ABSTRACT

Micro channel cooling is proposed for cooling of the high heat flux electronics. Generally, for high heat flux components liquid cooling is preferable cooling method. In these cases, the dominant thermal resistance is in the fluid. This is due to low thermal conductivity of fluids. Silicon has been used extensively as a heat sin material because of its compatibility to silicon integrated circuits, its high thermal conductivity, and the ease with which it can be used in fabricating!high aspect!ratio channels. Silicon heat collector has a dense array of microchannels etched into the surface that wor to transfer heat energy to a fluid which is circulated through the entire pac age. That heat energy is then pumped to a nearby radiator where it can be dispersed into the surrounding atmosphere with the aid of a fan, or through passive convection cooling. Micro!channel heat!sin s represent the most compact and efficient method of transferring heat from a power source to a fluid. "y minimi#ing the si#e of the slow!moving fluid boundary layer and increasing the area of contact between the heat sin fins and the fluid, the microchannel heat sin removes heat $% times more efficiently than conventional methods li e liquid!cooled cold plates. &arge heat flux from the component base can be removed with a much smaller '()$%* surface temperature rise. +eat transfer coefficients in a microchannel can be very high due to the thinner boundary layer. +owever, the high!pressure drop associated with microchannel flow prevents it to be employed in a micro!fluid loop with micro!pump due to the pumping power limit.

1.INTRODUCTION:
Micro!channel cooling is an effective method to enhance cooling for electronic devices. The problem of boundary layer development as a liquid coolant travels downstream persists in convection micro!channel heat sin .

,ig (.% - .ooling system

1.1 Invention- The use of micro!channel as a visible cooling system was proposed by T/.012 M34 5 613S1 'G12M34 14GI4112S* . They designed cooled hat sin by etching micro channel heat sin with $%um wide and 7%%um height on a silicon substrate. ,luid flow inside channel is at the heart of many natural and man!made systems. +eat and mass transfer is accomplished across the channel walls in biological systems, such as brain, lungs, idneys, intestines, blood vessels etc.. as well as in man!made systems, such as heat exchanges, nuclear reactions, air separation units, desalination etc8. In general, the transport process occur across the channels walls where as bul flow ta es place through the channel of cross!sectional area. The channel cross section thus serves as a conduct to transport fluid to and away from channel walls.

2.HEAT SINKIn electronic systems, a heat sink is a passive heat exchanger component that cools a device by dissipating heat into the surrounding air. In computers, heat sin s are used to cool central processing units or graphic processors. +eat sin s are used with high!power semiconductor devices such as power transistors and optoelectronic devices such as lasers and light emitting diodes '&19s*, wherever the heat dissipation ability of the basic device pac age is insufficient to control its temperature. 3 heat sin is designed to increase the surface area in contact with the cooling medium surrounding it, such as the air. 3pproach air velocity, choice of material, fin 'or other protrusion* design and surface treatment are some of the factors which affect the thermal performance of a heat sin . +eat sin attachment methods and thermal interface materials also affect the eventual die temperature of the integrated circuit. Thermal adhesive or thermal grease fills the air gap between the heat sin and device to improve its thermal performance. Theoretical, experimental and numerical methods can be used to determine a heat sin :s thermal performance.

,ig ;.% - 3 finned heatsin and fan clipped onto a microprocessor, with a smaller heatsin without fan in the bac ground.

2.1 OBJECTIVES:
3 channel serves to accomplish two ob<ectives i* "ring a fluid into intimate contact with channel wall, and

ii*

"ring fluid to the wall and remove fluid away from the walls as the transport process is accomplished.

The rate of transport process depends on surface area, which varies with the diameter 9 for a circular tube, where as flow rate depend on cross sectional area. In human body, the head and mass transfer occurs inside lung and dimensions of around >um. idney=s with flow channels approaching capillary

Mini channel Micro channel Transitional micro channel

7mm?@ 9?;%% um ;%% um ?@ 9 ? (% um (% um?@ 9 ? ( um

+eat transfer and fluid flow in mini channel and micro channel a* Single!phase gas flow in micro channels b* Single!phase liquid flow in micro channels c* Single!phase electro! inetic flow in micro channels d* ,low boiling in micro!channels e* .ondensation in micro!channels f* "iomedical applications of micro!channel flows.

