Item Emcdirectory-Design 2008

te te ee techhhhnolooooogi gi gi gi gies es es s es
nn Conndduccttttiv t e Maaateria rials l ...... .......... . ...... .................................8888 8

Connnnnnnsul s ttan t t Seeeervice cess... .. . .... ................ . ... .. .. ..... . ................... . . 2110 110
EMC MMMMCC MC MC MC MC DDe eeesign & &&& So So So So Softw tw w ftw w tw t are re ........... ....... . .... ... ...... . .................... 174 744 7
Fe Fer Fer er Fe rrit rr es sss, s Filterss rs s rs rs rrs & C & & & C & ooonn nect ectors ors rs s ............. . .................. 125 25 55
Lig Lig Lig Lighttnin in nng, Traan an aaa sie iee ie i s nts t &E &ESD .. ................. . ................. 1588
Magnet net ttic Shiield eld eld ee ing ng ngg .... ..... ............ . ... ...... .. ..... .....................200 00 00
Shielded Roooooooms mmmmm ... ............ . ... ........... ................. .......................116 164 4
Shieldin ng n ............. .. ... ..... . . ..... ..... ..... . .. ........ ........... .................... . ..99 99
Standarrrrds RRRRRecap caa cap aapp .. . . . ... ...... . . ... ...... ...... . ......... ... ... .. ...... .. ................ ... . 211 2
Testingg && g TTe Te T st st st st st Equ qu uip pm pm pm p ent ent en ee ..... .... ......... ... ..... . ................ ....... .. 17 17
ddire ect cctor or or or or o ie ie iiiee iesssss
Compaaaanny DDDD y DDDDDire ire ire rrre ir ireccto ct c ry ryy........ ... .... .. ... .. ..... .. ....... . ................ ... . ......2243 43
Gov Gov Goov o Govern ern n ern r men nnn me t D t D t Dire ire iii ccto c rryyy ...... ... . ............. . ............ .... ... .............2228
Produc uc uc ucts ss ss & S & S & S & S & S Serv erv erv ervice c sss s IInde nnnde exxxxxxxx........... . ...... .................235 23
Pro Pro Pro Proofes fes fes fes fes ssio sio sio sio sional nal nal nal nal SSo So So Socie cie ie cie ieeeetiee ti ti tie ie t sssss..... ............... .... ...... ................... 2119
iiinddu dust tri ries es es es && &&& &&& aapp pp ppplliica ca cations
Avi Avi Av A oni ni ni nics cs cs cs ........ .... ... ............ ................. .... ... ...........................42 42
Com Com Com Co put put put puters er ers er rss / Ac / A / A / A cessor so so ss ies es s .. .......... ...... . .........................108 08
Med Med Med Me edica ica ca callll ........... ... ...... ..... ..... ...... . ..............................78, 13344
Mil Mi MMi M itaryyyyyyy.. .. ........... ...........................................................222
Prii Pri ri Pr Pr Pr Pr nte nt nnnt nnn d CC d CCi c irc irc irc ircuit it it uit uit uit it Board aa s........... 116, 144, 176, 196
TTTTel TTe ecom .......... ..... . ... . .................................................36 3666
PRESORTED BOUND
PRINTED MATTER
US POSTAGE
PAID
PERMIT NO. 225
MECHANICSBURG, PA
ITEM PUBLICATIONS
1000 GERMANTOWN PIKE, F-2
PLYMOUTH MEETING, PA 19462-2486
CHANGE SERVICE REQUESTED
2008
EMC Directory
& Design Guide
interferencetechnology.com
TM
Cover NEW ag_08.indd 1 5/7/2008 3:01:08 PM
87 Newtown Road | Danbury, CT 06810 | T 203.744.7265 | F 203.798.2351 | info@vanguardproducts.com
www. v a n g u a r d p r o d u c t s . c o m
ULTRA-VANSHIELD
Dual Elastomer EMI/RFI Shielding Gaskets
The only shielding gasket that conducts like metal yet seals like rubber.
ULTRA-VANSHIELD
Dual Elastomer EMI/RFI Shielding Gaskets
The only shielding gasket that conducts like metal yet seals like rubber.
87 Newtown Road | Danbury, CT 06810 | T 203.744.7265 | F 203.798.2351 | info@vanguardproducts.com
www. v a n g u a r d p r o d u c t s . c o m
Vanguard.indd 1 2/11/2008 2:19:24 PM

ETS this antenna breaks 40.indd 1 3/3/2008 1:50:19 PM
Spira.indd 1 2/11/2008 4:59:53 PM
EMI Suppression and Absorption
The Wave-X family of products was devel-
oped in response to a critical industry need
for a simple and reliable EMI solution. EMI
is not a single-source problem; that is why
Wave-X has diferent sizes, features, and
formulations. The Wave-X products are
capable of attenuating noise from 5MHz
to 40GHz and are simple to integrate. Find
out what ARC Technologies and the Wave-X
family of products can do to streamline your
time-to-market product cycle and increase
product reliability.
ARC Technologies, Inc., 11 Chestnut St., Amesbury, MA 01913 USA
7eI: (978) 388-2993 - Fax: (978) 388-6866 - maiI: saIes@arc-tech.com
$BCM F "TTFNCM J FT r $FM M 1IPOFT r $PNQVUFST r (14 r "VUPNPUJ WF &M FDUSPOJ DT r .FEJ DBM &RVJ QNFOU
Tailored permeabilities for
BWBSJFUZPGBQQMJDBUJPOT
Ultra thin sheets
Carbon loaded silicone sheets
Molded confgurations for
FBTZJOUFHSBUJPO
Extrudable absorbers
and suppressors
Rigid or fexible injection
molded absorber structures
UL94-VO rated and
RoHS compliant
To learn more, visit
www.arc-tech.com
Absorber Solutions Across a Wide Range of Applications.
ARC.indd 1 3/17/2008 1:20:22 PM
4
INTERFERENCE TECHNOLOGY EMC DIRECTORY & DESIGN GUIDE 2008
contents 2008
24
Mains Supply
75%is
recuperated
Recuperation unit PV-Simulator
EUT

Mains-Simulation 3phase

Measurement
System
017

TESTING & TEST EQUIPMENT
Managing and planning the EMC of MOTS and COTS used within
MOD systems and platforms .............................................................. 22
The incorporation of MOTS and COTS equipment into defense
systems often requires EM barriers.
PETE DOREY, TV PRODUCT SERVICE LTD.
Solar inverters and the issue of EMC compliance .......................... 30
EMC regulation of solar installation equipment has failed to keep
pace with actual developments.
SIEGFRIED W. BEST, ELECTRONIK INDUSTRIE
A closer look at the FCC dynamic frequency selection certication
issues ..................................................................................................... 36
Additional industry training is needed focusing on accurate test
procedures.
DAVID A. CASE NCE, NCT, CISCO SYSTEMS, INC.
New EMC requirements for commercial avionics: RTCA/DO-160F
..................................................................................................................... 42
The test levels, requirements, and procedures are intended to
reect the state-of-the-art in aviation technology and EMC testing
methodology.
ERIK J. BORGSTROM, ENVIRON LABORATORIES LLC
Understanding shielding effectiveness of materials and
measurements in the near eld and far eld ................................... 60
When we treat the shielding effectiveness measurement with a
uniform eld, the results are similar for both near and far elds.
KERMIT O. PHIPPS AND PHILIP F. KEEBLER, EPRI EMC LABORATORY
The IEC Advisory Committee on EMC (ACEC): coordination of
international EMC standards ............................................................. 70
Since its formation, ACEC has developed a unique structure for EMC
publications that is used to this day in the IEC and in other regional
standardization organizations.
DR. WILLIAM A. RADASKY, PH.D., P.E., METATECH CORPORATION
The international medical device EMC standardIEC 60601-1-2
................................................................................................................. 78
The -2 standard is increasingly important in the electrical medical
device world.
DAN HOOLIHAN, HOOLIHAN EMC CONSULTING
88
CONDUCTIVE MATERIALS
Thermoplastic materials with inherent shielding improve
management of the electromagnetic spectrum ............................. 88
New materials offer a wide array of design, performance,
environmental, and economic benets.
ANN MARIE BURNELL, PH.D., SABIC INNOVATIVE PLASTICS
Solving the galvanic corrosion issue in EMI shielding ................... 94
Tungsten carbide/aluminum composite particles inhibit galvanic
corrosion of aluminum.
HARRY FUERHAUPTER, POTTERS INDUSTRIES, INC.
32
64
90
Aluminum Corrosion in Salt Spray
1
10
100
1000
WC-Aluminum Silver/Aluminum Nickel/Graphite
168 hr Wt Loss 500 hr Wt Loss
W
e
i
g
h
t

L
o
s
s

(
m
g
)
96
Table of Contents REVISED ag_08.indd 4 5/6/2008 5:34:29 PM
AEMI.indd 1 3/26/2008 4:05:09 PM
6
contents 2008
99
SHIELDING
Crucial RF shielding selection considerations ............................... 100
Attenuation performance is the single, most critical factor in
selecting RF shielding material.
GARY FENICAL, LAIRD TECHNOLOGIES
EMI shielding and optical enhancement to touch screens ........ 108
Incorporation of a circular polarizer is a powerful option for
enhancing LCD contrast.
BRIAN E. HERR, RICHARD D. PAYNTON, AND RANDALL C. PYLES,
DONTECH, INC.
PCB board level enclosures: A vital design element .................... 116
There is a greater need than ever to consider the radiated
interference between individual equipment and adjacent circuits on
PCBs.
ALAN WARNER, TECAN COMPONENTS LTD.
125
FERRITES, FILTERS & CONNECTORS
Utilizing overlooked characteristics of ferrites for improved
printed circuit board EMI suppression ........................................... 126
An understanding of the effects of DC bias is needed to design high
performance PCB EMI lters.
LEE HILL, SILENT SOLUTIONS LLC AND JEFF BRUCE, STEWARD INC.
A design approach for reducing EMI problems with electronic
medical equipment ............................................................................ 134
High-tech medical equipment creates high levels of electrical energy.
PHILIP F. KEEBLER AND KERMIT O. PHIPPS, EPRI EMC LABORATORY
Capacitor termination can enhance reliability .............................. 144
Using a polymer termination for multilayer capacitors forestalls
damage during PCB assembly.
MATTHEW ELLIS, SYFER TECHNOLOGY LIMITED
Power line lters: Whats wrong and how we can x em .......... 150
Test methods for power line lters have not kept pace with
requirements for system components.
HERBERT BLUM, SCHURTER, INC. AND ANTHONY A. ANTHONY, X2Y
ATTENUATORS, LLC
158
LIGHTNING, TRANSIENTS & ESD
Robust ESD protection and signal integrity for the next
generation of electronic devices ..................................................... 158
New architecture represents a fundamental change in the approach
to forestalling ESD damage.
JOE SALVADOR, CALIFORNIA MICRO DEVICES
164
SHIELDED ROOMS
Designing an RF shielded enclosure ............................................... 164
Anticipated problems must be factored into enclosure design.
RON BREWER, EMC/ESD CONSULTANT
106
120
130
139
0
100
200
300
400
500
600
700
800
1 10 100 1000
Frequency (MHz)
|I
m
p
e
d
a
n
c
e
|
(
)0A
0.1 A
0.2 A
0.3 A
0.4 A
0.5 A
149
Subampability
: (sub-amp-ability). noun: The ability to use an amplifier individually, or

as a building block, upon which power can be added incrementally.
Grow as you go. One small step at a time. Building on whats already there.
AR has applied this age-old idea to amplifiers used for EMC testing. When you need a more powerful amplifier, now you can add the
power, instead of tossing out the old amp and starting all over again.
Add Power To Existing Amps.
With test specs constantly changing, its an idea whose time has come. Many amplifiers within our S and W Series are designed so
that the power can be expanded with a relatively simple upgrade. Of course, the amplifiers can still be used individually when needed.
The latest examples are Models 10S4G11A (10 watts, 4-10.6 GHz) and 15S4G8A (15 watts 4-8 GHz). A fairly simple upgrade
performed by AR expands the 10S4G11A to a 20S4G11A (20 watt, 4-10.6 GHz) and the 15S4G8A to a 35S4G8A (35 watts, 4-8 GHz).
Once this initial upgrade is performed, the skys the limit. The 20S4G11A and the 35S4G8A are like building blocks that can easily be
expanded by adding sub amps and controller/combiner units.
At AR, were always thinking ahead. And we know you are, too. Thats why youll appreciate our Subampability concept
and the fact that all AR products are backed by the strongest, most comprehensive warranty in the industry, and a global support system
that's second to none.
To learn more, visit www.ar-worldwide.com or call us at 215-723-8181.
See Application Note #40 Expandable Power for further details.
rf/microwave instrumentation
Other ar divisions: modular rf receiver systems ar europe
USA 215-723-8181. For an applications engineer, call 800-933-8181.
In Europe, call ar emv United Kingdom 441-908-282766 ar emv France 33 -1- 47-91-75-30 emv Germany 89-614-1710 emv Netherlands 31-172-423-000
ISO 9001:2000
Certified
Copyright 2008 AR. The orange stripe on AR products is Reg. U.S. Pat. & TM. Off.
Heres The Idea Behind Our
Subampability
Concepts!
AR subamp.indd 1 4/3/2008 3:14:37 PM
8
contents 2008
InterferenceTechnologyThe EMC Directory & Design Guide, The EMC Symposium Guide, and The EMC Test & Design Guide are distributed annually at no charge to qualied
engineers and managers who are engaged in the application, selection, design, test, specication or procurement of electronic components, systems, materials, equipment, facilities or
related fabrication services. To be placed on the subscriber list, complete the subscription qualication card or subscribe online at InterferenceTechnology.com.
ITEM PUBLICATIONS endeavors to offer accurate information, but assumes no liability for errors or omissions in its technical articles. Furthermore, the opinions contained herein do not
necessarily reect those of the publisher.
ITEM
TM
, InterferenceTechnologyThe EMC Directory & Design Guide
TM
, and Interference Technology.com
TM
are trademarks of ITEM PUBLICATIONS and may not be used without
express permission. ITEM, InterferenceTechnologyThe EMC Directory & Design Guide, The EMC Symposium Guide, The EMC Test & Design Guide and InterferenceTechnology.
com, are copyrighted publications of ITEM PUBLICATIONS. Contents may not be reproduced in any form without express permission.
DEPARTMENTS
interferencetechnology.com ........................... 14
CONSULTANT SERVICES .................................. 210
EDITORIALS .........................................................10
INDEX OF ADVERTISERS..................................256
STANDARDS RECAP ......................................... 211
DIRECTORIES
COMPANY DIRECTORY ....................................243
GOVERNMENT DIRECTORY .............................228
PRODUCTS & SERVICES INDEX ......................235
PROFESSIONAL SOCIETIES ............................. 219
TRADE SHOWS .................................................253
176
EMC DESIGN & SOFTWARE
Off-chip decoupling measures: the EMC perspective .................. 176
Off-chip decoupling, or buffering, is a necessity.
MART COENEN, EMCMCC BV
Signal integrity analysis and physically based circuit extraction of
a mounted SMA connector ............................................................... 180
A proposed general approach is given for the denition of an
equivalent circuit with SMAs mounted on boards in any generic
stack-up.
A. CICCOMANCINI SCOGNA, PH. D., CST OF AMERICA, INC.
The importance and methods of full wave simulation validation
............................................................................................................... 186
Regardless of the accuracy of the modeling tool, each modeling
exercise requires some level of validation before simulation results
can be trusted.
BRUCE ARCHAMBEAULT, PH.D. AND SAMUEL CONNOR, IBM
Software simulation boosts the efcacy of PCB design ............. 196
Adding an effective package to the design cycle can pinpoint areas
critical to EMC compliance.
DIRK MLLER, FLOWCAD
200
MAGNETIC SHIELDING
Magnetic shield design for manufacturing .................................... 200
Sensitive electronic devices require protection from
radiating magnetic elds.
DAVID GRILLI, THE MSHIELD COMPANY, INC.
206
EMC EDUCATION
The importance of including electromagnetic compatibility
studies into the engineering curriculum at the university level
............................................................................................................... 206
University level education in EMC Engineering is a growing
necessity.
TONY DIBIASE, SPEC-HARDENED SYSTEMS
154
202
183
197
Enabling Your Success
Add New Life
Extend the life cycle of your probes. Thousands of
existing FP and HI Series battery powered probes can
now use our newest eld monitor the HI-6100. The
HI-6100 Field Monitor is a hardware replacement for
the familiar FM5004 monitor, and shares compatibility
with its command set.
Discover New Features
With the HI-6100, your existing probes work the same,
only better. You get new features like a bright 13.5 mm
x 10 mm backlit LCD color display, I/O that includes
IEEE-488, RS-232 and USB, user denable menus with
intuitive control functions, and the exibility to add
LaserPro laser-powered probes.
Mix and Match Probes
The HI-6100 is more than just a new eld monitor for
the probes you already have its a gateway to the
future. The HI-6100 supports up to four probes of any
vintage including our newest LaserPro Series in
its slim, 3U cabinetry. Just plug in a matching optional
power module for the type of probe youre using and
start taking measurements.
Roadmap to the Future
With the HI-6100, your existing probe investment is
protected while you gain a clear upgrade path to the
industrys newest technology. So when new probe
advances are introduced that are right for your lab,
youll be ready to take advantage of them. Its what
we mean when we say were Enabling Your Success.
www.ets-lindgren.com
Corporate ofces: USA +512.531.6400 and Finland +358.2.8383300
Company locations in the US, UK, Finland, France, Singapore, Japan, China and Taiwan
Representatives and Distributors worldwide
Our All-in-One Solution
For Your Legacy and Laser Probes
copyright 2007 ETS-Lindgren MT
ETS our all in one solution.indd 1 3/3/2008 2:04:01 PM
10
OATS BE WARNED!
Transmitter Testing Could Be Costly for Labs
Te FCC recently ned an FCC-listed laboratory for operating a transmitter
during compliance testing. Te equipment under test was an Emergency Loca-
tor Transmitter (ELT), which is used for search and rescue operation by the
DoD and civilian authorities.
Te transmitter, operating at 406.025 MHz was picked up by the Air Force
Search and Rescue Satellite (SARSAT) System. Tis spurred investigation by
the FCC and subsequent action which resulted in a ne of $8000.
Operators of OATS testing facilities: Be advised that compliance testing is
fraught with nancial peril (as if we didnt know that already: snow and ice,
wind and the elements, mice and other varmints). But why in this case?
Because neither the lab, nor its customer, had a license to operate the ELT.
Although there was no intentional disregard for the Rules or intent to cause
interference and the operation ceased immediately, the lawyers got out their
mortarboards and trowels and built a brick wall with Section 87.473(b) of the
FCC Rules:
[l]icenses for ELT test stations will be granted only to applicants to train per-
sonnel in the operation and location of ELTs, or for testing related to the manu-
facturer or design of ELTs.11 Section 87.475(d) of the Rules states the frequencies
available for ELT test stations are 121.600, 121.650, 121.700, 121.750, 121.800,
121.850, and 121.900 MHz and also states that ELT test station licensees must
[n]ot cause harmful interference to voice communications on these frequencies
or any harmonically related frequency, and must [c]oordinate with the ap-
propriate FAA Regional Spectrum Management O ce prior to the activation of
each transmitter.
Further, although this good lab fessed up and cooperated, they argued for
a reduced newith futilityby noting: the proposed forfeitures amount
should be reduced because it made good faith and voluntary disclosures to
the Commission, and because it has taken remedial measures to ensure future
compliance. Te Commission found that neither of these arguments supports
Reduction of the forfeiture amount. Reductions based on good faith eorts to
comply generally involve situations where violators demonstrate that they initi-
ated measures to correct or remedy violations prior to a Commission inspec-
tion or investigation.
So whats a lab to do? Labs operate transmitter equipment on OATS for the
purpose of compliance testing. Well, before you light up that radio, particularly
if you are at or near or harmonically related to an emergency services trans-
mitter, better check to see if you need a license to sputter RF into the aether.
One protection would be to get a Special Temporary Authority (STA) from the
FCC, under Part 5 of the Rules. Te other protection would be to drop a mega-
buck into a shielded anechoic chamber and move that transmitter inside.
Mike Violette
President, Washington Labs
mikev@wll.com
Editorial Review Board
Keith Armstrong
Cherry Clough Consultants
Stephen Caine
Alion Science & Technology
Tomas Chesworth
Seven Mountains Scientic, Inc.
Richard Ford
Consultant
Donald Heirman
Don Heirman Consultants, LLC
Daniel D. Hoolihan
Hoolihan EMC Consultants
William F. Johnson
WFJ Consulting
Herbert Mertel
Mertel Associates
Mark Montrose
Montrose Compliance Services, Inc.
Henry W. Ott
Henry Ott Consultants
OATS BE WARNED!
in my opinion
EDITORS NOTE
Note: this is a continuing fea-
ture that will appear regularly in
Interference Technology publi-
cations. In this space, a guest
columnist from the EMC indus-
try will have the opportunity to
editorializeto express views,
to reect on events, or to call
for change. In coming editions,
we may encounter many shades
of opinion and novel ideas. Our
current guest columnist is Mike
Violette, President of Washing-
ton Labs and a veteran of the
EMC industry. Here, youll nd
his take on compliance testing
in an OATS and possible conse-
quences of non-compliance with
FCC rules.
Editorial Guest ag_08.indd 10 5/6/2008 5:56:23 PM
TDK.indd 1 3/28/2008 11:17:50 AM
12
S u b s c r i p t i o n s
ITEM, InterferenceTechnologyThe EMC Directory & Design Guide, The EMC Symposium Guide, and The EMC Test & Design Guide are distributed annually at no charge to
engineers and managers who are engaged in the application, selection, design, test, specication or procurement of electronic components, systems, materials, equipment, facilities or
related fabrication services. Subscriptions are available through interferencetechnology.com.
USA
1000 Germantown Pike, F-2
Plymouth Meeting, PA 19462
Phone: (484) 688-0300
Fax: (484) 688-0303
E-mail:
info@interferencetechnology.com
www.interferencetechnology.com
CHINA, TAIWAN, HONG KONG
Chen Yu (Jenny) Zhen
c/o Beijing Leadzil Online Technology
+8610-6525 0537
Email: chenyuzhen@leadzil.com
JAPAN
TV SD Ohtama, Ltd.
Miho Toshima
+81-44-980-2092
E-mail: m-toshima@tuv-ohtama.co.jp
ITEM PUBLICATIONS endeavors to offer accurate
information, but assumes no liability for errors or
omissions. Information published herein is based on the
latest information available at the time of publication.
Furthermore, the opinions contained herein do not
necessarily reect those of the publisher.
ITEM
TM
, InterferenceTechnology and
InterferenceTechnology.com
TM
are trademarks of
ITEM PUBLICATIONS and may not be used without
express permission. ITEM, InterferenceTechnology
and InterferenceTechnology.com are copyrighted
publications of ITEM PUBLICATIONS. Contents may not
be reproduced in any form without express permission.
Copyright 2008 ITEM Publications ISSN 0190-0943
ITEM
TM
Publisher Emeritus
Robert D. Goldblum
Publisher
Graham S. Kilshaw
Managing Editor
Christine K. Frost
Editor
Elizabeth A. Buchanan
Art Director
John Wallace
Business Development Manager
Bob Poust
Business Development Executive
Robb Allison
Administrative Manager
Eileen M. Ambler
Circulation Manager
Irene H. Nugent
Product Development Manager
Helen S. Flood
Marketing Manager
Marla Merriwether
EMC Directory & Design Guide 2008
We Think Frank Got It Right
When commissioned to design a library, the Nineteenth Century architect Frank
Furness did not start planning soaring staircases and domed ceilings. He went
to spend several days with Melvil Dewey of Dewey Decimal System fame. He
realized that his foremost task was to design a structure that serves the purpose
of both librarians and readers. He had to create a functional, logical structure
that ordered a great deal of information in such a way that it was readily
accessible to the readers who would use it.
Basically, we think he had the right idea. Our new website design includes all
the information regular site visitors have come to expect. Certain features such
as News, Standards, and New Products, and Calendar are self explanatory.
Channels are one of the basic features of the new site. Relying on the original
meaning of the word, we hope our readers will follow these navigable passages
to the information they need. Tere are channels leading to information on the
key markets of aerospace, automotive, military, and NEBS. Major technologies
have their channels, including ampliers, antennas, connectors, lters, shielding,
and testing.
Although were as proud as ever of our hardcopy editions such as this Directory
& Design Guide and, one trend were rmly committed to is the growing
importance of non-traditional, online sources of information. By mid-May,
the new and expanded InterferenceTechnology.com should take its place in
cyberspace. Actually, a great deal of planning, thought, and organizing has gone
into this transformation.
Following the organizers mantra, weve grouped like with like. All the
Directories are now in one place, including the Products and Services Directory,
the EMC Test Lab Directory, the Government Directory, and the Standards
Update Directory. Similarly, the Resources section now includes a Video Library,
Research and White Papers, Videos, Application Notes, and EMC Jobs. Happily,
our neatening of the cyber-shelves has left room for valuable additions such
as the videos, webinars, and white papers. One nal addition were looking for
is reader feedback. Be sure to visit to the new site, and feel free to forward your
ideas and impressions.
One nal thought and trend wed like to leave you with is the growing awareness
of environmental issues and the push to re-use and recycle. Keep this Design
Guide on your shelf, pass it on to an interested party, or if the time comes, make
sure it goes to the recycle bin and not the landll.
Regards,
Elizabeth A. Buchanan
Editor
EMC Di t & D i G id 2008
from the editor
Editorial ag_08.indd 12 5/6/2008 6:03:19 PM
AH All you need.indd 1 2/11/2008 3:45:53 PM
The most widely used source of EMI/ EMC information is re-launching on Tuesday,
May 20 2008 at www.interferencetechnology.com. This completely re-designed website
will bring the following new information and services to our readers:
10 new online Forums to discuss EMC test and design techniques, to
find solutions and suppliers, to get references, and more.
10 new Channels of information - all articles, standards, news, etc.
are now organized by your electronics industry, and for the EMC
technologies you use the most.
New additional EMC Resources: videos, white papers, application
notes, and more.
A new EMC Contracts & Awards section.
Our Buyers Guides now feature easy-request, free sample offers
from many suppliers.
Your All New Online Resource For
EMC Re-Launches on May 20, 2008.
IT 2-pg spread.indd 2 4/29/2008 4:52:35 PM
Visit the new InterferenceTechnology.com, on Tuesday, May 20 for:
News
Standards Updates
New Product Announcements
Seminars, Conferences, and Events
Contract and Award Announcements
Surveys
Forums
New Resources including: videos, white papers, application notes.
Directories: products, services, test labs, government, standards.
Regular feature articles and our unique archive going back to 1995.
Jobs
And more.
An Online Guide to Electromagnetic Compatibility
www.interferencetechnology.com
Mark Your Calendar Now!
IT 2-pg spread.indd 3 4/29/2008 4:52:38 PM
EMC Detroit.indd 1 1/25/2008 12:15:57 PM
We Are Power!
Power Of Choice T
h
e
INSTRUMENTS FOR INDUSTRY INC.
The SVC & SMV500RH from IFI is a 500 watt
100-500 & 500-1000 MHz amplifier in an in-
credibly small and lightweight package making
it ideal for limited space and mobile applica-
tions. They are 8.75H x 19W x 25D. Other
frequency ranges & power levels are available.
IFI is pleased to announce our innovative
PT186-2KWR military ruggedized pulse ampli-
fier for outdoor mobile & fixed applications.
This model is a 6.5-18.0 GHz 1.5 KW peak
power amplifier for up to 6% duty cycles. In ad-
dition, this model features outstanding RF pulse
fidelity for all its possible applications in a com-
pact lightweight design. We also offer a
CW/Pulse version as well as other frequency
ranges to meet virtually any customers re-
quirement.
IFIs PT251-2KW is providing a minimum of
2.0KW of Pulse power from 1.0-2.5 GHz at duty
cycles up to 10%. This unit is another industry
first from IFI in a single drawer 10.5H x 19W
x 25D. This compact design is ideal for the high
power test specifications & requirements cus-
tomers must meet for todays program applica-
tions. We offer 2KW for the entire 1.0-18.0 GHz
frequency range as well as higher power levels
as required.
New Amplifier Solutions From IFI...
903 South Second Street Ronkonkoma, NY 11779
Tel: 631-467-8400 Fax: 631-467-8558 E mail: sales@ifi.com www.ifi.com
IFIs ST181-50 is designed specifically for bell-
core testing providing a minimum of 50 watts
up to 18 Ghz with better than 20 dBc harmonic
levels. This unit is another industry first fromIFI
in a single drawer 14H x 19W x 27D. This
compact design is ideal for many test specifica-
tions & requirements customers must meet for
todays program applications.
IFI is offering our latest complete Rack Inte-
grated System for various EMC & EW applica-
tions. For 10 kHz it is a versatile State-of-the-Art
design that can be tailored to meet customers
specific requirements for frequency bandwidth
& various RF output power levels. These sys-
tems can include any combination of Pulse, CW,
or Gridded amplifiers in very compact solutions.
IFIs SMCC2000 is
a powerhouse, 1
rack wide 200-
1000 Mhz produc-
ing 2000 watts.
This amplifier is
perfect for EMC testing in any lab application. It
is another industry first from IFI in a single rack;
this compact design is ideal for all test require-
ments that customers must meet for todays re-
quired applications.
IFIs Pulse/CW Millimeter Amplifiers operate
from 18.0-26.5 or 26.5-40.0 GHz for power lev-
els from 25-250 watts or greater. These ampli-
fiers operate in either Pulse or CW modes in a
5.25 rack height. Higher power units are taller.
IFIs innovative SMC Ruggedized Amplifier for
outdoor mobile & fixed applications. This model
is a 400MHz -1.0 GHz 200W Amplifier with noise
quieting as standard. In addition, this model fea-
tures outstanding RF Pulse fidelity for all its pos-
sible applications in a compact lightweight
design. This model is only 5.25 High and
weighing only 45 pounds. We also offer other
frequency ranges to meet virtually any cus-
tomers requirement.
IFI_1.indd 1 5/1/2008 11:10:20 AM
903 South Second Street, Ronkonkoma, NY 11779
Tel: 631-467-8400 Fax: 631-467-8558
E mail: sales@ifi.com
www.ifi.com
Frequency Min Pwr Min Sat Max
Model Range Out* Gain* NF
Number (GHz) (Watts) (dB) (dB)
S/T-10 Series 10 Watts CW 118 GHz
S21-10 1-2 10 40 15
S31-10 1-3 10 40 15
S42-10 2-4 10 40 15
S41-10 0.8-4.2 10 40 15
S41-13 0.8-4.2 13 40 15
ST181-10 1-18 10 40 35
ST182-10 2-18 10 40 35
T84-10 4-8 10 40 35
T128-10 8-12 10 40 35
T1812-10 12-18 10 40 35
T184-10 4-18 10 40 35
T186-10 6-18 10 40 35
T188-10 8-18 10 40 35
S/T-20 Series 20-25 Watts CW 118 GHz
S21-20 1-2 20 43 15
S31-20 1-3 20 43 15
S42-20 2-4 20 43 15
S41-20 0.8-4.2 20 43 15
S41-25 0.8-4.2 25 44 15
ST181-20 1-18 20 43 35
ST182-20 2-18 20 43 35
T82-20 2-8 20 43 35
T84-20 4-8 20 43 35
T184-20 4-18 20 43 35
T184-25 4-18 25 44 35
T186-20 6-18 20 43 35
T188-20 8-18 20 43 35
T1812-20 12-18 20 43 35
T128-20 8-12 20 43 35
S/T-50 Series 40-60 Watts CW 118 GHz
S21-50 1-2 50 47 15
S31-50 1-3 50 47 15
S42-50 2-4 50 47 15
S41-50 0.8-4.2 50 47 15
T82-50 2-8 50 47 35
T62-50 2-6 50 47 35
T84-50 4-8 50 47 35
T186-40 6-18 40 46 35
T188-40 8-18 40 46 35
T188-50 8-18 50 47 35
T186-50 6-18 50 47 35
T186-60 6-18 60 48 35
T1812-50 12-18 50 47 35
T128-50 8-12 50 47 35
*Higher output power and gains available
**New single chassis
S = Solid State
T = TWT
GT = TWT Pulse or CW
Medium Power
T-200 Series 200-300 Watts CW 121.5 GHz
T21-200 1-2 200 53 35
T21-250 1-2 250 54 35
T251-200 1-2.5 200 53 35
T251-250 1-2.5 250 54 35
T281-200 1-2.8 200 53 35
T281-250 1-2.8 250 54 35
T31-200 1-2.8 200 53 35
2.8-3 100 50 35
T42-200 2-4 200 53 35
T42-250 2-4 250 54 35
T82-200 2-8 200 53 35
T82-250 2-8 250 54 35
T84-200 4-8 200 53 35
T84-250 4-8 250 54 35
T128-200 8-12 200 53 35
T128-250 8-12 250 54 35
T1812-200 12-18 200 53 35
T1812-250 12-18 250 54 35
T188-200 7.5-18 200 53 35
T188-250 7.5-18 250 54 35
T188-300 7.5-18 300 55 35
T186-200 6-18 200 53 35
T186-250 6-18 250 54 35
T186-300 6-18 300 55 35
T2118-250 18-21.5 250 54 35
T-500 Series 500 Watts CW 118 GHz
T21-500 1-2 500 57 35
T251-500 1-2.5 500 57 35
T42-500 2-4 500 57 35
T7525-500 2.5-7.5 500 57 35
T82-500 2-2.5 150 53 35
2.5-8.0 450 57 35
T84-500 4-7.5 500 57 35
7.5-8 450 57 35
T128-500 8-12 500** 57 35
T1812-500 12-18 500** 57 35
T188-500 7.5-18 500** 57 35
T186-500 6-18 500** 57 35
GT-200 Series 200-500 Watts Pulsed/CW, 0-100% Duty Cycle
GT21-200 1-2 200 53 35
GT21-250 1-2 250 54 35
GT251-500 1-2.5 500 57 35
GT281-200 1-2.8 200 53 35
GT281-250 1-2.8 250 54 35
GT281-500 1-2.8 500 57 35
GT42-200 2-4 200 53 35
GT42-250 2-4 250 54 35
GT7525-500 2.5-7.5 500 57 35
GT84-200 4-8 200 53 35
GT84-250 4-8 250 54 35
GT84-500 4-7.5 500 57 35
7.5-8 450 57 35
GT825-200 2.5-8 200 53 35
GT128-200 8-12 200 53 35
GT188-200 7.5-18 200 53 35
GT188-250 7.5-18 250 54 35
GT188-300 7.5-18 300 55 35
GT188-500 7.5-18 500 57 35
GT1812-200 12-18 200 53 35
GT186-200 6-18 200 53 35
GT186-250 6-18 250 54 35
GT186-300 6-18 300 55 35
High Power
Solid State &
Traveling Wave Tube Amplifiers
IFI_2.indd 1 5/1/2008 11:12:35 AM
Tel: 631-467-8400 Fax: 631-467-8558
www.ifi.com
Number (GHz) (KWatts) (dB) (dB)
T-1000 Series 1-2 Kilowatts CW, 118 GHz
T21-1000 1-2 1.0 60 35
T251-1000 1-2.5 1.0 60 35
T42-1000 2-4 1.0 60 35
T84-1000 4-8 1.0 60 35
T7525-1000 2.5-7.5 1.0 60 35
T188-1000 7.5-18 1.0 60 35
T186-1000 6-18 1.0 60 35
T21-2000 1-2 2.0 63 35
T251-2000 1-2.5 2.0 63 35
T42-2000 2-4 2.0 63 35
T84-2000 4-8 2.0 63 35
T108-1000 8-10 1.0 60 35
T128-2000 8-12 2.0 63 35
T1812-2000 12-18 2.0 63 35
Traveling Wave Tube,
Pulse & CW TWT Amplifiers
MMT Series 5-150 Watts, 1840 GHz
T2618-10 18-26.5 10 40 35
T2618-25 18-26.5 25 44 40
T2618-40 18-26.5 40 46 40
T2618-50 18-26.5 50 47 40
T2618-100 18-26.5 100 50 40
T2618-150 18-26.5 150 53 40
T2618-200 18-26.5 200 54 40
T4018-10 18-40 10 40 40
T4018-25 18-40 25 44 40
T4018-40 18-40 40 46 40
T4026-10 26.5-40 10 40 40
T4026-25 26.5-40 25 44 40
T4026-40 26.5-40 40 46 40
T4026-50 26.5-40 50 47 40
T4026-100 26.5-40 100 50 40
T4026-150 26.5-40 150 53 40
T4026-200 26.5-40 200 54 40
T3832-40 32-38 40 46 40
T3832-60 32-38 60 48 40
T3027-120 27.5-30 120 52 35
T3027-150 27.5-30 150 53 35
Millimeter
High Power
Digital Display Monitors: Power Supply Currents,
Voltage, Forward RF Power, Reflected RF Power,
Total Hours, Operate Hours,
Status Indicators: Power On,
Standby, Operate,
Faults: Overcurrent, VSWR
Overload, Thermal Overloads,
Power Supply
Controls: AC Breaker On/Off,
Standby, Operate,
Fault Reset, Local/Remote
Ease of Maintenance
Designed to meet the safety
requirements of the IEC-348 and Underwriters
Labratory of American Standards
Broadband Coverage
Applications Include:
MIL-STD-461/462, RTCA/D0-160,
SAE Specifications, Radiated
Susceptibility, Bellcore testing,
Broadband Communications.
Ruggedized Versions are available for
Shipboard and Airborne applications
Amplifier Features Include:
Number (GHz) (KWatts) (dB) (dB)PT-
PT-1KW Series 1-2 Kilowatts, 6% Duty Cycle
PT21-1KW 1-2 1.0 60 35
PT21-2KW 1-2 2.0** 63 35
PT251-1KW 1-2.5 1.0 60 35
PT42-1KW 2-4 1.0 60 35
PT42-2KW 2-4 2.0** 63 35
PT82-1KW 2-8 1.0 60 35
PT825-1KW 2.5-8 1.0 60 35
PT825-2KW 2.5-8 2.0** 63 35
PT84-1KW 4-8 1.0 60 35
PT84-2KW 4-8 2.0** 63 35
PT128-1KW 8-12 1.0 60 35
PT1812-1KW 12-18 1.0 60 35
PT188-1KW 8-18 1.0 60 35
PT186-1KW 6.5-18 1.0 60 35
PT188-2KW 8-18 2.0** 63 35
PT128-2KW 8-12 2.0** 63 35
PT1812-2KW 12-18 2.0** 63 35
PT-KW Series 3-8 Kilowatts, 10% Duty Cycle
PT1412-5KW 1.2-1.4 5.0 67 35
PT1412-6KW 1.2-1.4 6.0 68 35
PT3525-5KW 2.5-3.5 5.0 67 35
PT4830-5KW 3.0-4.8 5.0 67 35
PT5727-4KW 2.7-5.7 4.0 66 35
PT128-3KW 8.2-12.4 3.0** 65 35
PT108-6KW 8.7-10.5 6.0 68 35
PT1715-4KW 15-17 4.0** 66 35
PT9593-4KW 9.3-9.5 4.5 66 35
PT128-8KW 8-12 8.0 69 35
PT1093-5KW 9.3-10 5.0 67 35
*Higher output power and gains available
**Over majority of Frequency Range
High Power Pulse
IFI_3.indd 1 5/1/2008 11:13:43 AM
Frequency Min Pwr Min Sat
Model Range Out Gain
Number (MHz) (Watts) (dB)
SMCC Series 200-1000 MHz
SMCC10 200-1000 10 40
SMCC25 200-1000 25 44
SMCC50 200-1000 50 47
SMCC100 200-1000 100 50
SMCC200 200-1000 200 53
SMCC250 200-1000 250 54
SMCC350 200-1000 350 55
SMCC500 200-1000 500 57
SMCC600 200-1000 600 58
SMCC800 200-1000 800 59
SMCC1000 200-1000 1000 60
SMCC2000 200-1000 2000 63
SMCC3000 200-1000 3000 65
CMC/SMC Series 1-1000 MHz
CMC10 1-1000 10 40
CMC25 1-1000 25 44
CMC50 1-1000 50 47
CMC100 1-1000 100 50
CMC120 1-1000 120 51
SMC25 80-1000 25 44
SMC50 80-1000 50 47
SMC100 80-1000 100 50
SMC150 80-1000 150 52
SMC200 80-1000 200 53
SMC250 80-1000 250 54
SMC500 80-1000 500 57
SMC1000 80-1000 1000 60
SMC2000 80-1000 2000 63
SMC3000 80-1000 3000 65
SVC Series 100-500 MHz
SVC10 100-500 10 40
SVC25 100-500 25 44
SVC50 100-500 50 47
SVC100 100-500 100 50
SVC200 100-500 200 53
SVC250 100-500 250 54
SVC500 100-500 500 57
SVC800 100-500 800 58
SVC1000 100-500 1000 60
SVC1500 100-500 1500 62
SVC2000 100-500 2000 63
SVC3000 100-500 3000 65
SMV/SMIV Series 500-1000 MHz
SMV10 500-1000 10 40
SMV50 500-1000 50 47
SMV100 500-1000 100 50
SMV200 500-1000 200 53
SMV250 500-1000 250 54
SMV500 500-1000 500 57
SMV800 500-1000 800 58
SMV1000 500-1000 1000 60
SMV2000 500-1000 2000 63
SMV3000 500-1000 3000 65
SMIV10 400-1000 10 40
SMIV50 400-1000 50 47
SMIV100 400-1000 100 50
SMIV200 400-1000 200 53
SMIV250 400-1000 250 54
SMIV500 400-1000 500 57
SMIV800 400-1000 800 58
SMIV1000 400-1000 1000 60
SMIV2000 400-1000 2000 63
SMIV3000 400-1000 3000 65
Tel: 631-467-8400 Fax: 631-467-8558
www.ifi.com
SMX-CMX Series .01-1000 MHz
SMX10 .01-1000 10 40
SMX25 .01-1000 25 44
SMX50 .01-1000 50 47
SMX100 .01-1000 100 50
SMX200 .01-1000 200 53
SMX500 0.1-1000 500 57
CMX3001 .01-1000 300/100 55/50
CMX3002 .01-1000 300/200 55/53
CMX3003 .01-1000 300/300 55/55
CMX5001 .01-1000 500/100 57/50
CMX5002 .01-1000 500/200 57/53
CMX5003 .01-1000 500/300 57/55
CMX5005 .01-1000 500/500 57/57
CMX10001 .01-1000 1000/100 60/50
CMX10002 .01-1000 1000/200 60/53
CMX10003 .01-1000 1000/300 60/55
CMX10005 .01-1000 1000/500 60/57
CMX100010 .01-1000 1000/1000 60/60
Combination
M/TCCX/SCCX Series .01-220 MHz
M10* .01-220 10 40
M50* .01-220 50 47
M75* .01-220 75 48
M100* .01-220 100 50
M200 .01-220 200 53
M423 .01-220** 300 55
M404 .01-220** 500 57
M406 .01-220** 1000 60
TCCX2000 .01-220** 2000 63
TCCX2200 .01-220** 2200 63
TCCX2500 .01-220** 2500 64
TCCX3500 .01-100** 3500 66
TCCX4500 .01-100** 4500 67
SCCX10 .01-220 10 40
SCCX25 .01-220 25 44
SCCX50 .01-220 50 47
SCCX75 .01-220 75 48
SCCX100 .01-220 100 50
SCCX200 .01-220 200 53
SCCX250 .01-220 250 54
SCCX500 .01-220 500 57
SCCXL1000 .01-100 1000 60
SCCXL2500 .01-100 2500 64
Solid State &
Tetrode Tube
* These models have No Display and No GPIB Remote
** Tetrode Tube Units
Solid State, Tetrode
Tube & Combination Amplifiers
Solid State
IFI_4.indd 1 5/1/2008 11:14:56 AM
Tel: 631-467-8400 Fax: 631-467-8558
www.ifi.com
TEM Cells, Antennas,
Sensors And Accessories
TEM Cells
CC Series DC-2 GHz
Model DC to Max. Maximum Test Septum
Number Frequency Object Size (Inches) Height
MHz Length Depth Height Inches Meters
CC-100S 91 26.2 26.2 13.1 39.4 1.00
CC-101 100 22.6 22.6 7.6 26.6 0.68
CC-101S 100 22.6 22.6 11.3 34 0.86
CC-101.5 150 15.7 15.7 5.2 15.7 0.40
CC101.5S 150 15.7 15.7 7.8 23.6 0.60
CC-102 200 11.8 11.8 3.9 11.8 0.30
CC-102EX 375 11.8 11.8 3.9 11.8 0.30
CC-102S 200 11.8 11.8 5.9 17.7 0.45
CC-102SEX 325 11.8 11.8 5.9 17.7 0.45
CC-103 300 7.9 7.9 2.6 7.9 0.20
CC-103EX 500 7.9 7.9 2.6 7.9 0.20
CC-103S 300 7.9 7.9 4.0 11.8 0.30
CC-103SEX 500 7.9 7.9 4.0 11.8 0.30
CC-104 400 5.9 5.9 1.9 5.9 0.15
CC-104EX 750 5.9 5.9 1.9 5.9 0.15
CC-104EXX 1000 5.9 5.9 1.9 5.9 0.15
CC-104S 400 5.9 5.9 2.9 8.9 0.23
CC-104SEX 750 5.9 5.9 2.9 8.9 0.23
CC-104SEXX 1000 5.9 5.9 2.9 8.9 0.23
CC-105 500 4.7 4.7 1.5 4.7 0.12
CC-105EX 750 4.7 4.7 1.5 4.7 0.12
CC-105EXX 1000 4.7 4.7 1.5 4.7 0.12
CC-105S 500 4.7 4.7 2.3 7.1 0.18
CC-105SEX 750 4.7 4.7 2.3 7.1 0.18
CC-105SEXX 1000 4.7 4.7 2.3 7.1 0.18
CC-108 800 2.9 2.9 0.9 3.0 0.08
CC-108EX 1200 2.9 2.9 0.9 3.0 0.08
CC-108EXX 1600 2.9 2.9 0.9 3.0 0.08
CC-110 1000 2.3 2.3 0.7 2.4 0.06
CC-110EX 1500 2.3 2.3 0.7 2.4 0.06
CC-110EXX 2000 2.3 2.3 0.7 2.4 0.06
CC-110S 1000 2.3 2.3 1.1 3.6 0.09
CC-110SEX 1400 2.3 2.3 1.1 3.6 0.09
CC-110SEXX 1800 2.3 2.3 1.1 3.6 0.09
BC-110 1000 1.6 1.6 0.5 1.6 0.04
EFG-3/EFG-3B
E-Field
Generating Antenna
The EFG-3 E-Field generating antenna is designed to
generate strong electric field intensities within its
vicinity for use in radiated susceptibility testing systems.
The EFG-3 provides a means for dissipating any un-
used power through the use of a conventional coaxial
50 ohm termination of appropriate power handling ca-
pability. This allows the EFG-3 to handle up to 1000
watts of continuous power.
Ultra
Wideband
E-Field Sensor
EFS-7 Series Sensor Specifications
E-Field Range 0 - 300 V/m*
Frequency Range 10 kHz - 500 MHz**
Sensor Range 30dB per antenna or probe
Accuracy +/- 5%
Flatness +/- 1.5dB
* Up to 1000 V/m with optional isotropic probes
** Up to 50 GHz with optional isotropic probes
Optional Isotropic Probes
Model Sensitivity Frequency
0301 30, 100, 300 V/m 300kHz - 1GHz
0301-S 1, 3, 10 V/m 300kHz - 1GHz
0301-H 100, 300, 1000 V/m 300kHz - 1GHz
0301-D 30, 100, 300 V/m 300kHz - 3GHz
0301-SD 1, 3, 10 V/m 300kHz - 3GHz
0301-HD 100, 300, 1000 V/m 300kHz - 3GHz
3050 30, 100, 300 V/m 300MHz - 50GHz
Available Accessories:
Standard & Broadband Gain Horns
Waveguide to Coax Adapters
Double Ridge Waveguide to Coax
Adapters & Dummy Loads
Phase Shifters
Fixed Attenuators
EFG-3/EFG-3B Specifications:
Power Handling Capability: Up to 1000 watts
continuous CW input, 2000 watts for EFG-3B
Frequency Range: 10kHz to 220 MHz
Input Impedance: 50 ohms nominal
Output Port Impedance: 50 ohms nominal
VSWR: Less than 4:1 at all frequencies,
reflections included
Physical Size: Main antenna element:
1 meter x 1 meter x 10 centimeters (LxWxD)
Load Required: 50 ohm, standard coaxial
termination, with power rating
appropriate for source
Connectors: Type N Female (EFG-3)
Type C Female (EFG-3B)
IFI_5.indd 1 5/1/2008 11:19:21 AM
Copyright 2008 Underwriters Laboratories Inc. ULAB-00940-02 2/08
Extensive EMC expertise
found nowhere else.
One-stop access to a comprehensive
portfolio of integrated services.
Whether its European Union directives, telecom NEBS requirements, wireless certifications or automotive compatibility
standards, ULs EMC experts can provide the knowledge, quality of service and on-time delivery that comes with
more than 110 years of engineering testing experience. The UL Market Access Solutions team can help you understand
global market requirements, develop compliance strategies, and work through technical compliance and testing issues.
To take advantage of ULs unequalled breadth and depth of EMC expertise,
e-mail emc@us.ul.com or call 1-800-873-8536.
Mark Miles
Senior Engineering Associate
22 Years of Experience
UL EMC Automotive Group
Mark manages projects to test
component compliance standards for
most of the worlds car manufacturers.
Hes just one of the thousands of
UL employees who set the standard.
ULAB-00940-02 emc key indd 1 3/11/08 11:14:20 AM
UL.indd 1 3/17/2008 12:21:49 PM
22
testing & test equipment EMC OF MOTS AND COTS
PETE DOREY
TV Product Service Ltd.
Fareham, UK
D
efence contractors intending to
supply military-o-the-shelf (MOTS)
and/or commercial-off-the-shelf
(COTS) electrical/electronic equipment for
use on UK military platforms, or to integrate
them into UK military systems now have
new guidance on a risk assessment process
for achieving electromagnetic compatibility
(EMC). Te author, one of the lead authors
of the UK Ministry of Defence Standard
59-411 for Electromagnetic Compatibility,
explains the guidance contained in Part 1 of
the standard.
One of the di culties with integrating
MOTS and COTS products into complex
military systems is achieving electromag-
netic compatibility (EMC). Electromagnetic
compatibility is the ability of electrical and
electronic equipment and systems to share
the electromagnetic spectrum and to perform
their desired functions without unacceptable
degradation from or to the electromagnetic
environment.
Te MOTS acronym is used to describe
both military o-the-shelf or modied o
the shelf equipment. Military-o-the-shelf
equipment is qualied to a non-UK military
EMC standard such as the US standard MIL-
STD-461. Modied-o-the-shelf equipment
is a COTS product that has been modied to
enhance its EMC performance.
Commercial o-the-shelf (COTS) prod-
ucts are proprietary and meet the EMC
performance requirements of the EU Direc-
tive for EMC, 2004/108/EC, and carry CE
Marking that allows their free trade across
EU member states.
Te incorporation of MOTS and COTS
equipment into defence systems and platforms
often requires electromagnetic barrierssuch
as shielded racks and lters and the use of
fibre-optics. These measures reduce sus-
ceptibility to harsh defence electromagnetic
environments and also enhance compatibility
with sensitive co-located systems such as mili-
tary radio. To assess the degree of protection
required (or indeed if any is required), the risk
assessment process of Def Stan 59-411 can be
used to compare the existing EMC compli-
ance of the MOTS/COTS equipment to the
defence EMC requirement.
DEF STAN 59-411 EMC RISK
ASSESSMENT
Te UK EMC standard for defence procure-
ment, Def Stan 59-411, includes a risk assess-
ment approach in its Part 1 Management and
Planning for MOTS/COTS equipment as
shown in Figure 1. Te process requires the
intended electromagnetic environment to be
dened, the evidence of EMC compliance to
be evaluated, and the functional criticality
of the equipment and platform to be deter-
mined. Finally, the unacceptable risks are to
be mitigated by either carrying out remedial
re-design, installation methods (electromag-
netic barriers), and/or retesting.
SPECIFYING THE
ELECTROMAGNETIC
ENVIRONMENT
Te target electromagnetic environment is
Managing & planning the EMC of MOTS
and COTS used within MOD systems &
platforms
The incorporation of MOTS and COTS equipment into defense systems
often requires EM barriers.

Article 22 ag_08.indd 22 5/6/2008 11:29:59 AM
51
52
53
54
55
56
57
58
P
o
w
e
r

(
d
B
m
)
Frequency (MHz)
200 0 400 600 800 1000 1200
Psat
P1dB
AMPLIFIER EVOLUTION IN PRACTICE -
Introducing the MILMEGA Silicon Carbide UHF range
Nearly 3 times smaller and lighter
than the competition
Designed to bring the intrinsic benets of silicon carbide transistor technology to a lab environment, the
new range of innovative UHF ampliers from MILMEGA delivers unrivalled power density, exceptional
reliability, embedded intelligence and portability in a 21st century response to the challenge of compact
power provision. Available as 250W, 500W and 1000W rack mounting units.
With the exibility and ease of power upgrade that you would expect from MILMEGA products, these new
ampliers further enhance our reputation for going the extra mile to deliver what customers want with a
quality and innovation that competitors aspire to.
MILMEGA Limited Ryde Business Park, Nicholson Road, Ryde, Isle of Wight, PO33 1BQ United Kingdom
Tel. +44 (0) 1983 618004 Fax. +44 (0) 1983 811521 sales@milmega.co.uk www.milmega.co.uk
Designers and Manufacturers of High
Power Microwave and RF Ampliers
Find out more at www.milmega.co.uk/RF
Milmega.indd 1 2/11/2008 2:00:16 PM
24
usually specied in the User Require-
ment Document (URD) or System
Requirement Document (SRD). It may
be specied for a unique purpose, or
it may be one of the generic electro-
magnetic environments encompassed
by the default test requirements of Def
Stan 59-411 (e.g., a ship below decks
environment). Once the environment
denition is known, the adequacy of the
MOTS/COTS EMC performance can be
evaluated.
EVALUATING MOTS/COTS EMC
PERFORMANCE
Obtaining the evidence of EMC compli-
ance is one of the major challenges of
the risk assessment process. All MOTS/
COTS items of equipment must carry
CE Marking, which currently may indi-
cate that the manufacturer or supplier
declared conformity with either the ear-
lier EU EMC Directive 89/336/EEC for
apparatus placed on the market up until
20 July 2007, or has declared conformity
with the current EU EMC Directive
2004/108/EC for apparatus placed on
the market since 20 July 2007.
In both cases, the requirement for
CE Marking does not apply if the ap-
paratus is military equipment exempted
under Article 296 of the Treaty of the
European Community (as described
below under the heading CE Marking
Considerations).
For equipment already placed on the
market prior to 20 July 2007, the existing
declaration of compliance with 89/336/
EEC remains valid for a two-year transi-
tion period until 20 July 2009. After this
date, all equipment must comply with
2004/108/EC.
Te manufacturer or supplier pre-
pares a Declaration of Conformity
(DoC) identifying the EMC standards
to which the equipment is compliant.
Te DoC may be with the equipment
documentation, on the manufacturers
website, or supplied on request.
Under the current EMC Directive
2004/108/EC, the manufacturer or
supplier must maintain Technical
Documentation containing an EMC
assessment such as a Test Report and
design information. Ideally, a copy of
the EMC Test Report or Test Certi-
cate should be obtained to conrm the
actual tests undertaken and the limits
applied.
Having identied the EMC standards
applied to the MOTS/COTS equipment,
a gap analysis is performed to evaluate
the EMC compliance evidence of the
MOTS/COTS equipment against the
EMC test requirements of Def Stan
59-411.
To compare test compliance evi-
dence for MOTS/COTS equipment
against UK Defence Standard 59-411,
differences in the test methods and
limits must be identied and accounted
for in the comparison. Tese include
ports tested, frequency range, limit
levels, emission test detector type, test
bandwidth, test distance, susceptibility
test modulation, and coupling method.
Because of the multitude of commer-
cial standards used today, there is the
possibility of numerous comparisons,
and consequently gap analysis tools
have been developed to assist in this
process.
Te gap analysis determines whether
the MOTS/COTS standard test is more
or less stringent than the Def Stan
59-411 test limit and the applicable
margin. It also identies the frequency
range addressed by the commercial
standard to allow a user to identify un-
tested frequency bands. Based on this
information, a user can determine the
risk of deploying a piece of equipment
meeting the MOTS/COTS standard in
an environment represented by the Def
Stan 59-411 standard or can identify the
degree of additional protection required
to meet the Def Stan 59-411 standard in
terms of barrier performance, shielding
attenuation, and lter attenuation.
FUNCTIONAL CRITICALITY
Te risks identied from the evaluation
of the MOTS/COTS EMC compliance
evidence in the previous process must
now be compared to the criticality
of the MOTS/COTS equipment and
the criticality of the environment or
platform in which the MOTS/COTS
equipment will be operated. Generally,
the greater the criticality of the MOTS/
COTS equipment, the lesser the degree
of susceptibility risk will be permitted.
Te greater the criticality of the envi-
ronment or platform, the lesser the de-
gree of emissions risk will be permitted.
Once the project has determined the
unacceptable risks, they are mitigated
as follows.
Figure 1. MOTS/COTS risk assessment.
MOD EMC Defense Standards
Part 1 of the EMC Defence Standard
(Def Stan) 59-411, which superseded
Def Stan 59-41, focuses on Manage-
ment and Planning.
Parts 2 to 5 relate respectively to: The
Electric, Magnetic and Electromag-
netic Environment; Test Methods &
Limits for Equipment & Sub Systems;
Platform & System Tests & Trials;
and Code of Practice for Tri-service
Design & Installation.
Absorbing Clamp
30 to 1000 MHz
LISNs
10 KHz to 1 GHz, 5 to 350 Amperes
TEM Cells
DC to 2000 MHz
EM Injection Clamp
10 KHz to 1000 MHz
Injection Probes - Clamp-on,
CW and Pulse 10 KHz to 2000 MHz,
Internal Diameters from 32 to 66mm,
50 to 750 Watts
Providing a complete family of
EMC Testing solutions
Applications Mil-Std 461/462, CISPR, FCC, VDE, IEC 1000-4-6, -7, -8, -9, -10, ESD, HIRF, TREOP Bellcore, SAE J15447, RTCA DO-160
CISPR-22 Telecom Conducted Emission Test Accessories
Fischer Custom Communications, Inc.
S E R V I N G T H E E M C C O M M U N I T Y S I N C E 1 9 7 1
20603 Earl Street Torrance, California 90503 USA Telephone (310) 303-3300
Fax (310) 371-6268 E-mail sales @fischercc.com www.fischercc.com
IEC 1000-4-8 Test Equipment
Coupling Decoupling Networks
150 KHz to 230 MHz / Power lin 15 to 200
Amperes, Balanced line / Coaxial /
Shielded Multipin / Unshielded Multipin
Monitor Current Probes
Surface & Clamp-on, 1 Hz to 5 GHz
Internal Diameters 5 mm to 1 meter
Fischer.indd 1 2/11/2008 4:16:52 PM
26
MITIGATION OF UNACCEPTABLE RISK
Tere are two options:
Retest the MOTS/COTS equipment to determine com-
pliance with Def Stan 59-411. Tis is technically a good
approach as any subsequent required protection can be
properly specied, and over-protection will be avoided.
However, the disadvantage of this approach is the cost
implications of the additional testing required.
Remedial re-design can be achieved by adding the appro-
priate protection barriers to reduce the coupled RF elds
or currents the equipment could be exposed to or could
emit to below the levels it was originally required to meet.
Many manufacturers now oer suitable RF shielded racks
and enclosures for this purpose. Tese allow the MOTS/
COTS equipment to be housed without modication such
that line replacement is readily achieved. Te gap analysis
process provides the barrier performance specication
required. Where a piece of modied MOTS/COTS equip-
ment becomes modied-o-the-shelf equipment mar-
keted as a variant or new model, the resulting equipment
needs to meet the EMC Directive with CE marking as a
new apparatus in its own right.
CE MARKING CONSIDERATIONS
Te manufacturer or supplier of military
equipmentwhether bespoke, MOTS or
COTSneeds to comply with those ap-
plicable UK regulations that implement
EU Directives including the EU EMC
Directive.
The current UK EMC regulations
(SI 2006 No. 3418) implementing EMC
Directive 2004/108/EC do not have a
specic exemption for military equip-
ment; whereas, the previous regulations
did include such an exemption (SI 2005
No. 281). Also, the European Commis-
sion is re-examining Article 296 of the
Treaty of the European Community
(TEC)the so-called military exemp-
tion. The expected outcome is that
defence procurement contracts will re-
quire compliance with all applicable EU
directives, unless a specic exemption
is granted under Article 296 TEC on a
case-by-case basis, because of essential
national security interests. Te existing
perception by manufacturers was that a
blanket exemption applied to military
equipment. Tis assumption is incorrect,
and manufacturers need to re-examine
their contracts and to apply CE Marking
unless specically exempted.
Applying the EMC Directives to
defence projects could lead to the du-
plication of compliance-testingonce
for Def Stan 59-411 and once for CE
Markingand could incur additional
costs as well.
However, testing can be minimised
by establishing within the Technical
Documentation the equivalence be-
tween Def Stan 59-411 and commercial
standards using the gap analysis process
described above. Note that the process
can be used in either direction; to show
equivalence of commercial standards to
Def Stan 59-411 or to show equivalence
See whats in the new Military EMC channel today.
The new Interference Technology website organizes
information in the way you need it. If Military EMC
is a key part of your work, you can now find all the
information you need in one place. You will discover
relevant articles, a new discussion forum, news,
standards updates, new products, surveys, white-
papers, videos and much more.
Other Forums Include:
Aerospace EMC
Telecom / NEBS
Automotive EMC
Amplifiers
Antennas
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Military EMC
House Military.indd 1 5/4/2008 4:25:09 PM

Call for Papers, Workshops, and Tutorials

The IEEE Product Safety Engineering Society seeks original, unpublished papers and
tutorials on all aspects of product safety and compliance engineering including, but not
limited to:

Product Safety: Consumer, medical, computer (IT), test and measurement, power
supplies, telecommunication, industrial control, electric tools, home
appliances, cellular and wireless, etc.
Safety Subjects: Electrical, mechanical, fire, thermal, chemical, optical, software,
functional, reliability, etc.
EMC / RF: Electromagnetic emissions, electromagnetic immunity, regulatory,
Introduction to EMC/RF for the safety engineer and compliance
engineer.
Components: Grounding, insulation, opto-couplers, capacitors, transformers,
current-limiters, fuses, power line filters, ferrite, environmental,
electromagnetic emissions, electromagnetic immunity, regulatory,
etc.
Certification: Product safety, electromagnetic emissions, electromagnetic
immunity, environmental, processes, safety testing, regulatory, etc.
Standards Activities: Development, interpretations, status, interpretations, country
requirements, Laboratory Accreditation, etc.
Safety Research: Body physiological responses to various hazardous energy sources,
unique safeguard schemes, electrically-caused fire, etc.
Environmental: RoHS, WEEE, EuP (Energy-using Products), Energy Star,
Packaging Directives, REACH (Chemical), CeC, etc.

Authors Schedule

Intent to present and topic (e-mail) April 29, 2008
Draft e-paper June 1, 2008
Notification of Acceptance July 6, 2008
Complete e-paper August 17, 2008

Send intent to present, topic, and questions to Richard Nute
richn@ieee.org or FAX 1-858-592-2620

See http://www.ieee-pses.org/symposium/index.html#CFP
for more details on requirements and dates.

Chair
Gary Schrempp
Gary_Schrempp@dell.com

Co-Chair
Doug Nix
dnix@ieee.org

Treasurer
Bansi Patel
BansiPatel@eaton.com

Secretary
Brian Greaney
brian.a.greaney@hp.com

Technical Program
Bob Griffin
bobgriff@us.ibm.com

Gary Tornquist
garytor@microsoft.com

Richard Nute
richn@ieee.org

Exhibits/Promotions
Thomas Ha
tom@gmcompliance.com

Exhibit Manager
Sue Kingston
s.kingston@ieee.org

Registration
Diana Krynski
d.krynski@ieee.org

Arrangements/Logistics
Brian Greaney

Daniece Carpenter
Daniece_Carpenter@Dell.com

Communications, Webmaster,
and Program Records
Dan Roman
Dan.Roman@ieee.org

Merchandising
Daniece Carpenter

IEEE Conference Planner
Jessica Lotito
j.lotito@ieee.org

Conferences Vice President
Richard Georgerian
richardg@ieee.org

At-Large Members
Jim Bacher
Jack Burns
Daniece Carpenter
Elya Joffe
Henry Benitez
Ken Thomas

2008 IEEE Symposium
on Product Safety and
Compliance Engineering
Sponsored by the IEEE Product Safety Engineering Society
20-22 October 2008 Austin Marriott North, Austin, TX
www.ieee-pses.org/symposium
IEEE_PSES.indd 1 2/29/2008 4:07:47 PM
DOREY
interferencetechnology.com INTERFERENCE TECHNOLOGY
29
testing & test equipment
Be sure to go to the new, user-friendly
InterferenceTechnology.com to access a comprehensive
list of EMC test laboratories and their capabilities.
MORE ON OUR WEBSITE
of Def Stan 59-411 to commercial standards. Note, however,
that the generally held perception that Def Stan 59-411 satis-
es the majority of the EMC Directive requirements is not
always true. Unsatised requirements need to be addressed
by testing in accordance with commercial standards.
CONCLUSION
Once the Technical Documentation is established, dem-
onstrating compliance with the EMC Directive and the
associated commercial standards, the manufacturer or sup-
plier then makes a Declaration of Conformity and applies
CE Marking. What assistance is available in this process?
Tird-party certication of the technical documentation is
no longer mandatory, and the current EMC Directive has
replaced Competent Bodies with Notied Bodies whose
involvement in assessing the Technical Documentation is
optional. However, given the complexity of performing gap
analysis, a Notied Body provides a low risk solution.
Pete Dorey is a Senior EMC Consultant at TV Product Service Ltd. He
can be reached at PDorey@tuvps.co.uk.
Call us: 631-724-4619 or e-mail us: emc@aratech-inc.com
Searching for the very best
High Performance & Reliability
for HiRF Testing?
TMDs Mighty Amplifiers Deliver!
TMD Technologies Ltd
Swallowfield Way Hayes Middlesex UB3 1DQ UK
Phone 44 (0)20 8573 5555 Fax 44(0)20 8569 1839
www.tmd.co.uk email: wecare@tmd.co.uk
the power in microwaves!
1-18 GHz frequency range (with 6 units)
2 18 kW output power
> 3 kV/m @ 1 metre field strength with
Matched antennas from Q-par Angus, UK
www.q-par.com
RTCA/DO160 A-E (F) category K specification
Excellent after sales support worldwide
Compact and lightweight for mobility
30
testing & test equipment SOL AR I NVERTERS AND THE I SSUE OF EMC COMPLI ANCE
SIEGFRIED W. BEST
Electronik Industrie
Heidelberg, Germany
A
s populations throughout the
world become more aware of envi-
ronmental issues and the necessity
of forestalling further damage and pollution,
attention has been focused on nding eco-
friendly means of generating electric power.
Wind farms are one highly touted solution.
Te other is producing current using the
photovoltaic cells found in solar panels.
One critical subsystem of solar, or pho-
tovoltaic, installations is the solar inverter.
These devices carry out the key step of
feeding the newly generated power into
the power grid. Like every advance in the
use of electricity from incandescent light
to the latest sleek laptops, the ow of elec-
trons brings the possibility of errant energy
resulting in electromagnetic interference.
Of course, the next logical concern is pre-
venting or attenuating this interference and
achieving electromagnetic compatibility or
EMC. Further, the inherent concept of EMC
involves dening certain limits that allow
multiple devices and systems to function
efficiently without causing problems or
suering impairment caused by interfer-
ence. Finally, the ultimate achievement of
this ideal mandates standards that dene
the limits and test procedures and specify
the test equipment that can assure that true
compliance has been achieved.
SOLAR INVERTERS AND EMC: THE
DILEMMA
At present, assuring the EMC compliance of
solar inverters is problematic. Te amount
of power generated is considerable, and
an abundance of caution is the only pru-
dent course. Another complication arises
in dealing with the e ciency ratioi.e.,
maximizing the percentage of the power
generated by the solar installation that
actually makes it into the grid as usable
power. A high e ciency ratio means fast
switching operations with their inherent
steep rise and fall times and interference.
Also, the push for designing economical
solar inverters has resulted in topologies
without transformers. Such designs result
in high voltages and fast rising voltage
spikesalong with the unintended side
eect of EMI.
RELEVANT STANDARDS
Like many other areas of swiftly chang-
ing technologies, EMC regulation of solar
installation equipment has failed to keep
pace with actual developments. At present,
there are no specic standards regulating
solar inverters. In fact, there is no precise
category for these devices. At various
times, solar inverters have been dened
as household appliances; ISM (industrial,
scientic, medical) equipment; or as in-
formation technology components. Tese
arbitrary descriptions would make solar
inverters subject to EN55014, EN55011, or
EN55022. Presently, eorts are underway
to create standards applying specially to
photovoltaic power generation systems.
Committee K 373 of the DKE has divided
eorts into ve discrete projects, creating
standards specically for: solar cells, solar
disks/panels; connectors used in photovol-
Solar inverters and the issue of
EMC compliance
EMC regulation of solar installation equipment has failed to keep pace with
actual developments.

MIL-STD-461F & DO-160F
Pulsed Transient Test Solutions
Look to HVT for turn key transient test solutions meeting the
latest specifications. User Friendly, Repeatable, and Reliable.
From the only completely handheld 30 kV battery operated ESD
simulator to truly off the shelf MIL SPEC and AVIONICS
Single, Multi Stroke, and Multi Burst lightning test solutions. We
have your pulse, couplers, and monitor probes. Everything you
need to verify waveforms and perform testing.
Our patented solid-state high voltage circuits have years of service
behind them in some of the most grueling Avionics, Military,
SPD component, and Regulatory Testing Environments world-
wide. Yes, software with reporting capability can control and
automate your test routines. Contact us today to add some
real firepower to your transient test arsenal.
AVIONICS Single / Multiple Stroke and Multiple
Burst systems. Your complete solution to require-
ments of DO-160 Section 22, Boeing D6-16050,
Airbus AMD07-025, and other manufacturer
specs. Call us if you have Section 23 equipment
requirements.
CONDUCTED SUSCEPTIBILITY modular system
providing complete generator, coupling, calibration,
and waveform verification solutions for the voltage
spike, rectangular, and damped sine wave require-
ments of CS106, CS115, & CS116, DO-160 Sections
17 & 19, Airbus AMD 24C, and many more
NEMP PULSE TEST INSTALLATIONS Turnkey solution
to RS105. Wide range of antenna sizes and high
voltage pulse generators to produce RS105 specified
50 kV/m for almost any EUT size. Sets up in under
4 hours. Excellent field uniformity, reliability, and
reproducibility.
ESD3000 Only 30kV ESD Simulator which
is both battery operated and completely
hand-held, eliminating base unit, external
power supply, and tether. Full range of R-C
discharge values available. Fully integrated
test enclosure with safety features for
testing explosive devices. Guaranteed
waveform conformity to MIL-STDs 331,
1512, 1576, STANAG 4239 and many more.
Tel: 703-365-2330 www.hvtechnologies.com e-mail:emcsales@hvtechnologies.com
HV Tech.indd 1 2/11/2008 3:21:43 PM
32
At various times,
solar inverters have
been def ned as
household appliances;
ISM (industrial,
scientif c, medical)
equipment; or as
information technology
components.
taic systems; verication of simulation
programs of photovoltaic systems; and
building construction of photovoltaic
systems.
Te need for Committee K 373s ef-
forts could not be more evident. Today,
manufacturers of solar inverters claim
compliance and a x the CE Mark to
their devices by asserting that they
meet the requirements of the follow-
ing standards:
Appliance safety in accordance with
IEC 60950-1:2003-08 as well as EN
50178:1998-04
Emi ssions i n accordance with
61000-4-6-3:2002-08 as well as
EN 61000-6-4:2008, as well as EN
61000-6-4:2002-08
Power feedback to the mains in accor-
dance with EN 61000-3-2:2001-12
TEST SYSTEM FOR SOLAR
INVERTERS
One recent development that promises
to clarify the present confusion about
the standardization of solar inverters
is the availability of a complete test
system including a mains simulation
unit (with power feedback) and a PV
(photovoltaic) simulator unit (Figure
1). Te PV simulator mimics the be-
havior of the solar panels. A system
of precise controls allows the user to
adjust or readjust the program quickly
to simulate the characteristics of dif-
ferent types of solar panels and their
varying power outputs. Both stable
tion unit is a four-quadrant amplier,
an AC/DC voltage source needed for
the eld of low-frequency conducted
phenomena. Tis amplier is based
on a linear push-pull design. Some of
features of this amplier include:
Very low harmonic distortion even
under extremely non-linear condi-
tions
Fast slew rate of >52 V/s (rise time
of <5 s at 230 Vrms as required by
EN 61000-4-11)
Operation from DC up to 5 kHz of
large signal bandwidth (-3 dB)
optionally to 15 or 30 kHz
Small signal bandwidth up to 50 or
100 kHz
Te heart of the unit devoted to
measurement is an analyzer reference
system (ARS) for the analysis of har-
monics and icker in accordance with
IEC 61000-3-2 and IEC 61000-3-3.
Within the ARS, the digital ickme-
ter meets the the requirements of
IEC 61000-4-15, and the real time
harmonics analyzer accords with IEC
61000-4-7. Flicker measurements are
made on two channels and are provid-
ed with a calibrated mains impedance
network. An adjustable mains imped-
ance simulation system is available
especially for currents >16 amps.
RECOVERY UNIT
If solar inverters, as well as other
equipment that feed power into the
gridsuch as wind-driven generators
and combined heat and power plants
are to be measured accurately and ac-
cording to the relevant standard, the
mains simulation system of the test
setup must be able to withstand high
currents. Actually, the power from the
simulator (the testing substitute for
power from the actual mains) when fed
into test system is a loss to the system
and contributes to overall power losses
when operated in a power/current
sink mode. Load resistors switched in
parallel to the amplier output will
convert the supplied power to heat.
Tus, maximum heat generation will
be reached at only 30 percent of rated
power.
On the other hand, the recovery
unit functions very differently and
brings about an increase in sink power
Mains Supply
75% is
recuperated
Recuperation unit
PV-Simulator
EUT

Mains-Simulation 3phase

Measurement
System
Figure 1. Design of the test system for solar inverters with mains components that include a
mains simulation unit, a photovoltaic simulator, and a power recovery unit.
and turbulent weather conditions
can be simulated accurately (Figure
2). Tis latter feature provides a key
parameter for EMC testingrepeated
measurement under precisely the same
conditions.
Te output of the PV simulator is
fed into the mains simulation unit,
which also includes measurement
instrumentation calibrated to check
emissions and immunity limits in ac-
cordance to the relevant EN standards.
A recovery unit allows for a consider-
able degree of heat dissipation, thus
the test system is suitable for solar
inverters of a few kW up to and over
100 kW.
THE BASIC EMC SYSTEM
Te basic unit for the mains simula-
RF isolation is nothing new for Ramsey Electronics. In 1997 Ramsey took the technician
out of the large expensive shielded screen room and put his hands and eyes into a
portable RF Benchtop Screen Room with our patented STE series RF Shielded test
enclosures. With thousands placed in service worldwide, our STE technology has
become the standard for efficient and cost effective RF isolation testing for cell phones,
pagers, PDAs, wireless LAN devices, and a host of other wireless devices that need to be
isolated from the outside RF world.
That legacy continues with a wide variety of STEs designed for virtually any wireless
hardware or application testing. Our exclusive double lip gasket technology assures an
RF tight seal each and every time. Steady-hold hinges maintain the opening at any loca-
tion and prevent gasket compression due to prolonged closure pressure when not in use.
From our exclusive hands-on RF shielded gloves which give you full access to the DUT, to
our automatic RF and/or AC inhibits, we give YOU the options you need, while still main-
taining near off-the-shelf delivery schedules within a budget you can live with!
When you need to be isolated from the rest of the RF world...weve got you covered!
Wireless Device Testing To 18GHz
Over 100dB Isolation Available
802.11a/b/g/n, WLAN, & WiFi
Cellular, PCS, GSM, 3G, & UMTS
Pagers, Transmitters, & Receivers
WiMax, Bluetooth, Wibree, ZigBee
RFID
PCMCIA WLAN Cards
Notebook & Tablet Computers
Blade Servers & Dense Packs
Forensics Isolation
Trust YOUR RF Testing To Our
Proven Patented Design!
RAMSEY ELECTRONICS, LLC. 590 Fishers Station Drive, Victor NY USA
(585) 924-4560 (585) 924-4555 FAX
www.ramseytest.com
Test Equipment Solutions for the Wireless Industry
Ramsey.indd 1 2/15/2008 5:35:43 PM
34
Figure 2. The top diagram shows the current/voltage curve while
the bottom diagram shows the characteristic power curve with the
maximum power points along with a secondary maximum at partial
shading effects.
and energy recovery. Te recovery unit takes the place
of the load resistors and functions as a resistor in which
impedance is constantly being adjusted to the optimum
value, thus absorbing the power supplied by the EUT. Tis
adjustment takes place in less than a ms. In summary, the
recovery unit assures constant optimal impedance and fast
changes in feed-in power. It also assures that power is not
converted into heat and that power will ow into the grid
at a high e ciency ratio.
Te recovery unit is connected in parallel to the 4-quad-
www.emtest.com
EM TEST
HIGHLIGHTS 2008

A
L
L
N
E
W

IN
2
0
0
8
!
> New equipment
> New benets
> All equipment with USB interface
> All software packages are
Windows Vista compatible
> New design
BEST
35
Testing for EMC compliance
remains an enduring challenge. New
See whats in the new Antennas channel today.
information in the way you need it. If Antennas
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Ant ennas
products and new technologies
demand innovative test equipment
and test procedures. Find the
information you need readily
by visiting the completely
revamped, user-friendly
InterferenceTechnology.com. Check
the Testing section of Channel
Guides, and go to Directories for
a complete listing of test labs and
testing equipment.
MORE ON OUR WEBSITE
rant amplier. When the amplier is
in source mode operation, the recovery
unit remains inactive, and there is no
eect on the amplier. As soon as the
current is introduced, it passes im-
mediately into the grid, bypassing the
4-quadrant amplifier. This method
assures recovery of energy with an ef-
ciency rating of 75 percent. For accu-
rate simulation of actual operation, it is
important that this process takes place
in real time and that any current shape
can be accepted. Te amplier is the
determinant of the simulated mains
voltage and remains unaffected by
the recovery unit. Overall, this system
topology and the resultant decreases in
losses boosts the performance of the
amplier by a factor of ve.
CONCLUSION
Using the test system described, a user
can determine the EM performance
of solar inverters under an extensive
range of input conditions and over
widely varying mains conditions. Te
photovoltaic (PV) simulator offers
a wide selection of testing options
that allow users to test for other key
performance parameters including
the e ciency of the maximum power
point (MMP) tracking and surveil-
lance of power generation. These
features assure that the PV generator
provides continual performance at the
maximum power point.
Siegfried W. Best serves as editor-in chief
of the well known German technical periodical
Elektronik Industrie, as well as the editor-in
chief of Automobil Elektronik. He began his
technical career in the German Army, where he
served as a master sergeant working in wireless
communications. Earlier in his career, he held
several positions with Siemens. He is the author
of numerous technical articles and three books
works that cover short wave communications,
active antennas, and optical communications.
Otto Frey provided the English transla-
tion of this article. He spent 25 years with
Haefely as an EMC export manager. He is
now with the Swiss associate of KILOSENSE,
a China based company that provides EMC
consultation and representation, focusing
largely on exports to China and India. He can
be reached at otto_ f rey_2000@yahoo.com.
The complete test system including a mains
simulation unit (with power feedback) and a
PV (photovoltaic) simulator unit used in this
article was designed and manufactured by
Spitzenberger & Spies, Viechtach, Germany.
Let me know what you think.
36
testing & test equipment FCC DYNAMI C FREQUENCY SELECTI ON CERTI FI CATI ON I SSUES
DAVID A. CASE NCE, NCT
Cisco Systems, Inc.
Richland, OH
S
ince July 20, 2006, systems op-
erating under FCC Part 15.407, spe-
cically in the 5250- to 5350-MHz
and the 5470- to 5725-MHz bands, are
required to support Dynamic Frequency
Selection (DFS) before the products can be
certied. As part of the approval process,
the FCC must carry out a 100-percent pre-
audit test procedure on the DFS master
devices. Now that the FCC is in the second
year of the certication program, the pro-
gram is no closer to being transferred to the
Telecommunication Certied Bodies than
it was at the outset. Further, those expect-
ing a quick review time nd themselves in
a program that can take up to ve months
or more. Tere are several reasons for this,
and most of the issues are not FCC related,
but test lab and manufacturer related. Tis
article will discuss some of the issues that
have helped slow the program down.
SHORT HISTORY OF DFS
Te requirements for DFS can be found in
ITU-R Resolution 229, which addressed
allocating the 5150- to 5350-MHz and
the 5470- to 5725-MHz bands for mobile
systems. To facilitate band sharing, two
cognitive radio techniques were adopted.
Te rst is TPC (Transmitter Power Con-
trol); the second is Dynamic Frequency
Selection.
As dened, the master (control system)
must have radar detection capabilitiesi.e.,
DFS. Client cards that support peer-to-peer
must also be DFS capable.
Basically, DFS functionality performs
a channel availability check before using
the channel and then listens in the quiet
periods to determine if a radar signal is
present. If one is present on a given channel,
the master that has DFS capabilities issues a
control signal and then moves the clients o
the channel that has the radar signalthus
averting any interference with the radar. As
part of DFS, the systems also make sure that
the channels are loaded evenly.
DFS PRE-GRANT AUDIT TESTING
ISSUES
What causes the lengthy turnaround times?
Actually, there are a number of reasons for
the sluggish pace. First, any audit program
is usually slow, and the FCC is constrained
by budget and resource limitations and can
only audit the products serially. A second
reason is that the National Telecommuni-
cations and Information Administration
(NTIA) insists that the FCC lab perform the
complete DFS test, a process that can take
several days even if no problems exist.
One of the major reasons for the lengthy
audit period is unrelated to any lack of
FCC resources or NTIAs insistence on
a 100-percent audit. Some problems are
caused by the test labs and/or manufac-
turers who fail to understand some cru-
cial issues. For example, one issue is that
manufacturers do not ship everything
needed for the audits or fail to enclose
complete instructions. Te FCC lab must
then spend additional time getting the unit
A second look at the FCC dynamic
frequency selection certif cation issues
Both manufacturers and test labs must decide on the proper test
procedures for DFS products.
Article 28 ag_08.indd 36 5/6/2008 12:03:33 PM
Millions of people worldwide depend on CPI Communications Amplifiers for superior
performance, reliability and
quality. We have a proven
50-year track record of consistent
performance, service and support.
We're the quality supplier in Communications
Klystrons and HPA's: Power Output up to 3.5 kWs is available at S, C, X, Ku and Ka bands.
We feature Solid State Bricks and amplifiers: Power Output up to 400 watts is available at L, S, C, X and Ku bands.
We can help you select the right microwave product for your application.
Communications & Power Industries Canada, Inc.
45 River Drive / Georgetown, Ontario / Canada L7G 2J4
TEL: 1-905-877-0161 / FAX: 1- 905-877-5327
For Sales offices worldwide please e-mail:
marketing@cmp.cpii.com
WEB: www.cpii.com/cmp
Meeting the new Automotive and
Military EMC standards (200V/m
CW and 600V/m pulsed) with CPI
high-powered TWT amplifiers.
EMC facilities worldwide depend on CPI
amplifiers for superior performance,
reliability, and quality.
CPI has a proven
track record of con-
sistent performance,
service, and support.
EMC Facilities Worldwide
Depend on CPI Amplifiers Every Day
CPI is the only quality
supplier of both the
TWT and the TWT
amplifier for EMC
testing with CW and
pulsed amplifiers from 1.0-95.0GHz and power levels
exceeding 2.0-kWatts over selective frequencies.
For high-powered CW and
pulsed EMC testing.
satcom di vi si on
CPI.indd 1 3/17/2008 1:43:35 PM
38
to operate correctly or must wait for
additional equipment to complete
the setup. Moreover, the FCC will
not discover these omissions until
the unit is ready for audit. Some of
the specic issues include: the lack of
setup instructions, no test mode, an
insu cient test mode, no test mode
instructions, and missing peripheral
equipment. Other problems include
devices that have been setup only for
conducted testing and failure to sup-
ply antennas with the device. By far,
the failure to indicate a test mode is
the most signicant problem.
In some cases, the systems sent
simply do not work, or have other
technical compliance problems that
delay the audit test and hold up the
next unit in the queue. Sometimes, the
manufacturers test software will not
turn o the 30-minute channel lock
out-time, or it will turn o coming up
on a random channelthus making it
impossible to select the same the chan-
nel again for testing. (Tese problems
are related to test mode issues.)
Te biggest show-stopper accord-
ing to anecdotal information, is the
high percentage of failures that occur
during the initial DFS pre-grant audits.
Certainly, an occasional failure may
occur; but when a large percentage of
productsperhaps 35 to 40 percent
of the systems has problems, there is a
major cause for concern. As discussed
in a recent Telecommunications Certi-
ed Body training class, such failures
include, but are not limited to, the
following:
Radiated Testing vs. Conducted
Testing
Treshold not correct
Must account for cable loss-
es
Manufacturers tolerance in
antenna gain
Include minimum gain antenna
w/sample requests
Non-linearity in statistical tests
across the radar detection BW
40-MHz BW (Channel Bonding)
compliance issues statistical tests
differ greatly when compared to
20-MHz BW mode
Channel Move Time packet trans-
mission to stop within 200 ms
30 Minute Non-occupancy no
emissions permitted
NTIA ISSUES
Any possibi l it y of changi ng and
streamlining the FCC audit program
lies, at least in part, with the NTIA
since this agency is charged with pro-
tecting the government radar signals.
To safeguard radar, the NTIS contin-
ues its practice of monitoring available
DFS devices bought directly o the
shelf. The outcome of these NTIA
audits could have a big impact ei-
ther positive or negativedepending
on how the chosen products comply.
Also, further FCC testing of some
units has resulted in a clarication
by the FCC on client card testing
requirements.
ADDRESSING THE ISSUES
In regard to the entire telecommuni-
cations industry, both the manufac-
turers and test labs should acquire
a better understanding of the issues
and should decide on the proper test
procedures for these products. For
example, the FCC performs radiated
not conductedtesting. If a lab carries
out conductive testing and the DFS
threshold is set to detect with a cer-
tain gain antenna, the tester needs to
make sure that the antenna cable loss
is taken into account and must verify
that the antenna used actually has the
correct gain. Tis verication can be
achieved by performing an over-the-
air test (radiated) to see if it actually
detects at that threshold.
Test labs must be aware of changes
to the procedures as well. Specifi-
cally, as technologies evolve, so must
the FCC test procedures. The FCC
and industry have discovered a small
problem with the detection of certain
radar signals. In the 40-MHz 802.11
channels, problems have arisen at the
band edge. Consequently, there is now
an FCC guidance note that amends the
test procedure so as to verify that the
systems do detect the radar signals in
this mode.
CONCLUSION
Te simple truth is that the testing is
complicated, and additional industry
training is needed that focuses on the
accurate performance of these tests.
This issue has been discussed with
the FCC. It has been proposed that
the FCC should hold a DFS training
session for test labs similar to that
which was held for labs performing
SAR testing. Until such time as the
telecom industry can resolve the high
failure rate of initial audits, and the
NTIA audits demonstrate that the
systems can pass the tests, delays in
the approval process are inevitable.
ENDNOTES
1. D. Case, The FCC Dynamic Frequency
Selection Test Procedure, Interference
Technology Design Guide and Directory,
2006.
2. Costs of the test set up can range up to
$100,000 or more.
3. FCC KDB #: 594340, Dated 03/05/07
4. October 2007 TCB workshop slides 8 and
9 (client Beacon Test or slides 10 15 (Test
Issues).
5. October 2007 KDB Workshop, slide 12.
BIBLIOGRAPHY
47 Code of Federal Regulations Part 15.407
(2005)
ITAC-R US DFS Test procedure Rev 7
ITU-R Resolution 229
ITU-R M-1652
David A. Case NCE, NCT is a Technical
Leader for Cisco Systems Compliance and
Certication Group. He was a member of the
U.S. working group that developed the DFS test
procedure and is a member of a number of tech-
nical standards working groups. He currently
serves on the board of Directors for the Mobile
Manufacturers Forum.
Testing to exacting standards can
involve setup challenges, equipment
problems, doubts on interpreting
results. Help is available. Just explore
the new InterferenceTechnology.
com. Listed videos and white papers
offer guidance. The Calendar details
upcoming events including seminars
and hands-on workshops, and the
Standards Update section informs
you of the latest changes in relevant
standards.
MORE ON OUR WEBSITE
Ophir.indd 1 3/18/2008 3:08:28 PM
40
SUPPLIERS TESTING & TEST EQUIPMENT
A.H. Systems, Inc. ............................................................ 13, 49
Chatsworth, CA; 818-998-0223; www.AHSystems.com?it
Acme Testing Co. ................................................................. 195

Acme, WA; 360-595-2785; www.acmetesting.com
Advanced Test Equipment Rentals ..................................... 34
San Diego, CA; 888-404-2832; www.atecorp.com
ARA Technologies .................................................................. 29
Smithtown, NY ; 631-724-4619; aratech-inc.com
AR RF/Microwave Instrumentation .......7, 58, 59, 67, 91, 191
Souderton, PA; 215-723-8181; 800-933-8181 www.arww-
rfmicro.com
Com-Power Corporation ....................................................... 61
Brea, CA; 714-528-8800; www.com-power.com
CPI (Communications&Power Industries) Satcom Div. ... 37
Georgetown, ON, CANADA; 905-877-0161; www.cpii.com/
cmp
CSA International .................................................................. 71
Toronto, CANADA; 866-797-4272; www.csa-international.
org
Dayton T. Brown, Inc. ............................................................ 79
Bohemia, NY, 631-589-6300, www.dtbtest.com
DNB Engineering, Inc. ................................................... 81, 159
Fullerton, CA; 714-870-7781; www.dnbenginc.com
Electronics Test Centre (Kanata) ......................................... 85
Kanata CANADA; 613-599-6800; www.etc-mpb.com
EMC Certication Dr. Rasek ............................................... 195
Ebermannstadt, GERMANY; + 49-9194-9016; www.emcc.
de
EMC Consulting Dr. Rasek .................................................... 87
Ebermannstadt, GERMANY; + 49-9194-9016; www.emcc.
de
Continued on page 86

www.emtest.com
THE NUMBER ONE IN EMC

TES
T
TH
E B
ES
T!
EM TEST is the worlds leading manufacturer and supplier of equipment
and systems for transient and conducted EMC testing. We have over 20
years of experience from working with the electric and electronic, auto-
motive, telecom, aerospace, and military industries.
EM TEST stands for quality and reliability, for user convenience, and per-
formance. We provide both full-compliance solutions and real return on
investment. As an active member of numerous standards committees
and working groups EM TEST is one of the most competent partners for
EMC testing in the market. You will nd our expertise and innovative
spirit in each of our productsfor your benet, today and tomorrow.
See whats in the new Telcom/NEBS channel today.
information in the way you need it. If Telecom/NEBS
Aerospace EMC
Military EMC
Automotive EMC
Amplifiers
Antennas
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Telecom/NEBS
House NEBS.indd 1 5/4/2008 5:09:45 PM
42
testing & test equipment RTCA/DO-160F
ERIK J. BORGSTROM
Environ Laboratories LLC
Bloomington, MN
R
TCA/DO-160F, Environmental
Conditions and Test Procedures for
Airborne Equipment, prepared by
RTCA Special Committee 135, was issued
on December 6, 2007, superseding the pre-
vious version, DO-160E.
[1]
DO-160F covers
standard procedures and environmental
test criteria for testing airborne electrical
and electronic equipment (avionics). Te
tests specified in DO-160F are typically
performed to meet Federal Aviation Ad-
ministration (FAA) or other international
regulations covering the equipment that is
installed on commercial aircraft.
Te tests and test levels/limits (also re-
ferred to as Equipment Categories) found
in DO-160F are applicable to virtually ev-
ery type of aircraft in use today, including
small general aviation aircraft, business jets,
helicopters, regional jets, and Jumbo Jets
such as the newest airliners from Airbus (the
A380) and Boeing (the 787).Te document
includes 26 sections and three Appendices,
but it is Sections 15 through 23 and also Sec-
tion 25 that cover EMC. Other examples of
tests covered in DO-160F are: temperature;
altitude; vibration; sand/dust; power input;
radio frequency susceptibility; lightning;
and electrostatic discharge.
Te creation and revision of DO-160F is
coordinated with the European Union ver-
sion of RTCA, EUROCAE. As a result of this
trans-Atlantic cooperation and joint eort
by the two organizations, RTCA/DO-160F
and its European twin, EUROCAE/ED-14F,
are identically worded. Te purpose of this
article is to provide an overview of each of
the sections that deal with EMC in DO-160F.
Changes in each section since the release
of DO-160E will also be summarized; and
nally, we will take a look into the crystal
ball to speculate on the nature of future
revisions to DO-160.
SECTIONS 13:
Te rst three sections cover the Purpose and
Applicability (Section 1) of DO-160, provide a
Denition of Terms (Section 2) used through-
out the document, and give Conditions of
Tests (Section 3). Tese rst three sections are
referenced in all of the subsequent sections
of DO-160 and provide the general informa-
tion and guidance needed for performing the
specied tests accurately.
Whats New for DO-160F?
In Section 2, additional guidance cover-
ing Applicability of Test Results.
In Section 3, additional guidance cover-
ing EUT Conguration for Susceptibility
Tests.
SECTION 15: MAGNETIC EFFECT
Tis MC (for Magnetic Compatibility
as opposed to EMC for Electromagnetic
Compatibility) test is performed to deter-
mine to what extent the equipment-under-
test (EUT) will deect a compass needle, or
will aect the indication from a compass
sensor, also known as a Flux Gate.
A standard compass that has a large
enough dial to read one degree of needle
New EMC requirements for commercial
avionics: RTCA/DO-160F
The test levels, requirements, and procedures are intended to ref ect the
state-of-the-art in aviation technology and EMC testing methodology.

