LG KF750 KF755c Secret Service Manual

Service Manual
Internal Use Only
Service Manual KF750/KF755c
Model : KF750/KF755c
Date: May, 2008 / Issue 1.0
Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 4.16 Checking Common Power Source Block......................................140 4.17 Checking VCXO Block .......................145 4.18 Checking Front End Module Block.....150 4.19 Checking Front End Module Block input logic .................................151 4.20 Checking WCDMA Block ...................154 4.21 Checking GSM Block .........................169
2. PERFORMANCE...............................7
2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radio Performance ..................................9 2.4 Current Consumption.............................18 2.5 RSSI.......................................................18 2.6 Battery Bar .............................................18 2.7 Sound Pressure Level............................19 2.8 Charging ................................................20
5. DOWNLOAD .................................184
5.1 LGDP2 .................................................184 5.2 Download .............................................186
6. BLOCK DIAGRAM ........................188 7. Circuit Diagram ............................191 8. BGM Pin Map................................203 9. PCB LAYOUT ................................209 10. Calibration & RF Auto Test Program (Hot Kimchi)................219
10.1 General Description ...........................219 10.2 XCALMON Environment ....................219 10.3 Calibration Environment.....................220 10.4 Program Operation ............................221
3. TECHNICAL BRIEF ........................21

3.1 Digital Baseband(DBB) & Multimedia Processor...............................................21 3.2 GAM Hardware Subsystem ...................45 3.3 Audio Part ..............................................57 3.4 GPADC(General Purpose ADC) and AUTOADC2 ...........................................65 3.5 Charger control ......................................66 3.6 Voltage Regulation.................................72 3.7 RF Technical Description.......................73
4. TROUBLE SHOOTING ...................84

4.1 Power ON Trouble .................................84 4.2 USB Trouble ..........................................85 4.3 SIM Detect Trouble ................................86 4.4 MicroSD card Trouble ............................87 4.5 Keypad, Touch Button and Touch Screen Trouble ...........................88 4.6 Multi EL lighting Trouble ........................93 4.7 Camera Trouble .....................................97 4.8 Main LCD Trouble................................103 4.9 Keypad Backlight Trouble ....................105 4.10 Folder ON/OFF Trouble .....................107 4.11 Audio Trouble Shooting .....................109 4.12 Charger Trouble Shooting..................128 4.13 Checking Bluetooth Block ..................131 4.14 RF Component...................................138 4.15 Procedure to check ............................139
11. Stand-alone Test ........................226

11.1 General Description ...........................226 11.2 Program Operation ............................227 11.3 Stand-alone Test................................230
12. EXPLODED VIEW & REPLACEMENT PART LIST ......233

12.1 EXPLODED VIEW .............................233 12.2 Replacement Parts ............................235 12.3 Accessory ..........................................258
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.
Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item Shape Size Weight Power Talk Time Specification GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset 50.8X102.8X11.8 mm 116g (with standard battery) 800mAh Li-Ion Over 170 Min (WCDMA, Tx=12 dBm, Voice) Over 190 Min (GSM, Tx=Max, Voice) Standby Time Over 220 hrs (WCDMA, DRX=2.56) Over 220 hrs (GSM, Paging period=5) Antenna Main LCD Main LCD BL Vibrator Speaker MIC Receiver Earphone Jack SIM Socket Volume Key Voice Key External Memory I/O Connect Intenna type 2.4"(320x240), 260K TFT Color LCDs White LED Backlight Yes (Coin Type) Yes Yes (SMD Type) Yes Yes Yes(SIM Block Type) : 3.0V & 1.8V Push Type ( + , - ) Push Type T - Flash Socket 18 Pin
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2. PERFORMANCE
2.2 Usable environment

1) Environment
Item Voltage Operation Temp Storage Temp Humidity Specification 3.7 (Typ), 3.4 (Min), (Shut Down: 3.23) -20 ~ + 60 -30 ~ + 85 max. 85 Unit V C C %
2) Environment (Accessory)
Item Power
* CLA : 12~24V(DC).
Spec. Available power
Min 100
Typ. 220
Max 240
Unit Vac
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2. PERFORMANCE
2.3 Radio Performance

1) Transmitter-GSM Mode
No 1 Conducted Spurious Emission Item MS allocated Channel 1G~12.75GHz -33dBm GSM 100k~1GHz -39dBm DCS/PCS 9k~1GHz 1G~1710MHz 1710M~1785MHz -39dBm -33dBm -39dBm
1785M~12.75GHz -33dBm Idle Mode 100k~880MHz 880M~915MHz 915M~1000Mz 1G~1.71GHz -60dBm -62dBm -60dBm -50dBm 100k~880MHz 880M~915MHz 915M~1000MHz 1G~1.71GHz 1.71G~1.785GHz -60dBm -62dBm -60dBm -50dBm -56dBm
1.71G~1.785GHz -56dBm 1.785G~12.75GHz -50dBm Radiated Spurious Emission MS allocated Channel 1G~4GHz -30dBm 30M~1GHz -36dBm
1.785G~12.75GHz -50dBm 30M~1GHz 1G~1710MHz 1710M~1785MHz 1785M~4GHz -36dBm -30dBm -36dBm -30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm
Idle Mode
30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~1.71GHz
-57dBm -59dBm -57dBm -47dBm
30M~880MHz 880M~915MHz 915M~1GHz 1G 1.71GHz 1.71G~1.785GHz 1.785G~4GHz
1.71G~1.785GHz -53dBm 1.785G~4GHz -47dBm
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2. PERFORMANCE
No 2 3
Item Frequency Error Phase Error 0.1ppm 5(RMS) 20(PEAK)
GSM
DCS/PCS 0.1ppm 5(RMS) 20(PEAK) 3dB below reference sensitivity RA250: 250Hz HT100: 250Hz TU50: 150Hz TU1.5: 200Hz +0.5dB -30dB -33dB -60dB -66dB -69dB -71dB -77dB -19dB -21dB -21dB -24dB 400kHz 600kHz 1200kHz 1800kHz Frequency offset -22dB -24dB -24dB -27dB 800kHz 0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 6000kHz 6000kHz +0.5dB -30dB -33dB -60dB -60dB -65dB -73dB
Frequency Error Under Multipath and Interference Condition
3dB below reference sensitivity RA250 : 200Hz HT100 : 100Hz TU50 : 100Hz TU3 : 150Hz
Output RF Spectrum
Due to modulation
0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 3000kHz 3000 ~ 6000kHz 6000kHz
Due to Switching transient
400kHz 600kHz 1200kHz 1800kHz
Intermodulation attenuation
Intermodulation product should be Less than 55dB below the level of Wanted signal
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2. PERFORMANCE
No 8
Item Transmitter Output Power Level 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
GSM Power 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 Toler. 3 3 3 3 3 3 3 3 3 3 3 5 5 5 5 Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
DCS/PCS Power 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Toler. 3 3 3 3 3 3 3 3 3 4 4 4 4 4 5 5
Burst timing
Mask IN
Mask IN
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2. PERFORMANCE
2) Transmitter-WCDMA Mode
No 1 Item Maximum Output Power Specification Class 3 : +24dBm(+1/-3dB) Class4: +21dBm(2dB) 2 3 4 Frequency Error Open Loop Power control in uplink Inner Loop Power control in uplink 0.1ppm 9dB@normal, 12dB@extreme Adjust output(TPC command) cmd +1 0 -1 1dB +0.5/1.5 -0.5/+0.5 -0.5/-1.5 2dB +1/3 -0.5/+0.5 -1/-3 3dB +1.5/4.5 -0.5/+0.5 -1.5/-4.5
Group (10 equel command group) +1 5 6 Minimum Output Power +8/+12 +
-50dBm(3.84MHz)
Out-of-synchronization handling of output power Qin/Qout : PCCH quality levels Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB
7 8
Transmit OFF Power Transmit ON/OFF Time Mask
-56dBm(3.84MHz) 25us PRACH,CPCH,uplinlk compressed mode
Change of TFC
25us Power varies according to the data rate DTX : DPCH off (minimize interference between UE)
10 11 12
Power setting in uplink compressed Occupied Bandwidth(OBW) Spectrum emission Mask
3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz,1M -3910*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M
13
Adjacent Channel Leakage Ratio(ACLR)
33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm
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2. PERFORMANCE
No 14
Item Spurious Emissions (*: additional requirement)
Specification -36dBm@f=9~150KHz, 1K BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k -30dBm@f=1~12.75GHz, 1M -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k
15
Transmit Intermodulation
-31dBc@5MHz, Interferer -40dBc -41dBc@10MHz, Interferer -40dBc
16
Error Vector Magnitude (EVM)
17.5%(>-20dBm) (@12.2K, 1DPDCH+1DPCCH)
17
Transmit OFF Power
-15dB@SF=4, 768kbps, multi-code transmission
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2. PERFORMANCE
3)Receiver-GSM Mode
No 1 2 Item Sensitivity (TCH/FS Class II) Co-Channel Rejection (TCH/FS Class II, RBER, TU high/FH) 3 Adjacent Channel Rejection 4 400kHz C/Ia2=-44dB Wanted Signal: -98dBm 1st interferer: -44dBm 2st interferer: -45dBm 5 Blocking Response (TCH/FS Class II, RBER) Wanted Signal: -101dBm Unwanted Signal: Depend on freq. C/Ia2=-44dB Wanted Signal :-96dBm 1st 1st interferer: -44dBm 2st interferer: -44dBm Wanted Signal: -101dBm Unwanted Signal: Depend on freq. 200kHz C/Ia1=-12dB C/Ia1=-12dB GSM850/900 -105dBm C/Ic=7dB DCS & PCS -105dBm C/Ic=7dB
Intermodulation Rejection
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2. PERFORMANCE
4) Receiver-WCDMA Mode
No 1 2 Item Reference Sensitivity Level Maximum Input Level Specification -106.7dBm(3.84M) -25dBm(3.84MHz) -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3) 3 Adjacent Channel Selectivity (ACS) 33dB UE@+20dBm output power(class3) 4 In-band Blocking -56dBm/3.84MHz@10MHz UE@+20dBm output power(class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(class3) 5 Out-band Blocking -44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3) -30dBm/3.84MHz@f=2025~2050 & 2230~2255MHz, band a) UE@+20dBm output power(class3) -15dBm/3.84MHz@f=1~2025 & 2255~12500MHz, band a) UE@+20dBm output power(class3) 6 Spurious Response -44dBm CW UE@+20dBm output power(class3) 7 Intermodulation Characteristic -46dBm CW@10MHz & -46dBm/3.84MHz@20MHz UE@+20dBm output power(class3) -57dBm@f=9KHz~1GHz, 100k BW 8 Spurious Emissions -47dBm@f=1~12.75GHz, 1M -60dBm@f=1920~1980MHz, 3.84MHz -60dBm@f=2110~2170MHz, 3.84MHz
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2. PERFORMANCE
5) Transmitter
5.1 Transmitter
No 1 2 3 Out Power Power Density Power Control Item Specification Class 2 : -6~4dBm Power density < 20dBm per 100kHz EIRP Option 2dB step size 8dB 4 TX Output Spectrum -Frequency range fmax & fmin @ below the level of -30dBm (100khz BW) within 2.4GHz~2.4835GHz 5 6 TX Output Spectrum -20dB Bandwidth Tx Output Spectrum -Adjacent channel Po 1MHz -20dBm @ C/I = 2MHz -40dBm @ C/I 3MHz 7 Modulation Characteristics 140kHz delta f1 avg 175kHz delta f2max 115kHz at least 99.9% of all deltaf2max delta f2avg/deata f1avg 0.8 8 9 Init. Carrier Freq. Tolerance Carrier Frequency Drift 75KHz 1 slot : 25kHz 3 slot : 40kHz 5 slot : 40kHz Maximum drift rate 20KHz/50usec 10 Out of Band Spurious Emissions Freq.Range 30MHz~1GHz Above 1GHz~ 12.75GHz 1.8~1.9GHz 5.15~5.3GHz -47dBm -47dBm -47dBm -47dBm Operating -36dBm -30dBm Standby -57dBm -47dBm
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2. PERFORMANCE
5.2 Transmitter
No 1 2 3 Item Sensitivity single slot packets Sensitivity multi slot packets C/I performance Specification BER 0.1%@-70dBm BER 0.1%@-70dBm BER 0.1%@ (Low,Mid,High Frequency) 2405MHz, 2441MHz, 2477MHz Interference Co-Channel interference, C/I co-channel Adjacent(1MHz)interference, C/I 1MHz Adjacent(2MHz)interference, C/I 2MHz Adjacent( 3MHz)interference, C/I 3MHz Adjacent( 3MHz)interference to in band mirror frequency, C/I image 1MHz 4 Blocking Characteristic BER 0.1%@wanted signal -67dBm interfering Signal Frequency 30MHz~2000MHz 2000MHz~2400MHz 2500MHz~3000MHz 3000MHz~12.75GHz 5 Intermodluation Performance BER 0.1%@wanted signal -64dBm static sinwave signal at f1=-39dBm a BT modulated signal f2=-39dBm(payload PRBS15) 6 Maximum Input Level BER 0.1%@-20dBm PowerLevel -10dBm -27dBm -27dBm -10dBm Ratio 11dB 0dB -30dB -40dB -9dB -20dB
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2. PERFORMANCE
2.4 Current Consumption

(VT test : Speaker off, LCD backlight On) Stand by WCDMA Only 220 Hours = 3.6 mA (DRX=2.56) GSM 220 Hours = 3.6 mA (paging=5period) Voice Call 170 Min = 280 mA (Tx=12dBm) 190 Min = 250 mA (Tx=Max) VT 125 Min= 380 mA (Tx=12dBm)
2.5 RSSI
No 1 2 3 4 5 BAR 7 5 BAR 5 4 BAR 4 2 BAR 2 1 BAR 1 0 WCDMA -93 (+/- 2dB) -98 (+/- 2dB) -101 (+/- 2dB) -104 (+/- 2dB) -106 (+/- 2dB) GSM -90 (+/- 2dB) -104 (+/- 2dB) -108 (+/- 2dB) -110 (+/- 2dB) -112 (+/- 2dB)
2.6 Battery Bar

Indication Bar 3 2 Bar 2 1 Bar 1 Icon Blinking Low voltage, warning message Power OFF Standby 3.69 0.05V 3.53 0.05V 3.40 0.05V 3.40 0.05V 3.26 0.05V
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2. PERFORMANCE
2.7 Sound Pressure Level

No 1 Test Item Sending Loudness Rating (SLR) NOM MAX 2 Receiving Loudness Rating (RLR) NOM MAX 3 Side Tone Masking Rating (STMR) NOM MAX 4 5 6 7 Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) NOM MS MAX refer to TABLE 30.3 refer to TABLE 30.4 NOM MAX 8 Idle Noise-Receiving (INR) NOM MAX 9 Sending Loudness Rating (SLR) NOM MAX 10 Receiving Loudness Rating (RLR) NOM MAX 11 Side Tone Masking Rating (STMR) NOM MAX 12 13 14 15 Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) HEAD SET NOM MAX refer to TABLE 30.3 refer to TABLE 30.4 NOM MAX 16 Idle Noise-Receiving (INR) NOM MAX -45dBPA under -40dBPA under -55dBm0p under 40dB over -1 3dB -12 3dB 25dB over -47dBPA under -36dBPA under 8 3dB -64dBm0p under 40dB over -1 3dB -15 3dB 17dB over Specification 8 3 dB
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2. PERFORMANCE
No TDMA NOISE GSM: Power Level: 5
Test Item GSM MS DCS: Power Level: 0 DCS
Specification SEND REV. SEND REV. GSM Headset SEND REV. DCS SEND REV. -62dBm under
17
(Cell Power: -90 ~ -105dBm) Acoustic(Max Vol.) MS/HEADSET SLR: 8 3dB MS/HEADSET RLR: -13 1dB/-15dB (SLR/RLR: mid-Value Setting)
2.8 Charging
Normal mode: Complete Voltage: 4.2V Charging Current: 500mA Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level) Extend await mode: At Charging prohibited temperature(0C under or 45C over) (GSM: It should be kept 3.7V in all power level WCDMA: It will not be kept 3.7V in some power level)
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
Access subsystem - Access Central Processing Unit (CPU) subsystem - ARM926, Joint Test Action Group (JTAG), Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM - Access peripheral subsystems - Subscriber Identity Module (SIM) interface, IrDA, Universal Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on - Digital Signal Processor (DSP) subsystem - CEVA-X1620, JTAG, Static Random Access Memory (SRAM), and Program Data Read Only Memory (PDROM) - EDGE/GSM/GPRS (EGG) subsystem - EGG hardware accelerators - WCDMA subsystem - WCDMA hardware accelerators Application subsystem - Application CPU subsystem - containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM - Application peripheral subsystems - I2C, keypad, UART, and so on - Graphics subsystem - XGAM subsystem - Audio Processing Execution (APEX) and video encoder subsystems In addition to the two subsystems above, there is also a test block, chip control block, and a pad multiplexing block residing at the top level DSP - The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. - The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.
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3. TECHNICAL BRIEF
Multi-media Processor(MMIC : ZR3453X ) - The ZR3453X is an advanced multimedia coprocessor for cellular devices. ZR3453X is an MCP that includes a multimedia core and SDRAM memory chip. The multimedia core performs audio and video recording, playback, and editing; still image capture (DSC), viewing, and editing; MIDI/MP3 playback (for ring tones); 3D acceleration (for gaming). The memory chip in the MCP is a 16MB (2MB) mobile SDRAM (that can be enlarged by packaging to 64MB), used both for program code and for working data (both stream data and frame buffers). WCDMA subsystem - The digital baseband controller WCDMA subsystem incorporate a WCDMA modem - An interface to the WCMDA together with memory control and an internal single port RAM. The WCDMA subsystem has three AHB slave interfaces. - The Ericsson DB 3150 also includes HSDPA class 6 functionality. - The WCDMA subsystem is handled and provided by Ericsson. XGAM subsystem - The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. - The XGAM subsystem is handled and provided by Ericsson. Operation and Services - I2C Interface - SIM Interfaces - General Purpose I/O (GPIO) Interface - External Memory Interface that supports NAND, NOR, PSRAM, SDRAM - JTAG - RTC - ETM (in Prototype Package)
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3. TECHNICAL BRIEF
Headset <BT + FM Radio> <u- SD card> <VGA> CDI <LCD> PDI LED Key_IF Light Sensor From Zoran LCDIF SUB PMIC I2C_2 <Numeric Key> SD_IF Touch Button GPIO_I2C_2 Touch Panel GPIO_I2C_1 EL Controller GPIO_I2C_2 Accelerometer AB3000 Analog Baseband Processor (Power Management) BAT_IF < USB Transceiver > FM_ANT USB
18Pin Cradle Cradle 18Pin Connector Connector
Rem o c o n E ar j a c k U A RT U SB TV O u t 2.0HS
TV_Out <Battery>
EMIF2 EMIF1 Memory SDRAM (1G) NAND (2G) Application CPU DB3150 Digital Baseband Processor (Dual core) I2C_1 AB3000 Analog Baseband Process or ( Audio) PCM
<SIM> SIM_IF <Vibrator> Vibrator_IF(PWM) Amp
I2S_0 S PI USB I2S_1
<Spk>
Zoran_GPIO <Mic> Zoran_CDI
Access CPU
<5 Mega> ANT GSM/ EDGE PA + Ant Sw. RF3000 GSM / EDGE Transceiver RF3100 WCDMA Transceiver Zoran_I2C
< Zoran >

To EMP CAM IF
Figure 3-1-1 KF750 Block Diagram
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3. TECHNICAL BRIEF
3.1.2 External memory interface D evi ce P ar t N am e

area.
M aker
I t em
Ti me
Si ze
S peed
RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory
A. KF750
2Gb NAND flash memory +1G SDRAM
D evi ce
P ar t N am e M aker
P ar t N am e
I t em Ti me
M aker er
I t em
Ti me
Si ze
S pee eed
S i ze S peed Pr ogr am speed 200 s 1Pa ge=( 2K + 64)Byt es 10. 32M Byt e/ s
NAND f l ash KAL00900BM -DJ55 Sam sung Er ase speed 1. 5m s 1B l ock=( 128K+4K)Byt es 88M Byt e/ s
Figure 3-1-1 KF750 Block Diagram
Figure 3- 1- 2. External Memory Configuration of KF750
Data Communication - IrDA (SIR) - UARTs (ACB, EDB (RS232)) - Slave USB
Package - 12 by 12 mm 344 balls, 0.5mm pitch FPBGA Production Package
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3. TECHNICAL BRIEF
3.1.3 Hardware Architecture

A. Block Diagram
Figure 3-1-3. Access system of Ericsson DB3150
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3. TECHNICAL BRIEF
Figure 3-1-4. Application system of Ericsson DB3150
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3. TECHNICAL BRIEF
B. CPU Subsystem
Access CPU subsystem The digital baseband controller includes an access CPU subsystem, which includes the submodules described below. - 32 KiB I-cache - 16 KiB D-cache - Page table - Memory Management Unit (MMU) - JTAG - ETM9 - 26 KiB I-TCM - 8 KiB D-TCM Application CPU subsystem The digital baseband controller includes an Application CPU subsystem, which includes the submodules described below. - 32 KiB I-cache - 16 KiB D-cache - Page table - MMU - JTAG - ETM9 - 8 KiB I-TCM - 8 KiB D-TCM
C. Peripheral Hardware Subsystem

The digital baseband controller includes hardware that supports mobile terminal peripherals such as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the Peripheral subsystem. The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate bridges, which provide a simple interface to support different timing and memory access arrangements.
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3. TECHNICAL BRIEF
D. DSP Hardware Subsystem

The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.
E. XGAM Subsystem
The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. The XGAM subsystem is handled and provided by Ericsson.
F. System Control Subsystem

The SYSCON resides at the top level of the circuit architecture and is responsible for clock generation and clock and reset distribution within the digital baseband controller, as well as to external devices. The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON controls the fundamental modes of operation within the digital baseband controller. Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control registers.
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3. TECHNICAL BRIEF
3.1.4 RF Interface
A. Asta Interface
Asta controls GSM RF part using these signals through GSM RF chip-Gimli. RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB
RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB
Y4 AA2 Y3 Y2
QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR
Figure 3-1- 5. Schematic of Asta RF Interface
B. WCDMA Radio Link Interface

RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN
RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB Y4 AA2 Y3 Y2 AB8 V7 AB5 AB6 Y10 W10 W9 Y9 Y8 W8 W7 QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR WTX_BAND_1_EN
TP300
RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN ADC_I_NEG ADC_I_POS ADC_Q_NEG ADC_Q_POS DAC_I_NEG DAC_I_POS
WDCDC_EN WPOW_DET_EN WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P WTX_I_N WTX_I_P
Figure 3-1-6. Schematic of WCDMA RF Interface
- 29 -
3. TECHNICAL BRIEF
3.1.5 SIM Interface

SIM interface scheme is shown in Figure3-1-6. SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(Asta) with ABB(Veronica) and filter.
SIM (Interface between DBB and ABB) SIMDAT0 SIMCLK0 SIMRST0 SIM card bidirectional data line SIM card reference clock SIM card async/sync reset Table 3-1-2. SIM Interface
Asta
VDD E 10K
SIMVCC Veronica 10K VDD SDAT SCLK SRST SIMDAT SIMCLK SIMRST DAT CLK RST CARD
SIMDAT0 SIMCLK0 SIMRST0
Figure 3-1-7. SIM Interface
3.1.6 UART Interface

UART signals are connected to Asta GPIO through IO connector Resource Name UART0 ACC_GPIO_2 ACC_GPIO_3 ACC_UART_RX ACC_UART_TX UART1 APP_GPIO_0 APP_GPIO_1 APP_UART_RX APP_UART_TX Table 3-1-3. UART Interface APP Receive Data APP Transmit Data ACC Receive Data ACC Transmit Data Note
- 30 -
3. TECHNICAL BRIEF
3.1.7 GPIO (General Purpose Input/Output) map

In total 39 allowable resources. This model is using 39 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table. DB3150's GPIO ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_6 ACC_GPIO_7 ACC_GPIO_8 ACC_GPIO_9 ACC_GPIO_10 ACC_GPIO_11 ACC_GPIO_12 ACC_GPIO_13 ACC_GPIO_14 ACC_GPIO_15 ACC_GPIO_16 ACC_GPIO_17 ACC_GPIO_18 ACC_GPIO_19 ACC_GPIO_20 ACC_GPIO_21 ACC_GPIO_22 ACC_GPIO_23 GPIO Mapping ACC_GP00_USB_STP ACC_GP01_USB_DIR ACC_GP02_UART0_RX ACC_GP03_UART0_TX ACC_GP04_USB_CLK ACC_GP05_USB_NXT ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7 ACC_GP12_TOUCH_LDO_EN ACC_GP13_SPK_AMP_EN ACC_GP14_BT_SPI_INT ACC_GP15_FLIPSENSE ACC_GP16_FM_GPIO2 ACC_GP17_PHFSENSE ACC_GP20_USB_CS_PD ACC_GP21_VC_IO_OFF ACC_GP22_USB_DAT3 ACC_GP23_BT_SPI_CS0n ACC_GP24_BT_SPI_DAT0 ACC_GP25_BT_SPI_DAT1 ACC_GP26_BT_SPI_CLK ACC_GP27_AMP_SW_EN Init Status Output low input input Output input input input / Output input / Output input / Output input / Output Output low Output low Input Input Input Input input / Output Output low input / Output Output Output low Input Output low Output low
Table 3-1-4. Asta ACC GPIO Map Table
- 31 -
3. TECHNICAL BRIEF
DB3150's GPIO APP_GPIO_0 APP_GPIO_1 APP_GPIO_2 APP_GPIO_3 APP_GPIO_4 APP_GPIO_5 APP_GPIO_6 APP_GPIO_7 APP_GPIO_8 APP_GPIO_9 APP_GPIO_10 APP_GPIO_11 APP_GPIO_12 APP_GPIO_13 APP_GPIO_14
GPIO Mapping APP_GP00_UART_RX APP_GP01_UART_TX APP_GP02_MMP_INT_n APP_GP03_MMP_PWR_EN APP_GP04_TOUCH_SCREEN_INT APP_GP05_TOUCH_SCREEN_SCL MICROSD_DAT3 APP_GP07_3AXIS_INT APP_GP10_MMP_RESET_N APP_GP11_REMOTE_INT APP_GP12_LCD_ID APP_GP13_MC_CLKRET SUB_PM_RESETB MOTOR_EN APP_GP16_TOUCH_SCREEN_SDA Table 3-1-5. Asta APP GPIO Map Table
Init Status Input Output Input Output low Input Output Input Input Output low Input Input Input Output low Output low input / Output
DB3150's GPIO GPIO_0 GPIO_1 GPIO_2 GPIO_3 GPIO_4 GPIO_5 GPIO_6 GPIO_7 GPIO_8 GPIO_9
GPIO Mapping CI_VSYNC_WITHOUT_FF APP_GP05_TOUCH_RESET CI_VSYNC
Init Status Output low Output low Output low
MMP_CAM_RESET_N MMP_CAM_PWR_EN MMP_CAM_PWDN FLASH_LED_EN FLASH_LED_TORCH FLASH_LED_INH Table 3-1-5. MMIC APP GPIO Map Table
Output low Output low Output low Output low Output low Output low
- 32 -
3. TECHNICAL BRIEF
3.1.8 USB
The USB block supports the implementation of a High-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention. The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO register access. The USB block can request up to six DMA channels, three for IN endpoints and three for OUT endpoints.
USB Function USB_STP USB_DIR USB_CLK USB_NXT USB_DAT0 USB_DAT1 USB_DAT2 USB_DAT3 USB_DAT4 USB_DAT5 USB_DAT6 USB_DAT7 USB_CS_PD VBUS
Note ULPI stop signal ULPI direction signal USB clock ULPI next signal USB data0 USB data1 USB data2 USB data3 USB data4 USB data5 USB data6 USB data7 USB chip select Power supply for Asta USB block Table 3-1-6. USB Signal Interface of Asta
- 33 -
3. TECHNICAL BRIEF
A CC_GP00_USB _STP A CC_GP01_USB _DIR A CC_GP02_UA RT0_RX A CC_GP03_UA RT0_TX A CC_GP04_USB _CL K A CC_GP05_USB _NXT A CC_GP06_USB _DA T4 A CC_GP07_USB _DA T5 A CC_GP10_USB _DA T6 A CC_GP11_USB _DA T7
J9 K9 P2 N9 M9 N4 P3 P4 R4 R3 R2
A CC_GPIO_0 A CC_GPIO_1 A CC_GPIO_2 A CC_GPIO_3 A CC_GPIO_4 A CC_GPIO_5 A CC_GPIO_6 A CC_GPIO_7 A CC_GPIO_8 A CC_GPIO_9
USB_DAT1 USB_DAT0 USB_DAT2
L4 USB_DAT_VP L3 USB_SE0_VM M4 USB_OE
Figure 3-1-8. Schematic of Asta USB block
VBAT
VDDE_1V8
C600 0.1u 0603
C601 4.7u 10V
VCC F3 NC2 F2 NC1 F1
ACC_GP20_USB_CS_PD ACC_GP04_USB_CLK USB_DAT0 USB_DAT1 USB_DAT2 ACC_GP22_USB_DAT3 ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7 ACC_GP05_USB_NXT ACC_GP00_USB_STP ACC_GP01_USB_DIR 51K
GND3 E4 GND2 D2 GND1 C5
C3 A4 B1 A1 A2 A3 A5 A6 B6 C6 D5 D6 E5 E1 E6 0.1u 4.7u
TEST CHIP_SEL VCC_IO1 CLOCK DATA0 VCC_IO2 RREF DATA1 DATA2 DM U601 DP DATA3 DATA4 ISP1508AET FAULT ID DATA5 CFG2 DATA6 CFG1 DATA7 NXT PSW_N VBUS STP REG3V3 DIR CFG0 XTAL1 REF1V8 XTAL2
C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 R606 1% 12K 0.1u 0.1u 4.7u 2.2u
R603
USB_DM USB_DP
R605
1K
VBUS_USB_TRX USB_XTAL1
C602
C606
C604
C603
USB Transceiver for High Speed
Figure 3-1-9. Schematic of USB Transceiver
- 34 -
C605
0603
0603
0603
C607
3. TECHNICAL BRIEF
3.1.9 Slider ON/OFF Detection

There is a magnet to detect the slide module status, up or down. If a magnet is close to the hall-effect switch U101, the voltage at Pin 4 of U101 goes to 0V. Otherwise 1.8V. This SLIDE_DET signal is delivered to Asta ACC_GP15_FLIPSENSE.
SLIDE DETECT
VDDG_2V75 U101 1 2 C109 0.1u 3 VDD GND1 NC TK 60012B M5 6 IO_VDD GND2 OUT 5 4 A CC_GP15_FL IPSENSE VDDE_1V8
C112 0.1u
Figure 3-1-10. Slider On/Off Detector
- 35 -
3. TECHNICAL BRIEF
3.1.10 Bluetooth Interface

KF750 supports Bluetooth operation using STLC2593C Bluetooth module.
A. General Description
The Bluetooth interface utilizes the SPI interface for control signals going to and from the Bluetooth module. The SPI is also used for data transmissions. It uses the PCM interface for transmitting audio to and from the Bluetooth module. The Bluetooth module uses both the 26 MHz master clock signal and the 32,768 kHz low-frequency clock signal for internal timing within the Bluetooth module. The intention is to use the low-frequency clock as a low-power timing provider and to use the 26 MHz as a high precision timing reference used mainly by the Bluetooth radio during operation. The clock request mechanism is used to minimize current consumption for the total system. The intention is to use the CLKREQ signal to ask for the master clock when needed, for example, when the Bluetooth radio is operating.
B. SPI Interface
The physical SPI interface is made up of 5 signals : clock, chip select, data in, data out and interrupt. When the SPI mode is selected , these signals are available through the BT_UART and BT_HOST_WAKEUP pins. The SPI interface is Master at the Host side, and Slave at the BT Controller side. It is designed to work with the H4 protocol. It does not support HCI synchronous data packet transfer. Data are transferred on the SPI interface in byte format, LSB first. The SPI interface can operate only in half duplex mode.
C. PCM Interface
The PCM interface is used to send audio to and from the Bluetooth module. The interface is a synchronous interface using a PCM clock and a PCM sync signal for synchronization. Two data signals are used for data, one in each direction. The PCM clock signal operates at frequencies as high as 1 MHz. The word length of the audio data can be 8 or 16 bits. Furthermore, the PCM interface has a function known as MP-PCM, which is an addressing scheme, used to have more than two devices talking on the bus. To add this function, the data pins have to be bi-directional. Additionally, the position of the audio data relative to the frame sync pulse must be selectable. During the periods within a frame that a device is not transmitting audio data, it must put both PCM data signals in a high-impedance state to allow other devices access.
- 36 -
3. TECHNICAL BRIEF
D. Master Clock and Clock Request Interface

The master clock (MCLK) is a 26 MHz signal used as the high precision clock signal for the Bluetooth module. The signal can be switched on and off by the platform. The master clock request (CLKREQ) is used by the Bluetooth module to ask for the master clock. If the Bluetooth module asserts the signal high, it gets the master clock. The other alternative for the Bluetooth module is to set the clock request output to high impedance state, indicating that it does not need the master clock. The Bluetooth module receives the master clock, if other parts of the chipset request it.
E. Low Frequency Clock Interface

The low-frequency clock signal (RTCCLK) is used by the Bluetooth module as a low-power clock. The clock is used in different Bluetooth modes, like sniff and park, to have a correct timing on the Bluetooth air interface without having the master clock running. The low-frequency clock is always present, in some applications even when the chipset is powered down.
F. STLC2593C
WFBGA 5.0 x 7.5 x 0.8 mm lead-free/RoHs compliant 100 pins External component: B-BPF (Bluetooth) PCB footprint < 45mm2 Based on Ericsson Technology Licensing Baseband Core (EBC) Bluetooth specification compliance: V2.0 + EDR. - Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability - Support ACL and SCO links - Extended SCO (eSCO) links - Faster Connection HW support for packet types - ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5 - SCO: HV1, HV3 and DV - eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5 - Adaptive Frequency Hopping (AFH) Transmit Power - Power Class 2 and Power Class 1.5 (above 4dBm) - Programmable output power - Power Class 1 compatible
- 37 -
3. TECHNICAL BRIEF
HCI - HCI H4 Transport Layer - HCI proprietary commands (e.g. peripherals control) - Single HCI command for patch/upgrade download Supports Pitch-Period Error Concealment (PPEC) Efficient and flexible support for WLAN coexistence in collocated scenario Low power consumption - Ultra low power architecture with 3 different low-power levels - Deep Sleep modes, including Host power saving feature - Dual Wake-up mechanism: initiated by the Host or by the Bluetooth device Communication interfaces - Fast UART up to 4Mbit/s - SPI interface - PCM interface - Up to 10 additional flexibly programmable GPIOs - External interrupts possible through the GPIOs - Fast master I2C interface Clock support - System clock input (digital or sine wave) at9.6, 10, 13, 16, 16.8, 19.2, 26, 33.6 or 38.4MHz - Low Power clock input at 32.768 kHz ARM7TDMI CPU Memory organization - On chip RAM, including provision for patches - On chip ROM, preloaded with SW up to HCI Ciphering support up to 128 bits key Single power supply with internal regulators for core voltage generation Supports 1.65 to 2.85 Volts IO systems Auto calibration (VCO, Filters)
- 38 -
3. TECHNICAL BRIEF
G. KF750 Bluetooth Schematic

TP801
U801
R803 B T_CL K 0 C800 DNI C801 DNI A CC_GP25_B T_SPI_DA T1 A CC_GP26_B T_SPI_CL K A CC_PCM_SYNC A CC_PCM_CL K A CC_PCM_DL D A CC_PCM_UL D
TP809TP810TP811TP812
STL C2593
B T_CL K _REQ_OUT_1 J7 G7 B T_UA RT_TXD J6 B T_UA RT_RTS K1 B T_RFP J1 B T_RFN B T_VIO_A B T_VIO_B B T_VIO_C B T_VIO_D B T_VIO_E B T_VSSDIG1 B T_VSSDIG2 B T_VSSDIG3 B T_VSSDIG4 B T_VSSDIG5 B T_VSSA NA 1 B T_VSSA NA 2 B T_VSSA NA 3 B T_VSSA NA 4 B T_VSSA NA 5 B T_VSSA NA 6 B T_VSSA NA 7 B T_VSSA NA 8 B T_VSSA NA 9 B T_VSSA NA 10 B T_VSSA NA 11 B T_VSSA NA 12 B T_VSSRF1 B T_VSSRF2 B T_VSSRF3 B T_VSSRF4 M6 J9 N3 N5 G8 H6 H7 H8 K8 L8 D1 D2 E3 F1 F2 F3 F4 G1 G3 G4 H3 H4 H1 L1 J2 K2
A CC_GP24_B T_SPI_DA T0 A CC_GP23_B T_SPI_CS0n 1nH C803
RESOUT2_n RTCCL K
K7 B T_RESETN F6 B T_REF_CL K _IN K9 B T_L P_CL K L9 B T_WA K EUP
FL 800 5 4 VDDE_1V8 B P1 B P2
DEA 212450B T-7043C1 3.9n H C802 1 U_B P B P_DC 2 L 800 3.3n H
OUT801
OUT802 1.2p L 801
OUT803
N4 B T_PCM_SYNC M4 B T_PCM_CL K K5 B T_PCM_A M5 B T_PCM_B M3 B T_GPIO_9 K3 B T_GPIO_11 K4 B T_GPIO_10 J3 B T_GPIO_16 L3 B T_GPIO_8 G9 B T_GPIO_0 E7 B T_CL K _REQ_IN_1 F9 B T_CL K _REQ_IN_2 E8 B T_HOST_WA K EUP L7 B T_CONFIG_1 M7 B T_CONFIG_2 N6 B T_CONFIG_3
FB 800 60
6 3
H9 B T_UA RT_RXD K6 B T_UA RT_CTS
G2 G1
VSS_B T_RF
VSS_B T_RF
VSS_B T_RF
C804 0.1u
VDDE_1V8 A CC_GP14_B T_SPI_INT
VDDK _2V75 VSS_B T_A NA
B T_CL K REQ_n VDDK _2V75
J8
B T_CL K _REQ_OUT_2
DO NOT CHA NGE
R807
B2 B T_RSVR_CL 1 C3 B T_RSVR_CL 2 M8 B T_RSVR_D C1 B T_RSVR_DSM C2 B T_RSVR_N M2 B T_RSVR_RF J4 B T_REG_CTRL N7 B T_HVD E6 B T_VDD_CL D 0.1u 0.1u
VSS_B T_RF
L2 B T_HVA 1 D3 B T_HVA 2 E1 B T_HVA 3 E2 B T_HVA 4 E4 B T_HVA 5 H2 B T_TEST1 G2 B T_TEST2 G6 B T_A F_PRG
C808 0.1u VDDE_1V8
VDDE_1V8
VB A T C809 C810
R808
100K
D4 F7 F8 L4 L5 L6
NC1 NC2 NC3 NC4 NC5 NC6
VSS_B T_A NA C5 FM_ROUT B5 FM_L OUT D6 FM_VIO D8 FM_SDIO FM_GND1 FM_GND2 FM_GND3 FM_GND4 FM_GND5 FM_GND6 FM_GND7 FM_GND8 FM_RFGND A3 B4 B6 B7 C4 C6 C7 D5 C8 C811 C812 1u 1u FM_RP FM_L P
A PP_I2C_SDA C813 0.1u
A CC_GP16_FM_GPIO2 VDDE_1V8 RESOUT1_n