2.2 T !es o" #ICRO$CHANNE% &oo'in( s ste)*s a+ Sin('e !hase 'i,-i. "'o/ in )i&0o$&hanne' i* ii* iii* Micro!pumps, micro!valves, micro!sensors and analy#er of biological materials. +eat removal system, cooling of mirrors in high power laser system. 3dvances in biometric and genetic engineering require controlled fluid transport and control in passages of several micrometers.

Aater is treated as continuous media. 1eo)et0 o!ti)i2ation - +eat dissipation rate ,low rate 6ressure drop ,luid temperature rise ,luid in to surface temperature difference 3+ Sin('e !hase E'e&t0o$kineti& "'o/ in )i&0o$&hanne's : 1lectro! inetic flow system is used in lab!on!a chip devices. The lab!on!a!chip devices are miniature bio!medical or chemistry laboratory on a small glass or plastic chip. &ab!on!a!chip has a networ of micro!channels, electrodes sensors and electrical circuits. 1lectrodes are placed at strategic locations on the chip. 3pplying electric field along micro!channel control the liquid flows and other operations are done on a chip. The ey microfluidic functions required in various lab!on!chip devices include pumping, mining, thermal cycling, dispensing and separating most of these processes are electromagnetic processes.

&+ 4'o/ 3oi'in( in )i&0o$&hanne' : 6rocess ta es places in compact evaporator applications. 3utomative air conditioning evaporators use small passage with flute function heat exchanges. 1xtruded channel with passage diameters smaller than (nm being applied in compact condensor application. ,low boiling is pursued in heat removal from high heat flex devices 'computer chip*, laser diodes and components. .onsiderations -! i* +igh heat transfer coefficient during flow boiling. ii* +igher heat removal capability for given mass flow rate of coolant.

A.vanta(es - ! 3bility of fluid to carry large amount of thermal energy through latent heat of vapouri#ation.

.+ Sin('e !hase (as "'o/: In this type of micro!channel cooling system , the gas flow is of viscous type and the gas was compressed. 2eynolds number and mach numbers were used in this type of flow system. The wall effects and gas flow regimes were used.

e+ 4'o/ 3oi'in( in )i&0o$&hanne's: This process ta es place incompact evaporator applications. 3utomotive air conditioning evaporators use small passage with plate fin heat exchanger. 1xtruded channels with passage diameter smaller than (mm being applied in compact condenser application. ,low boiling is pursued in heat removal from high heat flux devices 'computer chips, laser diodes and components*.

2.5 Consi.e0ations:

(* high heat transfer coefficient during flow boiling.

;* +igher heat removal capability for given mass flow rate of coolant.

A.vanta(es:

3bility of fluid to carry large amount of thermal energy latent heat of vapori#ation.

2.6Bio$)e.i&a' a!!'i&ation:
i*Transport and manipulation of living cells and biological macromolecules place increasingly critical demand on maintaining system conditions with acceptable ranges. ii*Micro!channel geometry used in changing the temperature of small liquid volumes in 943 chains. iii*.oncentration system. .onsequently, convective heat transfer performance of a heat sin across heat sin . Heat sink - 3 passive heat exchange component that cools a device by dissipating heat into surrounding air. +eat sin is used with high power semi conductors devices 'power transistors, optoelectronic devices'lasers, light emitting devices'#ed*. deteriorates in the of solutes, nutrients, gases metabolic products are maintained within

specified tolerances to ensure cell proliferation with bio!reactors of micro!channel cooling

direction resulting in elevated maximum temperature and significient temperature gradient

2.7 T !es o" "'o/s in )i&0o$&hanne' &oo'in( s ste):

(* %a)ina0 "'o/ th0o-(h )i&0o$&hanne'sThe fluid flows in the channel in parallel layers of channels with no disruptions between layers and channels. The liquid tends to flow without mixing in the channels. /se - micro!scale cooling system

a*

,or circular micro!pipes and convection ducts.

,ig ;.$'a* - &aminar flow through micro!channels ;* Inte(0ate. )i&o$&hanne' &oo'in( "o0 5D e'e&t0oni& &i0&-it a0&hite&t-0e

In this type of micro!channels the fluid flows in all layers of the chip. These devices are in two or more than two layers.. The di!electric liquid flows in all direction covering all channel=s of the sin .

;.$ 'b* - Integrated micro!channel cooling 5+ #i&0o$Channe' Coo'in( "o0 hi(h !o/e0 se)i &on.-&to0 .evi&es: In this type of channel cooling system used in semi!conductor devices li e transistors, bi!polar chips. This system is used in linear operations of electronic equipments.

