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DATA SHEET
handbook, 2 columns
M3D116
Philips Semiconductors
Product specication
BYV96 series
Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYV96D BYV96E VR continuous reverse voltage BYV96D BYV96E IF(AV) average forward current PARAMETER repetitive peak reverse voltage
MAM047
CONDITIONS
MIN.
UNIT
Ttp = 55 C; lead length = 10 mm see Fig 2; averaged over any 20 ms period; see also Fig 6 Tamb = 55 C; PCB mounting (see Fig.11); see Fig 3; averaged over any 20 ms period; see also Fig 6
0.8
IFRM IFSM
Ttp = 55 C; see Fig 4 Tamb = 55 C; see Fig 5 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax L = 120 mH; Tj = Tj max prior to surge; inductive load switched off see Fig 7
17 9 35
A A A
ERSM Tstg Tj
65 65
10 +175 +175
mJ C C
1996 Jun 07
Philips Semiconductors
Product specication
BYV96 series
UNIT
1 150 300
V V A A ns
Cd dI R -------dt
40
pF A/s
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.11. For more information please refer to the General Part of associated Handbook. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient CONDITIONS lead length = 10 mm note 1 VALUE 46 100 UNIT K/W K/W
1996 Jun 07
Philips Semiconductors
Product specication
BYV96 series
MGC587
handbook, halfpage
2.0
handbook, halfpage
1.2
lead length 10 mm
1.2
Fig.2
Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
Fig.3
Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
MGC585
20
IFRM (A) 16
= 0.05
12 0.1
8 0.2
0.5 1
0 10 2
10 1
10
10 2
10 3
tp (ms)
10 4
Ttp = 55C; Rth j-tp = 46 K/W. VRRMmax during 1 ; curves include derating for Tj max at VRRM = 1000 V.
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Jun 07
Philips Semiconductors
Product specication
BYV96 series
MGC586
10
IFRM (A) 8
= 0.05
0.1
0.2
0.5 1
0 10 2
10 1
10
10 2
10 3
tp (ms)
10 4
Tamb = 55 C; Rth j-a = 100 K/W. VRRMmax during 1 ; curves include derating for Tj max at VRRM = 1000 V.
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
MGC576
MGC583
handbook, halfpage
handbook, halfpage
200
P (W)
a = 3 2.5
1.57 1.42
Tj o ( C)
100
1 D E
0 0 1 IF(AV) (A) 2
Fig.6
Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current.
Fig.7
1996 Jun 07
Philips Semiconductors
Product specication
BYV96 series
MGC577
MGC574
handbook, halfpage
IF (A) 6
10
0 0 1 2 VF (V) 3
10 1 0 100 Tj ( C)
o
200
VR = VRRMmax.
Fig.8
Fig.9
MGC584
handbook, halfpage
50 25
7 50 10
1996 Jun 07
Philips Semiconductors
Product specication
BYV96 series
DUT +
IF (A) 0.5 1 t rr
10
MAM057
Fig.12 Test circuit and reverse recovery time waveform and definition.
1996 Jun 07
Philips Semiconductors
Product specication
3.81 max
28 min
,
4.57 max
BYV96 series
0.81 max
28 min
MBC880
Fig.14 SOD57.
DEFINITIONS Data Sheet Status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
1996 Jun 07
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