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Energy-Saving Initiative Motors & Controls Consumer Electronics Forum In This Issue...
A Hearst Business Publication
onsense tools for the busy EE
MAY 2012
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Vol. 54, No. 12 MAY 2012
CONTENTS
PRODUCT
UPDATE
Dc/dc
converters
68
C
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v
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r

P
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t
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.
DEPARTMENTS
6
Viewpoint: Its not a small world after all
8
Product of the Year Story Behind the Story:
International Rectifiers IR3550 a big feat in a small
footprint
11
OUTLOOK (Technology News)
Hybrid cube promises memory revolution
Standoff sensing system identifies materials using
dual-laser technique
SID lights up Boston
At Sensors Expo, MEMS the word
Whats new at IMS2012
63
Whats Inside: Samsung Galaxy Nexus SCH-i515
Mobile Handset
64
Product Application: Industrial automation electronics
66
Product Roundup: Packaging & EMI/RFI Shielding
68
Product Update: Dc/dc converters
NEW PRODUCTS
77
Power Sources
83
Packaging & Interconnections
88
Intergrated Circuits
90
Components & Subassemblies
93
Optoelectronics
94
Test & Measurement
Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553.
Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or
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Want to see what the Editors are thinking? www2.electronicproducts.com/ElectronicProductsBlogs.aspx
Focus: Industrial strength, smartphone sensibilities
New Scale Technologies
Data centers discover the value of LiFePO4 batteries
Palladium Energy
Safety and the lithium battery
Monolithic Power Systems
whats ONLINE...
Matching ESD protection to process geometry
ON Semiconductor
The evolution of quartz timing technology
Pericom
Redefining low power in current-sense amps
Touchstone Semiconductor
OUTLOOK
Hybrid cube
promises memory
revolution
11
COVER STORY
Lighting & Optoelectronics
39
This month, Electronic Products looks at several
technical issues faced by those designing LED-
based lighting and flat-panel displays.
41
When it comes to binning LEDs,
some like it hot
44
Drivers enable next-gen LED street
lighting
51
Balancing power parameters in LED apps
54
New approach prevents thermal runaway
58
Increasing viewability, not backlighting,
for displays
ENERGY-SAVING INITIATIVE SERIES
22
Part 1 The history of energy harvesting
FEATURES
27
Motors & Controls
Brushless motors with integral controls
30
Consumer Electronics Forum
Whats Inside
Samsung Galaxy
Nexus SCH-i515
Mobile Handset
63
ELECTRONIC PRODUCTS www2.electronicproducts.com MAY 2012 5
shrimp at the bottom of the Mariana
Trench, but that doesnt really apply
to people in some of the remote parts of Africa or Latin
America, does it? Personally, this traveler has been in a
few places in the last few years where Internet access or
cell service was nonexistent to limited, at best. But I
think we fool ourselves into believing the hype the
world is such a small place. Maybe I should just blame
Disney and the Its a Small World After All stuff for
my childhood misconception.
Bryan DeLuca
To comment on this Viewpoint, visit www.eebeat.
com/?p=4967
Its not a small world
after all
L
ike nodes of many kinds, peo-
ple have a tendency to cluster
together. Why? Jobs, food,
shelter, safety, and the comfort of
human companionship.
But what about technology? We
think technology makes the world
a small place, and it does on some
level because it allows us to con-
nect to anyone in the world,
right? Yes, you can make calls
to remote places or share ideas
on the Internet with people in
other countries. Yes, yes, yes.
But overall you cannot reach
everyone everywhere by far. I
call BS on the whole thing.
Did you ever look at a light
pollution map? More than
half the land mass of the world
is blacked out. If you fly over
east of the Mississippi, the place
it lit up like a Christmas tree. I
can even see from the air the ma-
jor roadways that lead to my house
while coming in at JFK. Fly over China and its dark in so
many places.
But light pollution is not the only map that looks like
this. So does cell phone coverage. Now stack those maps
on top of a population density and you start getting a re-
ally good picture of how the world is wired to say the
least. And where the technology, including communica-
tion, really spans. We tend to even forget about the power
we need to run everything.
So why do we try to kid ourselves the world is such a
small place? Yes, James Cameron can tweet he saw some
VIEWPOINT
Coming in over Long Island, you can trace
every major roadway. (Photo courtesy of
Laura Leudesdorff-DeLuca)
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Electronic
PRODUCTS
International Rectifiers IR3550
a big feat in a small footprint
PRODUCT OF THE YEAR
THE STORY BEHIND THE STORY
T
he IR3550 PowIRstage is a pio-
neering device that features a
synchronous buck gate driver,
an integrated synchronous MOSFET,
and a Schottky diode all in a 6 x 6 x
0.9-mm PQFN package. The device
targets high-current multiphase buck
regulators and simplifies dc/dc con-
verter design. It will find application
in next-generation servers, storage,
and communication systems. The
company set the standards for this
device high, requiring that the pack-
aging optimized efficiency by reduc-
ing parasitic and increasing thermal
conduction. The driver design of this
new device had to ensure that the
drive characteristics optimized the
efficiency of the Generation 12.5
MOSFETs used in the device. The
IR3550 design team was required to
hit the efficiency targets that cus-
tomers demanded and to hit the
space/density requirements as well
a big feat in a small footprint.
Three teams from within IR com-
bined to accomplish this design:
multiphase design, packaging, and
application engineering.
The company saw that next-gen-
eration high-performance server,
storage, and communication system
CPUs, GPUs, and DDR memories have
increasingly challenging power man-
agement requirements of up to 300-A
load currents at very low voltages of
around 1 V. The very high efficiency,
low power losses, excellent thermals,
and reduced space were some of the
key demands for these next-genera-
tion systems. In order to meet these
requirements, a multi-
phase synchronous buck
converter is needed. The
maximum current per
phase has traditionally
been limited to 15 to 30
A due to the limitations
of conventional MOS-
FET, driver, and packag-
ing technologies. The
IR3550 PowIRstage de-
livers the highest bench-
marked efficiency in the
marketplace for high-
current multiphase solu-
tions and it does it at 60
A. This allows custom-
ers to increase the main
CPU dc/dc solution efficiency signifi-
cantly, saving energy and cost or meet
a similar efficiency to previous gen-
erations, but without a heat sink, sav-
ing space and cost or meet a similar
efficiency to previous generations,
but with at least one, possibly two
fewer phases For example, you can
convert a six-phase design to a five- or
even four-phase design. For increas-
ing load requirements extra phases
are required to handle the power,
which in most cases is extremely un-
desirable and leads to extra board
space, increased system costs and
higher component count.
Paul OShea
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News about Products... Product Technology... Product Applications OUTLOOK
Hybrid cube promises
memory revolution
M
icron Technology (Boise, ID) is working on a Hy-
brid Memory Cube (HMC) that uses through-hole
via (TSV) technology to provide a new category of
high-density memory unlike anything else around today.
Micron says HMC will deliver 15x higher bandwidth us-
ing 70% less power in one-
tenth the space of existing
server memory and
thats certainly a big
step forward.
The rst cube product
will be available mid-2013 as a 2-
Gbyte, four-layer cube with a 160 Gbyte/s
external interface.
The cube essentially a single chip will have
four, or more, DRAM die stacked above a high-speed logic
layer. These layers are connected using TSV. The DRAM is
new and is designed solely to handle data, with the logic
layer handling all DRAM control within the HMC. Having
short interconnects means you can have faster intercon-
nects that do not need fancy drivers to handle inches of
circuit board.
Micron says HMC will yield more than 15x the perfor-
mance of a DDR3 module due to the very fast interface,
unlike the slower parallel interface used in current mod-
ules. Micron also promises the device will take 70% less
energy/bit than DDR3 and the HMCs stacked architecture
uses nearly 90% less space than todays RDIMMs.
Micron has co-founded the Hybrid Memory Cube consor-
tium with Samsung, and other industry leaders have since
joined them. The consortium aims to identify and approve
specications for a Cube standard during 2012. For more in-
formation, visit www.micron.com/innovations/hmc.html
Jim Harrison
Company claims 15x higher bandwidth using 70% less power
in 10% the space of existing server memory
Standoff sensing system identifies
materials using dual-laser technique
I
dentifying chemicals from
a distance could take a step
forward with the introduc-
tion of a two-laser system be-
ing developed at the Depart-
ment of Energys Oak Ridge
National Laboratory.
In a paper published in the
Journal of Physics D: Applied
Physics, Dr. Ali Passian and
colleagues present a technique
that uses a quantum cascade
laser to pump, or strike, a
target, and another laser to
monitor the materials re-
sponse as a result of tempera-
ture-induced changes. With
two lasers, one serves as the
pump and the other is the
probe, said Passian, a mem-
ber of ORNLs Measurement
Science and Systems Engineering Division. The novel as-
pect to our approach is that the second laser extracts infor-
mation and allows us to do
this without resorting to a
weak return signal.
While this approach is sim-
ilar to radar and lidar sensing
techniques in that it uses a re-
turn signal to carry informa-
tion of the molecules to be
detected, it differs in a number
of ways. It uses photothermal
spectroscopy conguration,
where the pump and probe
beams are nearly parallel, and
probe beam reectometry as
the return signal, which mini-
mizes the need for wave-
length-dependent expensive
infrared components.
This work represents a
proof of principle success that
Passian and co-author Dr.
Rubye Farahi said could lead to advances in standoff detec-
tors with potential applications in quality control, forensics,
An infrared pump laser scans a region of interest of the sample and an
accompanying probe laser reads out the absorption spectrum of the
constituent molecules.
OUTLOOK
SID lights up Boston
D
isplayWeek is the premier annual showcase of the Society for Informa-
tion Display (http://sid.org/) and takes over the Boston Convention
Center from June 3 to 8. Companies that participate in DisplayWeek
are viewed as technology leaders by the display industry, and by the interna-
tional press that covers this event. The annual DisplayWeek Exhibition is the
best event for sales and marketing of displays and display-related products to
the North American market.
This years special topics of inter-
est are 3D, Green Technologies, Sol-
id-State Lighting, and Flexible Elec-
tronics and Printed Displays.
Attendees at Display Week 2012 will
be given the opportunity to attain a
comprehensive learning experience
in these special topics of interest by
listening to presentations during
the four-day technical symposium,
attending the Sunday Short Courses
and Monday Seminars, and getting
a business perspective from the Busi-
ness and Investors Conferences and
the Market Focus Conferences.
3D-ready TVs are still one of the
biggest commercial stories in display
technology in recent years. Re-
searchers continue to pursue the dif-
ferent approaches of active-shutter
vs. passive glasses technology, and
glasses-free viewing is a major chal-
lenge that many experts believe
must be met in order to make 3D
displays truly successful.
Environmental, social, and legis-
lative forces are also combining to
ensure that manufacturers use the
greenest-possible processes to create
the most energy-efcient displays.
Some of the questions still needing
answers revolve around the antici-
pated production and end-of-life is-
sues for the display industry.
Solid-state lighting has begun to
fulll its promise with regard to sav-
ing energy and providing design
exibility. Many presentations at
this years solid-state-lighting ses-
sions will be about OLEDs and the
trends in LED illumination.
This is the rst year that SID has
dedicated sessions to exible elec-
tronics and printed displays; among
airport security, medicine and the mil-
itary. In their paper, the researchers
also noted that measurements obtained
using their technique may set the stage
for hyperspectral imaging - providing
high-resolution chemical as well as
topographical information.
For more information, see www.ornl.
gov/info/press_releases/newsroom.cfm.
By Jim Harrison
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Change Batteries in 2018
Features
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Enabling long battery life in an always-on system means drawing very little active standby current. Fortunately, our
LTC
3104 does just that: its buck regulator can deliver 300mA with up to 95% efficiency with a no load quiescent current of
just 1.8A when in Burst Mode
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from the buck output. The LTC3104s wide 2.5V to 15V input voltage range accommodates a variety of input sources, making
it ideal for remote sensor networks, portable instruments and a wide range of battery-powered devices.
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Output Current (A)
65
E
f
f
i
c
i
e
n
c
y

(
%
)
95
100
60
55
90
75
85
80
70
0.0001 0.01 0.1 1
50
0.001
V
IN
= 4V
V
IN
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V
OUT
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L = 10H
LTC3104 Efciency Curve
(Automatic Burst Mode Operation)
OUTLOOK
At Sensors
Expo,
MEMS
the word
T
he organizers of this years Sen-
sors Expo are quick to point out
that microelectromechanical
systems (MEMS) will be a key technol-
ogy featured in the educational ses-
sions and throughout the Expo Hall
during the event. We are proud of
our history and our focus on cutting
edge technology by partnering with
the MEMS Industry Group and oth-
ers, said Wendy Loew, Group Show
Director for Questex Media Group,
LLC, producers of Sensors Expo.
Since 1987, when the industry was
just in its infancy, we have been bring-
ing together the industry leaders like
Epson, ROHM, PCB Piezotronics, and
MicroStrain to share the newest tech-
nologies with engineers who are pro-
viding the solutions for tomorrow.
Beginning Tuesday, June 5, MEMS
education at Sensors Expo will kick
off with a pre-conference workshop
entitled MEMS in the Mainstream:
Commercialization and Product Real-
ization - Leveraging the MEMS Infra-
structure produced in partnership
with MEMS Industry Group (MIG).
the exciting work that will be described at the symposium
are the printing of organic TFTs and a new way to use high-
temperature processes on low-temperature substrates.
This years keynote speakers will offer talks about
breakthroughs in OLEDs and how they can be used for
OLED TVs. For example, mass-production OLED displays
have gone from 5 to 55 in. in just three years. Another
speaker will talk about three waves of display evolution
for the continuous growth of the LCD market including
the notebook, at-screen monitors, and LCD TVs, but
these have slowed and even stagnated. The next wave
will be the multi-purpose use of displays, such as in smart
windows, smart e-boards, and digital art displays. The
nal keynote will be about the development of novel dis-
plays by the Camera Culture Group at the MIT Media
Lab. These architectures exploit both the design of opti-
cal elements (e.g., lenslet arrays and layered light-attenu-
ating masks) and the development of the associated light-
eld encoding/decoding algorithms. Some of the novel
displays include a new type of I/O device that possesses
the ability to both capture images
and display them; and a 6D optical
system, which responds to changes
in viewpoint as well as changes in
back-lit transmitted illumination.
Paul OShea
For more on DisplayWeek at
the Boston Convention Center
from June 3 to 8, go to http://
www.displayweek.org/
>>
Find out how LabVIEW can make you better at ni.com/labview/better 800 453 6202
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OUTLOOK
Whats new at IMS2012
haul, WiGig (IEEE 802.11ad) multi-Gbit/s solutions in-
cluding wireless cable replacement (HDMI, USB 3.0, Dis-
playPort), wireless docking
stations, video/magazine ki-
osks and wireless sensors. The
HMC6000 transmitter IC can
translate analog baseband in-
phase and quadrature signals
to a selected channel in the 60-
GHz band, requiring only an
external crystal oscillator.
The HMC6000 transmitter
IC includes a low-phase-noise
frequency synthesizer for tuning across the 57 to 64-GHz
band in 500 or 540 MHz steps depending upon the refer-
ence input frequency. The HMC6001 receiver IC operates
with single-ended input signals from a selected channel
in the 60 GHz band and downconverts them to differen-
tial analog I and Q baseband signals.
Analog Devices (Booth #1725) will spotlight complete
system solutions and demos of new offerings, including RF/
IF ampliers, frequency synthesizers and data converters,
including the industry rst ADL5324 half-Watt RF driver
amplier with dynamically adjustable bias and extended
temperature range for wired and wireless applications. In
addition, ADI will demo the ADRF660x series of mixers and
ADRF670x series of modulators, which achieve a break-
through level of integration, enabling LTE and 4G base sta-
T
his years International Microwave Symposium
(IMS2012) is being held in Montral, Quebec, Can-
ada, from June 17 to 22. It coincides with the 60th
anniversary of the Microwave Theory and Techniques So-
ciety (MTT-S), which will be celebrated in various ways at
the symposium. Below are just a few products that will be
shown. For additional related news plus more products
shown at IMS2012, visit my column at www.eebeat.com/
?author=5 during the conference.
Showcased parts
TriQuint Semiconductor (Booth# 1815) will present a pair
of best-in-class ultra-low-noise single-ended ampliers for
3G/4G cellular base
station frequencies,
the TQP3M9036
(0.4-1.5 GHz) and
TQP3M9037 (1.5-
2.7 GHz). Although
highly integrated
and fully matched,
the parts deliver a
noise gure of less
than 0.5 dB while providing 19 dB of gain minimum.
Samples are now available.
Hittite Microwave (Booth #1701) will showcase the
HMC6000/6001 silicon transceiver chipset, which targets
60-GHz applications such as: metrocell/picocell back-
TriQuints TQP3M9036/37 ultra-low noise
amplifiers
Hittites HMC6000/6001
silicon transceiver chipset
Sensors Expo will be held June 6 and 7 at the Donald E.
Stephens Convention Center in Rosemont, IL. For more
information, visit www.sensorsexpo.com.
This symposium will explore the many models of achiev-
ing MEMS commercialization and product realization.
System-level customers in attendance will learn how to
leverage a mature MEMS infrastructure capable of deliver-
ing system-level components without the cost, develop-
ment time or performance risks of
years past.
Speakers will discuss how MEMS
fabrication has evolved, creating a
new era of in-house fabrication as
well as fabless and fab-lite manufac-
turing. Presentations will include
different perspectives on how com-
panies have incorporated MEMS so-
lutions into their current product
line while using their existing in-
frastructure. They will also address
the product development challeng-
es and the market-pull-versus-tech-
nology-push issues that are unique
to MEMS. In other words, MEMS is
in the mainstream.
The conference will showcase over 55 sessions during
the two-day event, including a dedicated MEMS track with
nine sessions. Specic MEMS sessions include:
Sensor Fusion: Applications, Challenges and Solu-
tions, chaired by Stephane Gervais-Ducouret, Director
for Sensors, Freescale
An Integrated 6-axis MotionProcessor, by Stephen
Lloyd, Vice President of Engineering and New Product
Development, InvenSense
MEMS in High Performance Audio, by Rob OReilly,
Senior Staff Engineer, Analog Devices.
In addition to the conference pro-
gramming dedicated to MEMS, Sen-
sors Expo will also provide a show-
case of the newest MEMS products
and services, as well as education on
what is to come, at the MEMS Pavil-
ion. The Pavilion will display best-
in-class exhibitors including Ad-
vanced Microsensors, Fraunhofer
ENAS, Fraunhofer IPMS, Omron, ST-
Microelectronics, Tronic MEMS, X-
Fab, and Yole Development all
providing their latest MEMS tech-
nologies. Inside the pavilion, the
MEMS Innovation Area will be dedi-
cated to companies who are on the
forefront of strategic MEMS products, such as MEMS Indus-
try Group, Acuity, Hua Yank, and Plures Technologies.
Richard Comerford
Analog, Digital & Mixed-Signal
ICs, Modules, Subsystems & Instrumentation
2 Elizabeth Drive Chelmsford, MA 01824
978-250-3343 tel 978-250-3373 fax sales@hittite.com
Order On-Line at: www.hittite.com
Receive the latest product releases - click on My Subscription
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OUTLOOK
tion manufacturers to realize an unprecedented 60 percent
reduction in board space and a signicant savings on BOM
costs.
At the Agilent booth (#1015) you will see the EXG
N5171B,EXG N5172B, MXG N5181B, and MXG N5182B X-
Series signal generators which the company claims provide
unmatched performance in phase noise, output power,
ACPR, EVM, and bandwidth.
The MXG delivers phase
noise performance of 146
dBc/Hz at 1 GHz and 20-kHz
offset, and a spurious perfor-
mance of 96 dBc at 1 GHz.
Both the MXG and EXG fea-
ture low EVM, output power
up to +27 dBm, and ACPR of
up to 73 dBc (W-CDMA
test model 1, 64 DPCH).
Anritsu (Booth # 807)
will be showcasing its MS2830A Signal Analyzer and Vec-
torStar Broadband ME7838A system. With extended fre-
quency range to 43 GHz, the MS2830A can measure Tx
characteristics of mobile backhaul signals used in the mi-
crowave band, as well as second-order harmonics in digi-
tal terrestrial and satellite broadcasting systems up to 36
GHz. The ME7838A has industry-best broadband fre-
quency coverage starting at 70 kHz and operational
from 40 kHz to 125 GHz as well as best-in-class dy-
namic range (108 dB at 65 GHz and 107 dB at 110 GHz)
and measurement speed (55 ms for 201 points).
The OX-501 mini OCXO from Vectron International
(Booth #1300) combines a small footprint with high sta-
bility, providing 20 ppb over the full industrial tempera-
ture range in a compact industry-
standard 9x14-mm package. The
OX-501 bridges the gap between
AT cut based TCXOs and larger
OCXO designs and provides im-
proved phase noise and short-
term stability.
Teseq (Booth# 82) will show-
case the PMM 9180 digital EMC/
EMI receiver module that provides a frequency range
from 6 to 18 GHz. It is ideal for use in commercial test labs
and by in-house manufacturers labs. It features a high
speed optical interface, an operating temperature of 5
to 45C, a measurement accuracy of +2.0 dB and a maxi-
mum input level of 137 dBV without damage. It is fully
compliant with CISPR 16-1-1 and MIL-STAD.
Christina Nickolas
Vectrons
OX-501
Agilent Technologies MXG and
EXG signal generators
IMS2012 (www.ims2012.org) will be held at Palais des
congrs de Montral in Canada during Jun 17-22.
Design Outside the Box !
ZILOGS REFERENCE DESIGNS
For more information, please visit www.zilog.com
Mini-Z Modules are 28-pin dual-inline single-board computers that are easy to use
and support a wide base of free application resources.
These handy modules feature the 16-bit ZNEO CPU-based Z16F2810 MCU and are
designed to be pin-compatible with various other stamp modules, which allow for
fexibility to utilize diferent vendors base boards that you may already have in your
arsenal.
These Mini-Z stamps also ship with supporting design boards, which provide a
mix-and-match capability for creating fast solutions.
Here are just several of the Mini-Z Reference Designs Zilog ofers:
Mini-Z ZNEO 28-Pin Module
Mini-Z WLAN 28-Pin Module
Mini-Z Solid State Relay (SSR) Design Board
Mini-Z ZNEO SSR Kit
Mini-Z WLAN SSR Kit
Part Number
Z16F2800100MODG
Z16F28WF100MODG
Z16SSR00100DBDG
Z16SSR00100KITG
Z16F28WF100KITG
Mini-Z Reference Design Products
Design With Freedom
mouser.com/bomtool
The Newest Products for Your Newest Designs
Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc.
mouser.com
Semiconductors and electronic
components for design engineers.
Authorized Distributor
Scan here to try
Mousers new
BOM Tool
mouser.com
A BOM Tool as high-tech
as the parts it researches.
ElecProd_5-1 BOM.indd 1 4/13/12 8:55 AM
Engineering
Distribution
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In Partnership with
E
very DIYer sometimes find themself
asking: Should I hire a professional?
Developing and cleaning a BOM
yourself is no different, beyond considering the hours
required to complete it (especially if Microsoft Excel or
other software is used that was not created specifically to
manage a BOM).
So it makes little senseparticularly if you are trying to
respond to an RFQ on time, to not use the BOM cleansing
and finalizing support tools provided by an authorized
electronics distributor. Here are a variety of reasons why:
The one cent mistake that can cost thousands
BOM software tools will validate the accuracy and cur-
rency of supplier names and part numbers, finding and
correcting misspelled manufacturer names on the cleansed
spreadsheet. You may have one row on your spreadsheet
that references TI and another row that reads Texas In-
struments. The BOM tool will recognize that and map
both into a consistent, proper format. Scrubbing old and
incorrect data for parts also minimizes sourcing delays
caused by inaccurate or invalid part data.
Environmental compliance
Using a distributors BOM tool can help head off any com-
pliance issues that may arise. It severely lessens the possi-
bility that a new RoHs-imposed regulation or a prohibited
chemical listed in REACH might find its way onto a BOM,
thus eliminating fines or lost sales due the oversight.
Part obsolescence
Using a distributors BOM analysis tool helps designers avoid
specifying discontinued parts or parts on the suppliers Not
Recommended for New Designs list, which means a part
has been superseded by another. When a BOM tool catches
obsolete semiconductors early, you stand a better chance of
finding an alternative quickly and/or developing a second-
ary source. Similarly, the BOM tool provides you with the
time needed to find an approved substitute for parts that
come in and out of stock frequently.
Early access to new technology
BOM tools reference a huge parts database, helping you
find the right solutions to fit your design. A distributors
relationship with suppliers gives them access to supplier
technology roadmaps and ensures that you get the newest
parts that meet your needs.
Mousers new Bill of Materials (BOM) Management Tool
(for more in-depth details of Mousers new BOM see the
article on the opposite page) enables users to import a new
BOM or view BOMs saved in their account. It lets you set
preferences for how you want your BOM to be processed
(such as currency, formatting, RoHS options, and more).
The tool will remember your preferences, naming
conventions and column mapping for future BOMs as well
as the product selections you have made previously.
It can analyze partial part numbers and descriptions
using a relevancy engine so that the best options can be
offered rather than simply showing that no results have
been found.
Upon completion of processing your BOM, you are
presented with an import summary, which quickly lets
you know the number of lines that were imported,
unresolved, quoted and unmatched. If the tool found
more than one match, you then review the possible
matches and select the one you want (a process known as
part resolution). Once in the part resolution phase, you
will see the data you provided at the top of the screen and
all the possible matches below it. Simply examine the
results displayed, select the part you want, and then click
the Add Selected Part to BOM button.
The new Mouser BOM Tool is available to anyone with a
My Mouser Account.
BY MURRAY
SLOVICK
Dont Let Your BOM become a BOMB
Engineering
Distribution
able to learn more about this timesaving business tool,
easily accessible at www.mouser.com/bomtool/.
Our goal was to build the most intelligent BOM tool
for our industry,
making the materials
management process
less burdensome for
engineers and buyers,
shared Shumate. It
remembers not just
your preferences,
but the layout of
your spreadsheets,
your naming
conventions and
the product selections made previously. No part number,
no problem. Instead of only matching exact
manufacturers part numbers, it can analyze partial part
numbers and descriptions using a relevancy engine so
that the best options can be offered. Currently, other
industry BOM tools come up short by showing no
results found.
Unlike other distributors BOM tools, engineers and
buyers can choose what product data they want in
which columns and export everything into their
original spreadsheet with their own custom formatting
intact. Currency, formatting, RoHS options, and other
individual preferences are remembered allowing each
user to create a truly personalized experience. If a
customer does not have a spreadsheet, they can easily
paste data directly into the tool. Overall, Mousers BOM
tool is designed to work around individual users, rather
than demanding that individual users conform to a set
process determined by the distributor. Ultimately, this
benefits customers by allowing them to spend less time
reformatting data and resetting preferences. The tool is
as unique as each customer that visits mouser.com and
uses it.
Overall, Mousers new and improved BOM
Management Tool gives engineers and buyers what they
demand most time to design the next technological
wonder. For more information, visit www.mouser.com/
bomtool/.
Engineering
Distribution
A
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W
orking smarter is all about discovering new
efficiencies the kind of efficiencies that
streamline complex mundane tasks, offer
process improvements, and conserve valuable resources.
Regardless of the end product, every business is in a race
against time hard at work identifying new ways to
create more product while actually using less time.
This served as the business context and challenge
that led to the development of the all-new intelligent
Bill-of-Materials (BOM) Management Tool from Mouser
Electronics.
Mouser a subsidiary of TTI and part of the esteemed
collection of Berkshire Hathaway companies is a
leading worldwide
electronics distributor
focused on design/
prototype creation and
development. The
companys chief mission
is helping design
engineers and buyers
engineer a speed-to-
market advantage by
supplying the newest semiconductors and components for
product design,
combined with
any number of
Mousers value-
added services.
Mousers new
BOM Management
Tool is available
to anyone with a
My Mouser Account,
enabling users to
import a new BOM
or view BOMs
saved in their
account. In visiting
with Hayne Shumate,
Vice President of
Mouser Internet
Business, we were
In Partnership with
Engineering a Better BOM Tool
By Mouser Electronics, www.mouser.com, (800) 346-6873
Engineers and buyers can learn more about
Mousers new intelligent BOM tool on
Mouser.com/bomtool.
Hayne Shumate, Vice President of Mouser
Internet Business, heads the companys
BOM tool development team.
Mousers global headquarters and
distribution center spans over 492,000
square feet.
Making low-voltage energy harvesting practical:
Part 1
The history of energy harvesting
Bringing a sleeping giant to life
BY BOB CHAO, CEO
Advanced Linear Devices
www.aldinc.com
T
odays world-wide mantra is for
everyone and everything to be
wireless and as energy efficient
as possible. Suddenly, being tethered
to a line source or even a recharge-
able battery-pack, is not acceptable.
Engineering has extended battery
life to the point we now have the abil-
ity to cut the ac power cord for ex-
tended hours, in some cases portables
units can 24 hours or
more before requiring a
recharging. Energy har-
vesting creates the next
technology shift giving
us the ability to cut, or
at least reduce signifi-
cantly, both the a/c cord
and batteries with that
will at some point re-
quire recharging.
Ultimately, the goal
is to be able to capture
any number of very
low-state energy sourc-
es such as photovoltaic,
piezoelectric, thermo-
electric, wind, biome-
chanical or even ambi-
ent radio frequency
(RF) and electromag-
netic (EM) radiation harness this
currently unused power to run any
number of devices and products al-
lowing them to be in a near always
charged status.
We have come a long way. In the
last few years. Energy-harvesting tech-
nology has evolved to capture accu-
mulate, store and manage the energy
available from these sources. Figure 1
shows the basic concepts of energy
harvesting. But it has been a long jour-
ney since man first felt the suns rays.
Thanks to fossil fuels
The interest in harvested energy was
given a kick start in the late 1970s
when the first energy crunch came
about. Suddenly, fledgling technolo-
gies such as solar became all the rage,
and large-scale wind farms started
cropping up as well. Coincidentally,
technology had evolved to make this
somewhat practical. And contrary to
most normal technological develop-
ment tracks, the dynamics of large-
scale wind and solar technology were
much easier to implement than mi-
cro- and nano-scale technology. It
seemed like the planets had
aligned to present the ideal
combination of circumstances to
give birth to the energy-harvesting
industry and bring it into the main-
stream.
Of course, just because it can be
done doesnt always mean it will be
done. There was a lot of panic short-
ly after the first energy crisis, and
that jump-started large-scale devel-
opment of the only two practical
sources of scavenged or free energy
available at that time-wind and solar
power. As fossil fuel prices adjusted
to market demands over the next few
years, the bump that wind and solar
got from the initial panic seemed to
fade into the background. Develop-
ment continued, but alluring ROIs
that the hand-wringers promised
with the demise of fossil fuels never
materialized. The cost of fossil fuels
stabilized, and the cost of energy
harvesting still had a fairly high
amortization cost curve.
Solar powers contribution
Modern commercial photovoltaic
technology was developed in the
United States in 1954 when Daryl
Chapin, Calvin Fuller, and Gerald
Pearson developed the first commer-
cially producible silicon photovoltaic
(PV) cell at Bell Labs. This first sili-
con solar cell offered a mere 4% effi-
ciency.
It wasnt until the late 1960s that
solar cell technology advanced
enough to be implemented with
some confidence on a larger scale.
NASA decided solar was a better
choice to power satellites than nucle-
ar, which gave a green light to the
technology for commercialization.
Shortly thereafter, in the early
1970s, Dr. Elliot Berman, backed by
Exxon Corporation, designed a sig-
nificantly less costly solar cell. This
was accomplished by selecting a low-
er grade of silicon and evolving
an electronic products special series
ENERGY-SAVING
INITIATIVE
Fig. 1: Energy-harvesting
overview. (Courtesy of Advanced
Linear Devices.)
Solar-powered satellite. (Courtesy: NASA)
If you use RFID toll tags, automated water, gas or electric utility
meters, tire pressure monitors, or numerous other electronic
devices, youre probably using Tadiran batteries. You never knew
it because our batteries perform just as they were designed to,
delivering decades of trouble-free performance.
If theyre good enough for you, then theyre
good enough for your next project. Specify
a lithium battery that is so reliable,
its forgettable.
Tadiran Batteries
2001 Marcus Ave.
Suite 125E
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1-800-537-1368
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www.tadiranbat.com
You probably use
a Tadiran battery
but you dont
even know it.
PROVEN
25
YEAR
OPERATING
LIFE
ENERGY-SAVING
INITIATIVE
cheaper packaging. This reduced the
cost of the cell by 80%, bringing it
down from $100/W to $20/W. From
this point on, solar started to find a
home in more segments of industry.
But it wasnt until the 1990s that
better and cheaper cells were devel-
oped by applying methods such as
growing the silicon into shapes that
eliminated most of the slicing or
finding a way to simply apply solar
cell material onto inexpensive, but
rigid support structures, such as ce-
ramic, glass, plastic, or steel.
Coming soon to an array near you
are tomorrows PV cells with an ex-
pected 40%+ efficiency from
nanoparticle- and molecular beam
epitaxy-based technologies currently
on the drawing board. Essentially,
the developments of the 1990s laid
down the platform for todays 21st
century micro- and nano-photovol-
taic energy-harvesting technology.
Feel the wind
Over the years, man has used the
wind to power an almost unimagi-
nable array of devices.
Today, even human breath is ca-
pable of being harvested as a power
source a far cry from the trade
winds that powered early man to the
far corners of the world.
The most ubiquitous wind har-
nessing device is the windmill. Oth-
er than the sail, the windmill con-
cept is the basis for all wind-driven
energy devices. Perhaps the most re-
nowned utilization of windmills is
the fabled Dutch windmill innova-
tion that allowed them to drain lakes
and rivers in Europes Rhine river
delta. As far back as 200 BC, the Chi-
nese used windmills to pump water
a technique that was refined well
into the 19th century and used in
farm irrigation. About the same time,
the Persians used windmills to grind
their grain. This same general wind-
mill technique was later adapted to
generate early forms of electricity.
The first wind turbine to generate
electricity was developed by Profes-
sor James Blyth of Andersons Col-
lege in Glasgow. The configuration
consisted of cloth sails resembling
windmill blades. The generated en-
ergy was stored in accumulators and
used to power the lights of his vaca-
tion cottage in Marykirk.
Todays wind turbines are a far
cry from the windmills of bygone
eras. Modern wind turbine fields can
be seen in any number of geographic
locations around the country and
the world. According to the U.S. De-
partment of Energy, by 2030, wind-
generated energy will account for
20% of all of the generated energy in
the U.S. Europe is expected to be
even more wind powered by then.
Flip it around 180
Solar and wind have always been the
predominant sources of scavenged/
waste or free energy. Their success and
what we have learned from them has
inspired great thinkers to scale down
energy harvesting to the micro level.
As a result, the girth of energy har-
vesting has ex-
panded beyond just
wind and sun to in-
clude movement,
heat, mechanical
vibration, RF, and
others, as men-
tioned previously.
Low-power en-
ergy harvesting is
a technology of
the 21st century.
As such, its history is short but dy-
namic. Technology advancements of
the late 20th century jump started
this emerging field. The ability to re-
duce the power requirements of por-
table devices by orders of magnitude,
in just the last 10 years, has made
formerly unthinkable waste energy
sources realistic for the next genera-
tion of portable and remote devices.
While low-power harvested ener-
gy has been on the drawing board
since the late 1990s, it wasnt until
about 10 years ago that the first gen-
eration of low-power energy-harvest-
ing devices emerged. They were de-
signed to harvest micro power
primarily from photovoltaic or piezo-
electric sources. However, they were
really designed more as backup
sources to charging circuits and still
required battery back-up. In 2007,
the first true micro-powered energy-
harvesting product was developed. It
was capable of capturing energy not
only from photovoltaic or piezoelec-
tric, but also from virtually any mi-
cro-power source and its generating
action, such as:
Mechanical: vibration, stress
Thermal: furnaces, heaters,
friction
Light: photo-sensor, photo-diode
Electromagnetic:inductors,
coils, transformers
Natural Resources: wind, water,
solar, human
Other: chemical, biological
The ability to capture waste ener-
gy is due to technology known as
zero- and nano- powered metal-
oxide semiconductor field-effect
transistors (MOSFETs). These devices
can be triggered by input voltages as
low as 100 mV, and input power of as
low as 200 nA. The ultra-low pow-
ered energy-harvesting modules are
the technology that has unlocked
the next generation of energy-har-
vesting devices (see Fig. 2). This tech-
nology will be discussed, in detail, in
the next installment of this series.
This leap in technology has gener-
ated a fast-forward movement in the
development of true, untethered mi-
cro-powered energy-harvesting de-
vices. The future of this technology
will also be covered in detail, in the
third and final article in this series.
The wheels have been greased a
glimpse of the future has been
handed to us, and Moores Law is
starting to come into play in this
arena. The history of energy har-
vesting is a colorful one- from Ne-
anderthal man lying on a rock in
the sun to warm up, to future min-
iature wind turbines that can cap-
ture waste heat and power from the
breath of a human. Because micro-
power energy harvesting is such a
new platform, much of its history is
still to be written. We are lucky to
be at the forefront of the next evolu-
tion of energy harvesting.
Fig. 2: Zero-Threshold and nanopower MOSFETs.

