Você está na página 1de 43

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B

www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

TL08xx JFET-Input Operational Amplifiers


Check for Samples: TL081, TL081A, TL081B, TL082, TL082A, TL082B, TL084, TL084A, TL084B
1

FEATURES
Low Power Consumption: 1.4 mA/ch Typ Wide Common-Mode and Differential Voltage Ranges Low Input Bias Current: 30 pA Typ Low Input Offset Current: 5 pA Typ Output Short-Circuit Protection Low Total Harmonic Distortion: 0.003% Typ High Input Impedance: JFET Input Stage Latch-Up-Free Operation High Slew Rate: 13 V/s Typ Common-Mode Input Voltage Range Includes VCC+

DESCRIPTION
The TL08xx JFET-input operational amplifier family is designed to offer a wider selection than any previously developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature high slew rates, low input bias and offset currents, and low offset-voltage temperature coefficient. Offset adjustment and external compensation options are available within the TL08x family. The C-suffix devices are characterized for operation from 0C to 70C. The I-suffix devices are characterized for operation from 40C to 85C. The Q-suffix devices are characterized for operation from 40C to 125C. The M-suffix devices are characterized for operation over the full military temperature range of 55C to 125C.
TL084, TL084A, TL084B D, J, N, NS, OR PW PACKAGE (TOP VIEW)

TL081, TL081A, TL081B D, P, OR PS PACKAGE (TOP VIEW)

TL082, TL082A, TL082B D, JG, P, PS, OR PW PACKAGE (TOP VIEW)

OFFSET N1 IN IN + VCC

1 2 3 4

8 7 6 5

NC VCC + OUT OFFSET N2

1OUT 1IN 1IN + VCC

1 2 3 4

8 7 6 5

VCC + 2OUT 2IN 2IN +

NC No internal connection

1OUT 1IN 1IN + VCC + 2IN + 2IN 2OUT

1 2 3 4 5 6 7

14 13 12 11 10 9 8

4OUT 4IN 4IN + VCC 3IN + 3IN 3OUT

TL082M . . . FK PACKAGE (TOP VIEW)

TL084M . . . FK PACKAGE (TOP VIEW)

NC 1OUT NC VCC+ NC

NC 1IN NC 1IN + NC

4 5 6 7 8

3 2 1 20 19 18 17 16 15 14 9 10 11 12 13

NC 2OUT NC 2IN NC

1IN + NC VCC + NC 2IN +

4 5 6 7 8

3 2 1 20 19 18 17 16 15 14 9 10 11 12 13

1IN 1OUT NC 4OUT 4IN


4IN + NC VCC NC 3IN +
NC No internal connection
Copyright 19772014, Texas Instruments Incorporated

NC VCC NC 2IN + NC

NC No internal connection

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

2IN 2OUT NC 3OUT 3IN

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Symbols
TL081 OFFSET N1 IN + IN OFFSET N2 + OUT IN + IN + OUT TL082 (EACH AMPLIFIER) TL084 (EACH AMPLIFIER)

Schematic (Each Amplifier)


VCC +

IN + 64 OUT 128 64 C1

IN

1080 VCC OFFSET N1

1080

OFFSET N2

TL081 Only

Component values shown are nominal.

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

Absolute Maximum Ratings (1)


over operating free-air temperature range (unless otherwise noted)
TL08_C TL08_AC TL08_BC VCC+ VCC VID VI Supply voltage (2) Differential input voltage Input voltage (2) (4) Duration of output short circuit (5) Continuous total power dissipation TA Operating free-air temperature range D package (8-pin) D package (14-pin) N package (14-pin) JA Package thermal impedance (6) (7) NS package (14-pin) P package PS package PW package (8 pin) PW package (14 pin) Operating virtual junction temperature TC Case temperature for 60 seconds Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds Tstg Storage temperature range FK package J or JG package 0 to 70 97 86 76 80 85 95 149 113 150 113 150 150 85 95
(3)

TL08_I 18 18 30 15 Unlimited

TL084Q 18 18 30 15 Unlimited

TL08_M 18 18 30 15 Unlimited

UNIT

18 18 30 15 Unlimited

V V V

See Dissipation Rating Table 40 to 85 97 86 76 40 to 125 55 to 125 97 86 80 76 85 95 149 113 150 260 300 65 to 150 65 to 150 65 to 150 65 to 150 C C C C C/W C

(1) (2) (3) (4) (5) (6) (7)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC. Differential voltages are at IN+, with respect to IN. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7.

