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QUARTZ

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Service Manual

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HTC Proprietary
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Confidential Treatment Requested

Rev. A05

HTC Corporation
Engineering Mobility

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REVISION CONTROL TABLE

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REV DATE CONTENTS DEPT REVISED STAGE

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AX01 2008/04/14 Fist Draft PSE Jason.Cl_Lee DVT

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A01 2008/10/7 Formal release PSE Jason.Cl_Lee PVT
1. Add tamper evident label.
2. Revise chapter 11.1 LCM and Bezel replacement.
A02 2008/10/29 PSE Jason.Cl_Lee MV
3. Add internal storage content pre-load process.
4. Update chapter 9.1 SPL list for repair
1. Add “write engineer ID” in the diagnostic process.
2. Add “Adjust the backlight to lowest” in the
A03 2008/11/19 power management for idle and sleep PSE Jason.Cl_Lee MP
current measurement.

1. Remove some parts of board level 2.5.

2. Add document no for internal storage pre-load tool.
3. Add the last step of internal storage pre-load
A04 2008/11/26 process to check the internal storage content. PSE Jason.Cl_Lee MP
4. Add chapter 9.3 FRU M/B addition parts location.
5. Add unit water sensitive label location.
6. Update chapter 9.1 SPL for repair.
A05 2008/12/10 1. Add TV out test in the chapter 4.1 Win CE test item PSE Jason.Cl_Lee MP

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Table of Contents

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1. INTRODUCTION ......................................................................................................................................................4

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1.1 Product overview ...............................................................................................................................................6

2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE...........................................................................10

2.1 Tools List..........................................................................................................................................................10

2.2 Disassembling procedure ................................................................................................................................11
2.3 Assembling procedure ......................................................................................................................................17

3. ROM RE-FLASH PROCEDURE ............................................................................................................................23

3.1 Internal storage pre-load .................................................................................................................................23

3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility) ........................................................................................25
3.3 Rom Image upgrade thru SD card ..................................................................................................................29

4. DIAGNOSTIC PROGRAM .....................................................................................................................................31

4.1 List of Diagnostic / WinCE Test Items..............................................................................................................31

5. POWER MEASUREMENT TEST...........................................................................................................................45

5.1 Main board leakage current Test Procedure ...................................................................................................45

5.2 Battery rundown test procedure ......................................................................................................................48

6. COSMETIC INSPECTION CRITERIA....................................................................................................................54

6.1 Classes definition of inspective area ...............................................................................................................54

6.2 Display inspection............................................................................................................................................55
6.3 Main unit inspection.........................................................................................................................................55

7. GENERIC TROUBLESHOOTING..........................................................................................................................56

8. GENERIC LABELING PLAN ..................................................................................................................................61

9. GENERIC SPARE PART LIST AND PHOTOS.......................................................................................................65

9.1 SPL for Repair .................................................................................................................................................65

9.2 Board Level 2.5 Repairs ..................................................................................................................................70
9.3 FRU M/B addition parts location......................................................................................................................73

10. RF ANTENNA SPECIFICATION ..........................................................................................................................74

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11. APPENDIX ...........................................................................................................................................................76

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11.1 LCM and LCM bezel replacement ...................................................................................................................76

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2nd camera and daughter board assembly ......................................................................................................80

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11.2

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1. Introduction
ƒ This manual provides the technical information to support the service activities of Diamond.
ƒ This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product
function. After reading this chapter, you will know what feature the product has
and basic hardware operation. Also you will know how to perform soft-rest and
hard-rest in this chapter.
z Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter,
you will learn how to disassemble and assemble the product. Also, you will
know what tools to use and the torque. Please follow the instruction to
dissemble the unit to prevent from damaging the unit.
z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to
perform the ROM image re-flesh by using RUU and SD-Card. Also you can
find the steps of enter the boot loader mode.
z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
z How to use the diagnostic program to perform unit function test
z How to test some functions in Windows Mobile mode (ex. WLAN,
Bluetooth, and USB etc…)
z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use
MB leakage test procedure and battery run-down test (Battery Capacity
Measurement).
z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the
appearance quality inspection criteria, ex. Display, bezel, and housing etc…
z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do
generic trouble-shooting.
z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for
reference, ex. Regulation label, and battery label etc…
z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts

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reference list and photos for repairing, including unit and Board level.

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z Chapter 10: RF Antenna Specification- Reference Spec for RF test.

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z Appendix: Additional information.

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1.1 Product overview

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2. Device Disassembling and Assembling Procedure

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2.1 Tools List

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level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
5 Micro Memory Card with Diag. test HTC design DCT-00062
program (need be encoded by
HTC)
6 Micro memory card for ROM code HTC design
re-flash ( must be encoded by HTC)
7 Micro memory card for internal
L1
storage pre-load
7 Universal leakage current tester HTC design MLT-00001
8 Battery holder HTC design
9 Unit current consumption test HTC design
fixture
10 Power supply
11 Current Meter
12 Mobile tester
13 TV out cable HTC option parts 73H00274-02M
14 TV
13 Special Made Plastic Stick HTC special tools RTT-00006
L2 14 Hand tools
19 Label printer ( 400 dpi resolution and up )
18 Lead-free Soldering station
L 2.5 19 Air heater

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2.2 Disassembling procedure

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Tools needed for Assembling and Disassembling
process.

