Optiplex 990 Customer Brochure

DELL OPTIPLEX 990
TM TM
TECHNICAL GUIDEBOOK
INSIDE THE OPTIPLEX 990
TABLE OF CONTENTS
OVERVIEW Mini Tower Computer (MT) View Desktop Computer (DT) View Small Form Factor Computer (SFF) View Ultra Small Form Factor Computer (USFF) View MARKETING SYSTEM CONFIGURATIONS Operating System, Chipset Processor Memory Drives and Removable Storage, System Expansion Slots Graphics/Video Controller External Ports/Connectors CommunicationsNetwork Adapter (NIC), Wireless Audio and Speakers, Keyboard and Mouse Security, Software, Environmental, All-in-One Stands & Mounts, Service and Support DETAILED ENGINEERING SPECIFICATIONS System Dimensions (Physical) System Expansion Slots System Level Environmental and Operating Conditions Power Audio Communications Graphics/Video Controller Hard Drives Optical Drive Media Card Reader BIOS Defaults Chassis Enclosure and Ventilation Requirements Environmental Attributes Acoustic Noise Emission Information 19 19 20 21-22 23 23-27 28-30 31-39 40-42 43 44 45 46 47-50 11 12 13 14-15 16 16 17 17 18 3-4 5-6 7-8 9-10
DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5
MINI TOWER COMPUTER (M T) VI EW
FRONT VIEW 1 2 3
BACK VIEW 6 7 8 9 Optical Drive (optional) Optical Drive Eject Button USB 2.0 Connectors (4) 12 Power Connectors 16 Padlock Ring 10 Power Supply Diagnostic Light 11 Power Supply Diagnostic Button 14 15 Expansion Card Slots(4) Security Cable Slot
Power Button, Power Light

Optical Drive Bay (optional)
Headphone Connector
4 Microphone Connector 5
Drive Activity Light

13 Back Panel Connectors
Diagnostic Lights (4)
BACK PANEL CONNECTORS 1 2 3 4 5 6 Mouse Connector Link Integrity Light Network Connector Network Activity Light Serial Connector Line-out Connector 7 8 9 Keyboard Connector USB Connectors (6) DisplayPort Connector
10 VGA Connector 11 Line-in/Microphone Connector
MT System Board Components

Number 1 2 3 4 5 6 7 8 9 10 11 12 Name Internal Speaker Connector (INT_SPKR) Front IO Connector (FRONTPANEL) Thermal Sensor Connector(THRM_2) SATA 0 Connector(SATA0) SATA 1 Connector(SATA1) SATA 2 Connector(SATA2) SATA 3 Connector(SATA3) Internal USB Connector (INT_USB) Buzzer (BEEP) LPC Debug Connector (LPC_DEBUG) PCI-e 16x Connector(SLOT1) PCI-e 1x Connector(SLOT2) 4 Number 13 14 15 16 17 18 19 20 21 22 23 Name PCI Connector(SLOT3) PCI-e 4x Connector(SLOT4) Intrusion Switch Connector (INTRUDER) System Fan Connector (FAN_HDD) P2 Power Connector (12V_PWRCONN) Processor Connector (N/A) CPU fan Connector (FAN_CPU) Memory Connectors(DIMM1, DIMM2, DIMM3, DIMM4) Power Switch Connector (PWR_SW) Battery Connector (BATTERY) P1 Power Connector (POWER)
D ESK TOP COMP UT ER (D T) VIEW
FRONT VIEW 1 2 3 4 Optical Drive Optical Drive Eject Button 5 6 7 8
BACK VIEW
Microphone Connector Headphone Connector Drive Activity Light Diagnostic Lights (4)
9 Padlock Ring 10 Security Cable Slot 11 Power Connectors 12 Back Panel Connectors
13 14 15
Expansion Card Slots(4) Power Supply Diagnostic Light Power Supply Diagnostic Button

USB Connectors (4)
BACK PANEL CONNECTORS 1 2 3 4 5 6 Mouse Connector Link Integrity Light Network Connector Network Activity Light Serial Connector Line-out Connector 7 8 9 Keyboard Connector USB Connectors (6) DisplayPort Connector
10 VGA Connector 11 Line-in/Microphone Connector
DT System Board Components

Number 1 2 3 4 5 6 7 8 9 10 11 12 Name Internal Speaker Connector (INT_SPKR) Front IO Connector (FRONTPANEL) Thermal Sensor Connector(THRM_2) SATA 0 Connector(SATA0) SATA 1 Connector(SATA1) SATA 2 Connector(SATA2) Internal USB Connector (INT_USB) PCI-e 16x Connector(SLOT1) PCI-e 4x Connector(SLOT4) Buzzer (BEEP) LPC Debug Connector (LPC_DEBUG) PCI Connector(SLOT3) 6 Number 13 14 15 16 17 18 19 20 21 22 23 Name PCI-e 1x Connector(SLOT2) Intrusion Switch Connector (INTRUDER) Thermal Sensor Connector(THRM_1) System Fan Connector (FAN_HDD) P2 Power Connector (12V_PWRCONN) Processor Connector (N/A) CPU Fan Connector (FAN_CPU) Memory Connectors(DIMM1, DIMM2, DIMM3, DIMM4) Power Switch Connector (PWR_SW) Battery Connector (BATTERY) P1 Power Connector (POWER)
SM ALL FORM F ACTOR COMP UTER (SF F ) VIEW
FRONT VIEW 1 2 3 Optical Drive Optical Drive Eject Button 5 6 7 8
BACK VIEW
Microphone Connector Headphone Connector Diagnostic Lights (4) Drive Activity Light
9 Padlock Ring 10 Security Cable Slot 11 Power Connectors 12 Power Supply Diagnostic Button
13 14 15
Power Supply Diagnostic Light Back Panel Connectors Expansion Card Slots(2)
4 USB 2.0 Connectors (4)
BACK PANEL CONNECTORS 1 2 3 4 5 6 Mouse Connector Serial Connector Link Integrity Light Network Connector Network Activity Light Line-out Connector 7 8 9 Keyboard Connector DisplayPort Connector VGA Connector
10 USB Connectors (6) 11 Line-in/Microphone Connector
SFF System Board Components

Number 1 2 3 4 5 6 7 8 9 10 11 Name P1 power Connector (POWER) System fan Connector (FAN_HDD) Internal Speaker Connector (INT_SPKR) Buzzer (BEEP) PCI-e 4x Connector(SLOT2) PCI-e 16x Connector(SLOT1) SATA 2 Connector(SATA2) SATA 1 Connector(SATA1) SATA 0 Connector(SATA0) Front IO Connector (FRONTPANEL) Intrusion Switch Connector (INTRUDER) 8 Number 12 13 14 15 16 17 18 19 20 21 Name LPC debug Connector (LPC_DEBUG) Battery Connector (BATTERY) P2 Power Connector (12V_PWRCONN) Processor Connector (N/A) CPU Fan Connector (FAN_CPU) Power Switch Connector (PWR_SW) Memory Connector(DIMM3) Memory Connector(DIMM1) Memory Connector(DIMM4) Memory Connector(DIMM2)
UL TR A SMALL FO RM F ACTO R COMP UTER (U SFF ) VIEW
FRONT VIEW 1 Optical Drive 2 Optical Drive Eject Button 3 Power Button, Power
6
BACK VIEW
Headphone Connector Microphone Connector

USB Connectors (2)
10 Wi-Fi Antenna (optional) 11 Network Activity Light 12 Captive Thumbscrew
17 18 19 20 21 22 23
Line-in/ Microphone Connector DisplayPort Connector VGA Connector Serial Connector USB Connectors (5) Network Connector Link Integrity Light
7 8
Light
13 Padlock Ring 14 Security Cable Slot 15 Power Connector
4 Drive Activity Light

5
Diagnostic Lights (4)
16 Line-Out Connector
USFF System Board Components

Number Name Number Name
1 2 3 4 5 6 7 8 9
Front Panel Connector (FRONTPANEL) Memory Connector(DIMM_2) Memory Connector(DIMM_1) CPU Fan Connector (FAN_CPU) Internal Speaker Connector (INT_SPKR) Buzzer (BEEP) Front IO Connector (F_USB_AUDIO) System Fan Connector (FAN_HDD) Mini-PCI Socket (PCIE_MINICARD)
10 11 12 13 14 15 16 17 18
SATA 1 Connector(SATA_1) SATA 0 Connector(SATA_0) P1 Power Connector(POWER1) HDD-ODD Power Connector (HDD_ODD_POWER) Intrusion Switch Connector (INTRUDER) LPC Debug Connector (LPC_DEBUG) P2 Power Connector(12V_PWRCONN) Processor Connector (N/A) Battery Connector (BATTERY) 10
MARKETING SYSTEM CONFIGURATIONS