,ig ;.$'c* - Micro!channel cooling for high power semiconductor devices Micro!scale pumping technologies for micro!channel cooling systems (%%@ h '$%* 'T(!T;* T !e o" )eta's -se.: si'i&on8 a''-)ini-)

5.Heat Re)ova' /ith #i&0o$&hanne' Heat Sinks:

Aith component heat dissipation levels reaching $%% A)cm; and beyond, conventional air cooling systems are inadequate for removing excess heat. 2esearch has intensified toward developing more innovative chip cooling techniques. The ultimate goal is to reduce thermal resistance from the chip <unction to ambient, and eep the chip=s <unction temperature as low as possible. ,or high performance .6/s, graphics cards, power amplifiers and other devices, air!cooling has proven ineffective at dissipating high heat fluxes. +eat transfer methods such as heat pipes, vapor chambers, nano!materials, liquid cooling and miniature refrigeration systems have been attracting more interest.

&iquid!cooled micro!channel heat sin s and coolers have been shown to be a very effective way to remove high heat load. 3 large heat transfer coefficient can be achieved by reducing the channel hydraulic diameter. In a confined geometry the small flow rate within micro!channels produces laminar 'smooth* flow, which results in a heat transfer coefficient inversely proportional to the hydraulic diameter. In other words, the narrower the channels in the heat sin , the higher the heat transfer coefficient.

5.1 A 90a&ti&a' I)!'e)entation O" Si'i&on #i&0o$&hanne' Coo'e0s:

More than twenty!five years ago, Tuc erman and 6ease first described the use of silicon micro!channel cooling for very high power densities . +owever, the coolers could not be fabricated easily and pressure drops were very high. 3s chip power densities are now increasing beyond air cooling limits, a variety of liquid cooling methods are being investigated. 9ue to the high heat transfer coefficient associated with it, micro!channel cooling is an attractive approach, but several practical issues need to be addressed. 2eviews of micro! channel cooling are available, though only a few recent publications discuss integration of micro!channel coolers with pac aged silicon chips. we addressed some of the practical issues for implementing silicon micro!channel cooling in a single chip module 'S.M*.

7.; Si'i&on #i&0o$&hanne' Desi(n

2ecent progress in high!rate, deep reactive ion etching '92I1* of Si has greatly simplified the fabrication of silicon micro!channel coolers. 3lso, methods for reducing the pressure drop have been reported including subdividing the flow into multiple heat exchanger #ones with shorter channel lengths and manifold designs with large cross!sectional area 'i.e. equal, or larger than, the channel cross!sectional area*. 3 7!9 rendering of part of an assembled micro!channel cooler is shown in ,igure (, where the manifold chip is on top and is shown as semi!transparent green. In operation, alternate #ig#agged rows of fluid vias are used as inlets and outlets, so the ;% x ;% mm micro!channel cooler is divided into six parallel!fed heat exchanger #ones and the flow length between the inlets and outlets is about 7 mm. The fluid vias in the manifold chip were formed as #ig#agged arrays of circular openings instead of elongated slots to reduce the li elihood of the manifold

wafers brea ing during fabrication and assembly. The micro!channel coolers had a %.B mm seal region around the perimeter, so the actively cooled area was (C.D x (C.D mm in si#e.

,ig 7.;'a*- Silicon plate

,igure 7.;'b* - 9 rendering of a portion of an assembled micro!channel cooler having six heat exchanger #ones.

The manifold chip also contained distribution channels etched about ;$% microns deep on the side facing the micro!channels to help redistribute the flow to, or from, the fluid vias. 3lso, the fin segments were removed from the regions under the fluid vias on the channel chip to further aid in the redistribution of the flow at the fluid vias. Staggered fins were used on the channel chip, which allow easy flow redistribution, but appropriate filtration of the coolant is still required. The micro!channel coolers were fabricated using photolithography and deep Si 92I1 on ($% mm wafers at a M1Ms foundry. The manifold and channel wafers were fusion bonded together and then diced to produce the completed Si micro!channel coolers. The channel depth was about ;$% microns.

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5.5 1EO#ETR: O9TI#I;ATION O4 #ICRO$CHANNE% COO%IN1 S:STE#:

(* +eat dissipation rate ;* ,low rate 7* 6ressure drop >* ,luid temperature rise $* ,luid inlet to surface temperature difference.

