a) Longitudinal Piezoresistor

(b)

(c) F Transverse Piezoresistor

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Example of a Piezoresistive Force Sensor

Gauge factor is a function of doping material or doping concentration. Because grains are randomly oriented, gauge factor is not sensitive to orientation.
N type Phosphorous doped Si
-22 -20 -18 -16 -14 -12 -10 -8 -8 -6 -4 -2 1019 1020 1021 30 28 26 24 22 20 18 16 14 12 10 8 1019 1020 1021

P type Boron doped Si

Chang Liu

contact region with metal leads (heavily doped)

resistor (moderately doped)

desired resistor pattern

doping contact region dopant atoms mask shield contact doping mask shield

(a)

mask shield

A-A mask shield

heavy doping

doping resistor (b)

mask shield

resistor doping

mask shield

A-A ohmic contact mask shield metal

moderate doping ohmic contact

metal leads (c)

A-A

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Transduction Principle Acceleration Inertial Force ma Displacement Of structure Capacitive

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Prof. Richard Muller and Roger Howe

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Chang Liu

Roger Howe

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Ask, not about how many times your paper is cited. Ask not the average citation number of the journal you publish your paper in

Ask how much money, job, and value you generate from each paper.

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Accelerometers

Motorcycle security sensor

Analog Devices Accelerometer

Full range: 0-5g sensitivity: 200 mV/g resolution: 5 mg at 100 Hz noise floor: 0.5 mg/(Hz)1/2
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Also, 10 million sold on 5/15/1998 by Motorola

BT Smart Quill

http://www.bt.com/innovation/exhibition /smartquill/index.htm

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Transduction Principle Acceleration Inertial Force ma Stress of Structure Piezoresistive Piezoelectric

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Displacement Of structure Capacitive Optical Tunneling

Piezoresistive Accelerometer

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Condition for Mechanical Equilibrium

Total force on a given mechanical member is zero. Total moment on a given mechanical member is zero.

Tensile Compressive

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t fixed end cantilever

L M=Fx

w
F

emax
F

smax(x)
distributed tensile force distributed compressive force
dF(x,h) h

dA

smax(x)

F F

smax
tensile neutral plane
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h

t compressive x

-smax

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Good vs. Bad Designs

doped resistor (a)

doposited resistor

(b) ineffective design #1

(c) ineffective design #2

(d)
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Case 6.2 Bulk Micromachined Single-Crystal Silicon Accelerometer

proof mass
A

piezoresistor

f
le ra tio n

ac ce
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r
I t

l
w

I I I

piezoresistor heavily doped region

silicon

(a)

oxide

ion flux (e)

Al PI Cr/Pt/Ni/Pt Cr/Au Permalloy PR Hinge Ni

(a)

(b)

p+ doped (b)

ion flux
(e)

(c)

(f) oxide

oxide (c)

(d)

(g)

oxide
(f )

(d)

(e)

(h)

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Pros and Cons of Piezo vs. Capacitive

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Options
Material
Metal Single crystal silicon Silicon germanium Polysilicon Epitaxial silicon

Transduction materials
Doping concentration, geometry

Geometry Pressure Humidity Processing

Fully integrated, assembled.

Manufacturing ten plants to choose around the globe

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

What are some specs that you can think of? Lets name them

Chang Liu

Legends program interface static mechanics control analog circuit mass, spring damping
package dimension bandwidth minimum detection signal cost

areas of investigation

dynamics multiphysics modeling digital circuit

product attributes

bias voltage

mask layout
power & energy

operatiing temperature range

process flow selectivity high volume production packaging

pressure level

environment immunity

stress

temperature stabiltiy doping level noise

ckt integration wafer sizes

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encapsulation
dynamic range

doping level

foundry compatibility
yield

transduction principle

The Three Pillars of MEMS design

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materials

fabrication

Legends program interface static mechanics multiphysics modeling analog circuit mass, spring damping
package dimension bandwidth minimum detection signal cost

areas of investigation

dynamics control

product attributes

digital circuit

bias voltage

mask layout
power & energy

operatiing temperature range

process flow pressure level selectivity high volume production packaging

environment immunity

stress

temperature stabiltiy doping level noise of material

ckt integration wafer sizes

Chang Liu

encapsulation
dynamic range

doping level

foundry compatibility
yield

transduction principle

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Transduction Principle Acceleration Inertial Force ma Stress of Structure Piezoresistive Piezoelectric

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Displacement Of structure Capacitive Optical Tunneling

Displacement Of fluid mass

Chang Liu

1996

Chang Liu

1996

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What happened next?