Dissipation Rating Table


PACKAGE D (14 pin) FK J JG TA 25C POWER RATING 680 mW 680 mW 680 mW 680 mW DERATING FACTOR 7.6 mW/C 11.0 mW/C 11.0 mW/C 8.4 mW/C DERATE ABOVE TA 60C 88C 88C 69C TA = 70C POWER RATING 604 m/W 680 m/W 680 m/W 672 m/W TA = 85C POWER RATING 490 mW 680 mW 680 mW 546 mW TA = 125C POWER RATING 186 mW 273 mW 273 mW 210 mW

Copyright 19772014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

Electrical Characteristics
VCC = 15 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TA (1) MIN VIO Input offset voltage Temperature coefficient of input offset voltage Input offset current (2) Input bias current (2) Commonmode input voltage range Maximum peak output voltage swing Large-signal differential voltage amplification Unity-gain bandwidth Input resistance Commonmode rejection ratio Supplyvoltage rejection ratio (VCC/VIO) Supply current (each amplifier) Crosstalk attenuation VIC = VICRmin, VO = 0, RS = 50 VCC = 15 V to 9 V, VO = 0, RS = 50 VO = 0, No load AVD = 100 RL = 10 k RL 10 k RL 2 k VO = 10 V, RL 2 k VO = 0, RS = 50 VO = 0, RS = 50 25C Full range TL081C TL082C TL084C TYP 3 MAX 15 20 MIN TL081AC TL082AC TL084AC TYP 3 MAX 6 7.5 MIN TL081BC TL082BC TL084BC TYP 2 MAX 3 5 MIN TL081I TL082I TL084I TYP 3 MAX 6 9 mV UNIT

VIO

Full range

18

18

18

18

V/C

IIO IIB

VO = 0 VO = 0

25C Full range 25C Full range 25C 25C Full range 25C Full range 25C 25C 11 12 12 10 25 15

200 2

100 2

100 2

100 10

pA nA pA nA V

30

400 10

30

200 7

30

200 7

30

200 20

VICR

12 to 15 13.5

11 12 12

12 to 15 13.5

11 12 12

12 to 15 13.5

11 12 12

12 to 15 13.5

VOM

V 12 200 V/mV

12 200

10 50 15

12 200

10 50 25

12 200

10 50 25

AVD

B1 ri CMRR

3 1012 70 86 75

3 1012 86 75

3 1012 86 75

3 1012 86

MHz

25C

dB

kSVR

25C

70

86

80

86

80

86

80

86

dB

ICC VO1/VO
2

25C

1.4

2.8

1.4

2.8

1.4

2.8

1.4

2.8

mA

25C

120

120

120

120

dB

(1) (2)

All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range for TA is 0C to 70C for TL08_C, TL08_AC, TL08_BC and 40C to 85C for TL08_I. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

