Tg4011ag Final 7115 100929

ORDER NO.
KM41009270CE
Telephone Equipment
Model No.
KX-TG4011AGT KX-TG4012AGT KX-TG4013AGT KX-TGA403AGT
Expandable Digital Cordless Phone

T: Black Metallic Version (for Argentina)
Panasonic System Networks Co., Ltd. 2010 Unauthorized copying and distribution is a violation of law.
KX-TG4011AGT/KX-TG4012AGT/KX-TG4013AGT/KX-TGA403AGT
TABLE OF CONTENTS
PAGE 1 Safety Precautions----------------------------------------------- 4 1.1. For Service Technicians --------------------------------- 4 2 Warning -------------------------------------------------------------- 4 2.1. Battery Caution--------------------------------------------- 4 2.2. About Lead Free Solder (PbF: Pb free)-------------- 4 2.3. Discarding of P. C. Board-------------------------------- 5 3 Specifications ----------------------------------------------------- 6 4 Technical Descriptions ----------------------------------------- 7 4.1. US-DECT Description ------------------------------------ 7 4.2. Block Diagram (Base Unit_Main)---------------------- 9 4.3. Block Diagram (Base Unit_RF Part) -----------------10 4.4. Circuit Operation (Base Unit) -------------------------- 11 4.5. Block Diagram (Handset)-------------------------------18 4.6. Block Diagram (Handset_RF Part)-------------------19 4.7. Circuit Operation (Handset)----------------------------20 4.8. Circuit Operation (Charger Unit) ----------------------22 4.9. Signal Route -----------------------------------------------23 5 Location of Controls and Components ------------------24 6 Installation Instructions ---------------------------------------24 7 Operating Instructions-----------------------------------------24 8 Test Mode ----------------------------------------------------------25 8.1. Engineering Mode ----------------------------------------25 9 Service Mode -----------------------------------------------------29 9.1. How to Clear User Setting (Handset Only)---------29 10 Troubleshooting Guide ----------------------------------------30 10.1. Troubleshooting Flowchart -----------------------------30 11 Disassembly and Assembly Instructions ---------------41 11.1. Disassembly Instructions -------------------------------41 11.2. How to Replace the Handset LCD -------------------44 12 Measurements and Adjustments---------------------------45 12.1. Equipment Required -------------------------------------45 12.2. The Setting Method of JIG -----------------------------45 12.3. Adjustment Standard (Base Unit)---------------------49 12.4. Adjustment Standard (Charger Unit)-----------------50 12.5. Adjustment Standard (Handset) ----------------------51 12.6. Things to Do after Replacing IC or X'tal ------------52 12.7. Frequency Table ------------------------------------------54 13 Miscellaneous ----------------------------------------------------55 13.1. How to Replace the Flat Package IC ----------------55 13.2. How to Replace the Shield Case ---------------------57 13.3. How to Replace the LLP (Leadless Leadframe Package) IC------------------------------------------------59 13.4. Terminal Guide of the ICs, Transistors and Diodes -------------------------------------------------------61 14 Schematic Diagram ---------------------------------------------62 14.1. For Schematic Diagram---------------------------------62 14.2. Schematic Diagram (Base Unit_Main) --------------64 14.3. Schematic Diagram (Handset_Main) ----------------66 14.4. Schematic Diagram (Charger Unit) -----------------68 15 Printed Circuit Board-------------------------------------------69 15.1. Circuit Board (Base Unit_Main) -----------------------69 15.2. Circuit Board (Handset_Main)-------------------------71 15.3. Circuit Board (Charger Unit) ---------------------------73 16 Exploded View and Replacement Parts List -----------74 16.1. Cabinet and Electrical Parts (Base Unit) -----------74 16.2. Cabinet and Electrical Parts (Handset) -------------75 16.3. Cabinet and Electrical Parts (Charger Unit) -------76 16.4. Accessories ------------------------------------------------77 PAGE 16.5. Replacement Parts List--------------------------------- 78
1 Safety Precautions
1.1. For Service Technicians
Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires, injury or electric shock, which can be caused by improper repair work. 1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 3. FASTON terminals shall be plugged straight in and unplugged straight out. ICs and LSIs are vulnerable to static electricity. When repairing, the following precautions will help prevent recurring malfunctions. 1. Cover plastic parts boxes with aluminum foil. 2. Ground the soldering irons. 3. Use a conductive mat on worktable. 4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced. 2. Replace only with the same or equivalent type recommended by the manufacturer. 3. Dispose of used batteries according to the manufactures Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note: In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder. Caution PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700 F 20 F (370 C 10 C). Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB. PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C). When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below).
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
3 Specifications
Note: Design and specifications are subject to change without notice. Note for Service: Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition. Analog telephone connection: Telephone Line
4 Technical Descriptions
4.1.
4.1.1.
US-DECT Description
TDD Frame Format
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same frequency. Refer to Frequency Table (P.54).
4.1.2.
TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy bearer use. In 1 slot 417 s, the 10 ms of voice data is transmitted. 2 - Handsets Link
Traffic Bearer A link is established between base unit and handset. The state where duplex communication is performed. Handset doesn't make up duplex in no free RF channels because of interference. (*1) Dummy Bearer Base unit sends Dummy-data to the all stand-by state handsets. Handsets receive that data for synchronization and monitoring request from the base unit. Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1) Note: (*1) It is a feature under FCC 15 regulation and for interference avoidance. In the case of checking RF parts, it is better in least interference condition.
4.1.3.
Signal Flowchart in the Radio Parts
Reception A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit. Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna. As for a handset RF, RF signal is received in one antenna. BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA". BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker. Transmission A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset. Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna. As for a base unit RF, RF signal is received in two antennas. BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal from RX signal in the selected antenna, and demodulates it to digital data "RXDATA". BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
4.2.
Q141 RLY Q161 R151,R152 INUSE DETECT 2 INUSE DETECT 1 TEL JACK
X501 13.824 MHz
R131, R133
D101
L1T L1R
SIDE TONE CIRCUIT
ANT1 ANT2
SW1
RECEIVE AMP
Q171
DCP
Q111
DCM
KEY 1
RF_PART
ANT1
ANT2
RXp
KEY C
LOUT LIN HOOK DCIN 2 DCIN 1 BELL HSMIP HSMIN
BELL DETECT
DC JACK
RXn
IC302 IC501
BBIC 3.0 V REGULATOR
RXON
TXp
Block Diagram (Base Unit_Main)
TXn
STM/CKM
SCL, SDA WP
IC611
VCC EEPROM MEMORY
VCCA
9
PDN DET DOUBOUT 3.0V
TXON
VBAT VCCPA VBAT_APU VCC_IF VCC_FE VCC_VCO
RSTN
RESET
R371 R372 CHARGE_CONTACT

+ -
VBAT
IC331
RESET IC
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_Main)
4.3.
Block Diagram (Base Unit_RF Part)

ANT2 ANT2 TXp TXn ANT1 DA801 TXON
RXON RXp RXn
ANT1
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)
10
4.4.
Circuit Operation (Base Unit)
General Description: (BBIC, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression and memory management required in a digital telephone. The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions as follows.
4.4.1.
BBIC (Base Band IC: IC501)
DTMF Generator When the DTMF data from the handset is received, the DTMF signal is output. Caller ID demodulation The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office. Digital Switching The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the Telephone line, etc. They are determined by the signal path route operation of voice signal. Block Interface Circuit RF part, Key scan, Telephone line.
4.4.2.
EEPROM (IC611)
Following information data is stored. Settings ex: message numbers, ID code, Flash Time, Tone/Pulse
11
4.4.3.
Power Supply Circuit/Reset Circuit
The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is insulated from VBAT by Doubler of BBIC. Circuit Operation:
12
4.4.3.1.
Charge Circuit
The voltage from the AC adaptor is supplied to the charge circuits.
13
4.4.4.
Telephone Line Interface
Telephone Line Interface Circuit: Function Bell signal detection ON/OFF hook and pulse dial circuit Side tone circuit Bell signal detection and OFF HOOK circuit: In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T) and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows: T L101 R111 C111 Q111 BBIC pin 5 [BELL] When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through the circuit). Following signal flow is the DC current flow. T L101 D101 Q141 Q161 R163 R167 D101 L102 P101 R ON HOOK Circuit: Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition. Pulse Dial Circuit: Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing. Side Tone Circuit: Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is canceled by the canceller circuit of BBIC.
14
4.4.5.
Parallel Connection Detect Circuit/Auto Disconnect Circuit
Function: In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected in parallel is on hook or off hook by detecting changes in the T/R voltage. Circuit Operation: Parallel connection detection when on hook: When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is 0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower. Parallel connection detection when off hook: When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by detecting the voltage changes. If the Auto disconnect function is ON and statuses are Hold, BBIC disconnects the line after detecting parallel connection is off hook.
15
4.4.6.
Calling Line Identification (Caller ID)
Function: Caller ID The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of the message format which can be received: i.e. the single message format and plural message format. The plural message format allows to transmit the name and data code information in addition to the time and telephone number data. *: Also the telephone exchange service provides other formats.
16
Call Waiting Caller ID Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call, to receive information about a calling party on a waited call. The transmission of the calling information takes place almost immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new call. Function: The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and MARK data pass the following route. Telephone Line P101 L101, L102 C121, C122 R121, R122 IC501 (25, 24). If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the information for the second and subsequent callers is not displayed on the portable handset display.
17
4.5.
Block Diagram (Handset)

3V
IC3
EEPROM X1 10.368 MHz BATTERY ANT1
CHG_DET
CHG_CTL
WP, CLK, DATA
Power_adj TXn TXp
IC801
RESET
VDD_PADRV PSEL PON TXON RXON RF_RXn RF_RXp
Q4 CHARGE
D7
C144
BATTERY D1
1.8V 3V
AVD
RF PART
Q2 BATTERY
LD0_CTRL
CP_VOUT2
IC1
BBIC
BATTERY
MIC
MICp MICn
VDDPA
1.8V
3V LED (KEY) Q7
Receiver
LSRp LSRn VDD2 VDD1
KEY_LED
3V LED (BELL) Monitor SP