The history of energy harvesting
The New 45 watt GRN Series power supply.
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Brushless motors
with integral
controls
The third wave of distributed motion
aids reliability, MTBF
BY JOHN MOREHEAD, Vice President,
Business Development
Dunkermotoren USA
www.dunkermotor.com
J
ust as fractional horsepower gear-
motors freed factories in the 1920s
from their cumbersome, inefficient,
and unreliable overhead networks of
shafts and pulleys connected by leath-
er belts, todays brushless servo motors
with integral intelligent control allow
machine builders to shorten product
devel opment
time, reduce
wiring com-
plexity and in-
stallation costs,
and increase
machine effi-
ciency and
reliability. In-
tegrated mo-
tor/controls
allow design
e ng i ne e r s
more time to
focus on the
control architecture more specific
to the machines problem at hand.
Distributed motion history
Aside from water-wheel-powered
saw and grist mills of the 18th cen-
tury, the first wave of modern dis-
tributed motion followed the indus-
trial revolution in the late 19th
century when factories began using
one or more of the early large, floor-
mounted electric motors to drive a
complex system of ceiling-mounted
lineshafts, bearing supports, spindles
and pulleys that distributed motion
to where the work was being done.
A second wave came in the 1920s,
with the advent of small fractional
horsepower gearmotors which could
be matched to the individual appli-
cation requirements of diverse pieces
of machinery and were compact
enough to mount directly on the
machinery. This brought about sig-
nificant productivity and reliability
gains by eliminating the typical
problem of the whole plant being
down when a prime mover failed or
required maintenance.
In the late 20th century, innova-
tors in the motors and motion con-
trol industries recognized that ad-
vances in electronic components
were a big help in developing brush-
less dc motor applications by inte-
grating the formerly dis-
crete motor and
control together
into a compact,
single compo-
nent only
sl i ght l y
l a r g e r
than the
motor itself. The
challenge then was
to design controls compact enough
to fit the motors form factor and
perform reliably over a realistic life-
time when attached to a source of
inherent heat generation.
From the mid-1990s onward, a va-
riety of brushless motors with inte-
grated controls were introduced with
capabilities ranging from simple
speed to full-on intelligent servo mo-
tor control. The systems incorporat-
ed the motor, power electronics,
controller, software, feedback, I/O
and communications in a single me-
chatronic component. This third
wave of distributed motion moves
away from large, expensive central-
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Motors & Controls
ized controls, enclosures, and unnecessary wiring and
incorporates the motion controls directly into the indi-
vidual axes of motion.
Types of integral control brushless motors
Brushless motors with some form of controls built-in
offer a wide variety of capabilities.
Integrated commutation electronics: Perhaps the simplest
embodiment and in some applications an easy, long-
life, maintenance-free drop-in replacement for brushed
dc motors. Many of these two-wire motors are for sin-
gle-direction applications, as in pumps, and offer not
only simple speed control by varying the dc voltage,
but in most cases the life of the motor is increased by a
factor of five or more. Variations have the ability to re-
verse direction and stop and hold via more I/O.
Integrated 4-quadrant digital speed control: These motors
can be commanded through digital inputs to run in
either direction, stop and hold with torque, or coast to
a stop. Other inputs can switch between preset speeds
or allow for variable analog speed reference. Accel/de-
cal ramps can be programmed and digital outputs give
hall-effect pulses, direction of rotation, and ready/er-
ror state information back to a programmable logic
controller.
Integrated positioning control: These motors can close a
position loop. Initially, the selection of the mode of op-
eration (analog or digital torque or speed control and
relative, absolute and/or modulo position control) is set
up via a GUI and the parameters are downloaded to the
motor. Once set-up, it runs as a stand-alone, pro-
grammed servo which interfaces to the rest of the ma-
chine via digital and analog I/O.
Integrated master electronics: These motors have the ability
to be a master in a network of several other motors. Like
the integrated positioning control motor, it requires no
higher level controller, but it is not limited to standard
operating modules and is freely programmable to the
application needs and can close current, velocity, and
position loops or control slave node motors.
Integrated CANopen electronics: Integrating CANopen
electronics follows the trend in machine design to use
distributed control of not only I/O devices, but motors
as well and functions as a single node on a CAN of up
to 126 motors. The ability to access each motor through
the CAN network may eliminate the need for separate
I/O modules and/or PLC altogether.
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control provides the answer: All speed and positioning con-
trollers are designed to match with DC motors up to 700 watts
power. The EPOS2 positioning controller can be used with
CANopen and Interpolated Position Mode.
Motors & Controls
Integrated Profibus electronics: Inte-
grating these electronics is similar
to the CANopen version noted
above but functions as a slave on a
Profibus DP network.
Integrated EtherCAT electronics:
These are designed to be a slave
on an EtherCAT network and
CANopen over Ethernet (CoE) is
supported.
Benefits of integrated control
There are many benefits of integrated
control brushless motors, and the one
that gets the most attention is reduced
cost. When specifying brushless mo-
tors in the past, it was not unusual
that the requisite standalone elec-
tronics to provide the commutation
and simple speed-control capabilities
cost more than half as much as the
motor itself, not to mention the wire
or cabling and connectors needed to
mate the two components. The inte-
grated control approach is much more
economical.
Other economies come in to sig-
nificantly reduce installation and
start-up time, as this type of motor ap-
proaches plug-and-play. Brushless dc
motors are typically higher in efficien-
cy than the motors they replace and
can significantly reduce energy costs.
Many of todays integral control mo-
tors are also available with high envi-
ronmental protection ratings like IP65
and as a single, integrated unit offer
rugged high reliability. The integrated
control solution saves space and great-
ly simplifies the machines overall lay-
out, wiring, and parts count. Integral
controls also reduce EMI.
When networked, integral control
motors can reduce bus load and, with
integral encoders, are easy to con-
nect. Some versions also provide im-
portant emergency capabilities, such
as returning to a safe position when
there is a network failure.
From a reliability standpoint, some
integrated controls yield an MTTF of
650,000 hours and, as noted, brush-
less motors typically offer five times
the life of brushed motors. Should
there be a problem, the time required
to diagnose and replace a single com-
ponent is significantly reduced. And,
the inevitable finger pointing by
discrete component suppliers is elim-
inated. A big benefit for machine
builders adopting these motors is the
continued advancements in the field
of silicon and software that contrib-