testing
Ingenium
Introducing one of the top EMC Testing Laboratories in North America ...
Military/Aerospace, Wireless, Automotive and Commercial EMC Testing located in Rockford, Illinois
8 independent Mil-Standard/Aerospace test chambers - 200 V/m from 10kHz to 40GHz
Comprehensive power conversion and motor drive capacity - 500HP
State-of-the-art 10-meter semi-anechoic chamber
8,000 lb turntable and exhaust air exchange for IC Engines
Pre-compliance chamber
Dont miss Ingenium Testing Services Grand Opening event on May 1, 2008!
For registration and information visit www.ingeniumtesting.com
Ingenium.indd 1 2/14/2008 2:48:27 PM
44
deection is the only test equipment
required. Te EUT is simply moved
closer to the compass on an East-West
line until one degree of deection away
from magnetic North is observed. Te
separation distance is then measured
and the Equipment Category is de-
termined.
Equipment Classes
Tere are ve equipment categories (Y,
Z, A, B, and C) that apply to installation
separation distances between the EUT
and compass (or compass sensor) of less
than 30 centimeters to more than 300
centimeters.
New Category Y for 0 to 30 cm in-
stallation separation distance.
Much needed descriptions of each
equipment category has been added
to Section 15.1 Purpose of Test
along with a discussion of how the
test results are used to determine
how close the EUT may be installed
to a compass (or compass sensor).
Te use of an equivalent magnetic
sensor was added, to allow for the
use of electronic compasses as op-
posed to the typical free magnet
compass.
SECTION 16: POWER INPUT
Although an argument can be made
that Power Input (or Power Quality
as they are referred to in other stan-
dards) tests are not truly EMC tests,
they are included here for two reasons.
First, power/input/quality tests are of-
ten performed in the EMC lab by EMC
test personnel. Second, in the latest ver-
sions of DO-160, the frequency ranges
for some of the tests fall well within
the parameters of typical EMC tests,
and the test equipment used is similar
to that used in many other true EMC
tests found elsewhere in DO-160 and
other EMC standards.
The tests in Section 16 are per-
formed to determine that the EUT
can operate as required during all of
the dierent conditions of AC and/or
DC power variations that occur during
normal and emergency aircraft opera-
tion. In addition, Section 16 includes
tests to verify that the EUT does not
have a negative inuence on the aircraft
power system that would be harmful
or would otherwise cause degraded
performance in other installed equip-
ment.
One interesting note about Section
16 is the fact that it is now the only
section of DO-160 that contains re-
quirements and tests that cover both
the susceptibility of the EUT (such as
surge, dropout, frequency transients,
etc.), and the generation of harmful
interference (emissions) from the EUT
(such as current harmonics, re-generat-
ed energy, power factor, etc.).Tis fact,
along with the increasing complexity
and variety of modern aircraft power
systems, and the sheer size of Section
16 (61 pages in DO-160F), has spurred
some discussion on SC-135 about the
possibility of spinning o the power
input/quality requirements into a com-
pletely dierent documentalthough
no immediate change is currently un-
der consideration.
To keep pace with the state-of-the-
art in aircraft power system design,
Section 16 has seen dramatic changes
over the last decade. With the new
power systems in use on the newest
transport aircraft, the changes made
for DO-160F are quite extensive.
Change 2 to DO-160D, issued June
12, 2001, revised Section 16 fairly
dramatically, by including new tests,
and modications to existing testing,
to address the issues of AC harmonic
current content and variable frequency
AC power systems.
[2]
In DO-160E, the
entire section was re-ordered so that
all the AC tests were in one subsec-
tion and all DC tests were in another
subsection, making Section 16 easier
to use and understand. DO-160E also
introduced some new tests, such as a
DC content test for AC powered equip-
ment, and a new subsection covering
Load Equipment Inuence on Aircraft
Electrical Power Systems. In DO-160F,
even more tests are required, for both
AC and DC powered equipment. Ad-
ditionally, a whole series of new tests
and test levels to cover 270-volt DC
power systems has been added, along
with a greatly expanded list of tests to
cover the EUT inuence on the aircraft
electrical power systems.
DC Input tests
On DC inputs, there are tests that
cover:
Steady-state over- and under-voltage
conditions
Ripple voltage
Momentary power interruption
Momentary sags and surges
Exposed voltage decay time (270
volt only)
Inrush current
AC Input tests
AC inputs are subjected to the follow-
ing tests:
Steady-state over- and under-voltage
conditions
Steady-state over- and under-fre-
quency conditions
Steady-state phase unbalance (three-
phase power)
Voltage and frequency modulation
Voltage and frequency transients
Momentary power interruption
Momentary sags and surges
DC oset and voltage distortion
Harmonic current emissions
Phase unbalance (three-phase in-
puts)
DC current content
Inrush current
Current modulation
Power factor
Equipment Categories
Tere are three equipment categories
(A, B, D, or Z) that indicate the type of
power used by the equipment and the
type of AC and/or DC power source
with which the equipment is compat-
ible. For AC powered equipment, an
additional designator, noted in paren-
theses following the category designa-
tor, is a two-character code indicating
that the equipment has been tested for
use with constant frequency (CF), nar-
row variable frequency (NF), or wide
variable frequency (WF).
Up to four additional category
designators are also used to indicate
testing for:
AC current harmonics (H)
AC current modulation (L)
AC power factor (P)
DC current ripple (R)
AC or DC inrush (I)
1-800-WOP DLA8
|otete'-et|se'o.co/ec
ee's to a stoog cuo o ea||t. |o oute to a'et
|auoc|, ao oooucts |ose t|e| .a. Coo||cat|oos
cao be. aoo bu||o.
T|at's .| ou oeeo ao ||C |eaoe, a oatoe .|o
oes a oe oo.eu| b|eoo o soeeo, eoet|se aoo
sev|ce. /t |otete', .e oe oueue t|es
as ast as t|ee oas, 2+-|ou tuoaouoo
oo ouotes aoo sae-oa test oata. Cu
aovaoceo soeeo |s a|so a uoct|oo o |ocat|oo.
\|t| t|e ost ||C ac|||t|es |o t|e |ooust, +0 aoo
couot|og, ou cao get |ee aoo get to |t, aste. |o
|T to |ooust|a|, autoot|ve to eo|ca|, ou'|| |ave
o|ect access to eog|oees .|t| ooouct aoo |ooust-
soec||c oo|c|eoc as .e|| as t|e g|oba| acceo|tat|oos
to eosue ou test|og uos soot||.
/s ou test|og oeco|ates, ou'|| eo,o t|e oe's
o suoe|o sev|ce. \e ocus oo c||eot cooat|b|||t,
gett|og to 'oo. ou aoo ou ooouct, ceat|og a
co||aboat|ve atoso|ee aoo t|eo oe||ve|og test
eoo ts oo||oe .|t| | TestCeota|
.
|t's eooug| to |u a e. bas o 'ta'e e
out to t|e test |ab' oo t|e .a |o.
To acce|eate ou ||C test|og, ca|| +-800-\C||||/3
tooa. C, v|s|t lntertek-etlsemko.com/emc aoo .atc|
ou ooouct
|se aoo s||oe.
B0* !0 C|!
!0 MKK|! |!|K.
0K
t:
0K
H / o.a/ ja
//o //o./ /o o///a, ao
/.//,.o /a 1/J
ond more thon 1,000 reosons
to co|| us jor LMC.
. t.ss
L
Intertek.indd 1 2/11/2008 4:27:50 PM
46
New category (D), tests, and test
levels covering 270-Volt DC pow-
ered EUTs.
Loss-of-Phase test for three-phase
AC powered EUTs.
Many additional tests in the Load
Equipment Influence on Aircraft
Electrical Power Systems section.
Specic tolerances for all test pa-
rameters
Speci f ic def i nition of Manual
Reset
SECTION 17: VOLTAGE SPIKE
Tis test determines whether the EUT
can operate as required during and/or
after voltage spikes are applied to the
AC and/or DC power input(s). Any
method of generating the spike may be
used, provided that the pulse produced
has a duration of at least 10 micro-
seconds, a rise-time of less than two
microseconds, and a source impedance
of 50 ohms. A minimum of 50 voltage
spikes is applied within one minute.
Tis test is very similar to MIL-STD-
461F test method CS106.
[3]

Tere are two equipment categories.
Te Category B test level is twice the
AC (rms) and/or DC line voltage (or 200
volts, whichever is less). Te Category
A test level is 600 volts.
Requirement for testing all inputs
simultaneously if they are all con-
nected to the same power bus.
Tree-phase power test setup.
Clarication of source impedance
tolerance.
SECTION 18: AUDIO
FREQUENCY CONDUCTED
SUSCEPTIBILITYPOWER
INPUTS
Tis test is performed to determine
that the EUT will operate as specied
when audio frequency interference is
applied to the AC and/or DC power
input. Te test setup and procedure
are nearly identical to MIL-STD 461F
test method CS101, with the only dif-
ference being the actual test level and
frequency range. Te audio frequency
interference is transformer-coupled
onto each power input lead, and the
peak-to-peak voltage level of the in-
terference signal is measured across
the power input and return leads.
Test levels are up to 8 percent of the
nominal AC input voltage, and the
frequency range is as broad as 10 Hz
to 150 kHz.
Te EUT must be tested while oper-
ating at both minimum and maximum
current draw (if applicable) and at the
AC power frequency extremes if des-
ignated for use with variable frequency
systems. Te frequency scan rate is 30
steps per decade, with a one-minute
dwell time at each frequency.
Tere are three DC power equipment
categories (R, B, and Z) that indicate
the type of power used by the equip-
ment and the type of DC power source
with which the equipment is compat-
ible. The two AC power equipment
categories are specified (R and K).
Category R is used with an additional
designation (a two-character code),
placed in parentheses following the
category designator, indicates that
the equipment has been tested for use
with constant frequency (CF), nar-
row variable frequency (NF), or wide
variable frequency (WF). Category
K designates that the EUT has been
tested for use with any type of AC
power input and has been tested to a
higher level of voltage distortion than
category R.
Tree-phase power test setup.
270-VDC test category/level has
been added (Figure 1).
Common-mode test (at 2x the dif-
ferential-mode level) for 270-VDC
Category Z
Requirement for testing all inputs
simultaneously if they are all con-
nected to the same power bus
SECTION 19: INDUCED SIGNAL
SUSCEPTIBILITY
Te tests in this section are performed
to determine that the EUT can operate
as required when the equipment and
interconnecting cables are subjected
to audio frequency electric fields,
magnetic elds, and transient voltage
spikes. Te test levels for the intercon-
necting cable tests are determined by
the length of wire that is exposed to
the radiating wire. For the inductive
switching transients (induced spikes)
test, the exposed length is either 1.2 or
3.0 meters, with the amplitude of the
spikes applied to the radiating wire be-
ing at least 600 volts peak-to-peak.
For the magnetic and electric elds
induced into cables, the test level is
dened as the product of the length of
interconnecting cable that is exposed
to the radiating wire and the rms volt-
age or current applied to the wire. Tis
test level is designated volts x meters
(V-m), or amps x meters (A-m). For
example, Category Z requires an elec-
tric eld test level of 1800 V-m, which
is typically obtained by exposing three
meters of cable to a radiating wire
with 600 volts rms applied to it. If,
because of space restrictions, less than
three meters of cable is exposed to the
radiating wire, the voltage applied to
the wire must be increased so that the
test level of 1800 V-m is achieved. An
exception to this requirement arises
when the actual length of the cable in
the nal installation is known to be
less than 3 meters. In such a case, the
test level may be reduced in proportion
to the ratio of the reduced coupling
length.
Te frequency ranges for the swept
frequency tests are determined by the
equipment category specied. Te fre-
quency scan rate is 30 steps per decade,
with a 10-second dwell time at each
frequency.
Te equipment categories are indicated
by two characters. Te rst character
(A, B, C, or Z) indicates the tests per-
formed and the severity level of the
tests. Te second character (C, N, or
W) indicates the AC power system
operating frequency (constant, narrow
variable, or wide variable) with which
the EUT is compatible.
No signicant changes.
1
EMC
EMI
EMP
EMR
EMV
ESD
EMCON
HERF
HERO
HERP
HIRF
TEMPEST
COMSEC
LIGHTNING
P-STATIC
RADHAZ
RF WEAPON
For more information or for full brochure
contact:
John Dawson
301-342-4797
DAWSONJL@NAVAIR.NAVY.MIL
Kurt Sebacher
301-342-1664
SEBACHERKK@NAVAIR.NAVY.MIL
5.4.4 Mark Mallory
301-342-1663
MARK.MALLORY@NAVY.MIL
Kurt Sebacher
301-342-1664
KURT.SEBACHER@NAVY.MIL
Navair.indd 1 2/11/2008 2:13:05 PM
48
SECTION 20: RADIO
FREQUENCY SUSCEPTIBILITY
(Radiated and Conducted)
Tese tests are performed to determine
that equipment will operate as specied
when the EUT and its interconnecting
cables are exposed to radio frequency
interference. Continuous wave (CW),
square wave AM (SW), and pulse mod-
ulated (PM) RF signals are required. A
Line Impedance Stabilization Network
(LISN) must be inserted in series with
each power lead and ungrounded power
return lead, with a 10-F capacitor
connected between the power input of
the LISN and the ground plane. Unless
otherwise specied, interconnecting
cables shall be at least 3.3 meters in
length, and power leads should be no
more than one meter in length for
these tests.
Conducted Susceptibility
Te RF conducted susceptibility test
procedure is similar to MIL-STD-461F
test method CS114. RF interference is
coupled into the EUT interconnect-
ing cables and power leads using an
injection probe that is calibrated (in
a 50-ohm xture) to the required test
level prior to performing the test. Te
amount of RF power applied to the in-
jection probe that is required to achieve
the specied RF current in the xture
is recorded for each test frequency. Tis
calibration table, showing RF power
required at a given frequency, is then
used during the actual test.
During testing, the RF current that
is induced into the cable or lead under
test is monitored with a calibrated RF
current probe, and the RF power ap-
plied to the injection probe is increased
until the appropriate current level (as
dened by the applicable equipment
category used) is reached. Te amount
of RF applied to the injection probe is
limited to no more than 6 dB above the
power level recorded during calibra-
tion in the 50-ohm calibration xture.
Te test frequency range is 10 kHz to
400 MHz, and two scans are typically
required for each testonce with a
CW signal, and then again with a SW
modulated signal.
Radiated Susceptibility
The RF radiated susceptibility test
procedure is similar to MIL-STD-
461E test method RS103. Te EUT and
its interconnecting cables and power
leads are exposed to RF radiated elds
in the frequency range of 100 MHz to
18 GHz.
Tere are two RF radiated suscepti-
bility test methods allowed in Section
20. The first uses a standard semi-
anechoic chamber as in MIL-STD-461F
test method RS103. Te chamber must
be lined with RF absorber, and the
minimum performance of the absorber
is specified. The minimum antenna
distance is one meter, and multiple
antenna positions are required when
the beamwidth of the antenna does
not totally cover the system. If the
EUT has apertures, connectors, seams,
or other points of penetration of the
EUT enclosure, all of these must be
exposed directly to the test antenna,
necessitating multiple EUT positions
during testing.
Calibration of the RF field prior
to placement of the EUT is required.
Te RF power applied to the antenna
input that is required to achieve the
specied test level is recorded for each
antenna used. During EUT testing,
this calibrated power level for each test
frequency is applied to the antenna.
Te second method uses a mode-tuned
reverberation chamber, which must un-
dergo a eld uniformity validation and
maximum chamber loading verication
prior to the rst use of the chamber,
or after any modications. Field uni-
formity and maximum electric eld
strength measurements are performed
with a three-axis E-Field probe at up
to nine dierent positions within the
chamber. Also, a passive, linear antenna
is moved to dierent positions within
the chamber to calibrate the antenna
for use prior to each test. Tis calibra-
tion allows the antenna to be used to
measure chamber Q, time constant,
and chamber loading factor, during
EUT testing. As with the anechoic
0.01
0.10
1.00
10.00
100.00
0.01 0.10 1.00 10.00 100.00 1000.00
kHz
Vpp
Figure 1. Category Z, 270-Volt DC AF conducted susceptibility test level.
AH Who says.indd 1 2/11/2008 3:37:22 PM
50
10
100
1000
0.1 1 10 100 Frequency (GHz)
V/m
Category B Category F Category G Category D Category L
100
1000
10000
0.1 1 10 100
Frequency (GHz)
V/m
Category G Category B Category F Category D Category L
Figure 2. Category B, D, F, G, L radiated susceptibility test levels (CW & SW).
Figure 3. Category B, D, F, G, L radiated susceptibility test levels (pulse).

2
0
0
7

T
h
e
r
m
o

F
i
s
h
e
r

S
c
i
e
n
t
i
f
i
c
I
n
c
.

A
l
l
r
i
g
h
t
s
r
e
s
e
r
v
e
d
.
The new Thermo Scientific ECAT
Lightning Test System

because failure is not an option.
With its fully-automated test operations, the Thermo Scientific
ECAT Lightning Test System (LTS) yields reliable, repeatable
and accurate test results to RTCA DO 160E/F Section 22,
Boeing, Airbus, EUROCAE, and more.
Building on the legacy of proven ECAT field-upgradable modular
technology, it features fast test setup, intuitive programming,
built-in voltage and current monitoring, and front panel and
remote computer control. We also offer on-site calibration and
field service worldwide.
For more information, please contact us at 800-753-9835.
Or, visit us at www.thermo.com/esd.
Thermo Scientific ECAT Lightning Test System
for RTCA DO 160E/F, Section 22
Part of Thermo Fisher Scientific
Thermo Scientific.indd 1 2/13/2008 2:33:53 PM
52
chamber method, the calibrated power
level for each test frequency is applied
to the antenna during EUT testing.
Equipment category designation for
Section 20 is denoted by two letters.
Conducted susceptibility test levels
are designated with the rst category
character and radiated susceptibil-
ity test levels with the second category
character. Tere are seven equipment
categories for conducted susceptibility,
and 10 equipment categories for radiated
susceptibility. Tese categories indicate
the severity level of the tests performed,
and/or the type of modulation used.
Category S is the least severe at one V/m,
and Category L is the most severe, with
test levels as high as 7200 V/m.
Examples of some of the conducted
and radiated equipment categories are
shown in Figure 2 and Figure 3.
Reduced number of equipment
categories.
Tere is now only one test method
for conducted susceptibility.
Clarication has been added regard-
ing the requirement to expose all
apertures and openings of the EUT
in anechoic chamber method.
SECTION 21: EMISSION OF
RADIO FREQUENCY
Te tests in this section are performed
to determine that the EUT does not
emit radio frequency interference in
excess of the specied limits. Con-
ducted RF emissions appearing on
interconnecting cables and power
leads are measured. Radiated RF emis-
sions from the EUT, interconnecting
cables, and power leads are measured
as well.
Measurements must be made with
an instrument using a peak detector,
and with IF bandwidths, frequency step
size, and dwell time as specied in Sec-
tion 21, Table 1, for the frequency range
being scanned.
A LISN must be inserted in series
with each power lead and ungrounded
power return lead, with a 10-F capaci-
tor connected between the power input
of the LISN and the ground plane. Un-
less otherwise specied, interconnect-
ing cables shall be at least 3.3 meters in
length, and power leads should be no
more than one meter in length for these
tests. Ambient emission levels must be
at least 6 dB below the applicable limit
and must be measured and recorded if
any signals are found to be within 3 dB
of the applicable limit.
Conducted Emissions
Conducted RF currents on intercon-
necting cables and power leads are mea-
sured with a clamp-on current probe.
Te probe is positioned ve centimeters
from the EUT and measurements are
made over the frequency range of 150
kHz to 152 MHz.
Radiated Emissions
Radiated RF elds are measured with a
linearly polarized antenna over the fre-
quency range of 100 MHz to 6 GHz. As
with RF radiated susceptibility testing
NCEE Labs
is the regions premier pre-compliance and compliance testing laboratory.
Accredited by A2LA (Test Lab Certification 1953.01) to 17025 for EMC testing, our 15,700 square-foot world class, state-of-the-art
facility houses one of the nations public 10-meter semi-anechoic chambers. Were located in the heart of the Midwest, minutes
from the airport and I-80, so if you like to be on-site during testing, NCEE Labs makes it easy.
NCEE Labs is staffed by professionals who provide our growing nation-wide base of customers:
A testing schedule that meets your deadlines
Unparalleled customer service and support
A comprehensive set of capabilities
The thoroughness and professionalism that
provides security when it counts
To schedule reliable, on-time, and affordable testing that will help you get
your products to market on time and within budget, call NCEE Labs,
402.472.5880 or email info@nceelabs.com.

4740 Discovery Drive, Lincoln, NE 68521-5376
Call: 402.472.5880 FAX: 402.472-5881
Visit our website at www.nceelabs.com for more information!
ERI K J. BORGSTROM
53
in Section 20, there are two RF radi-
ated emissions test methods allowed
in Section 21: the anechoic chamber
method, and the reverberation chamber
method.
The anechoic chamber method
requires a chamber lined with RF
absorber, and the minimum perfor-
mance of the absorber is specied. Te

20.00
30.00
40.00
50.00
60.00
70.00
80.00
100 1000 10000
Frequncy in MHz
L
e
v
e
l

(
d
b
u
V
/
m
)
38
47
1164 1215
1559
1610
40
40.2
38.5
48.9
340
56.8
45.3
56.9
73
5020 5100 960
38.
320
37.7
44.
108
2
27
152
48.
1680
Figure 5. Category P radiated RF emissions limit.
0
10
20
30
40
50
60
0.1 1 10 100 1000
Frequency in MHz
L
e
v
e
l

:

d
B
u
A
30 2 .150
Category P
Power Lines and
Interconnecting Bundles
9
152 108
53
For Category P, the fundamental transmit frequency and
harmonically related conducted emissions in the frequency
range of 2 to 30 MHz shall not exceed the Category B
conducted emission limits for radio transmitters operating from
2 to 30 MHz when the transmitter is keyed and power is
delivered to the antenna load.
Figure 4. Category P conducted RF emissions limitpower leads.
54
measurement antenna distance is one
meter, and multiple antenna positions
are required when the beamwidth of
the antenna does not totally cover
the system. If the EUT has apertures,
connectors, seams, or other points of
penetration into the EUT enclosure,
all of these must be directly exposed
to the test antenna, requiring multiple
EUT positions during testing.
Te second method uses a Rever-
beration Chamber, which requires
a field uniformity validation as de-
scribed in Section 20. EUT loading is
measured after the EUT is installed
in the chamber, and the data are used
as a correction factor for the radiated
emissions measurement. A minimum
of 200 sweeps of the analyzer or mea-
surement receiver is required over one
rotation of the tuner for each measured
frequency range.
Tere are four equipment categories
(B, L, M, H, and P) that indicate the
location of the equipment and the
separation between the equipment and
aircraft antennas. In general, the closer
the equipment is to an aircraft antenna,
and the more it approaches a direct
view of an aircraft antenna, the tighter
the emissions limits.
Te conducted emissions frequency
range has been broadened to 150
kHz - 152 MHz, and the Radiated
Emissions test frequency range has
been narrowed to 100 MHz - 6
GHz.
A new procedure for radiated emis-
sions measurements in a reverbera-
tion chamber has been added.
In the anechoic chamber method,
clarication has been added regard-
ing the requirement to expose all ap-
ertures and openings of the EUT.
A new limit category has been
addedCategory Pto provide
added protection for certain receiv-
ers by use of even deeper notches
than previously used (Figure 4 and
Figure 5).
Category P includes special notches
in the radiated emissions limit that
were added at the last minute at the
insistence of RTCA Special Com-
mittee 159 to protect GPS receivers,
in particular.
SECTION 22: LIGHTNING
INDUCED TRANSIENT
SUSCEPTIBILITY
These tests determine whether the
EUT can operate as specied during
and/or after various lightning induced
transient waveforms are injected into
connector pins, interconnecting cables,
and power leads using pin injection,
and/or cable bundle tests. The pin
injection method is normally used to
show damage tolerance, while the cable
bundle tests are normally used to show
upset tolerance. Change 3 to DO-160D,
issued December 5, 2002, amounted to
a considerable revision of Section 22,
primarily adding procedures, wave-
forms, and test levels for multiple burst
and multiple stroke cable bundle test
methods. New waveform set designa-
ERI K J. BORGSTROM
55
tors (G through K) were also added to
cover the multiple burst and multiple
stroke tests.
Pin Injection
During pin injection testing, the EUT
is normally powered so that the circuits
being tested are biased as they would
be in normal operation. Te test level
is dened as an open circuit voltage
(Voc) with a specied source imped-
ance from the generator. For example,
waveform 3, test level 2 species Voc as
250 volts, with a short circuit current
(Isc) of 10 amps. Te ratio of Voc to Isc
yields a generator source impedance
requirement of 25 ohms. Te genera-
tor is adjusted to produce waveform 3
with these specied characteristics, and
the transient waveform is then applied
directly to the interface pins. After the
pins have been tested, the EUT is evalu-
ated to determine if its performance has
been degraded.
Cable Bundle Tests
Cable bundle tests are performed using
either cable induction or ground injec-
tion to couple the transient waveforms
into the interconnecting cable bundles
and power leads.
The cable induction test method
uses an injection probe to induce the
transient waveforms into interconnect-
ing cables and power leads. Te ground
injection method is very similar to the
cable induction method, except that the
transient waveform is applied between
the EUT case and the ground plane.
Te EUT is isolated from the ground
plane by lifting all local grounds and
returns and by insulating the case from
the ground plane, a step that forces the
injected transient into the cable shields
and any other return paths back to the
ground plane.
A Line Impedance Stabilization Net-
work (LISN) must be inserted in series
with each power lead and ungrounded
power return lead, with a 10-F ca-
pacitor connected between the power
input of the LISN and the ground plane
for AC powered equipment, or with a
33,000-F capacitor connected across
the power inputs of the LISNs for DC
powered equipment. Unless otherwise
specied, interconnecting cables shall
be at least 3.3 meters in length, and
power leads will be no more than one
meter in length for these tests.
For each waveform, either a voltage
or current test level is given, along with
a current or voltage limit. For example,
waveform 2, test level 3, species a volt-
age test level (V
T
) of 300 volts and a cur-
rent limit (I
L
) of 600 amps. Tese re-
quirements mean that during the test,
the generator level is increased until
the peak voltage measured on a single
turn monitor loop placed through the
injection probe reaches 300 volts or
until the monitored induced current
in the cable or lead reaches the 600
amp limit.
Cable bundle tests may be performed
using the single stroke method alone,
or using a combination of the single
stroke, multiple stroke, and multiple
burst methods.
56
No signicant changes to the test levels or methods.
Clarication of waveform parameters added.
Section was reorganized for readability by moving notes
under gures to the proper paragraphs within the pro-
cedure.
Guidance added for determination of test level of noisy
waveforms.
SECTION 23: LIGHTNING DIRECT EFFECTS
Te tests in this section are performed to determine the abil-
ity of externally mounted electrical and electronic equip-
ment to withstand the direct eects of a severe lightning
strike. Te equipment will not normally be powered during
the test, and these tests usually cause damage (sometimes
spectacular damage) to the EUT. High voltage and/or high
current tests at levels of thousands of kilovolts and/or hun-
dreds of kilo-amps are required.
Category designations consist of four characters that describe
the nature and severity of the test waveforms applied. Te rst
two characters designate the high voltage strike attachment
test category, and the last two characters designate the high
current physical damage test category. Te designated test
category for the EUT should correspond to the lightning strike
zone in which the EUT will be installed on the aircraft.
Clarication of test waveforms and methods has been
added throughout the section, greatly improving the
usability.
Tables added and gures improved (and added) to make
test procedures more understandable.
Category designations have been added to separate volt-
age and current tests.
Category designations have been claried, and Category
F has been deleted.
SECTION 25: ELECTROSTATIC DISCHARGE (ESD)
Tis test determines whether the EUT can operate as speci-
ed during and after being subjected to an electrostatic air
discharge event. Te test procedure and test generator used
are similar to those used in most other international ESD
standards, except that the EUT is bonded to the ground
plane and only air discharge is specied. Test points are
chosen based on their accessibility to personnel, with 10
positive and 10 negative polarity discharges at 15 kV ap-
plied to each one.
Tere is only one category (A), with a test level of 15 kV.
No signicant changes, except correcting typographical
errors in the gures.
$0.1-&5&40-65*0/4
47"%"58)*5&4"/%45&45$&/5&3
IE8I 6AFAILIIIE8. A8-31A MIL-8I 44A
MIL-8I 41E MIL-8I 219 MIL-hk 240
PadiaIed SuscepIibiliIy
ElecIromagheIic CompaIibiliIy
ElecIrosIaIic Discharge
ElecIromagheIic hIerIerehce
LighIhihg EIIecIs
ElecIromagheIic Pulse
Shieldihg EIIecIivehess
Hazards (Ordhahce, Fuel, Persohhel)
UWB / High Power Microwave
High hIehsiIy PF EME
8urvivabiIity, uIoerabiIity, & Assesseot irectorate
Fhooe. 505.18.115
www.wsr.ary.iI/capabiIities/testiog/Iab_Iac/Iab_Iac.htI
.!24%
Te single stroke test method is designed to represent the
internal aircraft wiring response to the most severe external
aircraft lightning strike. A single occurrence (stroke) of the
specied test waveform is applied to the cable bundle or wire
under test, and is repeated for a total of ten applications in
each polarity.
Te multiple stroke test method is designed to represent
the induced eects to internal aircraft wiring in response to
an external aircraft lightning strike that is composed of a
rst return stroke immediately followed by multiple return
strokes (Figure 5).
Te multiple burst test method is designed to represent
the induced eects to internal aircraft wiring in response
to an external aircraft lightning strike of a multiple burst
nature (Figure 6). Te specied test waveform is applied to
the cable bundle or wire under test, and repeated for at least
ve minutes in each polarity.
Category designations consist of ve characters that de-
scribe the pin and cable test waveform sets and test levels.
Te three-pin Injection test waveforms are grouped
in two waveform sets (A & B). Te ve cable bundle test
waveforms are grouped in four Single Stroke Waveform
Sets (C through F), and four combined Single Stroke,
Multiple Stroke, and Multiple Burst Waveform Sets (G
through K).
See whats in the new Aerospace EMC channel today.
information in the way you need it. If Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
Antennas
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Aerospace EMC
House Aerospace.indd 1 5/4/2008 5:15:20 PM
rf/microwave instrumentation modular rf receiver systems ar europe
The same things that drive you, drive us. Were passionate about exploring new possibilities. Finding new ways to help
our customers be more productive. To make testing faster, easier, and more accurate. To make equipment more reliable and
more cost-effective.
Building Blocks! Thats The Idea
Behind Our Subampability Concept!
Were building amplifiers that can grow as your
needs change. When you need a more powerful
amp, you simply add the power instead of tossing
out the old amplifier and starting all over. Smart!
Adaptable,
Constantly Changing.
The TGAR system, for automotive
transient immunity testing, is so flexible it
can handle most existing specs such as
ISO 7637-2, SAE J113-11 and most US,
European and Japanese manufacturer
specifications. And it easily adapts to handle
most new ones as they emerge.
Powerhouse!
When it comes to power and
reliability, those who know
come to AR. For amplifiers
like the 10000A250A, with
10,000 watts of power, 6:1 VSWR
tolerance, and a frequency range of
100 kHz 250 MHz.
Our Conducted Immunity
Test Systems Stand Alone!
The CI self-contained
RF Conducted Immunity
Test Systems have no
equals. Nothing even
comes close for ease of use, accuracy,
flexibility, reliability, or any features that
really matter. Testing to CE, MIL and
Auto Standards.
Weve Seen The Future.
And Were In It.
No one knows exactly
whats next in EMC
and Wireless testing.
But two things are
certain: The demand for
more power and higher
frequencies will continue. And
AR will always be several steps ahead, with the
amps and accessories that meet the changing needs.
Survival Of The Fittest.
When testing gets tough, ordinary amps fold
back and lose power. But AR amps stand
up to the toughest conditions with
infinite VSWR tolerance. You get
every watt of power, every time.
Radiant Arrows.
Our unique bent element Radiant Arrows
are about 60% smaller than standard log
periodic antennas. For fields from
26 MHz to 6.0 GHz, the Radiant
Arrows offer 6dBi (+ 1.5) gain
and produce high fields even in the
toughest applications. They can also
be calibrated for emissions testing.
Safe Bet!
ARs highly-advanced Starprobe
laser probes have 3 levels of

safety to protect your equipment and the reliability of your data.
Other probes dont even come close. Frequency covered
5 kHz - 60 GHz, high level of accuracy, laser or battery options.
Were D
AR 2-pg spread.indd 2 1/25/2008 12:06:54 PM
To be ready for the future, today. Weve got the best minds in the business and theyre constantly coming up with smart,
new solutions to help you stay ahead now and in the future.
WOW!
AR Systems can perform entire tests
with just the press of a few buttons
and with unmatched accuracy
and reliability. The AS40000
Radiated Immunity Test System
(800 MHz 40 GHz) contains 5
amplifiers, a field monitor, 2 power
meters, 2 system controllers, a
signal generator, and a 20 ft.
antenna mast with 5 antennas.
AR Modular RF Is A Leading Supplier Of Booster Amplifiers For
Tactical Military Radio
Our battle-tested booster amplifiers cover the broadest frequencies
and wave forms and are compatible with
virtually every transceiver. Were also
supplying some of the most high efficiency
modules for jamming applications.
A Wide Range of Modules and Amplifier systems.
And Infinite Solutions.
AR Modular RF not only offers modules and rack
mounted amplifiers from 10 kHz to 6 GHz
(with power that goes from watts to kilowatts), we also
provide customer-specific designs and modifications of our
products to meet the most demanding requirements
and solve the toughest problems.
Get Ready For The Next Wave
In EMI Receivers.
The CER2018 Receiver is a complete
EMI test solution with continuous
coverage from 20 Hz to 18 GHz and
expendability to 110 GHz. To ensure
accuracy, it self-calibrates on demand at
every frequency scan.
One Company, Infinite Solutions
Your Test Is Only As Good
As The Sum Of Its Parts.
It doesnt make sense to compromise the
quality of AR amplifiers with inferior parts.
AR offers accessories that are power and
frequency matched to our amps. And
theyre specially designed to make
testing more efficient.
Driven!
AR 2-pg spread.indd 3 1/25/2008 12:06:57 PM
60
testing & test equipment SHI ELDI NG EFFECTI VENESS OF MATERI ALS
KERMIT O. PHIPPS
PHILIP F. KEEBLER
EPRI EMC Laboratory
Knoxville, TN
T
raditionally Schelkunoffs shield-
ing eectiveness equation has been
used universally in teaching and
practice throughout the entire EMC com-
munity. In this article, we will review
the basic three classic problems found in
Schelkunos textbook. We will attempt to
shed some light on the confusion of near-
eld and far-eld measurements regarding
shielding eectiveness. Special attention
will be focused on the expression SE =
A+R+B and the popular use of the shielding
expression, SE = SE(H) = SE(E).
SCHELKUNOFFS APPROACH
Schelkunos approach was to use a ba-
sic model based on a transmission line
driven by a generator that was terminated
at the other end with lumped impedance.
Schelkuno substituted the voltage and
current waves associated with the trans-
mission line with transverse electromag-
netic elds. He derived solutions for the
electric and magnetic elds of both surfaces
of a shield using Maxwells equations. He
later published these derivations in his
textbook Electromagnetic Waves
[1]
and ap-
plied these solutions to the three classic
problems listed below.
Plane sheet exposed to plane waves.
Cylindrical shell exposed to current
elds on the center axis of the cylinder.
Spherical shell exposed to elds from
a loop antenna in its center.
Equation 1 below represents the basic
shielding equation that is popular through-
out the EMC and shielding communities.
SE = A + R = B (1)
where
A = Absorption loss during a single tran-
sient through the boundary of the
shield.
R = Loss due to the rst reection at both
surfaces of the boundary.
B = Al l other ref lections withi n the
boundary.
Te B term is often neglected because
of the extremely small size of the term,
except where the A term is found to be
< 6. Schelkuno doesnt provide a clear
examination of the re-reection term B in
his classic problems since they did exhibit
values of the A term that are greater than 6
dB. Disregarding the B term, the basic form
the shielding equation becomes:
SE = A + R (2)
Equation (2) is then the generic expres-
sion for all three problems illustrated in
Schelkunos textbook. Treatment of the R
term varies according to the type of prob-
lem being worked.
Te Absorption Term A is based pri-
marily on material properties and depends
only on conductivity (), permeability (),
the thickness of the material (d), and the
frequency of the source ( f ). For all three
problems, A is expressed by:
Understanding shielding effectiveness of
materials and measurements in the near
f eld and far f eld
When we treat the shielding effectiveness measurement with a uniform
f eld, the results are similar for both near and far f elds.

Com-Power.indd 1 4/28/2008 7:07:57 PM
62

(3)
Te Reection Term R depends on
the shape of the shield and the source.
For Problems 1, 2, and 3, Schelunko
obtained the following expressions:

(4)
Problems 1 and 2

(5)
Problem 3
In this problem k is the intrinsic imped-
ance ratio of the shield Zi to the wave
impedance Zw. Te magnitude of |k| =
|Zi/Zw| is a measure of the change in
the eld as it enters or leaves the barrier.
Large values >> 1 or small values << 1
indicate a large impedance mismatch
at the surface of the barrier and result
in large values of reection.
For E elds k has the following rela-
tionship:

(6)
For H elds k has the following re-
lationship:

(7)
For practical shields |k| << 1 equa-
tions (4) and (5) reduce to:

(8)

(9)
Te reection term for all three prob-
lems may be rewritten as:

(10)
Here, c = 4 for Problems one and two,
plane and cylindrical waves; and c = 3
for Problem three for spheres.
Tis approach is used by many prac-
ticing engineers; however, the basic
problem with using these equations is
the fact that the equations are based on
planar waves that exist in the far eld
where the wave impedance is considered
to be that of free space, 377 ohms.
When performing shielding eective-
ness measurements, the practicing en-
gineer must understand the relationship
of near and far conditions when specify-
ing shielding material or attempting to
measure the susceptibility of sensitive
electronic equipment. Tis dictum holds
true even more so when attempting to
shield a piece of equipment from an
outside threate.g., the safety of aircraft
ight systems and/or safety controls of a
nuclear facility against cell phones and
other similar wireless devices.
UNDERSTANDING THE
NEAR-FIELD AND FAR-FIELD
RELATIONSHIP
More often than not, shielding material
measurements are made in the near eld
where the wave impedance is not equal
to 377 ohms, and the general axiom of
SE = SE(H) = SE(E) does not hold up.
Alternatively, the measurements can
be carried out within a uniform eld
(Planer Wave Characteristics) by using
coaxial test xtures and/or TEM cells.
Tese test methods work well for very
high frequencies where the material
may be located in the far eld. Still, if
a low frequency shielding eectiveness
measurement is attempted, it will most
likely be in the near eld. It would be
impossible to determine the true shield-
ing eectiveness of the material as it
will exhibit one shielding eectiveness
value for the electric eld and a dierent
one for the magnetic eld. All factors
are determined by the proximity of the
shielding material to the source.
When the shielding material is close
to the source, the wave impedance is a
function of the source properties. Te
wave impedance is the ratio of the elec-
tric and magnetic elds where:
(11)
If the source that is being shielded
against is a high current source with
low voltage, the predominant eld will
be magnetic. If the source has a high
voltage characteristic with low current,
the predominant eld will exhibit the
characteristics of an electric eld.
Figure 1 illustrates the basic imped-
ance transition region and indicates
where these theories hold true, the as-
sociated tests, and the typical measure-
ment approaches used.
Te only way of obtaining a meaning-
ful shielding eectiveness measurement
in the near eld is to place the threat
source nearby. Ten the power density
should be measured with special probes
or smart sensors, and the shielding ef-
fectiveness can be computed with and
without the actual threat source.
MEASUREMENTS TO
ILLUSTRATE DIFFERENCES
IN NEAR- AND FAR-FIELD
SHIELDING EFFECTIVENESS
To illustrate the principles in Figure
Figure 1. Wave impedance vs. distance and demarcation point for near and far measurements.
NEW ONSITE CALIBRATION SERVICES
Liberty Labs, Inc. can come perform onsite
NSA from 30-1000MHz and qualify site VSWR
from 1-18GHz. We can also train your employees
to perform these calibrations in future and we
can sell you the equipment/antennas needed.
We are a US distributor for Schwarzbeck
Mess - Elektonik and Austrian Research
Centers GmbH - ARC equipment.
For NSA we recommend UHAP/VHAP from
Schwarzbeck and the PRD from Austrian Research.
For Site Validation above 1GHz we recommend the
SBA 9112/9113 from Schwarzbeck and the POD
Set from Austrian Research.
We can perform an NSA Calibration at your site at
3&10m for $3500 which includes the report.
We can perform a Geometric, 1 distance, NSA
Calibration for $2500 which includes the report.
We can perform Site Validation (VSWR) above
1GHz to 18GHz for $3500 which includes the report.
We ask for the following terms:
*Calibrations must be scheduled 1 month in advance
* A 50% down payment before scheduled.
* Final payment within 1 week of on-site
calibration. Final payment must be received
before the report will be sent.
*The locations must be pre-marked on-site for
test point of NSA and Site Validation (VSWR) prior to
our arrival. If not completed prior to arrival we will
charge $175/hr for setup.
*All travel & shipping costs are additional
Please call for pricing on equipment or
email sales for more information!
CONTACT INFO:
Liberty Labs, Inc.
1346 Yellowwood Road
PO Box 230
Kimballton, IA 51543
PH: 712-773-2199
FAX: 712-773-2299
www.liberty-labs.com
sales@liberty-labs.com
SBA 9112 & SBA 9113
Site VSWR Set
POD 16 & POD 618
Liberty Labs.indd 1 5/4/2008 5:38:54 PM
64
1, testing was performed via three
methods:
Using a modied method of MIL-
DTL-83528C-2001 at 0.5 meters
using loops and rods with reference
antennas
Using a bi-conical/log periodic an-
tenna at 3 meters
Using uniform fields generated
within a Crawford cell.
Figure 2 shows the basic test setup
of MIL-DTL-83528C-2001 performed
at 0.5 m. Te material being evaluated is
aluminized plastic that is thin enough
to provide measurable values of shield-
ing eectiveness.
Te testing was done at 0.5 m in ac-
cordance with MIL-DTL-83528C-2001
and illustrates the concept of near-eld
measurements where SE is not equal to
SE(H) = SE(E), and the lab measurements
supporting this concept are seen in Fig-
ure 3 below. One of the main dierences
besides the change in distance is the use
of reference antennas of like build at 0.5
meters from the source. As an example,
if the source antenna was a rod (electric
eld), it would have a matched reference
rod at 0.5 meters from it on the other
side. Inside the enclosure, an active rod
or loop antenna would be used, depend-
ing on measuring either the electric or
the magnetic eld.
In Figure 3 notice how the graphed
data follows the trend of wave impedance
as it changes in accordance to wavelength
as seen in Figure 1showing a transition
from near eld to far eld where the
magnetic- and electric-eld shielding
eectiveness are almost the same.
In order to illustrate the concept
of far-field measurements and that
Schelkunos equations are applicable
for plane waves, a bi-conical/log-pe-
rodic antenna (BLPA) at three meters
was used as the source. Measurements
inside the enclosure were performed
with a loop or rod antenna respectively
at 30 cm (Figure 2). As seen in the mea-
surements in Figure 5, the electric eld
shielding eectiveness is within 3 dB of
that of the magnetic eld shielding ef-
fectiveness. As predicted by Schelkun-
os shielding theory, electromagnetic
waves are planer at this distance.
Figure 4 shows the BLPA method at
3 meters. Te frequency starts at 1 MHz
to ensure that the measurements are
performed within the far-eld region.
As can been seen in Figure 5 the
measurements of the shielding eec-
tiveness for the electric eld and the
magnetic eld are relatively the same.
Next, a nal measurement was per-
formed using a Crawford Cell which
should produce a uniform plane wave
from 100 kHz to 100 MHz to ll the
gap in the BLPA measurement. A Bdot
sensor and fractional dipole were used
as reference and measurement sensors
for the test. Figure 6 shows the basic
test setup and the Crawford Cell being
measured for uniform eld generation.
A small shielded box with a 6-inch
square test window was used to hold
the material-under-test. A sensor probe
was located inside the box while the ref-
erence probe measured the eld being
generated between the plates.
As expected the test results were
similar to that of the BLPA in the
far eld. As may be seen once again,
when using plane waves, Schelkunos
equations are valid, and only valid
for plane waves. Te data in Figure 7
shows that the shielding eectiveness
Figure 2. MIL-DTL-83528 test setup with reference antennas (0.5 m).
Figure 3. Near eld measurement of aluminized plastic lm with loop and rod antennas at 0.5 m.
Sunol Sciences Corporation
Pleasanton, California Tel: 925-485-9260 Fax: 925-485-9325
info@sunolsciences.com www.sunolsciences.com
HORN ANTENNAS
COMMUNICATIONS ANTENNAS
FLUSH MOUNT TURNTABLES SYSTEM CONTROLLERS
EMC TEST ANTENNAS
POSITIONERS
FREE SPACE TURNTABLES
DUAL AXIS POSITIONERS
WIRELESS TEST ANTENNAS
ANTENNA MASTS
Sunol 1-4C ad US CS3.indd 1 4/26/2008 12:36:12 PM
66
for the electric eld and magnetic eld
are within 3 dB of each other. And at
100 kHz there is no shielding of the
electric- and magnetic-fields by the
aluminized plastic.
CONCLUSIONS
When the shielding eectiveness of
the aluminized plastic is compared
to the far-eld and the near-eld mea-
surements using antenna techniques,
it is clear that the wave impedance
conditions aect the outcome. How-
ever, when we treat the shielding
effectiveness measurement with a
uniform field such as that used in
the standard shielding eectiveness
equations, the results are similar for
both types of elds. Tis illustrates
that these conditions do not reect
real world shielding eectiveness. Te
practicing engineer must understand
these dierences and must develop
meaningful tests that consider the
threat source and the relative dier-
ences in dening meaningful shield-
ing eectiveness values.
Finally, the only shielding eective-
ness measurements that can be relied
on for near-eld values are the ones
that consider power densities that rst
treat the magnetic and electric elds
separately, and then combine them into
a single calculation of power.
Figure 4. BLPA test at 3 meters.
Figure 5. Near eld SE measurement of aluminized plastic lm with BLPA far eld source at 3 m.
Figure 6. Stripline test.
Worlds Largest Selection Of Field Probes 5 kHz to 60 GHz
ARs line of field monitoring equipment is not only the largest, most comprehensive in the EMC field, its also the most
technologically advanced. No other company even comes close to the performance, the reliability or the options available from AR.
The family of Starprobe
laser powered probes covers the broadest frequency range 5 kHz to 18 GHz!
These E-field laser probes contain an internal microprocessor that enables them to think for themselves and adapt to their environment.
This provides optimal linearization, temperature compensation, control, and communication functions.
They also have three levels of safety for ultimate protection.
Starprobe
1 Laser Powered Probe (Model FL7030) 5 kHz - 30 MHz / 1.5 - 300 V/m
Starprobe
2 Laser Powered Probe (Model FL7006) 100 kHz - 6 GHz / 0.5 - 800 V/m redesigned to meet the
IEC6 GHz requirement!
Starprobe
3 Laser Powered Probe (Model FL7018) 3 MHz - 18 GHz / 1 - 1000 V/m the world's first 18 GHz laser probe!
Six battery-operated E&HField Probes,100 kHz - 60 GHz with quicker calibration turnaround, more complete data and
excellent isotropic response and linearity.
Starmonitor
Field Monitor, (FM7004) exceptionally precise with auto-recognition to adapt to laser or battery-powered probes.
Like all AR products, our probes and monitor are backed by our limitless support network and by the most comprehensive warranty
in the industry.
The Bigger Picture!
Meet the power houses of the family.
Starprobe 1, 2 and the newest member, the
worlds first 18 GHz laser probe Starprobe 3
We also would like you to meet our
battery operated probes
And, the anchor of the family -
our exceptionally precise field monitor
ISO 9001:2000
Certified
AR bigger.indd 1 4/3/2008 3:03:24 PM
68
Kermit O. Phipps is a NARTE Certied EMC engineer and conducts tests
and evaluations of equipment performance in accordance with standards
of ANSI/IEEE, IEC, U.S. Military, and UL, as well as with the EPRI System
Compatibility Test Protocols for EPRI. He served in the U.S. Air Force as a
manual electronic warfare and component specialist, resolving hardware
and software problems. He conducts research on surge protection, power-
line lters, shielding eectiveness, and electromagnetic interference. Mr.
Phipps is the author and co-author of test plans, protocols, and research
papers presented at international power quality and EMC conferences.
He has conducted a number of power quality and EMC training sessions
and eld investigations. Most recently, he has completed his voluntary
work as chairman in developing a new EMC standard for power-line
lters, IEEE 1560.
Philip F. Keebler has conducted System Compatibility Research on
personal computers, lighting, medical equipment, and Internet data
center equipment. Te lighting tasks were associated with characterizing
electronic uorescent and magnetic HID ballasts, electronic uorescent
and HID ballast interference, electronic uorescent and HID ballasts
failures, electronic uorescent and HID lamp failures. He has drafted
test protocols and performance criteria for SCRP tasks relating to PQ
and EMC. Mr. Keebler also manages the Electromagnetic Compatibility
(EMC) Group at EPRI where EMC site surveys are conducted, end-use
devices are tested for EMC, EMC audits are conducted, and solutions
to electromagnetic interference (EMI) problems are identied. He has
completed his service as editor developing a new EMC standard for
power-line lters, IEEE 1560.
Figure 7. Shielding effectiveness measurement within a Crawford cell.
MORE ON OUR WEBSITE
Teseq Inc. New Jersey 08837 USA
T + 1 732 417 0501 F + 1 732 417 0511
usasales@teseq.com www.tesequsa.com
COMPLIANCE 3
THE EMC TEST SOFTWARE
WHICH PASSES EVERY TEST
Compliance 3 automates your EMC test laboratory. Flexibility is the keyword
here. This Windows-based program controls RF emissions and immunity tests
for every application, from pre-compliance development through accredited
testing. Compliance 3 comes in a wide range of performance packages to suit
your unique requirements; and Teseqs on-site support and training will ensure
your lab is up and running as quickly as possible.
What does this mean? Compliance 3 is an advantage for every test laboratory!
Test our results:
a Emissions and Immunity applications
a Wide range of performance packages
a Supports all manufacturers test instruments
a Supports industry, military, automotive and medical
technology standards
a Can be individually congured for your own test methods
a Automated EUT monitoring
a Global support network
Whether youre pondering Schelkunoffs equation
on shielding effectiveness or the on-going relevance
of Maxwells equations, a wealth of challenging,
illuminating, and informative articles is readily available.
Just go to the new, revamped InterferenceTechnology.
com, and look under resources. Youll nd research and
white papers, videos, and application notes with insights
on the many challenging aspects of EMC.
See whats in the new Amplifiers channel today.
information in the way you need it. If Amplifiers is
a key part of your work, you can now find all the
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Antennas
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Amplifiers
House Amplifiers.indd 1 5/4/2008 5:44:14 PM
70
testing & test equipment THE I EC ADVI SORY COMMI T TEE ON EMC (ACEC)
DR. WILLIAM A. RADASKY, PH.D., P.E.
Metatech Corporation
Goleta, CA
W
hile many EMC engineers
are familiar with the electro-
magnetic compatibility (EMC)
standards developed by the International
Electrotechnical Commission (IEC), they
are probably unaware of how the structure
of the IEC EMC standards eort was devel-
oped over the years or how this structure is
maintained. Te IEC has over 175 commit-
tees and subcommittees dealing with elec-
trical and electronic products and systems.
Tese product committees must deal with
horizontal aspects such as safety, environ-
mental protection, and EMCin addition
to those factors that directly involve the
performance of their products of interest.
For this reason, the EMC committees within
the IEC (namely CISPR and TC 77) develop
the basic standards that can be applied by the
product committees. Te hierarchy of IEC
EMC standards and the ways to write EMC
standards within the IEC were developed by
and are maintained by the Advisory Com-
mittee on Electromagnetic Compatibility
(ACEC).
Tis paper reviews the early history of
ACEC, the current status of ACEC, and
IEC Guide 107 (written by ACEC) that
implements the EMC strategy within the
IEC. Also, a summary of important accom-
plishments of ACEC over the past decade is
provided along with emerging issues likely
to demand future consideration.
BRIEF HISTORY OF ACEC
On 21 June 1978, the Committee of Action
(the technical management board of the IEC
at the time) set up an EMC Coordinating
Working Group (EMC-CWG), whose task
was to coordinate the IEC work dealing
with EMC and to advise the Committee of
Action if there were problems in the man-
ner in which the EMC standards were being
applied. After an organizational period, the
rst meeting of the EMC-CWG was held on
1213 March 1980 in Geneva, Switzerland.
Te rst Chairman of the EMC-CWG was
Prof. Ralph Showers (U.S.) and the Secretary
was Mr. A. Ffoulkes. Prof. Showers served
as Chairman of the EMC-CWG from 1980
to 1991; the name of the committee was
changed during this period to ACEC.
[1]
Mr. Georges Goldberg (Switzerland) was
elected as the next chairman and served
from 1992 until 1996. Mrs. Margaret Read
served as Secretary during most of this pe-
riod. Te next ACEC Chairman was Dr. Wil-
liam Radasky (U.S.), who began his term on 1
January 1997 and will serve until the end of
2008. Secretaries over this period included
Mr. Gabriel Barta from 1997 to 2001 and Dr.
Rmy Baillif from 2002 to the present.
ACEC TODAY
While the names of committees and boards
within the IEC have changed over the years,
the role of ACEC has stayed the same. ACEC
reviews the development of basic EMC
standards produced by CISPR and TC 77
and the way these standards are applied by
product committees of the IEC. Addition-
ally, ACEC coordinates with ISO, ITU, and
The IEC Advisory Committee on EMC
(ACEC): coordination of international
EMC standards
Since its formation, ACEC has developed a unique structure for EMC
publications that is used to this day in the IEC and in other regional
standardization organizations.

Testing and Certification for
North America and the World
Global Ofces and Laboratories: r"UMBOUB("r$IBSMPUUF/$r$IJDBHP*-r$MFWFMBOE0)r%BMMBT59
r)BSUGPSE$5r-PT"OHFMFT$"r/BTIWJMMF5/r&ENPOUPO"#r.POUSFBM12r5PSPOUP0/r7BODPVWFS#$
r"SOIFNUIF/FUIFSMBOETr.JMBO*UBMZr#BOHBMPSF*OEJBr.VNCBJ*OEJBr)POH,POH$IJOB
r(VBOH[IPV$IJOBr4IBOHIBJ$IJOBr4FPVM3FQVCMJDPG,PSFBr5BJQFJ5BJXBOr5PLZP+BQBO
1-866-463-1785
cert.sales@csa-international.org
www.csa-international.org
CSA Internationals global network of offices and laboratories can
help you obtain the recognized product certification marks you need
for North America, Europe, Asia and other regions.
Gas-red t 1MVNCJOHt &MFDUSJDt &MFDUSPOJDt .FDIBOJDBM
CSA.indd 1 2/29/2008 3:58:25 PM
72
other international and regional stan-
dards bodies to ensure that the EMC
work in the international community
is performed in a consistent manner.
In all cases, ACEC recommendations
for action are submitted to the succes-
sor of the Committee of Action, which
is now known as the Standardization
Management Board (SMB), for its ap-
proval. Tis Board makes the techni-
cal decisions regarding IEC standards
development. Figure 1 illustrates the
relationship between ACEC and the
SMB in chart form.
The terms of reference for ACEC
today state, Te object of ACEC is to be
at the disposal of the Standardization
Management Board (SMB), to advise
on, guide and coordinate IEC work re-
lating to electromagnetic compatibility
matters, in order to avoid duplication
and conict in IEC standards.
[2]
Te
coordination activities relate to elec-
tromagnetic emissions, coupling, and
immunity to disturbances and cover:
denitions, instrumentation, methods
of measurement, requirements and
limits, codes of practice, and char-
acterization and classication of the
electromagnetic environment. ACEC
also gives guidance to the IEC Central
Office on documentation for EMC,
which includes brochures, workshops,
web pages and other forms.
ACEC is currently composed of four
members each nominated by CISPR
and TC 77 (EMC) and four additional
independent experts knowledgeable
in EMC matters, but not represent-
ing other technical committees that
are members of ACEC; presently the
four ACEC experts are from Belgium,
Canada, Germany, and Japan. Besides
these 12 members, members come from
product committees whose activities
include EMC aspects as an important
part of their work. Currently, there
are six committees participating in
ACEC work. Tey are TC 22 (power
electronic systems and equipment);
TC 46 (cables, wires and waveguide
components); SC 62A (common aspects
of electrical equipment used in medical
practice); TC 64 (electrical installations
and protection against electric shock);
SC 65A (industrial process controls
system aspects); and TC 108 (safety of
electronic equipment including infor-
mation technology).
ACEC meets twice per year to
discuss progress within the IEC and
to receive reports from the members
concerning the status of EMC work.
From time to time, conicts among IEC
committees involving EMC standards
(either under development or under
revision) arise, and these are discussed
within ACEC. When a conclusion is
reached, recommendations for resolu-
tion are submitted to the SMB for de-
cision. As the Chairman of ACEC over
the past 11 years, I have made an eort
to move some of the meetings from
Geneva to dierent parts of the world
to allow local IEC National Commit-
tees to participate in the meetings and
to equalize the travel expenditures for
the members. Since 1996 ACEC has met
in London, Paris twice, Stockholm, Er-
langen twice, Beijing, Piscataway (New
Jersey) twice, Tokyo, Copenhagen, and
Honolulu. Te next two meetings are
planned for Singapore and Brussels.
IEC GUIDE 107
IEC Guide 107 is entitled, Electro-
magnetic CompatibilityGuide to the
Drafting of Electromagnetic Compat-
ibility Publications.
[3]
Tis guide was
rst written in 1989 by the ACEC, and
the second edition (published in 1998)
is under revision at this time largely
to take into account some changes in
the denition of horizontal standards
and committees within the IEC. It is
the comprehensive guide that denes
the dierent types of EMC standards
within the IEC and is a handbook on
how to write these dierent types of
EMC publications. The publication
includes a description of its scope and
intent: This guide describes proce-

STANDARDIZATION
MANAGEMENT
BOARD
A C E C
TC 77 CISPR
Product
committees
Basic, Generic,
Product standards

Product standards
Liaisons
CENELEC
CIGRE
EURELECTRIC

ISO ITU Others
Figure 1. Organization of the technical work of the IEC on EMC.
[3]
795 Marconi Avenue, Ronkonkoma, NY 11779 USA
Tel: (631) 737-1500 Fax: (631) 737-1497
www.retlif.com E-mail: sales@retlif.com
Additional locations in New Hampshire, Pennsylvania & Washington D.C.
Retlif touches many worlds with full Electromagnetic Interference and Environmental
Simulation testing, as well as engineering and educational services.
Retlif adds tangible value both technically and cost-effectively. We seamlessly guide
your products through complex regulatory structuresdomestic, international and
militarywith expertise that expedites the process. And Retlif offers the industrys
best lead time scheduling.
NARTE recognized, NIST CAB designated and accredited to ISO-STD-17025 by
both NVLAP and A2LA, our recognition and accreditations are unmatched:
American Bureau of Shipping Industry Canada
Defense Electronics Supply Center Lloyds Register
FAA UMTA
FCC U.S. Armed Forces
FDA U.S. Coast Guard
FRA VCCI
Independent and proud of it, Retlif has been a field leader for nearly 30 years.
Put us to the test and see why for yourself.
Retlif.indd 1 3/17/2008 2:37:55 PM
74
dures for the drafting of IEC publica-
tions, which relate wholly or partly to
electromagnetic compatibility (EMC).
Tey should be applied when prepar-
ing new electromagnetic compatibility
publications or EMC clauses as well as
when revising existing publications.
Tese procedures should be followed
in order to ensure that the resulting
publications are consistent with each
other and current practice, and to avoid
overlapping document scopes.
In particular, IEC Guide 107 de-
scribes the principal types of EMC
standards, which provide emission lim-
its and immunity requirements. Tere
are four types of publications that are
dened in the guide including:
Basic EMC publications
Generic EMC standards
Product family standards
Product standards
Some information from Guide 107
concerning these types of publications
is summarized below.
Basic EMC publications give the
fundamental principles, concepts,
terminology or technical character-
istics for the achievement of EMC
and serve as reference documents for
product committees. Tese publica-
tions are usually developed by TC 77
and CISPR/A and may be standards,
technical specications, or technical
reports. Tey are general in nature and
hence are not dedicated to EMC for
specic product families or products.
Te most famous of these types of basic
EMC publications are found in the IEC
61000-4-x series covering measurement
and test techniques. It is important to
note that basic standards should not
include prescribed limits and/or spe-
cic performance criteria. Tese are
covered by the generic, product family
or product standards.
Generic EMC standards are de-
signed to apply, for a dened electro-
magnetic environment, to products
for which no dedicated product family/
product EMC standards exist. They
specify a set of essential requirements,
test procedures, and generalized per-
formance criteria applicable to such
products or systems operating in this
electromagnetic environment. Prod-
uct committees should determine if
the tests, test levels, and performance
criteria for the particular electromag-
netic environment covered in a generic
EMC standard are adequate for their
products before developing a separate
product EMC standard.
Product fami l y/product EMC
standards apply to a product family,
which is a group of similar products
for which the same standards can be
applied or to a specic product type.
Product family/product EMC standards
dene specic emission and immunity
requirements, as well as measurement
and test procedures dedicated to par-
ticular product families/products. Tey
should indicate the relevant installation
and operating conditions. Tey should
also give precise performance criteria,
taking into account the purpose of
the equipment wherever possible. Te
principal IEC EMC product families
include:
Multimedia equipment including:
radio and TV receivers and associ-
ated equipment; information tech-
nology equipment (ITE); telecom-
munication equipment (as far as it
is within the scope of the IEC); and
power line telecom (PLT) terminal
equipment
Household and commercial equip-
ment (other than ITE)
Industrial-process measurement
and control equipment (other than
ITE)
Tra c and transportation equip-
ment
Utilities equipment (electricity, gas,
water, etc.)
Medical equipment
Measuring and test equipment
Equipment connected to the HV, MV
and LV public mains networks.
Given this well-dened structure for
EMC publications, it is the job of ACEC
to ensure that these standards are de-
veloped in a consistent manner and that
they do not conict with each other.
Some examples will be mentioned later
in this article.
MAJOR ACCOMPLISHMENTS
BY ACEC
Over the past 11 years, this author has
had the opportunity to observe and to
participate in several important accom-
plishments of ACEC. Some of these are
summarized below:
Resolution of a long-standing dis-
agreement between PC manufacturers
and electric power system suppliers
dealing with the harmonic emission
limits required for personal computers.
Long negotiations were required over
nearly 10 years with Mr. Georges Gold-
berg (Switzerland), Prof. Eisuke Masada
(Japan), and Dr. William Radasky (U.S.)
leading the ACEC negotiation eorts.
Finally, compromise emission limits
were accepted by the PC industry along
with a simplication of test methods by
the power industry.
ACEC formed an ad hoc group to
study the need for forming a new IEC
technical committee dealing with
measurement methods for evaluating
limits for human exposure to electro-
magnetic elds. Tis work was led by
Mr. Georges Goldberg and resulted in
the establishment of TC 106 (methods
for the assessment of electric, magnetic
and electromagnetic elds associated
with human exposure) by the SMB.
Because of the di culties in track-
ing over 100 product EMC standards
as they were developed and revised,
a system was set up by ACEC for the
electronic survey of all new standards
being developed by the IEC and for re-
view of these product standards while
they were still in a draft form. Prof.
Michel Ianoz (Switzerland) has chaired
this eort for many years with the sup-
port of several ACEC reviewers and the
ACEC Secretary, Dr. Rmy Baillif (IEC
Central O ce).
ACEC recommended the formation
of an EMC Zone on the IEC website
(www.iec.ch) to inform those working
in the IEC where important EMC in-
formation could be found. In addition,
a portion of this website is designed
for the public to learn about EMC. Mr.
Peter Kerry (U.K.) was instrumental in
the development of the EMC Zone,
and he was also active in the prepara-
tion of the Guide to Guide 107a
pamphlet that provides an overview of
IEC Guide 107.
ACEC also initiated a comprehen-
sive EMC Workshop Program both for
IEC Delegates and for industrial groups
throughout the world. Members of
Copyright 2008 Underwriters Laboratories Inc. ULAB-00940-02 2/08
Extensive EMC expertise
found nowhere else.
One-stop access to a comprehensive
portfolio of integrated services.
Whether its European Union directives, telecom NEBS requirements, wireless certifications or automotive compatibility
standards, ULs EMC experts can provide the knowledge, quality of service and on-time delivery that comes with
more than 110 years of engineering testing experience. The UL Market Access Solutions team can help you understand
global market requirements, develop compliance strategies, and work through technical compliance and testing issues.
To take advantage of ULs unequalled breadth and depth of EMC expertise,
e-mail emc@us.ul.com or call 1-800-873-8536.
Mark Miles
Senior Engineering Associate
22 Years of Experience
UL EMC Automotive Group
Mark manages projects to test
component compliance standards for
most of the worlds car manufacturers.
Hes just one of the thousands of
UL employees who set the standard.
ULAB-00940-02 emc key indd 1 3/11/08 11:14:20 AM
UL.indd 1 3/17/2008 12:21:49 PM
76
ACEC participated in workshops held during the annual
IEC General Meetings beginning in 2000 in Stockholm
and continued in Florence, Beijing, Montreal, Seoul, Cape
Town, Berlin, and Paris (2007). Te next IEC ACEC EMC
Workshop is planned for Sao Paulo, Brazil in November
2008. Te industry workshops have been supported strongly
by Dr. William Radasky (U,S,), Mr. Diethard Moehr (Ger-
many) and Mr. Don Heirman (U.S.) and have been held in
the United States, Cuba, China, Brazil, Argentina, Iran,
Japan, Malaysia, and Vietnam. Workshops are planned for
Singapore and Romania in 2008.
To increase the e ciency of existing test methods and
to establish new test methods for both immunity and
emissions, ACEC supported the development of joint task
forces (JTFs) between SC 77B and CISPR/A. Tis work was
coordinated by Jacques Delaballe (France) and Don Heirman
(U.S.) and has resulted in new standards dealing with TEM
Waveguides (61000-4-20) and Reverberation Chambers
(61000-4-21). Work is continuing to revise both of these
standards and to develop a new standard on the use of fully
absorber-lined rooms (FAR).
EMERGING ISSUES FOR ACEC
Over the past few meetings, several topics and questions ap-
pear to be emerging as important future issues for ACEC.
One major issue is the development of PLT (power line
telecommunications) to provide Internet access to users
over power lines. Te emissions from PLT may interfere
with radio communications in some cases. Tere are on-
going discussions concerning whether emission limits are
needed for this service.
Another major issue is how to promote new test meth-
ods (such as TEM cells or reverberation chambers) when
it is not always possible to provide new methods that cor-
relate readily to older test methods (such as semi-anechoic
chambers).
Can ACEC help promote the development of measure-
ment uncertainty factors to be used in the evaluation of
immunity tests?
How will the power system harmonic emissions stan-
dards adapt to future changes in consumer electronics,
without a rm agreement concerning the best procedures
for controlling low frequency emissions?
Will ACEC be able to work more closely with the ISO to
ensure that there is not a duplication of the development of
basic EMC standards?
Will ACEC be able to continue to promote IEC EMC
standards to be used throughout the world to minimize
regulatory burdens on manufacturers?
SUMMARY
ACEC and its predecessor have been active in the IEC in
coordinating the work of electromagnetic compatibility
(EMC) since 1978. Since that time, ACEC has developed
Built For Speed.
OK, truth be told, were not expecting to set any land speed
records. Indeed, considering the specialized equipment this
truck is carrying, speeding is strongly discouraged.
But when it comes to EMC compliance testing,
this vehicle helps make TVRheinland
the
pace-setters of the industry.
With 19 conveniently located, state-of-the art
testing facilities in North America alone,
TVRheinland
is uniquely qualied to help

our clients get their products to market quickly.
1-TUV-RHEINLAND
(1-888-743-4652)
www.us.tuv.com
Get into the fast lane. Contact us today.
But if testing at one of our labs isnt convenient for your
particular product or situation, one of our dedicated mobile labs can come to you.
Since 1872, TVRheinland

has been helping its clients meet their test and
compliance needs quickly, efciently and reliably.
Whether you have EMC, Telecom or Product Safety needs, TVRheinland
has
the experience, resources and talented professionals you need.
RADASKY
77
MORE ON OUR WEBSITE
a unique structure for EMC publications that is used to
this day in the IEC and in other regional standardization
organizations. ACEC is an active committee and has solved
several important problems for the IEC EMC community.
ACEC continues to work on emerging EMC issues often
created by the development of new electronic products,
services, or test methods.
Readers who are interested in the work of ACEC or who
wish to submit questions or topics to the committee are
encouraged to contact the ACEC Secretary, Dr. Rmy Bail-
lif, at rb@iec.ch.
REFERENCES
[1] Personal Communications with Dr. Rmy Baillif, Secretary of ACEC,
January 2008.
[2] Terms of Reference for ACEC, CA/2143/INF, 30 November 2001.
[3] IEC Guide 107, Electromagnetic CompatibilityGuide to the Draft-
ing of Electromagnetic Compatibility Publications, Edition 3, 2008
(Draft).
William A. Radasky received the B.S. degree with a double major in
Electrical Engineering and Engineering Science from the U.S. Air Force
Academy in 1968. He also received the M.S. and Ph.D. degrees in Electrical
Engineering from the University of New Mexico in 1971 and the University
of California, Santa Barbara in 1981, respectively.
He started his career as a research engineer at the Air Force Weapons
Laboratory in Albuquerque, New Mexico working on the theory of the
electromagnetic pulse (EMP). In 1984 he founded Metatech Corporation in
Goleta, California where he is currently President and Managing Engineer.
During his 39-year career, he has published over 375 technical papers and
reports dealing with electromagnetic interference (EMI) and protection.
Dr. Radaskys current interests include studies to understand the threat
of Intentional EMI and to develop mitigation and monitoring methods to
protect facilities from this new threat. He is Chairman of IEC Subcommittee
77C, which is developing high-power electromagnetic protection and test
standards for civil systems. He is also the Chairman of TC-5 (High Power
EM) for the IEEE EMC Society. Other IEMI activities include his role as
Associate Editor for the IEEE EMC Transactions special issue on IEMI
in 2004 and as chair of the IEEE Standards Working Group to provide
protection guidelines for publicly accessible computers from the threat
of IEMI. In addition he is the Chairman of the IEC Advisory Committee
on EMC (ACEC), which is tasked to coordinate all EMC standardization
work for the IEC. He is an EMP Fellow and a member of the Eta Kappa
Nu and Tau Beta Pi honor societies. In October 2004 he was presented
the Lord Kelvin Medal in Seoul, South Korea by the International Elec-
trotechnical Commission for exceptional contributions to international
standardization.
Getting EMICompliant products to market quickly is imperative for todays industry leaders. Thats why Sypris
offers Electromagnetic Interference Testing. Companies turn to Sypris for a breadth of testing servicesincluding
timely, accurate product reporting to electromagnetic emissions and immunity standards. By choosing Sypris
for EMI testing, you avoid costly compliance setbacks, and you get your products to market ASAP.
The One You Choose For
Electromagnetic Interference Testing (EMI)
Discover what Sypris Test & Measurement
can do for you by calling us today at 800-839-4959.
www.wetest.com
EMI Compliance Or SpeedToMarket
Full EMI/EMC Capabilities, including dips, dropouts, harmonics, flicker, ESD, surge, burst and Radiated &
Conducted Emissions / Immunity.
Onsite Field Services, including Normalized Site Attenuation and Shielding Effectiveness Testing
BSMI
AS/NZS
ICES and many more ...
EN
IEC
VCCI
CE Mark
FDA
SAE
MIL-STD-461/462
RTCA DO-160
FCC
3 & 10 meter Open Area Test Site
16x24x12 fully ferrite lined
(commercial) shielded room
16x20x10 absorber lined
(military) shielded room
200V/m field strengths up to 18GHz
Sypris EMI Testing Meets The Following Standards:
The latest national and international standards
information can be found in the Standards Update
section of the new InterferenceTechnology.com. Staying
informed is the rst step in achieving compliance so visit
the site often for the latest updates.
78
testing & test equipment I EC 60601-1- 2
DAN HOOLIHAN
Hoolihan EMC Consulting
Lindstrom, MN
INTRODUCTION
T
he most well-known and used
EMC Standard for Electrical Medical
Devices is IEC 60601-1-2 (-2) which
is entitled Medical Electrical Equipment
Part 1-2: General Requirements for Basic
Safety and Essential Performance Collater-
al Standard: Electromagnetic Compatibility
Requirements and Tests. Te standard was
most recently released as the Tird Edition
in March of 2007. Te Standard is currently
under review by Maintenance Team 23
of Subcommittee 62A (Common Aspects
of Electrical Equipment Used in Medical
Practice), which is part of the International
Electrotechnical Committees Technical
Committee 62 (Electrical Equipment in
Medical Practice).
Tis article discusses some of the changes
from Edition 2 to Edition 3, reviews key-
requirements of the -2 standard, and
discusses possible future directions for the
standard. It is an overview type of article
since the actual standard is too long and
detailed to review in depth.
CHANGES FROM EDITION 2.0 TO
EDITION 3.0
In the Foreword of the third edition, it is
stated Tis edition of the IEC 60601-1-2 was
revised to structurally align it with the 2005
edition of IEC 60601-1 and to implement
the decision of IEC subcommittee 62A that
the clause numbering structure of collat-
eral standards written to IEC 60601-1:2005
would adhere to the form specied in ISO/
IEC Directives, Part 2:2004. Te principal
technical changes are in Clause 4, which now
recognizes that there is a general require-
ment for a risk management process in IEC
60601-1:2005.
Additional changes include a new Clause
1.3 entitled Related Standards, a new Annex
B (Guide to Marking and Labeling Require-
ments for Medical Electrical [ME] Equipment
and Medical Electrical [ME] Systems), and
Annex H (Mapping between the Elements
of the Second Edition of IEC 60601-1-2 as
amended and IEC 60601-1-2:2007).
Clause 1.3 of the -2 standard has two
sub-clauses; the rst is titled IEC 60601-1
and basically says that this collateral stan-
dard complements IEC 60601-1. Te second
sub-clause is Particular Standards. It states
that A requirement in a particular standard
takes priority over the corresponding re-
quirement in this collateral standard.
Annex B is Informative and has two
sub-clauses; B.1 (Marking on the Outside
of ME Equipment, ME Systems, or Teir
Parts) and B.2 (Accompanying Documents,
Instructions for Use). Both sub-clauses refer
to specic sub-clauses in the body of the
standard for the readers guidance.
Annex H does an excellent job of mapping
the requirements between Edition 2 and Edi-
tion 3 of the -2 standard. An abbreviated
version of Annex H is shown in Table 1.
TESTING REQUIREMENTS
EMISSION
ME Equipment and ME Systems are clas-
The international medical device EMC
standardIEC 60601-1-2
The -2 standard is increasingly important in the
electrical medical device world.

Innovation. Integrity. Dependability.
Innovation. Integrity. Dependability.
NEBS Approved
Independent
Testing Lab
See our web site for
most current list of
accreditations
767-01, 767-02, 767-03
accredited
461/462
ISO 9001:2000
Certified
1195 Church Street, Bohemia, NY 11716-5014 USA
Please direct all inquiries to: 1-800-TEST-456 email contact@dtbtest.com
www.dtbtest.com
TM
Automotive / Off-road
Defense / Government
Aviation / Aerospace
Consumer Electronics
Transportation / Shipping
Shipboard
Rail / Transit
Medical
Telecom / IT / NEBS
A World of Engineering and Testing Under One Roof
Power Systems Testing (AC 480V- 3 Phase-
200 Amp, DC 300V - 150 Amp)
Full Spectrum EMI / EMC Testing
Combined Environments
Data Acquisition and Interface
Over 100 Engineers and Technicians
24/7 Operation with Stand-by Facility Power
On-Site Surveys
Courtesy of Union Switch & Signal, Inc.
DTB.indd 1 2/18/2008 5:16:16 PM
80
sied as either Class A or Class B and
Group 1 or Group 2 as per CISPR 11
(Industrial, Scientific and Medical
(ISM) Radio-Frequency Equipment
Electromagnetic Disturbance Char-
acteristics Limits and Methods of
Measurement).
Class A equipment is equipment
suitable for use in all establishments
other than domestic and those directly
connected to the public low-voltage
power supply network that supplies
buildings used for domestic purposes
Class B equipment is equipment
suitable for use in all establishments
including domestic establishments
and those directly connected to the
public low-voltage power supply net-
work that supplies buildings used for
domestic purposes
Group 1 equipment contai ns
all ISM equipment in which there
is intentionally generated or used
conductively-coupled Radio Frequency
(RF) energy that is necessary for the
internal functioning of the equipment
itself
Group 2 equipment contains all
ISM equipment in which RF energy is
intentionally generated or used in the
form of electromagnetic radiation for
the treatment of material, and spark
erosion equipment
Most medical equipment is Group
1 equipment.
Some examples of Group 2 equip-
ment are:
Medical Imaging Equipment (sys-
tems for magnetic resonance im-
aging)
Therapy Equipment (diathermy
equipment including short-wave,
ultra-short-wave, and microwave)
Terapy Equipment (hyperthermy
equipment)
High-Frequency Surgical Equip-
ment and Systems (because they
apply RF energy to the patient)
Frequency, MHz Class A dBV Class A dBV**
Group 1
Quasi-Peak
Group 1
Average
Group 2
Quasi-Peak
Group 2
Average
Group 2
Quasi-Peak
Group 2
Average
0.150.50 79 66 100 90 130 120
0.505 73 60 86 76 125 115
530 73 60 9070* 8060* 115 105
*Decreasing Linearly with the logarithm of the frequency
**Mains supply currents in excess of 100 amps per phase when using the CISPR voltage probe or a suitable V-network (Line Impedance
Stabilization Network [LISN] or Articial Mains Network [AMN])
IEC 60601-1-2 2nd Edition as amended IEC 60601-1-2:2007
1 Scope and Object 1 Scope, Object and Related Standards
Annex FFF 2 Normative References
2 Terminology and Denitions 3 Terms and Denitions
3 General Requirements 4 General Requirements
6 Identication, Marking, and Documents 5 Identication, Marking, and Documents
36 Electromagnetic Compatibility 6 Electromagnetic Compatibility
36.201 Emissions 6.1 Emissions
36.202 Immunity 6.2 Immunity
Annex AAA General Guidance and Rationale Annex A General Guidance and Rationale
Annex B Guide to Marking and Labeling Requirements for ME
Equipment and ME Systems
Annex BBB Example Completion of Table 201 through Table 208 Annex C Example Completion of Table 1 through Table 8
Annex CCC Guidance in Classication According to CISPR 11 Annex D Guidance in Classication According to CISPR 11
Annex DDD Guidance in the Application of IEC 60601-1-2 to
Particular Standards
Annex E Guidance in the Application of IEC 60601-1-2 to
Particular Standards
Annex EEE Electromagnetic Environments Annex F Electromagnetic Environments
Annex HHH Guidance for Determining if Electrical Equipment that
is not ME equipment and that is used in an ME system is exempt
from the EMC testing requirements of the collateral standard
Annex G Guidance for Determining if Electrical Equipment that
is not ME equipment and that is used in an ME system is exempt
from the EMC testing requirements of the collateral standard
Annex H Mapping Between the Elements of the Second Edition
of IEC 60601-1-2 as amended and IEC 60601-1-2:2007
Bibliography Bibliography
NOTE All annexes in Edition 3.0 are Informative.
Table 1. Annex H (abbreviated version).
Table 2. Mains terminal disturbance voltage limits for class A equipment measured on a test site (Table 2a from CISPR 11).

DNB.indd 1 2/21/2008 3:36:57 PM
82
CONDUCTED EMISSION
REQUIREMENTS
It can be seen that the Class B limits
for Group 1 equipment are anywhere
from 10 to 17 dB lower than the Class
A limits depending on the frequency
range.
Tere are additional tables of emis-
sion limits in CISPR 11 which cover (1)
Mains Terminal Disturbance Voltage
for Induction Cooking Appliances; (2)
Limits of the Magnetic Field Induced
Current in a two-meter loop antenna
around the device under test; (3) lim-
its of the magnetic eld strength; (4)
Electromagnetic Radiation Disturbance
Limits for Group 2, Class B Equipment
Measured on a Test Site; (5) Electro-
magnetic Radiation Disturbance Limits
for Group 2, Class A Equipment; (6)
Electromagnetic Radiation Disturbance
Limits for Class A Electro-Discharge
Machining (EDM) and Arc Weld-
ing Equipment Measured on a Test
Site; (7) Electromagnetic Radiation
Disturbance Peak Limits for Group 2,
Class A and Class B ISM Equipment
Producing CW-type Disturbances and
Operating at Frequencies above 400
MHz, (7) Electromagnetic Disturbance
Peak Limits for Group 2, Class B ISM
Equipment Producing Fluctuating Dis-
turbances other than Continuous Wave
(CW) and Operating at Frequencies
above 400 MHz; (8) Electromagnetic
Radiation Disturbance Weighted Lim-
its for Group 2, Class B ISM Equipment
Operating at Frequencies above 400
MHz; and (9) Limits for Electromag-
netic Radiation Disturbances to Protect
Specic Safety Services in Particular
Areas.
ME equipment and ME systems with
a rated input current of less than 16
amps per phase must comply with IEC
61000-3-2 ( EMC Part 3-2: Limits
Limits for Harmonic Current Emissions)
for harmonic distortion.
ME equipment and ME systems
with a rated input current of less than
16 amps per phase must also comply
with IEC 61000-3-3 (EMC Part 3-3:
Limits Limitation of Voltage Changes,
Voltage Fluctuations and Flicker in
Public Low-voltage Supply Systems, for
equipment not subject to conditional
connection) for voltage f luctuations
and icker.
Bot h I EC 61000-3-2 and I EC
61000-3-3 specify limits, test methods,
and test equipment.
IMMUNITY
Te Immunity requirements of -2 are
based on the International Immunity
Standards contained in the series of
IEC 61000-4-x standards where x is 2,
3, 4, 5, 6, and 11.
Te Electrostatic Discharge (ESD)
criteria are contained in IEC 61000-
4-2 (EMC Part 4-2: Testing and Mea-
surement Techniques Electrostatic
Discharge Immunity Test). Te require-
ments are that the medical equipment
shall comply with test levels of 2 kV,
4 kV, and 8 kV for air discharge and
2 kV, 4 kV, and 6 kV for contact
discharge.
Te Radiated RF Electromagnetic
Field criteria are taken from IEC
61000-4-3 (EMC Part 4-3: Testing
and Measurement Techniques Radi-
ated, Radio-Frequency, Electromagnetic
Field Immunity Test). Te test require-
ments are 3 volts per meter over the
frequency range of 80 MHz to 2.5 GHz
for Non-Life-Supporting equipment
and 10 volts per meter over the same
frequency range for Life-Supporting
equipment.
For Electrical Fast Transients and
Bursts, medical equipment shall have
an immunity test level of plus or minus
2 kilovolts for alternating current and
direct current power lines and plus or
minus 1 kilovolt for signal and intercon-
necting cables. Te test method shall be
as per IEC 61000-4-4 (EMC Part 4-4:
Testing and Measurement Techniques
Electrical Fast Transient/Burst Im-
munity Test) which simulates electrical
noise from switching relays.
Surge testing is also covered in IEC
60601-1-2, and the testing is done as
per IEC 61000-4-5 (EMC Part 4-5:
Surge Immunity Test). Te require-
ments to be met are test levels of 0.5
kV, 1 kV, and 2 kV for alternating
current power lines to ground and 0.5
kV and 1 kV for alternating current
phase-to-phase voltage testing. This
test simulates secondary effects of
lightning discharges.
Te next immunity test is for con-
ducted disturbances induced by RF
fields as per IEC 61000-4-6 (EMC
Part 4-6: Testing and Measurement
Techniques Immunity to Conducted
Disturbances, Induced by Radio-Fre-
quency Fields). Te test level require-
ment shall be 3 volts (rms) over the
frequency range of 150 kHz to 80 MHz
for Non-Life-Supporting Equipment.
Te RF signal shall be modulated at ei-
ther 2 Hz or 1000 Hz depending on the
intended use of the equipment under
test. Life-Supporting Equipment shall
meet 3 volts (rms) over the frequency
Table 3. Mains terminal disturbance voltage limits for class b equipment measured on a test site
(Table 2b in CISPR 11).
Frequency, MHz Class B dBV Class B dBV
Groups 1 and 2, Quasi-Peak Groups 1 and 2, Average
0.150.50 6656* 5646*
0.505 56 46
530 60 50
*Decreasing Linearly with the logarithm of the frequency
Frequency, MHz Test Site In Situ
Group 1, Class A, 10
meters, dBV/m
Group 1, Class B, 10
meters, dBV/m
Group 1, Class A, 30
meters*, dBV/m
0.1530 Under Consideration Under Consideration Under Consideration
30230 40 30 30
2301000 47 37 37
*30 meters from the wall of the building in which the equipment is located
Table 4. Electromagnetic radiation disturbance limits for Group 1 equipment (Table 3 in
CISPR 11).
KHA3000/1000
Harmonic/Flicker Analyzer
KES4021
Electrostatic Discharge Simulator
Complying with International Standars.
Best Suited to EMC Testing for Automotive Components.
PCR-LA SERIES
EMC Test System for
Automotive Electronics
Harmonic and ficker analyzer compliant with
the latest versions of the IEC and JIS standards
PLZ6000R
6kW Regenerative DC Electronic Load
KES7000 SYSTEM
EMC Test System for Automotive Components
Complies with
EN/IEC61000-4-2 standard
High Quality Multifunction
AC Power Source
Power regeneration efciency of up to 90% or more!
Environment-friendly,Energy Saving
Energy Saving!
KES7800 SERIES
Field Decay Surge Generator
Kikusui.indd 1 2/25/2008 3:01:49 PM
84
range of 150 kHz to 80 MHz except at
the ISM frequency bands in that range
where the EUT must meet 10 volts
(rms). Tis test simulates cables acting
as receiving antennas and converting
radiated elds into conducted RF sig-
nals on the cables.
Te last immunity test is a test for
Voltage Dips, Short Interruptions, and
Voltage Variations on Power Supply
Input Lines. Te appropriate standard
is IEC 61000-4-11 (EMC Part 4-11:
Voltage Dips, Short Interruptions, and
Voltage Variation Immunity Tests). Te
criteria to be met are summarized in
Table 10 of -2. Equipment and systems
that are not life-supporting and that
draw more than 16 amps per phase are
exempt from this testing. Non-Life-
Supporting Equipment and Systems
with a rated input power of 1 kVA or
less and all Life-Supporting Equipment
and Systems shall comply with the cri-
teria in Table 10. Some exceptions to
the requirements are allowed for Non-
Life-Supporting equipment that draws
more than 1 kVA of power but less than
16 amps per phase. Tis is a test that
simulates everyday power uctuations
in the input alternating current power
lines that feed the power supplies of the
medical device equipment.
NON-TESTING REQUIREMENTS
OF IEC 60601-1-2
Non-testing requirements of the stan-
dard are covered in Clause 5 of Edition
3.0 and include identication, marking,
and accompanying documents.
Identifcation and Marking
ME equipment and ME systems that
include RF transmitters or that in-
tentionally apply RF electromagnetic
energy for diagnosis or treatment shall
be labeled with the following symbol
for non-ionizing radiation:
For ME equipment and ME systems
for which the connector testing ex-
emption specied in 6.2.2.2 c) is used,
symbol IEC 60147-5134 (2003-04) for
ESD sensitivity shall be applied adjacent
to each connector for which the testing
exemption is used.
ME equipment and ME systems
specied for use only in a shielded lo-
cation shall be labeled with a warning
that they should be used only in the
specied type of shielded location.
Accompanying Documents
In the Instructions for Use, all ME
equipment and ME systems shall in-
clude the following:
A statement that medical electrical
equipment needs special precau-
tions regarding EMC and needs to
be installed and put into service
according to the EMC information
Test & Calibration Services
Antenna Calibration EMF Probe Calibration
Over-The-Air Testing Radiated Performance Testing
Chamber NSA Measurement
www.ets-lindgren.com/services
Corporate Offices: USA + 1.512.531.6400 info@ets-lindgren.com Offices in the US, Finland, UK, France, Singapore, Japan, China, Taiwan
HOOLI HAN
85
provided in the accompanying documents; and
A statement that portable and mobile RF communica-
tions equipment can aect medical electrical equip-
ment
In the Technical Description, the accompanying docu-
ments for all ME equipment and ME systems shall include
the following:
A list of all cables and maximum lengths of cables (if ap-
plicable), transducers, and other accessories with which
the manufacturer of the ME equipment and ME system
claims compliance with the requirements of 6.1 and 6.2.
Accessories that do not aect compli-
ance with the requirements of these
subclauses need not be listed. Acces-
sories, transducers, and cables may
be specied either generically (e.g.,
shielded serial cable, load impedance)
or specically (e.g., by manufacturer
and model or part number).
A warning that the use of accessories,
transducers, and cables other than
those specied, with the exception
of transducers and cables sold by
the manufacturer of the equipment
or system as replacement parts for
internal components, may result in
increased emissions or decreased
immunity of the ME equipment or
ME system.
A warning that the ME equipment
or ME system should not be used
adjacent to or stacked with other
equipment and that if adjacent or
stacked use is necessary, the ME
equipment or ME system should be
observed to verify normal operation
in the conguration in which it will
be used.
A justication for each compliance
level that is lower than the IEC 60601
test level for that immunity test.
Tese justications shall be based
only on physical, technological, or
physiological limitations that prevent
compliance with the IEC 60601-1
test level.
Table 2 completed as per the ow-
chart of Figure 3.
Te performance of the ME equip-
ment or ME system that was deter-
mined to be Essential Performance.
Testing for Safety versus
Testing for Performance
Te activities of the Maintenance Team
working on the fourth Edition of IEC
60601-1-2 are centered around the issue
of separating the standard into two standards; one for Safety
(EMC and Safety are considered separate concepts) and one
for EMC for Performance. Tis is a very di cult concept to
implement in the standard.
Te major dierence would be that for a Safety standard
a medical device could fail an immunity test as long as it
failed safely. Tat is, if the equipment shut down yet did not
harm the patient in any way (did not create an unacceptable
risk), that could be an acceptable outcome.
However, in the EMC Performance standard, if the medi-
cal device were to fail an immunity test at a standard level
EMI/EMC SOLUTIONS & SERVICES
The Electronics Test Centre brings compliance, certification services, customized test
and engineering to the Aeronautical, Automotive, Medical, Military, and Commercial and
Telecommunications industries.
Our key assets are our staff. NARTE Certified Engineers and E3 Technologists brings a
broad range of expertise and experience to our facility since 1988.
EMC testing in support of Transport Canada, FAA and EASA certified aircraft
and engine systems for Aircraft Type Certification Programs.

Tel: (613) 599-6800 Fax: (613) 599-7614
www.etc-mpb.com sales@etc-mpb.com
ETC Service Highlights:
EMI/EMC Testing & Consultation
HIRF [greater than 200 V/m]
Lightning [up to Level 5 & Beyond]
Pin, SS, MS, MB
Surge and Customized Transients
T-PEDS
RF Site Surveys
Shielding Effectiveness
Transmissivity Testing Safety
v
v
v
v
v
v
v
v
Lab Highlights:
NARTE Certified Technicians, E
3
Technologists
& Electrical/Mechanical Engineers
5 Anechoic Chambers
HIRF Test Facilities
High Voltage Lab
Mechanical Engineering & Design
Engineering and analysis of materials
and components
Custom Fabrication
Machining, MIG, TIG Welding
v
v
v
v
v
v
Aeronautical [DO-160, Airbus, Boeing]
Automotive [SAE, CISPR, ISO]
Commercial / Telecom [CISPR, CE Mark,
ANSI, Telcordia, FCC, IC]
Military & Defence [Mil-Std, DEF-STAN]
v
v
v
v
Medical [CISPR]
Railway [EN] EMC & Surges
Space & Nuclear
Wireless [FCC, Industry Canada,
European]
v
v
v
v
Compliance & Certification Testing Industries:
86
MORE ON OUR WEBSITE
of electromagnetic inuence, that medical device would
have to be redesigned so that it could pass the minimum
standard level of electromagnetic energy specied in the
test.
CONCLUSION
Te -2 standard is increasingly important in the electrical
medical device world. Equipment that complies with the
requirements of the standard has the potential of being
used seamlessly around the world.
Te concept of EMC for Safety and EMC for Performance
is being debated relative to the next edition of the standard.
Stay tuned as the Maintenance Team for the international
standard discusses the multitude of technical and adminis-
trative issues relative to the Safety/Performance split.
Dan Hoolihan is a past president of the IEEE EMC Society. He has
been a member of the Board of Directors since 1987 and has held numer-
ous leadership positions in the society. Dan is also active on the ANSI
Accredited Standards Committee on EMC, C63 as Vice Chairman. He
was co-founder of Amador Corporation (1984-1995). He can be reached
at DanHoolihanEMC@aol.com.
Testing medical equipment against stringent EMI and
reliability standards is more than good practice; it can
literally be a matter of life or death. The latest EMC
standards for medical equipment and other electronics
can be found on the new InterferenceTechnology.com.
Check the Standards Update section for the latest
developments.
SUPPLIERS TESTING & EQUIPMENT (continued from page 40)
EM TEST ............................................................................ 34, 40
Reinach (BL), SWITZERLAND; +41 61 717 91 91; www.
emtest.com
ETS-Lindgren .............................1, 9, 84, 169, 177, Back Cover
Cedar Park, TX; 512-531-6400; www.ets-lindgren.com
Fischer Custom Communications ....................................... 25
Torrance, CA; 310-303-3300; www.schercc.com
Garwood Laboratories, Inc. .................................................. 55
Pico Rivera, CA; 888-427-4111; www.garwoodtestlabs.com
HV TECHNOLOGIES, Inc. ...................................................... 31
Manassas, VA; 703-365-2330; www.hvtechnologies.com
Ingenium Testing, LLC........................................................... 43
Rockford, IL ; 815-315-9250; Jim.Blaha@IngeniumTesting.
com
Instruments For Industry (IFI) ................................ 1721, 193
Ronkonkoma, NY; 631-467-8400; www.i.com
Intertek - Boxborough (Headqtrs) ....................................... 45
Boxborough, MA; 1-800-WORLDLAB; www.intertek-
etlsemko.com
Kikusui America Inc. .............................................................. 83
San Jose, CA; 800-KIKUSUI; www.kikusui.us
Liberty Labs, Inc. .................................................................... 63
Kimballton, IA; 712-773-2199; www.liberty-labs.com
MILMEGA Ltd ......................................................................... 23
Ryde, UNITED KINGDOM; +44 (0)1983 618004; www.
milmega.com
NAWCAD E3 DIVISION - Code 5.4.4.5.................................. 47
Patuxent River, MD; 301-342-1663; www.nawcad.navy.mil
NCEE Labs ............................................................................... 52
Lincoln, NE; 402-472-5880; www.nceelabs.com
Nemko Inc. .............................................................................. 54
Ottawa CANADA; 613-737-9680; www.nemko.com
Noise Laboratory Co., Ltd. .................................................... 26
Sagamihara City, JAPAN; 81-42-712-2051; www.noiseken.
com
HOOLI HAN
87

A2LA Accredited
CE Mark Testing
200 Volts per meter
NARTE certified EMI engineers
Full service engineering support
FULL VEHICLE ANECHOIC CHAMBER
DOC, FDA, FCC, RTCA, MIL-STD, SAE testing

2
0
0
8

R
a
d
i
o
m
e
t
r
i
c
s

M
i
d
w
e
s
t

C
o
r
p
.
(815)293-0772 www.radiomet.com
OPHIR RF ................................................................................. 39
Los Angeles, CA, 310-306-5556, www.ophirrf.com
Pearson Electronics, Inc. ....................................................... 40
Palo Alto, CA; 650-494-6444; www.pearsonelectronics.
com
Radiometrics Midwest Corp. ............................................... 87
Romeoville, IL; 815-293-0772; www.radiomet.com
Ramsey Electronics ............................................................... 33
Victor, NY; 585-924-4560; www.ramseytest.com
Retlif Testing Laboratories ................................................... 73
Ronkonkoma, NY; 631-737-1500; http://www.retlif.com
Sunol Sciences Corporation ................................................. 65
Pleasanton, CA; 925-485-9260; www.sunolsciences.com
Sypris Test and Measurement - Corporate Ofce ............. 77
Orlando, FL; 800-839-4959; www.wetest.com
TDK CORPORATION ............................................................... 11
Mount Prospect, IL ; 847-803-6100 ; www.tdk.com
TESEQ Inc. ............................................................................... 68
Edison, NJ; 732-417-0501; www.teseq.com
Thermo Fisher Scientic ....................................................... 51
Lowell, MA; 978-275-0800; www.thermo.com/esd
TMD Technologies Ltd .......................................................... 29
Hayes, United Kingdom; +442085735555; www.tmd.co.uk
TV Rheinland of North America, Inc. ............................... 76
Newtown, CT ; 203-426-0888; www.tuv.com
Underwriters Laboratories, Inc. .......................................... 75
Northbrook, IL; 847-272-8800; www.ul.com/hitech/emc
White Sands Test Center E3 Test Facilities ........................ 58
White Sands Missile Range, NM ; 505-678-6107; john.
chavarria@wsmr.army.mil
EMCC
DR. RAEK
EMC
in VEHICLES
EMC, RADIO, TELECOM
ENVIRONMENT, SAFETY
TM
CONSULTING, PLANNING
EMI INVESTIGATION
TESTING, SUPPRESSION
EXPERT OPINION, CERTIFICATION
SEMINARS
A2LA/ AEMCLAP/ AEMCLRP,
EA/ DAR/ DATech, . KBA
ACCREDITED, EBA RECOGNIZED
EMCC DR. RAEK
Moggast, Boelwiese 4-8 91320 Ebermannstadt
Germany
T: +49- 9194- 9016 F: +49- 9194- 8125
partner@emcc.de www.emcc.de
88
conductive materials THERMOPL ASTI C MATERI ALS
ANN MARIE BURNELL, PH.D.
SABIC Innovative Plastics
Exton, PA
T
he electromagnetic spectrum is
one fundamental facet of our known
worldfrom the visible light seen by
the tiniest child to the properties of terahertz
rays still under study at cutting edge research
facilities. On the other hand, plastics, espe-
cially new thermoplastic materials, have to
be counted among humankinds more recent
accomplishments. Happily, careful consider-
ation and a thorough understanding of the
physical properties of both the EM spectrum
and modied thermoplastics can lead to more
eective ways of controlling the EM environ-
ment in both existing and new applications.
One of first basic design questions in-
volved when undertaking the design of an
electrical/electronic device is essentially a
simple yes or no decision. Is the device to
be transparent to electromagnetic waves,
or should some material be used to shield
against, deect, attenuate, absorb, or reect
electromagnetic waves. Although there are
a number of ways to manage EM radiation,
the following article focuses on innovative
thermoplastics. Tese new materials with
their intrinsic shielding capability oer a wide
array of design, performance, environmental,
and economic benets.
DEALING WITH THE EM
SPECTRUM
By denition, the EM spectrum is a con-
tinuum of all electromagnetic waves arranged
according to frequency and wavelength, as
shown in Figure 1. Generally, EM radiation
is classied by wavelength into a variety of
types of radiation, including radio waves,
microwaves, X-rays, and gamma rays. Ma-
terials, including compounded engineering
thermoplastics, play a unique role in device
design by enabling the device to interact ap-
propriately with electromagnetic radiation.
In engineering thermoplastics and fiber-
reinforced composites (FRPs), the choice of
resin, ller, and reinforcing agent strongly
inuences the response the material will have
to EM radiation.
NEW APPROACHES TO EMI/RFI
DEVICE SHIELDING
Many devices such as televisions, mobile
phones, wireless networks, automotive
infotainment, and medical devices use
radio waves for the transmission of voice
or data. Teir performance, however, can
be compromised if electromagnetic inter-
ference is not managed. For example, new
medical devices are being designed for
portability, allowing faster diagnosis and
patient assessment in remote locations such
as doctors o ces, battleelds, or the scene
of accidents. It is critical that these devices
perform with high precision and e ciency
for accurate diagnostics. Consequently,
EMI/RFI interference must be controlled.
Shielding can be provided using enclosures
that protect the device and/or surrounding
devices from electromagnetic interference.
However, the weight of metal enclosures
may interfere with the portability of medi-
cal devices. Termoplastic materials with
shielding capability not only oer weight
Thermoplastic materials with inherent
shielding improve management of the
electromagnetic spectrum
New materials offer a wide array of design, performance, environmental,
and economic benef ts.