1. Lens Cleaning Cloth.

2. Screw Driver T6X40.
3. Flat Plastic Stick.
4. Plastic Tweezers.

Press the battery cover and push the battery cover

as shown photo.

Use your finger to lift up battery.

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Use Torx bit no 6 to remove five screws.

Use Flat Plastic Stick to separate LCM and

housing.

Disconnect vibrator.

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Use flat plastic stick to disconnect LCM connector.

Use flat plastic stick to disconnect 2nd camera.

Use flat plastic stick to disconnect main camera.

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Use flat plastic stick to remove speaker.

Use flat plastic stick to remove receiver.

Remove one gasket on the LCM.

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Place the LCM module into the oven by 60℃ and
5 minutes.

Press LCM as shown the photo to separate LCM

and bezel.

Lift up the LCM as shown the photo.

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The disassembly process is finished.

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2.3 Assembling procedure

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Tools needed for Assembling and Disassembling
process.

1. Lens Cleaning Cloth.

2. Screw Driver T6X40.
3. Flat Plastic Stick.
4. Plastic Tweezers.

Place LCM into bezel as shown the photo.

For LCM and LCM bezel assembly, please
also refer appendix 11.1

Stick one EMI gasket on the LCM as shown the

photo.

EMI gasket P/N: 72H02659-00M

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Place receiver on the LCM bezel. The pins of
receiver should direct LCM side.

Place speaker into housing.

Assemble main camera and then stick one EMI

gasket on it.

EMI gasket P/N: 72H02659-00M

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Place 2nd camera on the main board as shown the

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photo especially the red circle must toward the
bottom.

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Please replace 2nd camera and daughter
BD in the same time if 2nd camera is
defective.
For 2nd camera and daughter BD
assembly, please refer appendix 11.2

Connect LCM cable and main board.

Place main board on the LCM and then ensure the

main board is locked by the two hooks.

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Remove protector of vibrator tape.

Connect vibrator with main board and then ensure

the cable of vibrator is fixed on the vibrator tape.

Combine housing with LCM bezel.

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Fasten five screws.

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Torque: 1.5±0.05 kg-cm2
72H02643-00M * 1
72H01059-00M * 4

Stick one tamper evident label as shown the

photo.
tamper evident label P/N: 77H00460-01M

Place battery into device.

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Place battery cover.

Insert stylus into device.

The assembly process is finished.

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3. ROM Re-flash Procedure

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3.1 Internal storage pre-load
Internal storage pre-load-1

1. Download the internal storage content from

SDO (GSD-00005788).
http://htcscm10.htc.com.tw/SDO
2. Download the autorun.exe from SDO
(DOC-00049134).
http://htcscm10.htc.com.tw/SDO
3. Un-zip the image file.

Internal storage pre-load-2

4. Format the Micro SD card with FAT32.

5. Create a folder named 2577 in the Micro
SD card.
6. Copy autorun.exe into 2577 folder.
7. Copy all the files of internal storage content
into the 2577 folder as shown the photo.

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8. Insert the micro SD into the device and
then the device will copy the files to internal
storage automatically.

Internal storage pre-load-4

9. After completing the data copy, the program

will compare the checksum value with the
checksum file in the micro SD card.

Internal storage pre-load-5

10. You can also check the internal storage if

have the folder as shown the photo.

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3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility)

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Connect device to PC

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1. Setting and allow USB connections in
Microsoft ActiveSync.
2. Connect your device and desktop/ or
laptop via USB cable.
3. Check the pop-up message from
Microsoft ActiveSync when device is
synchronized with PC.

Download OS Image from SDO

4. Download OS image from SDO.

http://htcscm10.htc.com.tw/SDO
5. Un-zip the file and execute RUU
program.

Check the setting of menu

6. Select the type of USB connection with

“ActiveSync” mode in the settings of
menu.

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RUU-1

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7. Tap the RUU to execute ROM code

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re-flash.
8. Read the pop-up message form
ROM update utility and select the “I
understand…” checkbox.
9. Click “Next” to proceed.

RUU-2

10. Read the pop-up message form

ROM update utility to follow and
perform the instructions and select
the “I completed…” checkbox.
11. Click “Next” to proceed.

RUU – 3

12. Current image version

confirmation.
13. Click “Update” to proceed

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RUU-4

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14. Double verify the ROM revision
which you want to update before
re-flash procedure.
15. Click “Next” to proceed.

RUU-5

16. Read the information from

pop-up message and the OS
update procedure will takes 10
minutes long.
17. Click “Next” to proceed.

RUU – 6

18. You can see the update

progress from your PC and in
your device.

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RUU – 7

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19. The OS upgrade is finished,
click “Finish” to close the utility.

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Download OS Image from SDO

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10. Download OS image from
SDO.
http://htcscm10.htc.com.tw/SDO
11. Un-zip the image file.

Format SD card and copy image file to SD card

12. Format the Micro SD card to

FAT32 mode.
13. Copy image file XXX.nbh to
the micro SD card and
re-name to QUARIMG.NBH.

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SD Upgrade - 1

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14. Turn off the device and insert

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Micro SD card.
15. Press and hold Volume
down+ Power button to
entry boot loader mode.
16. Press Volume up button to
upgrade procedure.

SD Upgrade - 2

17. After finishing re-flash

process, press reset button
to re-boot the device.
[Note]: This process will takes 10
minutes, please don’t power off
the device.

