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1
Department of Prosthodontics, Faculty of Dentistry, University of Yüzüncü Yıl, 65080 Kampus, Van, Turkey
2
Department of Endodontics, Faculty of Dentistry, University of Yüzüncü Yıl, 65080 Kampus, Van, Turkey
3
Dental Materials Unit, Center for Dental and Oral Medicine, Clinic for Fixed and Removable Prosthodontics and Dental Materials Science, University
of Zürich, Plattenstrasse 11, CH-8032 Zürich, Switzerland
Corresponding author, Andaç Barkın BAVBEK; E-mail: bavbekab@yahoo.com
This study tested whether exhaled humid conditions would affect the adhesion of etch-and-rinse, two-step and one-step self-etch
adhesive resins to enamel. Enamel surfaces of human maxillary anterior teeth (N=240, n=20) were exposed to four humid conditions
(H1: 63–68%, H2: 73–78%, H3: 93–98%, H4: 36–45% RH) during bonding with Adper Single Bond 2 (SB2), Clearfil SE Bond (CSE)
and Adper Easy Bond (AEB). Specimens were stored in distilled water at 37ºC for 24 h and tested to failure using micro-shear bond
strength (μSBS) test. Data were analyzed using two-way ANOVA and Tukey’s test (p<0.05). The μSBS to enamel with SB2, CSE
and AEB was not significantly affected by humidity parameters. AEB resulted in significantly lower μSBS in all conditions. The
frequency of adhesive failures was the highest at H2, H3 for SB2, H3 for CSE and H1-4 for AEB indicating that humidity conditions
may decrease adhesion quality to enamel.
Keywords: Adhesion, Micro-shear bond strength, Relative humidity, Self-etch adhesive resin, Total-etch system
Fig. 1 Schematic drawing of the laminar flow chamber where extended RH conditions
was established using a nebulizer at 30°C (Relative humidity of H1: 63–68%,
H2: 73–78%, H3: 93–98% and laboratory humidity condition, H4: 36–45%).
470 Dent Mater J 2013; 32(3): 468–475
Table 1 The type, brand, chemical composition, batch numbers and application protocols of the materials used for
the experiments
Manufacturer and
Type Brand, Abbreviation, Chemical Composition Application Protocol
Batch Numbers
One-bottle Adper Single Bond 2 (SB2) 3M ESPE, Applied two layers for 15 s.
Total-etch Bis-GMA, HEMA, dimethacrylates, polyalkenoic acid St. Paul, USA Gently air-thin each layer
adhesive copolymer, initiators, water and ethanol Batch no: 9XE for 5 s.
for 30 s. Then, an etch-and-rinse (total-etch) adhesive Micro-shear bond strength (μSBS) testing
resin (Adper Single Bond 2-SB2, 3M ESPE, St. Paul, All specimens were tested to failure for μSBS using a
USA) was applied according to the manufacturer’s special testing machine (Bisco Inc, Schaumburg, IL,
instructions and photo-polymerized using a light- USA) at a crosshead speed of 0.5 mm/min (Figs. 2a–b).
emitting diode (LED) polymerization unit (Elipar S10, Maximum stresses in Newton (N) were obtained from
3M ESPE) for 10 s. the screen of the machine. The quantitative values were
Group CSE: In this group, enamel surfaces were converted into megapascal (MPa) by dividing it by the
conditioned initially with the primer of the two-step bonded area (mm2) of the relevant resin cements.
self-etch adhesive (Clearfil SE Bond-CSE, Kuraray
Noritake Co., Osaka, Japan). After exposure to humid Failure analysis
conditions for 30 s, bonding was applied according to the The debonded areas of all specimens were examined
manufacturer’s recommendations. The adhesive resin under stereomicroscope (Olympus SZ40, Tokyo, Japan)
was applied accordingly, and photo-polymerized for 10 s. at 30× magnification. Failure modes were assigned as
Group AEB: The enamel surfaces in this group were adhesive, cohesive or mixed. Representative specimens
exposed to humidity conditions for 30 s and treated with were sputter coated using a gold alloy to evaluate the
one-step self-etch adhesive resin (Adper Easy Bond- debonded areas on enamel under Scanning Electron
AEB, 3M ESPE) and photo-polymerized for 10 s. Microscope (SEM) (LEO 440, Electron Microscopy Ltd,
After conditioning enamel surfaces with the Cambridge, UK) with an acceleration voltage of 20 keV.
adhesive resins at different RH levels as described
before, resin composite (Reflexions, Bisco, Schaumburg, Statistical analysis
USA) was condensed into translucent polyethylene Statistical analysis were made using SPSS for Windows,
tubes (diameter: 1 mm; height: 2 mm) which positioned version 15.0 (SPSS Inc., Chicago, IL, USA). The μSBS
on the enamel surfaces and polymerized using the LED values of specimens in different humid conditions were
polymerization unit for 20 s. not normally distributed (Kolmogorov-Smirnov and
After the composite resin was polymerized, all Shapiro-Wilk, α=0.05). Thus, they were logarithmically
specimens were stored at 37°C water for 24 h until the transformed before statistical analysis. Data (MPa)
tests. were submitted to two-way analysis of variance (2-
Dent Mater J 2013; 32(3): 468–475 471
Figs. 2a–b Photos of the a) testing machine used for determining μSBS tests, b) position of the
specimen in the jig in relation to the shearing blade of the testing machine.