N O T E : O ff e r i n g s m a y v a r y b y c o u n t r y . F o r m o r e i n f o r m a t i o n r e g a r d i n g t h e c o n g u r a t i o n o f y o u r c o m p u t e r , c l i c k Start>Help and Support and select the option to view information about your computer.
OPERATING SYST EM
MT DT SFF USFF
Windows 7 operating system
Windows Vista operating system Windows XP operating system Other OS Media Support (optional)
Microsoft Windows 7 Home Basic (32 and 64 bit), Microsoft Windows 7 Home Basic SP1 (32 and 64 bit), Microsoft Windows 7 Home Premium (32 and 64 bit), Microsoft Windows 7 Professional (32 and 64 bit), Microsoft Windows 7 Ultimate (32 and 64 bit), Windows Vista Home Basic SP2 (32 bits), Windows Vista Business SP2 (32 and 64 bit), Windows Vista Ultimate SP2 (32 bit) Basic Driver support only via Dell.com
FreeDOS for (N-series),
Ubuntu Linux version 10.10 (China only) X X X X
C HI PS ET
MT Chipset Non-volatile memory on chipset BIOS Conguration SPI (Serial Peripheral Interface) TPM 1.2 Security Device (Trusted Platform Module)1 Non-TPM NIC EEPROM 64Mbit (8MB) &16Mbit(2MB) located at SPI_FLASH on chipset 18KB located at TPM1.2 on chipset Available in select countries LOM conguration contained within SPI_FLASH no dedicated LOM EEPROM DT SFF USFF
Intel Q67 Express Chipset
11
PROCES SOR
NOTE: Global Standard Products (GSP) are a subset of Dells relationship products that are managed for availability and synchronized transitions on a worldwide basis. They ensure the same platform is available for purchase globally. This allows customers to reduce the number of congurations managed on a worldwide basis, thereby reducing their costs. They also enable companies to implement global IT standards by locking in specic product congurations worldwide. The following GSP processors identied below will be made available to Dell customers. NOTE: Processor numbers are not a measure of performance. Processor availability subject to change and may vary by region/ country.
MT
Intel Quad Core Processors Intel Core i7 2600 / 3.40GHz, 8M, VT-x, VT-d, TXT (vPro), 95W Intel Core i7 2600S / 2.80GHz, 8M, VT-x, VT-d, TXT (vPro), 65W Intel Core i5 2500 / 3.30GHz, 6M, VT-x, VT-d, TXT (vPro), 95W Intel Core i5 2500S / 2.70GHz, 6M, VT-x, VT-d, TXT (vPro), 65W Intel Core i5 2400 / 3.10GHz, 6M, VT-x, VT-d, TXT (vPro), 95W Intel Core i5 2400S / 2.50GHz, 6M, VT-x, VT-d, TXT (vPro), 65W Intel Dual Core Processors Intel Core i3 2120 / 3.30GHz, 3M, VT-x, 65W Intel Core i3 2100 / 3.10GHz, 3M, VT-x, 65W Intel Pentium G850 / 3.10GHz, 3M, VT-x, 65W Intel Pentium G840 / 3.10GHz, 3M, VT-x, 65W Intel Pentium G620 / 3.10GHz, 3M, VT-x, 65W X X X X X X-GSP
DT
SFF
USFF
X-GSP
X-GSP X-GSP
X-GSP
X-GSP
X-GSP X-GSP
X-GSP
X-GSP
X-GSP X-GSP
X X X X X
X X X X X
X X X X X
12
M EMO RY
NOTE: Memory modules should be installed in pairs of matched memory size, speed, and technology. If the memory modules are not installed in matched pairs, the computer will continue to operate, but with a slight reduction in performance. The entire 16GB memory range is available to 64-bit operating systems. MT Type: DDR3 Synch DRAM Non-ECC Memory DIMM Slots DIMM Capacities Minimum Memory Maximum System Memory Memory congurations 16GB1 DDR3, 1333MHz, (4 DIMM) 8GB1 DDR3, 1333MHz, (2 DIMM) 4GB1 DDR3, 1333MHz, (2 DIMM) 4GB1 DDR3, 1333MHz, (1 DIMM) 3GB DDR3, 1333MHz, (2 DIMM) 2GB DDR3, 1333MHz, (2 DIMM) 2GB DDR3, 1333MHz, (1 DIMM) 1GB DDR3, 1333MHz, (1 DIMM) X X X X X X X X X X X X X X X X X X X X X X X 4 Up to 4GB 1GB 16GB1 4 Up to 4GB 1GB 16GB1 DT 1333MHz 4 Up to 4GB 1GB 16GB1 2 Up to 4GB 1GB 8GB1 SFF USFF
13
1
The total amount of available memory will be less than 4GB. The amount less depends on the actual system configuration. To fully utilize 4GB or
more of memory requires a 64-bit enabled processor and 64-bit operating system.
DRIV ES AND R EM OVABL E ST ORAG E

MT Bays: 5.25-inch Optical Bay Supported (External) Optical Drives Supported (maximum) Hard Drive Bay Supported (Internal) Hard Drives Supported 3.5/2.5 (maximum) Interface: SATA 2.0 SATA 3.0 3.5 Hard Drives: 1TB1 SATA 7200 RPM HDD 500GB1 SATA 7200 RPM HDD 320GB SATA 7200 RPM HDD 250GB1 SATA 7200 RPM HDD
1
DT
SFF
USFF
2 2 2 2/2
1 1 1 1/2
1 1 (slim-line) 1 1/2
1 1 (slim-line) 1 0/1
2 2
1 2
1 2
0 2
X X X X
X X X X
X X X X
2.5 Hard Drives: (Hybrid drive includes 4GB NAND Flash for greater performance) 128GB1 SATA Solid State Drive 500GB SATA 7200 RPM Hybrid HDD 320GB1 SATA 7200 RPM Opal SED HDD 500GB SATA 7200 RPM HDD 250GB1 SATA 7200 RPM HDD
1 1
X X X X X
X X X X X
X X X X X
X X X X X
RAID 1 Data Protection: (includes two matching capacity/speed hard drives) 1TB1 SATA 7200 RPM HDD (3.5) 500GB1 SATA 7200 RPM HDD (3.5) 320GB1 SATA 7200 RPM HDD (3.5) 250GB1 SATA 7200 RPM HDD (3.5) 500GB1 SATA 7200 RPM Hybrid HDD (2.5) 500GB1 SATA 7200 RPM HDD (2.5) 250GB1 SATA 7200 RPM HDD (2.5) X X X X X X X X X X X X X
14
DRIV ES AND R EM OVABL E ST ORAG E

MT RAID 0 Performance: (includes two matching capacity/speed hard drives) 1TB1 SATA 7200 RPM HDD (3.5) 500GB SATA 7200 RPM HDD (3.5) 320GB1 SATA 7200 RPM HDD (3.5) 250GB SATA 7200 RPM HDD (3.5) 500GB1 SATA 7200 RPM Hybrid HDD (2.5) 500GB SATA 7200 RPM HDD (2.5) 250GB1 SATA 7200 RPM HDD (2.5) Optical Drive: (SFF/USFF require slim-line optical drive) Blu-ray Writer SATA 1.5Gbit/s DVD+/-RW2 SATA 1.5Gbit/s DVD-ROM3 SATA 1.5Gbit/s Media Card Reader: (requires slim line optical) Dell 19 in 1 Media Card Reader X X X X X X X X X X X X X X
1 1 1
DT
SFF
USFF
X X X X X X X X X X X X X
NOTE: Dell 19 in 1 Media Card Reader (MCR) is supported via a F5 to F3 bay converter on the MT and DT and may require a slim line optical drive depending on selectable conguration. MCR is not available on the SFF and USFF.
S YSTEM EXPANSI ON S LOTS