5.6 A.vanta(es o" )i&0o &hanne' &oo'in( s ste)s:

(* .ools integrated circuits. ;* +eat is absorbed by walls and heat is moved to the radiator. 7* .ools integrated chips $% times faster than convection cooling. >* 1asy to manufacture $* Eery effective for small areas 'FBcentimeter square*

6.#ICRO$CHANNE% HEAT SINK DESI1N:

The micro channel heat sin was designed in such a way that it ta es the heat from the surrounding of the chip and it collects to the plate 'channels*. 3nd this collected heat, after moving to the channels was detected by the sensors at floe passages and walls of the channel plates and gets cooled by the fans, di!electric liquid. In the micro!channel design, the plates were designed in such a way that the gap was maintained between plate to plate as minimum width as $%um and height 7%%um and length as $%%um. The spacing is provided between each plate for the air passage.

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Microchannel
&

heat sink
A

Tm

+ t Ac Aw

Tb Tw

Heat input q

Structure constaints
Substrate thickness t 100 m (Silicon wafer thickness)

Aspect ratio H/Ww 30 (D !")

,ig >.% - Micro!channel heat sin To design the heat sin , we use si'i&on !'ates as the channels for the heat sin .

6.1 #ICRO$CHANNE% COO%IN1 ARRAN1E#ENT:

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,ig >.('a* - Micro!channel cooling arrangement

,ig >.('b* - Thermal management solution for a typical des top or server application In the above figures it is explained that the cooling system was placed on the chip. 3nd on the chip a soc et was placed and on the soc et a small substrate was placed, this substrate transfer heat to the under!fill. This under fill has alternate sin s, this underfill transfer heat to the pac age die'chip plate* and the heat is transferred to interface material and then moved to integrated heat spreader of first and second stage and finally they were moved to the heat sin micro!channel walls and plates..

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,ig >.('c* - .ross section of Micro!channel cooling

6.2 4EATURES O4 THIS S:STE#:

1+ This system was related to 6eltier effect 'property of T1 material* 2+ &ow efficiency 'input power larger than dissipated heat* 5+ &ow heat flux dissipation rate '7A)cm;* 6+ &imited operation temperature range 6.5 #i&0o&hanne' &oo'in(: 1ither single phase or two!phase, can dissipate heat of B%% A)cm; '.ost effective, compact, low acoustic noise* Cha''en(es: a+ 9a&ka(in(: +ermetic seal, interface with microelectronics !6rocess and materials compatibilityI. yields 'if monolithic*, T1. matching

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3+ .oolant and coolant clogging.oolant selection 'temperature range, thermal properties*, filtering &+ +ot spots Thermal stress!!!performance of I.=s

6.6 #ONO%ITHIC HEAT SINK:

,ig >.> - Monolithic heat sin

6.6.1 TECHINICA% ISSUES:

(. Gptimum design ;. 6rocess and material capability of I.=S 7. +ermetic sealing >. .ooling $. 6umping D. Temperature gradient B. .ost.

6.7 #ICRO$CHANNE%S 4OR %I<UID COO%IN115

(* Straight parallel fins ;* &abyrinth 7* Gffset strip fins >* Split flow

6.= #ICRO$CHANNE% 4OR AIRCOO%IN1(* 2adial ;* 6ins 'micro heat sin s*

6.> CHANNE% SECTION SHA9ES

(* Square ) 2ectangular H +igh ) &ow aspect ratios ;* Triangular 7* Trape#oidal >* .ircular channels

6.?#OTIVATION:
Micro!channels are amongst most effective of high heat!flux heat transfer technologies! can provide temperature control, uniformity and stability, and are also suitable for spot cooling. (* Ahy the increased interest in micro!channels I ;* 4ew manufacturing techniques 'etching, vapour deposition, diffusion bonding8. 1xtruded aluminum multi!channel tubes* 7* 4ew mar ets for miniature heat!exchangers ' electronic cooling 5 automotive*. 4ew needs 'military and commercial* for more aggressive cooling techniques.