Electrical Characteristics
VCC = 15 V (unless otherwise noted)
PARAMETER TEST CONDITIONS (1) TA 25C Full range Full range 25C 125C 25C 125C 25C RL = 10 k VOM Maximum peak output voltage swing Large-signal differential voltage amplification Unity-gain bandwidth Input resistance Common-mode rejection ratio VIC = VICRmin, VO = 0, RS = 50 RL 10 k RL 2 k AVD B1 ri CMRR kSVR ICC VO1/VO2 VO = 10 V, RL 2 k 25C Full range 25C Full range 25C 25C 25C 25C 25C 25C 80 80 11 12 12 10 25 15 3 1012 86 86 1.4 120 2.8 80 80 12 200 12 to 15 13.5 30 18 5 100 20 200 50 11 12 to 15 12 12 10 25 15 3 1012 86 86 1.4 120 2.8 12 200 V/mV MHz dB dB mA dB 13.5 V 30 TL081M, TL082M MIN TYP 3 MAX 6 9 18 5 100 20 200 50 TL084Q, TL084M MIN TYP 3 MAX 9 15 UNIT

VIO VIO IIO IIB VICR

Input offset voltage Temperature coefficient of input offset voltage Input offset current (2) Input bias current (2) Common-mode input voltage range

VO = 0, RS = 50 VO = 0, RS = 50 VO = 0 VO = 0

mV V/C pA nA pA nA V

Supply-voltage rejection VCC = 15 V to 9 V, ratio (VCC/VIO) VO = 0, RS = 50 Supply current (each amplifier) Crosstalk attenuation VO = 0, No load AVD = 100

(1) (2)

All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 17. Pulse techniques must be used that maintain the junction temperatures as close to the ambient temperature as possible.

Operating Characteristics
VCC = 15 V, TA= 25C (unless otherwise noted)
PARAMETER SR tr Slew rate at unity gain Rise-time overshoot factor Vn In THD (1) Equivalent input noise voltage Equivalent input noise current Total harmonic distortion TEST CONDITIONS VI = 10 V, RL = 2 k, CL = 100 pF, See Figure 1 VI = 10 V, RL = 2 k, CL = 100 pF, TA = 55C to 125C, See Figure 1 VI = 20 V, RL = 2 k, CL = 100 pF, See Figure 1 RS = 20 RS = 20 , f = 1 kHz f = 10 Hz to 10 kHz f = 1 kHz MIN 8 (1) 5 (1) 0.05 20 18 4 0.01 0.003 TYP 13 V/s s % nV/Hz V pA/Hz % MAX UNIT

VIrms = 6 V, AVD = 1, RS 1 k, RL 2 k, f = 1 kHz,

On products compliant to MIL-PRF-38535, this parameter is not production tested.

Copyright 19772014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

Parameter Measurement Information


10 k 1 k VI OUT + VI + CL = 100 pF RL = 2 k RL OUT CL = 100 pF

C2 IN + C1 500 pF N2 N1 +

IN

N1 OUT

Figure 3.

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

Figure 1.
100 k IN

Figure 2.
TL081 OUT

100 k

1.5 k VCC

Figure 4.

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

Typical Characteristics
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.

Table of Graphs
Figure VOM Maximum peak output voltage Large-signal differential voltage amplification Differential voltage amplification PD ICC IIB VO CMRR Vn THD Total power dissipation Supply current Input bias current Large-signal pulse response Output voltage Common-mode rejection ratio Equivalent input noise voltage Total harmonic distortion vs vs vs vs Frequency Free-air temperature Load resistance Supply voltage Figure 5, Figure 6, Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure 20 Figure 21 Figure 22

AVD

vs Free-air temperature vs Load resistance vs Frequency with feed-forward compensation vs Free-air temperature vs Free-air temperature vs Supply voltage vs Free-air temperature vs Time vs Elapsed time vs Free-air temperature vs Frequency vs Frequency

MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY


15 VOM VOM Maximum Peak Output Voltage V VCC = 15 V 15 VOM VOM Maximum Peak Output Voltage V RL = 10 k TA = 25C See Figure 2

12.5

10

7.5


VCC = 10 V VCC = 5 V 1k

MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY

12.5


VCC = 15 V VCC = 10 V

RL = 2 k TA = 25C See Figure 2

10

7.5

2.5

0 100

10 k 100 k f Frequency Hz Figure 5.

1M

10 M

5 VCC = 5 V 2.5

0 100

1k

10 k 100 k f Frequency Hz Figure 6.