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4.1 List of Diagnostic / WinCE Test Items

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Mode No Item Description Remark
Function Test
1 Auto Auto Regular Tests (Display, B.L, Vibrator, etc…)
2 F/T1 Test
3 Back Light Test LCD back light test
4 ROM Checksum Calculate ROM code size
5 RAM Test SDRAM test
6 SD Card Test Micro SD card read / write test
Power, Volume up, Volume down, APP1,
7 Key Test
App2 and App3.
8 Display Test Pattern display test
9 T/P Test Touch panel calibration
10 Vibrator Test Vibrator on test
Diagnostic mode

11 LED Test Device status LED test

12 Read Batt Info Read battery information
13 MoviNand Test Internal storage read / write test
14 G-Sensor Test Motion G sensor function test
15 Read WiMAX MAC Read WiMAX MAC address
Read WiMax
16 Get WiMax ID information
( SQN1130 ) ID
17 Get Wlan ID Get WLAN ID information
18 Exit Exit the function test
Run-in Test
1 2 Hour 2 Hour Run-in Test/Press Volume-up key. Option
4 Hours Run-in Test/Press Volume-down
2 4 Hours Option
key.
3 8 Hours 8 Hours Run-in Test/Press Phone-on key. Option
4 12 Hours 8 Hours Run-in Test/Press Home key Option
5 No Limited No limited Run-in Test/Press Phone-end key. Option
Format FAT (Clear Personal information, talk times and format storage)

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Device Info

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Erase MoviNand ( Clear internal storage )

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1 Bluetooth Test Bluetooth Function Test

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2 USB Test USB link test (Microsoft ActiveSync)
3 Camera Test Camera Function Test
Win CE mode

4 WLAN Test WLAN Function Test

5 GPS Test GPS Function Test
6 FM Radio Test FM Radio Function Test
7 Audio Test All Audio Function Test
8 WIMAX Test WIMAX Function Test
9 TV out Test TV out function Test

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Diagnostic mode

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How to select test item: Using Volume -"Up" or "Down" to select the test items

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How to execute the test program: Press “Home” button at the bottom of touch panel to start each of test items.

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Main Menu/Function Test Menu

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1. Turn the device power off and insert
Diagnostic SD card into the device.
2. Press and hold Volume down +
Power button then enter Diagnostic
mode.
3. Using to select the test item and
move to next page as well.
4. Select item “Function Test” to find
the Function test menu.

Auto Test

1. Press the Action key to start the

Auto-test.
2. It will perform the regular tests, please
follow the system instruction to do the
test.

F/T1 Test

1. Press Volume key to select F / T1 Test

on Function test menu.
2. Connect device and computer via
USB cable. The device will start to
sync

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Back Light Test

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2. Press Volume key to select Back Light

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Test on Function test menu.
3. Press Home icon to switch the LCD
backlights level from Level1, Level2,
Level3 and Level4.
4. Press Home icon to exit and return to
Function test menu.

ROM Checksum Test

1. Press Volume key to select ROM

Checksum on function test menu.
2. The Rom Checksum will be
displayed on the screen.
3. Press Home icon to exit and return to
Function test menu.

RAM Test

1. Press Volume key to select RAM Test

on function test menu.
2. The test result will be displayed on the
screen.

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SD Card Test

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1. Press Volume key to select SD Card
Test on function test menu.
2. The test result will be displayed on the
screen.

Key Test

1. Press Volume key to select Key Test

on function test menu.
2. Follow the instruction on screen to
perform the Key/Button test. ( Volume
Up / Down, App1, App2 and APP3)

Display Test

1. Press Volume key to select Display

Test on Function test menu.
2. After the test pattern is show up,
please check the pattern if any
un-uniform color or chromatist.
3. Press Home icon to continue the next
test pattern.

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T/P Test

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Press Volume key to select T/P Test on
function test menu.

Vibrator Test

1. Press Volume key to select Vibrator

Test on function test menu.
2. Press Home icon to exit vibrator test.

LED Test

1. Press Volume key to select LED Test

on function test menu.
2. Check LED behavior if correct or not.

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Read Batt Info

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1. Press Volume key to select Read Batt
Info on function test menu.
2. Press Home icon to exit.

MoviNand Test

1. Press Volume key to select NoviNand

Test on function test menu.
2. The test result will be displayed on the
screen.

G-Sensor Test

1. Press Volume key to select G-

Sensor Test on Function test menu.
2. Put the unit on the table with when
performing this G sensor testing.

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Read WiMAX ( SQN1130 ) ID

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1. Press Volume key to select Read
Wimax ( SQN1130 ) ID on function
test menu.
2. Press Home icon to exit.

Get Wlan ID

1. Press Volume key to select Get Wlan

ID on function test menu.
2. Press Home icon to exit.

Main Menu/Engineer ID

1. Choose Engineer ID item and then

tap Home icon.
2. Choose A1 LCM or A2 LCM to
write engineer ID in the main
board.

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WinCE mode Test

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Bluetooth Test - 1

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1. Tap icon Comm Manager on the
Today screen and turn on Bluetooth.
2. Tap the icon “Settings” down-right
the corner of the screen and select
the “Make this device….” Checkbox.
3. Press Action key (Jog-ball) to go
next test pattern.