PAOUTp PAOUTn CKM//STM
CKM/STM
3V
LCD
KEYS
KX-TGA403 BLOCK DIAGRAM (Handset)
18
P3_3~P3_7 P1_1~P1_4
BELL_LED
4.6.
Block Diagram (Handset_RF Part)

ANT
TXON DA801
RXON RF_RXn RF_RXp
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
19
4.7.
4.7.1.
Circuit Operation (Handset)

Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18). DECT BBIC (Base Band IC): IC1 - All data signals (forming/analyzing ACK or CMD signal) - All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.) - PLL Oscillator - Detector - Compress/Expander - Reception RF Power Amp: IC801 - Amplifier for transmission EEPROM: IC3 - Temporary operating parameters (for RF, etc.)
4.7.2.
Power Supply Circuit/Reset Circuit
Circuit Operation: When power on the Handset, the voltage is as follows; BATTERY(2.2 V ~ 2.6 V: BATT+) F1 Q2 (1.8 V), IC1-43pin (2.5V) The Reset signal generates IC1 (61 pin) and 1.8 V.
20
4.7.3.
Charge Circuit
Circuit Operation: When charging the handset on the Base Unit, the charge current is as follows; DC+(6.5 V) F301 R371 R372 CHARGE+(Base) CHARGE+(Handset) Q4 D7 F1 BATTERY+... Battery... BATTERY- R45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND) In this way, the BBIC on Handset detects the fact that the battery is charged. The charge current is controlled by switching Q9 of Handset. Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.7.4.
Battery Low/Power Down Detector
Circuit Operation: Battery Low and Power Down are detected by BBIC which check the voltage from battery. The detected voltage is as follows; Battery Low Battery voltage: V(Batt) 2.25 V 50 mV The BBIC detects this level and " " starts flashing. Power Down Battery voltage: V(Batt) 2.0 V 50 mV The BBIC detects this level and power down.
4.7.5.
Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
21
4.8.
Circuit Operation (Charger Unit)
Charge control is executed at handset side so that the operation when using charger is also controlled by handset. Refer to Circuit Operation (Handset) (P.20)
The route for this is as follows: DC+pin of J1(+) F1 R1 CHARGE+pad Handset CHARGE-pad DC-pin of J1(-).
22
4.9.
Signal Route
RF part signal route
23
5 Location of Controls and Components

Refer to the Operating Instructions. Note: You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
7 Operating Instructions
24
8 Test Mode
8.1.
8.1.1.
Engineering Mode
Base Unit
25
Frequently Used Items (Base Unit) ex.)

Items Frequency ID Address 00 07 / 00 08 00 02 ~ 00 06 Default Data 00/01 Given value New Data Remarks Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the computer system.
Note: (*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex) 0 1 . . . 9 Input Keys 0 1 . . . 9 Desired Number (hex) A B C D E F Input Keys [Flash] + 0 [Flash] + 1 [Flash] + 2 [Flash] + 3 [Flash] + 4 [Flash] + 5
26
8.1.2.
Handset
27
Frequently Used Items (Handset) ex.)

Items Battery Low Frequency ID Address 00 11 / 00 12 00 07 / 00 08 00 02 ~ 00 06 Default Data 00 / 00 00 / 01 Given value New Data Possible Adjusted Value MAX (hex) Possible Adjusted Value MIN (hex) Remarks
(*2)
Note: (*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) 0 1 . . . 9 Input Keys 0 1 . . . 9 Desired Number (hex.) A B C D E F Input Keys [Flash] + 0 [Flash] + 1 [Flash] + 2 [Flash] + 3 [Flash] + 4 [Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the handset.
28
9 Service Mode
9.1. How to Clear User Setting (Handset Only)
Handset Press , , , simultaneously until a beep sound is heard. Then single handset is initialized. (The contents of user setting are reset to factory default) *Usage time is not cleared.
29
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
Cross Reference: Check Power (P.31) Check Battery Charge (P.32) Check Link (P.33) Check the RF part (P.35) Check Handset Transmission (P.40) Check Handset Reception (P.40) Check Caller ID (P.40)
30
10.1.1. Check Power 10.1.1.1. Base Unit
Cross Reference: Power Supply Circuit/Reset Circuit (P.12)
Note: BBIC is IC501. (*1) Refer to Specifications (P.6) for part number and supply voltage of AC adaptor. (*2) Refer to Circuit Board (Base Unit_Main) (P.69).
10.1.1.2. Handset
Cross Reference: Power Supply Circuit/Reset Circuit (P.20)
31
10.1.2. Check Battery Charge 10.1.2.1. Base Unit
Cross Reference: Charge Circuit (P.13)
10.1.2.2. Handset
Cross Reference: Check Power (P.31) Charge Circuit (P.21)
10.1.2.3. Charger Unit
Cross Reference: Charge Circuit (P.21)
32
10.1.3. Check Link 10.1.3.1. Base Unit
Cross Reference: Power Supply Circuit/Reset Circuit (P.12) Check the RF part (P.35) Note: *1 How to adjust +3.0V: Execute the command "VDA" Refer to Things to Do after Replacing IC or X'tal (P.52) for Base Unit. *2 How to adjust the frequency of X501: To see the frequency, execute the command SFR, then check the TP_CKM (IC501-57pin). To adjust frequency, send command SFR until the frequency counter becomes13.824 MHZ55HZ.
33
10.1.3.2. Handset
Cross Reference: Power Supply Circuit/Reset Circuit (P.20) Check the RF part (P.35) Note: *1 How to adjust the frequency of X1: To see the frequency, execute the command SFR, then check the TP_CKM (IC1-46pin). To adjust frequency, send command SFR until the frequency counter becomes10.368 MHz55HZ. Refer to Things to Do after Replacing IC or X'tal (P.53) for Handset.
34
10.1.4. Check the RF part 10.1.4.1. Finding out the Defective part
After All the Checkings or Repairing 1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Note: (*1) HS: Handset (*2) BU: Base Unit
35
10.1.4.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.37). Please refer to the each item.
Note: (*1) Refer to Check Link (P.33).
36
10.1.4.3. Check Table for RF part

No. Item 1 Link Confirmation Normal HS, BU Mode [Normal Mode] 2 X'tal Frequency confirmation HS, BU Mode: [Adjustment] TX confirmation Regular HS (BU) Mode: [Test RX Mode] BU (HS) Mode: [Test TX_Burst Mode] RX confirmation Regular HS (BU) Mode: [Test TX_Burst Mode] BU (HS) Mode: [Test RX Mode] Range Confirmation Normal HS, BU Mode: [Normal Mode] BU (Base Unit) Check 1. Register Regular HS to BU (to be checked). 2. Press [Talk] key of the Regular HS to establish link. Check X'tal Frequency. (13.824000 MHz 100 Hz) 1. Place Regular HS 15 cm away from a checked BU. 2. Confirm "TXDATA" waveform of BU (*1) and RXDATA waveform of Regular HS by Digital Oscilloscope. HS (Handset) Check 1. Register HS (to be checked) to Regular BU. 2. Press [Talk] key of the HS to establish link. Check X'tal Frequency. (10.368000 MHz 100 Hz) 1. Place Regular BU 15 cm away from a checked HS. 2. Confirm "TXDATA" waveform of HS (*2) and "RXDATA" waveform of Regular BU by Digital Oscilloscope.
1. Place Regular HS 15 cm away from a checked BU. 2. Confirm "RXDATA" waveform of BU (*1) and TXDATA waveform of Regular HS by Digital Oscilloscope.
1. Place Regular BU 15 cm away from a checked HS. 2. Confirm "RXDATA" waveform of HS (*2) and "TXDATA" waveform of Regular BU by Digital Oscilloscope.
1. Register Regular HS to BU (to be checked). 2. Press [Talk] key of the Regular HS to establish link. 3. Compare the range of the BU (being checked) with that of the Regular BU.
1. Register HS (to be checked) to Regular BU. 2. Press [Talk] key of the HS to establish link. 3. Compare the range of the HS (being checked) with that of the Regular HS.
Note: (*1) Adjustment Standard (Base Unit) (P.49) (*2) Adjustment Standard (Handset) (P.51)
37
10.1.4.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item Range Confirmation TX TEST (TX Power check) HS, BU setting Checked unit: Low TX power (*1) Regular unit: High TX power (*1) BU (Base Unit) Check 1. Register Regular HS to BU (to be checked). 2. Set TX Power of the BU and the Regular HS according to CHART1. 3. At distance of about 20m between HS and BU, Link OK = TX Power of the BU is OK. No Link = TX Power of the BU is NG. 1. Register Regular HS to BU (to be checked). 2. Set TX Power of the BU and the Regular HS according to CHART1. 3. At distance of about 20m between HS and BU, Link OK= RX Sensitivity of the BU is OK. No Link = RX Sensitivity of the BU is NG. HS (Handset) Check 1. Register HS (to be checked) to Regular BU. 2. Set TX Power of the HS and the Regular BU according to CHART1. 3. At distance of about 20m between HS and BU, Link OK = TX Power of the HS is OK. No Link = TX Power of the HS is NG. 1. Register HS (to be checked) to Regular BU. 2. Set TX Power of the Checking HS and the Regular BU according to CHART1. 3. At distance of about 20m between HS and BU, Link OK= RX Sensitivity of the HS is OK. No Link = RX Sensitivity of the HS is NG
Range Confirmation RX TEST (RX sensitivity check) HS, BU setting Checked unit: High TX power (*1) Regular unit: Low TX power (*1)
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

BU (to be checked) TX Power Low High Regular_HS TX Power High Low
BU (Base Unit) TX Power Check BU (Base Unit) RX Sensitivity Check
HS (Handset) TX Power Check HS (Handset) RX Sensitivity Check
HS (to be checked) TX Power Low High
Regular_BU TX Power High Low
Note: (*1) Refer to Commands (Base Unit) (P.48).
38
10.1.5. Registering a Handset to the Base Unit
10.1.6. Deregistering a Handset
10.1.7. Deregistering All Handsets by the Base Unit
39
10.1.8. Check Handset Transmission
Cross Reference: Signal Route (P.23)
10.1.9. Check Handset Reception
Cross Reference: Signal Route (P.23) Note: When checking the RF part, Refer to Check the RF part (P.35).
10.1.10. Check Caller ID
Cross Reference: Telephone Line Interface (P.14) Calling Line Identification (Caller ID) (P.16) Note: Make sure the format of the Caller ID service of the Telephone company that the customer subscribes to. It is also recommended to confirm that the customer is really a subscriber of the service.
40
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1. Base Unit
41
11.1.2.
Handset
42
11.1.3.
Charger Unit
43
11.2. How to Replace the Handset LCD