1M

10 M

Copyright 19772014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

15 VOM VOM Maximum Peak Output Voltage V

12.5

TA = 25C

V VOM OM Maximum Peak Output Voltage V

10

7.5


TA = 55C TA = 125C

MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY


15 VCC = 15 V RL = 2 k See Figure 2

MAXIMUM PEAK OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE

12.5

10


RL = 10 k RL = 2 k

2.5

0 10 k


4M 10 M

7.5

2.5

VCC = 15 V See Figure 2

40 k 100 k 400 k 1 M f Frequency Hz Figure 7.

0 75

50

25

25

50

75

100

125

TA Free-Air Temperature C Figure 8.

MAXIMUM PEAK OUTPUT VOLTAGE vs LOAD RESISTANCE


15 VOM Maximum Peak Output Voltage V VOM VOM VOM Maximum Peak Output Voltage V VCC = 15 V TA = 25C See Figure 2 15

MAXIMUM PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE


RL = 10 k TA = 25C

12.5

12.5

10

10

7.5

7.5

2.5

0 0.1

0.2

0.4

0.7 1

7 10

2.5

0 0 2 4 6 8 10 12 14 16 |VCC| Supply Voltage V Figure 10.

RL Load Resistance k Figure 9.

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREE-AIR TEMPERATURE


1000 400 A AVD VD Large-Signal Differential Voltage Amplification V/mV 200 100 40 20 10 4 2 1 75 VCC = 15 V VO = 10 V RL = 2 k 50 25 0 25 50 75 100 125
A AVD VD Large-Signal Differential Voltage Amplification 105 106

LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE SHIFT vs FREQUENCY


VCC = 5 V to 15 V RL = 2 k TA = 25C 0 45

103

Differential Voltage Amplification

102 Phase Shift

90 135

101

1 1 10

TA Free-Air Temperature C Figure 11.

100 1k 10 k 100 k f Frequency Hz

1M

180 10 M

Figure 12.

DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREQUENCY WITH FEED-FORWARD COMPENSATION


106 250 VCC = 15 V C2 = 3 pF TA = 25C See Figure 3 225

TOTAL POWER DISSIPATION vs FREE-AIR TEMPERATURE


VCC = 15 V No Signal No Load

AVD Differential Voltage Amplification V/mV

PD Total Power Dissipation mW

105

200 175 150 125 100 75 50 25 TL081 TL082, TL083 TL084, TL085

104

103

102

10

1 100

1k

10 k

100 k

1M

10 M

0 75

50

25

25

50

75

100

125

f Frequency With Feed-Forward Compensation Hz Figure 13.

TA Free-Air Temperature C Figure 14.

Copyright 19772014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

Phase Shift

104

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

SUPPLY CURRENT PER AMPLIFIER vs FREE-AIR TEMPERATURE


2 ICC I CC Supply Current Per Amplifier mA 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 75 50 25 0 25 50 75 100 125 ICC I CC Supply Current Per Amplifier mA VCC = 15 V No Signal No Load 2 1.8 1.6 1.4 1.2 1

SUPPLY CURRENT PER AMPLIFIER vs SUPPLY VOLTAGE


TA = 25C No Signal No Load

0.8 0.6 0.4 0.2 0 0 2 4 6 8 10 12 14 16 |VCC| Supply Voltage V Figure 16.

TA Free-Air Temperature C Figure 15.

INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE


V CC = 15 V

VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE


6 VI and VO Input and Output Voltages V VCC = 15 V RL = 2 k CL = 100 pF TA = 25C

100

4 Output 2

I IB Input Bias Current nA

10

0.1


25 0 25 50 75 100 125 TA Free-Air Temperature C Figure 17.