Bluetooth Test-2

4. Tap Start->Settings->Connections->
Beam and select “Receive all….”
Checkbox.
5. To create a file, tap Start->Programs
->Notes->New
6. Tap and select the “Beam file…”

Bluetooth Test-3

7. Once device is searched, tap the

device to send the file.
8. Return to Today screen and tap
Start->Program->Comm Manager
->Bluetooth to turn off Bluetooth.

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USB Test

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1. Start up the Microsoft®

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ActiveSync®program in the PC.
2. Select ActiveSync in the setting of
menu
3. Insert USB cable and connect unit to
desktop/ or laptop.
4. The USB to PC icon -> is
appears on the Today screen when
your device is connected to your
desktop/ or laptop.

Camera Test

1. Tap Start->Program->Camera or
Press Camera button to turn on the
Camera.
2. Make sure the device will present
and enter the preview display.
3. Check camera pre-view and image
quality.

WLAN Test

1. Tap icon Comm Manager on the

Today screen and turn on WLAN.
2. Select the hot-spot/ or access point
which searchable and appears on
screen.
3. Once the hot-spot (access point) is
connected, press the IE button and
logon Internet.

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GPS Test

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1. Download test program from SDO

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(DOC-00042190)

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http://htcscm10.htc.com.tw/SDO
2. Setup the COM port to COM4.
3. Place device in GPS receptor
coverage area and tap the icon
“Open GPS”.
4. Check the GPS status as picture
shown.
FM Radio Test

1. Insert the headset into the USB

connector before doing the testing.
2. Tap icon FM Radio in the programs
of the menu.
3. Select the different channels for
testing.

Audio Test-1

1. Download test program from SDO

(DOC-00046466)
http://htcscm10.htc.com.tw/SDO
2. Un-zip the image file.
3. Copy “mfgtest.dll” and “Audio
Test.exe” to Micro SD card.
4. Execute ”Audio Test” program from
internal storage.
5. Choose the each test in the menu of
“Tools”

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Audio Test-2

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6. Select the Speaker Test then press
Play button for testing.

Audio Test-3

7. Select the Receiver Test then press

Play button for testing

Audio Test-4

8. Connect the headset into the USB

port before doing the testing
9. Select the Headset Test then press
Play button for testing

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Audio Test-5

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10. Select the Int-Rec Test then press
the “Record” button for voice
recording first
11. Stop the voice record then press
“Play” button for internal receiver
test

Audio Test-6

12. Connect the headset into the USB

port before doing the testing
13. Select the Ext-Rec Test then press
the “Record” button for voice
recording first

WIMAX Test-1

1. In Comm Manager, turn on WiMAX

function.

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WIMAX Test-2

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2. Tap Start > Settings > WiMAX > list tab.
3. Check if device can search WiMAX
base station or simulator.

WIMAX Test-3

4. In Status tab, check if device can

receive base station information.

TV out Test

1. Insert TV out cable into the device.

2. The device will detect the TV out
cable and then choose the signal type
of TV. If device doesn’t detect the TV
out cable, please tap Start > Setting >
System tab > TV out.
3. Connect the TV out cable to TV.
4. Play one video file to check if there
are video and audio output on TV

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5. Power Measurement Test

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5.1 Main board leakage current Test Procedure

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This is a quick method to measure if any abnormal leakage current on main board
which caused high power consumption compare to GOOD main board.
(1) Requirement：
- Control box
Equipment list
1. Control box

2. 4 colors cable
Cable A: Red
Cable B: Yellow
Cable C: Green
Cable D: Black

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C. types Jig

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Jig - D (6 pins-Short)

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Jig-D

Equipment set up
1. Connect control box and jig through
3 colors cable with red, black and yellow

2. Set up each button by row A~D

according to product specification
A Following is an setting for QUARTZ
Button set up matrix
MODEL JIG TYPE
A B C D
B QUARTZ D 1 8 0 1

It means, press button A1,B8,C0, D1

C

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3. Install jig to device

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(the photo is for reference only)

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Start testing
1. Turn on control box power button

2. Press Power button to turn on the

device.

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2. In “main page”, Check phone status,

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Click “Turn on flight mode”.
Set the unit to :

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* Flight mode

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* Make sure all RF function is off (phone,

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BT, Wifi..)
* Adjust the backlight to lowest.

4. Measure Idle mode current. Idle current

value must under 64mA, if over the
Idle current test criteria, it means M/B failed, please
replace M/B for repair.

5. After idle current checked, Switch OFF

the unit. Unit is turn off and no display.
Sleep current test Sleep current value must less than 3 mA,
if over the criteria, it means M/B failed,
please replace M/B for repair.
Conclusion:
If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD. If
there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace M/B
for repair.

5.2 Battery rundown test procedure

Test Requirement:
-Windows 2000/XP
-USB Cable
-ActiveSync 4.2 above (WINCE 6.0 should use ActiveSync 4.5)
-Master Unit
-Battery in Warranty

Caution: Please charge your unit to full capacity for battery (until the green light
is displayed) before doing the test.

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TEST PROCEDURE

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Connect device to PC

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I. Setting and allow USB

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connections in Microsoft
ActiveSync.
II. Connect your device and desktop/
or laptop via USB cable.
III. Check the pop-up message from
Microsoft ActiveSync when
device is synchronized with PC.

Copy the Battery Rundown tool into the device

IV. Make a folder in the device.
V. Copy PowerDetect.exe into the
folder.

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Battery Rundown-1

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VI. Adjust the Backlight brightness
into the maximum level on battery
power.

Battery Rundown-2

VII. Disable Turn off backlight if device

is not used for in Battery power.