PROTECT YOUR IDEAS.
A good idea can only become a great idea if it gets the job done right. So 3M has expanded its line of EMC products to provide
more ways to control electromagnetic interference from internal sources, help limit EMI susceptibility from external sources and
help manufacturers meet high certication standards around the world. Our growing list of EMC products includes EMI shielding
foil, fabric tapes, sheets and lms as well as EMI braided sleeving, EMI absorbers, gaskets and conductive materials, and
conductive transfer adhesives. Protect your ideas, and your product integrity, with innovative products and global support from 3M.
For more information, visit www.3M.com/emc, email us at electrical@3M.com or call 800-676-8381.
2008 3M. All rights reserved.
More EMC Products and Solutions than Ever Before.
083MHA103-InterferenceTech-EMC GTP indd 1 2/26/08 9:20:17 AM
3M.indd 1 2/26/2008 12:40:01 PM
90
savings, but also more exibility in
design, colorability, and part consoli-
dation.
Traditional thermoplastic housings,
which are inherently electrically insu-
lating, can be made suitable for electro-
magnetic shielding by applying a metal
liner to the interior of the housing, by
adding a coating with a metal layer, or by
using vacuum metallization technology.
While oering good electromagnetic
shielding performance, these methods
introduce additional costs associated
with the unit build such as racking, x-
turing, masking, tooling, and in-process
handling. In addition, these operations
might impact lead times, and some
have implications for the environment.
Coating parts with metalssuch as
coppercan make it di cult to achieve
a uniform, durable thickness in all areas,
particularly those with complex features
and deep draws. Moreover, once the
part is coated, shielding eectiveness
may be compromised by defects such
as scratches or by damage to the metal
coating occurring during assembly or
use.
In contrast, the use of thermoplastics
with inherent, rather than added, EMI/
RFI shielding capability can shorten
cycle time, improve performance, and
reduce overall system costs. Te shield-
ing properties of engineering thermo-
plastics can be changed through the
incorporation of conductive llers and/
or reinforcements. Typical conducting
llers include carbon ber, stainless steel
fiber, graphite, nickel-coated carbon
ber, silver-based additives, and carbon
nanotubes. Te inherent conductivity,
volume percentage, and dispersion of the
conductive additive in the thermoplastic
aect the volume resistivity and surface
resistivity of the nal part. For instance,
the same additive may be used to design
thermoplastic solutions to control the
dissipation of electrostatic charge at
lower loadings or to impart EM shielding
capability at higher volume loadings.
CHOOSING THE RIGHT
SHIELDED THERMOPLASTIC
To choose the right inherently shielded
thermoplastic, it is important to under-
stand the other properties needed in
the device enclosure while in use and at
end of life. Large enclosures, requiring
enhanced rigidity, such as in telecom
applications, benet from materials con-
taining reinforcing bers. An enhanced
stiness-to-weight ratio can be designed
into the material with fibers such as
carbon ber or nickel-coated ber, or
via combinations of a non-reinforcing
conductive material with an electromag-
netic transparent ber such as glass.
Another material selection criterion
is color. When pre-colored materials
are needed, compositions based on
melt-processable stainless steel bers
oer more versatility than carbon ber
(given its black color). From the overall
systems perspective, incorporating
melt-processable stainless steel bers
in thermoplastics is more durable and
usually cost-eective than metalliza-
tion processes. Tis approach also oers
weight reduction and corrosion resis-
tance, as well as design and manufactur-
ing exibility compared to metallized
designs. Additionally, this type of system
helps meet di cult environmental chal-
lenges such as conforming to the end-of-
life disposal guidelines of the European
Waste Electrical and Electronic Equip-
ment (WEEE) directive. Typically, with
this technology, shielding values ranging
from 40 to 60 dB can be obtained under
far-eld conditions, a range su cient for
most civilian applications.
GENERAL PROCESSING
GUIDELINES
Since inherently shielded thermoplastics
Figure 1. The Electromagnetic Spectrum.
Figure 2. A Transcranial Doppler Device using an inherently conductive plastic compound as a
cost-effective and lightweight EMI shielding solution for the devices housing.
Adaptable,
Constantly Changing!
ISO 9001:2000
Certified
The TGAR System Makes Automotive Conducted Immunity Testing Simple, Easy And Flexible.
The innovative, user-friendly TGAR System is so flexible it can handle most existing specs and most new ones. More than
likely, youll never have to buy another transient generator system.
The feature you want are finally here! Base current rating of 100 amps, covers a large amount of existing specs and is capable of
generating custom pulses. Meets the requirements of ISO 7637-2 (2004), SAE J1113-11, JASO and SAE J1455 International
Automotive Standards. It also meets the requirements of Ford, DaimlerChrysler, General Motors; and many of the test specs of
Toyota, Honda, BMW, Mercedes Benz, and more. As software updates come along, just download them from our website.
It has a built-in oscilloscope for easy pulse verification and self-calibration, and the test data is conveniently included in the
DUT test report. Lab-View based software and built-in arbitrary waveform generators allow users to create custom waveforms.
It even includes a built-in auxiliary power supply.
New Lower-Cost System
A second, lower cost TGAR system with a base current rating of 32 amps is now available.
Both systems are backed by the most comprehensive warranty in the industry and by the AR global support team.
For more information, visit www.ar-worldwide.com or call 215-723-8181.
AR TGAR.indd 1 4/3/2008 3:18:59 PM
92
are designed with the optimum loading
of additives, long-term integrity of the
conductive additive and optimum dis-
persion in the thermoplastic matrix are
critical. Tese materials can be processed
on conventional injection molding
equipment using controlled processing
conditions to prevent ber attrition and
to ensure optimal shielding properties.
General recommendations include rela-
tively high melt and mold temperatures;
gentle plasticizing; minimum injection
pressures; and low back-pressure during
screw recovery. At elevated tempera-
tures, the viscosity of the composite melt
is reduced, allowing lower processing
pressures that result in less shearing ac-
tion, less ber attrition, and an optimum
stainless steel ber network. Hot runner
systems can be used to process stainless
steel filled compounds. Designs that
utilize open nozzle or needle shut-o
valves are preferred over torpedo-shaped
hot runners as the latter design results in
excess ber attrition and reduced shield-
ing eectiveness (SE).
Additionally, wall thickness plays a
role in determining overall shielding
performance. Managing wall thickness
can reduce ber attrition during injec-
tion molding that can result from the
increased pressure and shear stresses
required to ll thinner walled sections.
As a general guideline, minimum wall
thicknesses of 2 mm, along with gener-
ous radii on corners and gradual wall
thickness transitions, are recommended
to minimize ber attrition during lling
and forming.
DESIGN CONSIDERATIONS
Material selection and processing are
not the only considerations in achiev-
ing optimal shielding eectiveness for
enclosures. Other key factors are part
thickness, part geometry, joint design,
aperture design, and grounding solu-
tions. For example, enclosures are often
injection-molded in two halves. During
assembly, any imperfections in tting
together the two halves can create losses
of the electrical performance in the nal
system. It is important to achieve con-
tinuity between the two halves. Good
contact at the interface of the two parts
is critical to minimize impedance and to
avoid the formation of a slot antenna
that leaks electromagnetic radiation.
Employing joint design to increase area
contact via lap or tongue-and-groove
joints will reduce contact impedance.
Traditional techniques such as the
use of ultrasonic or vibration welding,
interference fits, self-tapping screws,
or conductive gaskets may also reduce
contact resistance.
The attenuation effectiveness of a
shield will be reduced by electromag-
netic energy leakage at joints, seams,
holes, and slots. Clearly, reducing the
negative eects associated with these
openings through design is important
for effective performance, regardless
of shielding method or material (metal
or thermoplastic). For example, holes
and slots are typically designed into the
enclosure for vents or access points, but
these may act like windows for electro-
magnetic radiation to escape or to pen-
etrate a shield if not designed properly.
Aperture size, wavelengths of the radi-
ant eld, and orientation of the aperture
relative to the plane of propagation of
the electromagnetic eld all impact the
susceptibility of the device to leakage.
It is recommended that designers use
many small holes to allow for less leak-
age rather than a large hole of the same
area. Also, narrow, short, deep holes are
preferable to wide, shallow slots. Holes
should be positioned perpendicular to
the external magnetic eld and parallel
to the external electric elds.
CONCLUSION
Employing thermoplastic materials with
electromagnetic interference shield-
ing for the enclosures of electronic
devices in healthcare and many other
industries oers a variety of advantages
over traditional shielding materials.
Termoplastics, which can be partnered
with a variety of conductive llers and/or
reinforcement materials, oer enhanced
design capabilities, the potential for
parts consolidation, weight reduction,
increased portability, and improved
corrosion resistance as compared to
metallized thermoplastics. With these
capabilities, device designers can gain
productivity and cost advantages and
enhanced compliance with environ-
mental regulations. Te usefulness of
inherently shielding thermoplastics as
enclosure materials will continue to
expand with new material performance
capabilities in combination with opti-
mized part design and proper processing
techniques.
BIBLIOGRAPHY
http://en.wikipedia.org/wiki, accessed January
2008.
Fagan, J., Shielding Issues with Plastics, Confor-
mity (April 2007), pp. 4049.
Fagan, J., et al., Stainless Steel Filled Termo-
plastic Composites for Use in Electromagnetic
Shields in Automotive Electronics.
SABIC Innovative Plastics Literature, LNP
Faradex Compounds avai lable through
http://www.geplastics.com/gep/Plastics/en/
ProductsAndServices/ProductsAndServices/
products_and_services.html.
Lackey, Ellen, et al., Electromagnetic Radiation
& Composites, Manufacturing Composites
(May 2006), pp. 3467.
http://ec.europa.eu/environment/waste/weee/
legis_en.htm, accessed March 2008.
http://www.multigon.com, accessed March
2008.
http://www.geplastics.com/gep/en/NewsRoom/
PressReleaseDetail/january_29_2008_sabi-
cinnovativeplasticshelps.html.
Chromerics Corporate Literature, EMI Shielding
Design, available through www.chromerics.
com:
Schelkuno, S.A., Te Impedance Concept and
Its Application to Problems of Reflection,
Refraction, Shielding and Power Absorption,
BSTJ 17 (1938), pp. 1749.
Vaseka, G.J., Teory, Design and Engineering
Evaluation of Radio Frequency Shielded
Rooms, U.S. Development Centre, Johnsville
(PA), Report NADC-EL-54129, August 1956.
Ann Marie Burnell is Manager, LNP Global
Technology at SABIC Innovative Plastics.
MORE ON OUR WEBSITE
Conductive Materials are just one of
the EMI/EMC products that undergo
constant change and improvement.
Today, there are conductive plastics
available that were strictly in the
R&D phase just months ago. Keep up
with the latest product developments
in each weeks Interference
Technology eNews, keep an eye
on the New Products section of
InterferenceTechnology.com.
See whats in the new EMI Shielding channel today.
information in the way you need it. If EMI Shielding
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
Antennas
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
I
m
a
g
e
s

C
o
u
r
t
e
s
y

o
f

L
a
i
r
d

T
e
c
h
n
o
l
o
g
i
e
s
House Shielding.indd 1 5/4/2008 6:26:20 PM
94
conductive materials GALVANI C CORROSI ON
HARRY FUERHAUPTER
Potters Industries, Inc.
Malvern, PA
A
n on-going issue in the design
of reliable EMC shielding is galvanic
corrosion of aluminum. How can an
aluminum frame be protected from galvanic
corrosion if it contacts an EMI gasket con-
taining non-aluminum particles? Chromate
conversion coatings have long been used to
reduce the corrosion rate of aluminum, but
with RoHS restrictions on hexavalent chro-
mium [Cr(VI)], the problem becomes more
severe. A viable solution to this issue is an
aluminum-based conductive ller for EMI
gaskets that produces almost no aluminum
corrosion. It contains no silver or nickel, yet
it provides excellent shielding eectiveness
with long-term stability. Tis article describes
the mechanism of galvanic corrosion and how
it aects gasket material selection.
GALVANIC CORROSION
Unlike oxidation, galvanic corrosion is a
process that occurs by electron transfer be-
tween two dissimilar metals in a corrosive
environment. In this situation, the natural
oxidation characteristics of each metal are
enhanced such that the metal that is more
easily oxidized experiences a higher corrosion
rate than it would were it not in contact with
the other metal. Te metal that is less prone
to oxidation experiences a lower corrosion
rate than normal.
In general, a galvanic series chart of me-
tals can be used to predict which metals will
corrode faster or more slowly when placed
into contact with each other (Figure 1). Te
positions of the metals on the chart indicate
which are more noble (cathodic) and which
are more active (anodic). Te farther apart
the metals are in the series, the greater the
potential for galvanic corrosion.
Herein lies the problem. Aluminum is a
very active metalit readily forms a natural
oxide layer. Metals often selected for EMI
shielding are less prone to oxidation. Com-
bine the two metals, and the potential for
galvanic corrosion is created.
TYPICAL CONDUCTIVE FILLERS
Elastomer gaskets for EMI shielding are
typically lled with metal or metal-coated
particles that oer high conductivity. Silver-
coated particles are often chosen for appli-
cations where high performance and long-
term stability is required since silver is the
most conductive metal, and even its oxide
Solving the galvanic corrosion issue in
EMI shielding
Tungsten carbide/aluminum composite particles inhibit galvanic corrosion
of aluminum.

Figure 1. Galvanic series.
Galvanic Series of Some Metals in Seawater
N
o
b
l
e
Gold
Graphite
Silver
Stainless Steel
Nickel
Monel
Bronze
Copper
Brass Tin
Lead
Tin-lead solder
Steel or iron
Aluminum
Zinc
Magnesium

A
c
t
i
v
e
(Abbr. from Corrosion Engineering, Fontana and
Greene, 1978)

We Got
You
Covered.
No matter what your
application, Swift
Textile Metalizing
has the right
metalized material.
We offer a wide
range of woven,
nonwoven, knit and
finished articles to
meet your EMI/RFI
shielding needs.
And our durability
is second to
none. STMs
metalized fabrics
are proven performers
for gaskets, shielding
tapes, cable shielding
and composites.
STMs advanced
technology
guarantees the
results you want
every time. And
speaking of time, we
offer fast dependable
delivery on standard
items in stock.
For more
information and
for free samples,
call 860-243-1122.
When it comes to
metalized materials,
weve got you covered.
www.swift-textile.com
Swift.indd 1 2/11/2008 11:53:54 AM
96
is somewhat conductive. Based on the
galvanic series chart, if silver is put into
contact with aluminum in a corrosive
environment, the aluminum corrosion
rate will signicantly increase because
of galvanic coupling. For this reason,
some manufacturers have chosen nickel
or nickel-coated graphite as a non-silver
alternative ller. Research shows, how-
ever, that this can cause more aluminum
corrosion than some silver-coated llers.
Initially, this may seem contrary to the
galvanic series chart, but there is a viable
explanation.
While the galvanic series holds true
for metals and metal alloys that con-
tact each other, the behavior of core/
shell particles follows a more complex
galvanic coupling mechanism. In a
paper presented at the 2004 IEEE/EMC
Symposium,
[1]
it was demonstrated that
core/shell particles take on the galvanic
characteristics of the core material rat-
her than the coating. Terefore, a nickel-
coated graphite particle would behave
more like graphite than nickel, and
silver-coated aluminum would behave
more like aluminum than silver.
Salt spray corrosion tests made with
uorosilicone gaskets lled with silver-
coated aluminum and nickel-coated
graphite proved that the predicted beha-
vior of the particles followed that of the
core material. Aluminum corrosion, as
measured by weight loss of an aluminum
coupon in contact with the gaskets, was
signicantly higher for nickel/graphite
than silver/aluminum (Figure 2). Tis
finding is explained by the fact that
graphite is at the opposite end of the gal-
vanic series from aluminumthereby
setting up a strong galvanic couple with
an aluminum frame.
AN IMPROVED CONDUCTIVE
FILLER
Based on earlier research, it would ap-
pear that the best conductive ller for a
gasket that contacts aluminum would be
aluminum. However, aluminum forms
a natural oxide layer that is electri-
cally resistive, which makes aluminum
particles a poor choice for conductive
llers. Signicantly, there is a technique
for bridging the oxide layer of the alu-
minum particle to make the particles
more conductive without adding a metal
coating.
[2]
Te unique particle has an aluminum
core with a tungsten carbide coating.
Te tungsten carbide (WC) particles
actually penetrate the aluminum oxide
layer and act as multiple expressways
for electron ow between aluminum
particles (Figure 3). Tungsten carbide
itself is not a metal, yet it has an electri-
cal resistivity similar to stainless steel
(70 -cm). Powder resistivity measu-
rements show the eectiveness of this
composite particle as compared to pure
aluminum (Figure 4).
Te best feature of tungsten carbide is
that it has virtually no galvanic coupling
with aluminum. It is a galvanically inert
material. Tis allows the composite WC-
Al particle to be extremely compatible
with aluminum frames, as if aluminum
were in contact with aluminum. Salt
spray tests made with aluminum cou-
pons in contact with uorosilicone gas-
kets lled with WC-aluminum, silver/
aluminum, and nickel/graphite conrm
the superior compatibility of the WC-
aluminum particle (Figure 5).
EMI SHIELDING AND STABILITY
OF WC-ALUMINUM
For a ller material to be of use in an EMI
shielding gasket, properties other than
aluminum compatibility are important.
Gaskets lled with 70% by weight of a
45-m diameter WC-aluminum ller
were sent to an accredited testing labora-
tory for analysis. Test methods described
in the standard MIL-DTL-83528C were
used.
An interesting aspect of WC-alu-
minum filler is that it has excellent
shielding properties even though it is
not as conductive as silver-coated ller
materials (Figures 6 and 7). Other ma-
terials, such as nickel/graphite, are also
Filler
Al wt loss (mg)
168 hr 500 hr
Ag/Al 8.7 28.6
Ni/C 29.3 127.4
Aluminum >250 M-cm
Aluminum + 15 wt% WC 0.8 1.2 -cm
Aluminum + 20 wt% WC 0.5 0.9 -cm
Aluminum
Tungsten
Carbide
Aluminum
Oxide Layer
Figure 2. Aluminum corrosion in salt spray.
Figure 3. WC penetration of aluminum
particles.
Figure 4. Powder resistivity of 60 m diameter
powder.
1
10
100
1000
WC-Aluminum Silver/Aluminum Nickel/Graphite
168 hr Wt Loss 500 hr Wt Loss
W
e
i
g
h
t

L
o
s
s

(
m
g
)
Figure 5. Aluminum corrosion in salt spray.
FUERHAUPTER
97
conductive materials
known to show this behavior.
POTENTIAL USES OF WC-ALUMINUM
Considering the combination of benecial properties exhib-
ited by WC-aluminum powder, creative product designers
will no doubt nd multiple uses for this unique material.
High corrosion environments
Marine environments are particularly severe high corrosion
situations where almost any conductive metal in contact
with aluminum will cause aluminum pitting. WC-aluminum
would be ideal for these environments.
High sulfur environments
Silver is especially prone to reaction with environmental sul-
fur. Te black silver sulde that develops on the surface of a
gasket lled with silver-coated ller will signicantly increase
its electrical resistivity. Situations in which exposure to fuel
vapors is unavoidable would benet from the non-silver ller,
WC-aluminum.
Shielding Effectiveness of WC/Al Gaskets
0
20
40
60
80
100
120
140
0.01 0.1 1 10 100 1000 10000
Frequency (MHz)
Radiated
Transfer Impedance
S
E

(
d
B
)
Specic Gravity 3.55 g/cc
Hardness 74 Shore A
Tensile strength 325 psi
Tear strength 45 psi
Elongation 160%
Volume resistivity 1.87 -cm
Volume resistivity after life testing
(48 hours at 200 C)
2.00 -cm
Electrical stability
during vibration
During 2.87 -cm
After 1.46 -cm
Volume resistivity after
electromagnetic pulse (EMP)
exposure
.043 -cm
Figure 6. Gasket properties with 70 wt% WC-aluminum.
Figure 7. Shielding effectiveness of WC/Al gaskets.
EEEEEEEEEMMMMMMMMIIIIIIIIIIIIIII ggggggggeeeeeeettttttttttttttttiiiiiiiinnnnnnnggggggg yyyyyyyyyooooooouuuuuuu ddddddddooooooooowwwwwwwwwwwwwwwwnnnnnnn???????? EEEEEEEEEEEEEEMMMMMMMMMMMMMMIIIIIIIIIIIII gggggggggggggeeeeeeeeeeeetttttttttttttttttttttttttiiiiiiiiiiiiinnnnnnnnnnnnggggggggggggg yyyyyyyyyyyooooooooooouuuuuuuuuu dddddddddddddoooooooooooowwwwwwwwwwwwnnnnnnnnnnnn??????????
Resonances in your PCB, leading to EMI,
can ruin your day.
With ICs running at increased frequencies, simultaneous
switching noise is causing resonances in power distribution
planes. Utilizing FaradFlex
ultra-thin power/ground planes

will greatly reduce resonances in your PCB design resulting
in:
Eliuination of uany discrete capacitors (and associated
vias and traces)
Feduced EMl.
So if you want to build it right the rst time
use FaradFlex
Standard FR-4 with

34 discrete capacitors
0.1F each
FaradFlex P/G planes
with no capacitors
Simulation service provided by TechDream Inc. using
Contacts: John Andresakis (518) 686-8088
Bob Carter (503) 313-1905
Visit us at www.oakmitsui.com
98
Nickel-Coated Carbon Fiber, Gold-Coated
Nickel and Gold-Coated Nickel Graphite
NOW AVAILABLE!
Strong chemical exposure
Certain medical and military applications call for exposure
to strong chemicals such as bleach for disinfection. Many
metals are aected by this treatment. Tungsten carbide
is a very chemically resistant material, and it enhances
the chemical resistance of the composite WC-aluminum
particle.
SUMMARY
Galvanic corrosion is a recurring problem with aluminum
that product designers must face. Te solution is to prevent
the formation of a galvanic couple with aluminum in the
rst place. Te conductive ller for EMI gaskets that has the
least amount of galvanic corrosion on aluminum is a unique
WC-aluminum composite particle.
REFERENCES
[1] A.R. Pawlowych, Galvanically compatible elastomeric gasketing mate-
rial for EMI shielding applications, 2004 IEEE/EMC Symposium, Santa
Clara, CA, August 9-13, 2004.
[2] R.J. Teichmann, Galvanically compatible conductive ller, US Patent
5,175,056.
Harry Fuerhaupter is a Principal Chemist with Potters Industries.
He manages the R&D activities for the Conductives product group, which
includes developing new conductive llers and nding new applications for
them. He can be reached at Harry.Fuerhaupter@pqcorp.com.
MORE ON OUR WEBSITE
SUPPLIERS CONDUCTIVE MATERIALS
Conductive Materials .......................................................... 89
3M Electrical Products
Austin, TX, 800-676-8381, www.3M.com/emc
Oak-Mitsui Technologies .................................................... 97
Hoosick Falls, NY; 518-686-4961, www.oakmitsui.com
Sulzer Metco (Canada) Inc. ................................................ 98
Fort Saskatchewan, CANADA; 780-992-5280; www.
conductivellers.com
ISO 9001: 2000
Swift Textile Metalizing LLC .............................................. 95
Bloomeld, CT; 860-243-1122; www.swift-textile.com
Protecting electronics with conductive materials may not be
new, but todays new formulations and products rise to the
challenge as never before. Keep up with the latest product
releases by visiting the new InterferenceTechnology.com,
and be sure to check out the extensive choices for conductive
materials listed in the Products and Services section.
Leaders in EMI
For all your EMI requirements, contact sales@lairdtech.com today!
EMI SHIELDING
Laird Technologies EMI shielding solutions include:
Board-level shields
Electrically conductive elastomers
Fabric-Over-Foam shielding gaskets
Vent panels
Form-In-Place
Microwave absorbers
Electronit mesh
Fingerstock
SIGNAL INTEGRITY
Laird Technologies filtering solutions include:
Ferrite EMI cable cores
Connector plates
Unique common mode chokes
CAN-bus chokes
High-current thru-hole and surface mount components
Impedance chip beads
Surface mount inductors
Toroid inductor cores
Laird.indd 1 4/28/2008 7:24:20 PM
100
shielding RF SHI ELDI NG SELECTI ON CONSI DERATI ONS
GARY FENICAL
Laird Technologies
St. Louis, MO
INTRODUCTION
D
esigners must attenuate RF
signals for various reasons. Since a
product cannot be legally marketed
unless it meets EMC requirements, design-
ers must curtail RF signals above a certain
limit. It is important to consider RF shielding
materials at the beginning of a design project
because choosing the correct kind of shield-
ing upfront assures that an electronic device
will achieve optimum functionality. It also
assures that any EMI issue can be found and
resolved early in the design process, a design
strategy that saves both time and money.
Such forethought also speeds the latest prod-
ucts to market and to protability.
Filtering can be very eective in many
instances, but can have an impact on signal
integrity. In contrast, shielding materials
achieve suppression, but have no eect on
the wave shape or the intended operation of
the signal path. Because the shielding mate-
rial is not inserted into the circuit, it has no
aect on the high frequency operating speed
of the system. Moreover, its eectiveness will
not change should alterations be made to
the design some time in the future. Shield-
ing does not create timing problems and
waveform distortion, nor does it decrease
system reliability. It does, however, reduce
crosstalk. Plus, shielding oers the added
benet of handling both emission and sus-
ceptibility problems. In fact, shielding will
increase immunity even if it was installed
only for emission suppression. RF gaskets
can be used to provide isolation between
anything from individual components to
entire sections of complete systems.
In todays sophisticated electronic de-
vices, using just one technique to achieve
EMC compliance is neither su cient nor
economical. A complete program of care-
fully designed layout, ltering, grounding,
and shielding is required. In addition to
these specic choices, the design team must
follow the time-proven basics of sound en-
closure design.
1
Te careful designer will
try to resolve EMI at the source or receptor.
Te designer who gives careful consider-
ation to the choice of RF shielding materi-
als is rewarded with a degree of condence
when sending o the ultimate product for
compliance testing. Clearly, no one wants
to hear that the product that is scheduled
for market introduction next week is out of
compliance.
At component level, e cient isolation
is usually achieved using BLS (board level
shields). Tis article will focus on RF gas-
kets although some of the considerations
explored can apply to board level shields. In
fact, designers sometimes turn to combina-
tion products such as mold-in-place board
level shields using both gasket material and
metal to create a very eective and e cient
shield. Te four basic types of RF gaskets
(Figure 1) are:
Metal, sometimes referred to as nger-
stock, includes a large variety of metals,
with varying proles, mounting methods,
and other characteristics.
Electrically conductive elastomer (ECE)
Crucial RF shielding selection
considerations
Attenuation performance is the single, most critical factor in selecting RF
shielding materials.

Thats because no matter how good something looks, the
proof is always in the performance. We know because weve
been manufacturing EMI Shielding Products for over 25 years.
Youll find our products in companies all over the world and
out of it too. To learn more about what makes us buzz, go to
www.alcotech.com, and please no licking the filters.
YOU CANT FAKE QUALITY.
ALCO TECHNOLOGIES 1815 W. 213TH STREET #175 TORRANCE, CA 90501 TEL: (310) 328-4770 FAX: (310) 328-1262 WEBSITE: WWW.ALCOTECH.COM
Alco.indd 1 2/11/2008 12:58:31 PM

102
refers to dozens of elastomer/ller
combinations with many mount-
ing methods and unlimited proles
produced by various manufactur-
ing methodsincluding extrusion,
molding, depositing, die-cutting,
form-in-place (FiP), and mold-in-
place (MiP).
Knitted mesh comes in both metal
and conductive yarns.
Fabric-over-foam (FoF) is a con-
ductive fabric wrapped over a non-
conductive foam core.
Details on the manufacturing of
gaskets and specic and specic fea-
tures and benets are readily available
from manufacturers and may well ar-
rive along with the purchased gaskets.
Still, there are basic considerations that
should guide the designer in making the
all-important initial choice. Tese con-
siderations are not in any specic order.
Te thoughtful designer should evalu-
ate each one and should determine its
relevance to a particular application.
OPERATING FREQUENCY
Critical criteria when choosing an RF
gasket include an exact determination
of the RF frequency involved, har-
monics, and distance from the source.
Limiting consideration solely to the
RF frequency involved could lead to
the choice of an inappropriate gasket.
In fact, many gaskets work well across
wide frequency ranges, but some may
perform better in certain circumstanc-
es. Generally metals have shielding
eectiveness (SE) values in excess of a
Figure 1. Qualitative shielding effectiveness.
100 dB from 10 kHz to 10 GHz. Tey
maintain consistent SE across the entire
frequency range with little variance.
Te SE of ECE gaskets varies with
compression force. Recommended
compression values for ECE gaskets
are based on SE values up to 120 dB.
However, ECE tends to achieve higher
SE levels as frequency increases, mak-
ing it an ideal choice for as operating
and data frequencies
Knitted mesh gaskets provide excel-
lent SE across a wide frequency range,
but that effect tends to decrease at
higher frequencies, generally above 10
MHz. This decrease occurs because
they are manufactured using knitted
wire, a material choice that creates
apertures and skin eects. However, SE
values remain high from 40 to 90 dB,
depending on upon the wire type and
the compression.
FoF gaskets can be produced with
very low compression forces while
retaining excellent SE values from 70
to 100 dB up to about one GHz and
then falling slightly at a rate of 20 dB
per decade of frequency. See Figure
1. Given their overall e cacy, any of
these gaskets will provide the required
SE for most commercial applications.
Consequently, other factors must be
considered in making the optimum
choice.
ATTENUATION PERFORMANCE
Commonly referred to as shielding
eectiveness (SE), attenuation perfor-
mance is the single, most critical fac-
tor in selecting RF shielding materials.
Attenuation performance is dierent
in each case. Parameters must be
determined before specifying any RF
gasket. Also, the attenuation of RF gas-
kets is impacted by the installation and
mounting of the shielding, conductivity
of the surrounding materials, and the
physical t of the shielding gasket. In
some instances, mechanical factors
may require the use of more expensive,
high performance material. Conversely,
other applications may achieve ad-
equate SE using a lower performance
material. Why pay for a top-line ma-
terial such as beryllium copper when
more economical choices provide the
necessary shielding?
MATERIALS COMPATIBILITY/
CORROSION
It is important to choose a shielding
gasket that is compatible with the metal
of the conducting surface on which it
is to be mounted. RF gaskets are made
of metal or materials with metal llers.
With the exception of a few special met-
als, these metals are not in their natural
state. Metals are rened from ore that
contains metal oxides. Subsequently,
the ore is rened into the metals we use.
From the instant that rened metal is
created, it begins the process of return-
ing to its natural stable statei.e., an
oxide. Tis process of reversion can be
accelerated by galvanic incompatibility.
Galvanic corrosion occurs when two
metals are in contact, the two metals
are dissimilar, and their junction is in
the presence of an electrolyte.
Basic Corrosion Prevention
Whenever possible, avoid the use
of dissimilar metals. Te following
steps may be taken to prevent, or at
least to minimize corrosion poten-
tial, in the event that it is necessary
to use two dissimilar metals in close
contact with one another.
Limit contact between metals with
widely different electrochemical
potentials.
Insert a third metal between the
two dissimilar metals, a step that
reduces the potential dierence of
the galvanic couple. For example,
nickel or tin-plated copper is suitable
FENI CAL
103
shielding
is suitable for use with aluminum and silver combina-
tions.
Design the ange interface so that the surface area of
the anodic metal is signicantly larger than the cathodic
metal. Te electromotive force (EMF) dierence remains
the same; however, the current density is decreased so
the corrosive attack on the cathodic metal is reduced.
Eliminate moisture, salts, and other electrolytes from
entering the joint interface with an improved ange de-
sign. If this option is not feasible, use an environmental
seal outboard of the conductive element in a dual EMI
shield/environmental seal.
Choose the mating pair based on the intended operat-
ing environment; then choose an appropriate plating.
Te appropriate choice will depend on several factors.
A clean room or air conditioned o ce is considered a
fairly benign environment, and the designer can choose
from a number of plating options. In a slightly harsher
environment such as a manufacturing facility, greater
care must be given to plating selection. Finally, in an
extreme environment where the device will be subjected
to wind, rain, snow, or temperature changes, the utmost
care must be exercised when plating is selected.
ENVIRONMENTAL SEALING
An electrically conductive elastomer (ECE) is the only
product that combines both RF shielding and environmental
properties. While the these two characteristics are inherent
in an RF ECE, an alternate option is pairing another gasket
type with an outboard environment seal. Such a seal will
keep any harsh environmental conditions from reaching the
metals and the gaskets in the interior of the device.
With its dual characteristic, the ECE gasket is generally
the smallest and most e cient product for providing both
RF shielding and environmental production. It may not
be suitable in every application. If mechanical and space
considerations allow, a combination gasket might be consid-
ered. Such gaskets are made of metal/elastomer or knitted
elastomer, and in some applications they may prove more
economical.
COMPRESSION LOAD OR FORCE
As pressure is applied to the shielding gasket, it can change
shape resulting in inferior performance. Careful selection
must be given to choosing the correct size, thickness, shape,
and material. Properly designed gaskets rarely fail. Failure
is usually the result of improper installation or use. Inap-
propriate use will aect gasket compression. If the gasket
is under-compressed, it cannot achieve its advertised SE. If
it is over-compressed, it will likely sustain damage that, in
turn, results in inferior shielding performance.
Other load and force considerations must be consid-
ered. Tese include the base metal material and thickness,
fastener spacing, and the atness of the mating surface.
Today, the available range of gasket materials can handle a
wide range of compression forces. For example, some mate-
rial such as fabric-over-foam and ultra-soft metals can be
www.chomerics.com
781.939.4850
chomailbox@parker.com
Together, we can specify
an effective EMI shielding
solution for your application.
Whether youre shielding an entire cabinet
or a handheld device, Chomerics has the
right EMI solution for your application. When
you need shielding for telecommunications,
avionics, information systems, automotive,
consumer, industrial or medical electronics
Chomerics has you covered.
Chomerics EMI shielding
products include:
- 0onduclive eloslomers
and compounds
- Foom-bosed goskels
- RF ond microwove obsorbers
- FM shielding ploslics
- 0onduclive poinls
- Fingerslock, foil ond lopes
- Shielded venls ond
oplicol windows
- FM ond sofely lesl services
Porlner wilh lhe leoding globol
manufacturer of EMI shielding solutions
0homerics. Now olso offering Tecknil ond
Silver 0loud FM producls.
-
-
-
-
-
-
-
-
104
used with extremely low compression
while providing excellent shielding ef-
fectiveness.
In ECE materials, density, specic
gravity, shore A, and conductive par-
ticle loading aect the compression and
load forces on the gasket. Quantifying
these factors can become quite com-
plicated. Gasket manufacturers that
support knowledgeable eld application
engineers (FAEs) are the best source for
sorting through all of these factors and
in identifying the appropriate gasket for
each application.
For applications in which weight is
a factor, lower compression forces al-
low for lighter weight base materials.
Weight is especially important in the
aerospace and space craft industries.
Te automobile industry also strives
to limit weight when possible. With to-
days light weight plastic products com-
pression force is a vital consideration.
Tin plastic cases cannot withstand
the pressure that is required to com-
press many gaskets. Te designer must
choose a gasket designed especially to
work with a low compression force.
FASTENING/MOUNTING
METHODS
Many types of mountings are available
including pressure-sensitive adhesive
(PSA), clip-on, slot-mounted, riveted,
soldered, welded, tted die-cut proles,
snap-in, and many more. Mounting
methods are limited only by the design-
ers imagination. Figure 2 shows a few
more common methods. Remember to
take into account any environmental
concerns such as humidity or corrosive
environments that could affect the
mounting method.
Obviously, the dierent gasket types
such as metal, knitted wire mesh, FoF,
ECE, or a combination type will deter-
mine, or possibly limit, the choice of
mounting methods. Again, the prudent
designer must have the foresight to
plan ahead regarding EMI issues and
should create an overall design that will
accommodate a suitable mounting for
gaskets. Trying to install a gasket into
a space where it was never intended to
go is an exercise in futility at best; and
in the worst scenario becomes a waste
of time and money that provides inad-
equate RF shielding.
DEMANDING/HARSH
ENVIRONMENTS
Te right choice of gasketing is particu-
larly critical in sectors in which equip-
ment may be subjected to harsh wash-
down, chemical, or processing proce-
dures. Tis consideration is especially
signicant in military applications, but
also holds true in some medical and
food service settings. Generally, metals
are not a good choice if there is contact
with moisture. Elastomers are the best
choice for such applications. If metal
gaskets are used for the EMI seal, it is
advisable to use an outboard elastomer
seal to prevent moisture damage. As
noted above, whether a combination of
metal/elastomer or ECE is chosen will
depend upon several factors. In many
cases, size will be the determining fac-
tor as ECE is the only gasket choice that
provides both RF shielding and occlu-
sion of moisture in one compact gasket.
Table 1 indicates base elastomers and
suitable uses.
COMPRESSION
Compression force, compression range,
and compression set must be consid-
ered to achieve eective performance
and to extend the longevity of the
gasket.
Compression Range
Solid metal gaskets, especially copper
beryllium (CuBe), have a maximum
deection range of approximately 90
percent of their free height. Other
metal gaskets have varying ranges;
the range for recyclable clean copper
(RCC) comes close to that of CuBe. In
comparison, the usable range for hollow
core CuBe wire mesh is 75 percent; for
Fluid Silicone Fluorosilicone Fluorocarbon EPDM
Impermeability to Gases Poor Fair Good Good
Ozone and Ultraviolet Excellent Excellent Excellent Excellent
ASTM 1 Oil Fair Good Excellent Dont use
Hydraulic Fluids (Organic) Fair Good Excellent Dont use
Hydraulic Fluids (Phosphate ester) Fair Fair Good Excellent
Hydrocarbon Fuels Dont use Good Excellent Dont use
Dilute Acids Fair Good Excellent Good
Concentrated Acids Dont use Dont use Fair Fair/Good
Dilute Bases Fair Good Excellent Excellent
Concentrated Bases Dont use Dont use Fair Good
Esters/Ketones Dont use Dont use Dont use Excellent
DS-2 (Decontaminating Fluid) Poor Poor Fair Good
STB (Decontaminating Fluid) Good Good Good Good
Low Temperature Excellent Excellent Fair/Poor Excellent
High Temperature Excellent Good Excellent Good
Compression Set Good Good Excellent Good
Radiation Resistance Good Poor Poor Good
Table 1. Resistance of principle elastomers to uids.
FENI CAL
105
shielding
solid wire mesh, its 10 percent; and
for solid elastomers, its 15 percent.
Geometry is not such an important
issue for metal nger gaskets, but it
Figure 2. Mounting methods.
is very important for wire mesh and
conductive elastomers. For example,
depending upon the shape, conductive
elastomers deection ranges from 15
percent up to about 60 percentthe us-
able range is approximately half of this
value. Te elastomer shape regarded as
the best trade-o between compression
force and compression height is a hol-
low tube (either circular or with a D
cross section). With this conguration,
30- to 40-percent usable deection can
be achieved. FoF gaskets have a wide
range of workable compression heights,
determined largely by the foam core
and the geometry of the gasket.
Compression Force/
Compression Set
Depending upon the configuration,
CuBe, RCC (recyclable clean copper)
solid metal, and CuBe hollow core
wire mesh gaskets typically require
compression forces between three to
20 pounds per linear foot to establish
surface contact and to provide adequate
shielding. Monel or tin-plated, copper-
Magnetic Shield Corporation 740 No. Thomas Drive, Bensenville, IL 60106 888-766-7800 or 630-766-7800
Magnetic Interference
cant be seen, felt or eliminated but
it can seriously affect electronics
that are not properly shielded.
Choose the preferred source for
more than 65 years - Magnetic
Shield Corporation - for your
magnetic shielding materials.
We stock sheet and foil in various
thicknesses and widths, plus a vast
array of wire, cable, conduit and
braided sleeves.
We also custom manufacture
simple and complex magnetic
shield shapes.
106
clad steel (SnCuFe) wire mesh and elastomer gaskets require
compression forces of up to 800 pounds per linear foot to
achieve maximum shielding eectiveness. A combination
of compression force and gasket material characteristics
determines the compression set.
Compression set requires the user to increasingly
higher compression forces
to the gasket after each
opening of the enclosure
to maintain a constant
shielding effectiveness
value. An additional de-
gree of compression set
takes place during each
repeated opening/closing
cycle. This cumulative
process is demonstrated in
Figure 3. Tis compression
set cycle continues until
the gasket loses its resil-
iency; and at that point, it
must be replaced.
Depending upon the
manufacturing method
used, RCC and CuBe
spring ngers and CuBe
wire mesh gaskets have
no compression set. Tis
marked resiliency is char-
acteristic of the alloys and
is a function of the way
in which the alloy mate-
rial was processed, rather than conguration. Conductive
elastomer and FoF gaskets, particularly in the taller con-
gurations, have compression set values in excess of 25 to
35 percent. For Monel and SnCuFe wire mesh, compression
set is about half that of the conducted elastomer and runs
about 10 to 15 percent. Solid metal gaskets made from
cold-worked spring materials, such as stainless steel and
phosphor bronze, have compression sets of about half of
the corresponding wire mesh value and run about four to
six percent.
SPACE/WEIGHT CONSIDERTIONS
Unless the design is a space craft, the weight of the gasket
material chosen is usually not an issue. Most terrestrial ap-
plications are not concerned with weight savings of a few
ounces achieved using a particular gasket design. Compar-
ing the dierent gasket designs, the RCC and CuBe solid
metal or hollow core wire mesh, as well as FoF gaskets, tend
to be lighter in weight. In fact, they are usually one-sixth
the weight of Monel/SnCuFn wire mesh or conductive elas-
tomers. Also, the use of metal gaskets allows the designer
to reduce the weight of the overall system conguration.
Te lower mechanical forces required by RCC and CuBe
gaskets allow the use of lighter weight structural materials.
Tis overall weight reduction is also true for FoF and new
compressible compounds used for mold-in-place and form-
in-place gasketing. See the examples in Figure 4. Tis factor
is usually more important than the actual weight of the gas-
ket not only in avionic applications, but also in applications
such as metal or plastic miniature handheld devices where
lower fastener withdrawal forces are recommended.
Figure 3. Compression set.
Figure 4. Form-in-place and mold-in-place.

FENI CAL
107
shielding
RECYCLABILITY
Products must meet the current RoHS requirements of
the European Union as well as environmental require-
ments imposed by manufacturers. Every year, theres
more and more evidence that our world is a fragile place.
Tis fragility demands that new environmental laws and
regulations be put into place to preserve resources and to
protect humans and their surroundings. Electrical and
electronic equipment have been singled out as potential
environmental hazards; and consequently, the European
Community and its constituent states have adoped RoHS
and WEEE. RoHS, or the Restriction of the Use of Certain
Hazardous Substances in Electrical and Electronic Equip-
ment (Directive 2002/95/EC) and WEEE or Waste Elec-
trical and Electronic Equipment (Directive 2002/96/EC)
are two European directives restricting the use of certain
substances and dictating the way in which materials are
to be discarded or recycled.
Many of the new laws and regulations, such as RoHS and
WEEE, have forced companies to look for alternative solu-
tions for products destined for the European market. Elec-
tronic manufacturers have expanded their research eorts
to seek out cost-eective, safe, environmentally responsible
alternate solutions to use in otherwise successful products.
Te RoHS directive states that new electrical and electronic
equipment may not contain certain environmentally harm-
ful materials such as lead and mercury. Beryllium is not
listed as a restricted material but is on the watch list and
may be restricted in the near future. Although all beryllium
copper RF gaskets are exempt from the directives for the
time being, many OEM customers are seeking a beryllium-
free solution. Te scope of future industry directives and
legislation are uncertain, but the trend toward a greener
marketplace is clear. Customer demands and a growing rec-
ognition of the importance of environmental stewardship
have created a clear mandate to develop alternate alloys.
Ironically, the rising price of beryllium in the new greener
marketplace has only added to the impetus to nd a new
alloy for shielding alloy for RF gasketing.
Te nal result of extensive research was the develop-
ment of the recyclable clean copper (RCC), one of the metal
gaskets discussed above and included in Figure 1.Tese
gaskets oer a new range of environmentally friendly, cop-
per-based shielding options. Tese new products provide a
beryllium-free EMI solution for use in a wide range of slotted
applications. RCC is fully compliant to the RoHS Directive
and alleviates the environmental, safety, and segregation
concerns associated with the traditional use of beryllium-
based copper alloys. This new gasket is characterized
excellent mechanical properties. It displays superior yield
strength (over 1000 MPa) compared to other copper alloys.
It exhibits excellent elastic resilience and oers comparable
spring performance to that of CuBe.
GREEN FoF
Another gasket alternative is a halogen-free product compli-
ant with IEC 61249-2-21:2003. Tis type of gasket provides
shielding eectiveness in excess of 100 dB to 1 GHz. It has
an extremely low compression force ranging from 5 to 10
lb/ft and low surface resistivity. Its operating temperature
ranges from -40 degrees to +150 degrees F, and its ame clas-
sication is UL 94 VO. It contains neither BFRs (bromated
ame retardants) nor halogen in either the foam core or the
pressure sensitive adhesive. See Figure 5 and Table 2.
CONCLUSION
Tis article reviewed the basic types of RF gaskets and ten
vital factors to be reviewed in using gaskets in shielded
enclosure design. It should be noted that while these topics
are important, an eective EMC Design Plan will also fac-
tor in other vital considerations including cost, life cycle,
applicable standards, storage environment, shielding and
grounding, electrical requirements, and product safety.
REFERENCES
[1] G. Fenical, Cost Considerations for Selecting RF Shielding Materials.
Interference Technology Test and Design Guide, pp. 7078, October
2007.
Gary Fenical is the Senior EMC Engineer at Laird Technologies and is
the author of many articles on EMC requirements for medical devices,
Mutual Recognition Agreements, and guidelines to meet the essential
requirements of the EMC Directive. Gary is currently chairman of the
SAE AE-4, E3 Committee on EMC. Gary can be reached at (570) 424-
8510, gfenical@lairdtech.com.
Substance Permissible Limit (by weight)
Bromine (Br) 900 ppm (0.09%)
Chlorine (Cl) 900 ppm (0.09%)
Total concentration of Chlorine
(Cl) + Bromine (Br)
1500 ppm (0.15%)
Table 2. Substance chart from IEC 61249-2-21:2003.

Fabric + Hot-melt
Foa
Attachment
> PSA (pressure sensitive adhesive)
Figure 5. Fabric-over-foam (FoF) cross section.
MORE ON OUR WEBSITE
Weighing the design options and making the right
shielding choice is a crucial step in achieving EMC
compliance. Designers faced with a shielding dilemma can
turn to the new, user-friendly InterferenceTechnology.com.
Check out Resources for white papers and applications
notes on this crucial subject, and be sure to look under
Directories to scan the wealth of shielding choices listed
in the Product and Services section.
108
shielding EMI SHI ELDI NG AND OPTI CAL ENHANCEMENT TO TOUCH SCREENS
BRIAN E. HERR, RICHARD D.
PAYNTON, RANDALL C. PYLES
Dontech, Inc.
Doylestown, PA
E
lectromagnetic attenuation fea-
tures can be incorporated as an inte-
gral part of touch screens rather than
as a separate component in those display
applications requiring shielding for EMI/
EMC compliance. Various enhancement
techniques and design considerations
will be reviewed. Features and methods
employed will vary with particular touch
screen enhancements and will include
conductive layer, encapsulation, termina-
tion, and touch screen mounting. Possible
enhancements to optical performance
including opportunities for contrast en-
hancement through reection reduction
techniques will also be presented.
INTRODUCTION
Electronic displays are now commonplace
in many demanding environments where
both high ambient light readability and
electromagnetic compatibility (EMC) can
be achieved only through enhancements to
commercial-o-the-shelf (COTS) compo-
nents. It is also common that touch screens
are integrated into display systems as they
are a very e cient user interface, especially
in the case of portable electronics. EMC
denotes the ability of an electronic system
to function within its operational envi-
ronment without emitting unacceptable
levels of electromagnetic (EM) radiation or
failing to perform because of an external
EM eld. Te dilemma for system design-
ers is that COTS touch screens typically
degrade the high ambient readability of
high performance displays to an unusable
level. However, the technology to modify a
display for high ambient light readability is
readily available. Touch screens integrated
into display assemblies can be congured
with an electromagnetic interference (EMI)
shielding conductive ground plane (CGP)
and contrast enhancement features to ad-
dress two performance issues with one part.
It is assumed that the reader understands
the basic principles behind touch panel
technology. Te enhancements described
focus on resistive touch screen technology
and their integration into a high ambient
light readable liquid crystal display (LCD)
assembly. However, these features can be
applied to other touch screen technologies
as well.
ELECTROMAGNETIC
INTERFERENCE SHIELDING
A Faraday cage is a continuous electrically
conductive enclosure that surrounds the
equipment and attenuates transmitting
electric elds to a desired level. Metalized
enclosures form most of a Faraday cage in
typical display assemblies, but obviously
must leave the display face open and view-
able. Therefore, CGPs with satisfactory
transparent properties must be installed
in the display optical path to complete the
Faraday cage and to function as an EMI
shield. If this element of the Faraday cage
is not properly terminated (e.g., the shielded
touch screen is terminated only on one or
EMI shielding and optical enhancement to
touch screens
Incorporation of a circular polarizer is a powerful option for
enhancing LCD contrast.

The Leading Source for EMI Shielding
Reliable Board, Enclosure and Cable Solutions
Leader Tech is a world-leading innovator
and U.S. manufacturer of EMI shielding
products for circuit boards, electronic
enclosures and interconnect cables.
Our core products include standard and
custom circuit board shields, beryllium
copper ngerstock gaskets, conductive
elastomers, advanced RF absorber
materials and EMI/RFI ferrites.
Board, Enclosure or Cable EMI Shielding problems?
Leader Tech sales engineers are waiting for your call.
866.TECH.EMI (866.832.4364) | www.l eadert echi nc. com | 12420 Racetrack Road | Tampa, FL 33626
FerriShield is now Leader Tech
In addition to the worlds
largest, in-stock assortment
of cable-mounted ferrites,
FerriShield customers now have
access to a greatly expanded
EMI Shielding product
line, dramatically improved
engineering support and an unrivaled customer service team.
Printed Circuit Board Shielding
Finger Stock Gaskets
FerriShield Ferrites
Conductive Elastomers
Microwave Absorbers
Oriented Wire Gaskets
Wire Mesh Gaskets
EMI Air Vent Panels
EMI Shielding Products
Leader Tech.indd 1 2/13/2008 6:07:27 PM
110
two corners), this portion of the shield
could act as an antenna and could
reradiate an undesired eld.
Common techniques for adding
conductive properties to an optical
substrate include vacuum deposited
transparent conductive coatings and
integration of ne wire meshes. Elec-
trically conductive, optically transpar-
ent ground planes pass a dominant
portion of the visual spectrum (i.e.,
380 nm to 780 nm). Te properties of
transmittance and conductivity can
be adjusted or tuned to t the needs of
the specic application. All transpar-
ent conductive materials require an
optical substrate as a carrier. It is im-
portant to review and understand the
properties of the optical materials that
comprise a touch screen as they relate
to the CGP because performances of
the individual elements, added or in-
herent, are interrelated.
Transparent Thin Film
Conductive Coatings
Transparent thin lm conductive coat-
ings oer excellent optical and mod-
erate EMI shielding properties. See
Table 1 for relative shielding values.
A transparent thin lm conductive
coating is typically deposited onto an
optical medium using a high vacuum
coating process (e.g., ion enhanced e-
beam evaporation or DC magnetron
sputtering). These are high-energy
processes that can create very dense
films. The durability of a specific
coating is largely dependent upon the
optical substrate, the specic materials
deposited, and the deposition method.
Te base material of optical plastic
substrates often must be enhanced
with a hard coating for the conductive
coating to have adequate durability
and conductivity properties.
Typical transparent conductive
lms include transparent conductive
oxides (TCOs), such as indium tin
oxide (ITO), and metal alloyed lms
(e.g., alternating layers consisting of Ag
& ITO). Increasing the conductivity of
the coating will increase the average
EMI attenuation level over the fre-
quency range of 100 KHz through 20
GHz. Typical conductivities for trans-
parent thin lm conductive coatings
for this purpose range from 1 ohm/sq
to 100 ohms/sq. Unfortunately, there
is an inverse relationship between
light transmittance and conductivity.
Metal alloyed lms oer better cost/
performance options over TCOs, es-
pecially when applied to plastics. Tey
can be cost eectively deposited in
resistances down to 2 ohms/sq. while
maintaining moderate total luminous
light transmittance performance (i.e.,
> 68% T
L
). Te photopic transmission
of metallic coatings quickly decreases
as the conductivity increases. Addi-
tionally, metal alloys have an inferior
mechanical and galvanic durability.
By contrast, TCOs become very
costly to apply to plastics for resistances
below 30 ohms/sq., but can be applied
to glass to values below 1 ohm/sq. A
low resistance coating on glass will
offer high performance but will cost
more because it is deposited in a batch
vacuum process rather than a web or
continuous process. Additionally, most
TCOs can be fully integrated into a
multi-layer dielectric stack as part of a
broadband anti-reection (AR) coating.
An AR coating reduces surface reec-
tion losses and increases transmitted
light. A fully enhanced TCO can have
a total luminous reection of a broad-
band white light source (e.g., illuminant
D
65
) of less than 0.5%. Furthermore, the
photopic absorption of TCOs tends to
be very low, often less than a few percent
at fairly high conductivities (i.e., < 10
ohms/sq.).
Fine Wire Mesh
Fine wire mesh CGPs offer excellent
EMI shielding and good optical proper-
ties. (See Table 1 for relative shielding
values.) Fine wire mesh is a grid pat-
tern with high open area and excellent
conductivity (e.g., < 30 m-ohms/sq.).
Te material is typically stainless steel
or copper. For higher shielding applica-
tions, it is created by weaving ne wires
(e.g., 0.0008 to 0.002) in a plain weave
format. Plain weave mesh is constructed
with wires crossing alternately over and
then under one another with adjacent
wires 180 degrees out of phase (similar
in construction to a window screen but
signicantly ner). Te mesh must be
conductively plated to fuse the wire
crossovers for very high shielding (e.g.,
silver conductive plating). The mesh
can then be blackened with a black
conductive corrosion resistant plating
to improve galvanic stability and optical
performance (by reducing reections).
The mesh is typically specified by
the number of strands per inch in
the x and y directions (e.g., 100 x 100
mesh) or openings per inch (OPI).
Often the number of strands per inch
is stated only once (e.g., 100 mesh)
because most of the weaves used in
the optical industry are square (i.e.,
the same number of wires per inch
in both x and y directions). The mini-
mum wire diameter and the number
of strands per inch will vary with the
physical properties of the base materi-
al. Standard mesh counts range from
50 to 255 strands per inch. Different
mesh count options are available for
increased shielding needs and for
moir control options. Whenever two
light transmitting matrices are over-
laid, there is a potential for a moir
pattern to be generated. The moir
pattern will hinder display readability
if the mesh interferes with active-
matrix display pixels. Therefore, a
touch screen with a mesh CGP must
be optically fitted to the specific elec-
tronic display (e.g., LCD) to minimize
or eliminate this phenomenon. EMI/
EMC performance will not change
when the mesh orientation is adjust-
ed. The necessity of creating a good
optical fit makes the remote design
process more challenging compared
to designing with transparent film
processes. Empirical optical testing
may be required.
Frequency 80 Mesh Plated 10 O/sq ITO
H Field
100 KHz 15 dB 0 dB
1 MHz 32 dB 1 dB
E Field
100 KHz 86 dB 72 dB
10 MHz 81 dB 36 dB
Plane Wave
100 MHz 71 dB 24 dB
1 GHz 58 dB 25 dB
10 GHz 34 dB 18 dB
Table 1. Relative shielding values.
EMI/RFI Shielding Solutions
TECH-ETCH, INC., 45 Aldrin Road, Plymouth, MA 02360 TEL 508-747-0300 FAX 508-746-9639
L Highly skilled customer service
L Industry leader of innovative designs
L Better than 99% quality rating
L Customization of standard products
L ISO 9001:2000 Registered
L Large inventory for immediate delivery
L Finest catalog in the industry: print & web
L Exceptional FREE sample program
L Product specialists for application assistance
L Computerized quoting for instant pricing
Visit our web site to send
for our NEW CATALOG or a FREE SAMPLE!
www.tech-etch.com/shield
Our extraordinary on-time delivery performance is only one reason the electronics
industry relies on Tech-Etch to meet its EMI/RFI shielding requirements.
Tech-Etch.indd 1 2/14/2008 2:22:06 PM
112
Figure 1. Ambient reections magnitudes, COTS resistive touch
screen.
Figure 2. Termination example.
CONTRAST ISSUES WITH COTS
TOUCH SCREEN
A contrast measurement of an elec-
tronic display will gauge how read-
able a display is in a demanding high
ambient light environment. Tis test
measures the relation between the
activated or on areas of a display and
the dark or o areas. High ambient
contrast is a function of the inherent
display performance, ambient environ-
ment, display luminance, and reec-
tions from the display. Contrast per-
formance will decrease signicantly as
the display reection increases. Tere
will be reections at interfaces where
light transfers from one medium to
another caused by index of refraction
changes. Resistive touch screens have
four major interfaces, each of which
either goes from air to an optical me-
dium or, conversely, from the optical
medium to air. Reection problems
are further compounded because the
resistive touch screen is comprised of
plastic substrates with hard coatings
and thin lm coatings on both rigid
and exible optical materials (either
glass or plastics) that create many
additional material interfaces and
sources of reection.
Equation 1. Fresnel equation for normal
reections.
A better understandi ng of the
cumulative eects of surface reec-
tion can be attained using the Fresnel
equation above. When applied for nor-
mal incident light to the rst surface
interface where the initial medium
is air (n
1
= 1.0) and the exit medium
is an acrylic hard coating (n
2
= 1.5),
the result is a value of 4% for the rst
surface reection. Te reection issues
become further compounded when the
wave eects of the thin lm coat-
ings (i.e., the conductive layers inside
the touch screen) are entered into the
equation. Te total luminous reection
for a COTS touch screen can exceed
20%, a value which would destroy the
contrast of almost any display in a high
ambient light environment. See Figure
1 for a surface reection summary of a
typical resistive touch screen.
DESIGN CONSIDERATIONS
AR Enhancement of Outer
Surfaces
An anti-reective coating applied to
both the front and rear surfaces of
the touch screen would reduce the
ref lections by approximately 50%.
Direct enhancements to the internal
ITO components of the touch screen
cannot be performed on a COTS touch
screen. Although indirect solutions are
possible, it should be noted that fully
optimizing the internal ITO coating
would be impossible under current
technology constraints. While inte-
grating the TCO into an AR coating,
which is index-matched to air, the nal
layer would need to be a dielectric
that is not conductive and, therefore,
would render the resistive touch screen
electrically inoperative. Tese factors
aside, reasonable levels of optimization
can still be achieved. Note that there
is a wide range of internal reection
present in COTS touch screens (i.e.,
< 2% to greater than > 8% per inter-
face).
A thi n f i l m coati ng cannot be
directly deposited in a vacuum to
the completed COTS resistive touch
screen. The direct deposit coating
process would cause the air gap be-
tween the exible membrane and the
carrier or support layer to collapse.
Tis would result in varying degrees of
plastic deformation around the spacers
and degradation of either the optics or
touch screen electrical performance.
For this reason, it is common to apply
the conductive coating to an optical
substrate and then to laminate it onto
a surface of the touch screen. Te most
cost eective lamination is a exible
lm lamination (0.003 to 0.009 in
total thickness) to one or both surfaces
of the touch screen. Note that a exible
lm is the only suitable option for the
front surface of the touch screen. Com-
mon lm optical substrates include
polyethylene terephthalate (PET),
cellulose triacetate (TAC), cyclo-olen
and poly-olen substrates. Again, the
exible substrates can be hard coated
with a thick lm system (e.g., acrylic
or silane) with the thin lm coatings
applied over top to improve mechani-
cal durability. Te conductively coated
carrier lm can be easily applied with
an optical adhesive.
Considerations for carrier lm se-
lection are index of refraction, durabil-
ity, cost, and birefringent properties.
EMI Shielding
Te EMI shield can be applied to the
front, rear, or both surfaces of the
touch screen. Care must be taken not
to interfere with the resolution or sen-
sitivity of the touch screen if the touch
screen itself must be shielded (i.e., the
CGP is on the outer most surface).
Tin lm conductive coatings applied
to the rear surface of the touch screen
offer a simple cost effective way to
achieve EMI attenuation. Te degree
of index matching of the rear surface is
dependent upon the contrast required
or the amount of rear surface reec-
tion that can be tolerated.
HERR /PAYNTON/PYLES
113
shielding
Grounding of the thin film coating
can be readily achieved by using an
electrically conductive pressure sensi-
tive adhesive (PSA) and attaching the
touch screen to the metal perimeter
of the LCD, or to a bezel or housing to
complete the Faraday cage. A conduc-
tive adhesive or gasket could also be
employed to terminate the CGP. The
gasket should be placed under com-
pression with mechanical clamping.
See Figure 2 for additional details.
It is common to apply a conductive
buss (e.g., Ag epoxy or acrylic buss)
over the thin lm conductive coating
CGP to provide mechanical durability
when utilizing a compression gasket.
Te shock and vibration associated
with normal use can cause the thin
lm coating (typical thickness ranging
from hundreds to thousands of ang-
stroms) to wear and be compromised.
Additionally, the buss can be used to
wrap the termination around to the
other side of the touch screen. In some
touch screen designs, the EMI conduc-
tive buss can readily make contact with
one of the internal conductive layers of
the touch screen that is brought out
to the edge causing interference with
the touch operation. In these cases,
an insulating layer must be added to
prevent operational interference.
Touch screen designs with ne wire
mesh shielding must consider mesh
encapsulation, mesh orientation (i.e.,
an element of moir control), and mesh
termination. Applying the mesh to the
rear surface of the touch screen oers
the simplest and a very cost eective
way to achieve EMI attenuation. Te
rst step would be to treat the outer
surfaces as described before with AR
coatings and then to apply the prop-
erly oriented mesh under tension to
the rear surface of the touch screen.
Te edges can be secured around the
perimeter with an adhesive. Te major
drawback of this approach is that the
mesh must be handled with extreme
care to prevent damage during in-
stallation. Te product should be as-
sembled in a clean room environment
because of the di cultly in cleaning
exposed mesh.
Encapsulating the mesh is strong-
ly recommended to ease handling.
This can be done i n conjunction
with the optical enhancement to the
rear surface of the touch screen. For
example, with a glass touch screen,
an extra layer of glass with an AR
coating can be added with the mesh
lami nated i n bet ween. The mesh
can be terminated with a conduc-
tive buss around the perimeter or
can be allowed to extend. Extended
mesh would allow for the highest
shielding as the transfer impedance
to adj acent conduct i ve surf aces
would be minimized. However, this
technique poses more difficulties in
the packaging of the touch screen
display assembly and should be con-
sidered early in the design. Again, if
the mesh shield were required to be
on the front of the touch screen, it
would have to be embedded in a thin
f lexible membrane.
Custom Shields &
Precision Metal Parts
Shield Design
Options:
Board-level
Removable lid
Multi-cavity
Complex geometry
Shielding
Materials:
Brass
Steel
Aluminum
Titanium
Nickel Silver
Fotofab works with
hundreds of alloys
Prototype or
production,
think of Fotofab
for your
shielding needs.
RF Shields & More
Whether you need a multi-cavity shield or a simple
ve-sided box, Fotofab has a solution for you. Visit our
Shielding Design Guide at www.fotofab.com/RF.
Have a shield or metal part ready for quote? Submit
your specications and drawing online. Of course, you
can always call one of our Technical Sales Staff at (773)
463-6211 to discuss shielding material, plating, design
options and cost saving ideas.
Precision Metal Parts
We work with hundreds of alloys ranging from 0.0002
(0.05mm) to 0.090 (2.29mm) thick. Fotofab offers
chemically etched parts, laser cutting, plating, electro
polishing, tape & reel packaging and more.
Fast Delivery
Fotofab understands the importance of a deadline. Our
standard lead-time starts at 2 weeks with multiple expedite
options available. You can even go from print-to-part as fast
as same day! Ask about our 24-hour expedite service!
For over 40 years, Fotofab has been manufacturing quality
shields and precision metal parts.
Would you like a copy of our Design Guide to
Photochemical Machining? Visit us at
www.fotofab.com/RF and we will send you a FREE copy.
Innovative solutions - exceptional capabilities
3758 Belmont Avenue Chicago, IL 60618 USA
phone 773-463-6211 fax 773-463-3387
www.fotofab.com/RF sales@fotofab.com
114
Full Enhancement of the Touch Screen
A circular polarizer (CP) can be integrated into the front
membrane to suppress the internal reections of a touch
screen. A CP is a linear polarizer combined with a wave
retarder. Te retarder is used to introduce a phase shift be-
tween the orthogonal components of the polarized light. In
this way, two equal components of light oscillating perpen-
dicular to each other with a relative phase dierence act as
vectors to yield a rotating linear polarization state. Te eld
inverts, and the light wave begins rotating in the opposite
direction when the circularly polarized light reects o of a
conductive surface interface. When this light passes through
the retarder again, it is now linearly polarized 90 degrees out
of phase with the linear polarizer element of the CP, and a
majority of the energy is absorbed. In summary, a CP can
eliminate over 99% of the internal reections. With a CP
integrated into the touch screen, the outer surface would
then be the only surface which would require the AR coating
for refection control. Index-matching other surfaces would
only slightly improve display readability. Total absorption
of the reected energy will never be achieved as there is
always a small portion of light that will have reected an
even number of times, preventing the proper circular polar-
ization. Additionally, the polarization will become elliptical
as angles deviate from normal incidence.
Tere are two challenges that are presented to the de-
signer when integrating a CP. First, the most common rst
surface membrane or exible carrier lm of a touch screen is
PET. PET has signicant birefringent properties that greatly
interfere with the proper function of the wave retarder.
Terefore, the PET component must be removed from the
touch screen and must be replaced with a non-birefringent
component for a CP to be utilized. Te second challenge
is that a CP in the most ideal situation will remove 50% of
unpolarized light and must be properly congured not to
interfere with polarized display lighting. In the case of a
plasma display (an unpolarized light source), the CP will
drop the luminous output of the display by over 50%, and
there is nothing that can be done to regain this lost energy.
In an LCD, the output of the display is polarized. Firstly, a CP
would have to be oriented so as to maximize transmission
when used over a polarized light modulator such as an LCD.
However, maximized transmission of linearly polarized light
through a CP is slightly less than 50% as the display output
becomes circularly polarized.
Circularly polarized light does not e ciently transmit
through a linear polarizer. To overcome this challenge, an-
other retarder is required on the inner surface of the touch
screen that converts the displays output back to linearly
polarized light. Transmission of polarized light through a
properly oriented linear polarizer can exceed 95%. Teoreti-
cally it could rise to to greater than 99%. Performance is
greatly dependent upon the polarizing e ciency of the LCD
and the linear polarizer component of the CP, the quality
of the retarders, and the overall alignment of the optics. In
the end, incorporation of a CP is a very powerful option
for enhancing the contrast of an LCD without impacting
its output luminance. Optical tting must be performed to
each display to ensure proper performance. Usability must
also be considered as the CP adds thickness and, hence,
reduces touch sensitivity. It is also the most costly of reec-
tion reduction solutions. Incorporation of a CP is a major
change to the touch screen design and should be considered
prior to manufacture.
CONCLUSION
Touch screens are suitable user interfaces for high ambient
light readability applications. Te performance of COTS
touch screens varies. It is best to start with a product
that has properties close to those required in the end ap-
plication. It is important to select touch screen attributes
that will not interfere with any required enhancements.
EMI shielding can be readily incorporated into either the
front or rear surface of the touch screen using a lamina-
tion process of secondary materials. However, application
of a CGP is more readily applied to the rear of the touch
screen. Transparent thin lm conductive coatings are
recommended for applications requiring low levels of EMI
shielding, and ne wire meshes are the material of choice
for very high levels of shielding. Both materials should
be considered for moderate levels of shielding. Contrast
enhancing properties of a touch screen can be improved
during subsequent EMI shield incorporation or during
initial product design. Tere is no one solution that works
best for all applications. Each application should be con-
sidered unique, and features should be selected for specic
end program suitability.
Brian E. Herr is the Display Integration Manager at Dontech, Incor-
porated. Brian began work in display enhancement applications imme-
diately after graduation with a BSME from Penn State over 8 years ago.
Brian is now leading the company display product design, development,
and execution eorts.
Richard D. Paynton is President & CEO of Dontech, Incorporated.
He holds a BSEE. Richard has been actively engaged in display contrast
enhancement and EMI suppression technology for over 25 years. He has
successfully guided Dontech to become a leading company which provides
innovative solutions to optical problems.
Randall C. Pyles is Director of Engineering at Dontech, Incorporated.
He holds BS, MS, and JD degrees. Randy has been involved with all
aspects of LCD and at panel system integration, ruggedization and
enhancement for over 20 years.
MORE ON OUR WEBSITE
Protecting sensitive electronics against the damage
caused by lightning, transients, and ESD has never been
more vital. Look for the products that counter these
threats. Just go to the new InterferenceTechnology.
com, and check out Products and Services and New
Products. While youre onsite, look for technical articles
and white papers that cover these phenomena.
EMC China 2008.indd 1 2/14/2008 2:34:24 PM
116
shielding PCB BOARD LEVEL ENCLOSURES
ALAN WARNER
Tecan Components Ltd.
Weymouth, UK
P
CB design is vital to the effcacy
of innumerable electronic products.
A reliable product and marketplace
success are the ultimate rewards for careful
consideration of all design issues. Choosing
an appropriate board level enclosure is just
one element of successful design eorts,
and the choice must be carefully considered
along with other crucial issues including the
operating environment, the overall volume
of the product to be manufactured, the as-
sembly method to be used, the planned test
and inspection methodology, and PCB and
equipment layout.
All too often, decisions on RFI enclosures,
like power supply choices, are left until the
end of the design process creating a situation
that makes their addition more di cult to
accommodate. As a result, the enclosures
may interfere mechanically with other areas
of the design.
THE 3 DSDESIGN, DEVELOP,
DRAW
An efficacious mindset underlying the
design and development of PCB level cans
and systems can be summed up in three
crucial steps: design, develop, and draw.
Active communication and consultation
between the enclosure customer and the
design team are crucial. Look for an enclo-
sure manufacturer that will provide initial
design guidance, ongoing advice, site visits,
prototyping, sample production, finish
and thickness options, forming, assembly,
and reevaluation for cost reduction. Cost
containment is certainly crucial to the
protable marketing of a nished product.
A structured eort combining a detailed
design plan and customer input can result
in the desirable goal of arriving at dened
costs for dened ends.
FORMAT CHOICES
When choosing the format of the enclosure
to be used, several factors must be consid-
ered. Exactly what is being shielded? What
is the exact nature of the culprit that
necessitates shielding? Will the customer
require access to the components inside of
the enclosure for rework, testing, inspec-
tion, or adjustment after the enclosure has
been placed on the PCB? Will the enclosure
be through-hole or surface mounted? What
is the expected volume of production, and
will that volume justify the costs of machine
placement? How many areas of circuitry
will require shielding, either individually or
from each other? Are individual enclosures
or multi-cavity enclosures the best choice in
this application? Is the nal product likely
to undergo shock, vibration, or package-
drop testing?
SHIELDING FORMATS
Careful consideration of the questions men-
tioned above will assist in the choice of the
most appropriate, cost-eective shielding
format for a particular application. Among
four-sided enclosures, there are a number
of choices, each suited to varying applica-
tion requirements. A four-sided enclosure
PCB board level enclosures:
A vital design element
There is a greater need than ever to consider the radiated interference
between individual equipment and adjacent circuits on PCBs.

W. L. Gore & Associates

North America Europe International
1 (800) 445-GORE (4673) +49 9144 6010 1 (302) 292-5100
+44 1392 561511
gore.com/emi
Innovation Through Creativity
GORE EMI SHIELDING AND GROUNDING SOLUTIONS
GORE-SHIELD
GS8000 EMI
Gasket
a softer, highly
compressible,
gasket with
high-level
EMI shielding
GORE-SHIELD GS5200
EMI Gaskets and
Grounding Pads
highest-level of
EMI shielding and
grounding in a
die-cut form factor
GORETM snapSHOTTM

Board-Level
EMI Shield
revolutionary,
multi-cavity
shielding solution
GORE-SHIELD SMT
EMI Gaskets
unique surface-
mountable
EMI gasket
building blocks
GORE-SHIELD
Supersoft SMT
Grounding Pads
soft, resilient, surface-
mountable grounding
solution
Gore.indd 1 3/18/2008 2:21:14 PM
118
with a spring-ngered lid consists of a
four-sided fence with an array of pins
on the PCB edge that are used to solder
the fence to the PCB using hand sol-
dering, wave soldering, or pin-in-hole
ref low soldering. A spring-fingered
lid is generally used with this type of
enclosure. It is the best form of remov-
able lid if the fence height is su cient
to accommodate the ngers. Spring
ngers may be oered in varying sizes
such as standard height or low prole.
An internal spring nger is another
option in situations where there is
insu cient clearance on the outside of
the fence to allow for external ngers.
Also, external and internal ngers can
be mixed as long as they are in the
same format on opposing faces.
Another enclosure option is a four-
sided surface-mount enclosure with
spring ngers. Tis type of enclosure is
the same as the normal four-side enclo-
sure, but lacks the xing pins. It is usu-
ally seam-soldered to a continuous track
on the PCB. When gauging the height of
the fence in relation to the length of the
spring ngers, a designer must factor in
the thickness of the solder llet at the
base of the fence. An alternative to the
even continuous seam-soldered fence is
to castellate the PCB board edge of the
fence. Tis choice reduces the amount
of solder used to attach the fence to
the board and also provides clearance
for tracks to cross the fence boundary
without resorting to specic track clear-
ance mouse holes or multi-layer PCBs.
If the fences are to be machine placed
onto the PCB, a pick-and-place target
may be needed. Tis would probably
be combined with a punch-and-press
format fence (Figure 1).
Four-sided PCB enclosures are also
available with plain, folded lids. See
Figure 2. Tis type of lid is generally
less costly to produce, especially dur-
ing the development phase. Te only
drawback to this design is that there is
no guarantee of a connection between
the lid and the fence apart from where
the lid-hold-down tags are placed. Any
gaps in the connection could have an
eect on the EMC performance of the
enclosure. Tese lid hold-down tags
can be either the fold-down type or
the twist type illustrated in Figures 2
and 3 and blowups. Both options are
suitable for up to ve lid removals and
replacements.
For applications for which a very
low prole fence and lid are needed,
an enclosure with a pip-lock lid can be
used. Pips in the side walls of the lid
lock into slots on the fence side walls.
Tis design choice comes with fence
heights as low as 1.5 mm. As with the
tag-and-slot lid, there is no guarantee
of connection between fence and lid
except at the locations secured by the
pip. Also, the more pips along any wall,
the more di cult it becomes to remove
the lid after placement for necessary
repairs or adjustments.
Some designers prefer to place the
lid and fence as a unied set using the
pick-and-place facilities of a surface-
mount assembly line. Lids are removed
only if rework to the components inside
the enclosure is required. Electing this
option means that an array of holes
must be made in the lid to allow the
reow heat into the enclosure to solder
the electronic components inside to
the PCB as shown in Figure 4. Unfor-
tunately, these holes may degrade the
EMC performance of the enclosure by
up to 20 dBs.
Where the enclosure can be placed
after testing, or when the PCB produc-
tion yield is to be quite high, the more
cost eective option is the ve-sided
can. Tis choice can be supplied with
soldering pins, spot welded corners, or
butted corners, or it can be fashioned
with ref low heat holes for machine
placement. By far the most cost eec-
tive ve-sided enclosure for develop-
ment and low volume production is the
bend-line-formed ve-sided enclosure.
It is delivered in at sheets with tags.
Figure 1. Punch-and-press format fence with
pick-and-place target. Figure 3. Plain folded lid with twist tag.
Figure 2. Four-sided can with plain folded lid.
EMC_Bejing.indd 1 1/25/2008 1:11:32 PM
120
See Figure 5. These are folded and
formed into the required shape by the
user as they are placed onto the PCB.
SHIELDING MATERIALS
For most RF shielding nearly any base
material such as copper, brass, stain-
less steel, aluminum, or nickel silver
will work as a shield. In PCB mounting
where components are soldered to the
board, plating is used on most materi-
als other than nickel silver. Tradition-
ally, bright tin plating had been used;
however, with the implementation of
the RoHS Directive on hazardous sub-
stances, the PCB assembly lines have
switched to non-lead solder, which
has a reow temperature equal to or
in excess of the melting point of bright
tin. Consequently, there has been a
general change to the use of nickel
silver. Alternative plating nishes such
as silver or gold can be used, but clearly
these can be cost prohibitive. At low
frequencies where the interference is
usually magnetic, the use of specialist
materials such as Mu metal or radio
metal are more common, although
some shielding can be provided by
the use of thicker steel or phosphor
bronze.
The frequency limitation of thin
metal fabricated shielding is usually
between 3 to 5 GHz, beyond which
two effects may limit shielding ef-
fectiveness or its usefulness. Because
of the eect of stray capacitance be-
tween the enclosure and the electronic
components on the PCB, any minor
movement in the metal of the enclosure
could cause microphony to occur. At
these frequencies, shielding usually
takes the machine-from-solid form, a
choice that overcomes this eect.
Another very high frequency ef-
fect occurs when the cavity of the
enclosure becomes a fraction of a
waveguide, possibly at harmonics
of the circuit operating frequency.
This effect causes the enclosure to
act as a cavity resonator rather than
as an EMI shield. Tis eect can be
partially overcome by the inclusion
of absorbing material inside of the
enclosure and by the careful choice
of enclosure size.
DESIGN FOR MANUFACTURE
AND ASSEMBLY
One of the key considerations in en-
closure design is understanding the
production volume of the ultimate
component or product. Tis judgment
will determine the eventual method of
manufactureand to some degree
the enclosure format. As was noted
above in discussion of the fence-and-
lid designs versus the ve-sided can,
clearly the manufacture of a one-piece
component will be less expensive than
creating two pieces that must be put
together to form the shield.
The production method chosen
will also have an impact on compo-
nent cost. For example, consider the
comparative costs of photo chemical
machining (PCM) versus punch-and-
press progression tooling or some
halfway hybrid of the two processes.
Will the components be hand or ma-
chine placed? If machine placement
is an option, then a pick-and-place
target may be required as most place
machines use a vacuum suction head
to pick up the components. Tere are
some machines that use pincer type
pickup systems, but these are still fairly
uncommon.
For machine placement, the co-pla-
narity of the PCB edge of the fence of a
ve-sided can will need to be 0.1 mm
or better to ensure that the can will sit
in the solder paste when placed and
while going through the reow oven.
Machine placement generally requires
some form of special packaging, either
tape-and-reel or waff le trays. Still,
not all surface-mount assembly lines
can handle wa e trays; and for larger
enclosures, wide tape feeders can slow
down the placement process since they
will take up several feeder slots that
could be used for a number of smaller
electronic components.
For straightforward hand-placed
fences in small to medium volume, the
usual production method is PCM strip-
line assemblyin which the fence is
made from a long single strip of metal,
with part etched bend lines in each
corner. Tese are then hand-formed
into a rectangle or whatever shape is
required. Tey are then spot-welded
or seam-soldered in one corner to
form the nal permanent shape. One
of the benets of this method is that
the maximum number of components
can be obtained from a single sheet of
material.
For fences that will ultimately go
into a punch-and-press, a fold-down
format similar to a ve-sided can is
used. Te bulk of the material is re-
moved from the top surface, leaving
either web corners or an all around
web. Tese fences also lend themselves
to the inclusion of a pick-and-place
target. See Figure 5. Additionally, a
ve-sided can for machine placement
will require heat holes and an area clear
of these holes to provide the pick-and-
place target.
Figure 6. Five-sided enclosure with part-
etched perforations for access.
Figure 4. Five-sided enclosure with butted
corners and reow heat holes.
Figure 5. Five-sided enclosure delivered at
for self-forming.
WARNER
121
shielding
ACCESS TO THE COMPONENTS
WITHIN THE ENCLOSURE
Where practical, access to the compo-
nents inside the enclosure is achieved
by lifting one of the various types of
lids described above away from the
enclosure fence. In situations where
access is required only on a very
small percentage of a high-volume,
high-yield line, perhaps for corrective
rework, a ve-sided enclosure with a
rework access area is one possible solu-
tion. As shown in Figure 6, an area of
the top face is surrounded by a series
of postage stamp type perforations,
possibly with a part etched line joining
them, to allow for easy removal using
small long-nosed pliers.
Following the corrective action,
the exposed area can be re-sealed
using either a spring-ngered lid or a
plain folded lid touch-soldered to the
remaining frame left on the PCB. Tis
process eliminates the di cult task
of attempting to remove a complete
enclosure. Such an attempt would
likely result in damage to the PCB, or
worse still, the disposal of complete
units as preferable to undertaking the
painstaking repair process. Given the
escalating complexity and cost of high
volume products and the implementa-
tion of environmental directives such
as WEEE, a rework access area delin-
eated with perforations is an option
worth serious consideration. Finally,
in cases in which there are a number
of separate areas of the PCB that must
be shielded either from extraneous in-
terference, or from each other to avoid
crosstalk problems, the option of using
a multi-cavity labyrinths arises.
COMPONENT
MANUFACTURING METHODS
A number of methods are used to
manufacture shielding enclosures from
metal including photo chemical ma-
chining (PCM), laser cutting, punch-
and-press, or some hybrid of these
processes. Te method chosen would
depend on the technical requirements
of the enclosure, the ultimate volume
of production, and the component cost
Figure 7. Etched fold lines.
Figure 8. Paste deposits for screening cans.
Roxtec Inc
10127 E. Admiral Place, Tulsa, OK 74116
PHONE 800 520 4769, FAX 918 254 2544
EMAIL emc@us.roxtec.com, www.roxtec.com
EMI/RFI Protection
For enclosures and thru-wall penetrations
NProvides grounding and RF protection.
NVeried by authorities in shielded attenuation test according
to EN 50 147 -1:1996 5.2.2. standards.
NVeried in transfer impedance tests according to the VG95373.
NProtection against re (UL1479), smoke, gas and water.
Traditional EMC glands require a hole for each cable. The Roxtec sealing systems
allows multiple cables through one opening and with its Multidiameter Technology
one module can seal multiple cable diameters.
An example of a measurement of shielding effectiveness
122
constraints imposed on the project.
PCM is actually the same process as
that used to manufacture bare circuit
boards; the one distinction is that it
starts with a sheet of metal instead
of a metal-clad insulator. Te process
consists of creating a at form of the
product to be produced. Using CAD,
etch and bend allowances are added
before two photo tools, one for each
side of the metal, are plotted. Where
the process is etching the prole of a
productthe two tools are the same.
When bend lines, logos, or connector
or aperture details are required on one
side of the material, the two tools are
dierent. Te sheet of metal, pre-coated
with photo resist, is then exposed to
UV light through the photo tools.
Te sheet is then developed, and the
unwanted resist removed leaving clear
outlines of where the material is to be
etched away.
Te PCM process has several advan-
tages. Te cost of tooling and tool mod-
ication is low, and turnaround times
are fast. Bend lines can be etched so as
to create precise anglese.g., 135, 90,
or 45 degrees. See Figure 7. Te process
is burr and stress free, and magnetic
and other material processes are unaf-
fected by the process. Complex designs
are easy to tool, and the inclusion of
apertures, track clearance holes, logos,
and other details has no cost eect on
the ultimate productan advantage
that allows mechanical designers to be
as creative as they wish.
An alternative to PCM is to laser
prole the enclosures. Tis choice is
not cost eective for volume work on
small cans, and precision bend lines are
di cult to achieve. Still, lasers come
into their own for larger enclosures
manufactured from thicker material,
such as 19-inch rack housings.
Toggle or y presses can be used for
simple one-sided forming; however, for
forming multiple sides at the same time
and for cutting material, a power press
would be required. A small press can
be manually operated with one die set.
Alternately, a very large press will be
machine operated and can hold a much
larger, multi-stage tooling.
A die set consists of a set of (male)
punches and (female) dies, which, when
pressed together may form a hole in the
material or may reform the material
in some desired manner. Te punches
and dies are removable; the punch is
temporarily attached to the end of a
ram during the punching process as the
ram moves up and down in a vertically
linear motion. Although the materials
used for screening enclosures are rela-
tively thin, larger high-power presses
are needed because of the number of
progression stages of press tooling used
to create the complex structures used
in electronics. Tese progression tools
require a large tool bed and are, as such,
more powerful than would normally
be required for the thin material being
handled.
PCM VS. PUNCH-AND-PRESS
Switching from PCM to hard tooling
is usually based on nancial consid-
erations. If the use of hard tooling is
being considered, the product and
enclosure design must be fully xed
before embarking on hard tooling
because even minor changes can be
very expensive. Te critical switchover
point where the decision is made to use
punch-and-press is impelled by enclo-
sure complexity. Complex products
necessitate higher tooling expenditures
so the ultimate volume of product pro-
duction and sales must be great enough
to justify this option.
One of the most cost ef fective
materials currently in use for volume
production is pre-tin plated mild steel,
but this material choice is suitable only
in instances where bare steel edges will
not be an issue after placement on the
PCB. If the product may be subjected
to any form of harsh environment, this
Figure 9. Stencil layout for screening can
deposit with components that require
screening within footprint.
Figure 10. Enhanced stencil layout for
screening can deposit for components that
require screening within footprint.
Figure 11. Conventional single thickness
paste deposits.
Figure 12. Selective multi-height paste
deposits can be achieved using multi-level
stencils.
APEX DIE CO., INC
Die cut EMI/RFI Shields,
Gaskets, Steel Rule Dies
888-937-3907
dave@apexdc.com
www.apexdc.com
Isolated paste
deposits
Stencil
Webs
WARNER
123
shielding
choice risks the possibility of corrosion
occurring. Also, with the introduction
of non-lead solder on volume assembly
lines, more designers are switching to
nickel silver as an alternative to bright
tin-plated steel.
HYBRID MANUFACTURE
Fortunately, enclosure production
is not simply a matter of choosing
between the less expensive and the
costly. For some designs, using PCM
proling followed by one-hit forming
will improve the cost eectiveness of
production without any commitment
to full progression tooling. Another
viable option for cost eective, high
volume production would be separate
blanking and forming press tools, a
two-step solution that also bypasses
the very high costs of progression
tooling.
PCB DESIGN
Te rule of thumb for determining PCB
track width should be a minimum of
three times material thickness; this
formula ensures an even llet of sol-
der on either side of the can wall and al-
lows for any placement tolerance. Some
designers prefer a continuous track for
the shielding fixturea choice that
results in a continuous seam, solder-
joined to the PCB (apart from any track
clearance holes). Others prefer a castel-
lated edge to the enclosure resulting
in an intermittently broken track for
soldering the can to the PCB. Te latter
choice enables signal or other tracks to
cross the enclosure boundary on the
surface of the PCB. On multi-layer PCB
designs, common practice is to make
the outer layers of the PCB RF ground
and to conne the signal tracking to
the internal layers.
ASSEMBLY
Today, the assembly of RFI shielding
cans onto the PCB is an increasingly
important factor in the quality of n-
ished assemblies. Often, pressed (or
stressed) cans will not sit ush against
the PCB surface. Several methods are
currently used to overcome this prob-
lem. One of these is preheating and
placing weights on the cans during
reow, but this technique can be prob-
lematic. Weighted cans can aect the
reow characteristic of the assembly
and are also likely to lead to problems
with joint integrity during cooling and
use. Shielding cans manufactured us-
ing PCM do not exhibit these severe co-
planarity problems since PCM does not
induce stress into the material. Once
plated and assembled, the seating faces
on all four sides of a PCM-produced
can will achieve the atness tolerances
required.
Another aid in overcoming any
co-planarity problems is the use of
selected thickness, printed solder de-
posits. On one printing pass, creating
solder deposits of increased height
for the shielding can and other larger
components may assist in eliminating
problems associated with component
co-planarity. Tis technique provides
stronger solder fillets that increase
mechanical security and may prevent
problems associated with voided l-
lets.
Often solder deposits are printed in
isolated blocks, but the solder does not
reow su ciently and can create voids
and blowholes in the sealing llet that
require reworking. One obvious solu-
tion is to ensure that the solder paste
deposits do not have these large inter-
rupts that cause these troublesome
eects in the rst place. It is possible
to create integral solder deposits that
assist in reowing without voids. Re-
placement of the solid metal tags with-
in the solder paste stencil with suitable
mesh aperture patterns that join the
isolated deposit apertures permits a
su cient admixture of solder material
and ux within the paste (Figure 8). In
turn, this improved paste helps cre-
ate a condition of surface tension that
ensures that solder ll ows over all
areas creating an even llet of solder
all around the base of the can.
Initially both the PCB and screening
can possess good solderable nishes.
Te addition of printed solder paste
along with the heat applied during re-
PEI manufactures custom EMI/RF shields to meet the most stringent customer requirements. PEI produces your shields, or produces shielding prod-
ucts using the photo chemical machining process. The process allows for quick turnaround times, precise tolerances, and the ability to etch into the
surface, creating bend lines for easy forming, as well as your own custom graphics. PEIs shielding will meet all solder-ability requirements. Tooling is
inexpensive, and can be altered quickly and efciently. If you are having EMI or RF problems, PEI is your answer. Our on staff sales personnel are very
knowledgeable and can provide answers to all your questions.
For an immediate quote, contact pei@photofabrication.com, or:
Photofabrication Engineering Inc., 500 Fortune Boulevard, Milford, MA. 01757
Fhooe. 508.418.2025 Fax. 508.418.3582 www.photoIabricatioo.co
MATERIALS
B|oss 1J1J Steel lic|el Sil.e|
PLATING
lic|el Tir , ||i|t u| Jull TirleoJ ,Sr||
lic|el ulJ Sil.e| t|e| ulotirs o.oilo|le
USES
Protect components from radio frequency/electro-
magnetic interference
Provide electrical grounding
Foreign material protection
EMI & RF SHIELDING
124
ow often encourages the migration of
solder up the can walls away from the
PCB. Te result is sometimes less than
aesthetic and may not provide adequate
shielding or the mechanical strength
required in the solder llet.
A unique solution to this problem
of solder llet migration is the reow
Plimsoll line (RPL). In this instance, a
Plimsoll line is found not on the hull of
a ship, but on the can wall. Specically,
an interruption in the plating nish on
the can wall allows the solder only min-
imal upward migration and ensures
that fillet strength and volume are
maximized. It also avoids the problems
associated with the formation of blow
holes, gaps, and an untidy appearance
of the can wall nish.
Another problem with the tra-
ditional approach, including webs
between adjacent apertures as seen
in Figure 9, is that it often results in
isolated paste deposits that do not al-
ways deliver integral solder llets and
that may need rework. An enhanced
stencil design as shown in Figure 10,
includes metal mesh that ensures paste
deposits on the entire can footprint on
the PCB; and the presence of both ux
and paste contributes to an eective
reow process.
Yet another issue that is common
when placing enclosures or other large
components on PCBs is to place suf-
cient solder paste on the surface of
the PCB to accommodate ne pitch
components both within and outside
the enclosure. Tis requirement can be
achieved by using a multi-level stencil,
with the volume of solder paste dis-
pensed on the board being a function
of the stencil thickness as well as the
aperture size. Cf. Figures 11 and 12.
CONCLUSION
Te ubiquity of electronics and radio
applications in our everyday lives,
alongside the changing directives from
various regulatory bodies, means there
is a greater need than ever to consider
the radiated interference between in-
dividual equipment and adjacent
circuits on PCBs. Te shielding of this
interference needs to be considered
alongside all of the other design aspects
of a product and preferably at an early
stage, to avoid costly modications to
PCB layouts or equipment re-designs
following initial EMC testing. Other
issues to consider include product test-
ing, handling of the shielding in pro-
duction, other regulatory directives,
such as RoHS compliance, and cost.
Alan Warner, the author of Te World of
EMI/RFI Enclosures, oers over 40 years of ex-
perience in the electronics industry, has a degree
in Electronics and Systems Engineering and is a
member of the Institute of Electrical and Elec-
tronics Engineers (IEEE) and Institute of Sales
and Marketing Management (ISMM).
Alan is now retired from Tecan but still acts
as a consultant. Trough his company AW Ser-
vices, he now oers EMC trainingin particular
for xed installations.
Tis article is an extract from Tecans recent
publication, The World of EMI/RFI Enclo-
sureswhich covers all aspects of the design,
prototyping and manufacture of o-the-shelf and
custom shielding solutions, from cans to complex
multi-cavity and totally-enclosed structures. Te
guide is available from Tecancontact emc@
tecan.co.uk for further details.
SUPPLIERS SHIELDING
Alco Technologies, Inc. .................. 101
Torrance, CA; 310-328-4770; www.
alcotech.com
Apex Die & Gasket Inc. ...................122
Tempe, AZ; 888-937-3907; www.
apexdc.com
Chomerics, Div. of Parker Hannin
Corp. ................................................. 103
Woburn, MA; 781-935-4850; www.
chomerics.com
emscreen GmbH ............................. 173
Taufkirchen, GERMANY;
+49-89-614171-71; www.emscreen.de
Fotofab ............................................. 113
Chicago, IL; 773-463-6211; www.
fotofab.com
GORE ............................................... 117
Elkton, MD; 800-445-4673; www.
gore.com
Laird Technologies............................99
Delaware Water Gap, PA;
800-843-4556; www.lairdtech.com
Leader Tech, Inc. .............................109
Tampa, FL; 813-855-6921; www.
leadertechinc.com
Magnetic Shield Corporation ........105
Bensenville, IL; 630-766-7800; www.
magnetic-shield.com
Photofabrication Engineering Inc. 123
Milford MA, 508-478-2025, www.
photofabrication.com
Roxtec ............................................... 121
Tulsa, OK; 800-520-4769; www.
roxtec.com
Spira Manufacturing Corporation .... 2
N. Hollywood, CA; 818-764-8222;
www.spira-emi.com
Tech-Etch, Inc. ................................. 111
Plymouth, MA; 508-747-0300; www.
tech-etch.com
MORE ON OUR WEBSITE
Board level shields are a vital
element in PCB design. Familiarize
yourself with the many choices
available. Just go to the new
InterferenceTechology.com, and
check the many shielding choices
listed in the Products and Services
section under Directories. And
while youre onsite, check out the
New Products section for the latest
innovations in shielding products.
Quell.indd 1 3/17/2008 2:29:42 PM
126
ferrites, flters & connectors OVERLOOKED CHARACTERI STI CS OF FERRI TES
LEE HILL
Silent Solutions LLC
Amherst, NH
JEFF BRUCE
Steward Inc.
Chattanooga, TN
ABSTRACT
W
hile nickel-zinc composition
soft ferrites are routinely used
for PCB EMI suppression, the
consequences of DC and low frequency AC
bias on a devices high frequency imped-
ance has not been widely discussed in the
EMC and magnetic component literature.
Virtually all EMI suppression applications
in DC and AC power lter circuits place
two-terminal ferrites under bias. Tis paper
discusses the impact of low frequency bias
on high frequency device performance and
suggests several methods to address these
impacts while improving the performance of
EMI lters containing nickel-zinc ferrites.
INTRODUCTION
Nickel-zinc composition soft ferrites are
widely used in the design of electronic
products for suppression of EMI emissions
and improvement of EMI immunity. Te ge-
ometry, composition, and impedance versus
frequency characteristics of surface mount
devices for printed circuit board (PCB) de-
signs have been rened to produce devices
that provide peak impedances at frequencies
ranging from below 100 MHz to 1 GHz. Te
EMC literature contains many texts and
papers describing the basic properties and
applications of ferrites intended for use on
cables and PCBs
[1]-[3]
. More recent work has
proposed simple models
[4]
and sophisticated
empirical methods
[5], [6]
to provide lumped
element RLC models, as well as numerical
modeling methods to accurately and e -
ciently incorporate ferrites for printed circuit
board applications into circuit and enclosure
level computational analyses
[7]
.
While much information concerning
practical methods for the modeling and
measurement of the complex impedance of
high frequency ferrites is available, a dearth
of applications information exists concerning
the eect of DC and low frequency AC bias on
the impedance characteristics of nickel- zinc
ferrites at frequencies between 30 and 1000
MHz. While the magnitude of impedance un-
der zero bias is the most commonly presented
performance characteristic of PCB ferrites, a
large percentage of commercial applications
utilize these devices under DC bias. An un-
derstanding of the eects of DC bias is neces-
sary to select components and design cost-
eective, high performance PCB EMI lters.
Tis paper provides background information
and sample analyses of the behavior of several
dierent PCB ferrite devices under varying
levels of DC bias. Te discussions provide a
means to characterize and distinguish the
variation of resistance and reactance, and
associated expected performance of devices
with dierent a) standard package sizes, e.g.,
EIA 1206, 0805, etc., b) maximum current
ratings, c) parallel resonant frequencies, and
d) responses to applied DC bias.
LOSS AND FREQUENCY DOMAIN
CHARACTERIZATION
Loss
Tere are three dierent types of resistance
Utilizing overlooked characteristics of
ferrites for improved printed circuit board
EMI suppression
An understanding of the effects of DC bias is needed to design high
performance PCB EMI f lters.