ute to the advancement of these solu-
tions not only from a performance
and reliability standpoint, but in
terms of value.
One example of an integral con-
trol brushless motor would be the
BG45x15PB from Dunkermotor; a
compact 12 to 24-V, 47-W BLDC mo-
tor that is 45 mm (or 1.77 in.) square.
It has a Profibus interface, integral en-
coder, and four-quadrant positioning
motion control. This highly reliable
unit can perform complex motion
profiles and dynamic positioning.
The standard unit has a list price of
$774 and is available with optional
planetary or right-angle gearing and a
power-off brake. Dunkermotor pro-
duces integral control brushless mo-
tors in a range of different sizes with
up to 550-W poweroutput.
Brushless motors with integral controls
Consumer Electronics Forum
Industry experts discuss new developments, continued trends,
and the future of portable devices for consumer electronics
A
s 2012 unfolds, we are already
seeing a splash of new technolo-
gies related to consumer elec-
tronics, such as haptic features on
smartphones. We also continue to see
the continuation of the trend of por-
table products with integrated batter-
ies and the need for new approaches to
lower power consumption. In this fo-
rum, we also investigate the challeng-
es designers and manufacturers face.
Electronic Products: Within the next
twelve months, what major develop-
ments do you see in consumer elec-
tronics?
ShreHarsha Rao (Product Line Manager
for Haptics or Tactile Feedback Technology
within Texas Instruments Analog): So the
question you
asked me is very
relevant for what
we are doing here
in TI. So for peo-
ple who dont
know what hap-
tics is, its basical-
ly a touchscreen
tactile feedback
technology that is actually gaining a
lot of momentum in the smartphone
and tablet market today. So in its very
basic form, when your cell phone vi-
brates, thats the basic form of haptics.
Its the tactile feedback that is getting
the users attention.
But where we expect and we are
seeing this technology take off is to
improve and enhance the user experi-
ence for gaming on mobile devices.
Today, people are using their iPhones
or their Androids or tablets for that
matter for gaming. And the touch-
screen technologies of today are great.
But one thing that it critically lacks is
the feedback. It never touches back or
it never talks back to you. And thats
the technology that we are develop-
ing, and thats the technology that
were going to see in smartphones that
are already shipping today and that
are in smartphones and tablets in the
next few months.
So for example lets say you are
playing Angry Birds, which is a very
popular game. Imagine if you can ac-
tually feel the vibration strength when
you pull the string, and when you hit
the bricks, you can feel the vibration
strength. And then lets say youre
playing a racing game. And then when
your car hits the bump, you can actu-
ally feel it on your handheld device
versus nothing.
So its the critical piece of user expe-
rience of tactile feedback that is miss-
ing in todays mobile devices. TIs
Haptics technology is bringing it back.
And, I can publicly state that weve
had a few mobile devices like HTC,
the Nokia cell phones and some of the
Android tablets like Toshiba which
already include TI Haptics technolo-
gies. But what I cannot state is obvi-
ously a lot of products that are in the
pipeline. But we expect a slew of these
tactile feedbacks/haptics-based mobile
phones and tablets to hit the market in
the next few months. And we are pret-
ty excited about that.
Electronic Products: I actually had
a chance to feel that by playing a gui-
tar app on a smartphone with the
chords. And it was really fantastic ex-
perience, just like I was really playing
guitar, you know, you feel all the
chords.
Mike Salas (General Manager of Micro-
controller Products at Silicon Labs): Being
an MCU supplier, we actually have a
large depth and breadth of customers
that we deal with especially in the con-
sumer electronics space. And whats
clear to us is that innovation really does
continue to occur at the individual
product level. Companies continue to
find ways to build more appealing solu-
tions for consumers in everything
from thermostats and washing ma-
chines to wireless headsets and watch-
es. Weve seen them all. But clearly,
the push is on to IP-enable the entire
consumer electronics industry in an
CONVENED AND MODERATED
BY CHRISTINA NICKOLAS
TECHNOLOGY
ROUNDTABLE
a e s t he t i c a l l y
pleasing way. Put
another way, com-
plexity is out, and
elegance and 24/7
convenience are
in.
So I think the
challenge for com-
panies today is to
find ways to successfully tie together
what I think are three independent dis-
ciplines in a completely synergistic way
these being software developers,
hardware designers, and mechanical
engineers. And whats fascinating to
me is that as a supplier in the micro-
controller business, we have technolo-
gies and tools to help bring these three
disciplines together in ways not possi-
ble in years past. As a result, many fas-
cinating things are occurring in the
consumer space right now.
Rory Pynenburg (Director of Technolo-
gy at Micro Power Electronics, manufac-
turer of mission-critical batteries, chargers,
and power supplies): I would echo Mikes
sentiments that this is going to require
more of a systems approach to prod-
ucts moving forward. One thing that I
see is the continuation of the trend of
portable products with integrated bat-
teries.
The classic ex-
amples of this are
the tablet and the
MP3 player. In
those cases, the
batteries need to
power the host
device for the du-
ration of its life.
From a power per-
spective, the main goals are improve-
ments in energy density, which relates
to the runtime, form factors, reliabili-
ty, better cycle life, recharge rate, and
obviously safety. The problem is
to get all of these elements to work to-
gether.
Upal Sengupta (Marketing Manager
for Portable Power at Texas Instruments):
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TECHNOLOGY
ROUNDTABLE
Consumer Electronics
So I could continue that thought say-
ing that basically theres just a much
wider proliferation of devices in every-
bodys household. You have a smart-
phone, a tablet, notebook, PC, and
connected TV that is Internet-enabled,
DVRs, and more. So theres just a much
broader proliferation of electronic de-
vices in everybodys household. And
theyre all going to be connected.
Theyre all going to somehow commu-
nicate with each other. You can share
files. And you use them all in multiple
modes. You have a smartphone that
you use both for business and for en-
tertainment and playing games,
watching movies, whatever.
Youll find that people are using
their equipment a lot. And so that
does speak to battery life that theyre
going to put more demands on the
battery life. The other side of that is
theyre going to be
recharging very
frequently, on a
daily basis or
sometimes even
more, right? And
so you want that
battery use and re-
charge profile to
be as seamless as
possible. So that gives us opportuni-
ties for things like wireless charging,
higher-rate chargers, so that you can
frequently top off your battery with a
minimum impact on downtime for
the user.
Vijendra Kuroodi (Principal Systems
Architect at ROHM Semiconductor): Yes, I
would like to echo on that. I interact
with systems architects in companies,
mostly in the consumer electronics
and the PC industries and we discuss
product requirements and specifica-
tions. I very often hear the need for
new approaches to lower power con-
sumption. Just as Upal was saying, tab-
lets and portable computing and com-
munications devices will continue to
be very important, and customers are
looking for new ways to reduce power
consumption.
So that brings us to this point; La-
pis Semiconductor, which is a member
of the ROHM group of companies, has
announced the ML610Q792 Sensor
Hub, which is targeted at the smart-
phone market. The Sensor Hub helps
reduce power consumption in certain
frequently used smartphone applica-
tions. What has happened in the tab-
let, ultrabook, or smartphone plat-
forms is that there
are so many sen-
sors, that they are
best managed lo-
cally by a dedi-
cated sensor hub.
The Lapis Sen-
sor Hub is based
on a low-power 8-
bit microcon-
troller core and includes a 16-bit co-
processor for additional on-demand
processing power. When the phone
runs a pedometer application, for ex-
ample, the low-power Sensor Hub
handles computation locally, which
reduces power consumption by avoid-
ing the need to frequently wake up a
powerful quad-core system processor
which may not be running optimal
software.
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TECHNOLOGY
ROUNDTABLE
Ted Worroll (Global Product Man-
ager, ITT): And obviously if youre fa-
miliar with ITT and ICS division, we
manufacture the interconnect systems
that go anywhere from military to
consumer electronics.
But getting back to that power
question and wireless charging, here
in the United States, we have a wireless
charging system that provides power
to 5-W handheld devices. It uses mag-
netic resonance to wirelessly charge
low-wattage-type systems for those
military handheld devices and/or
smartphones.
In our Shenzhen factory in China,
we have a 3.3-kW wireless charging
system. If youre thinking about 3.3
kW, its a lot of power. And why would
somebody need that? Well thats actu-
ally the charging number for wireless
charging of electric vehicles today. And
it separates two plates basically 18 inch-
es apart. And its close to 95% efficient
in terms of transferring energy.
We also manufacture interconnects
that are used in consumer devices, and
we talk about lithium-ion technology
and batteries. Were very familiar with
the capabilities of electric vehicles, as
well as what you would find in hand-
held portable devices, whether its
medical or just consumer needs. We
also manufacture interconnects for
microphone speakers, vibrators, an-
tenna pickup, so on and so forth.
And what we see in the industry is a
huge move away from beryllium cop-
per. We spend a lot of time with mate-
rial-science-type technologies in find-
ing that correct product, that correct
alloy that will replace beryllium. Many
people want to move away from beryl-
lium as its hazardous material.
But long story short, weve moved a
lot of our contacts, interconnect sys-
tems to titanium copper today. And
we have 4 billion of these intercon-
nects out in the field with no failures.
So we see small size, material size in
terms of alloys and low-contact resis-
tance and basically spring-loaded-type
features to do the interconnects as
well as components in antennas. And
that includes battery contacts and bat-
tery device as well.
Challenges designers face
Electronic Products: What are the is-
sues that designers face while consum-
er devices not only need to be con-
nected to the Internet, but also need
to be fully featured and connected to
one another?
Rory Pynenburg: If I can just jump
back in again with some of the battery
requirement issues here, as theyre be-
coming more fully functioned and
consumers are using these devices in
diverse environments and demanding
longer runtimes, theres a drive for cell
vendors and battery manufacturers to
improve the energy density of the stor-
age system.
One of the easiest ways that this
can be achieved and Ive seen it on
numerous cell vendor roadmaps is
to increase the voltage and use materi-
als that have higher-charge voltages.
This is a great way forward, however,
the problem with this approach is that
for products with well-established bas-
es in the market, there may be issues
with peripherals such as charges that
will need to be field upgraded. At Mi-
cro Power, were investing a lot of ef-
fort in developing system-level solu-
tions capable of supporting any
foreseeable changes in the battery
technology. In this approach, our cus-
tomers avoid having to bring products
back into a central location for up-
dates.
ShreHarsha Rao: So I can agree
with the comment that was made ear-
lier. All the gentlemen on the call clear-
ly expressed concerns about the power
rate. So what we are seeing obviously is
with every new generation of a mobile
phone and a tablet release, you can ex-
pect brighter displays, 4G LTE, mo-
dems, and all that kind of stuff.
The bottom line is still that con-
sumers expect better battery life. I
mean there was a big issue when the
iPhone 4S was released and its battery
life was slightly down compared to the
previous one and consumers com-
plained about it.
TI and several other companies are
working to reduce the power con-
sumption in a mobile device. If you
look at a power profile of a mobile
phone battery, its dominated by the
applications processors and the dis-
play. It is extremely important that the
apps processor needs to be turned on
only when absolutely needed in order
to save power. All the analog sensor
components around it need to reduce
the interaction with the apps proces-
sor in order to save power.
And I think one of the gentlemen
from ROHM mentioned about the
sensor hub, I think thats actually a
fantastic concept. And obviously its
something that TI is working on and
were taking it to the next level, which
is to actually have it integrated in
chipsets. But most importantly is how
are these various sensors on a mobile
phone, at a tablet, working in tandem,
in synchronization without bothering
the host. Because the less you bother
the host, the less you wake up the host,
the more power youre going to save.
So thats where we are dedicated to-
wards, coming up with this intelligent
analog companion chips around
these power-hungry chipsets that can
seamlessly work and it kind of gathers
data from the sensors on the phone
and make intelligent things happen.
You know, for example, when you
tilt your iPhone or an Android phone,
the gyro or the accelerometer sends a
signal to the chipset saying all right,
youre going to move your screen the
other way. What if you can do that
intelligently without the host interac-
tion? Youre going to save a lot of
power there.
So those are some of the things that
I think more and more people are go-
ing to start investing in and looking
into the next few months because bat-
tery power cannot go down even if
you start adding features to these
phones.
Mike Salas: Lets tie some of these
themes together. What we are all talk-
ing about is the ability to capture in-
formation, the ability to compute that
information, and then the ability to
communicate that information.
Fundamentally, the function of
capturing information is the process
of interacting with the real world. This
We all live in this
very technical world.
We design very
complex things.
The march toward
innovation is very
compelling.
But ultimately,
it does come down
to the consumer.
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includes technologies such as envi-
ronmental sensors, human interfaces,
and the ability to effectively move in-
formation from an analog world into a
digital one.
Computing clearly is the process of
then taking this captured information
and making decisions about what you
want to do with this information. And
this is clearly driven by the end prod-
uct or application itself. This is where
processing or microcontroller horse-
power comes to the table.
The last thing is this ability to com-
municate. If you capture information
and have computed it, you also need
to communicate it. Traditionally, this
has been primarily a wired function,
using things like UARTs, USB interfac-
es, or Ethernet interfaces to send the
processed information somewhere.
Of course, more recently, weve re-
ally seen the emergence of wireless
connectivity, which can be enabled by
devices like wireless MCUs. However,
in either the wired or wireless world,
the real emerging issue is how to en-
able these devices to operate in this
new IP-enabled, iPhone-driven world.
For the foreseeable future, what I
think youll see is a bifurcated model
where youll have proprietary point-
to-point or point-to-multipoint solu-
tions that will be used alongside more
standardized approaches, whether
they be ZigBee or Wi-Fi or 6LoWPAN.
Every wireless approach has its pros
and cons.
However, utilizing many of the
technologies from these companies
on the roundtable today can really
help make these disparate approaches
appear more seamless to the consum-
er. And I think, fundamentally, thats
going to be our job to determine
how we can address these challenges
and then develop a more seamless pre-
sentation to answer the end consum-
ers needs.
Vijendra Kuroodi: I just wanted to
mention that with all the innovations
we are seeing in the consumer elec-
tronics space, ROHM has invested a lot
in sensor technologies and human in-
terface processing. We have invested
in technologies that make it easier for
a human to interact with a device us-
ing various kinds of sensors.
For example, ROHM has acquired
Kionix, which is one of the top suppli-
ers of MEMS sensors for smartphones
and tablets. Another example is the
display or the touch interface. ROHM
has the expertise in multiple products
that go with the display and touch in-
terface touch sensors, timing con-
trollers, LCD drivers, optical sensors,
motion sensors, analog and mixed-
signal technology, the whole thing;
we have invested in the entire chain of
technologies that help a device inter-
act with a human. We also try to bring
those together and provide a solution.
Electronic Products: Are they new
markets? Any opportunities that could
be created? Anything going away?
Upal Sengupta: We hope not. I
think to that point of that weve all
been talking about, therere so many
more kinds of products. So in general,
yes, of course some things will become
less popular. You know, a case in point
is the netbook PC. That was kind of a
hot topic three years ago, but it was es-
sentially been completely overrun by
the tablet today, right?
But as things go away, there will be
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TECHNOLOGY
ROUNDTABLE
one or more things that probably re-
place them, right? And I think we see
there are all kinds of connected gad-
gets that weve all been talking about.
Therere just many more things that
people use now, many more products
with a battery, many more connected
devices in everybodys household, as
well as being built into peoples vehi-
cles, right?
So I think that youre just going to
see more and more different applica-
tions. As the basic technology has
been developed over the past few
years, thats now being fanned out
into so many more applications, right?
And obviously, I think one of the
things that you saw at the Consumer
Electronics Show a couple of months
ago, was a lot of emphasis on ultra-
books. And so you saw more ultrabook
PCs or lighter-weight, higher-perfor-
mance products coming out, that will
fill that gap between the tablet and
the higher computing needs that peo-
ple still have.
ShreHarsha Rao: What youre see-
ing is that gesture-based computing to
be a new market in the whole consum-
er electronic devices. I mean, Siri has
been super popular now. Its a way to
communicate with your handheld us-
ing voice. I think now, is there a touch-
less gesturing that you can do, very
Microsoft Kinect-like that you can in-
teract with your handheld devices or
even tablets for that matter.
So we think that is what
in TI we call as Natural
User Interface or NUI. It
kind of blends in very well
with our applications pro-
cessor strategy, which is OMAP, and also
our 3D imaging in a lot of sensors that
are required to make this work. So TI has
a breadth in both the processing world
from an applications processor and also
the sensors from analog world to make
this, what we believe is a natural exten-
sion of the way you interact with hand-
held devices.
You know, a lot of these gestures
are very intuitive for humans, just like
touch is so intuitive. As example my
2-year-old daughter now unlocks an
iPhone and plays YouTube videos. Its
so intuitive. And you can take it to the
next level by adding gestures. And I
think thats only going to grow. And I
think this is probably a new market
which brings in a lot of silicon content
from the embedded sensor side and
also a lot of processing on the applica-
tions processor side.
Vijendra Kuroodi: Yes, I cant agree
more with ShreHarsha. This is obvi-
ously true. We are seeing a lot of inter-
est in gesture recognition. And we
have a very interesting product based
on IR sensing that can recognize ges-
tures where you can swipe your arm,
left to right or up and down, and have
these gestures recognized.
I believe that we will see a lot of in-
novations in the TV market. Obvious-
ly, TVs are becoming smarter and more
connected. The display technologies
are improving and we will see new
uses for a TV. We will see improved
gesture recognition for games. So
Siri has quickly become one
of the most popular tools
on the iPhone 4S. (Via:
gizmodo.com)
TECHNOLOGY
ROUNDTABLE
whether it is added intelligence in a
remote control or new applications for
a connected TV, therell be a lot of in-
novation there.
Mike Salas: Im going to echo a lot
of the statements already made today.
But theres one thing I think is impor-
tant for all of us to keep in mind. This
is my litmus test. We all live in this
very technical world. We design very
complex things. The march towards
innovation is very compelling. But ul-
timately, it does come down to the
consumer.
And the litmus test for me is when
I call my wife, my kids or my friends, I
interact with them in a non-technical
way. What do they see and find ap-
pealing in consumer technology at
the end of the day? And what I found
and this is just my general observa-
tion is the need for simplicity. Its
taking a thermostat, for example, that
may have all these different buttons
and different screen options and is
very hard to program, and then re-en-
gineering it with a very simple intui-
tive human interface. Thats what is
very appealing to a consumer.
The IP enablement piece is very im-
portant. Clearly, as consumers have
become more and more familiar and
comfortable with iPhone technology
and IP-enabled technology, the ability
to now use smart phone applications
to drive other tasks is clearly becom-
ing important.
If you look under the hood, there
are a lot of things that we can do to try
to make the user experience simpler.
For example, when bridging technolo-
gies, if youre going to IP-enable some-
thing, there are a lot of technologies
that you have to worry about. You have
to figure out, is it going to be a ZigBee
or Wi-Fi solution, or are you going to
transmit over an Ethernet or USB con-
nection. Theres a way that we can
make that simpler. You can offer, for
example, a microcontroller solution
with the ability to bridge between a
proprietary solution into a more stan-
dardized solution, such as a bridge be-
tween the wired and wireless worlds.
My perspective is that this is the
way its going to be for the next 12 to
24 months at a minimum as we try to
find ways to bridge between the com-
plexities and to really hide these com-
plexities from the end consumer. At
the end of the day, we just need to
make technology very simple for
them. And I think thats really what
consumers are looking for.
Rory Pynenburg: I couldnt agree
more. Its our obligation as designers
to increase simplicity. But at the same
time, improve the ruggedness of de-
vices, and in doing so, the reliability.
One of the pieces that Micro Power
is working on to improve this rugged-
ness is contact-less charging. The main
challenge with it, though, as was men-
tioned previously, is its 95% efficiency.
That 5% loss of energy is going some-
where, usually as heat within the host
device. Many ultraportable devices
don't have provision for active cool-
ing, so the ability to remove heat from
the product will have to rely on smart,
holistic system-level design.
To continue with the complete
Consumer Electronics Forum, visit
www2.electronicproducts.com.
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MAY 2012
Lighting &
Optoelectronics
Special
When it comes
to binning LEDs,
some like it hot ... 41
Drivers enable
next-gen LED
street lighting ..... 44
Balancing power
parameters in
LED apps ........... 51