Table 2 The mean μSBS values and standard variations of the resin composite to enamel bonded with SB2, CSE, AEB
adhesive resins at different humid conditions. Same capital superscript letters in the same row and same lower
case letters in the same column show no statistical difference (p<0.05). See Table 1 for group abbreviations
RESULTS
While adhesive resin type significantly affected the
results (F=131.596, p=0.000), RH parameters did not
have a significant effect (F=2.406, p=0.068). Interaction
terms were significantly different (F=2.158, p=0.049).
The mean μSBS values to enamel with SB2, CSE
and AEB were shown in Table 2. Among all adhesive
resins, AEB resulted in significantly lower μSBS (3.4–
5.8 MPa) than those of SB2 (8.5–11.8 MPa) and CSE Fig. 3. The distribution of the failure types in percentage
(9.6–12.9 MPa) in all H1, H2, H3 and H4 conditions per experimental group at different relative
(p<0.05). SB2 and CSE showed no significant difference humidity conditions.
in terms of μSBS (p>0.05).
The frequency of adhesive failures was the highest
at H2, H3 for SB2, H3 for CSE and H1-4 for AEB
indicating that humidity conditions may decrease
adhesion quality to enamel (Fig. 3). Cohesive failures depending on the adhesive resin (Figs. 4a–d, 5a–d, 6a–
were more in common in CSE followed by SB2. d). With the increase in RH level, the amount of bonded
SEM images especially in H4 conditions showed resin on the enamel surface decreased.
cohesive failure of the resin composite at varying degrees
472 Dent Mater J 2013; 32(3): 468–475
Figs. 4a–d SEM images (×2,000) of enamel surface after debonding from specimens belonging to Group SB2.
a) bonded at H1. Note the large cohesive failure in the composite resin, b) bonded at H2, c) bonded at H3. Note the
very small amount of resin composite attached on the enamel surface compared to (adhesive failure), d) bonded
at H4. Note the large fragment of composite resin adhered on the enamel surface (mixed failure). The arrow in
all SEM images indicate the remnants of resin composite.
Figs. 5a–d SEM images (×2,000) of enamel surface after debonding from specimens belonging to Group CSE.
a) bonded at H1. Note the distributed resin composite remnants on the enamel (cohesive failure), b) bonded at
H2, c) bonded at H3. Note the very small amount of resin composite left adhered (adhesive failure), d) bonded
at H4. Note the resin composite layer throughout the debonded surface (cohesive failure). The arrow in all SEM
images indicate the remnants of resin composite.
Figs. 6a–d SEM images (×2,000) of enamel surface after debonding from specimens belonging to Group AEB.
a) bonded at H1, b) bonded at H2. Note the resin composite remnants on the enamel covering a small area (mixed
failure), c) bonded at H3. Note the absence of resin composite (adhesive failure), d) bonded at H4. Note the resin
composite layer very small remnants of composite particles (cohesive failure). The arrow in all SEM images
indicate the remnants of resin composite.
was accepted.
DISCUSSION
In the experimental set-up, in an effort to simulate
In this study, the μSBS of resin composite to enamel was the exhaled humidity conditions in the oral environment,
tested after conditioning the enamel surface with three a humid air chamber was constructed and the humidity
different adhesive systems applied at various humidity was measured with the help of a digital hygrometer. To
conditions. Since humidity did not significantly influence the authors’ best knowledge, a similar methodology has
the mean μSBS results within one adhesive system, not been established for in vitro conditions to date. The
the null hypothesis that increased percentage of RH humid air has been warmed in the nebulizer up to 30oC
conditions simulating the oral environment would not before it departed from the chamber. The idea for this
affect the bond strength of the adhesive resins to enamel, was to simulate the respiratory system that heats the
Dent Mater J 2013; 32(3): 468–475 473
air exhalation. to the wet and dry enamel surfaces. Similarly, Chuang
Total etch adhesive and two-step self-etch adhesive et al.26) reported that marginal quality was not affected
resin exhibited significantly higher μSBS than that when SB2 was applied on dry and wet enamel. However,
of one-step self-etch adhesive resin to enamel at all in both studies wetness of the enamel surfaces were
humidity conditions. Previous in vitro studies did not constituted with water contamination. In this study,
consider humidity conditions but assuming that they interaction terms were significant indicating that
were performed in laboratory conditions, their results some resin types behaved differently in varying RH
could be compared to our results obtained at 36–45% conditions. This can be attributed to the distinction in
RH (H4) conditions. Among many studies, where the chemical composition of adhesives used in the study.