Note: The illustrations are simplified in this page. They may differ from the actual product.
44
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in Troubleshooting Guide (P.30)
12.1. Equipment Required

Digital multi-meter (DMM): it must be able to measure voltage and current. Oscilloscope. Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm) Hewlett Packard, 53131A is recommended. DECT tester: Rohde & Schwarz, CMD 60 is recommended. This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

<Preparation> Serial JIG cable: PQZZ1CD300E* PC which runs in DOS mode Batch file CD-ROM for setting: PNZZTG4011AG Note: *: If you have the JIG Cable for TCD500 series (PQZZ1CD505E), change the following values of resistance. Then you can use it as a JIG Cable for both TCD300 and TCD500 series. (It is an upper compatible JIG Cable.)
Resistor R2 R3 R4 R7 Old value (k) 22 22 22 4.7 New value (k) 3.3 3.3 4.7 10
12.2.1. Connections (Base Unit)

Connect the AC adaptor. Connect the JIG Cable GND (black). Connect the JIG Cable RX (red) and TX (yellow).
Note: *: COM port names may vary depending on what your PC calls it.
45
12.2.2. Connections (Handset)

Connect the DC Power or Battery to BATT+ and BATT-. Connect the JIG cable GND (black) to GND. Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
Note: *: COM port names may vary depending on what your PC calls it.
46
12.2.3. How to install Batch file into P.C.
Note: ***** varies depending on the country or models.
47
12.2.4. Commands (Base Unit)

See the table below for frequently used commands.
Command name rdeeprom readid writeid hookoff hookon RdEeprom Function Read the data of EEPROM Read ID (RFPI) Write ID (RFPI) Off-hook mode on Base On-hook mode on Base Read EEPROM Example Type rdeeprom 00 00 FF, and the data from address 00 00 to FF is read out. Type readid, and the registered ID is read out. Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E 98 is written. Type hookoff. Type hookon. Type RdEeprom 03 e2 04, and the data from address 03 e2 to 03 e4 is read out *This command gets 4 byte "WW", "XX", "YY", "ZZ". *Please NEVER forget these 4 byte data! Typesendchar epw 03 e2 04 FF FF FF FF Type sendchar RST Type getchk. Type sendchar epw 03 e2 04 WW XX YY ZZ *"WW", "XX", "YY", "ZZ" is 4 byte data that already read from same address. Type reeprom 01 23 45.01 23 is address and 45 is data to be written.
sendchar epw sendchar RST getchk sendchar epw
Write EEPROM Reset baseset Read checksum Write EEPROM
getchk
Write the data of EEPROM
12.2.5. Commands (Handset)

See the table below for frequently used commands.
Command name rdeeprom readid writeid hookoff hookon getchk wreeprom Function Read the data of EEPROM Read ID (RFPI) Write ID (RFPI) Off-hook mode on Base On-hook mode on Base Read checksum Write the data of EEPROM Example Type rdeeprom 00 00 FF, and the data from address 00 00 to FF is read out. Type readid, and the registered ID is read out. Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E 98 is written. Type hookoff. Type hookon. Type getchk. Type wreeprom 01 23 45. 01 23 is address and 45 is data to be written.
48
12.3.1. Bottom View
DC 6.5V
CHARGE+ ANT1
L361
CHARGECL1 DC SP
SPP
SPN
DCP
DCM
L1T C351 C478 C477

F301
L1R L371 D473 3.0A TDO STM/CKM/P15

C142 C301 R301
D472
D361
12.3. Adjustment Standard (Base Unit)
R165 C167
R507
C479
D143
RA502
R305
CL2 C476 FCT R166 L476

C601 C512
D142
R512
C307
R162
R304
R307
C171 8 R502 5 C181 L474

R601
C513
C184
R607
R181 C186
C475
R163
C521
C168
C525
R167
R136
D133
R334
VCCA VREF R178 VBG
R604 C332
R115
C473 C472 C120 C124 C123 C151 C133
R503
C115
C121 R112
R122 C126
R121
D153 R152 C152 R151
RA504
C524 R505 R506
C611
Note: (*1) is referred to No.2 of Check Check Table for RF part (P.37) (*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
BLK RED WHT TDI TCK TMS R321 C343 R302 R322 DCDC_OUT RTCK
4
ANT2 Q161
C163 C165 R161 R164 C510 C530 C511 1 C514
When connecting the simulator equipment for checking, please refer to below.
RA151
C125
L372 C352 C112
C122
D363
L362 CHG+2 GND UTX CHG-2 URX
C661
RED
BLK
PbF
RED RSTN VBAT
CHG
GRN
YLW
Spectrum Analyzer
49
IC601
4 R603 R602 R335 VDDC E +3.0V RTCK Q601 C322
3
Frequency Counter (*1)
* Send command "SFR", then the frequency output on this TP.

IC302
C321
Oscilloscope (*2)
R612 R605 R606
+6.5V
* Start Monitor
IC611
PNLB1712Z
B
12.4. Adjustment Standard (Charger Unit)

12.4.1. Bottom View

Digital Volt Meter Charge+ ChargeTP4
12
/2 W
PQUP11532Y
J1
F1 1 TP3 2
PbF
PNLP1029YA
TP3
TP4 (GND) DC POWER DC 6.5 V

50
12.5. Adjustment Standard (Handset)

12.5.1. Component View

KX-TGA650XX KX-TGA651XX KX-TGA250XX KX-TGA251XX KX-TGA403XX
PNLB1734Y PbF
GND
TP_ANT1
DECT Tester CMD60
R EC EI VE R
R ED
TGA650XX TGA651XX
ANT
C175 R578
C70
C152
C71
BL K
C186
C187 C204
AF Volt Meter
D21
D22
C104 C103
C106
C107
R236 C138
C804 C803 C802 L801 C812
C811 C813 L802
C814 IC801
D14 C863 C864 RA800 R880 Q880 R801 R808 C880 C881 C73 RA32
D13 C72
R802 C819
R805
C834
C837 C826 C822
JTAG STM R63 R405 R66 C44 R225 R64
56
RED
R53 R50
1 F
R231C201C200 C105 C206 R54 C203 R232
BLK
R807 R203 C43 C48 C17 R215
(at battery low)
Power Key
D400 Q400
C10 1.8V RA4
C55
C52 C53
21 C188 L46 L47
Oscilloscope (*2)
DC POWER 2.00~2.25V
R402 R400 C38 R406 R407
C400
R23 CLK
R27 R403 R404
R248 CP3.0V RA40 Q10
CP 3.0V 1.8V
Q401
R20
POWER
C332
GND
Q12 Q11
R332 R331 C331
IC3
1 4
Current Probe
R330 C342
E Q7
+ +
MIC+ MICUTX GND
C341
DC 6.5V
RCVRCV+ C340 C150 R2 D7 C3 Q4 RA61 URX
BAT R45 C35 R8 R3 C121
RX TX GND
BATT+
F1
R30 C147
R7
R4
BATT-
CHG(+) C5 D3
CHG(-) D4
C113 MIC
MIC+
MIC-
Note: (*1) is referred to No.2 of Check Check Table for RF part (P.37) (*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
51
DC Power 2.30~2.60V
2.7 V Zener
PC URX
AF Generator
Digital Volt Meter
R37 R36 C39 C30
GND
R249
C51 CP4.0V
CP 4.0V
GND
C40 C54 C49 C50
Frequency Counter (*1)
CLK 100 22pF
Oscilloscope
56
RA1
TGA250XX TGA251XX TGA403XX
150
C580
C806 L803 C805 C809 C810 DA801 C827
R55
R233
SPEAKER C139
8 80 R806 C C861 C825
C45 C46
C820
C182 R401
C860
IC1
C47
X1 C2 C1
Q2 C13 C11 D1
C97 C96 R6
C12 C18 R28
C172
RA30 RA31 Q9 R31 R74 C75 C74 R73
12.6. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment data, etc. in memory. The set doesn't operate if it is not executed.
12.6.1. How to download the data 12.6.1.1. Base Unit

First, operate the PC setting according to The Setting Method of JIG(P.45). Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment Adjusted parameter data is stored in memory. 1) Change the address 0001 of EEPROM to 55 to download (country version batch file, default batch file, the data. 2) Default batch file: Execute the command default.bat. etc.) 3) Country version batch file: Execute the command TG4011USAGrevXXX_YYY.bat. (*1) 4) Clock adjustment System clock Clock adjustment data is in EEPROM, adjust the data again after replacing it. 1) Apply 6.5V between DCP ad DCM with DC power. 2) Input Command " sendchar sfr", then you can confirm the current value. 3) Check X'tal Frequency.(13.824 MHz 100 Hz). 4) If the frequency is not 13.824 MHz 100 Hz, adjust the frequency of CLK executing the command "sendchar sfr xx xx (where xx is the value)" so that the reading of the frequency counter is 13.824000 MHz 15 Hz.
EEPROM (IC611)
X'tal (X1)
Note: (*1) XXX_YYY: revision number XXX, YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting Method of JIG (P.45).
52
12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG(P.45). Then download the appropriate data according to the following procedures.
Items Adjusted parameter data is stored in memory. (country version batch file, default batch file, etc.) How to download/Required adjustment 1) Default batch file: Execute the command default.bat. 2) Default batch file (remaining): Execute the command TGA402USDEFrevXXX_YYY.bat. (*2) 3) Country version batch file: Execute the command TGA402USAGrevXXX_YYY.bat. (*2) 4) Clock adjustment 5) 2.35 V setting and battery low detection 1) Apply 2.25 V between BATT+ and BATT-. 2) Execute the command sendchar PAD sendchar LED 0 sendchar CRX 0 1 sendchar AD1 It assumes that the return value is XX. a) 6c XX 71: No need to adjust b) XX: 6A ~ 6B: Need to adjust XX: 72 ~ 74: Need to adjust Write AD value of 2.25 V to EEPROM. ex) read data: XX = 6A, write data:YY = 6A read data: XX =73, write data: YY = 73 EEPROM = 0009 (Low Voltage) write YY Execute the command wreeprom 00 09 01 YY. EEPROM = 000A (No Voltage) write YY - 1D Execute the command xwreeprom 00 0A 01 ZZ. Note: No Voltage writing data limit is 00. c) XX: 00 ~ 69: Reject XX: 75 ~ FF: Reject 1) Apply 2.40 V between BATT+ and BATT-. 2) Confirm that there is no flashing of Battery lcon. 3) Apply 2.25 V 0.08 V between BATT+ and BATT-. 4)Confirm that there is flashing of Battery lcon. 1) Apply 2.6 V between BATT+ and BATT- with DC power. 2) Input Command sendchar sfr, then you can confirm the current value. 3) Check Xtal Frequency. (10.368 MHz 100 Hz). 4) If the frequency is not 10.368 MHz 100 Hz, adjust the frequency of CLK execute in the command sendchar sfr xx xx (where xx is the value) so that the reading of the frequency counter is 10.368000 MHz 5 Hz.
EEPROM (IC3)
Battery Monitor Check
Battery Low Confirmation
Battery Clock Adjustment (X1)
CLK
Note: (*2) XXX_YYY: revision number XXX and YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting Method of JIG (P.45).
53
12.7. Frequency Table