TP814
A PP_I2C_SCL RTCCL K 22n 22n 10p
A4 B3 A7 A6 A5 B8 C9 D7 D9 E9
FM_VA FM_VD FM_GPIO1 FM_GPIO2 FM_GPIO3 FM_FMIP FM_RSTB FM_RCL K FM_SENB FM_SCL K
C814
C815
C816
C817 120p
FM_A NT
B l u et o o t h (+FM Rad i o )
Figure 3-1-11. Schematic of STLC2593C Clock - Clock request Connected to CLKREQ of Asta and Veronica, input to Gimly - Fast clock : 26MHz Supplied MCLK from Gimly Frequency deviation : 20ppm - Low power clock : 32.768kHz Supplied RTCCLK from Veronica Power - Supplied 2.75V, 1.8V from internal regulators of Veronica Reset - RESOUT2_n signal of Asta controls STLC2593C reset. SPI - Connected to SPI of Asta - HCI interface between Asta and STLC2593C PCM - Audio signal interface between Asta/Veronica and STLC2593C ANT - 2.4GHz, 50 ohm matching
- 39 -
3. TECHNICAL BRIEF
3.1.11 MicroSD Interface card

KF750 supports the MicroSD card interface as external memory card. MicroSD card has 4-data line, so KF750 uses 4-data line. All control and data line is connected to Asta. Cause of the difference between Asta and MicroSD card, a level shifter should be added. MicroSD card Interface MICROSD_CMD MICROSD_CLK MICROSD_DAT VDDG_2V75 Command/Response Clock Data line Supply voltage from Veronica internal LDO Table 3-1-7. MicroSD card Interface Card detection - When there are no card in MicroSD card socket, REAL_MICROSD_DAT3 pin is high cause of an internal pull-up. - If Card is inserted in socket, The pull up can be disconnected by using SET_CLR_DETECT command. - VDDG_2V75 always supply power.
VDDE_1V8
VDDG_2V75
2 4 6 8
2 4 6 8
U900 A5 C5 B2 C1 A2 B4 A4 B5 B1 A3 A1 B3 C3 C9 0 1 0.1u VCCA DA T0_DIR DA T0A DA T123_DIR DA T1A D A T2A DA T3A CMD_DIR CMDA CL K A CL K _F GND1 GND2
SN74A VCA 406EZXYR D5 VCCB DA T0B DA T1B DA T2B DA T3B D2 D1 C4 D4
MICROSD_DA T0 MICROSD_DA T_DIR MICROSD_DA T1 MICROSD_DA T2 MICROSD_DA T3 MICROSD_CMD_DIR MICROSD_CMD MICROSD_CL K A PP_GP13_MC_CL K RET R907 470K
100K R916
100K
RA1
1 3 5 7
RA2
1 3 5 7
100K
REA L _MICROSD_DA T0 REA L _MICROSD_DA T1 REA L _MICROSD_DA T2 REA L _MICROSD_DA T3
CMDB CL K B
C2 D3 C903 0.1u R941
REA L _MICROSD_CMD REA L _MICROSD_CL K DNI
Figure 3-1-12. MicroSD card and Schematic of MicroSD card Interface
- 40 -
3. TECHNICAL BRIEF
3.1.1 Power On Sequence

User presses END key and then ONSWAn signal is changed to Low. Veronica initiates the internal oscillator and powers on the regulators. Veronica generates a power for Asta. Veronica releases the power reset signal(PWRRSTn) and generates an interrupt(IRQ0n) to Asta.
Veronica Power for Asta Press END key PWRRST ONSWAn ONSWA IRQ IRQ0n PWRRSTn
Asta
RESPOW_N IRQ0_N
Figure 3-1-13. Power On Sequence
- 41 -
3. TECHNICAL BRIEF
3.1.13 KeyPad, Touch button and Touch screen

There are 21 buttons and 5 side keys and touch button in Figure 2-1-13/14. Shows the Keypad circuit. END Key is connected ONSWAn for Veronica. When Touch button and Touch screen is touched, Interrupt is given to Asta than, she read the status register what button is touched by I2C. I2C is realize by Asta GPIO.
KEYIN0 KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 VOLUME1 1 4 7 *
KEYIN1 VOLUME2 2 5 8 0
KEYIN2
KEYIN3
KEYIN4
KEYIN5
3 6 9 #
MULTI CAMAF CAMSHOT HOME
SEND CLR
OK
Table 3-1-8. Key Matrix Mapping Table
VDDE_1V8
1 SW1101
K EYOUT2 RA 101
NUMB ER_K EY
K EYOUT3
3
2 4 6 8
1 3 5 7
10K
101
1
102
2
103 K EYIN3
3
K EYOUT1 104
4
105
5
106 MUL TI
6
K EYOUT2 107
7
108
8
109
9
K EYOUT3 HOT101 K EYIN0 K EYOUT4 K EYIN1 K EYIN2

HOT4
K EYOUT1 HOME
110
0
HOT102
HOT5
K EYOUT4
K EYIN3 K EYIN3
SEND
OK END
K EYOUT1 CL R
ONSWA _n
V A 900
D900
K EYOUT2
RB 521S-30
ONSWA _n
ICVS0514X350FR
KEYOUT0 KEYIN0 KEYIN1
CN703 1 2 3 4
K EYIN4 K EYIN5
ON_SW K EY
10K 10K R900 R901
VDDE_1V8
Figure 3-1-14. KEY CIRCUIT
- 42 -
3. TECHNICAL BRIEF
TOUCH_3.1V
17 1 2 3 4 5 6 7 15
CN901
18 14 R905 R906 R907 13 12 TOUCH_SCREEN_INT 11 TOUCH_SCREEN_SCL 10 TOUCH_SCREEN_SDA 9 8 16 4.7K 4.7K DNI
I2C interface
Figure 3-1-15. Touch button and Touch screen connector
- 43 -
3. TECHNICAL BRIEF
3.1.14 Multi EL lighting

There are 13 EL lighting channel. Each lighting channel is operated independently. EL controller(U901) control AC generator and EL driver(U900). AC generator generate 190V AC signal. And this 190V AC signal is switched by EL driver. Through EL driver, AC signal of the each lighting channel is switched independently. Finally, switched AC signal illuminate EL sheet.
VREG_6.1V
R909
C902 2.2u
0 L900 100uH R910 C903 470pF R913 D901 RF051VA2S
TOUCH_3.1V
D1 D2 D3 D4 D5
Q900 SIA450DJ
S1 S2
C904 0.1u
R912 100K
100K
10M
C905 150p
C906 0.1u
TP902
TOUCH_3.1V 33 32 31 30 29 28 27 26 25 33 25 23 18 16 13 VSS1 P0_3 P0_5 P0_7 VDD P0_6 P0_4 P0_2 GND SLUG NC5 NC4 NC3 NC2 NC1
U900 HV509 BP HVGND HVOUT16 HVOUT15 HVOUT14 HVOUT13 HVOUT12 HVOUT11 HVOUT10 HVOUT9 HVOUT8 HVOUT7 HVOUT6 HVOUT5 HVOUT4 HVOUT3 HVOUT2 HVOUT1 28 27 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12
TP903
1 2 3 4 5 6 7 8
P0_1 P2_7 P2_5 P2_3 P2_1 P3_3 P3_1 P1_7
U901 CY8C21434
P0_0 P2_6 P2_4 P2_2 P2_0 P3_2 P3_0 XREX
24 23 22 21 20 19 18 17
BP HV_OUT_14 HV_OUT_13 HV_OUT_12 HV_OUT_11 HV_OUT_10 HV_OUT_9 HV_OUT_8 HV_OUT_7 HV_OUT_6 HV_OUT_5 HV_OUT_4 HV_OUT_3 HV_OUT_2
21 _POL 22 _LE 15 GND 24 TOUCH_RST

TP905 TP906 TP907
DOUT
9 10 11 12 13 14 15 16
P1_5 P1_3 P1_1 VSS2 P1_0 P1_2 P1_4 P1_6
19 CLK TOUCH_BUTTON_SCL TOUCH_BUTTON_SDA TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA 17 DIN 20 VDD
I2C
C907 0.1u 56K
EL controller
AC generator
EL driver
EL lighing channel output (connected with EL sheet)
Figure 3-1-16. Multi EL lighting
- 44 -
R915
ISSP
14 VPP 26 VBIAS
3. TECHNICAL BRIEF
3.2 GAM Hardware Subsystem
Figure 3-2-1. GAM Subsystem Functional Block Diagram

The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of visual imagery and the transfer of this data to the display. GAM also provides support for the camera module. The visual data could be graphics, still images or video. The GAM subsystem consists of five modules: GRAM : graphics memory (160 kB). GAMCON : GAM controller. GRAPHCON : graphics controller. PDI/SSI : programmable display interface for parallel/serial displays. CDI : camera data interface.
- 45 -
3. TECHNICAL BRIEF
3.2.2 Block Description

A. GAM Controller(GAMCON)
The GAM Controller (GAMCON) is responsible for clock gating and distribution within the GAM module. GAMCON receives the HCLK from SYSCON and distributes to GRAPHCON, GRAM, PDI and CDI. GAMCON also distributes the GAM reset signal to GRAPHCON, GRAM, PDI and CDI. The reset signals CIRES_N and PDIRES_N are distributed from GAMCON to the camera and display module respectively, see Figure 2.28. The CIPCLK is used to clock the received data into the camera data interface. The CIPCLK can be in the range of 100 kHz to 16 MHz.
B. Graphics RAM (GRAM) Block

GAM includes 160 kB of graphics memory (GRAM) in order to support display screen sizes of QCIF + alfa display size and three frame buffers when decoding QCIF video. The GRAM can be accessed in 8, 16 or 32-bit mode. Write access takes a single AHB clock cycle. Non-sequential read and the first access of a sequential read access takes two AHB clock cycles. Subsequent sequential read access take a single AHB clock cycle. The GRAM contains both frame buffer and temporary data. There are three image areas with one used for normal MMI graphics and the other two areas used for still images, video frames or camera frames. The three image areas can be combined into one frame buffer. GRAM is required to transfer a VGA (640 by 480 pixels) image from the camera data interface (CDI) over DMA at 100 MBit/s, within a 50 ms timeframe. The GRAM is used as a buffer, but the average transfer bandwidth required is approximately 3 Mword/s (32-bit word), that is 12 MByte/s.
C. Graphics Controller (GRAPHCON) Block

GRAPHCON is controlled by the application CPU and can perform operations on pixels and image areas. Images can be moved and merged with other images and text. The GRAPHCON block receives graphical objects from GRAM and performers the appropriate graphical manipulation. The resulting data is transfers to the display interface (PDI). GRAPHCON can receive images from the camera data interface (CDI) and send them to the PDI automatically. GRAPHCON performs conversion from YUV to RGB and can scale (zoom) still or video images.
D. Programmable Display Interface (PDI) Block

The programmable display interface (PDI) is designed to interface both parallel and serial display modules. The display data is transferred from the 32 word FIFO on GAMCON to the display module via the PDI block. The PDI block is built around a micro controller and executes 16-bit instruction words to individually control the I/O ports. It has a 128 byte program memory, programmable by the CPU, which can store up to 64 instructions.
- 46 -
3. TECHNICAL BRIEF
The CPU transfers all set-up and control data to the display. Data is transferred to PDI as 32- bit words, which in turn writes 8-bit data to the display. The programmable PDI block is configured at the software build stage, to support either parallel interface such as PPI or serial interface such as SSI or I2C.
E. Camera Data Interface (CDI) Block

The camera data interface (CDI) block is designed to support a range of still image camera modules. An 8-bit parallel bus supports data transfer from the camera module to the CDI. The pixel clock is an output clock from the camera module to the CDI and qualifies the data on the parallel bus. One byte of data is captured on each rising edge of the pixel clock. CDI allows the pixel clock to be in the range of 100 kHz to 16 MHz. The horizontal synchronization line is an input from the camera module and defines one scanline of image data. The horizontal synchronization line can be programmed to be active high or low. The vertical synchronization line is an input from the camera module and defines one image frame (image height) of data. The vertical synchronization line can be programmed to be active high or low. The frame rate can be adjusted by skipping frames and various interrupts are used to inform the application CPU regarding the progress of incoming images and potential errors. The normal data format on the data bus is YUV 4:2:2 (raw binary image data) according to the CCIR-656 standard. A function within the CDI can be programmed to reorder the YUV parameters as they pass through the CDI. In addition, the CDI is able to detect the end of an image and perform some truncation as well as overflow conditions. There is nothing preventing the use of other data types such as JPEG or RGB (as long as the timing is followed), but only YUV data can be sent to the display. Camera images can also be sent to a DMA channel to store the image in external memory. The I2C interface and GPIO are part of the interface to the camera module, but they are not part of the CDI block. The I2C is used to set-up and control the camera module. The camera module I2C lines must go high impedance when the supply is removed from the camera. The I2C commands needed to control the camera, as well as the functional behavior of the module, are also different for each implementation. The ON-signal (GPIO) is used to power-on the camera from Standby or Off mode (implementation dependent). This signal must be held low when the mobile equipment is powered down and during the mobile equipment reset period. The GPIO pin can also be an input or high impedance during mobile equipment reset and start. In this case, it must have pull-down to ground. The camera module reset signal is an output to the camera module.
- 47 -
3. TECHNICAL BRIEF
3.2.3 Camera & Camera Interface

E20 CI_RES_N F20 CI_PCLK E19 CI_VSYNC F18 CI_HSYNC
F19 G21 F21 G20 H21 G19 G22 H22
VMCL K VPCL K VHREF VVS VIDA VIDB VIDC VIDD VIDE VIDF VIDG VIDH VIDI VIDJ VIDK VIDL VIDM VIDN VIDO VIDP
P12 P10 M12 K 12 P8 N8 P9 M10 N10 N9 N11 P11 N12 N7 L8 P13 L9 N13 M11 M9
MMP_CA M_MCL K MMP_CA M_PCL K MMP_CA M_HSYNC MMP_CA M_VSYNC
CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7
CI_RES_n CI_PCLK CI_VSYNC CI_HSYNC
MMP_CA M_DA TA [ 0] MMP_CA M_DA TA [ 1] MMP_CA M_DA TA [ 2] MMP_CA M_DA TA [ 3] MMP_CA M_DA TA [ 4] MMP_CA M_DA TA [ 5] MMP_CA M_DA TA [ 6] MMP_CA M_DA TA [ 7] MMP_CA M_DA TA [ 8] MMP_CA M_DA TA [ 9] MMP_CA M_DA TA [ 10] MMP_CA M_DA TA [ 11]
VGA Camera
5 Mega Camera
Figure 3-2-2. Camera Interface (DB3150 and Zoran)
5M CAMERA INTERFACE
CAM_AVDD_2.8V
CAM_VDD_1.8V
CAM_VDD_AF_2.8V
FL700 ICVE10184E070R100FR MMP_CAM_DATA[8] MMP_CAM_DATA[9] MMP_CAM_DATA[10] MMP_CAM_DATA[11]

9 8 7 6 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 1 2 3 4
5M_CAM_DATA[8] 5M_CAM_DATA[9] 5M_CAM_DATA[10] 5M_CAM_DATA[11]
CN701 R702 MMP_CAM_MCLK MMP_CAM_PCLK R703 10 33 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VA701 VA702 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 VA700
10

5M_CAM_DATA[0] 5M_CAM_DATA[1] 5M_CAM_DATA[2] 5M_CAM_DATA[3] 5M_CAM_DATA[4] 5M_CAM_DATA[5] 5M_CAM_DATA[6] 5M_CAM_DATA[7] 5M_CAM_DATA[8] 5M_CAM_DATA[9] 5M_CAM_DATA[10] 5M_CAM_DATA[11]
FB700
C701 0.1u 0603
C704 0.1u 0603
C702 0.1u 0603
C703 1u
C700 10u
MMP_CAM_RESET_N 10 R704 R705 0603 10 0603 R706 10 R707 0603 10 0603 MMP_I2C_SDA MMP_I2C_SCL MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_PWDN
Active High
10
C710
ICVL0518100Y500FR
ICVL0518100Y500FR
MMP_CAM_DATA[3] MMP_CAM_DATA[2] MMP_CAM_DATA[1] MMP_CAM_DATA[0]
9 8 7 6
INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1
1 2 3 4
C705 C706 DNI DNI
ICVL0518100Y500FR
C707 0.1u 103 00 p 061 3p0603 0603 10p 06 10 03 p 06
10
Figure 3-2-3. 5M Camera Connector(34Pin - Main Board)
- 48 -
C708
C709
C711
FL702 ICVE10184E070R100FR
3. TECHNICAL BRIEF
VGA_VDD_2.8V VGA_VDD_1.8V
C102 0.1u
AXK720147G
ACC_GP21_VC_IO_OFF SYSCLK0 CI_PCLK CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 GC 1N104 1 2 3 4 5 6 7 8 9 10 G3 G2 20 19 18 17 16 15 14 13 12 11 G4
C103 0.1u
CI_RES_n APP_I2C_SCL APP_I2C_SDA CI_HSYNC CI_VSYNC CI_D7 CI_D6
ENBY0019501
C1006 0.1u
Figure 3-2-5. VGA LCD FPCB Connector
- 49 -
3. TECHNICAL BRIEF
The 5M Camera modules are connected to 34-pin main board and VGA Camera module is connected to LCD FPCB with 20-pin Board to Board through 70 pin Board to Board connector. VGA interface is dedicated camera interface port in DB3150, but 5 Mega camera is connected to MMIC (Multi-media IC). 5 mega camera supply 24MHz master clock to camera module and receive 80MHz pixel clock(30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module. The camera module is controlled by I2C port. VGA camera port supply 24MHz master clock to camera module and receive 32.2MHz pixel clock(15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module. The camera module is controlled by I2C port.
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Symbol MMP_CAM_MCLK GND MMP_CAM_PCLK GND 5M_CAM_DATA[0] 5M_CAM_DATA[1] 5M_CAM_DATA[2] 5M_CAM_DATA[3] 5M_CAM_DATA[4] 5M_CAM_DATA[5] 5M_CAM_DATA[6] 5M_CAM_DATA[7] 5M_CAM_DATA[8] 5M_CAM_DATA[9] 5M_CAM_DATA[10] 5M_CAM_DATA[11] GND
Symbol CAM_AVDD_2.8V GND CAM_VDD_1.8V CAM_VDD_1.8V GND MMP_CAM_RESET_N GND MMP_I2C_SDA MMP_I2C_SCL GND MMP_CAM_VSYNC MMP_CAM_HSYNC GND MMP_CAM_PWDN GND CAM_VDD_AF_2.8V GND 1
Pin 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 8
Table 3-2-1. Interface between Main board and 5M camera
- 50 -
3. TECHNICAL BRIEF
Pin 1 2 3 4 5 6 7 8 9 10
Symbol ACC_GP21_VC_IO_OFF SYSCLK0 GND CI_PCLK CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5
Symbol VGA_VDD_2.8V VGA_VDD_1.8V CI_RES_n APP_I2C_SCL APP_I2C_SDA VGA_VDD_1.8V CI_HSYNC CI_VSYNC CI_D7 CI_D6
Pin 20 19 18 17 16 15 14 13 12 11
Table 3-2-2. Interface between VGA Camera Module
- 51 -
3. TECHNICAL BRIEF
3.2.4 Camera Regulator

MMP_CAM_PWR_EN enables 1.8V & 2.8V Camera Regulator for 5M Camera. (2.8V for analog and AF, 1.8V for I/O, 1.5V for digital)
5M CAMERA POWER
VBAT CAM_VDD_AF_2.8V CAM_VDD_1.8V VBAT CAM_AVDD_2.8V
PGND
MMP_CAM_PWR_EN 1u
1u
1u
C720
C721
1u
C723
Figure 3-2-6. 1.8V and 2.8V Camera Regulator
SUB PMIC gives power to VGA camera. It controlled by I2C (VGA : 2.8V for analog, 1.8V for I/O, digital)
VB A T
R930
C915 2.2u
C916 10u
VDDE_1V8 C917 C918 0.1u R942 DNI C919 C920 1u 1u 1u
B5 F4 E1 A5 A4 B6 C6 C5 D6 E6
VB A TCP VB A T1 VB A TL DO C3P C3N C2P C2N C1P C1N VIO RESETB SDA SCL CPGND SGND L EDGND
VOUT L ED1 L ED2 L ED3 L ED4 L ED5 L EDFL SB IA S SSENS GC1 GC2
B4 D2 C2 C1 B1 B2 A2 F5 F3 E4 E3 SB IA S SENS GA IN1 GA IN2
WL ED_PWR WL ED1 WL ED2 WL ED3 WL ED4 WL ED5
U903 B D6095GUL
C724
VGA Camera POWER

RB 521CS-30 R934 0 R935 0 VGA _VDD_2.8V RB 521CS-30
SUB _PM_RESETB SUB _PM_SDA SUB _PM_SCL
0 0 0
R931 R932 R933
C4 D4 D5 A3 E5 B3
T1 T2 T3 T4
L DO1O L DO2O WPWMIN FL A SHCNT
F2 E2 D1 D3
TP915
VGA _VDD_1.8V
L CD_PWM C921 C922 1u 1u
Figure 3-2-7. VGA Camera LDO in SUB PMIC
A1 A6 F6 F1
- 52 -
C722
1u
U703 1 VIN 2 EN1 3 EN2 4 NC1
RT9011-MGPQW 8 VOUT1 7 VOUT2 6 NC2 5 GND
U702 R1114D281D-TR-F 3 VDD VOUT GND1 GND2 2 5
MMP_CAM_PWR_EN
4 NC 6 CE
3. TECHNICAL BRIEF
3.2.5 Display & LCD FPC Interface

LCD module include device in table 3-2 Type Main LCD Main LCD Backlight Device 240 x RGB x 320 262K Color TFT LCD 5 White LEDs Table 3-2-3. Device in LCD Module LCD Module is connected to multi Key PCB with 37-pin Connector in sub PCB. The LCD is controlled by 8-bit PDI(Parallel Data Interface) in DB3150.
L CD L DO
VDDE_1V8 VDD_L CD_2.6V VA905 ICVN0505X150FR VA906 ICVN0505X150FR
R902
C900 0.1u
4.7K
C901 0.1u
L CD_PWM
L CD_VSYNC L CD_RD_N L CD_WE_N_OUT L CD_A DS_N_OUT L CD_CS_N_OUT
L CD_DA TA [ 7] _OUT L CD_DA TA [ 6] _OUT L CD_DA TA [ 5] _OUT L CD_DA TA [ 4] _OUT L CD_DA TA [ 3] _OUT L CD_DA TA [ 2] _OUT L CD_DA TA [ 1] _OUT L CD_DA TA [ 0] _OUT A PP_GP12_L CD_ID
R904
51K
Table 3-2-4. LCD module Connector
C908
0.1u
L CD_RESET_N_OUT WL ED5 WL ED4 WL ED3 WL ED2 WL ED1 WL ED_PWR
CN900 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37
- 53 -
3. TECHNICAL BRIEF
3.2.6 LCD Module Block diagram
Figure 3-2-9. LCD Module Block diagram
- 54 -
3. TECHNICAL BRIEF
3.2.7 LCD Backlight Illumination

There are 5 white LEDs in LCD Backlight circuit which is driven SUB PMIC(BD6095).I2C is used for Backlight brightness control.
L CD B A CK L IGHT
VB A T
R930 0
C915 2.2u
C916 10u
B5 F4 E1 A5 A4 B6 C6 C5 D6 E6
U903 B D6095GUL
0 0 0
R931 R932 R933
C4 D4 D5 A3 E5 B3
RB 521CS-30
R934 0 R935 0
VGA _VDD_2.8V
T1 T2 T3 T4
F2 E2 D1 D3
RB 521CS-30
TP915
VGA _VDD_1.8V
Figure 3-2-10. SUB PMIC Circuit LCD Backlight
3.2.8 Keypad Illumination

There are 2 WHITE LEDs in Main board backlight circuit, which are driven by LEDC port in ABB (Veronica) and light guide is used for luminance Uniformity
A1 A6 F6 F1
VBAT
L D101 1
R101 K EY_L ED1 100o h m R102 K EY_L ED2 100o h m RSB6.8CST2R RSB6.8CST2R ZD102
A C SSC-SWTS1007 L D102 1 2 A C SSC-SWTS1007
Figure 3-2-11. Keypad Backlight LED Interface and Backlight Circuit
ZD101
- 55 -
3. TECHNICAL BRIEF
3.2.9 Three-axis-accelerometer
The SMB380 is a triaxial low-g acceleration sensor IC with digital output for motion applications. It allows measurements of acceleration in perpendicular axes as well as absolute temperature measurement. If Motion is detected, then interrupt is issued to CPU and CPU read its motion value by I2C(SMB_SDA,SMB_SCL) interface.
VDDH_SMB _2V75
VDDE_1V8
R911
DNI R909
R910
U901 1 2 3 4 5 R912 C905 22n NC1 VDD GND INT CSB
B MA 150 NC2 VDDIO SDI SDO SCK 10 9 8 7 6
DNI
APP_GP07_3AXIS_INT
11 NOT1 12 NOT2
SMB _SDA SMB _SCL
390
0.1u C904
- 56 -
3. TECHNICAL BRIEF
3.3 Audio Part

3.3.1 Audio Part Block Diagram
Figure 3-3-1. Audio Part Block Diagram
3.3.2 Audio Signal Processing & Interface

Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (Asta). This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip. The downlink path amplifies the signal from DBB chip (Asta) and outputs it to Receiver (or Speaker). The audio interface consists of PCM encoding and decoding circuitry, microphone amplifiers and earphone drivers. The PCM encoder and decoder blocks are two-channel, 16-bit circuits with programmable gain amplifiers (PGA). The decoder has a receive volume control. The audio inputs and outputs can be switched to normal or auxiliary ports.
- 57 -
3. TECHNICAL BRIEF
Figure 3-3-2. Audio Interface Detailed Diagram(Veronica)
R888 DNI
RB521S-30
D502
C514 10u B1 D1 C518 0.1u 0603 10V SIMVCC
C515 0.1u 0603
C516 10u
CCO2
U803 R1114D181D 3 VDD VOUT GND1 GND2 2 5
R818 2.2K C818 1u
FB604
4 NC 6 CE
VSSBUCK PBIAS
R507 Local Ground Plane 0 0603
C819 2.2u
SIMVCC
F1
Use Multiple Vias
R607
J2 SIMRST_N H5 SIMCLK SIMDAT H2
SIMRST_n SIMCLK SIMDAT

TP502 TP503 TP504 TP505
C520 1u Close to AB
HOOK 47K C608 10n 0603
D4 SCK1 D3 WS1 C2 SDI1 C1 SDO1 E4 SCK2 C3 WS2 D2 SDI2 F4 SDO2 MIC1P MIC1N MIC2P MIC2N MIC3P MIC3N MIC4P MIC4N K8 J8 L8 M9 M10 H8 K9 L9
C609
0.1u 0603 0.1u 0603 FB603
FB605
I2S0_CLK I2S0_WS I2S0_ULD I2S0_DLD I2S1_CLK I2S1_WS I2S1_ULD I2S1_DLD MIC1P MIC1N MIC2P MIC2N FM_RP FM_LP
MIC2P C610 MIC2N TV_OUT MIDR R610 R612 470 1% 470 1% PULL-UP REMOVED 2007.10.01
TP508 TP509
C613 EAR_L C614 EAR_R
100u
FL601 1 2 3 4 IN1 NC1 NC2 IN2
PGND
100u
NUF2114MN 8 OUT1 7 NC4 6 NC3 5 OUT2
FB600
R816
47
FB601
R817
47
C523
1u
CCO1 CCO2 SPKRP SPKRN BEARP BEARN AUXO1 AUXO2 LINEIN1 LINEIN2 MIDR
M7 K7 M2 M3 M4 J6 K6 M6 L1 0 K10 L5 47 n C527 22p C529 22p C530 22p C528 22p
CCO1 CCO2 SPKRP SPKRN BEARP BEARN EAR_R EAR_L
Speaker Amp.
VBAT
MIDR R517 1% 39K C525 2.2u BEARP C1 ACC_GP13_SPK_AMP_EN C531 SPKRP C532 SPKRN 47n 47n 1 % 10K R50 26 00 3 C2 1 % 10K R50 26 10 3 C3 100K 220n B1 BYPASS _SHUTDOWN IN+ INU500 GND VOVO+ VDD B2 A1 B3 4 A3 BEARN R519 1% 15 2 3 R518 1% 15 10 1 U501 FSA2268TUMX 8 1A 1B0 1B1 2B0 2B1 GND S1 2A S2 VCC 7 5 VBAT 6 9 C535 10 n 0603 SPK_RCVSPK_RCV+
J5 C524 DEC3 J4 DEC4
SWBOOST BOOST_ISENSE+ BOOST_ISENSEV_BOOST BOOST_SW1 BOOST_SW2 BOOST_SW3 BOOST_FB+ VSSBOOST
A4 B5 C5 B3 C4 B4 A3 D5 E5
TPA6205A1ZQVR
R522
0603
C536
ACC_GP27_AMP_SW_EN R524 1% 39K R525 47K 0603
Figure 3-3-3 . Audio Section scheme
- 58 -
C522
1u
3. TECHNICAL BRIEF
3.3.3 Audio Mode

Audio Mode includes three states.( Voice call, Midi.MP3). Each states is sorted by the total 7 Modes according to external Devices (Receiver,Loud Speaker,Headset). Video Telephony Mode Operate on state of the WCDMA CALL.
Mode Receiver Mode Loud Sp eaker Mode Voice ca ll Headset Mod e Vid eo Teleph on y Mod e MIDI MP3 Headse t Mode Only Lo ud Speaker Loud Speaker Mode
Veron ica In /Out Port IN MIC1P/MIC1N MIC1P/MIC1N MIC2P/MIC2N MIC1P/MIC1N OUT BEARP/BEARN SPKRP/SPKRN AUXO1/AUXO2 SPKRP/SPKRN SPKRP/SPKRN SPKR/SPKN AUXO1/AUXO2
Table 3-3-1. Audio Mode
- 59 -
3. TECHNICAL BRIEF
3.3.4 Voice Call

A. Voice call Downlink Mode(Receiver, Speaker, Headset)
This section provides a detailed description of the Voice Call RX functions.
Figure 3-3-4. Voice call Downlink Scheme
The voice decoder accepts a serial input stream of linear PCM coded speech. The receive bandpass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path. The final step in the receive path is the auxiliary output. The auxiliary audio amplifier is intended to drive low impedance headphones. The earphone amplifier and the auxiliary audio outputs can be powered down (muted) via I2C. Both the earphone driver and one of the auxiliary drivers can simultaneously provide an output signal during voice decoding. Receiver Mode : BEARP/N Port Receiver(32) Loud Speaker / Video Telephony Mode : Veronica SPK Amp SPKR/N AUDIO AMP(TPA6205) Speaker(8) Headset Mode : Auxiliary audio amplifier AUXO1/2 AUDIO AMP(TPA4411) Head Phone
- 60 -
3. TECHNICAL BRIEF
B. Voice Call Uplink Mode (Receiver,Speaker,Headset)

This section provides a detailed description of the Voice Call TX functions.
Figure 3-3-5. Voice call Uplink Scheme
From the audio path view point, voice call has the same structure as video telephony. The TXMIX connection enables insertion of audio into the uplink audio path. This can, for example, be used to play dictation recordings for the listener at the other party, in a voice call or video telephony call. The connection to TXMIX from the Audio Mixer must be performed in 8 kHz mono, since this is supported by the Voice mode. Due to performance reasons it may not be possible to decode every audio format during video telephony. Each Voice Uplink Mode paths shown below. Receiver Mode : C-MIC(SP0102BE3) Veronica Input(MIC1N/1P) Loud Speaker Mode : C-MIC(SP0102BE3) Veronica Input(MIC1N/1P) Video Telephony Mode : C-MIC(SP0102BE3) Veronica Input(MIC1N/1P) Headset Mode : Headset MIC Veronica Input(AUXI1N/1P) When the headset is inserted, EAR_DETECT_n(Circuit Diagram net Name) converted into low state So, the headset icon is displayed on Main LCD.
- 61 -
3. TECHNICAL BRIEF
3.3.5 MIDI (Ring Tone Play)

This section provides a detailed description of the MIDI and WAV-file functions.
Figure 3-3-6. External MIDI path
In Figure 2-4-6, External MIDI path is the same as Voice Loudspeaker downlink Mode, except source in Asta (DSP and Audio Mixer). MIDI : Asta PCM Decoder Auxiliary audio amplifier SPKRP/N Port AUDIO AMP(TPA6205) Speaker(8)
- 62 -
3. TECHNICAL BRIEF
3.3.6 MP3 (Audio Player)

This section provides a detailed description of the MP3 file functions.
Figure 3-3-7. MP3 Scheme
MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used as a audio amp and one speaker.
- 63 -
3. TECHNICAL BRIEF
3.3.7 Video Telephony

This section provides a description of the Video Telephony functions.
Figure 3-3-8. Video Telephony Scheme
Video Telephony Mode has same paths with Loud Speaker Mode.
3.3.8 Audio Main Component

There are 4 components in KF750 schematic Diagram. Part Number marked on KF750 Schematic Diagram.
NO 1 2 3 4
ITEM Speaker/Receiver MIC Audio AMP Ear-Jack SET
PART NUMBER BRS201417SL08-P SP0102BE3 TPA6205A/TPA4411 SGEY0005527 Sisonic TI
MAKER
I - sound
Table 3-3-2. Audio Component List
- 64 -
3. TECHNICAL BRIEF
3.4 GPADC(General Purpose ADC) and AUTOADC2

The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention. The AUTOADC2 periodically measures the battery voltage or current. (Fig.3-41) shows the schematic of GPADC part. The GPADC channel spec is as following (Table 3-4-1).
Fig 3-4-1. Schematic of GPADC and AUTOADC2
Fig 3-4-2. GPADC and AUTOADC2 Block diagram
ADC 6 channels Resource GPA0 GPA2 GPA3 GPA4 GPA6 GPA7 Name RTEMP VLOOP WPOWERSENSE WRFLOOP GPA6 VBACKUP Description Radio temperature sense Loop voltage sense Reference voltage for PAM Lock inform Headset detect Backup battery
Table 3-4-1. GPADC channel spec
- 65 -
3. TECHNICAL BRIEF
3.5 Charger control

A programmable charger in AB3000 is used for battery charging. It is possible to set limits for the output voltage at CHSENSE- and the output current from DCIO via the sense resistor to CHSENSE-. The voltage at CHSENSE- and the current feed to CHSENSE- cannot be measured directly by the GPADC. Instead, the two measuring amplifiers translate these inputs to a voltage proportional to the input and within the range of the GPADC. (Fig.3-5-1) shows the schematic of charging control part.
300K
X500 2 1 32.768KHz C512 24p
K12 XTAL1 K11 XTAL2 C513 24p RTCCLK J12 32KHZ
VBAT R506 Close to Pin 1 KDS221E_RTK
C1
A2
TP501 D501 SRST_n SCLK SDAT
A1_C2 3
G10 SIMOFF_N K2 SRST_N J3 SCLK K3 SDAT H4
BDATA FGSENSE+
CN500 1
33u
G1
G2
Battery Conn.
R508 0603 2012 1% 1/4W
G12 C519 47p Close to AB G11
C517
Phone ground return path
R509 Close to Pin 3 0.025 R511 0603 0
route as a differential pair
VBAT
FGSENSE-
R512
H1 E1
VBAT_D CHSENSE+
BATT_GND 2012 1% 1/4W Q501 SIA911DJ