2006 IEEE. Reprinted with
permission, from 2006 EMC Zurich
Symposium.
Article 17 ORIGINAL ag_08.indd 126 5/6/2008 2:15:25 PM
Murata.indd 1 2/18/2008 4:57:58 PM
128
How is
finding the right core
for your EMC design
making you feel today?
to be able to reach your customer
service team with product questions
by the level of in-stock inventory in
prototype-to-production quantities
to find most products can be
delivered to you in 24 hours
EMI Suppression Cores Bobbins Thermistors Specialty Services
In North America: 800-775-3829
In Europe: +44-1189-602430
In China +86-512-62620226
info@dextermag.com
If you arent feeling this way,
then look to Dexter
<
wowed
>
<
impressed
>
<
revlieved
>
www.dextermag.com/IT.aspx
parameters used to characterize ferrite devices used for EMI
suppression.
Two-terminal AC loss versus frequency. Tis is given by 1.
the resistance plot R in Fig. 1. It may be measured with
or without applied DC bias.
Nickel-zinc ferrites are intentionally used at frequencies
where the resistive part of their impedance is dominant,
whereas ferrites used primarily as cores in energy storage
inductors and signal transformers are used at frequencies
where the impedance is dominated by inductive reactance.
DCR or DC resistance is measured under DC bias only, 2.
with no AC signal applied.
Tis parameter allows the voltage drop at DC and AC
power frequencies to be calculated for ferrites used as lter
elements in power bus lters.
Volume resistivity, determined by voltage drop per 3.
current density.
Tis intrinsic property characterizes the current density
induced into bulk ferrite material for a given applied voltage.
Tis parameter is considered when ferrite is placed close to
or in direct contact with two or more conductors that exhibit
a potential dierence, such as in electrical connectors or
power transformers.
Only 1 and 2 are generally useful in the characteriza-
tion and use of SMT ferrite devices. Te maximum permis-
sible current for a given device will be inversely proportional
to its DCR. Current ratings for ferrites characterized by
impedance are determined by the current that induces the
maximum permissible temperature rise in the component.
Impedance versus Frequency
Ferrite devices for PCB applications at frequencies above
30 MHz are most commonly manufactured with a ferrite
material composed of iron oxide, nickel, and zinc. Most
devices are characterized with an RF impedance analyzer
to generate a swept frequency characteristic that displays
magnitude of impedance versus test frequency. Fig. 1 shows
the impedance versus frequency characteristic of a 0805
package size two-terminal ferrite device intended for use in
noise suppression applications above 30 MHz. As suggested
Figure 1. Impedance versus frequency characteristic of high
frequency SMT ferrite under zero bias.
HI LL /BRUCE
129
ferrites, flters & connectors
by
[4], [6]
, this characteristic can be modeled using lumped
elements, whose peak impedance is pure resistance at the
parallel resonant frequency. Tis characteristic demonstrates
a frequency dependent loss and reactance, and can be divided
into three regions; 1) Low frequency, high Q, since X=ZL >>
R, 2) mid frequency, low Q, and 3) high frequency, increasing
Q as 1/ZC > R. In Region 1 the magnitude of impedance is
dominated by inductive reactance, in Region 2, by resistance,
and in Region 3, the magnitude of capacitive reactance (not
shown in Fig. 1) eventually overtakes R.
Since EMI is generally measured as a scalar quantity
in decibels, a data plot showing only magnitude of im-
pedance could at first glance be considered sufficient
to generate an insertion loss prediction in conjunction
with Fig.2 and:
Ferrite With Voltage Noise
rrite Without Fe Voltage Noise
Log 20 Loss Insertion = (1)
Load Source
Load
Z Z
Z
rrite Without Fe Voltage Noise
+
=
(2a)
Load Ferrite Source
Load
Z Z Z
Z
Ferrite With Voltage Noise
+ +
= (2b)
Most manufacturers of EMI suppression ferrites provide
plots of impedance magnitude versus frequency for devices
under zero bias. Since many applications require EMI sup-
pression along conductors with net DC
or low frequency power current, further
characterization is necessary in order to
predict and optimize noise reduction
performance.
APPLICATION CIRCUITS WITH
DC BIAS
Nickel-zinc SMT ferrites are commonly
used as a series lter element in digital
electronic design, placed between a DC
power supply positive terminal and
the power supply input pin of a high
frequency digital integrated circuit, as
shown in Fig. 3. Tis application reduces
the amplitude of the noise current and
the resulting noise voltage induced by
the integrated circuit along the power
supply conductors. Te impedance of
the power bus is represented as ZPB.
If the power supply conductors include
attached wires with signicant physical
length compared to the noise frequency
wavelength, then ZPB can also be con-
sidered to be the antenna input imped-
ance for the power supply conductors
when driven by noise currents.
[8]
From
this discussion and Fig 3. a number of
observations can be made:
Noise suppression is maximum 1.
when the amplitude of the noise voltage at the power
bus or antenna terminals is minimum. Tis condition
occurs when the amplitude of noise current I(F)NOISE
is minimum. Referring to (2b), for e cient antennas
with low input impedance ZLOAD, noise voltage at the
load is minimum at frequencies where the ferrite device
impedance dominates both the noise source and antenna
input impedance. Te impact of the ferrite device can
Figure 2. Simple series element noise schematic.
Figure 3. Noise circuit with ferrite under DC bias.
130
IMPEDANCE VERSUS DC BIAS FOR A SINGLE
COMPONENT
Fig. 4 displays a family of curves that illustrate the impact of
DC bias on the impedance versus frequency characteristic
of a 0805 nickel-zinc SMT ferrite bead rated for use up to
500 mA. It is common practice in the EMC industry to use
the approximate value of a ferrites magnitude of impedance
at 100 MHz as a unique identication parameter; the part
characterized by Fig. 4 is therefore referred to as a 600 ohm
device. Te impact of increasing DC bias can be qualitatively
summarized as follows:
At frequencies below the zero bias parallel resonance, 1.
there is an apparent reduction in the two terminal series
impedance presented by the device. At 100 MHz, a 200
mA DC bias through the device will result in more than
a 50% reduction in impedance.
Te resonant frequency of the device increases. 2.
Te quality factor Q increases as can be seen in 3.
At very high frequencies, peak performance at any bias 4.
level is generally within 3 dB of a zero bias peak.
Te impact of increasing bias can be described as fol-
lows:
EMI suppression will be inversely proportional to ap- 1.
plied DC bias at frequencies below the zero bias parallel
resonance.
Low frequency EMI suppression is greatly reduced at 2.
higher bias levels. At higher frequencies, Q increases and
the devices dierent impedance versus frequency versus
bias characteristics converge.
For electronic systems where DC and AC power sup- 3.
ply currents are determined by the type and number of
scaleable hardware options installed, the number of noise
sources and power supply current will increase simultane-
ously. An increase in total system noise amplitude may be
associated with the addition of active circuitry when the
root cause is actually a reduction in lter performance
due to increased DC bias.
EFFECTS OF BIAS AS A FUNCTION OF SMT
PACKAGE SIZE AND DEVICE SELECTION FOR A
GIVEN APPLICATION
When ferrite devices are selected for DC power bus EMI lter
applications, the most common device performance criteria
are 1) adequate DC current rating and DCR, 2) maximum
impedance, 3) minimum package size consistent with PCB
assembly technology, and 4) cost. Te manner and priority
with which criteria 1, 2 and 3 are considered can have a
profound eect on the choice of device and resulting noise
lter performance.
Suppose a design application requires a high frequency
ferrite for ltering 300 mA of digital logic supply current.
How then should a designer select a part for maximum noise
attenuation if there are three 600 ohm devices available
with the following package sizes & current ratings; #1 =
0603, 300 mA, #2= 0805 (500 mA), and #3= 0805 (1.5A).
We assume that all three devices have su ciently similar
zero bias impedance versus frequency characteristics and
0
100
200
300
400
500
600
700
800
1 10 100 1000
Frequency (MHz)
|
I
m
p
e
d
a
n
c
e
|

(
)
0A
0.1 A
0.18
0.3 A
0
100
200
300
400
500
600
700
800
1 10 100 1000
Frequency (MHz)
|
I
m
p
e
d
a
n
c
e
|

(
)
0A
0.3 A
0.6 A
0.9 A
1.2 A
1.5 A
Figure 5. Magnitude of impedance vs. frequency characteristic vs. DC
bias for 0603 SMT 600-ohm device, 300 mA maximum current rating.
Figure 6. Magnitude of impedance vs. frequency vs. DC bias
characteristic for 0805 SMT 600-ohm device, 1.5A maximum current
rating.
0
100
200
300
400
500
600
700
800
1 10 100 1000
Frequency (MHz)
|
I
m
p
e
d
a
n
c
e
|

(
)0A
0.1 A
0.2 A
0.3 A
0.4 A
0.5 A
Figure 4. Magnitude of impedance vs. frequency vs. DC bias
characteristic of 0805 SMT ferrite, 500 mA maximum current rating.
also be seen as a simple voltage divider between the noise
source and its load.
Te ferrite device is placed under DC bias in this appli- 2.
cation. If its impedance versus frequency characteristic
varies with DC bias, then noise attenuation in the circuit
will vary with DC bias.
For arbitrary digital electronic devices and arbitrary 3.
length power supply (bias) conductors, both noise cur-
rent and antenna input impedance will be a function of
frequency.
HI LL /BRUCE
131
were normalized to account for the ap-
proximately 50 ohm greater zero bias
peak impedance of devices 1 and 3,
the maximum value peak impedances
would dier by less than 2%! Since Fo
and Fm, do not vary much among the
three devices, we can consider a low
frequency ranges up to and including
the highest zero bias Fo, and a high
frequency range beyond the highest
Fm. At low frequencies the largest
device with highest current rating
provides maximum impedance. But
when placed under 300 mA of bias,
its impedance at its zero bias reso-
nance frequency declines by 55% when
compared to its zero bias
value. At maximum bias,
all three devices exhibit
a maximum impedance
within 25% of their peak
impedance at zero bias, an
insignicant change in the
context of noise suppres-
sion measurements units
of decibels. At frequencies
near and above Fm for
any device there is much less change in
peak impedance with frequency.
CONCLUSIONS
Larger package size in general main- 1.
tains a greater percentage of zero bias
impedance at frequencies below zero
bias resonance.
To yield maximum noise suppression 2.
in real applications, devices must be
characterized for impedance versus
frequency over the range of expected
bias levels.
Te frequency of maximum imped- 3.
ance can be tuned by the applica-
tion of a xed DC bias.
acceptable DCRs for the given appli-
cation. Fig.s 4, 5 & 6 give impedance
versus frequency versus bias data for
these three devices.
Te eect of 300 mA of bias is tabu-
lated at the frequency of peak imped-
ance under zero bias Fo and presented
in Table I. Also summarized is the eect
of maximum rated bias current and its
associated frequency of peak imped-
ance Fm. Note that these maximum
currents are signicantly dierent for
each device, yet the peak impedances
demonstrated by each device under
maximum bias are remarkably similar.
If the maximum bias peak impedances
Table I. Summary of bias effects on peak impedance for three different devices.
Device
Number
SMT Package
Type &
Maximum Current
Rating
Zero Bias
Characteristic
at Parallel Resonance
300 mA Bias
Characteristic
Maximum Bias
Characteristic
Peak Z
(ohms)
Frequency
(MHz)
Peak Z
(ohms)
Frequency
(MHz)
Peak Z
(ohms)
Frequency
(MHz)
1 0603, 300 mA 754
175
201 175 577 476
2 0805, 500 mA 696
143
270 143 517 439
3 0805, 1.5 A 750
138
336 138 587 605
132
Many application circuits apply a 4.
bias current. Manufacturers im-
pedance characterizations at zero
bias are insu cient for predicting
performance, even in applications
with bias levels below 300 mA.
At high frequencies, a devices peak 5.
impedance is much less sensitive
to bias and will maintain a greater
percentage of its claimed zero bias
impedance.
A devices high current rating and/ 6.
or large package size does not neces-
sarily alleviate DC bias eects on its
impedance.
ACKNOWLEDGMENTS
The authors thank Arlin Grant and
Aaron Fitzsimmons of Steward for
supporting this project and providing
plenty of data, and Randal Vaughn of
SILENT for manuscript review.
REFERENCES
[1] C. R. Paul, Introduction to Electromagnetic
Compatibility. New York: John Wiley & Sons,
1992.
[2] H. W. Ott, Noise Reduction Techniques In
Electronic Systems, 2nd ed. New York: John
Wiley & Sons, 1988.
[3] D. L. Terrell and R. Keenan, Digital Design
for Interference Specications, 2nd ed. Pinella
Park, Florida: The Keenan Corporation,
1997.
[4] W. D. Kimmel, Wide Frequency Impedance
Modeling of EMI Ferrites, in Proc. IEEE EMC
Symposium,
[5] Digital Design for Interference Specications,
2nd ed. Pinella Park, Florida: Te Keenan
Corporation, 1997.
[6] Q. W. Yu, W. Holmes, and Krishna Naishad-
ham, RF Equivalent Circuit Modeling of
Ferrite-Core Inductors and Characterizations
of Core Materials, IEEE Trans. Electromag.
Comp., vol. 44, no. 2, pp 258-262, Feb 2002.
[7] K. Naishadham, A Rigorous Experimental
Characterization of Ferrite Inductors for RF
Noise Suppression, in Proc. IEEE RAWCON.,
Denver, CO, Aug. 1999, pp. 271-274.
[8] M. Li, X. Luo, and J. Drewniak, FDTD
Modeling of Lumped Ferrites, IEEE Trans.
Electromag. Comp., vol. 42, no. 1, pp 142-151,
May 2000.
[9] T. Hubing and J. F. Kaufman, Modeling the
Electromagnetic Radiation From Electrically
Small Table-top Products, IEEE Trans. Elec-
tromag. Comp., vol. 31, pp. 74-84, Feb. 1989.
Lee Hill of SILENT can be reached at LHill@
silent-solutions.com.
Jeff Bruce, Steward, a unit of Laird Tech-
nologies, can be reached at Je.bruce@lairdtech.
com.
SUPPLIERS FERRITES, FILTERS &
CONNECTORS
Advanced Monolythic Ceramics, Inc.
.......................................................... 139
Olean, NY, 716 372-5225, www.
amccaps.com
Amphenol Canada Corp. ............... 135
Scarborough, Ontario
CANADA; 416-291-4401; www.
amphenolcanada.com
Arcotronics, Inc. ............................. 155
Bohemia, NY; 631-563-9568; www.
arcotronics.net
Captor Corporation.........................141
Tipp City, OH; 937-667-8484; www.
CaptorCorp.com
Curtis Industries ............................ 143
Milwaukee, WI; 414-649-4200; www.
curtisind.com
Dexter Magnetics ........................... 128
Elk Grove Village, IL; 800-775-3829;
www.dextermag.com/softmagnetics.
aspx
EMC Component Group, Inc. .........131
Santa Clara, CA; 408 330-9216; www.
emccomponent.com
EMC Eupen, A Div. of I2R Corp. .... 146
Farmingdale, NJ; 732-919-1100; www.
emceupen.com
EMI Filter Company ........................131
Largo, FL 33773; 727-585-7990
/ 800-323-7990; www.
emiltercompany.com
ETS-Lindgren
................... 1, 84, 169, 177, Back Cover
Cedar Park, TX; 512-531-6400; www.
ets-lindgren.com
Fair-Rite Products Corp................. 129
Wallkill, NY; 845-895-2055; www.
fair-rite.com
Genisco Filter Corp. ....................... 143
San Diego, CA; 858-565-7405; sales@
genisco.com
Intermark (USA) Inc. ...................... 179
San Jose, CA; 408-971-2055; www.
intermark-usa.com
LCR Electronics, Inc. ...................... 148
Norristown, PA; 610-278-0840; www.
lcr-inc.com
Murata Electronics North America
.......................................................... 127
Smyrna, GA; 800-241-6574;
770-436-1300; www.murata.com
Oxley Developments Company Ltd.
.......................................................... 148
Cumbria, Ulverston United Kingdom;
+44 0 1229 840519; www.oxleygroup.
com
Pacic Aerospace & Electronics, Inc.
.......................................................... 137
Wenatchee, WA, 509-665-6500, www.
pacaero.com
Quell Corporation .......................... 125
Albuquerque, NM; 505-243-1423;
www.eeseal.com
The unique properties of ferrites
play a crucial role in EMC
compliance. Find more information
on ferrite beads, cores, powdered
ferrites and other products in the
Products and Services section of
MORE ON OUR WEBSITE
See whats in the new EMI Ferrites channel today.
information in the way you need it. If EMI Ferrites is
a key part of your work, you can now find all the
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
Antennas
EMI Connectors
EMI Filters
EMI Shielding
EMI Ferrites
sponsored by:
House Ferrites.indd 1 5/4/2008 8:05:23 PM
134
ferrites, flters & connectors EMI PROBLEMS WI TH ELECTRONI C MEDI CAL EQUI PMENT
PHILIP F. KEEBLER and
KERMIT O. PHIPPS
EPRI EMC Laboratory
Knoxville, TN
T
he use of electricity in medical
equipment dates back to 1745 when
Leyden, who invented the Leyden
jar capacitor, designed an electrostatic
machine to charge the capacitor, which was
then discharged into the body ostensibly to
cure some types of paralysis, diseases of
the internal organs, impotence, infertility,
psychoses, and a variety of other ailments.
Even early medical devices, which were very
simple, generated some form of electromag-
netic emissions (radiated and conducted),
but the emissions were low in magnitude
and occupied a short frequency band.
Moreover, there were few, if any, medical
equipment or systems that might be com-
promised by such emissions. Today, the
case is much more problematic. High-tech
medical equipment creates high levels of
electrical energy, measures picovolt to mil-
livolt signals from the human body, treats
diseases and illnesses with fewer invasive
procedures, and probes the micro-cellular
structures of vital organs. The demand
for microprocessor-controlled medical
equipment that can operate in known and
complex electrical and electromagnetic
environments that are forever changing has
never been greater, and the concerns over
creating an EMI problem continue.
Advances in power electronics technolo-
gies allow the designers of electronic medi-
cal equipment to meet the power-related
demands for biomedical equipment and
medical imaging systems. Some examples
of the various types of power electronic
devices used in different categories of
electronic medical equipment are shown
in Table 1. With these advances, higher
powers can be switched faster, and more
data can be processed in a shorter amount
of time. System designers may design some
of their own subsystems for use with other
systems that they select from the shelf. Data
processing systems, memory devices, and
display devices are just a few of the digital
devices that end up in medical systems
all of which are powered by one or more
power supplies. Although these subsystems
have been tested for EMC compliance in-
dividually, they will react dierently when
assembled into a larger system. Modern
electronic power supplies, for example, are
being designed to provide more power in
smaller-sized cases (i.e., increased power
density). Te use of embedded solutions to
reduce component electrical noise through
ltering and shielding has helped to reduce
emission levels. Tese improvements have
reduced the chances of an unwanted system
problem such as EMI, but the chance that
a serious EMI problem might occur is still
very real.
A design challenge that has already been
dealt with by the power supply manufac-
turers for information technology and
consumer electronics equipment is the use
of higher-e ciency power supplies. Design-
ers know that increased e ciencies equate
to higher levels of radiated and conducted
noise that must be shielded and ltered,
A design approach for reducing
EMI problems with electronic
medical equipment
High-tech medical equipment creates high levels of electrical energy.

We wrote the book on
Filtered Products
Amphenol Canada 605 Milner Avenue, Toronto, Ontario, Canada M1B 5X6 Telephone: 416-291-4401 Fax: 416-754-8668
www.amphenolacp.com sales@ amphenolcanada.com
EMI QUIET
Amphenol.indd 1 3/7/2008 12:03:47 PM
136
respectively. Designers and manufacturers of power sup-
plies for the medical equipment industry may soon be
facing the same challenges. Such challenges will result in
the development and application of new emissions reduc-
tion methods at the printed circuit board level and at the
systems level.
With the demand for eective health care equipment
coming from end users in healthcare industries around
the world, medical equipment manufacturers are com-
pelled to incorporate power electronics technologies that
comply with the revised European standard for electro-
magnetic compatibility, Medical Electrical Equipment,
Part 1: General requirements for
safety. 2. Collateral standard:
Electromagnetic compatibility
Requirements and tests, (IEC
60601-1-2). Tese demands af-
fect the manufacturers of power
supplies and other subsystems
for medical equipment, who
must develop subsystems that
are more immune to common
electrical disturbances includ-
ing both radiated and conducted
electromagnetic energy. To meet these goals, manufactur-
ers will need to develop greater insight of the concepts
underlying the design of embedded systems. Tey must
Table 1. Comparison of types of power electronic devices used in various categories of electronic medical equipment.
also consider utilizing new types of embedded systems
when designing electronic medical equipment. Tis paper
focuses on utilizing the internal and/or external ground
system and internal power buses in a medical device or
system to reduce or eliminate undesired interactions such
as interference between power supplies and other subsys-
tems or between multiple subsystems.
POWER ELECTRONICS IN THE MEDICAL DEVICE
INDUSTRY
In the healthcare industry, advances in power electronics
technologies are paving the way for better performance and
greater reliability of electronic
medical equipment. Advances in
power electronics technologies
have yielded better methods for
switching semiconductors. Te
power electronics devices that
use advanced technology are
smaller, weigh less, and function
somewhat more e ciently than
earlier devices. Other advance-
ments i n power electronics
technologies include faster and
more robust power transistor switches and power diodes
with a lower forward voltage drop, which helps to improve
e ciency and to reduce the operating temperature of
In the healthcare industry,
advances in power electronics
technologies are paving the way
for better performance and
greater reliability of electronic
medical equipment.
KEEBLER /PHI PPS
137
The EMI Filter Specialists!
WEMS Electronics specializes in state-of-the-art military, defense and aerospace EMI filter solu-
tions. We offer custom multi-circuit & miniature feed-through filters for all power line and signal
line applications.
WEMS commitment to excellence has remained constant for over forty-five years. By seeking
EMI design solutions in compact packages, uniquely crafted for value, safety, and optimum per-
formance, some of the foremost names in the defense industry have benefited. Boeing, BAE,
Northrop-Grumman, Lockheed Martin, Honeywell, Rockwell, H.R.Textron, and Raytheon have
looked to WEMS for both technical expertise and pragmatic problem-solving.
WEMS Electronics
4650 West Rosecrans Avenue
Hawthorne, CA 90250
Phone: (310) 644- 0251
Fax: (310) 644-5334
salesinfo@wems.com
www.wems.com
the diethe heart of power electronic components. Te
improvement in e ciency reduces the size of magnetic
and cooling components within the power supply, thus
reducing the overall size of power-switching circuits as
well as the costs of manufacturing and operating them.
Improved switching techniques also reduce switching
noise (i.e., conducted emissions). Unfortunately, even
with better onboard ltering, some switching noise nds
it way back onto the ground circuits of medical devices in
healthcare facilities.
Although semiconductor devices are central to power
electronics, this technology is a synthesis of multiple
disciplines, including microcomputer technology, con-
trol theory, and computer-aided design (CAD) (Figure 1).
Tis syncretistic design approach focuses on developing
compatibility between circuits and subsystems, or at least
ensuring that each is grounded together, while the designer
hopes that none of them will generate unmanageable levels
of noise. Sophisticated circuit designs based on improved
control theory can reduce the number of components used
in a power electronics system, but usually accomplishes
little in the way of noise reduction.
Figure 1 also illustrates how the power bus system
and ground system are the central support for all circuits
and subsystems. Te power bus system may be AC or DC
and is usually a combination of both. Te ground system
inltrates all circuits and subsystems to provide the clean-
138
est zero-voltage reference for each.
Traditionally, once a beta version of
the end-use device design has been
completed, conducted emissions are
checked to determine if they are too
high and thus will not comply with
the required limits. Project engineers
often scramble looking for ways to
reduce conducted emissions. One of
the most common approaches is to
juggle various line lters (if the lter
is a OEM black-box unit) until one
is found that reduces the emissions to
an acceptable level. In some cases, the
lter is designed by the manufacturer
of the end-use equipment and usually
undergoes several changes before a
lter circuit that reduces emissions
down to an acceptable level is found.
In some instances, neither approach
works so the designer must go back to
see if the conducted emissions can be
reduced internally.
Among the various economic sec-
tors, the healthcare industry ranks
rst in the use of sensitive electronic
equipment. To meet the needs of this
expanding industry, there are over
12,000 medical equipment manufac-
turers in the United States. Almost all
of the medical equipment produced by
these manufacturers relies upon power
electronic components and systems to
function. Te healthcare industry is
growing exponentially, and the market
share of overall healthcare spending
going to the major power electronics
systems manufacturers is keeping pace
as new medical equipment and ap-
plications are constantly being intro-
duced. Tis growth also contributes to
increasing numbers of EMI incidents
involving healthcare equipment. Many
of these medical devices will need a
new type of solution to resolve emis-
sions problems.
SWITCHING POWER IN THE
HEALTHCARE INDUSTRY
Power electronics in the healthcare
industry depends heavily upon the
switch mode power supply (SMPS)
industry. Today, SMPSs are used in
almost every piece of electronic equip-
ment including electronic medical
equipment. Te future of the SMPS
industry looks bright with the market
trend following the consumer and
business markets. Manufacturers of
SMPSs expect the market to grow, and
some of these SMPSs will be used in
electronic medical equipment.
Te SMPS industry can be divided
into ve categories, all of which are
used in electronic medical equipment,
and all of which require some level of
EMI ltering. Te AC-to-DC SMPS
market can be divided according to
input power level. Specifically, the
market is divided into:
Low-range (1 to 300 watts) power
Medical Equipment Categories Likely to Use One SMPS
Alone
Likely to Use One SMPS
and One or More Power
Electronics Systems
Likely to Use Two SMPSs
Alone
Likely to Use Two or More
SMPSs and One or More
Power Electronic System
Patient Monitoring Equipment X
Diagnostic Equipment X
Medical Imaging Equipment X
X-Ray Equipment X
Surgical Equipment X
Therapeutic Equipment X
Life-Support Equipment X
Laboratory Equipment X
Table 2. Use of SMPSs and other power electronics systems in electronic medical equipment.
Figure 1. Inter-disciplinary technologies and changing lter concepts that are a part of future
power electronics.
KEEBLER /PHI PPS
139
level,
Mid-range (301 to 750 watts) power
level,
High-range (751 to 1,500 watts)
power level,
Very high-range (1,501 to 2,000
watts) power level, and
Extremely high-range (2,001 watts
and above) power level.
Each of these power categories is
found in many types of electronic
medical equipment. With increasing
power levels, larger conducted line
lters will be required since the lter
must pass line current without heating
up too much and without impacting
the characteristics of the ltering. Re-
duction of emissions through new l-
ter approaches, whether the new type
of lter is applied within the equip-
ment or at the main ground terminal
of the equipment, may reduce the size
and cost of traditional conducted line
lter approaches.
In the many types of electronic
medical equipment that rely upon
power electronics to function, there
is a combination of power electronics
components and systems. Tradition-
ally, conducted line lters, both inside
a power supplyand perhaps on the
main line power of a whole system
were the only lters for reducing emis-
Figure 2. Use of a ground noise lter combined with a conducted line lter.
Figure 3. Use of a ground noise lter ahead of a conducted line lter.
140
sions. Filtering was not commonly used between power
supplies or subsystems on grounds to reduce higher levels
of emissions from making their way to the main line where
a much larger lter would be needed to reduce the emis-
sions to an acceptable level. In some types of electronic
equipment, only a simple electronic power supply may be
Figure 4. Use of a ground noise lter on the ground of a microprocessor.
Figure 5. Circulation of ground noise within a healthcare facility. Figure 6. Use of ground noise lters inside a facility grounding system.
KEEBLER /PHI PPS
141
used while others may use a variety of simple and complex
components and systems. In the latter case, some isolation
between the power supply and adjacent systems may still
be needed to control emissions levels. In the healthcare
industry, many types of electronic medical equipment
in use today contain a combination of SMPSs and power
electronics systems, depending upon the application
and size of the medical equipment. Te combined use of
SMPSs within equipment increases line emissions and the
level of emissions that end up on ground circuits. Within
electronic medical equipment that employs SMPSs, one
may nd
One SMPS alone,
One SMPS and one or more power electronic sys-
tems,
Two SMPSs alone, or
Two or more SMPSs and one or more power electronic
systems.
Table 2 summarizes the use of SMPSs and power
electronic systems in electronic medical equipment cat-
egories.
In Table 2, note that the variety of electronic medical
equipment in use today relies upon both one or more SMPSs
and one or more non-SMPS power electronics system. Te
use of non-SMPS power electronics systems has grown
in the past twenty years. In the late 1970s, many types of
electronic medical equipment relied on one centralized
power supply, a linear power supply, to distribute the con-
verted and regulated voltage and current throughout the
equipment to one or more application-specic loads. Te
problem with that ltering approach is that there is only
so much space available for line lters. Having a line lter
in each power supply makes the power supply larger. Ten,
having one on the main line in the whole system makes
the whole system package even larger in turn.
Although the use of SMPSs has grown, advancements
in power electronics have also allowed medical equipment
designers to apply modular SMPSs and to regulate power in
part of the medical equipment with power electronic sys-
tems such as linear voltage regulators, which are distinct
from the SMPS. Equipment designers have been pressing
for SMPSs in smaller packages. Smaller EMI lters that
can eectively reduce emission levels before they reach the
main line will allow the main line lter to be reduced in size
as well. Modular SMPSs allow designers more exibility in
the design of medical equipment. Modular SMPSs may be
replaced with higher power versions during an equipment
redesign or upgrade process without the need to redesign
the electrical and mechanical systems used to support the
SMPS and the equipment.
USE OF GROUND NOISE FILTERS TO REDUCE
CONDUCTED EMISSIONS LEVELS
Figure 2 illustrates the use of a ground noise lter with a
conducted line lter. In this approach, ground noise in-
jected into the ground by the conducted line lter will be
reduced before it is re-injected into the facility building
Military Medical
Medical Industrial
EMI FILTERS Single-Phase Filters Three-Phase
filters Power Entry Modules IEC Inlet Filters
Tri-Mag, Inc. can build standard and custom
design EMI filters for any industry:
MEDICAL, MILITARY & INDUSTRIAL
In addition to
our wide range
of standard
products and
our capabilities
of building custom
products to fit any
application, all of Tri-
Mag, Inc. Filters are
built in the USA.

ROHS Compliance
1601 N. Clancy Ct. Visalia, CA 93291 Phone: (559) 651-2222 Fax: (559) 651-0188
www.tri-mag.com sales@tri-mag.com
5040 S. County Rd., Tipp City, Ohio 45371 Phone: (937) 667-8484 Fax: (937) 667-5133
www.captorcorp.com 2007 Captor Corporation
Need an EMI Filter?
Quality. Expertise. Solutions.
Do you need help meeting your EMI/EMC requirements? Did you just fail your
EMI test? Is physical size a limitation?
ITS TIME TO GET WHAT YOU NEED.
Custom lters in any shape/size/conguration
Any voltage/frequency/current/power
Prototypes through production
For over 40 years, Captors superior engineering and design has meant quality,
economy, and outstanding service. Call now for more details.
Visit Us Online!
www.captorcorp.com
142
ground system, thus reducing the noise in the facility as
well. Also, in some cases the use of a ground noise lter in
this conguration will reduce the emissions on the line at
the input of the conducted line lter and could result in a
size reduction for the line lter.
In Figure 3, the ground noise lter is placed between the
ground of the whole system and the ground of the line lter.
Tis arrangement, in turn, may reduce the emissions on
the input to the line lter and the emissions injected into
the line ground. Both approaches shown in Figures 2 and
3 may also reduce the amount of leakage current generated
See whats in the new EMI Filters channel today.
information in the way you need it. If EMI Filters is a
key part of your work, you can now find all the infor-
mation you need in one place. You will discover
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
Antennas
EMI Connectors
EMI Ferrites
EMI Shielding
EMI Filters
sponsored by:
by the medical equipmenta type of current that is often
di cult to control since additional ltering inside the line
lter can cause increases in leakage current.
Figure 4 illustrates the use of a ground noise lter on
the ground of a microprocessor inside a piece of electronic
medical equipment. Placing this lter at this spot separates
the ground noise generated by the microprocessor from
the rest of the circuit and vice versa. Tis option eectively
breaks the high-frequency ground loops in the circuit.
CIRCULATION OF GROUND NOISE INSIDE A
HEALTHCARE FACILITY
Ground noi se i nside healthcare
facilities often plague the opera-
tion of sensitive electronic medical
equipment that produce images such
as ultrasound, magnetic resonance
imaging (MRI), and computer to-
mography (CT) scanners. It is not
uncommon for field engineers to
spend many hours chasing down a
ground and/or ground noise problem
in eorts to improve image quality.
In some cases, subsystem equipment
is changed out without knowing for
certain whether or not the ground
noise plays a role in improving im-
age quality. Te use of ground noise
fi lters to improve image quality
is by far more cost-effective than
swapping out expensive imaging
components. Additionally, the use
of a ground noise lter on the main
ground of an imaging system will
reduce the noise generated by the
imaging system that is re-injected
back into the faci lity grounding
system.
Figure 5 illustrates how ground
noise may circulate within a health-
care facility. Ground noise will enter
a facility and will travel through the
facility grounding system. Ground
noise will also be generated by every
piece of equipment within the facility
and will combine at facility ground-
ing points where the noise level can
become quite high. Ground noise
may also circulate between electri-
cal panels, between equipment, and
between panels and equipment and
may eventually cause EMI problems
within equipment. Te use of one or
more ground noise lters in the facil-
ity grounding system may very well
reduce EMI problems as illustrated
in Figure 6.
KEEBLER /PHI PPS
143
CONCLUSION
With advances in the technology of medial equipment and
the expansion of healthcare facilities, new approaches to
reducing conducted emissions levels will be needed. Many
facilities must deal with serious ground noise problems. Te
strategic location of one or more ground noise lters will
lower the ground noise inside a facility and will eliminate
any ground noise loops as well. Tis strategic lter deploy-
ment will reduce the chances of an EMI problem occurring
and/or will maximize the chances for solving an existing
EMI problem. Te reduction in size of a conducted line lter
can save equipment space, reduce weight, and lower costs.
Tere are various locations within a circuit design where a
ground noise lter can be located, and many experiments
and investigations are currently underway. Tey hold the
promise of even more eective diagnostic and patient care
options within the worlds healthcare facilities.
Philip F. Keebler has conducted System Compatibility Research on
personal computers, lighting, medical equipment, and Internet data
center equipment. Te lighting tasks were associated with characterizing
electronic uorescent and magnetic HID ballasts, electronic uorescent
and HID ballast interference, electronic uorescent and HID ballasts
failures, electronic uorescent and HID lamp failures. He has drafted
test protocols and performance criteria for SCRP tasks relating to PQ
and EMC. Mr. Keebler also manages the Electromagnetic Compatibility
(EMC) Group at EPRI where EMC site surveys are conducted, end-use
devices are tested for EMC, EMC audits are conducted, and solutions
to electromagnetic interference (EMI) problems are identied. He has
completed his service as editor developing a new EMC standard for
Kermit O. Phipps is a NARTE Certied EMC engineer and conducts
tests and evaluations of equipment performance in accordance with
standards of ANSI/IEEE, IEC, U.S. Military, and UL, as well as with
the EPRI System Compatibility Test Protocols for EPRI. He served in the
U.S. Air Force as a manual electronic warfare and component specialist,
resolving hardware and software problems. He conducts research on surge
protection, power-line lters, shielding eectiveness, and electromagnetic
interference. Mr. Phipps is the author and co-author of test plans, proto-
cols, and research papers presented at international power quality and
EMC conferences. He has conducted a number of power quality and EMC
training sessions and eld investigations. Most recently, he has completed
his voluntary work as chairman in developing a new EMC standard for
2400 South 43rd Street Milwaukee, WI 53219
414.649.4200 800-657-0853
www.curtisind.com sales@curtisind.com
100% Safety and Performance Tested
Industry Leading Performance
Highest Quality Available
Engineering Support
On-Time Delivery
MORE ON OUR WEBSITE
The effective use of lters and connectors may be
particularly critical in medical equipment. In fact,
designing for EMC and the effective choice and placement
of lters and connectors is vital throughout industry
in telecom, food processing, automotive engineering,
and every application where reliable performance
is a must. Look for the latest in New Products on
InterferenceTechnology.com, and check the special issues
of the eNews focused on lters and connectors.
144
CAPACI TOR TERMI NATI ON ferrites, flters & connectors
MATTHEW ELLIS
Syfer Technology Limited
Norwich, Norfolk, UK
F
or safety cri tical applications
such as aerospace and military, failure
caused by a short circuited capacitor
could be disastrous. One of the most reliable
components for surface mount communica-
tions is the multilayer ceramic capacitor, in
which a block of ceramic dielectric is embed-
ded with layers of metal. Te electrode layers
are connected into a parallel plate structure
via caps of metallization and terminations
that are applied to opposite ends of the block
(Figure 1). Still, even multilayer ceramic
capacitors can fail if a fracture occurs be-
cause of PCB bending. Tese devices can
also be aected by exing or stress caused
by temperature cycling, a circumstance that
can make them vulnerable to cracking. Such
cracks may not manifest themselves imme-
diately, and even electrical testing can fail to
detect the cracks, thus causing the potential
for disaster.
Fortunately, greater degrees of board
bending without incurring capacitor damage
are now possible by adding polymer termi-
nation to the capacitors. Ordinarily, when
a circuit board is deected, it will take on
the form of an arc. Te outer surface of the
board stretches and elongates the distance
between the solder lands on which the chip
is mounted. Tis situation stresses the chip
as shown in Figure 2, the solder joint will be
deformed, and the chip may well crack.
Figure 3 shows a characteristic crack
resulting from PCB bending. Te crack is
contained within the terminated area of
the chip, running from the lower edge of
the termination toward the main face. An
electrical short circuit results when the crack
enters the electrode overlap. Te fault may
not be detected until some time after the
fracture occurs (Figure 4). A decline in the
Capacitor termination can
enhance reliability
Using a polymer termination for multilayer capacitors forestalls damage
during PCB assembly.

Figure 1. Multilayer chip capacitor structure. Figure 3. Typical mechanical crack.
Figure 2. Board bending may bread chip capacitors.
Your Source...
for a Spectrum of
custom application-specific
EMI filter solutions
Signal & Power Integrity
Get started with a
FREE diagnostic EMC test @
specemc.com/test
You cant afford to have EMI degrade the performance of your
system. And you know a 100% off-the-shelf EMI filter or
filtered connector is unlikely to satisfy the mechanical,
electrical and/or power requirements of your sophisticated
OEM design. Where can you turn for an optimized and
economical solutionSpectrum Control.
Whether we modify one of our thousands of
existing designs or start with a clean sheet
approach, our engineering team will push
the envelope of filter performance. We can
help you address both conducted and
radiated EMI through our integrated
approach to EMC problem solving
that includes in-house testing and
a cooperative design process.
See how easy it is to find a
custom application specific
EMI filter solution, call
888.267.1195 or visit
specemc.com
Low Pass
EMI Filters
Coaxial resin &
hermetically sealed filters
Surface mount filters
Microwave discrete filters
Motor-line feed thru filters (MLFT)
Filtered Arrays
& Connectors
D-sub & combo filtered connectors
Custom circular connectors
USB filtered & ESD
protected connectors
Easy Mate
& bolt-in filter plates

Filtered terminal blocks
Power Filters
High current feed thru filters
Power entry modules
Power line filters
Military/aerospace multisection filters
Custom commercial assemblies
Patch Antennas
& Assemblies
Patch antenna elements & assemblies
Satellite & terrestrial based apps
Small footprint & low profile designs
Hardened designs for military apps
Value Added Assemblies
Modify terminations
Add cables, connectors or wire harnesses
Gaskets & shielding
Customizing to simplify integration
Spectrum Control.indd 1 3/18/2008 2:11:43 PM
146
chips insulation resistance (IR) may be delayed until the
structure is penetrated by a conductive medium such as
atmospheric moisture.
TRACKING DOWN THE PROBLEM
On individual boards, the electrical problem may be tran-
sient. As the result of thermal treatment, often applied
inadvertently, the board may function for a time, only to fail
again later. Although the problem may seem to be isolated
to a single capacitor, more sophisticated analysis may reveal
that other capacitors have also cracked but have yet to aect
board operation.
Measures can be taken to reduce damage. For example,
most fractures occur during de-panelization so this sepa-
ration of daughterboards and motherboards should be
attempted only with purpose-built jigs and never by hand.
Te possibility of damage from transient incidentsi.e., un-
controlled problemsshould be recognized as well. Simply
changing the source of the capacitors will not pinpoint and
rectify the true cause. What had been considered a one-o
occurrence will inevitably happen again.
Tere are generally three dielectric categories of ca-
Figure 4. Electrical short circuit as a result of mechanical fracture. Figure 5. Bend test.
EMC Eupen
5033 Industrial Road,
Building 6,
Farmingdale, New Jersey 07727
Phone: 732-919-1100 Fax: 732-919-7196
Available exclusively through:
website: www.emceupen.com e-mail: sales@emceupen.com
Eupen power cords contain an integral line filter
that reduces common mode and differential mode
interference. Plus, because our cords are
shielded and our cable conductors are coated
with an RF absorbing ferrite compound, Eupen cords
are extremely effective against fast transients and
conducted interference over a wide frequency range.
Let your power cord be the solution to your
problem, not the cause. Call Eupen.
ELLI S
147
pacitors available: COG (NPO), X7R, and Y5V. Sizes usually
range from 0201 (0.5 mm long x 0.25 mm wide) to 2225 (5.6
mm long x 6.4 mm wide). Analysis of eld failures shows that
no one size is more vulnerable than another. Small capaci-
tors proved no stronger than large, and thin capacitors were
no weaker than thick ones. Interestingly, COG capacitors
did not often gure in cracking incidents.
STRENGTH TESTING
A bend test can be used to evaluate chip strength. Chip ca-
pacitors are soldered to a test board, which is then inverted
over a pair of horizontal support rods (Figure 5). Te board
is deected at a given speed to a xed extent, and the eect
on the capacitor is assessed. Recently, researchers con-
ducted a structured Bend Test program to determine the
parameters that aect a chips ability to withstand bending
forces. Te most common electrical parameter is change of
capacitance value. However, capacitance change is seldom
implicated in real incidents. Instead, micro-sectioning was
adopted as the key evaluation parameter. In over 15,000 chip
capacitors that were bent and micro-sectioned, an immedi-
ate change of IR was observed in less than one percent of
parts that were subsequently determined to have cracked.
Correlating the failures determined by micro-section with
those suggested by capacitance measurement demonstrates
that capacitance change was a feature of only a portion of
broken parts.
EMI/RFI Filtering & EMP Protection
ESD Filter Composite Available
Monolithic Planar Capacitors
Intermateable with Non-Filtered Connectors
Field Replaceable/Removable Transient Protection Devices
Standard Catalog Surge Protection
JANTX or High Reliability Commercial Grade TAZ Devices
RoHS Compliant Solderless Filtering Available
Filter Adapters Available for bolt on EMI solution
FILTERED INTERCONNECT SOLUTIONS
Call (949) 250-1244
customerservice@sabritec.com
EMI/EMP ESD CONNECTORS
www.sabritec.com
Innovative, World-Class
Ceramic Components
Sales agents throughout the world - for details check our web site.
CAPACITORS and EMI FILTERS
L The original capacitors
L High voltage MLCCs
L SMD and panel mount EMI lters
L X2Y Integrated Passive Components
L Planar capacitor arrays and discoidal capacitors
Syfer is continually developing new products
and technologies for a rapidly changing
market. Our manufacturing and quality
systems are reected in our international
approvals, class-leading products and global
customer base.
148
Figure 6. Chip geometry inuences mechanical fracture.
Te only signicant dierence in strength across a broad
matrix of capacitor design and build parameters can be
found between barium titanate-based (the key material used
in the X7R and Y5V dielectric categories) and neodymium
oxide based components (the base material of the COG
[NPO] category). COG capacitors fail at bend deections
approximately double those at which similar X7R and Y5V
parts fail. Circuit board solder pattern is also relevant. Land
widths narrower than the chip width were found to increase
board strength signicantly. See Figure 6.
Similarly, the edge of the termination band relative to the
edge of the solder pad is a factor. If the capacitor termina-
tion edges are positioned inboard of the solder lands, the
assembly with withstand greater deection without damage.
Te use of soft solder 50Sn and 50Pb, more than doubled the
average deection at failure, as compared to more commonly
used 62Sn/36Pb /2Ag solders. Te inuence of the type of sol-
der used poses a cautionary note for those anxious to switch
to alternative solders to comply with the RoHS directive.
Some equipment, for example safety-critical products
for the military, space, and aerospace sectors, is currently
exempt from the RoHS Directive. Experts in these indus-
tries are concerned over the risk of tin whiskers forming
on electronic components and breaking o to cause a short
circuit. Using a tin-lead nish and careful choice of termina-
tions can help allay this concern.
STRENGTHENING THE CHAIN
In the entire chain of materials that make up a chip
assemblyboard, land, solder joint, chip termination, and
chip ceramicthe weakest link is often the ceramic. Even
if changing properties of ceramic is not an option, other
materials can be improved to strengthen the overall chain.
For example, glass-based conductor materials usually used
for terminations can be replaced with a conductive plastic.
A silver-loaded epoxy polymer termination is exible, thus
reducing the stress between the PCB and the ceramic ca-
pacitor. It can be applied using conventional termination
techniques; but instead of being sintered at approximately
800 degrees C, it is cured at 180 degrees C.
Te polymer termination has a brous structure, and
its mechanical and electrical properties remain largely
STANDARD AND CUSTOM
EMI FILTERS AND CONTROLS
Standard off the shelf EMI Filters *NEW*
EMC Testing and custom EMI Filter Design.
EMI friendly Electronic and Motor Controls.
X &Y Capacitors (fully approved), Coils & Chokes.
CUSTOM SUBSYSTEMS AND BACKPLANES.
Manufacturing facilities in USA and CHINA
________________________
9 S. Forest Ave.,
Norristown, PA 19401
PH: 1-800-527-4362
Fax: 1-610-278-0935
sales@LCR-inc.com
www.LCR-inc.com
For: MILITARY, AEROSPACE, APPLIANCES, COMMERCIAL
TELECOMMUNICATIONS, MEDICAL & OTHERS
extreme
filters
www.oxleygroup.com
Oxley is respected across the world for
innovative products and systems that are
specified by international defence and
commercial customers, proving their worth
for reliability and quality.
With the the companys capacity to
develop customised filters for applications
where high performance is demanded,
Oxley has always been at the forefront of
advanced filter design and development.
Oxley should be the first name that
comes to mind with the ability to
withstand 2000 volts ac, as an integral
part of their specification.
UK and Europe:
Mark Johnson
t: +44 (0) 1229 840505
e: m.johnson@oxley.co.uk
USA:
Stephen North
t: +1 (203) 433 1537
e: s.north@oxleyinc.com
ELLI S
149
Figure 7. Polymer termination microstructure.
unaected by extremes of heat and chemical treatments
(Figure 7). After the polymer termination process stage,
the capacitors are plated with nickel and tin using the same
methods employed for industry-standard sintered silver-
terminated capacitors, so soldering characteristics remain
unchanged.
Te electrical parameters of a polymer-terminated chip
are indistinguishable from a conventional part. Reliability
testing conrms that the polymer has no negative eect
on electrical or environmental performances. Actually, a
polymer-terminated X7R or Y5V capacitor will aord a
bend test deection at failure, which is almost double that
of the same capacitor with a conventional termination. Tis
From design, quick-turn protos, and worldwide
ISO9001 manufacturing, we are the superlative
EMI solutions provider. The cornerstones of our mission are
simple: Quality. Integrity. Service. Value. It is this commitment to
total solutions without compromise that has led to our established
position as a premier designer, manufacturer & distributor of EMI
lters and magnetic products.
Plug into our comprehensive solutions. Radius Power
is a leader in the design & manufacture of power products used
to condition, regulate and govern electronic performance. The
company provides a broad line of EMI Filters, Power Entry Modules,
Power Transformers & Inductors to meet front-end requirements for
AC & DC power line applications. We offer free pre-compliance testing for conducted emissions at our labs or yours!
Bring us your EMI challenge & we will provide an optimized solution usually within 48 hours. Call Radius today.
Comprehensive EMI Solutions, On Time & On Budget
714-289-0055 PH 714-289-2149 FAX 1751 N. BATAVIA ST. ORANGE, CA 92865
www.radiuspower.com
performance places them in the same category with COG
capacitors amongst which real life failures are almost
unknown.
CONCLUSION
Millions of polymer-terminated X7R capacitors were
evaluated in applications known to be subject to problems
caused by capacitor cracking. During the trials no parts were
identied to have failed as a result of chip fracture. In fact,
polymer termination can be used with other products such
as surface-mount pi-lters, EMI chips, X2Y lters, and class
X and Y surge and safety capacitors. All are RoHS compliant
and compatible with lead-free soldering processes.
Matthew Ellis is an applications engineer at Syfer Technology Ltd. in
Arminghall, Norwich UK. He received his BSEE degree with honors from
the University of Leeds in Yorkshire. His current work focuses on multilayer
ceramic capacitors and high voltage applications. He can be reached at
mellis@syfer.com.
MORE ON OUR WEBSITE
Advances in lter and capacitor technology are part
of an ongoing and exciting process. Visit the new
InterferenceTechnology.com, and check out the New
Products Listings. And be sure to look for special editions
of the eNews focused on Filters.
150
POWER LI NE FI LTERS ferrites, flters & connectors
HERBERT BLUM
Schurter, Inc.
Santa Rosa, CA
ANTHONY A. ANTHONY
X2Y Attenuators, LLC
Erie, PA
T
odays rapidly evolving electron-
ics market will demand power line
lters that deliver ever more e cient
performance. Products that are being in-
troduced into numerous markets must
comply with new and ever more stringent
regulatory requirements for electromagnetic
compatibility (EMC). The new standards
require products that must operate across a
broadened frequency range (multiple GHz)
without radiating unwanted noise into the
ambient environment. Additionally, these
products must be immune to transients and
interference produced by other equipment
in the vicinity.
Tere are several basic EMC requirements
that systems using power line lters must
meet. A particularly vexing problem is that
independent testing of the power line lters
does not correlate well with the system tests
of the end product because of dierent load
impedances and frequency ranges. Unfortu-
nately, test methods for power line lters have
not kept pace with requirements for systems
compliance, and updated test methods have
been needed for sometime. Te following
table (Table 1) lists major certifying agen-
cies and their corresponding frequency test
ranges.
Conducted and radiated noise must be
contained dierentially L-L (line-to-line) to
30 MHz and common mode L-G (line-to-
ground) to 1.0 GHz. When rst tested in the
system, most of the o-the-shelf type power
line lters available today do not meet the
regulations across the broad frequency ranges
listed above, rendering them ineective for
use as broadband high frequency power line
lters. Te conguration of a typical lter
circuit that consists of ve components
including two Y caps, one X cap and two
inductors (in line common mode chokes)
does not behave ideally across the broad
spectrum of load impedances and frequency
ranges. Faults in design and construction can
render the lters ineective especially under
load. Specically, parasitic impedances of the
Power line f lters:
Whats wrong and how we can f x em
Test methods for power line f lters have not kept pace with requirements
for system components.

Table 1. Worldwide regulatory agencies and frequency ranges for equipment compliance where a power
line lter is likely to be used.
Aie you missing
youi Shieluing Effectiveness taiget
in on

fiom Zero Cround

Free Sample

Email us at
servicezerogroundcom
Thiee
giaues
of

Shielueu

Flexible

Conuuit

BBS Bronze Core witb Braid Sbield
IBC Bronze Core
SBS Steel Core witb Braid Sbield
To learn more visit us at
www zeroground com
or call us at
Zero Cround
D, D, D, D, ',
A
1 I
8SnILLD S L
^
/
^^
h
&
^
Zero Ground.indd 1 3/26/2008 2:05:04 PM

152
components cause capacitors to become
inductive and inductors to become
capacitive at the higher frequencies. At
some frequencies, noise is not attenu-
ated, or it bypasses the ground shields
altogether. At this point, additional
onboard protection or replacement of
the ineective power line lter becomes
necessary if the end product is to be
certied or agency approved.
Figure 1 shows the typical char-
acteristics of an existing power line
lter design, measured over the limited
frequency range specied by CISPR 17.
Te performance begins to degrade after
approximately 20 MHz and continues to
drop o as the frequency increases.
In addition to the high frequency roll
o, the lter peaks and resonates at criti-
cal points, and the system usually fails
to comply with agency requirements
when it is initially evaluated or tested
with load impedances other than 50 .
System test failure is a major reason for
escalating development time and costs
and has become a major concern for
equipment manufactures.
Figure 2 depicts an existing indus-
trial power line lter with two stages
of common-mode chokes, one stage of
dierential-mode choke, and four X &
Y type capacitors (seven components
altogether). Yet again, performance at
the higher frequencies is insu cient.
Te lter employed in the measured
application below shows degradation
above 35 MHz.
To their chagrin, equipment design-
ers are nding that it is less likely than
ever for their equipment to pass the
new EMC rules with the rst in-house
submission. Tese engineers may not as
yet comprehend the implications of the
extended frequency ranges that have
been implemented with the new EU
regulations. Previously, it has been rela-
tively easy to meet Class A requirements
because an additional 10 dB of loss was
allowed over the Class B specications.
However, many systems inevitably failed
the more stringent Class B require-
ments. With more electronic devices
being utilized in the home (cell phones,
vacuum cleaners, refrigerators, etc.) that
are operating at ever increasing frequen-
cies, the manufacturers of communica-
tion and other electronic equipment are
now faced with meeting both FCC Class
A and Class B to 1.0 GHz.
Design engineers generally focus
primarily on suppressing interference on
the signal lines, but often overlook the
role of power lines in generating noise.
If new products do not lter internally
generated noise adequately, it escapes
from the enclosure and onto the power
cord or into another section of the prod-
uct under test. Tis unwanted power
cord noise is then transmitted from the
cord (the antenna) externally into the
environment. Consequently, the equip-
ment fails the test as well as compliance
with agency requirements. Redesign of
the product will be required, typically by
trial and error, an inexact and ine cient
process that obviously increases costs
and stalls time to market.
An even bigger challenge is to de-
termine what types of solutions are
available and which is most suitable for
susceptibility protection and emissions
control in a specic application. Various
options include:
Building more L-C stages into the
existing power line lter
Improving the ltering within the
power supply
Adding clamp ferrites on the power
cord
Figure 1. Typical performance of a standard ve-element power line lter measured in
accordance with CISPR 17.
Figure 2. Typical performance of an industrial seven-element power line lter measured in a
50- system.
See whats in the new EMI Connectors channel today.
information in the way you need it. If EMI Connectors
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
Antennas
EMI Ferrites
EMI Filters
EMI Shielding
EMIConnectors
I
m
a
g
e
s

C
o
u
r
t
e
s
y

o
f

Q
u
e
l
l
House Connectors.indd 1 5/5/2008 11:58:16 AM
154
Adding shielding materials inside the
equipment
Inserting additional components
strategically:
On the power cord (either system
or chassis side)
Inside the plug
On the board
On the power supply, either on the
DC or the AC side
Needless to say, all of the above so-
lutions require additional components
that will add cost, necessitate redesign,
and delay market introduction. Exten-
sive redesign may be required if space
has already been optimized and there is
no room available for additional compo-
nents or a larger power line lter. An op-
timal solution would be a cost-eective,
space-saving replacement of the power
line lter that eliminates the need for the
alternative xes mentioned above.
One solution would be a power line
lter that provides 3040 dB of ltering
out to 8.5 GHz and includes components
based on the latest attenuation technol-
ogy. Additionally, it should be built in
accordance with UL and IEC standards
and should be approved by UL at 15 A
250 VAC and by VDE at 10 A 250 VAC.
Such attenuation components are
currently being utilized by the automo-
tive industry to lter DC motors. Within
the broad electronics industry, designers
of integrated circuit applications also
use such devices as decoupling com-
ponents to replace ve of the current
technology components. A power line
lter, incorporating an IEC 60320 inlet,
ange mounting, and industry standard
packaging would provide. a drop-in re-
placement for existing power line lters
in systems in need of improvements
in their high frequency performance
(Figure 4). Such a device would not
need to be changed when the current
requirements of the system change,
since there are no series inductors within
the product. Consequently, the filter
characteristics would not change with
dierent line currents.
Te following photographs (Figures 4
and 5) represent two views of an appli-
cation employing two dierent ltering
approaches. Te rst picture shows a
ferrite clamp added to the input power
cord. A power line lter and a ferrite
ring are shown inside the enclosure.
Te second picture shows the same ap-
plication using only a drop-in lter line
power replacement.
Te following chart (Figure 6) com-
pares three dierent power line lter
products measured in accordance with
CISPR 17 guidelines:
Typical power line lter using ve
components, one X cap, two Y caps
and two coils;
A pure capacitive lter being com-
prised of two Y caps;
Te drop-in lter line replacement
described above series with propri-
etary capacitive lter components.
Te chart shows a reduction of the
attenuation eectiveness of the typical
power line lter and the lter relying
solely on capacitors once the frequency
exceeds 50 MHz. Te third device con-
tinues to provide protection beyond the
limited frequency range of the CISPR
test. In the future, the industry will need
a dierent method of testing to extend
the frequency range to 1.0 GHz.
Figure 8 displays attenuation perfor-
mance data out to 8.5 GHz. Te testing
method utilized here is dierent from
the CISPR 17 dened test that has been
used for years. For convenience, this
new test method will be referred to as
the alternate method. Note that S
parameters are used to dene the three
dierent lters that are represented in
Figure 6, the resultant curves, and the
manner in which the individual tests are
performed. Tis test is a better indicator
Figure 3. A drop-in power line lter
replacement.
Figure 4. Standard power line lter with ferrites
(extra system cost).
Figure 5. Device retted with drop-in
replacement lter.
Figure 6. Comparison attenuation loss performance of three different power line lters
measured in accordance with CISPR 17.
Arcotronics CDOT.indd 1 3/20/2008 12:26:29 PM
156
of the lters performance in real life
applications because it is conducted
without baluns or other impedance-
stabilizing devices over an expanded
frequency range.
Te alternate test method uses a four-
port network analyzer to measure a dual
line lter for insertion loss on both lines
and coupling of noise from one side of
the lter to the other side. (Refer to cir-
cuit diagram in Figure 8 and test xture
in Figure 9 for port orientation).
Figure 7. Comparison log magnitude performance of three different power line lters measured
in accordance with the alternate test method.
Beautiful
But more than just a pretty face.
Schaffner EMC Inc. 52 Mayeld Avenue Edison, New Jersey 08837
T +1 732 225 9533 Toll free 1 800 367 5566 F +1 732 225 4789 www.schaffnerusa.com
The brand new three-phase EMC lters from Schaffner
combine state-of-the-art lter technology and functional
design. The choice is offered between traditional
chassis-mount versions (FN 3025) and our contemporary
DIN-rail mounting technique (FN 3026). Both ranges
convince with:
O Highly compact and light weight plastic lter design
O Revolutionary embedded terminals for fast and easy
connection
O Captive transparent covers for extra safety
O Exceptionally low leakage current (0.4mA and 2.5mA
versions)
O Filter modules from 10 to 50A for up to 3x 520VAC
Figure 8. Alternate test method circuit
diagram.
Figure 9. Test xture for alternate test method.
BLUM/ANTHONY
157
MORE ON OUR WEBSITE
When the network analyzer measures insertion loss, it will
send a signal from port 2 and will measure it at port 1 (S12), a
procedure that is called a throughput measurement. Te loss
is plotted after the lter element. Tis process is repeated for
all four throughput measurements: S12, S21, S34, and S43. Te
next set of measurements targets coupling of noise across the
lter. Te network analyzer sends a signal in one side of the
dual line lter port 4 and then measures the noise coupled to
the other side port 1, S14. Tis process is repeated for all four
paths of coupled noises: S14, S41, S32, and S23.
Figures 6 and 7 show test measurements for the same
products that were tested using two dierent methods or test
setups. Te data clearly indicate that the drop-in lter line de-
vice outperforms the other products tested in high frequency
ranges of >50 MHz. When tested with the alternate method
in the low to intermediate frequency range, this devices line-
to-line performance is indicative of a twisted pair, where the
noise coupling is canceled. Te alternate test method provides
comparative testing of power line lters over a broad frequency
range (eliminating the use of baluns). Te alternate method
also allows measurements of phase dierences. Comparing
the two test methods demonstrates that emissions testing at
the component or power line lter level and the systems level
must evolve in tandem if proper component selection in the
early stages of the system design are to improve.
While the data presented above show that the drop-in re-
placement power line lter clearly outperforms the other prod-
ucts tested for insertion loss in the broadband high frequency
ranges, these tests cannot guarantee or absolutely predict per-
formance in the end product or system. Optimal functioning,
EMC compliance, and market acceptance are the ultimate goals
of product design and testing. System emissions testing must
always be conducted to validate performance.
Herbert Blum is a member of the Schurter engineering team, based in
Luzern, Switzerland. He has been with the Schurter Company for ten years
and currently heads the development of power entry modules with lters.
His experience includes a long history in high frequency technology with
a background in radio control hardware design. He holds an equivalent
BSEE. Mr. Blum can be reached herbert.blum@schurter.ch or through
www.schurterinc.com.
Tony Anthony is the founder of X2Y Attenuators, LLC (www.x2y.co) and
principal inventor on over 200 issued Patents and Patents Pending relating
to X2Y Technology. Tony has over thirty-eight years of Senior Marketing and
Engineering experience in the electronics industry with Erie Technological
Products, Murata Manufacturing, and Spectrum Control. Tony has a BSEE
from the United States Naval Academy, Annapolis, MD. He can be reached
at tony@x2y.com.
www.schurterinc.com/new_emc
5150
frst of its kind fltered AC inlet performs at high
frequencies up to 1 GHz and beyond, using
X2Y technology
fnally, a simple
solution for
applications
compact modular package provides:
- double shielding to ensure performance
- ease of mounting and assembly
- standard, medical and industrial flter versions
- eco friendly design (no potting in flter casing)
- approved 10 / 15 A at 250 VAC according to ENEC & cURus
Filters and connectors have long been reliable standbys
in the quest for EMC. Still, the market offers not only the
products you rely on now, but updated and improved
versions. Go to the new InterferenceTechnology.com, and
check out Products and Services and New Products.
158
lightning, transients & esd ROBUST ESD PROTECTI ON
JOE SALVADOR
California Micro Devices
Milpitas, CA
T
he ESD protection landscape
has changed dramatically because
of three signicant trends: the adop-
tion of smaller manufacturing geometries,
a reduction in on-chip protection, and the
ever-changing application environment. As
the manufacturing geometries for todays
most advanced ASICs have decreased to 90
nm or less, the voltage or current levels that
can cause ESD-related failures has decreased
as well. Simply put, these ever smaller devices
are subject to damage by smaller levels of
voltage or current.
Specically, as IC manufacturers move to
these smaller geometries such as USB 2.0,
they continue to scale back the dimensions
of the transistors, interconnects, and the
silicon layers in their devices. Smaller silicon
structures and the increasing adoption of
high speed data interfaces add even more to
the complexity of maintaining high signal
integrity while ensuring robust ESD protec-
tion. Typically, such protection has meant
higher levels of capacitance, forcing designers
into a trade-o between ESD protection and
desirable signal integrity.
Also, a reduction in on-chip ESD protec-
tion is a factor in increased ESD damagea
dilemma that has been widely publicized by
the Industry Council on ESD Target Speci-
cations. Tis group recently announced a
move to reduce the standard level of on-chip
ESD protection, thus making external ESD
protection circuits even more critical for
adequate system reliability. Finally, the third
trend complicating eective ESD protection is
the proliferation of laptops, cell phones, MP3
players, digital cameras, and other handheld
mobile devices used in uncontrolled environ-
mentsi.e., without wrist-grounding straps
or conductive and grounded table surfaces. In
such environments, people touch I/O connec-
tor pins while connecting or disconnecting
cables. A portable device can also build up a
charge during normal use and can discharge
that energy when connected to another de-
vice such as a computer or television.
CHOOSING THE BEST ESD
PROTECTION
Determining which ESD device provides the
greatest protection is not an easy task. Several
types of ESD protection devices are available
today, but the most common can be divided
into three categories:
Polymer Devices seem attractive for
high-frequency applications because of their
sub-picofarad capacitance of 0.051.0 pF, but
this low capacitance comes with some not-
so-attractive side eects. A polymer device
does not break down until it reaches a trigger
voltage that is much higher than the clamp-
ing voltage. Te high trigger voltages and
clamping voltages of polymers make them
unreliable for ESD protection. In addition,
after the charge is dissipated, the polymer
is supposed to return to its high-impedance
state, but this can take from several hours to
a day, a time frame that makes them unat-
tractive for consumer applications that need
to be operational immediately after a cable
is plugged in. Finally, polymers degrade with
useanother characteristic that makes them
unacceptable in consumer applications.
Robust ESD protection and signal integrity
for the next generation of
electronic devices
New architecture represents a fundamental change in the approach to
forestalling ESD damage.


DNB 01.indd 1 2/25/2008 2:14:32 PM
160
Varistors and Suppressors are
relatively inexpensive, but suppressors
typically suer from high trigger volt-
ages, high clamping voltages, and high
resistance, characteristics that result in
most of the energy reaching the pro-
tected device instead of being shunted
to ground. Another disadvantage of
suppressors is that they degrade with
use. Changes in electrical properties
have been observed after a single ESD
strike, including changes in capacitance.
Most suppressors fail after 10 to 20 ESD
strikes.
Semiconductor Diodes devices are
characterized by low clamping voltages,
low resistance, fast turn-on times, and
better reliability. Diodes have tradi-
tionally been characterized by higher
capacitance than other solutions, but
new sub-picofarad designs make them
the most attractive combination of
robust ESD protection and good signal
integrity.
Often, system vendors compare ESD
protection devices using ESD level rat-
ings provided on a datasheet. In reality,
these ratings are not an accurate reec-
tion of how well the device will protect
a system. For example, the datasheet
rating for device X may be 8 kV while
the rating for device Y is 15 kV; hence
device Y is betteror is it? ESD ratings
for protective devices indicate only what
the device itself will survive rather than
the charge that the system will survive.
In many cases, the 8-kV device may
provide more protection than the 15-kV
one. In addition to the ESD rating level
of the protective device, voltage level
(clamping voltage) and the amount of
current (residual current) impacting the
ASIC are critical considerations.
A STARTING POINT FOR
COMPARISON: CLAMPING
VOLTAGES
Contemporary industry practice is to
publish the clamping voltage based on a
pulse with an 8-s rise time and a 20-s
duration. Most datasheets document
clamping voltage using a 1-A pulse and
sometimes a higher current pulse as
well. It is crucial to note that this pulse
is not equivalent to an ESD pulse, which
has a 1-ns rise time and a 60-ns duration.
Additionally, the clamping voltage seen
during a level 4 IEC 61000-4-2 strike
with a peak current of 30 A diers mark-
edly from that seen during a 1-A pulse.
Still, because clamping voltage is often
the only information available when
looking at datasheets, it provides a good
starting point when comparing dierent
ESD protection devices.
In general, semiconductor diodes
have the lowest peak clamping volt-
ages, while suppressors and polymers
have signicantly higher ones. Using
the standard 1-A pulse described above,
most semiconductor ESD protection
diodes are rated to clamp between 8 and
15 volts. When subjected to a 8-kV IEC
61000-4-2 strike, these diodes typically
show peak clamping voltages of 50 to 100
volts, depending on other diode charac-
teristics such as dynamic resistance.
In contrast, the clamping voltage of
suppressors can be several times higher.
Innovative EMI Solutions Since 1960
SOLAR ELECTRONICS COMPANY
10866 Chandler Blvd., North Hollywood, CA 91601
(800) 952-5302 (818) 755-1700 Fax (818) 755-0078
See our catalog online at www.solar-emc.com
Contact us at sales@solar-emc.com
,)'(4.).'
42!.3)%.4
'%.%2!4/2
The Solar Model 2654-1
Lightning Generator
synthesizes electrical
impulses needed for
testing susceptibility
to transients induced in
aircraft equipment by
lightning strikes.
The peak voltage and
current requirements of
RTCA/DO-160E, Section
22 are met at Levels 1
through 3. Using available
accessory probes, pulses can
be applied by pin injection,
cable bundle injection, and
ground injection.
SALVADOR
161
lightning, transients & esd
Are you 100% certain
your assets are protected?
Choose Carefully - the right lightning protection decision shouldn't happen by default. Make the right coaxial protection
choice with a NexTek lightning expert. We'll work hand-in-hand with you to select and design-in the right product for
your wireless communications application. Our broad family of best-in-class, standard lightning protection products lets
you tame the toughest EMI challenges. Unlike some suppliers, most of our technical support is free of charge. For a free copy of
our guide to selecting the right lightning protection, call 1-978-486-0582 today or visit us
on the web at nexteklightning.com. Let NexTek be your partner in current innovation.
Typical low capacitance suppressors can
have clamping voltages that range from
150 to 500 volts. Also, with trigger
voltage requirements as high 500 volts,
the use of polymers is curtailed by their
high clamping voltage characteristics.
Te high trigger requirement slows the
turn-on time of the polymer, increas-
ing the likelihood of damage to the
protected device. In general, because of
their lower clamping voltages and faster
turn-on times, semiconductor diodes
provide better ESD protection than
either polymers or suppressors.
RESIDUAL CURRENT AND
DYNAMIC RESISTANCE
Te amount of current owing through
to the ASIC is dependent on the dynamic
resistance through the protection circuit
versus the dynamic resistance through
the ASIC and the rest of the circuit. As
resistance through the protective circuit
increases, the amount of current owing
through the protected device increases
proportionately, thus increasing the
likelihood of ESD damage to the ASIC.
Conversely, as the dynamic resistance of
the ASIC increases, the residual current
owing through the ASIC will increase.
Because residual current is system
dependent, it is not typically specied
in ESD protection datasheets. Unfortu-
nately, very few ESD protection vendors
specify the dynamic resistance of their
products, but there are techniques for
approximating both residual current and
dynamic resistance.
Most diode vendors provide graphs
of current versus voltage. Although
these graphs usually use 8/20-s pulses
rather than the IEC 61000-4-2 pulses,
they can be used as general indicators of
the resistance of the circuit. For 8/20-s
pulses, the relationship between current
and voltage is fairly linear, and the slope
of the line is the dynamic resistance
(Rdyn). Typical ESD diodes have Rdyn
that ranges from less than one ohm to
three ohms. Polymers also have very low
resistance.
On the other hand, low capacitance
suppressors for high speed I/O ports
typically have very high dynamic resis-
tance in the range of 20 ohms or more,
which results in much higher current
levels for the protected ASIC. In fact,
suppressors and varistors shunt very
little current away from the protected
ASIC. Actually most of the current does
in fact reach the ASIC. Clearly, this char-
acteristic makes them poor choices for
ESD protection.
ENSURING ESD PROTECTION
RELIABILITY
Although semiconductor diodes pro-
vide the best ESD protection among
the traditional technologies, even they
cannot protect many of the newer
ASICs manufactured using the latest
submicron geometries. Further reduc-
ing the clamping voltages and dynamic
resistance of these devices through
traditional means would mean increas-
ing the capacitancean unacceptable
option in high speed applications. A
fundamentally new approach to ESD
protection utilizes a new double-clamp
162
architecture that integrates two stages of low capacitance
diodes along with inductors and a resistor, signicantly
reducing residual current and clamping voltage to provide
eective ESD protection while maintaining signal integrity
(Figure 1).
When an ESD strike occurs, the rst stage of the archi-
tecture begins to clamp, shunting most of the current and
reducing the voltage. Te remaining current passes through
a resistor and then hits a second stage, further reducing the
voltage and minimizing the current owing through to the
ASIC.
CONCLUSION
Tis architecture can provide ESD protection in high speed
USB, high denition multimedia, and personal computer
www.okaya.com
Surge Protectors
Gas Discharge Tube (RHCA)
RHCA (4532)
Surface Mount Gas Discharge Arrester
4 models with DC breakdown from 200V~400V
Impulse discharge current (8x20)-2000Amp
Impulse life test (8x20)-100Amp (300 times)
Applications:
Antena protection,
CATV, Telecom,
Security &
Data Systems,
Sound Systems.
RHCA
RHCA
OKAYA Electric America, Inc.
Ph: 800-852-0122 Fax: 219-477-4856
RHCA(3216)
GDT & ESD Arresters
5 models with DC breakdown
from 200V ~ 500V
Electro-static Surge life
(IEC61000-4-2) -8kV
(10k times)
Impulse discharge
current (8x20)
-200Amp
Lightning Protection
Certification and
Engineering Services
Direct and Indirect
Effects Testing
Professional Training Courses
Research Projects
Over its 27 years of
aerospace lightning-
protection services,
Lightning Technologies,
Inc. has been involved
in the certification of
virtually every type of
aircraft flying today.
Lightning Technologies, Inc.
10 Downing Industrial Parkway
Pittsfield, MA 01201-3890 USA
Telephone (413)499-2135
FAX (413)499-2503
www.lightningtech.com
lti@lightningtech.com
photo 2002 peter menzel
Figure 1.
SALVADOR
163
lightning, transients & esd
designs. Signal integrity is boosted
via on-chip matching, skew and EMI
reduction, and improved TDR (time
domain reectometry) brought about
by integrated inductance. This new
architecture represents a fundamental
change in the approach to forestalling
ESD damage and addresses the demand-
ing requirements of a new generation of
high speed electronic devices.
Joe Salvador is the Marketing Director for
Digital Consumer and Computing Products at
California Micro Devices, and can be reached at
joes@cmd.com.
SUPPLIERS FERRITES, FILTERS &
CONNECTORS (continued from page 132)
Radius Power, Inc. .......................... 149
Orange, CA; 714-289-0055; www.
radiuspower.com
Sabritec ............................................147
Irvine, CA ; 949-250-1244 ; www.
sabritec.com
Schaffner EMC, Inc. ....................... 156
Edison, NJ; 800-367-5566; www.
schaffner.com/us
Schurter, Inc. .................................. 157
Santa Rosa, CA; 707-636-3000; www.
schurter.com
Spectrum Control .......................... 145
Fairview, PA; 814-474-2207; www.
spectrumcontrol.com
Syfer Technology Limited ..............147
Norwich, UNITED KINGDOM; +44
1603 723310; www.syfer.com
Tri-Mag, Inc. .....................................141
Visalia, CA; 559-651-2222; www.tri-
mag.com
WEMS Electronics ......................... 137
Hawthorne, CA; 310-644-0251; www.
wems.com
Zero Ground LLC .............................151
Woodridge, IL ; 866-937-6463; www.
zero-ground.com
SUPPLIERS LIGHTNING &
TRANSIENTS
CITEL Inc.......................................... 163
Miami, FL; 305-621-0022;
www.citelprotection.com
DNB Engineering, Inc. ................... 159
Fullerton, CA; 714-870-7781;
www.dnbenginc.com
Lightning Technologies, Inc. ........ 162
Pittseld, MA; 413-499-2135;
www.lightningtech.com
NexTek, Inc. ..................................... 161
Westford, MA; 978-486-0582;
www.nexteklightning.com
Okaya Electric America, Inc. ......... 162
Valparaiso, IN; 800-852-0122;
www.okaya.com
Solar Electronics Co. ..................... 160
North Hollywood, CA; 800-952-5302,
818 755-1700; www.solar-emc.com
MORE ON OUR WEBSITE
Electrostatic discharge can play
havoc with the function of sensitive
electronics. Learn more about the
techniques for eliminating this peril.
A wide range of anti-static products
can be found in the Products
and Services section of the new
InterferenceTechnology.com. Just
look under Directories.
164
shielded rooms DESI GNI NG AN RF SHI ELDED ENCLOSURE
RON BREWER
EMC/ESD Consultant
Cocoa, FL
S
hielding has been with us a long
long time. Early AM radios had
shielded RF and IF transformers,
shielded electron tubes, and compartmen-
talized shielded chassis. Tese shields were
necessary to prevent RF pickup, feedback,
and oscillation by the electron tubes, radia-
tion from the local oscillator, RF contami-
nation of the IF strip, and crosstalk within
circuit wiring. By the mid-1940s, there were
a number of military RFI specications to
be met, and RF gaskets were in use (beryl-
lium copper, silver elastomers, and monel
wire mesh). In 1956 a tri-service shielded
enclosure measurement specication was
released called MIL-STD-285. Fifty years
later it is still being used to evaluate shielded
enclosures. Tis standard has been used
to measure almost every kind of shielded
enclosure, but it was originally designed to
measure the enclosure attenuation provided
for sources located outside the enclosure.
How the enclosure is measured is signi-
cant. Te measurement technique should
reect the proposed use of the enclosure.
Te same concept is true of enclosure
design. Problems likely to arise must be
factored into enclosure design. Is the
designer dealing with radiated emission,
radiated susceptibility, inductive and/or
capacitive crosstalk, or some combination
thereof? Also, does the problem entail plane
wave, electric, or magnetic eld coupling?
It doesnt make sense to worry about pro-
viding 120 dB of EF attenuation when the
equipment to be protected is sensitive to, or
produces only, magnetic elds (HF). Because
shielded enclosures are designed to contain
and/or to exclude electromagnetic energy,
an understanding of the design process
must include discussion of the character-
istics of radiated electromagnetic fields
and waves.
FIELDS AND WAVES
A stationary charge may cause upset to an
electronic device by exerting a repulsive
force on like charges in the device (this is
especially true with semiconductors); but if
the electrostatic charge remains unchanged,
it does not create an electromagnetic eld.
Conversely, current is charge in motion, and
current does create a magnetic eld. If the
current is steady-state (DC), the magnetic
eld will be constant. A constant magnetic
field does not create a radiated electro-
magnetic eld. When charge is accelerated
or decelerated, or when current increases
or decreases, a changing magnetic eld is
created. Tis, in turn, creates a changing
electric eld, and electromagnetic energy
is radiated away from the source. Te en-
ergy can be developed from either a high
impedance (high voltage low current)
electric eld source, or from a low imped-
ance (high current low voltage) magnetic
eld source. Monopole and loop antennas
are good examples of these two sources. See
the examples in Figure 1.
Close to the source, the relationship
between the electric and magnetic elds is
very complex; and although both will exist,
Designing an RF shielded enclosure
Anticipated problems must be factored into enclosure design.