CH 0 1 2 3 4 5 6 7 8 9 Ch (hex) 00 01 02 03 04 05 06 07 08 09 Frequency (MHz) 1928.448 1926.720 1924.992 1923.264 1921.536 1919.808 1918.080 1916.352 1914.624 1912.896
54
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
PbF (: Pb free) Solder Soldering Iron Tip Temperature of 700 F 20 F (370 C 10 C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. Flux Recommended Flux: Specific Gravity 0.82. Type RMA (lower residue, non-cleaning type) Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered. Note: If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.
55
13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil. 2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion. 2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
56
13.2. How to Replace the Shield Case

13.2.1. Preparation
PbF (: Pb free) Solder Soldering Iron Tip Temperature of 700F 20F (370C 10C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. Hot Air Desoldering Tool Temperature: 608F 68F (320C 20C)
13.2.2. Caution
To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the Shield Case

Note: If you dont have special tools (ex. Hot air disordering tool), conduct the following operations. 1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
57
13.2.4. How to Install the Shield Case

Note: If you dont have special tools (ex. Hot air disordering tool), conduct the following operations. Shield cases No. : PNMC1013Z 1. Put the shield case.
2. Solder the surroundings.
58
13.3. How to Replace the LLP (Leadless Leadframe Package) IC

Note: This description is only applied on the model with Shield case.
13.3.1. Preparation
PbF (: Pb free) Solder Soldering Iron Tip Temperature of 700 F 20 F (370 C 10 C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. Hot Air Desoldering Tool Temperature: 608 F 68 F (320 C 20 C)
13.3.2. Caution
To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.3.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
59
13.3.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC. Note: When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted. Note: Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
13.3.5. How to Remove a Solder Bridge

When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
60
13.4. Terminal Guide of the ICs, Transistors and Diodes

13.4.1. Base Unit
13.4.2. Handset
61
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main)) 14.1.1.1. Acoustic Testing Mode
Notes: 1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))

Notes: 1. DC voltage measurements are taken with an oscilloscope or a tester with a ground. 2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes: 1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
62
Memo
63
14.2. Schematic Diagram (Base Unit_Main)

ANT2 R892 470
ANT2
C892 5p W 0.2mm GND L mm 1st layer C894 2.2p W 0.2mm L 10mm 1st layer W 0.15mm L 20mm 3rd layer
R807 470 C822 10p GND C827 10p GND C826 10p C863 1.5p C820 1.5p
RXON
GND
CL2
RXn
RXp
GND ANT1 DA802 1 3 GND

CL1
GND C895 1.2p C896 C859 2.2p 2.2p GND GND GND GND DA801 2 3 1 L809 7.5n
GND TXp C805 2.7p GND
C812 0.9p C813 2p C810 2.4p
2 C893 3p W 0.2mm L 10mm 1st layer W 0.2mm L mm 1st layer
TXn
W 0.15mm L 20mm 3rd layer R806
GND GND
C806 2.7p GND VBAT
470
GND
C891 5p
W 0.15mm L 5.0mm 1st layer
R891
C825 10p GND
ANT1 TXON TXn TXp RXp RXn RXON ANT2 TO RF BLOCK
470 W 0.2mm L 10.0mm 1st layer
GND GND
C811 10p
VBAT
TXON ANT1
(1) (2) (3) (4)
45
* Start Monitor * When "SFR" command is executed, 13.824MHz frequency will be output.
*R507
VBAT
5
46 47 48 49 50 51 52 53 54
GND
+3.0V
C515
K1u
*Q651
*R512 NC
C1 B1 E
1 2
RSTN MSG_LED NC 1k
55 56
C516 STM/CKM/P15
RA501 33
5 6 7 8 7 6 4 3 2 1
0.1u 0.1u
57 58 59 60 61 62 63 64 65 66
10
2APVCC MSG_LED ANS_LED NC KEYIN1 KEYIN2 KEYIN3 KEYS_C KEYS_D KEYS_E
FCT
3
C517
*R651 *R652
NC NC
C2 B2
ANS_LED KEYIN1 KEYIN2 KEYIN3 KEYS_C KEYS_D KEYS_E JTAG_TDO JTAG_TDI JTAG_TCK JTAG_TMS JTAG_RTCK
8
C518 0.1u
+3.0V
NC NC NC NC NC NC
C658 NC C659 NC C660 NC
C651 C652 C653 C654 C655 C656
45
RA502 10k
VDDC
TXp RXp RXn GND_RF TRSW_p ANT_n ATST_n ATST_p TEST RSTN *IC501 NC VCC_VCO GPIO[27] VDDUSB DM_USB/GPI28 DP_USB/GPI29 VDDC1 JTAG_TDO JTAG_TDI JTAG_TCK JTAG_TMS JTAG_RTCK
*WBX01
NC
*SW1
2 1
(5)
*C661 NC
PARALLEL WIRE AP1
JTAG_TDO
JTAG_TMS
JTAG_TCK
JTAG_TDI
UTX
JTAG_RTCK
URX
(6)
GND
UTX
TMS
TDO
TCK
TDI
NC: No Components
64
RTCK
URX
R502 33
(6)
(5)
(1) (2) (3) (4)
*R604 SPP SPN C508 10p C478 10p C477 10p *D473 NC
A K
NC
68 69 70 71 72 73 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 74 75 76 77 78 79 80 81 82 83 84 39 40 4 3 2 1 42 43
EEP_SCL EEP_SDA EEP_WP

67 44
X501
13.824M
R509 NC
41
SO
*CE
*WP
VSS
*C601 C519 0.1u C509 12p

A K
MSG_LED ANS_LED SPI_DI SPI_DO SPI_CLK *D472 NC C479 10p 10p C476 *L476 NC NC C507 K2.2u C472 NC C185 NC C120 1000p C178 NC 10p R171 22 C174
E
C514 0.1u C513 K2.2u C512 0.1u C511 10u C510 K1u C530 10p C473 NC C522 L474 10p C475 NC
*IC601
NC
*HOLD
NC
VDD SCK
*IC501 GND
SI
*R607 NC
E
R602
NC
Q601 NC
*R601 NC C520
86 85 87 88 89
+3.0V
C B
SPI_CS FLASH_RST KEYIN1 KEYIN2 KEYIN3
R603 0.1u
MIN VCCA VREF DCIN3/LIN1 DCIN2 DCIN1 DCIN0/LIN0 DOUBOUT DOUBCAPP1 DOUBCAPP DOUBCAPN DOUBCAPN1 VBAT COREOUT VDDC2 GPIO[26] GPIO[25] GPIO[24] GPIO[23] GPIO[22] GPIO[21] GPIO[20]
NC FLASH_RST SPI_CLK SPI_DO SPI_DI SPI_CS C124 C123

10 11 12 13 14 15 16 17 18 19 20 21 22
GPIO[0]/SCL_IIC GPIO[1]/SDA_IIC GPIO[2] GPIO[3] GPIO[4] GPIO[5] GPIO[6] GPIO[7] GPIO[8] VDDIO1 GPIO[9] GPIO[10] GPIO[11] GPIO[12] GPIO[13] GPIO[14] GPIO[15] GPIO[16] GPIO[17] VDDIO2 GPIO[18] GPIO[19]
TXn TRSW_n ANT VCC_FE VDD_IF VCC_IF VDD_APU VBAT_APU XIN XOUT DCINS PWM0 PWM1 SPOUTP VCCPA SPOUTN LOUT HSSPOUTP MPWR HSMIP HSMIN MIP
0.022u
C
C176 10u
+3.0V
R175 560 C175

B
R176 100 C164 NC Q171 NC 100k R177 NC C161 10u 910 R172
VREF
3.0V
C504 C521
VCCA VCCA
VDDC
C502 10u C524 NC
1000p K0.22u
1u 1u
VDDC
A2
A1
A0
64K EEPROM
GND
+3.0V
10u
1u
C611 C505 R501 10

+3.0V
C506
C173
R160
R505 2.2k C503 10u C523 R503 1k VBG NC NC R178 C501 0.1u R506 NC
3 4
C126 C186 10p C125 NC 10p 0 C181 NC
IC611
0.1u
C171
C167 1000p 0.022u R181 R166 R122 R121 C168 NC R167 27 NC R164 2.7k R165 27k
VCC
SCL WP
SDA
1.2V
5
2 1
6 +3.0V +3.0V
C165 NC
R605 R606
2 1
R612 RA504 68 10k C525 NC R136 NC L501 100n RA151 1k 3.3k 3.3k
4 3
Rx
C172 NC C151 10p C133 NC
R163 D153 D133