G1 S1 D1
R513 0.1
F2
CHSENSE-
E2
CHREG
D3
DCIN_A
D4
R514 47K DCIN F3 J1 DCIO VBUS
D2
G2 S2
VBUS
Fig. 3-5-1. Battery charging circuit
Fig. 3-5-2. Battery charging block diagram
Name CHSENSE+ CHSENSE-
Type Analog Analog
Unused VBAT VBAT
Description Current sensing input positive Current sensing input negative
Table 3-5-1. Charger Control channel spec
- 66 -
3. TECHNICAL BRIEF
3.5.1 Fuel Gauge

AB3000 supports the measurement of the current consumption/charging current in the U8100 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity. The function of the fuel gauge block is schematically described in (Fig.3-5-3). A sense resistor R_FGSENSE is connected in series with the battery. The voltage across the resistor, equivalent to the current entering/leaving the battery, is integrated using an ADC block.
Fig. 3-5-3. The analog front-end of the fuel gauge block
Fig. 3-5-4 The Schematic of the fuel gauge block
Name FGSENSE+ FGSENSE-
Type Analog Analog
Unused VBAT VBAT
Description Fuel gauge current sensing input positive Fuel gauge current sensing input negative
Table 3-5-2. Fuel Gauge channel spec
- 67 -
3. TECHNICAL BRIEF
3.5.2 Battery Temperature Measurement

The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. (Fig.3-5-5) shows the schematic of battery temperature measurement part.
300K
X500 2 1 32.768KHz C512 24p
Close to Pin 1 KDS221E_RTK
R506
C1
A2
A1_C2 3
BDATA
Fig 3-5-5. Battery Temperature Measurement
Name BDATA
Type Digital Input/Output
Unused Unconnected
Description current output
Table 3-5-3 BDATA channel spec
- 68 -
3. TECHNICAL BRIEF
3.5.3 Charging Part

The charging block in AB3000 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. (Fig.3-5-6) shows the schematic of charging part.
1/4W 0.025 Close to AB R511 0603 VBAT 0 G11 FGSENSE-
return path
R512
H1 E1
VBAT_D CHSENSE+

G1 S1 D1
R513 0.1
F2
CHSENSE-
E2
CHREG
D3
DCIN_A
D4
D2
G2 S2
VBUS
Fig. 3-5-6. Charging Part
When VBAT is below a certain value, 3.2V, a current generator take care of initial charging of the CHSENSE+ node and internal trickle charge signal is active. This part of the charging block is powered on and active when DCIO is asserted. The DCIO signal is asserted when its voltage is above the voltage at VBAT. As soon as generator is turned off and all parts of the charging block are functional and active. Battery block indication as shown in (Fig.3-5-7)
4.2 ~3.88 (V) 100~66 (%)
3.87 ~3.81 (V) 65~44 (%)
3.80 ~3.74 (V) 43~25 (%)
3.73 ~3.59 (V) 24~3 (%)
3.58 ~3.20 (V) 2~0 (%)
Fig. 3-5-7 Battery Block Indication
- 69 -
3. TECHNICAL BRIEF
Trickle charging
When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA.
Parameter Trickle current
Min 30
Typ 50
Max 60
Unit mA
Table. 3-5-4. Trickle charging spec
Normal charging
When the VBAT voltage is within limits or the internal regulators are turned on, the current source for trickle charging is turned off and all parts of the charging block are active. The charging method is CCCV. (Constant Current Constant Voltage) This charging method is used for Lithium chemistry battery packs. The CCCV method regulates the charge current and the VBAT voltage. This charging method prevents the battery voltage to go above the charge set in the CCCV algorithm. (Fig.3-5-8) shows the charging voltage(a) and charging current change(b).
(a) Charging voltage
(b) Charging current
Fig 3-5-5. Battery Temperature Measurement
- 70 -
3. TECHNICAL BRIEF
Charging Method : CCCV (Constant Current Constant Voltage) Maximum Charging Voltage : 4.2V Maximum Charging Current : 700mA Nominal Battery Capacity : 860 mAh Charger Voltage : 4.8V Charging time : Max 3.5h Full charge indication current (icon stop current) : 80mA Low battery POP UP : Idle - 3.52V, Dedicated - 3.48V Low battery alarm interval : Idle - 3 min, Dedicated - 1 min Cut-off voltage : WCDMA call - 3.1V, ELSE - 3.2V
Charging of Extended Temperature

When the battery temperature is outside the normal charging specification, the battery voltage, VBAT, is maintained at 3.7V. Under 0 C : Extended temperature From 0 C to 45 C : Normal charging temperature Over 45 C : Extended temperature
- 71 -
3. TECHNICAL BRIEF
3.6 Voltage Regulation

The LDO regulators and the BUCK converter generate a range of programmable voltages, each optimized for its load. When the analog baseband controller boots up or down, internal signals activate or deactivate the LDO regulators and the BUCK converter. In active mode, the LDO regulators and the BUCK converter are activated and deactivated through I2C. The low power regulator is on all the time and has extremely low power consumption with limited output current. It provides power for the 32 kHz oscillator and the real-time clock (RTC).
LDO ABB_LDO a (VDD_A) ABB_LDO c (VDD_C) ABB_LDO d (VDD_D) ABB_LDO e (VDD_E) ABB_LDO f (VDD_F) ABB_LDO g (VDD_G) ABB_LDO h (VDD_H) ABB_LDO k (VDD_K) ABB_LDO LP (VDDLP) ABB_BUCK (VBUCK) ABB_SIM LDO (SIMVCC)
Net Name VRADA_2V8 VDDC_2V65 VDDD_1V5 VDIGRAD_1V8 VDDE_1V8 VDDF_2V5 VDDG_2V75 VDDH_SMB_2V75 VDDK_2V75 VBACKUP VCORE SIMVCC
Output Voltage 2.8V 2.65V 1.5V 1.8V 1.8V 2.5V 2.75V 2.75V 2.75V 1.5V 1.2V 2.85V
Output Current 150mA 200mA 200mA 200mA 200mA 30mA 100mA 100mA 200mA 6.5mA 600mA 50mA
Usage RF3000 and RF3100 analog Hall Sw itch, Audio Amp AB3000 CODECs/ ADC/ PLL RF3000 and RF3100 digital All I/ O Supplies and Memory DB3150 Analog SD card and LCD 3 Axis Accelerator Bluetooth RTC module DB3150 Core SIM card
Table. 3-6-1. LDO and Buck
- 72 -
3. TECHNICAL BRIEF
3.7 RF Technical Description

The RF platform of KF750 supports two different communication modes (WCDMA/GSM modes) including four communication bands (WCDMA2100/GSM900/GSM1800/GSM1900). The all the RF blocks can be divided into three main parts, which are a WCDMA part, a GSM, and a RF front-end. Different from other general solutions, the RF front-end of KF750 consists of an antenna switch and an EDGE power amplifier module (PAM). The simplified block diagram is shown in Figure 3-7-1.
Figure 3-7-1. Block diagram of RF part
- 73 -
3. TECHNICAL BRIEF
3.7.2 WCDMA Part

The W-CDMA transceiver uses differential analog in-phase and quadrature-phase interfaces, that is an IQ-interface, both in the receiver and transmitter information path. The transceiver has the following general features: Power class : Power class 3 (+24dBm) in Band I Zero-IF Receiver.No IF filter needed Direct IQ modulation transmitter
Figure 3-7-2. WCDMA RF structure
A. Transmitter Part
The W-CDMA transmitter architecture is an on frequency linear direct up-conversion IQ-modulator. The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to RF output frequency and is designed to achieve LO and image suppression. The in-phase and quadraturephase reconstruction filters are fully integrated and a programmable gain amplifier implements the gain control. The transmit output stage provides at least +5 dBm at maximum power control at the singleended 50 output. Gain is set through the 3-wire bus. An external SAW filter between the WCDMA circuit and the power amplifier is used to improve noise performance. Two 10-bit DACs are used to control the DC/DC converter and the PA gain. After the power amplifier, the signal is sent through an isolator and through the duplex filter, which directs the transmit signal to the antenna connector through the antenna switch. The supply voltage and bias of the power amplifier are adapted depending on the output power to achieve high efficiency at every transmitter power level. A high efficiency DC/DC converter regulates the supply voltage and the bias operation point is controlled by a D/Aconverter in the W-CDMA radio circuit. These DACs are controlled through the 3-wire-bus
- 74 -
3. TECHNICAL BRIEF
Figure 3-7-3. WCDMA Transceiver Architecture
B. Receiver Part
The W-CDMA receiver architecture is a direct down-conversion Zero Intermediate Frequency (ZIF) receiver with integrated low-pass channel filter, i.e. the front-end receiver converts the aerial RF signal from W-CMDA band I down to a ZIF. The first stage consists of one single-ended low noise amplifier (LNA) with a 16 dB gain step. This LNA is followed through an external filter by an IQ down-mixer which consists of a mixer in parallel driven by quadrature out-of-phase LO signals. The In phase (I) and Quadrature phase (Q) ZIF signal are then low pass filtered to provide protection from high frequency offset interferer fed into the channel filter. The front-end zero IF I and Q outputs are applied to the integrated low-pass channel filter with a provision for 4 x 8 dB gain steps in front of the filter. The filter is a self-calibrated 6 pole, 2 zero filter with a cut-off frequency around 2.15 MHz and a second order group delay compensation (2 poles, 2 zeroes). Once filtered, the zero IF I and Q signals are further amplified with provision of 31 x 1 dB steps and DC offset compensation. The zero IF output buffer provides close rail-to-rail outputs signal.
- 75 -
3. TECHNICAL BRIEF
C. Synthesizer
The RX and TX RF VCOs are fully integrated and self-calibrated on manufacturing tolerances. They have 16 different frequency ranges that are selected internally depending on the frequency programming. The calibration is done on each low to high logical transition of the SYNON bit in the control register or on each change of the integer divider ratio of the RF fractional N synthesizer. A high-performance RF fractional-N synthesizer PLL is included on-chip which enables the frequency of the RF VCO to be synthesized. The frequency is set through the 3-wire serial programming bus. The PLL is based on Sigma-Delta (.) fractional-N synthesis that enables the required channel frequency, including Automatic Frequency Control (AFC) from a free running external 26 MHz reference frequency. Very low close-in-phase noise is achieved. This allows widening of the PLL loop bandwidth and shorter settling time. The programmable main dividers are controlled by a second order -modulus controller. They divide the RF VCO signals down to frequencies of 26 MHz (12 Hz step programmability). Their phase is then compared in a digital Phase/Frequency Detector (PFD) to the 26 MHz reference clock signal. The phase error information is fed back to the RF VCO through the charge pump circuit that .sources. into or .sinks. current from the loop filter capacitor, thus changing the VCO frequency such that the loop finally gets phase-locked.
C217 DNI FL 200 4 5

O2 G2
C216 56p SA FEB 2G14FA 0F00 3 2 VRA DA _2V8
WTXMOD_B A ND_I
1 4 SA FEB 1G95K A 0F00 3 FL 201 C220 DNI
G2 G1 IN OUT G3
C218 56p VRA DA _2V8
C221 DNI
L203 5.6nH
O1 G1
5 2
IN
C222 DNI
VRA DA _2V8
WPA _B IA S WPA _VCC
41 40 39 38 37 36 35 34 33 32 31
VDIGRA D_1V8
VRA DA _2V8
C223 DNI
VGACTL DATA CLK EN REFIN NC4 RXIA RXIB RXQA RXQB
WTX_I_P WTX_I_N WTX_Q_P WTX_Q_N

TP200 TP201 TP202 TP203
1 2 3 4 5 6 7 8 9 10
PGND VCCTX RF_DAC2 RF_DAC1 NC13 MIX1_B MIX1_A NC12 NC11 NC10 VCCRX
GNDTX NC1 NC 2 TX_1 NC 3 VCCL OTX TXIA TXIB TXQA TXQB
U203
RF3100_OM6195HN
NC9 L NA 1_OUT NC8 L NA 1_IN NC7 NC6 VCCL ORX NC5 VDD TST
30 29 28 27 26 25 24 23 22 21 C227 D NI C228 DNI
C224
5.6p
C225 WRX_B A ND_1 56p L 204 4.7n H
TP204
11 12 13 14 15 16 17 18 19 20
R 205 WRX_Q_N RF_CTRL _DA TA RF_CTRL _CL K 2 20 RF_CTRL _STRB WCL K C229 8.2p R207 WRX_I_N 220 R208 WRX_I_P 220 220 R206 WRX_Q_P
Figure 3-7-4. WCDMA Transceiver schematic
- 76 -
3. TECHNICAL BRIEF
D. Power Amplifier Module

The SKY77174 Power Amplifier module is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 1920-1980 MHz bandwidth into a single compact package.
Figure 3-7-5. SKY77174 Functional Block Diagram
VCC_PA
C200 0.01u WTX_B A ND_1_EN WPA _B IA S C206 22p C204 10p C203 1000p U200 1 2 3 C207 WTXMOD_B A ND_I 56p GND2 C210 DNI C209 DNI 5 VB IA S GND1 4 VCC1 ENA B L E VCONTROL RF_IN SK Y77174 PGND VCC2 GND3 RF_OUT 11 10 9 8 7 6 8.2n H L 202 C211 DNI L 200 1n H 1 2 3 L DC181G9519B -327 N200 IN GND1 M_OUT GND2 6 5 4 IS200 CES201G95DCB 000 GND1 GND2 OUT IN GND3 GND4 WTX_B A ND_1
C205 1000p
C_OUT TERMINA TE
C213 DNI WPOW_SENSE
Figure 3-7-6. WCDMA PAM schematic
47
VB A T
R200
- 77 -
3. TECHNICAL BRIEF
3.7.3 EDGE/GPRS/GSM RF block

The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data. The receive interface is based on I and Q data and the transmitter interface is based on envelop and frequency data. The quad band EDGE/GSM/GPRS transceiver has the following general features: Power class GMSK low bands: Class 4 (33 dBm) GMSK high bands: Class 1 (30 dBm) 8PSK low bands: Class E2 (27 dBm) 8PSK high bands: Class E2 (26 dBm) Multi slot class 12 (4+4=5) Dual Transfer Mode (DTM) class 9 (3+2=5) Zero-IF receiver Polar modulation transmitter
Figure 3-7-7. GSM Transceiver Architecture
- 78 -
3. TECHNICAL BRIEF
A. Transmitter Part
Polar modulation transmitter architecture based on the direct phase/frequency modulation/synthesizer architecture is implemented for GSM, GPRS and EDGE. This architecture has the capability of generating both the GSM/GPRS constant envelope GMSK modulation and the linear EDGE 8-PSK modulation in a very cost efficient way. The motivation for a polar modulation transmitter architecture compared to traditionally linear architectures is to reduce the output noise (thus eliminating the need for off-chip filters) reduce the power consumption by utilizing non-linear switching analog signal processing blocks, and to eliminate the need for an RF isolator. The transmitter block consists of several sub-blocks: A separate block is used to convert the digital bit streams from the baseband into parallel words to be used in the DACs and the Sigma Delta modulator. The combined DAC and LP-filter is used to convert the digital words of the digital block into analog signals. The second FM-path is used to add the high frequency part of the FM to the VCO. It also includes an auto-tuning block that compensates VCO gain variations. In the Sigma Delta modulator block, the phase/frequency modulator in this polar modulation architecture is a sigma-delta controlled fractional-N frequency synthesizer with an additional frequency insertion point after the loop filter at the input of the VCO. In addition, The TX-buffer is used to drive the PA with the correct power level. A divide by 2 or 4 block is used to generate the correct output frequency from the 4 GHz VCO. The phase locked loop has two information inputs: the divider ratio in the feedback path and a direct path to the VCO. The phase locked loop generates the radio frequency carrier including the phase modulation information at the desired channel frequency.
B. Receiver part
Direct down-conversion zero-IF receiver architecture is used for the four EDGE/GSM/GPRS frequency bands 800, 900, 1800 and 1900 MHz. The complete receiver with four Low Noise Amplifiers (LNAs), one for each supported band, is integrated on chip. After the down-conversion, the in-phase and quadrature-phase components are low pass filtered with two anti-alias filters before the signals are fed to the integrated high dynamic range sigma-delta A/D-converters. The only required external components are the band selectivity SAW filters in front of the LNAs. One filter is required per supported frequency band. The digital output signals are sent over a serial interface to the digital baseband circuit for further processing and detection.
- 79 -
3. TECHNICAL BRIEF
C. Synthesizer
The synthesizer contains all the frequency generating blocks in the RF3000 circuit: The reference 26 MHz frequency generation is made in a external crystal oscillator, which is fully integrated in the circuit (except for the crystal). The digital bus controls the center frequency of the XO. All RFfrequencies are generated in a single 4GHz VCO, subsequently divided by 2 or 4 to arrive at the final frequency. To cover the required frequency range, the integrated Voltage Controlled Oscillator (VCO) operates at twice the frequency for band 1800/1900, and at four times the desired frequency for band 800/900. The RF-VCO is locked to the XO in a fractional-N PLL consisting of a prescaler, a phase-frequency detector, a charge-pump, a sigma-delta modulator and a fully integrated loop filter. Automatic trimming of the VCO center frequency and the RC constant makes sure that the variation of the PLL dynamics is sufficiently low. The XO also has an external reference mode where a differential 26 MHz clock reference signal can be supplied externally at the XoP and XoN pins. A single-ended clock reference buffer MCLK sources a harmonically controlled square wave reference signal to be used in the baseband. An additional single-ended clock is generated for use in the W-CDMA circuit. This output is activated by a control signal in the digital bus.
- 80 -
3. TECHNICAL BRIEF
3.7.4 Front-End Module (FEM)

A single antenna is used for all four bands. The antenna switch and the EDGE/GSM/GPRS power amplifiers are integrated to a single circuit containing: Antenna Switch with support for W-CDMA band 1 Power amplifiers for high and low band EDGE/GSM/GPRS AM modulator/control circuit Lowpass transmitter filtering The antenna switch block connects the proper block in the radio system to the antenna connection. In GSM/GRPS/EDGE systems, transmit and receive operations are divided in time, and the switch connects the proper block in accordance with the mode of operation (that is, transmit or receive; one at a time in the GSM, DCS, and PCS bands). In W-CDMA systems, the transmitter and the receiver operate simultaneously (that is, full duplex). The switch is used only for selecting the W-CDMA mode of operation . the split between transmit and receive frequencies is handled by the W-CDMA duplexer.
Figure 3-7-8. Front-End Module
- 81 -
3. TECHNICAL BRIEF
A. Front End Part

SKY77519 TX-RX Front End Module (FEM) offers a complete transmit VCO-to-Antenna and Antennato-receive SAW filter solution in a low profile (1.2 mm), compact form factor for handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation, Polar EDGE modulation, and provides single UMTS band (band 1 or band 2) antenna switch-through via a dedicated UMTS port.
Figure 3-7-9. SKY77519 Functional Block Diagram

VB A T
TX_DCSPCS
C100 22p
C101 10n
C102 10u
C103 10u
A NTSW0 C104 22p A NTSW1
15 16 17 18 19 20 22 24 21 23
GND6 GND7 GND8 GND9 GND10 GND11 GND12 GND13 DCS_PCS_IN GSM_IN VA PC VB A TT
PGND GND5 GND4 GND3 GND2 GND1 WCDMA 1 RX1 RX2 RX3 RX4
29 14 13 12 11 9 10 7 6 5 4 WRF_B A ND_1 RX850 RX900 RX1900 RX1800
A NTSW2
C105 22p
C106 22p
25 26
B S2 27 B S1 28 SK Y77519 VA PC
RSVD 3 MODE 2 TXEN 1 A NT U100 8
C107
22p
DNI C108
G2
TX_EGSM
C109
DNI
SW100 K MS-518
Figure 3-7-10. Front End part schematic
- 82 -
G1
3. TECHNICAL BRIEF
3.7.5 Control Flow

The access side of the digital baseband controller controls the overall radio system. In both EDGE/GSM/GPRS and W-CDMA air interface mode, the digital baseband controller controls the radio system through a three-wire serial bus. The digital baseband controller also manages PA band control and the antenna switch mechanism in the front end module. The 26 MHz VCXO clock residing in the GSM/EDGE transceiver is turned on only when required, the digital baseband controller initiates this. The EDGE/GSM/GPRS RF system requires control, which is temperature dependent. The temperature within the RF system is estimated by a voltage measurement performed by the analog baseband controller. The control flow for the RF system is shown in Figure 3-7-11.
Figure 3-7-11. RF Control Flow
- 83 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 Power ON Trouble
TP01_BB (END)
SEND OK KEYOUT1 KEYOUT2 KEYIN4 KEYIN5 END ONSWA_n KEYOUT1 VA900 CLR
EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050
TP01_BB (END) TP(END)
ICVS0514X350FR
D900
KEYOUT2
RB521S-30
ONSWA_n
VA901
VA902
VA903
KEYIN4 KEYIN5
VDDE_1V8
10K 10K
R900 R901
TP01_BB (END)
VA904
ON_SW KEY
< MULTIKEY PCB >
VDD_D VDD_A
START
VDD_E
The voltage of main battery is higher than 3.2V ? Yes
No
change main battery

C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E A11 VDD_C B12 VDD_H A9 VDD_F A7 VDD_G VDD_K VDDLP M12 J11 C506 1u C507 1u
C501 1u
C502 1u
C503 2.2u
VDD_F
VDD_G
END key operates well? ONSWAn(D900) level is low when END key pressed.
No
Follow the keypad Trouble shooting guide
C508 1u
C509 1u
C510 1u
C511 33nF
Yes
VDD_H
VDD_H VDD_K VDD_LP
Check the voltage. VDD_A (C501) 2.75V VDD_D (C502) 1.5V VDD_E(C503) 1.8V VDD_F (C508) 2.5V VDD_G (C509) 2.5V VDD_H (C507) 2.75V VDD_K(C510) 2.75V VDD_LP(C511) 1.5V SWBUCK(L500) 1.2V
SWBUCK VDD_D VDD_E
VDD_A
VDD_F VDD_G
No Change main board
< MAIN PCB >
- 84 -
4. TROUBLE SHOOTING
4.2 USB Trouble

START (Measure during the state of USB module running)
Input power(R619) is 5V? Yes
No
Check host USB port or USB cable
No VBAT power(C601 or C600) is same to battery? Yes No ACC_GP20_USB_CS_PD(R603) is 1.8V? Yes Change main board
Resolder or check the VBAT line
Resolder or change U601
TP02_BB R619
VBAT 7 8 9 10 11 12 13 14 15 16 17 18 R623 DNI VA601 VA602 R624 20 ULCE0505C015FR ULCE0505C015FR VA603 C620 22p C621 22p C622 22p USB_DP/RMT_INT USB_DM/RMT_ADC EAR_DETECT_n VBAT_+4.2V VBAT_+4.2V ONSWB_n VCHG_+5V VCHG_+5V VPPFLASH USB_POWER UART_TX UART_RX GND
TP04_BB R603
ZD600
C619 2.2u
ULCE0505C015FR
RSB6.8CST2R
TP03_BB C600 C601

VBAT VDDE_1V8
CTS_ON
VPPFLASH_E VBUS APP_ACC_UART_TX APP_ACC_UART_RX VBUS_USB_TRX
D600 USFB13L
0 R619
R622
DNI
HSEJ-18S04-25PC
NCP348MTR2G U603 10 9 8 _EN GATE_OUT GATE OUT2 OUT1 IN1 IN2 IN3 _FLAG 1 4 5 3
TP601
C600 0.1u 0603
C601 4.7u 10V
R625
FB602 7 6 C623 1u C624 0.01u
DCIN_A
0
2 GND 11 NC1 12 NC2
TEST CHIP_SEL VCC_IO1 CLOCK DATA0 VCC_IO2 RREF DATA1 DATA2 DM U601 DP DATA3 DATA4 ISP1508AET FAULT DATA5 DATA6 DATA7 NXT STP DIR CFG0 REF1V8 ID CFG2 CFG1 PSW_N VBUS REG3V3 XTAL1 XTAL2
C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 R606 1% 12K 0.1u 0.1u 4.7u 2.2u
R603
USB_DM USB_DP
R605
1K
VBUS_USB_TRX USB_XTAL1
C602
C606
C604
C603
C605
0603
0603
0603
C607
TP02_BB R619 R619 TP04_BB R603 R603
TP03_BB C600 C600
TP03_BB
C601 C601
< Main Board Bottom side >
- 85 -
4. TROUBLE SHOOTING
4.3 SIM Detect Trouble

SIM control path - Asta generates SIM interface signals(1.8V level) to AB3000. - AB3000 converts SIM interface signals to 3V.
START
Reconnect SIM card
SIM work well?

N o
Yes
Finish
Resolder J901 on main PCB and check the contact between J901 and SIM card
J90 1
Yes
SIM work well?

N o
Finish
< SOCKET PCB - SIM Conne cto r >
Change SIM card
Yes
SIM work well?

N o
Finish
Change main board
- 86 -
4. TROUBLE SHOOTING
4.4 MicroSD card Trouble

Baseband chipset use polling method to detect the microSD Card.
START
Re-insert MicroSD card
MicroSD card work well? No Check operation of MicroSD card using other notebook or PDA
Yes
Finish
MicroSD work well? Yes FINISH
No
Change the MicroSD
MICRO SD
J 90 0 REA L _MICROSD_DA T2 REA L _MICROSD_DA T3 REA L _MICROSD_CMD VDDG_2V75 1 2 3 4 9 10 DA T2 DA T3 CMD VDD GND1 GND2 DA T1 DA T0 VSS CL K GND3 GND4 8 7 6 5 11 12 REA L _MICROSD_DA T1 REA L _MICROSD_DA T0 REA L _MICROSD_CL K
VA908 EVLC18S02015 VA909 EVLC18S02015 VA907 EVLC18S02015
< Socke tPCB side mic roSD Socket >
- 87 -
4. TROUBLE SHOOTING
4.5 Keypad, Touch Button and Touch Screen Trouble

4.5.1 Keypad Trouble
(1) If one of the side key is short with other signal or pressed, some key is not work.
- 88 -
4. TROUBLE SHOOTING
Main key PCB

TP08_BB CN1 CN1
ACC_GP15_FLIPSENSE VDDE_1V8 VDDG_2V75 K EY_L ED1 K EY_L ED2 K EYOUT1 K EYOUT2 K EYOUT3 CN1 G1 1 2 3 4 5 6 7 8 9 10 G3 G2 20 19 18 17 16 15 14 13 12 11 G4 R103 R104 1800 1800 MIC1P MIC1N CCO1 K EYOUT4 KEYIN0 KEYIN1 KEYIN2 K EYIN3
VBAT
TP06_BB RA101 RA101
VDDE_1V8
RA 101
NUMB ER_K EY
101
1
Side key
TP05_BB Side key
2 4 6 8
1 3 5 7
10K
102
2
103
3
K EYOUT1 104
4
105
5
106
6
K EYOUT2 107
7
108
8
109
9

HOT4
110
0
HOT102
HOT5
K EYIN3
TP07_BB VA101 ~VA101 VA108 ~ VA108

K EYOUT1 K EYOUT2 K EYOUT4 K EYOUT3 K EYIN0 K EYIN1 K EYIN2 K EYIN3
EVLC14S02050
EVLC14S02050
EVLC14S02050
EVLC14S02050
EVLC14S02050
VA104
VA105
VA107
VA101
VA108
VA102
VA103
VA106
EVLC14S02050
EVLC14S02050
EVLC14S02050
20 pin CONNECTOR_Female
CN700 G1 1 2 ACC_GP15_FLIPSENSE 3 VDDE_1V8 4 VDDG_2V75 5 KEY_LED1 6 KEY_LED2 7 VBAT 8 KEYOUT1 9 KEYOUT2 10 KEYOUT3 G3 G4 11 KEYIN3 12 KEYIN2 13 KEYIN1 14 KEYIN0 15 KEYOUT4 16 CCO1 17 18 MIC1N G2 20 19 MIC1P
Main board
TP08_BB CN700 CN700
- 89 -
4. TROUBLE SHOOTING
4.5.2 Touch button and Touch screen Trouble
- 90 -
4. TROUBLE SHOOTING
Main Board
TOUCH_3.1V
LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] APP_GP12_LCD_ID VDDE_1V8

Touch Screen I2C with GPIO#1
TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT
27 28 29 30 31 32 33 34 35 36 37
54 53 52 51 50 49 48 47 46 45 44
TP09_BB CN702 CN702
FLCD
TOUCH_3.1V
L CD_DA TA [ 4] L CD_DA TA [ 5] L CD_DA TA [ 6] L CD_DA TA [ 7] A PP_GP12_L CD_ID VDDE_1V8 TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT
26 27 28 29 30 31 32 33 34 35 36 37
55 54 53 52 51 50 49 48 47 46 45 44
TP09_BB CN106 CN106
TP09_BB CN108 CN108

CN108 TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT TOUCH_3.1V 1 2 3 4 5 6 44 43 42 41 40 39
Multikey
TP09_BB CN902 CN902

- 91 -
4. TROUBLE SHOOTING
TOUCH_LDO
TOUCH_3.1V VREG_6.1V VBAT DNI 0 R710
U700 R1114D311D 3 VDD VOUT 2 GND1 5 GND2 C717 1u
ACC_GP12_TOUCH_LDO_EN C716 1u
4 NC 6 CE
U700 TP10_BB U700
R709
The output must be 3.1V DC.

Main Board
2K IN_TOUCH_SCREEN_SDA IN_TOUCH_SCREEN_SCL
2.2K
2.2K
TP11_BB U800 U800
R801
TOUCHSCREEN L ev el Sh i f t er
TOUCH_RST C4 C3 C2
B4
B3
A PP_GP04_TOUCH_SCREEN_INT A PP_GP05_TOUCH_RESET A PP_GP05_TOUCH_SCREEN_SCL
TP804 TP806 TP807
A1 A2 A3
B2
R802 B1 C1
A1
R800
TOUCH_SCREEN_INT
U800 B4 A 2 TXS0104EZXUR GND VCCB VCCA A3 A4 OE B3 A CC_GP12_TOUCH_L DO_EN
A4
B1
TP813 A PP_GP16_TOUCH_SCREEN_SDA 0.1u TOUCH_3.1V 0 0 1u R805 0.1u R804 C806 C807 VDDE_1V8
B2
The output must be 3.1V DATA or Clock signal

Multikey
C805
TOUCH_CONNECTOR
TOUCH_3.1V
R906 TP12_BB R906

17 1
CN901
18 14 R905 R906 R907 13 12 TOUCH_SCREEN_INT 11 TOUCH_SCREEN_SCL 10 TOUCH_SCREEN_SDA 9 8 16 4.7K 4.7K DNI
TP12_BB R907 R907
2 3 4 5 6 7 15
Change Multikey PCB
- 92 -
4. TROUBLE SHOOTING
4.6 Multi EL lighting Trouble
- 93 -
4. TROUBLE SHOOTING
Main Board
TP13_BB CN702
TOUCH_3.1V LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] APP_GP12_LCD_ID VDDE_1V8
27 28 29 30 31 32 33 34 35 36 37
54 53 52 51 50 49 48 47 46 45 44
CN702
FLCD
TOUCH_3.1V
L CD_DA TA [ 4] L CD_DA TA [ 5] L CD_DA TA [ 6] L CD_DA TA [ 7] A PP_GP12_L CD_ID VDDE_1V8 TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT
26 27 28 29 30 31 32 33 34 35 36 37
55 54 53 52 51 50 49 48 47 46 45 44
TP13_BB CN106 CN106
TP13_BB CN108 CN108

Multikey
TP13_BB CN902 CN902
- 94 -
4. TROUBLE SHOOTING
TOUCH_LDO
TOUCH_3.1V VREG_6.1V VBAT DNI 0 R710
U700 R1114D311D 3 VDD VOUT 2 GND1 5 GND2 C717 1u
ACC_GP12_TOUCH_LDO_EN C716 1u
4 NC 6 CE
U700 TP14_BB U700
R709
2.2K
2.2K
Main Board
R800 2K IN_TOUCH_SCREEN_SDA IN_TOUCH_SCREEN_SCL
R801
R802
TOUCH_RST C4 C3 C2
U800 TP15_BB U800
B4
B3
A PP_GP04_TOUCH_SCREEN_INT A PP_GP05_TOUCH_RESET A PP_GP05_TOUCH_SCREEN_SCL
TP804 TP806 TP807
A1 A2 A3
B2
A1
B1
C1
TOUCH_SCREEN_INT
U800 B4 A 2 TXS0104EZXUR GND VCCB VCCA A3 A4 OE B3 A CC_GP12_TOUCH_L DO_EN
A4
B1
TP813 A PP_GP16_TOUCH_SCREEN_SDA 0.1u TOUCH_3.1V 0 0 1u R805 0.1u R804 C806 C807 VDDE_1V8
B2
The output must be 3.1V DATA or Clock signal
C805
Main Board
VB A T
DCDC FOR EL
MIC94071YMT Q400 4 3 PGND EN VIN VOUT GND 1 2 U400 1 2 OUT VIN EN A NGD PGND SW FB NC T_GND 8 R404 7 6 5 9 L 400 10u H
VREG_6.1V
U400 TP16_BB U400 output output

20K
EL _DCDC_EN C422 2.2u
3 4
R406
MIC2290YML
5.1K
C421 4.7u
- 95 -
4. TROUBLE SHOOTING
EL sheet operating voltage generator EL sheet operating voltage generator (L900, D901, Q900, C903, R910 or R913)
Multikey
(L900, D901, Q900, C903, R910 or R913)
TP17_BB Check the output of C903 Check the output of C903 Output must be 190V AC about 800KHz Output must be 190V AC about 800KHz
VREG_6.1V
R909
C902 2.2u
0 L900 100uH R910 C903 470pF R913 D901 RF051VA2S
TOUCH_3.1V
D1 D2 D3 D4 D5
Q900 SIA450DJ
S1 S2
C904 0.1u
R912 100K
100K
10M
C905 150p
C906 0.1u
ReplaceU900 U900 Replace
- 96 -
4. TROUBLE SHOOTING
4.7 Camera Trouble

5M Camera control signals are generated by Zoran.
4.7.1 5M Camera
START
Press END Key to turn on the power
NO Is the circuit powered?
Follow the Power On Trouble Shooting
YES 1 Reconnect the 5M 34pin B to B connector
YES 5M Camera Operation OK?
NO 2
C721 = 1.8V?
Or
NO Change U703 or Change U702 NO
C722 = 2.8V?
YES Change 5M Camera
5M Camera Works
Change the Main Board
- 97 -
4. TROUBLE SHOOTING
CN701
5M Camera off
34pin 5M Camera Connector in Main Board
- 98 -
4. TROUBLE SHOOTING
VBAT
CAM_VDD_AF_2.8V
CAM_VDD_1.8V
PGND
MMP_CAM_PWR_EN 1u
1u
C720
C723
C721
2
C722
U703
TP18_BB (1.8V)
U702
TP 2
5M Camera
TP19_BB(2.8V)
C721
1u
U703 1 VIN 2 EN1 3 EN2 4 NC1
TP18_BB
5M Camera
5M Regulator in Main Board (Top)
5M Regulator in Main Board (Bottom)
VBAT
CAM_AVDD_2.8V
U702 R1114D281D-TR-F 3 VDD VOUT GND1 GND2 2 5 1u
TP19_BB
MMP_CAM_PWR_EN 1u
4 NC 6 CE
C724
C722
- 99 -
4. TROUBLE SHOOTING
4.7.2 VGA Camera

VGA Camera control signals are generated by DB3150.
START
YES 1 Reconnect the 80pin BtoB connector CN702 and VGA 20 pin Camera Connector
YES VGA Camera Operation OK?
NO 2 NO
c921 = 2.8V? c922 = 1.8V?
Change U903 NO
YES Change VGA Camera
NO VGA Camera Operation OK? Change the Camera&LCD FPCB or Soket PCB NO YES VGA Camera Works Change the Main Board
- 100 -
4. TROUBLE SHOOTING
CN702 CN104
Main Board 80 pin BtoB Connector LCD FPCB 20 pin VGA Connector
- 101 -
4. TROUBLE SHOOTING
VB A T
R930 0
C915 2.2u
C916 10u
B5 F4 E1 A5 A4 B6 C6 C5 D6 E6
U903 B D6095GUL
TP21_BB TP 2
RB 521CS-30 R934 0 R935 0 VGA _VDD_2.8V
0 0 0
R931 R932 R933
C4 D4 D5 A3 E5 B3
T1 T2 T3 T4
F2 E2 D1 D3
RB 521CS-30
TP915
VGA _VDD_1.8V
A1 A6 F6 F1
TP20_BB
C922 TP20_BB (1.8V) U903 TP21_BB (2.8V)
C921
Charge Pump in Socket Board
- 102 -
4. TROUBLE SHOOTING
4.8 Main LCD Trouble