adhesion of total-etch, two-step self-etch and one-step If the chemical composition of the adhesive systems
self-etch adhesive systems to enamel was studied, Lopes were examined, HEMA monomer could be found in SB2,
et al.17) emphasized the similarity of the bond strength CSE and AEB adhesive systems. Hydrophilic property
to enamel between total-etch system and two-step self- of HEMA monomer, which designated the bonding
etch system whereas some studies18,19) pointed out the performance of the adhesives, could be verified according
differences between SB2 and CSE on bond strength to to their polymerized and unpolymerized states27). If the
enamel. Our results were comparable with the third water absorption takes place before polymerization, a
preliminary study of Adebayo et al.20), regarding the reduction in the polymerization degree might occur due
mean μSBS values of SB2 and CSE adhesives. On the to the dilution of the monomer in the adhesive system.
other hand, McLeod et al.21) observed that the total-etch As shown in the present study, the specimens were
systems showed significantly higher shear bond strength prone to humid conditions prior to the application of
to enamel than those of self-etch systems where they the adhesive. However, the hydrophilic adhesive system
used CSE and AEB. Nazari et al.22) have put forward was not affected from the existing humidity conditions
the superiority of the bond strength of the total-etch according to μSBS values in all groups. Unlike SB2
adhesive to one-step self-etch adhesive on both intact and AEB, CSE contains 10-MDP monomer, merging
and ground enamel surfaces. In particular, a study of both hydrophilic and hydrophobic functional groups28).
Mine et al.23) showed significantly lower bond strength of Apparently, here hydrophobic functional monomers in
AEB than CSE. It has to be noted that in these studies CSE were not influenced from the humid conditions29).
either macroshear test17,21), or microtensile test18,23) was This could be due to the hydrophilic monomer in CSE
used. In vitro studies are considerably influenced by that contributed to the water sorption capability of
the testing parameters. Thus, our study can only be HEMA29). In fact, SB2 contains not only HEMA but also
compared in the real sense with those studies where also water, ethanol and 10% silica nanofillers by weight30).
microshear test was used18-20,22). Ethanol is added into the agent as solvent to accelerate
The quality of the bond strength of self-etch adhesive water elimination31). As mentioned above, if the ratio of
systems is related to their acidity. The self-etch adhesive the water to solvent in the chemical composition
systems are generally categorized as: strong (pH≤1), increases, the degree of polymerization is negatively
mild (pH≈2) and ultra-mild (pH>2.5)16). The pH levels of affected32,33). The humid conditions did not affect the bond
CSE and AEB self-etch systems used in our study were strength in Group AEB. It was reported that excess water
about 2 and 2.4, respectively23). A well-structured and may influence the mechanical properties of adhesive
rough enamel surface could not be accomplished by mild layer of the one-step self-etch adhesives by inhibiting
adhesives22). Although both self-adhesives used in the the optimal polymerization of the monomers32,33). Beside
present study appear in the mild acidic category, CSE a significant difference about μSBS values in Group
presented significantly higher mean μSBS than AEB in AEB from the other groups, an adequate bonding
all conditions. This could be explained by the chemical quality of AEB could also not be observed in the SEM
compositions of the adhesives. The 10-methacryloxydecyl findings. As previously detected by Mine et al.23), etching
dihydrogen phosphate monomer (10-MDP) present in capability of AEB on the enamel surface was not ideal
the chemical composition of CSE is claimed to interact and bonded particles decreased in H2 compared to H1
with the hydroxyapatite of the enamel by ionic bond and H4. Moreover, no resin remnant was found on the
to produce MDP-Ca salts24). On the other hand, both debonded surface in Group AEB at H3. In accordance
adhesives contain cross-linking monomers that improve with the mechanical superiority of CSE, less adhesive
the bonding performance to the substrate. McLeod failure types were observed in Group CSE than in
et al.21) stressed the amount of these monomers in the Group AEB. In Group CSE, quantity of the composite
one-step self-etch systems to be less than two-step ones. resin remnants on debonded surface decreased and the
This could be one reason for lower results with the AEB bonded resin amount on the enamel became sparse with
group. the increased humidity level indicating that humidity
In the presence of four different humidity conditions, level may indeed impair the adhesion quality.
mean μSBS of the composite resin to enamel with all Adhesive failure types were dominated in the
adhesive systems tested was not statistically significant debonded areas in Group SB2 at H2 and H3 conditions.
within each group. Furuse et al.25) applied five different These alterations were independent from the μSBS
adhesive systems including SB2 and CSE and found no values. Thus, not only the μSBS values but also the
statistical difference between μSBS of resin composite failure types should be assessed when evaluating
474 Dent Mater J 2013; 32(3): 468–475
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