New approach
prevents thermal
runaway ............. 54
Increasing
viewability, not
backlighting, for
displays .............. 58
Elect ronic
PRODUCTS PRODUCTS
Elect ronic
SPECI AL
LIGHTING & OPTOELECTRONICS
T
he human eye is an extraordi-
narily sensitive optical instru-
ment, and our brains are physi-
ologically wired to detect exceptions
and inconsistencies in our environ-
ment and analyze them as possible
sources of food, physical threats, etc.
Most people can readily detect the
difference between the points
(0.4200, 0.4400) and (0.4203, 0.4403)
on the CIE 1931 chromaticity dia-
gram (Fig 1) four decimal places of
accuracy! Therefore, even tiny pro-
cess variations in manufacturing can
manifest themselves as a problem
when it comes to any product that
deals with light and color.
We see this phenomenon in lot-to-
lot variation in dyes, fabrics and
paints but also with traditional light
sources like fluorescent, compact flu-
orescent and metal halide lamps (Fig.
2). The LED industry has had to wres-
tle with this issue as it has rapidly
When it comes to binning
LEDs, some like it hot
The human eyes sensitivity demands that LEDs be sorted in
ways that will easily provide uniformity in real-world conditions
evolved over the past decade, and the
way we have chosen to deal with it is
called binning.
Binning
Just as the name implies, binning
is a physical sorting of LED lamps
of similar brightness and color.
The individual bins are then priced
and sold commercially based on
desirability and availability. Bright-
er lamps, closer to the black body
locus (BBL) are generally more de-
sirable and availability is synony-
mous with manufacturing yield.
The lighting industry has sold, or
binned, traditional lamps by
brightness (connoted for incandes-
cent lamp by wattage) and color
(the correlated color temperature,
or CCT, expressed in kelvins) for
decades, so the LED binning is re-
ally only an extension of an exist-
ing paradigm.
One of the most difficult con-
cepts for many LED luminaire de-
signers to master is the analog na-
ture of LEDs. LEDs are not one fixed
wattage/light output, and they are
also not one fixed color/CCT/chro-
maticity. These parameters vary as a
function of many criteria: drive cur-
rent, operating temperature, number
of operating hours, phosphor technol-
ogy, and the design of the LED lamp
itself. Over the years, LED companies
have more or less arbitrarily selected
standard currents and temperatures at
which to bin their products, and they
publish standard graphs to form a
mathematical framework from which
to calculate the performance
of the LED lamp under various
operating conditions (Fig 3).
The most common binning
current for lighting-class LEDs
is 350 mA, but this too varies
by model and manufacturer. LED
lamps designed for general, non-light-
ing applications (so-called high-
brightness LED lamps) are often
binned at 20 mA. Historically, nearly
all LED lamp types have been binned
at 25C, the nominal ambient temper-
ature in the factory at the time of
manufacture.
Turning up the heat
Cree was the first LED manufacturer
to depart from the 25C binning
convention with the release in Feb-
ruary, 2011, of the XLamp MT-G (Fig.
BY MARK McCLEAR
Director of Business Development, SSL
Cree
www.cree.com
Fig. 1: Superimposed on the CIE 1931
chromaticity diagrams black-body locus
(BBL) are typical lighting-class LED bins.
Fig. 2: This bank of 400-W metal-halide lamps
illuminating a building faade in Chicago, IL, shows stark
lamp-to-lamp color variations.
Fig. 3: On a typical LED datasheet, users can find
the mathematical framework in graphical form for
calculating luminous flux under real-world
conditions.(A): XLamp XP-G relative flux vs.
junction temperature (I
F
= 350 mA). (B): XLamp XP-
G relative flux vs.current (T
J
= 25C).
4), binned at 85C. Subsequently, five
additional XLamp platforms span-
ning thousands of lumens in flux
range, single- and multi-
chip arrays, stan-
dard and high-
voltage options,
and all ANSI
c hr omat i c i t y
ranges have
been binned at
85C. This has
resulted in the
considerable ex-
perience with
so-called hot binning, and a thor-
ough understanding of the strengths
and weakness of this approach, from
the standpoints of both LED manufac-
turing and LED applications.
As the name implies, hot binning is
binning the LED lamps at a higher
temperature than the conventional
25C. The LED manufacturers who
have decided to launch new products
binned at an elevated temperature have
converged on 85C as the new conven-
tional binning temperature. Though
85C, like 25C before it, is somewhat
arbitrary, it has one major advantage
it is a lot closer to the typical operat-
ing temperature of many solid-state
lighting luminaires than 25C.
Binning at 85C makes the initial
part of the design process slightly
easier and more intuitive. For exam-
ple, if a designer were working on an
LED system that needed 1,000 lu-
mens at an 85C temperature, then
he or she could simply select 10 LED
lamps with a luminous flux of 100
lumens per LED, binned at 85C.
Thus, hot binning makes it easy to
estimate the performance of these
LED lamps in this real-world situa-
tion. On the other hand, if the LEDs
were binned at 25C, the same 10
LED lamps would need to be binned
at 114 lumens each and de-rated per
the LEDs mathematical framework
(Fig. 3) to arrive at the same 1,000
lumen goal at the system level.
So, the good news is binning at
85C makes the first-pass math more
intuitive. The bad news is you still
have to do the same math if your sys-
tem runs or ever runs at any
temperature other than 85C. Exam-
ples of this would be outdoor lumi-
naires (60 to 65C is much more
common) or freezer cases (20 to
25C is typical) or downlights in in-
sulated ceilings or almost any retro-
fit bulb (often over 100C). In each
of these cases the value of binning at
85C is lost and the designer is back
to doing the same math from a new
mathematical framework where, ar-
bitrarily, 85C is now set to equal
100%.
Dont get burnt
As we pointed out earlier, LED lamp
performance can vary considerably as
a function of drive current and tem-
perature. Since an LED supplier can
never know exactly what application
an LED will be applied to in the field,
minimizing this variation across all
possible drive currents and operating
temperatures is very important. Mini-
mizing this variation also poses ex-
treme challenges to LED chip design,
phosphor technology, process control,
and package/lamp construction.
There are hundreds of ways to cut
corners on these LED lamp design pa-
rameters this is one of the main dif-
ferences between lighting-class and
high-brightness LEDs and the re-
sults are often not readily apparent
from a typical LED datasheet. Hot bin-
ning can mask some of these issues
even further, so hot binning can be
misused to mask enormous color vari-
ation of low-quality LED lamps over
the full range of operating tempera-
tures and drive currents.
For example, Fig. 5 shows LED
lamps binned at 85C from two differ-
ent manufacturers. In each case, the
LED lamps were driven starting at the
binning drive current (350 mA) and
then stepped up to the datasheet max-
imum (1,500 mA). The lamps were
mounted on a thermal chuck to con-
trol the temperature from 35C and
allowed to run up to 105C at each
current step, and the chromaticity
points (x, y in Fig. 1) were recorded.
In Fig. 5, LED A has a very large
color variation over 400K CCT
as a function of drive current and tem-
perature. We also note that this varia-
tion is more or less horizontal across
the CCT range. Over the allowable op-
erating range of the device, the LED
lamp actually changes color from the
starting point in the 2,700K ANSI
quadrangle and crosses over well into
the 3,000K ANSI quadrangle. This
would not be considered acceptable
color stability performance for most
lighting applications.
Binning this lamp hot is conve-
nient for the manufacturer of LED A,
who is betting that the lamp will be
used in or around 85C in the field, and
also near the nominal binning current
of 350 mA. If this is the case, the cus-
tomer will more or less get the flux and
chromaticity that was ordered. Prob-
lems arise when the actual application
(for example, outdoor, freezer, down-
lights, and bulbs, as noted previously)
calls for almost any temperature or
drive current other than the hot-bin-
ning parameters selected arbitrarily by
the LED manufacturer.
LED B, on the other hand, shows
only 31K variation across this same
range of drive currents and tempera-
tures, and remains in the ANSI 3,000K
quadrangle under all datasheet oper-
ating conditions. This lighting-class
LED lamp system was engineered to
manage the variation more in the ver-
tical direction along constant CCT
lines regardless of end
use application.
In summary, binning is
how LED manufacturers
reconcile manufacturing
process variations and the
exacting sensitivities of
the human vision system.
Binning at 85C is quickly
becoming the convention
in the Lighting-class LED
market segment because
binning at elevated temperatures can
make the initial design efforts a bit
more intuitive. There is no freedom
from LED binning at this point in
LED technology development, or
from the math that must be done in
designing with these analog compo-
nents in most real-world applications.
Hot LED binning is not always a mag-
ic fix-all designed to help LED system
designers it can also be a market-
ing fix-all designed to help mask an
underlying design weakness of an
LED component.
Fig. 4: The
XLamp MT-G shown
here was the first LED
to be binned hot, at
85C.
Fig. 5: This diagram, of LED color shift over maximum current
and temperature, shows how hot binning can be used to
mask massive color shift for some LEDs.
When it comes to binning LEDs, some like it hot SPECI AL
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SPECI AL
I
n Canada and the United States,
power is often distributed to out-
door lighting fixtures at 347 or
480 Vac, respectively. With the adop-
tion of LEDs, the light fixture must
then convert the power to much low-
er voltages on the output; in the U.S.
this voltage needs to be below 60 Vdc
if safety extra-low-voltage (SELV)
constraints are observed.
Until now, this conversion was ac-
complished using bulky and ineffi-
cient step-down transformers that
increased design complexity as well
as power losses in the conversion
stage. What is needed is a new type of
integrated power supply that can pro-
vide this conversion without the need
of the external step-down transform-
er thus simplifying the design, reduc-
ing the driver system weight and
eliminating the energy losses associ-
ated with the transformer.
According to industry analyst
firm Strategies Unlimited, the U.S.
market has taken the lead in proving
the viability of LED technology for
outdoor lighting applications. The
Department of Energy (DOE), the
Municipal Solid-State Street Lighting
Consortium, and the Design Lights
Consortium have all undertaken ef-
forts to increase the industry aware-
ness of the quality requirements nec-
essary to successfully progress the
LED adoption. Strategies Unlimited
says the CAGR for unit growth is
forecasted to grow 26% from 2010 to
2015, with the market reaching $544
billion in revenues in 2015.
The driver system is the key to en-
Drivers enable next-gen
LED street lighting
What designers must consider when selecting a driver, focusing
on why eliminating the step-down transformer is a good idea
abling the promise of the LEDs. LEDs
are complex, sophisticated semicon-
ductor devices whose tightly interde-
pendent photometric (luminous flux
and efficacy), electrical (current,
voltage, power) and thermal (junc-
tion temperature) characteristics of-
ten behave in a highly nonlinear
manner. LED drivers play a critical
role in ensuring the light fixtures ef-
ficiency, life expectancy and compli-
ance with current regulations. Be-
yond providing an efficient and
controlled power conversion opti-
mized to drive the LEDs, the system
can also integrate dimming capabili-
ties, protections, and other features
that decrease the operating costs
even further and enhance the value
to the end user.
A new class of integrated drivers is
now able to specifically address and
eliminate the challenge of using an
external step-down lighting trans-
former in many outdoor and high-
bay LED lighting fixtures. This arti-
cle will explore the choices a street
light fixture designer must consider
when selecting a driver and specifi-
cally focus on why eliminating the
external step-down transformer
might be a good idea.
Power conversion function
In the past, an accepted driver solu-
tion for a 480- or 357-Vac street light-
ing system was to use a step-down
lighting transformer to convert the
480- (or 347-) Vac) input voltage to
the lower voltage required by the
power supply driving the LED (often
277 or 120 Vac). One or more power
supplies can be used with one step-
down transformer to then drive the
LED output strings
often at voltages
below 60 Vdc.
Today, a valid al-
ternative is to choose
an integrated power
supply that can han-
dle the 480-Vac-to-
less-than-60-Vdc con-
version in one, single
product.
To understand the
choice, it is important
to comprehend the
key characteristics of
each component in-
volved in the driver
system. A typical 125-VA-rated light-
ing transformer can weigh 2.3
pounds and dissipate up to 7 W. A
reference 40-W power supply able to
handle input voltages of 120 or 277
Vac can weigh less than a half pound
and be 90% efficient. A new, inte-
grated 480 Vac input 40 W power
supply is still 90% efficient and
weighs only slightly more (0.80 lbs)
than the previous one.
When envisioning a modular de-
sign of the driver system, a designer
can choose to scale the driver system
BY IRENE SIGNORINO
Director of Business Development
Industrial and Automotive
Microsemi
www.microsemi.com
Fig. 1: The latest LED driver technology reduces weight while
delivering more power.
by using multiple power supplies.
Typically, no more than four power
supplies would be used as the com-
plexity added into the wiring system
would decrease the benefits of the
scalable design.
Figure 1 shows the difference in
weight between the driver system of
fixtures built using traditional solu-
tions and those built using next-gen-
eration integrated LED drivers that
eliminate bulky external step-down
transformers. As shown, a significant
(>50%) driver system weight reduc-
tion can be achieved, thus enabling
some transportation costs reductions
as well as more compact designs.
Because the external step-down
transformer is completely eliminated
and the power conversion is achieved
with a power supply at least as effi-
cient as the original power supply,
the new driver solution also provides
increased energy savings to the street
light operator (see Fig. 2). For exam-
ple, a typical installation of 10,000
40-W fixtures used by a municipality
that pays $0.1 kWh can achieve a
five-year period energy savings of
$400,000.
Finally, removing the external
component increases the reliability
of the LED driver by reducing the
points of potential failure.
Additional driver features
Todays LED drivers integrate many
features that are specifically opti-
mized for streetlights. These features
are as critical for a successful lighting
fixture design as the decision of us-
ing (or not using) an external step-
down transformer.
Dimming capabilities and inte-
grated protections (over current, over
voltage and/or thermal protections)
are fairly well understood and prop-
erly used.
Additional benefits can be real-
ized by leveraging the integrated
fault detection capabilities of the
next-generation LED drivers. Fault
detection and management capabili-
ties can be used to detect and com-
municate a faulty condition. The
managing entity is often required to
provide a certain amount of light in
places used by the public. If an acci-
dent happens due to lack of light, the
entity might be exposed to potential
liability claims. A system that pro-
vides a quick alert about a faulty
light is therefore
valuable.
Such a system
can be as simple as a
person noticing and
reporting the non
operating light or as
complex as a wired
or wireless data net-
work actively de-
tecting and report-
ing the faulty light
immediately and
around the clock. If
the light is part of a
network, a device
capable of detecting
and reporting the fault to the net-
work is necessary. The newer drivers
do in fact integrate such capability.
Figure 3 shows a wiring diagram for
incorporating fault management
functionality into an integrated LED
driver solution.
The same integrated capability
can also be used for basic trouble-
shooting, such as the light fixture
not turning on (if the fault alert is
on, but there is no light, then it is
likely the LED module is damaged
but not the driver).
One of the first examples of this
new generation of integrated LED
drivers is Microsemis LXMG221D-
0700040-D2F solution, which inte-
grates a high-voltage step-down
transformer into a single compact,
lightweight and high-performance
solution. The device operates on 347-
or 480-Vac systems for North Ameri-
can and Canadian installations, and
is designed for constant-current, sin-
gle 700-mA string applications using
approximately 12 to 17 LEDs (<57
Vac) without flickering.
The device features high active
power factor correction and low to-
tal harmonic distortion across the
entire input voltage range at full
load, and is dimmable to 10% by dif-
ferent dimming methods (0 to 10 V,
PWM or potentiometer) for addition-
al power savings. Multiple protection
features include overvoltage and
overcurrent protection and automat-
ic over-temperature shutdown. Built-
in fault management also enables
fixtures to sense and manage failed
(short and open) LED situations.
Municipalities face increasing
pressure to deliver improved street
lighting reliability while reducing
costs and simplifying fixture moni-
toring and maintenance. Achieving
these goals has been difficult with
traditional solutions that require
cumbersome transformers with
high power losses or with poorly
designed drivers.
Now, thanks to the availability
of integrated LED drivers that pro-
vide the power conversion without
needing a external bulky trans-
former, fixture designers can create
significantly smaller, lighter, and
more efficient solutions. These driv-
ers also deliver more benefits and
higher value to the end user via
highly reliable designs, dimming,
fault detection and management
capabilities, and built in robust
protections.
Fig. 2: Integrated LED driver solutions deliver increased energy
savings.
Fig. 3: Fault
management
circuitry for
integrated LED
driver solution.
SPECI AL
Drivers enable next-gen LED street lighting
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Whether you need the fastest real-time oscilloscope on earth with the highest measurement
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Whether you need the fastest real-time oscilloscope on earth with the highest measurement
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SPECI AL
L
ow-power LED solutions typically
consist of a single string of LEDs or
a single input and output control
point for the LED driver. These drivers
must perform the basic functions of
any LED power supply, such as power
conditioning and conversion and load
control. High-power solutions can of-
ten leverage specialist stages for these
functions. Low-power solutions of less
than 35 W, such as a light bulb, must
perform all three functions in as few
stages as possible, because cost and
space are at a premium.
The challenge for a low-power LED
design is to achieve a balance of power
conditioning set by regulatory stan-
dards. Power conversion, also guided
by regulatory standards, must be safe
and efficient. Superior load control
must be incorporated. This includes
constant current regulation and dim-
ming fidelity, which is generally set by
market acceptance. The FL7730 and
FL7732 PFC controllers strike this bal-
ance quite well and perform all three
functions in one stage. With these so-
lutions there is significant interplay
among all three functions. To under-
stand the solutions we will start with
the highest order and focus primarily
on power conditioning and power
conversion. The interplay of load con-
trol does take part in power condition-
ing, but in order to meet power condi-
tioning standards and market
requirements, understanding how to
achieve power condition, such as EMI
requirements and power factor, is vi-
tal. The next step is to understand load
control, such as fault protection, con-
stant current control and dimming.
Flybacks are used for most low-pow-
er isolated LED supplies, but not all fly-
Balancing power
parameters in LED apps
The challenge for a low-power LED design is to keep
power conditioning, conversion, and load control in balance
backs are alike.
The operation
and regulation of
a flyback will af-
fect system per-
formance and
cost. The typical
flyback used for
low-power sup-
plies is not power
factor corrected
and tends to have
a high-voltage
electrolytic ca-
pacitor after the
BY ALEXANDER CRAIG
Principal Engineer
Fairchild Semiconductor
www.fairchildsemi.com
Fig. 1: PWM controller schematic with primary side regulation, allowing
isolated LED drivers to be created with fewer components.
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MicroDSub_Ad512_SASP_1/3pgAd 4/3/12 4:15 PM Page 1
bridge rectifier.
These supplies are typically second-
ary side regulated (SSR), meaning they
have an optocoupler, a voltage refer-
ence and a fast loop band width of 1
kHz to react to load charges. This type
of flyback is not ideal for LED lighting
for two reasons: the flyback is not pow-
er factor corrected and is typically set
up as a constant voltage supply where
LEDs are better driven with content
current.
In single-stage flyback PFC, quality
power factor is achieved by using a
boundary, or critical, conduction mode
PFC control IC that uses a fixed on-
time variable switching frequency
scheme. This feature improves and
maintains the power factor but places
restrictions on the turns ratio n and
output voltage of the transformer where
n = V
RO
/V
O
+ V
F
. Equation 1 shows the
input current as a function on phase
angle. The denominator makes the cur-
rent shape non-sinusoidal, unless the
ratio V
IN
Peak
/V
R
is made very small
where V
R
is the reflected voltage.
Equation 1
With higher reflected voltages re-
quired to achieve an expectable power
factor, the stress on the MOSFET volt-
age can be increased where V
DS,max
=
V
IN,PK,max
+ V
R
+ V
spike
. These restrictions
tend to force the use of higher-voltage
MOSFETs: ~800 or 900 V.
This approach typically uses a SSR
constant current control scheme that
measures the load current and volt-
age directly. Power loss is incurred in
measuring the load current but good
constant-current control of a few
percent can be achieved but an opto-
coupler is also required. These sup-
plies operate with a slow feedback
loop of ~20 Hz, which works well for
LED loads because they are not dy-
namic. The energy storage performed
by the high-voltage electrolytic ca-
pacitor in the classic flyback is ac-
complished with lower-voltage (LED
string voltage) capacitors.
To work around cost limitations
with the single-stage flyback PFC,
some have tried a primary side regu-
lated (PSR) flyback with a passive
PFC. This approach reduces the pow-
er loss on the SSR and the voltage
stress on the MOSFET, however this
process uses HV capacitors and other
parts in the primary side which lim-
its power factor, lifetime, and size.
To achieve a cost effective balance
of power conditioning, power conver-
sion and load control for LED applica-
tions a new approach is employed
with the FL7730 and FL7732. These
PWM controllers uses a different type
of single-stage topology with primary
side regulation, allowing isolated LED
drivers to be created with
fewer components and
minimized cost without
requiring a high-voltage
input capacitor or SSR
feedback circuitry. Refer to
Fig. 1 for the simplified
overall schematic.
To achieve good power
factor and low THD, the
flyback is operated in
DCM at a fixed frequency
with constant on-time
over the half sine wave.
Therefore the input current is I
IN
=
I
P_avg
= T
ON
(V
IN
/L
m
)T
ON
/ 2T and is pro-
portional to V
IN
. With this approach
good power factor does not require a
high reflected voltage, thus allowing
the use of less expensive 600-V MOS-
FETs in place of costly 800- or 900-V
MOSFETs.
The center peace of the FL7730 and
FL7732 is the PSR Load control func-
tion block. This unique circuitry is
called the TRUE-
CURRENT control
and has been prov-
en in applications such as chargers.
By adding two key features to the
TRUECURRENT control the FL7732
and FL7730 can accurately regulate
output current versus changes in in-
put voltage, output voltage and mag-
netizing inductance variation. For
FL7730 designs, the device also al-
lows for a simple but effective dim-
ming.
The basic operation of the TRUE-
CURRENT control block is illustrated
in Fig. 2 and Eq 2.
Equation 2
Equation 2 describes how the out-
put current is determined by the diode
peak current and the discharge time
on the energy stored in the transform-
Fig. 2: The TRUECURRENT
PSR Load control function
block can regulate output
current versus changes in
input voltage, output
voltage, and magnetizing
inductance variation.
Fig. 3: Constant-current regulation showing measured results
from an evaluation board.
Table 1: Constant current regulation by line voltage change (11 ~ 28 V)
Input Voltage Min Current Max Current Tolerance
90 Vac /60 Hz 347 mA 357 mA 1.5%
110 Vac /60 Hz 345 mA 360 mA 2.1%
140 Vac /60 Hz 342 mA 352 mA 1.5%
180 Vac /50 Hz 342 mA 356 mA 2.0%
220 Vac /50 Hz 340 mA 351 mA 1.7%
265 Vac /50 Hz 336 mA 347 mA 1.7%
Table 2: Constant current regulation by output voltage change (90 ~ 265 Vac)
Output
Voltage
90 Vac 110 Vac 140 Vac 180Vac 220 Vac 265 Vac Tolerance
20 V 347 mA 357 mA 350 mA 353mA 346 mA 344 mA 1.9%
22 V 350 mA 355 mA 352 mA 350 mA 349mA 343 mA 1.7%
24 V 357 mA 354 mA 349 mA 347 mA 344mA 342 mA 2.1%
SPECI AL
er. The output current (I
OUT
), the aver-
age of the diode current in steady state,
is estimated using the peak inductor
current as measured by the current
sense resistor at the source of the MOS-
FET and inductor current discharge
time (T
dis
) as measured by the V
S
pin
shown in Fig. 1. Since the output cur-
rent (I
OUT
) is the average of the diode
current in steady state. Proper selec-
tion of the current sense resistor (R
CS
)
allows the measurement of the peak
drain current value with a peak detec-
tion circuit. The I
OUT
is calculated us-
ing the inductor discharge time and
can be measured in the V
S
pin. When
the diode current goes to zero, the
voltage on the V
S
pin starts to rapidly
decrease as can be seen in Fig. 1. These
measurements and the knowledge of
the switching period (T
S
) are the pri-
mary factors on the TRUECURRENT
control block.
This output information is com-
pared with a precise internal refer-
ence to generate an error voltage
(VCOMI), which determines the
duty cycle of the MOSFET (Q
1
) for
constant-current-mode operation.
This innovative technique is how
the FL7732 and FL7730 precisely
control a constant-current output.
This can be seen in Fig. 3 and Table
1, which show measured results
from an evaluation board showing
constant-current deviation in the
wide output voltage range from 11
to 28 V of less than 2.1% at each
line-input voltage.
The first key feature added for
lighting is the Line Compensator
that receives information about the
line voltage from the V
S
pin and
uses it to modify the peak current
circuit. This innovative solution al-
lows for extremely tight tolerances
and constant-current regulation
over a wide input voltage range.
This can be seen in Fig. 3 and Table
2, which show measured results
from an evaluation board showing
constant-current deviation in the
wide line regulation at the rated
output voltage (24 V) is <2.1%.
A more detailed explanation of
the operation of high power factor
PSR flyback can be found at www.
fairchildsemi.com/an/AN/AN-9750.pdf.
The second key feature for lighting
is the dimming control function,
which will be explained in more de-
tail in a future article.
New approach
prevents thermal
runaway
Preventing thermal runaway resulting
from failed power FETs improves a
lighting systems safety and performance
BY PHILIPPE DIFULVIO
Application Engineering Manager
and FARAZ HASAN, Sr.
Global Strategic Business Manager
for Industrial, Appliance, Lighting
TE Circuit Protection
www.circuitprotection.com
M
ost industrial and consumer
electronics incorporate ther-
mal protection devices to
prevent damage caused by overheat-
ing and improve reliability and safety.
The heat generated by resistive and in-
ductive loads, power capacitors, and
current drivers to MOSFETs, switches,
and relays presents significant chal-
lenges to engineers charged with de-
signing in reliable, safe thermal man-
agement.
In recent years, a variety of innova-
tive technologies have emerged to
help designers of electrical and elec-
tronic applications implement ther-
mal protection. The objective is to pro-
tect the application and the end user
from catastrophic thermal events by
interrupting electrical current flow
when a component or board area is
heated to a specific rated temperature.
Conventional solutions
Traditional thermal protection devices
are available in a variety of shapes,
sizes, and technologies to help protect
equipment from damage caused by
thermal events. Two notable devices
are the thermal fuse/thermal cutoff
(TCO) and the thermal switch. Both
provide wide-ranging and specific
temperature activation characteristics
in both AC and DC applications and
can be specified as bolt-in, clip-on,
pig-tail, or lead-type configurations.
However, these devices can complicate
design-in and manufacturing process-
es. Careful handling procedures must
be adhered to in order to guarantee
that they perform as expected.
Thermal fuses typically contain a
component that is temperature sensi-
tive, such as a low-temperature alloy
or a plastic/wax pellet, which holds a
spring contact mechanism. The device
is normally closed and opens when ac-
tivated at a given maximum, or trip,
temperature. These devices are also
non-resettable and must be replaced
after they trip.
Thermal fuses require special han-
dling in the manufacturing process. If
they are to be soldered, or require wire
extensions to be soldered or welded to
the leads, a heat-sink must be attached
to the lead to conduct heat away from
the temperature-sensitive alloy so as
to not activate it or limit the effective-
ness of the device before it is to be used
in its intended application.
Another common thermal protec-
tion device is the thermal switch.
These devices are designed for multi-
ple uses and can be configured to be
normally-open or normally-closed.
When a specific trip temperature is
reached the thermal switch activates
and opens like a thermal fuse to stop
the current flow. Likewise, when de-
signed to close during a thermal event,
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SPECI AL
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plication. Thermal cut-offs also
exhibit lower current ratings, lim-
ited dc rating (ac rated), vibration
sensitivity and installation sensi-
tivity. Due to repeated operations
at temperatures close to but below
their calibration temperatures, or
as a result of excessive thermal
waves across the case and the leads
of the TCO, nuisance trips may
occur because of pellet shrinkage.
Thermal fuses, unlike electrical
fuses, react only to excessive tempera-
ture, not excessive current unless
the excessive current is sufficient to
cause the thermal fuse itself to heat up
to the activating temperature due to
I
2
R effects. Thermal fuses are also in-
tended as a fail-safe or as an added
safety backup that will activate when
other electrical safety measures such
as circuit breakers or traditional fuses
fail. Thermal fuse operating character-
istics can also change over time from
self-heating effects or from operating
under high current loads.
With applications continually
moving towards more compact sur-
face-mount designs, the major limita-
tions of traditional thermal protection
devices are that they are not available
in surface-mount configurations, re-
quire costly manual application pro-
cesses, and, in the case of traditional
TCOs, they may fail short.
Reflowable thermal
protection device
TE Circuit Protection has introduced a
surface-mount, thermal protection de-
vice that is pick/place compatible and
can be designed-in and reflowed on a
PCB, utilizing standard surface-mount
lead (Pb)-free reflow manufacturing
processes over a broad range of device
activation temperatures.
The reflowable thermal protection
(RTP) device is set to withstand the de-
manding environmental, life, and reli-
ability requirements of automotive and
industrial applications, including
shock, vibration, temperature cycling,
and humidity exposure. Once the re-
flow process is complete an arming
procedure is all that is required in order
for the device to be ready to activate at
its predetermined trip temperature.
Another area where thermal protec-
tion may be desirable is the PCB trace
itself. When PCB traces are electrically
Fig. 1: The RTP device can be placed in series
to help protect the power FET.
the thermal switch can be used to ac-
tivate a secondary airflow device, such
as a fan, to cool the application. When
a predetermined temperature is
reached the device will revert to its
pretripped state, normally open or
normally closed.
One limitation of traditional TCOs
is that they are not surface mount or
reflowable like standard semiconduc-
tor products and require manual ap-
www.clare.com
78 Cherry Hill Drive
Beverly, MA 01915
978-524-6768
Industry Leading
High Brightness
LED Drivers
Up to 550V Operation for Off - Line Applications
Drives Series and Parallel LED Strings
Linear or PWM Brightness Control
Regulated LED Drive Current
Minimal Additional Component Count
Compact 8-Pin SOIC RoHS Compliant Package
For more information on Clare LED Drivers visit:
http://www.clare.com/Products/LEDDrivers.htm
SPECI AL
stressed, hot-lines begin forming on the trace causing delam-
ination. Leaving PCB traces unprotected can result in a cata-
strophic thermal event. When properly selected and thor-
oughly tested in the end-application, the RTP device protects
PCB board traces from damage caused by overheating.
Thermal runaway in dimmer apps
Universal dimmers, used with increasingly popular LED
lighting systems, are subject to power FET and MOV failure
which can lead to thermal runaway and potentially cata-
strophic events. Because most lighting dimmers are embed-
ded in the wall of a house or building, providing robust, reli-
able circuit protection is a primary design consideration.
Two power FETs are typically used to dim the lights and
set the speed of the motor in universal dimmers. Tradition-
ally, metal oxide varistors (MOVs) have been used to protect
the FETs from damage from overvoltage events such as light-
ning and other surges. Today, however, the need for safety is
driving designers to also employ thermal cutoff devices to
sense overtemperature events as a means for providing sec-
ondary thermal protection. If a power FET fails in resistive
mode or an MOV fails due to an increase of the leakage cur-
rent, either of which can lead to thermal runaway, the ther-
mal device activates to shut down power and prevent cata-
strophic events.
Seen in Fig. 1, the RTP device can be placed in series and
in intimate thermal contact with the power FET to help the
application against damage from elevated FET temperatures.
If the FET fails in resistive mode and overheats, the RTP will
activate to help prevent thermal runaway.
In this example the RTP device (model RTP-140) is rated
to activate at 140C. Once it has been reflowed onto the PCB
a simple arming procedure is all that is needed to ready the
device. Once installed, it will activate at 140C to interrupt
the current if FET failure results in overtemperature condi-
tions, opening before the solder melt point of 220C. This
device is useful for, but not limited to, LED lighting and ap-
pliance electronics and can be reliably used and reflowed
into areas of high-power components on the PCB wherever
thermal protection is needed to help protect against damage
caused by thermal runaway.
Figure 2 shows how proper thermal coupling with the RTP
device can help protect a specific component or application.
Intimate thermal contact with the potential heat source is
critical to achieve the desired
performance. The performance
of the RTP device is based on the
expectation that the PTH pin of
the RTP shares a copper mount-
ing pad with the primary ther-
mal pin or heat sink of the FET
or other components heat-sink-
ing pin(s)/tab(s).
The RTP device is a conve-
nient, cost-effective alternative
to traditional thermal protec-
tion devices. It allows use of
standard surface-mount production methods, obviating the
need for special assembly procedures and their associated
costs. These characteristics make it suitable for LED lighting
systems and appliance electronics. The device also helps
protect power components in IT servers, telecom power, and
automotive electronics.
Fig. 2: Proper thermal
coupling of an RTP device.
Introducing:
The tiny giant
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New approach prevents thermal runaway
A
s display sizes on mobile phones and other con-
sumer devices have grown, the importance of pow-
er consumption and display viewability has grown
accordingly. With increasing numbers of features and
functions crammed into smaller and smaller devices, bat-
teries are taxed to levels never before seen, or perhaps
even anticipated.
With displays often consuming as much as 50% of sys-
tem power, system designers and device OEMs are con-
stantly looking for ways to reduce the power consump-
tion of the display without any impact to the users
Increasing viewability, not
backlighting, for displays
Most consumer devices suffer from poor sunlight viewability,
but compensating with backlighting drains too much power
experience. Unfortunately, all previous accepted methods
for display power consumption reduction have negative
effects on the users viewing experience, especially when
viewing video and mixed-media content.
Sunlight and batteries
One common theme among all portable devices is prob-
lems with display viewability in certain ambient-lighting
environments, particularly bright sunlight. While simple
monochrome E-ink-type reflective displays do not have
this issue due to the high contrast ratio of black on white,
popular display technologies like LCDs suffer from sig-
nificant display viewability drop-off as reflected ambient-
light levels increase. In some cases, display content will
completely washout in bright sunlight, making viewing
impossible and forcing the user to either find a lower-
lighting environment, or wait until ambient lighting
changes enough to allow content viewing.
The common solution for addressing this is to simply in-
crease the display brightness, but this has a negative effect
on user experience; namely, battery life suffers greatly.
As a rule of thumb, as the size of the display increases,
so does power consumption. For example, a typical 4-in.
LCD mobile phone display may consume as much as 650
mW at 100% backlight. However, a 10.1-in. LCD display
like those used in tablet PCs can consume more than
2,000 mW at maximum backlight. While battery capacity
certainly will increase when changing form factors (mo-
bile phone to tablet), battery capacity will typically scale
linearly with device size, meaning that single-charge bat-
tery life generally does not change from a 4-in. mobile
phone to a 10-in. tablet.
Dynamic compensations role
All consumer devices employ dynamic range compensa-
tion (DRC) to render a source image or video stream suit-
able for display on an output device. Dynamic range is
broadly defined as the difference in intensity between the
darkest and brightest part of a scene. The human eye can
capture a very wide dynamic range five orders of mag-
nitude. However, typical displays can reproduce informa-
tion over a range of only a few hundred counts or less.
The dynamic range capability of a display is governed
by the display technology (LCD, PDP, or OLED), the pow-
er or brightness, the amount of screen reflection, and the
ambient lighting conditions. Therefore, to retain as much
information from a real-world scene after digital capture,
BY PAUL KARAZUBA
Senior Product Marketing Manager, QuickLogic
www.quicklogic.com
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Fig. 1: Most video content has
been created for displays with
high dynamic ranges, and so
must be altered dynamically to
suit displays with lower ranges
like those in a typical mobile
device display.
transmission, and display, dynamic
range must be compressed at each step
along the chain. In some applications,
dynamic range expansion may be re-
quired.
If the display is large enough that
the video fills the viewers visual field,
the eye can apply this processing itself.
However, the most common use case
in portable devices is that the display
fills only the central portion of the
field of view. The eye cannot perform
this processing optimally and there-
fore digital processing must be substi-
tuted.
So in the case of viewing video on a
mobile device, even if the display has
a dynamic range capability equal to or
exceeding that of the original video,
DRC is still required to produce natu-
ral-looking video. Because the human
eye can apply very strong DRC, a dis-
played video will only look natural
and realistic if the same kind of pro-
cessing is applied.
As both display power consump-
tion and viewability have been known
problems for many years, a number of
DRC technologies have been devel-
oped to address them, in particular:
Content adaptive backlight control
(CABC)
Ambient light compensation (ALC)
Histogram equalization (HE)
Visual Enhancement Engine (VEE)
and Display Power Optimizer
(DPO)
Adapting to content
CABC is a method of DRC whereby
the displays dynamic range capabili-
ties are mapped to the contents dy-
Increasing viewability, not backlighting, for displays