LCD control signals are generated by DB3150.
START
YES 1 Disconnect and Reconnect the 80pin (Main) or 44 pin (LCD PCB)
YES LCD Display OK?
NO Disconnect and Reconnect the LCD FPCB 44pin and 37pin LCD connector (Multikey PCB)
NO LCD Display OK? Change LCD FPCB or Multikey PCB
YES Change LCD Module
YES The LCD Works LCD Display OK?
NO Change the Main Board
- 103 -
4. TROUBLE SHOOTING
CN702 CN108
Main Board 80 pin BtoB Connector
LCD FPCB 44 pin BtoB Connector
CN902 CN900
Multikey PCB 44pin & 37pin LCD Connector
- 104 -
4. TROUBLE SHOOTING
4.9 Keypad Backlight Trouble
START
YES Keypad Backlight Works? NO No
VBAT applied? YES No
Change Main Board
Check V at R 101 or R 102 is confirm YES YES Keypad Backlight Works? No
Change LD101 or LD102
No Crack Mainkey PCB to main board YES Change Mainkey PCB Change Main Board
Keypad Backlight Works
- 105 -
4. TROUBLE SHOOTING
1
TP22_BB
VBAT L D101 1 2
TP23_BB
2
R101 K EY_L ED1 100o h m R102 K EY_L ED2 100o h m
A C SSC-SWTS1007 L D102 1 2 A C SSC-SWTS1007 RSB6.8CST2R RSB6.8CST2R ZD102
TP24_BB
ZD101
R102
R101
TP24_BB TP23_BB
3
TP22_BB
- 106 -
4. TROUBLE SHOOTING
4.10 Folder ON/OFF Trouble
START
Check magnet Yes Turn the power on
No
Insert magnet In component
Pin 1 of U101 = 2.75V
No
Change Main board
Yes Yes
Crack Mainkey PCB
Yes Change Mainkey PCB No
No Slide OK? Change Main board
Yes Finish
- 107 -
4. TROUBLE SHOOTING
SLIDE DETECT
VDDG_2V75 U101 TK 60012B M5 6 IO_VDD GND2 OUT 5 4 A CC_GP15_FL IPSENSE VDDE_1V8
TP25_BB
C109 0.1u
1 2 3
VDD GND1 NC
C112 0.1u
2
U101
TP25_BB (2.75V)
1
Be sure that magnet is here
- 108 -
4. TROUBLE SHOOTING
4.11 Audio Trouble Shooting

4.11.1 Receiver
Signals to the receiver - Receiver signals are generated at Veronica BEARP, BEARN - Receiver path: 1. Veronica (BEARP, BEARN)r 2. R518,R519 on main boardr 3. U501 (Analog switch) on main boardr 3. LCD FPCBr 4. Speaker/Receiver
Note: It is recommended that engineer should check the soldering of R, L, C along the
corresponding path before every step.
- 109 -
4. TROUBLE SHOOTING
START
Connect the phone to network Equipment and setup call Setup 1KHz tone out
NO
Does the sine wave appear at R518, R519 ?
Change the main board
YES The sine wave not appear Does the sine wave appear at Number 65, 66 pin in the main Bd CN702? NO Check 5, 8 pin at U501
YES
Does the sine wave appear at EAR(+) PAD in LCD FPCB?
NO Change the LCD FPCB
YES
Does the Receiver get in contact with the LCD FPCB sus
NO Re-assemble the Receiver
YES
Can you hear sine wave out of the receiver ?
NO Change the Receiver
YES
END
- 110 -
4. TROUBLE SHOOTING
1 TP26_BB R518, R519
2 TP27_BB Pin 65, 66 CN702
LCD FPCB 3
TP28_BB
- 111 -
4. TROUBLE SHOOTING
Speaker Amp.
VBAT
TP26_BB R518, R519
R517 1% 39K
C525 2.2u BEARP R518 1% 15 10 1 B2 A1 B3 4 A3 BEARN R519 1% 15 2 3 U501 FSA2268TUMX 8 1A 1B0 1B1 2B0 2B1 GND S1 2A S2 VCC 7 5 VBAT 6 9 C535 10 n 0603 SPK_RCVSPK_RCV+
C1 ACC_GP13_SPK_AMP_EN C531 SPKRP C532 SPKRN 47n 47n 1 % 10K R50 26 00 3 C2 R50 26 10 1 % 10K 3 C3 100K 220n B1
BYPASS _SHUTDOWN IN+ INU500
GND VOVO+ VDD
TPA6205A1ZQVR
R522
0603
C536
VGA_
VG
CN702 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 C715 DNI 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 SBIAS SENS GAIN1 GAIN2 CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7 SPK_RCV+ SPK_RCVMOTOR_PWRMOTOR_PWR+ LCD_RD_N LCD_VSYNC LCD_RESET_N LCD_WE_N LCD_CS_N LCD_ADS_N LCD_PWM WLED5 WLED4 WLED3 WLED2 WLED1 WLED_PWR VREG_6.1V
P-SEL I2C with GPIO#2
TP27_BB Pin 65, 66
VDD_LCD_2.6V
CI_RES_n SYSCLK0 CI_PCLK CI_HSYNC CI_VSYNC
R700 R701
0 0
ACC_GP21_VC_IO_OFF APP_I2C_SCL APP_I2C_SDA ONSWA_n KEYOUT1 KEYOUT2 KEYIN4 KEYIN5 LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] APP_GP12_LCD_ID VDDE_1V8
TOUCH_3.1V
TOUCH_BUTTON_SCL
Touch Button I2C with GPIO#2
TOUCH_BUTTON_SDA C712 DNI C713 C714 DNI DNI
TOUCH_RST
- 112 -
4. TROUBLE SHOOTING
1 2
TP26_BB R518, R519 TP27_BB Pin 65, 66
Measured 1khz Sine Wave Signal
3
TP28_BB
- 113 -
4. TROUBLE SHOOTING
4.11.2 Speaker (Voice Loud Speaker, Midi, MP3, Key Tone)

Signals to the speaker - Speaker signals are generated at Veronica SPKRP, SPKRN - Speaker path: 1.Veronica (SPKRP, SPKRN) 2. C531, C532 on the main board 3. U500(audio amp) on the main board 4. U501 (Analog switch) on the main board 5. LCD FPCB 5.Speaker/Receiver
Note: It is recommanded that engineer should check the soldering of R, L, C along the
corresponding path before every step.
- 114 -
4. TROUBLE SHOOTING
START
Does the sine wave appear at C531, C532?
NO Change the main board
YES The sine wave not appear
Does the sine wave appear at U500 ? YES
NO Change the U500
Does the sine wave appear at U501 ?
NO Change the main board
YES
Does the sine wave appear at EAR(+) PAD in LCD FPCB?
NO Change the LCD FPCB
YES
Can you hear sine wave out of a speaker ?
NO Change the Speaker
YES
END
- 115 -
4. TROUBLE SHOOTING
1
TP29_BB C531, c532
3
TP31_BB U501
B SIDE
TP30_BB U500 TP32_BB
- 116 -
4. TROUBLE SHOOTING
TP30_BB U500
Speaker Amp.
TP29_BB C531, c532
VBAT
2
R517 1% 39K C525 2.2u BEARP C1 BYPASS _SHUTDOWN IN+ INU500 GND VOVO+ VDD B2 A1 B3 4 A3 BEARN R519 1% 15 2 3 R518 1% 15 10 1
TP31_BB U501
U501 FSA2268TUMX 8 1A 1B0 1B1 2B0 2B1 GND S1 2A S2 VCC 7 5 VBAT 6 9
SPK_RCV+
ACC_GP13_SPK_AMP_EN C531 SPKRP C532 SPKRN 47n 47n 1 % 10K R50 26 00 3
B1 C2 R50 26 10 1 % 10K 3 C3 100K 220n
SPK_RCV-
TPA6205A1ZQVR
R522
C535 10 n 0603
0603
C536
- 117 -
4. TROUBLE SHOOTING
4.11.3 Microphone (Voice call, Voice Recorder, Video Recorder)

Microphone Signal Flow - MIC is enable by MIC Bias - CCO1, MIC1P, MIC1N signals to ABB3000 (Veronica ) Check Points - Microphone bias - Audio signal level of the microphone - Soldering of components Signal from the mic - MIC - C104 on mainkey PCB - C106, C108 on mainkey PCB - R103, R104 on mainkey PCB - Veronoca
- 118 -
4. TROUBLE SHOOTING
START
Check the MIC bias level at the C104
2 1
Is the level of CCO1 2.4Volt ? No Check the signal level at C106, C108 at the putting Audio signal in MIC
Yes
3
A few hundred of mV of the signal measured ? Change the MIC No Resolder C106, C108 and try again. If fail again, chage the main Bd
Yes Change the main B,d Yes
No Does it work properly ?
YES
END
- 119 -
TP33_BB C106, C108
1
TP32_BB C104
CCO1 C104 10u SPM0204HE5-PB -3 P 4 G2 3 G1 2 O 1 MIC101 C106 47n MIC1N C108 47n MIC1P C105 47p
TP32_BB C104
MIC
Sep er at e DGND : 0.15m m L i n e
TP33_BB C106, C108
- 120 -
2
TP33_BB C106, C108
Measured Some Noise Signal
- 121 -
4. TROUBLE SHOOTING
4.11.4 Headset Receiver (Voice call, Video Telephony, MP3)

START
1
Insert Headset. Does the Headset icon display on the main LCD? NO Does the level of R621 under 0.5Volt ? NO
YES YES YES
2
Does the level of R621 over 1.6Volt ?
NO
Does the sine wave appear at C613, C614 ? YES NO
Change the main B,d N0
4
Change the the FL601
Does the sine wave appear at FL601 ? YES
Resolder R620 And try again from the start
Does the sine wave appear at FB600, FB601?
NO Change the FB600, FB601
YES Does the sine wave appear at R816, R817?
8
Resolder CN600 Pins or change the Headset
NO Change the FB600, FB601
YES Can you hear sine wave out of the receiver ? YES NO Change the main Bd
END
- 122 -
4. TROUBLE SHOOTING
TP38_BB FB600, FB601
TP39_BB 7 R816, R817
TP35_BB C613, C614
TP37_BB 5 FL601
4 TP36_BB R620 1 TP34_BB R621
8 TP40_BB CN600
- 123 -
TP38_BB FB600, FB601 TP39_BB R816, R817

FB605
R607 HOOK 47K C608 10n 0603
VBAT
TP35_BB C613, C614
TP39_BB R816, R817

near to connector L600 270nH C611 22p FM_ANT
C609 MIC2P C610 MIC2N
0.1u 0603 0.1u 0603 FB603
TV_OUT MIDR R610 R612 470 1% 470 1% PULL-UP REMOVED 2007.10.01 VA600 ULCE0505C015FR
C613 EAR_L C614 EAR_R
100u
FL601 1 2 3 4 IN1 NC1 NC2 IN2
PGND
FSUSB30UMX U602 10 1 SEL HSD1+ 9

TP600
100u
FB600
R816
47
CN600
FB601
R817
47
19 R616 0603 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 ULCE0505C015FR ULCE0505C015FR VA603 C620 22p C621 22p C622 22p FM_ANT HS_MIC TV_OUT(2007.09.18) EAR_L EAR_R USB_DP/RMT_INT USB_DM/RMT_ADC EAR_DETECT_n VBAT_+4.2V VBAT_+4.2V ONSWB_n VCHG_+5V VCHG_+5V VPPFLASH USB_POWER UART_TX UART_RX GND
VCC HSD2+ _OE D+
2 3 4 5 USB_DP/RMT_INT USB_DM/RMT_ADC VBAT CTS_ON
8 7 6
HSD1- GND HSD2D-
VDDE_1V8 C616 0.1u
C615 DNI R620 220K R621 0
R618
1K
D600 USFB13L
0 R619
R623
R622
C618 RSB6.8CST2R DNI ZD600 C619 2.2u
DNI
DNI
VA601
ULCE0505C015FR
VA602
R624
HSEJ-18S04-25PC
NCP348MTR2G U603 10 9 _EN GATE_OUT GATE OUT2 OUT1 IN1 IN2 IN3 _FLAG 1 4 5 3
TP601
TP36_BB R620
TP34_BB R621
8 R625 FB602 7 6 C623 1u C624 0.01u
DCIN_A
0
2 G ND 11 NC1 12 NC2
TP40_BB CN600
- 124 -
4.11.5 Headset MIC(Voice call, Video Telephony)

START
1
Insert Headset. Does the Headset icon display on the main LCD? NO Does the level of R621 under 0.5Volt ? NO
YES
YES
2
YES Does the level of R621 over 1.6Volt ?
Check the signal level at U803 at the putting Audio signal in MIC Change the main B,d N0
Resolder R620 And try again from the start
6
A few hundred of mV NO Resolder U803 and try again. If fail again, Change the main Bd
of the signal at U803 ?
measured
YES
Change the main Bd
Does it work properly ??
NO Try again from the start
YES
END
- 125 -
4. TROUBLE SHOOTING
4
TP43_BB U803
3
TP42_BB R620
TP41_BB R621
- 126 -
4. TROUBLE SHOOTING
APP_ACC
DNI
R614
R613
0603
DNI
APP_ACC
R615 APP_GP11_REMOTE_INT 3.3K USB_DP

TP600
FSUSB30UMX U602 10 1 SEL HSD1+ 9 8 7 6 VCC HSD2+ _OE D+ 2 3 4 5 USB_DP/RMT_INT USB_DM/RMT_AD
REMOTE_ADC USB_DM VDDE_1V8
HSD1- GND HSD2D-
R617
5.6K
C615 DNI R620 220K ACC_GP17_PHFSENSE R621 0
R618
1K
C616 0.1u
C618 DNI
TP43_BB U803
TP41_BB R621
TP42_BB R620
R888 DNI
CCO 2
R818 2.2K C818 1u
FB604
4 NC 6 CE C819 2.2u
- 127 -
4. TROUBLE SHOOTING
4.12 Charger Trouble Shooting

300K X500 2 1 32.768KHz C512 24p K12 XTAL1 K11 XTAL2 C513 24p RTCCLK J12 32KHZ
C1
A2
A1_C2 3
BDATA FGSENSE+
CN500 1
33u
G1
G2
Battery Conn.
R508 0603 2012 1% 1/4W
C517
R509 Close to Pin 3 0.025 R511 0603 0
VBAT
FGSENSE-
R512
H1 E1
VBAT_D CHSENSE+

G1 S1 D1
R513 0.1
F2
CHSENSE-
E2
CHREG
D3
DCIN_A
D4
D2
G2 S2
VBUS
Main Battery Charging Path
Charging Procedure - Connecting TA and Charger Detection - Control the charging current by AB3000 - Charging current flows into the battery Check Point - Connection of TA - Charging current path: - Battery Trouble shooting setup - Connect TA and battery to the phone Trouble Shooting Procedure - Check the charger connecter - Check the Charging current Path: Red Line( - Check the battery )
- 128 -
4. TROUBLE SHOOTING
start
1 1
Check the pin and battery connect terminals of I/O connector
Connection OK?
NO
Change I/O connector
YES
NO
2 2
Is the TA voltage 5.1V?
Change TA
YES
3 3
Is it charging properly after changing Q500?
YES
END
NO
Change the board
Trouble Shooting - Charging
- 129 -
4. TROUBLE SHOOTING
300K
X500 2 1 32.768KHz C512 24p
C1
A2
A1_C2 3
BDATA FGSENSE+
CN500 1 G1 2 G2 3
33u
Battery Conn.
R508 0603 2012 1% 1/4W
C517
R509 Close to Pin 3 0.025 R511 0603 0
VBAT
FGSENSE-
R512
H1 E1
VBAT_D CHSENSE+
BATT_GND 2012 1% 1/4W Q501 SIA911DJ R513 0.1 route as a differential pair
F2
CHSENSE-
Q501
S1 D1 D3
G1
E2
CHREG
DCIN_A
D4
D2
G2 S2
VBUS
Main Battery Charging Path
- 130 -
4. TROUBLE SHOOTING
4.13 Checking Bluetooth Block
BT IC
PMIC
<Bottom view>
<Top view>
start
1. Check PMIC Block
2. Check BT IC Block
** BT - Bluetooth
- 131 -
4. TROUBLE SHOOTING
1.8V(C804)
2.75V(C808)
BT ANT pad
BT IC
2.75V(C810) PMIC <Bottom view>
BT CLK(R803) <BT IC Block>
2.75V(C809)
1.8V(C503)
2.75V(C510)
<PMIC Block>
- 132 -
4. TROUBLE SHOOTING
4.13.1 Checking BT IC Block

2
TP02_BT 1.8V(C503)
TP01_BT 2.75V(C510)
VDDD_1V5 SHARED_I2C_SDA SHARED_I2C_SCL TX_ADC_STRB MOTOR_PWM HOOK REMOTE_ADC TESTOUT RTEMP
KEY_LED1 KEY_LED2 SUB_LED
VBACKUP
ADOUT
TP02_BT 1.8V(C503)
VRADA_2V8 VDDD_1V5 VDDE_1V8 VDIGRAD_1V8
VBAT
VBAT RB521S-30 VRADA_2V8
D500
VDDD_1V5 R504 VDDE_1V8 0
H12 SDA H10 SCL
D8 A10 B10 C9 D9 E9 F11 E11 F10
H11 TXON G4 ADSTR B9 ADOUT C8 VDDADC
A6 LED1 D6 LED2 B7 LED3
B6
VDIGRAD_1V8 C501 1u C502 1u C503 2.2u
C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E A11 VDD_C B12 VDD_H A9 VDD_F A7 VDD_G VDD_K VDDLP M12 J11 C506 1u C507 1u C508 1u C509 1u C510 1u C511 33nF
TP01_BT 2.75V(C510)
VDDC_2V65 VDDH_SMB_2V75 VDDF_2V5 VDDG_2V75 VDDK_2V75
VIBR
GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 GPA6 GPA7 GPA12
VDDC_2V65 VDDH_SMB_2V75 VDDF_2V5 VDDG_2V75 VDDK_2V75 R505 VBACKUP 2.2K VBAT_C 1608 120ohm(@100MHz) FB500 VBAT VCORE
VBUCK VDDBUCK SWBUCK
B2 A2 A1 RB521S-30 BLM18PG121SN1J 2.8*2.6*1.0 0.7A? 20% L500 4.7uH VCORE D502
C514 10u B1 D1 C518 0.1u 0603 10V SIMVCC
C515 0.1u 0603
C516 10u
VSSBUCK PBIAS
SIMVCC
F1
Use Multiple Vias
U502 AB3000-R2B

TP502
C520 1u Close to AB
SCK1
D4
I2S0_CLK
- 133 -
4. TROUBLE SHOOTING
Check voltage level at C510 with Oscilloscope
About 2.75V?
No
Check PMIC (U502)
Yes
Check voltage level at C503 with Oscilloscope
About 1.8V?
No Check Veronica (U502)
Yes
Check Next Stage
- 134 -
4. TROUBLE SHOOTING
4.13.2 Checking BT IC Block

3
TP05_BT 1.8V(C804)
TP06_BT 2.75V(C808)
TP04_BT 2.75V(C810)
TP07_BT BT CLK(R803)
TP03_BT 2.75V(C809)
VDDK _2V75
TP04_BT 2.75V(C810)
R807
B2 C3 M8 C1 C2 M2 J4
B T_RSVR_CL 1 B T_RSVR_CL 2 B T_RSVR_D B T_RSVR_DSM B T_RSVR_N B T_RSVR_RF B T_REG_CTRL
N7 B T_HVD E6 B T_VDD_CL D 0.1u 0.1u
TP03_BT 2.75V(C809)
D4 F7 F8 L4 L5 L6
C809
C810
- 135 -
4. TROUBLE SHOOTING
_ K1 B T_RFP J1 B T_RFN M6 B T_VIO_A J9 B T_VIO_B N3 B T_VIO_C N5 B T_VIO_D G8 B T_VIO_E
VDDE_1V8
TP05_BT 1.8V(C804)
FB 800 60
B T_VSSDIG1 B T_VSSDIG2 B T_VSSDIG3 B T_VSSDIG4 B T_VSSDIG5 B T_VSSA NA 1 B T_VSSA NA 2 B T_VSSA NA 3
H6 H7 H8 K8 L8 D1 D2 E3 F1
C804 0.1u
_ B T_VSSA NA 11 B T_VSSA NA 12 B T_VSSRF1 B T_VSSRF2 B T_VSSRF3 B T_VSSRF4 B T_HVA 1 B T_HVA 2 B T_HVA 3 B T_HVA 4 B T_HVA 5
H3 H4 H1 L1 J2 K2 VSS_B T_RF L2 D3 E1 E2 E4
C808 0.1u
4
TP06_BT 2.75V(C808)
H2 B T_TEST1 G2 B T_TEST2 G6 B T_A F_PRG VSS_B T_A NA
TP07_BT BT CLK(R803)
TP801
U801
R803 B T_CL K 0 C800 DNI C801 DNI A CC_GP25_B T_SPI_DA T1 A CC_GP26_B T_SPI_CL K RTCCL K RESOUT2_n K7 B T_RESETN F6 B T_REF_CL K _IN K9 B T_L P_CL K L9 B T_WA K EUP
STL C2593
B T_CL K _REQ_OUT_1 J7 G7 B T_UA RT_TXD J6 B T_UA RT_RTS K1 B T_RFP J1 B T_RFN B T VIO A M6
H9 B T_UA RT_RXD K6 B T_UA RT_CTS
- 136 -
4. TROUBLE SHOOTING
TP08_BT BT BT IC IC Output(C803) Output(C803)
TP08_BT BT IC Output(C803)
FL 800 5 4 B P1 B P2
DEA 212450B T-7043C1 3.9n H C802 1 U_B P B P_DC 2 L 800 3.3n H
1nH C803
OUT801
OUT802 1.2p L 801
OUT803
6 3
G2 G1
VSS_B T_RF
VSS_B T_RF
VSS_B T_RF
1 3
2 4
Check voltage level at
No
1.8V, 2.75V ?
C804, C808, C809 and C810 with Oscilloscope
Check PMIC Block
Yes Check frequency at

5
No
26MHz ?
BT CLK (R803) with Oscilloscope
Check VCXO(X100) block
Yes
Check Power level at BT IC Output (C803) with Spectrum Analyzer
Range -2 ~ 2dBm ?
No Change BT Chip (U801)
Yes
Check Next Stage
- 137 -
4. TROUBLE SHOOTING
4.14 RF Component
SW100 SW101 X100 (Bottom)
U203 U102 FL200

FL102,FL101,FL100
FL201 U202 U200 N200 U100 U201 IS200 FL202 (Top)
Figure 4-1. RF component
Reference X100 U100 U102 FL100 FL101 FL102 SW100 SW101
Description 26MHz Crystal GSM900/DCS/PCS/EDGE PA + Ant. SW GSM / EDGE Transceiver(RF3000) DCS Rx SAW Filter PCS Rx SAW Filter GSM900 Rx SAW Filter RF Test Connector Antenna Connector
Reference U200 U201 U202 U203 N200 IS200 FL200 FL201 FL202
Description WCDMA PA WCDMA DC/DC Converter WCDMA Power Detector WCDMA Transceiver(RF3100) WCDMA Power Coupler WCDMA Isolator WCDMA Rx SAW Filter WCDMA Tx SAW Filter WCDMA Duplexer
- 138 -
4. TROUBLE SHOOTING
4.15 Procedure to check

start
Oscilloscope setting
1. Check Power Source Block
2. Check VCXO Block
3. Check Ant. SW Module
Agillent 8960 : Test mode(WCDMA) Ch. 9750 (Uplink) Ch. 10700 (Downlink)
4. Check WCDMA Block
Agillent 8960 : Test mode(GSM) Ch. 62, P.L. 7 level setting Ch. 62, -60dBm setting
5. Check GSM Block
Redownload SW, Cal
- 139 -
4. TROUBLE SHOOTING
4.16 Checking Common Power Source Block
Step 3 WCDMA PAM Block Step 2 GSM PAM Block
(Top)
Step 4 Checking VCC
Step 1 Power Source Block (Bottom)

Figure 4-2. Common Source Block
- 140 -
4. TROUBLE SHOOTING
4.16.1 Step 1
300K VBAT R506 Close to Pin 1 KDS221E_RTK
1 C1 A2 2
TP02_RF Check point (C517) (C517)
CN500 1 G1 2 G2 3
A1_C2 3
TP02_RF (C517)
33u
D501 Battery Conn.
C517
201 1% 1/4
TP01_RF Check point (CN500) (CN500)
TP01_RF (CN500)
Figure 4-3. Power Source Block

BATT_GND
Step 1 Check Point (C517) in Power Source Block To Check Power source to Check if main power source input or not
No 3.7V OK?
Yes
Proceed to the Step 2
Check Point (CN500) in Power Source Block To Check Power source

3.7V OK? Yes
No
Check The PowerSupply
Check (C517 & CN500) in Block to check inner line connection From CN500 to C517
Short? Yes
No
Change Board
Soldering Check Component (CN500) In Power Source Block
- 141 -
4. TROUBLE SHOOTING
4.16.2 Step 2
TP03_RF (C102,C103) TP03_RF (C102,C103)
VB A T
C100 22p
C101 10n
C102 10u
C103 10u
C102
15 16 17 18 19 20 22 24 21 23 GND6 GND7 GND8 GND9 GND10 GND11 GND12 GND13 DCS_PCS_IN GSM_IN VA PC VB A TT PGND GND5 GND4 GND3 GND2 GND1 29 14 13 12 11 9 WRF_B A ND_1 RX850 RX900 RX1900 RX1800
C103
WCDMA 1 10 RX1 7 RX2 6 RX3 5 RX4 4 RSVD 3 MODE 2 TXEN 1 A NT SK Y77519 U100 DNI C108 8
GSM PAM
25 26
B S2 27 B S1 28
C107
22p
G2
SW100 K MS-518
Figure 4-4. Step 2 : GSM PAM Block
Step 2 Check VBATT (C102, C103) in GSM PAM Block to Check if main power source input or not
3.7V OK? Yes
No
Proceed to the Step 3
Check Point (C517) in Power Source Block To Check Power source Check (C517 & C102,C103) in Block to check inner line connection From C517 to C102, C103
Short? Yes 3.7V OK? Yes
No
Check The PowerSupply
No
Change Board
- 142 -
G1
4. TROUBLE SHOOTING
4.16.3 Step 3
VB A T
TP04_RF (C202, C201)
WCDMA PAM
C201 10u
C202 0.01u
WPA _VCC
C208 DNI
WDCDC_EN
U201 L M3208TL B1 VDD SW A1 PVIN FB C2 VCON SGND C1 EN PGND
A2 C3 B3 A3
DC/DC Converter
(C202,C201) C202 C201 TP04_RF
Figure 4-7. Step 3 :WCDMA PAM Block
Step 3 Check VBAT (C201, C202) in WCDMA PAM Block
3.7V OK? Yes
No
See the Next Page
Check Point (C517) in Power Source Block To Check Power source
3.7V OK? Yes
No
Check the PowerSupply
Check (C517 & C201, C202) in Block , to check inner line connection From C517 to C201, C202
No Short ? Yes
Change Board
- 143 -
4. TROUBLE SHOOTING
4.16.4 Step 4: Checking VCC
TP05_RF C501 (VDD_A) (VDD_A) C501
C503 (VDD_E)
TP06_RF C503 (VDD_E)
AB3000
(Bottom)
Figure 4-5-1. Power for Radio ASIC

TP05_RF C501 (VDD_A)
VRADA_2V8 (RF3000 analog)

R504 0
C501 1u
C502 1u
C503 2.2u
VDIGRAD_1V8 (RF3000 digital)

TP06_RF C503 (VDD_E)
AB3000
C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E
Figure 4-5-2. Schematic (Power)
Check Point VDD_A (C501)
2.8V OK?
No Yes
Check the AB3000
Check Point VDD_E (C503)
1.8V OK?
No Yes Common Input Power is OK See The Next Part
Check the AB3000
- 144 -
4. TROUBLE SHOOTING
4.17 Checking VCXO Block

The reference frequency (26MHz) from U102 (GSM Transceiver RF3000) is also used in WCDMA TX part and BB part. Therefore, 3 test points in the following figure should be checked.
U102 GSM Transceiver (RF3000)
X100 Crystal
U203 WCDMA Transceiver (RF3100)
Figure 4-6. VCXO block
Notebook to send TP command Oscilloscope
Phone
Figure 4-7. Connection for Checking VCXO Block
- 145 -
4. TROUBLE SHOOTING
Check 1. Crystal and RF3000(GSM Transceiver) part If you already check this crystal part, you can skip check 1
X100 Crystal GSM Transceiver (RF3000)

TP07_RF R113 R113
Figure 4-8-1. Test Point (Crystal Part)

8 CL K 9 TESTOUT 10 MCIK REQ TP100 MCL K REQ
R109
100K
RF_CTRL _CL K 4 1
X100 3 2 R112 100K
26MHz K SX-23-26000K FA -QA 0R
WCL K
R113 100K
MCL K
TP07_RF R113
100K R114
Figure 4-8-2. Schematic (Crystal Part)
Figure 4-9. 26MHz at R113
- 146 -
11 12 13 14 15 16 17
WBCLK GNDA11 XON XOP GNDA12 MCLK
TESTOUT
4. TROUBLE SHOOTING
Check 2. 26MHz at WCDMA TX part
TP08_RF C229 C229
GSM Transceiver (RF3000)
X100 Crystal
WCDMA Transceiver (RF3100)
Figure 4-10-1. Test point (26MHz at TX part)
TP204
RF_CTRL _DA TA RF_CTRL _CL K RF_CTRL _STRB WCL K C229 8.2p
11 12 13 14 15 16
VGACTL DATA CLK EN REFIN NC4
TP08_RF C229
Figure 4-10-2. Schematic (26MHz at TX part)
Figure 4-11. 26MHz at C229
- 147 -
4. TROUBLE SHOOTING
Check 3. 26MHz at BB part
TP09_RF R114 R114
GSM Transceiver (RF3000)
Figure 4-12-1. Test point (26MHz at BB part)

8 CL K 9 TESTOUT 10 MCIK REQ TP100 MCL K REQ
VDDE_1V8
R109
100K
RF_CTRL _CL K 4 1
X100
11 12 13 14 15 16 17
WBCLK GNDA11 XON XOP GNDA12 MCLK
TESTOUT
R305
3 2
R112 100K
100K
Baseband (DB3150)
WCL K
TP09_RF R114
MCL K
R113 100K
TP301
MCL K SYSCL K 0
W14 MCL K Y16 SYSCL K 0
MCLK
100K R114
MCLK
Figure 4-12-2. Schematic (26MHz at BB Part)
Figure 4-13. 26MHz at R114
- 148 -
4. TROUBLE SHOOTING
Check R113 Refer to Figure 4-8
Checking 1 26MHz at VCXO Yes
No
VCXO part has a problem. Changing XTAL or U102
Check R114 Refer to Figure 4-10
Checking 2 26MHz at MCLK
No
VCXO part has a problem. Changing XTAL or U102
Yes
VCXO part is O.K. Check next stage
- 149 -
4. TROUBLE SHOOTING
4.18 Checking Front End Module Block

TP10_RF
Antsw0 Antsw1
Antenna Switch Module (+ GSM/EDGE PA)
Antsw2
Figure 4-12. Front End Module Block (Bottom and Top)
TX_DCSPCS
C100 22p
A NTSW0
TP10_RF
A NTSW1
C104 2 2p
15 16 17 18 19 20 22 24 21 23
29 14 13 12 11 9 10 7 6 5 4
A NTSW2
C105 22p
C106 2 2p
25 26
B S2 27 B S1 28 SK Y77519 VA PC
C1
TX_EGSM
C109
DNI
Antenna Switch Module (+ GSM/EDGE PA)
- 150 -
4. TROUBLE SHOOTING
4.19 Checking Front End Module Block input logic

4.19.1 Mode Logic by TP Command
- 151 -
4. TROUBLE SHOOTING
Mode EGSM Tx DCS Tx PCS Tx EGSM Rx DCS Rx PCS Rx WCDMA
Antsw0 L L L H H H L
Antsw1 L H H L H H H
Antsw2 H H H H L H L
Table 4-1. Front End module Logic
- 152 -
4. TROUBLE SHOOTING
4.19.2 Checking Switch Block power source

Before Checking this part, must check common power source(through Veronica) part
TP Command MODE=0 SWRX=64,2
No
Check Soldering It is necessary to check short condition. Using Tester, Check 3 capacitors ANTSW0(C104),ANTSW1(C106) ANTSW2(C105)
Open?
Yes
Check soldering (C104)
No
High?
Check ANTSW0(C104) To check Switch input power source
No
OK?
Resoldering
Yes
Yes
Check each mode By TP command
Change the Board
- 153 -
4. TROUBLE SHOOTING
4.20 Checking WCDMA Block

start
1. Check VCXO Block
U203 WCDMA Transceiver RF3100 U200 WCDMA PAM
2. Check Front End Module
Duplexer / Isolator / DCDC 3. Check Control Signal (Top)
4. Check RF TX Level
5. Check PAM Block
6. Check RF RX Level (Bottom) Re-download SW, Cal
SW100 RF switch
Figure 4-27. WCDMA Block
- 154 -
4. TROUBLE SHOOTING
4.20.1 Checking VCXO Block

Refer to 4.16
4.20.2 Checking Ant. SW module

Refer to 4.17
4.20.3 Checking Control Signal

First of all, control signal should be checked. (data, clk, strobe)
PIN14 (STROBE) PIN13 (CLK) PIN12 (DATA)
U203 WCDMA Transceiver (RF3100)
Figure 4-28-1. Test points (Control Signal)
- 155 -
4. TROUBLE SHOOTING
TP204
RF_CTRL _DA TA RF_CTRL _CL K RF_CTRL _STRB WCL K C229 8.2p
Figure 4-28-2. Schematic (Control Signal)
Notebook to send TP command Oscilloscope
Phone
Figure 4-29. Connection for Checking Control Signal
- 156 -
11 12 13 14 15 16
VGACTL DATA CLK EN REFIN NC4
RF3100
4. TROUBLE SHOOTING
PIN14 (STROBE)
PIN12 (DATA)
PIN13 (CLK)
PIN14 (STROBE)
PIN12 (DATA)
PIN13 (CLK)
Figure 4-30. Control Signal

TP Command MODE=4 WTXC=10700, 1,890,903,542,557
Check PIN12,PIN13, and PIN14. Check shape and pk-pk level Refer to Figure 4-30
No
Similar ?
Download the SW If signal is not OK even after downloading, Change the U203
Yes
Control Signal is O.K. Check next stage
- 157 -
4. TROUBLE SHOOTING
4.20.4 Checking RF TX Level

TP13_RF Check 2 C107 FEM Output TP17_RF Check 6 C207 PAM Input
TP12_RF Check 1 SW100 RF test connector
TP16_RF Check 5 IS200 Isolator Input TP15_RF Check 4 IS200 Isolator Output TP14_RF Check 3 C226 Duplexer Output
(Top)
(Bottom)
Figure 4-31. Test point (RF TX Level)
Notebook to send TP command Spectrum Analyzer
Phone
Fig. 4-32 Connection for Checking RF TX Level
- 158 -
4. TROUBLE SHOOTING
15 16 17 18 19 20 22 24 21 23 25 26
B S2 27 B S1 28 SK Y77519
TP12_RF SW100 RF test connector
C107
22p
TP13_RF C107 FEM Output
DNI C108
G2
SW100 K MS-518
TP14_RF C226 Duplexer Output

L 205 NA
22p C226 WRF_B A ND_1
FL 202 2 A NT
SA YZY1G95EB 0B 00 7 RX TX 5
WRX_B A ND_1 WTX_B A ND_1
1 4 8
GND1 GND2 GND3
3 GND6 6 GND5 9 GND4
TP17_RF C207 PAM Input

WTX_B A ND_1_EN WPA _B IA S C206 22 p C204 10 p C203 1000p U200 1 2 3 C207 WTXMOD_B A ND_I 56p 4 VCC1
VCC_PA
C200 0.01u
C205 1000p SK Y77174 PGND VCC2 GND3 RF_OUT GND2 11 10 9 8 7 6 8.2n H L 202 C211 DNI L 200 1n H 1 2 3
ENA B L E VCONTROL RF_IN
TP16_RF IS200 Isolator Input

L DC181G9519B -327 N200 IN GND1 M_OUT GND2 6 5 4
G1
TP15_RF IS200 Isolator Output

GND1 GND2 OUT IN GND3 GND4 WTX_B A ND_1
IS200 CES201G95DCB 000
C210 DNI
C209 DNI
VB IA S
GND1
C_OUT TERMINA TE
C213 DNI WPOW_SENSE
47
VB A T
R200
- 159 -
4. TROUBLE SHOOTING
Fig. 4-33-1 Output Level at RF test connector (SW100)
Fig. 4-33-2 Output Level at FEM Output (C107)
Fig. 4-33-3 Output Level at Duplexer (C226)
Fig. 4-33-4 Output Level at Isolator Output (IS200.2.Out )
- 160 -
4. TROUBLE SHOOTING
Fig. 4-33-5 Output Level at Isolator Input (IS200.3. In)
Fig. 4-33-6 Output Level at PAM Input (C207)
Fig. 4-33-7 Output Level at RF3100(Ylva) Output (C218)
- 161 -
4. TROUBLE SHOOTING
To verify that the phone fulfils requirments on maximum output power.
Set the FDD Test of the Agillent 8960 Set the Maximum Power
TP Command MODE=4 WTXC=10700, 1,890,903,542,557 TFTI=10700
Check output power at the SW100 with antenna Cable. Refer to Figure 4-33-1
Check 1 About 22~23dBm?
Yes RF TX Level is OK Check next stage
No Check the power at the C107 with probe. Refer to Figure 4-33-2 Check 2 About 15dBm? Yes The SW100 has any problem. Change the SW100
No Check the power at the C226 with probe. Refer to Figure 4-33-3 Check 3 About 19dBm? Yes The U100 has any problem. Change the U100
No Check the power at the IS200 Out with probe. Refer to Figure 4-33-4 Check 4 About 19dBm? No Check the power at the IS200 In with probe. Refer to Figure 4-33-5 Check 5 About 17dBm? Yes The IS200 has any problem. Change the IS200 Yes The FL202 has any problem. Change the FL202
No Check the power at the C207 with probe. Refer to Figure 4-33-6 Check 6 About -6dBm? No The U203 will be not operated. Change the board Yes The U200 has any problem. You have to check PAM block.
- 162 -
4. TROUBLE SHOOTING
4.20.5 Checking PAM Block
TP19_RF PAM Input PAM Input (C207)
(C207)
TP20_RF WPA_BIAS WPA_BIAS (C206) (C206)
WCDMA PAM
TP21_RF VCC_PA VCC_PA (C212) (C212)
DC/DC converter
TP18_RF Duplexer Output Duplexer Output (C226) (C226)
Figure 4-34. Test points of WCDMA TX PAM block
- 163 -
4. TROUBLE SHOOTING
TP18_RF Duplexer Output (C226)