VDDC
A A
NC K
K
12 R161 100k C184 K1.0u
Q161
B
C163 NC
390k C122 680p
390k C121 680p
EEP_SCL EEP_SDA EEP_WP PDN_DET HOOK BELL KEYS_E KEYS_D KEYS_C UTX URX
R162
Tx
27k BELL HOOK R152 470k R114
E C
R151 100k
Caller ID
PDN_DET R335
KX-TG4011/4012/4013AG SCHEMATIC DIAGRAM (Base Unit_Main)
65
C332 C342 0.1u NC 0 R334 47k R321 F140 F100 R322 C343 10p
+3.0V
C152 0.01u
+3.0V
3.0V
C341
330u
47k Q111
B
D113
A K
C142 D143 C113 R145 2.2k K0.68u R113 10k C111 0.047u R111 100k R144 NC
B
K0.01u 25V D142

A K
NC
VBAT VBAT
*IC331
*R332 NC C331 NC *R331 NC NC D331 NC GND C307 R307 NC R305 NC C305 C304 GND
12 11 1 2 10
1 VOUT VIN 2 NC 3
NC
VSS 4
Q143
NC
NC
R333
Q142
2 VOUT1 3 INPUT 4
VOUT2 ADJ
Q141
C
IC302
C112 0.047u 1 C322 C321 10p 1u
R112 100k
R142
E C
Bell
VBAT +6.5V
2.7k R141 100k
B E
R133 330k C132 K0.01u

4 3
DCDC_OUT
R131 10M
R304 NC NC NC L301 NC
NC R115 NC
C115
D101
*D363
A K
*D361
A K
R372 NC NC 5.6
R371 5.6 *C306 NC NC *L371 *L361 220nH 220nH L372 L362 NC C301 Q301 NC
C102 680p
C101 680p
+6.5V +6.5V
DC/DC CONVERTOR
33u
33u
JJ301
L101
L102
ZA1
SA103
1 3 2 1 2
REFERENCE 1XX : TEL LINE 3XX : POWER, CHARGE 4XX : MIC, SP 5XX : BBIC 6XX : FLASH, EEPROM, KEY, LCD 7XX : FOR DK 8XX : RF
3 4 8 5 7 6
NC
NC
VSS
SA101 NC NC
1 2
IC301
DCDC_IC
C303 NC
VOUT 4 EXT
ON/*OFF 5 VIN
*C352 R302 NC R301 C308 C302 NC NC 10p

+6.5V
*C351 0.1u CHG-2 CHG+2 1u DCM CHARGECHARGE+
P101 22
270V
! F301
3.0A DCP
GAP
L1T
L1R
(GREEN)
(YELLOW)
NC: No Components
14.3. Schematic Diagram (Handset_Main)

Charge Current
F1
BATTERY
BATT+
5.6n
C150
BATTERY
NC
C1CP1 6.3V 330u GND
NC
C3
+1.8V
R406 NC R401 NC
C340 NC R407 NC
C341 J39p GND
C342 NC GND GND (MAX500mA) +1.8V 1.8V
GND D400 NC R400 R402
BATTERY R330 1M C331 1u Q11 D1 Q12 C2CP2 6.3V 330u GND LDO_CTRL
1.8V
Q400
BATT-
R45 0.1
C35 J56p
C400 NC GND R403 NC
NC
NC
NC
Q2
GND
Q401
GND
GND
NC
R331 27k R332 GND 27k GND GND
C332 1u
C10 K2.2u GND
GND SOCn SOCp
R404 NC GND LCD_CD LCD_SCL LCD_SDA
CKM KEY_LED ROW1 ROW2 ROW3 ROW0 COL5 R20 10 C39 NC
CHARGE_CTRL
R7 CHARGE
3.0V
4.0V
CP4.0V
1.2k
CP+3.0V CP+4.0V CP3.0V
R2 Q4
NC D7
GND
CHG(+) C147 1.5k R30
CHARGE Terminal
CHG(-)
C40 k0.1u
R4 NC
R6 NC
R31 100
8 7 6 5
RA1 1k
POWER C53 K10u C52 K10u C54 D10p GND

60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
GND R3 Q9 100 R8 C121 NC GND GND +1.8V LCD_CSB R64 R66 10k 1k Power_adj UTX URX LCD_RESET BELL_LED_A C45 K0.1u GND 1k
+1.8V
C51 K1u C55 D10p GND
(1) (2) (3)

C38 NC S1
C5 K1u
NC
1 2 3 4
GND C49 1u
R405 NC
GND
STM
BAT UTX URX GND GND JTAG
2 1
*IC1
GND
C50 1u
C44 K0.1u R225 0
P0_0/UTX P0_1/URX P0_2/SDA2 P0_3/SCL2 P0_4/SPI_EN P0_5/SPI_CLK P0_6/SPI_DO P0_7/SPI_DI P2_6/WTF_IN P1_1/INT1/LE P1_2/INT2/SK P1_3/INT3/SIO P1_4/INT4/TDOD P1_5/INT5/RDI/VDDE P2_7/BXTAL VDD1 PON/P1_6 CP_VOUT2/LED2 CP_VOUT1/LED1 CP_C2y
RA61 220 R63 100
JTAG
PON PSEL VDD_PADRV TXp TXn
TX _RF
BATTERY To PA C182 3p
COL0 SHARP 2 2 2 3 6 9 2
TXON
VSS_LNA1 RF_RXp RF_RXn VSS_LNA2 RFP1 RFP0 REF_RES AVS_XTAL XTAL2 XTAL1 AVD_XTAL RF_SUPPLY1 LDO_CTRL AVD LSRn LSRp VREFm MICh CIDOUT/MICn CIDINn/MICp
61 62 63 64 65 66 67 68 69 70 C46 71 72 10p 73 74 75 76 77 78 79 80
RSTn JTAG P2_5/PCM_FSC/SF P2_4/SCL1/PCM_DO/DP3 P2_3/SDA1/PCM_DI/DP2 P2_2/PCM_CLK/CLK100 P2_1/ECZ2/PWM1/LED4 P2_0/ECZ1/PWM0/LED3 VDD2 LDORF_CTRL RF_SUPPLY2 RFP0n RFP4 RFP3 VDD_PADR VSS_PADR1 RF_TXp RF_TXn VSS_PADR2 RFP2
VBAT2 CP_C1y CP_C2x CP_C1x VBAT1 PAOUTn/P3_0 VDDPA PAOUTp/P3_1 P1_7/CHARGE CHARGE_CTRL SOCn SOCp NTC/ADC2 ADC1/INT0/P1_0 ADC0/P3_3 PARADET/P3_4 RINGOUT/RINGING/P3_5 RINGn/P3_6 RINGp/P3_7 CIDINp/VREFp
40 39 38 37 36 35 34 33 CHARGE 32 31 CHARGE_CTRL SOCn 30 L46 SOCp 29 L47 28 27 COL0 26 COL1 25 COL2 24 COL3 23 COL4 22 21
(4) (5) (6)
GND
R23 VREFm C96 D10p C97 D10p RA4 3.3k K10u C12
COL1 2 2 2 2 2 5 8 0
81
1 2 3 4 5 R203 6 F56k 7 8 9 10 C47 1u 11 10p 12 C43 13 C48 NC 14 15 16 17 18 19 20
COL2 2 2 2 2 AST 1 4 7
RF_RXp RF_RXn RXON
GND
C17 D10p C18 D10p
COL3 DOWN 2 2 2 1 UP SP R
TO RF BLOCK
RX _RF
GND *X1 R215 0 C13 K0.1u
1 3 2 10.368M GND
VREFm
1k
COL4 SOFT_C SOFT_A SOFT_B 2 2 2 1 TALK
0.75V 0V
R27 820 R28 820
C11 K0.1u
250mVp-p
(7) (8)
COL5 ROW0 RIGHT 2 1 LEFT
(9) (10)
ROW3
ROW2
ROW1
LDO_CTRL
BELL_LED_A
BATTERY
KEY_LED
[EX /FX] CP+3.0V
[RU] CP+4.0V
(11) (12) (13) (14) (15)

3 4
NC
NC
*LED8
*LED7
*LED9
*LED6
*C138
*LED5
*LED4
NC *LED1
*LED2
*LED3
BELL LED (Amber) NC *LED12
*C139
KEY B/L
NC
*R248 0
*R249 NC
LCD B/L
RF-SHIELD RE2
*LED21
*LED22
*LED23
GND
GND
1 2
GND
Q7 GND
NC: No Components
*RA30 330
*RA31 330
*RA32 120
66
C822
L801 TP_ANT1 27n
C827 10p 2
*C826 4p C837 NC
10p
W 0.15mm L 20+/-2mm 3rd layer
R807 220
RXON
GND
RX_RF
RF_RXn C820 NC
GND
C803 1.5p C804 2p 2p
3 C802 1 DA801
BATTERY R37 NC R36 NC CP+3.0V GND RA40 10k

