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Introduction 319 10.2 Acoustic Wave Propagation 320 10.3 Acoustic Wave Propagation Representation 321 10.

4 Introduction to Acoustics 321 10.4.1 Particle Displacement and Strain 321 10.4.2 Stress 323 10.4.3 The Piezoelectric Effect 324 10.5 Acoustic Wave Propagation 325 10.5.1 Uniform Plane Waves in a Piezoelectric Solid: 325 Quasi-Static Approximation 10.5.2 Shear Horizontal or Acoustic Plate Modes 328 10.5.3 Love Modes 330 10.6 Concluding Remarks 334 References 334 11 IDT Microsensor Parameter Measurement 337 11.1 Introduction to IDT SAW Sensor Instrumentation 337 11.2 Acoustic Wave Sensor Instrumentation 337 11.2.1 Introduction 337 11.3 Network Analyser and Vector Voltmeter 338 11.4 Analogue (Amplitude) Measuring System 339 11.5 Phase Measurement System 340 11.6 Frequency Measurement System 341 11.7 Acoustic Wave Sensor Output Frequency Translation 342 11.8 Measurement Setup 343 11.9 Calibration 344 References 345 12 IDT Microsensor Fabrication 347 12.1 Introduction 347 12.2 Saw-IDT Microsensor Fabrication 347 x CONTENTS 12.2.1 Mask Generation 347 12.2.2 Wafer Preparation 348 12.2.3 Metallisation 349 12.2.4 Photolithography 350 12.2.5 Wafer Dicing 352 12.3 Deposition of Waveguide Layer 353 12.3.1 Introduction 353 12.3.2 TMS PECVD Process and Conditions 354 12.4 Concluding Remarks 358 References 358 13 IDT Microsensors 359 13.1 Introduction 359 13.2 Saw Device Modeling via Coupled-mode Theory 360 13.3 Wireless SAW-based Microsensors 364 13.4 Applications 367 13.4.1 Strain Sensor 367 13.4.2 Temperature Sensor 371 13.4.3 Pressure Sensor 375 13.4.4 Humidity Sensor 376 13.4.5 SAW-Based Gyroscope 380 13.5 Concluding Remarks 395 References 395 14 MEMS-IDT Microsensors 397 14.1 Introduction 397 14.2 Principles of a MEMS-IDT Accelerometer 398 14.3 Fabrication of a MEMS-IDT Accelerometer 399 14.3.1 Fabrication of the SAW Device 401 14.3.2 Integration of the SAW Device and Seismic Mass 402 14.4 Testing of a MEMS-IDT Accelerometer 402 14.4.1 Measurement Setup 403

14.4.2 Calibration Procedure 404 14.4.3 Time Domain Measurement 405 14.4.4 Experimental 406 14.4.5 Fabrication of Seismic Mass 408 14.5 Wireless Readout 412 14.6 Hybrid Accelerometers and Gyroscopes 414 14.7 Concluding Remarks 416 References 416 15 Smart Sensors and MEMS 417 15.1 Introduction 417 15.2 Smart Sensors 421 15.3 MEMS Devices 434 15.4 Concluding Remarks 442 References 443 XI Appendices A. List of Abbreviations 445 B. List of Symbols and Prefixes 449 C. List of Some Important Terms 455 D. Fundamental Constants 457 E. Unit Conversion Factors 459 F. Properties of Electronic & MEMS Metallic Materials 461 G. Properties of Electronic & MEMS Semiconducting Materials 463 H. Properties of Electronic & MEMS Ceramic and Polymer Materials 465 I. Complex Reciprocity Relation and Perturbation Analysis 467 J. Coupled-mode Modeling of a SAW Device 477 K. Suggested Further Reading 481 L. Webography 487 M. List of Worked Examples 491 Index 493

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