L 2 05 NA
22p C226 WRF_B A ND_1
FL 202 2 A NT
1 4 8
GND1 GND2 GND3
3 GND6 6 GND5 9 GND4
VCC_PA
C200 0.01u WTX_B A ND_1_EN WPA _B IA S C203 1000p U200 1 2 3 C207 WTXMOD_B A ND_I 56p 4 VCC1 ENA B L E VCONTROL RF_IN SK Y77174 PGND VCC2 GND3 RF_OUT GND2 C210 DNI C209 DNI 5 VB IA S GND1 11 10 9 8 7 6 8.2n H L 202 C211 DNI L 200 1n H
TP20_RF WPA_BIAS (C206)
C206 22p
C204 10p
C205 1000p
TP19_RF PAM Input (C207)
VB A T
C213 DNI
VB A T
C201 10u
C202 0.01u
WPA _VCC L201 3.3uH
C208 DNI
WDCDC_EN
U201 L M3208TL B1 VDD SW A1 PVIN FB C2 VCON SGND C1 EN PGND
TP21_RF VCC_PA (C212)

C212 4.7u
VCC_PA
A2 C3 B3 A3
- 164 -
4. TROUBLE SHOOTING
TP Command -mode =4 - WTXC=10700, 1,890,903,542,557
Check Duplex output (C226) To Check PAM output
No 23dBm ?
Level <10dBm? Yes
No
Download the SW & Calibrate
Yes
WCDMA PAM is OK See the Next page
Check C207 To Check PAM Input level
Level >2dBm No Yes
Check the WCDMA RF Tx Chip (Ylva)
Check C206 To Check PAM control signal from RF3100 (Ylva) (WPA_BIAS) Check C212 To Check PAM VCC BIAS from DC/DC converter (VCC_PA)
1.3V ? No Yes
Check the RF3100 to WCDMA PAM Signal line
3.2V ? No Yes
Change the DC/DC
Change The PAM
- 165 -
4. TROUBLE SHOOTING
4.20.6 Checking RX I,Q

To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q.
TP22_RF WRX_Q_ N(R205) WRX_Q_ P(R206) WRX_I_N (R207) WRX_I_P (R208)
WCDMA Transceiver (RF3100)
Figure 4-35. RF3100, WCDMA Transceiver
3 4 5 6 7 8 9 10
NC8 NC 2 L NA 1_IN TX_1 NC7 NC3 NC6 VCCL OTX VCCL ORX TXIA TXIB RF3100_OM6195HN NC5 VDD TXQA TST TXQB
U203
28 27 26 25 24 23 22 21 C227 DNI
TP204
11 12 13 14 15 16 17 18 19 20
R205 WRX_Q_N RF_CTRL _DA TA RF_CTRL _CL K 2 20 RF_CTRL _STRB WCL K C229 8.2p R207 WRX_I_N 220 R208 WRX_I_P 220 220 R206 WRX_Q_P
- 166 -
4. TROUBLE SHOOTING
Figure 4-36-1. RX I,Q signal (CW:2142MHz)
Figure 4-36-2. RX I, Q signal
- 167 -
4. TROUBLE SHOOTING
Set the CW Mode of the Agillent 8960 Feed a CW signal at 2142MHz Set the RX Continuous mode
TP Command MODE=4 WRXC=10700
Check the pk-pk level at R205,R206, R207 and R208 With Oscilloscope. Refer to Figure 4-36-1
No About 130mVp-p? Change RF3100 (U203)
Yes Check the Mean level at R205,R206, R207 and R208 With Oscilloscope. Refer to Figure 4-36-1 No About 160mV? Change RF3100 (U203)
Yes Check the frequency at R205,R206, R207 and R208 With Oscilloscope. Refer to Figure 4-36-2 No About 2MHz? Change RF3100 (U203)
Yes Verify whether the signal was similar as Figure 4-36-2 with Oscilloscope. No Similar? Change RF3100 (U203)
Yes
Check Next Stage
- 168 -
4. TROUBLE SHOOTING
4.21 Checking GSM Block

start
1. Check VRADA_2V8 VDIGRAD_1V8 U102 GSM/EDGE Transceiver RF3000 U100 GSM/EDGE PAM (+Ant. SW) (Top)
2. Check VCXO Block
3. Check FEM Module
4. Check Control Signal
5. Check RF TX Path SW100 RF switch 6. Check RF RX Path
(Bottom)
Re-download SW, Cal
Figure 4-13. GSM Block
- 169 -
4. TROUBLE SHOOTING
4.21.1 Checking Regulator Circuit

Refer to 4.15 Checking Power Source block IF you already check this point while checking power source block (4.15), You can skip this test.
4.21.2 Checking VCXO Block

Refer to 4.16 Checking VCXO block IF you already check this point while checking VCXO block (4.16), You can skip this test.
4.21.3 Checking Front End Module

Refer to 4.18 Checking Ant. SW Module IF you already check this point while checking Ant. SW module (4.18), You can skip this test.
- 170 -
4. TROUBLE SHOOTING
4.21.4 Checking Control Signal

Test Program Script MODE=0 SWTX=1,64,7
RF_CTRL_CLK (PIN8) RF_CTRL_DAT A(PIN7) RF_CTRL_STR B (PIN6)
RF3000
Figure 4-14. Test points of RF control signals
TP22_RF
1 2 3 4 5 6 7 8 9 10 TP100
PGND GNDA1 TXLB GNDA2 NC GNDA3 RX1800N RX1800P GNDA4 RX1900P RX1900N
41 40 39 38 37 36 35 34 33 32 31
11 12 13 14 15 16 17 18 19 20
WBCLK GNDA11 XON XOP GNDA12 MCLK GNDD VCCD DATAB DATAA
GNDA 5 A MMOD GNDA 7 TXHB GNDA 9 STR DA TA CL K TESTOUT MCIK REQ
U102 RF3000_OM6191HN
GNDA 6 RX900N RX900P GNDA 8 RX800P RX800N VCCA GNDA 10 DA TA C DA TA STR
30 29 28 27 26 25 24 23 22 21
- 171 -
4. TROUBLE SHOOTING
Figure 4-15. GSM RF Control signal
Check PIN6,PIN7,PIN8 of RF3000. Check if there is any Major difference. Refer to Figure 4-15 No No
Similar? Yes
Short? Yes Change the board
Re-download SW
Control signal is OK. See next page to check
- 172 -
4. TROUBLE SHOOTING
4.21.5 Checking RF Tx Path

A. GSM Tx path Level
Figure 4-16. GSM/DCS/PCS Tx Path Level
- 173 -
4. TROUBLE SHOOTING
U102 RF3000
U100 GSM/EDGE PAM (+Ant. SW)
(Top)
(Bottom)
Figure 4-17. Test Points of GSM/DCS/PCS Tx Path
- 174 -
4. TROUBLE SHOOTING
B. GSM Tx Output Level Check TP23_RF SW100 RF test connector
(Bottom)
15 16 17 18 19 20 22 24 21 23 25 26
B S2 27 B S1 28 SK Y77519
TP23_RF SW100 RF test connector
C107
22p
DNI C108
G2
SW100 K MS-518
- 175 -
G1
Figure 4-18. GSM900/DCS/PCS Tx Level at
Test Program Script 1. GSM900 Tx MODE=0 SWTX=1,64,5 2. DCS Tx MODE=2 SWTX=1,699,0 3. PCS Tx MODE=1 SWTX=1,661,0
v Agilent 8960 Setting : GSM BCH+TCH Mode v Oscilloscope Setting
Check GSM/DCS/PCS output power at Check if there is any Major difference. Refer to Figure 4-42. GSM900>32dBm DCS>29dBm PCS>29dBm
. Similar? No See Next page to check Tx path
Yes
GSM900/DCS/PCS Tx path OK. See Chapter 4.8.6 to check Rx path
- 176 -
C. GSM RF Transceiver Check
RF3000 (U102)
TP24_RF
DCS/PCS Tx (R106)
GSM900 Tx (R101)
Figure 4-19. GSM900/DCS/PCS Transceiver (RF3000)
R101 TX_EGSM
O2 G2 IN O1 G1
4 5
18
R103
R104
300
300
GSM900 Tx (R101)
FL 100
SA FEB 1G84FA 0F00 3 2
FL 101 4 5
O2 G2
SA FEB 1G96F 3 2 C126 5.6p 30 29 28 27 26 25 24 23 22 21
IN O1 G1
L 102 5.6n H
C122 5.6p
C123 5.6p
L 105 5.6n H
TP24_RF
L 106 TX_DCSPCS 2.7n H 24 R106
C125 5.6p
R107
R108
C130 3.3p
C131 2.7p
220
220
DCS/PCS Tx (R106)
VA PC RF_CTRL _STRB RF_CTRL _DA TA R109 100K TESTOUT TP100 MCL K REQ
1 2 3 4 5 6 7 8 9 10
Check GSM RF Transceiver Output power at .
GSM900/DCS/PCS >5dBm Yes
No
Redownload SW
See Next page to check Tx path
- 177 -
11 12 13 14 15 16 17 18 19 20
GNDA 5 A MMOD GNDA 7 TXHB GNDA 9 STR DA TA CL K TESTOUT MCIK REQ
U102 RF3000_OM6191HN
PGND GNDA1 TXLB GNDA2 NC GNDA3 RX1800N RX1800P GNDA4 RX1900P RX1900N
41 40 39 38 37 36 35 34 33 32 31
GNDA 6 RX900N RX900P GNDA 8 RX800P RX800N VCCA GNDA 10 DA TA C DA TA STR
4. TROUBLE SHOOTING
D. GSM PAM Check

TP25_RF TP26_RF
Vapc (U100 pin 25)
GSM900/DCFS/PCS PAM Output (C107)
GSM/EDGE PAM (+Ant. SW)
(Top)
(Bottom)
Figure 4-20. Test points of GSM900/DCS/PCS Tx
15 16 17 18 19 20 22 24
29 14 13 12 11 9 10 7 6 5 4
TP25_RF
21 23 25 26
Vapc (U100 pin 25)
B S2 27 B S1 28 SK Y77519
C107
22p
TP26_RF
GSM900/DCFS/PCS D PAM Output C1 (C107)
- 178 -
4. TROUBLE SHOOTING
Check Vapc level at . Check if there is any Major difference. Refer to Figure 4-20.
GSM900>1.5 V? DCS/PCS>1.3 V? Yes
No
Redownload SW, Cal
Check GSM900/DCS/PCS PAM output power at .
GSM900:33.0dBm DCS: 31.0dBm Yes
No
Changing GSM PAM (U100)
GSM Tx path OK. See Next page to check
- 179 -
4. TROUBLE SHOOTING
4.21.6 Checking RF Rx Path

A. GSM Rx path Level
DCS/PCS : -51.7dBm
`
GSM900 : -51.5dBm
GSM900 : -50dBm DCS : -50dBm PCS : -50dBM
Figure 4-21. GSM/DCS/PCS Rx Path Level
- 180 -
4. TROUBLE SHOOTING
GSM Transceiver U102
TP27_RF
GSM Rx PCS Rx DCS Rx
TP28_RF
GSM/EDGE PA U100
(Top)
(Bottom)
Figure 4-22. GSM900/DCS/PCS Rx path
Test Program Script 1. GSM900 Rx MODE=0 SWRX=64,2 2. DCS/PCS Rx MODE=2(DCS),1(PCS) SWRX=699,2
v Agilent 8960 Setting CW Mode GSM900 : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@Ch700(1967.8MHz) v Oscilloscope Setting
- 181 -
4. TROUBLE SHOOTING
B. GSM RF Level Check
GSM Transceiver U102
TP28_RF
PCS Rx (C114) GSM Rx (C120) DCS Rx (C112) GSM/EDGE PA U100
Figure 4-23. Test Points of GSM900/DCS/PCS Rx
DCS Rx (C112)
C112 RX1800 C113 C115 2 2p 22p
PCS Rx (C114)
22p C114 22p RX1900
L 100 10n H
L 101 10n H
FL 100 4 5
SA FEB 1G84FA 0F00
FL 101 4 5
O2 G2
SA FEB 1G96FA 0F00 3 2 C119 C121 12p 22p
IN
GSM Rx (C120)
C120 22p RX900
O2 G2 IN O1 G1
3 2
L 102 5.6n H
O1 G1
C122 5.6p
C123 5.6p
L 105 5.6n H C124
L 103 18n H C126 5.6p 12p
4 5
O2 G2 IN O1 G1
FL 102 1 SA FEB 942MFL 0F00
L 104 10n H
C125 5.6p
3 2
C127 41 40 39 38 37 36 35 34 33 32 31 C129 PGND GNDA1 TXLB GNDA2 NC GNDA3 RX1800N RX1800P GNDA4 RX1900P RX1900N 10p
O2 G2
5 6p
4 5 GNDA 6 RX900N RX900P GNDA 8 RX800P RX800N VCCA 30 29 28 27 26 25 24 23 L 107 18n H C132 10p 3 2
O1 G1
VA PC
1 2 3 4 5 6 7 8
GNDA 5 A MMOD GNDA 7 TXHB GNDA 9 STR DA TA
FL 103
IN
L1 NA
1SA FEB 881MFM0F00
U102 RF3000_OM6191HN
- 182 -
4. TROUBLE SHOOTING
v Agilent 8960 Setting CW Mode GSM900 : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz)
Check GSM900/DCS/PCS Rx signal level at . GSM900:-51.5dBm DCS/PCS:-51.7dBm
No
Change Ant. SW module (U100)
Yes GSM Rx path OK.
- 183 -
5. DOWNLOAD
5. DOWNLOAD
5.1 LGDP2
5.1.1 File map
C:\DOWNLOAD - LGDP2_V34_UMTS_KF750.exe (Execution File) - meflash.dll (EMP DLL File) - LDR Files (Loader Files) CXC1721606_A2_P6C_ACC_Pre.ldr, CXC1721607_A2_P6C_APP_Pre.ldr, CXC1721610_A2_P6C_ACC_Production.ldr, CXC1724028_1A2_P6C_APP_Large_Production.ldr C:\DOWNLOAD\Model\EMP\KF750 - KF750_080501_MP.dll (Model DLL) - SSW File (Model Binary) - MAP File (GDFS Files)
5.2.1 Frame Preference Dialog

Port Selection Select download ports. DLL Selection Select Model DLL. Download Configuration Setup DLL configuration. DLL Information Show DLL configuration information what is selected.
- 184 -
5. DOWNLOAD
5.1.3 DLL Preference Dialog

This page is depend on model DLL. To run, press Download Configuration at Frame Preference Dialog. Use USB Address If this check is unchecked, Connected phone use from Port 1 dialog. Unchcked, use fixed USB port. You should assign port number with USB Address. Image Files Select Image binary files. GDFS File Select GDFS files.
- 185 -
5. DOWNLOAD
5.2 Download
On Frame Preference Dialog, select download port and select model DLL. Add Binary images and GDFS files. Close all preference dialog and select Start Button on main page. Connect phone and wait until download finished.
* Usage fixed USB port
- 186 -
5. DOWNLOAD
5.2.1 How to run

Not Qualcomm USB Driver but EMP USB Driver assign port ID in order phone connected from ID 1. For use fixed port ID, assign port ID before download job.
5.2.2 Setting
Phone should connect just one before detect USB address. Connect phone first curl-cord. Press Set Button. Check USB Address which is loaded. Do 2 again. After assign all ports, press save dialog.
- 187 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
GSM & WCDMA RF Block
UMTS RF Filter FL200
Duplexer FL202
DCDC U201
Isolator IS200 UMTS TX Filter FL201
UMTS PAM U200 UMTS TRx U203(Ylva)
Antenna GSM PAM with FEM U100 GSM TRx U102(Gimly)
Test Conn. SW100
Crystal -26M X100
Bluetooth Antenna STLC2593C
Bluetooth U801
Figure 5-1. RF Block Diagram
- 188 -
6. BLOCK DIAGRAM
Blo ck Common
Ref. Name U100 SW100 X100
Part Name SKY77519 KMS-518 KSX-23-26000KFA-QA0R SAYZY1G95EA0B00 RF3100 (Ylva) SAFEB2G14 FA0F00 SAFEB1G95KA0F00 LM3208DS SKY77174 CES201G95DCB000 LMV221 LDC181G9519B-327 DB3150 RF3000 (Giml y) SKY77519 SAFEB942MFL0F00 SAFEB1G96 FA0F00 SAFEB1G84 FA0F00 DB3150 STLC2593
Function FEM Test Conn ector Crystal Duplexer TRx RX RF Filter Tx RF Filter DC/DC PAM Isol ator Power Detec ting Directional Couple r Modem TRx PAM Filter Filter Filter Modem Blu etooth
Com ment Band S elect Calibration, etc Reference -13M TRX TRX RX TX TX TX TX TX TX TRX TRX GSM/DCS/PCS Tri w ith FEM RX RX RX TRX TRX
WCDMA
FL202 U203 FL200 FL201 U201 U200 IS200 U202 N200 U301
GSM
U102 U100 FL102 FL101 FL100 U301
Bluetooth
U801
Table 5-1. RF Block Component
- 189 -
6. BLOCK DIAGRAM
Whole Block Diagram
- 190 -
7. CIRCUIT DIAGRAM
10
11
12
VB A T
SHIEL D CA N
A
SC100 TX_DCSPCS C100 22p C101 10n C102 10u C103 10u 1 2 3 4 5 6 7 8 9 10 11 12
A NTSW0 C104 22p A NTSW1
15 16 17 18 19 20 22 24 21 23
A NTSW2
C105 22p
C106 22p
25 26
B S2 27 B S1 28 SK Y77519 VA PC
C107
22p
DNI C108
G2
DNI
SW100 K MS-518 L 802
G1
SW101 20369-001E G1 G2 G3
C109
1n H A NT
DNI C111
TX_EGSM
VDDK _2V75
D
R100 C112 RX1800 C113 C115 22p L 101 10n H R101 TX_EGSM
O2 G2 IN O1 G1
D
22p 22p C114 22p RX1900 L 100 10n H B T_CL K REQ_n MCL K U101 SN74L VC1G125DRL R 5 1 _OE VCC 2 A 4 3 GND Y C117 0.1u R102 B T_CL K 1 18 FL 100 4 5 SA FEB 1G84FA 0F00 3 2 33 R105 100K 0
C118 4.7u
R103
R104
300
300
FL 101 4 5
O2 G2
SA FEB 1G96FA 0F00 3 2 C119 C121 12p 22p C120 22p RX900
IN O1 G1
L 102 5.6n H
C122 5.6p
C123 5.6p
L 105 5.6n H C124
L 103 18n H C126 5.6p 12p
4 5
O2 G2 IN O1 G1
FL 102 1 SA FEB 942MFL 0F00
L 104 10n H
C125 5.6p
3 2
L 106 TX_DCSPCS 2.7n H
R106 24 41 40 39 38 37 36 35 34 33 32 31 C129 PGND GNDA1 TXLB GNDA2 NC GNDA3 RX1800N RX1800P GNDA4 RX1900P RX1900N 10p
O2 G2
C127
56 p
C128
27p
RX850
4 5 L 107 18n H C132 10p 3 2

O1 G1
C130 3.3p
C131 2.7p
VA PC
RF_CTRL _STRB RF_CTRL _DA TA R109 100K TESTOUT TP100 MCL K REQ
DCL K _DA TSTR
11 12 13 14 15 16 17 18 19 20
R110
4.7K
1 2 3 4 5 6 7 8 9 10
GNDA 5 A MMOD GNDA 7 TXHB GNDA 9 ST R DA TA CL K TESTOUT MCIK REQ
GNDA 8 U102 RX800P RH X80 0N RF3000_OM6191 N VCCA
30 GNDA 6 29 RX900N 28 RX900P 27 26 25 24 23 GNDA 10 22 DA TA C 21 DA TA STR
R107
R108
220
220
FL 103
IN
L 108 NA
1SA FEB 881MFM0F00 A DOUT
A MP_L SB _FREQ_L SB
RTEMP
RF_CTRL _CL K
X100 4 1 3 2 R112 100K

TP101 TP102
R111
4.7K
VRA DA _2V8
QDA TA _A MP_MSB
27p C133
C134 10u
WCL K IDA TA _FREQ_MSB R113 100K VDIGRA D_1V8
MCL K
100K
R114 27p C135
10
11
12
- 191 -
7. CIRCUIT DIAGRAM
VCC_PA
VB A T
C200 0.01u WTX_B A ND_1_EN WPA _B IA S C206 22p C204 10p C203 1000p U200 1 2 3 C207 WTXMOD_B A ND_I 5 6p GND2 C210 DNI C209 DNI 5 VB IA S GND1 4 VCC1 ENA B L E VCONTROL RF_IN SK Y77174 PGND VCC2 GND3 RF_OUT 11 10 9 8 7 6 8.2n H L 202 C211 DNI L 200 1n H 1 2 3 L DC181G9519B -327 N200 IN GND1 M_OUT GND2 6 5 4 WDCDC_EN IS200 CES201G95DCB 000 GND1 GND2 OUT IN GND3 GND4 WTX_B A ND_1 WPA _VCC
C201 10u
C202 0.01u
C205 1000p
VCC_PA
C208 DNI
C_OUT TERMINA TE
U201 L M3208TL B1 SW VDD A1 PVIN FB C2 V CO N SGND C1 EN PGND
A2 C3 B3 A3 C212 4.7u
C213 DNI WPOW_SENSE
47
VB A T
R200
VRA DA _2V8
C214 0.1u
C215 10 p
C217 DNI FL 200 4 5

O2 G2
C216 56p U202 SA FEB 2G14FA 0F00 3 2 VRA DA _2V8 R202 WPOW_SENSE 220 R203 R204 L203 5.6nH 62 62 2 3 1 1
O1 G1
L MV221 OUT RE F DAP EN 6 5 4
R201 WPOW_DET 1K
5 2 WTXMOD_B A ND_I 4 1 SA FEB 1G95K A 0F00 3 FL 201 C220 DNI C221 DNI
G2 G1 IN OUT G3
C218 56p VRA DA _2V8
IN
VD D RF_IN G ND
L201 3.3uH
C219 33n F
C222 DNI
VRA DA _2V8
WPA _B IA S WPA _VCC WPOW_DET_EN 41 40 39 38 37 36 35 34 33 32 31 VDIGRA D_1V8 VRA DA _2V8
C223 DNI
WTX_I_P WTX_I_N WTX_Q_P WTX_Q_N

TP200 TP201 TP202 TP203
1 2 3 4 5 6 7 8 9 10
PGND VCCTX RF_DAC2 RF_DAC1 NC13 MIX1_B MIX1_A NC12 NC11 NC10 VCCRX
GNDTX NC1 NC2 TX_1 NC3 VCCL OTX TXIA TXIB TXQA TXQB
U203
RF3100_OM6195HN
NC9 L NA 1_OUT NC8 L NA 1_IN NC7 NC6 VCCL ORX NC5 VDD TST
30 29 28 27 26 25 24 23 22 21 C227 DNI C228 DNI
C224
5.6p
C225 WRX_B A ND_1 56p L 204 4.7n H 22p C226 WRF_B A ND_1 L 205 NA
TP204
11 12 13 14 15 16 17 18 19 20
FL 202 2 A NT
R 205 WRX_Q_N RF_CTRL _DA TA RF_CTRL _CL K 220 RF_CTRL _STRB WCL K C229 8.2p R207 WRX_I_N 220 R208 WRX_I_P 220 220 R206 WRX_Q_P
1 4 8
G ND1 GND2 GND3
3 GND6 6 G ND5 9 GND4
- 192 -
7. CIRCUIT DIAGRAM
4
VDDF_2V5
5
VDDE_1V8
6
VCORE
10
11
12
R300
R301
R302
QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR
WTX_BAND_1_EN
RF_CTRL_CLK RF_CTRL_STRB RF_CTRL_DATA
WDCDC_EN WPOW_DET_EN
ACC_PCM_CLK ACC_PCM_SYNC ACC_PCM_ULD ACC_PCM_DLD
C300
1u
0 C302
C301
1u
1u
TX_ADC_STRB
TP300
VDDE_1V8
WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P
WPOW_DET
WTX_I_N WTX_I_P WTX_Q_N WTX_Q_P
ANTSW0 ANTSW1 ANTSW2
0.1u 0.1u 0.1u 0.1u
0.1u
0.1u 0.1u 0.1u
0.1u
C305 0.1u
R304 0
33n
33n
0.1u 0.1u
C306 C307
C303 C304
C312
C313 C314 C315
C316 C317 C318 C319
C321
R305
100K
AB12 C325 AB11 AB15 C326 AB14
AA10 W11 AA6 AA9 L2
AA12 AB13
A11 AB17 A18 E22 B2 L1 K1 M22 T22 W1
A10 A2 A22 E1 A7 AA1 AA11 AA22 AB1 AB2 AB21 AB22 B1 B22 A16 B21 K22 N1 R22 T1 Y11 AA14
Y10 W10 W9 Y9
W4 W5 Y5 AA5 W2
AB8 V7 AB5 AB6
AB4 AB3 AA4 AA3
Y4 AA2 Y3 Y2
AB7
C323 C324
C308 C309 C310 C311
C320
C322
0.1u 0.1u
0.1u
0.1u 0.1u
0.1u 0.1u 0.1u 0.1u
0.1u
W6 Y13
TX_POW
EFUSE_HV4
VDDCO_1V2_00 VDDCO_1V2_01 VDDCO_1V2_02 VDDCO_1V2_03 VDDCO_1V2_04 VDDCO_1V2_05 VDDCO_1V2_06 VDDCO_1V2_07 VDDCO_1V2_08 VDDCO_1V2_09 VDDCO_1V2_10 VDDCO_1V2_11 VDDCO_1V2_12 VDDCO_1V2_13 VDDCO_1V2_14 VDDCO_1V2_15 VDDCO_1V2_16 VDDCO_1V2_17 VDDCO_1V2_18 VDDCO_1V2_19 VDDCO_1V2_20 VDDCO_1V2_21
VDDIO_2V5_1 VDDIO_2V5_2
ANT_SW0 ANT_SW1 ANT_SW2 ANT_SW3 TX_ADC_STRB
VDDIO_1V8_00 VDDIO_1V8_01 VDDIO_1V8_02 VDDIO_1V8_03 VDDIO_1V8_04 VDDIO_1V8_05 VDDIO_1V8_06 VDDIO_1V8_07 VDDIO_1V8_08 VDDIO_1V8_09
DAC_I_NEG DAC_I_POS DAC_Q_NEG DAC_Q_POS
PCMCLK PCMSYN PCMULD PCMDLD
ADC_I_NEG ADC_I_POS ADC_Q_NEG ADC_Q_POS
RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN
RF_CTRL_CLK RF_CTRL_STRB RF_CTRL_DATA RF_CTRL_RESERVED
PLL_26_FILTVDD PLL_26_VCONT PLL_PG_416_FILTVDD PLL_PG_416_VCONT
RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB
VDDCO_PLL_1 VDDCO_PLL_2
VCCAD VDDAD VCCDA VCCGPAD VDDCO_AF
TP301
NA1 NA2
G18 V6
Y8 W8 W7 Y7
V4 W3 V5 Y1
L9
SD_A DDR(1: 13) C2 C1 D2 D1 E3 E2 F2 G2 F1 G1 H1 H2 J1 J2 K2 C3 D3 E5 E4 F5 F4 F3 G3 G4 G5 H3 H4 J4 J3 K4 K3 B5 D4 A4 B4 C4 C5 B3 A3 B 13 A 12 A 13 A 14 B 14 B 15 A 15 B 16 C 16 A 17 B 17 C18 B 18 A 20 A 19 B 19 B 20 C20 C19 C21 D21 C22 D20 D22 E21 F22 D12 C12 D 13 C13 D14 C14 D15 C1 5 D1 6 E16 C1 7 D17 E17 D18 E18 D19 E6 E7 J 10 A9 D9 C10 B 11 B 10 D10 C11 D11 B 12 B9 C9 EMIF2_D(0) EMIF2_D(1) EMIF2_D(2) EMIF2_D(3) EMIF2_D(4) EMIF2_D(5) EMIF2_D(6) EMIF2_D(7) EMIF2_D(8) EMIF2_D(9) EMIF2_D(10) EMIF2_D(11) EMIF2_D(12) EMIF2_D(13) EMIF2_D(14) EMIF2_D(15)
NA ND CS NF_CE_n MMP_CS_n ZORA N CS SD_CS2_n 1Gb i t s SDRA M 2n d CS NF_MMP_RE_OE_n NF_MMP_WE_n
MCL K SYSCL K 0 SYSCL K 1 USB _XTA L 1 PWRRST_n
W14 MCL K Y16 SYSCL K 0 Y15 SYSCL K 1 W16 SYSCL K 2
TP303
C327 1000p
RESOUT0_n RESOUT1_n RESOUT2_n
P11 PWRRST_N V18 RESOUT0_N A B 16 RESOUT1_N A A 16 RESOUT2_N A A 17 Y14 V16 W15 V17 A A 15 W18 N2 M1 M2 M3 P1 N3 A 21 A1 D6 A5 C6 D5 B6 A8 D8 C8 D7 B8 C7 B7 A6 SERVICE_N MCL K REQ SYSCL K REQ_N RTCCL K IN A CCSL EEP A PPSL EEP DCON TCK TMS TDI TDO TRST_N RTCK TEMU0_N TEMU1_N ETM_PSTA T0 ETM_PSTA T1 ETM_PSTA T2 ETM_TSYNC ETM_TCL K ETM_TPK T0 ETM_TPK T1 ETM_TPK T2 ETM_TPK T3 ETM_TPK T4 ETM_TPK T5 ETM_TPK T6 ETM_TPK T7
Q300 C R306 VPPFL A SH 100K E B

IN
OUT
TP306
SD_DA TA (0: 15) SD_DA TA (0) SD_DA TA (1) SD_DA TA (2) SD_DA TA (3) SD_DA TA (4) SD_DA TA (5) SD_DA TA (6) SD_DA TA (7) SD_DA TA (8) SD_DA TA (9) SD_DA TA (10) SD_DA TA (11) SD_DA TA (12) SD_DA TA (13) SD_DA TA (14) SD_DA TA (15) B3 C4 C3 D4 D3 E4 E3 F4 J4 K3 K4 L3 L4 M3 M4 N3 DQ0 DQ1 DQ2 DQ 3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
DNU1 DNU2 DNU3 DNU4 DNU5 DNU6 DNU7 DNU8 DNU9 DNU10 DNU11 NC1 NC2 NC3 NC4 NC5
RN1107
GND
MCL K REQ B T_CL K REQ_n RTCCL K A CC_SL EEP A PP_SL EEP DCON
EMIF1_A 01 EMIF1_A 02 EMIF1_A 03 EMIF1_A 04 EMIF1_A 05 EMIF1_A 06 EMIF1_A 07 EMIF1_A 08 EMIF1_A 09 EMIF1_A 10 EMIF1_A 11 EMIF1_A 12 EMIF1_SDB S0_A 13 EMIF1_SDB S01_A 14 EMIF1_SDB S1_A 15 EMIF1_D00 EMIF1_D01 EMIF1_D02 EMIF1_D03 EMIF1_D04 EMIF1_D05 EMIF1_D06 EMIF1_D07 EMIF1_D08 EMIF1_D09 EMIF1_D10 EMIF1_D11 EMIF1_D12 EMIF1_D13 EMIF1_D14 EMIF1_D15 EMIF1_SDCS_N EMIF1_SDCL K EMIF1_SDCK EN EMIF1_SDCA S_N EMIF1_SDRA S_N EMIF1_WE_N EMIF1_B E0_N EMIF1_B E1_N
SD_B A 0 SD_B A 1 SD_DA TA (0) SD_DA TA (1) SD_DA TA (2) SD_DA TA (3) SD_DA TA (4) SD_DA TA (5) SD_DA TA (6) SD_DA TA (7) SD_DA TA (8) SD_DA TA (9) SD_DA TA (10) SD_DA TA (11) SD_DA TA (12) SD_DA TA (13) SD_DA TA (14) SD_DA TA (15) SD_CS_n SD_CL K SD_CK E SD_CA S_n SD_RA S_n SD_WE_n SD_DQML _n SD_DQMU_n
A2 A9 A10 B1 B10 N1 N10 P1 P2 P9 P10 B2 B7 B9 F3 J3
SD_A DDR(1) SD_A DDR(2) SD_A DDR(3) SD_A DDR(4) SD_A DDR(5) SD_A DDR(6) SD_A DDR(7) SD_A DDR(8) SD_A DDR(9) SD_A DDR(10) SD_A DDR(11) SD_A DDR(12) SD_A DDR(13)
TP302
TP304
TP305
J TA G CONNECTOR
R307
100K
Rev _D
SD_CS2_n
ETM CONNECTOR
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A 10 A 11 A 12
C7 C8 C9 B8 M9 L9 K9 J9 H7 H8 D9 H9 G7
SD_A DDR(1) SD_A DDR(2) SD_A DDR(3) SD_A DDR(4) SD_A DDR(5) SD_A DDR(6) SD_A DDR(7) SD_A DDR(8) SD_A DDR(9) SD_A DDR(10) SD_A DDR(11) SD_A DDR(12) SD_A DDR(13)
VDDE_1V8
TP315
SD_CS_n
D
A CC_IRQ_n A PP_IRQ_n I2S0_CL K I2S0_WS I2S0_UL D I2S0_DL D HPCM_PCM_CL K HPCM_PCM_SYNC HPCM_PCM_DOUT HPCM_PCM_DIN
A B 20 MSA CCIRQ_N A A 20 MSA PPIRQ_N R20 R19 T21 T19 T20 U22 U20 U21 I2S0CL K I2S0WS I2S0UL D I2S0DL D I2S1CL K I2S1WS I2S1UL D I2S1DL D
U301 DB 3150
VDDE_1V8
R308
10K
TO ZORA N(I2S1)
SRST_n SCL K SDA T
P10 SRST_N U5 SCL K P9 SDA T
GPIOs E
A CC_GP00_USB _STP A CC_GP01_USB _DIR A CC_GP02_UA RT0_RX A CC_GP03_UA RT0_TX A CC_GP04_USB _CL K A CC_GP05_USB _NXT A CC_GP06_USB _DA T4 A CC_GP07_USB _DA T5 A CC_GP10_USB _DA T6 A CC_GP11_USB _DA T7 A CC_GP12_TOUCH_L DO_EN A CC_GP13_SPK _A MP_EN A CC_GP14_B T_SPI_INT ZR ENA B L E PIN#1 A CC_GP15_FL IPSENSE A CC_GP16_FM_GPIO2 A CC_GP17_PHFSENSE A CC_GP20_USB _CS_PD A CC_GP21_VC_IO_OFF A CC_GP22_USB _DA T3 A CC_GP23_B T_SPI_CS0n A CC_GP24_B T_SPI_DA T0 A CC_GP25_B T_SPI_DA T1 A CC_GP26_B T_SPI_CL K A CC_GP27_A MP_SW_EN
J9 K9 P2 N9 M9 N4 P3 P4 R4 R3 R2 R1 T2 T4 U1 T3 T5 U4 V3 V1 U2 U3 V2 R21 M14 N14 P13 P14 N22 N21 M21 L 22 N20 N19 P21 P22 P19 P20 P12
A CC_GPIO_0 A CC_GPIO_1 A CC_GPIO_2 A CC_GPIO_3 A CC_GPIO_4 A CC_GPIO_5 A CC_GPIO_6 A CC_GPIO_7 A CC_GPIO_8 A CC_GPIO_9 A CC_GPIO_10 A CC_GPIO_11 A CC_GPIO_12 A CC_GPIO_13 A CC_GPIO_14 A CC_GPIO_15 A CC_GPIO_16 A CC_GPIO_17 A CC_GPIO_18 A CC_GPIO_19 A CC_GPIO_20 A CC_GPIO_21 A CC_GPIO_22 A CC_GPIO_23 A PP_GPIO_0 A PP_GPIO_1 A PP_GPIO_2 A PP_GPIO_3 A PP_GPIO_4 A PP_GPIO_5 A PP_GPIO_6 A PP_GPIO_7 A PP_GPIO_8 A PP_GPIO_9 A PP_GPIO_10 A PP_GPIO_11 A PP_GPIO_12 A PP_GPIO_13 A PP_GPIO_14 AA21 I2CSCL Y20 I2CSDA W20 I2CSCL2 Y21 I2CSDA2
AA13 VSSCO_PLL_1 Y12 VSSCO_PLL_2
L4 USB_DAT_VP L3 USB_SE0_VM M4 USB_OE
VSSAD GNDAD VSSDA VSSGPAD VSSCOMMON
MCCLK MCCMD MCCMDDIR MCDAT0 MCDAT1 MCDAT2 MCDAT3 MCDATADIR
PDI_RES_N PDI_C0 PDI_C1 PDI_C2 PDI_C3 PDI_C4 PDI_C5 PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7
A PP_GP00_UA RT_RX A PP_GP01_UA RT_TX A PP_GP02_MMP_INT_n A PP_GP03_MMP_PWR_EN A PP_GP04_TOUCH_SCREEN_INT A PP_GP05_TOUCH_SCREEN_SCL MICROSD_DA T3 A PP_GP07_3A XIS_INT A PP_GP10_MMP_RESET_N A PP_GP11_REMOTE_INT A PP_GP12_L CD_ID A PP_GP13_MC_CL K RET SUB _PM_RESETB MOTOR_EN A PP_GP16_TOUCH_SCREEN_SDA
EMIF2_D00 EMIF2_D01 EMIF2_D02 EMIF2_D03 EMIF2_D04 EMIF2_D05 EMIF2_D06 EMIF2_D07 EMIF2_D08 EMIF2_D09 EMIF2_D10 EMIF2_D11 EMIF2_D12 EMIF2_D13 EMIF2_D14 EMIF2_D15 EMIF2_CS0_N EMIF2_CS1_N EMIF2_CS2_N EMIF2_SDCA S_RE_OE_N EMIF2_WE_N EMIF2_SDCL K EMIF2_CL K EMIF2_FB CL K EMIF2_SDCL K EN EMIF2_SDRA S_A DV_N EMIF2_B E0_N EMIF2_B E1_N EMIF2_NFIF_REA DY EMIF2_WA IT_N CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7
2G v 1.8 x 8 NA ND + 1G v 1.8 x 16 SDRA M(MCP)