namic range. Most video and display
content is intended to be viewed on
displays with a dynamic range exceed-
ing 1,000:1. However, most handheld
consumer device displays have a dy-
namic range of ~600:1 (see Fig. 1). Note
that this dynamic range is stated while
in ideal viewing conditions, such as a
dark room similar to a movie theater.
Most video content will not actu-
ally have a dynamic range that exceeds
1,000:1. CABC will calculate the ratio
of the video contents dynamic range
to the intended displays dynamic
range, and then scale the video con-
tent using that ratio to the mobile dis-
play (see Fig. 2a). What results is video
content that is scaled to match the
original content versus display ratio.
CABC can then reduce the back-
light level of the display to eliminate
the upper end of the wasted range
(see Fig. 2b). However, the lower end
remains wasted. The net result is that
CABC has reduced display power con-
sumption. Evidence shows that CABC
can reduce system power consump-
tion by as much as 10% to 15%.
But while CABC can save system
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Fig. 2: CABC looks to scale content based on
the relative differences in range been display
types.
Increasing viewability, not backlighting, for displays
power, it has a number of drawbacks:
1. Actual power savings are content-
dependent and are thus hard to pre-
dict. While the displays dynamic
range does not change, the contents
dynamic range is always changing.
CABC is constantly sampling and scal-
ing, leading to actual power savings
that are difficult, if not impossible, to
predict. Content with a high dynamic
range, such as movies or television
shows, will lead to lesser power sav-
ings than low dynamic range content,
such as childrens cartoons.
2. CABC does not account for ambient
light. CABC looks at a displays dy-
namic range under ideal viewing con-
ditions, but the reality of mobile de-
vices is that content is almost never
viewed in ideal conditions. As ambi-
ent light increases, effective display
dynamic range worsens. So as ambi-
ent-light levels increase, the viewabili-
ty of the display worsens (see Fig. 2c).
3. Changes to backlight levels can
show up as flickering. CABC is con-
stantly adjusting display brightness to
display content. As the contents dy-
namic range increases and decreases,
the display will adjust brightness lev-
els. If content is constantly changing
dynamic range, display brightness will
change just as much, which can result
in a flickering effect to the viewer.
At minimum, this effect is annoying;
at maximum, it causes some viewers
to stop using a device.
ALC and HE
Ambient-light compensation (ALC)
is a very simple method of display
power savings where the display
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Table 1. Comparison of original and VEE-enabled efficiency
Display
size
Product Use case Ambient
light level
(lux)
Original
backlight
level
(%)
Original
system
power
(W)
DPO-en-
abled back-
light level
(%)
DPO-
enabled
system power
(W)
Total system
power
savings
(W)
Batery-life
improvement
(%)
10.1-in.
LCD
Tablet Dark room 10 60 3.93 20 2.7 1.230 31
Indoor 100 80 4.53 30 2.97 1.560 34
Cloudy
outdoor
5,000 100 5.02 40 3.36 1.660 33
5-in. LCD Smart-
phone
Airplane 10 66 1.48 13 1.26 0.220 15
Indoor 100 80 1.6 13 1.26 0.340 21
Outdoor 10,000 93 1.72 26 1.32 0.400 23
backlight intensity is changed ac-
cording to the ambient-light condi-
tions. As the ambient-light level in-
creases, display brightness increases,
and as ambient light decreases, dis-
play brightness decreases. ALC algo-
rithms are so simple that they tend
to be included in the mobile device
operating system programming
available to OEMs. ALC does not ad-
just display content at allonly the
display backlight is changed. As am-
bient light increases, details in the
dark are lost first, and then more and
more content is lost (see Fig. 3)
Histogram equalization (HE) is a
simple method of adjusting the sig-
nal based on the range of the con-
tent, not the original display (see Fig.
4). HE increases the global contrast
of the display content, espe-
cially where the display
content consists of close
contrast values. Through
this adjustment, the intensi-
ties can be better distributed
on the histogram (and thus
the display). This allows for
areas of lower local contrast
to gain a higher contrast.
Histogram equalization ac-
complishes this by effectively spread-
ing out the most frequent intensity
values.
While HE is a known method of
image enhancement, it is widely
considered to not be ideal for video
and photographs.
HE algorithms are indiscrimi-
nate. HE does not identify good
versus bad content. It may in-
crease the contrast of background
noise, while decreasing the us-
able signal.
HE can produce undesirable ef-
fects like visible image gradient
when applied to images with
low color depth.
VEE and DPO
Based on Apical Ltds iridix
algorithm, QuickLogics Vi-
sual Enhancement Engine
(VEE) and Display Power Op-
timizer (DPO) technologies
implement a DRC method
that applies different tonal
and color transformations to
every pixel in an image.
Based on a model of human percep-
tion, the DRC algorithms results in a
displayed image that retains detail,
color, and vitality even under diffi-
cult viewing conditions.
VEE and DPO technologies spe-
cifically address the problem of the
low contrast ratio of mobile displays
to bring a more TV-like viewing ex-
perience to mobile devices while
conserving power. In effect, VEE au-
Increasing viewability, not backlighting, for displays SPECI AL

Fig. 4: Histogram equalization brings content in line with
the dynamic range of a mobile display, but does not
discriminate between noise and signal.
tomatically generates and applies a
different iridix tone curve transform
to every pixel in the input video,
based on global user parameters that
control its general behavior.
The principal limitation to the
strength of VEE processing is the
source videos signal-to-noise ratio.
The basic algorithm does not distin-
guish between video detail and
noise; noise in very dark or bright ar-
eas may be rendered visible after pro-
cessing. Practical implementations
of iridix tone matching include a
gain control feature that limits the
strength of processing in different
intensity ranges, so that noise is al-
ways kept outside the visible range.
More recent additions to the core
VEE algorithms have been the incor-
poration of modules for nonlinear
space-variant color correction, noise
reduction, and preservation of fine de-
tail. To further improve display quali-
ty, VEE technology has been supple-
mented by extra image and video
enhancement blocks such as dither-
ing, hue rotation, color correction,
and nonlinear sharpness filtering.
VEE and DPO have been mea-
sured in real-world applications. Ta-
ble 1 shows the viewing experience
and power consumption of two con-
sumer devices using VEE and DPO.
VEE effectiveness can be seen when
the original backlight level is com-
pared to the VEE-enabled backlight
level. For the 5-in. display smart-
phone, in the outdoor use case, the
VEE-off backlight level was set at
93%. When VEE is enabled, the OEM
deemed that the display content
quality was equal at a backlight level
of 26%. The drop from 93% to 26%
in backlight intensity allows for a
DPO-based single-charge battery life
improvement of 23%.
Fig. 3: Ambient light compensation increases the backlight
intensity, but as the ambient-light level increases, more of
the detail disappears as contrast differences are lost
because the content is not adjusted to compensate.
The two standout features of the Samsung Galaxy Nexus (SCH-i515)
are the display size and the 4G/LTE support. The Nexus is a slate-format
Android 4.0 4G (LTE) smartphone with a 4.65-in.-diagonal Super AMO-
LED, a 5-Mpixel auto-focus primary camera module (with LED flash) and a 1-
Mpixel secondary camera module. Also, the Droid Charge comes with 32
Gbytes of internal iNAND NAND flash memory (from SanDisk), and fea-
tures a modest MCP (128-Mbit NOR flash + 64-Mbit pseudo SRAM) to
support the phone portion of the design. As a result of the inherent
costliness of LTE currently, the phone with contract is more expensive
than other smartphones currently offered (a $299 price point vs. $200 price
point).
Courtesy of Samsung
Product Teardown:
Samsung Galaxy Nexus
SCH-i515 Mobile Handset
The information in this feature represents a small sample of the data available from the IHS iSuppli Teardown Analysis Service. This service provides com-
plete, detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown
analyses on products including wireless handsets, digital still cameras, PDAs, and laptop computers. IHS delivers complete assessments of all elec-
tronic, electro-mechanical, and mechanical components in such products, from semiconductors to passives to displays. Component data includes
parts and estimated pricing and is broken down by assembly, function, component family, and type.
For more information on the IHS iSuppli Teardown Analysis Service, e-mail IHS at info@isuppli.com
To get the complete teardown analysis and parts list of the Samsung Galaxy Nexus SCH-i515 Mobile Handset including datasheets,
go to... www2.electronicproducts.com/whatsinside.aspx
% of Total Cost by Component Type
% of Total Cost by Function % of Total Cost by Assembly
Accessories 1.82%
Battery 1.90%
BT/FM/GPS/
WLAN 3.31%
Power
Management 4.40%
RF/PA 4.67%
Camera 5.19%
User Interface 5.32%
App
Processsing 6.04%
Mechanical/
Electro
Mechanical 8.13%
Baseband
8.57%
Display
25.71%
Memory
24.94%
Electro
Mechanical 5.03%
Passive 3.49%
Mechanical 3.04%
Box Contents 2.48%
Battery 1.89%
Discrete
Semiconductor 0.55%
Module 0.20%
Optical
Semiconductor 0.14%
Touchscreen 0.00%
Integrated Circuit
52.49%
Display
25.54%
Camera
5.15%
WHATS INSIDE?
Y
ou just cant have industrial
without motors and they need
controller chips. Lets look at
five recent additions to this impor-
tant area.
Infineons 120-MHz XMC4000
MCU family (www.infineon.com) tar-
gets energy-efficient real-time indus-
trial control with an ARM Cortex M4
core and flexible peripherals built
Industrial automation electronics
PRODUCT
APPLICATION
around a Connection Matrix. The
matrix uses multiplexers on the I/O
signals of each
peripheral to al-
low each mod-
ule or slice of a
module to trigger
events in other components inde-
pendently of the core CPU or bus
system.
After initialization, the chips pe-
ripherals operate with no interven-
tion by the core CPU. They are re-
petitive in two ways: with multiple
instances of a peripheral type and
subdivision into multiple identical
slices. Each chip has 1 Mbyte of
eFlash including hardware ECC, 160
Kbytes of RAM, 12-channel DMA,
and IEEE 1588 compliant Ethernet
MAC, three CAN nodes, 12-bit A/D
converter kernels with up to 26 chan-
nels, and USB 2.0 full-speed on-the-
go. Extended temperature range up
to 125C is available, and samples
can be ordered now.
Texas Instruments (www.ti.com) of-
fers the DK-LM3S-DRV8312 motor
control kit to showcase its three-phase
brushless dc motor driver and dem-
onstrate the operational advantages
of TIs InstaSPIN BLDC control solu-
tions simplified tuning, immediate
acceleration, and reliable low-speed
operation. The brains of the kit is a
low-cost Stellaris LM3S818 MCU on a
controlCARD module that is pre-pro-
grammed with all the necessary firm-
ware in flash memory. Also included
are the Crosshairs embedded kernel
and the PC application interface that
enables the control and monitoring
of the entire system.
The kit has a DRV8312 DMC base-
board with a slot for the control-
CARD, a 55-W NEMA17 brushless dc
motor, a 24-V 2.5-A dc power adapt-
er, cables/accessories, complete doc-
umentation, source-code and bina-
ries for the controlCARD, and Code
Composer Studio IDE.
For more information on Solid State Relays with TVS visit:
http://www.clare.com/Products/SSRFormA.htm
When it Absolutely, Positively
Has to Work in a High EMI/RFI
Environment...
Part Load Load On Input Control Speed Isolation
Number Voltage Current Resistance Current t
on
/ t
off
Voltage
(V) (mA) () (mA) (ms) (V
rms
)
CPC1317 70 150 16 1 2.5 / 2.5 3750
CPC1335 350 100 35 1 10 / 10 3750
TVS: Peak Pulse Power = 600W; Clamping Voltage = 66.5V (Max);
Working Voltage = 40.2V (Max)
Both devices meet Installation Class 3 Requirements of EN50130-4
Trust Clares Optically Isolated
Solid State Relays with Built-In
Transient Voltage Suppression
www.clare.com
78 Cherry Hill Drive
Beverly, MA 01915
978-524-6768
Features of the kits DRV8312 mo-
tor control board include a three-
phase inverter power stage capable of
PMSM or BLDC motor control, iso-
lated JTAG on the controlCARD, a
quadrature encoder interface, and a
Hall sensor input. The kit is just
$299. See www.ti.com/tool/dk-lm3s-
drv8312.
The International Rectifier (www.irf.
com) IRS2334SPbF and IRS2334MPbF
are three-phase 600-V gate driver ICs
for inverter motor drive applications.
They come in SOIC20WB or QFN5X5
packages and can use 3.3-V inputs.
The three-phase IC family pro-
vides protection for both negative-
voltage spikes and short-circuit
events. The ICs output drivers fea-
ture a high-pulse-current buffer
stage with minimum driver cross-
conduction. Propagation delays are
matched to simplify use at high fre-
quencies, and floating channel can
be used to drive n-channel power
MOSFET or IGBTs in the high-side
configuration. The ICs feature pro-
tection for undervoltage lockout,
dead-time, and shoot-through. They
cost $1.95 each in lots of 10,000 and
are available now.
The Renesas (http://am.renesas.
com) 32-bit RX62G microcontroller
is optimized for digital power con-
trol applications including motor
control with PFC for digital power
supply, UPS, and solar inverters. It
has 128 or 256 Kbytes of no-wait-
state flash, plus an additional 32
Kbytes of flash and 8 or 16 Kbytes of
fast SRAM.
The 100-MHz/165-DMIPS IC has
a single-precision 32-bit IEEE-754
floating-point accumulator, a multi-
ply/divide unit, fast interrupts, and a
five-stage pipeline. It has two 12-bit
and one 10-bit A/D converter, four
312.5-ps high-resolution timers, and
a 16-bit general-purpose PWM timer.
The MCU can control up to three
three-phase motors simultaneously
and CAN channels are optional. The
ICs cost $3.95 each in lots of 10,000,
and production will commence in
mid-2012.
The low-cost PIC16F1787 8-bit
microcontroller from Microchip
(www.microchip.com) can handle some
tough motor control apps with three
16-bit programmable switch-mode
controller modules that use digital
and/or analog feedback for frequen-
cy control and have 16-ns clock reso-
lution, advanced dead-band control,
and auto-shutdown and restart.
The MCU also has a 12-bit A/D
converter with seven differential or
fourteen single-ended inputs, four
fast comparators with selectable volt-
age references and 50-ns response
time, three operational amps, and an
8-bit D/A. It has 14 Kbytes of flash
program memory and 1 Kbyte of
SRAM, and features supply currents
as low as 150 A from a 1.8-V supply
at 1 MHz and 50 nA in standby
mode. The chip has a wide operating
voltage range of 2.3 to 5.5 V for the
F version and 1.8 to 3.6 V for the
low-power LF variant. Versions in
this MCU family come in packages
as small as 4 x 4 mm (UQFN) and
start at just $1.18 each per 10,000.
Jim Harrison
www.harwin.com/
shield-clips
P I C K & P L A C E R E A D Y B Y D E S I G N
SMT shield clips
simplify RFI shielding
Eliminates cost of hand
soldering fences or
cans to a PCB
Tape & reel packaging
for automatic placement
Three clips sizes for
cans with wall thickness
of .005-.040
O
r
d
e
r
F
r
e
e
S
a
m
p
le
s
N
O
W
Harwin shield clips third vertical EP April 12.qxd
F
or packaging semiconductor de-
vices, an important breakthrough
was recently announced by RED
Micro Wire (RMW), a subsidiary of
RED Equipment (www.redequipment.
com), in the area of semiconductor
bonding wire. The company intro-
duced a high-quality copper wire with
glass insulation for use as a highly reli-
able alternative to gold wire, which
has been known
the standard.
Created using
the newly pat-
ented Adar-Bolotinsky method for mi-
cro wire production, the wire can be
used like traditional copper bonding
wire but offers several advantages that
make it more cost effective. Unlike tra-
ditional wires, RMWs wires are cast,
not drawn, which permits production
of a soft metal core with a high-
strength, ultra-fine glass coating with
multiple advantages. The process is
able to scale down to 4 m, versus the
16 to 14 m minimum of other wire
solutions, enabling it to support high
scalability for future designs.
The new wire also eliminates anti-
oxidation issues, enabling a longer
shelf life, and it supports larger spools
to simplify materials management. In
terms of electrical design, the wire in-
herently protects against shorts
since it is coated and cannot accident-
ly make electrical contact. This allows
greater flexibility in design, with re-
laxed design rules.
Shimon Dahan, CEO, RED Micro
Wire, notes that, By providing cost-
effective, low-diameter, insulated mi-
cro wire that is as good as gold, we
can help our OEM customers keep up
with Moores Law, as they prepare
their own designs for the future.
RMW began sampling the technol-
ogy with OEM customers in March,
and intends to have full production
by the end of the year.
Bomar Interconnect Products
(www.bomarinterconnect.com) has un-
veiled RF-shielded coax connectors
that handle up to 18 GHz. An addition
to the companys V-Bite RF edgeboard
connector line, the 161VUs504EFT
threaded RF connector features a bot-
tom shield to help eliminate induc-
tance. The connector is soldered di-
rectly to the pc boards ground layer,
providing not only consistent perfor-
mance to 18 GHz but also higher man-
ufacturing tolerances. Offered with
50- impedance, the connector suits a
broad range of high-power RF applica-
tions, and is priced at less than $16
each in 1,000-piece quantities.
Tech-Etch (www.tech-etch.com), an
industry leader in etching, forming,
heat-treating, and finishing of berylli-
um copper, is making available engi-
neering services for the design of com-
ponents made of the alloy. The
mechanical and electrical properties
of beryllium copper make it the mate-
rial of choice for battery contacts,
RED Micro Wire glass-insulated
copper bonding wire
Bomar
Interconnect
Products 18-
GHz shielded
RF coax
connector
PRODUCT
ROUNDUP
Chomerics, a division of Parker Hannifn Corporation, is a global supplier of EMI Shielding, Thermal Management, Display Enhancement Filters and Engineered
Thermoplastic solutions. Our worldwide network of Applications Engineering support, manufacturing facilities, and sales offces insures Chomerics products are
available when and where you need them.
Contact Chomerics Applications Engineering at 781-935-4850 go to www.chomerics.com for more information.
SOFT-SHIELD
3700 soft silicone core technology