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Battery Rundown-3

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VIII. Execute PowerDetect.exe under
WinCE

Battery Rundown-4

IX. Set the Sleep as 1hour

X. Set the Record as 2Mins

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Battery Rundown-5

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XI. After running 1 hour, the test will be
finished.
XII. Press the Power Button to turn on the
power.
XIII. Click ok to quit the program.

Battery Rundown-6

XIV. Test result is generated into the log

file as PowerCap(x).

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Battery Rundown-7

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XV. Tag the log file to check the capacity.

Caution: If the capacity is under 70%,

Please replace a new battery.

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6. Cosmetic Inspection Criteria

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6.1 Classes definition of inspective area

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z Class A area => The front side of main unit involve all buttons and LED lens except LCD.

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z Class C area => 4 sides and back views of main unit.
z Class D area => The socket of battery, inner side of battery cover.

Photo of inspection areas

Class A area Class C area Class D area

IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT
WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA
RESPECTIVELY.

Description
¾ D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot
¾ Inspecting distance: 30 ± 5cm / Mechanical inspection angle: 90 degrees /
¾ LCM inspection angle: 90 ± 15 degrees / Inspection time: 5 seconds per surface.
¾ Ambient illumination is to be 500-1100 Lux
¾ The inspection condition of Newton ring:
a. Inspection distance: 30cm / Inspection time: 5 sec
b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp)
c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp.

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d. The criteria of Newton ring's tinges and measure of area must follow up the worst-case sample.

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6.2 Display inspection

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Inspection Defects Accept Level Level
Single Red+ Green+ Blue ≦ 3, S > 5mm. Minor
Bright Dots 2 adjacent 0 Minor
3 or more adjacent 0 Minor
Electrical Single Total Number ≦ 2, S > 5mm. Minor
Dark Dots
Characteristic 2 adjacent 0 Minor
Defects Dark or Bright lines 0 Minor
All Allowable Dots Defects Total Number ≦ 3, S > 5mm. Minor
The black edge around display area must be
Shift and tilt of screen viewed area Minor
detected by front view.
0.03 < W ≦ 0.1 (mm)
Scratch Minor
L ≦ 5 (mm), N ≦ 2 (mm)
0.03 < W ≦ 0.1 (mm)
Foreign Scratch, Lint (linear foreign objects) 0.3 < L ≦ 3.0 (mm) Minor
Objects or Lint N≦5
on power off
status Spots 0.1 < D ≦ 0.3 (mm), N ≦ 4 Minor
Fish eye on film 0.1 < D ≦ 0.4 (mm), N ≦ 4 Minor
Breakage on film surface Not acceptable Minor
Total acceptable defect quantity ≦ 10 Minor

6.3 Main unit inspection

GAP & STEP INSPECTION

DESCRIPTION ACCEPT CRITERIA LEVEL

1 GAP BETWEEN ALL GENERIC ME PARTS < 0.4 MM MINOR

2 GAP BETWEEN TOUCH WINDOW AND A PARTS < 0.3 MM MINOR

3 STEP BETWEEN MATING PARTS < 0.3 MM MINOR

IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT
WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA
RESPECTIVELY.

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7. Generic Troubleshooting

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1．Main Unit Does Not Respond to Power Button

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(1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging.
(2) Check if battery installed well.
(3) Check the Power Button whether it’s damaged.
(4) Replace another battery pack.
(5) Try to start boot-loader mode [refer to section 4.1]. Re-flash ROM if boot loader mode is enabled.
(6) Check all connectors including LCD FPC to Main Board.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

2．Touch Panel Does Not Respond to Screen Tap

(1) Check the connection of LCM FPC cable whether is properly connected.
(2) Try to cold boot the unit then perform screen tap again.
(3) Try with another T/P with bezel assembly.
(4) Try with another Main Board.
(5) Replace T/P with bezel if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

3．Buttons Do Not Respond

(1) Try to cold boot the unit then tries again.

(2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not
responding.
(3) Try with another Main Board or Front Bezel.
(4) Replace Main Board or Front Bezel if necessary.
(5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

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4．Unusual Vertical / Horizontal lines or partial display

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(1) Check the connection of LCM FPC whether is properly connected.

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(2) Try to cold boot the unit then tries again.
(3) Try to re-flash the ROM code.
(4) Try with another T/P with bezel assembly.
(5) Try with another Main Board.
(6) Replace T/P with bezel assembly if necessary
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

5．Back Light Does Not Turn ON/OFF

(1) Check the connection of LCM FPC whether is properly connected.

(2) Try to re-flash the ROM code.
(3) Try with another T/P with bezel assembly.
(4) Try with another Main Board.
(5) Replace T/P with bezel assembly if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

6．PC Connection not possible

(1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is
installed.
(2) Check whether “Connection Settings” in the MS ActiveSync is properly set.
(3) Check whether it connects with other cables or cradle, customer’s cable might be damaged.
(4) Check the external appearance of the connector on the unit whether it is physically damaged.
(5) Try to re-flash the ROM code.
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

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7．Battery Pack does not start

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(1) Make sure the battery cover is closed properly.

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(2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition.