SD_CKE2
G4 G5 G6 H5 H6 K5 K6 K7 K8 M5 M6 M7 M8 N2 N9
EMIF2_A 01 EMIF2_A 02 EMIF2_A 03 EMIF2_A 04 EMIF2_A 05 EMIF2_A 06 EMIF2_A 07 EMIF2_A 08 EMIF2_A 09 EMIF2_A 10 EMIF2_A 11 EMIF2_A 12 EMIF2_SDB S0_A 13 EMIF2_SDB S01_A 14 EMIF2_SDB S1_A 15 EMIF2_A 16 EMIF2_A 17 EMIF2_A 18 EMIF2_A 19 EMIF2_A 20 EMIF2_A 21 EMIF2_A 22 EMIF2_A 23 EMIF2_A 24 EMIF2_A 25 EMIF2_CRE_A 26
SD_CL K SD_CK E SD_WE_n SD_B A 0 SD_B A 1 SD_RA S_n SD_CA S_n SD_DQML _n SD_DQMU_n EMIF2_D(00: 07)
E9 E8 H4 G8 F8 D7 D8 E7 F7 G3 H3
_CS1 _CS2 CL K CK E1 _WED BA0 BA1 _RA S _CA S L DQM UDQM
B4 VDD1 G9 VDD2 H2 VDD3 M2 VDD4 D2 VDDQ1 F2 VDDQ2 K2 VDDQ3 C2 VSS1 F9 VSS2 G2 VSS3 N4 VSS4 E2 VSSQ1 J2 VSSQ2 L2 VSSQ3 B6 VCC1 N7 VCC2 VCCQ N6 C333 0.1u C334 0.1u C335 0.1u VDDE_1V8 C328 0.1u C329 0.1u C330 0.1u C331 0.1u C332 0.1u
U300 K A L 00900B M-DJ 55
VDDE_1V8
EMIF2_A (11) EMIF2_A (12) EMIF2_A (13) EMIF2_A (14) NF_CE_n NF_CL E NF_A L E NF_A L E NF_CL E NF_MMP_RE_OE_n NF_REA DY NF_MMP_WE_n RESOUT0_n
R309
2.2K
EMIF2_D(0) EMIF2_D(1) EMIF2_D(2) EMIF2_D(3) EMIF2_D(4) EMIF2_D(5) EMIF2_D(6) EMIF2_D(7) TP324
J5 L5 J6 L6 J7 L7 J8 L8
IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7
C6 F6 D5 C5 E5 E6 D6 F5
EMIF2_D(00: 15)
NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20
_CE CK E2 ALE CL E _ RE R__B _ WE _WP
B5 VSS5 N5 VSS6 N8 VSS7
R310 DNI
SD_CK E2
NF_REA DY
G
A PP_I2C Vo l t ag e Ch an g ed 2007.10.01
E20 CI_RES_N F20 CI_PCLK E19 CI_VSYNC F18 CI_HSYNC
KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5
GND_00 GND_01 GND_02 GND_03 GND_04 GND_05 GND_06 GND_07 GND_08 GND_09 GND_10 GND_11 GND_12 GND_13 GND_14 GND_15 GND_16 GND_17 GND_18 GND_19 GND1_1 GND1_2 GND1_3
VDDE_1V8
VDDE_1V8
Y22 W19 V22 V20 W22 V19 W21 V21 U18 U19 T18
Y19 AA19 Y18 Y17 AB19 AB18 AA18 W17
K10 K11 K12 K13 K14 L10 L11 L12 L13 M10 M11 M12 M13 N11 N12 N13 J11 J12 J13 J14 N10 W12 W13
AB9 AB10 AA7 Y6 AA8
R312 3300 R313 3300 R314 3300 R315 3300 R311
SHARED_I2C_SCL SHARED_I2C_SDA APP_I2C_SCL APP_I2C_SDA
KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5
L14 M20 M19 L21 L20 L19 K19 K20 J19 K21 J20 J21 J22 H19 H20
TP325
CI_RES_n CI_PCLK CI_VSYNC CI_HSYNC
LCD_RESET_N LCD_VSYNC LCD_WE_N LCD_ADS_N LCD_CS_N LCD_RD_N
MICROSD_CLK MICROSD_CMD MICROSD_CMD_DIR MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_DAT_DIR
LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]
USB_DAT1 USB_DAT0 USB_DAT2
F19 G21 F21 G20 H21 G19 G22 H22
MICROSD c o n n ec t ed w i t h ZORA N 2007.09.25 MICROSD c o n n ec t ed w i t h DB 3150 2007.10.01
10
11
12
- 193 -
7. CIRCUIT DIAGRAM
10
11
12
Fr o m VB UCK
MMP_VDD_CORE_1.0V
Fr o m VB UCK
MMP_VDD_1.9V
VDDG_2V75 CAM_VDD_1.8V
CA M_VDD_1.8V
MMP_VDD_CORE_1.0V
VDDG_2V75
VDDE_1V8
27Mh z XTA L
MMP_XTA L _IN APP_GP10_MMP_RESET_N C401 0.1u C402 0.1u C403 0.1u C404 0.1u C405 0.1u C406 10p C400 10u FA -238_27MHz_9PF X400
4 1 3 2
MMP_XTA L _OUT
B
0
27MHz MMP_VDD_1.9V VDDE_1V8 C407 8p C408 8p
R400
FB400
FB401
C410 0.1u 0.1u 1u
C 4 11 10p
C412 C413 DNI 0.1u
C414 0.1u
C415 0.1u
C416 10p
C409 10u
0.1u
C417 C418
1u
DNI
C419
C420
R401
C413 REMOVED 2007.10.01
D10 D9 G4 H4 K10 R402 M8 D6 G2
E10
K4 L4
TCK TDO TDI TMS TRSTN
VDDQ2 VDDQ1
VDD_PMU VDD_HOST VDD_SERIAL VDD_GENERAL VDD_NAND VDD_CIS VDD_LCD VDD_MMC
VDDCORE1 VDDCORE2 VDDCORE3 VDDCORE4
AVDD_VDACI AVDD_VDACP
AVDD_USBT AVDD_USBC
AVDD_PLL
RESETN
TEST
F14
D8 F4 J11 L7
D7 L6
H11 G11
D11 D13 E12 E14 D14
G13
TP400
NF_MMP_RE_OE_n NF_MMP_WE_n A PP_GP02_MMP_INT_n EMIF2_A (11) EMIF2_A (12) EMIF2_A (13) EMIF2_A (14) EMIF2_D(0) EMIF2_D(1) EMIF2_D(2) EMIF2_D(3) EMIF2_D(4) EMIF2_D(5) EMIF2_D(6) EMIF2_D(7) EMIF2_D(8) EMIF2_D(9) EMIF2_D(10) EMIF2_D(11) EMIF2_D(12) EMIF2_D(13) EMIF2_D(14) EMIF2_D(15)
TP402 TP403
3 P12 P10 M12 K 12 P8 N8 P9 M10 N10 N9 N11 P11 N12 N7 L8 P13 L9 N13 M11 M9 B5 A5 B6 B4 A4 C3 A3 A2 A1 B2 B1 B3 C1 C2 C5 C6 D3 D1 A6 D2 D5 C4 D4 E1 E4 E3 E2 H3 H1 R425 0
TP411 TP412
PGND
MMP_CS_n
B8 A8 B7 B9 A7
HCS0N HCS1N HRDN HWRN HGINTN
SDA T0 SDA T1 SDA T2 SDA T3 SCMD SCL K SWP VMCL K VPCL K VHREF VVS VIDA VIDB VIDC VIDD VIDE VIDF VIDG VIDH VIDI VIDJ VIDK VIDL VIDM VIDN VIDO VIDP L D0 L D1 L D2 L D3 L D4 L D5 L D6 L D7 L D8 L D9 L D10 L D11 L D12 L D13 L D14 L D15 L D16 L D17 L CS0N L CS1N L RDN L WRN LA0 L CK L HS L VS L A CT HPCMCL K HPCMFS HPCMDO HPCMDI A MCL K A B CL K A FS A DO A DI UDP UDN UVB US UID URSET
F1 F2 E5 F3 H2 G1 G3 MMP_CA M_MCL K MMP_CA M_PCL K MMP_CA M_HSYNC MMP_CA M_VSYNC
VB A T
DCDC FOR EL
MIC94071YMT Q400 4 EN VIN VOUT GND 1 2 U400 1 2 OUT VIN EN A NGD PGND SW FB NC T_GND 8 R404 7 6 5 9 L 400 10u H
VREG_6.1V
TP404 TP406 TP407 TP408
A 10 HA 11 A9 HA 12 C8 HA 13 C7 HA 14 D12 C10 C12 C13 C14 B 14 C11 B 13 A 14 A 13 B 12 A 12 B 11 A 11 C9 B 10 L 13 M13 L 12 L 11 K 13 M14 L 14 L 10 J 12 H12 K 14 G12 J 13 H13 K 11 HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 HD8 HD9 HD10 HD11 HD12 HD13 HD14 HD15 NCSN NA L E NCL E NREN NWEN NRB N ND0 ND1 ND2 ND3 ND4 ND5 ND6 ND7 ND15
EL _DCDC_EN C422 2.2u
3 4
20K
R406
MMP_CA M_DA TA [ 0] MMP_CA M_DA TA [ 1] MMP_CA M_DA TA [ 2] MMP_CA M_DA TA [ 3] MMP_CA M_DA TA [ 4] MMP_CA M_DA TA [ 5] MMP_CA M_DA TA [ 6] MMP_CA M_DA TA [ 7] MMP_CA M_DA TA [ 8] MMP_CA M_DA TA [ 9] MMP_CA M_DA TA [ 10] MMP_CA M_DA TA [ 11] CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7
MIC2290YML
DC/DC MOVED ON MA IN PCB 2007.10.01
EMIF2_D(00: 15)
L CD[ 0: 7] = VGA D[ 0: 7] 2007.10.01
E
CI_HSYNC CI_HSYNC_WITHOUT_FF CAM_VDD_1.8V
U404 ZR3453
5.1K
C421 4.7u
MMP_VDD_1.9V
VB A T
DC/DC FOR ZORA N
MMP_VDD_CORE_1.0V
R413
R414 C423 10u C424 1u 1 U403 MIC2238_A A YML 12 FB 2 FB 1 E N2 A VIN SW2 EN1 PGOOD VIN 11 10 9 R415 DNI 2 R416 100K 3 4 L 401 R422 C426 22p 180K 4.7u H 5 6 13
L CD CONNECTED ON DB 3150 2007.10.01
R815
0 CI_PCL K C820 DNI A PP_GP03_MMP_PWR_EN
F
EL _DCDC_EN
R418 1K
R417 1K
N2 SPICL K K3 SPICS L2 SPIDO J3 SPIDI M4 UA RTTX N3 UA RTRX M1 UA RTRTS L1 UA RTCTS N14 SCL P14 SDA P2 M3 P7 N1 P1 M5 N6 M6 P5 N5 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9
TP410
F
L 402 4.7u H R424 22p C425 68K C427 2.2u
CI_HSYNC_WITHOUT_FF CI_VSYNC_WITHOUT_FF
SUB PM I2C DISCONNECTED WITH ZR 2007.10.01
8 SW1 A GND PGND 7 T_GND _FPWM
2.2u
R427
MMP_CA M_RESET_N MMP_CA M_PWR_EN MMP_CA M_PWDN FL A SH_L ED_EN FL A SH_L ED_TORCH FL A SH_L ED_INH
I2S1_CL K I2S1_WS I2S1_UL D I2S1_DL D

ZORA N USB DOESTNT USE 2007.10.01
C429
22p
AGND_VDAC
E13 VENBYPIN E11 VENBYPOUT
XTALIN
R433
2.2u H C430 330p C431 330p
390
75
TV_OUT
R434
F6 F7 F8 F9 G6 G7 G8 G9 H6 H7 H8 H9 J6 J7 J8 J9
GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 GND12 GND13 GND14 GND15 GND16
L 403
AVSS_PLL
H14
F12
J14
MMP_XTAL_IN
MMP_XTAL_OUT
F11
K5 L5
AGND_USBT AGND_USBC
G14 TVDA TA F13 TVREF
P3 P4 J4 P6 M7
R432
CI_VSYNC_WITHOUT_FF A PP_GP05_TOUCH_RESET CI_VSYNC
130K
C428
R429
N4 M2 K2 K1 L3
TP413
270K
R430
R428
47K
J2 J1
HPCM_PCM_DIN HPCM_PCM_DOUT
DNI
MMP_I2C_SCL MMP_I2C_SDA
HPCM_PCM_CL K HPCM_PCM_SYNC
XTALOUT
10
11
12
- 194 -
7. CIRCUIT DIAGRAM
10
11
12
A
VDDD_1V5 SHARED_I2C_SDA SHARED_I2C_SCL
3
ONSWA_n ONSWB_n DCON ACC_IRQ_n APP_IRQ_n PWRRST_n
VBACKUP
TRICKLE
KEY_LED1 KEY_LED2 SUB_LED
SYSCLK1 ACC_SLEEP APP_SLEEP
ADOUT
Q500 KTN2222AU
TX_ADC_STRB
MOTOR_PWM
HOOK REMOTE_ADC TESTOUT RTEMP
VRADA_2V8 VDDD_1V5 VDDE_1V8 VDIGRAD_1V8
VBAT
R500
100K
R501
VBAT
100
VBAT RB521S-30 VRADA_2V8
to WCDMA & GSM PAM, Backlights, Speaker Amp, USB/RMT Switch, and Ext. LDOs to RF3000, RF3100 analog and WCDMA Power Detector
D500
VDDD_1V5 R504 VDDE_1V8 0
to AB3000 CODECs/ADC/PLL to All I/O Supplies and Memory to RF3000 and RF3100 digital
B
H12 SDA H10 SCL D8 A10 B10 C9 D9 E9 F11 E11 F10 H11 TXON G4 ADSTR B9 ADOUT C8 VDDADC K4 MCLK J10 SLEEPA L12 SLEEPB C7 ONSWA_N B8 ONSWB_N G9 ONSWC J9 IRQA_N L11 IRQB_N H9 PWRRST_N A6 LED1 D6 LED2 B7 LED3 B6
VDIGRAD_1V8 C501 1u C502 1u C503 2.2u VDDC_2V65 VDDH_SMB_2V75 VDDF_2V5 VDDG_2V75 VDDK_2V75
VIBR
4.7u C504 4.7u C505 1u D11 E12 A12 A8 M11 VBAT_C A5 C10
GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 GPA6 GPA7 GPA12
C500
VBAT_A VBAT_B
C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E A11 VDD_C B12 VDD_H A9 VDD_F A7 VDD_G VDD_K VDDLP M12 J11 C506 1u C507 1u C508 1u C509 1u C510 1u C511 33nF
VBAT_E VBAT_F VBAT_G VBAT_C MOD1
VDDC_2V65 VDDH_SMB_2V75 VDDF_2V5 VDDG_2V75 VDDK_2V75 R505 VBACKUP 2.2K
to Hall Switch, AB3000 BEAR and Headphone Amp. 3 Axis Accelerator to DB3100 analog to SD Card and LCD to Bluetooth to AB3000 RTC module
300K
X500 2 1 32.768KHz C512 24p
K12 XTAL1 K11 XTAL2 C513 24p RTCCLK J12 32KHZ VBUCK VDDBUCK TP501 G10 SIMOFF_N K2 SRST_N J3 SCLK K3 SDAT H4 SWBUCK B2 A2 A1
VBAT_C 1608 120ohm(@100MHz) FB500 BLM18PG121SN1J
VBAT VCORE
VBAT R506
2.8*2.6*1.0 0.7A? 20% L500 4.7uH VCORE RB521S-30 D502 to DB3100 CORE
Close to Pin 1 KDS221E_RTK
C1
A2
D501
A1_C2 3
SRST_n SCLK SDAT
C514 10u B1 D1 C518 0.1u 0603 10V SIMVCC
C515 0.1u 0603
C516 10u
BDATA FGSENSE+
VSSBUCK PBIAS
CN500 1
33u
G1
G2
Battery Conn.
R508 0603 2012 1% 1/4W
C517
R509 Close to Pin 3 0.025 R511 0603 0
SIMVCC
F1
Use Multiple Vias
VBAT
FGSENSE-
U502 AB3000-R2B

TP502 TP503 TP504 TP505
C520 1u Close to AB
R512
H1 E1
VBAT_D CHSENSE+
BATT_GND 2012 1% 1/4W Q501 SIA911DJ R513 0.1 route as a differential pair
F2
CHSENSE-
D4 SCK1 D3 WS1 C2 SDI1 C1 SDO1 E4 SCK2 C3 WS2 D2 SDI2 F4 SDO2 MIC1P MIC1N MIC2P MIC2N MIC3P MIC3N MIC4P MIC4N K8 J8 L8 M9 M10 H8 K9 L9
I2S0_CLK I2S0_WS I2S0_ULD I2S0_DLD I2S1_CLK I2S1_WS I2S1_ULD I2S1_DLD MIC1P MIC1N MIC2P MIC2N FM_RP FM_LP
E
S1 D1
G1
E2
CHREG
TP508 TP509
D3
DCIN_A
D4
D2
C522 C523
1u 1u
G2 S2
VBUS R515 47K
TRICKLE
G1
TRICKLE CCO1 CCO2 SPKRP SPKRN BEARP BEARN AUXO1 AUXO2 LINEIN1 LINEIN2 MIDR
J7 VDDD_1V5 VDDC_2V65 VBAT L6 L3
VDD_ADC1 VDD_ADC23 VDD_SPKR VDD_BEAR VDD_CODEC VDD_DIG VDD_PLL
F
K5 R516 15 C526 0.1u 0603 VDDE_1V8 F9 M8 E3 M1
M7 K7 M2 M3 M4 J6 K6 M6 L 10 K10 L5 47n C527 22p C529 22p C530 22p C528 22p
CCO1 CCO2 SPKRP SPKRN BEARP BEARN EAR_R EAR_L
Speaker Amp.
VBAT
MIDR R517 1% 39K C525 2.2u BEARP C1 ACC_GP13_SPK_AMP_EN C531 SPKRP C532 SPKRN 47n 47n 1 % 10K R50 26 00 3 C2 R50 26 10 1 % 10K 3 C3 100K 220n B1 BYPASS _SHUTDOWN IN+ INU500 GND VO VO+ VDD B2 A1 B3 4 A3 BEARN R519 1% 15 2 3 R518 1% 15 10 1 U501 FSA2268TUMX 8 1A 1B0 1B1 2B0 2B1 GND S1 2A S2 VCC 7 5 VBAT 6 9 C535 10n 0603 SPK_RCVSPK_RCV+
J5 C524 DEC3 J4 DEC4
VDD_IO
VSS_DIG VSS_CODEC VSS_BEAR VSS_SPKRP VSS_SPKRN VSS_PLL
C533 DNI 0603
C534 0.1u 0603
OTP_TEST
F7 VSSTH1 G7 VSSTH2 G6 VSSTH3
VSSTH5 VSSTH6 VSSTH7 VSSTH8 VSSTH9 VSSTH10 VSSTH11 VSSTH12
100K
E8 TEST D10 VREF H3 IREF
SWBOOST BOOST_ISENSE+ BOOST_ISENSEV_BOOST BOOST_SW1 BOOST_SW2 BOOST_SW3 BOOST_FB+ VSSBOOST
A4 B5 C5 B3 C4 B4 A3 D5 E5
TPA6205A1ZQVR
C11 SUB G2 SUB2
E10 VSS_A K1 VSS_B C6 VSS_C G3 VSS_D
1u
R522
C537
R523
0603
E6 E7 F8 G8 H7 H6 G5 F5
D7 L7 M5 L2 L4 L1
0603
C536
Separate VSS_DIG & VSS_PLL GND
10
11
12
- 195 -
7. CIRCUIT DIAGRAM
10
11
12
VBAT
VDDE_1V8
C600 0.1u 0603
C601 4.7u 10V
VDDE_1V8
KNATTE2-C2 C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 R606 1% 12K 0.1u 0.1u 4.7u 2.2u APP_GP00_UART_RX ACC_GP02_UART0_RX USB_DM USB_DP ACC_GP03_UART0_TX APP_GP01_UART_TX DCIN R605 1K VPPFLASH VBUS_USB_TRX ONSWB_n USB_XTAL1 D2 C3 D4 D3 C5 D5 D1 DTMS_I CTMS_I CFMS_I DFMS_I DCIO_I VPPFLS_I CTS_ON_I
C4
U600 DTMS_E CTMS_E CFMS_E DFMS_E DCIO_E VPPFLS_E CTS_ON_E A1 A3 A4 A2 B5 A5 B1 R60 0 0 603 DNI R60 103 06 R60 06 203 0 0 APP_ACC_UART_RX ACC should be mounted APP_ACC_UART_TX
B
R603
C602
C606
C604
C603
C605
0603
0603
0603
C607
EMI/ESD Filter for UART and DCIN

C
R888 DNI
CCO2
R818 2.2K C818 1u
FB604
4 NC 6 CE C819 2.2u
R607 HOOK 47K C608 10n 0603 VBAT APP_ACC_UART_RX APP_ACC_UART_TX C609 MIC2P C610 MIC2N 0603 TV_OUT MIDR R610 R612 DNI DNI 470 1% 470 1% PULL-UP REMOVED 2007.10.01 VA600 ULCE0505C015FR FM_ANT 0603 0.1u FB603 C611 22p 0.1u FB605 near to connector L600 270nH
GND5 C2 GND4 C1 GND3 B4 GND2 B3 GND1 B2
TEST CHIP_SEL CLOCK VCC_IO1 DATA0 VCC_IO2 DATA1 RREF DATA2 DM U601 DP DATA3 DATA4 ISP1508AET FAULT ID DATA5 CFG2 DATA6 CFG1 DATA7 NXT PSW_N VBUS STP DIR REG3V3 CFG0 XTAL1 XTAL2 REF1V8
VCC
R60 4 0 603 DNI DCIN_A VPPFLASH_E CTS_ON
C613 R614 R613 0603 EAR_L C614 EAR_R
100u
FL601 1 2 3 4 IN1 NC1 NC2 IN2
PGND
R615 APP_GP11_REMOTE_INT 3.3K USB_DP

TP600
FSUSB30UMX U602 10 1 SEL HSD1+ 9 8 7 6 VCC HSD2+ _OE D+ 2 3 4 5
100u
FB600
R816
47
CN600
FB601
R817
47
19 R616 0603 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 ULCE0505C015FR ULCE0505C015FR VA603 C620 22p C621 22p C622 22p FM_ANT HS_MIC TV_OUT(2007.09.18) EAR_L EAR_R USB_DP/RMT_INT USB_DM/RMT_ADC EAR_DETECT_n VBAT_+4.2V VBAT_+4.2V ONSWB_n VCHG_+5V VCHG_+5V VPPFLASH USB_POWER UART_TX UART_RX GND
REMOTE_ADC USB_DM
HSD1- GND HSD2D-
USB_DP/RMT_INT USB_DM/RMT_ADC VBAT CTS_ON
F
R617 5.6K VDDE_1V8 C616 0.1u
BAT600 VBACKUP C617 1u
C615 DNI R620 220K ACC_GP17_PHFSENSE R621 0
R618
1K
D600 USFB13L
0 R619
R623
R622
C618 RSB6.8CST2R DNI ZD600 C619 2.2u
DNI
DNI
VA601
VA602
R624
ULCE0505C015FR
BACK_UP BATTERY
HSEJ-18S04-25PC
NCP348MTR2G U603 10 9 8 R625 FB602 7 6 C623 1u C624 0.01u OUT2 OUT1 _FLAG 3
TP601
_EN GATE_OUT GATE
IN1 IN2 IN3
1 4 5
DCIN_A
0
2 GND 11 NC1 12 NC2
10
11
12
- 196 -
7. CIRCUIT DIAGRAM
10
11
12
A
VGA_VDD_1.8V
VGA_VDD_2.8V
To Slide FPCB CN1006 SLIDE_CON_Female 5M CAMERA INTERFACE

CN702 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 C715 DNI 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 SBIAS SENS GAIN1 GAIN2 CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7 SPK_RCV+ SPK_RCVMOTOR_PWRMOTOR_PWR+ LCD_RD_N LCD_VSYNC LCD_RESET_N LCD_WE_N LCD_CS_N LCD_ADS_N VREG_6.1V LCD_PWM WLED5 WLED4 WLED3 WLED2 WLED1 WLED_PWR CAM_AVDD_2.8V CAM_VDD_1.8V CAM_VDD_AF_2.8V
VDD_LCD_2.6V
CI_RES_n SYSCLK0 CI_PCLK CI_HSYNC CI_VSYNC
R700 R701
0 0
20 pin CONNECTOR_Female
ACC_GP21_VC_IO_OFF APP_I2C_SCL APP_I2C_SDA ONSWA_n KEYOUT1 KEYOUT2 KEYIN4 KEYIN5 LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] APP_GP12_LCD_ID VDDE_1V8
FB700
C701 0.1u 0603
C704 0.1u 0603
C702 0.1u 0603
C703 1u
C700 CN700 10u G1 1 2 ACC_GP15_FLIPSENSE G2 20 19 MIC1P 3 18 MIC1N 4 VDDG_2V75 5 KEY_LED1 6 15 KEYOUT4 7 14 KEYIN0 8 KEYOUT1 9 KEYOUT2 10 11 KEYIN3 G3 G4 KEYOUT3 13 KEYIN1 12 KEYIN2 16 CCO1 17
CN701 R702 MMP_CAM_MCLK MMP_CAM_PCLK R703 10 33 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VA701 VA702 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 VA700
10
VDDE_1V8

TOUCH_3.1V
5M_CAM_DATA[0] 5M_CAM_DATA[1] 5M_CAM_DATA[2] 5M_CAM_DATA[3] 5M_CAM_DATA[4] 5M_CAM_DATA[5] 5M_CAM_DATA[6] 5M_CAM_DATA[7] 5M_CAM_DATA[8] 5M_CAM_DATA[9] 5M_CAM_DATA[10] 5M_CAM_DATA[11]
MMP_CAM_RESET_N R704 R705 0603 0603 R706 R707 0603 0603 10 10 10 10 MMP_I2C_SDA MMP_I2C_SCL MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_PWDN
Active High
KEY_LED2 VBAT
10
C710
TOUCH_BUTTON_SCL
Touch Button I2C with GPIO#2
ICVL0518100Y500FR
ICVL0518100Y500FR
TOUCH_BUTTON_SDA C712 DNI C713 C714 DNI DNI
TOUCH_RST
MMP_CAM_DATA[3] MMP_CAM_DATA[2] MMP_CAM_DATA[1] MMP_CAM_DATA[0]
9 8 7 6
INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1
1 2 3 4
C705 C706 DNI DNI
ICVL0518100Y500FR
P-SEL I2C with GPIO#2
C707 0.1u 103 00 0603 10p 06 p 061 3p0603 10 03 p 06
C708
C709
C711
FL702 ICVE10184E070R100FR
to MAIN_KEY PCB
10
TOUCH_LDO
TOUCH_3.1V VREG_6.1V VBAT
To Socket PCB CN901

DNI 0 R709 R710
SIDE_KEY
KEYOUT0 KEYIN0 KEYIN1 EVLC14S02050 EVLC14S02050 EVLC14S02050
SLICE_BOARD TO MAIN CONNECTOR

U700 R1114D311D 1 3 VDD VOUT 4 NC 6 CE C716 1u 2 GND1 5 GND2 MICROSD_CMD_DIR VDDG_2V75 MICROSD_DAT_DIR APP_GP13_MC_CLKRET MICROSD_CLK C717 1u
ACC_GP12_TOUCH_LDO_EN
VDDH_SMB_2V75 APP_GP07_3AXIS_INT APP_I2C_SDA APP_I2C_SCL
APP_ACC_UART_RX APP_ACC_UART_TX CTS_ON
MICROSD_CMD MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3
SUB_PM_RESETB FLASH_LED_INH FLASH_LED_EN FLASH_LED_TORCH
MOTOR_EN TOUCH_3.1V MOTOR_PWM
WLED_PWR WLED1 WLED2 WLED3 WLED4 WLED5
SIMCLK SIMDAT SIMRST_n SUB_LED SIMVCC
LCD_PWM
MOTOR_PWRMOTOR_PWR+
VDDE_1V8
KEYOUT0 KEYIN0 KEYIN1
CN703 1 2 3 4
VA703
VA704
SBIAS SENS GAIN1 GAIN2
VA705
VBAT
F
CN704 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78
For ACF connection test TP

MOTOR_PWR+
TP708 TP709
JTAG LCD LDO_2.6V

G
VGA_VDD_2.8V SBIAS WLED_PWR TOUCH_3.1V VBAT VDD_LCD_2.6V U701 R1114D261D-TR-F 3 1 VDD VOUT 4 NC 6 CE VBAT URT700 C718 12 11 10 9 8 7 6 5 4 3 2 1
CTS RTS DSR NC4 NC3 NC2 VBAT NC1 TX RX GND
TP710 TP711 TP721 TP722 TP723 TP724 TP725 TP726
5M CAMERA POWER
VBAT CAM_VDD_AF_2.8V CAM_VDD_1.8V VBAT CAM_AVDD_2.8V
MICROSD_DAT0 SIMDAT SENS GAIN1 VDDH_SMB_2V75
1u
VPPFLASH_E USB_DP USB_DM VBUS CTS_ON DCIN_A APP_ACC_UART_TX APP_ACC_UART_RX
R713 R714
DNI DNI
ON_SW ON_SW
OJ700
OJ701
OJ702
OJ703 1u
PGND
UTXD URXD PWR VB A T VCHA R TX RX GND 3G
MMP_CAM_PWR_EN
1u
1u
1u
1u
U703 1 VIN 2 EN1 3 EN2 4 NC1
U702 R1114D281D-TR-F 3 VDD VOUT GND1 GND2 2 5
MMP_CAM_PWR_EN
4 NC 6 CE
C719
1u
2 GND1 5 GND2
C720
C721
H
C724 C722
2.5G
DOWNLOAD POINT
C723
10
11
12
- 197 -
7. CIRCUIT DIAGRAM
10
11
12
A
2.2K 2.2K R802 2K R800
R801
TP801
U801
R803 B T_CL K 0 C800 DNI C801 DNI A CC_GP25_B T_SPI_DA T1 A CC_GP26_B T_SPI_CL K RTCCL K RESOUT2_n K7 B T_RESETN F6 B T_REF_CL K _IN K9 B T_L P_CL K L9 B T_WA K EUP
STL C2593
B T_CL K _REQ_OUT_1 J7 G7 B T_UA RT_TXD J6 B T_UA RT_RTS K1 B T_RFP J1 B T_RFN M6 B T_VIO_A J9 B T_VIO_B N3 B T_VIO_C N5 B T_VIO_D G8 B T_VIO_E B T_VSSDIG1 B T_VSSDIG2 B T_VSSDIG3 B T_VSSDIG4 B T_VSSDIG5 B T_VSSA NA 1 B T_VSSA NA 2 B T_VSSA NA 3 B T_VSSA NA 4 B T_VSSA NA 5 B T_VSSA NA 6 B T_VSSA NA 7 B T_VSSA NA 8 B T_VSSA NA 9 B T_VSSA NA 10 B T_VSSA NA 11 B T_VSSA NA 12 B T_VSSRF1 B T_VSSRF2 B T_VSSRF3 B T_VSSRF4 H6 H7 H8 K8 L8 D1 D2 E3 F1 F2 F3 F4 G1 G3 G4 H3 H4 H1 L1 J2 K2
A CC_GP24_B T_SPI_DA T0 A CC_GP23_B T_SPI_CS0n 1nH C803
IN_TOUCH_SCREEN_SDA IN_TOUCH_SCREEN_SCL
OUT801 TOUCH_RST C4 C3 B3 C2 B2 OUT802 OUT803
FL 800 5 4 VDDE_1V8
DEA 212450B T-7043C1 3.9n H C802 1 U_B P B P1 B P2 B P_DC 2 L 800 3.3n H
6 3
H9 B T_UA RT_RXD K6 B T_UA RT_CTS N4 B T_PCM_SYNC M4 B T_PCM_CL K K5 B T_PCM_A M5 B T_PCM_B

TP809TP810TP811TP812
G2 G1
1.2p L 801
A PP_GP04_TOUCH_SCREEN_INT A PP_GP05_TOUCH_RESET
TP804 TP806 TP807
A1 A2 A3
B4
A1
B1
C1
TOUCH_SCREEN_INT
VCCB
VSS_B T_RF
VSS_B T_RF
VSS_B T_RF
M3 K3 K4 J3 L3
B T_GPIO_9 B T_GPIO_11 B T_GPIO_10 B T_GPIO_16 B T_GPIO_8
A4
B1
C804 0.1u TP813 A PP_GP16_TOUCH_SCREEN_SDA
VDDE_1V8 A CC_GP14_B T_SPI_INT
TOUCH_3.1V
C806
C807
L7 B T_CONFIG_1 M7 B T_CONFIG_2 N6 B T_CONFIG_3
VSS_B T_A NA
1u
R805
0.1u
VDDK _2V75
VDDE_1V8
B T_CL K REQ_n VDDK _2V75
J8 B2 C3 M8 C1 C2 M2 J4
B T_CL K _REQ_OUT_2 B T_RSVR_CL 1 B T_RSVR_CL 2 B T_RSVR_D B T_RSVR_DSM B T_RSVR_N B T_RSVR_RF B T_REG_CTRL
C805
G9 B T_GPIO_0 E7 B T_CL K _REQ_IN_1 F9 B T_CL K _REQ_IN_2 E8 B T_HOST_WA K EUP
B2
VCCA
A CC_PCM_SYNC A CC_PCM_CL K A CC_PCM_DL D A CC_PCM_UL D
U800 B4 A 2 TXS0104EZXUR GND A3 A4 OE B3 A CC_GP12_TOUCH_L DO_EN
FB 800 60
A PP_GP05_TOUCH_SCREEN_SCL
R804
0.1u
DO NOT CHA NGE
VSS_B T_RF R813 C808 0.1u VDDE_1V8 R812 IN_TOUCH_SCREEN_SDA VSS_B T_A NA DNI TOUCH_B UTTON_SDA R811 IN_TOUCH_SCREEN_SCL R814 10 10 TOUCH_SCREEN_SCL DNI TOUCH_B UTTON_SCL TOUCH_SCREEN_SDA
N7 B T_HVD E6 B T_VDD_CL D 0.1u 0.1u
L2 B T_HVA 1 D3 B T_HVA 2 E1 B T_HVA 3 E2 B T_HVA 4 E4 B T_HVA 5 H2 B T_TEST1 G2 B T_TEST2 G6 B T_A F_PRG C5 FM_ROUT B5 FM_L OUT D6 FM_VIO D8 FM_SDIO FM_GND1 FM_GND2 FM_GND3 FM_GND4 FM_GND5 FM_GND6 FM_GND7 FM_GND8 FM_RFGND A3 B4 B6 B7 C4 C6 C7 D5 C8
VDDE_1V8
VB A T C809 C810
R807
R808
100K
D4 F7 F8 L4 L5 L6
C811 C812
1u 1u
FM_RP FM_L P
ISSP OPTION
D
A PP_I2C_SDA C813 0.1u
A CC_GP16_FM_GPIO2 VDDE_1V8 RESOUT1_n

TP814
A PP_I2C_SCL RTCCL K 22n 22n 10p
A4 B3 A7 A6 A5 B8 C9 D7 D9 E9
FM_VA FM_VD FM_GPIO1 FM_GPIO2 FM_GPIO3 FM_FMIP FM_RSTB FM_RCL K FM_SENB FM_SCL K
C815
C816
C814
E
C817 120p
FM_A NT
B l u et o o t h (+FM Rad i o )
10
11
12
- 198 -
7. CIRCUIT DIAGRAM
10
11
12
R937 U904 G_SLUG 1 2 3 4 5 6 7 CT EN_SET FL EN A GND IN LX PGND A A T1270IFO-T1 14 RSET 13 FL OUTA 12 FL GND 11 FL OUTB 10 FL INH 9 GND 8 OUT
2 4 6 8
2 4 6 8
100K
FL A SH_L ED_TORCH FL A SH_L ED_EN
100K
100K R916
RA1
RA2
200K
SOCK ET_PCB
MICROSD_DA T0 MICROSD_DA T_DIR MICROSD_DA T1 MICROSD_DA T2 MICROSD_DA T3 MICROSD_CMD_DIR MICROSD_CMD MICROSD_CL K A PP_GP13_MC_CL K RET
St ep -Up Cu r r en t Reg u l at o r
VB A T VDDE_1V8 VDDG_2V75 C923 2.2u
1u H L 901
C925 47n
FL A SH_L ED_INH
U900 A5 C5 B2 C1 A2 B4 A4 B5 B1 A3 A1 B3 C3 C901 0.1u VCCA DA T0_DIR DA T0A DA T123_DIR DA T1A DA T2A DA T3A CMD_DIR CMDA CL K A CL K _F GND1 GND2
SN74A VCA 406EZXYR D5 VCCB DA T0B DA T1B DA T2B DA T3B D2 D1 C4 D4
1 3 5 7
1 3 5 7
R940
R938
100K
100K
15
CA MERA FL A SH L ED
L D901 2.2u C924 VA 901 EVL C14S02050 VA 900 EVL C14S02050
REA L _MICROSD_DA T0 REA L _MICROSD_DA T1 REA L _MICROSD_DA T2 REA L _MICROSD_DA T3
R907
470K
CMDB CL K B
C2 D3 C903 0.1u R941
REA L _MICROSD_CMD REA L _MICROSD_CL K DNI
VDDH_SMB _2V75
VDDE_1V8
L EVEL SHIFTER FOR MICROSD 2007.10.02

