C160-E010

Thermal Analysis 60 Series Application Data Book

Polymer and Electronic Material

Contents
Plastic
1.1 Influence of heat treatment on polyethyleneterephthalate (PET) -- 1 1.2 Heat history of polyethertherketone (PEEK) ----- 2

Condensation Reaction of Phenol Resin

6.1 Condensation reaction of phenol resin ---------- 20

Quantification of Reinforcing Materials Characterization by Melting and Crystallization

2.1 Melting and crystallization of nylon A and B ----- 3 7.1 Quantification of glass fiber in polyethyleneterephthalate (PET) --- 21 7.2 Quantification of carbon black in styrene-butadiene rubber (SBR) - 22

Characterization by Glass Transition

3.1 Glass transition of high-impact polystyrene (PS) -- 5 3.2 Glass transition of polyvinylchloride (PVC) ------- 7 3.3 Glass transition of polyimide (PI) ------------------- 8

TMA Measurement
8.1 Thermal stress of polyethyleneterephthalate (PET) fiber -- 23 8.2 Shrink stress of magnetic tape --------------------- 24 8.3 Softening temperature of polymethylmethacrylate (PMMA) --- 25

Measurement of Water Content by TG

4.1 Water content in polyethyleneterephthalate (PET) -- 9 4.2 Water content in polyethyleneterephthalate (PET) fiber -- 10 4.3 Water content in polyimide (PI) film -------------- 11

Electronic Materials
9.1 Thermal expansion of a printed circuit board -- 26 9.2 Decomposition of a diode --------------------------- 27 9.3 Quantification of quartz in epoxy resin ----------- 28 9.4 Melting point of lead free solder ------------------- 29

Measurement of Decomposition and Oxidation Reaction

5.1 Decomposition of nylon 6 --------------------------- 12 5.2 Decomposition characteristic of modified polyphenyleneoxide (PPO) - 13 5.3 Decomposition of polyethyleneterephthalate (PET) ---- 15 5.4 Oxygen induction time (OIT) of polyethylene (PE) ---- 17 5.5 Thermal decomposition of Teflon ----------------- 19

Plastic
1.1 Influence of heat treatment on polyethyleneterephthalate (PET)
s Explanation PET bottle was measured by DSC. With the original sample, the peak by melting is mainly observed at 254.8 C. It shows that the structure before heating was crystalline. On the other hand, as for DSC (2nd-heating) of an original sample which is cooled rapidly after heating, glass transition is observed at 77.6 C. Because the glass transition occurs in a non-crystalline solid, it turns out that the PET becomes non-crystalline when it is cooled rapidly. The exothermic peak at 136.8C means that the non-crystalline PET changes to the crystalline PET at this temperature. s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Flow Rate Heating Rate : PET : 6.72mg : 50mL/min : 10C/min

Atmospheric Gas : N2 [Temperature Program]

DSC mW

5.00

PET bottle(original)
136.81C -59.75J/g

0.00

77.60C 31.49J/g

254.84C

PET bottle(2nd-heating)
-5.00

-38.86J/g 254.00C

100.00 Temp [C]

200.00

300.00

Fig. 1.1.1 DSC curves of PET bottle (original and 2nd-heating)

1.2. Heat history of polyetheretherketone (PEEK)

s Explanation It is known that the thermal character and the mechanical property which polymer material has will change a lot with the heat history which material received. In the case of a thermoplastic resin, since solid crystal structure changes depending on the cooling speed after melting, if the sample which the cooling speed differ is heated by DSC, many case where a difference is observed in peak form will be seen. Since glass transition is observed at 144.6C, film-like PEEK is non-crystalline. On the other hand, since only the melting at 339.2C is mainly observed, the block form PEEK is crystalline. In spite of being same PEEK, it is expected that the film does not crystallize since it was cooled rapidly in molding, and that the block was cooled gradually and crystallized well. s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Sample Sample Amount Flow Rate Heating Rate : PEEK film : 5.86mg : PEEK block : 8.44mg : 50mL/min : 20C/min

Atmospheric Gas : N2 [Temperature Program]