NOTE: See Detailed Engineering Specications for supported voltage, maximum wattage and card dimensions. NOTE: Add in card location and priority: PCI: 1394; PCIe x16: GFX, USB 3.0, Serial, Parallel/Serial, NIC, Wireless; PCIe x4: GFX, USB 3.0, Serial, Parallel/Serial, NIC, Wireless; PCIe x1: USB 3.0, Serial, Parallel/Serial, NIC, Wireless MT PCI Slot PCIe x16 Slot PCIe x16 (wired x4) Slot PCIe x1 Slot Half mini-PCIe connector Serial ATA (SATA) connectors 1 1 1 1 0 4 DT 1 1 1 1 0 3 SFF 0 1 1 0 0 3 USFF 0 0 0 0 1 2
1 2 3
For hard drives, GB means 1 billion bytes; actual capacity varies with preloaded material and operating environment and will be less. Discs burned with this drive may not be compatible with some existing drives and players; using DVD+R media provides maximum compatibility. DVD-ROM drives may have write-capable hardware that has been disabled via firmware modifications.
15
GRAPHICS/VI DEO CONTROLLER

NOTE: MT supports full height (FH) cards and DT and SFF supports low prole (LP) cards. MT Intel HD Graphics [with Celeron/Pentium class CPU-GPU combo] Intel HD Graphics 2000[with iCore Dual/Quad core class CPUGPU combo] Enhanced Graphic/Video Options 1GB AMD RADEON HD 6670 with DP, DVI and VGA 1GB AMD RADEON HD 6450 with DP and DVI 512MB AMD RADEON HD 6350 with dual DVI or dual VGA (adapters convert DMS-59 connector to dual DVI or dual VGA) Optional card Optional card Optional card DT SFF USFF
Integrated on CPU
E XTE RN AL PORTS /C ON NECT ORS

NOTE: MT supports full height (FH) cards and DT and SFF supports low prole (LP) cards. See chassis diagrams section for port/ connector locations MT USB 2.0 (1 internal on MT and DT) Serial Parallel/2nd Serial via optional PCIex1 card Parallel via optional PCIex1 card 2nd Serial via optional PCIex1 card Network Connector (RJ-45) PS/2 1394 Controller via optional PCI card USB 3.0 via optional PCIex1 card Video: VGA DisplayPort (1.1a) Audio: Line in for microphone Line in for microphone or stereo Line out for headphones or speakers 1 Front 1 Rear 1 Front, 1 Rear 1 Rear 1 Rear Optional FH card Optional FH card 2 Rear Optional LP card Optional LP card Optional FH card Optional LP card, available in Q3 2011 Optional LP card 1 Rear DT 4 Front, 6 Rear 1 Rear SFF USFF 2 Front, 5 Rear
16
C OMMUNIC ATI ONS - NET WORK ADAPTER (NIC)

NOTE: MT supports full height (FH) cards and DT and SFF supports low prole (LP) cards.
MT
Intel 82579LM Gigabit Ethernet LAN 10/100/1000 (Remote Wake Up, PXE support and Intel Active Management Technology support) Broadcom NetXtreme 10/100/1000 PCIe Gigabit Networking Card
1
DT
SFF
USFF
Integrated on system board Optional card
This term does not connote an actual operating speed of 1 Gb/sec. For high speed transmission, connection to a Gigabit Ethernet server and
network infrastructure is required.
C OMMUNIC ATI ONS WIRELESS

MT
Dell Wireless 1520 PCIe WLAN card (802.11n) Dell Wireless 1520 half mini-PCIe WLAN card (802.11n)
DT
Optional card
SFF
USFF
Optional
AUDIO AND S PEAKERS MT

Realtek ALC269Q High Denition Audio Codec Internal Dell Business Audio Speaker Dell AX210 2.0 Desktop Speakers Dell AX510/AX510PA Flat Panel Soundbar Speakers
DT
SFF
USFF
Integrated on system board Optional Optional Optional
K E YB O AR D AN D M O US E MT
Dell KB212 USB Entry Keyboard with optional palmrest Dell Multimedia Pro Keyboard Dell Smartcard Keyboard Dell MS111 USB Optical Mouse Dell Laser Mouse
DT
Optional Optional Optional Optional Optional
SFF
USFF
17
S ECURIT Y MT
Trusted Platform Module (TPM) 1.2 Chassis Intrusion Switch Dell Smartcard Keyboard Chassis lock slot and loop support Dell Data Protection | Hardware Encryption Engine
1
DT
Optional Optional Standard
SFF
USFF
Integrated on system board
Optional. Available in Q3 2011
TPM is not available in all countries. Depending on your country regulations, no-TPM system boards may be available.
S OF TW AR E MT
Dell Client Manager Dell Data Protection | Access (DDPA) Dell Data Protection | Encryption (DDPE)
DT
Standard
SFF
USFF
Available via Dell.com
Optional. Available in Q3 2011
E N V I R ON M ENT AL
NOTE: For more details on Dell Environmental features, please to go to Environmental Attributes section. See your specic region for availability.
MT
Sustainable packaging BFR/PVCfree limited congurations MultiPack packaging Energy Efficient Power Supply X
DT
X
SFF
X Select countries only
USFF
Optional, US only Optional Standard
AL L-IN-O N E ST AN DS AN D M OUNTS MT
Small Form Factor AIO Stand Ultra Small Form Factor AIO Stand Ultra Small Form Factor Wall Mount / Desk Mount
DT
SFF
Optional
USFF
Optional Optional
S ERVIC E AN D S UPPOR T
NOTE: For more details on Dell Service Plans please to go to: www.dell.com/service/service_plans
MT
3 Year Warranty1 Next Business Day On-site2 (3-3-3) ProSupport
1
DT
Standard Optional
SFF
USFF
For a copy of our guarantees or limited warranties, please write Dell USA L.P., Attn: Warranties, One Dell Way, Round Rock, TX 78682. For more information, visit www.dell.com/warranty.
Service may be provided by third-party. Technician will be dispatched if necessary following phone-based troubleshooting. Subject to parts availability, geographical restrictions and terms of service contract. Service timing dependent upon time of day call placed to Dell. U.S. only.
18
DETAILED ENGINEERING SPECIFICATIONS

S YSTEM DIM ENSI ONS (PH YSIC AL )
NOTE: System Weight and Shipping Weight is based on a typical conguration and may vary based on PC conguration. A typical conguration includes: integrated graphics, one hard drive, one optical drive.
MT
Chassis Volume (liters) Chassis Weight (pounds/kilograms) 26.27 19.55 / 8.87
DT
15.06 16.67 / 7.56
SFF
8.38 12.57 / 5.70
USFF
3.70 7.20 / 3.265
Chassis Dimensions: (HxWxD)

Height (inches/centimeters) Width (inches/centimeters) Depth (inches/centimeters) Shipping Weight (pounds/kilograms - includes packaging materials) 14.17 / 36 6.89 / 17.5 16.42 / 41.7 23.45 / 10.64 14.17 / 36 4.02 / 10.2 16.14 / 41 20.03 / 9.09 11.42 / 29 3.65 / 9.26 12.28/31.2 15.2 / 6.89 9.32 / 23.67 2.56 / 6.5 9.44 / 24 9.56/ 4.34
Packaging Parameters (HxWxD)

Height (inches/centimeters) Width (inches/centimeters) Depth (inches/centimeters) 21.31/54.13 18.75/47.63 14.09 / 35.79 21.31 / 54.13 18.75/47.63 10.84/27.53 19.25/48.90 15.81/40.16 10.19/25.88 19.13/48.59 14.38/36.53 9.63/24.46
S YSTEM EXPANSI ON S LOTS

MT
PCI Slot (Voltage supported 3.3V/5V/12V/-12V) Height (inches/centimeters) Length (inches/centimeters) Maximum Wattage PCIex16 Slot (BLUE) (Voltage supported 3.3V/12V) Height (inches/centimeters) Length (inches/centimeters) Maximum Wattage PCIex16 wired as x4 Slot (BLACK) (Voltage supported 3.3/12V) Height (inches/centimeters) Length (inches/centimeters) Maximum Wattage PCIe x1 Slot (Voltage supported 3.3V/12V) Height (inches/centimeters) Length (inches/centimeters) Maximum Wattage Mini PCIe x1 Slot 1 4.376 / 11.115 6.6 / 16.765 25W 1 4.376 / 11.115 6.6/ 16.765 75W 1 4.376 / 11.115 6.6 / 16.765 25W 1 4.376 / 11.115 4.5 / 11.44 10W
DT
1 2.731 /6.89 6.6/16.765 25W 1 2.731 /6.89 6.6 /16.765 35W 1 2.731 /6.89 6.6 /16.765 25W 1 2.731 / 6.89 4.5 / 11.44 10W
SFF
USFF
1 2.731 /6.89 6.6 /16.765 35W 1 2.731 /6.89 6.6/16.765 25W
* Card length can be longer than standard Half-Length Card but cannot be a Full-Length Card.
19
S YSTEM LEV EL ENVI RONMENT AL AN D OPER AT ING CON DITI ONS

