TDA7267

2W MONO AMPLIFIER

CAN DELIVER 2W THD 10% 12V/8 INTERNAL FIXED GAIN 32dB NO FEEDBACK CAPACITOR NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLE REJECTION LOW TURN-ON/OFF POP STAND-BY MODE

MINIDIP (4+4)

ORDERING NUMBER: TDA7267

DESCRIPTION The device TDA7267 is a new technology Mono Audio Amplifier in MINIDIP package specifically designed for TV application. Thanks to the fully complementary output configuBLOCK DIAGRAM

ration the device delivers a rail to rail voltage swing without need of boostrap capacitors.

VS

VS=12V 100F

0.1F IN

IN

+ OUT

470F

SVR 47F

S-GND

P-GND
D94AU165

June1998

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TDA7267
ABSOLUTE MAXIMUM RATINGS
Symbol VS IO Top Tj Tstg Operating Supply Voltage Output Put Peak Current Operating Temperature Range Junction Temperature Storage Temperature Range Parameter Value 18 1.5 0 to 70 150 -40 to 125 Unit V A C C C

PIN CONNECTION (Top view)

VS OUT SVR IN

1 2 3 4
D94AU163

8 7 6 5

GND GND GND GND

THERMAL DATA
Symbol Rth j-amb Rth j-case Parameter Thermal Resistance Junction to ambient (on PCB) Thermal Resistance Junction to case Value 80 15 Unit C/W C/W

ELECTRICAL CHARACTERISTICS (Tamb = 25C; VS = 12V; RL = 8; f = 1KHz; unless otherwise specified.)

Symbol VS IS Isb VO AV RIN PO THD SVR EI Vsb Parameter Supply Voltage Range Quiescent Current Stand-By Current Quiescent Output Voltage Voltage Gain Input Impedance Output Power Distortion Supply Voltage Rejection Input Noise Voltage Stand-By Enable Voltage THD = 10% PO = 1W Vripple = 150mVrms; Fripple = 1KHz Rg = 10K; BW = 20Hz to 20KHz 1.8 Pin 3 shorted to GND 6 32 100 2 1.0 50 1.5 5 1 Test Condition Min. 4.5 20 Typ. Max. 18 30 0.3 Unit V mA mA V dB K W % dB V V

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TDA7267
APPLICATION CIRCUIT

VS 0.1F IN

VS=12V 100F 470F OUT 8

IN

SVR 47F

STAND-BY

P-GND
D94AU166

APPLICATION HINTS: For 12V supply and 8 speaker application, its maximum power dissipation is about 1W. Assumming that max ambient temperature is 70C. Required thermal resistance of the device and heat dissipating means must be equal to (150 - 70)/1 = 80C/W.

Junction to pin thermal resistance of the package is about 15C/W. That means external heat sink of about 65C/W is required. Cu ground plane of PCB can be used as heat dissipating means. Stand-By switches must be able to discharge Csvr current.

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TDA7267
MINIDIP PACKAGE MECHANICAL DATA
DIM. MIN. A a1 B B1 b b1 D E e e3 e4 F I L Z 0.44 3.3 1.6 0.017 8.8 2.54 7.62 7.62 7.1 4.8 0.130 0.063 0.38 0.7 1.39 0.91 0.5 0.5 9.8 0.346 0.100 0.300 0.300 0.280 0.189 0.015 1.65 1.04 mm TYP. 3.3 0.028 0.055 0.036 0.020 0.020 0.386 0.065 0.041 MAX. MIN. inch TYP. 0.130 MAX.

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TDA7267

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics Printed in Italy All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

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