EMC Chambers
Compact, 3m, 5m, 10m
RF Shielded Enclosures
MRI Enclosures
Military Test Chambers for 461E
Avionics Test Chambers for DO160
Free Space Simulation Chambers
Reverberation Chambers
P
3
RF Sliding Doors
Turnkey Services
Facility Relocations
Facility Upgrades
Let Panashield help you with
your EMC facility project.
Our experienced personnel
will provide technical support
to guide you through the
design, supply and certifica-
tion of the following types of
facilities:
www.panashield.com
Facility Solutions
for
Global EMC
Tel: 203.866.5888 Fax: 203.866.6162 help@panashield.com
10 Meter EMC Chamber
Panabolt RF Shielding
3 Meter EMC Chamber
Booths 2114, 2116
Panashield.indd 1 3/28/2008 10:58:55 AM
166
the eld characteristic will be primarily either electric or
magnetic. Farther from the source, the relationship be-
tween the electric and magnetic elds becomes constant
with ratio of E/H = 120 . Tis relationship is illustrated
in Figure 2. Te simplications and approximate distance
for the change from near eld to far eld generally used by
EMC practitioners is R = /2. Tis formula assumes that
the dimensions of the source structure are less than one-
half wavelength. Antenna designers who strive to be more
precise may take exception to this notion!
SHIELDING EFFECTIVENESS MODELS
Tere are three models typically used to describe shielding
eectiveness. One of these works only at the low frequencies
(including DC). Te other two are usable for RF. At the lower
frequencies, where the inductive reactance of the material
is less than the materials resistance, shielding eective-
ness is primarily determined by the materials conductivity
(for EF) and permeability (for HF). Tis observation often
leads to the erroneous belief that the materials resistance
determines its shielding eectiveness. Various RF gasket
manufacturers have attempted to use a materials volume
resistivity to dene shielding eectiveness and then to ap-
ply those values over frequency ranges where the values are
invalid. If one considers the behavior of a capacitor from
DC throughout a wide frequency range, its obvious that a
~
HF Source
High Current
Low Voltage
Low Impedance
EF Source
~
7777777777777777777
High Voltage
Low Current
High Impedance
structure can have extremely high resistance at DC and very
low RF impedance at the higher frequencies. Te reverse is
true for inductance! A reective shield requires both low
resistance and low RF impedance. RF impedance cannot
be determined by measuring just the resistance.
Circuit Approach
In the midrange of frequencies from roughly 300 kHz to
3 GHz, shielding eectiveness can be modeled using the
circuit approach. In this frequency range, shielding can be
determined from the materials transfer impedance. Tis
approach was developed by Wheeler in the mid-1950s to
estimate magnetic eld shielding of an enclosure. Te
technique has been expanded to include magnetic, electric,
and plane wave shielding. Te circuit approach describes a
shielded enclosure as either a short circuited loop antenna
for magnetic elds, or as a fat electric dipole antenna for
electric and plane wave elds. By modeling the enclosure
as an antenna, the circuit approach provides answers that
factor in the overall size of the enclosure, as well as the
shielding material characteristics. Te method essentially
determines the RF current that can be induced into the
skin of the enclosure (as an antenna structure of a given
size) and what electromagnetic eld levels will be developed
within the interior of the enclosure by the induced currents
being coupled through the transfer impedance. Tis circuit
approach method is easier to adapt for the analysis of aper-
tures or discontinuities than the transmission line approach
described next, but it still has its shortcomings. When the
dimensions of the enclosure (with respect to frequency)
permit the development of standing waves, i.e., when the
longest dimension is equal to a half wavelength, then the
enclosure becomes an RF cavity, and the transmission line
approach becomes the model of choice.
Transmission Line Approach
Te transmission line approach was developed by Schelkun-
o in the early 1940s. Briey, the dierence in the radiated
eld and shield impedances results in some of the RF energy
incident on the enclosure surface being reected (R) from
the surface, and some energy being absorbed (A) as it travels
through the shield material. As such, shielding eectiveness
can be described in terms of the individual contributing
factors that represent the change in eld strength. Tis
description of shielding eectiveness is easy to visualize,
and it is frequently used in presentations covering the
theory of shielding.
Schelkunoff s method is particularly well suited to
large homogeneous enclosures without discontinuities
where the wavelength is longer than the dimensions of
the enclosure. Te method does not account for the size
of the enclosure; and because a plane wave assumption
is being made, it does not provide accurate estimates of
magnetic or electric eld attenuations at low frequencies
where dimensions of the enclosure are small in comparison
to the wavelength. Schelkunos approach was modied
by Richard Schultz (the author of MIL-STD-285), and the
1200
1000
300
900
800
500
377
700
600
100
200
150
0.3 0.4 0.5 0.6 0.8 1 2 3 4 5 6 8 10
Z
W
R = /2
NF FF
Solid lines show
simplification used for
EMC requirements
Figure 1. EF & HF vs. distance.
Figure 2. Wave impedance vs. distance.
BREWER
167
shielded rooms
combined Schelkuno-Schultz analysis method, although
much improved, still is not entirely eective in estimating
the magnetic eld attenuation. Te most accurate analy-
sis approach for magnetic eld shielding was developed
by King in 1933 and is based upon Maxwells equations.
Much of the work was done by John Quine et. al. at RADC,
using the transmission line approach to analyze shielded
enclosure discontinuities such as apertures and RF gasket
materials. Although there will be elements of each of these
approaches scattered throughout this article, the discussion
will focus primarily on the transmission line approach.
Some pedagogical simplications will be made, which may
annoy some readers, but will clarify the basic concepts.
Tere are two cases to examine: Case 1 where the RF
source is located outside the enclosure and Case 2 where
the RF source is inside the enclosure. Refer to Figure 3 for
an illustration of these two cases.
In both cases,
SEdB = 10 log (P
1
/P
2
) = 20 log (F
1
/F
2
)
where
F
1
and F
2
are the magnetic, electric, or plane wave eld
intensities at the enclosure surface closest to the RF source
and on the opposite side of the enclosure wall, respec-
tively.
For Case 1, where the source is external, the overall
shielding eectiveness (in dB) can be generalized and ap-
proximated by:
SEdB = AdB + R()dB + BdB
where
A = Absorption loss in dB
R() = Reection loss (Not really a loss but rather a re-
direction of the RF energy. Because the RF source
is located outside the enclosure, the redirected
energy can be viewed as a loss)
B = Correction for multiple internal reections. Typi-
cally, it is signicant only for very thin materials
when the absorption loss is less than 10 dB, and it
will not be discussed in this article.
At the higher frequencies, an enclosures shielding ef-
fectiveness is dominated by absorption that is independent
of the type of wave illuminating the enclosure and is given
by the following expression:
AdB = kt (F
MHz
)
0.5
where
k = 3.34 (if t is in mils) , k = 0.131 (if t is in mm)
t = thickness of the material in mils or mm (this will
determine which k to use)
= relative magnetic permeability
= relative conductivity
F
MHz
= Frequency in MHz
Te RF energy reected from the enclosure surface
F1
F2
R(dB)
A(dB)
B(dB)
Thickness (t)
Reflected
Wave
Incident
Wave
Transmitted
Wave
Internal
Reflected
Wave
F1
F2
R(dB)
A(dB)
B(dB)
Thickness (t)
Reflected
Wave
Incident
Wave
Transmitted
Wave
Internal
Reflected
Wave
F1
F2
R(dB)
A(dB)
B(dB)
Thickness (t)
Reflected
Wave
Incident
Wave
Transmitted
Wave
Internal
Reflected
Wave
F1
F2
R(dB)
A(dB)
B(dB)
Thickness (t)
Reflected
Wave
Incident
Wave
Transmitted
Wave
Internal
Reflected
Wave
Case I Case II
Note:
If A(dB) > 6 Then B(dB) approx 0. If two signals approximately 12dB (or more) different in
amplitude are added, the smaller has almost no effect on the amplitude of the sum.
SE(dB) = 20 log F1/F2 = A(dB) + R(dB) + B(dB)
Figure 3. Source location cases.
168
results from the mismatch between the incident wave im-
pedance (Zw) and the shield material impedance (Zs). For
distant sources where the separation distance (d) is equal
to or greater than d = /2 or about 1/6 wavelength (plane
wave region), the wave impedance is constant at Zo = 120
ohms regardless of the originating source impedance or
separation distance. On the other hand, for nearby sources,
the wave impedance Zw varies with both the source im-
pedance and the distance from the source to the shield
material. Te wave impedance of low impedance sources
(magnetic eld) will be less than 120 (i.e., 377) ohms and
will increase to that limiting value as distance increases.
Te wave impedance of high impedance sources (electric
eld) will be greater than 120 ohms and will decrease to
that limiting value as distance increases. Consequently,
there are three equations that are used to calculate the
reection from the shield surface. Tese equations assume
that the ratio of Zw/Zs or Zs/Zw >10when /2 r or 2
r/ = 1 the EF and HF equations become equal to the
plane wave equation.
Plane Wave:
RdB
P
= 20 log (120 /4 Z
s
)
Electric Field:
RdB
E
= 20 log [(120 /4 Z
s
)(/2 r)]
Magnetic Field:
RdB
H
= 20 log [(120 /4 Z
s
)(2 r/)]
where
Z
s
= 3.68 * 10
7
(F
Hz
/)
0.5
= relative magnetic permeability
= relative conductivity
F
Hz
= Frequency in Hz
Note that Z
s
increases with increasing frequency which
results in a decreasing value for reection. Figure 4 illus-
trates and compares the shielding eectiveness of copper
and iron.
For Case 2, the overall shielding eectiveness (in dB) is
approximately:
SEdB AdB
Cu Reflection EF
Cu Reflection PW
Cu Reflection HF
Fe Reflection EF
Fe Reflection PW
Fe Reflection HF
Absorption (dB/mil)
Fe Cu
100 1k 10k 100k 1M 10M 100M 1G 10G
FREQUENCY - Hz
300
250
200
150
100
50
0
S
H
I
E
L
D
I
N
G

E
F
F
E
C
T
I
V
E
N
E
S
S

-
d
B
Copper (Cu) Iron (Fe)
RF source 30 cm from surface
(/2) = 0.3m
Figure 4. Shielding effectiveness of copper and iron.
Total Shielding Solutions
World class experience
in shielded chamber
design, manufacture
and installation...
Let us provide the full turnkey
solution for you....
Design
Manufacture
Installation
Maintenance
Testing & Calibration
Tel: +44(0)1942 296190
www.rainfordemc.com
sales@rainfordemc.com
A resource you can call on to support all your
EMC, anechoic and screened room requirements
L
L
L
L
L
L
L
L
L
L
Emissions & Immunity
3M Compact, 3M, 5M
& 10M Solutions
Antenna Measurement
Chambers
High performance
shielded rooms for
EMC Tempest, EMPP
and MRI
Mode Stir Mast,
Turntables & Controllers
BREWER
169
shielded rooms
where
A = Absorption loss in dB
R() 0 dB
Te reason that reection R() was not considered a loss
in this case is that the energy reected/redirected from the
interior wall is still within the enclosure. Admittedly, it is
not zero, but its eect can still be quite small. Tese internal
reections within the enclosure may result in evanescent
waves that are out of phase with the original signals that
created the interference. Tey may interfere either with
the operation of the circuits that produced them or may
combine with normal waves resulting
in an increase in EF levels. Even if these
eventualities do not occur, the reected
waves can exit through apertures
simultaneously with normal incident
waves and can result in an increase
in the overall field strength. As the
enclosure size increases to the point
where standing waves can exist, reso-
nant amplication may occur. Ten,
the EF levels within the enclosures can
increase typically by 30 to 40 dB, dwarf-
ing the previous problem.
This problem can arise even in
the case of very good enclosures. For
example, most sheet metal military
avionics enclosures are made from 30
to 40 mil aluminum.
AdB = 3.34 * 30 (1 * 0.64 * 100)
0.5
= 802 dB attenuation at 100 MHz
We cannot measure that much at-
tenuation, nor are we likely to be able to
achieve it, but its evident that not add-
ing in the reection did not matter.
ENCLOSURE SIZE
Te fact that the size of a shielded en-
closure has an effect on its shielding
eectiveness is not often discussed. Size
matters because the enclosure Q is pro-
portional to the energy stored in the cavity
volume to the energy dissipated in the in-
ternal surface area. Shielding eectiveness
is directly proportional to the enclosure
volume and inversely proportional to the
Q, which is altered by any lossy elements
such as RF gaskets, seams, dissimilar
materials, installed components, etc. For
those readers that are interested in more
information about this topic, a signicant
amount of research (with papers) has been
done in this area by John Quine, et. al. at
RADC, Rome, NY.
Also, the size determines enclosure
resonance frequencies. Te resonances
makes the SE uctuate as a function of frequency. Te
attenuation may remain constant, but the eld strength
internal to the enclosure increases at the resonant frequen-
cies. Te higher internal eld strength values would make it
appear as if the SE of the enclosure has deteriorated. Typical
equivalent loss in SE resulting from resonance is 30 to 40
dB. However, studies done at Georgia Tech have indicated
as much as 60 dB loss for very high Q enclosures.
For a simple rectangular enclosure (dimensions L, W,
H in meters), the various resonant frequencies can be cal-
culated from the following expression:
Whatever The Wireless Application
Weve Got You Covered.
For reliable EMI/RFI shielding
performance, turn to the most
experienced manufacturer in the
shielding industry: ETS-Lindgren
.
No other shielding company
provides the product development,
design/consultation, engineering
expertise, and quality testing that
result in the industrys most
effective EMI/RFI protection
from interference.
It doesnt matter if youre at
the end of the RF Spectrum or
any point in between; we have
the attenuation solution you
need. Whether it is Cellular,
Bluetooth, Wi-Fi, UWB, WiMAX,
MIMO or the next standard on
the horizon, ETS-Lindgren can
provide unmatched shielding
performance every step of
the way.
For application assistance or
to request our literature, call
630.307.7200. Visit our Web site
at www.ets-lindgren.com.
Enabling Your Success
Division Headquarters: USA 630.307.7200
Company locations in the US, UK, Finland, France, Singapore, Japan, and China
Representatives and Distributors Worldwide
170
TE
lmn
= 0.5 C [(l/L)
2
+ (m/W)
2
+ (n/H)
2
]
0.5
where L< W < H and l, m, and n are integers.
Setting l and m = 1 and n = 0 permits us to calculate
TE
110
the lowest resonant frequency for the cavity.
Te increase in eld strength is dramatic! Based on stud-
ies done on resonant cavities for reverberation chamber
tests for MIL-STD-461 testing by USN Dahlgren, VA, [M.
Hateld, et al.] the average EF strength inside an unloaded
(empty) reecting cavity can be calculated by:
E(V/m)
ave
=
[(QP
in
ant
Z
o
C
o
)/(12V
vol
F
MHz
)]
0.5
Te peak eld strength is 6 to 8 dB greater than the mean,
and the eld distribution levels throughout the enclosure
are not uniform. Since cavity Qs are proportional to the
energy stored in the volume of the cavity to the energy dis-
sipated in the impedance of its internal surface area (Vol/
As), using materials with the same magnetic permeability
(i.e., 1), for the same cavity conguration, the Qs would be
proportional to the ratios of the surface conductivity of the
cavities. For some idea of the Q values, at 2000 MHz, an
empty copper enclosure would have an unloaded Q of about
26,000, and a loaded Q of about 2600. Heres the eect of
generating a 2000-MHz 10-watt signal inside the enclosure.
Te antenna e ciency is assumed to be 0.9:
E(V/m)
ave
=
[(QP
in

ant
Z
O
C
O
)/(12 V
vol
F)]
0.5
Becomes:
E(V/m)
ave
=
[(2600 * 10 * 0.9 * 120 * 300)/(12 * 1 * 2000)]
0.5
= 187 V/m
ave
and 374 V/m
peak
Tis eect can be a major problem, particularly for design-
ers and builders of spacecraft.
In general, loading the enclosure with conductive or
absorbing materials reduces the volume and increases the
internal surface area. Ba es and compartmentalization push
resonant frequencies higher, reduce Q, and provide localized
shielding of components/modules.
Tese high-level calculated shielding eectiveness values
indicate best-case shielding eectiveness since they do not
include the eects of apertures or other discontinuities.
Unfortunately, it is not practical to build an all-welded
enclosure. Most enclosures require various openings for
controls, access panels, ventilation, viewing, etc. Tese
aperture/discontinuities account for most of the leakage
in a shielding enclosure.
APERTURE EFFECTS
Apertures come in dierent shapes, but considering the
shielding eectiveness as the inverse of the radiation ef-
ciency of an equivalent shaped slot antenna provides a
simple model for calculating aperture worst-case shielding
eectiveness. Some error results from this assumption,
but it is adequate for design because the actual shielding
eectiveness will be greater than the calculation indicates.
Shielding eectiveness of a single aperture with the largest
opening dimension (D) is given by the rst part of the fol-
lowing equation. Te second part of the equation corrects
for multiple equal-sized (D) apertures.
SE
dB
= 20 log /2 D - 20 log n |
S /2

where
k = 20 for slot and k = 40 for a round hole
D = length of slot (meters) and L > w and L >> t or
Diameter of Hole (meters) D >> t
= wavelength in meters
n = number of apertures within /2
Tis equation can be solved in terms of dimension (D) to
determine what size aperture is required for a given attenu-
ation, but in general, apertures should not be longer than D
= /50. Tis makes for a very small opening! For example,
to achieve acceptable attenuation values at a frequency of
10 GHzthe 10th harmonic of a 1000-MHz clock (not
unusual for high-speed digital devices)apertures should
not exceed 0.6 mm. In a manufacturing environment, this
would require continuous seams.
APERTURE SEALING
Notwithstanding the type of shielding panel or skin materi-
al used, the enclosure shielding eectiveness depends upon
how well the panel or skin is sealed into the enclosure
i.e., the quality of the RF bond across the seam aperture.
Any isolated panel/skin that is not adequately grounded/
bonded to the enclosure can behave as an antenna struc-
ture. Grounding the panel at only one point will reduce its
antenna e ciency and will often prevent it from acting as
an antenna, but it will not eliminate leakage through the
rest of the seam.
Te best methods for sealing the perimeters of shielded
apertures, in order of eectiveness, are welding, brazing,
soldering, and rivetingexcept in a high shock and vibra-
tion environment where riveting is better than soldering.
ISOLATED/BUTT
1
SHEAR/WIPING
3
COMPRESSION
2
MICROWAVE
CHOKE
4
Figure 5. Four basic seam designs.
BREWER
171
shielded rooms
Parameter 100 kHz < F < 100 MHz F > 100 MHz
SE + EMCSM
> 60 dB
Use knife edge
1
or overlapping seams with metal-metal
contact. Harden all apertures. Protect from corrosion using
conductive nishes
Use knife edge seams
2, 3
with metal-metal contact. Harden all
apertures using high performance RF gaskets. Protect from
corrosion using conductive nishes
SE + EMCSM
< 60 dB
Use knife edge or overlapping seams with metal-metal
contact. Harden all apertures. Taped butt joints OK. Protect
from corrosion using conductive nishes.
Use knife edge or overlapping seams with metal-metal
contact. Harden all apertures with RF gaskets. Protect from
corrosion using conductive nishes
Note:
1. Simple knife edge/pan contacts can be dimples or bosses
2. If new construction knife edge/pan type construction is preferred
3. If existing hardware, use a high performance continuous seal
Table 1. Seam design and RF gasket guidelines.
Unfortunately, these methods prevent easy access for
maintenance and repairs. Installing closely spaced screws
or clamps permits, but does not facilitate, eld removal.
Terefore, enclosures generally use positive contact designs
to provide and maintain a low RF impedance connection
across mating surfaces. Tis design option may take the
form of bosses, segmented or interlocking seam edges,
overlapping surfaces, or RF gaskets. Depending on the
seam design, these approaches may eliminate the need for
fasteners altogether; but in any case, they will permit the
fasteners to be spaced farther apart.
Tere are over 2000 dierent RF gasket designs avail-
able based on combinations of materials and construction.
With good printed circuit board design, a minimum of 60
dB is adequate for most commercial applications. Military
equipments will typically require 80 to 100 dB. Te vari-
ous RF gasketing materials have substantial dierences in
their electrical, mechanical, and corrosion properties. Also,
each is better suited for some applications than others. Te
choice depends on the type of enclosure seam in which the
gasket is used. Just based on attenuation, for levels greater
than 80 dB, beryllium copper, tin, and silver-plated metal,
or metal-lled elastomer gaskets are the most popular.
From 60 to 80 dB, choices also include monel, nickel, Sn-
CuFe, and silver-plated fabric. For 60 dB and below, every
material can be used.
SEAM CONFIGURATIONS
Tere are four seam congurations to choose from. Tese
are (1) the isolated seam, (2) the compression seam, (3) the
shear or wiping seam, and (4) the insulated or choke seam.
Tese seam congurations are illustrated in Figure 5. Te
isolated seam can best be described as a butt joint. An ex-
ample is the top and bottom seams between blank panels
or pull-out drawers mounted in a rack. Because there is no
overlap, it is di cult to use conventional gasket materi-
als, and the preferred sealing method is adhesive-backed
conductive foil or cloth tape placed over the seam. Tis
static (xed) conguration is used frequently in lightweight
spacecraft and satellite applications, but its meant to be
a permanent solution that will not be repeatedly opened
and closed.
Te compression seam tends to be the most frequently
used type of seam. It may not be the best, but it works. Tis
conguration is also intended to be a static joint. In this
application, panels overlap the perimeter of the apertures.
If the contact surfaces are conductive, these can generally
meet the 60-dB commercial requirement with the use of
closely spaced screws, especially hi torque types. For higher
levels of attenuation, this seam design can also be sealed
with any type of RF gasket material. Since the gasket mate-
rial compression forces are normal to the panel, uniformly
spaced threaded fasteners or clamps still must be used
around the perimeter to maintain the RF seal. Choosing a
lower compression force gasket enables the use of lighter
weight enclosure materials and wider spacing of the fasten-
ers. As enclosure congurations become smaller and more
complex, gasket choices become limited, and form-in-place,
printed or vulcanized elastomer gaskets are used.
Te shear seam is the only dynamic conguration, and
RF Testing
Economical benchtop RF test
enclosure for initial compliance
testing.
from $1295
Shielding Tents with external
frame, instant up/down for
emissions-free room. from $3500
EMC Spectrum Analyzers
Color LCD Scope
2-ch 250MHz Scope with 128
MS/s and real-time sampling of
1GS/s! Adv triggering.
250MHz spec. analyzer and
125MS/s waveform gen.
PS5203 (32MS buffer) $2237
PS5204 (128MS buffer) $3360
Worlds Fastest
Ti me- Sa vi n g Sol u t i on s
f or E MI E n gi n eer s
Owon - 25/60MHz 2-ch +
trigger standalone USB bench
scope with 7.8 color LCD.
Battery powered optional.
PDS5022S (25MHz) $325
PDS6062T (60MHz) $599
Handheld Palm PC-based 2.7GHz
Spectrum Analyzer. Continuous/
single/peak-holding/avg sweeps -
unlimited storage for wfms, set-ups,
etc. Built-in WiFi/Bluetooth/IR.
PS2701T $1990
B
e
s
t
S
e
l
l
e
r
6 in 1 Scope
6-in-1 USB scope adapter! 200kHz 2-ch
10-bit scope, 2-ch spectrum analyzer,
2-ch chart recorder, 16-ch 8MHz logic
analyzer, 5-ch signal gen, 8-ch pattern
gen. SPI/I2C/1-w/UART decoding.
PoScope with probes $199
Winner!
25MHz 100MS/s 2/16ch scope/
logic-analyzer 5ns-5s/div with
complex triggering. See wfm +
data lines. 7.8 TFT Color LCD.
USB-connected. 4MS buffer.
MSO5022 SALE!$799 $899
Bargain MSO
Handheld Scope
20MHz or 60MHz rugged
handheld USB scope with
3.8 color LCD. Built-in meter
- great for your tool kit.
HDS1022M (20MHz) $499
HDS2062M (60MHz) $699
Scope + Anal yzer
25/100MHz 2-ch /16 logic scope
and logic analyzer. 2000 wfm/s
refresh rate. See waveforms
and logic data simultaneously.
Trigger on data or signal edge.
DS1022CD $699
DS1102CD $1499
N
E
W
!
R
I
G
O
L
High accuracy/stability, wide
range, low phase noise/
leakage, serial control.
Keypad/rotary setting.
TGR1040 10MHz-1GHz $2498
TGR2050 150kHz-2GHz $4558
1/2GHz RF Generators
172
exceed the radiated susceptibility levels. Tis is indicative
of a potential major self-compatibility problem and must be
handled separately from environmental EMC.) To account
for variations in the electromagnetic characteristics from
one system to the next, an EMC safety margin (EMCSM)
is added. Te EMCSM is 6 dB if the levels were measured
and 12 dB in the case of P&A.
Frequencies less than 100 kHz
Emission or susceptibility frequencies of less than 100 kHz
imply a magnetic eld (HF) coupling problem. In such a
case, the shielding eectiveness is highly dependent on
the type of material used for the enclosure. Regardless, it
is necessary to start by determining the shielding eective-
ness (SE) required at the highest frequency and then adding
in the appropriate EMCSM.
Next, assume a low-cost permeable material, and calcu-
late the thickness (t) required to produce an absorption loss
(A) = SE + EMCSM. Stop if the calculated thickness (t) is less
than the maximum design thickness. Otherwise, increase
the thickness and/or change to a higher permeable mate-
rial, and repeat the calculation. Cold rolled steel is a good
start, followed by hot rolled steel, and then puried iron.
When the required thickness-permeability forces a selec-
tion of exotic high permeable materials such as m metal,
conetic, or supermalloy, reconsider thickness constraints
before making a decision to use these materials.
For HF shielding, overlapping seams (with minimum
air-gap) are required for ux transition across the seam.
Overlap requirements are 10 to 100x the thickness of the
material, but 0.5 inch is typically used. RF gaskets are not
used, and butt joints should not be used.
Frequencies over 100 kHz
Emission or susceptibility frequencies that are over 100 kHz
can be either an HF or EF coupling problem. In either case
at these higher frequencies, conductive materials can be
used. Te design approach is determined by whether the RF
source is inside or outside the shield, how much attenuation
is needed( i.e., greater or less than 60 dB), and whether the
frequency is greater or less than 100 MHz. Start by calculat-
ing the shielding eectiveness (SE) required at the highest
frequency, and then add in the appropriate EMCSM.
If the source is inside, assume a low-cost conductive
material (such as aluminum), and calculate the thickness (t)
required to produce an absorption loss (A) = SE + EMCSM.
Stop if the calculated thickness (t) is less than the maximum
design thickness. Otherwise, increase the thickness, and/or
change to a permeable material, and repeat the calculation.
Cold rolled steel is a good start, followed by hot rolled steel,
and then puried iron.
If the source is outside, assume a low-cost conductive
material (such as aluminum), and calculate the reection
from the shielding material rst. In this case, the reection
(R) requires about one skin depth making it essentially
independent of the thickness of the materialespecially
at the higher frequencies. If the reection is adequate at
it must be treated dierently than the other two. Tis type
of joint is constructed in several dierent congurations,
i.e., pan-edge, knife-edge, modied knife-edge, and/or
longitudinal. Tese designs align the mechanical forces
parallel to the panel surface so no fasteners or clamps are
required to preserve the shielding. Obviously, this design
can eliminate the need for fasteners. Plain pan covers can
be used; but without bosses or segmented edges, it is dif-
cult to assure good contact around the perimeter. If RF
gaskets are required for higher attenuation, metal-nger
gaskets are normally used for this application; however,
some fabric-over-foam congurations have been used. If
fabric gaskets are used, care should be taken to assure that
the seam design does not abrade the fabric. With metal-
nger gaskets, this conguration has the highest shielding
eectiveness over the widest frequency range; plus it is
self-cleaning. Because of the di culty of retrotting this
conguration into an existing product, this design should
be considered from the beginning of the project. When
designed in from the beginning, it typically results in the
highest performance with the lowest overall cost.
Te insulated (choke) seam is quite dierent from the
previous three seams described. Tose seams are broadband
RF congurations, which rely on making a low impedance
metal-to-metal RF bond across the mating surfaces. Te
choke seam is for those high frequency equipment designs
that do not need a broadband solution. Some designs even
require that the cover must be insulated from the base. In
fact, some even require that the metal cover be covered with
plastic to minimize corrosion and to make it easy to clean.
So long as the attenuation is required only in a high but nar-
row frequency range, these objectives can be accomplished
with a microwave choke seam. Tis seam is essentially an
RF lter. Each side of the seam has a machined /4 or a /2
groove that reects an out-of-phase signal component to
combine with and to attenuate the signal. Te groove can
be stagger tuned using a stepped conguration to increase
the bandwidth, but unfortunately cannot achieve the band-
widths of the previous three designs.
SHIELDING DESIGN PROCESS
Tis approach does not always work, but it provides a
methodology for getting started.
Start by dening the EUTs radiated requirements. Tis
denition can be determined by measuring the electromag-
netic environment (EME), or by referring to the current
military or commercial requirements that apply to the
equipment being shielded. Once thats done, determine
the EUT radiated emission and susceptibility levels. Tis
can be calculated, done by measurement, or by prediction
and analysis (P&A). Tere are three frequency ranges of
interest: (1) less than 100 kHz, (2) between 100 kHz and
100 MHz, and (3) greater than 100 MHz.
Tese levels are then compared to each other and to
the dened environmental requirements to determine the
worst case shielding eectiveness needed. (Note: It doesnt
happen often but sometimes the radiated emission levels
BREWER
173
shielded rooms
the lower frequencies, then the mate-
rial selection is complete. If not, then
calculate a thickness (t) required to
produce an absorption loss (A) such
that A + R = SE + EMCSM. Stop if the
calculated thickness (t) is less than
the maximum design thickness. Oth-
erwise, increase the thickness, and/or
change to a permeable material, and
repeat the calculation.
Finally, once the material character-
istics are established, seam design and
RF gasket choices are made to complete
the design process. Tese are based on
attenuation vs. frequency and are sum-
marized in Table 1.
Ron Brewer is currently a senior EMC/RF
engineering analyst for NASA/Analex at the
Kennedy Space Center. A NARTE-certif ied
EMC/ESD engineer, he has worked full time in
the EMC eld for more than 30 years. Mr. Brewer
was named a Distinguished Lecturer by the IEEE
EMC Society. He has taught more than 385 EMC
technical short courses in 29 countries and has
published numerous papers on EMC/ESD and
shielding design. He completed undergraduate
SUPPLIERS SHIELDED ROOMS
ETS-Lindgren (Lindgren RF
Enclosures, Inc.
................... 1, 84, 169, 177, Back Cover
MORE ON OUR WEBSITE
Shielded rooms have long played a
crucial role in the quest for EMC. Find
the latest information on this crucial
aspect of EMC testing by visiting the
new InterferenceTechnology.com.
Just look under Resources for
white papers and applications notes
on this crucial subject, and be sure to
look under Directories to scan the
companies specializing in shielded
room design.
www.emscreen.de
emscreen develops, plans
and installs customized room
shielding solutions for various
applications in the felds of
Security, Laboratory & Test
and Medical Technology.
Upon customers requests we
deliver shielded rooms as
turnkey solution including
interior work, furnishing and
building technology.

Our oferings include:
architectonically shielded
room
modular room shielding/
shielded cabins
shielded tents
shielded boxes
magnetic shielding
special solutions for specifc
requirements
consulting

Electromagnetic
Screening GmbH
Wallbergstrae 7
D-82024 Taufkirchen/Germany
Phone: +49 89 614171-0
Fax: +49 89 614171-71
E-Mail: info@emscreen.de
Tailor-made shielding solutions
Glendale Heights, IL; 630-307-7200;
emscreen GmbH ............................ 173
Taufkirchen, GERMANY;
+49-89-614171-71; www.emscreen.de

An Company
ORBIT Advanced Electromagnetics,
Inc. (AEMI) ........................................... 5
Santee, CA; 619-449-9492; www.
aemi-inc.com
Panashield, Inc. .............................. 165
Norwalk, CT; 203-866-5888;
www.panashield.com
Rainford EMC Systems Ltd. .......... 168
St. Helens, Merseyside, UNITED
KINGDOM; +44 1942 296 190;
www.rainfordemc.com
Saelig Company ..............................171
Pittsford, NY; 888-772-3544;
www.saelig.com
and graduate work in engineering science and
physics at the University of Michigan. Email:
ronbrewer@ieee.org. Q
174
emc design & software OFF - CHI P I C DECOUPLI NG MEASURES
MART COENEN
EMCMCC bv
Eindhoven, the Netherlands
O
ver the years, many papers and
articles have been written about opti-
mizing o-chip IC decoupling. Many
IC vendor application recommendations
feature a cluster of decoupling capacitors
adjacent to the IC, in close proximity to one
anotherviz. an electrolytic capacitor along
with a small and a large value ceramic ca-
pacitor at the various supply nodes. Te basic
conviction underlying this approach is that
the decoupling impedance must be low over
as broad a frequency range as possible.
In functional PCB design and IC applica-
tions, this approach holds true. However,
when dealing with electromagnetic com-
patibility, an opposite track must be taken.
In nearly all digital, as well as analog and
RF designs, intentional on-chip decoupling
capacitance is includedregardless of the
origin of the IC design. When this on-chip
decoupling exists in parallel with o-chip
decoupling of lesser impedance, all interfer-
ence currents will be forced o-chip rather
than remaining conned within the tiny
silicon chip area. An increase in the current
loop area increases the amount of direct RF
emissions from the IC package. Also, forc-
ing the decoupling current to ow o-chip
will cause ground bounce between the PCB
reference plane and the silicon substrate.
Specically, V
ss
-net will become superim-
posed on all signal input and output lines
connected to the IC and will cause all PCB
traces to radiate as well.
A simple model will demonstrate the
eect of the on-chip circuitry on the ul-
timate utility of the IC packages and PCB
application. Typically, whatever occurs o-
chip has little eect on on-chip circuitry at
frequencies above 300 MHz, or even less.
Essentially, when designed as a transmis-
sion line, the speed of charge transfer from
o-chip to on-chip should not exceed the
propagation delay of the package designor
even worse, exceed the LC time-constant of
on-chip capacitance working in conjunction
with the package interconnect, lead frame,
and bond wire.
ON-CHIP SOURCE
REPRESENTATION
Te on-chip interference source can be de-
scribed as an AC or time-dependent current
source in parallel to an on-chip capacitance
(with some internal series resistance). In
literature, this kind of noise source is often
denoted by ICEM or LECC models repre-
senting the behavior of the core of a digital
IC. For o-chip interfaces, the IBIS model
is frequently used. In fact, version 4.1 and
above are particularly well suited to the
analysis of both signal and power integrity.
For the purpose of EMC calculations, all AC
or time-dependent currents through all the
pins of the IC must be taken into account
before a reasonable calculation of RF emis-
sions can take place.
Achieving an eective AC or time-de-
pendent current characterization requires
factoring in every aspect of the entire
applicationincluding transistor level IC
design, the 3D extracted parameters of
Off-chip decoupling measures:
The EMC perspective
Off-chip decoupling, or buffering, is a necessity.

NEC Informatic.indd 1 3/26/2008 3:55:31 PM
176
the IC package, as well as all o-chip
measures taken with regard to supply
decoupling or signal loading. Alterna-
tively, a limited suitable model can be
dened.
When a load capacitance is mea-
sured at an output, and when that
output signal transition is fast, then
the signal peak current will be as high
as the voltage swing divided by the
output driver impedancei.e., R
on
of
the switching output since the load ca-
pacitance represents an instantaneous
short-circuit impedance. When the
same transition is applied to a trans-
mission line as a load, the output signal
peak current will be limited to the same
R
on
plus the characteristic impedance
of that transmission line. With an R
on

of 10 and a Z
transmission line of
100 , the output and the consequent
peripheral supply current peak will be
decimated. Tis assumption holds true
as long as the transmission line length
(i.e., its propagation delay) remains long
in comparison to the rise time of the
output signal.
The package, represented as an
inductance or transmission line, and
the o-chip decoupling capacitors are
placed in parallel with the on-chip ca-
pacitance physically embedded within
the on-chip interference current source.
As long as the bypass impedance of the
package impedance in series with the
o-chip decoupling capacitors is low
as compared to the on-chip decoupling
impedance, ALL switching current will
appear o-chip.
Simple CMOS chip designs have
an equivalent on-chip capacitance of
one nF and above. A typical acceptable
gure might be 700 pF/mm
2
(standard
cell capacitance); whereas, in a best-
case scenario tens of nF/mm
2
(dedi-
cated decoupling capacitance) might be
achieved. In large processor designs
e.g., 100 mm
2
on-chip capacitances of
over 200 nF have been measured. Te
on-chip capacitance is the sum of the
metal-to-metal power grid capacitance,
the N well-to-substrate capacitances,
and the gate oxide capacitances along
with their interconnects as capaci-
tive loads. Tis summed capacitance
appears as soon as the nominal sup-
ply voltage is supplied to the IC and
the CMOS transistors turn on. With
normal CMOS IC designs, this on-
chip capacitance can be measured as
a function of the DC biasi.e., supply
voltage. More recent CMOS digital
designs include embedded low drop
out (LDO) voltage regulators or embed-
ded IP-block enabling supply switches.
With these recently designed chips, the
total on-chip capacitance can only be
estimated. Consequently, these newer
digital designs should include on-chip
decoupling underlying the regulators
or switches since no o-chip remedies
are available.
At low frequencies, the interference
current will be distributed between
the on-chip and o-chip capacitance in
inverse proportion to their values. With
1 nF on-chip and 100 nF o-chip, 99
percent of the decoupling current will
ow through the o-chip capacitance.
At very high frequencies, the o-chip
current will be blocked by the equiva-
lent series inductance represented by
the IC package.
SUPPLY BOUNCE
Safeguarding effective function and
ensuring robust design of digital ICs
necessitate on-chip voltage bounce that
is equal, or less than, 10 percent of the
nominal supply voltage. In the instance
of nanometer CMOS designs, supply
bounce values of 5 percent or less are
recommended. In all these CMOS
designs, a 10, or even 20, times larger
decoupling capacitance embedded on-
chip is needed to compensate for the si-
multaneous switching capacitance on-
chip. Adhering to this design dictum, a
total on-chip capacitance of 1 nF means
that a maximum 100 pF of capacitances
(gateoxide + interconnect) should be
allowed to switch simultaneously. Tis
on-chip decoupling constraint applies
only to the cycle-to-cycle operation of
the digital CMOS design and does not
hold true for an instantaneous change
of its operating condition.
When the IC is supplied from an
external supply voltage regulator
module (VRM) or an external power
management unit (PMU), the response
rate of these regulators is typically
around several s for both the linear
and switching regulator versions. For
example, consider a digital CMOS IC
running with a 1-GHz clock and going
from an idle to an active state. In this
instance, the long-term average sup-
ply current goes up from A or mA
to amps. Essentially, a thousand clock
cycles have passed before the voltage
regulator reacts appropriately. An o-
chip decoupling or buer capacitor is
necessary to provide the amount of
charge (Q = lt = CV) needed to
keep the supply voltage within lim-
its during the response time of the
regulator.
For example, when 1 amp is required
over 1 s, 1 C of charge is required.
When the nominal supply voltage is 1.8
V, the delta voltage allowed is 180 mV.
Te buer capacitance value between
the IC to be decoupled and the voltage
regulator must be 6 F, or slightly more,
perhaps 8 F. With a 5 percent supply
voltage tolerance, the buffer capaci-
tance must be twice this value.
In synchronous single-frequency
digital CMOS designs, the peak current
is typically three to 10 times higher
than the average current. In this ex-
ample, the supply currents reach a peak
of three to ten amps. Te supply cur-
rent must diminish to zero before the
next clock edge, and all activity ceases
just before the next clock phase. Given
these constraints, the peak current
pulse width must be three to 10 times
shorter than the period width. With a
1-GHz clock, the gure should be 100
to 330 ps.
RESONANCES
Resonances are often observed between
o-chip decoupling capacitances. In
the case of electrolytic or small and
large value ceramic devices, resonances
also occur between the on-chip and
off-chip capacitances. Clearly, the
interference current produced by the
IC will be multiplied by the quality of
the resonant loop and will be radiated
by the larger loop area and ground
bounce voltage. Te on-chip/o-chip
resonance frequency is determined by
the smallest capacitance value in that
loop, typically the on-chip capacitance.
Tis on-chip capacitance (with the total
loop inductance) will determine the
resonance frequency.
www.ets-lindgren.com/services
Corporate Offices: USA + 1.512.531.6400 info@ets-lindgren.com Offices in the US, Finland, UK, France, Singapore, Japan, China, Taiwan
Boost Lab Productivity
TILE!
TM
Software Automates EMC Testing
with Drag & Drop Simplicity
Features:
Automates EMC Testing
-- Choose Ready-to-use Profiles for Testing to RE, CE and RI, CI Test Regulations
-- Design Custom Tests
Standard Compliant Test Methods
Vendor Compatible
-- 1500+ Drivers Available
Drag and Drop Microsoft Windows
TM
Interface
Field Proven in Hundreds of Installations
Used in Corporate Test Facilities and in Commercial Test Labs
ETS Boost lab.indd 1 2/28/2008 3:04:36 PM
178
With a leaded QFP package, the lead
length will be 4 mm, yielding an equiva-
lent total inductance of 8 nH. Tat total
along with an on-chip capacitance of 8
nF produces a resonance frequency of
about 20 MHz. Tis particular supply
system will not allow a supply recovery
faster than 17 ns, the time for the fastest
slew rate. When coupled (transmission)
lines are used between the on-chip
and o-chip decoupling position, the
inductance will be decimated.
Still, 1.7 ns will be too long for a
1-GHz clock operation. Te distance
or lead length must be shortened or an-
other decoupling technique should be
employede.g., integrating decoupling
capacitance in or on the package as is
done with most PC processors. In all
cases, resonances will occur between
the various decoupling positions, and
these resonances can be determined
using simple analog circuit simulators
such as SPICE.
When the activity within the IC
does not coincide with a resonance
of the supply decoupling circuitry,
few problems will occur. Unfortu-
nately, when it does coincide because
of a (sub-) harmonic of the clock and/or
data, interference may shoot sky high,
and the functionality of the IC may be
compromised. (Note: also the harmonic
frequencies are of importance.) When
such interference occurs within a par-
ticular data stream or data pattern, it
can be di cult to arrive at accurate
simulations or to detect the problem
within actual applications.
OFF-CHIP DECOUPLING
Te conventional wisdom for achiev-
ing a stable supply voltage is to place
the capacitors in close proximity and
to connect them to a PCB power plane
structure of nite length with a pro-
portionately lowered characteristic
transmission line impedance. Support
for this approach can be found in many
sectors of the industry.
With this conventional decoupling
technique, the impedance characteristic
on-chip will uctuate signicantly as a
result of frequency, the X-Y positioning
on the PCB, and the location of other de-
coupling capacitors (Figure 1). It should
be noted that resonances o-chip have
little eect on the internal voltage; but
at some frequencies, the noise o-chip
is greater than that on-chip.
Other techniques for assuring a
stable power supply involve the use of
an RF-lossy low-pass lter at each sup-
ply position to attain current conne-
ment. In eect, each IC supply node is
isolated from the rest of the PCB. Te
ltering is achieved using an RF-lossy
ferrite bead (e.g., R = 100 @ 100 MHz)
as well as the decoupling capacitors
mentioned earlier.
ROBUST DECOUPLING
Rather than focusing on the remaining
disturbance voltage and the decoupling
capacitors found o-chip, it would be
prudent to calculate the remaining
disturbance voltage on-chip and the
resulting ground bounce. Te o-chip
decoupling current should be kept low
and should not include any quality of the
resonance frequencies of the decoupling
capacitors used in parallel. Lowering the
series inductance to enhance recharging
will increase the resonance frequency.
RF-losses must be provided that will
counter the critical supply system
resonances. O-chip RF-lossy inductors
will block the instantaneous change of
supply current. Also, off-chip buffer
capacitance will be needed to maintain
the nominal supply voltage within its
tolerance, thus allowing the voltage
regulators to recoup the necessary volt-
age level. (cf. EMC-COMPO 2005)
CONCLUSIONS
Te IC decoupling schemes typically
1Meg 10Meg 100Meg 1G 10G
Frequency in Hertz
-120
-80.0
-40.0
0
40.0
P
lo
t1
123456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
32
33
34
35
36
37
38 39
40
41 42 43
44
45
47
48 49
50 51
52
53
54
55
56
57 58
59 61
62 46
60
Figure 1. Example of on-chip noise (green) vs. off-chip noise for a TLM BGA on a Eurocard PCB.
Figure 2. Example of on-chip noise (green) vs. off-chip noise for a leaded QFP on the same
Eurocard PCB.
1Meg 10Meg 100Meg 1G 10G
Frequency in Hertz
-140
-100
-60.0
-20.0
20.0
P
lo
t1
123456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62
COENEN
179
emc design & software
provided in application notes from various IC suppliers
are intended to assure the function of the IC in its ap-
plication. Tey do not, however, assure electromagnetic
compatibility.
Leaded packages such as a QFP function as a low-pass
lter, but they cause higher RF emissions at higher fre-
quencies (< 100 MHz). See Figure 2.
BGAs with TLM topology produce a greater level of
resonances at higher frequencies (> 100 MHz).
Creating an isolated power island on the PCB is vital
if interference is to be prevented from propagating
throughout the PCB.
Te decoupling measures taken o-chip have little ef-
fect on the on-chip supply bounce, but they can result in a
serious escalation of resonances with a typical quality fac-
tor of 10 when compared with actual, realistic decoupling
component values. O-chip decoupling, or buering, is a
necessity, particularly in instances in which the IC has time-
variant power consumption and active voltage regulators
are used. O-chip current paths can be conned using a
Kelvin contact approach (see Interference Technology 2007
Test & Design Guide).
BIBLIOGRAPHY
Kendall Castor-Perry and Tamar Schmitz, Prep for Surprises in Mod-
elling a Capacitor Bypass Network, EETimes Europe, Nov 19 and
December 9, 2007, pp 3435.
E. Engin ( Fraunhofer IZM, Berlin, Germany), M. Coenen, H. Koehne, G.
Sommer, and W. John, Tree-Pole Analysis Model to Predict SI and
EMC Eects, EMC-Compo 2002.
M. Coenen and R. Derikx, Vectorial Voltage Measurement for ICs on
Multi-IC PWB, EMC-Compo 2002.
M.J. Coenen and D. de Greef, Optimization Techniques for Minimizing
IR-drop and Supply Bounce, EMC-Compo 2005.
M. Coenen and R. de Jager, Standardization for EMC IC Modeling
EMC-Compo 2005
D. de Greef and M. Coenen, A Pre-Layout IR-Drop Estimator, EMC-
Compo 2007.
M. Coenen and D. de Greef, Optimal Techniques for Minimizing IR
Drop and Supply Bounce, Interference Technology EMC Test and
Design Guide 2007.
Mart Coenen, Enhancing Reliability and Reducing Cost by Taking
EMC Design Measures First Time Right, PACE, Eindhoven, the
Netherlands, 2007
Draft IEC 62433-2, Ed. 1: Models of Integrated Circuits for EMI Behav-
ioural Simulation ICEMCE, ICEM Conducted Emission Model.
C. Lochot and J.-L. Levant, ICEM: a new standard for EMC of IC denition
and examples, J.L. Levant, 2003 IEEE International Symposium on
Electromagnetic Compatibility, August 2003, Vol. 2, pp. 892897.
Nobuo Funabiki, Yohei Nomura, Jun Kawashima, Yuichiro Minamisawa,
Osami Wada, A LECCS Model Parameter Optimization Algorithm
for EMC Designs of IC/LSI systems, 17
th
Annual Zurich Symposium
on Electromagnetic Compatibility 2006, 27 February3 March 2006.
pp. 304307.
Hideki Osaka, Daisuke Tanaka, Osami Wada, Yoshitaka Toyota, and
Ryuji Koga, Linear Equivalent Circuit and Current Source for I/O
(LECCS-I/O) Modeling of IC Power Current for EMI Simulation, and
Linear Equivalent Circuit and Current Source for I/O (LECCS-I/O)
Modeling of IC Power Current for EMI Simulation, JIEP, Vol. 7, No.
6, September 2004, pp. 517524.
K. Ichikawa, M. Inagaki, Y. Sakurai, I. Iwase, M.Nagata, and O. Wada,
Simulation of integrated circuit immunity with LECCS model, 17
th
Annual Zurich Symposium on Electromagnetic Compatibility 2006,
27 February3 March 2006. pp. 308311.
Mart Coenen has over 28 years experience in EMC in various elds
and has published many papers and publications. He has been actively
involved in international EMC standardization since 1988 and last year
was awarded with the IEC 1906. He is the former project leader of the
standards: IEC 61000-4-6 and IEC 61000-4-2 but has moved his focus
towards EMC in integrated circuits. At present, he is convenor of IEC
TC47A/WG9 and until last year, a member of WG2.
In addition to his former career with Philips, he is co-founder of the Dutch
EMC/ESD Society and part-time lecturer of Post Academic EMC courses.
Aside from these activities, he owns a private EMC consulting company.
MORE ON OUR WEBSITE
Designing off-chip decoupling so that interference
is forced off-chip is just one challenge where todays
sophisticated EMC design software packages can help.
Visit the new InterferenceTechnology.com, and check
out the New Products Listings. And be sure to look for
special editions of the eNews focused on EMC Software.
180
emc design & software ANALYSI S OF A MOUNTED SMA CONNECTOR
A. CICCOMANCINI SCOGNA, PH. D
CST of America, Inc.
Framingham, MA
ABSTRACT
A
physically based method is used
for estimating the equivalent circuit
model of an SMA connector soldered
on the top plane of a multi-layer board and
connected to a single-end stripline. Starting
from the scattering parameters (S-parame-
ters) evaluated using a simulation software
package, the equivalent circuit is extracted
by modeling each part of the structure. Te
circuit is then validated by comparing the
outputs obtained via circuit-level simula-
tion of the extracted physical circuit with
those computed by means of the full wave
solution.
INTRODUCTION
At bit rates above one Gb/s, the eects of
board discontinuities on the integrity of the
signals cannot be ignored. For an accurate
design, the eects of parasitic, packaging,
board materials and trace geometries must
be characterized and quantied. An essen-
tial step in this process of characterization
is the measurement of the properties of the
board in terms of S-parameters, input im-
pedance, noise voltage, etc.
[1]

Microstrip and stripline structures
cannot be connected directly to the co-
axial ports of a network analyzer (NA). Te
structure or device-under-test (DUT) must
be physically connected to the NA by some
kind of transition network or xture. One of
the most frequently used xtures or connec-
tors for this kind of application is the surface
mounted assembly (SMA)
[2]
or simply the
SMA connector.
Te present paper proposes a Spice-like
equivalent circuit of an SMA. Each part
of the circuit is related to a single part of
the connector, and the values of the pas-
sive circuit elements are related to physical
properties and dimensions of the SMA. It is
worthwhile to note that the development of
an equivalent circuit for the SMA requires
less computational eort to achieve a solu-
tion, and its use eliminates the necessity of
performing repeated VNA calibrations
[37]

and/or de-embedding. In the next section,
the SMA and the analyzed PCB congura-
tion are described, and a physically-based
circuit is proposed. Then, a full-wave
software simulation
[8]
of the structure is
performed, and the computed S-parameters
are compared with those obtained by the
equivalent circuit. Finally, some conclusions
are addressed.
SMA SIMULATION MODEL
From an engineering point of view, the in-
teresting properties of an SMA connector
and the equivalent circuit used to predict
those properties are those of a SMA in use
and mounted on a boardnot simply an
isolated SMA. Consequently, the SMA con-
sidered in this article is one connected to a
short section of a stripline. Tis particular
SMA connector has a nominal impedance
of Z
SMA
= 50 , and its relevant dimen-
sions (taken from a commercial catalogue)
along with an illustration are represented
in Figure 1.
Signal integrity analysis and physically
based circuit extraction of a mounted
SMA connector
A proposed general approach is given for the defnition of an equivalent
circuit with SMAs mounted on boards in any generic stack-up.

Article 3 ag_08 large version.indd 180 5/6/2008 3:25:41 PM
CHANGING THE STANDARDS
h Need to get a solution fast without
slipping up on accuracy ? CST puts
EM simulation on
the fast track with
new software and
hardware technology
designed to t your
workow groove.
Solve your EMC/EMI
applications by performing 2D and
3D analyses with CSTs dedicated
software:
CST MICROWAVE STUDIO is the
market leading time domain tool for
3D EM simulation. CST PCB STUDIO
enables the simulation of entire board
systems, including PCB, cable and
Its the accuracy
that makes your ideas run faster.
connector. CST CABLE STUDIO lets you
analyze complex cable harnesses with
an unlimited number
of cables. Whatever
your application is, CST
has the technology to
cover them.
h Choose the accuracy
and speed offered by
CST STUDIO SUITE. Theres more to
EMC simulation than meets the eye.
CST STUDIO SUITE for EMC/EMI, signal and power integrity analysis.
CST COMPUTER SIMULATION TECHNOLOGY | www.cst.com | info@cst.com
Now even more choice
for EMC/EMI simulation
CST PCB STUDIO
CST CABLE STUDIO
CST MICROWAVE STUDIO
cst ITEM pcb cable 01 08 v5 indd1 1 29 01 2008 11:26:40
CST.indd 1 1/29/2008 12:56:09 PM
182
To characterize the electrical per-
formances and to obtain an equivalent
circuit of device behavior, a thorough
description is need. This SMA is
mounted on a multiple-layer board, and
its central conductor is soldered in a
through-hole via and is connected to a
2-cm long stripline (along the two inter-
nal reference planes), with characteris-
tic impedance o Z
c
= 50 . Four lateral
pins connect the external part of the
SMA with the two reference planes. In
the numerical electromagnetic model
of the SMA, the conductive parts of the
PCB are considered as copper (=5.8e7
depicts the surface current distribution
on the SMA connector, and it indicates
how it is concentrated on the inner
conductor pin, as well as around the
lateral grounding pins.
Particular attention should be paid
to excitation. Te two ports at which
the S-parameters are evaluated are
the upper surface of the SMA and the
end of the stripline. To ensure a TEM
structure of the electromagnetic eld
(essential condition for a meaningful
interpretation of the scattering ma-
trix), lumped voltage sources should
not be used because they would excite
higher order modes. Because of this
constraint, the TEM excitation has
been obtained by examining waveguide
ports that cause a TEM structure of the
eld at these planes. Simultaneously, it
is a perfect match for the line imped-
ance detected at the cross section.
EXTRACTION OF A PHYSICAL
BASED EQUIVALENT CIRCUIT
Te corresponding equivalent circuit
is illustrated in Figure 5. Te block la-
beled a) is a lossless transmission line
(TL) representing the upper external
part (vis--vis the board) of the SMA.
Its characteristic impedance Z
0
is Z
0
=
Z
SMA
and its ight time is calculated by
means of the following relation:

0
r
c
h
= TD
(1)
where
r
is the electric permittivity of the
dielectric lling the connector, h is the
height of the SMAs external part, and
c
0
the speed of light.
Te block labeled b) represents the
inductance of the central pin from the
top surface of the board to the stripline
pad. At this point, the electromagnetic
energy, in the form of voltage and cur-
rent waves, is split into two parts; one
ows along the stripline while the other
continues through the via hole that acts
as an open-end TL. Block c) represents
the inductance of the remaining part
of the via hole and its TL behavior.
Because there is no clear reference
conductor for this TL (vertically placed
in respect to the reference planes), the
characteristic impedance is taken equal
to the wave impedance
[9]
Figure 1. Real view of the SMA connector and 3D electromagnetic model.

Figure 2. Mesh view of the simulated electromagnetic model of SMA: hexahedral (time domain)
and tetrahedral mesh (frequency domain).
S/m). Te inner dielectric material of
the SMA is Teon (
r
= 2.2), and the
substrate dielectric is FR4 with
r
= 4
and tg=0.025 at 0.1 GHz.
To validate the code used for the
numerical simulation, time domain
(TD) and frequency domain (FD) are
used to solve the same model. Figure
2 illustrates the mesh used in the
numerical computation (hexahedral
and tetrahedral), and Figure 3 shows
the comparison of the calculated S-
parameters. Note that an excellent
agreement is observed over the entire
frequency range (010 GHz). Figure 4
SCOGNA
183

r 0
r 0
w

= Z (2)
in which
r
and
r
are the relative ef-
fective permittivity and permeability,
respectively, of the board dielectric.
Finally, the block d) represents the short
stripline with Z
0
= Z
c
(50 Ohm in this
case) and TD as in Equation (1) above.
Figure 6 shows the comparison be-
tween the S-parameters, in magnitude
and phase, obtained using software
with those obtained using circuit level
simulation. The agreement between
the results illustrates the robustness of
the proposed model. To obtain these
results, the inductances L
1
and L
2
in
Figure 5 are computed according to the
following expressions:
L
i
= L h
i
i = 1,2 (3)
where
L = 0.76 nH/m is in the range of the per-unit-length induc-
tance of the via [2], and h
i
is the length of the considered
portion of the via.
Finally, the eye diagram is calculated by using a pseudo
random bit sequence with the following parameters: T
bit
=
0.5 ns, t
r
= t
f
= 0.4 ns, V
high
= 1 V, V
low
= 0 V, and the result
is illustrated in Figure 7.
A dierent approach extracts a SPICE equivalent model
using the model order reduction (MOR) methodology, based
on macro modeling theory. Te technique is very accurate,
and it allows the preservation (or even enforcement) of
passivity. Figure 8 illustrates the comparative results ob-
tained using the 3D full wave simulation, the MOR, and the
Figure 5. Equivalent circuit model for the SMA connector.

Figure 3. Comparison between time domain
(TD) and frequency domain (FD): |S11| and
|S12|.
Figure 4. Surface current distribution at 5GHz.
184
SPICE equivalent model. Note how the results just about
overlap one another. Nevertheless, the trade-o is that the
H-SPICE net list generated by the MOR extraction is much
more complex as compared to the physical based model
extraction described in this article, and it is not gener-
ally as useful.
Equation (3) is crucial to the extension of the proposed
method to the extraction of circuit models of SMAs
mounted on boards with any type of stack-up design. As a
further example, the S-parameters of the SMA connector
are evaluated for the more complex stack-up conguration
represented in Figure 9. Te equivalent
circuit model is the same proposed in
Figure 2 with L
1
and L
2
calculated by
using Equation (3) above and TD time
equal to 7.9 ps for the block labeled (c).
Also, in this case agreement is excellent
over the over the entire frequency range
(Figure 10).
CONCLUSIONS
Tis work presents a physically based
equivalent circuit for a SMA connector.
Te global circuit is built using single
blocks corresponding directly to the ge-
ometry and physics of the device. Rules
are given to quantify the circuit elements
of each block, and a proposed general
Figure 6. Comparison between S-parameters computed by the full
wave analysis and those due to the equivalent circuit.
Figure 7. Eye diagram.
Figure 8. Comparison among S-parameters computed by means of 3D
full wave analysis (Orig), MOR extraction (MOR) and those due to the
equivalent SPICE circuit (SPICE). The frequency on the x-axis is in GHz.
SCOGNA
185
approach is given for the denition of
an equivalent circuit model with SMAs
mounted on boards in any generic
stack-up. Te results of a detailed full
wave analysis (validated by using two
dierent solvers) are used as tests of the
equivalent circuit and illustrate the reli-
ability and robustness of the latter.
REFERENCES
[1] S.H. Hall, G.W. Hall, and J.A. McCall, High-
Speed Digital System Design: A Handbook of
Interconnect Teory and Design Practises, John
Wiley & Sons, Inc., New York, USA, 2000.
MORE ON OUR WEBSITE
Figure 10. Comparison between S-parameters computed by CST MWS and by the equivalent
circuit (CST DS): a) S11 magnitude and phase, b) S21 magnitude and phase.
Figure 9. Cross section and stack-up of the test board.
[2] K.Naishadham, T. Durak Measurement-
Based Closed-Form Modeling of Surface-
Mounted RF Components, IEEE Trans.
Microwave Teory Tech., vol. 50, no. 10, pp.
22762286, October 2002.
[3] S. Pasha, M.Celik, A.C. Cangellaris, J.L.
Prince, Passive SPICE compatible models
of dispersive interconnects, in Proc. of 49
th

Electron. Comp. Technol. Conf., Tucson, AZ,
USA, June 1999.
[4] G.Antonini, SPICE compatible equivalent
circuits of rational approximation of fre-
quency domain responses submitted for
publication on IEEE Trans. on Electromagn.
Compat., 2002
[5] G.Antonini, A. Ciccomancini Scogna, A.
Orlandi, J.L. Drewniak, Full wave modeling
of via holes and equivalent circuit extrac-
tion for signal integrity analysis in Proc. of
EMC EUROPE 2002 Intern. Symp. on EMC,
September 913, Sorrento, Italy.
[6] V. Prevel, C. Lengoumbi, E cient RF analy-
sis in optical networks, Embedded Systems,
September 2002, www.embedded.com/
europe.
[7] E. Laermans, J. De Geest, D. De Zutter, F.
Olyslager, S. Sercu, D. Morlion, Modeling
complex via hole structures, IEEE Trans.
Adv. Packag., vol. 25, no. 2, May 2002, pp.
206214.
[8] CST STUDIO SUITE 2008, www.cst.com
[9] C.T.A. Johnk, Engineering Electromagnetic
Fields and Waves, 2
nd
ed., John Wiley & Sons,
New York, USA.
Antonio Ciccomancini Scogna, Ph.D.
received the PhD degree in Electrical Engineering
from University of LAquila, Italy. From March
05 to August 05 he was Postdoc with the UAq
EMC Lab (LAquila, Italy) working on EMC nu-
merical modeling and Signal Integrity analysis
in high-speed digital systems.
In 2004 he received the CST University Publi-
cation Award for the use of the Finite Integration
Technique in Signal Integrity applications. He
is the recipient of DesignCon nalist Best Paper
Award in 2007 and DesignCon Best Paper Award
in 2008. He is author of over 50 publications in
IEEE Transactions, Conference proceedings and
EDA magazines. He is member of IEEE, ACES
and EMC TC-9 and TC-10 Committees. Cur-
rently, he is senior application engineer at CST
of America.
(b)
(a)
Time-domain solvers, advanced
design environments, and
capabilities for solving multi-
disciplinary problemstodays
increasingly sophisticated EMC
design and analysis software
packages are transforming the
task of electronic design. Keep up
with the latest software releases
and updates. Visit the new
InterferenceTechnology.com, and
check out the New Products
Listings. And be sure to look for
special editions of the eNews
focused on EMC Software.
186
emc design & software FULL WAVE SI MUL ATI ON VALI DATI ON
BRUCE ARCHAMBEAULT, PH.D.
SAMUEL CONNOR
IBM
Research Triangle Park, NC
T
he need to validate simulations
and model results has never been
more vital. Full-wave and quasi-static
simulation tools using many dierent mod-
eling techniques are in common use for a
wide variety of EMI/EMC problems. Given
a particular model, software tools will pro-
vide an accurate result based on that input
or model. Unfortunately, there is no guar-
antee that the model was created properly,
that the essential physics of the problem
have been included, or that the results have
been interpreted properly. Some extra work
must be done to verify that the results are
correct for the intended simulation.
Tere is a sense by some that if a model-
ing tool has been validated in the past (with
measurements or some other technique),
then the user can trust all the results from
this tool in the future. Tis assumption is
extremely dangerous and should be avoided.
Some level of validation should be performed
on every group of models to make sure that
the geometry is correctly represented, that
the source in the model is realistic, and that
the results are in accord with the underlying
laws of physics. Tis article will discuss some
of the various techniques that can be used
to validate full wave simulations.
A number of papers on computational
modeling validation have been presented
at a wide variety of conferences in the past
few years.
[15]
Tis paper is a summary of the
various model validation techniques.
MODEL VALIDATION USING
MEASUREMENTS
Measurements are the most common way
to validate a simulation. In fact, when
performed carefully, measurements are an
ideal way to validate simulations. However,
measurements are not always accurate. Ex-
treme care must be used if simulations are
to be validated using measurements.
It is vital that the exact same measure-
ment conguration is used in the simula-
tion. Care must be taken to include mea-
surement limitations in the model. If direct
probing methods are used to measure/
model printed circuit board eects, then
the loading imposed by the test equipment
(typically 50 ohms) must be included in the
simulation, or the results are not likely to
agree. If radiated emissions are to be used
for validation, then the ground-reference in
the test site, the movement of the antenna
from one to four meters above the ground-
reference plane (for commercial EMC test-
ing), must be included. Another important
consideration is the physical antenna used
for the measurement. Tis antenna will
have an antenna factor that varies with
frequency and will have signicant direc-
tionality as well. Typically, modeling tools
have perfect isotropic antennas, which
may measure elds approaching from direct
directions much dierently than the real-
world antenna would.
Another aspect of model validation
by measurement is the accuracy of the
measurement itself. While most engineers
take great comfort in data from measure-
ments, the repeatability of radiated emis-
sions measurements in a commercial EMI/
The importance and methods of full wave
simulation validation
Regardless of the accuracy of the modeling tool, each modeling exercise
requires some level of validation before simulation results can be trusted.

EMSSA.indd 1 3/31/2008 4:49:47 PM
188
EMC test laboratory is unreliable. Te
differences between measurements
taken at different test laboratories,
or even within the same test labora-
tory on dierent days, can easily be as
high as 6 dB. Te poor measurement
accuracy (or repeatability) is due to
measurement equipment, antenna
factors, site-measurement reection
errors, and cable movement optimiza-
tion. Often, data from military EMI/
EMC laboratories with a plain shielded
room test environment are considered
to have a much higher measurement
uncertainty.
The test environments repeat-
ability, accuracy, and measurement
uncertainty must be included when
evaluating a numerical models result
against a measurement. Te agreement
between the modeled data and the
measurement data can be no better
than the test laboratorys uncertainty.
If measurement data disagree with
modeled data, some consideration
should be given to the possibility that
the measurement was incorrect and
the model data correct. Therefore,
it is essential to avoid measurement
bias and to consider both results as
correct equally. When two dierent
techniques provide dierent results,
all that can be logically known is that
one of them, or possibly both of them,
is wrong.
These caveats do not mean that
measurements should never be used
for simulation validation. Measure-
ments are especially useful when the
test environment is well controlled
and repeatable. For example, testing
printed circuit boards that have con-
nectors (BNC, SMA, etc.) mounted
on the board, and using a network
analyzer for the measurements, will
provide very repeatable results. As
long as the model includes the eects
of the source and load impedance
that the network analyzer adds to the
measurement, the comparison of the
modeled and measured results will
be valid.
MULTIPLE SIMULATION
TECHNIQUES
Another popular approach to validating
simulation results is to model the same
problem using two dierent modeling
techniques. If the physics of the problem
are correctly modeled with both simula-
tion techniques, then the results should
agree. Achieving agreement from more
than one simulation technique for the
same problem can add condence to the
validity of the results.
There are a variety of full-wave
si mul ation techniques. Each has
strengths, and each has weaknesses.
Care must be taken to use the ap-
propri ate si mul ation techniques
and to make sure they are different
enough from one another to make
the comparison valid. Comparing a
volume-based simulation technique
(i . e., FDTD, FEM, TLM) wit h a
surface-based technique (i.e., MoM,
PEEC) is preferred because the es-
sential nature of the techniques are
so very different. While this approach
means that more than one modeling
tool is required, the value of having
confidence in the simulation results
more than justifies the cost of many
vendor software tools.
Given the very nature of full-wave
simulation tools, structure-based reso-
nances often occur. Tese resonances
have a considerable impact on the
validity of the simulation results. Most
often, the simulations of real-world
problems are subdivided into small
portions because of memory and mod-
el complexity constraints. Tese small
models will have resonant frequencies
that are based on their arbitrary size
and will bear no real relationship to
the actual full product. Results based
on these resonances are often mis-
leading, since the resonance is not
due to the eect under study. Rather,
it is due to the size of the subdivided
model. When evaluating a model s
validity using multiple techniques,
care must be taken to make sure that
these resonances are not confusing the
real data. Some techniques, such as
FDTD, can simulate innite planes.
*

Other techniques allow innite image
planes, etc.
INTERMEDIATE RESULTS
Computational modeling provides a
tremendous advantage over measure-
ments since physical parameters may
be viewed in the computational model
although they could never be physi-
cally viewed in the real world. Electric
elds, magnetic elds, and RF currents
on a surface can all be viewed within
the computational model, although
direct measurement in the laboratory
may be di cult.
These parameters are used as an
intermediate result within the com-
putational model, and can be very
useful to help establish that the mod-
el has performed correctly. While the
final far-field result may be the goal
of the simulation, the intermediate
results should be examined to ensure
that the model is operating as theory,
experience, and intuition require.
One intermediate result that is
very useful is the steady-state cur-
rent at various frequencies. Thi s
current can be observed when using
integral equation based techniques
like MoM and PEEC. The currents
should be examined to insure that
the amplitude of the current does
not vary significantly between ad-
jacent cells. The current must go to
zero at the ends of thin wires (like a
dipole). Also, the currents must flow
in the proper direction. All these
considerations require the user to
examine the intermediate results
for reasonableness. If the results do
not make sense in terms of physics
and electromagnetics, then further
examination is required.
Another useful intermediate result
is the animation of the fields, volt-
ages, or currents in a time domain
si mulation (FDTD, PEEC, TLM).
Observing these quantities versus
time can be very helpful, not only for
understanding the effects of various
parts of the model, but also to assure
that the results make sense. Again, an
understanding of basic physics and
electromagnetics is required. Metal
shields should block emissions, cur-
rents should f low as expected, and
voltages should propagate along PC
boards as expected.
* Some FDTD tools allow metal plates to
be placed against the absorbing boundary
region, resulting in an apparent infinite
plane.
ARCHAMBEAULT
189
CHANGING THE STANDARDS
CST COMPUTER SIMULATION TECHNOLOGY | www.cst.com/microstripes | info@cst.com
MICROSTRIPES
MICROSTRIPES and FLO|EMC united:
available from CST
EMC analysis tools improve productivity
and support electromagnetic compliance
STANDARD PROBLEMS
A number of Standard Validation prob-
lems have been proposed over recent
years
[610]
to assist engineers who wish
to evaluate the various vendor model-
ing tools against specic problems that
are similar to the types of problems that
they intend to simulate. A wide variety
of problems has been developed, and
they are available on the IEEE/EMC
Societys modeling website. Validation
problems for printed circuit board
problems, antenna-li ke problems,
shielding problems, and benchmark
problems, etc. have been specied and
can be used to validate both modeling
tools and individual models if they are
similar to the standard. Results for most
of the standard modeling problems
have been published, and they can be
used directly for comparison with a
new models results.
CONVERGENCE
Tere are a number of model param-
eters that must be decided before the
actual simulation can be performed.
Te size of the grids/cells is often set
to lambda/10 to satisfy the assump-
tion that the currents/fields do not
vary within each grid/cell. However,
this size may not be small enough to
capture the currents/elds accurately
if the amplitude of the currents/elds
varies rapidly on the structure. Chang-
ing the size of the grid/cell is a good
way to insure that the proper size has
been used. If the results change when
the grid/cell size is changed, then the
correct size was not used. Once the
grid/cell size is correct, the nal results
from the simulation will not change.
With some simulation techniques
such as FEM, another convergence
check is important. Varying the size of
the computational domain assures that
there are no spurious responses and
that absorbing boundary mesh trunca-
tion eects will not interact with the
physical model. Again, the nal result
should not be dependent on the size of
the computational domain or the dis-
tance between the absorbing bound-
ary mesh truncation and the physical
model. If the results are seen to change
as these parameters are changed, the
model must be modied and re-run
until these parameters do not aect the
nal result of the simulation.
One important consideration when
using grid/cell size convergence or
computational domain size conver-
gence is the amount of computer ran-
dom access memory (RAM) required
to run the simulation. Often, models
are created that require most of the
RAM available, and modifying the
model for convergence testing may
require more RAM than is available.
Tis does not eliminate the need to
validate the model. If convergence
testing is not possible due to limited
RAM, then a dierent validation ap-
proach must be used.
KNOWN QUANTITIES
Under some ci rcumstances, it i s
possible to use known quantities to
190
validate a model. For example, the
radiation pattern of a half-wave di-
pole is a well known quantity; and if
the model is similar to a half-wave
dipole, then a dipole pattern simula-
tion may help increase condence in
the simulation results from the pri-
mary model. Another example involves
shielding eectiveness simulations. A
six-sided completely-enclosed metal
enclosure should have no emissions
when a source is placed inside the
enclosure. However, depending on
the implementation, some simulation
techniques, such as the Method of Mo-
ments (MoM) and most scattered eld
formulation techniques will show an
external eld even from a completely
enclosed metal box.
PARAMETER VARIATION
Within a model, there are usually a
number of parameters that are critical
to the models results. Size of apertures,
number of apertures, and component
placement on PCBs can vary the nal re-
sult of the simulation. In many cases, the
eect of changing a parameter can be
predicted from experience, even though
the actual amount of variation may not
be known in advance. In this example,
the size of the aperture can be increased,
and the shielding eectiveness for the
dierent aperture sizes examined for
reasonableness. Also, resonant fre-
quencies for the aperture can be seen
to vary as the size of the aperture varies,
providing another opportunity to check
the results from the simulation.
Original Data for FSV Example #1
-80
-70
-60
-50
-40
-30
-20
-10
0
0.0E+00 2.0E+08 4.0E+08 6.0E+08 8.0E+08 1.0E+09 1.2E+09 1.4E+09 1.6E+09 1.8E+09 2.0E+09
Frequency (Hz)
S
2
1

(
d
B
)
data set #1
data set #2
Figure 1. Example #1 data sets for comparison.
Grade Grade Range Spread Spread Range
ADM 3 Excellent-Good 3 Excellent-Good
FDM 4 Excellent-Fair 4 Excellent-Fair
GDM 4 Excellent-Fair 4 Excellent-Fair

Original Data for FSV Example #2
-1.0E+02
-9.0E+01
-8.0E+01
-7.0E+01
-6.0E+01
-5.0E+01
-4.0E+01
-3.0E+01
-2.0E+01
-1.0E+01
0.0E+00
0.0E+00 2.0E+08 4.0E+08 6.0E+08 8.0E+08 1.0E+09 1.2E+09 1.4E+09 1.6E+09 1.8E+09 2.0E+09
Frequency (Hz)
S
2
1

(
d
B
)
data set #3
data set #4
Figure 2a. ADM Histogram for Example #1.
Figure 2b. FDM Histogram for Example #1.
Figure 2c. GDM Histogram for Example #1.
Table 1. GRADE and SPREAD for Example #1.
Figure 3. Example #2 Data sets for comparison.
Introducing The
Conducted Immunity Test System
And Its Closest Competition.
The new CI self-contained Conducted Immunity Test Systems from AR stand alone. No competing products even come close. Not when it comes to
ease of use, flexibility, reliability, or any other features that really matter. Among the features that set the CI Systems apart are a higher level of accuracy, a
wider sensitivity range, excellent speed, and the ability to do accurate margin testing. The CI Systems make it easy to conduct customized tests; and reports
are generated directly into Microsoft
Word or Excel.
AR Components Can Be Used Independently
Of course, its the AR components that make these systems so accurate and reliable. The AR amplifier and signal generator are state-of-the-art
equipment. And you can use them independently, apart from the system. So when you purchase a CI System you also get a stand-alone AR amplifier and
signal generator! Talk about value!
Two CI Systems are currently available and more are on the way:
Model CI00250 (75 watt, 10 kHz 250 MHz) Provides complete testing solutions to the following standards: EN/IEC 61000-4-6,
IEC 60601-1-2, EN 50130-4, EN 61000-6-1/2, and EN 55024.
The CI00400 (100 watt, 10 kHz 400 MHz) Designed to test to MIL-STD-461D & E CS114, DO160D & E, EN/IEC 61000-4-6,
IEC 60601-1-2, EN 50130-4, EN 61000-6-1/2, and EN 55024 standards.
AR supplies a multitude of unique RF solutions to some of the best-known companies worldwide. Our products are backed by the strongest, most
comprehensive warranty in the industry, and a global support network thats second to none.
One of two CI Systems from AR.
All competing conducted
immunity test systems that even come close.
ISO 9001:2000
Certified
AR CITS.indd 1 4/2/2008 4:34:32 PM
192
HOW WELL DO THE
SIMULATION AND VALIDATION
AGREE?
Once the simulation results have been
validated and there are multiple plots
to compare, the question becomes
just how well do those plots agree.
Obviously, if the plots overlap com-
pletely, the agreement is very good.
However, this is seldom the case, and
some comparison methods are needed
to quantify the agreement.
Experts will be able to take a quick
look at such comparisons and to make
informed judgments based on years of
experience. However, when engineers/
students have less experience, a tech-
nique is needed that approximates the
judgment calls based on such experi-
ence and expertise. Simple subtraction
of the two plots is not usually su cient
since resonances may vary slightly in
frequency or amplitude causing large
dierences when subtracting, but ac-
tually causing little dierence in the
simulations.
The Feature Selective Validation
(FSV) technique
[1, 11, 12, 13]
has been
developed to mimic the experts and
to allow the computer to compare
results and to provide a measure-
of-goodness. The FSV technique
uses a combination of the Amplitude
Dierence Measure (ADM) and the
Feature Dierence Measure (FDM) to
provide the measure of the agreement
between two data sets. Te ADM gives
an indication of how well the overall
amplitude of the two data sets agrees,
and the FDM provides an indication of
how well the rapidly changing features
of the two data sets agree. If desired,
the ADM and FDM can be combined
to give the Global Dierence Measure
(GDM).
There are a number of different
ways the FSV information can be
used. The ADM, FDM, and GDM can
provide a point-by-point indication of
the agreement as well as an overall
average result. Instead of an average
agreement factor, the FSV can also
provide an overall indication of how
many data points agree in a histogram
fashion. Figure 1 shows an example
of two data sets plotted in the same
graph. At first glance, most engineers
would feel the two data sets agree
pretty well. Figures 2a, 2b, and 2c
show the confidence histogram for
the ADM, FDM and GDM, respec-
tively. The ADM histogram in Figure
2a indicates that approximately 55%
of the data poi nts have excel lent
agreement, and another 20% have very
good agreement. Similar judgments
are made for the FDM and GDM.
Typically, a threshold of 85% is
used to provide an overall GRADE
indication of the agreement. In other
Grade Grade Range Spread Spread Range
ADM 3 Excellent-Good 3 Excellent-Good
FDM 4 Excellent-Fair 4 Excellent-Fair
GDM 4 Excellent-Fair 4 Excellent-Fair
words, how much of the agreement is
required before 85% is reached. Using
the ADM in Figure 2a as example, note
that for an 85% condence, the agree-
ment is Excellent-to-Good, resulting
in a GRADE of 3. Te GRADE indi-
cates how many agreement categories
are required before the 85% point is
reached.
It is also often useful to see how
widely distributed the agreement is
between two data points. For example,
it is possible to have two data sets that
agree only fairly well (GRADE = 4).
Still, that numerical designation could
indicate an agreement either spread
over all the categories from excellent to
fair or one in which all the data sets fell
into the fair category. Appropriately
enough, the SPREAD indicates the
distributionjust how far the catego-
ries underlying the GRADE are spread
apart. The SPREAD starts with the
highest category in the histogram (not
necessarily the Excellent category) and
determines how many categories are
required to reach the 85% level. For the
ADM in Figure 2a, the SPREAD equals
three. Table 1 shows the GRADE and
SPREAD for the ADM, FDM, and
GDM for this set of data.
Another example is provided in
Figure 3. In this example, the data sets
do not agree as well as the example in
Figure 1. Figures 4a, 4b, and 4c show
the agreement for the ADM, FDM,
GDM, respectively, and Table 2 shows
the GRADE and SPREAD for this
example.
While there is a lot of information
that can be derived from the FSV
method, at a minimum, the GRADE
and SPREAD should be used whenever
comparing two sets of data. It is most
often used to compare simulation and
validation results, but two sets of mea-
sured results can also be compared
using the FSV (for example, when
comparing EMC emissions test results
from two dierent laboratories).
Table 2. GRADE and SPREAD for Example #2.
Figure 4c. GDM Histogram for Example #2.
Figure 4b. FDM Histogram for Example #2.
Figure 4a. ADM Histogram for Example #2.
ARCHAMBEAULT
193
SUMMARY
It is never enough to simply believe a model has created
the correct answers; engineers must be able to prove it by
validating the model. Simulation is usually performed on
a computer, and the old adage Garbage In, Garbage Out
(GIGO) still applies. Engineers should validate their mod-
els to ensure the models correctness and to gain insight
into the basic physics behind the model. Models can be
validated by a variety of techniques. Te best technique
for validating a specic model depends on a number of
parameters and should be decided on a case-by-case basis.
Measurements can be used to validate modeling results,
but extreme care must be used to ensure that the model
correctly simulates the measured situation. Omitting feed
cables, shielding or ground reections, or dierent mea-
surement scan areas can alter the results dramatically. An
inexact model result might be indicated when, in fact, the
measured and modeled results are obtained for dierent
situations and should not be directly compared.
Multiple simulation techniques applied to the same
model is a good way to insure that the correct physics are
included in the model and that the appropriate physics
are modeled correctly. Care is needed to insure that the
modeling techniques are dierent enough to insure that a
meaningful comparison is made. Intermediate results can
also be used to help increase the condence in a model.
Using the RF current distribution in a MoM model, or the
animation in an FDTD model, can help ensure the nal
results are correct by determining the accuracy of the
intermediate results. Tese intermediate results have the
added benet of increasing the engineers understanding
of the underlying causes and eects of the overall problem.
Tere are a number of other possible validation techniques,
including using known quantities, model parameter
variation, etc. Choosing among the various validation
possibilities depends on the exact model and the goal of
the simulation.
An indication of how well the simulation and valida-
tion results agree is available with the FSV technique. At a
minimum the GRADE and SPREAD provide a simple and
quick indication of the quality of the agreement between
data sets. Ultimately, engineers need to understand the
physics of the problem at-hand and must verify that the
results obtained are correct. Regardless of the accuracy
of the modeling tool for other models, each modeling
exercise must have some level of validation before the
simulation results can be trusted. While every model
does not require validation, each group of models or each
series of models for similar problems should have some
level of validation.
REFERENCES
[1] A. Duy, D. Coleby, A. Martin, M. Woolfson, T. Benson, Progress
in quantifying validation data, IEEE International Symposium on
EMC, Boston, Aug 1822 2003, pp. 32328.
[2] Andrew Drozd, Progress on the development of standards and
recommended practices for CEM computer modeling and code
validation, IEEE International Symposium on EMC, Boston, Aug
1822, 2003, pp. 313316
[3] B. Archambeault, Concerns and approaches for accurate EMC simu-
lation validation, IEEE International Symposium on EMC, Boston,
Aug 1822, 2003, pp. 329334.
[4] H.-D. Bruns, H.L. Singer, Validation of MoM Simulation results,
IEEE International Symposium on EMC, Boston, Aug 1822, 2003,
pp. 317322.
[5] M.A. Cracraft, X. Ye, C. Wang, S. Chandra, J.L. Drewniak, Modeling
issures for full-wave numerical EMI simulation, IEEE International
Symposium on EMC, Boston, Aug 1822, 2003, pp. 335340.
[6] B. Archambeault, S. Pratapneni, L. Zhang, D.C. Wittwer, Compari-
son of various numerical modeling tools against a standard problem
concerning heat sink emissions, IEEE International Symposium on
EMC, Montreal, Aug. 1317, 2001, Vol. II, pp. 13411346.
[7] B. Archambeault, S. Pratapneni, L. Zhang, D.C. Wittwer, J. Chen, A
proposed set of specic standard EMC problems to help engineers
evaluate EMC modeling tools, IEEE International Symposium on
EMC, Montreal, Aug. 1317, 2001, Vol. II, pp. 13351340.
[8] J. Yun, B. Archambeault, T.H. Hubing, Applying the method of
moments and the partial element equivalent circuit modeling tech-
niques to a special challenge problem of a PC board with long wires
attached, IEEE International Symposium on EMC, Montreal, Aug.
1317, 2001, Vol. II. pp. 13221326.
[9] H. Wang, B. Archambeault, T.H. Hubing, Challenge problem update:
PEEC and MOM analysis of a PC board with long wires attached,
IEEE International Symposium on EMC, Montreal, Aug. 1317, 2001,
194
Vol II, pp. 811814.
[10] B. Archambeault, A. Ruehli, Introduction
to 2001 special challenging EMC modeling
problems, IEEE International Symposium
on EMC, Montreal, Aug. 1317, 2001, Vol.
II, pp. 799804.
[11] B. Archambeault, A. Roden, O. Ramahi, Us-
ing PEEC and FDTD to solve the challenge
delay line problem, IEEE International
Symposium on EMC, Montreal, Aug. 1317,
2001, Vol II, pp. 827832, Vol.2.
MORE ON OUR WEBSITE
An ever-growing number of software
packages facilitate EMC design and
provide accurate modeling of EMC
issues. Look for a comprehensive list of
EMC software providers in the Prod-
ucts and Services section of the new
InterferenceTechnology.com, and be
sure to check out special issues of Inter-
ference Technology eNews that feature
a special focus on EMC software.
See whats in the new Antennas channel today.
information in the way you need it. If Antennas
Aerospace EMC
Military EMC
Telecom / NEBS
Automotive EMC
Amplifiers
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Ant ennas
[12] General FSV information http://www.eng.
dmu.ac.uk/FSVweb/
[13] Free FSV tool download site http://ing.uni-
vaq.it/uaqemc/public_html/FSV_2_0
Bruce Archambeault is an IBM Distin-
guished Engineer at IBM in Research Triangle
Park, NC. He received his B.S.E.E degree from
the University of New Hampshire in 1977 and his
M.S.E.E degree from Northeastern University in
1981. He received his Ph. D. from the University
of New Hampshire in 1997. His doctoral research
was in the area of computational electromagnet-
ics applied to real-world EMC problems.
In 1981 he joined Digital Equipment Cor-
poration and through 1994 he had assignments
ranging from EMC/TEMPEST product design
and testing to developing computational electro-
magnetic EMC-related software tools. In 1994
he joined SETH Corporation where he contin-
ued to develop computational electromagnetic
EMC-related software tools and used them as a
consulting engineer in a variety of dierent in-
dustries. In 1997 he joined IBM in Raleigh, N.C.
where he is the lead EMC engineer, responsible
for EMC tool development and use on a variety of
products. During his career in the U.S. Air Force,
he was responsible for in-house communications
security and TEMPEST/EMC related research
and development projects.
Dr. Archambeault has authored or co-
authored a number of papers in computational
electromagnetics, mostly applied to real-world
EMC applications. He is currently a member of
the Board of Directors for the IEEE EMC Soci-
ety and a past Board of Directors member for
the Applied Computational Electromagnetics
Society (ACES). He has served as a past IEEE/
EMCS Distinguished Lecturer and Associate
Editor for the IEEE Transactions on Electromag-
netic Compatibility. He is the author of the book
PCB Design for Real-World EMI Control and
the lead author of the book titled EMI/EMC
Computational Modeling Handbook.
Samuel Connor received his BSEE from the
University of Notre Dame in 1994. He currently
works at IBM in Research Triangle Park, NC,
where he is a senior engineer responsible for
the development of EMC and SI analysis tools/
applications.
Mr. Connor has co-authored several papers
in computational electromagnetics, mostly
applied to high-speed signalling issues in PCB
designs.
ERI K J. BORGSTROM
195
Continued from page 56
THE LATEST FROM SC-135:
From the most recent (March, 2008) meeting of SC-135,
here is a sampling of some possible changes to look for in
the future:
A Users Guide appendix (informative only) will be
added to many of the sections of DO-160.
Section 16 will have even more tests and power types.
Section 20 is to have mode-stirring re-introduced as an
option for the reverberation chamber test method.
Section 21 will be revised to include special limits and
procedures to address protection of onboard GPS receiv-
ers used for navigation.
Section 25 will be revised to add more test levels steps,
contract discharge, and indirect discharge testing.
Tese revisions, and more, are proposed for inclusion
in the new DO-160G, which is slated for publication in
December 2010.
SUMMARY
RTCA/DO-160, and its European twin, EUROCAE/ED-14,
are truly the world standards for electromagnetic compat-
ibility requirements for aircraft electronic equipment. Te
test levels, requirements, and procedures are intended to
reect the state-of-the-art in aviation technology and
EMC testing methodology. Since both aviation technology
and EMC testing methodology are evolving at a rapid rate,
work is continuing on the next revision RTCA/DO-160.
REFERENCES
1. RTCA/DO-160E, Environmental Conditions and Test Procedures
for Airborne Equipment, RTCA, Inc., December 9, 2004.
2. RTCA/DO-160D, Environmental Conditions and Test Procedures
for Airborne Equipment, RTCA, Inc., July 29, 1997.
3. MIL-STD-461F, Requirements for the Control of Electromagnetic
Interference Characteristics of Subsystems and Equipment, Dept.
of Defense Interface Standard, 10 December 2007.
Erik Borgstrom has worked in the EMC testing eld for more than 21 years.
He currently holds the position of EMC Operations Manager for Environ Labo-
ratories LLC and specializes in the EMC testing requirements for the Defense
and Aerospace industries. Mr. Borgstrom is an active member of the IEEE,
and he serves as the IEEE EMC Societys liaison to RTCA as a member of the
Standards Advisory and Communication Committee. Mr. Borgstrom is also
active on SAE Committees AE-2 and AE-4 (HIRF), and is Environs representa-
tive to RTCA, where he is an active member of RTCA Special Committee 135,
serving as Change Coordinator for Section 25 (ESD) of DO-160.
EMC, RADIO, TELECOM
ENVIRONMENT, SAFETY
EMCC
DR. RAEK
ALL
AIRCRAFT
& SPACECRAFT
EMC, EMP, HERF TESTS
TM
RTCA, MIL-1757, AIRBUS, BOEING, EFA, SAE...
* all HERF TESTS * all MIL- 461 TESTS
* LEMP-EFA 1 * LEMP-DO-160-DSW
* LEMP-EFA 2 * LEMP-DO-160-SW
* LEMP-136 * LEMP-DO-160-LW
* NEMP-EFA-1 * LEMP-IEC-DSW
all MULTIPLE BURST & MULTIPLE STROKE
HERF more than 20 000 V/m
CW more than 1 000 V/m
All EMP Generators for Sale
EMCC DR. RAEK
Moggast, Boelwiese 4-8 91320 Ebermannstadt
Germany
T: + 49 - 91 94 - 90 16 F: + 49 - 91 94 - 81 25
partner@emcc.de www.emcc.de
Not
a P
a G
a P
a E
a P
FCCPa
Marin
MILST
South
Medic
Autom
Justaf
Tofindo
pl
AcmeTes
P.O.Box
Acme,WA
188822
justanother
R
ProperSelection
GeneratingReal
Performingina
EMCProblem
ProvidingSuper
EMCCom
art15B/ICICES00
neEquip:IEC/EN6
TD461A/B/C/D/E
Korea(Republico
calDevices:IEC/EN
motiveEMCDirect
fewofthe150+
utmoreabout
leasevisitusa
stingCompany
3,2002Valley
A982200003
63837,www.
AccreditedE
RealHelp:
nofApplicableT
listic&Affordab
TechnicallyCom
MitigationAssis
iorQualityTest
plianceTesti
03 CE
0945 BS
E/F AS
of) Te
N6060112VC
tive RT
accreditedEMC
thowAcmeTe
t:www.acmet
y
Highway,
acmetesting.co
EMCTestLab
TestStandards
bleTestPlans
mpetentManner
stancebyExpert
Reports
ng:
EMark(EMCDirec
SMI(TaiwanR.O.C
S/NZS
elcordiaGR1089
CCI(Japan)
TCADO160D/E
CTestswecando
stingcanhelp
testing.com
om
b
r
ts
ctive)
C.)
CORE
o!
you,
MORE ON OUR WEBSITE
Changing avionics standards are just one facet of the
ever-evolving and seemingly more stringent challenges of
meeting demanding international standards for EMC. Stay
informed by checking the Standards Update section of
the new InterferenceTechnology.com, and look for standards
news in each edition of Interference Technology eNews.
Article 18 ag_08.indd Sec1:195 5/6/2008 12:34:53 PM
196
emc design & software SOF T WARE SI MUL ATI ON
DIRK MLLER
FlowCAD
Munich, GERMANY
U
ltimately, electromagnetic com-
patibility can be validated only in
the measurement chamber with
existing prototypes. Tose tests are time
consuming and expensive. Tere are vari-
ous ideas for cutting the costs of testing
with early software simulations during
the design process. Still, EMC is complex
discipline and carrying out a complete 3D
simulation for an entire complex board, in
an acceptable timeframe, is presently very
di cult. Because of this di culty, experts
concentrate on simulating only critical areas
of the board, such as power and ground sys-
tems or single critical nets to determine the
cause of radiation (emission) and irradiation
(susceptibility).Te knowledge gained from
those analyses nds its way into design rules
given to PCB designers.
With a recently developed simulation
software package, the user can view com-
pletely routed layout designs from most
popular PCB layout tools. During a layout
review, various design rules for all layers,
nets, or traces are checked. Imports of layout
data of the following PCB layout tool sup-
pliers are available: Altium, Cadence, Men-
tor, OrCAD and Zuken. Tis package was
developed jointly by experts from a simula-
tion software company and a well know IT
industry giant. One contributed knowledge
for interfacing with the various PCB layout
tools while the latter drew on decades of
expertise in creating and verifying EMC/SI
rules. Over the years, company experts had
examined EMC issues using sophisticated
measurement techniques on a variety of
designs, eventually creating general valid
design rules. Critical designs were checked
against those design rules, and the results
were thoroughly veried by measurements.
Te nal product of this collaboration was
a software tool that recognizes the main
contributors to frequent electromagnetic
perturbations.
Tis general purpose software does not
require an expert on EMC. It puts the PCB
designer in a position to check his designs
for EMC compliance. In turn, the design sta
member doing the layout is provided a list
with a detailed description and a possible
scenario for xing any EM problem. Te
integrated viewer shows the exact location
of the violation within the design. In fact, a
major focus in developing this package was
to give users without specialized knowledge
the ability to locate EMC violations easily
and early in the design cycle, thus minimiz-
ing costly measurements and redesigns.
RULE BASED CHECKS
Emission or coupling is caused by viola-
tions of certain geometrical rules. For
example, consider the return current path
of the design. Each signal has a path preset
by the signal traces, but there is always a
return pathoften on power and ground
layers. Te return current always prefers
the route of least resistance; and at higher
frequencies, this will be the route of lowest
impedance. Te new software determines
where the return path is discontinued. For
Software simulation boosts the eff cacy of
PCB design
Adding an effective package to the design cycle can pinpoint areas critical to
EMC compliance.

MLLER
197
example, the path might stop because of
a split plane. If the return path cannot
follow the signal path geometrically,
the return current will use a dierent
path. Depending on the size of the area
surrounding the detour of the return
current, an antenna may occur radiat-
ing or receiving interference, resulting
in failure to achieve EMC compliance
or possible design malfunctions. Tis
software tool recognizes if such dis-
continuities of copper areas at power
supply layers are connected by one or
more capacitors for high frequencies
(Figure 1). Tose capacitors will create
a path with low impedances for the
return current, avoiding undesirable
return paths.
Another rule searches for nets that
change signal layer and reference plane
for the return current. Little radia-
tion occurs if the signal traces change
SimLab Software GmbH | www.simlab-emc.com | info@simlab.de
Found it? Solved it!
SI, PI and EMC solutions from SimLab
Dont waste time; locate
the source of your problem.
Use EMBoardCheck, an
SI, PI and EMC rule checker
which comes
with pre-
dened EMC
rules devel-
oped and
veried by IBM experts.
After importing PCB layout
data from major layout
tools, simply customize
the EMC rules, start the
rule check and view the
violations within minutes.
But the design process
dont stop with locating the
issues. With PCBMod you
can analyse real
word conducted
emissions:
simulate entire
board systems,
including PCB, cable and
connector.
Find your answers to EMC
issues with SimLab soft-
ware solutions.
EMBoardCheck
PCBMod
Figure 1. An EMC error caused by a capacitor that is too far away from the signal to bridge the
split plane.
The return current
always prefers
the route of least
resistance; and at
higher frequencies,
this will be the route of
lowest impedance.
198
emc design & software SOF T WARE SI MUL ATI ON
only from above the reference plane
to directly below it. In this case, the
return current could continue to ow
in the same plane. If signal layers and
the reference plane change simultane-
ously, the return current paths must
be secured (Figure 2). With capacitors
close to the via, one must avoid the
return currents that create unwanted
routes and result in a loop. Tis soft-
ware design rule must recognize and
allow for a layer change in the area of
escape-vias below a BGA because the
return current does not ow via the
capacitor but through the BGA. If this
rule is violated, the via where changing
layers occurred will be highlighted by
the software.
At higher signal frequencies, one
needs to reduce the length of the line
at the outer layers. Te maximum al-
lowed line length will be checked and
violations will be indicated
Another rule will check for maxi-
mum distance of a blocking capacitor
to a connector pin on the power supply
voltage. Because a blocking capacitor
has a small eective radius, a permis-
sible distance to the decoupling pin
cannot be exceeded. Otherwise, the
capacitor is useless and should be
omitted. Violation of this rule will be
listed along with the distance to the
respective capacitor. A nal important
rule is that a trace should not be routed
too closely to the edge of its reference
plane. In this case, the line impedance
will change and may result in signal
reections at the impedance discon-
tinuities.
With this software package, the
user can check specic rules, be guided
through an error list, and then be
shown the critical areas in the layout.
Changing the position of the compo-
Figure 2. If signal layers and the reference plane change simultaneously, the return current
paths needs to be secured.
nents early in the design phase can
create layout routes that forestall EMC
problems. Supplementary shielding
or lters might not be needed, saving
valuable board space and component
costs.
CONCLUSION
As board design becomes ever more
complex and EMC regulations grow
ever more stringent, seeking solutions
early in the design cycle has become a
necessity. Software simulation pack-
ages, especially when combined with
eective interfaces with widely used
layout tools. can prove invaluable in the
process of product development.
Dirk Mller Dirk Mueller received his elec-
tronic engineering degree in 1989. Since 2003 Mu-
eller has been Managing Director of FlowCAD,
the Cadence Channel Partner for PCB products
in Central Europe as well as other ow integrated
vendors like SimLab, Mecadtron and Valor.
SUPPLIERS EMC DESIGN &
SOFTWARE
AR RF/Microwave Instrumentation
............................... 7, 58, 59, 67, 91, 191
Souderton, PA; 215-723-8181;
800-933-8181 www.arww-rfmicro.
com
MORE ON OUR WEBSITE
Todays sophisticated EMC Design
software packages speed the process
of achieving the optimal layout. Visit
the new InterferenceTechnology.
com, and be sure to look for special
editions of the eNews focused on
EMC Software.
CST of America, Inc. ............181, 189
Framingham, MA; 508 665 4400;
www.cst.com
EM Software & Systems-SA (Pty)
Ltd .................................................... 187
Stellenbosch, SOUTH AFRICA; +27 21
8801880; www.emss.co.za
ETS-Lindgren
............... 1, 9, 84, 169, 177, Back Cover
Cedar Park, TX; 512-531-6400;
Instruments For Industry (IFI)
...............................................1721, 193
Ronkonkoma, NY; 631-467-8400;
www.i.com
Intermark (USA) Inc. ...................... 179
San Jose, CA; 408-971-2055; www.
intermark-usa.com
Kimmel Gerke Associates, Ltd. ....210
South St. Paul, MN; 888-EMI-GURU;
www.emiguru.com
NEC Informatec Systems, Ltd.
Tokyo ................................................175
Tokyo, JAPAN; www.emistream.com
SimLab Software GmbH ............... 197
Munich, GERMANY; +49-89-7600090;
www.simlab-emc.com
Underwriters Laboratories, Inc. -
Northbrook, IL .................................. 75
847-272-8800; www.ul.com/hitech/
emc
See whats in the new Automotive EMC channel today.
information in the way you need it. If Automotive EMC
Aerospace EMC
Military EMC
Telecom / NEBS
Amplifiers
Antennas
EMI Connectors
EMI Ferrites
EMI Filters
EMI Shielding
Automotive EMC
House Automotive.indd 1 5/5/2008 1:42:10 PM
200
magnetic shielding MAGNETI C SHI ELD DESI GN FOR MANUFACTURI NG
DAVID GRILLI
The MShield Company, Inc.
Londonderry, NH
M
agnetic shielding for static
and low frequency (< 100 kHz),
time-varying magnetic fields is
accomplished by containing a specic de-
vice or item within a sheet metal enclosure
of high permeability material. Typically, a
sensitive electronic component requires
magnetic shielding protection from nearby
transformers or power supplies radiating a
potentially troublesome magnetic eld. High
permeability material is a nickel iron alloy
consisting of 50 to 80 percent nickel. Initial
static permeability values are in excess of
60,000. Permeability is dened as a ratio of
the ux induced in a material (expressed as B,
measured in Gauss) proportional to the am-
bient or applied magnetic eld (expressed as
H, measured in Oersted). As a reference, the
initial permeability of a material is dened as
the ratio of the induced ux B in the material
Magnetic shield design for manufacturing
Sensitive electronic devices require protection from
radiating magnetic f elds.

Figure 1. BH graph used to determine a materials permeability.
MuShield is a small company that tackles big
problems. Our team is a talented mix of engineers
with extensive experience in the field of magnetic
shielding. This enables us to build, test, and deliver
a product that works within a reasonable time frame.
Visit us online at www.mushield.com.
Magnetic Shielding That Works!
The MuShield Company 9 Ricker Avenue Londonderry, NH 03083 Toll Free: 888.669.3539 Email: info@mushield.com
EMI Shielding & Design
Magnetic Shielding Materials
Sheet
Coil
Seamless Tubing
MuMetal2
Permalloy
HyMU80
Shielding Consultation
Custom Electronic Components Shielding
Prototyping
Manufacturing Capabilities
Heat Treatment
Design Capabilities
Performance Testing
Production Capabilities
R
R
R
R
MuShield.indd 1 1/25/2008 12:19:36 PM
202
divided by the ambient Earths magnetic eld, H (approxi-
mately .50 Oersted). Te high ratio indicates the materials
ability to induct magnetic ux. Te simple B-H Graph shown
in Figure 1 is used to determine a materials permeability and
resultant magnetic shielding performance. Te orange line on
the B-H Graph represents the function of high permeability
material at DC and 60 Hz. Te permeability value is equal to
the derivative of that function. Note that as the applied eld
increases beyond the steepest slope, the permeability starts
to decrease. Tis change is known as the saturation point
of the material. Once the material becomes fully saturated,
it oers no magnetic shielding protection as the derivative
asymptotically approaches zero.
In most shielding applications, the specied shielding
alloy is between .004 and .120 thick sheet metal. Ticker
materials can be milled from bar stock. High permeability
magnetic shielding alloys are produced by several steel mills
worldwide.
FABRICATION
Te typical magnetic shield design requires sheet metal
fabricating and metal forming techniques. Shielding shapes
include simple sheet metal cylinders, complex weldments,
and precision machined housings. But, in almost all cases,
an application involves an enclosure type design. Since mag-
netic ux will follow the path of least reluctance, the high
Figure 4. Typical shapes for magnetic shields are cylinders, cans. and
rectangular enclosures. The covers for the cylinders were spun to shape.
Figure 5. A small cover is spun to shape. Figure 2. High permeability alloys laser machine readily.
Figure 3. Fusion welded seams are TIG (Tungsten Inert Gas) welded.
permeability of the enclosure shape absorbs and shunts the
magnetic ux, leaving the inside of the enclosure with a lower
or attenuated magnetic eld. Te shield enclosure can also
work the other way by containing a magnetic eld within the
enclosure boundary.
Once a shield enclosure is designed for shielding eective-
ness, a mechanical design application is needed. A simple
cylindrical shape is often the most eective shield and the
simplest to fabricate. Sheet metal is rolled, and a seam can
Figure 6. Examples of spun parts.
Advancd Magnetics.indd 1 3/20/2008 2:50:35 PM
204
be butt welded or can be overlapped and
spot welded. Te mechanical forming
constraints of high permeability alloys
are very similar to those of stainless
steel.
Other typical shapes are similar to an
electronic chassis where a prefabricated
at panel is formed using a conventional
sheet metal press brake and associated
forming equipment. Complex assem-
blies can be fusion welded (Figure 2)
or spot welded or can be attached with
mechanical fasteners.
roll formed to shape, the seam can be
overlapped and spot welded or butted
and fusion welded.
A spot weld is a simple electrical resis-
tance weld, and a butt, fusion weld is usu-
ally accomplished via a process known as
TIG (Tungsten, Inert Gas) welding. Te
inert gas used is argon, and it serves to
prevent oxidation and carburization of
the material for the brief time it is in a
molten state. Laser and electron beam
welding can also be used (Figure 3). High
permeability alloys weld quite well. and
demanding mechanical tolerances can be
achieved with proper weld xturing.
SHAPES
Boxes and chassis shapes are achieved
using a pre-cut blank and a typical press
brake. Usually a part is developed in a
at pattern layout, which can then be
laser machined or punched in a CNC
(Computer Numerical Control) punch
press. Subsequent forming operations
are done in a press brake. Corners and
seams can be left open or can be welded
shut depending on the application. In
CYLINDERS
Te simplest and most eective shape
for a magnetic shield is a sheet metal
cylinder made of a high permeability
material. A machine known as a slip
roll or pinch roll is employed. Te ma-
terial is pinched between two rollers.
Motion is applied and the material is
then pushed against the forming roll.
Te resultant diameter of the nished
cylinder is determined by the posi-
tion of the forming roll relative to the
pinching rolls. After the cylinder is
Magnetic Shield Corporation 740 No. Thomas Drive, Bensenville, IL 60106 888-766-7800 or 630-766-7800
Magnetic Interference
cant be seen, felt or eliminated but
it can seriously affect electronics
that are not properly shielded.
Choose the preferred source for
more than 65 years - Magnetic
Shield Corporation - for your
magnetic shielding materials.
We stock sheet and foil in various
thicknesses and widths, plus a vast
array of wire, cable, conduit and
braided sleeves.
We also custom manufacture
simple and complex magnetic
shield shapes.
Blank is placed on
Draw Ring with
forming chamber in
raised position.
Forming chamber is
lowered and initial
pressure is applied.
As punch moves
upward, variable
controlled pressure
in forming chamber
permits blank to
conform to punch.
The pressure is
released, forming
chamber raised and
punch lowered from
nished part.
Figure 7. The hydro-forming process.
GRI LLI
205
magnetic shielding
high volume applications, tooling can be designed that will
pre-cut and form the blank in a single operation.
METAL SPINNING & HYDROFORMING
When stringent mechanical tolerances are required, metal
spinning and hydroforming can be utilized. Metal spin-
ning, as the name implies, involves rotating the material in
a lathe and using a forming role to ow the metal against a
mandrel. See examples in Figures 4, 5, and 6. Te mandrel is
a machined tool made to conform to the inside prole of the
desired nished sheet metal part. Te forming roll is usually
controlled by an operator (spinner). Spinning metal requires
a great deal of experience. If forced too far, the metal will
crease or tear because of work hardening. Often the metal
will require in-process annealing to relieve mechanical stress,
and additional spinning can then occur. Of course, spinning
can be used only on parts that are round or conical. Te
advantage of spinning is low tooling costs as mandrels are
often made from wood or aluminum.
Hydroforming involves a simple tool machined to the
inside dimensions of the part and a hydroform machine. Te
hydroform pushes the tool into a rubber diaphragm behind
which hydraulic pressure forces the sheet metal to wrap
around the tool. In addition to round parts, many unique
shapes can be made by hydroforming. Hydroform tools are
made from tool steels and other materials such as kirksite,
a zinc alloy that can be cast into unique shapes (Figure 7).
Hydoformed and spun parts usually require a nal trimming
operation to remove excess material and/or to add detail.
Most trimming operations can be accomplished on laser,
milling, or shell trimming machinery.
HEAT TREATING
Te nal step in manufacturing magnetic shielding parts is
heat treating. Cold working and machining will have rendered
the grain structure of the material in a less than ideal shielding
condition. High permeability material is best heat treated in
a dry hydrogen atmosphere, or vacuum furnace. Hydrogen
is preferred as hydrogen gas will help remove any carbon or
oxygen impurities. Te material is brought up to 2100 degrees
F and held for two to four hours. Te furnace is then cooled
at a specic rate to optimize grain growth and reordering. A
Figure 8. The large grain size is evident after heat treating.
large, well ordered grain will yield maximum permeability
resulting in optimum shielding (Figure 8).
CONCLUSION
Magnetic shielding characteristics are optimized if welding
can be avoided. Te shield designer should strive to minimize
welded sections and to allow generous forming radii. Magnetic
ux leakage will occur at sharp corners eecting overall shield
performance. Te most e cient magnetic shield geometry
would be a spherical shell. Since spherical shells are di cult
and costly to form, the next best design is a simple cylinder.
Rectangular boxes and chassis, although not optimal, will
perform adequately as magnetic shields. Te design engineer
has a degree of exibility when optimizing a design. Unlike
RFI shields where holes and apertures are discouraged, mag-
netic shields can have holes and openings although its best to
minimize their number. In recent years, FEA (nite element
analysis) modeling of magnetic shield designs has become
very helpful and has aided in the design process described
here. Since the proof is in the prototype and since so many
extenuating circumstances can aect shield performance, its
best to try one on for form, t, and function rst.
David Grilli is President of the MShield Company of Londonderry, NH.
He can be reached at dgrilli@mushield.com.
SUPPLIERS MAGNETIC SHIELDING
Ad-Vance Magnetics, Inc. ................................................... 203
Rochester, IN; 574-223-3158; www.advancemag.com
Alco Technologies, Inc. ...................................................... 101
Torrance, CA; 310-328-4770; www.alcotech.com
Magnetic Shield Corporation ............................................. 204
Bensenville, IL; 630-766-7800; www.magnetic-shield.com
MShield Company, Inc. ..................................................... 201
Londonderry, NH; 888-669-3539; 603-666-4433; www.
mushield.com
MORE ON OUR WEBSITE
Looking for answers about magnetic shielding? Which
material to choose, the use of multiple layers, or the
appropriate level of permeability? A wealth of information
is available on the new InterferenceTechnology.com. Just
look under Resources for white papers, research, and
applications notes covering this vital facet of EMC.
206
emc education THE I MPORTANCE OF EMC STUDI ES
TONY DIBIASE
Spec-Hardened Systems
Rochester, NY
T
he study of electromagnetic felds
eects and their impact on electrical
and electronic products and services is
a continuous, evolving process. If there were
ever a time when engineering as an art, or if
the informed guess was acceptable, that is no
longer the case. Electromagnetic engineer-
ing is a science complete with all the logic
and discipline that that word connotes. Tis
rigor has created the necessity for techni-
cal universities to implement the study of
electromagnetic elds and their eects into
their engineering curricula.
INTRODUCTION
In the design and development of electri-
cal and electronic products and systems,
electromagnetic compatibility (EMC) issues
have become evermore signicant design
considerations. Tis emphasis on EMC is the
result of several signicant factors. Todays
products and systems must meet their func-
tional and interoperability requirements,
and must do so while meeting the regulatory
imperative for compliance with national and
international electromagnetic standards.
Tese increasing burdens apply to many
categories of products and systems such as
consumer electronics, medical equipment,
telecommunications products and systems,
military and aerospace systems, and automo-
tive products. All have an important role in
the quality of our electronic infrastructure
and clearly are essential to publics health
and welfare. Consequently, well trained and
experienced EMC engineers will be needed
to deal with EMC issues that may occur in
these products and systems.
A GLOBAL VIEW OF EMC
Te study of electromagnetic eld eects
on electrical and electronic products and
systems transcends the boundaries of several
traditional educational disciplines including
electrical and mechanical engineering and
computer science. Electromagnetic eld the-
ory is based on the works of several legendary
scientists whose ranks include James Clark
Maxwell, Wilhelm Weber, Andre Marie Am-
pere, Michael Faraday, Carl Guass, and others.
Still, in the everyday world when faced with
non-compliance or a malfunctioning device,
the EMC engineer must be prepared to apply
the appropriate scientic knowledge to arrive
at a very pragmatic solution. Given the many
complexities and uncertainties involved in
attempting to analyze and model the eects
of electromagnetic elds, an EMC engineer
must often rely on testing data to support
his understanding of the EMC issues under
investigation. Unfortunately, within EMC
work, there has been an over-reliance on the
trial-and-error method of problem-solving.
Tis has proven to be an ineective, costly,
and time-consuming approach to attaining
the desired results. A manufacturer relying
on this method of EMI problem-solving is
putting himself at a signicant competitive
disadvantage. Formally trained EMC engi-
neers or consultants are well prepared to deal
with these situations, and their involvement
can be very cost-eective.
The importance of including
electromagnetic compatibility studies
into the engineering curriculum at the
university level
University level education in EMC Engineering is a growing necessity.