allows the use of low cost, low closure force,
fabric over foam, EMI gasketing technology in
elevated temperature applications up to 125 C.
With a UL 94-V0 fammability rating, and shielding
effectiveness performance over 100 dB up to 3
GHz, these gaskets provide EMI shielding solutions
for the automotive, life science, and information
technology markets previously not possible with
urethane foam based products. The very low force
requirements of 1 lb./inch, compression set of 7%,
and resistance to abrasion and shear, provides
more reliable long term shielding, especially in
applications where gasketed enclosure fanges are
frequently opened and closed
www.parker.com
www.chomerics.com
781-935 4850
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SOFT-SHIELD
3700
High Temperature, Conductive
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EP 3700.indd 1 4/5/2012 1:54:51 PM
Tech-Etch berylium-copper components
Heilind
Electronics
Autosplice RFI
shield clips
grounding clips, connector contacts,
ESD clips, and shielding gaskets.
Tech-Etchs in-house tool-and-die
department produces bending tools
capable of forming intricate sharp
bends in tempers from annealed to
full hard. Component parts are then
heat-treated in an inert atmosphere to
enhance spring properties. The treat-
ment results in greater deflection,
without compression set, while achiev-
ing close dimensional control. Finally,
parts can be finished in many ways,
with tin, silver, zinc, sulfamate nickel,
electroless nickel, palladium nickel,
and gold. Visit www.tech-etch.com/pho-
toetch for a Precision Engineered Parts
Capabilities Brochure and additional
information.
Heilind Electronics (www.heilind.
com) is now producing Autosplice RFI
shield clips to allow placement of EMI/
RFI shielding on pc boards without
hand soldering. The miniature sur-
face-mount clips are put on a board
using standard high-speed placement
equipment, eliminating extra holes
and preserving board space.
The clips have four independent
spring contacts that allow shield re-
moval and replacement for rework and
tuning. Originally designed for the
handheld device market, they can be
used in any application where space is
a premium.
To help engineers who are trouble
shooting diverse and many times
elusive EMI issues, Leader Tech has
published a free, six-page quick-refer-
ence guide that provides an overview
of company products and capabili-
ties. The company notes that it is ex-
tremely common today for products
to integrate specialized components
from several different manufacturers.
Unfortunately, this trend has also led
to many unanticipated radiated emis-
sions and compliance problems. In-
dependently these components per-
form as expected, but when they are
installed in close proximity on the
same circuit board, signal integrity
and interference problems become
apparent.
The new product reference guide
from Leader Tech features three one-
page sections that highlight shielding
solutions for virtually any board, en-
closure, or cable interference problem
so engineers can quickly find one or
more cost-effective solutions to their
problem, thus reducing time to mar-
ket, while lowering shielding expense
and dealing with a single source. The
Leader Techs Products and Capabili-
ties Overview brochure is available for
download from the companys Web
site, www.leadertechinc.com.
Richard Comerford
M a x i m u m
s e c u r i t y f o r
y o u r
e l e c t r o n i c s
New R6 enclosure
has highest
EMI/RFI
protection available
In the fields of intelligence and computer
security, TEMPEST requirement NSA 94-106
is among the most stringent. The new R6
electronics enclosure, developed by
Equipto Electronics engineers, far
exceeds this standard for EMI/RFI defense.
Tested by an independent laboratory, the
R6 included front and rear opening doors,
a fiber wave guide in the top and a
proprietary honeycomb filter in the
bottom, and more.
Because of the proprietary design of the
R6 enclosure, please contact Equipto
Electronics for more information.
800-204-7225 Ext. 9/ 630-859-7840
email: sales@equiptoelec.com
www.equiptoelec.com
ISO 9001:2008 RoHs Compliant
Made with pride in the USA
Aurora, IL
Independent laboratory test results available upon request.
Equipto ad EP 4.375X7.25:Layout 1 7/27/10 8:28 AM Page 1
Packaging & EMI/RFI Shielding
1/16th-brick converters suit
low-profile apps
The PKU-C series of isolated dc/dc power converters are provided in an indus-
try-standard sixteenth-brick form factor and deliver an output current up to
20 A with an output power equivalent to 100 W. The converters suit the need
for mid-range IT and communications power applications including decen-
tralized local data-storage equipment that requires
12- and 5-V to power disk drives.
The dc/dc converters operate from a 36 to 75-V
input range and suit applications powered by a cen-
tralized 48-V bus. The 12V PKU4104C and 5V
PKU4105C feature a floating output and can be
combined to power disk-drive-array application re-
quiring more than 100 W. They provide 92.7% efficiency at 50% load and
12-V output. The converters deliver full performance up to 80C with a 3.0-
m/s airflow, and full output power with natural convection up to 65C. ($24.50
ea/large qty available now.)
Ericsson Power Modules, Plano, TX
Keith Merrill 972-583-6910 pm.info@ericsson.com
www.ericsson.com/powermodules
Mini LED drivers offer
5 to 20-W output
The LDU series of PCB mount dc-input constant current
LED drivers feature four models with power outputs of 5,
7, 14 and 20 W. They have a typical efficiency of 93% for
the 5 to 14-W models and 95% for the 20-W devices. The
LDU20 series provides up to 700mA output current, and
the LDU05, 07 and 14 series have a maximum output of
1,000 mA. They suit indoor, outdoor, underwater, automotive LED lighting
application, and also for battery powered applications.
The LED drivers accommodate input voltages from 7 to 30 Vdc. Dimming
options include two analog methods (voltage or resistance) and a pulse width
modulation input signal. The PWM approach has a maximum operating fre-
quency of 1 kHz, with a minimum 200ns on/off time. The analog dimming
method can adjust the output current from 25% to 100% of nominal current.
(From $7.02 ea/500 available now.)
XP Power, Sunnyvale, CA
Duane Darrow 408-732-7777 ddarrow@xppower.com
www.xppower.com
C
M
Y
CM
MY
CY
CMY
K
EMCO_AD_March_EP_AD_PRINT.pdf 1 2/7/12 9:24 AM
Dc/dc converters suit railway apps
The CCR050 series dc/dc converter target railway ap-
plications and satisfy the majority of rolling-stock dc
power applications with a single unit. The converters
accept a very wide nominal input voltage range from
24 to 110 Vdc (16.8 to 137.5 Vdc full range) and pro-
vide up to 50W output. The nominal output voltage
is 24 Vdc with alternative output voltages available.
Efficiency levels are >85% at 72V input voltage.
The dc/dc converters comply with the EN50155
requirements for railway applications, including EN 50121-3-2, EN55011 and
EN 61373. The converters feature reverse input voltage protection, overvolt-
PRODUCT
UPDATE
Dc/dc converters
75W dc/dc converters
target avionics
The MGDS-75-S series of high-input-voltage dc/dc con-
verters targets avionics, aerospace, military, and missile
applications. The converters have an input voltage range
of 155 to 480 V, making them suitable for 270-V applica-
tions and meeting MIL-STD-704E/F requirements, or for
use with power-factor-corrected front-end converters.
The converter family consists of five single-output
models offering 3.3-, 5-, 12-, 15-, and 26-
V outputs, each capable of delivering up
to 75 W in the quarter-brick footprint of
57.9 x 36.8 x 12.7-mm. The units have
10% voltage trim capability. Efficiency
age protection, permanent short-circuit protection and
inrush current limitation. Operating temperature range
is 40 to 70C without derating. They are available in
open frame or housed in a metal enclosure. The open-
frame version measures 105 x 100 x 35.5 mm. (Contact
company for price and availability.)
Martek Power, Torrance, CA
Information 310-202-8820 sales.mpa@martekpower.com
www.martekpowerabbott.com
40-W 32nd brick targets
telecom
The CPZ 40-W 32nd brick series of
dc/dc converters is a pick-and-
place-capable surface-mount mod-
ule that uses solder ball pins which
allow it to conform to coplanarity
deviations. The converters target
space-constrained distributed power and intermediate
bus converter applications including networking and
telecommunications, data processing, railway, military,
medical, and aerospace equipment. The modules provide
40 W at 55C and 200-lfm airflow.
The converters are offered in three 2:1 input voltage
ranges of 9 to 18, 18 to 36 or 36 to 75 Vdc. Output volt-
levels are as high as 92%, and the standard operating tem-
perature range is 40 to 105C case temperature. Protec-
tion functions such as undervoltage lockout, overvoltage
protection, current limit, and overtemperature protec-
tion. (Contact company for price and availability.)
Gaia Converter, Saint Laurent Quebec, Canada
Francois Baudin 514-333-3169
www.gaia-converter.com
PRODUCT
UPDATE
www.micropowerdirect.com
MicroPower Direct
We Power Your Success - For Less!
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Call today for a surprisingly low
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VISO = 3,750V
30kV/S CMR
Internal OptoCoupler
Short Circuit Protected
Compact SIP Package
Compatible With M57962AL
IG100 Series
30kV/S CMR
VISO = 3,750V
Single Supply Drive
Built-In OptoCoupler
Compatible With EXB841
IGD841
3,000V Isolation
Operates With IGD962
Dual Outputs
-40C to +85C Operation
Small SIP Package
IGD962
High SPEED
Mi P Di i
GO DIRECT
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A Controller With A Built-In
DC/DC Will Be Released Shortly!
MPD EP1205.indd 1 4/5/2012 3:25:23 PM
First dc/dc converter 1/32 brick
offers 30 W
The ULT series of isolated 30W dc/dc converters are the industry first in a
1/32-brick Distributed-power Open Standards Alliance (DOSA)compatible
open-frame package. Measuring 19.1 x 23.4 x 8.89 mm, they are available
with either a throughhole or a surfacemount
option.
The dc/dc converters offer a 2:1-input volt-
age range from 36 to 75 Vdc to meet the re-
quirements of 48V and 60V battery backup
systems. The product includes 12, 5, and
3.3Vout models. The 12-Vout model provides
30 W max, the 5- and 3.3-V models produce
25 W. Line regulation is 0.1% of Vout across
all Vin conditions at full load. An external
trim function allows the output voltage to be trimmed by +10% to 20%.
Input to output isolation is certified to 1,500 V according to safety standard
EN/UL60950. They target industrial, telecommunications, routing, optical
networking, wireless equipment, and microwave radio point-to-point com-
munications. (Contact company for price and availability.)
Murata Power Solutions, Mansfield, MA
Information 508-339-3000 usmedia@murata-ps.com
www.murata-ps.com
Supply offers dc input for
co-location centers
The DS460SDC-3 is a compact 460W bulk front-end power supply that
achieve a conversion efficiency of 90% at 50% full load. It is a dc-input power
supply targeting co-location systems that use distributed power architectures,
especially in computing, storage, networking and data-
com applications.
The front-end supply is pin- compatible with
the ac-input DS460S-3 bulk power supply, en-
abling users to switch easily from an ac to a dc
supply infrastructure. Housed in a plug-in, rack-
mount module with a 1U x 2U form factor, the dc-
input is 7.75in. long. It features and input from 40 to
72-Vdc and accommodates all standard 48-V battery back-
up schemes, and has a maximum inrush current of 50 A. It generates a main
payload output of 12.3 Vdc, capable of delivering up to 36 A continuously, and
also produces an auxiliary always on 12Vdc output. The supply has a turn-on
delay of <2 s, and the main output rises monotonically in <50 ms. ($190 ea/
large qty available now.)
Emerson Network Power Embedded Power, Carlsbad, CA
Information 760-930-4600
www.PowerConversion.com
ages of 3.3, 5, and 12 Vdc are standard. The product is 0.92 x 0.90 x 0.374-in.,
using 30% less area than a 16th-brick converter. The typical efficiency exceeds
90% for 5- and 12-V models. The converters provide 2,250-Vdc input-to-out-
put isolation. (Call 888-438-3232 for price and availability.)
Semiconductor Circuits, Atkinson, NH
Sales 888-GET-DCDC FAX 603-893-6280
www.dcdc.com
Main Output
Voltage
Output Power
Input
Voltage
Typical
Ef ciency
Convection
Cooling
Forced Air
Cooling Model
MVAB120-12 12V
75W 120W
90-264Vac /
120-300Vdc
88%
MVAB120-24 24V 90%
MVAB120-48 48V 91%
Look Ma! No Fans!
Up to 75W without fans? Thats cool!
Our MVAB120 series of high ef ciency, open frame
single output, 120 Watt power supplies deliver
up to 75W using convection cooling only.
Just 250 LFM forced airfow required
Compact design: 2 x 4 x 1.35
Industry standard footprint / 1U height
Look Ma! No Fans!
Cool & Ef cient
Power
For specifcations on this cool, no fans solution,
please visit: murata-ps.com/mvab120
Dc/dc converters offer
84% efficiency
The R1S/E, RB/E, and RO/E dc/dc converters offer 1-W
output with 84% efficiency and up to 70% efficiency at
1/2-brick converters
deliver 75 W
The DCHBW75 series of 75-W dc/dc
power converters are provided in an
industry standard half-brick 2.40 x
2.28 x 0.50-in. footprint. The series consists of 3.3-, 5-, 12-,
15-, 24-, 28-, and 48-Vdc single-output models that operate
over 4:1 input voltage ranges of 9 to 36 and 18 to 75 Vdc.
Standard features of the dc/dc converters include 90%,
efficiency soft start, adjustable output voltage, remote
sense, six-sided shielding, and positive remote on/off con-
trol. All models are RoHS compliant and have UL60950-1,
EN60950-1, and IEC60950-1 safety approvals. They have
no minimum load requirements and operate over an am-
bient temperature range from 40 to 76C (with derat-
ing). ($57.30 ea/large qty available now.)
Wall Industries, Exeter, NH
Russ Berube 603-778-2300 rberube@wallindustries.com
www.wallindustries.com
Step up LED drivers offer
4:1 input
Available in 2 x 1-in. packages, the AMLB-Z step up
dc/dc LED drivers offer a 4:1 input range from 9 to 36 Vdc
that steps down to an output voltage range from 14 to 48
Vdc. They produce constant output currents from 150 to
20% load. The converters operate from 40 to 100C
without derating.
The R1S/E series dc/dc converters feature an unpotted
SMD-design, the RO/E-series is of-
fered in an SIP4 package, and RB/
E-series in an SIP7 package. Appli-
cations include vapor phase sol-
dering processes. The unregulated
converters have 5V/200mA out-
put and input voltages of 3.3, 5, 12
or 24 Vdc. They feature a standard
isolation of 1 kVdc/1s and option-
ally 2 kVdc/1s. They comply with EN60950-1 and
UL60950-1. (Ea/small qty: R1S/E, $6; RB/E, $5; RO/E, $5
available now.)
Recom Power, Brooklyn, NY
information 718-855-9710
www.recom-power.com
Dc/dc converters
700 mA and have ripple and noise as low 350 mVp-p.
The modular drivers feature remote on/off function,
continuous short-circuit protection,
and adjustable PWM. They offer
analog dimming functions to en-
sure the consistent and constant
brightness of the LEDs they drive.
(From $13.73 each available
now.)
Aimtec, Montreal, Quebec, Canada
Information 888-9AIMTEC (924-6832)
www.aimtec.com
800-542-3355
www.calex.com
Designed, Made and Supported in the USA
5 Year Warranty
Reasonable NRE for Custom Designs
4 - 6 Week Production Lead Time
From Standard
to Custom
DC Converters
e-mail: sales @ calex.com
15-W dc/dc converter
suits military avionics
The 15-W DVAB dc/dc converter series delivers a dual out-
put converter with zero-cross
regulation due to two inde-
pendent control loops. It is
designed for use in rugged
commercial avionics, mili-
tary avionics, and other criti-
cal reliability power systems.
The input range extends
from 15 to 50 V with 80V transient for 1-s per MIL-STD-
Dc/dc converters are
DOSA compliant
The DOSA-2 product line is a family of non-isolated SMT
dc/dc converters that comply with the latest 2nd Genera-
tion DOSA standards for PoL converters. They are com-
prised of the iCF 3-A/16.5-
W, the iCG 6-A/33-W, the
iBF 12-A/66-W, and the iAF
20-A/110-W converters.
The converters suit harsh
telecom, broadcast mast-
mounted applications, in-
dustrial, test and measurement, and medical equipment.
The converters use an input voltage range of 4.5 to 14 V
and feature adjustable output voltages from 0.7 to 5.5 V
with conversion efficiencies up to 97%. Units can operate
704. The converter series offers 5, 12, or 15V output.
It has a nominal fixed-frequency of 325 kHz and uses a
fault-tolerant magnetic feedback design. The operating
temperature extends from 55 to 125C with no power
derating. (Contact company for price and availability.)
VPT, Blacksburg, VA
www.vpt-inc.com
PRODUCT
UPDATE
in ambient temperatures from 40C
up to 115C. The modules range in
size from 12.2 x 12.2 x 4.45 mm to
33 x 13.46 x 7.75 mm. (From $6.17
ea/reel qty available now.)
TDK-Lambda Americas
San Diego, CA
Sales 619-575-4400
www.us.tdk-lambda.com
UNIPOWER JUST GOT MORE POWERFUL
Solutions from 40W to over 300kW and 1.8V to 500kV
Broad range of Custom and Standard products
Contact us for design and application support 954-905-1071 or sales@unipowerco.com
unipowerco.com/power Powering Technology
High Voltage Military / C.O.T.S.
Medical
Datacom
Commercial / Industrial
Telecom / Network
Converter
modules feature
4:1 input voltage
The Traco Power TEP 150WI series
dc/dc converters feature a 4:1 input
voltage. They meet EMC demands
including conducted noise in accor-
dance to EN55022 class B, and burst
and surge immunity without exter-
nal components.
The dc/dc converter modules of-
fer 87% efficiency, with constant
current output charac-
teristics for battery
load applica-
tions. The 98
x 52 x 34-
mm metal
case features over temperature pro-
tection and an operating range from
40 to 75C. They provide reverse
input protection, undervoltage lock-
out, and 2,250-Vdc I/O isolation.
($215 ea/large qty available now.)
Power Sources Unlimited
Wrentham, MA
Sales 800-966-7784
sales@psui.com
www.psui.com
Dc/dc converters
suit IP65
applications
The PCMDS150WK-IP65 primary
switched dc/dc converters suit in-ve-
hicle, rail technology, industrial, and
telecommunication applications.
The 150-W converters provide an in-
put range for battery voltages of 24-,
36-, 48-, 60-, 72-, 80-, 96- and 110-V
according to EN 50 155. With the
help of a transformer and a second-
ary linear
choke, a gal-
v a n i c a l l y
isolated out-
put voltage
of 24 V is
p r o d u c e d
that is ad-
justed by pulse-width modulation.
The dc/dc converters measure 192
x 115 x 68 mm, have a thermo-selec-
tive vacuum encapsulation for uni-
form heat dissipation and resistance
to shock, vibration and moisture.
They suit applications requiring
protection per IP65. The converters
need no ground load and are short-
circuit protected by primary and
Dc/dc converters
Our Newest
Chassis Mount
AC/DC Power Supplies
www.ConTech-us.com
sales@ConTech-us.com
Toll Free 877-302-4411
Avai l abl e from
25- 150 Watts
secondary power limiting. (Contact company for price
and availability.)
MTM Power, Canton, MA
Sales 774-565-3800 info-inc@mtm-power.com
www.mtm-power.com
1-kW, dc/dc converter
uses convection cooling
The BAP 1K-U7712 series of dc/dc converters that gener-
ate up to 1kW output power with convection cooling.
Housed in a 7 x 7 x 12-in. chassis-mount enclosure,
these converters suit industrial applications including
factory automation systems, industrial control equip-
ment, production machinery
and mining equipment. They
comply with EN/UL 60950 and
equivalent industrial safety
standards. A railway grade ver-
sion that meets EN 50155 is also
available.
The 1kW dc/dc converters
contain two internal modules, each capable of generating
500 W (minimum). A dual-output version with two inde-
pendent, fully regulated outputs of 500-W each is also
possible. The units operate from inputs of 48, 72, 110, 125
Quarter brick IBC module
supplies 850 W
The IB050Q096T80N1-00 quarter-brick intermediate bus
converters (IBCs) modules provide up to 850 W of output
power. They suit demanding applications spanning en-
terprise, optical access, and storage networks.
The quarter-brick modules are available as a drop-in
upgrade for the industry stan-
dard 5:1 fixed ratio convert-
ers. They operate from a 36 to
60V input with 2,250Vdc
isolation from input to output, and
achieve 98% peak efficiency. The supplies are rated at up
to 80 A, 850 W from 55 to 60Vin and 550W from 36
or 250 Vdc (15%) and provide regulated outputs of 24,
48, 110, or 125 Vdc. Efficiency is 85% (minimum), protec-
tion features include 2,250Vdc input/output isolation,
overload, overvoltage, and short-circuit protection with
thermal shutdown and self-resetting. ($720 ea/100
available now.)
Absopulse Electronics, Carp, Ontario, Canada
Carole Lombard 613-836-3511
absopulse@absopulse.com
www.absopulse.com
PRODUCT
UPDATE
20-W dc/dc converters
feature wide input
The B2000RU series of wide-input 20-W dc/dc converters
are offered in 1 x 2-in. cases. The 14 standard models op-
erate from 4:1 inputs of 9 to 36 or 18 to 75 Vdc, providing
regulated single outputs of 3.3, 5, 12, 15, 5, 12, or 15
Vdc. Standard features include 1,600-
Vdc input/output isolation and short-
circuit protection. All models meet
EN 55022 and EN 61000-4. The MTBF
(per MIL HDBK 217F) is >560 khours.
The dc/dc converters are packaged
in 1.0 x 2.0-in. cases and specified for
operation from 40 to 66C (ambient). They suit process
control systems, telecommunications equipment, robotic
Vin. The 2.30 x 1.45 x 0.42in. quarter-brick modules
allow designers to conserve board space and achieve full-
load operation at 50C with 400-lfm airflow. The mod-
ules are pin-compatible with industry standard square
wave bus converters, and operate at 1 MHz. ($0.09/W in
OEM qty available now.)
Vicor, Andover, MA
Sales 800-735-6200 custserv@vicr.com
www.vicorpower.com
systems, and board-level power distribution subsystems.
(From $34.80 ea/100 available now.)
MicroPower Direct, Stoughton, MA
Sales 781-344-8226 sales@micropowerdirect.com
www.micropowerdirect.com
10 to 20-W dc/dc
converters offer 4:1 inputs
The VYB series of dc/dc converters feature a 4:1 input that
provide outputs ranging from 10 to 20 W. They are pack-
aged in an industry standard 2 x 1in. footprint. The con-
verters target battery-driven applications where charging
and discharging conditions require an ultra-wide input
range. The temperature range extends from 40 to +85C
The dc/dc converters are available in +3.3, +5, +12, or
+15 Vdc single output models and 5, 12, or 15 Vdc
dual output models. They accept input voltages from 9
to 36 Vdc or 18 to 75 Vdc. Outputs are fully regulated to
within 0.5% over all line input conditions and 1.0%
for all load conditions. The converters have an input to
output isolation of 1,500 Vdc across the range. ($19.74
ea/100 available now.)
CUI Inc, Tulatin, OR
Maggie Lefor 503-612-2391
mlefor@cui.com
Dc/dc converters
(718) 956-8900 (800) 221-5510
e-mail: kec@keyelco.com Website: keyelco.com
E L E C T R O N I C S C O R P.
SOLAR MIDGET FUSE HOLDERS
THiNK Keystone Solar Midget Fuse Holders