Input 0 0.5 1 1.5 t Time s Figure 18. 2 2.5 3 3.5

0.01 50

10

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

OUTPUT VOLTAGE vs ELAPSED TIME


28 24
CMRR Common-Mode Rejection Ratio dB
89

COMMON-MODE REJECTION RATIO vs FREE-AIR TEMPERATURE


VCC = 15 V RL = 10 k 88

VO Output Voltage mV

20 16 12 8 4 0 4 0 0.2 0.4 0.6 0.8 1.0 1.2 t Elapsed Time s Figure 19.

87

VCC = 15 V RL = 2 k CL = 100 pF TA = 25C See Figure 1

86

85

84

83 75

50

25

25

50

75

100

125

Vn V nV/ Hz n Equivalent Input Noise Voltage nV/Hz

40

THD Total Harmonic Distortion %

TA Free-Air Temperature C Figure 20.

EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY


VCC = 15 V AVD = 10 RS = 20 TA = 25C 1 0.4

TOTAL HARMONIC DISTORTION vs FREQUENCY


VCC = 15 V AVD = 1 VI(RMS) = 6 V TA = 25C

50

0.1 0.04

30

20

0.01 0.004

10

0 10 40 100 400 1 k 4 k 10 k f Frequency Hz Figure 21. 40 k 100 k

0.001 100

400

1k 4 k 10 k f Frequency Hz Figure 22.

40 k 100 k

Copyright 19772014, Texas Instruments Incorporated

Submit Documentation Feedback

11

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

APPLICATION INFORMATION
RF = 100 k

15 V TL081 CF = 3.3 F + 1 k 15 V 3.3 k f= 1 2 RF CF 9.1 k VCC + TL081 + Output VCC R1 = R2 = 2(R3) = 1.5 M C2 C1 = C2 = C3 = 110 pF 2 1 fo = = 1 kHz 2 R1 C1 + + + 3.3 k Output

Figure 23.

Input

R1 C3

R2

R3 C1

Figure 24.
VCC + 1 M VCC + 1 F Input 100 k + TL084 VCC + TL084 100 k 100 k 100 F 100 k VCC + VCC + TL084 Output C Output B TL084 Output A

Figure 25. Audio-Distribution Amplifier

12

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


www.ti.com SLOS081H FEBRUARY 1977 REVISED JANUARY 2014

6 sin t 18 pF

1N4148 15 V 18 pF 1 k 18 k (see Note A)

VCC + 1/2 TL082 + VCC 1 k 15 V 1N4148 88.4 k 18 k (see Note A) 6 cos t 16 k 220 pF 30 k 43 k VCC + VCC +
1/4 TL084

88.4 k 18 pF

A.

These resistor values may be adjusted for a symmetrical output.

220 pF 43 k VCC +
1/4 TL084

43 k Input

220 pF

1.5 k

VCC

1.5 k VCC

VCC

Output A Output A Output B

2 kHz/div Second-Order Bandpass Filter fo = 100 kHz, Q = 30, GAIN = 4

2 kHz/div Cascaded Bandpass Filter fo = 100 kHz, Q = 69, GAIN = 16

Figure 27. Positive-Feedback Bandpass Filter

Copyright 19772014, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

1/4 TL084

43 k

43 k

1/2 TL082 + VCC 16 k +

88.4 k

VCC+

Figure 26. 100-KHz Quadrature Oscillator

30 k

VCC +

220 pF

1/4 TL084

43 k

Output B

VCC

13

TL081, TL081A, TL081B, TL082, TL082A, TL082B TL084, TL084A, TL084B


SLOS081H FEBRUARY 1977 REVISED JANUARY 2014 www.ti.com

REVISION HISTORY
Changes from Revision G (September 2004) to Revision H Page

Updated document to new TI datasheet format - no specification changes. ....................................................................... 1 Added ESD warning. ............................................................................................................................................................ 2

14

Submit Documentation Feedback

Copyright 19772014, Texas Instruments Incorporated

Product Folder Links: TL081 TL081A TL081B TL082 TL082A TL082B TL084 TL084A TL084B