DSC mW/mg

181.42C
1.00

PEEK film
0.00

144.55C -31.51J/g 341.74C

PEEK block
-1.00

-35.71J/g 339.22C
-2.00 0.00 100.00 200.00 Temp [C] 300.00 400.00

Fig. 1.2.1 DSC curves of PEEK

Characterization by Melting and Crystallization

2.1 Melting and crystallization of nylon A and B
s Explanation The melting and the crystallization of nylon A and B which a lot differs were measured. In melting process, a difference is looked at endothermic peak width by the difference in a lot. The exothermic peak form by crystallization differs in cooling process, and the difference between lots is seen further notably. s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Sample Sample Amount Flow Rate Heating Rate Cooling Rate : nylon A : 5.35mg : nylon B : 5.52mg : 40mL/min :10C/min : -10C/min

Atmospheric Gas : N2 [Temperature Program]

DSC mW

nylon A
2.00

108.25C
0.00

nylon B

-2.00

102.68C 199.25C

-4.00

200.17C

100.00 Temp [C]

200.00

Fig. 2.1.1 DSC curves of nylon A, B (melting)

DSC mW

2.00

153.24C

0.00

nylon A
147.31C
-2.00

160.47C

-4.00

nylon B

100.00

Temp [C]

200.00

Fig. 2.1.2 DSC curves of nylon A, B (crystallization)

Characterization by Glass Transition

3.1 Glass transition of high-impact polystyrene (PS)
s Explanation If a non-crystalline high polymer is heated, in order that a high-polymer chain may begin internal rotation at a certain temperature, specific heat will change abruptly. This temperature is called glass transition temperature. Glass transition temperature is characteristic temperature showing the thermal character of a polymer and reflects the molecular structure and the heat history of a sample directly. Here, glass transition of PS and high-impact PS was measured. Glass transition temperature of highimpact PS is falling about 14C than that of general PS. Moreover, after heat-treating each sample at 150C, when the rapid cooling was carried out, glass transition temperature went up 5-7C, respectively. s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Sample Sample Amount Heating Rate : PS : 10.18mg : High-impact PS : 10.02mg : 20C/min

[Temperature Program]

DSC mW

2.00

PS
92.39C

0.00

High-impact PS
78.29C

103.90C

-2.00

87.20C

50.00

100.00 Temp [C]

150.00

Fig. 3.1.1 DSC curves of PS and High-impact PS

DSC mW

2.00

PS
97.82C

High-impact PS
0.00

85.31C

-2.00

50.00

100.00 Temp [C]

150.00

Fig. 3.1.2 DSC curves after heat treatment

Characterization by Glass Transition

3.2 Glass transition of polyvinylchloride (PVC)
s Explanation Here, the glass transition temperature of PVC which changed the amount of addition of plasticizer was measured. Sample B has much amount of plasticizer compared with A, and glass transition temperature is low about 7.8C. s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Sample Sample Amount Heating Rate : PVC(A) : 10.76mg : PVC(B) : 9.77mg : 20C/min

[Temperature Program]

DSC mW 2.00

1.00

PVC(A)

81.68C

0.00

PVC(B)
-1.00

73.87C

-2.00

-3.00 50.00 100.00 Temp [C] 150.00

Fig. 3.2.1 DSC curves of PVC

3.3 Glass transition of polyimide (PI)

s Explanation Glass transition temperature of polyimide is 307.6C and high. Curing of unreacted polyimide corresponding to 6.2J/g was detected at 371.4C. Moreover, in second run, glass transition temperature became 314.8C and moved to 7.2C higher-temperature side . s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Flow Rate Heating Rate : PI : 7.56mg : 30mL/min : 20C/min

Atmospheric Gas : N2 [Temperature Program]

DSC mW

0.00

1st run

307.62C

371.40C

6.15J/g
-2.00

2nd run

314.82C

-4.00

200.00

300.00 Temp [C]

400.00

Fig. 3.3.1 DSC curves of Polyimide

Measurement of Water Content by TG

4.1 Water content in polyethyleneterephthalate (PET)
s Explanation Water content in polymer needs evaluation and control, since it affects the characteristic of polymer. Here, the trace water of 18g in PET was quantified. s Analytical Conditions Instrument : TGA-50 Sample Sample Amount Heating Rate : PET film : 31.11mg : 5C/min

[Temperature Program]