R911 0 DNI R909 R910
U901 1 2 3 4 5 R912 C905 22n NC1 VDD GND INT CS B
B MA 150 NC2 VDDIO SDI SDO SCK 10 9 8 7 6
DNI
C
SMB _SDA SMB _SCL
APP_GP07_3AXIS_INT
390
11 NOT1 12 NOT2
0.1u C904
SIMVCC
USIM
SIMVCC REA L _MICROSD_DA T2 REA L _MICROSD_DA T3 REA L _MICROSD_CMD VDDG_2V75 SIMRST_n SIMCL K C906 22p C907 1u C908 VA908 EVLC18S02015 VA909 EVLC18S02015 VA907 EVLC18S02015
MICRO SD
J 900 1 2 3 4 9 10 D A T2 D A T3 CMD VDD GND1 GND2 DA T1 DA T0 VSS CL K GND3 GND4 8 7 6 5 11 12 REA L _MICROSD_DA T1 REA L _MICROSD_DA T0 REA L _MICROSD_CL K
Fo r Pr o d u c t i n s p ec t i o n TP
CTS_ON A PP_A CC_UA RT_TX A PP_A CC_UA RT_RX
TP917 TP901 TP902
10K
R913
J 901 4 1 GND VCC 5 2 VPP RST 6 3 CL K I_O 8 7 GND2 GND1 L 900 0
Th r ee-ax i s -ac c el er o m et er
D
D
SIMDA T
C909 33p
33p
MOTOR CIRCUIT
MOTOR_EN TOUCH_3.1V VB A T TOUCH_3.1V
3 2 1
DNI
R?
R? C911 1u
D900 SIMDA T
6 5 4 1 2
SIMCL K
SUB L ED
L D900 R900 VB A T SUB_LED 100o h m R920 R923 5.1K ZD1 ZD2 RSB 6.8CST2R B1 Q901 R936 MOTOR_PWM 0
E GND B IN C OUT 4 5
R919
100K
SIMVCC
Q900 K RX102U
SIMRST_n
1K
PL R0504F RSB 6.8CST2R
C1
B YPA SS _SHUTDOWN IN+ INU902
GND VOVO+ VD D
B2 A1 B3 A3 R926 110K C913 0.01u MOTOR_PWRMOTOR_PWR+
R925 R924
51K C2 51K C3 0.01u C912
K RC402E
R927
910
C914 DNI
TPA 6205A 1ZQVR
L CD B A CK L IGHT
VB A T SMB _SDA SMB _SCL R930 SUB _PM_SCL SUB _PM_SDA C915 2.2u 0 0 R928 R929 A PP_I2C_SDA A PP_I2C_SCL
From MAIN CN703 SLICE_BOARD TO MAIN CONNECTOR

MICROSD_CMD_DIR VDDG_2V75 MICROSD_DAT_DIR APP_GP13_MC_CLKRET MICROSD_CLK
Fo r A CF c o n n ec t i o n t es t TP
MOTOR_PWR+
TP905 TP906
C916 10u
VDDH_SMB_2V75 APP_GP07_3AXIS_INT APP_I2C_SDA APP_I2C_SCL
MOTOR_PWRMOTOR_PWR+
VDDE_1V8
WLED_PWR WLED1 WLED2 WLED3 WLED4 WLED5
SIMCLK SIMDAT SIMRST_n SUB_LED SIMVCC
A5 A4 B6 C6 C5 D6 E6
C3P C3N C2P C2N C1P C1N VIO RESETB SDA SCL CPGND SGND L EDGND
U903 B D6095GUL
L ED1 L ED2 L ED3 L ED4 L ED5 L EDFL SB IA S SSENS GC1 GC2
LCD_PWM
SBIAS SENS GAIN1 GAIN2
WL ED1 WL ED2 WL ED3 WL ED4 WL ED5
MOTOR_EN TOUCH_3.1V MOTOR_PWM
VB A TCP VB A T1 VB A TL DO
VOUT
WL ED_PWR
SUB_PM_RESETB FLASH_LED_INH FLASH_LED_EN FLASH_LED_TORCH
B5 F4 E1
APP_ACC_UART_RX APP_ACC_UART_TX CTS_ON
MICROSD_CMD MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3
VGA _VDD_2.8V SB IA S WL ED_PWR TOUCH_3.1V MICROSD_DA T0 SIMDA T SENS

TP907
G
TP908 TP909 TP910 TP911 TP912 TP913 TP914
0 0 0
R931 R932 R933
C4 D4 D5 A3 E5 B3
VBAT
RB 521CS-30
R934 0 R935 0
GA IN1 VGA _VDD_2.8V VDDH_SMB _2V75 VGA _VDD_1.8V 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 CN1
T1 T2 T3 T4
F2 E2 D1 D3
RB 521CS-30
TP915
A1 A6 F6 F1
10
11
12
- 199 -
7. CIRCUIT DIAGRAM
10
11
12
MULTI_KEY
KEYOUT1
SEND
OK
KEYOUT1 KEYOUT2 KEYIN4 KEYIN5
END ONSWA_n VA900
CLR
EVLC14S02050 EVLC14S02050 EVLC14S02050 EVLC14S02050
ICVS0514X350FR
LCD INTERFACE
VA905 ICVN0505X150FR
LCD LDO
VDDE_1V8 VDD_LCD_2.6V
D900
KEYOUT2
RB521S-30
ONSWA_n
VA901
VA902
VA903
KEYIN4
VA906 ICVN0505X150FR
KEYIN5
R902
B
ICVE10184E150R500FR FL900 LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3]
9 8 7 6 INOUT_B1 INOUT_A1 INOUT_B2 INOUT_A2 INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 G2 G1 1 2 3 4
C900 0.1u
4.7K
C901 0.1u
VDDE_1V8
10K 10K
R900 R901
LCD_DATA[0]_OUT LCD_DATA[1]_OUT LCD_DATA[2]_OUT LCD_DATA[3]_OUT
LCD_PWM
ICVE10184E150R500FR FL901 LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

LCD_VSYNC LCD_RD_N LCD_WE_N_OUT LCD_ADS_N_OUT LCD_CS_N_OUT LCD_DATA[4]_OUT LCD_DATA[5]_OUT LCD_DATA[6]_OUT LCD_DATA[7]_OUT
ICVE10184E150R500FR FL902 LCD_CS_N LCD_ADS_N LCD_WE_N LCD_RESET_N

R906
R907
R905
2 3 4 5 6 7 15
13 12
10
0.1u
LCD_RESET_N_OUT WLED5 WLED4 WLED3 WLED2 WLED1 WLED_PWR
4.7K
4.7K
DNI
LCD_CS_N_OUT LCD_ADS_N_OUT LCD_WE_N_OUT LCD_RESET_N_OUT
LCD_DATA[7]_OUT LCD_DATA[6]_OUT LCD_DATA[5]_OUT LCD_DATA[4]_OUT LCD_DATA[3]_OUT LCD_DATA[2]_OUT LCD_DATA[1]_OUT LCD_DATA[0]_OUT APP_GP12_LCD_ID
R904
51K
CN900 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37
10
VA904
ON_SW KEY
TOUCH_CONNECTOR
TOUCH_3.1V
10
17 1
CN901
18 14
TOUCH_SCREEN_INT 11 TOUCH_SCREEN_SCL 10 TOUCH_SCREEN_SDA 9 8 16
C908
MULTI EL
TOUCH_BUTTON_SDA C902 2.2u TOUCH_BUTTON_SCL
VREG_6.1V
R909
E
TOUCH_RST
E
L900 100uH R910 C903 470pF D901 RF051VA2S TOUCH_3.1V
D1 D2 D3 D4 D5
From Slide FPCB CN1005 44PIN_CONNECTOR_Female_1T

VDD_LCD_2.6V
TOUCH_3.1V
EL DWONLOAD & TEST POINT
TP103
TP109
TP105
TP106
TP107
TP108
TP908
TP111
TP112
Q900 SIA450DJ
S1 S2
CN902 TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT TOUCH_3.1V TOUCH_BUTTON_SDA TOUCH_BUTTON_SCL LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] APP_GP12_LCD_ID VDDE_1V8 WLED_PWR WLED5 WLED4 WLED3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 TOUCH_RST VREG_6.1V
C904 0.1u
10M
R913
TOUCH_SCREEN_SDA
R912 100K
100K
VREG_6.1V
TOUCH_SCREEN_SCL
F
C905 150p C906 0.1u
KEYOUT1 KEYOUT2 KEYIN4 KEYIN5 ONSWA_n

LCD_RD_N LCD_VSYNC LCD_RESET_N LCD_WE_N LCD_CS_N LCD_ADS_N WLED1 WLED2 LCD_PWM
TP902
TOUCH_3.1V 33
U900 HV509 SLUG BP HVGND HVOUT16 HVOUT15 HVOUT14 HVOUT13 HVOUT12 HVOUT11 HVOUT10 HVOUT9 HVOUT8 HVOUT7 HVOUT6 HVOUT5 HVOUT4 HVOUT3 HVOUT2 HVOUT1 28 27 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12
TP903
HV_OUT_PAD& BP_PAD SIZE 1.7X1.4mm

1 2 3 4 5 6 7 8 HV_OUT_2 HV_OUT_3 HV_OUT_4 HV_OUT_5 HV_OUT_6 HV_OUT_7 HV_OUT_8 HV_OUT_9 HV_OUT_10 HV_OUT_11 HV_OUT_12 HV_OUT_13 HV_OUT_14
32 31 30 29 28 27 26 25
33
P0_1 P2_7 P2_5 P2_3 P2_1 P3_3 P3_1 P1_7
BP
U901 CY8C21434
P0_0 P2_6 P2_4 P2_2 P2_0 P3_2 P3_0 XREX
24 23 22 21 20 19 18 17
25 NC5 23 NC4 18 NC3 16 NC2 13 NC1 21 _POL 22 _LE 15 GND 24 TOUCH_RST

TP905 TP906 TP907
VSS1 P0_3 P0_5 P0_7 VDD P0_6 P0_4 P0_2
GND
BP HV_OUT_14 HV_OUT_13 HV_OUT_12 HV_OUT_11 HV_OUT_10 HV_OUT_9 HV_OUT_8 HV_OUT_7 HV_OUT_6 HV_OUT_5 HV_OUT_4 HV_OUT_3 HV_OUT_2
DOUT
OUT902
OUT900
OUT901
OUT903
OUT904
OUT905
OUT906
OUT907
9 10 11 12 13 14 15 16
P1_5 P1_3 P1_1 VSS2 P1_0 P1_2 P1_4 P1_6
19 CLK TOUCH_BUTTON_SCL TOUCH_BUTTON_SDA EL_G1 EL_G3 17 DIN 20 VDD
OUT913
OUT909
OUT910
OUT908
OUT911
OUT912
OUT914
EL_G2
I2C
C907 0.1u 56K
R915
TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA
ISSP
14 VPP 26 VBIAS
10
11
12
- 200 -
7. CIRCUIT DIAGRAM
10
11
12
MA IN_K EY
ACC_GP15_FLIPSENSE VDDE_1V8 VDDG_2V75
B
VBAT
K EY_L ED1 K EY_L ED2 K EYOUT1 K EYOUT2 K EYOUT3
CN1 G1 1 2 3 4 5 6 7 8 9 10 G3
G2 20 19 18 17 16 15 14 13 12 11 G4
R103 R104
1800 1800
MIC1P MIC1N CCO1 K EYOUT4 KEYIN0 KEYIN1 KEYIN2 K EYIN3
A n t en n a Feed i n g
VDDE_1V8 SW101 20279-001E-01 G1 G2 L1 A NT 2.4n H
C
2 4 6 8 RA 101
NUMB ER_K EY
101
1
EVLC14S02050
EVLC14S02050
EVLC14S02050
EVLC14S02050
EVLC14S02050
1 3 5 7
10K
102
2
103
3
K EYOUT1 104
4
105
5
106
6
VA104
VA105
VA107
107
7
108
8
109
9

HOT4
VA101
K EYOUT2
VA108
VA102
VA103
VA106
EVLC14S02050
EVLC14S02050
EVLC14S02050
K EYOUT1 K EYOUT2 K EYOUT4 K EYOUT3 K EYIN0 K EYIN1 K EYIN2 K EYIN3
C114 0.5p
C113 0.75p
C115 DN I
C
OUT101 OUT102
MA IN_K EY CONNECTOR_Fem al e Fr o m So c k et PCB CN900
D
110
0
HOT102
HOT5 4 1 SW1101
K EYOUT2
K EYOUT3 K EYIN3
3 2
K EYIN3
MUL TI
K EYOUT1 HOME
K EYOUT4
K EYIN3
MA IN_K EY L ED
F
C104 10u SPM0204HE5-PB -3 VBAT L D101 1 2 R101 K EY_L ED1 100o h m R102 K EY_L ED2 100o h m RSB6.8CST2R RSB6.8CST2R ZD102 P 4 G2 3 G1 2 O 1 MIC101 C106 47n MIC1N U101 1 C108 47n MIC1P C109 0.1u 2 3 VDD GND1 NC TK 60012B M5 6 IO_VDD GND2 OUT 5 4 A CC_GP15_FL IPSENSE VDDG_2V75 C105 47p CCO1
SLIDE DETECT
VDDE_1V8
A C SSC-SWTS1007 L D102 1 2 A C SSC-SWTS1007
MIC
Sep er at e DGND : 0.15m m L i n e
ZD101
C112 0.1u
10
11
12
- 201 -
7. CIRCUIT DIAGRAM
10
11
12
MAIN_Slide_FPCB
SPK_RCV+ SPK_RCVCN101 1 2
Speaker_PAD
MOTOR_PWR+ MOTOR_PWR-
CN107 1 2
Ambient Light Sensor

SENS SB IA S NC2 7 NC1 VCC 3 4 GC1 GND 2 5 IOUT GC2 6 1 B H1600FVC U101 C101 1u
44 PIN_CONNECTOR_MA L E_1T
GA IN1 GA IN2
R102 1 1K VDD_LCD_2.6V
C
CN108 TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT TOUCH_3.1V 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 TOUCH_RST VREG_6.1V
SLIDE CONNECTOR_Male
TOUCH_B UTTON_SDA TOUCH_B UTTON_SCL L CD_DA TA [ 0] L CD_DA TA [ 1] L CD_DA TA [ 2] L CD_DA TA [ 3] L CD_DA TA [ 4] L CD_DA TA [ 5] L CD_DA TA [ 6] L CD_DA TA [ 7] A PP_GP12_L CD_ID VDDE_1V8 WL ED_PWR WL ED5 WL ED4 WL ED3
K EYOUT1 K EYOUT2 K EYIN4 K EYIN5 ONSWA _n

L CD_RD_N L CD_VSYNC L CD_RESET_N L CD_WE_N L CD_CS_N L CD_A DS_N W L E D1 WL ED2 L CD_PWM
CN106 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 SB IA S SENS GA IN1 GA IN2 CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7 SPK _RCV+ SPK _RCVMOTOR_PWRMOTOR_PWR+ L CD_RD_N L CD_VSYNC L CD_RESET_N L CD_WE_N L CD_CS_N L CD_A DS_N L CD_PWM WL ED5 WL ED4 WL ED3 WL ED2 WL ED1 WL ED_PWR VREG_6.1V
VGA CAMERA INTERFACE
D
VDD_LCD_2.6V
CI_RES_n SYSCL K 0 CI_PCL K CI_HSYNC CI_VSYNC A CC_GP21_VC_IO_OFF A PP_I2C_SCL A PP_I2C_SDA ONSWA _n K EYOUT1 K EYOUT2 K EYIN4 K EYIN5 L CD_DA TA [ 0] L CD_DA TA [ 1] L CD_DA TA [ 2] L CD_DA TA [ 3] L CD_DA TA [ 4] L CD_DA TA [ 5] L CD_DA TA [ 6] L CD_DA TA [ 7] A PP_GP12_L CD_ID VDDE_1V8 TOUCH_SCREEN_SCL TOUCH_SCREEN_SDA TOUCH_SCREEN_INT
C102 0.1u
AXK720147G
ACC_GP21_VC_IO_OFF SYSCLK0 CI_PCLK CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 GC 1N104 1 2 3 4 5 6 7 8 9 10 G3 G2 20 19 18 17 16 15 14 13 12 11 G4
C103 0.1u
CI_RES_n APP_I2C_SCL APP_I2C_SDA CI_HSYNC CI_VSYNC CI_D7 CI_D6
E
TOUCH_3.1V
ENBY0019501
C1006 0.1u
TOUCH_B UTTON_SCL TOUCH_B UTTON_SDA
TOUCH_RST
TP100 TP101 TP102
TP103
10
11
12
- 202 -
8. BGM Pin Map
8. BGM Pin Map

DBB IC : DB3150 R3A (top view)
Use Don't Use
- 203 -
8. BGM Pin Map
ABB IC : AB3000 R2A (top view)
Use Don't Use
- 204 -
8. BGM Pin Map
Memory IC : KAL00900BM-DJ55 (top view)
Use Don't Use
- 205 -
8. BGM Pin Map
ZORAN IC : ZR3453X (top view)
Use Don't Use
- 206 -
8. BGM Pin Map
Bluetooth IC : STLC2593 (top view)
Use Don't Use
- 207 -
- 208 -
9. PCB LAYOUT
<ACF connector> Socket PCB connection
<FPCB Connector> LCD assembly status Connector combination <Touch Screen level shifter> Touch operation <X-tal> Check the freq. 26MHz <GSM Transceiver> Check Rx/Tx operation <WCDMA Transceiver> Check Rx/Tx operation <GSM Rx SAW filter> Check Rx operation <OVP> Check VCHG output <GSM PA + ASM> Tx amplifier and antenna switch operation <DC/DC for Zoran> Zoran operation <ZORAN> Multi Media chipset <WCDMA PA> WCDMA Tx amplifier operation <X-tal> Check the freq. 27MHz <DC/DC for PA> WCDMA Tx operation <CAM LDO> Camera operation
- 209 -
9. PCB LAYOUT
<DC/DC for EL> EL operation <5M CAM Connector> 5M camera operation <Backup Battery> RTC clock operation <Memory (2G/1G)> <DBB (DB3150) > <Headset Mic LDO> Headset operation <Headset filter> Headset operation <Headset filter> Headset operation <X-tal> RTC clock (32.768kHz) <SideKey> Volume up/down operation <PMIC & Audio IC> Check output of LDO Check audio path <Battery Connector> Power supply <EMI/ESD filter> UART/Charging operation <MiainKey Connector> Numeric Key & SideKey <Speaker Amp> Speaker operation <Touch LDO> Touch operation <LCD LEO> LCD operation <USB Transceiver> USB operation
<Bluetooth IC> B/T & FM radio operation
- 210 -
9. PCB LAYOUT
<ACF connector> Main & Socket PCB connection
- 211 -
9. PCB LAYOUT
<LDO for flash LED> Flash LED operation <Flash LED> CAM flash operation <Sub LED> CAM flash & trickling charge <Level shifter> u-SD card level shifter <3 axis accelerometer> Motion sensor operation <LDO for LCD backlight> LCD operation <Motor operating IC> Motor operation
<u-SD card socket> Socket soldering
<SIM socket> Socket soldering
- 212 -
9. PCB LAYOUT
- 213 -
9. PCB LAYOUT
<FPCB connector> LCD assembly status Connector combination <EL driver IC> EL operation <EL operating IC> EL operation <LCD connector> LCD operation <Touch Connector> Touch operation
- 214 -
9. PCB LAYOUT
<MainKey Connector> Number & sidekey operation
<Touch&Multi sidekey> <MainKey LED> MainKey backlight
<CAM sidekey> Camera operation
<Hall IC> Slide detect <Mic> Voice input
- 215 -
9. PCB LAYOUT
<Antenna Connector> Antenna connection
- 216 -
9. PCB LAYOUT
<Spk/Receiver connector> Speaker operation
<Ambient Light Sensor> ALC operation
<FPCB Connector> LCD assembly status Connector combination <FPCB connector> LCD assembly status Connector combination
- 217 -
<VGA CAM connector> VGA operation
<Motor pad> Check soldering
- 218 -
10. Calibration
10. Calibration
10.1 General Description
This document describes the installation and software usage for the calibration of LGs GSM/GPRS/EDGE/WCDMA Multimedia Mobile Phone. The calibration menu and its result is displayed in PC terminal by Mobile phone.
10.2 Environment
10.2.1 H/W Environment
- PC with RS-232 Interface & GPIB card installed - GSM/GPRS/EDGE/WCDMA Multimedia Mobile Set - Agilent 8960 Series 10 E5515C Instrument (E1987A ver A.05.28) - Tektronix PS2521G Power Supply or Agilent A66311B - ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)
10.2.2 S/W Environment

- National Instrument GPIB & VISA (ver 2.60 full) driver install - Agilent 8960 VXI driver(E1960) install - Hot Kimchi EXE files - OS : Window98, Window2000, WindowXP
10.2.3 Configuration Diagram of Calibration Environment
KF750
Figure 10-1. Calibration Configuration Figure
- 219 -
10. Calibration
10.3 Calibration Environment

Ensure that the following conditions are maintained throughout the duration of the tests and calibrations described within this document.
Parameter Temperature Relative Humidity Vbatt Supply current
Min 15 20 3.6 0
Typ 25 40 3.7
Max 30 75 3.8 3
Unit C % V A
Table 10-1. Nominal Environmental Test Conditions
- 220 -
10. Calibration
10.4 Program Operation

10.4.1 Hot Kimchi Program Overview
When trying to calibrate the mobile phone, the service engineers make a configuration of calibration environment like Figure10-1. And if you finish making configuration, please execute the Hot Kimchi program. See Figure10-2. Hot Kimchi supports following functions. - Calibration of EGSM 900, DCS 1800, PCS1900, and WCDMA - Instrument (Agilent8960, Tektronix PS2521G) control - UART communication with mobile phone
Figure 10-2. Hot Kimchi Window
- 221 -
10. Calibration
10.4.2 Setting
Select a ezlooks
Select Off-line in the EZLOOKS MODE.
- 222 -
10. Calibration
Select a Line System
Select Manual in the RUN MODE. Select your com port appropriately.
- 223 -
10. Calibration
Select a Logic Operation
Select Logic Mode you want. 1. CAL only 2. AUTO only 3. CAL + AUTO Select your com port appropriately. MONitor Port is to communicate with 2.5G mobile phone
- 224 -
10. Calibration
10.4.3 Calibration Procedure

Select a model name - KF750. Click the START button.
- 225 -
11. Stand-alone Test

11.1 General Description
1) General Description
This document describes the installation and software usage for the stand-alone test of LGs GSM/GPRS/EDGE/WCDMA Mobile Phone. The test menu and its result is displayed in PC terminal by Mobile phone. This test software was called XCALMON(eXtended CALibration and MONitor program). XCALMON can support both calibration and test. This test software includes GSM, DCS, PCS, EDGE, and WCDMA Band test.
2) XCALMON Environment
H/W Environment - PC with RS-232 Interface & GPIB card installed - GSM/GPRS/EDGE/WCDMA Mobile Set - Agilent 8960 Series 10 E5515C Instrument (E1987A ver A.05.28) - Tektronix PS2521G Power Supply or Agilent A66311B - ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery) S/W Environment - National Instrument GPIB & VISA (ver 2.60 runtime) driver install - Agilent 8960 VXI driver(E1960) install - XCALMON EXE files - OS : Window98, Window2000, WindowXP - Serial port configuration Baud rate: 115200 / Char length: 8bit / No Parity/ No Flow control / Stop bits: 1 bit
3) Configuration Diagram of Test Environment
KF750
- 226 -
11.2 Program Operation

1) XCALMON Program Overview
When trying to test the mobile phone, the service engineers make a configuration of calibration environment like previous figure. And if you finish making configuration, please execute the XCALMON program. Running the XCALMON program, you will see XCALMON program window like below. If XCALMON program would be executed, it checks the connection of instruments and initializes them automatically. XCALMON supports following functions. - Test of EGSM 900, DCS 1800, PCS1900, GSM850 and WCDMA - Instrument (Agilent8960, Tektronix PS2521G) control - UART communication with mobile phone XCALMON has three windows and each window support different function. - Command window which supports interactive ITP commands like Hyper terminal - Calibration tree window - Quick Command mode window
- 227 -
2) XCALMON Icon Description A. DOS Window Icon

When you click the DOS window icon, then you should see the ITP command window like DOS window of DOS-operating system. In ITP command window, you can communicate with a mobile phone which is running in ITP mode. For example, if you will enter command VERS and enter the return key, you should get the response of the present running ITP version information from a mobile phone.
XCALMON ITP Command Window
B. Calibration Tree Window Icon

When you click the calibration window icon C, then you see the calibration tree window. That will be shown all calibration items. If you want to calibrate a mobile phone for all calibration items, you should select Calibration and push F4 button in your keyboard. Also there are four tap view in calibration window. - OUTPUT : All results of calibration. See figure 9-4 - STATUS : Summary of Test result - INSTRUMENT : Control and view instrument connection status. See figure 9-5 - PC SETTING : Control and view UART connection status. See figure 9-6
- 228 -
C. Quick Command mode window Icon

When clicking the Quick command mode window icon Q, then you find out the Quick Command mode window. That window is for test of the mobile phone.
XCALMON Quick Command mode Window
D. ITP Starting Window Using Production Loader

When clicking the ITP starting window icon L, then you find out the ITP starting window. That dialog window just waits for power-on of the mobile phone. When it will occur power-on, it automatically start ITP running.
XCALMON ITP Starting Window (Using Production Loader)
- 229 -
11.3 Stand-alone Test

1) Test Procedure
Test procedure of XCALMON is the same as below procedure. - Configuration of test environment - Running ITP using preloader and production loaders - Verification of stand-alone test by Quick Command mode A. Configuration of test environment Configure to test the mobile phone like 12.1. If configuration will be accomplished, XCALMON program will be started. B. Running ITP Using Preloader and Production Loaders If XCALMON will be executed, you should run ITP using L ITP starting icon at first. Click the L icon, then you will see the ITP start window like 12-2 D. When you will turn on the mobile phone, the loaders will be downloaded automatically like below figure and then it will execute the ITP at once. 4 loaders are needed and exists in the folder loader. And all you have to do is select the profile KF750_KT520_20080412.prfl If the ITP will operate normally, you should see the characters TP, OK in ITP command window like 12-2 A.
Loader downloading
- 230 -
2) Test
If you want to test a mobile phone, click the Quick command mode icon Q. A. Select System You can select the GSM or WCDMA system. B. Select Band You can select the GSM quad band or WCDMA band. C. Testing Channel You can select only one channel. D. RF operation You can select Rx or Tx. If you select all item and click test, you can find out result pass or fail.
- 231 -
- 232 -
12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW
36 37 32 31
35 19
18
76 75
16 15
17
33 30 29 34 72
11 10 12 9 8 7 13 14 23 20 22 21
28
51 56 27 26 52 54
71 57 58 59 60 61
25 1
24
73
50
53
55 70
49 3 2 44 69 47 48 68 44 65 66 42 43 41 38 39 40 45 67 62 63 64
4 5 74 6 46
- 233 -
78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36
35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
- 234 -
12.2 Replacement Parts <Mechanic component>

Level 2 3 4 4 2 3 4 5 5 5 5 5 5 5 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 3 Location No AAAY00 ACGA00 MCJA00 MLEA00 APEY00 ACGM ADBY00 MDAD00 MDAK00 MLCE00 MPBT00 MTAA00 MTAD00 MWAE00 MBJL00 MBJL01 MBJL02 MCCC00 MCCF00 MCJN00 MGAD00 MLEA00 MPBH00 MPBU00 MPBU01 MPBZ00 MPBZ01 MSDB00 MSDD00 MTAA00 MTAB00 MTAC00 ACGQ00 Desciption ADDITION COVER ASSY,BATTERY COVER,BATTERY LOCKER,BATTERY PHONE COVER ASSY,REAR DECO ASSY DECO,CAMERA DECO,REAR LENS,FLASH PAD,CAMERA TAPE,DECO TAPE,WINDOW WINDOW,CAMERA BUTTON,SIDE BUTTON,SIDE BUTTON,SIDE CAP,EARPHONE JACK CAP,MOBILE SWITCH COVER,REAR GASKET,SHIELD FORM LOCKER,BATTERY PAD,MIKE PAD,CONNECTOR PAD,CONNECTOR PAD PAD SPRING,COIL SPRING,PLATE TAPE,DECO TAPE,PROTECTION TAPE,SHIELD COVER ASSY,SLIDE Part Number AAAY0304201 ACGA0021501 MCJA0064801 MLEA0045801 APEY0553901 ACGM0107001 ADBY0011901 MDAD0035301 MDAK0014501 MLCE0008901 MPBT0053401 MTAA0152901 MTAD0081101 MWAE0032401 MBJL0052201 MBJL0052001 MBJL0052101 MCCC0052301 MCCF0052201 MCJN0080501 MGAD0168201 MLEA0045701 MPBH0037901 MPBU0032501 MPBU0032901 MPBZ0200401 MPBZ0200501 MSDB0005501 MSDD0006801 MTAA0152601 MTAB0218501 MTAC0071601 ACGQ0023401
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Spec
Color Without Color Black
Remark
69, 70
PRESS, STS, , , , , MOLD, POM TX-31, , , , ,
Without Color Black Black Black Black
ELECTROFORMING, Cu, 0.2, , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LEXAN 141R, , , , , COMPLEX, (empty), 0.7, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, Tempered Glass, 0.5, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, Urethane Rubber S190A, , , , , COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , PRESS, BeCu, , , , , COMPLEX, (empty), 0.1, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,
Silver Black Without Color Without Color Without Color Without Color Black Silver Black Black Black Black Black Gold Without Color Without Color Black Black Without Color Without Color Black Gold Without Color Without Color Gold Black
65
73 76 64 66 67
58, 59 57 54
55
44
75
63 77
- 235 -
Level 4 5 5 4 5 5 6 7 7 7 6 6 6 6 5 5 5 5 4 5 5 4 5 5 5
Location No ACGK00 MCJK00 MFBD00 ACGS00 ABGG00 ACGS00 ADBY00 MDAP00 MTAK00 MWAE00 MCJW00 MDAN00 MFBC00 MTAA00 MTAB00 MTAB01 MTAZ00
Desciption COVER ASSY,FRONT COVER,FRONT FILTER,MIKE COVER ASSY,SLIDE(UPPER) BUTTON ASSY,SUB COVER ASSY,SLIDE(UPPER) DECO ASSY DECO,SLIDE(UPPER) TAPE,CAMERA WINDOW,CAMERA COVER,SLIDE(UPPER) DECO,SPEAKER FILTER,SPEAKER TAPE,DECO TAPE,PROTECTION TAPE,PROTECTION TAPE
Part Number ACGK0105601 MCJK0083501 MFBD0028301 ACGS0020201 ABGG0001801 ACGS0016501 ADBY0011801 MDAP0001801 MTAK0007301 MWAE0032301 MCJW0016801 MDAN0013901 MFBC0036901 MTAA0152501 MTAB0212201 MTAB0232201 MTAZ0168901 MWAC0093502 ADBY0012301 MDAP0002301 MMAA0009601 ARDY0004601 MPBT0057601 MPBU0026201 MTAC0067301 COMPLEX, (empty), , , , , UPPER SEND/END
Spec
Color Black
Remark
MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , ,
Black Without Color Silver Silver Silver Black Black Without Color Without Color Black Silver Without Color Without Color Without Color Without Color Without Color Black Black Black Without Color Without Color Without Color Black Without Color
38 43
MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), 0.1, , , , CUTTING, PMMA MR 200, 0.8, , , , CASTING, Al Alloy, , , , , ELECTROFORMING, Cu, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 0.1, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, Tempered Glass, , , , , Lower Deco Assy MOLD, POM TX-31, , , , , COMPLEX, (empty), 1, , , ,
4 15 17 9 6 14 7
MWAC00 WINDOW,LCD ADBY01 MDAP00 MMAA00 ARDY00 MPBT00 MPBU00 MTAC00 DECO ASSY DECO,SLIDE(UPPER) MAGNET,SWITCH RAIL ASSY,SLIDE PAD,CAMERA PAD,CONNECTOR TAPE,SHIELD
29 41, 42 45 31
COMPLEX, (empty), 0.3T, , , , COMPLEX, (empty), , , , , 1.4 mm,2.3 mm,SWCH18A ,N ,SQR , ,; ,BH ,[empty] ,2.7mm ,2.3mm +0.0mm,-0.2mm ,SWRCH ,WHITE ,[empty] ,[empty] COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , PRINTING, (empty), , , , ,
GMEY00
SCREW MACHINE,BIND
GMEY0017001
28
4 4 4 4 4 4 4 4 4
MBJC00 MCCH00 MCCH01 MIDZ00 MIDZ01 MIDZ02 MIDZ03 MKAG00 MLAZ00
BUTTON,FUNCTION CAP,SCREW CAP,SCREW INSULATOR INSULATOR INSULATOR INSULATOR KEYPAD,MAIN LABEL
MBJC0024801 MCCH0123101 MCCH0123001 MIDZ0166101 MIDZ0166701 MIDZ0167801 MIDZ0167901 MKAG0006201 MLAZ0038303
Silver Black Black Without Color Without Color Without Color Without Color Black White
3 27 26
39
- 236 -
Level 4 4 4 4 4 4 4 4 6 6 6 3 3 4 5 5 5 5 5
Location No MPBG00 MPBJ00 MTAB00 MTAB01 MTAC00 MTAF00 MTAJ00 MTAK00 ADCA00 ADCA00 MIDZ00 GMEY00 MLAK00 ACKA00 MCBA00 MIDZ00 MIDZ01 MCBA00 MLAZ00
Desciption PAD,LCD PAD,MOTOR TAPE,PROTECTION TAPE,PROTECTION TAPE,SHIELD TAPE,MOTOR TAPE,FLEXIBLE PCB TAPE,CAMERA DOME ASSY,METAL DOME ASSY,METAL INSULATOR SCREW MACHINE,BIND LABEL,MODEL CAN ASSY,SHIELD CAN,SHIELD INSULATOR INSULATOR CAN,SHIELD LABEL
Part Number MPBG0072301 MPBJ0051501 MTAB0228401 MTAB0212201 MTAC0067601 MTAF0019601 MTAJ0004801 MTAK0007401 ADCA0076201 ADCA0076101 MIDZ0175201 GMEY0009201 MLAK0018616 ACKA0006801 MCBA0027701 MIDZ0168901 MIDZ0169001 MCBA0027801 MLAZ0038301 PRESS, STS, , , , , CUTTING, BeCu, , , , , CUTTING, Bs, , , , , PRESS, STS, , , , , PID Label 4 Array SUB COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,
Spec
Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Black Without Color Without Color Without Color Without Color Color Unfixed Without Color Without Color
Remark 1 12
CUTTING, BeCu, 0.05, , , ,
40 16
1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm KG110 MADE IN KOREA
23
51 50 49 46
- 237 -
12.2 Replacement Parts <Main component>