MT Temperature Operating Non-Operating (Storage) Relative Humidity Maximum vibration Operating Non-Operating Maximum Shock Operating Non-Operating Maximum Altitude Operating Non-Operating 15.2 to 3048 m (50 to 10,000 ft) 15.2 to 10,668 m (50 to 35,000 ft) Bottom half-sine pulse with a change in velocity of 50.8 cm/sec (20 inches/sec) 27-G faired square wave with a velocity change of 508 cm/sec (200 inches/sec) 0.25 G at 3 to 200 Hz at 0.5 octave/min 0.5 G at 3 to 200 Hz at 1 octave/min 10 to 30 C (50 to 95 F) -40 to 60 C (-40 to 140 F) 20% to 80% (non-condensing) DT SFF USFF
20
POWER
NOTE: These form factors utilize a more efficient Active Power Factor Correction (APFC) power supply. Dell recommends only Universal Power Supplies (UPS) based on Sine Wave output for APFC PSUs, not an approximation of a Sine Wave, Square Wave, or quasi-Square Wave. If you have questions, please contact the manufacture to conrm the output type.
MT APFC Power Supply Wattage AC input Voltage Range AC input current (low ac range/high AC range) AC input Frequency AC holdup time (80% load) Average Efficiency (Energy Star 5.0 Compliant) Typical Efficiency (Active PFC) DC parameters +3.3v output +5.0v output 65% 10.0A 13A 10.0A 13A 265W 90 264Vac 5.0A / 2.5A 47HZ/63HZ 16MSEC EPA 265W High Efficiency 90 264Vac 5.0A / 2.5A 47HZ/63HZ 16MSEC 87 90 87% @ 20 50 100% load 65% 7.0 A 15A APFC 250W 90 264Vac 4.4A / 2.2A 47HZ/63HZ 16MSEC
DT EPA 250W High Efficiency 90 264Vac 4.4A / 2.2A 47HZ/63HZ 16MSEC 87 90 87% @ 20 50 100% load
SFF APFC EPA 240W High 240W Efficiency 90 90 264Vac 264Vac 4.0A / 2.0A 47HZ/63HZ 16MSEC 4.0A / 2.0A 47HZ/63HZ 16MSEC 87 90 87% @ 20 50 100% load 65%
USFF EPA 200W High Efficiency 90 264Vac 2.9A / 1.45A 47 63 Hz 16 ms 87 90 87% @ 20 50 100% load N/A
7.0 A 15A
3.5A 11A
3.5A 11A
N/A N/A +12VA 12.5 A &
+12.0v output
12VA/17A; 12VB/9A
12VA/17A; 12VB/9A
17.8A
17.8A
17A
17A
+5.0v auxiliary output -12.0v output Max total power Max combined +3.3v / +5.0v power Max combined 12.0v power (note: only if more than one 12v rail) BTUs/h (based on PSU max wattage) Power Supply Fan Compliance: 1watt requirement Blue Angel Compliant Climate Savers / 80Plus Compliant FEMP (CECP) Standby Power Compliant
4.0A 0.5A 265W 90W 240W 904 BTU 80*25mm Yes Yes No Yes
4.0A 0.5A 265W 90W 240W 904 BTU 80*25mm Yes Yes Yes Yes
4.0 0.5A 255W 90W N/A 853 BTU 80*20/25m m Yes Yes No Yes
4.0 0.5A 255W 90W N/A 853 BTU 80*20/25m m Yes Yes Yes Yes
4.0A 0.5A 235W 60W N/A 819 BTU 60*25mm Yes Yes No Yes
4.0A 0.5A 235W 60W N/A 819 BTU 60*25mm Yes Yes Yes Yes
+12VB - 6.0 A Note: +12VB Rated at 0.4A when in Standby Mode. N/A 0.1 A 200W N/A 200W 682 BTU N/A Yes Yes Yes Yes
21
POWER
NOTE: These form factors utilize a more efficient Active Power Factor Correction (APFC) power supply. Dell recommends only Universal Power Supplies (UPS) based on Sine Wave output for APFC PSUs, not an approximation of a Sine Wave, Square Wave, or quasi-Square Wave. If you have questions, please contact the manufacture to conrm the output type.
3.0v CMOS battery (Type and estimated battery life) Brand PANASONIC Type CR-2032L/ BE Voltage 3V Composition Lithium Life Continuous Discharge Under 15 k Load to 2.5V EndVoltage. 20 2 .1183Hrs. or Longer.1133Hrs.or Longer after 12 months. Continuous Discharge Under 15 k Load to 2.0V EndVoltage. 20 2 .1000Hrs. or Longer.970Hrs.or Longer after 12 months. 0 2 . 910Hrs. or Longer.890Hrs.or Longer after 12 months.
MITSUBISHI
CR2032
3V
Lithium
22
AUDIO
INTEGRATED REALTEK ALC269Q HIGH DEFINITION AUDIO High Denition Stereo support Number of channels Number of Bits / Audio resolution Sampling rate (recording/playback) Signal to Noise Ratio Analog Audio Dolby Digital THX Digital out (S/PDIF) Audio Jack Impedance Microphone Line-In Line-Out Headphone Internal Speaker Power Rating 40K ohm~60K ohm 40K ohm~60K ohm 100~150 ohm 1~4 ohm 2Watt (peak) / 1Watt (average) MT X DT X 2 16, 20, and 24-bit resolution Support 44.1K/48K/96K/192 kHz sample rates 98 dB DAC outputs, 90 dB for ADC inputs X X X X SFF X USFF X
C OMMUNIC ATI ONS - NET WORK ADAPTER (NIC)

INTEGRATED INTEL 82579 GIGABIT1 ETHERNET LAN 10/100/1000 External Connector Type Data Rates supported Controller Details Controller bus architecture Integrated memory Data transfer mode (example Bus-Master DMA) Power consumption (full operation per data rate connection speed) Power consumption (standby operation) IEEE standards compliance (example 802.1P) Hardware Certications (example FCC, B, GS mark) Boot ROM Support Network Transfer Mode (example Full Duplex, Half Duplex) Network Transfer Rate (example 10BASE-T (half-duplex) 10 Mbps 10BASE-T (full-duplex) 20 Mbps 100BASE-TX (half-duplex) 100 Mbps 100BASE-TX (full-duplex) 200 Mbps 1000BASE-T (full-duplex) 2000 Mbps
MT
DT RJ45
SFF
USFF
10/100/1000 Mbps PCIe-based interface for S0 state, SMBus for Sx low power state N/A N/A 711mW (Max.) 227mW (Max.) 802.3 N/A EEPROM (located in SPI)
10 Mb (full/half-duplex) 100 Mb (full/half-duplex) 1000 Mb (full-duplex)
23
C OMMUNIC ATI ONS - NET WORK ADAPTER (NIC) (CONT .)

INTEGRATED INTEL 82579 GIGABIT1 ETHERNET LAN 10/100/1000 (CONT.) Environmental Operating temperature Operating humidity Operating System Driver Support Manageability (examples WOL, PXE) Management Capabilities Alerting
1
MT
DT
SFF
USFF
0 C to 85 C (32 F to 185 F) 20% to 80% (non-condensing) Windows 7 32/64, Windows XP 32/64, Vista 32/64 WOL, PXE 2.1 Intel Standard Manageability, Intel Core 2 Duo/ Quad Processor with vPro Technology
C OMMUNIC ATI ONS INTEGRAT ED LAN

Broadcom NetXtreme 10/100/1000 PCIe Gigabit1 Networking Card Connector Type Data Rates supported Controller Details Controller bus architecture (example PCIe 1.0a x1) Integrated memory Data transfer mode (example Bus-Master DMA) Power consumption (full operation per data rate connection speed) Power consumption (standby operation) IEEE standards compliance (example 802.1P) Hardware Certications (example FCC, B, GS mark) Boot ROM Support Network Transfer Mode (example Full Duplex, Half Duplex) Network Transfer Rate (example 10BASE-T (half-duplex) 10 Mbps 10BASE-T (full-duplex) 20 Mbps 100BASE-TX (half-duplex) 100 Mbps 100BASE-TX (full-duplex) 200 Mbps 1000BASE-T (full-duplex) 2000 Mbps
1
MT
DT RJ45
SFF
USFF
10/100/1000 Mbps Half/Full duplex
PCIe c1.0a x1 64KBytes RX, 8KBytes TX Bus-Master DMA 2.84W (860mA @ +3.3V) Less than 300mW 802.3, 802.2, 802.3x, 802.1p FCC B, VCCI B, CE No
10BASE-T (full-duplex) 20 Mbps Max* 100BASE-TX (half-duplex) 100 Mbps Max* 100BASE-TX (full-duplex) 200 MbpsMax* 1000BASE-T (full-duplex) 2000 Mbps Max* * Depends on the system environment.
24
C OMMUNIC ATI ONS INTEGRAT ED LAN (C ONT .)