TGA % 100.20

100.10

-0.018mg -0.058%
100.00

99.90

99.80

99.70 50.00 Temp [C] 100.00

Fig. 4.1.1 TG curve of PET

4.2 Water content in polyethyleneterephthalate (PET) fiber

s Explanation Water content and the trace quantity of volatile components in PET fiber were quantified Since this sample is a fiber-like, it is difficult to sample in the usual crucible cell (65mm). It can sample easily by using the large capacity cell of TGA-51 exclusive use, and TG macro crucible (1114mm) (referring to the following figure) this time, and a very small quantity of water of 0.167% and very small quantities of volatile components were measured. s Analytical Conditions Instrument : TGA-51 Sample Sample Amount Flow Rate Heating Rate : PET fiber : 422.31mg : 20mL/min : 5C/min

Atmospheric Gas : N2 [Temperature Program]

Fig. 4.2.1 Macro crucible

TGA mg

0.00

-0.167%

-1.00

50.00

100.00 Temp [C]

150.00

Fig. 4.2.2 TG curve of PET fiber

10

Measurement of Water Content by TG

4.3 Water content in polyimide (PI) film
s Explanation Since this PI is a film-like, a sampling was difficult in the usual cell, as shown in the following figure, PI film was squarely cut in accordance with the height of TG macro crucible (1012mm) and the rounded film was put in the crucible. Since the measuring was carried out using a large amount of sample of 300mg, a very slight loss in quantity of 1.145% could be detected with high sensitivity. s Analytical Conditions Instrument : TGA-51 Sample Sample Amount Cell Flow Rate Heating Rate : PI film : 311.12mg : Platinum crucible : 20mL/min : 10C/min

Atmospheric Gas : N2

[Temperature Program]

Fig. 4.3.1 Sampling of a film-like sample

TGA %

100.00

-1.146%

99.00

98.00

0.00

100.00 Temp [C]

200.00

11

Fig. 4.3.2 TG curve of PI film

Measurement of Decomposition and Oxidation Reaction

5.1 Decomposition of nylon 6
s Explanation Nylon 6 was heated in nitrogen. On DTA curve, a endothermic peak at 222C corresponds to melting and a endothermic peak at 447.3C corresponds to decomposition reaction. The endothermic change after 500C is also a decomposition reaction. Moreover, the very small weight loss seen by 200C on TG curve is caused by dehydration. The weight loss by decomposition is measured after that. s Analytical Conditions Instrument : DTG-60 Sample Sample Amount : nylon 6 : 9.43mg

Atmospheric Gas : N2 [Temperature Program] Heating Rate : 10C/min

TGA %

DTA uV

100.0

TG curve

-2.428% -94.878%
100.0

50.0

-1.771%
0.0

DTA curve
0.0

222.04C 601.85C
-50.0

447.31C
0.0 200.0 400.0 Temp [C] 600.0 800.0

Fig. 5.1.1 TG-DTA curves of nylon 6

12

Measurement of Decomposition and Oxidation Reaction

5.2 Decomposition characteristic of modified polyphenyleneoxide (PPO)
s Explanation Measurement of the decomposition process by TGA is performed to evaluate the thermal resistance property of a sample by thermal analysis. Performs the measurement raising temperature at constant rate, and finds the start temperature of decomposition and the ratio of decomposition. Here, modified PPO was measured. Seemingly, it turns out that decomposition has started from near 300C. Moreover, the progress degree of the decomposition reaction at constant temperature can also be measured directly. Here, the decomposition process when holding at 300C was measured. s Analytical Conditions Instrument Sample(Fig.5.2.1) Sample Amount(Fig.5.2.1) Sample(Fig.5.2.2) Sample Amount(Fig.5.2.2) Atmospheric Gas Flow Rate [Temperature Program] Heating Rate(Fig.5.2.1) : 10C/min Holding Temperature(Fig.5.2.2) : 300C : TGA-50 : modified PPO : 12.05mg : modified PPO : 11.6mg : N2 : 30mL/min

TGA %

417.69C
100.00

-10.331mg -85.734%

50.00

0.00 0.00 100.00 200.00 300.00 Temp [C] 400.00 500.00 600.00

13

Fig. 5.2.1 TG curve of modified PPO

TGA % 105.00

Temp C

600.00

TG
100.00

60.00min -1.448%

90.00min -1.767%

120.00min -2.026%
400.00

95.00 200.00

Temperature

90.00 0.00 50.00 Time [min] 100.00 150.00

0.00

Fig. 5.2.2 TG curve of modified PPO (Isothermal)