Level 1 4 SNGF00 Location No Desciption IMT-2000(SLIDE) ANTENNA,GSM,FIXED Part Number TISL0003201 SNGF0033502
Spec
Color Black
Remark
3.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 3.0 ,-2.0 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0 ,50 ,3.0
52
4 4 5 6 7 7 7 7 7 7 6
SNGF01 SACY00 SACE00 SACC00 C1006 C101 C102 C103 CN104 R102 SACD00
ANTENNA,GSM,FIXED PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CONNECTOR,BOARD TO BOARD RES,CHIP PCB ASSY,FLEXIBLE,SMT TOP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD IC PCB,FLEXIBLE PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP CONN,RF SWITCH PCB ASSY,FLEXIBLE,SMT TOP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
SNGF0034101 SACY0073001 SACE0067701 SACC0044801 ECZH0003103 ECCH0004904 ECZH0003103 ECZH0003103 ENBY0016601 ERHY0011601 SACD0057301
53
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 20 PIN,0.4 mm,STRAIGHT ,AU ,0.9 STACKING HEIGHT 11 Kohm,1/16W ,F ,1005 ,R/TP
CN106
ENBY0019801
80 PIN,0.4 mm,ETC , ,H=1.5, Header
CN108
ENBY0036101
44 PIN,0.4 mm,ETC , ,H=1.0, Plug WSOF6 ,6 PIN,R/TP ,Luminance sensor ,; ,IC,A/D Converter POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
7 6 4 5 6 7 7 7 7
U101 SPCY00 SACY01 SACE00 SACC00 C113 C114 L1 SW101
EUSY0343701 SPCY0110201 SACY0073101 SACE0067801 SACC0044901 ECCH0000196 ECZH0001002 ELCH0003828 ENWY0005501
0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 2.4 nH,J ,1005 ,R/TP ,MLCI ,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD ,[empty] ,[empty] , ,
6 7 7 7
SACD00 C104 C105 C106
SACD0057401 ECTH0002201 ECCH0000122 ECCH0000163 10 uF,6.3V ,M ,STD ,1608 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP
- 238 -
Level 7 7 7 7
Location No C108 C109 C112 CN1
Desciption CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CONNECTOR,BOARD TO BOARD DIODE,LED,CHIP
Part Number ECCH0000163 ECZH0003103 ECZH0003103 ENBY0043601
Spec 47 nF,10V,K,X5R,HD,1005,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 20 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,MALE ,SMD ,[empty] , , WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , , ,[empty] ,[empty] ,2P WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , , ,[empty] ,[empty] ,2P PIN ,42 dB,4.72*3.76*1.25 ,MEMS MIC , , , ,OMNI ,1.5TO5V , ,SMD 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 1800 ohm,1005 ,Bead 1800 ohm,1005 ,Bead 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP 1 V,1 A,HORIZONTAL ,1 G, ,; ,10C2P ,[empty] ,[empty] ,[empty] , ,[empty] SON2017-6 ,6 PIN,R/TP ,HALL SWITCH, Pb Free 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
Color
Remark
LD101
EDLH0013401
LD102
DIODE,LED,CHIP
EDLH0013401
7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7
MIC101 R101 R102 R103 R104 RA101 SW1101 U101 VA101 VA102 VA103 VA104 VA105 VA106 VA107 VA108 ZD101
MICROPHONE RES,CHIP RES,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP RES,ARRAY,R SWITCH,TACT IC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR DIODE,TVS
SUMY0010603 ERHY0003301 ERHY0003301 SFBH0008102 SFBH0008102 ERNR0000403 ESCY0005301 EUSY0268101 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 EDTY0009401
7 6 5 4 5 5 6 7 7 7
ZD102 SPCY00 SAFB00 SAJY00 SAJB00 SAJE00 SAJC00 C900 C901 C902
DIODE,TVS PCB,FLEXIBLE PCB ASSY,MAIN,INSERT PCB ASSY,SUB PCB ASSY,SUB,INSERT PCB ASSY,SUB,SMT PCB ASSY,SUB,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
EDTY0009401 SPCY0110101 SAFB0085701 SAJY0032201 SAJB0016001 SAJE0025701 SAJC0024701 ECCH0009101 ECCH0009101 ECCH0000198
Multi key PCB
Color Unfixed
18
Multi Key
Color Unfixed
0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
- 239 -
Level 7 7 7 7 7 7
Location No C903 C904 C905 C906 C907 CN900
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,FFC/FPC CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD DIODE,SWITCHING
Part Number ECCH0011201 ECCH0009101 ECCH0009515 ECCH0009101 ECCH0009101 ENQY0014301
Spec 470 pF,250V ,K ,X7R ,HD ,1608 ,R/TP ,; , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 150 pF,25V ,K ,X7R ,HD ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 37 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC ,STRAIGHT ,BOTH ,SMD ,[empty] ,[empty] , 14 PIN, mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,FEMALE ,SMD ,[empty] , , 44 PIN,0.4 mm,ETC , ,H=1.0, Socket EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) TUMD2 ,200 V,0.5 A,R/TP , ,; , , , , , , ,[empty] ,[empty] ,[empty] ,[empty] SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) 100 uH,M ,ETC ,R/TP ,power inductor 2.9x2.9 SC70-6L ,15 W,240 V,1.52 A,R/TP ,Nch MOSFET ,; ,NCHANNEL ,MOSFET ,240 ,+-20 ,; ,2.46 ,15 ,SC706L ,R/TP ,6P 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
Color
Remark
CN901
ENBY0045801
CN902
ENBY0036201
D900
EDSY0011901
7 7 7 7 7
D901 FL900 FL901 FL902 L900
DIODE,SWITCHING FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER INDUCTOR,CHIP
EDSY0017901 SFEY0011601 SFEY0011601 SFEY0011601 ELCH0002610
Q900
TR,FET,N-CHANNEL
EQFN0008301
7 7 7 7 7 7 7 7
R900 R901 R902 R904 R906 R907 R908 R909
RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER CAP,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP PCB ASSY,MAIN,PAD SHORT RES,CHIP RES,CHIP RES,CHIP IC IC
ERHY0009505 ERHY0009505 ERHY0009527 ERHZ0000493 ERHZ0000485 ERHZ0000485 ECZH0003103 SAFP0000501
R910
ERHY0018201
10000000 ohm,1/10W ,F ,1608 ,R/TP ,; ,10000000 ,1% ,1/10W ,1608 ,R/TP
7 7 7 7 7 7
R911 R912 R913 R915 U900 U901
SAFP0000401 ERHY0009506 ERHY0009558 ERHY0019101 EUSY0309902 EUSY0277001 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 68 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP 56000 ohm,1/10W ,J ,1608 ,R/TP ,; ,56000 ,5% ,1/10W ,1608 ,R/TP QFN ,32 ,R/TP ,S/W ic for EL, 5x5x1T ,; ,IC,BiCMOS Cap sense Inputs device ,32 PIN,R/TP ,5*5 Capsense TrackPad
- 240 -
Level 7 7 7 7 7 7 7 6 4 4 4
Location No VA900 VA901 VA902 VA903 VA904 VA905 VA906 SPJY00 SJMY00 SUSY00 SVCY01
Desciption VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR PCB,SUB VIBRATOR,MOTOR SPEAKER CAMERA
Part Number SEVY0004201 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0004101 SEVY0004101 SPJY0046501 SJMY0006508 SUSY0027201 SVCY0015301 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 5.6 V, ,SMD ,360pF, 1005 5.6 V, ,SMD ,360pF, 1005
Spec
Color
Remark
FR-4 ,0.5 mm,BUILD-UP 6 ,KF750 MULTIKEY PCB ,; , , , ,,,,,, 3 V,.08 A,10*3.45 ,17mm , ,3V , , ,12500 , , , ,38 PIN ,8 ohm,90 dB, mm, ,; , , , , , ,18*12*3.4T ,PIN CMOS ,VGA ,MAGNACHIP(1/7.4"), 5.5x5.1x3.2t, FPCB 90 MAIN ,240*320 ,42.2*60*1.5t ,262k ,TFT ,TM ,uPD161707 , 62 mm, LINE, ,; ,[empty] ,[empty] ,[empty] , ,[empty] , ,[empty] 48 11 13 5
SVLM00
LCD MODULE
SVLM0027801
4 3 4 5 6 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7
SWCC00 SAFY00 SACY00 SACE00 SACC00 C901 C903 C904 C905 C906 C907 C908 C909 C911 C912 C913 C915 C916 C917 C918 C919 C920
CABLE,COAXIAL PCB ASSY,MAIN PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP
SWCC0005301 SAFY0255701 SACY0073201 SACE0067901 SACC0045001 ECCH0000182 ECCH0000182 ECZH0003103 ECCH0000179 ECCH0000115 ECCH0004904 ECZH0000830 ECZH0000830 ECCH0004904 ECCH0000155 ECCH0000155 ECCH0000198 ECCH0005604 ECCH0004904 ECCH0004904 ECZH0003103 ECCH0004904
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 241 -
Level 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7
Location No C921 C922 C923 C924 C925 D900 J900 J901 L900 L901 LD900 LD901 Q900 Q901 R900 R907 R911 R912 R913 R916 R919 R920 R923 R924 R925 R926 R927 R928 R929 R930 R931 R932 R933 R934
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP DIODE,TVS CONN,SOCKET CONN,SOCKET RES,CHIP,MAKER INDUCTOR,CHIP DIODE,LED,ARRAY DIODE,LED,MODULE TR,BJT,ARRAY TR,BJT,NPN RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER DIODE,SWITCHING
Part Number ECCH0004904 ECCH0004904 ECCH0000198 ECCH0000198 ECCH0000163 EDTY0008607 ENSY0021401 ENSY0018101 ERHZ0000401 ELCH0003811 EDLA0000902 EDLM0009401 EQBA0000601 EQBN0012401 ERHY0003301 ERHZ0000487 ERHZ0000401 ERHZ0000474 ERHZ0000405 ERHZ0000406 ERHZ0000406 ERHZ0000530 ERHZ0000404 ERHZ0000493 ERHZ0000493 ERHZ0000331 ERHZ0000518 ERHZ0000401 ERHZ0000401 ERHZ0000401 ERHZ0000401 ERHZ0000404 ERHZ0000404 EDSY0018101
Spec 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP SC70-6L ,6 V,200 W,R/TP ,PB-FREE 8 PIN,ETC , , mm, 6 PIN,ETC , ,2.54 mm,H=1.5 0 ohm,1/16W ,J ,1005 ,R/TP 1000 nH,K ,1608 ,R/TP ,COIL TYPE ORANGE ,1 COLOR,3.2X2.4X2.4mm ,R/TP , WHITE ,1 LED,3.5X2.8X0.6T ,R/TP , UMT5 ,.2 W,R/TP , ESM ,100 mW,R/TP ,NPN TRANSISTOR 100 ohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 390 ohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 5.1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 110 Kohm,1/16W ,F ,1005 ,R/TP 910 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP VMN2 ,30 V,100 mA,R/TP ,1.0x0.6 ,; , , , , , , ,[empty] ,[empty] ,2P ,1 VMN2 ,30 V,100 mA,R/TP ,1.0x0.6 ,; , , , , , , ,[empty] ,[empty] ,2P ,1 0 ohm,1/16W ,J ,1005 ,R/TP
Color
Remark
7 7
R935 R936
DIODE,SWITCHING RES,CHIP,MAKER
EDSY0018101 ERHZ0000401
- 242 -
Level 7 7 7 7 7 7 7
Location No R937 R938 R940 R943 RA1 RA2 U900
Desciption RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,ARRAY,R RES,ARRAY,R IC
Part Number ERHZ0000439 ERHZ0000406 ERHY0009506 ERHZ0000401 ERNR0000404 ERNR0000404 EUSY0334202
Spec 200 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP BGA ,20 PIN,R/TP ,Levelshifter,sdcard,6ch ,; ,IC,Bus Controller 3*3 QFN ,10 PIN,R/TP ,3xis Accelerometer ,; ,IC,A/D Converter BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,Audio Amplifier CSP ,36 PIN,R/TP ,SUB PMIC,ALC,2LDO_150mA,1.33X ,; ,IC,Sub PMIC DFN ,14 PIN,R/TP ,700mA Boost converter ,; ,IC,DC,DC Converter 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , 18 V, ,SMD , VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 POLYI ,0.25 mm,3-1-3 RF , ,; , , , , , , , , ,
Color
Remark
U901
IC
EUSY0345201
U902
IC
EUSY0349001
U903
IC
EUSY0230104
7 7 7 7 7 7 7 7 7 7
U904 VA900 VA901 VA905 VA907 VA908 VA909 VA910 VA911 ZD1
IC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR DIODE,TVS
EUSY0264502 SEVY0001001 SEVY0001001 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0003801 SEVY0003801 EDTY0009401
7 6 4 5
ZD2 SPCY00 SAFF00 SAFC00
DIODE,TVS PCB,FLEXIBLE PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM BATTERY,CELL,LITHIUM CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
EDTY0009401 SPCY0109601 SAFF0172201 SAFC0107001
6 6 6 6 6 6 6 6
BAT600 C107 C117 C118 C300 C301 C302 C303
SBCL0001701 ECCH0009216 ECZH0003103 ECCH0007802 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0009101
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
- 243 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No C304 C305 C306 C307 C308 C309 C310 C311 C312 C313 C314 C315 C316 C317 C318 C319 C320 C321 C322 C323 C324 C325 C326 C327 C328 C329 C330 C331 C332 C333 C334 C335 C421 C422 C500 C501 C502
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009203 ECCH0009203 ECCH0000143 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0007802 ECCH0000198 ECCH0006201 ECCH0004904 ECCH0004904
Spec 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 33 nF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 33 nF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Color
Remark
- 244 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0005603 ECCH0006201 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000161 ECZH0000901 ECZH0000901 ECCH0005604 ECCH0009101 ECCH0005604
Spec 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty] 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
Color
Remark
C517
CAP,TANTAL,CHIP
ECTH0002002
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
C518 C519 C520 C522 C523 C524 C525 C526 C527 C528 C529 C530 C531 C532 C534 C535 C536 C537 C600 C601 C602
CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
ECCH0009101 ECCH0000122 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000163 ECCH0000198 ECCH0009101 ECCH0009216 ECCH0009216 ECCH0009216 ECCH0009216 ECCH0000163 ECCH0000163 ECCH0009101 ECCH0009106 ECZH0001216 ECCH0004904 ECCH0009101 ECCH0007802 ECCH0006201
- 245 -
Level 6 6 6 6 6 6 6 6 6 6
Location No C603 C604 C605 C606 C607 C608 C609 C610 C611 C613
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP
Part Number ECCH0009101 ECCH0009101 ECCH0009101 ECCH0006201 ECCH0000198 ECCH0009106 ECCH0009101 ECCH0009101 ECCH0000115 ECTH0005202
Spec 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 3.9 nH,S ,1005 ,R/TP ,PBFREE 1 nH,S ,1005 ,R/TP , 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
Color
Remark
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
C614 C616 C619 C620 C621 C622 C700 C701 C702 C703 C704 C707 C708 C709 C710 C711 C716 C717 C718 C719 C722 C724 C802 C803 C804 C808
CAP,TANTAL,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER
ECTH0005202 ECZH0003103 ECCH0005603 ECCH0009216 ECCH0009216 ECCH0009216 ECTH0001901 ECCH0009101 ECCH0009101 ECCH0004904 ECCH0009101 ECCH0009101 ECCH0009514 ECCH0009514 ECCH0009514 ECCH0009514 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ELCH0001040 ELCH0004703 ECCH0009101 ECZH0003103
- 246 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No C809 C810 C811 C812 C813 C814 C815 C816 C817 C818 C819 CN500 CN600 CN700
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,ETC CONNECTOR,I/O CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD DIODE,SWITCHING DIODE,SWITCHING DIODE,SWITCHING
Part Number ECCH0009101 ECCH0009101 ECCH0004904 ECCH0004904 ECCH0009101 ECCH0009110 ECCH0009110 ECCH0000110 ECCH0000129 ECCH0004904 ECCH0000198 ENZY0016301 ENRY0006501 ENBY0043701
Spec 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 120 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 3 PIN,3.0 mm,ETC , ,H-2.0 18 PIN,0.4 mm,ETC , ,1.2 Offset 20 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,FEMALE ,SMD ,[empty] , , 34 PIN,0.4 mm,ETC , ,H=1.0, Socket EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SMT ,20 V,200 A,R/TP , EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) USF ,30 V,1 A,R/TP , ,; , , ,22A , , ,667mW ,[empty] ,[empty] ,[empty] ,1 120 ohm,1608 , 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , ,SMD ,R/TP 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , ,SMD ,R/TP 1800 ohm,1005 ,Bead 1800 ohm,1005 ,Bead 1800 ohm,1005 ,Bead 60 ohm,1005 , 60 ohm,1005 , SMD ,2ch Audio EMI/ESD Filter (8.4ohm, 60pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW 10 uH,M ,3.2*2.6*1.0 ,R/TP ,
Color
Remark
CN701
ENBY0040301
6 6 6
D500 D501 D502
EDSY0011901 EDSY0014001 EDSY0011901
6 6 6
D600 FB500 FB600
DIODE,SWITCHING FILTER,BEAD,CHIP FILTER,BEAD,CHIP
EDSY0017601 SFBH0001501 SFBH0008103
6 6 6 6 6 6 6 6 6 6 6 6
FB601 FB603 FB604 FB605 FB700 FB800 FL601 FL700 FL701 FL702 FL800 L400
FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,SAW INDUCTOR,SMD,POWER
SFBH0008103 SFBH0008102 SFBH0008102 SFBH0008102 SFBH0000909 SFBH0000909 SFEY0014001 SFEY0011701 SFEY0011701 SFEY0011701 SFSY0027301 ELCP0006703
- 247 -
Level 6 6 6 6 6 6 6
Location No L500 L600 L800 L801 L802 Q300 Q400
Desciption INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP TR,BJT,NPN TR,FET,P-CHANNEL
Part Number ELCP0009401 ELCH0001556 ELCH0001034 ECCH0000701 ELCH0004703 EQBN0013301 EQFP0009301
Spec 4.7 uH,M ,2.8*2.6*1.0 ,R/TP , 270 nH,J ,1608 ,R/TP , 3.3 nH,S ,1005 ,R/TP ,PBFREE 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 1 nH,S ,1005 ,R/TP , 2-2H1A ,.1 W,R/TP ,VEBO=6V, Pb free MLF-4 ,0 W,0 V,1.2 A,R/TP ,Load Switch ,; ,P-CHANNEL ,MOSFET ,; ,; ,; ,; ,; ,MELF ,R/TP ,4P USM ,600 mW,R/TP ,EPITAXIAL PLANAR NPN TRANSISTOR SC70-6 ,6.5 W,-20 V,-4.5 A,R/TP ,P channel FET ,; ,PCHANNEL ,MOSFET ,-20 ,8 ,-4.5 ,0.153 ,6.5 ,SC70 ,R/TP ,6P
Color
Remark
Q500
TR,BJT,NPN
EQBN0014301
Q501
TR,FET,P-CHANNEL
EQFP0009101
6 6 6 6
R100 R102 R105 R300
PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP
SAFP0000501 ERHZ0000463 ERHY0009506 SAFP0000501 33 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
R301
SAFP0000501
R302
SAFP0000501
6 6 6 6 6 6 6
R304 R305 R306 R307 R308 R309 R310
SAFP0000501 ERHY0009506 ERHY0009506 ERHY0009506 ERHY0009505 ERHZ0000443 SAFO0000401 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 0OHM DNI
6 6 6 6 6 6 6 6 6
R311 R312 R313 R314 R315 R404 R406 R500 R501
SAFP0000501 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000237 ERHZ0000294 ERHY0009506 ERHY0009503 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,F ,1005 ,R/TP 5100 ohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 100 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
- 248 -
Level 6 6 6 6
Location No R504 R505 R506 R507
Desciption PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD OPEN RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP
Part Number SAFP0000501 ERHZ0000443 ERHZ0000265 SAFP0000401
Spec
Color
Remark
2200 ohm,1/16W ,J ,1005 ,R/TP 300 Kohm,1/16W ,F ,1005 ,R/TP
6 6 6
R508 R509 R511
SAFP0000401 ERHY0017201 SAFP0000401 0.025 ohm,1/4W ,F ,2012 ,R/TP
R512
SAFP0000501 0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012 ,R/TP 47 Kohm,1/16W ,J ,1005 ,R/TP 47 Kohm,1/16W ,J ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 39 Kohm,1/16W ,F ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 39 Kohm,1/16W ,F ,1005 ,R/TP 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 0OHM DNI
6 6 6 6 6 6 6 6 6 6 6 6 6 6
R513 R514 R515 R516 R517 R518 R519 R520 R521 R522 R523 R524 R525 R600
ERHZ0003901 ERHZ0000486 ERHZ0000486 ERHY0000181 ERHZ0000279 ERHY0000181 ERHY0000181 ERHY0009505 ERHY0009505 ERHY0009506 ERHY0009506 ERHZ0000279 ERHY0009527 SAFO0000401
R601
SAFP0000401
6 6 6 6 6 6 6 6
R602 R603 R604 R605 R606 R607 R610 R612
SAFP0000401 ERHZ0000493 SAFO0000401 ERHZ0000404 ERHZ0000212 ERHZ0000486 ERHY0009541 ERHY0009541 51 Kohm,1/16W ,J ,1005 ,R/TP 0OHM DNI 1 Kohm,1/16W ,J ,1005 ,R/TP 12 Kohm,1/16W ,F ,1005 ,R/TP 47 Kohm,1/16W ,J ,1005 ,R/TP 470 ohm,1/20W(0.05W) ,F ,0603 ,R/TP 470 ohm,1/20W(0.05W) ,F ,0603 ,R/TP
- 249 -
Level 6
Location No R613
Desciption PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD OPEN RES,CHIP PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD OPEN PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP CONN,RF SWITCH
Part Number SAFO0000401 0OHM DNI
Spec
Color
Remark
6 6 6 6 6 6 6 6
R614 R615 R616 R617 R618 R619 R620 R621
SAFO0000401 ERHY0009522 SAFP0000401 ERHZ0000499 ERHY0009504 SAFP0000501 ERHZ0000445 SAFP0000401
0OHM DNI 3.3 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
5600 ohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
220 Kohm,1/16W ,J ,1005 ,R/TP
R622
SAFO0000501
0OHM_1005_DNI
R623
SAFO0000501
0OHM_1005_DNI
6 6 6 6 6 6 6 6
R624 R702 R703 R704 R705 R706 R707 R710
SAFP0000501 ERHZ0000463 ERHZ0000206 ERHY0009502 ERHY0009502 ERHY0009502 ERHY0009502 SAFP0000501 33 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,F ,1005 ,R/TP 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
R713
SAFO0000401
0OHM DNI
R714
SAFO0000401
0OHM DNI
R803
SAFP0000401
6 6 6 6 6 6 6 6
R807 R808 R813 R814 R816 R817 R818 SW100
SAFP0000401 ERHZ0000406 ERHZ0000402 ERHZ0000402 ERHY0009531 ERHY0009531 ERHY0009516 ENWY0005301 100 Kohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 62 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP ,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER ,SMD ,R/TP ,AU , ,
- 250 -
Level 6 6 6 6 6 6
Location No SW101 U101 U300 U301 U400 U500
Desciption CONN,RF SWITCH IC IC IC IC IC
Part Number ENWY0005601 EUSY0245902 EUSY0316504 EUSY0327501 EUSY0154415 EUSY0349001
Spec ,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD ,[empty] ,[empty] , , DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7 FBGA ,107 PIN,ETC ,FULLY 1.8V 2G(LB/256Mx8) NAND+1G(2CS/16Mx4x16) SDRAM ,; ,IC,MCP BGA ,344 PIN,R/TP ,3.6Mbps HSDPA Digital Baseband
Color
Remark
BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,Audio Amplifier uMLP ,10 PIN,R/TP ,typ Rdson 0.4ohm, 1.4X1.8 ,; ,IC,Analog Switch BGA ,143 PIN,R/TP ,HSDPA Analog baseband ,; ,IC,Digital Baseband Processor CSP ,20 PIN,R/TP ,ESD protection & Filtering for analog signals, Pb-free TFBGA ,36 PIN,R/TP ,USB2.0 Transceiver, 3.5X3.5X0.8 uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF 6.5ohm 1.4X1.8 SON1612-6 ,6 PIN,R/TP ,3.1V 150mA LDO Pb-Free SON1612-6 ,6 PIN,R/TP ,2.6V 150mA LDO Pb-Free SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO WFBGA ,100 PIN,R/TP ,Bluetooth+FM 5*7.5*0.8 ,; ,IC,Bluetooth SON1612-6 ,6 PIN,R/TP ,1.8V 150mA LDO Pb-Free 5 V,<0.5pF ,SMD , 5 V,<0.5pF ,SMD , 5 V,<0.5pF ,SMD , 5 V,<0.5pF ,SMD , 18 V, ,SMD ,10pF, 1005 18 V, ,SMD ,10pF, 1005 18 V, ,SMD ,10pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 ,-40'C ~ +85'C, C0 1.05pF, C1 fF ,; ,32.768 ,20PPM ,12.5 , , ,SMD ,R/TP VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1
U501
IC
EUSY0340301
U502
IC
EUSY0297502
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
U600 U601 U602 U700 U701 U702 U801 U803 VA600 VA601 VA602 VA603 VA700 VA701 VA702 VA703 VA704 VA705
IC IC IC IC IC IC IC IC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR
EUSY0269001 EUSY0320201 EUSY0338301 EUSY0294801 EUSY0294901 EUSY0232812 EUSY0358701 EUSY0294701 SEVY0007301 SEVY0007301 SEVY0007301 SEVY0007301 SEVY0004301 SEVY0004301 SEVY0004301 SEVY0001001 SEVY0001001 SEVY0001001
X500
X-TAL
EXXY0024301
6 5 6 6
ZD600 SAFD00 C100 C101
DIODE,TVS PCB ASSY,MAIN,SMT TOP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
EDTY0009401 SAFD0105601 ECCH0009216 ECCH0009106
22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
- 251 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0005604 ECCH0005604 ECCH0009216 ECCH0009216 ECCH0009216 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECZH0000816 ECCH0000185 ECCH0000185 ECZH0000816 ECCH0000185 ECCH0000185 ECCH0000180 ECCH0000175 ECCH0000117 ECCH0005604 ECCH0009506 ECCH0000155 ECCH0005604 ECCH0000155 ECCH0000143 ECCH0009514 ECCH0000143 ECCH0009216 ECZH0000841 ECCH0006201 ECZH0003103 ECCH0000110 ECZH0000841 ECZH0000841 ECCH0000161 ECCH0000185
Spec 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 27 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Color
Remark
- 252 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Desciption CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECZH0000841 ECCH0000115 ECZH0000846 ECTH0003701 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009514 ECCH0000109 ECCH0000109 ECTH0003701 ECCH0009101 ECCH0009514 ECCH0009101 ECCH0009101 ECCH0009101 ECCH0009514 ECCH0009101 ECCH0004904 ECCH0009101 ECCH0004904 ECCH0005604 ECZH0001420 ECCH0009216 ECCH0000115 ECZH0001421 ECZH0001421 ECCH0000115 ECCH0000137 ECCH0000137 ECZH0001215 ECCH0000155 ECCH0004904 ECCH0004904 ECCH0004904
Spec 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 8 pF,50V,D,NP0,TC,1005,R/TP 8 pF,50V,D,NP0,TC,1005,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Color
Remark
- 253 -
Level 6 6 6 6 6 6 6 6 6 6 6 6
Location No C805 C806 C807 CN702 FB400 FB401 FB602 FL100 FL101 FL102 FL200 FL201
Desciption CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,SAW FILTER,SAW FILTER,SAW FILTER,SAW FILTER,SAW
Part Number ECCH0009101 ECCH0009101 ECCH0004904 ENBY0019901 SFBH0000903 SFBH0000903 SFBH0002302 SFSY0024302 SFSY0024303 SFSY0024301 SFSY0029201 SFSY0028101
Spec 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 80 PIN,0.4 mm,ETC , ,H=1.5, Socket 600 ohm,1005 , 600 ohm,1005 , 120 ohm,1608 ,CHIP BEAD, 2000mA 1842.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 1960 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 942.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 2140 MHz,1.35*1.05*0.6 ,SMD ,Pbfree_WCDMA_Rx_200ohm 1950 MHz,1.4*1.4 ,SMD ,Pb-free_DCS1900_Rx 1950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45 dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45 ,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP 1950 MHz,3.2x2.5x1.2 ,SMD ,IL 0.5dB, Isolation 14.5dB 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 18 nH,J ,1005 ,R/TP ,PBFREE 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 2.7 nH,S ,1005 ,R/TP ,PBFREE 1 nH,S ,1005 ,R/TP , 3.3 uH,M ,2.5*2.0*1.0 ,R/TP ,Chip power 8.2 nH,J ,1005 ,R/TP , 5.6 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD ,2.5X2X1MM ,11MM ,R/TP 4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD ,2.5X2X1MM ,11MM ,R/TP 2.2 uH,M ,1005 ,R/TP , 19.3 dB,0.3 dB,25 dB,1.6*0.8*0.6 ,SMD ,1920M ~ 1980M, 6pin 18 ohm,1/16W ,J ,1005 ,R/TP 300 ohm,1/16W ,J ,1005 ,R/TP 300 ohm,1/16W ,J ,1005 ,R/TP
Color
Remark
FL202
DUPLEXER,IMT
SDMY0001202
6 6 6 6 6 6 6 6 6 6 6 6 6 6
IS200 L100 L101 L102 L103 L104 L105 L106 L200 L201 L202 L203 L204 L401
ISOLATOR,GSM INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,SMD,POWER
SQGY0000101 ELCH0003824 ELCH0003824 ELCH0001036 ELCH0001032 ELCH0003824 ELCH0001036 ELCH0001039 ELCH0005020 ELCP0008003 ELCH0005016 ELCH0001036 ELCH0001035 ELCP0008004
6 6 6 6 6 6
L402 L403 N200 R101 R103 R104
INDUCTOR,SMD,POWER INDUCTOR,CHIP COUPLER,RF DIRECTIONAL RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER
ELCP0008004 ELCH0010401 SCDY0003501 ERHZ0000428 ERHZ0000458 ERHZ0000458
- 254 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No R106 R107 R108 R109 R110 R111 R112 R113 R114 R200 R201 R202 R203 R204 R205 R206 R207 R208 R400
Desciption RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER THERMISTOR RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP RES,CHIP RES,CHIP PCB ASSY,MAIN,PAD SHORT
Part Number ERHZ0000522 ERHY0003501 ERHY0003501 ERHY0009506 ERHZ0000485 SETY0007101 ERHY0009536 ERHY0009506 ERHY0009506 ERHZ0000483 ERHZ0000404 ERHY0003501 ERHZ0000500 ERHZ0000500 ERHY0009515 ERHY0009515 ERHY0009515 ERHY0009515 SAFP0000501
Spec 24 ohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP NTC ,4700 ohm,SMD ,1005 J B:3500K 100 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP 220 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
Color
Remark
R401
SAFP0000401
R402
SAFP0000501
R413
SAFP0000501
6 6 6 6 6 6 6 6 6 6 6
R414 R416 R417 R418 R422 R424 R425 R427 R428 R429 R430
SAFP0000501 ERHZ0000406 ERHY0009504 ERHY0009504 ERHZ0000433 ERHZ0000507 SAFP0000501 ERHY0000283 ERHY0009527 ERHY0000289 SAFP0000501 130K ohm,1/16W,J,1005,R/TP 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 270K ohm,1/16W,J,1005,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP 180 Kohm,1/16W ,J ,1005 ,R/TP 68 Kohm,1/16W ,J ,1005 ,R/TP
- 255 -
Level 6 6 6 6
Location No R432 R433 R434 R625
Desciption PCB ASSY,MAIN,PAD OPEN RES,CHIP,MAKER RES,CHIP PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT FRAME,SHIELD PCB,MAIN RF MODULE,HANDSET IC PAM IC IC IC
Part Number SAFO0000501 ERHZ0000509 ERHY0000170 SAFP0000501 0OHM_1005_DNI
Spec
Color
Remark
75 ohm,1/16W ,J ,1005 ,R/TP 390 ohm,1/16W ,F ,1005 ,R/TP
R700
SAFP0000501
6 6 6 6 6
R701 R800 R801 R802 R804
SAFP0000501 ERHZ0000437 ERHZ0000443 ERHZ0000443 SAFP0000401 2 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP
R805
SAFP0000401
6 6 6 6 6 6 6 6 6
R815 SC100 SPFY00 U100 U102 U200 U201 U202 U203
SAFP0000501 MFEA0021501 SPFY0174201 SMRH0004201 EUSY0296201 SMPY0013601 EUSY0222103 EUSY0299401 EUSY0327901 PRESS, STS, , , , , FR-4 ,0.8 mm,LX-BUMP 10 ,KF750 AMP MAIN PCB ,; , , ,,,,,,, MHz, MHz,QUAD EDGE 6x6 ,EMP U300 Tx Module HVQFN40 ,40 PIN,R/TP ,RF3000 EDGE Transceiver, 6x 6x1.0, 40 HVQFN dBm,40 %,90 mA, dBc,29 dB,4x4x1 ,SMD ,HSDPA MicroSMD ,8 PIN,R/TP ,DCDC for PAM 650mA, ~3.4V ,6 PIN,R/TP ,0.3_2v HVQFN40 ,40 PIN,R/TP ,WCDMA Transceiver, 6 * 6 * 1.0, OM6195HN MLF ,12 PIN,R/TP ,Dual DCDC,800mA, adj ,; ,IC,Sub PMIC FPBGA ,180 PIN,R/TP ,5M Camera,VGA30,Multi audio codec DFN ,10 PIN,R/TP ,OVP WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO BGA ,12 PIN,R/TP ,4-BIT BIDIRECTIONAL VOLTAGELEVEL TRANSLATOR (ZXU type) 26 MHz,10 PPM,15 pF,40 ohm,SMD ,3.2*2.5*0.85 ,10ppm at -30'C ~ +85'C, C0 1.6pF, C1 5.7fF 27 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppm at -20'C ~ +70'C, Pb Free POLYI ,0.2 mm,DOUBLE ,KF750 VOLUME SIDEKEY ,; , ,,,,,,,, Without Color 47
U403
IC
EUSY0154416
6 6 6
U404 U603 U703
IC IC IC
EUSY0330701 EUSY0319201 EUSY0319001
U800
IC
EUSY0334201
X100
X-TAL
EXXY0022801
X400
X-TAL
EXXY0023301
SPKY00
PCB,SIDEKEY
SPKY0056301
- 256 -
Level 4
Location No SVCY00
Desciption CAMERA
Part Number SVCY0017001
Spec CMOS ,MEGA ,5M AF [Micron 1/3.2", MI5130, Parallel, FPCB]
Color
Remark
- 257 -
12.3 Accessory
Level 3
Location No MHBY00
Desciption HANDSTRAP
Part Number MHBY0005603 Libra Hand Strap
Spec
Color Without Color
Remark
SBPL00
BATTERY PACK,LI-ION
SBPL0085703
3.7 V,800 mAh,1 CELL,PRISMATIC ,CMW PJT BATT, Innerpack, Europe Label, Pb-Free ,; ,3.7 ,800 ,0.2C ,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack ,CMW Slide & Folder 3.7 V,800 mAh,1 CELL,PRISMATIC ,463443,innerpack,EUROP ,; , , , ,PRISMATIC , , ,BLACK ,, ; ,[empty] ,[empty] ,[empty] ,18pin 6.2mm. NYX Box Package ,BLACK , ,N ; ,RMS 10mW(0.4V,RM3 ,16 OHM ,93dB,1KHZ,1mW ,65dB 10KHZ ,104dB 100KHZ ,[empty] ,BLACK ,18P MMI CONNECTOR ,Balance wire 250mm ,Earphone,Stereo 100-240V ,5060 Hz,5.1 V,.7 A,CE ,England, 18pin plug, Nyx packing ,; , , , , , ,WALL 2P ,I/O CONNECTOR ,
AIRY BLUE
BATTERY PACK,LI-ION
SBPL0087803
SGDY00
DATA CABLE
SGDY0010908
SGEY00
EAR PHONE/EAR MIKE SET
SGEY0005571
SSAD00
ADAPTOR,AC-DC
SSAD0025003
ADAPTOR,AC-DC
SSAD0025004
100-240V ,5060 Hz,5.1 V,0.7 A,CE ,18pin, UK, Viewty packing ,; , ,5.1V ,0.7A , , ,WALL 2P ,I/O CONNECTOR ,
- 258 -
Note
Note

LG KF750 KF755c Secret Service Manual

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LG KF750 KF755c Secret Service Manual

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Service Manual

Internal Use Only

Service Manual KF750/KF755c

Date: May, 2008 / Issue 1.0

3. TECHNICAL BRIEF ........................21

4. TROUBLE SHOOTING ...................84

11. Stand-alone Test ........................226

12. EXPLODED VIEW & REPLACEMENT PART LIST ......233

LGE Internal Use Only

LGE Internal Use Only

1.2 Regulatory Information

LGE Internal Use Only

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices ATTENTION

LGE Internal Use Only

LGE Internal Use Only

2.2 Usable environment

Spec. Available power

LGE Internal Use Only

2.3 Radio Performance

30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~1.71GHz

-57dBm -59dBm -57dBm -47dBm

30M~880MHz 880M~915MHz 915M~1GHz 1G 1.71GHz 1.71G~1.785GHz 1.785G~4GHz

1.71G~1.785GHz -53dBm 1.785G~4GHz -47dBm

LGE Internal Use Only

Item Frequency Error Phase Error 0.1ppm 5(RMS) 20(PEAK)

Frequency Error Under Multipath and Interference Condition

Due to Switching transient

400kHz 600kHz 1200kHz 1800kHz

LGE Internal Use Only

Item Transmitter Output Power Level 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

GSM Power 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 Toler. 3 3 3 3 3 3 3 3 3 3 3 5 5 5 5 Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

DCS/PCS Power 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Toler. 3 3 3 3 3 3 3 3 3 4 4 4 4 4 5 5

LGE Internal Use Only

Group (10 equel command group) +1 5 6 Minimum Output Power +8/+12 +

Transmit OFF Power Transmit ON/OFF Time Mask

-56dBm(3.84MHz) 25us PRACH,CPCH,uplinlk compressed mode

Power setting in uplink compressed Occupied Bandwidth(OBW) Spectrum emission Mask

3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz,1M -3910*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M

Adjacent Channel Leakage Ratio(ACLR)

33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm

LGE Internal Use Only

Item Spurious Emissions (*: additional requirement)

-31dBc@5MHz, Interferer -40dBc -41dBc@10MHz, Interferer -40dBc

Error Vector Magnitude (EVM)

17.5%(>-20dBm) (@12.2K, 1DPDCH+1DPCCH)

Transmit OFF Power

-15dB@SF=4, 768kbps, multi-code transmission

LGE Internal Use Only

LGE Internal Use Only

LGE Internal Use Only

LGE Internal Use Only

LGE Internal Use Only

2.4 Current Consumption

2.6 Battery Bar

LGE Internal Use Only

2.7 Sound Pressure Level

LGE Internal Use Only

No TDMA NOISE GSM: Power Level: 5

Test Item GSM MS DCS: Power Level: 0 DCS

LGE Internal Use Only

LGE Internal Use Only

3dB(after 14slots transmission gap) 5MHz(99%) -35-15(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1(f-3.5)dBc@f=3.5~7.5MHz,1M -3910*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M