Escolar Documentos
Profissional Documentos
Cultura Documentos
7, 1999
Journal Palmer, Alexander,Regular
and Nguyen
Issue Paper
It is possible to form solder joints with mechanical integrity, but not mechanical
strength comparable to that achieved by melting the solder, by sintering eutectic
tin-lead solder paste where small amounts of eutectic Sn-Bi powder are added to
the paste. This increases the rate of sintering through liquid-phase sintering.
912