Escolar Documentos
Profissional Documentos
Cultura Documentos
IPAD
MAIN PRODUCT APPLICATIONS: EMI filtering and ESD protection for: SIM Interface (Subscriber Identify Module) UIM Interface (Universal Identify Module) DESCRIPTION The EMIF03-SIM02F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 1.42mm x 1.42mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 on external & Vcc pins: 15kV(air discharge) 8kV (contact discharge) Level 1 on internal pins: 2kV (air discharge) 2kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 Figure 2: Configuration
VCC 100 RST in R1 47 CLK in R2 100 Data in R3 Data ext CLK ext RST ext
Flip-Chip (8 Bumps)
Marking GJ
3
RST in
2
RST ext
1 A
CLK ext
CLK in
Gnd
B C
Data in
VCC
Data ext
September 2005
REV. 5
1/7
EMIF03-SIM02F2
Table 2: Absolute Ratings (limiting values) Symbol Parameter and test conditions Internal pins (A3, B3, C3): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A2, B1, C2, C1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Maximum junction temperature Operating temperature range Storage temperature range Value 2 2 15 8 125 - 40 to + 85 - 55 to + 150 C C C Unit
VPP
kV
Tj Top Tstg
Table 3: Electrical Characteristics (Tamb = 25C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM Rd R1 , R3 R2 Cline Tolerance 20% Tolerance 20% @ 0V Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions IR = 1 mA VRM = 3V 1.5 100 47 20 Min. 6 Typ. Max. 20 0.2 Unit V A pF
IPP VCL VBR VRM IRM IR VF V IF I
2/7
EMIF03-SIM02F2
dB
dB
-10.00
-10.00
-20.00
-20.00
-30.00
-30.00
dB
-20.00
-10.00
-30.00 -40.00
-20.00
-30.00
-80.00 -90.00
-40.00 100.0k 1.0M C1/C3 line 10.0M f/Hz 100.0M 1.0G
Figure 7: Voltages when IEC61000-4-2 (+15 kV air discharge) applied to external pin
Figure 8: Voltages when IEC61000-4-2 (-15 kV air discharge) applied to external pin
Vexternal : 10V/d
Vexternal : 5V/d
Vinternal : 10V/d
100ns/d
Vinternal : 5V/d
100ns/d
3/7
EMIF03-SIM02F2
C(pF)
20. 00 16. 00 12. 00 8. 00 4. 00
VR(V)
0. 00 0 1 2 3 4 5
4/7
EMIF03-SIM02F2
Figure 12: Ordering Information Scheme
EMIF
EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m = 3: Leadfree Pitch = 400m, Bump = 250m
yy
xxx zz
Fx
500m 50
1.42mm 50m
1.42mm 50m
365
Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week)
240
365
Solder mask opening recommendation : 340m min for 315m copper pad diameter
x x z y ww
40
220
All dimensions in m
5/7
EMIF03-SIM02F2
Figure 16: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location 4 +/- 0.1 1.5 +/- 0.1
All dimensions in mm
Table 4: Ordering Information Ordering code EMIF03-SIM02F2 Marking GJ Package Flip-Chip Weight 2.9 mg Base qty 5000 Delivery mode Tape & reel 7
Note: More informations are available in the application notes: AN1235: Flip-Chip: Package description and recommendations for use AN1751: "EMI Filters: Recommendations and measurements"
8 +/- 0.3
ST E
ST E
ST E
xxz yww
xxz yww
xxz yww
4 +/- 0.1
Table 5: Revision History Date 08-Oct-2004 20-Oct-2004 25-Mar-2005 Revision 1 2 3 First issue. Minor layout update. Figure 1 on page 1: pin configuration definitions changed from RST out, CLK out and Data out to RST ext, CLK ext and Data ext. Titles in Figures 7 and 8 changed - No technical data changed out changed to ext in Figure 2. Description of Changes
13-Jun-2005 12-Sep-2005
4 5
6/7
EMIF03-SIM02F2
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
7/7