BROADCOM NETXTREME 10/100/1000 PCIE GIGABIT 1 NETWORKING CARD (CONT.) Environmental Operating temperature Operating humidity Operating System Driver Support Manageability (examples WOL, PXE) Management Capabilities Alerting (example ASF 2.0)
1
MT
DT
SFF
USFF
0 C to 55 C (32 F - 131 F) 5% ~ 85% (non-condensing) Windows 7, Windows XP, Windows Vista Ultimate, Windows Vista Business 32 bit/64 bit, Windows Vista Home Basic, Linux WOL, PXE2.1, ACPI None
25
C OMMUNIC ATI ONS WIRELESS
DELL WIRELESS 1520 PCIE WLAN CARD (MT, DT, SFF) OR HALF MINI-PCIE WLAN CARD (USFF) 802.11N External Connector Type
MT
DT
SFF
USFF
Custom WLAN Antenna Connector
Controller Details
Controller bus architecture WLAN standards supported 802.11b Data Rates supported 802.11a Data Rates supported 802.11g Data Rates supported 802.11n Data Rates supported Electrically compatible with the PCI Express Base Specication v1.1 (x1 lane) and PCIe v1.0a. 802.11a, 802.11b, 802.11g, 802.11n 11, 5.5, 2, 1 Mbps 54, 48, 36, 24, 18, 12, 9, 6 Mbps 54, 48, 36, 24, 18, 12, 9, 6 Mbps 300, 270, 243, 240, 180, 150, 144, 135, 130, 120, 117, 115.5, 90, 86.667, 72.2, 65, 60, 57.8, 45, 43.3, 30, 28.9, 21.7, 15, 14.4, 7.2 Mbps WEP 64-bit and 128-bit, TKIP, AES-CCMP 128-bit 0 to +70 C Max Operating Humidity 85 %
Encryption Operating temperature Operating humidity Operating System Driver Support
Windows 7 32/64, Windows XP 32/64, Vista 32/64
COMMUNICATION S USB 3.0 ADD-IN CARD

USB 3.0 PORT PCIE ADD-IN CARD Connector Type
MT
DT
SFF
USFF
PCI Express Gen. 2.0 X1
Controller Details
Controller bus architecture (example PCIe 1.0a x1) Chipset IO Ports Power Consumption Connector Full height USB3.0 add-in card Half height USB3.0 add-in card OS Support Optional Optional Win XP, Win Vista and Win 7 PCI Express one lane (x1) NEC PD720200 2 * USB3.0 port Under 30 mA USB 3.0 A Type
26
C OMMUNIC ATI ONS S ERI AL / PAR ALL EL PORT PC IE ADD-IN C AR D

NOTE: MT supports full height (FH) card.
SERIAL / PARALLEL PORT PCIE ADD-IN CARD Connector Type Data Rates supported Controller Details Controller bus architecture (example PCIe 1.0a x1)
MT
DT
SFF
USFF
RS-232 and IEEE1284 50bps ~115.2Kbps(Serial)&Maximum 1.8MBp(Parallel)
PCI Express one lane (x1) Microsoft Client XP/Vista/7 (X86/X64) Microsoft Server 2000/2003/2008 (X86/X64) Microsoft Embedded XP Embedded/POS Ready 2009/ Embedded System 2009 Linux Linux 2.4.x/2.6.x DOS DOS Optional
Driver Support
Full height Serial / Parallel add-in card Environment Operation Temperature Operation Humidity Storage Temperature
0 to 60C (32 to 140F) 5 to 95% RH -20 to 85C (-4 to 185F)
C OMMUNIC ATI ONS S ERI AL PO RT PCI E ADD-I N CAR D

NOTE: DT and SFF supports low prole (LP) card.
SERIAL PORT PCIE ADD-IN CARD Connector Type Data Rates supported Controller Details Controller bus architecture (example PCIe 1.0a x1)
MT
DT
SFF
RS-232
USFF
50bps ~115.2Kbps
PCI Express one lane (x1) Microsoft Client XP/Vista/7 (X86/X64) Microsoft Server 2000/2003/2008 (X86/X64) Microsoft Embedded XP Embedded/POS Ready 2009/ Embedded System 2009 Linux Linux 2.4.x/2.6.x DOS DOS Optional
Driver Support
Half height Serial add-in card Environment Operation Temperature Operation Humidity Storage Temperature
0 to 60C (32 to 140F) 5 to 95% RH -20 to 85C (-4 to 185F)
27
GRAPHICS/VI DEO CONTROLLER

Onboard Graphics. 1. Intel HD Graphics [with Celeron/Pentium class CPU-GPU combo] 2. Intel HD Graphics 2000 [with iCore Dual/Quad core class CPU-GPU combo]
MT
DT
SFF
USFF
Bus Type GPU core clock Frame Buffer Memory (onboard and shared) Size and Speed Overlay Planes Maximum Color Depth Maximum Vertical Refresh Rate Multiple Display Support Operating Systems Graphics/ Video API Support Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digital) External Connectors
Integrated Gen6 Core Intel HD Graphics /HD Graphics 2000 @ 850MHz Depends on available system memory (Up to 1.7GB with 4GB system Memory) Yes 32 bit 75 Hz Yes OpenGL 3.0/DirectX 10.1 Up to 2560x1600 @ 60Hz (DP) Up to 1920x1200 @ 60Hz (DVI & HDMI) Up to 2048x1536 @ 75Hz (VGA only) VGA, DisplayPort
DisplayPort
Bus Type Maximum supported resolution Maximum power consumption External connectors DisplayPort Audio Support DDPC Up to 2560x1600 @ 60Hz N/A DisplayPort Yes
Up to 1.7 GB of system memory may be allocated to support integrated graphics, depending on operating system, system memory size and other factors. 2 DVI and VGA can be used concurrently for multi-monitor display in DOS. The DisplayPort controller does not support multi-monitor display in DOS
28
GRAP HICS /V IDE O C ONT ROLLER (C ONT.)

1GB AMD RADEON HD6670
Bus Type (example integrated or PCIe x16) GPU core clock Frame Buffer Memory (onboard and shared) Size and Speed Maximum power consumption Overlay Planes Maximum Color Depth Maximum Vertical Refresh Rate Multiple Display Support Operating Systems Graphics/ Video API Support Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digital)
MT
DT
PCIEx16 800Mhz 1000Mhz 68W Yes 32-bit 85Hz Yes D3D and OpenGL
SFF
Dual-Link DVI: 2560 x 1600, 32-bit color DisplayPort: 2560 x 1600, 32-bit color VGA: 1920 x 1440, 32-bits color DisplayPort, DVI-D, VGA Yes 6.6 x 4.7 / 16.764 x 12.0
External connectors DisplayPort Audio Support Dimensions of full height card inches/centimeters (L x H) Dimensions of low prole card inches/centimeters (L x H) Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Altitude Range
10-50 C 5-90% RH 0-20,000 ft.
1GB AMD RADEON HD6450

Bus Type (example integrated or PCIe x16) GPU core clock Frame Buffer Memory (onboard and shared) Size and Speed Maximum power consumption Overlay Planes Maximum Color Depth Maximum Vertical Refresh Rate Multiple Display Support Operating Systems Graphics/ Video API Support Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digital) External connectors DisplayPort Audio Support Dimensions of full height card inches/centimeters (L x H) Dimensions of low prole card inches/centimeters (L x H) Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Altitude Range
MT
DT
SFF
Dual-Link DVI Max: 2560 x 1600/32bpp @ 75Hz DispalyPort Max: 2560 x 1600/32bpp @ 75Hz VGA Max : 1920x1440/32bpp @ 75Hz Min : 640x480/8bpp @ 60Hz 1 DVI-I and 1 DisplayPort Yes 6.6 x 4.7 / 16.764 x 12.0 6.6 x 3.35 / 16.764 x 8.5
10-50 C 5-90% RH 0-20,000 ft.
29
GRAPHICS/VI DEO CONTROLLER (C ONT.)