14

Measurement of Decomposition and Oxidation Reaction

5.3 Decomposition of polyethyleneterephthalate (PET)
s Explanation Here, PET was measured. Seemingly, it turns out that decomposition has started from near 350C. Moreover, it turns out that decomposition is proceeding also at a low temperature of 280C. s Analytical Conditions Instrument Sample(Fig.5.3.1) Sample Amount(Fig.5.3.1) Sample(Fig.5.3.2) Sample Amount(Fig.5.3.2) Atmospheric Gas Flow Rate [Temperature Program] Heating Rate(Fig.5.3.1) : 10C/min Holding Temperature(Fig.5.3.2) : 280C : TGA-50 : PET : 10.71mg : PET : 11.32mg : N2 : 30mL/min

TGA %

424.05C
100.00

-99.076%

50.00

0.00

0.00

200.00

400.00 Temp [C]

600.00

800.00

15

Fig. 5.3.1 Programmed Thermal Decomposition of PET

TGA %

Temp C

TG
100.00

60.00min -1.846%

90.00min -5.141%

120.00min -9.170%
600.00

90.00

400.00

Temperature
80.00 200.00

70.00 0.00 50.00 Time [min] 100.00

0.00 150.00

Fig. 5.3.2 Isothermal Decomposition of PET

16

Measurement of Decomposition and Oxidation Reaction

5.4 Oxygen induction time (OIT) of polyethylene (PE)
s Explanation PE is used for covering of an electric wire. However, by using it for a long period of time, oxygen in air is absorbed and it deteriorates gradually. The anti-oxidant is added in PE in order to prevent this oxidation reaction. This effect can be investigated by measuring oxygen induction time (OIT) using DSC. A sample is heated in nitrogen to the temperature to measure, and after reaching a purposed temperature, atmospheric gas is changed to oxygen. The time from inducing oxygen to the beginning of the exothermic peak by oxygen absorption is measured. Here, when held at 190C, oxygen induction time was 78.58 minutes, and when held at 200C it became 20.46 minutes. s Analytical Conditions Instrument Software Sample Sample Amount(Fig.5.4.1) Sample Amount(Fig.5.4.2) Atmospheric Gas Flow Rate [Temperature Program] Holding Temperature(Fig.5.4.1) : 190C Holding Temperature(Fig.5.4.2) : 200C : DSC-60 : OIT : PE : 5.05mg : 5.05mg : N2O2 : 50mL/min

DSC mW

Temp C

Temperature
10.00

200.00

100.00

DSC
0.00

Change from N2 to O2

78.58min

0.00 0.00 50.00 Time [min] 100.00

17

Fig. 5.4.1 Oxygen induction time of PE at 190C

DSC mW 20.00

Temp C

Temperature
200.00 10.00

0.00

DSC
20.46min Change from N2 to O2
100.00

-10.00

-20.00 -10.00 0.00 10.00 20.00 Time [min] 30.00 40.00

0.00 50.00

Fig. 5.4.2 Oxygen induction time of PE at 200C

18

Measurement of Decomposition and Oxidation Reaction

5.5. Thermal decomposition of Teflon
s Explanation Thermal decomposition measurement of Teflon which generates reactive gas was performed. s Analytical Conditions Instrument : TGA-50 Sample Sample Amount Flow Rate Heating Rate : Teflon : 24.47mg : 40mL/min : 10C/min

Atmospheric Gas : Air [Temperature Program]

TGA %

569.16C
100.00

-99.988%

50.00

0.00

0.00

200.00

400.00 Temp [C]

600.00

19

Fig. 5.5.1 TG curve of Teflon

Condensation Reaction of Phenol Resin

6.1 Condensation reaction of phenol resin
s Explanation Evaporation of water needs to be prevented in the calorimetric measurement of a condensation reaction. Since a reaction occurs at high temperature of 169C, it was measured using the high pressure cell (hermetic crucible). Glass transition was found at 70.9C. s Analytical Conditions Instrument : DSC-60 Sample Sample Amount Cell Flow Rate Heating Rate : Phenol Resin : 3.44mg : Aluminium high pressure cell : 30mL/min : 10C/min

Atmospheric Gas : N2 [Temperature Program]