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(3) Check whether AC Adapter is functioning properly.
(4) Check whether the condition of Battery Charging status is correct.
(5) Check the appearance of Battery Pack if any abnormal..
(6) Try with another Battery Pack or Replace Battery Pack if necessary
(7) Try with another Main Board or Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

8．Battery discharges quickly even after fully charged

(1) Make sure the Battery Pack takes fully charge with AC Adapter.
(2) Check whether the condition of Battery Charging status is correct.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

9．Battery Pack does not recharge

(1) Make sure the Battery Pack takes fully charge with AC Adapter.
(2) Check whether the condition of Battery Charging status is correct. Charge should be done no more than 4
hours.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

10．No Sound from Speaker or Distorted sound

(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.

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(3) Try to re-flash the ROM code.

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(4) Clean up the speaker connection side on MB if there is any contamination.

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(5) Dismantle and Check whether the Speaker is properly installed (Orientation)

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(6) Replace Speaker if necessary.

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(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

11．No Recorded Sound or Distorted sound

(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
(3) Try to re-flash the ROM code.
(4) Replace Main Board if necessary.
(5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

12．Wireless connection (WLAN/BT) not functioning

(1) Make sure the wireless environment is OK before connecting to WLAN.

(2) Make sure the wireless connection setting has properly set.
(3) Make a life connection with Internet or another device.
(4) Try to re-flash the ROM code.
(5) Try with another main board if necessary.
(6) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

13．WIMAX connection not functioning

(1) Make sure the wireless environment is OK before connecting to WIMAX.

(2) Make sure the wireless connection setting has properly set.
(3) Make a life connection with Internet.
(4) Go into boot loader mode and check CA data checksum is correct or not.
(5) Try to re-flash the ROM code.
(6) Try with another main board if necessary.

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12．GPS not functioning

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(1) Make sure the GPS environment is outside of room before connecting to satellite.

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(2) Make sure the GPS connection setting has properly set in navigation map.
(3) Try to re-flash the ROM code.
(4) Try with another main board if necessary
(5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

12．Internal storage device not functioning

(1) Make sure the GPS environment is outside of room before connecting to satellite.
(2) Make sure the GPS connection setting has properly set in navigation map.
(3) Try to re-flash the ROM code.
(4) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

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8. Generic Labeling Plan

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Agency label

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The brand name is shown on Bezel.

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HTC P/N: 77H00672-00M

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Size: 66.53*44.36mm

HTC P/N Description

99HGC000-00 SKU,GENERIC,English-WWE,Quartz,w/o SIM Lock
99HGC000-01 FRU,Main Unit,GENERIC,English-WWE,w/o SIM Lock,QUARTZ

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Agency label_QUAR100

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The brand name is shown on Bezel.

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HTC P/N: 77H00672-01M

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Size: 66.53*44.36mm

HTC P/N Description

99HGC001-00 SKU,HTC,Russian,RUS,HTC/Yota co-brand,HTC T8290,Black,w/o SIM
Lock,QUARTZ-C9#EMEA
99HGC001-01 FRU,Main Unit,HTC,Russian,RUS,HTC/Yota co-brand,HTC
T8290,Black,w/o SIM Lock,QUARTZ-C9#EMEA

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Unit label location explanation

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Tamper evident label

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HTC P/N: 77H00460-01M

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Qty: 1

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Tamper evident label

Unit Water sensitive label

HTC P/N: 77H00668-00M
Qty: 2

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Battery label

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BATTERY_LI-ION,1500mAh, 3.7V

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HTC P/N: 35H00077-13M (DYNAPACK)

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9. Generic Spare Part List and Photos

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9.1 SPL for Repair

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P/N Description
35H00077-13M BATTERY_LI-ION,1500mAh,3.7V,SONY Li-Polymer cell 454261,DYNAPACK,DAK520159-02B800L,66.8*44.6*5.15mm,60/-20d
36H00632-00M Receiver,2403 266 00028 ,PHILIPS
36H00748-00M Vibrator,GE0406BRC3,JNTECH,Quartz
36H00755-00M Speaker,SBI171029P-BS02B8M,BLUECOM
51H00489-00M PCBA,2nd Camera Daughter board,QUARTZ
51H40474-00M PCBA-MAIN BOARD,GSM900,1800,1900/WimaxBC3,QUARTZ
54H00279-00M Camera Module,PREMIER,CMHT-3A403D,AF,TDK,LARGAN, 相互 ,Micron MI-3130,3.1Mpixel,Micron,19.2*8.9*6.3mm,Raphael
54H00281-00M Camera Module,FF,Largan,Largan,LITEON,07PC03,APCB,0.3Mpixel,5*5*2.55mm,Raphael
72H01059-00M Screw,POINT Mechanical,P,1.6*4.5,BZ+NYLOK
72H02643-00M Screw,M1.6L7,Ni+NYLOK,POINT SCREW,QUARTZ
72H02654-00M EMI Gasket,Camera,Holder,Quartz
72H02659-00M EMI Gasket,Camera,Quartz
72H02883-00M EMI Gasket,U-TEK,41*46*0.05mm,Quartz
72H02898-00M Conductive Fabric,LCM_2,Quartz
72H02911-00M Conductive Fabric,LCM,Quartz
74H01195-00M Stylus Pre-Assy,Quartz
74H01196-00M Housing Pre-Assy,Quartz
74H01198-00M Cover Pre-Assy,Battery,Quartz
74H01200-00M Bezel Pre-Assy,Quartz
76H02703-00M Tape,Touch_Window,Quartz
76H02704-00M Tape,Vibrator,Quartz
76H02803-00M Rubber,2nd_Camera,Quartz
76H03038-00M Kapton,Camera,Quartz
76H03291-00M Tape,Touch_Window_2,Quartz
76H03298-00M Mylar,Gap,Quartz
77H00460-01M Tamper-Evident Label,VOID wording,black background,3*3mm,MING JYE
77H00668-00M Water Sensitive Label,MING JYE,4*2.5mm,3M 5558,Diamond
77H00672-01M Regulation Label,W/PCT MJ04,66.53*44.36mm,HTC T8290,MING JYE,Quartz-EMEA
83H00054-00S Sub-Assy to 82H,HTC,Subcontractor BOM,部份代工代料 ,HTC logo w/camera hole,YFO LAM,YFO TW,Sharp LCM