512MB AMD RADEON HD6350
Bus Type (example integrated or PCIe x16) GPU core clock Frame Buffer Memory (onboard and shared) Size and Speed Maximum power consumption Overlay Planes Maximum Color Depth Maximum Vertical Refresh Rate Multiple Display Support Operating Systems Graphics/ Video API Support Supported Resolutions and Max Refresh Rates (Hz) (Note: Analog and/or digital) External connectors Dimensions of full height card inches/centimeters (L x H) Dimensions of low prole card inches/centimeters (L x H) Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Altitude Range 10-50 C 5-90% RH 0-20,000 ft. 6.6 x 2.731 / 16.764 x 6.936 6.6 x 2.731 / 16.764 x 6.936
MT
DT
SFF
DVI Max : 1920x1200/32bpp @ 75Hz VGA Max: 1920x1440/32bpp @ 75Hz Min : 640x480/8bpp @ 60Hz 1 DMS59 (DVI x2 or VGA x2)
30
HARD DRIV ES 1
3.5 1TB SATA 7200 RPM HDD Capacity (bytes) Dimensions inches (W x D x H) Interface type and Maximum speed Internal buffer size Average Seek Time Rotational Speed Logical Blocks 1,000,204,886,016 5.87 x 4 x 1 Up to 6Gb/s (SATA 3.0) Up to 3Gb/s (SATA 2.0) 32 MB 8.5 ms 7200 rpm 1,953,525,168
Power Source
Power Consumption (reference only) Spin Up Current (reference only) Idle 5.0W, Active 10.0W(running IOmeter utility) 5V (1A) ,12V (2A)
Environmental Operating Conditions (Non-Condensing):

Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range 50C to 600C 20% to 80% non-condensing 290C -50 ft to 10000 ft
Environmental Non-Operating Conditions (Non-Condensing):

Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range
1
-400C to 650C 10% to 90% non-condensing 380C -50 ft to 35000 ft
For hard drives, GB means 1 billion bytes ; actual capacity varies with preloaded material and operating environment and will be less.
31
HARD DRIV ES 1 (C ONT .)

3.5 500GB SATA 7200 RPM HDD Capacity (bytes) Dimensions inches (W x D x H) Interface type and Maximum speed Internal buffer size Average Seek Time Rotational Speed Logical Blocks 500,107,862,016 5.87 x 4 x 1 Up to 6Gb/s (SATA 3.0) Up to 3Gb/s (SATA 2.0) 16 MB 8.5 ms 7200 rpm 976,773,168
Power Source


Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range -400C to 650C 10% to 90% non-condensing 380C -50 ft to 35000 ft
32

Power Source


33

Power Source


Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range
1
-400C to 650C 10% to 90% non-condensing 380C -50 ft to 35000 ft
34

2.5 128GB1 SATA SOLID STATE DRIVE Capacity (bytes) Dimensions inches (W x D x H) Interface type and Maximum speed MTBF Average Seek Time Logical Blocks 128,035,676,160 3.94 x 2.75 x 0.374 Up to 6Gb/s (SATA 3.0) Up to 3Gb/s (SATA 2.0) 1M hours n/a 250,069,680
Power Source
Power Consumption (reference only) Spin Up Current (reference only) Idle 1W, Active 1.25W 5V (1000mA)

Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range Op Shock (@0.5ms) 0C to 70C 10 to 90% 29C -200 to 5,000 m 1,500G

Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range -55C to 95C 5 to 95% 38C -200 to 10,600 m
35

2.5 500GB SATA 7200 RPM HYBRID HDD
Capacity (bytes) Dimensions inches (W x D x H) Interface type and Maximum speed Internal buffer size Average Seek Time Rotational Speed Logical Blocks Power Source
Power Consumption (reference only) Spin Up Current (reference only)
500,107,862,016 Approximately (3.93 x 2.75 x 0.374 inches) Up to 3Gb/s 16 MB 12 ms (Read) 7200 rpm 976,773,168
Idle 0.8W, Active 3.25W 5V (1A)
Environmental Operating Conditions (Non-Condensing): Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range Environmental Non-Operating Conditions (Non-Condensing): Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range
-400C to 650C 10% to 90% non-condensing 380C -50 ft to 35000 ft 50C to 600C 20% to 80% non-condensing 290C -50 ft to 10000 ft
36

N O T E : FIPS certied SED HDD will be made available in Q2 2011. 2.5 320GB OPAL SED SATA HDD Capacity (bytes) Dimensions inches (W x D x H) Interface type and Maximum speed Internal buffer size Average Seek Time Rotational Speed Logical Blocks 320,072,933,376 5.87 x 4 x 1 (includes sled) Up to 3Gb/s 16 MB 8.5 ms 7200 rpm 625,142,448
Power Source
Power Consumption (reference only) Spin Up Current (reference only) Idle 0.7W, Active 3.25W 5V (1A)


37

2.5 500GB SATA 7200 RPM HDD
38

2.5 250GB SATA 7200 RPM HDD
39
OPTICAL DR IVES
DVD +/- RW1
External Dimensions inches/centimeters (Without Bezel W x H x D) Weight (max) pounds/ kilograms Interface type and speed Disc Capacity Internal buffer size Access Times (typical) Maximum Data Transfer Rates Writes Reads Power Source DC Power Requirements DC Current 12V, 5V 1200mA (12V)/ 900mA (5V) 12V, 5V 1200mA (12V)/ 900mA (5V) 5V 1000mA 5V 1000mA 16x DVD/48x CD 16x DVD/48x CD 16x DVD/48x CD 16x DVD/48x CD 8x DVD/ 24x CD 8x DVD/ 24x CD 8x DVD / 24x CD 8x DVD/ 24x CD
MT
148.2mm(6in)/42mm (2in)/ 190.5 (max) 800g SATA 1.5Gbit/s Standard supplier dependent supplier dependent
DT
SFF
128.0 mm (5.04)/ 12.7mm (0.5 in)/ 126.1mm (4.97in) 170g SATA 1.5Gbit/s Standard supplier dependent supplier dependent
USFF
Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range Operating Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range
1
5C to 50C 20% to 80% RH 29C -200 to 3048
5C to 50C 20% to 80% RH 29C -200 to 3048
5C to 50C 20% to 80% RH 29C -200 to 3048
5C to 50C 20% to 80% RH 29C -200 to 3048
Environmental Non-Operating Conditions (Non-Condensing): -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m
Discs burned with this drive may not be compatible with some existing drives and players; using DVD+R media provides maximum compatibility.
DVD-ROM
External Dimensions inches/centimeters (Without Bezel W x H x D) Weight (max) pounds/ kilograms Interface type and speed Disc Capacity Internal buffer size Access Times (typical) Maximum Data Transfer Rates Writes Reads
MT
DT
SFF
USFF
N/A 16x DVD/48x CD
N/A 16x DVD/48x CD
N/A 8x DVD/ 24x CD
N/A 8x DVD/ 24x CD
40
OPTIC AL DR IVES (CONT .)

DVD-ROM (CONT.)
Power Source DC Power Requirements DC Current 12V, 5V 1200mA (12V)/ 900mA (5V) 12V, 5V 1200mA (12V)/ 900mA (5V) 5V 800mA 5V 800mA
MT
DT
SFF
USFF
Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range 5C to 50C 20% to 80% RH 29C -200 to 3048m 5C to 50C 20% to 80% RH 29C -200 to 3048m 5C to 50C 20% to 80% RH 29C -200 to 3048m 5C to 50C 20% to 80% RH 29C -200 to 3048m
Environmental Non-Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m
41
OPTIC AL DR IVES (CONT .)