1999, Dr. Yang Zhao of Analog Devices took the patent and started a company called MEMSIC In 2007, MEMSIC went public

Chang Liu

Chang Liu

Chang Liu

Chang Liu

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

STMicroelectronics THELMA Process

Thick Epi-Poly Layer for Micro-actuators and Accelerometers metal thick epitaxial polysilicon

(1)

silicon substrate (5)

thermal oxide

(2)
LPCVD polysilicon

deep reactive ion etching trenches

(6)

(3)
sacrificial release PECVDoxide sacrificial layer

(4)
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(7)

Chang Liu

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

Case 6.1: Analysis of Accelerometer

Acceleration induced force F, F=ma. The force induces stress at the fixed end of the cantilever beam. The stress is detected by chance in resistance. Assumptions
assume entire resistance is concentrated at the anchor; for moment of inertia at the end, ignore the thickness of the resistor. Assume the stress on the resistor is the maximum value. The proof mass is rigid. It does not bend because of the significant thickness and width.

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Analysis of Sensitivity
Under a given a, the force has a magnitude F = m a L The moment applied at the fixed end of the beam is M = F (l + )
2

Therefore the maximum strain, which is the strain experienced by the resistor, is
max
L F l + t 6 F (l + L )t Mt 2 2 = = = 3 3 Ewt 2 EI Ewt 6

The strain is applied in the longitudinal direction of the resistor. Assuming the gauge factor is G, the change in resistance is
R = G max R L L 6GF (l + ) 6Gm(l + ) 2 = 2 a = Ewt 2 Ewt 2

Chang Liu

Outline
Definition and applications The development of accelerometer before MEMS Transduction principle Transduction options Technical specifications Analog Devices accelerometers and development history MEMSIC accelerometer STMicroelectronics accelerometer Static modeling Dynamic modeling

Chang Liu

spring

damper package

K m f(t)
capacitor
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c P T x

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Things that relate to Designs

K M Resonant frequency Input voltage Bandwidth

Design affects materials

Fabrication methods Materials Patents

Materials dictates design

Patents, expertise, cost

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Things that relate to pressure

Damping regime
Overdamped, low Q, large damping Critical Under, high Q

Energy consumption Noise

Molecules impinge on mechanical structures

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How do you keep something under critical damped condition, in a $1 device? FOREVER?

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MEMS Gyroscope

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- Fc

v
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- Fc

push
v

Fc

v
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v Fc v Fc

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- Fc

Fc v
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z
yaw

Fc v v

Fc

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v y
pitch

Fc Fc

Fc v

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Fc Fc x
roll

v Fc v

Fc

v v

pitch

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Chang Liu

MEMS Gyro
First demonstrated at Draper lab in 1991 Bosch commercialized for automotive VSC in 1997 2003, the year InvenSense Started
Over 10 companies exist, addressing automotive Consumer grade MEMS gyro were thought not feasible
Impossible to go beyond $3/axis 2006, no market analyst have identified MEMS gyros for consumer market 2007, InvenSense introduced 1st integrated dual axis gyro at $1/axis 2005, STMicroelectronics Benedetto Vigna bet his house

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Nasiri-Fabrication Process InvenSense

MEMS wafer silicon cap wafer
MEMS silicon mass

vacuum

CMOS wafer
wafer bond/encapsulation (InvenSense Proprietary)

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Invensense Single Axis Gyro - Circuit

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Chang Liu

Steve Nasiri Lessons Learned

Must have a sustainable competitive advantage
Make your process as MOS compatible as you can Aim at much lower cost than existing solution (2x to 3x)

Consider Multiple foundries as early as possible

Develop proprietary process fabrication IP that can scale

Design for low cost solution

Invest in in house testing and calibration facilities

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Sensor Fusion

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Chang Liu