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NOTE:

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THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND

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APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO APPLY

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THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR MORE
INFORMATION.
AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.

FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO THE
REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO IT.

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74H01198-00M 35H00077-13M

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Part no Part no

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Description Cover Battery Description Battery

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Q'ty 1 Q'ty 1
Refurbishment YES Refurbishment NO
Repair Code C112 Repair Code B101
Return to HTC NO Return to HTC YES

Part no 74H01196-00M Part no 54H00279-00M

Description Housing Description Main Camera

Q'ty 1 Q'ty 1
Refurbishment YES Refurbishment NO
Repair Code C102 Repair Code G117
Return to HTC NO Return to HTC NO

Part no 51H40474-00M Part no 36H00632-00M

Description Main board Description Receiver

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment NO
Repair Code M001 Repair Code G103.1
Return to HTC YES Return to HTC NO

Part no 54H00281-00M Part no 51H00489-00M

Camera Module, 2nd Camera Daughter

Description Description
0.3Mpixel board

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment NO
Repair Code G117 Repair Code G117
Return to HTC NO Return to HTC NO

Part no 36H00755-00M Part no 74H01200-00M

Description Speaker Description LCM Bezel

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment YES
Repair Code G103 Repair Code C101.5
Return to HTC NO Return to HTC NO

Part no 83H00054-00S Part no 74H01195-00M

Description LCM with T/P Description Stylus

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment NO
Repair Code L101 Repair Code G102
Return to HTC YES Return to HTC NO

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Part no 72H01059-00M Part no 72H02643-00M

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Screw,POINT

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Description Description Screw,M1.6L7
Mechanical,P,1.6*4.5

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Q'ty 4 Q'ty 1

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Refurbishment NO Refurbishment NO
Repair Code N/A Repair Code N/A
Return to HTC NO Return to HTC NO

Part no 72H02883-00M Part no 77H00672-01M

EMI Gasket,U-
Description Description Regulation Label
TEK,41*46*0.05mm

Q'ty 1 Q'ty 1
Refurbishment Yes Refurbishment Yes
Repair Code N/A Repair Code N/A
Return to HTC NO Return to HTC NO

Part no 36H00748-00M Part no 76H02704-00M

Description Vibrator Description Tape,Vibrator

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment NO
Repair Code G105 Repair Code NO
Return to HTC NO Return to HTC NO

Part no 76H02703-00M Part no 72H02659-00M

Description Tape,Touch_Window Description EMI Gasket,Camera

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment NO
Repair Code NO Repair Code NO
Return to HTC NO Return to HTC NO

Part no 77H00460-01M Part no 72H02911-00M

Tamper-Evident
Description Description Conductive Fabric,LCM
Label,VOID wording

Q'ty 1 Q'ty 2
Refurbishment Yes Refurbishment NO
Repair Code NO Repair Code NO
Return to HTC NO Return to HTC NO

Part no 76H03291-00M Part no 72H02898-00M

Conductive
Description Tape,Touch_Window_2 Description
Fabric,LCM_2

Q'ty 1 Q'ty 1
Refurbishment NO Refurbishment NO
Repair Code NO Repair Code NO
Return to HTC NO Return to HTC NO

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Part no 76H03298-00M Part no 77H00668-00M

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Description Mylar,Gap Description Water Sensitive Label

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Q'ty 2 Q'ty 1

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Refurbishment NO Refurbishment Yes
Repair Code NO Repair Code NO
Return to HTC NO Return to HTC NO

Part no 77H00668-00M Part no 76H03038-00M

Description Water Sensitive Label Description Kapton,Camera

Q'ty 1 Q'ty 1
Refurbishment Yes Refurbishment NO
Repair Code NO Repair Code NO
Return to HTC NO Return to HTC NO

Part no 72H02654-00M Part no 76H02803-00M

EMI
Description Description Rubber,2nd_Camera
Gasket,Camera,Holder

Q'ty 3 Q'ty 2
Refurbishment NO Refurbishment NO
Repair Code NO Repair Code NO
Return to HTC NO Return to HTC NO

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9.2 Board Level 2.5 Repairs

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„ Basic Repair Instructions for Component Replacement:

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Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.