BLU-RAY WRITER
External Dimensions inches/centimeters (Without Bezel W x H x D) Weight (max) pounds/ kilograms Interface type and speed Disc Capacity Internal buffer size Access Times (typical) Maximum Data Transfer Rates Writes Reads Power Source DC Power Requirements DC Current 12V, 5V 1200mA (12V)/ 900mA (5V) 12V, 5V 1200mA (12V)/ 900mA (5V) 5V 900mA 5V 900mA 6X BD/16x DVD/40x CD 8X BD/16x DVD/40x CD 6x BD/16x DVD/40x CD 8x BD/16x DVD/40x CD 6X BD/8x DVD/24x CD 6X BD/8x DVD/ 24x CD 6X BD/8x DVD/24x CD 6X BD/8x DVD/ 24x CD
MT
DT
SFF
128.0 mm (5.04in)/ 12.7mm (0.5 in)/ 126.1mm (4.97in) 165g SATA 1.5Gbit/s Standard supplier dependent supplier dependent
USFF
128.0 mm (5.04in)/ 12.7mm (0.5 in)/ 126.1mm (4.97in) 165g SATA 1.5Gbit/s Standard supplier dependent supplier dependent
Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range Operating Temperature Range Relative Humidity Range Maximum Wet Bulb Temperature Altitude Range 5C to 50C 20% to 80% RH 29C -200 to 3048m 5C to 50C 20% to 80% RH 29C -200 to 3048m 5C to 50C 20% to 80% RH 29C -200 to 3048m 5C to 50C 20% to 80% RH 29C -200 to 3048m
Environmental Non-Operating Conditions (Non-Condensing): -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m -40C to 65C 5% to 95% RH 38C -200 to 10600m
42
MEDI A CARD READER (MCR)

NOTE: Dell 19 in 1 Media Card Reader (MCR) is supported via a F5 to F3 bay converter on the MT and DT and may require a slim line optical drive depending on selectable conguration. MCR is not available on the SFF and USFF chassis.
19 IN 1 MEDIA CARD READER

External Dimensions inches/(centimeters) (With Bezel W x H) Weight (max) pounds/kilograms Interface type and speed Media Supported ( maximum capacity supported will vary by Flash Media Types)
MT/DT
3.99/(10.13cm)/1.0/(2.54cm) ~155g USB 2.0, 480Mb/s CF I CF II Micro Drive (MD) Secure Digital (SD) SDHC Mini Secure Digital (mini-SD) Micro Secure Digital (Micro-SD)(with adapter) Multi Media Card (MMC) RS Multi Media Card (RS-MMC) Multi Media Card plus (MMC plus) RS Multi Media Card plus (RS-MMC plus) Multi Media Card Micro(MMC Micro) (with adapter) Memory Stick (MS) Memory Stick Pro(MS Pro) Memory Stick Pro Duo (MS Pro Duo) Memory Stick Duo (MS-Duo) Memory Stick Micro(MS Micro)(M2) (with adapter) Smart Media (SM) xD Compact Flash type I/II Version 4.0 Smart Media (SM) Specication 2003 Multi Media Card (MMC) Specication 4.2 Secure Digital (SD) 2.0 Memory Stick Pro (MS-PRO) Specication 1.02 Memory Stick (MS) Specication 1.43 xD Specication 1.2
Media Supported
Support Specication Versions:
Power Source Max Power Requirements Supply Voltage Range Power Consumption: Environmental Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range Environmental Non-Operating Conditions (Non-Condensing): Operating Temperature Range Relative Humidity Range -40C to 65C 5% to 95% RH 5C to 50C 10% to 90% RH 12V, 5V 4.75V ~ 5.25V Standby less than 0.5mA @ 5.0VDC
43
B I OS DE F AU L T S
System Conguration
Integrated NIC: USB Controller: Serial Port: SATA Operation: USB Controller: SMART Reporting: Diskette Drive: Miscellaneous Devices: Drives:
Enable Enable COM1 RAID On Enable USB Controller Disable Enable Enable (Front USB, Rear Dual USB, Rear Quad USB, PCI Slot) Enable (SATA-0, SATA-1, SATA-2, SATA3) Auto All Enable Disable Enable Enable Enable Disable Not set Not set Enable Disable Enable Deactivate Not set Power Off Disable Disable Disable Disable Set by the factory Optional User Entry Enable Enable Enable Enable Enable Thorough
Video Performance
Primary Video: Multiple Core Support: Intel SpeedStep: C States Control: Limit CPUID Value: HyperThread control:
Virtualization Support
Virtualization: VT for Direct I/O:
Security
Administrator Password: System Password: Password Changes: TPM Security: CPU XD Support: Computrace: SATA-0 Password: AC Recovery: Auto On Time: Deep Sleep Control: Fan Control Override: Wake on LAN:
Power Management
Maintenance
Service Tag: Asset Tag: SERR Message: Numlock LED: USB Emulation: Keyboard Errors: POST HotKeys: Fast Boot:
44
C HASSIS ENC LOS URE & V ENTIL ATIO N R EQ UI REM ENTS
ENCLOSURE VENTILATION If your enclosure has doors, they need to be of a type that allows at least 30% airow through the enclosure (front and back).
ENCLOSURE MINIMUM CLEARANCE Leave a 10.2 cm (4 in.) minimum clearance on all vented sides of the computer to permit the airow required for proper ventilation.
RECOMMENDED ENCLOSURE Do not install your computer in an enclosure that does not allow airow. This restricts the airow and impacts your computers performance, possibly causing it to overheat.
OPEN DESK MINIMUM CLEARANCE If your computer is installed in a corner, on a desk, or under a desk, leave at least 5.1 cm (2 in.) clearance from the back of the computer to the wall to permit the airow required for proper ventilation.
R EG UL A T OR Y C OM PLI ANC E AND ENV I R ONM ENT A L

Product related conformity assessment and regulatory authorizations including Product Safety, Electromagnetic Compatibility (EMC), Ergonomics, and Communication Devices relevant to this product may be viewed at www.dell.com/ regulatory_compliance. The Regulatory Datasheet for this product is located at http://www.dell.com/regulatory_compliance. Details of Dell's environmental stewardship program to conserve product energy consumption, reduce or eliminate materials for disposal, prolong product life span and provide effective and convenient equipment recovery solutions may be viewed at www.dell.com/environment. Product related conformity assessment, regulatory authorizations, and information encompassing Environmental, Energy Consumption, Noise Emissions, Product Materials Information, Packaging, Batteries, and Recycling relevant to this product may be viewed by clicking the Design for Environment link on the webpage.
45
E NVIR ONM ENT AL ATT RI BU TES

Reduce energy consumption, save money Energy efficient design: Allowing you compute more, and consume less. The Latitude Optiplex 990 has a 5.0 Energy Star rating, which means it uses energy-efficient power supplies, operates efficiently in multiple modes (Off, Sleep and Idle), and has advanced power-management features enabled. This level of efficiency helps you save money and energy associated with the use ofyour product. Compare energy consumption with energy savings calculator: www.dell.com/energy Take control of your energy consumption: Includes Energy Smart Power Management Settings which allows you to configure your computer to ensure the greatest energy saving in Inactive mode. Reduce, Re-use, Recycle Recycle responsibly and invest in peace of mind: Protect your company's sensitive data and recycle responsibly with the Dell Asset Recovery & Recycling Service. Find out how: http://content.dell.com/us/en/enterprise/services-asset-recoveryservices.aspx?redirect=2 Protect developing countries from e-waste exports: Because responsible recycling matters to you, it matters to us. In 2009, Dell was the first in the industry to ban the export of nonworking electronics or electronic waste (ewaste) to developing countries. Learn more: http://content.dell.com/us/en/corp/d/corp-comm/e-waste.aspx Eco-responsible packaging Molded paper pulp packaging (where available): Making it easier to choose products with eco-responsible packaging, this product is cradled in our innovative molded paper pulp packaging. We know that responsible sourcing is important to you, so our pulp is made with 100% news print or recycled cardboard that is sourced near manufacturing operations to the reduce carbon footprint of shipping. Recycled packaging: Helping you to avoid sending unnecessary waste to landfills, this products ships with expanded polyethylene cushion packaging material which has a high percentage of recycled content (20% in APJ, 25% in EMEA and 65% in Americas). Using recycled materials encourages waste reduction and the conservation of resources. Shipped in recycled materials: To help you reduce waste and reuse potentially useful materials, this product's packaging is made with up to 25% recycled post consumer cardboard Notes
All configs
All configs All configs
All configs
All configs
SFF configs only - regional disclaimer: only available in US, Canada and Malaysia
All configs except SFF
All configs
Reduce packaging waste: Dell is implementing a plan to simplify and revolutionize computer packaging that will result in the elimination of approximately 20 million pounds of packaging materials from 2008 All configs through 2012. Find out more: http://content.dell.com/us/en/corp/d/corpcomm/earth-products-packaging.aspx Environmentally Preferable Ingredients Finding better ingredients: Making it easy for you to reduce your environmental impact, the Optiplex 990 enclosure plastics are built with 10% Post Consumer Recycled Content. It also has reduced levels of BFR/PVC free configurations environmentally sensitive materials such as mercury and arsenic and can be configured to be completely free of BFR/PVC. This is one of Dell's most environmentally friendly products. Meets or exceeds world-wide environmental standards: WW EU RoHS All configs (Lead free), China RoHS and REACH compliant. EPEAT US/Canada/France , Energy Star, TCO, Blue Angel Learn more about Eco-Labels at http://content.dell.com/us/en/corp/d/corp-comm/dell-green-productcertifications.aspx
Eco- Participation
46
ACOUST IC NOIS E EMISSI ON INFORM ATI ON