ENR.indd 1 3/20/2008 11:40:53 AM
208
emc education THE I MPORTANCE OF EMC STUDI ES
THE INCREASING IMPORTANCE
OF THE ROLE OF AN EMC
ENGINEER
In the face of an increasingly global
economy and the technological ad-
vances that create a wide variety of
electronic devices, the need for highly
qualied EMC engineers can only in-
crease. EMC issues loom ever larger in
the process of product development.
Tere are several reasons for this de-
velopment including:
Te steadily growing and increas-
i ngly complex electromagnetic
environment (EMV) created largely
by the huge increase in electronic
devices coming to the marketplace.
In turn, these devices use an in-
creasing large swath of the available
electromagnetic spectrum.
Electronic device size is shrinking,
as the complexity and densities of
electronic devices increase. Unfor-
tunately, this combination of high
functionality and compact size only
results in greater sensitivity to elec-
tromagnetic interference eects.
Regulatory compliance standards
are in place or being enacted world-
wide, and these requirements must
be factored into the design process.
Obviously, the savvy manufacturer
wants a product acceptable in mar-
kets around the globe.
Also, it is important to recognize
that designing for EMC is just one
part of the overall process of product
creation. Safety, quality, reliability,
and optimum functionality are equally
vital elements in the design process.
Moreover, these design attributes are
all closely inter-related. It takes an
experienced, well trained and edu-
cated EMC engineer to assess all the
tradeos involved in developing the
required optimum design. Many times
a resolution of seemingly conicting
design specications must be worked
out before a successful new product or
device can be introduced.
EMC CONSIDERATIONS
IN DIFFERENT TYPES OF
ELECTRICAL AND ELECTRONIC
PRODUCTS AND SYSTEMS
Automotive New electronic products
and systems are being added to auto-
mobiles at a steady rate. Tese products
and systems must operate properly
under harsh environmental conditions.
Tese conditions include high levels of
electromagnetic interference. Automo-
tive assemblies are normally subjected
to electromagnetic eld levels of 200
volts/meter during EMC immunity
testing. Many automotive systems are
crucial to safety and must deliver fail-
safe performance even under stressful
conditions.
Products to be installed into auto-
mobiles must be tested to both emis-
sions and immunity standards testing
requirements. University research
studies now underway at several U.S.
universities are focused on the design
of components and systems that can
meet these daunting EMC criteria in
the increasingly complex EM environ-
ment of the modern automobile.
Telecommunications Once again,
as with other high tech equipment,
telecommunications devices must
undergo and must pass both emissions
and susceptibility testing. In fact, emis-
sions and immunity standards testing
requirements are imposed on a wide
range of telecommunications products
and systems, most notably in the Euro-
pean Union. Requirements must be met
when this equipment is installed in its
ambient EMV environment. Spectrum
allocations are closely controlled by na-
tional government agencies. Extensive
regulatory controls on telecommunica-
tion equipment are necessary since this
equipment is an essential part of the
countrys electronic infrastructure and
an important element in public safety.
Military And Aerospace Systems
Many military and aerospace systems
are deployed and must function prop-
erly in very intense EMVs. Challenges
include operating with other types of
equipment at their location, a situation
that can produce high levels of elec-
tromagnetic emissions and resultant
interference problems. Also, there
are military systems that are required
to function properly when subjected
to electromagnetic weapons threats.
Some of these electromagnetic threats
include satellite-based threats, high al-
titude electromagnetic pulse (HEMP),
microwave threats, and intentional
EMI (IEMI). Another concern is that
some military systems are placed in
locations where their radiated emis-
sions could cause a safety hazarde.g.,
stray EM emissions and unexploded
ordnance on the deck of an aircraft
carrier.
Consumer Electronics Consumer
electronics are required to meet exten-
sive radiated emissions and immunity
regulatory compliance standards re-
quirements in many counties globally,
including throughout the European
Union (EU). In the United States, the
Federal Communications Commission
has imposed regulatory compliance
radiated emissions limits require-
ments on many consumer products.
Te objective of these requirements
is to insure that the consumer elec-
tronic products operate properly in
their respective ambient EMVs and
that they do not interfere with other
electronic products in operation at
that location.
UNIVERSITY LEVEL EMC
PROGRAMS IN THE UNITED
STATES
Universities nationally and interna-
tionally are implementing programs
focused on electromagnetic compat-
ibility. Some of the universities in the
U.S. that have put in place programs
that are involved with EMC studies are
listed below.
Clemson University (Vehicle Elec-
tronics Laboratory-CVEL) automo-
tive engineering program involves
a signicant emphasis on EMC and
automotive design. These studies
include courses in the development
Unfortunately, within
EMC work, there has
been an over-reliance
on the trial-and-error
method of problem-
solving.
DI BI ASE
209
emc education
of EMC computer program model-
ing. Te university has been involved
in EMC research projects for over
20 years.
Missouri University of Science and
Technology at Rolla has just opened
a new EMC research center. Its
activities include work on improv-
ing the accuracy of EMC modeling
programs. It is also presently work-
ing in partnership with the General
Electric Corporation on an aviation
research project.
University of Michigan, Dearborn
is working in conjunction with Te
Society of Automotive Engineers of
South Eastern Michigan, a Chapter
of the IEEEs EMC Society. Te uni-
versity is involved in co-sponsoring
seminars that are related to EMC
design considerations in automotive
systems.
University of Wisconsin at Mil-
waukee College of Engineering and
Applied Science sponsors seminars
on EMC topics.
George Washington University Cen-
ter for Professional Development has
presented educational seminars on
EMC-related subjects.
Te University of California at Los
Angeles (UCLA) has a program
awarding certicates in EMC stud-
ies.
Other universities throughout the
U.S. have EMC-related activities as
part of their educational and research
programs. In fact, there is a consid-
erable amount of activity occurring
in the realm of university research
projects that are sponsored by U.S.
governmental agencies. Among these
research projects is one that involves
a study to develop countermeasures
against improvised explosive devices
(IEDs) that are used against our mili-
tary. Electromagnetic pulse and micro-
wave weapon systems are also subjects
of current research eorts. Also, there
are university research projects that
are aimed at assessing the eects of
electromagnetic elds on the safety of
humans and animals. Yet another cat-
egory includes EMC-related research
eorts being conducted for industry
via university/industry partnerships.
Te study requirements for an EMC
engineering program are essentially
a very good t with existing electri-
cal engineering programs since the
required prerequisite courses for such
a curriculum already exist in a good
electrical engineering program.
CONCLUSIONS
While there are various sources of
educational opportunities in the eld
of EMC, university level education in
EMC Engineering is a growing neces-
sity. In years to come, as EMC continues
to evolve, the need for an understand-
ing of the principles of EMC wil l
become essential. Te study of EMC
should be made an integral part of the
electrical engineering curriculum. In
the future as device frequencies exceed
the 40-GHz level, the EMC engineer
will need to deal with even greater chal-
lenges, and the education of formally
trained and mentored EMC engineers
will become a necessity rather than an
option. It is imperative that a greater ef-
fort be expended in the U.S. to increase
the number of formally trained EMC
engineers who will be needed to keep
pace with EMC studies and research
eorts. Such eorts are already under-
way at the university level in both the
European Community and the Asian/
Pacic region. An eective, competitive
global marketplace requires consistent
eorts around the globe.
Tony DiBiase is the president of Spec-Hardened
Systems, an EMC and Product Safety consulting
rm. He is a graduate of the Rochester Institute of
Technology and holds a BSEE degree. He has pre-
sented several seminars and training programs
and has written several articles on the topics of
EMC and product safety. He can be contacted
by e-mail at SHSESC@aol.com.
MORE ON OUR WEBSITE
EMC education is an ongoing
challenge. Even those of us who cant
schedule a return to the classroom
can check out the webinars
included in the Resources section of
InterferenceTechnology.com. Also,
be sure to review the Calendar for
upcoming shows and conferences
featuring demonstrations, one-day
seminars, and hands-on workshops.
FORUMS on the New
InterferenceTechnology.com
Looking For Answers? Trying
to Set the Record Straight?
The FORUMS on this all-new
website provide a unique
opportunity. Perhaps youve
reached a stumbling block on
how to proceed with an EMC
product design or a testing
project. Maybe, youve read
the applicable standards a
dozen times, but just what do
those words mean? Someone
must have encountered this
problem before; someone has
to have the answer you need.
Where are you going to nd
your answer?
The FORUMS section of the
new InterferenceTechnology.
com covers ten key EMC
sectors:
Aerospace
Automotive
Military
NEBS/Telecom
Ampliers
Antennas
Connectors
Filters
Shielding
Ferrites
If your quandary involves one
of these areas, just go to the
appropriate FORUM. Every
reader is part of the pool of
expertise so take a look at the
FORUM of interest. In fact,
the FORUMS are a great way
to keep abreast of current
concerns and thinking on
EMC. Check them regularly,
and stay informed.
210
c
o
n
s
u
l
t
a
n
t

