W24257A 32K 8 HIGH SPEED CMOS STATIC RAM

GENERAL DESCRIPTION
The W24257A is a high speed, low power CMOS static RAM organized as 32768 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.

FEATURES

High speed access time: 10/12/15/20 nS (max.) Low power consumption: Active: 400 mW (typ.) Single +5V power supply Fully static operation

All inputs and outputs directly TTL compatible Three-state outputs Available packages: 28-pin 300 mil SOJ, 330 mil SOP, skinny DIP and standard type one TSOP (8 mm 13.4 mm)

PIN CONFIGURATIONS

BLOCK DIAGRAM
VDD VSS

A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 V SS

1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-pin DIP

28 27 26 25 24 23 22 21 20 19 18 17 16 15

VDD WE A13 A8 A9 A11 OE A10 CS I/O8 I/O7 I/O6 I/O5 I/O4

A0 . . A14

DECODER

CORE ARRAY

CS OE WE CONTROL DATA I/O I/O1 . . I/O8

PIN DESCRIPTION
OE A11 A9 A8 A13 WE V DD A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 V SS I/O3 I/O2 I/O1 A0 A1 A2

28-pin TSOP

SYMBOL A0A14 I/O1I/O8 CS WE OE VDD VSS

DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground

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Publication Release Date: May 1997 Revision A14

W24257A
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.

TRUTH TABLE
CS H L L L OE X H L X WE X H H L MODE Not Selected Output Disable Read Write I/O1I/O8 High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 IDD IDD IDD

OPERATING CHARACTERISTICS
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)

PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current

SYM. VIL VIH ILI ILO VOL VOH IDD

TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD, CS = VIH or OE = VIH or WE = VIL IOL = +8.0 mA IOH = -4.0 mA 10 CS = VIL, I/O = 0 mA Cycle = MIN Duty = 100% 12 15 20

MIN. -0.5 +2.2 -10 -10 2.4 -

TYP. -

MAX. +0.8 VDD +0.5 +10 +10 0.4 170 160 150 140 30 10

UNIT V V A A V V mA mA mA mA mA mA

Standby Power Supply Current

ISB ISB1

CS = VIH Cycle = MIN, Duty = 100% CS VDD -0.2V

Note: Typical characteristics are at VDD = 5V, TA = 25 C.

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W24257A
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)

PARAMETER Input Capacitance Input/Output Capacitance

SYM. CIN CI/O

CONDITIONS VIN = 0V VOUT = 0V

MAX. 8 10

UNIT pF pF

Note: These parameters are sampled but not 100% tested.

THERMAL RESISTANCE
PARAMETER Junction to Case Thermal Resistance Junction to Ambient Thermal Resistance SYM . CONDITIONS A. F. R. = 1m/sec, TA = 25 C A. F. R. = 1m/sec, TA = 25 C MAX. 20 60 UNIT C/W C/W

JC JA

Note: These parameters are only applied to "TSOP" and "SOJ" package types.

AC TEST CONDITIONS
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS

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Publication Release Date: May 1997 Revision A14

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AC TEST LOADS AND WAVEFORM
R1 480 ohm R1 480 ohm 5V OUTPUT 30 pF Including Jig and Scope R2 255 ohm 5V OUTPUT 5 pF Including Jig and Scope R2 255 ohm

(For TCLZ , TOLZ , TCHZ, TOHZ , TWHZ , TOW )

3.0V

90% 10% 5 nS

90% 10% 5 nS

0V

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W24257A
AC CHARACTERISTICS
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)

Read Cycle
PARAMETER SYM. W24257A-10 MIN. Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change TRC TAA TACS TAOE TCLZ TOLZ TCHZ TOHZ TOH 10 3 0 3 MAX. 10 10 5 5 5 W24257A-12 MIN. 12 3 0 3 MAX. 12 12 6 6 6 W24257A-15 MIN. 15 3 0 3 MAX. 15 15 7 7 7 W24257A-20 MIN. 20 3 0 3 MAX. 20 20 10 10 10 nS nS nS nS nS nS nS nS nS UNIT

These parameters are sampled but not 100% tested.

Write Cycle
PARAMETER SYM. W24257A-10 MIN. Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write CS , WE TWC TCW TAW TAS TWP TWR TDW TDH TWHZ TOHZ TOW 10 9 9 0 9 0 6 0 0 MAX. 6 6 W24257A-12 MIN. 12 10 10 0 10 0 7 0 0 MAX. 7 7 W24257A-15 MIN. 15 13 13 0 10 0 9 0 0 MAX. 8 8 W24257A-20 MIN. 20 17 17 0 12 0 10 0 0 MAX. 10 10 nS nS nS nS nS nS nS nS nS nS nS UNIT

These parameters are sampled but not 100% tested.