Q10
GND
RF_RXp
C30 NC
GND
GND BPF
GND GND W 0.15mm L 5.0mm 1st layer
GND
C172 K0.1u
8 1 2 3 4
W 0.125mm L 7.6mm Gap 0.125mm 1st layer
8 7 6 5
NC
VCC WP SCL SDA
A0 A1 A2 GND
*R801 1.2k
R808 NC
C880 NC
*IC3
GND C808 100n C811 W 0.15mm L 20+/-1mm 3rd layer C809 10p 10p
R880 NC
(1) (2) (3)
7 6 5
1 2 3 4
BATTERY R801:220k R808:NC C860 10p C861 3p
Q880
NC C881 Power_adj NC
GNDGNDGND
11 GND 10 9 8 7 6 1 2 3 4 5
GND 3.6n C810 C805 L803 L802 3.6n 1.6p
GND
GND *R802
3.3p
BATTERY
100
GND C812 10p
VCC PSET PO GND VCCS POX PI PSEL PIX PAON PRAMP
GND TXn *C834 1p
TX_RF
TXp
C813
1.6p
3.3n
C806
C863 NC
C819
GND
W 0.15mm L 20+/-2mm 3rd layer R806 C825 10p 220
GND Pre-matching TXON
2 1
3 4
PSEL PON
GND C864 NC
GND
GND GND
Sp-phone RX/Beep
C73 NC C72 NC
10p
C188 K1u
Balun
3.3p
(4) (5) (6)
IC801
RA800 1k
C814
GND
GND
W 0.15mm L 3.0mm x2 1st layer
R805 47
GND
VDD_PADRV
1
+
SP-PHONE_SPEAKER
-
D14
GND GND GND GND
(7) (8)
LSRp LSRn
LSRp
RX-AF (Handset)
(9) (10)
*R50 10k *R236 NC *R52 1k *R53 3.3k *R51 470 *R54 10k C152 k1000p RCV+ LSRp GND *C175 NC *R578 NC C71NC LSRn NC
2 1
CP+3.0V *C186 NC GND *C206*C203 1 NC *C201 1 *C200 1 *C187 NC
D13
+
430k *R231 *R232 820k
C70
D22
100p
100p
J33p
10p
NC *C204 0.1
TX _AF
MICp *C580 NC CN5 CN5 CN5 CN5 CN5 CN5 CN5 CN5 CN5 CN5 CN5 CN5 GND
NC
MIC+
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
GND
to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250) to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)
GND OPT_PWR LCD_CSB RESETB A0 SCLK SID VDD VDDA VSS V0 GND
GND RS /CS SI SCL VDD V0 VR VOUT CAP2CAP2+ CAP1CAP1+ VSS /RES GND
1 2 3 4 5 6 7 8 9 10 11 12
GND GND GND GND GND
MICn
GND GND GND GND C113 D10p R73 1 82 MIC AP1 R74 2 82 MICD4 D3 C74 C75 D10p NC NC D10p VREFm GND VREFm GND
*C104
*C107
*C106
*C103
*C105
CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51 CN51
KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)
67
D21
(11) (12) (13) (14) (15)
LCD_SDA LCD_SCL LCD_CD LCD_RESET LCD_CSB
RECEIVER
-
R55 1k *R233
RCV-
14.4.
Schematic Diagram (Charger Unit)
TP3
!
1 2
F1
R1 12
TP2
J1 TP4 TP1
SCHEMATIC DIAGRAM (Charger Unit)
68
15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)
CL2 YLW D363 L362 L1T
C115 D143 R162 C142 L361
ANT2
GND
C168 R167
for JIG
UTX
R122
URX
C126
R163 R181 C186
C184
R165 C167
C475 C473 C472 C120 C124 C123 C151
C512 C513
C525
C601
C521
R507 R512
RED SPP
C133
C479
CHG
GRN CHARGE+ CHARGE-
RED
CHG+2 CHG-2
L1R
L372 R112 R115
C352
D142
VDDC
C524 R505 R506
SP
R607
RA502 C301
C611
R334
F301
+3.0V
R304 R307
R305 C307 R301
DC
BLK
RED WHT
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Component View))
69
BLK
C112
C121
R161 R164
C163 C165
D361
C122
Q161
C351
L371
GND
PbF
B
UTX URX C661
R121 D153
C125 VCCA VREF R178 VBG R136 RA151 D133
C171
R166
C181 C514 C510
C511
C530
L476
L474
R152 C152 R151
D473
C478
RSTN
C476
PNLB1712Z
IC601
R604 C332 R503
STM/CKM
D472
STM/CKM/P15
SPN
RA504
FCT
VDDC R612
C477
R602 R335
R603 E +3.0V Q601
R601
R502
RTCK
DCP
RTCK
3.0A
IC611
R605 R606
DCDC_OUT
C321
DCM
C322
R302
R321 C343
ANT1
IC302
VBAT
CL1
+6.5V
R322
VBAT
TMS
TCK
TDI
TDO
BLK DC SP TEL
C894
15.1.2. Bottom View
RED WHT
RED
GRN
YLW
PbF
PNLB1712Z
DA802
C859
C306
C892 C132 C825 C811 C891 R145 R133
R807
R892
JJ301
C895 DA801
R131
C101
D101
C303
C515
IC301
C812 L809
Q301
C518
RA501
C516
C805
R806 R891
C820
R144
Q142
C508
C806
R142
L301
C305
C519
R509
X501
IC501
C185
C522 C507
C520 C523 C504
C304
C509
R160
C506
C342
R333
C505
R501
C503
R331 C331 R332 ZA1 R177 C178
R172 C175
R175
Q171
D331
R371
R652
C176
R651
R176
R171 C113 R113
Q111
C174
IC331
C654 C655 C656
Q651
R111
SW1
C161
C164
C502
C172
C173
L102
L101
C501
C111 R372
HAK_CL1
C651
C652
C653
C658
C659
C660
KEYS_D KEYIN3 1 KEYS_E
KEYIN1 ANS_LED 2APVCC 10 KEYS_C KEYIN2 NC MSG_LED
D113
R114
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Bottom View))

C 81 0 C 81
C302 C308
BLK WBX01 CHG
RED
B
SA101
C341
C517
C827 C826 C863
C102
R141
Q143 Q141
SA103
ANT2
P101
C893
C822
C896
ANT1
KX-TG65XX/75XX/40XX
70
15.2. Circuit Board (Handset_Main)

KX-TGA650XX KX-TGA651XX KX-TGA250XX KX-TGA251XX KX-TGA403XX
PNLB1734Y PbF
R ED
TP_ANT1
R EC EI VE R
RCV+
BL K
TGA650XX TGA651XX
C175 R578 C186 C70 C187 C204 C580
RCVC152 C71
TGA250XX TGA251XX TGA403XX

C104 C103
D21
D22
R55
R231C201C200 C105 C206 R54 C203 R53 R50 R236 C107 R233 R232 C138
C106
BLK
C804
C803 C812
C811 C813 L802
C814
D14 C863 C864 RA800 R880 Q880 R801 R808 C880 C881 C73 RA32
SPEAKER C139
SPSP+
RED D13 C72
C806 L803
IC801
C805
R802
C819
C810 DA801 C827
C802
L801
R805
8 80 R806 C C861 C825
C837 C826 C822
C809
C834
JTAG STM R63 R405 R66 C44 R225 R64
C45 C46
C820
R402 R400 C38 R406 R407
C182 R401
D400 Q400
POWER
C860
R807 R203 C43 C48 C97 C17 C96 R215 C12 C18 R28
IC1
RA1
C47
X1 C2 C1
Q12 Q11 C3
C40 C54 C55 C52 C53 C49 C50
C10 1.8V RA4
Q2 C13 C11 D7 C400 Q401 C332 R330 C342 C341 C340 R403 R404 D1
21 C188 L46 L47
R23 CLK
R27
R37 R36 C39 C30 R20
R249
C51 CP4.0V
R248 CP3.0V RA40 Q10 8
X_CLK (10.368MHZ)
C172
R332 R331 C331
IC3
1 4
RA30 RA31 C150
E Q7 RCVRCV+ RA61 URX UTX GND MIC+ MIC-
R2 Q4
BAT R45 C35 R8 R3 C121
BATT+
BATT+
F1
R30 C147
R7
R4
BATT-
URX UTX JIG GND BAT BATT-
R6
Q9 R31
R74 C75 C74 R73
CHG(+)
CHG(-) D4
CHG (+)
C5
D3
C113 MIC
CHG (-)
MIC+
MIC-
KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))
71
15.2.2. Bottom View

LED12
PNLB1734Y
PbF
KX-TGA650XX KX-TGA651XX KX-TGA250XX KX-TGA251XX KX-TGA403XX CN5 12 1 TGA650XX TGA651XX
CN51 TGA250XX TGA251XX TGA403XX
R51 R52
LED1 LED21
LED2 LED22
LED23 SOFT_C LED3 S1 RIGHT LED6 R 2 3 LED7 6 8 9 LED4 #
SOFT_A
SOFT_B
UP TALK LEFT LED8 SP DOWN
1 LED5 4
7 LED9
MIC
KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))
72
15.3. Circuit Board (Charger Unit)

PQUP11532Y
R1
PNLP1029YA
J1
CIRCUIT BOARD (Charger unit (Component View))
PbF
15.3.2. Bottom View
TP4 (GND)
PQUP11532Y
TP4
J1
F1 1 TP3 2
CIRCUIT BOARD (Charger unit (Bottom View))
PbF
PNLP1029YA
TP3
73
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
1 3
4 2
7(*1) 5 6 7(*1)
PCB1
Ref.No. A
Figure
2.6 8 mm
Note: (*1) The SPACERs (No.7) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset) (P.75).
74
16.2. Cabinet and Electrical Parts (Handset)

111 B
E106 107
E105 E103 E107
104 E101(*1) 106 103 102 105
E102 B MIC100 112 113
108
E104
109 101
110
PCB100
118
120
116 115
(*2)
119 (*3)
114
117
Battery cover Ref.No. B 2 8 mm Figure Spacer (No.119) Stick it between ribs.
Put it in the center.
Note: (*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.44). (*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic. (*3) Attach the SPACER (No. 119) to the exact location described above.
75
16.3. Cabinet and Electrical Parts (Charger Unit)

200
200-1
PCB200
B 200-3 200-2
B 200-4
Ref.No. B
Figure
76
16.4. Accessories
A1 A2
77
16.5. Replacement Parts List

1. RTL (Retention Time Limited) Note: The RTL marking indicates that its Retention Time is Limited. When production is discontinued, this item will continue to be available only for a specific period of time. This period of time depends on the type of item, and the local laws governing parts and product retention. At the end of this period, the item will no longer be available. 2. Important safety notice Components identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts. 3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part. 4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics. 5. RESISTORS & CAPACITORS Unless otherwise specified; All resistors are in ohms () k=1000, M=1000k All capacitors are in MICRO FARADS (F) p=F *Type & Wattage of Resistor
16.5.1.2. Main P.C. Board Parts

Note: (*1) When replacing IC611 or X501, make the adjustment using PNZZTG4011AG Refer to How to download the data (P.52) of Things to Do after Replacing IC or X'tal.
Safety Ref. No. PCB1 Part No. Part Name & Description Remarks
IC302 IC501 IC611 Q111 Q141 Q142 Q161 Q171 D101 D113 D133 D143 DA801 DA802 L101 L102 L361 L371 L501 L809 RA151 RA501 RA502 RA504 SA101
16.5.1. Base Unit 16.5.1.1. Cabinet and Electrical Parts