s
e
r
v
i
c
e
s
Montrose Compliance Services, Inc.
Electromagnetic Compatibility and Product Safety
Mark I. Montrose
Consulting and Design Services Seminars Public and Private
Printed Circuit Board Layout and Design
CE Test Laboratory (ISO Guide 17025 Assessed)
Specializing in ITE and Industrial Products for CE Compliance
www.montrosecompliance.com
2353 Mission Glen Drive ( and FAX (408) 247-5715
Santa Clara, CA 95051-1214 mmontros@ix.netcom.com
628 LeVander Way
S. St. Paul, MN 55075
Lxperieace aatecks raaJ 3pectram al ptical
aaJ LMI/8II 3alatiaas
/04)#!,02/$5#43&/2%,%#42/.)#$)30,!9!00,)#!4)/.3
EMllR|l s|ielJir-ircu|uu|otir t|orsuo|ert curJucti.e
cuotirs, uuticol re wi|e aes|es 5J uui tu Z5J uui, .o|iet] u loss orJ ulostic
su|st|otes
T|orsuo|ert |eote|s, lR lte|s, |orJ uoss, lVlS lte|s
0urtec| E0S-|C0s auJieJ u| uutJuu|l|ueJ er.i|uraerts
|u| u.e| t|i|t].e ]eo|s ootech Ioc. |os |eer Jesirir orJ aoruoctu|ir uuticol
orJ EMllR|l sulutiurs tu er|orce elect|uric Jisulo]s. |u| uuticol ouulicotiurs |orir
|ua t|e ult|o.iulet tu t|e ir|o|eJ u| u| EMllR|l s|ielJir |ua 1J M|/ tu 1J C|/,
0urtec| u|u.iJes uraotc|eJ couo|ilities.
Fhooe. 215-348-5010 Fax. 215-348-9959
www.dootechioc.co
DELIVERING QUALITYONE TEST AT A TIME
Qualtest Inc.
6881 Kingspointe Parkway
Suite 15
Orlando, FL 32819
www.qualtest.com
Phone 407-313-4230
Fax 407-297-7376
17025 Accredited by A2LA and NVLAP
Carl M. Hebda
EMI/EMC Test Services Manager
Consultant services ag_08.indd 210 5/6/2008 4:19:18 PM
standards recap
211
standards recap
APRIL 2007
EMC TEST WALL CHARTS WITH UP-TO-DATE
STANDARDS OFFERED
Teseq (formerly Schaner Test Systems) is oering a
series of informative wall charts that illustrate common
EMC test requirements. Teseq reports that these attrac-
tive and easy-to-follow guides have been updated with
the latest EMC standards amendments and will be useful
for product designers and EMC test engineers. Te four
specic EMC topics covered are LF and RF immunity,
transient immunity, RF emissions, and automotive EMC.
LATEST EDITION OF IEC STANDARD ON
ELECTROMEDICAL EQUIPMENT NOW
AVAILABLE
Te latest edition of IEC 60601-1-2 is
now available. Entitled Medical electri-
cal equipment Part 1-2: General re-
quirements for basic safety and essential
performance Collateral standard: Elec-
tromagnetic compatibility Require-
ments and tests. Tis standard applies
to the electromagnetic compatibility of
medical electrical equipment and medi-
cal electrical systems. Its object is to
specify general requirements and tests
for this equipment and systems. Tese
requirements augment the requirements
of the general standard and serve as the basis for particu-
lar standards. Tis of IEC 60601-1-2 has been revised to
align it structurally with the 2005 edition of IEC 60601-1
and to implement the decision of IEC Subcommittee 62A
that the clause numbering structure of collateral stan-
dards written to IEC 60601-1: 2005 would adhere to the
form specied in the ISO/IEC Directives Part 2: 2004.
Te principal technical changes are in Clause 4, which
now recognizes that there is a general requirement for a
risk management process in IEC 60601-1: 2005. Keeping
Up With Automotive Standards
U.S. AND JAPAN INK TRADE AGREEMENT ON
TELECOM CERTIFICATION
Te United States and Japan recently signed a mutual
recognition agreement (MRA) that will help U.S. telecom-
munications and radio equipment makers market and sell
their products in Japan and will expand the acceptance
in Japan of determinations made by U.S. certication
bodies. Te agreement was signed by Deputy U.S. Trade
Representative Karan Bhatia and Japans representative in
Washington, DC, Charges dAaires ad interim, Akataka
Saiki.
Under this agreement, Japan will accept the results of
conformity assessment procedures (i.e. product testing
and certication) performed by approved certication
bodies in the United States demonstrating that telecom
equipment meets Japans technical requirements. MRAs
are government-to-government agreements that require
each party to accept the results of conformity assessment
procedures conducted on equipment by approved bodies
of the other party if the results demonstrate compliance
with that partys technical requirements. Te National
Institute of Standards (NIST), a federal agency within the
Department of Commerce, will designate quality assess-
ment bodies within the U.S. MRAs in no way alter either
partys ability to determine the level of health and safety
protection that it considers appropriate.
EUROPEAN UNION AIMS FOR ULTRA-
WIDEBAND HARMONIZATION
In late February, the European Union
adopted a decision that mandates condi-
tions for using ultra-wideband (UWB)
technology in next generation wire-
less devices throughout the European
Union. Te aim of this decision by the
EU Commission is to forestall any pos-
sible interference with other wireless
users. Te technical conditions in the
decision must be applied within the next
six months throughout the 27 Member
States that make up the European Union.
MAY 2007
REVISIONS TO ANTENNA CALIBRATION STANDARD
In December 2004, American National Standards
Institute (NIST) Accredited Standards Committee (ACS)
C63 Electromagnetic Compatibility published a new an-
tenna calibration standard that replaced the earlier 1988
and 1998 versions. Last year an interpretation and ow
chart were added to this standard that claried some text.
Te standard takes into account errors that are intro-
duced when using certain broadband antennas, especially
at frequencies below 200 MHz, and provides correction
factors when these antennas are used for site validation. It
also introduces measurement techniques for determining
antenna factors for other types of antenna.
ANSI LAUNCHES ENHANCED ELEARNING
STANDARDS WEBSITE.
Te American National Standards Institute (ANSI)
has launched a new version of its eLearning Portal. A free
educational resource, StandardsLearn.org supports the
C
ompliance with standards makes or breaks the marketing of any new product. This section recaps new and revised national and
international EMC standards. The information below has been featured in our weekly InterferenceTechnology eNews. Just go to
InterferenceTechnology.com, subscribe to the eNews, and youll be updated on important changes in EMC standards weekly.
eNews
for
standards
updates
interference
technology eNews
Standards Recap ag_08.indd 211 5/6/2008 4:24:19 PM
standards recap
212
United States Standards Strategy (USSS) tactical initiative
to make standards education a high priority within the
United States. Te goals of the USSS are to advance trade
in the global marketplace, to enhance consumer health
and safety, and to respond to critical domestic and inter-
national priorities. In addition to its eLearning program,
the website contains a database of nearly 1,500 commonly
used acronyms found in standards and conformity assess-
ment. Also on site, is a Standards Education Database, a
resource of nearly 200 education and distance-learning
programs provided by ANSI-accredited standards devel-
opers, ANSI members, and academic institutions.
SECOND AMENDMENT TO CISPR/TR 16-4-1 NOW
AVAILABLE
CISPR/TR 16-4-1-am2 Ed. 01 entitled Specication
for radio disturbance and immunity measuring apparatus
and methods Part 4-1: Uncertainties, statistics, and lim-
it modeling Uncertainties in standard-
ized EMC tests. Te maintenance result
date is 2009. No abstract of this 39-page
standard is available.
IEC NIXES PROPOSAL FOR
ADDITIONAL STANDARD CATEGORY
Te International Electrotechnical
Commission has announced that its
Standardization Management Board
(SMB) has decided not to create a sug-
gested category of stabilized standards
and has ruled that a maintenance review
of standards should still be undertaken
every 15 years. In late 2006, TC 100 had
asked for a new category of standards
in the maintenance cycle of TC (technical committee)
with the proposed name of stabilized standards. Te
proposal was based largely on the existence of a num-
ber of standards where the level of maturity is such that
maintenance is deemed unnecessary. Another factor
inuencing the proposal was the di culty in locating
experts for National Committees competent to deal with
older technologies covered in standards that are no longer
either taught or applied. Based on its present policies the
SMB decided not to accommodate this request.
CISPR STANDARD COVERS ELECTROMAGNETIC
DISTURBANCES FROM VEHICLE MOUNTED
ELECTRONICS
CISPR 12 Ed. 6.0 is entitled Vehicles, boats, and
internal combustion engines Radio disturbance
characteristics Limits and methods of measurement
of o-board receivers. Te limits in this International
Standard are designed to provide protection for broadcast
receivers in the frequency range of 30 MHz to 1000 MHz
when used in the residential environment. Compliance
with this standard may not provide adequate protection
for new types of radio transmissions or receivers used in
the residential environment nearer than 10 meters to the
vehicle, boat, or device. Tis standard applies to the emis-
sion of electromagnetic energy that may cause interfer-
ence to radio reception and that is emitted from:
a) vehicles propelled by an internal combustion engine,
electrical means, or both;
b) boats propelled by an internal combustion engine,
electrical means or both. (Boats are to be tested in
the same manner as vehicles except where they have
unique characteristics as explicitly stated in this stan-
dard;
c) devices equipped with internal combustion engines.
Tis sixth edition of the standard cancels and replaces
the fth edition published in 2001 and its Amendment 1
(2005). Tis edition constitutes a technical revision. Note
that the following changes were made to the previous edi-
tion: deletion of narrowband/broad band determination
and general improvement of wording.
JUNE 2007
IEC ISSUES CORRIGENDUM ON EFT/
BURST IMMUNITY TESTING
System (IEC) has issued a corrigendum
to IEC 6100044: Testing and mea-
surement techniquesElectrical fast
transient/burst immunity testing. Spe-
cically, in Section 6.2.2 on page 25, the
second paragraph must be deleted and
replaced with new test and an illustra-
tion. Also, the fourth paragraph must be
deleted.
NEW EDITION OF SWITCHGEAR/CONTROL GEAR
STANDARD SUPPORTS EMC TESTING
Te International Electrotechnical System (IEC)
has issued the fth edition of the agship international
standard for low-voltage switchgears and control gears.
IEC 60947-1, for rated voltages not exceeding 1000 VAC
1500 VDC, is now available. Tis fth edition replaces the
fourth edition, which was published in 2004. Te signi-
cant changes to this standard can be found in Clause 7.1
on Constructional Requirements and in the newly add-
ed material that supports electromagnetic compatibility
testing. Also, there are new normative annexes covering
environmental tests and on digital I/O for compatibility
with programmable controllers, as well as an informative
index on dielectric testing.
REVISED ESD CONTROL PROGRAM STANDARD IS
NOW AVAILABLE
Te ESD Association (ESDA) has issued a revised ver-
sion of the standard covering the design and implementa-
tion of an electrostatic discharge program. Te revised
standard ANSI/ESD S20/20-2007 covers the necessary
Breaking News
Emissions, susceptibility,
hazardous substances,
recycling issues? Quite simply,
compliance with standards
makes or breaks the marketing
of any new product. Just go to
InterferenceTechnology.com,
subscribe to the eNews, and
youll be updated weekly.
interference
technology eNews
standards recap
213
steps for designing, implementing, and maintaining
an EDS control program for the protection of sensitive
electronics. Changes noted from the earlier 1999 version
include: recommended limits have become required lim-
its; guidance sections have been removed and readers are
referred to the ESD Handbook; and compliance verica-
tion procedures are now specied.
JULY 2007
FINAL DRAFT OF ELECTROSTATIC PHENOMENA
STANDARD AVAILABLE FROM IEC
Te International Electrotechnical Commission is
oering a nal draft of Project IEC 61340-5-1 Ed. 1.0
Electrostatics Protection of Electronic Devices from
Electrostatic Phenomena General Requirements. It
should be noted that this is not yet a Standard. It is the
nal draft of a proposed standard. Tis nal draft inter-
national standard has a voting period of May 25, 2007
through July 27, 2007. Tose who purchase the nal draft
will receive a copy of the nal denitive version.
IMPLEMENTATION OF NEW EMC DIRECTIVE LOOMS
EMC Directive-2004-108-EC, the new electromagnetic
compatibility scheme for the European Community, went
into eect on July 20, 2007. One aim of the new direc-
tive is to simplify regulatory procedures and to reduce
costs for manufacturers while increasing information and
documentation on products for inspection authorities.
Te revised directive abolishes two conformity assess-
ment procedures for producers that require the mandato-
ry involvement of an independent inspection and veri-
cation body, thus reducing costs. Manufacturers will be
solely responsible for establishing the conformity of their
products and for the CE marking. Te EMC directive
governs the electromagnetic emissions of electrical and
electronic equipment and their immunity to interference.
Apart from the simplied conformity procedures, the
main elements of the revised directive include stricter re-
quirements concerning information and documentation
and a special regime for xed installations.
PROMINENT TEST EXPERTS CRITIQUE
CORRIGENDUM ON EFT/BURST IMMUNITY TESTING
Last month Interference Technology eNews noted the
publication of a corrigendum to IEC 6100044: Testing
and measurement techniquesElectrical fast transient/
burst immunity testing. Now, H. Kunkel and M. Fuhrer
of EM Test, Switzerland, have released a paper faulting
the testing techniques spelled out in the corrigendum
and calling for its withdrawal. Dr. Kunkel is a member of
TC77B MT12, and Mr. Fuhrer is an applications engineer.
NEW EMC DIRECTIVE FOR EU GOES INTO FORCE
Te new EMC Directive for the European Community
went into force on Friday, July 20, 2007. All new declara-
tions of conformity must now accord with 2004/108/EC
and must be issued under 2004/108/EC requirements
(extra documentation, information requirements, etc.).
With the repeal of 89/336/EEC, no new or amended
declarations may be issued under this directive. Tere is
a two-year period for existing declarations under 89/336/
EEC.
AUGUST 2007
TECHNICAL REPORT: DEALING WITH STATISTICS ON
RADIO INTERFERENCE COMPLAINTS
CISPR 16-4-4 Ed. 2.0 (2007-07) is entitled Speci-
cation for radio disturbance and immunity measuring
apparatus and methods Part:4.4: Uncertainties, statis-
tics, and limit modelling Statistics of complaints and a
model for the calculation of limits for the protection of
radio services. Tis Technical Report contains a recom-
mendation on how to deal with statistics of radio inter-
ference complaints. Further, it describes the calculation
of limits for disturbance eld strength and voltage for
the measurement on a test site based on models for the
distribution of disturbances by radiated and conducted
coupling. Tis second edition of CISPR 16-4-4 contains
two thoroughly updated Clauses 4 and 5.
IEC STANDARD ON MEASURING EM FIELD IMMUNITY
OF RELAYS AND PROTECTION EQUIPMENT
Te International Electrotechnical Commission (IEC)
has issued IEC 60255-22-3 (2007-07) entitled Measuring
Relays and Protection Equipment Electrical disturbance
tests Radiated electromagnetic eld immunity. Tis
part of IEC 60255 is based on IEC 61000-4-3 (electro-
magnetic compatibility) referring to that publication
where applicable. It species the general requirements for
radiated electromagnetic eld immunity tests for mea-
suring relays and power protection equipment for power
system protection, including the control, monitoring, and
process interface equipment used with those systems.
Te objective of the tests is to conrm that the equipment
under test (EUT) will operate correctly when energized
and subjected to an electromagnetic eld from a radiation
source operating within the frequency range of 80 MHz
to 2.7 GHz.
IEC ISSUES STANDARD ON HUMAN EXPOSURE TO
ELECTROMAGNETIC FIELDS
has issued IEC 63211 Ed. 1 (2007-08) entitled Assessment
of Electronic and electrical equipment related to human
exposure restrictions for electromagnetic elds (0 Hz 300
GHz). Tis standard applies to electronic and electrical
equipment for which no dedicated product, or product
family, standard applies. Te frequency range is covered
is 0 MHz to 300 GHz. Te object of this generic standard
is to provide assessment methods and criteria to evaluate
standards recap
214
such equipment against basic restrictions or reference
levels on exposure of the general public related to electric,
magnetic, and electromagnetic elds and induced and
contact current.
NEW STANDARD ON ELECTRICAL INSTALLATION
SAFETY & PROTECTION AGAINST VOLTAGE AND EM
DISTURBANCES
has issued IEC 60364-4-44 Ed. 2.0 (2007-08) entitled
Low-voltage electrical installations Part 4-44: Protec-
tion for safety Protection against voltage disturbances
and electromagnetic disturbances. Te rules of this part
of IEC 60364 are intended to provide requirements for
the safety of electrical installations in the event of voltage
disturbances and electromagnetic disturbances gener-
ated for dierent specied reasons. Tis second edition
of IEC 60364-4-44 cancels and replaces the rst edition
published in 2001, amendment 1 (2003) and amendment
2 (2006).
SEPTEMBER 2007
NEW STANDARDS ON EMC
REQUIREMENTS FOR WELDING
EQUIPMENT
Te International Electrotechni-
cal Commission (IEC) has issued IEC
60974-10 Ed. 2.0 (2007-08) entitled
Arc welding equipment Part 10:
Electromagnetic compatibility (EMC)
requirements. Tis document species
applicable standards and test methods
for radio-frequency for harmonic cur-
rent emission, voltage uctuations, and icker. Immu-
nity requirements and test methods for continuous and
transient, conducted, and radiated disturbances includ-
ing electrostatic discharge are detailed.
IEC 622135-2 Ed. 1.0 (2007-08) is entitled Resis-
tance Welding equipment Part 2: Electromagnetic
compatibility (EMC) requirements. This document
specifies test methods to be used in conjunction with
CISPR 11 to determine radio-frequency emissions.
It includes relevant standards and test methods for
harmonic current emission, voltage fluctuations, and
flicker. Other issues covered include immunity re-
quirements and test methods for continuous and tran-
sient, conducted, and radiated disturbances including
electrostatic discharge.
STANDARDS COVERS EMC REQUIREMENTS FOR
OPERATION OF 3G CELLULAR NETWORKS
Te European Telecommunications Standards In-
stitute (ETSE) has issued EN 301 908-7 V3.21. Tis
standard covers electromagnetic and radio spectrum
matters for base stations, repeaters, and user equipment
for IMT-2000 third generation cellular networks. Part 7
deals specically with the Harmonized EN for IMT-2000,
CDMA TDD (ULTRA TDD (base station) and covers
essential requirements of article 3.2 of the R&TTE Direc-
tive. Topics covered include spectrum emission mask,
transmitter adjacent channel leakage power ration, trans-
mitter spurious emissions, base station maximum output
power, transmit inter-modulation, and receiver spurious
emissions.
IEEE PUBLISHES GUIDE FOR THE APPLICATION OF
SPDS FOR LOWER POWER AC POWER CIRCUITS
Te IEEE Guide for the Application of Surge-Protec-
tive Devices for Low Voltage (1000 V or Less) AC Power
Circuits (C62.92-2007) provides speciers and users of
surge-protective devices (SPDs) about the application
considerations associated with power distribution sys-
tems within North America. Tis guide applies to SPDs
to be connected to the local side of the service entrance
main over current protective device of
50 Hz or 60 Hz AC power circuits rated
at 1001000 V rms. Te eects and
side eects on the presence and opera-
tion of SPDs in low power distribution
systems are described. Te coordination
of multiple SPDs on the same circuit is
described.
INDUSTRY GROUPS PUBLISH NEW
AIR INTERFACE SPECIFICATION FOR
CDMA BROADBAND
Te CDMA Development Group and
the Tird Generation Partnership Project
2 (wireless industry consortia with major
participants from North America, Japan,
Korea, and China) have released the rst air interface
specications for the Ultra Mobile Broadband standard,
a development they deemed as a major evolutionary step
for CDMA-based networks. Termed Ultra Broadband air
interface specication3GPP2 C.S0084-0 v2.0, it is ex-
pected that the UMB specication will quickly become an
o cial global standard when it is adopted by the 3GPP2
organizational partners, which include the Association of
Radio Industries and Businesses (ARIB) in Japan, China
Communications Standard Association (CCSA), Tele-
communications Industry Association (TIA) in North
America, Telecommunications Technology Association
(TTA) in Korea, and the Telecommunications Technology
Committee in Japan. Developers say this interface speci-
cation represents a major breakthrough that will allow
high-speed data downloads and uploads of 228 Mbps and
75 Mbps, respectively.
UMB is the leading Orthogonal Frequency Division
Multiple Access (OFDMA) solution and uses advanced
antenna techniques, sophisticated control and signaling
mechanisms, radio resource management (RRM), and
adaptive reverse link interface management.
RoHS or WEEE?
How do these environmental
standards impact electronics
manufacturing? How must
products be labeled? When
do the crucial deadlines fall?
Go to InterferenceTechnology.
com, subscribe to the eNews,
and youll receive weekly
updates.
interference
technology eNews
standards recap
215
OCTOBER 2007
NEW LIST OF EMC STANDARDS PUBLISHED IN THE
OFFICIAL EU JOURNAL
A list of harmonized EMC standards that implement
Directive 2004/108/EC of the European Parliament and of
the Council of 15 December 2004 relating to electromag-
netic compatibility was published late last month in the
O cial Journal of the European Union. Tis 19-page doc-
ument lists in a chart-like layout the European standard
organization, the numeric reference and title of the par-
ticular standard, its reference in the superceded standard,
and the date of cessation of presumption of conformity
of the superceded standard. Tis harmonized listing was
compiled with information provided by Member States.
IEC STANDARD ON MEASURING THE
ELECTROMAGNETIC IMMUNITY OF INTEGRATED
CIRCUITS
has issued IEC 62132-3 Ed. 1.0 Integrated circuits
Measurement of Electromagnetic Immunity, 150 kHz to
1 GHz Part 3: Bulk Current Injection (BCI) method.
Tis part of IEC 62312 describes a BCI test method for
measuring of integrated circuits (ICs) in the presence of
conducted RF disturbances. Tis method applies to ICs
that have o-board cable connectionse.g. into a cable
harness. Tis test method is used to inject RF current on
wire or a combination of wires. Tis standard establishes
a common base for the evaluation of semiconductor
devices to be applied to equipment used in environments
that are subject to unwanted electromagnetic signals.
IEC ISSUES TWO DRAFT EMC STANDARDS
ON MEASUREMENT, CONTROL, AND LAB USE
EQUIPMENT
has issued Project IEC 61326-3-1 Ed.1.0. Tis draft docu-
ment covers the EMC requirements for measurement,
control, and laboratory use equipment. Specically, Part
3-1 includes immunity requirements for safety-related
systems functions in general industrial applications. Proj-
ect IEC 61326-3-2 Ed. 1.0 covers the EMC requirements
for the same equipment in industrial applications with a
specied electromagnetic environment. Te voting period
for these drafts runs from September 28, 2007 through
November 30, 2007. Tose who purchase these draft ver-
sions will receive a copy of the nal denitive standards
when they have been voted into eect.
IEEE OFFERS COMPLETE COLLECTION OF EMC
STANDARDS ON CD-ROM
Te IEEE has long been a leader in creating standards
for electromagnetic compatibility, a set of issues aect-
ing many systems. To make it easier to access this body
of work, the IEEE has placed its 40 active EMC standards
on a CD-ROM, along with 40 archived ones to create a
comprehensive resource of best practices and methods.
Te standards on this VuSpec disk cover test and mea-
surement methods, instrumentation, equipment, systems
characteristics, interference control, computational
analysis, and spectrum management. Added features
include a glossary of over 800 terms, a keyword index,
a history of EMC regulatory bodies, and an overview of
IEEE EMC standards.
NOVEMBER 2007
TWO NEW EMC STANDARDS ON ROAD TRANSPORT
& ON-BOARD VESSEL COMMUNICATIONS
EQUIPMENT
ETSI ES 200 674-1, v2.1.1 (2007-10) covers electromag-
netic compatibility and radio spectrum matters (ERM);
Road transport and tra c telematics (RTTT); Part 1:
Technical characteristics and test methods for high data
rate (HDR) data transmission equipment operating in the
5.8-GHz industrial, scientic, and medical (ISM) band.
Lengthy PDF versions of ES 200 674-1 and EN 300 720-1
are available on the ETSI website.
ETSI EN 300 720-1, v1.3.2 (2007-10) covers electro-
magnetic compatibility and radio spectrum matters
(ERM); Ultra-high frequency (UHF) on-board vessels
communications systems and equipment; Part 1: Techni-
cal characteristics and methods of measurement.
CISPR AMENDMENT DEALS WITH RADIO
DISTURBANCE AND IMMUNITY MEASURING
APPARATUS
CISPR 16-1-4-am1 is an amended specication for ra-
dio disturbance and immunity measuring apparatus and
methods. Tis amendment includes ancillary apparatus
and radiated disturbances.
CISPR BASIC STANDARD ON MEASURING RADIO
DISTURBANCE AND IMMUNITY
CISPR 16-1-1 Ed. 2.2 is a part of CISPR designated as a
basic standard. It species the characteristics and perfor-
mances equipment for the measurement of radio distur-
bance voltages, currents, and elds in the frequency range
of 9 kHz to 18 GHz. Also, requirements are specied for
specialized equipment for discontinuous disturbance
measurements. Te requirements include the measure-
ment of broadband and narrowband types of radio distur-
bance. Te receiver types covered include:
quasi-peak measuring receiver
peak measuring receiver
average measuring receiver
rms-average measuring receiver
Te requirements of this publication are to be com-
plied with at all frequencies and for all levels of radio dis-
turbance within the CISPR range of the measuring equip-
ment. Tis consolidated version of CISPR 16-1-1 consists
standards recap
216
of the second edition (2006), its amendment 1 (2006), and
its amendment 2 (2007). Te technical content is, there-
fore, identical to the basic edition plus its amendments
and has been prepared for user convenience.
IEC ISSUES REPORT ON EMC TEST METHODS FOR
METALLIC COMMUNICATION CABLES
IEC Technical Report 62153-4-0 Ed. 1.0 is entitled
Metallic Communication Cable Test Methods Part
4-0: Electromagnetic Compatibility (EMC) Relation-
ship between surface transfer impedance and screening
attenuation, recommended limits. It describes important
background material used during the revision of IEC
81196-1:1995, Clause 14, Guidance for surface transfer
impedance and screening attenuation limits for exible
RF cables. Also included are the relationship between
surface transfer impedance and screening attenuation.
Measurements of surface transfer impedance are provid-
ed to show the correlation of mean screening attenuation
between 200 MHz and 500 MHz and
screening attenuation at both 30 MHz
and 300 MHz.
CORRIGENDUM RE EMC
REQUIREMENTS FOR MEASUREMENT
EQUIPMENT FOR LV SYSTEMS
Commission (IEC) has issued a Corrigen-
dum pertaining to IEC 61326-2-2 Ed. 1.0
(2007-11). Corrigendum 1 aects electri-
cal equipment for measurement, control
and laboratory use EMC requirements
Part 2.2: Particular requirements
Test congurations, operational condi-
tions, and performance criteria for portable test, mea-
suring, and monitoring equipment used in low-voltage
distribution systems.
IEC ISSUES TECHNICAL REPORT ON EMC TESTING OF
METALLIC COMMUNICATION CABLES
IEC 62153-2-1 Ed. 1.0 (2007-11) is a 52-page Technical
Report from the International Electrotechnical Com-
mission (IEC) entitled Metallic communication cable
test methods Part 4-1: Electromagnetic compatibil-
ity (EMC) screening measurements. It gives a brief
introduction to basic concepts and terms that reveal the
common features of test methods.
ETSI FINALIZES EMC STANDARD ON RFID
EQUIPMENT
EN 302 208 Ver. 1.2.1 is entitled Electromagnetic
compatibility and Radio spectrum Matters (ERM): Radio
Frequency Equipment operating in the band 865 MHz to
868 MHz with power levels up to 2 W; Part 1 Technical
requirements and methods of measurement. Tis stan-
dard received TB approval on November 30, 2007, and the
draft was received by the European Telecommunications
Standards Institute Secretariat on December 12, 2007.
2008 EDITION OF NATIONAL ELECTRICAL CODE NOW
AVAILABLE
Te 2008 Edition of the National Electrical Code, long
recognized as the denitive text for re safety in virtually
every type of building, is now available. Among several
hundred revisions are new articles on critical power oper-
ations systems for facilities that must stay online during a
crisis, standards for outlets used in electried truck park-
ing spaces, new rules for tamper-resistant receptacles, and
new provisions for reducing electrical hazards to workers.
Te new edition features greater consistency in ground-
ing and bonding terminology, new identiers at the top of
each page that make nding pertinent information easier,
and shading of revised sections so changes can be spotted
readily.
IEC ISSUES DRAFT OF AMENDMENT ON LIMITS FOR
HARMONIC CURRENT EMISSIONS
IEC 61000-3-2 am1 Ed. 3.0 (2007-11)
is entitled Electromagnetic compat-
ibility (EMC) Part 3-2: Limits Lim-
its for harmonic current emissions
(equipment input current of less than,
or approximately, 16 A per phase). Te
Final Draft International Standard has
the following voting period: 2007-11-30
to 2008-02-01. Purchasers of this draft
version will receive the denitive version
once it is published.
JANUARY 2008
IEC ISSUES DRAFT OF AMENDMENT ON ICS AND
MEASUREMENT OF EM EMISSIONS
IEC 61967-6 am1 Ed. 1.0 is entitled Integrated
Circuits Measurement of Electromagnetic Emissions,
150 kHz to 1 GHz Part 6: Measurement of conducted
emissions Magnetic probe method. Te Final Draft
International Standard has the following voting period:
2007-11-30 to 2008-02-01. Purchasers of this draft ver-
sion will receive the denitive version once it is pub-
lished.
ACCESS HOMELAND SECURITY STANDARDS ONLINE
Te Homeland Security Standards Data Base is pow-
ered online by the American National Standards Institute
(ANSI). Tis site provides one-step access to standards
critical to the jobs of rst responders, code o cials, and
others charged with keeping the nation safe. A browsing
feature lets readers access standards on threats, emer-
gency preparedness and response, borders and transpor-
tation, information analysis and infrastructure protec-
tion, and U.S. Department of Homeland Security adopted
standards.
IEC, ISO, FCC, CSA, or
CISPR?
Cut through the complications
of national and international
standards. Go to
InterferenceTechnology.
com for links to standards
organizations, and sign up for
weekly updates via the eNews.
interference
technology eNews
standards recap
217
DO-160F: ENVIRONMENTAL CONDITIONS & TEST
PROCEDURES FOR AIRBORNE EQUIPMENT
DO-160F: Environmental Conditions & Test Proce-
dures for Airborne Equipment was issued on December 6.
2007 and was prepared by RTCA Special Committee 135.
Tis document provides standard procedures and envi-
ronmental test criteria for testing airborne equipment for
the entire spectrum of aircraft from light general avia-
tion aircraft and helicopters through the Jumbo Jets
and SST categories of aircraft. Te document includes 26
sections and three Appendices. Examples of tests include
vibration, power input, radio frequency susceptibility,
lightning, and electrostatic discharge. Coordinated with
EUROCAE, RTCA/DO-160F and EUROCAE/ED-14F are
identically worded.
Revision F updates DO-160E issued in December 2004.
Twenty-one of the twenty-six sections have been revised.
Major changes were made to Section 8 Vibration, 10 -
Waterproofness, 16 Power Input, 18 Audio Frequency
Conducted Susceptibility, 20 RF Susceptibility, and 21
RF Emissions.
DO-160F is recognized by the International Organiza-
tion of Standardization (ISO) as a de facto international
standard ISO-7137.
THE 3G GROUP FINALIZES 4G SPECIFICATION
Although not strictly an EMC standard, the e cacy
of this new 4G specication will determine the quality of
WiFi communications in an ever more crowded spec-
trum. Te 3rd Generation Partnership Project, or 3GPP,
has settled on the nal specication for the upcoming
fourth generation (4G) Long Term Evolution (LTE) for
WiFi, which is expected to form the backbone of mobile
Internet access in the U.S. and across Europe. In its nal
form, 4G cellular technology will rely on the same basic
multiple-input, multiple-output antenna concept as that
of pieces together 802.11n, but oer improved bandwidth
surpassing the current 3G technology. Te LTE spec piec-
es together multiple signals to achieve a download rate
as high as 326 megabits/s. Uploads on a swath of 20 MHz
of spectrum peak at 86 MHz. Te new spec cuts latency
down to 10 milliseconds between tower and userthus
enabling time-dependant activities such as video calls or
games.
FCC ISSUES REQUIREMENTS FOR TCB POST-MARKET
SURVEILLANCE
Te Federal Communications Commissions O ce of
Engineering and Technology has issued KDB Publication
610077 detailing the requirements of telecommunications
bodies (TCBs) to conduct post market surveillance of
products they have certied. Te document details a typi-
cal procedure that fullls the requirements and addresses
several issues that may arise in implementing a post-mar-
ket surveillance program. One signicant change is that
the required audit sampling requirements has been raised
from two to ve percent.
FEBRUARY 2008
CISPR SPECIFICATION ON ANCILLARY APPARATUS
AND MEASUREMENT OF RADIO DISTURBANCE
CISPR 16-1-4 Ed. 2 (2008-01) is entitled Specication
for radio disturbance and immunity measuring apparatus
Part 1-4: Radio disturbance and immunity measuring
apparatus Ancillary equipment Radiated Distur-
bances. Tis part of CISPR 1600 is considered a basic
standard, which species the characteristics and perfor-
mance for the measurement of radiated disturbances in
the frequency range of 9 kHz to 18 GHz. Specications
for ancillary apparatus are included for: antennas and
test sites, TEM cells, and reverberating chambers. Te
requirements of this publication must be complied with
at all frequencies and for all levels of radiated distur-
bance within the CISPR indicated range of the measuring
equipment. Methods of measurement are covered in part
2-3, and further information on radio disturbance is given
in Part 3 of CISPR 16. Uncertainties, statistics, and limit
modeling are covered in Part 4 of CISPR 16. Tis con-
solidated version of CISPR-16-1-4 consists of the second
edition (2007) and its amendment (2007). Te technical
content is therefore identical to the base edition and its
amendment and has been prepared for user convenience.
PROJECT IEC 61643-21 AM1 ED.1.0 COVER
PERFORMANCE & TEST METHODS FOR LV SURGE
PROTECTORS
Te International Electrotechnical Commission
has published the draft of an amendment covering low
voltage surge protection devices. Te proposed change
is titled Amendment 1 Low voltage surge protection
devices Performance requirements and testing meth-
ods. Tis nal draft has a voting period February 2, 2008
to April 11, 2008. Purchasers of this draft edition will
receive the denitive version once it is approved.
IEEE NANOELECTRIC STANDARDS ROADMAP
AVAILABLE ONLINE
Nanoelectronics is not only one of the most talked
about trends in recent years; its also hard to keep track
of developments in this swiftly changing area of research
and development. Now, the IEEE Standards Association
is oering a draft of its IEEE Nanoelectrics Standards
Roadmap in PDF form (124 pp).
MARCH 2008
IEC ISSUES TECHNICAL REPORT ON EMC AND
OPTIMIZING SHIPBOARD CABLE INSTALLATIONS
Te International Electrotechnical Commission has
issued IEC 62482 Ed. 1.0 (2008-02) entitled Electrical in-
stallations in ships Testing method of routing distance.
Tis Technical Report denes a test method to determine
standards recap
218
minimum routing distances in order to avoid crosstalk of
fast transients (bursts). Te test results may be applied to
cable installations according to IEC 60092-352.
IEC ISSUES THREE NEW EMC STANDARDS ON MV,
HV, AND EHV POWER SYSTEMS
Te International Electrotechnical Commission
(IEC) has issued three new standards on electromag-
netic compatibilityspecically IEC 61000-3-6 Ed. 2.0;
IEC 61000-3-7 Ed. 2.0; and IEC 61000-3-13 Ed. 1.0. All
deal with the assessment of emission limits. Te rst
6100-3-6 is a technical report, informative in nature that
provides guidance on principles that can be used as the
basis for determining the requirements for the connec-
tion of distorting installations to MV, HV, or EHV public
power systems. For the purpose of the report, a distorting
installation means an installation (which may be a load
or a generator) that produces harmonics and/or inter-
harmonics.
Te second IEC 61000-3-7 provides guidance on de-
termining requirements for the connection of uctuating
installations to MV, HV, or EHV public power systems. A
uctuating installation is one (a load or a generator) that
produces voltage icker and/or rapid voltage changes. Te
third IEC 61000-3-13 provides guidance for the connec-
tion of an unbalanced, three-phase installation (load or
generator) that produces voltage unbalance in the system.
E-WASTE LEGISLATIONTO BE IMPLEMENTED IN
CANADA
Recently introduced e-waste regulations are being
implemented in several provinces across Canada. Te new
rules are similar to the European Unions Waste Electrical
and Electronic Equipment (WEEE) directive. Te legisla-
tions goal is to cut the amount of electronic and electri-
cal waste in landlls and to move the burden of disposal
costs for the products at their end-of-life treatment and
disposal to producers rather than end users.
FCC MODIFIES PCS AND AWS POWER LIMIT RULES
ON EMISSIONS AND POWER LIMITS
In a Tird Report and Order released March 21, the
Federal Communications Commission (FCC) has modi-
ed the rules governing broadband personal commu-
nications services (PCS) and advanced wireless service
(AWS-1) to permit the use of a power spectral density
model (PSD) when measuring and calculating emissions
and power limits. Te existing PCS and AWS-1 rules
measure radiated power in terms of watts per emission
and limit power output regardless of bandwidth size. In
the PSD model, radiated power levels are calculated on a
watts-per-MHz basis when operating with greater than
one MHz of bandwidth. Also, under the existing rules,
power levels are measured using peak values, while under
the new rules, power levels may now be measured using
average values. Te more practical measurement tech-
nique will accommodate new wireless technologies that
produce emissions with sub-microsecond power spikes.
To prevent interference that might occur from measuring
average power levels, the FCC adopted a peak-to-average
ratio limit of 13 dB.
APRIL 2008
IEC ISSUES DRAFT STANDARD ON EMC
REQUIREMENTS FOR MEASURING RELAYS &
PROTECTIVE EQUIPMENT
A draft from Project IEC 60255-26 is entitled Measur-
ing relays and protection equipment Part 26: Electro-
magnetic compatibility requirements. Tis nal draft
international standard has a voting period of March 21,
2008 to May 23, 2008. Tose who purchase the draft will
receive a copy of the denitive version once it is pub-
lished.
CISPR EMC STANDARD ON VEHICLES, BOATS, AND
INTERNAL COMBUSTION ENGINES
CISPR 25 Ed. 3 (2008-01) is entitled Vehicles, boats,
and internal combustion engines Limits and methods
of measurement for the protection of on-board receivers
CISPR 25:2008 contains limits and procedures for the
measurement of radio disturbances in the range of 150
kHz to 2500 MHz. Tis standard applies to any elec-
tronic/electrical component intended for use in vehicles,
trailers, and device. Refer to International Telecommuni-
cations Union (ITU) for details of frequency allocations.
Te limits are intended to provide protection for receiv-
ers installed in a vehicle from disturbances produced by
components/modules in the same vehicle. Te method
and measurements for a complete vehicle are in Clause 5,
and the methods and limits for components/modules are
in Clause 6. Only a complete vehicle test can be used to
determine the component compatibility with respect to a
vehicles limit.
Te receiver types to be protected are, for example,
broadcast receivers (sound and television), land mobile
radio, radio telephone, amateur radio, citizens band, satel-
lite navigation systems, and Bluetooth. For the purpose of
this standard, a vehicle is a machine that is self-propelled.
Vehicles include, but are not limited to, cars, trucks,
agricultural tractors, and snowmobiles. Annex A pro-
vides guidance in determining whether this standard
is applicable to particular equipment. Te limits in this
standard are recommended and are subject to modica-
tion as agreed between the vehicle manufacturer and the
component supplier. Tis standard is also intended to be
applied by manufacturers and suppliers of components
and equipment that are to be added to and connected to
the vehicle harness or to an on-board power connector
after delivery of the vehicle. Tis third edition cancels and
replaces the second edition published in 2002. Several sig-
nicant changes have been made in respect to the earlier
edition.
professional societies
219
IEEE Electromagnetic Compatibility Society
(S-27)
Headquarters:
IEEE Operations Center
445 Hoes Lane, P.O. Box 1331
Piscataway, NJ 08855-1331
Phone: (732) 981-0060
www.ewh.ieee.org
President:
Elya B. Joe
K.T.M. Project Engineering
Hod Hasharon, Israel
eb.joe@ieee.org
T
he Institute of Electrical & Electronics Engineers (IEEE),
the worlds largest professional engineering society, is
a global organization of individuals dedicated to improving
the understanding of electrical and electronics engineer-
ing and its applications to the needs of society. Te parent
organization has over 360,000 members, approximately 70
percent of whom belong to technical groups such as the
EMC Society.
Membership in the IEEE is on a qualied basis, with a ba-
sic annual fee of between $130.00 and $165.00 depending on
the region of the world. Te U.S. fee is $165.00. Te Institute
oers major medical and life insurance at low group rates,
and each member receives a copy of the monthly publication,
Spectrum. A liate, associate, and student memberships are
available for those who do not qualify for regular member-
ship; and special arrangements are provided for those tempo-
rarily out of work. Members may join one or more of the 39
technical societies by paying the additional individual society
fee(s). Te EMC Society has an annual fee of $25.00. Student
memberships are $13.00.
Te EMC Society, which enjoys a membership of over
5000, functions through a Board of Directors elected by the
Society membership. Te Board includes 20 members-at-
large who serve staggered 3-year terms. Te Executive Board
consists of the President, President-Elect, Immediate Past
President, Secretary, Treasurer, and ve Vice Presidents, who
oversee the activities of standing and technical commit-
tees. Te o cers are elected by the Board of Directors. Te
annual IEEE International Symposium on Electromagnetic
Compatibility is sponsored by the Board of Directors, which
also coordinates activities of standing technical and ad hoc
committees.
EMC Society publications include Transactions on EMC,
a quarterly journal which features state-of-the-art papers
on interference technology and EMC, and the EMC Society
Newsletter, a quarterly newsletter of society activities, indus-
try developments, practical papers, and notices of meetings,
regulations, and new publications.
Te EMC Society also has a group of distinguished lectur-
ers who are available to present talks to IEEE and other orga-
nizations. Te Society subsidizes the lecturers expenses, and
organizations are encouraged to contact Dr. James Drewniak
(573) 341 4969 or drewniak@mst.edu.com for further details.
Chairmen of these committees welcome assistance and
indications of interest in committee activities from the EMC
Society membership. EMC Society activities are provided by
54 chapters with members in 61 countries worldwide.
A Committee Directory, listing o cer, board, commit-
tee, and chapter contacts names, addresses, and telephone
numbers, is available on the IEEE EMC Society website at
www.emcs.org.
Te EMC Society is also active in technical conferences
and symposia through its sponsorship of the annual Inter-
national Electromagnetic Compatibility Symposium and
participation in other worldwide symposia. Symposia and
conferences are announced in the EMC Society Newsletter.
Te IEEE Symposium on Electromagnetic Compatibility
will be held in Detroit, Michigan at the Cobo Center from
August 1822, 2008. Visit the Symposium website at www.
emc 2008.org.
Te EMC Society has published a number of standards.
For information on EMC Society and other IEEE standards,
contact the IEEE Operations Center, 445 Hoes Lane, P.O. Box
1331, Piscataway, NJ 08855-1331; Phone: (732) 981-0060.
IEEE Product Safety Engineering Society
W
hile product safety had been addressed in various
committees over the years, there was never a profes-
sional society or symposium solely devoted to product safety
engineering as a discipline recently. Te IEEE Product Safety
Engineering Society (PSES) began operation on 1 January
2004.
Te eld of interest of the Society includes the theory,
design, development, and implementation of product safety
engineering for equipment and devices used in the scientic,
engineering, industrial, commercial, and residential arenas.
Te Society provides a focus for cooperative activities, both
internal and external to IEEE, including the promotion and
coordination of product safety engineering activities among
IEEE entities. In addition, the Society will provide a forum
for product safety engineering professionals and design
engineers to discuss and disseminate technical information,
to enhance personal product safety engineering skills, and
to provide product safety engineering outreach to engineers,
students and others with an interest in the eld. Te Society
is accepting members at any time during the calendar year,
both full IEEE members and a liate members. A member-
Professional Societies ag_08.indd 219 5/6/2008 4:34:59 PM
220
ship application is found on the Societys website, www.
ieee-pses.org.
Te IEEE Product Safety Engineering Society works close-
ly with various IEEE Societies and Councils that also include
product safety engineering as a technical specialty. Currently
there are 10 chapters with more in the formation process.
Every year, the PSES hosts a Symposium on Product
Compliance Engineering. Te next conference will be 23-24
October 2007 at the Radisson Hotel & Conference Center
in Longmont, Colorado. Te Symposium will consist of
Technical Sessions, Workshops, Tutorials and Demonstra-
tions specically targeted to the compliance engineering
professional. Attendees will have the opportunity to discuss
problems with vendors displaying the latest Regulatory Com-
pliance products and services. Te Call for Papers is at http://
www.ieee-pses.org/symposium/index.html#CFP. For more
information, visit http://www.ieee-pses.org/symposium/. Te
Societys website will post the date and location of future
conferences. Past papers from the Symposia are available in
IEEE Xplore or on CD (for a fee).
In addition to hosting an annual conference, the PSES
provides the opportunity for product safety engineers to
publish technical papers in a newsletter. See http://www.
ieee-pses.org/newsletters.html. For further information and
details on the Society, including becoming an author, please
visit the website at www.ieee-pses.org.
dB Society
T
his unique, interesting, and exclusive fraternity of EMC
engineers was founded in 1975 by 10 eminent EMC
engineers. Te purpose of the dB Society is to open doors
within the EMC community. Its primary objectives are to
greet and to welcome new engineers, suppliers, vendors, and
manufacturers to the EMC community and to assist them in
establishing contacts in the EMC eld.
Te following membership requirements are unique and
rigidly enforced:
Ten years of service to the EMC community,
Five years of service to a recognized professional, EMC
organization,
Sponsorship by two Duo-Decade members,
Favorable recommendations by three other recognized
individuals in the EMC community, and
Acceptance by the Admissions Board.
Business meetings and informal, relaxed get-togethers
take place during major EMC functions. A formal evening
social function is the highlight of each year and is usually
conducted during the IEEE EMC Symposium. All meetings
are for members only.
U.S. membership is limited to 100 EMC engineers. Tere
are Society a liates in the United Kingdom, India, and Israel.
Qualied candidates are invited to write to:
The dB Society
22117 NE 10th Place
Sammamish, WA 98074
FAX: (425) 868-0547
E-mail: j.n.oneil@ieee.org
ESD Association
Headquarters:
ESD Association
7900 Turin Road, Building 3
Rome, NY 13440-2069
phone: 315-339-6937
fax: 315-339-6793
email: info@esda.org
website: www.esda.org
F
ounded in 1982, the ESD Association is a professional
voluntary association dedicated to advancing the theory
and practice of electrostatic discharge (ESD) avoidance. From
fewer than 100 members, the Association has grown to more
than 2,000 members throughout the world. From an initial
emphasis on the eects of ESD on electronic components,
the Association has broadened its horizons to include areas
such as textiles, plastics, web processing, cleanrooms, and
graphic arts. To meet the needs of a continually changing
environment, the Association is chartered to expand ESD
awareness through standards development, educational
programs, local chapters, publications, tutorials, certication,
and symposia.
ELECTROSTATIC DISCHARGE (ESD) TECHNOLOGY ROADMAP
In the late 1970s, electrostatic discharge, or ESD, became a
problem in the electronics industry. Low-level ESD events
from people were causing device failures and yield losses. As
the industry learned about this phenomenon, both device de-
sign improvements and process changes were made to make
the devices more robust and processes more capable of han-
dling these devices. With devices becoming more sensitive
through the year 2010, it is imperative that companies begin
to determine the ESD capabilities of their handling processes.
Te ESD Technology Roadmap can be downloaded at: www.
esda.org
ANSI/ESD S20.20 CONTROL PROGRAM STANDARD AND
CERTIFICATION
A primary direction for the association is the continued
implementation of a facility certication program in conjunc-
tion with ISO registrars. With the associations ESD control
program standard, ANSI/ESD S20.20: Protection of Electri-
cal and Electronic Parts, Assemblies and Equipment (Exclud-
ing Electrically Initiated Explosive Devices), the Association
oers a means of independently assessing a companys ESD
control program and of issuing a formal ANSI/ESD S20.20
certication.
Te ANSI/ESD S20.20 standard covers the requirements
necessary to design, establish, implement, and maintain an
ESD control program to protect electrical or electronic parts,
assemblies and equipment susceptible to ESD damage from
UNITED KINGDOM &
EUROPE
INDIA USA &
NORTH AMERICA
dB Society.pmd 4/9/04, 11:25 AM 1
222
Human Body Model (HBM) discharges greater than or equal
to 100 volts. Developed in response to the Military Standard-
ization Reform Act, ANSI/ESD S20.20 has been formally
adopted for use by the U.S. Department of Defense.
Although ESD programs have been part of some ISO
9000 audits in the past, the assessment frequently has been
cursory and actual judgment of the program has been left to
the individual auditor. ANSI/ESD S20.20 provides a formal,
consistent process standard that can be audited. It provides
a single, auditable ESD standard for OEMs, suppliers, and
contractors. To date, there are approximately 45 facilities in
11 countries that have become ANSI/ESD S20.20 certied.
Accredited registrars conduct the actual assessments of
the companies. Te association has developed a training
program for the registrars and supervises registrar witness
audits. Tis independent assessment of a companys ESD
control program could be performed as part of the companys
ISO 9000 surveillance audit or as a separate audit. Currently,
there are 120 trained auditors in 11 countries who have been
certied to conduct ANSI/ESD S20.20 audits.
In addition, the ESD Association oers an ESD program
documentation review service. For a fee of $1,500 (US),
members of the ESD Associations Facility Certication
committee will review your ESD program documentation
and will compare it to the requirements listed in ANSI/ESD
S20.20-1999 or the newly revised ANSI/ESD S20.20-2007.
Facilities that choose to become certied during 2007 will
use the ANSI/ESD S20.20-1999 standard as the basis for
their certication. In 2008, companies will have a choice to
become certied to the 1999 or 2007 version. In 2009, facil-
ity certications will be based on the 2007 version only. A
report will be provided that describes the areas that need to
be improved for documentation to be compliant with ANSI/
ESD S20.20-1999 or ANSI/ESD S20.20, respectively. Tis
service should be considered a MUST for any company that
is preparing for facility certication based on ANSI/ESD
S20.20-1999 or ANSI/ESD S20.20-2007.
SYMPOSIA, TUTORIALS, AND PUBLICATIONS
As part of its commitment to education and technology, the
association holds the annual EOS/ESD Symposium, which
places major emphasis on providing the knowledge and tools
needed to meet the challenges of ESD. Scheduled for Septem-
ber 7-12, 2008, at the Westin La Paloma, Tucson, Arizona,
USA, the annual Symposium attracts attendees and contribu-
tors from around the world. Technical sessions, workshops,
authors corners, seminars, tutorials, and technical exhibits
provide a myriad of opportunities for attendees to expand
their knowledge of ESD.
In addition to tutorials and seminars, the association of-
fers a number of publications and reference materials for sale.
Tese range from proceedings of past EOS/ESD Symposia to
textbooks written by experts in the eld of ESD.
PROFESSIONAL CERTIFICATION
To help ensure that the industry can identify trained and
qualied personnel to help solve ESD control problems, the
association supports professional ESD certication programs
designed to dene technical competence and to foster excel-
lence. Te ESD Association oers two certications: ESD
Certied Professional-Device/Design and ESD Certied-
Program Manager. Individuals interested in certication
must rst contact the association to start a certication le in
their name.
Te Device/Design certication was created for device/
design engineers. Te Program Manager certication is
intended for individuals that are involved in designing, imple-
menting, managing, and auditing ESD control programs in
their facilities. All certication programs oered by the asso-
ciation are supported by educational programs, such as spe-
cial seminars and tutorials that provide individuals with the
background and knowledge to assist them in earning their
certication. Tese courses will be oered multiple times this
year, including during the Annual EOS/ESD Symposium. A
complete education schedule, which is updated regularly, is
available online at the association website, www.esda.org.
STANDARDS
Serving as a focal point for ESD standards development, the
associations eorts are inuencing standards throughout
the world. Industry standards and specications provide the
guidance companies need to get their ESD control programs
up and running. Tese voluntary standards cover procedures
and test methodologies for evaluating ESD control materials,
products, and the ESD sensitivity of components.
As an ANSI recognized standards development organi-
zation, the association has published more than two dozen
documents covering electrostatic discharge in the electronics
environment. Tese include standards, standard test meth-
ods, standard practices, technical reports, and informational
advisory documents.
NETWORKING AND LOCAL CHAPTERS
Like many organizations, one of the associations main func-
tions is that of referral and networking. Te ESD Association
welcomes technical questions and will refer the question to
an individual experienced in the eld; this individual will
contact the inquirer directly and will begin a dialogue to
address the situation. In addition, the association publishes
a membership directory, which is available to its members
on the ESDA website. Tis directory is an excellent resource
for locating professional expertise in a particular geographic
area. Most of the associations members are willing to share
their experience with others.
An extension of the networking concept, local chap-
ters supplement and expand the associations eort. Local
chapters provide opportunities for more frequent activities
and programs at the local level, including monthly meetings,
facility tours, networking, and regional ESD tutorials.
AN INTERNATIONAL FLAVOR
ESD Association activity does not stop at the U.S. borders.
Members include over 400 professionals from nearly 40
countries throughout the world. Te ESD Association has
223
presented educational seminars in Europe and Asia. In addi-
tion, the associations standards development eort includes
serving as the o cial U.S. representative to the International
Electrotechnical Commission (IEC) in the area of electrostat-
ics.
A key resource for ESD education and information, the
ESD Association can be reached at 7900 Turin Rd., Bldg. 3,
Rome, NY 13440; phone: 315-339-6937; fax: 315-339-6793;
email: info@esda.org; or visit the associations website at
http://www.esda.org.
Electronic Industries Alliance
Electromagnetic Compatibility Committee (G-46) Headquar-
ters
Chris Denham
VP, Standards & Technology
2500 Wilson Boulevard
Arlington, VA 22201-3834
Phone: (703) 907-7567
Fax: (703) 907-7968
www.geia.org
Committee Chairman
Robert H. Davis
Lockheed Martin, MS2
P.O. Box 4840, EP7-M/D-15
Syracuse, NY 13221-4840
Phone: (315) 456-1085
FAX: (315) 456-0440
robert.h.davis@lmco.com
T
he Electronic Industries Alliance (EIA) is a federation of
associations and sectors operating in the most competi-
tive yet innovative industry in existence. Tey are the critical
players within their industries. Each has its own members, its
own mission, its own autonomy. United under EIA, they form
the premier high technology organization in the world.
EIA connects them, oering not only digital age compa-
nies membership in leading associations, but also providing
the unique benets of a true cross-sector alliance.
EIA is a complete resource and a powerful, unied voice
to expand and to advance the electronics industries. With
over 2100 members, EIA represents over 80 percent of the
$550-billion electronics industry. Tis one-of-a-kind alliance
helps members grow their own businesses, advance the com-
mon good, better dene the electronics industry, and reap
the rewards.
EIA sectors and divisions include: the Consumer Elec-
tronics Association (CEA); the Electronic Components and
Assemblies, Equipment and Supplies Association (ECA); the
Electronic Information Group (EIG); the Government Elec-
tronics and Information Technology Association (GEIA); the
JEDEC Solid State Technology Association; and the Telecom-
munications Industry Association (TIA).
Te Government Electronics and Information Technol-
ogy Association represents the Defense and Information
Technology sector. Te GEIA consists of companies that
manufacture or engage in research, development, or systems
integration to meet the needs of agencies of the U.S. Govern-
ment. Our companies provide commercial products and
services to the government and design or manufacture items
to meet unique governmental requirements.
Te GEIA has 21 councils and committees that address is-
sues in market planning, engineering management, military
specications/standards, information technology, congressio-
nal/legislative issues, procurement regulations and legisla-
tion, export promotion and regulations, public relations,
manufacturing methods and operations, material manage-
ment, purchasing, and other areas.
Te EMC Committee (G-46) deals with the system-ori-
ented discipline that ensures electromagnetic compatibility
in electronics design. Te Committee develops technical
criteria and procedures to guide the design engineer. Its
work also includes spectrum management and conservation;
secure communications; and electromagnetic emissions,
susceptibility, control, and characterization.
Te EMC Committee was established to provide an
industry/user position on government specications, regula-
tions, and standards. Participation has expanded to include
G-46 representation on the various committees drafting
government specications and standards. For example, G-46
participated on the working committees for MIL-STD-464A
and MIL-STD-461E. Te scope of G-46 activities has ex-
panded through the formation of subcommittees to foster and
facilitate the EMC discipline for the benet of EIA member
companies; the nations industrial complex; and the consumer
of functional, compatible, and cost-eective products.
Activities include spectrum management and conserva-
tion; personnel safety; and health care electronics design, us-
age and installation in terms of regulated and non-regulated
electromagnetic (EM) emissions and immunity. Inter- and
intra-environmental areas as they aect systems, subsystems
and equipment, subassemblies, and components are also
areas of concern. In addition to other activities, committees:
Review, assess, advise, and coordinate related activities of
organizations/individuals in government, industry, and
technical societies within EIA.
Assure that EMC legislation, regulations, specications,
standards, requirements, and evaluation procedures are
adequate for procurement and application.
Assure that EMC legislation, regulations, specications,
standards, requirements, and evaluation procedures are
harmonized with their commercial counterparts to the
maximum extent practical for procurement and applica-
tion.
Propose and recommend action and provide support to
other organizations, as deemed desirable.
Coordinate and promulgate information to facilitate
advancement of the state-of-the-art.
Additional information on GEIA and the EMC Com-
mittee (G-46) can be obtained from Marina Spivey at (703)
907-7568, marinas@eia.org, or via the GEIA website at http://
www.geia.org.
224
Society of Automotive Engineers
Committee AE-4, Committee Headquarters:
Dorothy Lloyd
Aerospace Standards Specialist
400 Commonwealth Drive
Warrendale, PA 15096-0001
Phone: (724) 776-4841
dlloyd@sae.org
Committee Chairman:
Committee Chairman:
Gary Fenical
Laird Technologies
P.O. Box A
Shielding Way
Delaware Water Gap, PA 18327
Phone: (717) 424-8510, ext. 1177
gfenical@lairdtech.com
S
AE International is a professional society of engineers
dedicated to a broad spectrum of engineering disciplines
within the aerospace and automotive elds. Under the SAE
Aerospace Council, technical standards committees address
disciplines ranging from electrical power to multiplex signal
characteristicsand from ber optic data transmission to
electromagnetic compatibility. Te many elements of EMC
are handled by SAE Committee AE-4, Electromagnetic
Compatibility, which was organized in 1942 under the Aero-
space Council. Te committee is composed of technically
qualied members, liaison members, and consultantsall of
whom are responsible for writing standards on electromag-
netic compatibility.
Committee AE-4 provides assistance to the technical
community through standardization, improved design and
testing methodology, and technical forums for the resolu-
tion of mutual problems. Engineering standards, specica-
tions, and technical reports are developed by the Committee
and are issued by the Society for industry and governments
worldwide. Objectives of Committee AE-4 are to advance the
state of technology, to stabilize existing technology, to obtain
a uniformity of EMC requirements among government
agencies, and to further the interests of the EMC technical
community. Te theme of design before the fact for EMC is
a guiding concept. Special attention is given to maintenance
of EMI control requirements consistent with the rapidly
advancing state-of-the-art.
Te following is a partial list of documents that have been
issued to assist in implementing SAE objectives. For a com-
plete list, visit the SAE website at www.sae.org or call SAE
Customer Service at (724) 776-4841.
AEROSPACE RECOMMENDED PRACTICES (ARPS)
ARP 935A Control Plan/Technical Construction File
ARP 936A Capacitor, 10 mF for EMI Measurements
ARP 958C Electromagnetic Interference Measurement Antennas,
Standard Calibration Method
ARP 958D Electromagnetic Interference Measurement Antennas,
Standard Calibration Method
ARP 1172 Filters, Conventional, EMI Reduction, Specications for
ARP 1173 Test Methods for EMI Gasketing
ARP 1267 EMI Measurement of Impulse Generators, Standard
Calibration Requirements and Techniques
ARP 1481A Corrosion Control and Electrical Conductivity in Enclo-
sure Design
ARP 1705 Coaxial Test Procedure to Measure the RF Shielding
Characteristics of EMC Gasket Materials
ARP 1870 Aerospace Systems Electrical Bonding and Grounding for
Electromagnetic Compatibility and Safety
ARP 1972 Recommended Practices and Procedures for EMC Test-
ing
ARP 4043A Flightline Bonding and Grounding of Aircraft
ARP 4242 Electromagnetic Compatibility Control Requirements,
Systems
ARP 4244 Recommended Insertion Loss Test Methods for EMI
Power Line Filters
AEROSPACE INFORMATION REPORTS (AIRS)
AIR 1147 EMI on Aircraft from Jet Engine Charging
AIR 1209 Construction and Calibration of Parallel-Plate Transmis-
sion Lines for EMI Susceptibility Testing
AIR 1221 EMC System Design Checklist
AIR 1255 Spectrum Analyzers for EMI Measurements
AIR 1394A Cabling Guidelines for Electromagnetic Compatibility
AIR 1404 DC Resistivity vs. RF Impedance of EMI Gaskets
AIR 1423 EMC on Gas Turbine Engines for Aircraft Propulsion
AIR 1425A Methods of Achieving EMC of Gas Turbine Engine Ac-
cessories, for Self-Propelled Vehicles
AIR 1499 Recommendations for Commercial EMC Susceptibility
Requirements
AIR 1662 Minimization of Electrostatic Hazards in Aircraft Fuel
Systems
AIR 1700A Upper Frequency Measurement Boundary for Evaluation
of Shielding Effectiveness in Cylindrical Systems
AIR 4079 Procedure for Digitized Method of Spark Energy Mea-
surement
SAE AE-4 ELECTROMAGNETIC ENVIRONMENTAL EFFECTS
(E3 OR EMC) COMMITTEE
Te SAE AE-4 E3 Committee provides a technical, coordi-
nating, and advisory function in the eld of E3. Te focus
is on problem areas in which committee expertise can be
eectively applied at the national and international levels.
Electrical and electronic accessories are studied for compat-
ibility within systems and with various communications
media. Engineering standards, specications, and technical
reports are developed and are issued for the general informa-
tion of industry and government.
In the past, subcommittees have included AE-4R, Aircraft
Radiated Environments, and AE-4H, High Power RF Simula-
tors and Eects. AE-4 E3 holds national meetings in conjunc-
tion with the IEEE EMC Society Symposium, usually held in
August at various locations. Additional information about
225
meetings or more specic information on the activities of the
Committee can be obtained by contacting:
Dorothy Lloyd
Aerospace Standards Specialist
400 Commonwealth Drive
Warrendale, PA 15096-0001
Phone: (724) 776-4841
dlloyd@sae.org
or the Chairman, Gary Fenical, gfenical@lairdtech.com.
Visit the SAEs Technical Standards Committee Forum
website at http://forums@sae.org.
NARTE
N
ARTE, Inc. (Te National Association of Radio and
Telecommunications Engineers) was founded as a
non-prot membership/certication organization in 1982.
With the advent of deregulation and the Federal Commu-
nications Commissions encouragement/urging private
industry to establish certication standards to ll the
licensing void, NARTE initiated and developed a com-
prehensive certication program for telecommunications
engineers and technicians.
In 1988, a Command of the United States Navy, seek-
ing a credible and respected certication entity, selected
NARTE as the administrative agent for the certication of
engineers and technicians in the eld of electromagnetic
compatibility (EMC).
In 1993, NARTE, certied by the Federal Communi-
cations Commission (FCC) as a Commercial Operators
License Examination Manager (COLE Manager), was au-
thorized to administer all examination elements for FCC
licensure (formally an FCC responsibility).
In 1994, the ESD Association selected NARTE to
implement and administer a certication program for
Electrostatic Discharge Control Engineers and Techni-
cians.
During 1997, two nations, China and Japan, requested
NARTE assistance in the establishment of specic in-
country certication programs comparable to and able to
meet NARTE certication standards.
In 2000, NARTE established the Unlicensed Wireless
Systems Installer certication to identify fully quali-
ed design and installation personnel. Tis certication
accredits professionals who design and install wireless
systems that do not require a license from the FCC
including information systems, security systems, and
transportation systems.
In 2001, NARTE developed an Agreement with the
IEEE EMC Society for the co-promotion of awareness and
education in EMC/EMI elds. Today the EMC Society
is the keeper of the body of knowledge from which the
iNARTE examinations are derived.
In 2003 NARTE, together with specialist partners,
in cooperation with e-Global Education Partnership,
developed the Product Safety certication program. Te
Product Safety program accredits professionals who use
hazard-based analysis to identify and develop solutions
to eliminate or minimize safety hazards. In 2004 NARTE
signed an Agreement with the IEEE Product Safety
Engineering Society, PSES, to co-promote awareness and
education in Product Safety. Today, technical experts
within the PSES assist iNARTE in the development of the
examination question pools.
In 2006 NARTE executed Agreement with ANSI ASC
63, the Accredited Standards Committee on EMC, for the
purposes of joint cooperation and promotion in education
and technical achievement in EMC engineering.
By 2007, the global interest and participation in
NARTE Certication programs had resulted in almost
one quarter of members being from overseas countries. In
recognition of this, the NARTE Board of Directors voted
unanimously to change the Association name to the, In-
ternational Association for Radio. Telecommunications
and Electromagnetics, iNARTE.
As iNARTE an Agreement of mutual support and
cooperation was signed with the ESD Association in
2007. Te ESD-A will assist iNARTE in formulating and
maintaining the question pools from which certication
examinations are derived.
Since 1982, more than 15,000 telecommunications,
EMC, ESD, and Product Safety engineers and technicians
have met the rigid certication criteria encompassing
education, training, experience, supervisory and peer
references, and examinations.
Te competency of iNARTE-certied personnel has
prompted telephone, rail, power, pipeline, and other in-
dustries to mandate (or to prefer) iNARTE certication as
a prerequisite for employment.
iNARTE is governed by an elected Board of Directors
and o cers, each with exceptional expertise and experi-
ence related to the iNARTE activities. Tis governing
Board receives no compensation in any form. Policy is
formed and promulgated at the Board level and is com-
municated to the iNARTE Executive Director for imple-
mentation.
DESCRIPTION
iNARTE oers Telecommunications Certication
based on four criteria:
Education
Experience
Supervisory and peer references, and;
Testing.
In telecommunications, there are three certication
levels each for technicians and engineers. Entry level is
Junior class; however, initial certication may be at a
higher level depending on years of experience.
EMC, ESD, and Product Safety Certication are based
on the same four criteria of experience, education, refer-
ences, and testing. However, in these areas, one is certi-
ed as either a Technician or Engineeror in some cases,
226
both. Testing is mandatory and may be taken at any time
even though the requisite number of years experience
has not yet been attained. Certication as a Technician
requires six years of experience. Nine years of engineering
experience are required for Engineer certication.
Qualication criteria, examination details, and the
certication process are described on the iNARTE web-
site.
MEMBER SERVICES
i
NARTE certication bespeaks competence, training,
expertise, professional conduct, and ethical practices. It
is a mark of distinction recognized by many employers
as proof of ability. In many corporate environments, it is
a prerequisite for hiring, promotion, and salary advance-
ment. It is a reection of the respect peers and supervi-
sors have for certied individuals and for the way they
carry out their assigned job responsibilities.
OTHER MEMBER SERVICES
A job bank on the web, oering free placement of
resumes and the listing of job opportunities as they are
received at the Headquarters
A consultant listing on the iNARTE website for iN-
ARTE certied engineers and technicians
Local Chapters that promote camaraderie, bring
together those with similar interests, and expand job
contacts, etc.
iNARTE student chapters at colleges and universities
Awards to distinguished and eminent individuals
Additional information on all iNARTE activities is
available on the iNARTE website: www.NARTE.org. Toll-
free number: 1-800-89-NARTE (896-2783)
ACILThe American Council of
Independent Laboratories
T
he American Council of Independent Laboratories
(ACIL) is the trade association representing indepen-
dent, commercial engineering, and scientic laboratory,
testing, consulting, product certifying, and R&D rms;
manufacturers laboratories; related non-prot organiza-
tions; and consultants and suppliers to the industry. Te
organization was founded in 1937. All ACIL activities
focus on its mission: to enhance members success by pro-
viding advocacy, education, services, and mutual support
and by promoting ethics, objectivity, independence, and
free enterprise.
ACIL is a voluntary, non-prot membership organiza-
tion. Programs are determined by members, administered
by an elected Board of Directors, and supported by a
professional sta operating from headquarters in Wash-
ington, D.C.
ACILS CONFORMITY ASSESSMENT SECTION
ACILs Conformity Assessment Section consists of rms
with wide and varied interests, all performing testing, list-
ing, or labeling in accordance with applicable safety and
performance standards, and/or materials testing and reso-
lution of product and structural problems. Several com-
mittees have evolved within the Section to meet the needs
of its diverse membership, including the EMC Committee,
the U.S. Council of EMC Laboratories, and the Tird-
Party Product Certiers Committee. In January 2005, the
Section sponsored a booth at the Consumer Electronics
NARTE EMC Exam Prep Course: Detroit, MI, August 18
NARTE EMC Engineer Exam: Detroit, MI, August 22
227
Show that advocated the advantages of independent third-
party testing and the capabilities of ACIL member EMC
laboratories.
ACILS EMC COMMITTEE
ACILs EMC Committee was established in 1996 to
address the common concerns of the ACIL EMC com-
munity. Te Committee sponsors educational sessions at
ACIL meetings that include both technical and policy is-
sues such as mutual recognition agreements (MRAs). Te
Committee updates members on the latest developments,
upcoming requirements, and activities in the eldboth
domestic and international.
In January 2002, ACIL published a 143-page docu-
ment, Technical Criteria for the Accreditation of Elec-
tromagnetic Compatibility (EMC) and Radio Testing
Laboratories, a checklist to assist both assessors and
laboratories.
Te Committee also formed the U.S. Council of EMC
Laboratories (USCEL) in an eort to aid U.S. laboratories
in addressing technical issues arising from the U.S./EU
MRA and other global concerns. As the USCEL Secre-
tariat, ACIL provides sta and supports volunteers active
in this important area.
Over the past several years, ACIL has administered
round robin prociency testing programs with two arti-
facts allowing laboratories to make both AC line conducted
and radiated emissions measurements over the frequency
range of 0.1530 MHz and 30 MHz1 GHz, respectively.
While continuing the round robins in the frequencies
noted above, ACIL has launched another round robin
with a new test artifact. Tis artifact will allow participat-
ing laboratories to demonstrate prociency for radiated
emissions measurements in the frequency range of 118
GHz. Emissions measurements above 1 GHz are becoming
increasingly common with the advent of fast processors
and wireless devices in the 2.4- and 5-GHz bands.
ACIL also was instrumental in the formation of the
Telecommunication Certication Body Council (TCBC).
New rules establishing TCBs were adopted by the FCC in
December 1998, providing more options for manufactur-
ersthey can now choose to have their product certied
by either the FCC or a private certication body (TCB). A
TCB may approve equipment subject to certication (e.g.,
transmitters, telecom terminal equipment, or scanning re-
ceivers). Te TCB Council addresses the specic concerns
of the TCB community and all constituent bodies are
permitted to participate.
U.S. PRODUCT CERTIFIERS
Key U.S. product certiers are ACIL members and
are reaping many benets, such as participation in
the ACIL Tird-Party Product Certiers Committee
(3PC). Tis Committee provides a forum for members
to discuss and to act upon various issues of common
interest. Tis committee formed the American Council
for Electrical Safety to serve as a forum among testing
laboratories, regulators, and electrical inspectors.
ACILS NATIONALLY RECOGNIZED TESTING LABORATORY
(NRTL) MEMBERS
Most Nationally Recognized Test Laboratories (NRTLs)
are ACIL members. Te ACILs 3PC works with OSHA
to help improve the NRTL Programs value and to promote
items of mutual benet. Te Committee has recently devel-
oped a white paper on surveillance visits, which can also be
viewed on ACILs website.
ACIL OSHA ALLIANCE
In July 2003, ACIL cemented its relationship with the
Occupational Safety and Health Administration (OSHA)
with the signing of an alliance document. Among its
goals, the Alliance details training and education, out-
reach, and communication. Of note is the publication of
a pocket card, outlining the requirements of the NRTL
program and all of the marks of the NRTLs. Tousands of
these cards have been distributed throughout the OSHA
regional network and by ACIL NRTL laboratories. Work
to implement other goals is on going.
For more information, please contact Joan Walsh
Cassedy, CAE, ACILs Executive Director, at 1629 K Street,
NW, Suite 400, Washington, DC 20006-1633. Phone (202)
887-5872; Fax (202) 887-0021; email: jcassedy@ acil.org;
website: www.acil.org.
government EMI /EMC directory
228
Fax: (937) 255-5305
E3 Technical Expert
Mr. Manny Rodriguez ...................(937) 255-8928
manuel.rodriguez@wpafb.af.mil
Aeronautical Systems Center (ASC)
ASC/ENAD
2530 Loop Road West, Bldg. 560
Wright-Patterson Air Force Base, OH 45433-7101
Fax:(937) 255-5305
EMI/EMC Engineer
Mr. Brian M. Lezanic ..................... (937) 255-9051
brian.lezanic@wpafb.af.mil
Air Force Research Laboratory (AFRL)
AFRL/ VAOT
2130 8th St., B. 45
Fax: (937) 476-4263
Mr. Joe Harrington .......................(937) 904-8602
joseph.harrington@wpafb.af.mil
Long Range Strike Wing
651 AESS/EN
2690 Loop Rd. West, Bldg. 556
Fax: (937) 656-4621
Mr. Jerry Burns .............................(937) 656-5201
jeremy.burns@wpafb.af.mil
HQ Air Force Material Command (AFMC)
AFMC/ENP
Bldg. 262/Rm N145/Post116D
Wright-Patterson Air Force Base, OH 45433
Fax: (937) 656-4183
Mr. John S. Welch.........................(937) 255-0651
john.welch@wpafb.af.mil
Aeronautical Systems Center
653rd Aeronautical Systems Squadron
2530 Loop Rd. West
Wright-Patterson AFB, OH 45433-7101
Mr. Robert Rosengarten (937) 255-1786
robert.rosengarten@wpafb.af.mil
Special Operations Forces Systems Group
667 AESS/EN
1895 5th St.
Fax: (937) 255-4018
Mr. Steven Coffman ...................... (937) 255-2860
steven.coffman@wpafb.af.mil
Reconnaissance Systems Wing
GHSG/SD
2640 Loop Road West
Mr. Dave Osborne ......................... (937) 255-7437
david.osborn@wpafb.af.mil
ASC/ YPVF
2725 C Street
Bldg. 553, Room #353
Air Force Research Laboratory, Sensors
Directorate
AFRL/SNRA
2241 Avionics Circle
Bldg 620, Rm 1DG106
Wright-Patterson Air Force Base 45433-7318
EMI Laboratory
Mr. John Zentner .................. (937) 255-904-9024
john.zentner@wpafb.af.mil
Air Force Frequency Management Agency
(AFFMA)
2461 Eisenhower Ave., Ste. 1203
Alexandria, VA 22331-3000
Fax: (703) 428-1575
Technical Director:
Mr. Nelson V. Pollack ................... (703) 428-1501
nelson.pollack@pentagon.af.mil
Director, Operations Div.:
LT COL Thomas Fessenden ........... (703)428-1506
Thomas.Fessendon@pentagon.af.mil
Director, Plans, Requirements & Resources
Mr. Joseph Sulick ..........................(703) 428-1516
Joe.Sulick@pentagon.af.mil
AFFMA POC for E3 Issues:
Major David Pierce ........................(703) 428-1512
david.pierce@pentagon.af.mil
HQ AIA/A4MC
102 Hall Blvd, Ste 258
Lackland AFB, Texas 78243-7091
Fax: (210) 977-2164
HQ AIA/LGMY EMC Program Engineer:
Mr. Gerardo Bacuta ....................... (210) 977-2874
Gerardo.Bacuta@lackland.af.mil
Air Combat Command (ACC)
85 Engineering Installation Squadron
85 EISSCYM
670 Maltby Hall Dr., Ste.234
Keesler AFB, MS 39534-2633
85.eis@keesler.af.mil
Specialized Engineering Flight:
Mr. George R. McNeer, SCY ......... (228) 377-4329
Electromagnetics Section Chief:
Mr. Frederick G. Blache,SCYM ..... (228) 377-3926
fred.blache@keesler.af.mil
E
3
Engineers: ................................. (228) 377-3920
Mr. Gordon Conley .........................(228) 377-1080
gordon.conley@keesler.af.mil
Mr. Tim O. Hillman .........................(228) 377-1079
tim.hillman@keesler.af.mil
Mr. Thomas A. Lipski ....................(2280 377-1084
thomas.lipski@keesler.af.mil
Mr. Gregory P. Smith .....................(228) 377-1083
gregory.smith@keesler.af.mil
Mr. Jesse L. Thomas ..................... (228) 377-1126
jesse.thomas
Mr. Phi D. Tran ...............................(228) 377-1096
phi.tran@keesler.af.mil
Mr. Truong X. Vu ............................(228) 377-1866
truong.vu@keesler.af.mil
Mr. Brandon M. Walker ..................(228) 377-1048
brandon.walker@keesler.af.mil
Mr. Robert N. Wilson .....................(228) 377-1047
robert.wilson@keesler.af.mil
DEPARTMENT OF DEFENSE
Joint Spectrum Center (JSC)
2004 Turbot Landing
Annapolis, MD 21402-5064
Tel: (410) 293-4957
Fax: (410) 293-2631
Commander, JSC (J00):
CAPT Mike Murphy, USN .............. (410) 293-2450
michael.murphy@jsc.mil
Commander's Group: commander@jsc.mil
Technical Director (J01):
Mr. Mike Williams ..........................(410) 293-2457
mike.williams@jsc.mil
Executive Officer (J02)
CDR S.cott T. Stroble, USN ...........(410) 293-2452
scott.stroble@jsc.mil
Operations Division (J03):
Chief: Major Brian Owen, USA ......(410) 293-9813
brian.owen@jsc.mil
Senior Engineer:
Robert Lynch .................................(410) 293-9816
robert.lynch@jsc.mil
RD&A Division (J05):
Mr. Robert Schneider. .................. (410) 293-4958
robert.schneider@jsc.mil
Senior Engineer:
Mr. Marcus Shellman, Jr .............. (410) 293-4959
marcus.shellman@jsc.mil
Team Lead: Mr. Matthew Grenis .. (410) 293-9264
matthew.grenis@jsc.mil
Spectrum Management Information Technology
Division (J06):
Chief: Lt Col Avieon Morgan, USAF............... (410)
293-2527
avieon.morgan@jsc.mil
Plans and Resources Division (J07):
Chief: Mrs. Joanne F. Sykes ......... (410) 293-2356
joanne.sykes@jsc.mil
Acquisition Support Division (J08):
Chief: Lt Col David Gaines ............ (410) 293-2682
david.gaines@jsc.mil
Senior Engineer:
Mr. Irving J. Mager, Jr. ..................(410) 293-2103
irving.mager@jsc.mil
Joint Frequency Management and
Spectrum Engineering Office, Atlantic
(JFMO LANT)
Director JFMO LANT (USJFCOM/J63)
1562 Mitscher Ave., Ste. 200
Norfolk, VA 23551-2488
Tel.: (757) 836-8006
Fax: (757) 836-8022
Director: Raymond G. Davis
raymond.davis@jfcom.mil
UNITED STATES AIR FORCE
ASC/ENAD
2530 Loop Road West
T
he following is a list of the principal U.S., NATO and Canadian Government personnel known to be involved in the interference
technology eld. This list is based upon best available data at the time of publication. Additions, deletions and corrections for any
facility may be updated at any time by e-mailing your changes to cfrost@interferencetechnology.com.
directory of government personnel involved in EMI/EMC
Govermentt Directory ag_08 CS3.indd 228 5/6/2008 4:40:07 PM
229
Air Force Research Laboratory
Information Systems Directorate (AFRL/IF)
525 Brooks Rd.
Rome, NY 13441-4505
Multi-Sensor Exploitation Branch
Deputy Chief: Mr. Raymond W. Tucker, Jr., AFRL/
IFEC ............................................... (315) 330-3884
Raymond.Tucker@rl.af.mil ............... Fax: (315)
330-2022
UNITED STATES ARMY
U. S. Army Research, Development and
Engineering Command (RDECOM)
Attn.: AMSRD-AAR-AEP-F
Bldg. 3208
Picatinny Arsenal, NJ 07806-5000
Fax: (973) 724-3025
Mr. Tom Crowley, Supvr. .............. (973) 724-5678
thomas.m.crowley@us.army.mil
Mr. Derrick Coppin, Proj. Engr. .... (973) 724-4871
derrick.coppin@us.army.mil
Mr. Daniel Gutierrez, Sr. Proj. Engr. .......................
...................................................... (973) 724-4667
daniel.gutierrez@us.army.mil
Mr. Paul Lee, Proj. Engr. .....(973) 724-4584/4667,
paul.m.lee@us.army.mil
Mr. Rutveej Patel, Proj. Engr. ....... (973) 724-4082
rutveej.patel@us.army.mil
Army Research, Development, and
Engineering Command (RDECOM)
Attn: AMSRD-AMR-AE-S-E
Building 4488
Redstone Arsenal, AL 35898-5000
Fax: (256)313-8480
E3 for Army Aircraft Airworthiness
Branch Chief, Avionics & Electronics Branch:
Mr. Frederic T. Reed, III ............... (256) 313-8479
frederic.reed@us.army.mil
Ms. Karen Compton ...................... (256) 313-8437
karen.compton@us.army.mil
Mr. Duane Driver ........................... (256) 313-8447
duane.driver@usarmy.mil
Mr. Lee Fuller ................................ (256) 313-8452
lee.fuller@amrdec.army.mil
Mr. Dale Heber .............................. (256) 313-8455
dale.heber@us.army.mil
Mr. Bruce Hildebrandt .................. (256) 313-8457
bruce.hildebrandt@us.army.mil
Dr. Randolph Jones ...................... (256) 313-8462
randolph.d.jones@us.army.mil
Mr. David Lewey ........................... (256) 313-8464
david.lewey@us.army.mil
Mr. Abner Merriweather ............... (256) 313-8470
abner.merriweather@us.army.mil
Mr. Brian Smith ............................. (256) 313-8484
brian.smith42@us.army.mil
Attn.: AMSAM-RD-MG-SD
SC Functions
Mr. Dave Smith ............................. (256) 876-1688
wayne.d.smith2@us.army.mil
Army Test and Evaluation Command
(ATEC) Redstone Technical Test Center
(RTTC)
E3 Test Branch
Attn.: CSTE-DTC-RT-E-EM
Redstone Arsenal, AL 35898-8052
Supervisor: Mr. James L. Zimmerman ..................
......................................................(256) 876-6386
jzimmerman@rttc.army.mil
Mr. Jeff Craven ............................. (256) 842-2952
jcraven@rttc.army.mil
Mr. David Anconetani ................... (256) 876-0981
danconetani@rttc.army.mil
Mr. Mr. David Elkins...................... (256) 876-3965
delkins@rttc.army.mil
Mr. Jarrod Fortinberry .................. (256) 876-3505
jfortinberry@rttc.army.mil
Mr. Allen Landrith ......................... (256) 876-9495
alandrith@rttc.army.mil
Ms. Jennifer Oberle ...................... (256) 955-6140
joberle@rttc.army.mil
Mr. Joe Reyenga ........................... (850) 833-2837
gerald.reyenga@eglin.af.mil
Dr. Tom Shumpert ........................ (256) 876-9974
tshumpert@rttc.army.mil
Mr. Andrew Smilie ........................ (256) 876-9512
asmilie@rttc.army.mil
Mr. Lee Stucker ............................. (256) 876-1790
lstucker@rttc.army.mil
Dr. Mark Waller ............................. (256) 313-6970
mwaller@rttc.army.mil
Dr. Ken Whigham .......................... (256) 313-0257
kwhigham@rttc.army.mil
Army Center for Health Promotion &
Preventive Medicine (CDR USACHPPM)
Radiofrequency/Ultrasound Program
Attn.: MCHB-TS-ORF
5158 Blackhawk Road
Aberdeen Proving Ground, MD 21010-5403
Mr. John J. DeFrank ...................... (410) 436-3353
Army Engineer Research and Development
Center
Construction Engineering Research Laboratory
Attn.: CEERD-CF-F
P.O. Box 9005
Champaign, IL 61826-9005
Fax: (215) 373-3490
Dr. William J. Croisant .................. (217) 373-3496
william.j.croisant@erdc.usace.army.mil
Army Electronic Proving Ground
Test Engineering Directorate
Electromagnetics and Environments Division
Attn.: CSTE-DTC-EP-TR
Fort Huachuca, AZ 85613-7110
Div. Chf.: Mr. Tommy Romanowski ........................
...................................................... (520) 533-8116
tommy.romanowski@us.army.mil
E3 Branch/Blacktail Test Facility
Br. Chf.: Mr. Johnny Douglas........ (520) 533-5819
johnny.douglas@us.army.mil
Mr. James Smith ........................... (520) 533-2818
james.a.smith4@us.army.mil
Antenna Test Facility
Br. Chief: Mr. Tommy Romanowski ........................
...................................................... (520) 533-8116
tommy.romanowski@us.army.mil
Army Intelligence and Security Command
G4, Operations Division
Attn.: IALO-O
8825 Beulah St.
Ft. Belvoir, VA 22060-5246
Tel.: (703) 428-4479
Fax: (703) 428-4911
Ms. Anne Bilgihan
ambilgi@inscom.army.mil
Army Nuclear and Chemical Agency
(USANCA)
7150 Heller Loop, Ste. 101
Springfield, VA 22150-3198
Mr. R. Pfeffer ................................ (703) 806-7862
pfeffer@usanca-smtp.army.mil
Army Research Laboratory
Survivability/Lethality Analysis Dir.
Attn.: AMSRL-SL-BN
Bldg. E3331, Rm. 205
Mr. Mark Mar ................................ (410) 278-6220
mmar@arl.army.mil
Mr. Ray E. Parsons ........................(410) 278-3248
reparson@arl.army.mil
Mr. Brian G. Smith .........................(410) 278-7265
bgsmith@arl.army.mil
Mr. Garrison Still .......................... (410) 278-3377
gwstill@arl.army.mil
Army Research Laboratory
Attn: AMSRD-ARL-SL-EA
White Sands Missile Range, NM 88002-5513
Mr. Gabriel Palomino ....................(505) 678-8077
gpalomin@arl.army.mil
(ATEC)
United States Army Aberdeen Test Center (ATC)
Electromagnetic Interference Test Facility
(EMITF)
Attn.: CSTE-DTC-AT-SL-V-EMI
400 Colleran Road, Building 456
Fax: (410) 278-0579
EMITF Supervisor:
Mr. Michael C. Geiger ....................(410) 278-2598
michael.geiger@atc.army.mil
Mr. Tom Martin ............................. (410) 278-9340
thomas.martin@atc.army.mil
Electronic Technicians:
Mr. Brian Savage ......................... (410) 278-4851
brian.savage@atc.army.mil
Mr. Dennis Wanzer ....................... (410) 278-4832
dennis.wanzer@atc.army.mil
Mr. Todd Holman .......................... (410) 278-9340
richardt.holman@atc.army.mil
Mr. Terrell Corder.......................... (410) 278-9340
terrell.corder@atc.army.mil
Mr. Duane Buono .......................... (410) 278-9340
duane.buono@atc.army.mil
(ATEC)
Attn.: AMSTE-TM-A
Mr. Jose L. Acosta ......................... (410) 278-1327
Mr. Charles Sohl ............................(410) 278-1336
(ATEC)
Survivability Division
Attn.: CSTE-AEC-SVE S
Bldg. 1660
1660 Jeb Stuart Road
Ft. Bliss, TX 79916-6812
Fax: (915) 568-4404
Mr. Jose Reza ............................... (915) 568-6539
jose.reza@usaec.army.mil
(ATEC)
Test Support Branch
Attn.: CSTE-DTC-WS-EP-TT
Electromagnetics Environmental Effects (E
3
) Branch
Chf.: Mr. Dan Searls ......................(520) 538-4860
Daniel.W.Searls@us.army.mil
Mr. Mark Hynes ............................ (520) 538-4929
hynesm@epg.army.mil
Mr. Scott Morris ........................... (520) 533-8152
230
morriss@epg.army.mil
Battlefield Electromagnetic Environments Office
(BEEO)
Ms. Janet McDonald ..................... (520) 538-4958
mcdonaldj@epg.army.mil
Ms. Sue Schaaf ............................. (520) 538-4947
schaafs@epg.army.mil
White Sands Test Center
Attn.: CSTE-DTC-WS-SV-E
Building 21225
White Sands Missile Range, NM 88002-5158
Mr. Edwin Dunlap ......................... (505) 678-5070
Edwin.dunlap@us.army.mil
Mr. John Chavarria .......................(505) 679-8341
John.chavarria@us.army.mil
Ms. Stephanie Jesson .................. (505) 678-6107
Stephanie.jesson@us.army.mil
UNITED STATES MARINE CORPS
Marine Corps Operational Test and
Evaluation Activity (MCOTEA)
3035 Barnett Ave.
Quantico, VA 22134
Dr. Robert Bell .............................. (703) 784-3289
bellrs@nt.quantico.usmc.mil
Marine Corps Systems Command (MCSC)
Attn.: Mr. Praful Bharucha (C4II/ACENG)
2000 Lester Street
Quantico, VA 22134-5010
E
3
Control Program Sponsor
Mr. Praful Bharucha ......................(703) 432-3806
praful.bharucha@usmc.mil
UNITED STATES NAVY
Bureau of Medicine and Surgery (M3F72)
2300 E. St., N.W.
Washington, DC 20372-5300
Fax: (202) 762-0931
LTJG Jamaal Whitmore ............... (202) 762-3448
jawhitmore@us.med.navy.mil
MID-LANT Area Frequency Coordination
Office
Naval Air Warfare Center Aircraft Division
Code 5.2.2.2
23013 Cedar Point Rd., Unit 4, Bldg. 2118
Patuxent River, MD 20670-1183
Fax: (301) 342-1200
Mr. Mikel R. Ryan ..........................(301) 342-1532
mikel.ryan@navy.mil
Naval Air Systems Command (NAVAIR)
Electromagnetic Environmental Effects (E3)
Division
AIR 4.9.5
48142 Shaw Road, Building 3197, Suite 1040
Patuxent River, MD 20670
E3 Div. Hd.: Mr. Mike Squires ....... (301) 342-1660
Michael.Squires@navy.mil
E3 Aircraft Engineering Branch AIR 4.9.5.1
Br. Head: Mr. Robert B. Smith ..... (301) 342- 9223
Robert.B.Smith5@navy.mil
Mr. Patrick Ahern ...........................(301) 342-2158
Patrick.Ahern@navy.mil
Mr. Paul Belusko ............................(301) 757-2446
Paul.Belusko@navy.mil
Mr. Jon Bergmann ........................ (301) 995-3832
Jon.Bergmann@navy.mil
Mr. Ken Deans ................................(301) 757-2447
Kenneth.Deans@navy.mil
Mr. William DePasquale ............... (301) 757-6961
William.DePasquale@navy.mil
Ms. Angela Foret ............................(301) 342-7813
Angela.Foret@navy.mil
Mr.Michael Funya ..........................(301) 342-1662
Michael.Funya@navy.mil
Mr. Frederick Heather ................... (301) 342-6975
Frederick.Heather@navy.mil
Mr. Joe Kmetz ................................(301) 757-2361
Joseph.Kmetz@navy.mil
Mr. John Matsko ............................(301) 757-2445
John.Matsko@navy.mil
Mr. Luke Onachila ..........................(301) 757-2420
Luke.Onachila@navy.mil
Mr. John Schultz ............................(301) 757-2456
John.Schultz@navy.mil
NAVAIR E3 Aircraft Engineering
AIR 4.9.5.1
Patuxent River, MD
Fax: (301) 342-5390
EMI Lab
Hd.: Mr. Lance Pearce .................. (301) 342-0851
Lance.Pearce@navy.mil
Mr. Kenneth Brezinski .................. (301) 342-0848
Kenneth.Brezinski@navy.mil
Mr. Tom Dennehey ........................ (301) 342-0832
Thomas.Dennehey@navy.mil
Mr. Richard Harvan ...................... (301) 342-0847
Richard.Harvan@navy.mil
Ms. Diane Kempf .......................... (301) 342-0850
Diane.Kempf@navy.mil
Ms. Pam Lumsden ........................ (301) 342-0852
Pamela.Lumsden@navy.mil
Mr.Steve Salisbury ....................... (301) 342-7762
Steven.Salisbury@navy.mil
NAVAIR Aircraft Division, Lakehurst
AIR 4.9.5.1
Hwy. 547, Bldg. 355-2
Lakehurst, NJ 08733-5112
Fax: (732) 323-1844
EMI Lab
Mr. Richard Del Conte ................. (732) 323-2085
delcontera@navair.navy.mil
Mr. David Fetzer ........................... (732) 323-2085
fetzerdw@navair.navy.mil
NAVAIR E3 Weapons Engineering
China Lake Site
AIR 41M200D
1 Administration Circle
China Lake, CA 93555-6001
Fax: (760) 939-1065
Br. Head: Mr. Stephen N. Tanner ..(760) 939-4669
stephen.tanner@navy.mil
Mr. Matthew Artelt........................ (760) 939-7092
matthew.artelt@navy.mil
Mr. John Brandt ............................ (760) 939-1625
john.brandt@navy.mil
Ms. Elissa Carey ............................ (760)939-7525
elissa.carey@navy.mil
Mr. Chinh Dang .............................(760) 939-9435
chinh.dang@navy.mil
Mr. Luke Dawson .......................... (760) 939-7565
luke.dawson@navy.mil
Ms. Patricia Siegel ........................(760) 939-4637
patricia.siegel@navy.mil
NAVAIR E3 Weapons Engineering
Point Mugu Site
AIR 41M200E
575 I Ave., Ste. 1
Point Mugu, CA 93042-5049
Fax: (805) 989-3826
Ld. Engr.: Mr. Les Jue ................... (805) 989-7884
Leslie.Jue@navy.mil
Mr. Will Rom ................................. (805) 989-7885
Will.Rom@navy.mil
NAVAIR, Aircraft Division
48202 Standley Rd.
Unit 5,Ste. 3B
Patuxent River, MD 20670-1910
Integrated Battlespace Simulation & Test Depart-
ment
AIR 5.4.4BE
Fax: (301) 342-6982
Chief Engr.: Mr. Kurt Sebacher ..... (301) 342-1664
Kurt.Sebacher@navy.mil
Electromagnetic Compatibility (EMC) Branch
(5.4.4.5)
Hd.: Mr. Mark Mallory ................... (301) 342-1663
Mark.Mallory@navy.mil
Ms. Virginia Wines (Sec.) ...............(301)757-2507
Virginia.Wines@navy.mil
Mr. Paul Achtellik .......................... (301) 342-7820
Paul.Achtellik@navy.mil
Mr. Omar Ali ...................................(301) 342-7814
Omar.Ali@navy.mil
Mr. Richard Andrusko ...................(301) 342-7810
Richard.Andrusko@navy.mil
Mr. Russ Danaher ......................... (301) 342-0020
Russ.Danaher@navy.mil
Mr. John Finley ............................. (301) 342-4855
John.Finley@navy.mil
Mr. Travis Flanagan ...................... (301) 342-7771
Travis.Flanagan@navy.mil
Mr. Scott Graham ......................... (301) 342-7809
Scott.Graham@navy.mil
Mr. Scott Halt ................................ (301) 342-7575
Scott.Halt@navy.mil
Mr. Danny Johnson........................(301) 342-7811
Daniel.R.Johnson@navy.mil
Mr. Edward Kell ..............................(301) 342-7815
Edward.Kell@navy.mil
Mr. James Lewis ........................... (301) 342-5845
James.Lewis@navy.mil
Mr. Jeffrey Miller .......................... (301) 342-2220
Jeffrey.Miller@navy.mil
Mr. Tim Moynihan ......................... (301) 342-7846
Timothy.Moynihan@navy.mil
Mr. Mike Nahaj .............................. (301) 342-3554
Michael.Nahaj@navy.mil
Mr. Sam Niebauer ..........................(301) 757-0016
Samuel.Niebauer@navy.mil
Mr. Donn Rushing ......................... (301) 342-7848
Donn.Rushing@navy.mil
Mr. Christoph Theofolis .................(301) 342-1667
Christoph.Theofolis@navy.mil
Electromagnetic Environments (EME) Branch
AIR 5.4.4.6
Fax: (301)757-3611 (Bldg. 2105)
(301) 342-3786 (Bldg. 2100)
Branch Hd.: Alan Mazuc ................(301) 342-7816
Alan.Mazuc@navy.mil
Mr. John Crim ............................... (301) 757-3609
John.Crim@navy.mil
Mr. Fabrizio Donis ......................... (301) 757-3604
Fabrizio.Donis@navy.mil
Mr. Jack Farren ............................. (301) 342-0507
Jack.Farren@navy.mil
Mr. Miikka Holso ........................... (301) 757-3604
Miikka.Holso@navy.mil
Ms. Lai-hing Jair ........................... (301) 342-0510
Lai-hing.Jair@navy.mil
Mr. Charles Joseph ....................... (301) 757-3604
Charles.Joseph@navy.mil
Mr. Bruce McClure ........................ (301) 342-0511
231
Bruce.Mcclure@navy.mil
Mr. Mike Orloske ........................... (301) 757-3604
Mark.Orloske@navy.mil
Mr. Ken Runyun ............................ (301) 342-0504
RunyonKR@navair.navy.mil
Mr. Mike Whitaker ........................ (301) 757-3604
Mike.Whitaker@navy.mil
Aircraft Information Security (TEMPEST) Branch
AIR 5.4.4.7
Fax: (301)342-4593
Branch Hd.: Mr. John Ragland ..... (301) 342-6122
Johnnie.Ragland@navy.mil
Mr. Scott Anderson ...................... (301) 342-6066
Scott.T.Anderson@.navy.mil
Ms. Lesley Boylston ..................... (301) 342-6064
Lesley.Boylston@navy.mil
Mr. Tom Dorrie .............................. (301) 342-6065
Thomas.Dorrie@navy.mil
Ms. Tonya Goldring ...................... (301) 342-6108
Tonya.Goldring@navy.mil
Mr. Dan Lemanski ......................... (301) 342-6086
Daniel.Lemanski@navy.mil
Mr. James Lyon ............................ (301) 342-6129
James.Lyon@navy.mil
Mr. Paul Myers .............................. (301) 342-6106
Paul.Myers@navy.mil
Mr. Wayne Wilson ......................... (301) 342-6123
Wayne.Wilson@navy.mil
Ms. Kim Wooden .......................... (301) 342-2194
Kimberly.Wooden@navy.mil
NAVAIR Orlando
Code 6.7.2.3
12350 Research Parkway
Orlando, FL 32826-3275
Mr. Allen D. Parker, NCE ................(407)380-4920
allen.parker@navy.mil
Mr. Robert Kupke ..........................(407) 380-4921
robert.kupke@navy.mil
Mr. Jim Ruch.................................(407) 380-4954
james.ruch@navy.mil
Space and Naval Warfare Systems Center,
Charleston
(SPAWARSYSCEN, Charleston)
P.O. Box 190022
North Charleston, SC 29419-9022
Fax: (843) 218-4238
Electromagnetic Environmental Effects (E3)
Branch, Code J717
Branch Hd.: Mr. Joseph Epple ...... (843) 218-4228
joseph.epple@navy.mil
E3 Engineers
Mr. Frederic Duffy......................... (843) 218-4363
frederic.duffy@navy.mil
Mr. Lou Dornetto .......................... (843) 218-4229
louis.dornetto@navy.mil
Mr. Robert Haman .........................(843) 218-4741
robert.haman@navy.mil
Mr. Michael Hanna ........................ (843) 218-4039
michael.a.hanna@navy.mil
Mr. Guillermo Leiva .......................(843) 218-7129
guillermo.leiva@navy.mil
Mr. Jeff Lucas ................................ (843)218-4339
jeffery.lucas@navy.mil
Mr. Wayne Lutzen ......................... (843) 218-5723
wayne.lutzen@navy.mil
Mr. Thomas Sessions ................... (843) 218-6331
thomas.sessions@navy.mil
Space and Naval Warfare Systems
Activity Pacific
675 Lehua Ave.
Pearl City, HI 96782-3356
Fax: (808) 474-5511
Mr. Brian Kutara, 2915 ................ (808) 474-7330
bkutara@spawar.navy.mil
Mr.Lloyd Hayashida, 2915LH ........(808) 474-1967
lhayashi@spawar.navy.mil
Mr. Steve Kobashigawa, 2915SK ..(808) 471-1976
koba@spawar.navy.mil
SPAWAR Systems Center - San Diego
(SCC-SD)
53560 Hull Street
San Diego, CA 92152-5001
Fax: (619) 563-3791
Applied Electromagnetics Branch, Code 2851
Branch Hd.: Dr. John Meloling ..... (619) 553-2134
john.meloling@navy.mil
Ms. Carol Becker ...........................(619) 553-1033
carol.becker@navy.mil
Mr. Jim Birkett .............................. (619) 553-3586
jim.birkett@navy.mil
Mr. Jose L. Chavez ........................ (619) 553-5075
jose.chavez@navy.mil
Mr. David C. Dawson .................... (619) 553-4075
david.c.dawson@navy.mil
Mr. David Hurdsman ..................... (619) 553-4261
david.hurdsman@navy.mil
Mr. Lance Koyama ........................ (619) 553-3784
lance.koyama@navy.mil
Mr. Carl P. Kugel ........................... (619) 553-3066
carl.kugel@navy.mil
Mr. Ahn Lee ................................... (619) 553-3426
ahn.lee@navy.mil
Ms. Wendy Massey........................(619) 553-9711
wendy.massey@navy.mil
Mr. P. Michael McGinnis .............. (619) 553-5092
mike.mcginnis@navy.mil
Mr. Daniel Meeks .......................... (619) 553-6753
daniel.meeks@navy.mil
Mr. Chris Milligan ..........................(619) 767-4767
christopher.milligan@navy.mil
Mr. Rick Nielsen ............................ (619) 553-6015
rick.nielsen@navy.mil
Mr. Kianoush Rouzbehani ............ (619) 553-3134
kian.rouzbehani@navy.mil
Advanced ElectromagneticTechnology Branch, Code
2856
Branch Hd.: Jodi McGee ................. 619-553-3778
jodi.mcgee@navy.mil
Robert S. Abramo ........................... 619-553-3794
robert.abramo@navy.mil
Rich Adams ..................................... 619-553-4313
rich.adams@navy.mil
Diana Arceo .................................... 619-553-6344
diana.arceo@navy.mil
Lam T. Bui ....................................... 619-553-6038
lam.bui@navy.mil
Jennifer Edwards ............................ 619-553-5428
jennifer.edwards@navy.mil
Daniel R. Gaytan ..............................619-553-7461
daniel.gaytan@navy.mil
David Hilton .................................... 619-553-2666
david.r.hilton@navy.mil
Dr. Burt Markham ........................... 619-553-6082
burt.markham@navy.mil
Hoa Phan ......................................... 619-553-0148
hoa.phan@navy.mil
Randall Reeves ................................619-553-1032
randall.reeves@navy.mil
Mark Reissig ................................... 619-553-4322
mark.reissig@navy.mil
Steve Short ..................................... 619-553-0449
steve.short@navy.mil
Dave Southworth ............................ 619-553-3248
dave.southworth@navy.mil
Anthony Ton .................................... 619-553-5428
anthony.ton@navy.mil
Daryl W. Von Mueller ...................... 619-553-6527
daryl.vonmueller@navy.mil
Space and Naval Warfare Systems
Command (SPAWAR, 051-1E)
4301 Pacific Highway
San Diego, CA 92110-3127
Fax: (619) 524-7896
Electromagnetic Environmental Effects
Mr. F. (Mike) Stewart .....................(619) 524-7230
fred.stewart@navy.mil
Navy and Marine Corps Spectrum Center
(NMSC)
2461 Eisenhower Ave., Ste. 1202
Alexandria, VA 22331-1400
Fax: (703) 325-2667
Mr. Jim Anton ............................... (703) 325-2862
james.anton@nmsc.navy.mil
Mr. Randy Astrackon ................... (703) 325-2777
randy.astrack@nmsc.navy.mil
Mr. Richard Bertram ..................... (703) 325-2662
richard.bertram@nmsc.navy.mil
Mr. Adam Burak ........................... (703) 325-2833
adam.burak@nmsc.navy.mil
Mr. W. Guy Copeland .................... (703) 325-2823
guy.copeland@nmsc.navy.mil
Mr. Thomas E. Downie ................. (703) 325-2750
thomas.downie@nmsc.navy.mil
Mr. James A. Epps ........................ (703) 325-2730
james.epps@nmsc.navy.mil
Mr. Michael Horrocks ................... (703) 325-2802
michael.horrocks@nmsc.navy.mil
Mr. James D. Hunt, III ................... (703) 325-2746
james.hunt@nmsc.navy.mil
Ms. Claire E. Jacobsen ................. (703) 325-2806
claire.jacobsen@nmsc.navy.mil
Mr. Perry Lemmons ..................... (703) 325-2815
perry.lemmons@nmsc.navy.mil
Mr. Timothy Minnix ..................... (703) 325-2785
timothy.minnix@nmsc.navy.mil
Mr.Kurt Nahser ............................. (703) 325-2793
kurt.nahser@nmsc.navy.mil
Mr. Thomas Oliver ........................ (703) 325-2832
thomas.oliver@nmsc.navy.mil
Ms. Elvira Pearce .......................... (703) 325-2822
elvira.pearce@nmsc.navy.mil
Ms. Dru Pontius ............................ (703) 325-0117
dru.pontius.ctr@nmsc.navy.mil
Ms. Carolyn T. Spain..................... (703) 325-2715
carolyn.spain@nmsc.navy.mil
Mr. Anthoy White ......................... (703) 325-2802
anthony.white@nmsc.navy.mil
Mr. Raymond G. Willis .................. (703) 325-2835
raymond.willis@nmsc.navy.mil
Mr. Quan Q. Vu .............................. (703) 325-2865
quan.vu@nmsc.navy.mil
Naval Facilities Engineering Services
CenterEast Coast
Code 24
720 Kennon Street, S.E.
Bldg. 36, Suite 333
Washington Navy Yard
Fax: (202) 433-2280
Mr. Ram Rudra, P.E. .....................(202) 433-5094
sitaram.rudrapattana@navy.mil
232
E3 Systems Engineering and Technology Branch,
Code Q51
Branch Hd: Mr. Chris Barnes ........(540) 653-3457
christopher.j. barnes@navy.mil
E3 Assessment and Evaluation Branch, Code Q52
(RADHAZ/EMV)
Branch Hd: Mr. Charles Denham, NSWCDD
RADHAZ Program Manager .........(540) 653-3444
charles.denham@navy.mil
HERO Testing: Mr. Richard Magrogan ...................
......................................................(540) 653-3445
richard.magrogan@navy.mil
HERO Surveys/Site Approvals: Mr. Steve
Springer ........................................ (540) 653-2931
steven.p.springer@navy.mil
HERP/HERF Surveys: Mr. Robert Needy ................
......................................................(540) 653-3446
robert.needy@navy.mil
Reverberation and Wireless and Below Decks
Testing: Mr. Mike Slocum ............. (540) 653-2212
michael.slocum@navy.mil
CREW/CIED RADHAZ Testing: Mr. Jonathon
Watson .......................................... (540) 653-5271
jopnathon.p.watson@navy.mil
E3 Ship Integration Branch, Code Q53
Acting Hd.: Mr. Rich Link ............. (540) 653-3476
rich.link@navy.mil
E3 Force Level Interoperability Branch, Code Q54
Branch Hd.: Mr. Kenneth Larsen ..(540) 653-8907
kenneth.d.larsen@navy.mil
Shipboard EMI Control Group: Mr. Jason Bardine,
Lead .............................................. (540) 653-7450
jason.bardine@navy.mil
Spectrum Engineering Group: Ms. Margaret Neel,
Lead ..............................................(540) 653-8021
margaret.neel@navy.mil
Force E3 Interoperability Group: Mr. John "Bart"
Barbee, Lead .................................(540) 653-3483
john.s.barbee@navy.mil
Joint E3 Interoperability Group: Mr. Al Pitts, Lead
......................................................(540) 653-6268
albert.pitts@navy.mil
Shipboard EMC Improvement Program: Mr.
George Winters, Program Lead ...(540) 653-3463
george.f.winters@navy.mil
Naval Undersea Warfare Center (NUWC)
1176 Howell St.
Newport, RI 02841-1708
Fax: (401) 841-7423
Electromagnetic Compatibility Branch, Code 3431
Br. Hd.: Mr. Craig F. Derewiany .... (401) 832-5542
derewianycf@npt.nuwc.navy.mil
Mr. Scott Albert ............................ (401) 832-4122
albertsg@npt.nuwc.navy.mil
Mr. Jon Bond ................................ (401) 832-6480
bondjc@npt.nuwc.navy.mil
Mr. Michael J. Carpenter .............. (401) 832-5540
carpentermj@npt.nuwc.navy.mil
Mr. Kent Clemmons ...................... (401) 832-5522
clemmonske@npt.nuwc.navy.mil
Mr. Brian Clougher........................ (401) 832-4213
clougherbf@npt.nuwc.navy.mil
Mr. Douglas L. DeAngelis ............. (401) 832-5872
deangelisdl@npt.nuwc.navy.mil
Mr. Anthony Francis ..................... (401) 832-5493
francisa@npt.nuwc.navy.mil
Mr. Edward R. Javor ..................... (401) 832-5546
javorer@npt.nuwc.navy.mil
Mr. Alan T. McHale ........................ (401) 832-5635
mchaleat@npt.nuwc.navy.mil
Mr. Michael P. Martin ................... (401) 832-5630
martinmp@npt.nuwc.navy.mil
Chief of Naval Operations
Code NC-1, PT-5451, N6F13
2000-Navy Pentagon
Fax: (703) 601-1323
Spectrum Electromagnetic Environmental Effects
(E3) & EMP Policy & Programs
Head: Mr. Dave D. Harris ............. (703) 601-3968
dave.harris@navy.mil
Naval Ordnance Safety and Security
Activity (NOSSA)
NAVORDSAFSECACT INDIAN HEAD
Electrical Explosives Safety
Code N84
Farragut Hall, Bldg. D323
23 Strauss Ave.
Indian Head, MD 20640-5035
Fax: (301) 744-6088
Mr. Charles L. Wakefield .............. (301) 744-6082
charles.wakefield@navy.mil
Electrostatic Discharge (SEA 53C6)
Naval Postgraduate School
Attn.: Code EC/AB
833 Dyer Rd., Rm. 437
Monterey, CA 93943-5121
Tel.: (831) 656-2352
Fax: (831) 656-2955
Dr. Richard W. Adler
rwa@attglobal.net
Mr. Andrew A. Parker
aaparker@nps.navy.mil
Prof. Wilbur R. Vincent
wrvincent@urcad.org
Naval Research Laboratory
Code 5348
4555 Overlook Ave., S.W.
Washington, D.C. 20375-5320
Tel.: (202) 404-7726
Mr. Larry Cohen
Lawrence.Cohen@nrl.navy.mil
Naval SeaSystems Command (NAVSEA)
Force Electromagnetic Environmental Effects (E3)
and Spectrum Management Warfare Systems
Engineering Directorate (SEA 06)
1333 Isaac Hull Ave., S.E., Stop 5011
Wahington Navy Yard, DC 20376-5011
Fax: (202) 781-4568
Force E3 and Spectrum Management Branch (SEA
62E)
Branch Head:
Mr. D. Mark Johnson .....................(202) 781-3140
david.m.johnson4@navy.mil
Deputy: Mr. J. Don Pierce ............ (202) 781-4214
james.d.pierce@navy.mil
Naval Surface Warfare Center, Crane
Division (NSWC Crane)
Code 6094
300 Highway 361, Bldg. 3287E
Crane, IN 47522
Fax: (812) 854-3589
Mr. Larry McKibben ...................... (812) 854-5107
Lawrence.McKibben@navy.mil
Naval Surface Warfare Center
Dahlgren Division
5493 Marple Road, Suite 287
Dahlgren, VA 22448-5153
Electromagnetic Effects Division, Code Q50
Div. Hd: Mr. Marshall Baugher ..... (540) 653-3416
marshall.baugher@navy.mil
Mr. Fredric A. Stawarz .................. (401) 832-5550
stawarzfa@npt.nuwc.navy.mil
Mr. John L.Thibeault ..................... (401) 832-5551
thibeaultjl@npt.nuwc.navy.mil
Mr. Richard L. Thibeault ............... (401) 832-5552
thibeaultrl@npt.nuwc.navy.mil
Mr. Oscar R. Zelaya ...................... (401) 832-5597
zelayaor@npt.nuwc.navy.mil
EMC Lab ........................................ (401) 832-5554
OTHER UNITED STATES AGENCIES
Dept. of Health & Human Services
Food and Drug Administration
Center for Devices and Radiological Health
12725 Twinbrook Pkwy. (HFZ 133)
Rockville, MD 20852
Tel.: (301) 827-4944
Electrophysics Branch, Div. Physical Sciences
Mr. Howard I. Bassen, Chief
Mr. Paul S. Ruggera
Mr. Donald Witters
U.S. Environmental Protection Agency
(EPA)
Office of Radiation and Indoor Air (ORIA)
Radiation Protection Division (6608J)
1200 Pennsylvania Ave., N.W.
Washington, DC 20460
Fax: (202) 343-3204
Acting Dir.: Ms. Bonnie Gitlin ....... (202) 343-9371
gitlin.bonnie@epa.gov
Mr. Norbert Hankin .......................(202) 343-9235
hankin.norbert@epa.gov
HQ, Federal Aviation Administration
Office of Spectrum Policy and Management,
ASR-1
800 Independence Avenue, S.W.
Dir.: Mr. George Sakai .................. (202) 267-9710
George.Sakai@faa.gov
Deputy Director, ASR-2
Mr. Oscar Alvarez ..........................(202) 267-7531
Oscar.Alvarez@faa.gov
Spectrum Planning & International Div., ASR-200
Mr. Donald K. Willis .......................(202) 267-9715
Donald.Willis@faa.gov
Federal Aviation Administration
FAA Aviation Safety (AMN-110N)
1601 Lind Ave. S.W.
Renton, WA 98055
Fax: (425) 917-6590
Chief Scientific & Technical Advisor, EMI &
Lightning:
Mr. David Walen ............................ (425) 917-6586
dave.walen@faa.gov
445 12th Street, SW
Office of Engineering & Technology
Tel.: (202) 418-2470
Chief: Vacant
Deputy Chief.: Mr. Julius P. Knapp
Senior Associate Chief: Alan Stillwell
Policy & Rules Division
Tel.: (202) 418-2472
Chief: Alan J. Scrime
Deputy Chief: Geraldine Matise
Deputy Chief: Ronald Repasi
Assoc. Chief: William D. Lane
Spectrum Policy Branch
Chief: Mr. Jamison Prime
233
Technical Rules Branch
Chief: Ms. Karen Rackley
Spectrum Coordination Branch
Chief: Kathryn Hosford
Network Technology Development Division
Chief: Mr. Jeff Goldthorp
Deputy Chief: Kent R. Nilsson
Electromagnetic Compatibility Division
Tel: (202) 418-2475
Chief.: Mr. Ira Keltz
Deputy Chief: Charles J. Iseman
Technical Analysis Branch
Chief.: Mr. Ronald Chase
Experimental Licensing Branch
Chf.: Mr.James Burtle
Laboratory
7435 Oakland Mills Rd.
Columbia, MD 21046
FCC Laboratory Division
Dr. Rashmi Doshi, Chief ............... (301) 362-3011
Mr. Jim Szeliga ............................. (301) 362-3051
Mrs. Pat Wright ............................ (301) 362-3001
Equipment Authorization Branch
Mr. Joe Dichosco, Chief .............. (301) 362-3024
Ms. Evelyn Cherry......................... (301) 362-3022
Mr. Steve Dayhoff ......................... (301) 362-3027
Mr. Tim Harrington ...................... (301) 362-3039
Mr. Andrew Leimer ....................... (301) 362-3049
Mr. Stanley Lyles .......................... (301) 362-3047
Ms. Diane Poole ............................ (301) 362-3034
Audits and Compliance Branch
Mr. Raymond Laforge, Chief ....... (301) 362-3041
Mr. David Galosky......................... (301) 362-3290
Ms. Katie Hawkins ......................... (301)362-3030
Ms. Phyllis Parrish ...................... (301) 362-3045
Mr.Martin Perrine .......................... (301)362-3025
Mr. Richard Tseng ....................... (301) 362-3054
Technical Research Branch
Mr. William Hurst, Chief .............. (301) 362-3031
Mr. Kwok Chan ............................... (301)362-3055
Mr. James Drasher ....................... (301) 362-3047
Mr. Steve Jones ............................ (301) 362-3056
Mr. Steve Martin ........................... (301) 362-3052
Mr. Tom Phillips ............................ (301) 362-3044
Mr. George Tannahill .................... (301) 362-3026
Customer Service Branch
Mrs. Sandy Haase, Chief .............. (301) 362-3013
Ms. Bessie Bordenave ................... (301)362-3046
Ms. Linda Elliott ............................. (301)362-3032
Mr. Tim Jamerson......................... (301) 362-3014
Mr. Ken Reitzel ............................... (301)362-3015
Ms. Bette Taube ............................. (301)362-3028
Mrs. Joycelyn Walls ...................... (301)362-3017
Goddard Space Flight Center
Greenbelt, MD 20771
Code 565 Electrical Systems Branch
Mr. Steven Graham, EMC Engr. .... (301) 286-3248
Steven.M.Graham.1@nasa.gov
Code 549.3, Electromagnetic Test Engineering
Mr. Edward Dyer, Section Head ... (301) 286-6701
Edward.Dyer@nasa.gov
Mr. Todd Bonalsky, Ld. Magn. Engr. ............. (301)
286-1008
Todd.M.Bonalsky@nasa.gov
National Aeronautics and Space
Administration
Kennedy Space Center
Kennedy Space Center, FL 32899
EMC Engineers
Team Lead:
Ms. Dawn Trout (VA-F3) ............... (321) 867-5366
Dawn.H.Trout@nasa.gov
Mr. Ron Brewer (Analex) .............. (321) 867-5329
ronald.brewer-1@ksc.nasa.gov
Mr. Fred Becker ............................ (321) 867-5306
Frederick.becker-1@ksc.nasa.gov
Mr. Nick Billiris ............................. (321) 867-5330
nicholas.billiris-1@ksc.nasa.gov
Mr. Kevin Clinton (VA-F3) ..............(321) 867-5314
Kevin.J.Clinton@nasa.gov
Mr. Mark La Pointe (AI) ................ (321) 867-2644
mark.lapointe-1@ksc.nasa.gov
Mr. Noel Sargent (Analex) ............ (216) 433-3395
noel.b.sargent@grc.nasa.gov
Mr. James Stanley .........................(321) 867-1991
EMC Test Engineer Manager:
Mr. Jack Cowras (VB-E1) ............. (321) 867-2914
john.cowras-1@nasa.gov
Administration
Langley Research Center
5 North Dryden St., Bldg. 1202
Hampton, VA 23665
Fax: (757) 864-9884
EMC Test Facility (MS 130)
Ms. Courtney Rollins .................... (757) 864-7814
c.h.rollins@larc.nasa.gov
HIRF Laboratory (MS 130)
Mr. Reuben A. Williams ............... (757) 864-6212
r.a.williams@larc.nasa.gov
Mr. Stephen A. Scearce ................(757) 864-6235
s.a.scearce@larc.nasa.gov
Mr. Jay J. Ely ................................. (757) 864-1868
j.j.ely@larc.nasa.gov
Mr. Truong X. Nguyen ................... (757) 864-7528
t.x.nguyen@larc.nasa.gov
Administration
John H. Glenn Research Center
21000 Brookpark Road
Cleveland, OH 44135
EMC Engineer
Mr. Tesfahunei T. Tecle ............... (216) 433-6620
tesfahunei.t.tecle@grc.nasa.gov
Administration
Lyndon B. Johnson Space Center
2101 NASA Rd.
Houston, TX 77058-3696
Avionics Systems Test Branch (EV4)
Branch Chf.: Ms. Linda Bromley .. (281) 483-0129
Analysis Grp. Ldr.: Ms. C. Sham .. (281) 483-0124
EMC Grp. Ldr.: Mr. Robert Scully ..(281) 483-1499
robert.c.scully1@jsc.nasa.gov
EMC Test Laboratory
Facility Mgr: Mr. Rod Robinson ... (281) 483-1465
Electronic Systems Test Laboratory
Facility Mgr: Mr. Ned Robinson ... (281) 483-0130
Administration
George C. Marshall Space Flight Center
Marshall Space Flight Center, AL 35812
Spectrum Manager: Terry Luttrell (256)544-0130
Terry.Luttrell@nasa.gov
EMC Engineers (M/S ES42/4708)
Division Chief: Mr. Tony Clark ...... (256) 544-2394
Tony.Clark@nasa.gov
Branch Chief: Mr. Jeff Wesley .......(256)544-3393
Jeff.Wesley@nasa.gov
Team Lead: Mr. Mark Krome ........(256) 544-5635
Mark.Krome@nasa.gov
Mr. Michael Crane (ERC) ............. (256) 544-7259
Michael.G.Crane@nasa.gov
Mr. Tim Dew (ERC) ....................... (256) 544-3718
Michael.G.Crane@nasa.gov
Mr. Ross Evans (Stanley) ............. (256) 544-2305
Ross.W.Evans@nasa.gov
Mr. Truman Glasscock (Allied) ..... (256) 544-5218
Truman.G.Glasscock@nasa.gov
Mr. Kenneth Gonzalez (Qualis) ..... (256) 544-1658
KennethGonzalez@nasa.gov
Mr. Steve R Jones .........................(256) 544-4373
Steve.Jones@nasa.gov
Mr. Jonathan Mack .......................(256) 544-3599
Jonathan.D.Mack@nasa.gov
Mr. Matthew McCollum ................ (256) 544-2351
Matthew.Mccollum@nasa.gov
Mr. Matthew McGrath (Stanley) ... (256) 544-3051
Matthew.M.McGrath@nasa.gov
Mr. Tom Perry (Jacobs) ................ (256) 544-0744
Thomas.A.Perry@nasa.gov
Mr. Glenn Shelby ..........................(256) 544-0694
Glenn.Shelby@nasa.gov
Mr. Steve Linthicum (Stanley)...... (256) 544-5312
Steve.E.Linthicum@msfc.nasa.gov
EMI Test Facility ............................ (256) 544-8121
National Institute of Standards and
Technology
Electromagnetics Division
Boulder, CO 80305
Div. Chief: Dr. Dennis Friday ..........(303) 497-3131
friday@boulder.nist.gov
Secretary: Ms. Cindy Kotary .........(303) 497-3132
RF Fields Group
Group Leader: Dr. Perry Wilson .. (303) 497-3406
pfw@boulder.nist.gov
Secretary: Ms. Ruth M. Lyons...... (303) 497-3321
Antenna Theory & Applications
Mr. Michael Francis ...................... (303) 497-5873
francis@boulder.nist.gov
Antenna Near-field Measurements
Ms. Katherine MacReynolds ........ (303) 497-7282
mreynold@boulder.nist.gov
Reference Fields & Probes
Dr. Keith D. Masterson ................. (303) 497-3756
masterson@boulder.nist.gov
Complex Fields
Mr. Galen H. Koepke ..................... (303) 497-5766
koepke@boulder.nist.gov
Time Domain Fields
Dr. Robert T. Johnk ....................... (303) 497-3737
johnk@boulder.nist.gov
Quantum Electrical Metrology Division
Gaithersburg, MD 20899
Chf.: Dr. James Olthoff ................. (301) 975-2400
olthoff@nist.gov
Mr. F. D. Martzloff ......................... (301) 975-2409
National Telecommunications and
Information
Administration
(NTIA)
U.S. Department of Commerce
1401 Constitution Ave., N.W.
Office of Spectrum Management
Assoc. Admin.: William T. Hatch .. (202) 482-1850
whatch@ntia.doc.gov
Program Managers
Mr. W. A. Belote, Jr. ...................... (202) 482-2473
wbelote@ntia.doc.gov
Mr. W. Russell Slye ....................... (202) 482-3485
rslye@ntia.doc.gov
234
Mr. James T. Vorhies .................... (202) 482-3590
jvorhies@ntia.doc.gov
Spectrum Plans & Policies
Dir.: Mr. Frederick R. Wentland .... (202) 482-1850
fwentland@ntia.doc.gov
Spectrum Engineering and Analysis Division
Chief: Gerald F. Hurt ..................... (202) 482-1652
ghurt@ntia.doc.gov
Dep. Chief: Robert L. Hinkle ......... (202) 482-3212
rhinkle@ntia.doc.gov
Spectrum Support DivisionHCHB Room 1087
Chief: Mr. Gordon A. Crandall III .. (202) 482-2191
gcrandall@ntia.doc.gov
IRAC Support Branch/Executive Secretary
Chief: Mr. Stephen R. Veader ....... (202) 482-0599
Frequency Assignment BranchHCHB Room 1088
Chief: Mr. Wayne Davis ................ (202) 482-2802
Spectrum Engineering Branch
Chief: Mr. D. Anderson ................. (202) 482-1652
Institute for Telecommunications
Sciences (ITS)
325 Broadway
Boulder, CO 80305-3328
Director: Mr. Val M. O'Day ............ (303) 497-3484
Spectrum Division
Dep. Dir.: Mr. Kenneth C. Allen ......(303) 497-5474
kallen@its.bldrdoc.gov
Spectrum Use & Measurements Group
Mr. Frank H. Sanders .................... (303) 497-5727
fsanders@its.bldrdoc.gov
Propagation Modeling & Dev. Group
Mr. Ronald L. Ketchum ................. (303) 497-7600
rketchum@its.bldrdoc.gov
Telecommunication Planning & Analysis
Services Group
Mr. Eldon J. Haakinson ................. (303) 497-5304
ehaakinson@its.bldrdoc.gov
CANADA
National Defence Headquarters
101 Col. By Drive
Ottawa, Ontario K1A 0K2
Canada
EMC Group
Dr. S. Kashyap .............................. (613) 998-2484
satish.kashyap@dreo.dnd.ca
Aerospace Engineering Test
Establishment (DND)
PO Box 6550
Cold Lake, AB T9M 2C6
Canada
Tel.: (780) 840-8000
Mr. Serge Couture ................................... ext. 7511
couture.sj@forces.gc.ca
NATO
BELGIUM
Belgian Naval Headquarters
Project Office
Kwartier Koningin Elisabeth
1 Everestraat
1140 Brussels
Belgium
Fax: +32-2-7014786
CDR IR Filip Goussaert, Proj. Off. .+32-2-7013334
LT IR Yves Dupont, Proj. Off. ........+32-2-7014495
DENMARK
Naval Materiel Command Denmark
Danneskiold-Samsoees Alle 1, Holmen
Copenhagen
Denmark 1434
Tel.: +45 32 66 35 25
FAX: +45 32 66 35 09
Mr. Peter Malmberg ............................. et@nmc.dk
GERMANY
MODBonnGermany
Bundesministerium der Verteidigung
R IV 3
53003 Bonn Postfach 1328
Germany
Tel.: +49-228-12-4218
Fax: +49-228-12-6784
Wehrtechnische Dienststelle fr
Fernmeldewesen und Elektronik (WTD 81)
Center of Competence EMC
91171 Greding
Germany
Fax: +49-8463-652-655
GREECE
Ministry of National Defence
Hellenic Navy Research Center (GETEN)
229 Messogion Av.
Hollargos 155-60
Greece
Tel.: +30-1-6521650
Fax: +30-1-6521750
Dr. C. Fimerelis, Natl Rep. to SWG-10
Tel.: +30-1-6551221
geten1@compulink.gr
Comm. Eng.: Mr. N. Gioulbabas, Nat'l Rep. to
RADHAZWP
Tel.: +30-1-6551224
hnrc@compulink.gr
ITALY
Ministry of Defense
Centro Interforze Studi per le Applicazioni Militari
(CISAM)
Via della Bigattiera 10
San Piero a Grado
56010 San Piero a Grado (Pisa)
Italy
Fax: +39-050-964406
EMC Div. Hd.:
Lt.Col. Alessandro Brancaccio .. +39-050-964330
alessandro.brancaccio@cisam.it
EMI Section
Lt. Col. Luciano Porcelli ............ +39-050-964350
luciano.porcelli@cisam.it
EMP Section
Lt. Col. Massimo Agostinelli ..... +39-050-964360
massimo.agostinelli@cisam.it
HERO Section
Dr. Mario Pocai .......................... +39-050-964370
mario.pocai@cisam.it
HERP Section
Dr. Vincenzo Angelastro ............ +39-050-964380
vincenzo.angelastro@cisam.it
TEMPEST Section
Maj. Piero Fontana..................... +39-050-964340
piero.fontana@cisam.it
MARITELERADAR
Instituto per le Telecomunicazioni e l'Elettronica
della Marina Militare
"Giancarlo Vallauri"
Viale Italia
72-57126 Livorno
Italy
E-mail: mariteleradar@marina.difesa.it
EMC Dept.
Ric. Ing. Giancarlo Misuri.. + 00-39-0586-238208
EMC Section/Laboratory
Cdr. Roberto Desideri ......... +00-39-0586-238153
C.T.E.R. Salvatore Trovato .. +00-39-0586-238153
THE NETHERLANDS
Royal Netherlands Navy
Naval Establishment
Division Special Product/Consultancy
P.O. Box 1000
1780 CA Den Helder
The Netherlands
Tel.: +31-223-656124
Fax: +31-223-656467
Mr. Henk A. Klok
adv@meobh.navy.dnet.mindef.nl
Ministry of Defense
Directorate of Materials RNI Navy
Department of Naval Architecture & Marine Engi-
neering
P.O. Box 20702
2500 ES The Hague
The Netherlands
Tel.: +31 70 3162335
Fax: +31 70 3163131
Mr. Jan M. Schouten, RNL Navy Rep to SWG/10,
AEWG, LG7
jm.schouten@mindef.nl
UNITED KINGDOM
Defense Evaluation and Research Agency
Ministry of Defense
Room 12, Bldg. 264
DERA Fraser
Fort Cumberland Road, Eastney
Portsmouth, Hants P04 9LJ
United kingdom
Tel.: 01705-334533
FAX: 01705-334545
TEMPEST CONTACTS
Army Electronic Proving Ground
Test Engineering Directorate
RF Test Division
Attn.: CSTE-DTC-EP-TR
Div. Chf.: Mr. Ed Watt ................... (520) 533-8133
Ed.Watt@epg.army.mil
E3 Branch/Blacktail Test Facility
Br. Chf.: Mr. Johnny Douglas........ (520) 533-5819
johnny.douglas@epg.army.mil
Mr. James Smith ........................... (520) 533-2818
james.smith@epg.army.mil
235
products & services index
I
NTERFERENCE TECHNOLOGY'S 2008 EMC Products & Services Index contains approximately 200 different categories to help you nd the equipment,
components, and services you need. Locate additional product information by consulting the Advertiser Index on page 256. Full details of all the
suppliers listed within each category can be found in the Company Directory, starting on page 243. All listings are free of charge to advertisers. To list
your company in the index or to update a listing, go to the Products & Services Directory on www.InterferenceTechnology.com.
ABSORBER CLAMPS
Com-Power Corporation
DNB Engineering, Inc,
ETS-Lindgren
Fischer Custom Communications
Teseq
Underwriters Laboratories, Inc.
ABSORPTIVE FILTERS
Arcotronics, Inc.
Dontech Incorporated
Radius Power, Inc.
ANECHOIC CHAMBER TESTING
CKC Laboratories, Inc.
DNB Engineering, Inc.
Electronics Test Centre
EMC Consulting Dr. Rasek
ETS-Lindgren
Garwood Laboratories, Inc
Intertek Testing Services
NAVAIR Advanced Warfare
Technologies
National Technical Systems
Panashield, Inc.
Parker EMC Engineering
Radiometrics Midwest Corp.
Retlif Testing Laboratories
Schaffner EMC, Inc.
Sypris Test and Measurement
TUV SUD America Inc.
ANECHOIC CHAMBERS
Advanced Test Equipment Rentals
AR
ETS-Lindgren
Microsorb Technologies, Inc.
Panashield, Inc.
Schaffner EMC, Inc.
TUV Rheinland of North America
ANECHOIC CHAMBERS -
CALIBRATION TO IEC 80-3 REQS
ETS-Lindgren
Panashield, Inc.
ANECHOIC CHAMBERS - FIRE
PROTECTION
ETS-Lindgren
Panashield, Inc.
ANECHOIC MATERIALS
ETS-Lindgren
Fair-Rite Products Corp.
Leader Tech, Inc.
Panashield, Inc.
Schaffner EMC, Inc.
ANTENNA FILTERS
Captor Corporation
Fotofab
Spectrum Control
ANTENNA MASTS
ARA Technologies
emv GmbH
ETS-Lindgren
Schaffner EMC, Inc.
ANTI-STATIC COATINGS
Swift Textile Metalizing LLC
ANTI-STATIC MATERIALS
Laird Technologies
ANTI-STATIC PACKAGING
Laird Technologies
ARCHITECTURAL SHIELDING
PRODUCTS
Alco Technologies, Inc.
Axonics, Inc.
emscreen GmbH
Enclosures, Inc.)
Leader Tech, Inc.
Panashield, Inc.
AUDIO SUSCEPTIBILITY
TRANSFORMERS
Solar Electronics Co.
AUTOMOTIVE TESTING
Dayton T. Brown, Inc.
Garwood Laboratories, Inc.
Nemko Dallas, Inc.
TDK Corporation
Teseq
BACKSHELLS,
SHIELDEDASSEMBLIES,
TERMINATIONS
Quell Corporation
BICONICAL ANTENNAS
Citel, Inc.
Noise Laboratory Co., Ltd.
TDK Corporation
Teseq
BI-DIRECTIONAL COUPLERS
AR
emv GmbH
BOARD LEVEL SHIELDS
Chomerics
Fotofab
GORE
Kemtron Limited
Laird Technologies
LCR Electronics, Inc.
Leader Tech, Inc.
Tech-Etch, Inc.
BOOKS, EMI/EMC RELATED
iNARTE, Inc.
ITEM Publications
Kimmel Gerke Associates, Ltd.
Schaffner EMC, Inc.
BRAID
Zero Ground
BROADBAND EMI DETECTORS
ETS-Lindgren
Fotofab
BROADBAND EMI SHIELDING
MATERIAL
Ad-Vance Magnetics, Inc.
Agilent Technologies
Fotofab
Laird Technologies
Leader Tech, Inc.
Panashield, Inc.
Spectrum Control
Spira Manufacturing Corporation
Vanguard Products Corp.
Zero Ground
CABLE ASSEMBLIES &
HARNESSES, SHIELDED
Chomerics
Fotofab
GORE
Roxtec, Inc.
Zero Ground
CALIBRATION SERVICES
AR
ARA Technologies
EM Test AG
emv GmbH
ETS-Lindgren
Liberty Labs, Inc.
Pearson Electronics, Inc.
Schaffner EMC, Inc.
Teseq
Thermo Fisher Scientic
CALIBRATION TESTING
CERTIFICATION SERVICES
D.L.S. Electronic Systems, Inc.
LOOKING FOR
ANTENNAS. Youve
found one great source
of information. On
InterferenceTechnology.
com, search the Products
and Services Directory
for an extensive list
of manufacturers and
distributors. See for yourself.
Products & Services Directory ag_08_Irene.indd 235 5/7/2008 2:16:53 PM
236
iNARTE, Inc.
Technologies
Nemko Inc.
Panashield, Inc.
TDK Corporation
COAXIAL FILTER ONNECTORS
Citel, Inc.
EMC Eupen
Sabritec
Spectrum Control
COMPETENT / CERTIFIED
ACCREDITING BODIES TESTING
iNARTE, Inc.
COMPUTER-AIDED ANALYSIS
SERVICES
AHD EMC Lab
Chomerics
ETS-Lindgren
SimLab Software GmbH
CONDUCTIVE ADHESIVES, CAULKS,
EPOXIES & ELASTOMERS
ARC Technologies, Inc.
Chomerics
East Coast Shielding
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Roxtec, Inc.
Tech-Etch, Inc.
CONDUCTIVE CLOTH
Chomerics
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
CONDUCTIVE COATINGS,
LAMINATES, PAINTING, PLATING
Chomerics
Kemtron Limited
Laird Technologies
Oak-Mitsui Technologies
CONDUCTIVE MATERIALS
Laird Technologies
Leader Tech, Inc.
Sulzer Metco (Canada) Inc.
CONDUCTIVE PLASTICS
Chomerics
CONDUCTIVE TAPES
Chomerics
Kemtron Limited
Leader Tech, Inc.
CONDUCTIVE (PRESSURE
SENSITIVE) TAPES
Laird Technologies
CONDUIT, ELECTRICAL SHIELDED,
MAGNETIC & RF
Magnetic Shield Corporation
Zero Ground
CONSULTANTS
Chomerics
Don HEIRMAN Consultants
EM Software & Systems-SA (Pty) Ltd.
emscreen GmbH
ETS-Lindgren
Laird Technologies
Leader Tech, Inc.
Technologies
COUPLING - DECOUPLING
NETWORKS
AR
Schaffner EMC, Inc.
CRT ELECTRO-OPTICAL SHIELDS
Fotofab
Kemtron Limited
MuShield Company, Inc.
CURRENT PROBES
A.H. Systems, Inc.
emv GmbH
ETS-Lindgren
Liberty Labs, Inc.
Saelig Company
Schaffner EMC, Inc.
Teseq
DIE-CUT SHIELDING MATERIALS
Apex Die & Gasket Inc.
Chomerics
Fotofab
GORE
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Tech-Etch, Inc.
DIRECT LIGHTNING TESTING
EARTH RESISTANCE TESTERS SEE
GROUND RESISTANCE
Kikusui America Inc.
E-FIELD / H-FIELD ANTENNAS
A.H. Systems, Inc.
AHD EMC Lab
AR
Citel, Inc.
emv GmbH
ETS-Lindgren
Schaffner EMC, Inc.
TDK Corporation
ELECTROSTATIC DISCHARGE
GENERATORS
AR
EM Test AG
HV Technologies, Inc.
Technologies
Schaffner EMC, Inc.
Teseq
EMI GASKETS
Chomerics
Fotofab
Leader Tech, Inc.
Spectrum Control
Tech-Etch, Inc.
EMI RECEIVERS
ARA Technologies
ETS-Lindgren
Fotofab
Schaffner EMC, Inc.
Teseq
EMISSIONS TESTING
AHD EMC Lab
Chomerics
Elite Electronic Engineering Inc.
Technologies
Nemko Inc.
Teseq
237
EMI TEST ANTENNAS
A.H. Systems, Inc.
AHD EMC Lab
AR
emv GmbH
ETS-Lindgren
Fotofab
Schaffner EMC, Inc.
TDK Corporation
EMP SIMULATORS
Citel, Inc.
Technologies
EMP/LIGHTNING EFFECTS TESTING
Citel, Inc.
Technologies
Nemko Inc.
ENVIRONMENTAL TESTING
ESD SIMULATORS
AR
DNB Engineering, Inc,
EM Test AG
Liberty Labs, Inc.
Technologies
Schaffner EMC, Inc.
Teseq
ESD TESTING
AHD EMC Lab
iNARTE, Inc.
Technologies
Nemko Inc.
EUROPEAN CERTIFICATION
TESTING
AHD EMC Lab
Elite Electronic Engineering Inc
Nemko Dallas, Inc.
Panashield, Inc.
FACILITIES & SHIELDED
ENCLOSURES SERVICES
ETS-Lindgren
Enclosures, Inc.)
Technologies
Panashield, Inc.
FCC PARTS 15 & 18 TESTING
AHD EMC Lab
Chomerics
Nemko Dallas, Inc.
Panashield, Inc.
FCC PART 68 TESTING
Chomerics
iNARTE, Inc.
Nemko Dallas, Inc.
FCC PART 68 TEST EQUIPMENT
AR
Schaffner EMC, Inc.
FEED-THROUGH FILTERS
Arcotronics, Inc.
Captor Corporation
EMI Filter Company
EPCOS, Inc.
Enclosures, Inc.)
Genisco Filter Corporation
Oxley Developments Co., Ltd.
Quell Corporation
Radius Power, Inc.
Schaffner EMC, Inc.
Spectrum Control
TDK Corporation
WEMS Electronics
FERRITE BEADS & CORES
Chomerics
EPCOS, Inc.
Kemtron Limited
Leader Tech, Inc.
TDK Corporation
FERRITE SUPPRESSION
COMPONENTS
Leader Tech, Inc.
Schaffner EMC, Inc.
Spectrum Control
TDK Corporation
FIBER-OPTIC CABLES
ARA Technologies
Laird Technologies
FIBER-OPTIC SYSTEMS
AR
ETS-Lindgren
Enclosures, Inc.)
Schaffner EMC, Inc.
TDK Corporation
FILTER ARRAYS
Arcotronics, Inc.
Fotofab
Quell Corporation
Spectrum Control
TDK Corporation
FILTER CAPACITORS
Arcotronics, Inc.
Captor Corporation
EMI Filter Company
EPCOS, Inc
Enclosures, Inc.)
Fotofab
LOOKING FOR
METERS provide vital
data. Youve just found
some great sources for
meterselectrostatic
charge and decay, eld
intensity, magnetic eld,
RF power, or RAD-HAZ.
Check the comprehensive,
and continuously
updated, listings of
meter manufacturers
in the Products and
Services Directory on
238
Okaya Electric America, Inc.
Quell Corporation
Radius Power, Inc.
Sabritec
Schaffner EMC, Inc.
Spectrum Control
TDK Corporation
WEMS Electronics
FILTER CHOKES
Arcotronics, Inc.
Captor Corporation
Chomerics
Radius Power, Inc.
Schaffner EMC, Inc.
TDK Corporation
WEMS Electronics
FILTER COILS
Arcotronics, Inc.
Captor Corporation
Curtis Industries
Radius Power, Inc.
Schaffner EMC, Inc.
TDK Corporation
WEMS Electronics
FILTER MODULES
Schaffner EMC, Inc.
Spectrum Control
FILTER PIN CONNECTORS
Quell Corporation
Sabritec
Spectrum Control
FILTER PINS
EMI Filter Company
Quell Corporation
Spectrum Control
FILTER WIRE / CABLE
Spectrum Control
FILTERED POWER ENTRY MODULES
Arcotronics, Inc.
Curtis Industries
Radius Power, Inc.
Schaffner EMC, Inc.
Spectrum Control
FINGER STOCK
Chomerics
Fotofab
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Tech-Etch, Inc.
GROUNDINGSYSTEMS &
SERVICES
Chomerics
Citel, Inc.
Zero Ground DWARE,CABINETRY
HARDWARE & CABINETRY, EMI/
RFI, ESD-RELATED
Laird Technologies
Leader Tech, Inc.
Roxtec, Inc.
Schaffner EMC, Inc.
HELMHOLTZ COILS
AR
ETS-Lindgren
HIGH VOLTAGE PULSE
TRANSFORMERS
TDK Corporation
HONEYCOMB, EMI/RFI
ETS-Lindgren
Enclosures, Inc.)
Fotofab
Leader Tech, Inc.
Tech-Etch, Inc.
HONEYCOMB SHIELDING
Chomerics
Fotofab
Kemtron Limited
Leader Tech, Inc.
HORN ANTENNAS
A.H. Systems, Inc.
AHD EMC Lab
AR
ARA Technologies
emv GmbH
ETS-Lindgren
Liberty Labs, Inc.
Schaffner EMC, Inc.
TDK Corporation
Teseq
IMMUNITY TESTING
AHD EMC Lab
Chomerics
D.L.S. Electronic Systms, Inc.
Nemko Inc.
Teseq
IMPULSE GENERATORS
Rentals
AR
EM Test AG
Liberty Labs, Inc.
INDUCED CURRENT METERS &
PROBES
ETS-Lindgren
INDUCTORS
Arcotronics, Inc.
Captor Corporation
Fotofab
Kemtron Limited
Leader Tech, Inc.
Radius Power, Inc.
Schaffner EMC, Inc.
Spectrum Control
WEMS Electronics
INSERTION LOSS TEST NETWORKS
(MIL-STD & FCC)
INTERFERENCE GENERATORS
AR
Schaffner EMC, Inc.
Teseq
IRON CORE POWDERED MAGNETIC
MATERIALS
ISOLATORS, SIGNAL LINE
Arcotronics, Inc.
ISO 9000 TESTING
Nemko Dallas, Inc.
ISOTROPIC FIELD SENSORS
AR
emv GmbH
ETS-Lindgren
Liberty Labs, Inc.
LIGHTNING EFFECTS TESTING
Teseq
LIGHTNING/EMP GENERATORS
AR
Citel, Inc.
EM Test AG
Technologies
Schaffner EMC, Inc.
LIGHTNING SIMULATORS
AR
Citel, Inc.
EM Test AG
239
Technologies
Schaffner EMC, Inc.
LIGHTNING STRIKE TESTING
Citel, Inc.
National Technical Systems -
Headquarters
Technologies
Nemko Inc.
LINE IMPEDANCE STABILIZATION
NETWORKS LISNS)
emv GmbH
Liberty Labs, Inc.
Teseq
LOG PERIODIC ANTENNAS
A.H. Systems, Inc.
AR
ARA Technologies
emv GmbH
ETS-Lindgren
Liberty Labs, Inc.
Schaffner EMC, Inc.
MAGNETIC FIELD METERS
AR
Schaffner EMC, Inc.
MAGNETIC FIELD PROBES
AR
ETS-Lindgren
MAGNETIC FIELD SHIELDING
GASKETS
Chomerics
Fotofab
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Spectrum Control
METERS, ELECTROSTATIC CHARGE/
DECAY
METERS, FIELD INTENSITY
AR
ETS-Lindgren
METERS, RADIATION HAZARD
ETS-Lindgren
METERS, RF POWER
AR
emv GmbH
ETS-Lindgren
Schaffner EMC, Inc.
METRONICS, METAL ELECTRONIC
COMPONENTS
Leader Tech, Inc.
MICROWAVE ABSORBERS
Axonics, Inc.
Chomerics
ETS-Lindgren
Laird Technologies
Leader Tech, Inc.
Panashield, Inc.
TDK Corporation
MICROWAVE FILTERS
Citel, Inc.
EMI Filter Company
Fotofab
Spectrum Control
MICROWAVE POWER AMPLIFIERS
AR
ARA Technologies
CPI (Communications&Power
Industries) Canada Inc.
emv GmbH
Fotofab
Milmega Ltd.
OPHIR RF
Schaffner EMC, Inc.
MIL-STD 188/125 TESTING
Chomerics
MIL STD 461/462 TESTING
Chomerics
Technologies
Nemko Dallas, Inc.
Panashield, Inc.
MOBILE SHIELDED ROOMS
Panashield, Inc.
MONOPOLE ANTENNAS
Citel, Inc.
TDK Corporation
MRI SHIELDED ROOMS
ETS-Lindgren
Enclosures, Inc.)
Leader Tech, Inc.
Panashield, Inc.
NETWORK ANALYZERS
NVLAP APPROVED / A2LA
APPROVED TESTING
AHD EMC Lab
Chomerics
Technologies
Nemko Dallas, Inc.
PARALLEL PLATE LINE TEST SET
ETS-Lindgren
PORTABLE TEST EQUIPMENT
A.H. Systems, Inc.
AR
ARA Technologies
Saelig Company
Schaffner EMC, Inc.
POWER AMPLIFIERS, AUDIO BAND
AE TEchron, Inc.
POWER LINE CONDITIONING
EQUIPMENT
Citel, Inc.
LOOKING FOR
SHIELDING valuables
from harm is an age-old
idea, but eective use of
EMI shielding products can
be a challenge and todays
sensitive electronics demand
the best shielding choice.
Teres an Ask the Experts
Forum devoted to shielding
on InterferenceTechnology.
com. Post a question
yourself, or check out the
answers.
240
POWER LINE DISTURBANCE
MONITOR
POWER-LINE IMPEDANCE
STABILIZATION NETWORKS
(PLISNS)
Arcotronics, Inc.
ETS-Lindgren
POWER LINE FILTERS
Arcotronics, Inc.
Captor Corporation
Citel, Inc.
Curtis Industries
EPCOS, Inc
ETS-Lindgren
Enclosures, Inc.)
Radius Power, Inc.
Schaffner EMC, Inc.
Spectrum Control
TDK Corporation
WEMS Electronics
POWER LINE ISOLATORS
Arcotronics, Inc.
PRINTED CIRCUIT BOARD FILTERS
Arcotronics, Inc.
Captor Corporation
Curtis Industries
Leader Tech, Inc.
Oak-Mitsui Technologies
Radius Power, Inc.
Spectrum Control
TDK Corporation
WEMS Electronics
PRODUCT SAFETY TESTING
Chomerics
Nemko Dallas, Inc.
TEV Rheinland of North America
RADHAZ TESTING
Technologies
RADIATION HAZARD PROBES
ETS-Lindgren
RETROFIT FILTERS & ONNECTORS
Schaffner EMC, Inc.
RF LEAK DETECTORS
ETS-Lindgren
RF POWER AMPLIFIERS
AR Worldwide Modular RF
AR
ARA Technologies
CPI (Communications&Power
Industries) Canada Inc.
Fotofab
OPHIR RF
Schaffner EMC, Inc.
TDK Corporation
Teseq
RF SHIELDING GASKETS
Chomerics
Fotofab
GORE
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Roxtec, Inc.
Spectrum Control
Tech-Etch, Inc.
RS03>200 V/METER TESTING
Technologies
RTCA DO-160 TESTING
Chomerics
Technologies
Nemko Dallas, Inc.
Panashield, Inc.
SCIF DESIGN, CONSTRUCTION &
MAINTENANCE
ETS-Lindgren
Enclosures, Inc.)
Milmega Ltd.
Panashield, Inc.
SHIELDED AIR FILTERS
Chomerics
ETS-Lindgren
Fotofab
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Tech-Etch, Inc.
SHIELDED BUILDINGS
emscreen GmbH
ETS-Lindgren
Enclosures, Inc.)
Panashield, Inc.
SHIELDED CABINETS & HARDWARE
Chomerics
Enclosures, Inc.)
Fotofab
Panashield, Inc.
Saelig Company
SHIELDED CHASSIS, CASES &
CANS
Arcotronics, Inc.
Fotofab
Laird Technologies
Leader Tech, Inc.
SHIELDED COMPONENTS
Chomerics
Tech-Etch, Inc.
SHIELDED CONDUITS
Chomerics
SHIELDED DOORS
Chomerics
emscreen GmbH
ETS-Lindgren
Enclosures, Inc.)
Panashield, Inc.
Saelig Company
TDK Corporation
SHIELDED FUSE HOLDERS
Arcotronics, Inc.
SHIELDED ROOM FILTERS
Arcotronics, Inc.
Captor Corporation
Chomerics
EPCOS, Inc
ETS-Lindgren
Enclosures, Inc.)
Fotofab
Panashield, Inc.
WEMS Electronics
SHIELDED ROOMS
AR
emscreen GmbH
ETS-Lindgren
Enclosures, Inc.)
241
Panashield, Inc.
Schaffner EMC, Inc.
TDK Corporation
SHIELDED ROOMS, ACCESSORIES
ARA Technologies
Axonics, Inc.
Chomerics
emscreen GmbH
ETS-Lindgren
Enclosures, Inc.)
Leader Tech, Inc.
Panashield, Inc.
Roxtec, Inc.
Saelig Company
Schaffner EMC, Inc.
Zero Ground
SHIELDED ROOMS, LEAK
DETECTORS/MONITORS
ETS-Lindgren
SHIELDED ROOMS, MOBILE
Enclosures, Inc.)
Panashield, Inc.
SHIELDED SWITCHES
Arcotronics, Inc.
EMC Component Group, Inc.
Fotofab
SHIELDED TRANSPARENT
WINDOWS
Chomerics
emscreen GmbH
Enclosures, Inc.)
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
SHIELDED TUBING
Chomerics
SHIELDING EFFECTIVENESS
TESTING
AHD EMC Lab
Chomerics
D.L.S. Electronic Systems, Inc
emscreen GmbH
ETS-Lindgren
Enclosures, Inc.)
Leader Tech, Inc.
Technologies
Nemko Inc.
Panashield, Inc.
SHIELDING MATERIAL, FOILS
Chomerics
Fotofab
Laird Technologies
Leader Tech, Inc.
SHIELDING MATERIAL, MAGNETIC
FIELD
Chomerics
Enclosures, Inc.)
Fotofab
Kemtron Limited
Leader Tech, Inc.
Zero Ground
SHIELDING MATERIAL, RF
Axonics, Inc.
Chomerics
emscreen GmbH
Enclosures, Inc.)
Fotofab
GORE
Kemtron Limited
Laird Technologies
Leader Tech, Inc.
Panashield, Inc.
Roxtec, Inc.
Saelig Company
Schaffner EMC, Inc.
Spectrum Control
Tech-Etch, Inc.
Zero Ground
SIGNAL GENERATORS
Saelig Company
Schaffner EMC, Inc.
SIGNAL LINE FILTERS
Arcotronics, Inc.
Captor Corporation
Citel, Inc.
EMI Filter Company
EPCOS, Inc
ETS-Lindgren
Enclosures, Inc.)
Radius Power, Inc.
Spectrum Control
TDK Corporation
WEMS Electronics
SITE ATTENUATION TESTING
AHD EMC Lab
Chomerics
emscreen GmbH
ETS-Lindgren
Enclosures, Inc.)
Panashield, Inc.
SITE SURVEY SERVICES
AHD EMC Lab
ETS-Lindgren
Enclosures, Inc.)
Laird Technologies
SOFTWARE, EMI/EMC-RELATED
AR
EM Software & Systems-SA (Pty) Ltd.
emv GmbH
Schaffner EMC, Inc.
Simlab Software GmbH
Teseq
TDK Corporation
SPECTRUM ANALYZERS
STANDARDS TRANSLATIONS
STATIC CONTROL MATERIALS &
EQUIPMENT
Schaffner EMC, Inc.
SUPPRESSORS
Citel, Inc.
EMC Component Group, Inc
LOOKING FOR
TESTING is the bedrock
of EMC compliance.
Complying with regs and
preventing interference
depend on test results,
and EMC testing involves
complex procedures.
Keep up with the latest
in changing EMC
standards and mandated
procedures with your
subscription to Interference
Technologys eNews. Go
to InterferenceTechnology.
com and enter your email to
receive these timely updates
weekly.
242
Quell Corporation
Schaffner EMC, Inc.
SYSTEM ASSESSMENT, EMP,
SGEMP, EMI
Chomerics
Kimmel Gerke Associates, Ltd. - AZ
Kimmel Gerke Associates, Ltd. - MN
Laird Technologies
Technologies
TELCORDIA TESTING
Chomerics
Nemko Inc.
TELECOMMUNICATIONS TEST
NETWORKS
AR
OPHIR RF
TEM/GTEM CELLS
AR
emv GmbH
ETS-Lindgren
Enclosures, Inc.)
Schaffner EMC, Inc.
Teseq
TEMPEST FILTERS
Arcotronics, Inc.
Captor Corporation
Curtis Industries
Enclosures, Inc.)
Spectrum Control
WEMS Electronics
TEMPEST SUPPRESSED PRODUCTS
Arcotronics, Inc.
TEMPEST TEST EQUIPMENT
A.H. Systems, Inc.
ARA Technologies
TEMPEST TESTING
Chomerics
Technologies
Panashield, Inc.
TERMINAL BLOCKS
Curtis Industries
TEST ACCESSORIES
AR
EM Test AG
ETS-Lindgren
OPHIR RF
TEST ANTENNAS
A.H. Systems, Inc.
AHD EMC Lab
ARA Technologies
Teseq
TDK Corporation
TEST EQUIPMENT, LEASING &
RENTAL
A.H. Systems, Inc.
AR
Teseq
TEST EQUIPMENT, REPAIR AND
CALIBRATION
A.H. Systems, Inc.
AR
ETS-Lindgren
Schaffner EMC, Inc.
Teseq
TESTING LABORATORIES
Chomerics
iNARTE, Inc.
National Technical Systems -
Headquarters
Technologies
Nemko Inc.
TDK Corporation
TRAINING SEMINARS &
WORKSHOPS
Chomerics
D.L.S. Electronic Systems, Inc
EM Test AG
emscreen GmbH
Fotofab
iNARTE, Inc246.
Kimmel Gerke Associates, Ltd. - AZ
Kimmel Gerke Associates, Ltd. - MN
Leader Tech, Inc.
Nemko Inc.
Teseq
TRANSFORMERS, POWER LINE
ISOLATION
TRANSFORMERS, SIGNAL LINE
ISOLATION
TRANSFORMERS, SHIELDS
Fotofab
TRANSIENT DETECTION &
MEASURING EQUIPMENT
Chomerics
TRANSIENT GENERATORS
AR
Citel, Inc.
EM Test AG
Schaffner EMC, Inc.
Teseq
TRANSIENT SUPPRESSORS
Arcotronics, Inc.
Citel, Inc.
EPCOS, Inc
Quell Corporation
TUBING, EMI SHIELDED
TURNTABLES
emv GmbH
ETS-Lindgren
VOLTAGE PROBES
Saelig Company
WIRE & CABLE FILTERS
ETS-Lindgren
Panashield, Inc.
Schaffner EMC, Inc.
Siepel
Spectrum Control
Total Shielding Systems
Universal Shielding Corp.
243
company directory
M
ANUFACTURERS, CONSULTANTS, AND SERVICE ORGANIZATIONS active in the interference tech nology eld are listed in this directory. All companies
shown are advertisers in this issuethe page numbers of their advertisements are shown with their listings, and their U.S. and International
sales ofces are also given. To learn how to be included in this directory, please e-mail to info@interferencetechnology.com.
3M Electronic Solutions Division ........................ 89
A130-4N-36, 6801 River Place Blvd., Austin, TX 78726; 800-
676-8381; Fax: 800-828-9329, electrical@3M.com; www.3M.
com/emc;
A
A.H. Systems, Inc. .......................................13, 49
9710 Cozycroft Ave., Chatsworth, CA 91311; 818-998-0223;
Fax 818-998-6892; sales@ahsystems.com; www.AHSystems.
com; Arthur C. Cohen, Pres.; Travis Samuels, Ops. Dir.
AL T & M Solutions ................................................... 770-973-7492
GA T & M Solutions ................................................... 770-973-7492
LA Southwest Electronic Ind., Inc. ............................ 972-523-0017
OK Southwest Electronic Ind., Inc. ............................ 972-523-0017
TN T & M Solutions ................................................... 770-973-7492
TX Richardson, Southwest Electronics Ind. ............. 972-523-0017
INTERNATIONAL
AUS Sydney, Test & Measurement Australia PTY Limited
........................................................................... 61-2-4739-9523
AUT Ludwigsburg, ProNova Elektronik GmbH ....... 49-7141-285820
BEL Lelystad, EEMCCoimex ................................... 31-320-295-395
BGR Sofia, Test Solutions ...........................................359 2 970 1990
BOL Alianza S.E.T. ........................................................ 571-691-5369
CHE Ludwigsburg, ProNova Elektronik GmbH ....... 49-7141-285820
CHN Beijing, EMC Technology Ltd. .........................8610-8267-5757
Beijing, Compliance Direction Systems, Inc
. ......................................................................... 8610-6846-0592
COL Alianza S.E.T. ........................................................ 571-691-5369
CRI Alianza S.E.T. ........................................................ 571-691-5369
DEU Ludwigsburg, Pro Nova Elektronik GmbH .....49-7141-2858-20
ECU Bogota, Alianza S.E.T. .......................................... 571-691-5369
ESP Madrid, Unitronics S.A.U. ............................... 34-91-540-0125
FRA Gennevilliers, EMV France ............................33-1-47-91-75-30
GRC Vector Technologies LTD. ........................... 30 210 68 58008 0
HND Alianza S.E.T. ........................................................ 572-691-5369
IDN Singapore Technologies Electronics LTD ........... 65-6413-3119
IND TTL TECHNOLOGIES PVT. LTD. .......................... 8025260646
ISR Kfar-Saba, Wave Technologies .........................972-9-7644878
ITA Segrate,Narda Safety Test Solutions s.r.l. 011 39 02 2699871
Druento, Teseo S.P.A. .....................................39-011-994-1911
JPN Tokyo, Techno Science Japan Corp. ................... 81357176130
KOR Kyunggi-Do, Taehung Trading Inc. ..................... 031-454-2070
LUX EEMCCoimex ................................................... 31-320-295-395
MYS Singapore Technologies Electronics LTD ........... 65-6413-3119
NLD Lelystad, EEMCCoimex ................................... 31-320-295-395
PAN Alianza S,E,T, ........................................................ 571-691-5369
POL Warszawa, AM Technologies Polska ................48-2253-22801
RUS Moscow, Sernia LTD. ...................................011 7 495 932 9242
SGP Singapore Technologies Electronics LTD ........... 65-6413-3119
SLV Alianza S.E.T. ........................................................ 571-691-5369
SWE AGETO MTT AB ............................................. 01146084467730
THA Singapore Technologies Electronics LTD ........... 65-6413-3119
TUR Izmir, Norana ..................................................90-232-464-0011
TWN Shi-Chih City, Taipei-Hsien, Superlink Technology Corp.
.........................................................................886-2-2698-3456
ARA Technologies ........................................... 29
PO Box 226, Smithtown, NY 11787; 631 724-4619; Fax: 631
361-8691; emc@aratech-inc.com; aratech-inc.com
A2LA - American Assoc. for Laboratory Accred. ....227
5301 Buckeystown Pike Suite 350, Frederick, MD 21704;
301-644-3248; Fax 301-662-2974; www.A2LA.org
Acme Testing Co. ........................................... 195
P.O. Box 3, 2002 Valley Highway, Acme, WA 98220-0003; 360-
595-2785; Fax: 360-595-2722; cmetest@acmetesting.com;
www.acmetesting.com; John Griffin, V.P./G.M; Harry Hodes,
President/CEO
Ad-Vance Magnetics, Inc. ................................203
625 Monroe St., P. O. Box 69, Rochester, IN 46975;
574-223-3158; Fax 574-223-2524; sales@advancemag.com;
www.advancemag.com; Richard D. Vance, Pres.; Kay Nixon, VP
Advanced Monolythic Ceramics ........................ 139
3101 Constitution Ave., Olean, NY 14760; 716 372-5225; Fax:
716 372-5467; info@amccaps.com; www.amccaps.com;
Mike Rakoska, Customer Service Representative
Advanced Test Equipment Rentals ...................... 34
10401 Roselle St., San Diego, CA 92121; 800-404-2832; Fax
858-558-6570; sales@atecorp.com; www.atecorp.com
Central North, Mark Bohuslav....................................... 800-404-2832
Central South, Chris Reed ............................................. 800-404-2832
North East, Kevin Croppo .............................................. 800-404-2832
North West, Patrick Kennedy ........................................ 800-404-2832
South East, Greg Johnson ............................................. 800-404-2832
South West, Jim Tighe ......................................................800-404-283
AE Techron, Inc.
2507 Warren St., Elkhart, IN 46544; 574-295-9495; Fax:
574-295-9496; sales@aetechron.com; www.aetechron.com
5301 Stevens Creek Blvd., Santa Rosa, CA 95051; 800-829-
4444; contact_us@agilent.com; www.agilent.com
Amber Helm Development L.C. / AHD EMC Lab
92723 Michigan Hwy 152, Sister Lakes, MI 49047;
877-730-2433, Fax 269-424-7014; ghelm@ahde.com; www.
ahde.com; Gordon L. Helm, NCE
MI St. Joseph, Amber Helm Development L.C. / Gordon Helm,
NCE / PE ................................................................ 269-313-2433
Alco Technologies, Inc. ................................... 101
1815 W. 213th St. #175, Torrance, CA 90501; 310-328-4770;
Fax 310-328-1262; alcotech@alcotech.com; www.alcotech.
com; Lawrence Corky Lopez
Amphenol Canada Corp. .................................. 135
20 Melford Dr., Scarborough, Ontario M1B 2X6; 416-291-4401;
416-292-0647; sales@amphenolcanada.com; http://www.amphe-
nolcanada.com; Rick Lewis, Director / Data Telecom;
Andy Toffelmire, Director / Aerospace
CO Englewood, Sierra Tech. Grp. .............................. 303-790-1700
FL Treasure Island, EDSI ........................................... 813-360-2816
KS Lenexa, Mid-Tech ..................................800-444-9New Market,
ERI ......................................................................... 301-965-3771
APEX DIE & GASKET INC. .................................. 122
PO Box 1442, Tempe, Az 85280-1442; 888-937-3907; dave@
apexdc.com; www.apexdc.com
ARC Technologies, Inc. ...................................... 3
11 Chestnut Street; Amesbury, MA 01913; 978-388-2993;
Fax: 978-388-6866; sales@arc-tech.com; www.arc-tech.com;
Mackenzie OConnell, Marketing Coordinator
AR Worldwide Modular RF ..........7, 58, 59, 67, 91, 191
11807 North Creek Parkway South, Suite 109, Both-
ell, WA 98011; 425-485-9000; Fax 425-486-9657;
modularrfsales@ar-worldwide.com; www.arww-modularrf.
com; Chris Heavens, VP, General Manager
AK Cain-Sweet Co. ....................................................425-562-6028
AL Brennan Associates .............................................727-446-5006
AR Testech. .................................................................972-644-5010
AZ Technical Marketing Specialists ........................ 303-488-0220
CA Altamont Technical Services ............................... 925-294-9774
CO Technical Marketing Specialists ........................ 303-488-0220
CT R.J. Sickles Associates ........................................ 781-862-5100
DC Delmarva Engineering .........................................410-990-9000
DE Advanced Technical Marketing ........................... 973-257-9332
GA Brennan Associates .............................................727-446-5006
IA KJS Marketing Inc. ...............................................314-469-4544
ID Cain-Sweet Co. ....................................................425-562-6028
IL Electronic Instrument Associates Inc. ................ 630-924-1600
IN Delta Technology Solutions................................. 419-394-6766
KS KJS Marketing Inc. ............................................... 816-578-4751
KY Delta Technology Solutions................................. 419-394-6766
LA Kemp Instruments Inc. ......................................... 972-437-9100
MA R.J. Sickles Associates ........................................ 781-862-5100
MD Delmarva Engineering .........................................410-990-9000
ME R.J. Sickles Associates ........................................ 781-862-5100
MI Delta Technology Solutions................................. 419-394-6766
MN Electronic Instrument Associates Inc. ................612-695-4055
MO KJS Marketing Inc. ...............................................314-469-4544
MS Kemp Instruments Inc. ......................................... 770-277-9818
MT Cain-Sweet Co. ....................................................425-562-6028
NC Delmarva Engineering .........................................410-990-9000
ND Electronic Instrument Associates Inc. ................612-695-4055
NE KJS Marketing Inc. ...............................................314-469-4544
NH R.J. Sickles Associates ........................................ 781-862-5100
NJ Advanced Technical Marketing ........................... 973-257-9332
NM Technical Marketing Specialists ........................ 303-488-0220
company directory
Company Directory ag_08.indd 243 5/6/2008 5:16:56 PM
244
company directory
NY Advanced Technical Marketing ........................... 973-257-9332
NY GSC Representatives ........................................... 585-385-1170
OH Delta Technology Solutions................................. 419-394-6766
OK Testech. .................................................................972-644-5010
OR Cain-Sweet Co. ....................................................425-562-6028
PA Advanced Technical Marketing ........................... 973-257-9351
PA Delta Technology Solutions................................. 419-394-6766
RI R.J. Sickles Associates ........................................ 781-862-5100
TN Brennan Associates .............................................727-446-5006
TX Testech. .................................................................972-644-5010
UT Technical Marketing Specialists ........................ 303-488-0220
VA Delmarva Engineering .........................................434-964-0313
VT R.J. Sickles Associates ........................................ 781-862-5100
WA Cain-Sweet Co. ....................................................425-562-6028
WI Electronic Instrument Associates Inc. ................ 630-924-1600
WV Delta Technology Solutions................................. 419-394-6766
INTERNATIONAL
AUT EMV GmbH ......................................................49-89-614-17126
BEL EMV Benelux BV ................................................ 31-172-423000
BRA IME LTDA .........................................................55-11-3871-2329
CAN Cain-Sweet Co. ....................................................403-250-7288
Cain-Sweet Co. .................................................... 605-241-7770
Cain-Sweet Co. .................................................... 613-228-6955
Cain-Sweet Co. .................................................... 416-695-1444
Source Engineering .............................................. 519-621-4445
CHE Emitec AG .......................................................... 41-47-748-6010
CHN Corad Technology Ltd. ...................................86-21-6466-9185
DEU EMV GmbH ....................................................49-89-614-171-23
DNK Erik Blichfeld A/S ................................................. 45-7552-2020
ECU Southeastern Trading International..................... 305-592-2244
ESP Wavecontrol ......................................................3-49-3320-8055
FIN Caltest Oy..........................................................358-9-530-6070
FRA AR EMV France...............................................33-1-47-91-75-30
GBR AR EMV United Kingdom ...............................441-908-566-556
GRC Axel Representation, Ltd................................ 30-210-723-6753
HKG Corad Technology Ltd. .......................................852-279-30330
IDN Precision Technologies PTE Ltd. .......................... 65-273-4573
IND Complus Systems ............................................ 91-80-343-8707
ISR Erantel Electronics Ltd. .......................................972-9767-1332
ITA Teseo SpA ........................................................39-011-994-1911
JPN Nippon Automatic Control ............................... 81-3-5434-1600
KOR CSC Inc. ............................................................ 822-2616-67013
LUX EMV Benelux BV ................................................ 31-172-423000
MEX SI-EMC ...........................................................52-55-5553-8970
MYS Precision Technologies PTE Ltd. .......................... 65-273-4573
NLD EMV Benelux BV ................................................ 31-172-423000
PHL Precision Technologies PTE Ltd. .......................... 65-273-4573
RUS EMV GmbH ......................................................49-89-614-17128
SGP Precision Technologies PTE Ltd. .......................... 65-273-4573
SWE CE-BIT Elektronik AB ......................................... 46-8-735-7550
THA Precision Technologies PTE Ltd. .......................... 65-273-4573
TUR ORKO A.S. ............................................................. 312-426-6047
TWN Kimpsion Corporation ................................... 886-2-291-06715
ZAF Protea Data Systems Ltd....................................27-11-719-5797
AR Receiver Systems ................7, 58, 59, 67, 91, 191
21434 Osborne St.,Canoga Park, CA 91304-1520;
818-882-3977; Fax: 818-882-3981;info@ar-worldwide.com;
www.ar-worldwide.com; Dick Webb, General Manager
AR Worldwide RF/Microwave Instrumentation ...........
............................................7, 58, 59, 67, 91, 191
160 School House Rd., Souderton, PA 18964; 215-723-8181;
800-933-8181; Fax 215-723-5688; info@ar-worldwide.com;
www.arww-rfmicro.com/html/00000.asp; Kenneth Shepherd,
VP of Sales & Marketing
AK J.J. Associates, Inc. ............................................. 206-246-6619
AL Southern Scientific Sales .................................... 407-332-8252
AR Testech Sales Engineers ......................................972-644-5010
AZ Technical Marketing Specialists ........................ 480-929-0009
CA Altamont Technical Services ............................... 925-294-9774
CA Altamont Technical Services ...............................661-268-0835
CO Technical Marketing Specialists ........................ 303-488-0220
CT R.J. Sickles Associates ........................................ 781-862-5100
DC Delmarva Engineering .........................................410-990-9000
DE Advanced Technical Marketing ........................... 973-257-9332
FL Brennan Associates ............................................ 800-356-5006
GA Southern Scientific Sales .................................... 407-332-8252
IA Electronic Instrument Associates Inc. ................612-695-4055
ID J.J. Associates Inc .............................................. 503-463-9590
IL Electronic Instrument Associates Inc. ................ 630-924-1600
IN Delta Technology Solutions................................. 740-881-3883
KS KJS Marketing ...................................................... 816-578-4751
KY Delta Technology Solutions................................. 513-677-3987
LA Testech Sales Engineers ......................................281-893-9955
MA R. J. Sickles Associates ....................................... 781-862-5100
MD Delmarva Engineering .........................................410-990-9000
ME R.J. Sickles Associates ........................................ 781-862-5100
MI Delta Technology Solutions................................. 419-394-6766
MN Electronic Instrument Associates Inc. ................612-695-4055
MO KJS Marketing ...................................................... 816-578-4751
MO KJS Marketing ......................................................314-469-4544
MS Southern Scientific Sales .................................... 407-332-8252
MT J.J. Associates, Inc ............................................. 503-463-9590
NC Delmarva Engineering .........................................410-990-9000
NE KJS Marketing, Inc. .............................................. 816-578-4751
NH Intersell ................................................................ 603-465-5690
NH R.J. Sickles Associates ........................................ 781-862-5100
NJ Advanced Technical Marketing ........................... 973-257-9332
NM Technical Marketing Specialists .........................505-897-9355
NV Altamont Technical Services ............................... 925-294-9774
NY Advanced Technical Marketing ........................... 973-257-9332
NY GSC Representatives ........................................... 585-385-1170
OH Delta Technology Solutions................................. 419-394-6766
OK Testech Sales Engineers .......................................817-282-4471
OR J.J. Associates, Inc. ........................................... 503-463-9590
PA Advanced Technical Marketing ........................... 973-257-9332
RI R.J. Sickles Associates ........................................ 781-862-5100
SC Southern Scientific Sales .................................... 407-332-8252
TN Southern Scientific Sales .................................... 407-332-8252
TX Testech Sales Engineers ......................................281-893-9955
UT Technical Marketing Specialists .........................801-944-5605
VA Delmarva Engineering ......................................... 410-332-8252
WA J. J. Associates, Inc. ........................................... 206-246-6619
WI Electronic Instrument Associates Inc. ............... 630-924-1600
INTERNATIONAL
AUS Faraday Pty Ltd ............................................. 61-0-3-9722-9100
AUT EMV GmbH .............................................. 011-49-89-614-171-0
BEL EMV Benelux ...................................................... 31-172-423000
BLZ Sistemas e Ingenieria de EMC ........................52 55 55 53 89 70
BRA IME LTDA .........................................................55-11-3871-2329
CAN Multilek, Inc. ......................................................... 613-226-2365
CHE Emitec AG .......................................................... 41-41-748-6010
CHN Corad Technology Ltd. (Shanghai) ...............86-21-6466-9185
CHN Corad Technology Ltd. (Chengdu) ..................86-28-775-0639
CRI Sistemas e Ingenieria de EMC ........................52 55 55 53 89 70
DEU EMV GmbH ........................................................49-89-614-1710
DNK Erik Blichfeld ......................................................... 45-7552-2020
ESP Wavecontrol ......................................................34-933-208-055
FRA EMV S.A.R.L. .....................................................33-1-4791-7530
GBR EMV, Ltd. ........................................................44-1-908-566556
GRC Axel Representations Ltd. ......................................301-7236753
HKG Corad Technology Ltd. (Hong Kong) ................852-2793-0330
IDN csPrecision Technologies PTE, LTD. ......................65-2734573
IND Bangalore, Complus Sys. Pvt. Ltd. ................. 91-80-343-8707
ISR Erantel Electronics, Ltd ...................................... 972-9-7663478
ITA Teseo SpA ........................................................39-011-994-1911
JPN Nippon Automatic Control .......................... 81-(0)3-5434-1600
KOR EMC Solution ............................................. 011-82-22168-3910
LUX EMV Benelux ...................................................... 31-172-423000
MEX Sistemas e Ingenieria de EMC ........................52 55 55 53 89 70
MYS Precision Technologies PTE, LTD. ..........................65-2734573
NLD EMV Benelux ...................................................... 31-172-423000
NOR Nortelco A/S ........................................................ 47-22-57-6100
NZL Faraday Pty Ltd. ........................................... 61-0-3-9722-9100
PHL Precision Technologies PTE, LTD. ..........................65-2734573
PRT Wavecontrol ......................................................34-933-208-055
SGP Singapore, Precision Technologies ........................65-2734573
SWE CE-BIT Elektronik AB ...........................................46-8-7357550
THA Anatron Co. Ltd. ............................................. 66-2-732-0902-4
TUR Orko Mumessillik ............................................... 312-426-60-47
TWN Evergo Electronics Corp. ............................... 886-2-2715-0283
ZAF Protea Technology, Ltd. .................................... 27-11-887-2637
Arcotronics, Inc. ........................................... 155
20-1 Jules Court, Bohemia, NY 11716; 631-563-9568; 631-
563-9569; info@arcotronics.net; www.arcotronics.net; Dr.
Richard V. Michelson, Gen. Mgr.
CA Mountain View, Peninsula Tech. Sales .............. 650-965-3636
FL St. Petersburg, Tech-Rep Assoc. ......................... 727-322-1155
NJ Ringoes, Pro-Active Technology......................... 908-237-9378
INTERNATIONAL
AFG Codico GmbH Kg .....................................................43-1-862428
AUS Crusader Elec. Co. PTY Ltd. ...............................61-2-792-3922
BEL S.A.Elipse N V. .................................................... 32-3-385-0788
CHE Elabtex ..............................................................AG41-56-275111
DEU Arcontronics Bauelmente GmbH .................... 49-911-75-61-84
DNK Copenhagen, EJ Johanssen .........................................................
ESP Eurotronix S A .....................................................34-3-333-3800
ESP Factron S A .......................................................... 34-1-766-1577
FIN Helsinki, Oxxo Oy AB .................................... 3358-0-584-2600
FRA Arcotronics France SARL ............................ 33-1-69-53-64-00
GBR Abercorn Electronics Ltd. ............................. 44-1506-8344222
GBR Arcotronics Ltd. .............................................44-0-1327-351515
GRC Semicon-G Giallouisis OE ................................. 30-1-325-3626
IRL Neltronic Ltd. .................................................... 353-1-450-3560
ISR Talmir Electronics Ltd. ..........................972-4-520233/534563
ITA Arcotronics Italia SpA ........................................ 39-051-939111
JPN Nissei Electric Co. Ltd. .....................................81-3-3442-8151
KOR Dong Do Trading Co. Ltd. ..................... 82-2-566-2292/567.65
NLD Klaasing Electronics BV ......................................31-1624-81600
NOR Sheco AS ...............................................................47-2275-4160
PRT Niposom-J Nabais LDA ....................................351-1-848-7677
SWE Lac Electronik AB ................................................ 46-8-6428300
TUR Radel Electronik................................................ 90-212-2431538
Axonics, Inc. ................................................ 210
20 Post Lane North, Suffern, NY 10901; 845-228-8924; Fax:
845-689-0611; info@axonics.net; www.axonics.net
C
Captor Corporation ......................................... 141
5040 South County Road 25A, Tipp City, OH 45371; 937-
667-8484; Fax 937-667-5133; stimms@CaptorCorp.com;
www.CaptorCorp.com; Bob Jenks, Sales/Design Engineer;
Nathan Miller, Sales/Design Engineer; Joe Otto, Sales/Design
Engineer; Brian Monnin, Sales/Design Engineer; Scott Timms,
BP/GM; Ryan Sollmann, Sales/Design Engineer
CA Fremont, R C Products LLC/Bruce Creedy.........510-656-8490
Palm Desert, Ramsgate Tech Sls/Don Hosmer ..760-779-5600
FL Tampa, CBC Electronics/Seth Brock .................. 813-969-1901
IN CRP Technical Solutions/Chris Platt ...................317-841-7273
MA New England region, Integral Sales/Neil Reynolds
...............................................................................508-533-7732
TX Wylie, Stewart & Associates/Fred Stewart .........972-442-0336
WA Lionheart Northwest, Inc./Leo Smale .................425-882-2587
Chomerics, Div. of Parker Hannifin Corp. ............103
77 Dragon Court, Woburn, MA 01888; 781-935-4850; Fax:
781-933-4318; chomailbox@parker.com; www.chomerics.com;
Craig Lazinsky, Marketing Communications Mgr; Patty Terilli,
Sales Representative
NY Rochester, Chomerics .......................................... 781-939-4377
INTERNATIONAL
BRA Chomerics Brazil .............................................. +551139178544
GBR Marlow, Bucks, Chomerics Europe ................... +441628404000
HKG Kowloon, Hong Kong, Chomerics Asia Pacific +85224288008
CITEL, Inc. ....................................................163
1515 NW 167th St., Suite 6-303, Miami, FL 33169: 305-621-
0022; FAX 305-621-0766; citel@citelprotection.com; www.
citelprotection.com; Fabrice Lamier, Sales/Mktg. Manager;
Juan Carlos Rodriguez, Applications Engineer
INTERNATIONAL
CHN Shanghai, CITEL Shanghai/M. Xia ............ 86-21-58-12-25-25
DEU Dusseldorf, CITEL GMBH/Jorg Damschen ... 49-211-96-13-70
FRA Issy Les Moulineaux, CITEL 2CP/Jacques Niclause
........................................................................ 33-1-41-23-50-33
NLD Nederweert, Supersafe/Jean-Marie Peters ....31-495-460-670
5046 Sierra Pines Dr., Mariposa, CA 95338; 800-500-4362;
Fax 866-779-9776; ckclabs@ckc.com; www.ckc.com;
Todd Robinson, Director of Sales; Robert Tozier, Business
Development Specialist; Pamela Tucker, Business Development
245
company directory
Specialist
CA Brea / Robert Tozier ...............................................717-993-6112
Fremont/ Pamela Tucker ....................................... 510-249-1170
Mariposa / Pamela Tucker .................................... 510-249-1170
WA Bothel / Robert Tozier............................................425-402-1717
Com-Power Corporation.................................... 61
114 Olinda Drive, Brea, CA 92823; 714-528-8800; Fax 714-
579-1850; sales@com-power.com; www.com-power.com
CPI (Communications&Power Industries) Canada Inc. .
................................................................... 37
45 River Drive, Georgetown, ON, L7G 2J4, CANADA; 905-877-
0161; Fax 905-877-5327; marketing@cmp.cpii.com; www.cpii.
com/cmp; Tom Sertic
AZ R.A.Mayes, Eric Evans ......................................... 303-761-9447
CA Redondo Beach, C-WAVE .................................... 310-937-3521
CA San Jose, MC Microwave, Inc. ............................408-446-4100
CO R. A. Mayes, Eric Evans ....................................... 303-761-9447
FL Ft. Lauderdale, TEQSPEC, Bob Leacock ............954-370-5824
MD M. Lader Co. ......................................................... 610-825-3177
NJ PVP Sales, Vince Schiel ...................................... 201-841-2293
NJ Scientific Devices, New England .........................508-528-2458
NM R.A.Mayes, Eric Evans ......................................... 303-761-9447
NY PVP Sales, Vince Schiel ...................................... 201-841-2293
OK Comreps, John Casey .......................................... 972-867-7003
OR Lionheart, Leo Smale ...........................................425-882-2587
PA M. Lader Co. ......................................................... 610-825-3177
TX Comreps, John Casey .......................................... 972-867-7003
UT R.A.Mayes, Eric Evans ......................................... 303-761-9447
VA M. Lader Co. ......................................................... 610-825-3177
INTERNATIONAL
CHE Zugs, CPI Switzerland .......................................41-41-749-8522
DEU Munich, CPI Germany ......................................49-89-45-87370
DNK FA Consulting ........................................................... 49-70-8077
FIN Advancetec OY .................................................358-9-3505-260
GBR Walton-on-Thames, CPI UK ..........................44-1932-898-080
IND New Delhi, CPI India ......................................... 91-11-614-6716
ISR Tel Aviv, Rapac Electronics ..............................972-3-920-3456
ITA Torino, CPI Italy ................................................. 39-11-771-4765
JPN Tokyo ................................................................ 81-3-3639-9814
NLD Oudstrijdersstraat, CPI Belgium ........................ 32-14-43-1140
NOR Hans H. Schive ....................................................47-66-76-0513
SGP CPI Asia, Inc. ........................................................65-6225-0011
SWE Stockholm, Compomill .....................................46-31-733-2150
CSA International ............................................ 71
178 Rexdale Blvd., Toronto M9W 1R3, CANADA; 866-797-4272;
Fax: 416-747-4149 ; certinfo@csa-international.org; http://
www.csa-international.org
CST of America, Inc. ..............................181, 189
492 Old Connecticut Path, Suite 505, Framingham, MA 01701;
508-665-4400; info@cst.com; www.cst.com
CA CST of America, Inc. ............................................. 650 632 4456
INTERNATIONAL
AUS Oxley, RF Shop ................................................. +61 7 3375 6767
BRA CST GmbH ....................................................... +55 11 55392050
CHN Shanghai, CST China Ltd. ............................. +86 21 5080 2328
CHN Beijing, CST China Ltd. ................................. +86 10 6297 3195
DEU CST Computer Simulation Technology ...........+49 6151 7303 0
GBR Nottingham, CST GmbH ................................ +44 115 852 4032
JPN KawasakiCity, AET, Inc. ................................... +81 44 980 0505
KOR CST of Korea, Inc. ............................................ +82 31 781 6866
MYS Kuala Lumpur, CST SouthEast Asia ................ +6 03 6203 7690
TWN Hsinchu, Nearson Marketing Group, Inc. ........ +886 3 5332541
Curtis Industries ............................................143
2400 S. 43rd St., Milwaukee, WI 53219; 414-649-4200; Fax
414-649-4279; sales@curtisind.com; www.curtisind.com;
Steven Powers, Pres.; Al Hungsberg, Sales Director; Glenn
Cumming, Prod. Mgr.; Don Reynolds, VP Sales
D
Dayton T. Brown, Inc. ....................................... 79
1175 Church St., Bohemia, NY 11716-5031; 631-589-6300;
Fax: 631-589-3648; sbenza@dtbtest.com; www.dtbtest.com;
Steve Benza
D.L.S. Electronic Systems, Inc. ..............................
1250 Peterson Dr., Wheeling, IL 60090; 847-537-6400; Fax
847-537-6488; jblack@dlsemc.com; www.dlsemc.com;
Brian Mattson, General Manager; Steve Grimes, Sales and
Applications Engineer; Donald Sweeney, President; Jack Black,
business development manager
dB Society ....................................................221
22117 NE 10th Place, Sammamish, WA 98074-6863;
452-868-2558; Fax 425-868-0547; j.n.oneil@ieee.org;
d.hoolihan@ieee.org
Dexter Magnetic Technologies .......................... 128
1050 Morse Avenue, Elk Grove Village, IL 60007;
800-775-3829; Fax: 877-221-5052; @dextermag.com; www.
dextermag.com/softmagnetics.aspx
IL Elk Grove Village, Midwest - Chicago..................847-956-1140
MA Chelmsford, East Coast - Boston ........................978-250-4300
NY Hicksville, East Coast - New York ....................... 516-822-3311
TX Rockwall, Southwest - Rockwall ......................... 214-505-1670
INTERNATIONAL
CHN Nanjing, China ................................................+8625-84812400
GBR Berkshire, UK ............................................+44 (0) 1189-602430
DNB Engineering, Inc. ...................................... 81
1100 E. Chalk Creek Road, Coalville, UT 84017; 435-336-4433;
Fax 435-336-4436; carrie@dnbenginc.com; dnbenginc.com;
3535 W. Commonwealth Ave., Fullerton, CA 92833; 714-870-
7781; Fax 714-870-5081; Doug@dnbenginc.com;
www.dnbenginc.com; Doug Broaddus, Exec. VP
CA Riverside, Tony Piraino, Sls & Mktg Manager ... 951-637-2630
UT Coalville, Clay Alred, Manager ........................... 435-336-4433
INTERNATIONAL
TWN Taiwan, ................................................................... 222-777-534
5969 Robinson Avenue, Riverside, CA 92503-8620; 951-637-
2630; Fax 951-637-2704; Stan@dnbenginc.com;
www.dnbenginc.com
Don HEIRMAN Consultants ............................... 210
143 Jumping Brook Rd., Lincroft, NJ 07738; 732-741-7723; Fax
732-530-5695; d.heirman@ieee.org; www.DonHEIRMAN.com;
Lois Heirman, Secretary/Treasurer
Dontech Incorporated ..................................... 210
700 Airport Blvd., Doylestown, PA 18901; 215-348-5010; Fax
215-348-9959; info@dontechinc.com; www.dontechinc.com;
Jeff Blake, Director, Sales & Marketing; Bill Cusack, Eastern
Regional Sales Manager; Randall Pyles, DirectorEngineering;
John Vecchione, Western Regional Sales Manager
E
East Coast Shielding ....................................... 210
1914 Rt 57, Hackettstown, NJ 07840; 908-227-6857; Fax:
908-852-9163; mike@eastcoastshielding.com; www.east-
coastshielding.com
ElectroMagnetic Investigations, LLC
20811 NW Cornell Road, Suite 600, Hillsboro, OR 97124;
503-466-1160; Fax: 503-466-1170; support@emicomply.com;
www.emicomply.com; Henry Benitez, President; Jackie Benitez,
Office Manager; Derick Skouby, Engineering Director
Electronics Test Centre .................................... 85
302 Legget Drive, Suite 100, Kanata K2K 1Y5, CANADA;
613-599-6800; Fax: 613 599 7614; sales@etc-mpb.com; www.
etc-mpb.com; Lynn Diggins, Director Business Development
1516 Centre Circle; Downers Grove, IL 60515-1082; 800-ELITE-
11, 630-495-9770; FAX 630-495-9785; sales@elitetest.com;
www.elitetest.com; Steve Laya, Mktg. Mgr.
Elmag, ETS-Lindgren
EM Software & Systems-SA (Pty) Ltd .................. 187
PO 1354, Stellenbosch 7599 SOUTH AFRICA; +27 21 8801880;
Fax: +27 21 8801936; info@emss.co.za; www.emss.co.za
VA Hampton, EM Software & Systems (USA) Inc, ..866-202-9262
INTERNATIONAL
DEU Boblingen, EM Software & Systems GmbH ................................
........................................................................ 49 7031-714-5200
EM TEST .................................................. 34, 40
Sternenhofstrasse 15, Reinach (BL) 4153, Switzerland: 41-61-
717-91-91; FAX 41-61-717-91-99; sales@emtest.ch; www.
emtest.com
246
company directory
EMC Certification Dr. Rasek ............................. 195
Moggast, Boelwiese 5, Ebermannstadt 91320, Germany: 49-
9194-9331; FAX 49-9194-796484; emc.cert@emcc.de; www.
emcc.de; Klaus-Dieter Knoerig, CEO EMC Cert.; Mrs. Gisela
Muncy
EMC Consulting Dr. Rasek ................................. 87
Moggast, Boelwiese 8, Ebermannstadt 91320, Germany:
49-9194-9016; FAX 49-9194-8125; emc.cons@emcc.de; www.
emcc.de; Mrs. Irmhild Helldoerfer; Winfried Hoffman, CEO
Test Labs
EMC Component Group, Inc. ............................. 131
2901 Tasman Drive, Suite 106, Santa Clara, CA 95054;
408-330-9216; Fax: 408-330-0012; sales@emccomponent.
com; www.emccomponent.com
EMCO, ETS-Lindgren
EMC Eupen, A Div. of I2R Corp. ..........................146
5033 Industrial Rd., Bldg. 6, Farmingdale, NJ 07727;
732-919-1100; Fax: 732-919-7196, sales@emceupen.com.;
www.emceupen.com; Thomas Boughner, Sales Manager; Lori
Rumbaugh, Office Administrator; Steve Rust, Sales Engineer;
James Watts, VP; William J. Watts, President
CT EMC Eupen div. I2R Corp/Steve Rust ..................732-919-1100
DC EMC Eupen div. I2R Corp/Thomas Boughner .... 301-668-7002
DE EMC Eupen div. I2R Corp/Thomas Boughner .... 301-668-7002
MD Frederick, EMC Eupen div. I2R Corp/Thomas Boughner ...........
............................................................................... 301-668-7002
NC Raleigh, EMC Eupen div. I2R Corp./Thomas Boughner .............
............................................................................... 919-832-6244
NJ Farmingdale, EMC Eupen div. I2R Corp. .............732-919-1100
NY EMC Eupen div. I2R Corp./Steve Rust .................732-919-1100
PA EMC Eupen div. I2R Corp./Jim Watts ..................732-919-1100
SC EMC Eupen div. I2R Corp/Thomas Boughner .... 919-832-6244
VA EMC Eupen div. I2R Corp/Thomas Boughner .... 301-668-7002
WV EMC Eupen div. I2R Corp/Thomas Boughner .... 301-668-7002
Emerson & Cuming Microwave Products, Inc.
28 York Avenue, Randolph, MA 02368; 781-961-9600; Fax:
781-961-2845; sales@eccosorb.com; www.eccosorb.com;
Michael Plante, Director of Sales & Marketing
EMI Filter Company ........................................ 131
12750 59th Way North, Clearwater, FL 33773; 727-585-7990 /
800-323-7990; Fax 727-586-5138; sales@emifiltercompany.
com; www.emifiltercompany.com; Sally Hubbell, Sales Man-
ager; Ted Nordquist, Chief Engineer
emscreen GmbH ............................................. 173
Wallbergstrae 7, Taufkirchen 82024, GERMANY;
+49-89-614171-0; Fax: +49-89-614171-71; info@emscreen.
de; www.emscreen.de
ENR (see Seven Mountains Scientific)
www.7ms.com
EPCOS, Inc. ............................... Inside Back Cover
186 Wood Ave. S,Iselin, NJ 08830; 732-906-4300; Fax:
732-632-2830; ferrites.usa@epcos.com; inductors-emc.
usa@epcos.com; caps.usa@epcos.com; protectors.usa@
epcos.com; www.epcos.com; Suresh Chandran, Director of
Marketing, Capacitors; Joseph Pulomena, Director of Marketing
Ferrites & Inductors; Cliff Zatz, Director of Marketing, Ceramic
Components
CA Rancho Cucamonga, John Larsen ......................714-348-9936
Santa Clara, Mike Smith ...................................... 408-730-6811
CO Parker, Todd Ackerman ........................................ 303-284-3616
FL Lake Worth, Patrick Talio ..................................... 561-965-1544
GA Fayetteville, John Kovach .................................... 770-631-1260
IL Paul Skubiszewski ............................................... 847-299-7240
MA Peabody, Norm LeBel ..........................................978-535-5552
NC Apex, Lee Huntington...........................................919-303-5933
OH Columbus, Mike Rayke ........................................614-888-6100
PA Easton, Dick Roberts ............................................610-438-0646
TX Dallas, Vince Victor .............................................. 972-481-8818
INTERNATIONAL
MEX Rio Guadalquivir Yolanda Molina .................011-525-207-1802
ETS-Lindgren .............. 1, 9, 84, 169, 177, Back Cover
1301 Arrow Point Drive, Cedar Park, TX 78613; 512-531-6400;
Fax 512-531-6500; info@ets-lindgren.com; www.ets-lindgren.
com; Chris Brown, Sls. Mgr.
AL Decatur, Brennan Associates .............................. 706-367-5581
AZ Tempe, TMS......................................................... 480-929-0009
CA Livermore, Altamont Technical Services ............ 925-294-9774
CO Greenwood Village, TMS .................................... 303-488-0220
CT Norwalk, ETS-Lindgren ..................................... 203-838-4555
FL Clearwater, Brennan Associates .........................727-446-5006
GA Loganville, Brennan Associates .......................... 770-466-1500
IA Cedar Rapids, EIA ................................................612-695-4055
IL Bloomingdale, Elect. Inst. Assoc. ....................... 630-924-1600
IL Glendale Heights, ETS-Lindgren ........................ 630-307-7200
IN Indianapolis, Elect. Inst. Assoc. .......................... 630-924-1600
MD Frederick, EMC Technologists ............................ 301-668-7002
MO Lake Lotawana, KJS Marketing Inc. .................... 816-578-4751
NC Raleigh, EMC Technologists ................................732-919-1100
NH Hollis, Intersell .....................................................603-465-7500
NJ Farmingdale, EMC Technologists ........................732-919-1100
NM Albuquerque, Technical Marketing Specialists
...............................................................................505-286-0079
NY East Rochester, GSC Rep. .................................... 585-385-1170
TX Arlington, CF Scientific Systems .........................817-467-0970
UT Salt Lake City, TMS ..............................................801-944-5605
WA Bothell, Del Black Assoc. .....................................425-487-4396
WA Normandy Park, ETS-Lindgren ........................... 206-824-8122
WI Jackson, Electronic Inst. Assoc. ......................... 630-924-1600
INTERNATIONAL
ARG Buenos Aires, Precision Electronica SRL .......5411-4343-6277
ARG Buenos Aires, Vimelec S.A. ............................54-11-4912-3998
AUS Bayswater Victoria, Faraday ............................ 61-3-9722-9100
AUT Vienna, UEI ........................................................... 43 154515880
BGR Sofia, GIGA Electronics-- HOLADAY ONLY ........359 2 731 498
BRA Sao Paulo, QUEMC .........................................55-21-9236-7473
BRA QUEMC ............................................................55-21-9236-7473
CAN Nepean, Multilek Inc. ........................................... 613-226-2365
CHE Cham, Emitec AG ................................................41-41-7486010
CHL Santiago, Sistema de Instrumentacion-- HOLADAY ONLY
............................................................................. 56-2-696-0031
CHN Beijing, Corad Technology-- HOLADAY ONLY
.........................................................................86-10-8275-5304
CHN Shanghai, Corad Technology-- HOLADAY ONLY
..........................................................................86-21 6466-9185
CHN Chengdu, Corad Technology-- HOLADAY ONLY
........................................................................... 86-28-739-0426
CHN Xian, Corad Technology-- HOLADAY ONLY
.................................................................86-29-524-7655 x 808
CHN Shenzhen, Corad Technology-- HOLADAY ONLY
....................................................................... 86-755-8357-2143
CHN Beijing, ETS-Lindgren China .........................86-10-8275 5304
COL Satna Fe de Bogota, High-tec Higene Industr. Ltd.--
HOLADAY ONLY .................................................. 57-1-414-8636
CZE Praha, Testovaci Technika s.r.o. .................... 420-602-123-989
DEU Martinsried, EMCO Elektronik GmbH .........49-89-895-569-25
DEU Brake/Unterweser, ETS-Lindgren Germany .... 49-4401988963
DEU Maintal, Pischzan Technologies-- HOLADAY ONLY
............................................................................49 6109 771 948
DNK Taastrup, Metric A/S .......................................... 45-43-71 64 44
EGY Cairo, Omega Integrated Systems .................... 20-2-337-0501
ESP Madrid, ALAVA Ingenieros ................................. 340915679720
ESP Madrid, Nusim SA-- HOLADAY ONLY............... 3491 657 4024
FIN Eura, ETS-Lindgren Finland ............................. 358-2 8383 300
FRA LeBlanc Mesnil, ETS-Lindgren Europe ......... 33-1-48 65 34 03
FRA Emerainville, M2S Sarl ..................................... +33 164 616329
FRA Gennevilliers, M2S-- HOLADAY ONLY ...... 33-4-68-81-49-52
GBR Bucks, EMV Ltd.-- HOLADAY ONLY ..............+44 1908 566556
GBR Herts, ETS-Lindgren UK ..............................44-0-1438-730700
GRC Athens, J B Cambas Ltd.-- HOLADAY ONLY .... 30-1-674-7464
GRC Perama-Piraeus, Marac Elect...............................301 43 14 361
HKG Kowloon, Corad Technology-- HOLADAY ONLY
.............................................................................. 852 2793 0330
HKG Kwun Tong Kowloon, MaxTech Instruments Limited
.............................................................................. 852 27 933591
HKG North Point, PTC International- HOLADAY ONLY
........................................................................... 852-2-827-9977
HUN Halasztelek, ProMet Merestechnika Bt. .............36-24-521-240
IND Bangalore, Complus Systems .......................91-80-2343-8707
IND Bangalore, Complus Systems-- HOLADAY ONLY ......................
.........................................................................91-80-2343-8707
IRL Bray Co. Wicklow, Data Edge Ltd. .................44-1908-566-556
ISR Tel Aviv, R.D.T. Equip. & Systems ....................... 97-236450745
ITA Venaria Reale , AICOM Group .......................... 39.011.2265003
ITA Torino, TESEO SpA-- HOLADAY ONLY ........... 39 011 994 1911
JPN Tokyo, Access Japan Corporation ...................81-424-81-2977
JPN Astech Corp., Astech Corp. ............................. 81-3-3366-0813
JPN Tokyo, ETS-Lindgren Japan .............................81-3-3813-7100
KOR Seoul, Eretec .....................................................82-31-436-1100
KOR Youngdeungpo-gu, Eretec-- HOLADAY ONLY
............................................................................82-31-436-1100
MEX Col. Condesa, SI EMC sistemas e Ingenieria 52-55-5553 8970
MYS Selangor, TME-- HOLADAY ONLY.................... 603-5634-1017
NLD Alphen a/d Rijn, EMV Benelux B.V. .................31-0172-423000
NLD Ohmtronics-- HOLADAY ONLY ..........................31 40 257 3148
NOR Oslo, Laobrel AS -- HOLADAY ONLY ................. 47 23 05 19 30
NOR Nortelco ................................................................. 47 22 57 6100
NZL Auckland, Vicom ................................................ 64-3-379-3793
NZL Christchurch, Vicom-- HOLADAY ONLY .......... 64-3-379-3793
PAK Saddar Karac, Telec Elect. & Mach. .....................92-21-517201
PER Lima, Eliana Rey de Castro F. de C. Instrumentos y Compl
................................................................................511-241-5334
PHL Makati City, ArK One Solutions ......................... 63-2-833-9050
POL Warszawa, UEI ................................................ 48-22-549-92-46
PRT Alges, Rohde & Schwarz Portugal- HOLADAY ONLY
.............................................................................351 214 155700
RUS Moscow, Swemel ..................................................70952656672
SGP Singapore, ETS-Lindgren Singapore ..................65-653 67078
SGP Singapore, Precision Tech.-- HOLADAY ONLY ... 65-273-4573
SGP Singapore, Precision Technologies Pte Ltd ...........65-2734573
SWE Solna, Ce-Bit Elektronik ...................................46-87-35-75-50
SWE Motala, Proxitron AB--HOLADAY ONLY .............46 141 580 00
THA Prakanong, Bangkok, Comfort International Co.-- HOLADAY
ONLY ................................................................. 66-02-391-7078
TUR Istabul, Alka Elektrik-- HOLADAY ONLY .........90 212 245 1295
TUR Istanbul, aReF Medical Technical Services
....................................................................... 90-212-296-54-46
TWN Hsien, Burgeon ..............................................+886-03-3280531
TWN Taipei, Lintek Corporation-- HOLADAY ONLY
...................................................................... 886-02-270-90387
VEN Caracas, Physion Technologiea Nuclear-- HOLADAY ONLY
..............................................................................58-2-34-87-08
VNM Hanoi, Victory Co., Ltd.-- HOLADAY ONLY ..... 84-4-976-1586
ZAF South Africa, Environmental Instruments-- HOLADAY ONLY
.......................................................................... 27-021-975-1213
ZAF Bramley, Protea Data Systems ..........................27-11-719-5791
247
company directory
ETS-Lindgren (Lindgren RF Enclosures, Inc.)
................................ 1, 9, 84, 169, 177, Back Cover
400 High Grove Blvd., Glendale Heights, IL 60139; 630-
307-7200; Fax 630-307-7571; info@lindgrenrf.com; www.
ets-lindgren.com; Benjamin Turner, VP, Sales & Marketing; Bob
Piemonte, Industrial Sales Manager; Wayne Martin, Govern-
ment Sales Manager; Joseph Barwick, Industrial Business
Development Manager
AZ Tempe, Technical Marketing Specialists ........... 480-929-0009
CA Livermore, Altamont Technical Services ............ 925-294-9774
CA Monrovia, Technical Marketing Specialists .......505-286-0079
CA Monrovia, Wallace & Wallace .............................626-305-8800
CO Greenwood Village, Technical Marketing Specialists
.............................................................................. 303-488-0220
CT Hollis, Intersell .....................................................603-465-7500
FL Clearwater, Brennan Associates, Inc. .................727-446-5006
FL Orlando, Brennan Associates, Inc. ...................... 407-239-4399
GA Jefferson, Brennan Associates, Inc. ................... 706-367-5581
IL Bloomingdale, Electronic Instrument Assoc. ..... 630-924-1600
IN Noblesville, Electronic Instrument Assoc. ......... 317-770-3689
KS Overland Pk., M.I.N.K. Assoc. ............................. 913-341-8309
MA Lexington, R.J. Sickles Assocs. .......................... 781-862-5100
MD Frederick, EMC Technologies ............................. 301-668-7002
ME New England Area, Intersell ................................603-465-7500
MN Minnetonka, Electronic Instrument Assoc. ........612-695-4055
MO St. Louis, M.I.N.K. Assoc., Inc. ...........................314-995-5355
NC Raleigh, EMC Technologies ................................ 919-832-6244
NH Hollis, Intersell .....................................................603-465-7500
NJ Farmingdale, EMC Technologists ........................732-919-1100
NM Albuquerque, Technical Marketing Specialists
...............................................................................505-286-0079
NY East Rochester, GSC Representatives ................ 585-385-1170
OH Dublin, Delta Technology Solutions ................... 740-881-3883
OH St. Mary, Delta Technology Solutions ................ 419-394-6766
OR Salem, Del Black Associates .............................. 503-463-9590
TX Arlington, CF Scientific Systems Inc. ..................817-467-0970
TX Cedar Park, CF Scientific Systems, Inc. ..............512-250-2127
UT Salt Lake City, Technical Marketing Specialists
...............................................................................801-944-5605
WA Seattle, Del Black Associates .............................. 206-246-6619
WA Bothell, Del Black Associates ..............................425-487-4396
INTERNATIONAL
ARG Buenos Aires, Raul Salerno ........................... 54-11-4568-6657
BRA Rio de Janeiro, QUEMC Ltda ......................... 55-21-2557-3342
CAN Nepean, Ontario, Multilek Inc .............................. 613-226-2365
CHN Hong Kong, MaxTech Instruments Ltd. ............852-2793-3591
FRA Le Blanc Mesnil, ETS-Lindgren France .......... 33-1-4865-3403
GBR Stevenage, ETS-Lindgren UK........................ 44-1438-730-700
ISR Tel Aviv, Maron Technologies, Ltd. ................... 972-3-9067155
KOR South Korea, Eretec, Inc. ...................................82-31-4270061
MEX Mexico, SI-EMC .............................................52-55-55-538970
SGP Singapore, Nihon Denkei Co., Ltd. .......................65-355-0851
THA Bangkok, Dietheim Trading Co., Ltd. .................66-2-332-7140
TWN Kaohsiung, Burgeon Instrument Co., Ltd. .......886-7-227-2701
TWN Tao-Yuan Hsien, Burgeon Instrument Co., Ltd.
...........................................................................886-3-328-0531
ETS-Lindgren China
Beijing, CHINA; +86 (10) 8275 5304; www.ets-lindgren.com
Euroshield Oy, ETS-Lindgren
Eura, FINLAND; 358 2 8383 300; www.ets-lindgren.com
F
Your Signal Solution