DSC mW

1.00

169.10C

70.90C
0.00

50.76J/g

81.30C
-1.00

100.00 Temp [C]

200.00

Fig. 6.1.1 DSC curve of Phenol Resin

20

Quantification of Reinforcing Materials

7.1 Quantification of glass fiber in polyethyleneterephthalate (PET)
s Explanation Inorganic reinforcing materials are added for the improvement of mechanical strength and heat resistance. If the sample is heated in air using TG, this quantity can be measured easily. TG curve shows that decomposition starts from near 400C,and ends near 650C. During this period, PET decomposes completely, and inorganic residue remains. Therefore, the quantity that deducted the amount of decomposition of PET from the amount of original sample becomes the amount of glass fiber. (100-65.85=34.15%) s Analytical Conditions Instrument : TGA-50 Sample Sample Amount Flow Rate Heating Rate : PET : 11.19mg : 30mL/min : 50C/min

Atmospheric Gas : Air [Temperature Program]

TGA %

100.00

-7.369mg -65.853%

50.00

0.00 0.00 200.00 400.00 Temp [C] 600.00

21

Fig. 7.1.1 TG curve of PET

7.2 Quantification of carbon black in styrene-butadiene rubber (SBR)

s Explanation In DTG, quantification is performed by heating, controlling atmosphere. After setting a sample to equipment first, atmosphere is replaced with nitrogen enough. If a sample is heated to about 600C, the weight loss by thermal decomposition of SBR will be observed by TG. If atmosphere is changed to air after SBR decomposes completely, the weight loss by oxidation of carbon black will be observed shortly. Quantified value became 28.2%. In DTA, the endothermic peak by decomposition of SBR and the exothermic peak by oxidation of carbon black are observed. s Analytical Conditions Instrument : DTG-60 Sample Sample Amount : SBR : 20.19mg

Atmospheric Gas : N2Air [Temperature Program] Heating Rate : 20C/min

TGA mg

DTA uV

TG curve
0.0

2000

-68.405%

-10.0

-28.162%
1000

-20.0

-30.0

DTA curve
0 -40.0 0.0 10.0

497.01C
20.0 Time [min] 30.0 40.0

Fig. 7.2.1 TG-DTA curves of SBR

22

TMA Measurement
8.1 Thermal stress of polyethyleneterephthalate (PET) fiber
s Explanation Thermal stress measurement is the method which measures the strength of stress to the change of temperature after giving a constant strain to a sample and maintaining the rate of strain, and can know size stability, form stability, etc. Here, PET fiber was measured. 1% of strain was given to the sample and heated. The increase in stress is observed from 97.6C. This was caused by the shrinkage of strained fiber. In case of the sample that was made by being strained and oriented, if it exceeds the processing temperature at the time of drawing, the orientation is canceled and the shrinkage is observed. After that, the stress decreases gradually, and the sample melts near 255C,then the stress becomes 0. s Analytical Conditions Instrument : TMA-60 Sample : PET fiber Sample Length : 15.25mm [Temperature Program] Heating Rate : 10C/min

LOAD g 20.00

141.05C

97.64C
10.00

254.76C

0.00 100.00 Temp [C] 200.00 300.00

23

Fig. 8.1.1 Thermal stress measurement of PET fiber

8.2 Shrink stress of magnetic tape

s Explanation Shrink stress measurement is the method that generates power and measures that power so that it may not shrink, when the strain of a sample is set to 0 and a sample shrinks by heating. Here, the magnetic tape was measured. It turns out that the shrinkage starts from 100.7C, and the stress became 27.2g at maximum. s Analytical Conditions Instrument : TMA-60 Sample : Magnetic tape Sample Length : 12.25mm [Temperature Program] Heating Rate : 10C/min

LOAD g 40.00

30.00

194.17C 27.23g

20.00

10.00

0.00

100.71C
-10.00 100.00 Temp [C] 200.00 300.00

Fig. 8.2.1 Shrink stress measurement of magnetic tape

24

TMA Measurement
8.3 Softening temperature of polymethylmethacrylate (PMMA)
s Explanation Penetration measurement can be used as an index that mainly estimates the softening temperature and the heat modification temperature of plastic material. Here, the softening temperature of PMMA was measured. It turns out that softening of a sample has occurred from near 111.6C. s Analytical Conditions Instrument : TMA-60 Sample : PMMA Sample Length : 10.03mm [Temperature Program] Heating Rate : 5C/min