Available in Surface Mount and Thru-Hole Mount Specically Designed
for Photovoltaic (PV) Systems Accommodates Midget (SPF) Fuse Series
(10 38mm) Rated for up to 20 Amps Fully Insulated Low Prole
Cost effective solution Optional Cover available Request Catalog M60
Its whats on the inside that counts.
NEW
PRODUCTS
Need Custom
Power?
Think GlobTek!
The engineers at GlobTeks New Jersey
Design Center can rapidly create a cost-
effective tailored power system for your
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not only deliver the solution you need,
we guarantee that your product is com-
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and regulations, and will be created and
delivered in a timely fashion.
GlobTek will build your custompower
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Call 201.784.1000 to speak to an
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www.globtek.com
GlobTek EP 1_3rd vert 3.6.12_Layout 1 3/7/2012 7:20 AM Page 1
Dc/dc converters suit
IP65 applications
The PCMDS150WK-IP65 primary
switched dc/dc converters suit in-ve-
hicle, rail technology, industrial, and
telecommunica-
tion applications.
The 150-W con-
verters provide an
input range for
battery voltages of
24-, 36-, 48-, 60-, 72-, 80-, 96- and
110-V according to EN 50 155. With
the help of a transformer and a sec-
ondary linear choke, a galvanically
isolated output voltage of 24 V is pro-
duced that is adjusted by pulse-width
modulation.
The dc/dc converters measure 192
x 115 x 68 mm, have a thermo-selec-
tive vacuum encapsulation for uni-
form heat dissipation and resistance
to shock, vibration and moisture.
They suit applications requiring pro-
tection per IP65. The converters need
no ground load and are short-circuit
protected by primary and secondary
power limiting. (Contact company
for price and availability.)
MTM Power , Canton , MA
Sales 774-565-3800
info-inc@mtm-power.com
www.mtm-power.com
Toll Free: 1-866-997-3853
Email: sale-usa@pduke.com
WWW.PDUKE.COM
PDUKE TECHNOLOGY, INC
A Ulvl3l0N 0l P0wLR MA1L 1LCN0L00 C0., L1U
High efciency standard, modifed
standard and custom build
Up to 200 watt single, double & triple
output
2:1 or 4:1 ultra-wide range input
Cost efective small possible sizes for
board mount
Extensive technical support
DC to DC Converters
Hot-swap inverters offer
10.5-W/in.
3
density
The SABRE LITE series of sine-wave,
hot-swap inverter modules come in
a variety of
different, but
c ompa t i bl e
two-unit 19-
in. shelves.
They incorpo-
rate a DSP-controlled architecture to
produce a low-distortion 50- or 60-Hz
Power
Sources
edited by pauloshea
See more online at electronicproducts.com/ps
NEW
PRODUCTS
sine wave, efficiency levels >89%
and a power density of 10.5 W/in.
3
The sine-wave inverters feature ei-
ther 1 kVA/800W or 1.5 kVA/1,200
W output power in a 1U high unit.
They produce either 120 or 230-Vac
nominal voltage outputs from an in-
put voltage range of 40.5 to 58 Vdc.
Two units in a shelf can provide ei-
ther twice the capacity of a single
unit, or operate automatically in an
n + 1 redundant mode. Operating
temperature range without derating
is 5 to + 50C. (Contact company
Unipower, Coral Springs, FL
Joe Merino 954-346-2442
www.unipower-corp.com
YOUR TRUSTED POWER PARTNER
As the global
leader in precision,
programmable
power supplies,
AMETEK
Programmable
Power offers the
product breadth
and expertise test
engineers rely upon.
The industrys broadest selection
of AC and DC programmable
power supplies and loads
Deep application expertise
for industries ranging from
HBLEDs and electric vehicles to
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Able to deliver clean, low-noise
power even at high densities
The test engineers most reliable
and trusted power brands:
California Instruments, Elgar
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800-733-5427 (U.S. only) 858-458-0223
Dual-output PoE
midspan suits outdoors
The POE33U-560DO passive dual-
output midspan targets remote out-
door locations in harsh environ-
ments. The power injector has an
output of 56-Vdc/port with a total
power output of 33.6 W, suitable for
two outdo or IEEE802.3af-compliant
uses. Applications include utility
poles for IP camer-
as the device relays
data between ports
allowing for a wire-
less access point to
be deployed for
wireless transfer of data.
Standard features of the midspan
include short circuit protection and
compatibility for gigabit Base-T data
rates. The isolated unit has a mini-
mum output efficiency of 70% and
operates from 40 to 65C. It has a
waterproof housing with an ingress
protection rating of 67 suitable for
inclement weather and high humid-
ity conditions for commercial, resi-
dential and industrial applications.
($253.83 ea available now.)
Phihong USA, Fremont, CA
Keith Hopwood 510-445-0100
poe@phihongusa.com
www.phihong.com
300 W medical supply
fits in 5 x 3 x 1.5-in. pkg
The APS303Mx series of 300-W U-
frame switchers is safety approved to
the 3rd Edition of UL60601 and fea-
tures single outputs ranging from 5
to 54 V. The supply is offered in a 5 x
3 x 1.5-in. package.
The medical power supply series
consists of 10 standard output mod-
els and provides a risk analysis report
to comply with the military mission
oriented protective posture (MOPP)
applications. Standard features in-
clude 600W
peak-load opera-
tion for up to 5 s,
universal ac-input
with active power
factor correction,
dual-fused input
protection, leakage of 120 A at 264
Vac, power-good, fan fail, inhibit
and 12V fan control. ($85 ea/100
available now.
Advanced Power Solutions
Pleasanton, CA
sales@advpower.com
www.advpower.com
Power system serves
smart washroom apps
The GT-41076-0609-2.5-IS-P2 family
of inline encapsulated power sup-
plies address automated washroom
functionality that are driven by sen-
sor-based convenience systems. It
has IP64 ingress protection and a wa-
terproof connector. They are potted
in a 75 x 35 x 24.6-mm impact-resis-
tant polycarbonate case with ther-
mal conduction cooling and double/
reinforced insulation.
The encapsulated supplies deliver
regulated output voltages from 3.3 to
55.0 V (in 0.1V increments) at up to
6W continuous output power with
built-in overcurrent, short-circuit, and
overvoltage pro-
tection. They
feature include
a wall mount
with field-con-
figurable tabs,
90 to 264Vac
input, and pending safety agency re-
quirements for UL /cUL 60950/60601.1,
TUV IEC/EN60950/ 60601.1 and IEC/
EN 60335-1. (Contact company for
price and availability.)
GlobTek, Northvale, NJ
Sales 201-784-1000
sales@globtek.com
www.globtek.com
DIN-rail supplies suit
process control apps
The TSP series DIN rail power sup-
plies feature an output power from
90 to 600 W, is ATEX and IECEx cer-
tified, and meets UL508, NEC Class
2, SEMI F47, Class 1, Zone 2 Control
Power Sources
TEN- 8WI Series
8W in DIP 24 metal package
TEN- 20WIR Series
20W in 2 x 1 metal package
TEN- 40WIR Series
40W in 2 x 1 metal package
Single and dual output models
Excellent line load regulation
No minimum load required
Remote On/Off control
UL60950-1 approval
TEP-160WIR Series
160W, half brick package
TEP- 200WIR Series
200W, chassis mount package
with screw terminal blocks
Very high efficiency up to 91%
No minimum load required
Adjustable output voltage +10/-20%
Sense line
Remote On/Off control
Reverse input voltage protection
Over-temperature protection
UL60950-1 approval
TRACOPOWER launches new DC/DC converters that meet the stringent requirements
for mobile and stationary railway applications in accordance to EN50155 standard.
Main upgrades for railway capability:
Increased EMC immunity against surge, burst, radiated and conducted disturbances
Input voltage ranges cover the nominal 24, 36, 72 and 110 VDC with 40 % tolerance
Shock and vibration / thermal shock in accordance to EN61373 and MIL-STD-810F
New DC/DC-Converters
for Railway Applications
www.tracopower.com
POWERGATE LLC 866-588-1750 www.powergatellc.com
Power Sources Unlimited 800-966-7784 www.psui.com/traco
TRACO DC-DC-Conv.3.2012 1S. EP Bleed:Layout 1 29.03.12 16:35 Seite 1
NEW
PRODUCTS
equipment requirements for hazard-
ous locations. They suit industrial
and process control applications.
The DIN-rail supplies operate from
85 to 264Vac input. provide indus-
trial operating temperature range
from 25 to +70C, and have output
voltages of 12, 24, 36, or 48-Vdc with
output currents from 2 to 25 A. The
supplies have a typical efficiency of
87% with 0.5%
input and load
variation, 100
mVpea k- pea k
ripple and noise,
and have electronic
shortcircuit protection. ($65.00 ea/
large qty available now.)
Power Sources Unlimited
Wrentham, MA
Sales 800-966-7784
sales@psui.com
www.psui.com
LED drivers feature 75-,
150-, 300-W outputs
A series of 277 to 480Vac input LED
drivers are available in 75-, 150-, and
300-W outputs. The TSC-75W and
TSC-150W series are constant cur-
rent LED drivers with fixed and dim-
mable outputs. The TSV-300W is a
constant voltage driver.
Some models of the LED driver
models are Class-2 rated. All models
feature aluminum housings and are
IP67 rated. They offer over-voltage,
over-current and short circuit protec-
tion with automatic recovery. The driv-
ers are UL Recognized for both US and
Canada, and are CE certified. (From
each: TSC-75W, $86; TSC-150, $128;
TSC-300, $161 available now.)
Thomas Research Products
Huntley, IL
info@trpssl.com
www.trpssl.com
Laser system supplies
feature 300, 700-W
The LRC series high-voltage power
supplies suit mid-power CO2 and
similar medical and industrial laser
systems. The supplies are available in
open frame or enclosed configura-
tion and provide 300 and 700-W
output power. Strike voltages are 30
and 50-kV, respectively. Input volt-
age are 115 or 230 Vac at 50/60Hz.
The laser system power supply
features a superpulsing capability,
which provides maximum pulse cur-
rents of up to 60 mA and repetition
rates to 2
kHz at 100%
duty cycle.
Full power
is available
at 75% of maximum voltage. The
supply is switched at 42 kHz and the
current mode operation eliminates
the need for a discharge ballast ele-
ment. (Contact company for price
and availability.)
Unipower, Coral Springs, FL
Joe Merino 954-346-2442
www.unipower-corp.com
Open-frame supplies
provide 91% efficiency
The ABC200 and ABC400 open
frame power supplies provide 200-
and 400-W respectively, output pow-
er, and maintain 91% efficiency at
230-Vac input. The supplies target
datacom/telecom and industrial ap-
Power Sources
Board Mounted Power
1 to 3 Watts
SIP & DIP packages
Regulated & unregulated versions
10%, 2:1 & 4:1 inputs
500 V to 6 kV isolation
2 to 60 Watts
1 x 1, 1 x 2, 2 x 2 & DIP-24 footprints
Regulated single, dual & triple outputs
Wide 2:1 & 4:1 inputs
Up to 3.5 kV isolation
Medical safety approvals
3 to 10 Watts
Meets IEC60601-1 3rd edition
4000 VAC reinforced insulation
2A patient leakage current
LED drivers
5 to 48 Watts
Up to 1000 mA output
Constant current output
95% efficiency
Surface mount power
1 & 2 Watts
Regulated & unregulated versions
10, 2:1 & 4:1 inputs
Single & dual outputs
ECE series
5 to 40 Watts
Ultra compact from 1 x 1
Encapsulated
Single and dual outputs
<0.3 Watts no load input power
ECL series
5 to 30 Watts
Ultra compact size
Single & multi outputs
Open-frame & encapsulated
<0.3 Watts no load input power
AC-DClow power board mounted ranges
Visit our website to request a
copy of our latest Power Supply
Guide and see our complete line
of power products.
Industry standard DC-DCranges
Low cost
High reliability
Short lead times
Industry standard footprints
Highest power density
Download FREE
interactive guides to help select your
AC-DC & DC-DC products at:
www.xppower.com/literature_downloads
GREENPOWER Selector App
Available
AC-DClow power board mounted ranges
Industry standard DC-DCranges
5W
ACDC
in 1x1
20W
DCDC
in 1x1
Also available from www.newark.com
XP_BMP_ad_Elec_Prod_0412.qxp:Layout 1 12/4/12 10:17 Page 1
NEW
PRODUCTS
LED supplies feature
industrys lowest profile
The LDB75 constant-current LED
power supply series delivers up to 75-
W output power with the lowest pro-
file in the mar-
ket of 1.10-in.
The supplies
deliver con-
stant current
over a 5 to 100% range of single 24-,
36- or 48-V outputs.
The LED driver power supplies
measure 8.07 x 1.57 x 1.10in. and
provide protection to over-current,
over-voltage, short-circuit and over
temperature operation. They feature
universal input voltage 90 to 305
Vac, constantvoltage and current
mode operation, efficiency up to
91%, 0.95 power factor, IP67 protec-
tion from dust and immersion up to
1m of water, and an operating tem-
perature range from -30 to 50C.
(From $45 ea/100 available now.)
Excelsys Technologies, Rockwal, TX
Sales 972 771 4544
salesusa@excelsys.com
www.excelsys.com
plications. They have a power densi-
ty of 16W/in.
3
and incorporates an
interleaved transi-
tion mode PFC
converter and two-
FET forward con-
verters.
The power supplies fea-
ture a 90 to 264-Vac input range and
single outputs of 12, 24, or 48 Vdc. The
200W version is available in a 2 x 4
in. package and the 400W model is
provided in a 3 x 5in. package. The
supplies have protection for over-tem-
perature, output over-voltage, over-
current, and short-circuit. (Contact
Power-One, Camarillo, CA
Technical Support 800-678-9445
sales@power-one.com
www.power-one.com
Open-frame dc/dc
converter offers 4:1 input
The UWQ series of isolated open-
frame 204-W dc/dc converters are
packaged in a through-hole mount
industry standard quarter-brick for-
mat. The open-frame converter fea-
tures a 4:1 input voltage range from
18 to 75 Vdc around a nominal 48
Vdc input. The converters suit appli-
cations that require a regulated bus
converter with typical applications
including optical networking appli-
cations, wireless base stations and
microwave radio communications
equipment.
The dc/dc converters measure
58.4 x 36.8 x 11.7-mm, offers 92% ef-
ficiency, provide a single output volt-
age of 12 Vdc, up to 17 A of current,
and have a line regulation of 1%
and load regulation of 1.5%. The
input to output isolation is certified
to 2,250 Vdc. Controls include re-
mote on/off control of either nega-
tive or positive polarity. In addition
the converter has a number of pro-
tection features including over cur-
rent, over temperature, input under
voltage and output short circuit.
(Contact company for price and
availability.)
Murata Power Solutions
Mansfield, MA
usmedia@murata-ps.com
www.murata-ps.com
Power Sources
HIGHLIGHTS
Enclosures inform user interaction,
reshape product possibilities
Breaking away from the world of standard, boring geo-
metric shapes, the Blob series of enclosures introduces a
set of designs unlike any off-the-shelf packaging offered
before. These enclosures, whose design seems to owe as
much to the organic esthetics of 19th-century Art Nou-
veau as to 21st-century High-Tech sensibilities, have a
sound reason for their departure from the ordinary.
The enclosures designers set out to create a new style
of user-friendly housing that would give ergonomic clues
on how to interact with the electronic devices they en-
close, while suiting a wide range of users with different
hand sizes and grasping abilities. The resultant contoured
enclosures, when grasped, cause a users fingers to natu-
rally rest in the control area, where keypads and displays
can be easily located. As a result, tests have shown that
users instinctively understand how to interact with the electronics, without
instruction.
Initially, the series consists of three models: the Unit, the Control, and
the Panel. The Unit is the smallest, having external dimensions of 5.11 x
2.36 x 1.18 in., and has a lower grasp area and a recessed keypad/control
section suitable for left or right handed operation. The 4.48 x 2.99 x 1.22-in.
Control version can be held with one hand and operated with the other: the
way end user grips and orients this unit depends on how a designer defines
and lays out the display and operating area. The Panel model is the largest
(7.87 x 6.49 x 1.41 in.) and is intended for either handheld or desktop de-
vices; it can be held and operated with both hands or operated on a tabletop
its two symmetrically positioned gripping areas clearly indicate the right
orientation for use.
All the enclosures have a two-part design with a molded top and bottom
made of high quality ABS (UL 94 HB) that can be sealed to IP 54 using gas-
ket kits available as accessories. The enclosures come standard in two colors
off-white or lava gray and other colors are optionally available. All
models can be battery operated with AA, AAA, or button cells and special
cable glands can be positioned at any point on the split line between the
two parts. (From $16 available now.)
OKW Enclosures , Bridgeville , PA
Sean Bailey 412-220-9244 sales@okwenclosures.com
www.okwenclosures.com
NEW
PRODUCTS
Polyacrylamide resin
gains UL rating
Ixef 1524 polyacrylamide (PARA)
resin received a UL 94V-0 rating for
electrical/electronics applications at
0.4-mm-and-above thicknesses for
all colors. The 50% glass-filled PARA
targets injection-molded covers, in-
ternal frames, and other structural
components of mobile devices, in-
cluding tablets, notebooks, and ul-
trabooks, meeting demand for halo-
gen-free flame retardant (HFFR)
material.
The high-flow resin also permits
the molding of highly complex and
detailed thin-wall parts that can be
painted and are very thin, extremely
rigid, strong, and dimensionally sta-
ble. Ixef 1524 has a tensile modulus
up to 20 GPa (2900 kpsi) at 23C
(73F) and a Comparative Tracking
Index (CTI) of 600 volts and a Glow
Wire Flammability Index (GWFI) of
960C (1760F). (Contact company
Solvay Plastics , Alpharetta , GA
Information
www.solvayplastics.com
Packaging &
Interconnections
edited by richardcomerford and carolynmathas
See more online at electronicproducts.com/in
Epoxy resin
equalizes tension
DELO-DUOPOX AD840 tension-
equalizing adhesive cures at room
temperature and features excellent
adhesion to metal, plastic, and smooth
surfaces. Eliminating the necessity of
pretreatment translates removing
sand blasting costs and time.
The adhesive features a temperature
range of 40 to 284F and achieves
bond strength at temperatures above
176F with high peel and impact resis-
tance. Dispensed from a double car-
tridge with a static mixing tube, the
adhesive has a processing time that is
long and very
user friendly (up
to 90 min in a
preparation of
100 g), suitable
for the produc-
tion of large
components. (Contact company for
pricing available now.)
DELO Industrial Adhesives
Sudbury, MA
info@delo.us
www.delo.us
Vertical receptacle
suits right angles
The MINIPAK HDL power board-to-
board connector family includes a
new vertical receptacle for right-an-
gle configurations that provides 25%
more current density than competi-
tive products. The connector consists
of a right-angle plug and a right an-
gle or vertical receptacle with an eye-
of-the-needle tail for both solder and
pr e s s - f i t
a p pl i c a -
tions. Ful-
ly qualified to end-of-life conditions,
the connector features a current rat-
ing of up to 40 A per contact, with
nine adjacent contacts in a 1-in. PCB
space, all carrying 17.5 A while re-
maining within the 30 temperature
rise requirement. Its height is also
approximately 35% less than the pre-
vious de facto standard Multi-Beam
XL product, enabling improved cool-
ing efficiencies for compact 1U pow-
er supply designs.
Configurations are available with
up to 24 power contacts and 40 sig-
nal contacts without up-front tool-
ing charges. Three levels of mating
sequences suit hot-swap applications.
Applications include 1U servers,
high-end servers and telecommuni-
cations switches. (Contact company
for pricing and availability.)
TE Connectivity, Harrisburg, PA
Customer Support 800-522-6752
www.tycoelectronics.com/customer
support/support.asp
Mini SMT test point
has symmetrical design
A miniature SMT test point, Catalog
No. 5029, features a symmetrical flat-
wire design that enables high-strength
test point-to-PCB bonding with a
minimal footprint. The low-profile
ISO-9001-certified and RoHS-compli-
ant device accepts a variety of grip-
ping probes to replace wire-wrap posts
and turret terminals to test the cir-
cuitry of high-density PCB packages.
Phosphor bronze and silver plate
construction accommodate the use of
both lead-free solder and traditional
reflow processing.
Packaging is on tape
and reel, compatible
with most vacuum
and mechanical
pick-and-place as-
sembly systems. (Contact company
for pricing available now.)
Keystone, Astoria, NY
Sales 800-221-5510
kec@keyelco.com
www.keyelco.com
Rugged modular cases
have aesthetic design
Premier Series instrument cases are
said to combine the features of a
proven base platform with extru-
sion-based modular rugged construc-
tion and aesthetic design. The cases
are offered in 19 and 9.5-in wide
rackmount or desktop versions, 1U
to 8U heights, and standard depths
of 300, 420, and 540 mm.
The aluminum cases feature styl-
ized corners and trim bezels in a vari-
ety of colors (green, blue, and grey are
standard), as well as specially de-
signed protective elements to hide
screw fastenings. The desktop version
is supplied par-
tially assembled
with ready-made
side panels, cover,
and base trays; an
ergonomically de-
signed handle, a support stand/carry-
ing handle, various styles of flip-up
feet, folding keyboard lid, or glazed
door can be added as options. Custom
NEW
PRODUCTS
colors and configurations are also op-
tionally available. (From under $150
ea / lg qty available now.)
Pixus Technologies
Sacramento, CA
Justin Moll 916-524-8242
justin.moll@pixustechnologies.com
www.pixustechnologies.com
ph 877.670.7118
fax 541.323.4202
em info@tensility.com
web tensility.com
Untitled-10 1 4/9/12 2:49 PM
Multicavity shield
reduces RFI/EMI
The multicavity Slot-Lok Pro shield
uses standardized manufacturing
methods to create near custom mul-
ticavity solutions that reduce un-
wanted RFI/EMI emissions and ele-
vate crosstalk between components.
The shielding is constructed from
a solid RoHS-compliant frame and
removable high-retention cover so
that multiple
shields can be
combined under
the same foot-
print, saving
space, weight, assembly cost and
time to market while facilitating easy
rework and inspection processes.
The shields are quickly installed us-
ing through-hole or surface-mount
soldering. (Contact company for
Leader Tech, Tampa, FL
Tim Black 813-855-6921
tblack@leadertechinc.com
www.leadertechinc.com
LCD coatings
are antireflective
VISARC-coated antireflective sam-
ples are available for licensing by
OEMs and end customers. Based on
nanoparticle development, the high-
performance coatings are for use on
LCD/LED display screens and other
high-volume applications.
The coatings measured reflec-
tance of 0.3% exceeds the current
industry target of 0.5% as well as the
1.0% reflectance seen on current
commercial coatings applied on a
triacetyl cellulose (TAC) surface.
(Contact company for pricing
available now.)
Oxford Advanced Surfaces Group
Yarnton, U.K.
Mike Edwards +44 (0) 1865 854 807
www.oxfordsurfaces.com
Connector provides
high current density
The PwrBlade+T ac/dc power distri-
bution connector system addresses
demanding power applications re-
quiring higher linear current density
and low pow-
er loss. Capa-
ble of 192 A/
linear inch
with eight ad-
jacent high
power contacts energized simultane-
ously and equal 0.7 m power con-
tact resistance after environmental
exposure, it is rated up to 75 A per
power contact without exceeding a
30C temperature rise in still air. The
connector features a high-power
contact design and housing that al-
lows higher current-carrying capa-
bility in a more compact package.
It also features a highly vented,
halogen-free housing design, a low-
power contact option for applica-
tions with multiple voltages and
lower power requirements and half-
bullet guides for a reduced connector
footprint. (Contact company for
pricing and availability.)
FCI Electronics, Etters, PA
electronics.us@fciconnect.com
www.fciconnect.com
Wiring hubs reduce
cost in hazardous apps
The F300 Megablock wiring hubs
are designed for general-purpose,
Zone 2, and Di-
vision 2 hazard-
ous area applica-
tions where the
h i g h - e n e r g y
trunk can be
powered by a
wide range of
fieldbus power supplies. Theypro-
vide the ability to conduct live
maintenance in hazardous areas
and live connection and disconnec-
tion of fieldbus spurs without a gas
clearance certificate with Ex ic and
non-incendive field devices.
A pluggable Trunk In/Out con-
nector allows replacement of a Mega-
block without breaking the connec-
tion to other devices on the fieldbus
SMT pin suits
low-profile connections
The 1508 SMT pin is designed for use
as a test point or for low-profile
board-to-board connections. Avail-
able packaged for tape-and-reel (per
EIA-481) or in bulk for low-volume
requirements and prototyping, the
pin has a tail/pin diameter of 0.018
in. and features a
large base for sta-
bility and for a
secure solder
connection to
the PCB.
The pins come 1,600 parts per 13-
in. reel with a pitch of 8 mm and a
tape width of 16 mm. The tape
pocket has an opening of 0.110 in.
Gold plating is standard for high-in-
Tiny connectors
improve contact
Compact SlimStack B8 connectors
feature a CleanPoint contact to re-
move flux and contaminants for im-
proved signal continuity and electri-
cal reliability. The 0.40-mm-pitch
SMT board-to-board connectors, with
a 0.80-mm height and ultranarrow
2.50 mm width, provide maximum
space savings for high-end medical,
consumer electronics, and data/tele-
com mobile device applications.
CleanPoint contact design features
a beveled shape for a wider, more uni-
form cleaning path and a more stable
signal than other connectors for mo-
bile applications. The feature helps to
segment. The compact F97 termina-
tor, mounted in the Trunk Out con-
nection, provides termination when
the Megablock is at the end of the
fieldbus segment. (Contact compa-
ny for price and availability.)
MTL Instruments, Houston, TX
Shirley Gillespie 713-280-3509
Shirley.Gillespie@cooperindustries.com
www.mtl-inst.com
maintain a secure contact and to
avoid drop-shock continuity in the
event of falls. (Contact company for
price available now.)
Molex, Lisle, IL
Sales 800-786-6539
amerinfo@molex.com
www.molex.com
NEW
PRODUCTS
www.masterbond.com
154 Hobart Street, Hackensack, NJ 07601 USA
+1.201.343.8983 mainmasterbond.com
Exceptionally low volume resistivity
One to one mix ratio
Outstanding bond strength
Epoxy System EP21TDCSFL
Two Part Silver Conductive
Adhesive Has High Flexibility
2027AS_3.25x4.5.indd 1 3/20/12 8:18 PM
Paper Tube Company
1033 S. Noel Ave., Wheeling, IL 60090
The original, proven, Resinite insulating tubing presents a unique combination
of low cost coupled with high mechanical strength and good dielectric properties.
It will support lugs and terminals and can be fabricated to specifications. Will
accept dip and hand soldering of terminals. Can be embossed for threaded cores.
Also available in U/L flame retardant grade.
To receive literature & details fast - www.pptube.com
Phone: 847-537-4250 Fax: 847-537-5777 E-Mail: sales@pptube.com
More Than 75 Years- The Original
LOW COST, HIGH STRENGTH, PHENOLIC
IMPREGNATED, RESINITE DIELECTRIC
TUBING FOR COIL WINDING, INSULATING
terconnect reliability, corrosion pro-
tection, and wear resistance. (Con-
tact company for pricing and
availability.)
Mill-Max, Oyster Bay, NY
Customer Service 516-922-6000
www.mill-max.com/PR627
Reprints can be used as:
Trade Show Handouts
Media Kits
Point-of-Purchase Displays
Direct Mail Campaigns
Create a powerful statement for
your product, service or company
through professionally designed
marketing materials utilizing
editorial content from Electronic
Products.
Contact Wrights Media to discuss
how we can customize these
materials to enhance your current
marketing campaign.
U.S. copyright laws protect against
unauthorized use of published
content.
REPRINTS
EPRINTS
PLAQUES
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Call today
877-652-5295 and
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70329_EP_Ad_thirdvert:15155_ral-1-4page 8/18/10 2:01 PM
Key-fob enclosures suit
wireless remotes
FB-45 Series key-fob enclosures were
created to help meet the market de-
mand for compact, wireless remote-
control devices that can be carried in
hand or on a key ring or lanyard. The
2.75 x 1.37 x 0.69-in. enclosures
come in configurations with 0, 1, 2,
4, or 5 tactile buttons.
The base and cover of the enclo-
sure snap together, capturing a pc
board between them. All versions
have a molded-in key ring, and come
in bright white or black ABS plastic
with a UL94V-0 flame-retardant rat-
ing. An optional battery holder ac-
cepts 20-mm coin cell batteries, and
custom cutouts and printing are also
offered. ($1.96 or less depending on
qty available now.)
Polycase, Avon, OH
Erin Juristy 440-934-0444
ejuristy@polycase.com
www.polycase.com/fb-45-series
Adapters combine
performance, low cost
A full range of precision adapters are
available, both within series and be-
tween series, encompassing SMA,
SMA to N, 2.92
mm, 3.5 to 2.40
mm, 2.92 to 2.40
mm, SSMA to
2.40 mm, and
2.40 mm as well
as unique 0.9 to
1.85 mm. Featuring near-metrology-
grade performance, they suit appli-
cations requiring metrology-type
measurements where phase match-
ing is not required.
Each series is produced to the same
electrical length and provide an eco-
nomical lower-cost solution for criti-
cal production and test requirements.
The adapters also are approved for
satellite and other high-reliability ap-
plications. (Contact company for
pricing and availability.)
Southwest Microwave, Tempe, AZ
connectors@southwestmicrowave.com
www.southwestmicrowave.com
Two-door enclosures
are 18-in. deep
Hoffman brand two-door, floor-
mount enclosures are now available
in four 18-in. deep models. Featur-
ing a UL Type 4 rating, the A4L3 line
enclosures suit indoor or outdoor use
where it is necessary to protect elec-
tronics from wet, potentially corro-
sive environments.
The four 18-in.-deep models are
available in heights and widths of
62.06 x 48.06 or 60.06 in., and 74.06
x 60.06 or 72.06 in. All have a POW-
ERGLIDE handle with three-point
latching, which provides sufficient
compression to meet UL Type 4 re-
quirements without the use of quar-
ter-turn latching. Additional features
include a flange trough collar around
the door opening to exclude liquids
and contaminants, and a removable
center post for easy back panel in-
stallation. (Contact company for
Pentair Technical Products
Hoffman Brand, Anoka, MN
www.hoffmanonline.com
SMD terminal blocks
are pushbutton
The 2060 Series SMD terminal block
line adds one- and three-pole vari-
ants that bring pushbutton actua-
tion to PCB-based
LED lighting and
electronics. An al-
ternative to hand-
soldering PCB leads,
the 4.5-mm-high
pushbutton block streamlines termi-
nation and permits removal for wir-
ing error correction, enabling com-
pliance with Energy Star requirements
for end-of-life components.
The series accommodates a broad
range of solid/stranded conductors
(AWG 2418) within one unit and are
UL/cUL recognized: one-pole units
claim an industry-topping 600-V/9-A
rating; two- and three-pole models
are rated for 250 V/9 A. Applications
include LED lighting/signage; ther-
mostat, alarm, and HVAC controls;
and electronics requiring low-profile
SMT components. (Contact company
for pricing available now.)
Wago, Germantown, WI
Sales 800-346-7245
info.us@wago.com
www.wago.us
HIGHLIGHTS
60-V buck-boost LED driver offers 100 W
The LT3791 synchronous buck-boost dc/dc LED driver and voltage control-
ler delivers 100-W power. It features 4.7 to 60V input
voltage that suits automotive, industrial and architec-
tural lighting. The output voltage can be set from 0 to
60 V, enabling it to drive a wide range of LEDs in a
single string. An internal four-switch buck-boost con-
troller operates from input voltages above, below or
equal to the output voltage.
The buck-boost LED driver features three control loops to monitor input
current, LED current and output voltage. The LT3791 uses four external
switching MOSFETs and delivers from 5 to 100W output power with effi-
ciencies up to 98.5%. It provides current accuracy of 6% and 2% output
voltage accuracy. It uses either analog or PWM dimming as required by the
application. The switching frequency is programmable from 200 and 700
kHz or can be synchronized to an external clock. (From $4.75 ea/1,000
available now.)
Linear Technology , Milpitas , CA
Sales Office 408-428-2050 www.linear.com
16-bit MCU cuts power usage by 50%
The MSP430FR58xx Wolverine 16-bit microcontroller series
is said to require the lowest power/MIPS of any such device
and takes 50% less than the previous version. The MCU
takes just 360 nA in standby/real-time clock mode and less
than 100 A/MHz in active mode.
The chip has a fast wake-up time of 6.5 s, internal power management,
and a 12-bit A/D converter that takes only 75 A. It has up to 64 Kbytes of
FRAM program memory. (Price not available samples June.)
Texas Instruments , Dallas , TX
Information 800-477-8924 www.ti.com
Transceiver IC offers lowest power,
highest performance
Claimed to be the lowest-power, highest-performance device
of its kind, the AX5043 SRD (short-range-device) transceiver
IC offers a receive current of 9.5 mA and a sensitivity of 126
dBm. The part covers frequencies continuously from 70 to 1,050 MHz and
is housed in a 5 x 5-mm
2
QFN28.
The transceiver accommodates the requirements of the narrow-band
standards in Europe, the U.S., as well as in most Asian countries including
Japan and Korea. It uses an enhanced AXSEM standard register set and
comes with a micro-programmable 256-byte FIFO, which, for example, al-
lows repeating of bytes or waiting for match conditions.
The AX5043 has a differential Rx/Tx RF-port as well as a single-ended TX
port for use with external power amplifiers. The maximum output power
without external amplification lies between 16 and 20 dBm, depending on
the frequency. Additional features include 45-dB neighbor channel rejec-
tion, supply voltages from 1.8 to 3.6 V, and standby current of 400 nA with
duty-cycle-clock running.
The data rate can be chosen flexibly from 1 to 100 kbits/s, and many
modulation schemes are implemented (ASK, FSK, 4-FSK, OQPSK, MSK,
GFSK BT = 0.3 or BT = 0.5). The AX5043 can be configured to natively un-
derstand most common RF communication protocols such as wireless M-
bus for 868 MHz or 169 MHz. (Contact Sales for pricing available now.)
AXSEM , Dbendorf , Switzerland
Sales 41 44 882 1707 sales@axsem.com www.axsem.com
Dual-channel booster
amplifier triples speed
performance
The PB63 dual-channel booster am-
plifier offers a 1,000-V/s slew rate
and 1 MHz of power bandwidth. It is
claimed to accelerate power booster
performance by 300% compared to
the companys previous industry
benchmark power booster products.
By pairing this device with one or
two low-cost operational amplifiers,
semiconductor and flat-panel test
equipment manufacturers can now
realize a combination of improved
test equipment efficiency and pro-
ductivity in a more cost-optimized
solution compared to traditional
high-voltage amplifiers.
Features include a voltage opera-
tion of 20 to 75 V and continuous
output current drive capability of up
to 2 A. It provides both voltage and
current gain when paired with a
small-signal, general-purpose opera-
tional amplifier allowing the user
to optimize the accuracy, offset, in-
put noise, and settling time of the
composite circuit.
The PB63 is packaged in a 12-pin
PowerSIP. ($128.94 ea/1,000 avail-
able now.)
Cirrus Logic , Austin , TX
Product Support 800-625-4084
www.cirrus.com
600-V ICs target motor
drive apps
The IRS2334SPbF and IRS2334MPbF
are three-phase 600-V ICs for inver-
terized motor drives used in energy
efficient appliance and industrial ap-
plications. The IRS2334SPbF is of-
fered in an SOIC20WB package while
the IRS2334MPbF is available in a
QFN5X5 package featuring a foot-
print of 25 mm
2
.
The three-phase IC family pro-
vides protection including proprie-
tary negative voltage spike (Vs) im-
munity for safe operation under
extreme switching conditions and
short circuit events. The output driv-
ers feature a high pulse current buf-
fer stage designed for minimum
driver cross-conduction. Propaga-
NEW
PRODUCTS
POWER MANAGEMENT
ANALOG/MIXED SIGNAL
edited by christinanickolas, jimharrison and pauloshea
See more online at electronicproducts.com/ic
tion delays are matched to simplify
use at high frequencies. The floating
channel can be used to drive n-chan-
nel power MOSFET or IGBTs in the
high-side configuration. The ICs fea-
ture undervoltage lockout protec-
tion, integrated deadtime protection,
and shoot-through protection. ($1.95
ea/10,000 available now.)
International Rectifier
El Segundo, CA
Sales 310-252-7105
www.irf.com
Untitled-1 1 4/18/12 11:20:37 AM
8-bit MCUs have 12-bit
A/D, 8-bit D/A, op amp
Featuring a 12-bit A/D converter and
dual 16-bit PWMs with 64 MHz op-
eration, the PIC16F(LF)1782/83/84/86
or 87 8-bit microcontroller offers a
tiny 28-Lead UQFN 4 x 4 x 0.5 mm
package. It has up to 8 Kbytes of
flash, 256 bytes of EEPROM, and 1
Kbyte of SRAM. The IC takes just 125
A typ and 550 A
max at 4 MHz with a
1.8 V supply over the
-40- to 85C temper-
ature range. The LF
versions have sleep
currents of just 50 nA
typ.
The chip also has
an 8-bit D/A convert-
er, a 32 MHz oscillator, three com-
parators with 50 ns response time,
two operational amplifiers, and a
fixed voltage reference. It is available
in a number of different 28- and 40-
pin packages and has EUSART, I
2
C
and SPI interface peripherals. (From
$1.18 ea/10,000 available now.)
Microchip Technology
Chandler, AZ
Sales 480-792-7200
www.microchip.com
MCU has Cortex-M3,
IEEE 802.15.4 radio
The STM32W wireless microcon-
troller has a Cortex-M3 processor
core plus a certified 2.4 GHz IEEE
802.15.4 radio implementation. It
supports emerging industry-stan-
dard Smart Energy 2.0 protocol
(SEP 2.0) and use an IPv6-based
stack (ZigBeeIP) for extended in-
teroperability.
The device has up to 256 Kbytes
of flash along with an encryption
accelerator, two 16-bit timers, and
a 12-bit A/D converter. It runs at
6, 12, or 24
MHz from a
single 2.1 to
3.6 V supply.
Receive cur-
rent is 27 mA
total, transmit
current at +3
dBm is 31 mA,
and deep sleep current, with re-
tained RAM and GPIO, is 400 nA.
(Ea./1,000; $2.05 with 64 Kbyte
flash; $2.91 with 256 Kbyte flash -
samples available now.)
STMicroelectronics
Lexington, MA
www.st.com
Integrated Circuits
DIGITAL
NEW
PRODUCTS
Relay & Switch
MH Series
Pushbutton
MEMS microphone
offers high performance
to mass market
Aimed directly at mobile-handset
manufacturers, the AKU340 analog
MEMS microphone uses a dual-chip
design (it has a MEMS
device created with a
wel l - es t abl i s hed
surface-microma-
chining process as
well as a separate
ASIC for signal pro-
cessing) to consistently pro-
vide excellent acoustic performance.
With an SNR of 63 dB, the 2.5 x 3.35
x 1.0-mm unit has a very flat re-
sponse curve over a 50 Hz to 20 kHz
range, with sensitivity of less than 5
dB at 50 Hz so it can achieve superior
low-frequency recording.
Tight sensitivity matching be-
tween microphones (-38 dBV/Pa +/-2
dB at 1kHz and 94 dB SPL) allows the
microphone to provide unit-to-unit
performance consistency in mass-
produced electronic goods, which is
beneficial whether the microphone
is used by itself, or in a microphone
array where its uniformity increases
noise-suppression performance. At
114 dB SPL, total harmonic distor-
tion is less than 5%, ensuring cap-
ture of the true sound.
The device works from a 1.6 to
3.6-V supply, consuming less the 300
A at 1.8 V while providing power
supply rejection greater than 60 dB.
Its bottom-ported package is shield-
ed for RF and EM immunity. ($1.34
ea / 1,000 samples available now,
prod qty 3rd qtr.)
Akustica, Pittsburgh, PA
sales@akustica.com
www.akustica.com
Bus bars suit solar and
industrial drives
The RO-LINX PowerCircuit bus bars
distribute power and signal lines or
have components mounted on the
busbar structures. The bus bars target
solar and industrial drives from 25
kW to 250 kW with
current levels from
100 to 500 A with
copper thickness
from 400 to 800 m.
The bus bars are
solder-process com-
patible, help engineers in the design
of power and control circuitry while
maintaining small circuit foot-
prints. These three-dimensional ca-
pable structures suit power distribu-
tion applications in EV/HEVs,
wind/solar power, and variable-fre-
quency-drive markets. (Contact
Rogers, Rogers, CT
Information 860 774-9605
www.rogerscorp.com
Relay driver optimizes
inductive load control
Providing a rugged interface between
standard logic and 3 to 6-V dc induc-
tive loads, the DRDC3105 relay driver
is designed to handle relays, sole-
noids, incandescent lamps and small
motors in a wide range of applica-
tions. From a 5-V supply rail, the part
has the capability to drive coils rated
at up to 2.5 W.
The relay driver is offered in single
and dual driver configurations,
housed respectively in SOT23 and
SOT26 packages, and can replace be-
tween 3 and 6 discrete components.
With a Zener
diode includ-
ed across the
devices bipo-
lar transistor
output, the
need for an
external free-wheeling diode is re-
moved, and by clamping at 6.6 V the
Zener also sinks inductive currents to
ground, thereby reducing noise due
to EMI. (ea/10,000;$0.09 for the sin-
gle driver package;$0.15 for the dual
driver package available now)
Diodes, Plano, TX
Glen Wynn 972-385-6292
glen_wynn@diodes.com
www.diodes.com
Triac first to offer
700-V voltage tolerance
The BCR8LM-14LK high-commuta-
tion triac, supporting 8-A RMS on-
state current and voltage tolerance of
Components &
Subassemblies
edited by p.oshea, c.nickolas, and r.comerford
See more online at electronicproducts.com/cs
IR3553
4 x 6 mm - 40 A
IR3551
5 x 6 mm - 50 A
IR3550
6 x 6 mm - 60 A
1
2
3
4
5
6
7 8 9 10 11 12 13 14 15
16
17
18
19
20 21 22 23 24 25 26 27 28 29 30
Output Current (A)
E
f
f
i
c
i
e
n
c
y