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6.@ #AJOR ISSUES O4 #ICRO$CHANNE% COO%IN1:

(* ;* 7* >* $* D* B* C* +igh efficiency in heat dissipation &ower the temperature of chips, boards and systems &ower the temperature gradient of chip and board 'hot spots* Minimal increase in weight and volume 4o detrimental effect on I.. yield and performance 'monolithic approach* 2eliable 1nvironmental friendly .ost effective

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7.#ICRO E%ECTRONICS COO%IN1:

1+ .hip level cooling 2+ "oard level cooling

7.2 #ETHOD O4 CHI9 %EVE% COO%IN1:

(* +igh thermal conductivity material 'F7A)cm;* ;* Gas impingement 'F7w)cm;* 7* Single phase liquid cooling B%%A)cm;J 2equire pump to move coolant >* Two phase cooling +igh thermal conductivity 6ump may not be required 'heat pipe* $* Thermal electric cooling &ow efficiency and operation temperature

7.5 #ICRO$9U#9IN1 S:STE#:

The micro!pump is an electronic equipment, it pumps the di!electric liquid from tan to the channel cooling system. This pump is very small in si#e and it is very much useful for transferring the cooled liquid to the system. There different types of pumps used in micro channel cooling systems. They are (* mechanical pumps ;* 1lectrical pumps

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7* 0inetic pumps >* Magnetic pumps. .urrently all electronic equipments are using electrical pumps for more efficiency.

,ig $.7 -.ross!section of a liquid dosage system with micropump and flow sensor

7.6 E%ECRTO$OS#ATIC 9U#9 IN #ICRO$CHANNE% COO%IN1 :

The electro osmotic pump is based on electroosmosis through an ultra!fine porous glass filter. The silanol groups deprotonate on the glass surface while in contact with an electrolyte. 3s an external electric field is applied through the structure, ions in the bul fluid move, and simple ion drag creates a net motion of the bul liquid. 1lectro!osmotic pumping of the liquid with desired flow rates and pressures is achieved. The pump developed at Stanford, consists of an ultra!fine porous glass filter dis with a diameter of diameter of 7% mm and a thic ness of ; mm, platinum electrodes, a catalytic gas re!combiner, and plexiglas machined parts. The wor ing fluid is (mM buffered de!ioni#ed water '( mM 4a;">GB(% +;G dissolved into ( liter de!ioni#ed water*. The pumps provide flow rates of more than ;% ml)min and pressure drops of higher than ; bar with about ($% E applied voltages. The electro!osmotic pump has no moving mechanical parts, generates little noise, and is very compact with minimal volume.

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,ig $.>'a*- 1lecro!osmatic pump 1lectroosmoticmicrochannel cooling .ompact, high!tech cooling devices for microprocessors The technology combines two!phase convection in microchannels silicon heat sin s with a novel electroosmotic pump to achieve minimal heat sin volume at the chip bac side. The microchannel heat sin is approximately the si#e of the chip and allows remote heat re<ection from a fluid!air heat exchanger. The hermetically!sealed closed loop, features a novel and compact electroosmotic pump, forced two!phase convection in the heat sin , and a remote heat re<ecter. The electro osmotic microchannel cooling system was implemented in a laptop computer. 3 ( cm K ( cm silicon microchannel heat exchanger is attached to the processor, and the re<ecter coil and plate are located at the bac side of the laptop display panel. 3n 1G pump propels water through the loop ma ing use of the power supply for the fan with a converter.

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,ig $.> 'b* - .ross section of 1lectro osmotic micro channel cooling

,ig $.>'c* - Thermal resistance for various cooling fluids 7.7 9HASE CHAN1E #ATERIA%S IN #ICRO CHANNE% COO%IN1:

,ig $.$ - 6hase change materials in micro!channel cooling

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7.= #i&0o &oo'in( te&hni,-e: L 6assive cooling H L +eat pipe, no##le array, heat exchanger

3ctive cooling micro cooler H H Micro heat exchanger 'MM2* Micro compressor L L L 1lectrostatic diaphragm .entrifugal 'MIT* 1lectro! inetic 'Stanford*

Sorption compressor 'Twenty*

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=.CONC%USION
Micro!channel cooling system is very useful for the electronic devices for the immediate cooling of high heat flux devices. It cools the electric chips, boards $% times faster than convection cooling. .urrently this system is developing in defense sector of high power electronics. 3nd this system should be applied in all electronic equipment:s 'power plants, power grids, electronic based automobiles..etc*

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Re"e0en&es:
(. Tuc erman, 9. and 6ease, 2., +igh!6erformance +eat Sin ing for E&SI, I111 1lectron 9evice &etters, May (MC(. ;. Nu, A. and Mudawar, I., Measurement and .orrelation of .ritical +eat ,lux in Two! 6hase Microchannel +eat Sin s, Int. Oournal +eat and Mass Transfer, ;%%>. 7. Marston, 0., Gaynes, M., "e#ama, 2. and .olgan, 1., 3 6ractical Implementation of Silicon Microchannel .oolers, 1lectronics .ooling Maga#ine, 4ovember ;%%B.

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