TMA um 100.00

111.56C

50.00

0.00

50.00 Temp [C]

100.00

25

Fig. 8.3.1 TMA curve of PMMA

Electronic Materials
9.1 Thermal expansion of a printed circuit board
s Explanation With the parts with which an epoxy resin is joined to metal like a printed circuit board or IC, a coefficient of thermal expansion becomes important. Here, the expansion curve of a printed circuit board is shown. The inflection point of glass transition is observed near 90C, and it turns out that the coefficient of thermal expansion is changing remarkably before and behind it. s Analytical Conditions Instrument : TMA-60 Sample : Printed circuit board Sample Length : 10.01mm [Temperature Program] Heating Rate : 5C/min

TMA % 3.00

2.00

1.00

120.00C 189.8710-6/K 170.00C 89.36C

0.00

25.00C 75.8010-6/K 80.00C

-1.00 0.00 100.00 Temp [C] 200.00

Fig. 9.1.1 TMA curve of a Printed circuit board

26

Electronic Materials
9.2 Decomposition of a diode
s Explanation The diode of semiconductor parts was measured. A part of component which constitutes the diode is melting near 225C, and decomposition has started from near 300C. s Analytical Conditions Instrument : DTG-60 Sample Sample Amount : Diode : 10.1mg

Atmospheric Gas : Air [Temperature Program] Heating Rate : 10C/min

TGA %

DTA uV 400.00

TG curve
100.00

-58.752% 489.84C
300.00

50.00

-13.178%

200.00

435.37C
100.00 0.00

DTA curve
225.85C
0.00 100.00 200.00

361.31C
0.00

-50.00

300.00 Temp [C]

400.00

500.00

600.00

27

Fig. 9.2.1 TG-DTA curves of a Diode

9.3 Quantification of quartz in epoxy resin

s Explanation Here, the epoxy resin was heated in air. TG shows that decomposition starts from near 300C, and ends near 550C. During this period, epoxy resin decomposes completely, and inorganic residue remains. Therefore, the quantity that deducted the amount of decomposition of epoxy resin from the amount of original sample becomes amount of filling of quartz. (100-33.8=66.2%)Moreover, in DTA, glass transition of epoxy resin at 85C is measured, and in 300-550C, endothermic and exothermic peaks corresponding to decomposition are measured. Furthermore, a trace endothermic peak at 580C corresponds to transition of quartz. s Analytical Conditions Instrument : DTG-60 Sample Sample Amount Flow Rate Heating Rate : Epoxy resin : 22.67mg : 150mL/min : 20C/min

Atmospheric Gas : Air [Temperature Program]

TGA %

DTA uV 150.0

TG curve
100.0

489.9C

-33.83%

100.0

50.0 50.0

DTA curve
84.9C
0.0

358.3C
0.0 200.0 400.0 Temp [C]

425.1C

579.9C

600.0

Fig. 9.3.1 Quantification of quartz in epoxy resin

28

Electronic Materials
9.4 Melting point of lead free solder
s Explanation Development of the lead free solder that does not contain a lead from the problem of the environmental pollution is performed. Here, melting point of the lead free solder with which the conventional Sn-Pb solder differs from composition ratio of components was measured. Although, as for the solder containing a lead, melting was observed at 182.3C, with lead free solder, melting was observed at 209.2C and 217.5C. s Analytical Conditions Instrument : DSC-60 Sample (Fig.9.4.1) : Solder Sample Amount Sample Amount Sample Amount : 11.26mg : 10.38mg : 10.71mg Sample (Fig.9.4.2) : Lead free solder Sample (Fig.9.4.3) : Lead free solder Atmospheric Gas : N2 [Temperature Program] Heating Rate : 10C/min

DSC mW/mg 5.00

182.25C
4.00

3.00

2.00

1.00

0.00 150.0 200.0 Temp [C] 250.0

29

Fig. 9.4.1 DSC curve of SnPb solder

DSC mW/mg 0.00

209.23C
-2.00

-4.00

-6.00 150.0 200.0 Temp [C] 250.0

Fig. 9.4.2 DSC curve of lead free solder(SnAgBiCu)

DSC mW/mg 0.00

217.54C

-2.00

-4.00

-6.00 150.0 200.0 Temp [C] 250.0

Fig. 9.4.3 DSC curve of lead free solder (SnAgCu)

30

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