OPTIPLEX 990 MT Component CPU Memory HDD (#, capacity) RMSD Graphics Adapter Typical Conguration Intel i3,3.3GHZ,2c SNB 65W 2G DDR3 1333MHz 250G 7200RPM SATA2 16X DVD+/-RW SATA HH Intel HD Graphics Family High-end Conguration Intel i5,3.1GHZ ,4c SNB 95W 2G DDR3 1333MHz(x2) 500G 7200RPM SATA2(x2) 16X DVD+/-RW SATA HH ATI Radeon HD 6350
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 990 MT is as follows: (all values LWAd expressed in bels; 1 bel=10 decibels, re 10-12 Watts) Operating Mode Idle HDD Operating 90% CPU ODD Operating
Typical Conguration Declared Sound Power (LWAd) High-end Conguration Declared Sound Power (LWAd)
3.7 3.9 3.8 5.1
3.9 3.9 4.0 5.1
The Declared A-weighted Sound Pressure Level in decibels (re 2x10-5 Pa), at Operator, Bystander, and Desk Side Positions are measured in accordance with ISO 7779 7.6.1, 7.6.2, and C.15.2 and declared in accordance with ISO 9296 for this product is as follows1: Operating Mode Typical Conguration Declared Sound Pressure (LpA) Table-Top Operator Position (LpA) Idle HDD Operating 90% CPU ODD Operating 26.5 26.7 26.7 39.7 Bystander Position (LpA) 24.2 24.9 24.8 35.8 Floor-Standing Operator Position (LpA) 21.0 21.1 21.6 36.6 Bystander Position (LpA) 21.2 20.9 21.3 36.1 High-end Conguration Declared Sound Pressure (LpA) Table-Top Operator Position (LpA) 26.8 26.8 30.0 40.7 Bystander Position (LpA) 24.3 23.9 26.3 36.0 Floor- Standing Operator Position (LpA) 20.9 21.8 22.4 35.4 Bystander Position (LpA) 21.4 21.4 22.0 33.5
All tests are conducted according to ISO 7779 and declared according to ISO 9296 except 90% CPU. For this mode, the system CPU was stressed at 90% utilization with no other peripheral device actively seeking. This test mode is not specified in ISO 7779, but was measured using the same microphone distances and measurement techniques defined for the other reported operating modes. 2 Declared Sound Power rounded to nearest tenth of a bel per ISO 9296 section 4.4.2
47

OPTIPLEX 990 DT Component CPU Memory HDD (#, capacity) RMSD Graphics Adapter Typical Conguration Intel l3,3.3GHZ,2c SNB 65W 2G DDR3 1333MHz 250G 7200RPM SATA2 16X DVD+/-RW SATA HH Intel HD Graphics Family High-end Conguration Intel I5,3.1GHZ ,4c SNB 95W 2G DDR3 1333MHz(x2) 500G 7200RPM SATA2 16X DVD+/-RW SATA HH ATI Radeon HD 6350
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 990 DT is as follows: (all values LWAd expressed in bels; 1 bel=10 decibels, re 10-12 Watts) Operating Mode Idle HDD Operating 90% CPU ODD Operating
3.7 3.6 4.1 5.1
3.7 3.8 4.4 5.1
1 All tests are conducted according to ISO 7779 and declared according to ISO 9296 except 90% CPU. For this mode, the system CPU was stressed at 90% utilization with no other peripheral device actively seeking. This test mode is not specied in ISO 7779, but was measured using the same microphone distances and measurement techniques dened for the other reported operating modes. 2 Declared Sound Power rounded to nearest tenth of a bel per ISO 9296 section 4.4.2
48

OPTIPLEX 990 SFF Component CPU Memory HDD (#, capacity) RMSD Graphics Adapter Typical Conguration Intel l3,3.3GHZ,2c SNB,65W 2G DDR3 1333MHz 250G 7200RPM SATA2 16X DVD+/-RW SATA HH Intel HD Graphics Family High-end Conguration Intel I5,3.1GHZ ,4c SNB 95W 2G DDR3 1333MHz(x2) 500G 7200RPM SATA2 16X DVD+/-RW SATA HH ATI Radeon HD 6350
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 990 SFF is as follows: (all values LWAd expressed in bels; 1 bel=10 decibels, re 10-12 Watts)
Operating Mode Idle HDD Operating 90% CPU ODD Operating
3.6 3.6 3.9 4.6
3.9 4.0 4.3 4.6
49

OPTIPLEX 990 USFF Component CPU Memory HDD (#, capacity) RMSD Graphics Adapter Typical Conguration Intel l3,3.3GHZ,2c SNB 65W 1G DDR3 1333MHz 250G 7200RPM SATA2 8X 12.7 SATA DVDRW Intel HD Graphics Family
The Declared Noise Emission in accordance with ISO 9296 for the Dell OptiPlex 990 USFF is as follows: (all values LWAd expressed in bels; 1 bel=10 decibels, re 10-12 Watts)
Operating Mode Idle HDD Operating 90% CPU ODD Operating
Typical Configuration Declared Sound Power (LWAd)
3.7 3.7 4.3 4.7
The Declared A-weighted Sound Pressure Level in decibels (re 2x10-5 Pa), at Operator, Bystander, and Desk Side Positions are measured in accordance with ISO 7779 7.6.1, 7.6.2, and C.15.2 and declared in accordance with ISO 9296 for this product is as follows1:
Operating Mode
Typical Configuration Declared Sound Pressure (LpA) Table-Top Operator Position (LpA) Bystander Position (LpA) 27.5 29.2 34.9 34.7 Floor-Standing Operator Position (LpA) 22.3 21.9 26.4 31.6 Bystander Position (LpA) 21.6 21.5 25.0 29.3
Idle HDD Operating 90% CPU ODD Operating
29.8 30.8 36.3 39.3
50

Optiplex 990 Customer Brochure

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DELL OPTIPLEX 990

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

MINI TOWER COMPUTER (M T) VI EW

Power Button, Power Light

Drive Activity Light

Diagnostic Lights (4)

10 VGA Connector 11 Line-in/Microphone Connector

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

MT System Board Components

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

D ESK TOP COMP UT ER (D T) VIEW

FRONT VIEW 1 2 3 4 Optical Drive Optical Drive Eject Button 5 6 7 8

Power Button, Power Light

10 VGA Connector 11 Line-in/Microphone Connector

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

DT System Board Components

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

SM ALL FORM F ACTOR COMP UTER (SF F ) VIEW

FRONT VIEW 1 2 3 Optical Drive Optical Drive Eject Button 5 6 7 8

Power Button, Power Light

4 USB 2.0 Connectors (4)

10 USB Connectors (6) 11 Line-in/Microphone Connector

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

SFF System Board Components

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

UL TR A SMALL FO RM F ACTO R COMP UTER (U SFF ) VIEW

Headphone Connector Microphone Connector

10 Wi-Fi Antenna (optional) 11 Network Activity Light 12 Captive Thumbscrew

13 Padlock Ring 14 Security Cable Slot 15 Power Connector

4 Drive Activity Light

Diagnostic Lights (4)

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

USFF System Board Components

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

MARKETING SYSTEM CONFIGURATIONS

Windows 7 operating system

Ubuntu Linux version 10.10 (China only) X X X X

Intel Q67 Express Chipset

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

DRIV ES AND R EM OVABL E ST ORAG E

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

DRIV ES AND R EM OVABL E ST ORAG E

S YSTEM EXPANSI ON S LOTS

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

GRAPHICS/VI DEO CONTROLLER

E XTE RN AL PORTS /C ON NECT ORS

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

C OMMUNIC ATI ONS - NET WORK ADAPTER (NIC)

Integrated on system board Optional card

network infrastructure is required.

C OMMUNIC ATI ONS WIRELESS

AUDIO AND S PEAKERS MT

Integrated on system board Optional Optional Optional

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

Integrated on system board

Optional. Available in Q3 2011

Available via Dell.com

Optional. Available in Q3 2011

Optional, US only Optional Standard

DELL OPTIPLEX 990 TECHNICAL GUIDEBOOK VERSION 1.5

DETAILED ENGINEERING SPECIFICATIONS