Safety 1 2 3 4 5 6 7 8 9 Ref. No. Part No. PNKM1129T3 PNBC1303Z2 K2ECYZ000001 PQJJ1T039S PNJT1046Z PNLA1030Z PNYE1027Z PNKF1097Z1 PQHA10023Z Part Name & Description Remarks CABINET BODY PS-HB BUTTON, LOCATOR ABS-HB JACK, DC JACK, MODULAR CHARGE TERMINAL ANTENNA SPACER, ANTENNA CABINET COVER PS-HB RUBBER PARTS,FOOT CUSHION
R111 R112 R113 R114 R121 R122 R131 R133 R141 R142 R145 R151 R152 R160 R161 R162 R163 R164 R165 R167 R171 R172 R175 R176 R178 R181 R321 R322 R334 R335 R371
PNWPG4011AGH MAIN P.C.BOARD ASS'Y (RTL) (ICs) C0CBAYG00016 IC C2HBCY000064 IC(BBIC) PNWIG4011AGH IC(EEPROM)(*1) (TRANSISTORS) 2SC6054JSL TRANSISTOR(SI) B1ACGP000008 TRANSISTOR(SI) PQVTBF822T7 TRANSISTOR(SI) 2SD0874AS TRANSISTOR(SI) 2SC6054JSL TRANSISTOR(SI) (DIODES) PQVDMD5S DIODE(SI) MA111 DIODE(SI) MA111 DIODE(SI) MANV250GEL DIODE(SI) B0DDCD000001 DIODE(SI) B0DDCD000001 DIODE(SI) (COILS) PQLQXF330K COIL PQLQXF330K COIL G1CR22J00006 COIL G1CR22J00006 COIL G1CR10J00010 COIL G1C7N5JA0044 COIL (RESISTOR ARRAYS) D1H410220001 RESISTOR ARRAY EXB28V330 RESISTOR ARRAY EXB28V103 RESISTOR ARRAY D1H468020001 RESISTOR ARRAY (VARISTOR) J0LF00000048 VARISTOR (SURGE ABSORBER) (RESISTORS) PQ4R10XJ104 100k PQ4R10XJ104 100k ERJ3GEYJ103 10k ERJ3GEYJ473 47k ERJ3GEYJ394 390k ERJ3GEYJ394 390k PQ4R18XJ106 10M ERJ3GEYJ334 330k ERJ3GEYJ104 100k PQ4R18XJ272 2.7k ERJ2GEJ222 2.2k ERJ2GEJ104 100k ERJ2GEJ474X 470k ERJ3GEYJ911 910 ERJ3GEYJ104 100k ERJ3GEYJ273 27k ERJ12YJ120 12 ERJ3GEYJ272 2.7k ERJ3GEYJ273 27k ERJ12YJ270 27 ERJ2GEJ220 22 ERJ2GEJ104 100k ERJ2GEJ561 560 ERJ2GEJ101 100 ERJ2GEJ102 1k ERJ2GE0R00 0 ERJ2RKF1400 140 ERJ2RKF1000 100 ERJ2GEJ473 47k ERJ2GE0R00 0 ERJ1TYJ5R6U 5.6
S S
S S
S S S S S S S S S S S S S S S S S S S S S S S S
S S
78
Safety
Ref. No. R372 R501 R502 R505 R507 R605 R606 R612 R806 R807 R891 R892 C101 C102 C111 C112 C113 C120 C121 C122 C123 C126 C132 C142 C151 C152 C161 C167 C171 C173 C175 C176 C178 C184 C186 C302 C321 C322 C341 C342 C343 C351 C352 C476 C477 C478 C479 C501 C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C518 C519 C520 C521 C522 C530 C611 C805
Part No. ERJ1TYJ5R6U ERJ3GEYJ100 ERJ2GEJ330 ERJ2GEJ222 ERJ2GEJ102 ERJ2GEJ332 ERJ2GEJ332 ERJ2GEJ103 ERJ2GEJ471 ERJ2GEJ471 ERJ2GEJ471 ERJ2GEJ471 F1K2H681A008 F1K2H681A008 F1J2A473A024 F1J2A473A024 PQCUV1A684KB ECUE1H102KBQ F1K2H681A008 F1K2H681A008 ECUE1H100DCQ ECUE1H100DCQ ECUV1H103KBV ECUV1H103KBV ECUE1H100DCQ ECUE1C103KBQ F2G1H1000009 ECUV1H102KBV ECUV1C223KBV ECUV1A224KBV ECUE1H102KBQ PQCUV0J106KB ECUE1C223KBQ ECUV1A105KBV ECUE1H100DCQ ECUE1H100DCQ ECUV1A105KBV ECUE1H100DCQ F2A1A3310040 ECUV1C104KBV ECUE1H100DCQ ECUV1C105KBV ECUV1C104KBV ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1A104KBQ ECJ1VB0G106M ECJ1VB0G106M ECUE0J105KBQ ECJ1VB0G106M ECUV1A105KBV ECUV1A225KB ECUE1H100DCQ ECUE1H120JCQ ECUV1A105KBV ECJ1VB0G106M ECUE1A104KBQ ECUV1A225KB ECUE1A104KBQ ECUV1A105KBV ECUE1A104KBQ ECUE1A104KBQ ECUE1A104KBQ ECUE1A104KBQ ECUE1A104KBQ ECUE0J105KBQ ECUE1H100DCQ ECUE1H100DCQ ECUE1A104KBQ F1G1H2R7A480
Part Name & Description Remarks 5.6 10 33 2.2k 1k 3.3k 3.3k 10k 470 470 470 470 (CAPACITORS) 680p 680p 0.047 0.047 0.68 0.001 680p 680p 10p 10p 0.01 0.01 10p 0.01 10 0.001 0.022 0.22 0.001 10 0.022 1 10p 10p 1 10p 330 0.1 10p 1 0.1 10p 10p 10p 10p 0.1 10 10 1 10 1 2.2 10p 12p 1 10 0.1 2.2 0.1 1 0.1 0.1 0.1 0.1 0.1 1 10p 10p 0.1 2.7p
Safety
S S S S S S S S S S S
Ref. No. C806 C810 C811 C812 C813 C820 C822 C825 C826 C827 C859 C863 C891 C892 C893 C894 C895 C896 P101 SW1 F301 X501
Part No. F1G1H2R7A480 F1G1H2R4A480 F1G1H100A723 F1G1HR90A480 F1G1H2R0A480 F1G1H1R5A480 F1G1H100A723 F1G1H100A723 F1G1H100A723 F1G1H100A723 F1G1H2R2A480 F1G1H1R5A480 F1G1H5R0A480 F1G1H5R0A480 F1G1H3R0A480 F1G1H2R2A480 F1G1H1R2A480 F1G1H2R2A480
Part Name & Description Remarks
2.7p 2.4p 10p 0.9p 2p 1.5p 10p 10p 10p 10p 2.2p 1.5p 5p 5p 3p 2.2p 1.2p 2.2p (OTHERS) D4DAY220A022 THERMISTOR (POSISTOR) K0H1BA000259 SPECIAL SWITCH K5H302Y00003 FUSE H0J138500011 CRYSTAL OSCILLATOR (*1)
S S
16.5.2. Handset 16.5.2.1. Cabinet and Electrical Parts

Safety Ref. No. 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 Part No. PNGP1087Y5 PNYE1026Z PNKM1123Y6 PNHS1072Z PQHS10467Z L0AD02A00043 PQHG10729Z PNYE1027Z PNBC1003Y3 PNJK1071V PNHX1165Z PNJT1027Z PNJT1026Z PQHR11315Z L0AA02A00095 PQHS10784Y PQJC10056W PNKF1093Z1 PNHS1079Z PNKK1038Y1 Part Name & Description Remarks PANEL, LCD TAPE, DOUBLESIDED CABINET BODY SPACER, RECEIVER NET COVER, SPEAKER NET RECEIVER RUBBER PARTS, RECEIVER SPACER, CUSHION LCD BUTTON, VOLUME KEY KEYBOARD SWITCH COVER, LCD SHEET CHARGE TERMINAL (L) CHARGE TERMINAL (R) GUIDE, SPEAKER SPEAKER SPACER, SPEAKER NET BATTERY TERMINAL CABINET COVER SPACER, BATTERY LID, BATTERY PMMA-HB PS-HB
ABS-HB
ABS-HB
ABS-HB ABS-HB