(
%
)
60
V
out
MULTI-PHASE
DC-DC
CONTROLLER
for more information call 1.800.981.8699 or visit us at www.irf.com

Key Features
Output current capability up to 60A
Peak efciency up to 95% at 1.2V
OUT
Input voltage (V
IN
) range of 4.5V to 15V
Output voltage (V
OUT
) range from
0.25V to (V
CC
- 2.5V)
Operation up to 1MHz
Integrated current sense amplier
Thermal ag
Body-Braking
load transient support

Compliant with Intel DrMOS V4.0
Efcient dual sided cooling
Compact PQFN package
Lead free RoHS compliant package
PowIRstage
footprint compatibility offers exible design

PowIRstage
offers exceptional efciency across the entire load range

Scalable Solutions for Multi-Phase Power Systems
High Efciency, High Density
PowIRstage
able Solutio o t l S e bble Solu

18 1118
19 1119
6mm
6mm
4mm
6mm
5mm
6mm
THE POWER MANAGEMENT LEADER
NEW
PRODUCTS
for FREE PICO Catalog
Call toll free 800-431-1064
in NY call 914-738-1400
Fax 914-738-8225
PICOElectronics, Inc.
143 Sparks Ave. Pelham, N.Y. 10803
E Mail: info@picoelectronics.com
www.picoelectronics.com
Over 2500 Std.
DC-DC Converters
Surface Mount
From 2V to 10,000
VDC Output
1-300 Watt Modules
Isolated/ Regulated/
Programmable Models
Available
Military Upgrades Available
Custom Models,
Consult Factory
D
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elivery-Stock to one w
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for sam
ple quantities
A29_EDN_1-3V_2-25x10_A29.qxd 3/7/12 3:22 PM
700 V, enables triggering directly by a
microcontroller. The triac can be used
to drive loads such as ac motors, sole-
noids, and heaters in electric house-
hold appliances such as washing ma-
chines and refrigerators.
Triacs are used for controlling
power supply switching in ac cir-
cuits. The device maintains the per-
formance of existing TRIAC prod-
ucts, while achieving a gate trigger
current of 12 mA, allowing it to be
driven directly by a MCU. It does not
need an amplified circuit, and uses a
structure designed to reduce the gate
trigger current. ($1 ea/large qty
available now.)
Renesas Electronics America
Santa Clara, CA
Sales 800-366-9782
am.renesas.com
200-V rectifiers offered
in surface mount pkgs
A portfolio of 200V surface mount
Schottky rectifiers suit high voltage ap-
plications. The CMSH1-200HE (1 A,
200 V, SMA package), CMSH3-200MHV
(3 A, 200V , SMB package), CMSH5-
200HV (5 A, 200 V, SMC package), and
a bridge rectifier
CBRHDSH1-200
(1 A, 200 V, HD
DIP package).
The Schottky
rectifiers are en-
ergy efficient with a reverse leakage
current at maximum repetitive volt-
age of 50 A and a 0.9V forward
voltage drop. The devices suit power
management, power over Ethernet
line rectification, dc/dc conversion,
and solid state lighting applications.
(Full reel qty/ea: CMSH1-200HE,
$0.20; CMSH3-200MHV, $0.30;
CMSH5-200HV, $0.40; CBRHDSH1-
200, 0.44 available now.)
Central Semiconductor
Hauppauge, NY
Tom Donofrio 631-435-1110
tdonofrio@centralsemi.com
www.centralsemi.com
Accelerometer works in
760C environments
The Endevco model 6240M10, a her-
metically sealed piezoelectric charge-
output accelerometer, can operate
continuously at temperatures up to
649C and intermittently to 760C.
The transducers ability to perform
at extreme temperatures suits it for
monitoring aircraft and ground gas-
turbine vibration, exhaust and com-
pression systems, and other high-
temperature equipment.
With a sensitivity of 5 pC/g, the
1.335 x 0.80 x 0.80-in. sensor is sta-
ble over a wide op-
erating bandwidth
as well as tempera-
ture, and is com-
pact enough to fit in
tight spaces. The ground-
isolated units sensitive axis is in line
with its supplied mounting bolt (a
transverse version is optional), and
sensing elements and integral shield
are also isolated from its case. Opera-
tion requires a charge amplifier or
remote charge converter that accepts
a 100-k source, but no external
power is needed. (Contact Bruce Lent
for pricing, availability.)
Meggitt Sensing Systems
San Juan Capistrano, CA
Bruce Lent 949-493-8181, ext. 175
bruce.lent@meggitt.com
www.meggittsensingsystems.com
Silicon ESD devices target
high-data-rate apps
A family of eight silicon-ESD (SESD)
devices provide low insertion loss for
high-speed interfaces (for example,
USB 3.0/2.0, HDMI, eSATA, Display-
Port, and Thunderbolt technology).
The devices help protect against
damage caused by ESD, surge and
cable discharge events. They feature
single-channel and multi-channel
SESD protection devices offering bi-
directional capacitance of 0.10pF
typical, uni-directional of 0.20pF
typical, and ESD protection of 20-kV
air and contact discharge.
The SESD multi-channel devices
also feature a flow-through design
package that allows for matched im-
pedance of PCB trace routing for
maintaining high-speed signal integ-
rity. The single- and multi-channel
SESD devices also feature a 20kV
contact and air discharge rating, ex-
ceeding IEC61000-4-2s 8kV indus-
try standard. The single-channel de-
vices are available in 0201-sized
XDFN small footprint (0.6 x 0.3 x
0.31-mm) and 0402-sized XDFN (1.0
x 0.6 x 0.38-mm) packages. The multi-
channel SESD arrays feature a pack-
age height as low as 0.31 mm. (From
$0.16 ea/10,000 available now.)
TE Circuit Protection Group
Menlo Park, CA
Technical assistance 800-227-7040
www.circuitprotection.com
Components &
Subassemblies
NEW
PRODUCTS
LED lightbar system eases installation
Available in warm, neutral, cool-white, and custom RGB
colors, SunBrite SSP-LB-Series modular LED lightbar sys-
tem combines high-performance
lighting (200 to 300 lm/ft at 24 V)
with ease-of-installation, flexibility,
and cost savings. Unlike other light-
strip technologies, the system can
be installed without having an elec-
trician open walls and install new wiring.
The CE, UL, IP60 and RoHS-compliant lightbars are avail-
able in lengths of 6, 12, and 24 in. that can be joined together
easily to create desired length up to a maximum of 40 W, us-
ing compatible connector cables available in 10, 20, and 40 in.
lengths and 45 or 90 angle mounting clips. A specially de-
signed transformer allows wall plug-in and an available dim-
mer switch controls an entire line of connected light switches.
(From $25 to $30 per ft / prod qty available now.)
Lumex, Palatine, IL
Sales 800-278-5666 lmxsales@lumex.com
www.lumex.com
LED luminnaire outputs over 20,000 lm
The Cimarron LED outdoor luminaire is now available with
an output of 22,000 lm. The high-brightness fixture uses
90 high-brightness LEDS , consumes 310 W, and is available
in versions for Type II, III, IV, and V light distributions.
The UL, CSA-compliant fixture has a
60,000-hr-life solid die-cast housing de-
signed to IP65, with vertical fins along
the side walls to dissipate heat and chan-
nel rain water from the top. Internal sen-
sors detect above-tolerance temperatures and au-
tomatically reduce load to preserve LED life.
Mounting options include straight or upswept arms,
a wall mount, a 30 tilt arm, and an optional mast-arm fit-
ter. Further options include a vandal shield, bi-level or con-
tinuous dimming, and wiHUBB wireless controls. (Contact
Kent Wleke for pricing and availability.)
Hubbell Lighting/Spaulding Lighting brand
Greenville, SC
Kent Welke 864.678.1262 kwelke@hubbell-ltg.com
www.spauldinglighting.com
7-in. LCD can be read easily in direct
sunlight
The MT-TFT-1000BL series 7.0-in. TFT LCD is backlit with
LEDs to provide 1,000-nit brightness so it can be read in di-
rect sunlight. The automotive-grade 800 x 480-pixel display
measures 166.6 x 109.4 x 10.0 mm with a 152..4 x 91.44 active
area that can optionally be configured for touch sensing.
The RoHS-compliant units input is 16-bit-parallel DE
mode and the display has an on-board Vcom circuit and a
contrast ratio of 250:1. Also available is a 5.7-in. model, and
a 10.1-in model will debut later this year. (From $61 ea/1,000
available 12 to 14 weeks ARO.)
Microtips Technology, Orlando, FL
Information 888-499-TIPS mtusainfo@microtipsusa.com
www.microtipsusa.com
148-lm/W LED cuts
cost, time-to-market
Using a technology platform intro-
duced in January (www2.electronicprod-
ucts.com/-article-hlrc02_feb2012-html.
aspx), the XLamp XT-E white LED not only delivers twice
the lumens-per-dollar of other LEDs, but also delivers the
highest efficacy in the industry up to 148 lm/W in cool
white (6,000 K) at 85C and an operating current of 350
mA to reduce the number of LEDs needed to achieve a
given brightness. The warm-white (3,000-K) version pro-
vides 114 lm/W at 85C and 350 mA.
With its 3.45 x 3.45-mm XP footprint, the LED can be
used for almost all lighting applications, replacing exist-
ing XP LEDs in lighting to shorten the fixture design cy-
cle. Further reducing time-to-market, the LED is a succes-
sor to XP-E high-efficiency LED, and therefore application
for Energy Star qualification with the new LED requires
only 3,000 hr of LM-80 data, instead of the usual 6,000
hr. (Samples, free; commodity pricing competitive with
existing LEDs samples available now, production quan-
tities with standard lead times.)
Cree, Durham, NC
www.cree.com
Optoelectronics
edited by richardcomerford
See more online at electronicproducts.com/op
HIGHLIGHTS
Optimized for testing high power devices such as di-
odes, FETs, and IGBTs, as well as characterizing newer
semiconductor materials such GaN and SiC, the Model
2657A High Power System SourceMeter instrument
(SMU) lets users characterize devices and materials with
a built-in 3,000-V, 180-W source, thus delivering up to
five times more power than the nearest competitive sys-
tem. Not only does it do this at a significantly lower
cost, but the SMU can also resolve 1 fA with its high-
speed 6-1/2-digit measurement engine, even when
sourcing up to 3,000 V, thus supporting low-leakage
tests for next-generation power semiconductors.
The instrument lets users choose either of two mea-
surement modes integrating or digitizing for char-
acterizing both steady-state and transient behavior, in-
cluding rapidly changing thermal effects. Each mode
uses two independent ADCs one for current and the
other for voltage that run simultaneously: so users
can capture voltage and current transients, the digitiz-
ing mode uses two 18-bit converters capable of fast, 1-
point/s sampling, while the integrating measurement
mode employs dual 22-bit ADCs for precise measure-
Source-meter unit brings 5X more power to semi test
ment of very low currents
and ultra high voltages.
Included in the hard-
ware is TSP Express, an
LXI-based I-V test software
utility that lets users per-
form basic device charac-
terization without pro-
gramming or installing software users simply connect
a PC to the instruments LAN port and access the built-
in software with any Java-enabled Web browser. For
more advanced operation, two additional software tools
are provided: Test Script Builder for creating and run-
ning TSP scripts, and an IVI-based LabVIEW driver.
As an option, ACS Basic Edition software is available
to provide even more features for characterizing high-
voltage/current components. Its measurement libraries
support both dc and pulse-mode operation as well as a
variety of power devices FETs, BJTs, diodes, IGBTs,
and others with tests that include input, output, and
transfer characteristics on most devices. Its Trace mode
gives real-time control over voltage or current output
using a simple slider.
And while the 2657A can be connected to other in-
struments in a test system with standard safe-high-volt-
age (SHV) coax connections, special HV triaxial (guard-
ed) connections are offered to optimize measurement
accuracy. Further, the optional Model 8010 High Power
Device Test Fixture, which has rear-panel scope and
thermal-probe ports, makes it safer and simpler to con-
figure a system for testing packaged high power devices
up to 3,000 V or 100 A, (2657A, from $17,900; ACS Basic
Edition; $5,000; Model 8010 fixture, $6,500 available
2 weeks ARO.)
Keithley Instruments , Cleveland , OH
Information 440-248-0400 publisher@keithley.com
www.keithley.com
NEW
PRODUCTS
App covers LPDDR3 std/non-std testing
Designed for engineers who work on smartphones, tablets,
gaming consoles, and other consumer electronics, the
U7231B test application provides low-power double-data-rate
3 (LPDDR3) physical-layer compliance measurements. In ad-
dition to accelerating turn-on and debug of standard LPD-
DR3-based systems, the tool which runs on Infiniium
9000, 90000A, and 90000 X-Series oscilloscopes with LPD-
DR3 BGA probes also suits engineers working with non-
standard operating speeds and voltages.
Providing automated testing capabilities for clock, electri-
cal, and timing tests, the app automatically configures the
scope for each test and generates an HTML report at the tests
end. The report compares results with the specified test lim-
its and indicates how closely the device passes or fails each
test. ($4,200. or $2,000 for U7231A DDR3 test app upgrade
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Sales 800-829-4444 www.agilent.com
Test & Measurement
edited by richardcomerford
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DSA800Ad_EP4_12_Layout 1 3/15/12 8:59 AM Page 1
Fixed Frequency Active Filter Modules
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BlockMasters Clear Connects Push-In
Wire Connectors
BlockMasters Clear Connects Push-In Wire Connectors
are faster, simpler and safer than twist-on wire connectors. No
more twisting or taping! Transparent, color-coded and easy
to use, Clear Connects provide visual conrmation of wire
termination for a perfect connection every time! Available in 2-8
positions, Clear Connects accept
wire sizes from 22-12 AWG. A built-
in strip guide shows how much
wire to strip, and their compact size
enables connections in tight spaces.
BlockMaster Electronics, Inc.
1-800-595-8881
www.BlockMaster.com
Customized Solution at a Standard
Enclosure Price
The XPAND-A
Series enclosure from Buckeye Shapeform can be

made to any height, width, and depth and is perfect for both desk
and handheld applications. It is ideal for smaller- to medium-
size case requirements. Buckeye Shapeform can provide custom
nishing (plating and painting), punching, ventilation and single
and multi-color silk screening.
Next day shipping available on
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info@BuckeyeShapeform.com
www.BuckeyeShapeform.com
Audiolarm II
Piezoelectric Alarms
The industrys largest selection of piezoelectric whoops, warbles,
sirens, beeps and more. Available in variety of voltages and
output up to 103dB! Rugged panel mount products are IP68
and NEMA 4X when used with optional gasket. ISO 9001:2000
registered company all products made in the USA.
Floyd Bell Inc.
Tel: (614) 294-4000
Fax: (614) 291-0823
sales@oydbell.com
www.oydbell.com
Absopulse Electronics Ltd. ..................................... 80
Advanced Linear Devices, Inc. ............................... 32
Advanced Power Solutions .................................... 27
Agilent Technologies, Inc. ................ Cover 2, 48, 49
AKM Semiconductor, Inc. ...................................... 89
Allied Electronics Inc. ................................... Cover 3
America II Electronics, Inc. .................................... 47
AMETEK Programmable Power, Inc. ...................... 78
APM Hexseal .......................................................... 60
Arrow Electronics, Inc. ............................................. 7
Astrodyne Corp. ..................................................... 72
Avnet Electronic Marketing ............................. 33, 40
BlockMaster Electronics, Inc. .................................. 96
Buckeye Shapeform ................................................. 96
BUD Industries, Inc. ............................................... 84
Calex Manufacturing Company, Inc. ..................... 72
Central Semiconductor Corp. ................................ 31
Chomerics .............................................................. 66
CIT Relay & Switch ................................................ 90
Clare, Inc. ......................................................... 56, 64
Coilcraft, Inc. ......................................................... 10
ConTech ................................................................. 74
Digi-Key Corporation ............................................... 1
ELMA Electronics, Inc. .......................................... 38
EMCO High Voltage Corporation .......................... 68
Equipto Electronics Corp. ...................................... 67
E-T-A Circuit Breakers ............................................. 35
FCI Electronics ................................................. 54, 55
Floyd Bell Inc. ........................................................ 96
Fujipoly America Corp. .......................................... 58
GAIA Converter Inc. ............................................... 74
Garrett Electronics Corporation ............................ 60
General Cable ......................................................... 37
GlobTek, Inc. ........................................... Cover 1, 77
Hammond Manufacturing Company Inc. ............ 83
Harwin ................................................................... 65
Hittite Microwave Corporation ............................. 17
Integrated Power Designs, Inc. ............................... 25
International Rectier ............................................ 91
IXYS Corporation ................................................... 36
Keystone Electronics Corp. .................................... 76
KOA Speer Electronics, Inc. ................................... 53
Krohn-Hite Corporation .................................. 94, 96
Kyocera Display Corporation ................................. 59
Linear Technology Corporation ............................ 13
Master Bond Inc. .................................................... 86
Maxim Integrated Products, Inc. .................. Cover 4
Maxon Precision Motors, Inc. ................................ 28
Mean Well USA, Inc. ................................................ 4
Mega Electronics, Inc. ............................................ 75
Melexis ................................................................... 12
Memory Protection Devices ................................... 45
MicroMo Electronics, Inc. ...................................... 26
MicroPower Direct, LLC ......................................... 70
Minmax Technology Co., Ltd. . .............................. 80
Mouser Electronics ................................. 3, 19, 20, 21
MS Kennedy Corporation ...................................... 29
MTM Power ............................................................ 69
MuRata Power Solutions, Inc. ................................ 71
National Instruments ............................................. 15
Newark/element14 ................................................... 9
Online Components ..................................... Cover 1
Panasonic Industrial Co.-
OEM Batteries Group ........................................ 82
Panasonic Electric Works Corporation .................. 14
Pduke Technology .................................................. 77
Pelican Products, Inc. ............................................... 2
Pico Electronics, Inc. .............................................. 92
Precision Paper Tube Company ............................. 86
Precision, Inc. ......................................................... 41
Rigol Technologies ................................................. 95
RTG, Inc. ................................................................ 93
Spectrum Control Inc. ..................................... 50, 51
Tadiran ................................................................... 23
Taiyo Yuden (USA), Inc. ......................................... 61
Tensility International Corporation ...................... 85
The Bergquist Company ........................................ 43
Total Power International, Inc. .............................. 75
Traco Power ............................................................ 79
Unipower Corporation .......................................... 73
VARTA Microbattery Inc. ....................................... 57
XP Power ................................................................ 81
Yuan Dean Scientic Co., LTD. .............................. 61
Zilog Inc. ................................................................ 18

ADVERTISER INDEX
This index is provided as an additional service. The publisher does not assume any liability for errors or omissions.
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