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Publication Release Date: May 1997 Revision A14

W24257A
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TOH DOUT TAA TOH

Read Cycle 2
(Chip Select Controlled)

CS TACS DOUT TCLZ TCHZ

Read Cycle 3
(Output Enable Controlled)

T RC Address T AA OE T AOE T OLZ CS T ACS DOUT TCLZ T CHZ T OHZ T OH

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W24257A
Timing Waveforms, continued

Write Cycle 1
(OE Clock)

TWC Address T WR OE

TCW CS T AW WE TAS TOHZ D OUT T DW D IN TDH (1, 4) TWP

Write Cycle 2
(OE = VIL Fixed)

T WC Address TCW CS TAW WE TAS T WP TWHZ (1, 4) TOH (2) TOW (3) TWR

DOUT

TDW DIN

TDH

Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

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Publication Release Date: May 1997 Revision A14

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ORDERING INFORMATION
PART NO. ACCESS TIME (nS) 10 12 15 20 10 12 15 20 10 12 15 20 10 12 15 20 OPERATING CURRENT MAX. (mA) 170 160 150 140 170 160 150 140 170 160 150 140 170 160 150 140 STANDBY CURRENT MAX. (mA) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 PACKAGE

W24257AK-10 W24257AK-12 W24257AK-15 W24257AK-20 W24257AJ-10 W24257AJ-12 W24257AJ-15 W24257AJ-20 W24257AS-10 W24257AS-12 W24257AS-15 W24257AS-20 W24257AQ-10 W24257AQ-12 W24257AQ-15 W24257AQ-20
Notes:

300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP 300 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil SOJ 330 mil SOP 330 mil SOP 330 mil SOP 330 mil SOP Standard type one TSOP Standard type one TSOP Standard type one TSOP Standard type one TSOP

1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.

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PACKAGE DIMENSIONS
28-pin P-DIP Skinny

Symbol

Dimension in Inches

Dimension in mm

Min. Nom. Max.

0.175 0.010 0.125 0.016 0.058 0.008 0.130 0.018 0.060 0.010 1.388 0.300 0.283 0.090 0.120 0 0.330 0.350 0.310 0.288 0.100 0.130 0.135 0.022 0.064 0.014 1.400 0.320 0.293 0.110 0.140 15 0.370 0.055

Min. Nom. Max.

4.45 0.25 3.18 0.41 1.47 0.20 3.30 0.46 1.52 0.25 35.26 7.62 7.19 2.29 3.05 0 8.38 8.89 7.87 7.32 2.54 3.30 3.43 0.56 1.63 0.36 35.56 8.13 7.44 2.79 3.56 15 9.40 1.40

D
28 15

E1

14

A A1 A2 B B1 c D E E1 e1 L
a

eA S Notes:
S A A2 L B B1 e1 E

A1

Base Plane

Mounting Plane
a eA

1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec.

28-pin Small Outline J Band

Symbol

Dimension in Inches

Dimension in mm

Min. Nom. Max.

0.140 0.027 0.095 0.026 0.016 0.008 0.100 0.028 0.018 0.010 0.710 0.295 0.044 0.245 0.327 0.077 0.300 0.050 0.265 0.337 0.087 0.105 0.032 0.022 0.014 0.730 0.305 0.056 0.285 0.347 0.097 0.045 0.004 0 10

Min. Nom. Max.

3.56 0.69 2.41 0.66 0.41 0.20 2.54 0.71 0.46 0.25 18.03 7.49 1.12 6.22 8.31 1.96 7.62 1.27 6.73 8.56 2.21 2.67 0.81 0.56 0.36 18.54 7.75 1.42 7.24 8.81 2.46 1.14 0.10 0 10

28

15

HE

14

D c A L c e A1 y e1

A A1 A2 b1 b c D E e e1 HE L S y
Notes:

A2

s Seating Plane

b b1

1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec.

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Package Dimensions, continued

28-pin SO Wide Body

Symbol

Dimension in Inches

Dimension in mm

Min. Nom. Max.

0.112 0.004 0.093 0.014 0.008 0.098 0.016 0.010 0.713 0.326 0.044 0.453 0.028 0.059 0.331 0.050 0.465 0.036 0.067 0.103 0.020 0.014 0.733 0.336 0.056 0.477 0.044 0.075 0.047 0.004 0 10

Min. Nom. Max.

2.85 0.10 2.36 0.36 0.20 2.49 0.41 0.25 18.11 8.28 1.12 11.51 0.71 1.50 8.41 1.27 11.81 0.91 1.70 2.62 0.51 0.36 18.62 8.53 1.42 12.12 1.12 1.91 1.19 0.10 0 10

28

15

e1

HE

Detail F
1 b 14

A A1 A2 b c D E e HE L LE S y Notes:

e1 c
A A
2

LE

See Detail F Seating Plane

1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined .at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec.

28-pin Standard Type One TSOP

HD
Symbol

Dimension in Inches Dimension in mm Min. Nom. Max.

0.047 0.002 0.035 0.007 0.004 0.461 0.311 0.520 0.040 0.008 0.006 0.465 0.315 0.528 0.022 0.020 0.024 0.010 0.000 0 3 0.004 5 0.00 0 3 0.028 0.50 0.006 0.041 0.011 0.008 0.469 0.319 0.536 0.05 0.95 0.17 0.10 11.70 7.90 13.20 1.00 0.20 0.15 11.80 8.00 13.40 0.55 0.60 0.25 0.10 5 0.70

D c A A1 A2 b c D E HD e L L1 Y

Min. Nom. Max.

1.20 0.15 1.05 0.27 0.21 11.90 8.10 13.60

e E

L L1

A1 A2 A

Note: Controlling dimension: Millimeters

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Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064

Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668

Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.

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Publication Release Date: May 1997 Revision A14