Note: (*1) Reconfirm the model No. written on the handset's name plate when replacing PCB100. Because the model No. of the optional handset may differ from the included handset. (*2) When replacing IC3 or X1, make the adjustment using PNZZTG4011AG. Refer to Handset (P.53) of Things to Do after Replacing IC or X'tal. (*3) When replacing the handset LCD, See How to Replace the Handset LCD (P.44). (*4) When removing E106, use special tools (ex. Hot air disordering tool).
Safety Ref. No. PCB100 Part No. Part Name & Description Remarks
IC1
PNWPGA403AGR MAIN P.C.BOARD ASS'Y (RTL) (*1) (ICs) C1CB00003361 IC (BBIC (FLASH))
79
Safety
Ref. No. IC3 IC801 Q2 Q4 Q7 Q9 Q11 Q12 D1 D7 D13 D14 D21 D22 DA801 LED4 LED5 LED6 LED7 LED8 LED9 LED21 LED22 LED23 F1 L801 L802 L803 RA1 RA4 RA30 RA31 RA32 RA40 RA61 RA800 L46 L47 R3 R7 R8 R20 R23 R27 R28 R30 R31 R45 R50 R51 R52 R53 R54 R55 R63 R64 R66 R73 R74 R203 R215 R225 R231 R232 R248 R330
Part No.
Part Name & Description Remarks
Safety
PNWIGA403AGR IC (EEPROM) (*2) C1CB00001842 IC (TRANSISTORS) B1ADGE000004 TRANSISTOR(SI) B1ADGE000004 TRANSISTOR(SI) UN9219J TRANSISTOR(SI) 2SC6054JSL TRANSISTOR(SI) B1ADCF000161 TRANSISTOR(SI) B1ADCF000161 TRANSISTOR(SI) (DIODES) MA2YD2120L DIODE(SI) MA2ZD0200L DIODE(SI) MA8043M DIODE(SI) MA8043M DIODE(SI) MA8043M DIODE(SI) MA8043M DIODE(SI) B0DDCD000001 DIODE(SI) (LEDS) B3ACB0000190 LED B3ACB0000190 LED B3ACB0000190 LED B3ACB0000190 LED B3ACB0000190 LED B3ACB0000190 LED B3ACB0000216 LED B3ACB0000216 LED B3ACB0000216 LED (COILS) PQLQR2M5N6K COIL G1C27NJ00010 COIL G1C3N6ZA0063 COIL G1C3N6ZA0063 COIL (RESISTOR ARRAYS) D1H810240004 RESISTOR ARRAY D1H433220001 RESISTOR ARRAY D1H83314A013 RESISTOR ARRAY D1H433120001 RESISTOR ARRAY EXB28V121JX RESISTOR ARRAY EXB28V103 RESISTOR ARRAY D1H422120001 RESISTOR ARRAY D1H410220001 RESISTOR ARRAY (IC FILTERS) J0JDC0000045 IC FILTER J0JDC0000045 IC FILTER (RESISTORS) ERJ2GEJ102 1k ERJ2GEJ122 1.2k ERJ2GEJ101 100 ERJ2GEJ100 10 ERJ2GEJ102 1k ERJ2GEJ821 820 ERJ2GEJ821 820 ERJ3GEYJ152 1.5k ERJ2GEJ101 100 ERJ6RSJR10V 0.1 ERJ2GEJ103 10k ERJ2GEJ471 470 ERJ2GEJ102 1k ERJ2GEJ332 3.3k ERJ2GEJ103 10k ERJ2GEJ102 1k ERJ2GEJ101 100 ERJ2GEJ103 10k ERJ2GEJ102 1k ERJ2GEJ820 82 ERJ2GEJ820 82 D0GA563ZA006 56k ERJ2GE0R00 0 ERJ2GE0R00 0 ERJ2GEJ824 820k ERJ2GEJ434X 430k ERJ2GE0R00 0 ERJ2GEJ105X 1M
Ref. No. R331 R332 R801 R802 R805 R806 R807 C1 C2 C5 C10 C11 C12 C13 C17 C18 C35 C40 C43 C44 C45 C46 C47 C49 C50 C51 C52 C53 C54 C55 C72 C73 C74 C75 C96 C97 C103 C104 C105 C107 C113 C152 C172 C182 C188 C200 C201 C203 C204 C331 C332 C341 C802 C803 C804 C805 C806 C808 C809 C810 C811 C812 C813 C814 C819 C822 C825 C826 C827 C834 C860 C861
Part No. ERJ2GEJ273X ERJ2GEJ273X ERJ2GEJ122 ERJ2GEJ101 ERJ2GEJ470 ERJ2GEJ221 ERJ2GEJ221 F2A0J3310067 F2A0J3310067 ECUV1A105KBV ECUV1A225KB ECUE1A104KBQ PQCUV0J106KB ECUE1A104KBQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H560JCQ ECUE1A104KBQ ECUE1H100DCQ ECUE1A104KBQ ECUE1A104KBQ ECUE1H100DCQ ECUV1A105KBV ECUV1A105KBV ECUV1A105KBV ECUV1A105KBV PQCUV0J106KB PQCUV0J106KB ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H100DCQ ECUE1H101JCQ F1G1H100A723 ECUE1H101JCQ ECUE1H330JCQ ECUE1H100DCQ ECUE1H102KBQ ECUE1A104KBQ F1G1H3R0A480 ECUE0J105KBQ ECUV1C105KBV ECUV1C105KBV ECUV1C105KBV ECUV1C104KBV ECUE0J105KBQ ECUE0J105KBQ ECUE1H390JCQ F1G1H2R0A480 F1G1H1R5A480 F1G1H2R0A480 F1G1H3R3A480 F1G1H3R3A480 ECUE1A104KBQ F1G1H100A723 F1G1H1R6A480 F1G1H100A723 F1G1H100A723 F1G1H1R6A480 ECUE1H332KBQ F1G1H100A723 F1G1H100A723 F1G1H100A723 F1G1H4R0A480 F1G1H100A723 F1G1H1R0A480 F1G1H100A723 F1G1H3R0A480
Part Name & Description Remarks 27k 27k 1.2k 100 47 220 220 (CAPACITORS) 330 330 1 2.2 0.1 10 0.1 10p 10p 56p 0.1 10p 0.1 0.1 10p 1 1 1 1 10 10 10p 10p 10p 10p 10p 10p 10p 10p 100p 10p 100p 33p 10p 0.001 0.1 3p 1 1 1 1 0.1 1 1 39p 2.0p 1.5p 2.0p 3.3p 3.3p 0.1 10p 1.6p 10p 10p 1.6p 0.0033 10p 10p 10p 4p 10p 1p 10p 3p S S S S S S S
S S S S
S S
S S S S S S S S S S S S S S S S S S S S S S S S S S
80
Safety
Ref. No. MIC100 E101 E102 E103 E104 E105 E106 E107 X1
Part No.
Part Name & Description Remarks Safety Ref. No. Part No. Part Name & Description Remarks
(OTHERS) L0CBAY000032 MICROPHONE L5DYBYY00012 LIQUID CRYSTAL DISPLAY (*3) PNHR1247Z TRANSPARENT PLATE, LCD PMMA-HB PNHR1246Z GUIDE, LCD ABS-HB PNHX1254Z COVER, LCD PNLA1020Z ANTENNA PNMC1013Z CASE,MAGNETIC SHIELD (*4) PNVE1002Z BATTERY TERMINAL H0J103500033 CRYSTAL OSCILLATOR (*2)
PQZZ1CD300E JIG CABLE (*1) PNZZTG4011AG BATCH FILE CD-ROM (*1) PQZZ430PIR TIP OF SOLDERING IRON (*2) PQZZ430PRB RUBBER OF SOLDERING IRON (*2)
16.5.3. Charger Unit 16.5.3.1. Cabinet and Electrical Parts

Safety Ref. No. 200 Part No. PNLC1010ZT Part Name & Description Remarks CHARGER UNIT without NAME (RTL)(for TG4012LAT)(for TG4013LAT) CABINET BODY CHARGE TERMINAL CABINET COVER RUBBER PARTS, CUSHION ASS'Y PLATE KXKXPS-HB PS-HB FOOT
200-1 200-2 200-3 200-4
PNKM1131Y2 PNJT1010Z PNKF1098Z1 PQHA10023Z

Safety Ref. No. PCB200 Part No. Part Name & Description Remarks ASS'Y
J1 R1 F1
PNWPTGA641CH MAIN P.C.BOARD (RTL) (JACK) K2ECYB000001 JACK (RESISTOR) ERG2SJ120 12 (FUSE) K5H302Y00003 FUSE
16.5.4. Accessories
Note: You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
Safety Ref. No. A1 A2 Part No. PQLV219AGY PQJA10075Z Part Name & Description Remarks AC ADAPTOR CORD, TELEPHONE
16.5.5. Screws
Safety A B Ref. No. Part No. XTB26+8GFJ XTB2+8GFJ Part Name & Description Remarks TAPPING SCREW TAPPING SCREW
16.5.6. Fixtures and Tools

Note: (*1) See Equipment Required (P.45), and The Setting Method of JIG (P.45) (*2) When replacing the Handset LCD, See How to Replace the Handset LCD (P.44)
T.I KXTG4011AGT KXTG4012AGT KXTG4013AGT KXTGA403AGT
81

Tg4011ag Final 7115 100929

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ORDER NO.

KX-TG4011AGT KX-TG4012AGT KX-TG4013AGT KX-TGA403AGT

Expandable Digital Cordless Phone

About Lead Free Solder (PbF: Pb free)

Suggested PbF Solder

Signal Flowchart in the Radio Parts

SIDE TONE CIRCUIT

LOUT LIN HOOK DCIN 2 DCIN 1 BELL HSMIP HSMIN

Block Diagram (Base Unit_Main)

VBAT VCCPA VBAT_APU VCC_IF VCC_FE VCC_VCO

R371 R372 CHARGE_CONTACT

KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_Main)

Block Diagram (Base Unit_RF Part)

RXON RXp RXn

KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)

Circuit Operation (Base Unit)

BBIC (Base Band IC: IC501)

Power Supply Circuit/Reset Circuit

The voltage from the AC adaptor is supplied to the charge circuits.

Telephone Line Interface

Parallel Connection Detect Circuit/Auto Disconnect Circuit

Calling Line Identification (Caller ID)

Block Diagram (Handset)

WP, CLK, DATA

Power_adj TXn TXp

VDD_PADRV PSEL PON TXON RXON RF_RXn RF_RXp

3V LED (BELL) Monitor SP

KX-TGA403 BLOCK DIAGRAM (Handset)

Block Diagram (Handset_RF Part)

RXON RF_RXn RF_RXp

KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)

Circuit Operation (Handset)

Power Supply Circuit/Reset Circuit

Battery Low/Power Down Detector

Circuit Operation (Charger Unit)

RF part signal route

5 Location of Controls and Components

Frequently Used Items (Base Unit) ex.)

Frequently Used Items (Handset) ex.)

10.1.1. Check Power 10.1.1.1. Base Unit

Cross Reference: Power Supply Circuit/Reset Circuit (P.12)

Cross Reference: Power Supply Circuit/Reset Circuit (P.20)

10.1.2. Check Battery Charge 10.1.2.1. Base Unit

Cross Reference: Charge Circuit (P.13)

Cross Reference: Check Power (P.31) Charge Circuit (P.21)

10.1.2.3. Charger Unit

Cross Reference: Charge Circuit (P.21)

10.1.3. Check Link 10.1.3.1. Base Unit

Note: (*1) HS: Handset (*2) BU: Base Unit

10.1.4.2. RF Check Flowchart

Note: (*1) Refer to Check Link (P.33).

10.1.4.3. Check Table for RF part

10.1.4.4. TEST RANGE Check

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

BU (Base Unit) TX Power Check BU (Base Unit) RX Sensitivity Check

HS (Handset) TX Power Check HS (Handset) RX Sensitivity Check

HS (to be checked) TX Power Low High

Regular_BU TX Power High Low

Note: (*1) Refer to Commands (Base Unit) (P.48).

10.1.5. Registering a Handset to the Base Unit

10.1.6. Deregistering a Handset

10.1.7. Deregistering All Handsets by the Base Unit

Note: (1) HS: Handset (2) BU: Base Unit