Fair-Rite Products Corp. .................................. 129
1 Commercial Row, P.O. Box J, Wallkill, NY 12589; 845-895-
2055 ; Fax: 845-895-2629; ferrites@fair-rite.com; www.fair-
rite.com;Frank Babic, Product Manager; James Montgomery,
Applications Engineer; Jerry Barbaro, Area Sales Manager
(Western US, Mexico); Alan Keenan, European Sales Manager;
Bob Polhamus, Area Sales Manager (Northeast US, Canada);
Paul Zdanowicz, Director of Sales and Marketing
AZ Phoenix Arcadia Tech. Sls. ..................................480-956-8144
CA Seal Beach MFS Mktg. Grp. ................................562-598-7355
CA Sunnyvale PSC ......................................................408-737-1333
CO Littleton Chinook Technical Sls. .........................303-933-9007
FL Altamonte Sp. CBX Electronics ............................407-774-9100
IL Wheaton Chas. D. Atwater Assoc....................... 630-668-2303
IL Elk Grove Village Dexter MMD .............................847-956-1140
IL Chicago Newark Electronics ...............................312-784-5100
IN Ft. Wayne Frank J. Campisano Co. .................... 219-486-6443
MN Eagan Holmes Assoc. .........................................651-686-5354
NY Woodstock Elna Ferrite Labs. .............................. 914-679-2497
OH Columbus Frank J. Campisano Co. .....................614-538-1176
PA Leechburg Frank J. Campisano Co. .................... 412-845-2577
VA Roanoke A. B. Kreger Co. ....................................540-989-4780
WI Oshkosh Chas. D. Atwater Assoc. ....................... 414-303-0811
INTERNATIONAL
AUS Victoria Specialised Conductives ........................ 3-9846-1490
CAN Mississauga Pipe-Thompson, Ltd. ..................... 905-281-8281
Pierre Fonds ........................................................ 514-624-8760
ESP Madrid Redislogar S.A.......................................... 34-1413-9111
FRA Illzach Cedex Euro Schaffner............................. 33-8-931-0400
GBR Broxboume Cirkit Holding PLC .................... 44-1992-441-306
Colnbrook Dexter MMD .................................44-1753-737-400
ISR Silram Ltd. Kfar Saba ........................................ 972-9-767-1332
ITA Technopartner Capriate ......................................39-2-909-1540
JPN Nisshin Electric Co. Tokyo ............................... 81-33-226-5055
SGP Fair-Rite Asia Pte Ltd. .............................................65-281-1969
SWE Ce-Bit Elektronik Solna ..................................... 46-8-735-7550
Fischer Custom Communications ........................ 25
20603 Earl Street, Torrance, CA 90503; 310-303-3300; Fax
310-371-6268; sales@fischercc.com; www.fischercc.com;
Allen Fischer, Vice President
INTERNATIONAL
DEU Taufkirchen, emv GmbH ...................................49-89-614-1710
FRA emv, s.a.r.l. (FRANCE) ..................................... 33-1-6461-6329
GBR emv, Ltd. .......................................................... 44-1908-566556
ISR Kfar-Saba, Silram, Ltd. ..................................... 972-9-767-1332
ITA Savona , PMM ........................................................39 0182 5864
ITA Torino , Teseo ..................................................... 39-011-739651
JPN Tokyo, Nippon Automatic Control .............. 81-(0)3-5434-1600
NLD Comtest Instrumentation, B.V. ......................... 31-71-541-7531
SWE Stockholm, CE-BIT ............................................ 46-8-735-7550
Fotofab ....................................................... 113
3758 Belmont Avenue, Chicago, IL 60618; 773-463-6211;
Fax 773-463-3387; sales@fotofab.com; www.fotofab.com;
James Tankersley, Inside Technical Sales Representative; Alison
Anzalone, Sales & Marketing Manager
G
Garwood Laboratories, Inc. ............................... 55
7829 Industry Ave., Pico Rivera, CA 90660: 888-427-4111; FAX
562-949-8757; sales@garwoodlabs.com; www.garwoodlabs.
com; Heather Armstrong, Account Executive; Jason Armstrong,
Marketing Manager; Rocko Occiahto, Sales Manager
Garwood Laboratories, Inc. ............................... 55
950 Calle Negocio, San Clemente, CA 93673; 888-427-4111;
Fax: 949-361-9597; sales@garwoodlabs.com; www.gar-
woodlabs.com; Jason Armstrong, Marketing Manager; Rocko
Occiahto , Sales Manager; Sylvia Perry-Occhiato, Account
Executive
Genisco Filter Co. ..........................................143
5466 Complex Street #207, San Diego, CA 92123;
858-565-7405; Fax: 8585657415; sales@genisco.com
Global Certification Laboratories, Ltd.
4 Matthews Drive, East Haddam, CT 06423; 860-873-1451;
Fax: 860-873-1947; info@globaltestlabs.com; www.globaltest-
labs.com; Jim Costello, Engineer; Jack Rogers, owner
GORE. .......................................................... 117
402 Vieves Way, Elkton, MD 21922-0160; 800-445-4673; Fax
800-774-4673; electronics.usa@wlgore.com; www.gore.com
H
Henry Ott Consultants ..................................... 210
48 Baker Rd., Livingston, NJ 07039; 973-992-1793; FAX
973-533-1442; h.ott@verizon.net; www.hottconsultants.com;
Henry W. Ott, Pres.
Holaday Industries, Inc., ETS-Lindgren
Hoolihan EMC Consulting ................................. 210
32515 Nottingham Court, PO Box 367, Lindstrom, MN 55045;
651-213-0966; Cell: 651-269-3569; danhoolihanemc@aol.
com; www.emcxpert.com
HV TECHNOLOGIES, Inc. .................................... 31
8518 Rixlew Lane, Manassas, VA 20109; 703-365-2330; FAX
703-365-2331; emcsales@hvtechnologies.com; www.hvtech-
nologies.com; Tom Revesz, EMC Sales Manager
I
Instruments For Industry (IFI) ...................1721,193
903 South Second Street, Ronkonkoma, NY 11779; 631-467-
8400; Fax 631-467-8558; info@ifi.com; www.ifi.com; Mark
Swanson, President; Mike Yantz, Sr. VP Sales; Catherine Schlie,
Sales/Marketing; Leon Benatar, VP Engineering; Abe Jaffe,
Director of Operations
AL Huntsville, SMA ...................................................256-881-6035
AZ AZTEC Enterprises, Inc....................................... 800-304-3565
CA Danville, Advanced Technical Sales (ATS) ......... 925-736-2147
CO Denver, AZTEC Enterprises, Inc. ........................ 800-304-3565
CT dB Instruments Co. .............................................. 508-238-1303
DC Washington, Creative Marketing Associates Ltd. (CMA)
............................................................................... 301-953-7740
FL Longwood, SMA .................................................... 407-682.7317
GA Byron, SMA .......................................................... 478-953-1088
ID AZTEC Enterprises, Inc....................................... 800-304-3565
248
company directory
IN Micro Sales ...........................................................614-563-9800
KY Micro Sales ...........................................................614-563-9800
MA dB Insruments Co. ............................................... 508-238-1303
MD Columbia, Creative Marketing Associates Ltd. (CMA)
............................................................................... 301-953-7740
ME dB Instruments Co. .............................................. 508-238-1303
MI Micro Sales ...........................................................614-563-9800
MS SMA. .....................................................................256-881-6035
MT AZTEC Enterprises, Inc....................................... 800-304-3565
NC Fuquay-Varina, SMA ............................................ 919-567-9222
NH dB Instruments Co. .............................................. 508-238-1303
NJ South Plainfield, Contech Marketing ..................908-755-5700
NM AZTEC Enterprises, Inc....................................... 800-304-3565
NV AZTEC Enterprises, Inc....................................... 800-304-3565
OH Dublin, Micro Sales .............................................614-563-9800
PA Eastern Pennsylvania, Micro Lambda Inc. .........609-259-0400
Western Pennsylvania, Micro Sales ...................614-563-9800
RI dB Instruments Co. .............................................. 508-238-1303
SC SMA. ..................................................................... 919-567-9222
TN SMA ......................................................................256-881-6035
TX El Paso, Aztec Enterprises, Inc. .......................... 800-304-3565
Arlington, CF Scientific Systems .........................817-467-0970
UT Park City, AZTEC Enterprises, Inc. .................... 800-304-3565
VA Creative Marketing Associates Ltd. (CMA)
.....................................................................800-262-4662, x113
VT dB Instruments Co. .............................................. 508-238-1303
WV Micro Sales ...........................................................614-563-9800
WY AZTEC Enterprises, Inc....................................... 800-304-3565
INTERNATIONAL
AUS Mt. Riverview, Test & Measurement Australia Pty Ltd. ..............
.............................................................................. +61247399523
AUT EMCO Elektronik .................................................+49898955650
BEL Air-parts B.V. ........................................................+31172422455
BRA Rio de Janeiro RJ, QUEMC ............................... +552181116661
CAN Vancouver, Jerome and Frances Co. Ltd. ............ 604 986-1286
Ottawa, Multilek ................................................... 613-226-2365
CHE Planegg, EMCO Elektronik .................................+49898955650
CHN Shenzhen, Everjet Science & Technology Co
......................................................................... +8675526864487
DEU Planegg-Martinsried, EMCO Elektronik ............+49898955650
DNK Hovik, Saven Hitech ...............................................+4767120512
ESP Madrid, Adler Instrumentos ........................... +34-91-3584046
FIN Alphen aan den Rijn, Air-Parts B.V......................+31172422455
FRA Alphen aan den Rijn, Air-Parts B.V.....................+33158340000
GBR Hertfordshire, Dowding & Mills, U.K. ............ +44-462-421234
GRC Athens, M.J.PRINIOTAKIS SA .............. +302107227719 or +30
IND SECUNDERABAD (Hyderabad), Kaytronics.... +914027847924
ISR Petachtikva, RCM Ltd. .................................... +972-3-9229006
ITA Rome, LP Instruments ..................................... +390640800491
ITA Trezzano, LP Instruments ................................39-02-48401713
JPN Tokyo, Techno Science Japan Corp. (TSJ)........ +81357993160
KOR Kyonggi, Specs (Specsvision)............................ +82317065211
MYS Singapore Technologies Electronics Ltd. ............ +6564131727
NLD DA Lelystad, EEMC Coimex ............................+31 0320295395
NOR Hovik, Saven Hitech ...............................................+4767120512
POL Poznan, Astat Sp. Z o.o. ......................................+48618488871
POL Warsaw, Unitronex Corporation .........................+48226312643
RUS Moscow, Radiocomp ......................................+7(095)361-0904
SGP Singapore Technologies Electronics Ltd (STEE) ..+65 4131727
SWE Stockholm, Ingenjrsfirman Gunnar Petterson AB
.............................................................................. +46-8-930280
THA Singapore Technologies Electronics LTF ............ +6564131727
TWN THonova Resources, Taiwan ............................+886289726289
iNarte, Inc. ...................................................226
840 Queen Street, New Bern, NC 28560; 800-89-NARTE/
252-672-0111; Fax: 252-672-0111; narte@narte.org; www.
narte.org; Brian Lawrence, Executive Director
Ingenium Testing, LLC. ..................................... 43
3761 South Central Avenue, Rockford, IL 61102; 815-315-9250;
Fax: 815-489-9561; Jim.Blaha@IngeniumTesting.com
Intermark (USA), Inc. ...................................... 179
1310 Tully Rd. #117, San Jose, CA 95122; 408-971-2055; Fax:
408-971-6033; sales@intermark-usa.com; www.intermark-
usa.com; Masa Hatakeyama, VP
CA San Diego, Rina Tsujimoto .................................. 858-202-1585
INTERNATIONAL
DEU Frankfurt, Ichikawa...........................................49-6106 8524 20
HKG Tsen Wann, Sano .................................................852-2612-1161
JPN Nagoya, Yoshida................................................ 81-52-261-2740
SGP Singapore, Mori ....................................................... 65-56-6511
TWN Taipei, Iguchi ................................................... 886-2-26988833
Intertek Testing Services (Headqtrs) ................... 45
70 Codman Hill Rd.; Boxborough, MA 01719; 1-800-
WORLDLAB; Fax: (978)264-9403; icenter@intertek.com; www.
intertek-etlsemko.com
CA Laguna Niguel, Intertek ............................... 1-800-WORLDLAB
Menlo Park, Intertek .................................... 1-800-WORLDLAB
CO Boulder, Intertek ........................................... 1-800-WORLDLAB
GA Duluth, David Schramm ....................................... 678-775-2400
KY Lexington, Intertek ....................................... 1-800-WORLDLAB
MA Littleton, Mary Ellen Goyette ....................... 1-800-WORLDLAB
MI Grand Rapids, Tom Droog ....................................616-247-0515
MN Oakdale, Intertek........................................... 1-800-WORLDLAB
NJ Totowa, Intertek ............................................ 1-800-WORLDLAB
TX Richardson, Intertek ..................................... 1-800-WORLDLAB
ITEM
TM
ITEM Publications ...............................................
....................14, 15, 27, 35, 57, 69, 93, 142, 153, 194
1000 Germantown Pike, Suite F-2, Plymouth Meeting, PA
19462; 484-688-0300: Fax 484-688-0303; info@interfer-
encetechnology.com; www.interferencetechnology.com; Bob
Poust, Business Development Manager; Robb Allison, Business
Development Executive
INTERNATIONAL
CHN Beijing, Leadzil .................................................86-10-65250537
JPN Tokyo, TUV SUD Ohtama, ltd. .........................81-44-980-2092
K
Kemtron Limited
19-21 Finch Drive, Springwood Industrial Estate, Braintree CM7
2SF, United Kingdom: 44-1376-348115; FAX 44-1376-345885;
info@kemtron.co.uk; www.kemtron.co.uk
Kikusui America Inc. ....................................... 83
1744 Rollins Road, Burlingame, CA 94010; 800-KIKUSU/650-
259-5900; Fax 650-259-5904; info@kikusui.us; www.kikusui.
us
Kimmel Gerke Associates, Ltd - AZ. .................... 210
2538 West Monterey Avenue, Mesa, AZ 85202; 480-755-0080;
dgerke@emiguru.com; www.emiguru.com; Daryl Gerke, PE
Kimmel Gerke Associates, Ltd. - MN ................... 210
628 LeVander Way, South St. Paul, MN 55075; 888-EMI-
GURU; bkimmel@emiguru.com; www.emiguru.com; William
Kimmel, PE
L
Laird Technologies .......................................... 99
World Headquarters, 3481 Rider Trail South, St. Louis, MO
63045; 800-843-4556; Fax 314-344-9333; sales@lairdtech.
com; www.lairdtech.com; Valerie Adamo, Marketing Manager
CA San Jose .......................................................................................
408-544-9500 ...............................San Marcos (R&F Products)
760-736-7007
IL Schaumburg .........................................................847-839-6000
MO St. Louis ...............................................................314-344-9300
INTERNATIONAL
CHN Shenzhen ....................................................... 86-75-527141166
Tianjin .............................................................86-22-6629-8160
Suzhou ......................................................... 86-51-2651-51368
Shanghai ........................................................ 86-21-6442-8018
CZE Liberec .............................................................. 42-0488-575111
DEU Rosenheim ......................................................... 49-8031 24600
FRA Crosne ............................................................... 33-1-6949 7979
GBR Braintree ...........................................................44-1376-333900
JPN Yokohama .......................................................... 81-45785-1063
Kanagawa ........................................................... 81-4547-36808
KOR Seoul ...................................................................... 82-2477-1390
SGP Singapore ..............................................................65-6243 8022
TWN Luchu, Taoyuan .................................................886-3312-9292
LCR Electronics, Inc. ......................................148
9 S. Forest Ave., Norristown, PA 19401; 610-278-0840; Fax
610-278-0935; sales@lcr-inc.com; www.lcr-inc.com; Anand
Awasthi, Sales Engineer; Ron Minicucci, VP, Sales & Marketing
MD Aston PA, Keystone Marketing .............................610-745-7237
NJ Hazlet, Prime Manufacturers Rep ....................... 732-203-9051
NY Fulton, Jones/Sudders, Inc. ................................315-598-6942
Bohemia, Prime Manufacturers Rep .................... 631-244-1414
OH Beachwood, Electronic Salesmasters, Inc. ........ 216-831-9555
VA Aston PA, Keystone Marketing .............................610-745-7237
INTERNATIONAL
CAN Guelph, Nation Power & Signal ........................... 866-775-7715
IND Bangalore,Trinity Technologies ....................... 91-80-25714370
Leader Tech, Inc. ........................................... 109
12420 Race Track Rd., Tampa, FL 33626; 813-855-6921; Fax:
813-855-3291; sales@leadertechinc.com; www.leadertechinc.
com; Tim Black, Director, Sales & Marketing
L. Gordon Packaging
22 W. Padonia RD, Suite 304A, Timonium, MD 21093; 410-
308-2202; Fax: 410-308-2207; lgordonpkg@verizon.net; www.
lgordonpackaging.com
Liberty Labs, Inc. ............................................ 63
1346 Yellowwood Rd., PO Box 230, Kimballton, IA 51543; 712-
773-2199; Fax 712-773-2299; mhoward@liberty-labs.com;
www.liberty-labs.com; Michael W. Howard, President/CEO;
Cindy Schechinger, Office Admin.
INTERNATIONAL
JPN Yokohoma, Mitsunobu Samoto ....................... 81-45-500-1280
249
company directory
Lightning Technologies, Inc. ............................. 162
10 Downing Industrial Parkway, Pittsfield, MA 01201-3890;
413-499-2135; Fax 413-499-2503; lti@lightningtech.com;
www.lightningtech.com; Kenneth Wiles, Pres.; Mary Cancilla,
Off. Mgr.; Edward Rupke, VP Marketing; Mike Dargi, VP - Test
Services
Lodestome Pacific
4769 Wesley Drive, Anaheim, CA 92807; 714-970-0900;
Fax: 714-970-0800; sales@lodestonepacific.com; www.
lodestonepacific.com
Lubrizol Advanced Materials, Inc.
9911 Brecksville Rd., Brecksville, OH 44141; 8882342436; Fax:
216-447-6232; statrite@statrite.com; www.statrite.com; Dawn
Duncan, Marketing Communications; Kurt Edwards
INTERNATIONAL
BEL Brussels, Lubrizol Advanced Materials, Inc. .......32.2.678.1911
MYS Sermban, Lubrizol Advanced Materials, Inc. ..... 60.6.679.6002
M
Magnetic Shield Corporation ..................... 105, 204
740 N. Thomas Dr., Bensenville, IL 60106-1643; 630-766-
7800; Fax 630-766-2813; shields@magnetic-shield.com;
www.magnetic-shield.com; R. Dasso, Sls. Mgr.; B. Friestedt,
Sls. Mgr.; J. Fox, Pres.
CA West Hills, Cal-Ward Sls. ....................................818-883-2202
Mountain View, Peninsula Tech Sls. .................. 650-965-3636
IL Naperville, Stevens Sales .................................... 630-355-1877
MA Ashland, Daner-Hayes .........................................508-881-0400
Michigan Scientific Corporation
321 East Huron Street, Milford, MI 48381; 248-685-3939; Fax:
248-684-5406; mscinfo@michsci.com; www.michsci.com
32 Mechanic Ave, Suite 211, Woonsocket, RI 02895;
401-767-2269; Fax: 401-767-2255; engineer@microsorbtech.
com; www.microsorbtech.com; David Turi
Milmega Ltd ................................................... 23
Ryde Business Park, Nicholson Road, Ryde, United
Kingdom; +44 (0)1983-618004; FAX 44 (0)1983-811521;
sales@milmega.co.uk; www.milmega.com
Montrose Compliance Services, Inc. .................. 210
2353 Mission Glen Dr. Santa Clara, CA 95051-1214; 408-247-
5715; FAX 408-247-5714; mmontros@ix.netcom.com; www.
montrosecompliance.com; Mark Montrose, Prin.Consult.
Murata Electronics North America ..................... 127
2200 Lake Park Dr., Smyrna, GA 30080-7604; 800-241-6574;
770-436-1300; Fax 770-805-3192; chayden@murata.com;
www.murata.com; Deborah Beach, General Manager, Distribu-
tion; Tony Coalson, Vice President, Western Area Sales; John
Denslinger, Executive VP Sales & Marketing; Chinita Hayden,
Manager, Corporate Sales Promotion; Deryl Kimbro, Sr. Product
Manager, EMI and Inductor Products; Jerry Kolbe, Director,
Business Development; David McGinnis, Vice President,
Eastern Area Sales; Hideo Sakamoto, President
MShield Company, Inc. ..................................201
9 Ricker Avenue, Londonderry, NH 03053; 888-669-3539;
603-666-4433; Fax 603-666-4013; info@mushield.com;
www.mushield.com; David Grilli, Pres., Sr. Engr.
N
National Technical Systems - Headquarters
24007 Ventura Blvd., Suite 200, Calabasas, CA 91302: 800-
270-2516; FAX 818-591-0899; info@ntscorp.com; www.
ntscorp.com; Nia Carignan, Marketing Supervisor
AR Camden, NTS Camden ........................................ 870-574-0031
AZ Tempe, NTS Tempe ..............................................480-966-5517
CA Culver City, NTS Culver City ............................... 310-641-7700
CA Fullerton, NTS Fullerton ...................................... 714-879-6110
CA Santa Clarita, NTS Santa Clarita ........................ 661-259-8184
CA Santa Rosa, NTS Santa Rosa/Phase Seven ......... 707-2845875
MA Acton, NTS Acton .................................................978-263-2933
MA Boxborough, NTS Boxborough ........................... 978-266-1001
MI Detroit, NTS Detroit ..............................................313-835-0044
NJ Tinton Falls, NTS New Jersey ..............................732-936-0800
TX Plano, NTS Plano .................................................972-509-2566
VA Rustburg, NTS Rustburg/DTI ..............................414-846-0244
INTERNATIONAL
CAN NTS Calgary ........................................................ 403-568-6605
NAVAIR Advanced Warfare Technologies .............. 47
NAWCAD E3 DIVISION - Code 4.4.5, 48202 Standley Road,
Hangar 144, Suite 3B Unit 5,Patuxent River, MD 20670-1910;
301-342-1663; Fax 301-342-6982; Mark.Mallory@navy.mil;
Kurt.Sebacher@navy.mil; www.nawcad.navy.mil
NCEE Labs ..................................................... 52
4740 Discovery Drive, Lincoln, NE 68521; 402-472-5880; Fax:
402-472-5881; info@nceelabs.com; www.nceelabs.com; Doug
Kramer, Lab Manager
NEC Informatec Systems, Ltd. ........................... 175
1753, Shimonumabe Nakahara-Ku, Kawasaki, 211-8666 JA-
PAN; 81 44 455 8194; Fax: 81 44 455 8197; y-kinoshita@ak.jp.
nec.com;http://www.nec-nis.co.jp/en/; Yasushi Kinoshita
Kawasaki, 211-8666 JAPAN
Nemko Inc. .................................................... 54
303 River Road, Ottawa, K1V 1H2, CANADA; 613-737-9680;
Fax 613-737-9691; horace.lam@nemko.com; www.nemko.
com; Horace Lam, Marketing Sales
NexTek, Inc. .................................................. 161
439 Littleton Rd., PO Box 385, Westford, MA 01886;
978-486-0582; Fax: 978-486-0583; nextek@nexteklightning.
com; http://www.nexteklightning.com; Tim Mullane, Director
Business Development
Noise Laboratory Co., Ltd. ................................. 26
1-4-4, Chiyoda, Sagamihara City, 229-0037, JAPAN; 81-42-
712-2051; Fax 81-42-712-2050; sales@noiseken.com; www.
noiseken.com; Yuji Sato, Sls. Mgr.
NY New York, Shinyei Corp. of America ................... 212-682-4610
INTERNATIONAL
AUT Wien, deg-Messtechnik ......................................43-1-813-5380
BRA Sao Paulo, T&M Instruments ........................ 55-11-5092-5229
CHN Shanghai, Nihon Denkei Co., Ltd. .................86-21-5820-5887
Dalian, Nihon Denkei Co., Ltd. .................... 86-411-8762-2136
Shenzhen, Nihon Denkei Co., Ltd. ..............86-755-2096-6179
Tianjin, Nihon Denkei Co., Ltd. .................... 86-22-8386-5887
Shanghai Sanki Electronics Industries Co Ltd. ...........................
......................................................................... 86-21-5108-2783
DEU Rodemark, DHS Elmea Tools GmbH .............49-6074-9199080
IND Bangalore, Complus System Pvt Ltd ...........91-80-2343-8707
ISR Ramat Gan, IES Electronics Agencies (1986) Ltd.
............................................................................. 972-3-7530751
ITA Druento, TESEO SpA ..........................................39-11-994 1911
KOR Seoul, Noise Technology Co. Ltd. ................... 82-31-781-7816
MYS Kuala Lumpur, Nihon Denkei, Sdn Bhd .......... 60-3-9287-8671
SGP NihonDenkei Co. Ltd. ......................................... 65-6355-0851
THA Bangkok, Nihon Denkei Co. Ltd. ...................... 66-2-675-5688
TWN Taipei, Precision International Corp. ............886-2-8512-4888
O
Oak-Mitsui Technologies .................................. 97
80 1st Street, Hoosick Falls, NY 12090; (518) 686-4961; Fax:
(518) 686-8080; FaradFlex.Sales@oakmitsui.com; www.
oakmitsui.com; John Andresakis , VP of Strategic Technology;
Bob Carter, Senior Marketing and Business Development
Manager
Okaya Electric America, Inc. ............................ 162
52 Marks Road, Suite 1; Valparaiso, IN 46383; 800-852-0122;
Fax: 219-477-4856; www.okaya.com; Brian Maxwell, Market-
ing Manager
OPHIR RF ....................................................... 39
5300 Beethoven Street, Los Angeles, CA 90066;
310-306-5556; Fax: 310-577-9887; info@ophirrf.com; www.
ophirrf.com; Juliette Maor, Sales Manager

An Company
ORBIT Advanced ElectroMagnetics, Inc. (AEMI) ....... 5
P. O. Box 711719, Santee, CA 92072-1719; 619-449-9492; Fax:
619-449-1553; sales@aemi-inc.com; www.aemi-inc.com;
250
company directory
Peter Deal, Director of Sales; Scott Martin, General Manager
INTERNATIONAL
CAN Gloucester, Raymond EMC...................................613-841-1663
HKG Hong Kong, Corad Tech., Ltd ............................852-2793-0330
KOR Seoul, Chang Woo, Inc. ...........................................82 782 9056
Oxley, Inc. ....................................................148
25 Business Park Dr., Branford, CT 06405; 203-488-1033; Fax:
203-481-6971; inquire@oxleyinc.com; http://www.oxleyinc.
com; Martin Sloan, CEO
P
Pacific Aerospace and Electronics Inc. ............... 137
34 Olds Station Rd; Wenatchee, WA 98801; 509-665-6500;
Fax: 509-663-5039; dgardner@pacaero.com; www.pacaero.
com; Donna Gardner, Sales Account Manager; Ed Phinney,
Eng.Mgr.
Panashield, Inc. ............................................ 165
185 West Norwalk Road #R, Norwalk, CT 06850-4312; 203-
866-5888; Fax 203-866-6162; help@panashield.com; www.
panashield.com; Robert Yff, Pres.; Peggy Girard, VP/GM
Parker EMC Engineering .................................. 210
15246 Daphne Ave., Gardena, CA 90249-4122; 310-323-4188;
Fax: 310-323-4188; parkeremc@worldnet.att.net; www.parker-
emc.mustbehere.com; William H. (Bill) Parker, EMC Conslt.
Pearson Electronics, Inc. ................................. 40
4009 Transport Street, Palo Alto, CA 94303; 650-494-6444;
Fax 650-494-6716; sales@pearsonelectronics.com; www.
pearsonelectronics.com; Jeff Reed, President; Chris Waters,
VP Engineering
INTERNATIONAL
CHE Lengwil-Oberhofer, Telemeter Elect. ................ 41-71-6992020
CHN Corad Technology Ltd., T&M ............................852-2793-0330
DEU Munchen, Nucletron Vertriebs GmbH ............49-89-14900220
FRA Evry Cedex, BFi OPTILAS SA .......................33-1-60-79-59-01
GBR Newbury, Alrad Instruments .......................44-1-635-30345
ISR Kfar Saba, Phoenix Technologies, Ltd. .............972-9-7644800
ITA Milan, Hi-Tec S.R.L. ...........................................39-2-39266561
JPN Tokyo, Seki Technotron Corp. ............................. 03-3820-1716
KOR Seoul, Blue & Green Trading Co. ....................82-2-2026-4444
NLD Eindhoven, Ohmtronic BV.................................. 31-40-2573148
NOR Oslo, Semitronics AS ........................................47-22-80-49-20
SAU Broadway, Denver Tech. Prods......................... 27-11-626-2023
SWE Orebro, Trinergi AB ........................................... 46-19-18-86-60
Photofabrication Engineering, Inc. ....................123
500 Fortune Dr., Milford, MA 01757; 508-478-2025; Fax:
508-478-3582; pei@photofabrication.com; www.photofabrica-
tion.com
P.O. Box 840, Valley Forge, PA 19482-0840; 610-651-4700;
Fax 610-408-9724; mark.bricker@pottersbeads.com; www.
pottersbeads.com; Bob Mulhall, V.P. Business Mgr.; Mark
Bricker
INTERNATIONAL
AUS Victoria, Potters Ind. Pty., Ltd. .......................... 61-39-3147555
BRA Rio de Janeiro, Potters Ind. Limitada .............. 55-21-471-4040
CHN Beijing Potters, Gongyi Glass Corp. .............86-10-6736-4027
DEU Kirchheimbolanden, Potters-Ballotini GmbH ..49-6352-70440
FRA Saint Pourcain sur Sioule, Potters-Ballotini S.A.
........................................................................... 33-70-45-70-45
GBR Barnsley, Nigel Parkes ..................................... 441-226-287591
JPN Tokyo, Toshiba-Ballotini Co., Ltd. .................... 81-33794-7581
MEX Mexico City, Ballotini Panamericana S.A. ..........52-5-5844976
THA Samut Prakarn, Potters Limited .......................... 662-707-0500
Q
Qualtest, Inc. ................................................ 210
5325 Old Winter Garden Road, Orlando, FL 32811;
407-293-5844; Fax: 407-297-7376; info@qualtest.com; www.
qualtest.com
Quell Corporation ........................................... 125
5639 B Jefferson NE, Albuquerque, NM 87109; 505-243-1423;
Fax 505-243-9772; EESeal@Quell.US; www.eeseal.com; Paul
Miller, President; Kevin Foreman, CEO
INTERNATIONAL
CHE EMCT Inc. ............................................................41 31 859 3494
DEU Filcon Electronic................................................49 89 6141 6928
GBR Acte Components ............................................ 44 1 256 845 888
Esprit Solutions, Ltd. ........................................44 151 531 0454
GTK (UK) ...............................................................44 1243 87724
JPN Japan Aerospace Corp. ....................................... (212) 841-7439
NOR T & G Elektro AS .....................................................47 6712 9062
R
Radiometrics Midwest Corp. ............................. 87
12 E. Devonwood, Romeoville, IL 60446; 815-293-0772; Fax:
815-293-0820; info@radiomet.com; www.radiomet.com;
Dennis Rollinger, CEO
Radius Power, Inc. .........................................149
941 E North Elm Street, Orange, CA 92867; 714-289-0055;
info@radiuspower.com; www.radiuspower.com
Rainford EMC Systems Ltd ............................... 168
North Florida Road, Haydock, St. Helens, Merseyside WA11
9TN; UNITED KINGDOM; 44 1942 296 190; Fax: 44 1942 275
202; sales@rainfordemc.com; www.rainfordemc.com
Ramsey Electronics ......................................... 33
590 Fishers Station Dr., Victor, NY 14564; 585-924-4560;
Fax: 585-924-4555; brian@ramseyelectronics.com; www.
ramseytest.com; Brian Smith, Technical Sales Specialist
Rantec, ETS-Lindgren
Ray Proof Ltd. , ETS-Lindgren
Stevenage, UK; 44-1-438-730-700; www.ets-lindgren.com
Retlif Testing Laboratories................................ 73
795 Marconi Ave., Ronkonkoma, NY 11779; 631-737-1500;
Fax 631-737-1497; sales@retlif.com; www.retlif.com; Walter A.
Poggi, Pres.; William K. Hayes, Exec. V.P.; Scott Wentworth, NH
Branch Mgr.; Joseph Maiello, PA Branch Manager
CT Danielson, Mantec, Inc./Peter Mann ...................860-774-1551
DC Washington, Retlif Testing Laboratories............. 703-533-1614
NH Goffstown, Retlif ...................................................603-497-4600
PA Harleysville, Retlif/RSI ......................................... 215-256-4133
Roxtec, Inc. .................................................. 121
10127 E. Admiral Place, Tulsa, OK 74116; 800-520-4769; Fax:
918-254-2544; info@roxtec.com; www.roxtec.com
S
Sabritec....................................................... 147
17550 Gillette Ave., Irvine, CA 92614; 949-250-1244; Fax: 949-
250-1009; customerservice@ sabritec.com; www.sabritec.com;
Shannon Durr, Marketing Communications Manager
CO Denver, Trembly - David Orr .................................800-217-2731
FL West Melbourne, QREP - Mike Foresta ...............321-728-9811
IL Midwest US, Kathy McGlynn...............................773-334-7730
MA Natick, Mannix - Richard Mannix ...................... 508-655-8484
MN Excelsior, Frank Anthony Marketing ....................612-474-2850
NJ Farmingdale, EMC Technologies - Bill Watts .....732-919-1100
NM Albequerque, Trembly - Gary Mulryan ................800-217-2731
TX Irving, Space Elec. - Todd Cook .......................... 972-751-0200
UT West Jordan, Trembly - John Hoen ......................800-217-2731
WA Bellevue, AIE ............................................................ 4254554697
INTERNATIONAL
DEU Munich, Filcon Electronic - Gunther Magura . 49-89-614-1690
JPN Aichi-Pref, Chuubu Nihon Maruka ...............011-81454251610
Saelig Company ............................................. 171
1160-D2 Pittsford-Victor Rd., Pittsford, NY 14534;888-772-
3544; Fax: 585-385-1768; info@saelig.com, www.saelig.com
Schaffner EMC, Inc......................................... 156
52 Mayfield Ave., Edison, NJ 08837; 800-367-5566; Fax 732-
225-4789; usasales@schaffner.com; www.schaffner.com/us;
Gillis Mellen, Pres.
AZ Phoenix, JBS Associates, Inc/Debbie Cusimano .......................
................................................................................602-244-1212
CA Valencia, C & N and Associates/Peter Cop ........661-254-5844
CA Vista, Falcon Sales/Shirley Oakeson ...................760-598-7418
CA San Jose, ODonnell Associates North/Sherry Varela ................
...............................................................................408-456-2950
CO Centennial, Meridian Marketing,Inc/Michele La Berge .............
............................................................................... 303-790-7171
FL Oviedo, Sunland Associates/Dan Hollowell .......407-365-9533
IA Regional Manager/ Mike Sheppard ....................262-338-0256
ID Regional Manager/ Carl Martens ........................928-443-7650
IL Elk Grove Village, Brainard-Nielsen Marketing,Inc./Arthur
Guerra ................................................................... 847-734-8400
KS Regional Manager/Mike Sheppard .....................262-338-0256
MA Hingham, Norris Associates, Inc/Holly Good .... 781-749-5088
MN Minneapolis, Rockford Controls Minnesota/Mitzi Gerecke .......
763-557-2801
MO Regional Manager/ Mike Sheppard ....................262-338-0256
NC Raleigh, Aurora Tech Marketing/Gail Jones ....... 919-829-1970
NE Regional Manager/ Mike Sheppard262-338-0256
NY Smithtown, Aurora-Schmitt Associates/Bill Cavallo .................
................................................................................631-979-1313
251
company directory
NY Victor, Net Sales/Kathy Paladino ........................ 585-924-1844
OH Westlake, Allied Enterprises,Inc/Jim Estin .........440-808-8760
OR Regional Manager/Carl Martens .........................928-443-7650
PA Media, Colrud-Lowery/Peggy Manley ...............610-566-6686
TX Richardson, Advanced Technical Sales/Todd Zara ....................
............................................................................... 214-340-1300
WA Regional Manager/Carl Martens .........................928-443-7650
WY Regional Manager/Carl Martens .........................928-443-7650
INTERNATIONAL
BRA Sao Paolo , Spectrum Comercio /Dominique Alves ..................
.................................................................... BZ55-11-3889-0052
CAN Richmond, GMA/John Nichols ............................ 604-247-1122
CAN Brampton, E-Cubed Components, Inc/Michael Wheeler ...........
............................................................................... 905-791-0812
MEX Regional Manager /Mike Sheppard MX .............262-338-0256
Schurter, Inc. ................................................ 157
447 Aviation Blvd., Santa Rosa, CA 95403; 707-636-3000; Fax:
707-636-3033; info@schurterinc.com; www.schurter.com
Seven Mountains Scientific, Inc. (ENR) ...............207
P.O. Box 650, Boalsburg, PA 16827; 814-466-6559; mail@7ms.
com; www.7ms.com; Thomas Chesworth
Shanghai Viewtran Exhibition Service Co., Ltd
............................................................115, 255
Shanghai, CHINA; +86 21 62477218 62477258; Fax: +86 21
62475839; vtexpo@online.sh.cn; www.emcexpo.com; Yimin
Xu, Manager
SimLab Software GmbH ................................... 197
Kruenerstrasse 51, Muenchen 81373, GERMANY;
+49-89-7600090; sales@simlab.de; www.simlab-emc.com
Solar Electronics Co. ...................................... 160
10866 Chandler Blvd., North Hollywood, CA 91601;
800-952-5302, 818 755-1700; Fax 818 755-0078; sales@
solar-emc.com; www.solar-emc.com; Roy Talley, General
Manager
INTERNATIONAL
ARE Dubai, Denver Trading, Est. ............................................. 492772
AUS Boronia, Faraday Pty. Ltd ................................ 61-3-9729-5000
BRA Santa Cecilia , Ambriex S/A ............................... 55-11-8266722
CHN Hong Kong, Corad Tech. Ltd. ............................852-2793-0330
DEU Maintel, Pischzan Technologies ........................... 6108-771948
Berlin, Teseq Advance Solutions for EMC ............ 30 56598835
ESP Madrid, Adler Inst. ................................................... 91 3584046
Madrid, F.A. Consultores ....................................... 91-308-2136
FRA Morainvilliers, EUROMC ....................................... 1 39 75 33 44
Argeles sur Mer, M2S SARL .................................. 4 68 81 23 69
GBR Alton, Accelonix Ltd. ............................................ 01420 590000
Hitchin, Dowding & Mills......................................01462 421234
IND Bangalore, ELTEL Systems ..............................................265467
ISR Tel Aviv, R.D.T. Equip. & Systems ............................03 6450745
ITA Milan, L.P. Inst. S.r.l. ..............................................02-48401713
JPN Tokyo, Nippon Automatic Ctrl. Co. .....................03-5434-1600
KOR Seoul, EMC Solutions .......................................82-2-2168-3910
NLD Veldhoven, Comtest Instr. B.V. ..............................40-290-8830
NOR Nesbru, IDS A.S. .................................................. 47 66 98 18 70
SGP Precision Technologies .......................................65-6273-4573
SWE Motala, Proxitron AB .................................................. 141-58000
TWN Taipei, Alpha Precision Instr. Corp. ..................... 02-25084204
ZAF Wynberg, Protea Comm. & Meas. Div ...................11-786-3647
Spectrum Control ...........................................145
8031 Avonia Rd., Fairview, PA 16415; 814-474-2207; Fax
814-474-2208; info@spectrumcontrol.com; www.specemc.
com; Kerri Fabin, Director of Sales & Marketing - EMI Filters &
Components
AL Huntsville, GWA-Alt/Hsv .....................................256-882-6751
AZ Tempe, Westrep ................................................... 480-820-9932
Queen Creek, W. Reg. Sales Office/Jim Devere ..........................
...............................................................................866-281-0903
CA Anaheim, Westrep ................................................ 714-527-2822
Los Altos, Recht .................................................. 650-964-6321
CO Centennial, W. Howard Associates ..................... 303-766-5755
FL Hutchinson Island, FLA Technology Sales .........954-802-2385
Lake Mary, SE Reg Sales/Jason Russolese ...... 866-565-6226
IA Cedar Rapids, MidTech........................................219-395-0028
IN Indianapolis, Dytec, Inc. .......................................317-578-0474
Indianapolis,Alliance Mfg. (Automotive) ............ 317-575-4600
MA Woburn, Kitchen & Kutchin ................................. 781-782-0700
MD Columbia, Mechtronics Sales .............................410-309-9600
MN S. St. Paul, North Port Engineering .................... 651-457-8000
NC Raleigh, EMA (Electronic Marketing Association) ......................
............................................................................... 919-847-8800
NJ Fairfield, TAM (Technical Applications & Marketing) ................
............................................................................... 973-575-4130
NY E. Syracuse, Leonard D. Allen ..............................315-431-1001
PA Elizabethtown, NE Reg Sales/Jeff Showers ........866-281-0988
TX Richardson, Pro-Comp Sls. ................................ 972-669-1500
El Paso, World Class Marketing ..........................915-585-3228
WA Redmond, Haleo, Inc............................................ 425-497-8500
INTERNATIONAL
CAN ON, Canadian Source Corp. .................................905-415-1951
DEU Schwabach, European Sales ............................... 49-9122-7950
GBR Norfolk, UK & Ireland Sales.............................44-1493-602602
MEX Guadalajara, Marfil .......................................... 011-52-33-3670
Spira Manufacturing Corporation .......................... 2
12721 Saticoy St. South, N. Hollywood, CA 91605; 818-
764-8222; Fax 818-764-9880; sales@spira-emi.com; www.
spira-emi.com
AZ Tucson, Synergistic Technology Group ..............520-760-0291
CA RC Products ..........................................................510-440-0500
CA San Diego, Altamont Tech. Serv.......................... 858-733-0618
DC Carwithen Associates ..........................................410-549-3335
MD Mt. Airy, Carwithen Associates Inc. ....................410-549-3335
NM Synergistic Technology Group ............................520-760-0291
NV North, RC Products ..............................................510-440-0500
NV South, Synergistic Technology Group ................520-760-0291
VA Carwithen Associates ..........................................410-549-3335
INTERNATIONAL
AUT Tricom Mikrowellen GMBH ...............................49-8161-86066
CHE Tricom Mikrowellen GMBH ...............................49-8161-86066
CHN USA Contact, IES Technologies Inc. ...................630-632-5941
DEU Tricom Mikrowellen GMBH ...............................49-8161-86066
FRA Getelec ............................................................ 33-146-44-68-91
ISR Silram Ltd. ......................................................... 972-9-767-1332
JPN Intermark Co., Ltd. ............................................81-587-34-3761
Sulzer Metco (Canada) Inc. ................................ 98
10108 - 114 Street, Fort Saskatchewan, T8L 4R1, CANADA;
780-992-5280; Fax 780-992-5275; jim.girgulis@sulzer.com;
www.conductivefillers.com; Jim Girgulis, Business Manager,
Electronic Materials
Sunol Sciences Corporation ............................... 65
1051 Serpentine Lane, #100, Pleasanton, CA 94566; 925-485-
9260; Fax 925-485-9325; emc@sunolsciences.com; www.
sunolsciences.com
ISO 9001: 2000
Swift Textile Metalizing LLC .............................. 95
PO Box 66, Bloomfield, CT 06002; 860-243-1122; Fax 860-
243-0848; info@swift-textile.com; www.swift-textile.com;
Steven Smith, Sales
Syfer Technology Limited ................................. 147
Old Stoke Road, Arminghall, Norwich NR14 8SQ, United King-
dom: 44-1603-723310; FAX 44-1603-723301; sales@syfer.
co.uk; www.syfer.com; Howard Ingleson, Mng. Dir.; Chris
Noade, Mktg. Mgr.; Matt Youngs, Internal Sales
Sypris Test and Measurement ............................ 77
6120 Hanging Moss Road, Orlando, FL 32807; 800-839-4959
; Fax: 407-678-0578; testinfo@sypris.com; www.wetest.com;
Paul Bessette, National Director of Operations; Mark Dillard,
Director of Sales and Marketing; Kelly Kearns, Marketing
Communications Coordinator; Gary Rohlke, National Accounts
Manager
T
TDK Corporation of America ...............................11
1221 Business Center Drive, Mount Prospect, IL 60056;
847-803-6100; Fax: 847-803-1125; emcsolutions@tdktca.
com; www.tdk.com; Brad Poole, Project Manager; Sara Rey-
noso, Marketing Manager
AL Huntsville, TDK Corporation of America ........... 256-464-0222
CA Los Angeles, TDK Corporation of America ........ 562-596-1212
San Diego, TDK Corporation of America ............ 858-715-4200
San Jose, TDK Corporation of America ..............408-437-9585
CO Denver, TDK Corporation of America..................303-926-4995
FL Deerfield Beach, TDK Corporation of America 954-425-0095
GA Atlanta, TDK Corporation of America .................678-584-2275
IN Indianapolis, TDK Corporation of America ........ 317-872-0370
MI Detroit, TDK Corporation of America .................. 734-462-1210
NC Greensboro, TDK Corporation of America.......... 336-292-0012
NH Bedford, TDK Corporation of America ............... 603-622-0003
NJ Iselin, TDK Corporation of America ....................908-653-0910
TX Irving, TDK Corporation of America ...................972-506-9800
Austin, TDK Corporation of America .................. 512-258-9478
INTERNATIONAL
BRA Sao Paolo, TDK Corporation of America Brazil ..........................
.............................................................................. 551132899599
Tech-Etch, Inc. .............................................. 111
45 Aldrin Rd., Plymouth, MA 02360; 508-747-0300; Fax 508-
746-9639; sales@tech-etch.com; www.tech-etch.com; David
Dahlquist, Shielding Products Business Manager
AL Huntsville, Blair Engineering, SE, Inc. ................. 256 880 6602
CA Brea, Motion Components .................................. 714-255-1080
Santa Clara, Ross Marketing Assoc. .................. 408-988-8111
CO Westminster, Straube/Delltron ........................... 303-426-0890
DC Ellicott City, Eastern Tech Corp. ...........................410-715-2100
FL Miami, Blair Engineering, SE, Inc. ....................... 305 498 4882
St. Petersburg, Blair Engineering, SE, Inc. .......... 727 869 8600
GA Norcross, Blair Engineering, SE, Inc. .................. 770 734 0400
IL Barrington, EMT Engineering Sales .....................847-481-7403
KS Kansas City, Midtec Associates, Inc. .................. 913-541-0505
MA Carver, Connors Co., Inc. ................................... 508-866-5392
MD Ellicott City, Eastern Tech Corp. ...........................410-715-2100
ME Carver Connors Co., Inc. .................................... 508-866-5392
MI Farmington Hills, R. C. Merchant Co., Inc............248 476 4600
St. Joseph, R. C. Merchant Co., Inc. .....................269 983 7378
MN Burnsville, EMT Engineering Sls. ....................... 952-888-1020
MO St. Louis, Midtec Associates, Inc..........................314 839 3600
NC Wake Forest, Blair Engineering, SE, Inc. ........... 919 -562-6644
NH Carver, Connors Co., Inc. ................................... 508-866-5392
NJ Marlton, Brandon Associates, Inc. ...................... 856-767-2899
NY Canandaigua, Brandon Associates, Inc..............716-394-6080
Commack, Brandon Associates, Inc. ................... 631 864 8058
OH Kettering, Frederic Ohmer & Assoc. ................... 937-434-1454
OR Beaverton, Technical Marketing, Inc. .................503-627-9000
252
company directory
PA West Chester, Brandon Associates, Inc. .............610-738-8500
UT Westminster, Straube/Delltron ........................... 303-426-0890
VA Mechanicsville, Eastern Tech Corp.....................804-402-2277
WA Kirkland, Technical Marketing, Inc. ....................425-739-4600
Spokane, Technical Marketing, Inc. .................... 509-924-7609
WI Miquon, EMT Engineering Sls. ...........................262-236-4001
WY Westminster, Straube/Delltron ........................... 303-426-0890
INTERNATIONAL
BEL Teleson ..................................................................322-482-0737
CAN Dollard des Ormeuaux, The ID Group Inc. .......... 514-575-8044
CHN Beijing, Mindar China Co. LTD. .........................8610 64680338
DEU Berlin, Feuerherdt Gmbh ................................. 49307759094SS
DNK Gydevang, Bomberg EMC Products .....................454 814 0155
FRA Viroflay Cedex, Milmega S.A. ...............................33130247718
GBR Rochdale , TBA Electro Conductive Products ...441706 647718
ISR Rishon Le-Zion, Maham Fasteners .....................972 3 9626516
ITA Sirces/Italy .......................................................... 390245491945
JPN Tokyo, Taiyo Wire Cloth Co. ................................. 81334937851
NOR EG Components ....................................................472-291-7971
PRK Eretec .................................................................. 823-1427-0061
SGP Ayer Raja Industrial Estate, Glocom Marketing PTE, LTD.
................................................................................ 65 6873 0933
TWN Taipei Hsien, TennMax, Inc. ............................... 886226954137
ZAF Bryanston, Connecta P/L ....................................27 11 463 2240
TESEQ, Inc. .................................................... 68
52 Mayfield Avenue, Edison, New Jersey 08837; +1 732
417 0501; Toll free +1 888 417 0501; Fax: +1 732 417 0511;
usasales@teseq.com; www.teseq.com
Thermo Fisher Scientific .................................. 51
Thermo Fisher Scientific, 1 Lowell Research Center; Lowell,
MA 01852; 978-275-0800; Fax: 978-275-0850; sales.esd@
thermo.com; www.thermo.com/esd
TMD Technologies Ltd ...................................... 29
Swallowfield Way, Hayes, Middlesex UB3 1DQ, UNITED
KINGDOM; 44 20 8573 5555; Fax: 44 20 8569 1839; heather.
skinner@tmd.co.uk; www.tmd.co.uk
Tri-Mag........................................................ 141
1601 N. Clancy Court,Visalia, CA 93291; 559-651-2222; Fax:
141559-651-0188; jmli@tri-mag.com; http://www.tri-mag.
com/Filters/Filters.html; Ming-Li Jia; Luanne Martinez
TV Rheinland of North America, Inc. .................. 76
12 Commerce Rd., Newtown, CT 06470; 203-426-0888; Fax:
203-426-4009; info@tuv.com; www.tuv.com; Dana Craig,
Division Manager EMC/TELECOM
TV SD America Inc., New Brighton, MN
1775 Old Highway 8 NW, Suite #104, New Brighton, MN
55112; 651-631-2487 or go to www.TUVamerica.com; Fax
651-638-0285; info@tuvam.com; www.TUVamerica.com;
Anita Westman, EMC Account Executive; Kevin Larson, Product
Director EMC/Aero
U
Underwriters Laboratories, Inc. ......................... 75
Corporate Headquarters, 333 Pfingsten Rd., Northbrook, IL
60062-2096: 847-272-8800; FAX 847-272-8129; EMC@us.
ul.com; www. ul.com/hitech/emc
AK ANCHORAGE ........................................................ 907-258-5414
CA Brea ....................................................................... 714-447-3060
Granada Hills ........................................................818-830-8401
San Diego .............................................................614-546-0908
Santa Clara ...........................................................408-985-2400
CO Boulder ..................................................................303-442-6098
FL Tampa .....................................................................813-882-3118
GA Stone Mountain ....................................................770-498-9156
MD Baltimore...............................................................410-944-3580
ME Burlington ............................................................. 617-270-5577
MN New Brighton ........................................................ 612-631-0650
MO Chesterfield .......................................................... 314-205-0212
NC Research Triangle Park ........................................ 919-549-1400
NY Melville ................................................................. 516-271-6200
TX Dallas ....................................................................972-960-2669
WA Camas ................................................................... 360-817-5500
Edmonds ............................................................... 425-778-2710
INTERNATIONAL
DNK Herlev, DEMKO A/S ...........................................45-44-85-6565
GBR Guildford, UL International ............................ 44-1438-302-130
HKG New Territories, UL International ......................852-2695-9599
JPN Tokyo UL Japan Co., Ltd. ..................................81-3-3571-3188
KOR Seoul, UL Korea Ltd. .......................................... 82-2-784-4346
MEX Mexico City, UL deMexico, SA de C.V. ............. 52-5-294-7660
SGP Singapore, UL International Svcs. Ltd. ................. 65-274-0702
TWN Taipei, UL International Svcs......................... 886-2-2891-7642
V
Vanguard Products Corp. ..............Inside Front Cover
87 Newtown Rd., Danbury, CT 06810; 203-744-7265; Fax 203-
798-2351; info@vanguardproducts.com; www.vanguardprod-
ucts.com; Mark Hansen, Sls. Mgr.
CA South CA, LA, San Diego, Advanced Technical Sls Inside Front
Cover ..............................................................................................
714-726-4767
CA North CA & Bay Area, Advanced Technical Sls...........................
............................................................................... 925-736-2147
FL Coral Springs,Miller Industrial Sales Co. ..........954-755-5200
MN West WI, North IA, ND, SD, Jobst Assoc. ........... 952-447-3709
NY NJ, PA, James Himlin & Assoc. ..........................585-218-0036
OH IN, KY, WV, Micro-Sales, Inc. ............................. 330-722-7980
TX MS, LA, OK, AZ, KS, AR, NM, UT, CO, EMI Systems .................
............................................................................... 214-537-9333
WI East & Central WI, IL, MI, North IN, Cerny Associates ...............
................................................................................262-792-1060
INTERNATIONAL
AUS Victoria, Specialised Conductives ........... 61-39-8461-490
CAN Ontario, BK Component Solutions ......................416-509-5355
CHN VANGUARD PRODUCTS ....................................... 203-744-7265
DEU Herrieden, Thora Elektronik ......................... 49-982-592-80-0
FRA Viroflay Cedex, Milmega ................................. 33(1) 302-47718
GBR Milton Keynes, Osco Ltd..................................44-1908-376688
ISR Tel Aviv, C.C.S. Technologies, Ltd. ...................972-3540-5421
ITA Brembate, Technopartner ............................ 39 (0)-3548-74010
JPN Osaka, Vanguard-Japan/Kohyei Trading .....81-(663)-4195-42
MEX EMI Systems ......................................................... 214-537-9333
NOR Oslo, EG Components-Norway .......................... 47-22-91-7971
SWE Vallingby, EG Components-Sweden ................. 468-759-35-23
W
Washington Laboratories, Ltd.
7560 Lindbergh Drive, Gaithersburg, MD 20879;
301-417-0220; Fax: 301-417-9069; info@wll.com; http://www.
wll.com; Mike Violette, President
Wavecontrol
Pallars, 65-71, Barcelona 08018, SPAIN; +34 933208055; Fax:
+34 933208056; info@wavecontrol.com; www.wavecontrol.
com; Jordi Accensi, Sales Director
WEMS Electronics .......................................... 137
4650 W. Rosecrans Ave., Hawthorne, CA 90250-6898; 310-
644-0251 Ext. 176; FAX 310-644-5334; salesinfo@wems.com;
www.wems.com; John OBrien, W. Regional Sales Dir.; Norm
Richarte, Engineering Mgr.; David Stanis, Gen. Mgr.; Rodney
Boyd, E. Regional Sales Dir.
Westaim Ambeon - SEE Sulzer Metco (Canada) Inc.
www.conductivefillers.com
White Sands Test Center E3 Test Facilities ........... 56
USA White SandsTest Center, ATTN: CSTE-DTC-WS-SV-E
(S. Jesson), Building 21225, White Sands Missile Range,
NM 88002; 505-678-6107; Fax: 505-678-3999; stephanie.
jesson@wsmr.army.mil; John Chavarria, E3 Site Manager;
Stephanie Jesson, Test Officer/Consultant
World Cal, Inc. ............................................... 83
PO Box 410,2012 High Street, Elk Horn, IA 51531;
712-764-2197; Fax: 712-764-2195; dwarner@world-cal.com;
http://www.world-cal.com; Dennis Warner, Lab Manager
Z
Zero Ground .................................................. 151
3392 Hillside Court, Woodridge, IL 60517-1438; 866- ZERO-
GND (866-937-6463); Fax 630-968-1200; engineering@zero-
ground.com; www.zero-ground.com; Jim Ainsworth, XGS
Group, GM / Managing Dir; Northern CA; Lew Backer, XGS
Group, Managing Dir; AZ, NV, NM Sales; Reid Berg, Sales, Tri-
Flex Elect. Pty Ltd. - Author.Distr.-Australia; Roy Mason, ZERO
GROUND LLC, Regional Sales Manager - Canada; Mark Panko,
ZERO GROUND LLC, V.P. Sales & Marketing; Donna Silvers,
President, 2ND Source - Authorized Distr. (CA)
AZ XGS Group ............................................................520-818-9505
CA XGS Group ............................................................ 650-572-2741
XGS Group ............................................................ 858-207-9234
XGS Froup.............................................................650-581-9550
2ND Source ......................................................... 800-832-3340
NC Charlotte, Zero Ground ........................................704-564-9289
NM XGS Group ............................................................520-818-9505
NV XGS Group ............................................................520-818-9505
WI Appleton Control Systems ....................................920-725-1173
EMC Detroit.indd 1 1/25/2008 12:15:57 PM

Call for Papers, Workshops, and Tutorials

The IEEE Product Safety Engineering Society seeks original, unpublished papers and
tutorials on all aspects of product safety and compliance engineering including, but not
limited to:

Product Safety: Consumer, medical, computer (IT), test and measurement, power
supplies, telecommunication, industrial control, electric tools, home
appliances, cellular and wireless, etc.
Safety Subjects: Electrical, mechanical, fire, thermal, chemical, optical, software,
functional, reliability, etc.
EMC / RF: Electromagnetic emissions, electromagnetic immunity, regulatory,
Introduction to EMC/RF for the safety engineer and compliance
engineer.
Components: Grounding, insulation, opto-couplers, capacitors, transformers,
current-limiters, fuses, power line filters, ferrite, environmental,
electromagnetic emissions, electromagnetic immunity, regulatory,
etc.
Certification: Product safety, electromagnetic emissions, electromagnetic
immunity, environmental, processes, safety testing, regulatory, etc.
Standards Activities: Development, interpretations, status, interpretations, country
requirements, Laboratory Accreditation, etc.
Safety Research: Body physiological responses to various hazardous energy sources,
unique safeguard schemes, electrically-caused fire, etc.
Environmental: RoHS, WEEE, EuP (Energy-using Products), Energy Star,
Packaging Directives, REACH (Chemical), CeC, etc.

Authors Schedule

Intent to present and topic (e-mail) April 29, 2008
Draft e-paper June 1, 2008
Notification of Acceptance July 6, 2008
Complete e-paper August 17, 2008

Send intent to present, topic, and questions to Richard Nute
richn@ieee.org or FAX 1-858-592-2620

See http://www.ieee-pses.org/symposium/index.html#CFP
for more details on requirements and dates.

Chair
Gary Schrempp
Gary_Schrempp@dell.com

Co-Chair
Doug Nix
dnix@ieee.org

Treasurer
Bansi Patel
BansiPatel@eaton.com

Secretary
Brian Greaney

Technical Program
Bob Griffin
bobgriff@us.ibm.com

Gary Tornquist
garytor@microsoft.com

Richard Nute
richn@ieee.org

Exhibits/Promotions
Thomas Ha
tom@gmcompliance.com

Exhibit Manager
Sue Kingston
s.kingston@ieee.org

Registration
Diana Krynski
d.krynski@ieee.org

Arrangements/Logistics
Brian Greaney

Daniece Carpenter

Communications, Webmaster,
and Program Records
Dan Roman
Dan.Roman@ieee.org

Merchandising
Daniece Carpenter

IEEE Conference Planner
Jessica Lotito
j.lotito@ieee.org

Conferences Vice President
Richard Georgerian
richardg@ieee.org

At-Large Members
Jim Bacher
Jack Burns
Daniece Carpenter
Elya Joffe
Henry Benitez
Ken Thomas

2008 IEEE Symposium
on Product Safety and
Compliance Engineering
Sponsored by the IEEE Product Safety Engineering Society
20-22 October 2008 Austin Marriott North, Austin, TX
www.ieee-pses.org/symposium
IEEE_PSES.indd 1 2/29/2008 4:07:47 PM
EMC China 2008.indd 1 2/14/2008 2:34:24 PM
256
3M ELECTRONIC SOLUTIONS DIVISION 89
A2LA 227
A.H. SYSTEMS, INC. 13, 49
ACME TESTING 253
AD-VANCE MAGNETICS, INC. 203
ADVANCED MONOLYTHIC CERAMICS 139
ADVANCED TEST EQUIPMENT RENTALS 34
ALCO TECHNOLOGIES, INC. 101
APEX DIE & GASKET INC. 122
AMPHENOL CANADA CORP. 135
AR 7, 58, 59, 67, 91,191
A.R.A. TECHNOLOGIES 29
ARC TECHNOLOGIES, INC. 3
ARCOTRONICS, INC. 155
AXONICS, INC. 210
CAPTOR CORPORATION 141
CHOMERICS, DIV. OF PARKER HANNIFIN CORP. 103
CITEL, INC. 163
COM-POWER CORPORATION 61
CPI (Communications and Power Industries) Canada, Inc. 37
CSA INTERNATIONAL 71
CST OF AMERICA, INC. 181, 189
CURTIS INDUSTRIES 143
DAYTON T. BROWN, INC. 79
DEXTER MAGNETIC TECHNOLOGIES 128
DNB ENGINEERING, INC. 81, 159
DONALD HEIRMAN CONSULTANTS LLC 210
DONTECH INCORPORATED 210
EAST COAST SHIELDING LLC 210
ELECTRONICS TEST CENTRE 85
EM SOFTWARE & SYSTEMS SA (PTY) LTD. 187
EM TEST AG 34, 40
EMC/CHINA (BEIJING) 2008 119
EMC/CHINA 2008 SHANGHAI 115, 255
EMCC DR. RASEK 87, 253
EMC COMPONENT GROUP, INC. 131
EMC EUPEN, A DIV. OF I2R CORP. 146
EMI FILTER COMPANY 131
EMSCREEN GMBH 173
ENR 207
EPCOS, INC. INSIDE BACK COVER
ETS - LINDGREN 1, 9, 84, 169, 177, BACK COVER
FAIR-RITE PRODUCTS CORP. 129
FISCHER CUSTOM COMMUNICATIONS, INC. 25
FOTOFAB CORP. 113
GARWOOD LABORATORIES, INC. 55
GENISCO FILTER CO. 143
GORE 117
HENRY OTT CONSULTANTS 210
HOOLIHAN EMC CONSULTING 210
HV TECHNOLOGIES, INC. 31
IEEE 2008 SYMPOSIUM ON EMC (DETROIT) 16, 253
IEEE 2008 PRODUCT SAFETY ENGRG SYMPOSIUM 28, 254
INGENIUM TESTING LLC 43
INSTRUMENTS FOR INDUSTRY (IFI) 1721, 193
INTERMARK USA INC. 179
INTERTEK TESTING SERVICES 45
ITEM PUBLICATIONS
14, 15, 27, 35, 41, 57, 69, 93, 133, 142, 153, 194
KIKUSUI AMERICA, INC. 83
KIMMEL GERKE ASSOCIATES LTD. 210
LAIRD TECHNOLOGIES 99
LCR ELECTRONICS, INC. 148
LEADER TECH, INC. 109
LIBERTY LABS, INC. 63
LIGHTNING TECHNOLOGIES, INC. 162
MAGNETIC SHIELD CORPORATION 105, 204
MILMEGA LTD. 23
MONTROSE COMPLIANCE SERVICES, INC. 210
MURATA ELECTRONICS N. A., INC. 127
MUSHIELD COMPANY, INC. 201
NAVAIR ADVANCED WARFARE TECHNOLOGIES 47
NCEE LABS 52
NEC INFORMATEC SYSTEMS LTD. 175
NEMKO INC. 54
NEXTEK, INC. 161
NOISE LABORATORY CO., LTD. 26
OAK-MITSUI TECHNOLOGIES 97
OKAYA ELECTRIC AMERICA, INC. 162
OPHIR RF 39
REQUEST INFORMATION FROM OUR ADVERTISERS REQUEST INFORMATION FROM OUR ADVERTISERS
index of advertisers
ORBIT ADVANCED ELECTROMAGNETICS, INC. (AEMI) 5
OXLEY DEVELOPMENTS COMPANY LTD. 148
PACIFIC AEROSPACE AND ELECTRONICS, INC. 137
PANASHIELD, INC. 165
PARKER EMC ENGINEERING 210
PEARSON ELECTRONICS, INC. 40
PHOTOFABRICATION ENGINEERING, INC. (PEI) 123
QUALTEST, INC. 210
QUELL CORP. (FORMERLY METATECH) 125
RADIOMETRICS MIDWEST CORP. 87
RADIUS POWER, INC. 149
RAINFORD EMC SYSTEMS LTD. 168
RAMSEY ELECTRONICS 33
RETLIF TESTING LABORATORIES 73
ROXTEC, INC. 121
SABRITEC 147
SAELIG COMPANY, INC. 171
SCHAFFNER EMC, INC. 156
SCHURTER, INC. 157
SIMLAB SOFTWARE GMBH 197
SOLAR ELECTRONICS CO. 160
SPECTRUM CONTROL, INC. 145
SPIRA MANUFACTURING CORP. 2
SULZER METCO (CANADA) INC. 98
SUNOL SCIENCES CORPORATION 65
SWIFT TEXTILE METALIZING LLC 95
SYFER TECHNOLOGY LTD. 147
SYPRIS TEST AND MEASUREMENT 77
TDK CORPORATION OF AMERICA 11
TECH-ETCH, INC. 111
TESEQ, INC. 68
THERMO FISHER SCIENTIFIC 51
TMD TECHNOLOGIES LTD. 29
TRI-MAG, INC. 141
TV RHEINLAND OF NORTH AMERICA, INC. 76
UNDERWRITERS LABORATORIES, INC. 75
VANGUARD PRODUCTS CORP. INSIDE FRONT COVER
WEMS ELECTORNICS 137
WHITE SANDS TEST CENTER E3 TEST FACILITIES 56
ZERO GROUND LLC 151
Index of Advertisers ag_08.indd 256 5/6/2008 5:30:24 PM
For superior soIutions: EMC fiIters
just everywnere .
S|a|da|d 2-, 8- a|d 4-|||e ||||e|
|c| 1 |c 2,o00 A || |c:|
A|E, P|C a|d ||e Wa.e ||||e|
|eed|||cu| :crpc|e|| |c| up
|c o00 A a|d 440 VAC, /o0 VOC
|c|e |||c|ra||c| a| WWW.ep:c.:cr
w|de |a|e c| :|aroe| ||||e| a|d
||||e| :ao||e|
0W| a::|ed||ed E|C |aoc|a|c|]
|c|e ||a| o0 ]ea|' e/pe||e|:e
LMV ssaIdorI, armany Marrh 7 Io 9, Z006 haII 1, 8Iand 1LZ9
-OREINFORMATIONATWWWUSAEPCOSCOM
6aII 800-888-7729 E-aiI ioductors-ec.usa@epcos.co
EPCOS.indd 1 2/11/2008 4:11:48 PM
ETS 10000 chambers.indd 1 3/3/2008 2:12:40 PM

Item Emcdirectory-Design 2008

Enviado por

Dados do documento

Direitos autorais

Formatos disponíveis

Compartilhar este documento

Compartilhar ou incorporar documento

Opções de compartilhamento

Você considera este documento útil?

Este conteúdo é inapropriado?

Direitos autorais:

Formatos disponíveis

Item Emcdirectory-Design 2008

Enviado por

Direitos autorais:

Formatos disponíveis

te te ee techhhhnolooooogi gi gi gi gies es es s es

nn Conndduccttttiv t e Maaateria rials l ...... .......... . ...... .................................8888 8

Vanguard.indd 1 2/11/2008 2:19:24 PM

: (sub-amp-ability). noun: The ability to use an amplifier individually, or

Acme Testing Co. ................................................................. 195

Lightning Test System

laser probes have 3 levels of

is uniquely qualied to help

ultra-thin power/ground planes

Standard FR-4 with

Alco.indd 1 2/11/2008 12:58:31 PM

& bolt-in filter plates

Zero Ground.indd 1 3/26/2008 2:05:04 PM

Você também pode gostar