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Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged

Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A. Checking the polarity of CON8, and the position can't be shifted.
B. Checking the polarity of SW8、SW7, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
E. When you solder and repair that the soldering iron, temperature must be setup 415℃. (The
temperature range is 415℃±5℃), and the solder wire's diameter is 0.4/0.5/0.6mm (SAC 305 (1.1%)
F. Please be noticed to follow below steps for main board repair which is equipped with Golden
Capacitor:
1. When replacing level 2.5 components located around the golden capacitor:
I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20
seconds (including the time of removing and soldering)
III. The temperature of the soldering iron must be under 350°c
IV. When apply the solder tip to the part / component, the heating time must be under 5
seconds
V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden capacitor must be removed before perform pre-heating,
heating, soldering and de-soldering process, and then it must be replaced with a new one
(please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golden capacitor must be replaced with
a new one and must follow below soldering criteria: The temperature of the soldering iron must
be under 350°c When apply the solder tip to the part / component, the heating time must be
under 5 seconds The solder tip must not have a contact with the body of golden capacitor

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51H40474-XXM PCBA-MAIN BOARD

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Location P/N Description Remark

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MAM12 75H00706-00M Connector SIM Card,9P,1.27Pitch,SPPN08-D0-1000,PROCONN Side A

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MAM13 75H00760-10M Connector SD Card,11P,1.1pitch,502702-0891,MOLEX,0.5A,10V Side A
PAC36 16H00012-01M Gold Cap,0.02F,3.3V,XH311HG IV07E,SEIKO,-78/89% Side A
MIM1 / MIM2 / Side A
MIM3
36H00515-00M Switch,LS12K2-T,CITIZEN,3.85*2.9*1.55mm
PAF1 36H00300-00M Fuse,046702.5,2.5A/32V,LITTLEFUSE,Apache Side A
AAU1 36H01865-00M Microphone,KNOWLES,SPM0204LE5-QB,4.72*3.76*1.25mm Side A
MAM3 75H00766-00M Connector I/O,11P,0.45Pitch,302-11101-24,ACT,1A,30V Side B
PAM2 75H00529-00P Connector Battery,6P,2.5mm,2A,12V,BTR1S-6K2000,ACON Side B
MAM11 36H00410-00M Switch,SKRKAEE010,ALPS Side B

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SIDE A PHOTO AND COMPONENT LOCATION

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MIM1 MIM2

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MAM12

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MAM13 MIM3

PAF1

Side A

AAU1

PAC36

SIDE B PHOTO AND COMPONENT LOCATION

MAM3

PAM2
Side B

MAM11
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9.3 FRU M/B addition parts location

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72H02654-00M

76H03038-00M

72H02654-00M
76H02803-00M

77H00688-00M

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10. RF Antenna Specification

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Quartz WiMAX Antenna Test Specification

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Item Test Name Channel Cell Power level Note
Receiver Test Conducted level:20+/-0.75dBm
3 Receiver Sensitivity 0
4 Receiver Sensitivity 368 ≦ -85dBm RX frame:1000
5 Receiver Sensitivity 736
Transmitter Test Conducted level:20+/-0.75dBm
6 TX Power 0
7 TX Power 368 EIRP≧14dBm
8 TX Power 736

Quartz GSM Antenna Test Specification

1st Downlink
Item Test Name TX Level TCH note
cell power
1 Wait_Signal 0 600 -65
2 Power_Class 0 600 -65
PCS 1900 Receiver Test
3 Fast Bit Error Rate 0 512 -104
4 Fast Bit Error Rate 0 661 -104 ≦ 2%
5 Fast Bit Error Rate 0 810 -104
PCS 1900 Transmitter Test
6 TX Power 0 512 -65
7 TX Power 0 661 -65 ≧ 26 dbm
8 TX Power 0 810 -65
EGSM 900 Receiver Test (For EU SKU)
9 Fast Bit Error Rate 5 975 -104
10 Fast Bit Error Rate 5 37 -104 ≦ 2%
11 Fast Bit Error Rate 5 124 -104

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DCS 1800 Receiver Test

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21 Fast Bit Error Rate 0 512 -104

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22 Fast Bit Error Rate 0 698 -104 ≦ 2 %

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23 Fast Bit Error Rate 0 885 -104

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DCS 1800 Transmitter Test
24 TX Power 0 512 -65
25 TX Power 0 698 -65 ≧ 26 dbm
26 TX Power 0 885 -65

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11. Appendix

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11.1 LCM and LCM bezel replacement

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When you just want to replace a new LCM or LCM bezel, please take the steps as below.

Use flat plastic stick to remove the rest of glue on

the LCM bezel and make sure all glue is cleaned
completely.
Be carefully not to scrap LCM bezel.

Use flat plastic stick to remove the rest of glue on

the LCM and make sure all glue is cleaned
completely.
Be carefully not to scrap LCM.

Swap the three conductive fabrics if defective.

72H02911-00M * 2
72H02898-00M * 1

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After clean the glue on the LCM bezel, stick one

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touch window tape on the bezel as shown the
photo.

76H02703-00M

Use plastic stick to press the touch window tap to

make sure the tap is well pasted on the bezel.

Stick one 2nd camera tape on the bezel as shown

the photo and make sure the tap is well pasted on
the bezel.

76H03291-00M

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Lightly remove the protector of 2nd camera tape.

Lightly remove the protector of touch window tape.

Stick two mylar gap at both sides of bezel.

P/N: 76H03298-00M * 2

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Assemble LCM with LCM bezel.

After assembling LCM and LCM bezel, remove the

two mylars.

Use your finger to press around LCM to make sure

the LCM is well combined the bezel.

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11.2 2nd camera and daughter board assembly

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Prepare one 2nd camera.

Prepare one daughter board.

Use plastic tweezers to place 2nd camera into

daughter board and then make sure the 2nd
camera is well assembled.

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