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

PACKAGING INFORMATION
Orderable Device 5962-9851501Q2A Status
(1)

Package Type Package Pins Package Drawing Qty LCCC FK 20 1

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) -55 to 125

Device Marking
(4/5)

Samples

ACTIVE

TBD

POST-PLATE

N / A for Pkg Type

59629851501Q2A TL082MFKB 9851501QPA TL082M 59629851503Q2A TL084 MFKB 5962-9851503QC A TL084MJB 081AC 081AC 081AC 081AC 081AC 081AC

5962-9851501QPA 5962-9851503Q2A

ACTIVE ACTIVE

CDIP LCCC

JG FK

8 20

1 1

TBD TBD

A42 POST-PLATE

N / A for Pkg Type N / A for Pkg Type

-55 to 125 -55 to 125

5962-9851503QCA

ACTIVE

CDIP

14

TBD

A42

N / A for Pkg Type

-55 to 125

TL081ACD TL081ACDE4 TL081ACDG4 TL081ACDR TL081ACDRE4 TL081ACDRG4 TL081ACJG TL081ACP TL081ACPE4 TL081BCD TL081BCDE4 TL081BCDG4

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP SOIC SOIC SOIC

D D D D D D JG P P D D D

8 8 8 8 8 8 8 8 8 8 8 8

75 75 75 2500 2500 2500

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Addendum-Page 1

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70

50 50 75 75 75

TL081ACP TL081ACP 081BC 081BC 081BC

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL081BCDR TL081BCDRE4 TL081BCDRG4 TL081BCP TL081BCPE4 TL081CD TL081CDE4 TL081CDG4 TL081CDR TL081CDRE4 TL081CDRG4 TL081CP TL081CPE4 TL081CPSR TL081CPSRE4 TL081CPSRG4 TL081CPWLE TL081ID

Status
(1)

Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO SO SO TSSOP SOIC D D D P P D D D D D D P P PS PS PS PW D 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 75 2500 2500 2500 50 50 75 75 75 2500 2500 2500 50 50 2000 2000 2000

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM

081BC 081BC 081BC TL081BCP TL081BCP TL081C TL081C TL081C TL081C TL081C TL081C TL081CP TL081CP T081 T081 T081

TL081I

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL081IDE4 TL081IDG4 TL081IDR TL081IDRE4 TL081IDRG4 TL081IP TL081IPE4 TL081MFKB TL081MJG TL081MJGB TL082ACD TL082ACDE4 TL082ACDG4 TL082ACDR TL082ACDRE4 TL082ACDRG4 TL082ACP TL082ACPE4 TL082ACPSR

Status
(1)

Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC SOIC SOIC PDIP PDIP LCCC CDIP CDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO D D D D D P P FK JG JG D D D D D D P P PS 8 8 8 8 8 8 8 20 8 8 8 8 8 8 8 8 8 8 8 75 75 75 2500 2500 2500 50 50 2000 75 75 2500 2500 2500 50 50

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -55 to 125 -55 to 125 -55 to 125 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Call TI Call TI Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM

TL081I TL081I TL081I TL081I TL081I TL081IP TL081IP

082AC 082AC 082AC 082AC 082AC 082AC TL082ACP TL082ACP T082A

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL082ACPSRE4 TL082ACPSRG4 TL082BCD TL082BCDE4 TL082BCDG4 TL082BCDR TL082BCDRE4 TL082BCDRG4 TL082BCP TL082BCPE4 TL082CD TL082CDE4 TL082CDG4 TL082CDR TL082CDRE4 TL082CDRG4 TL082CJG TL082CP

Status
(1)

Package Type Package Pins Package Drawing Qty SO SO SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PS PS D D D D D D P P D D D D D D JG P 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 50 2000 2000 75 75 75 2500 2500 2500 50 50 75 75 75 2500 2500 2500

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI N / A for Pkg Type

T082A T082A 082BC 082BC 082BC 082BC 082BC 082BC TL082BCP TL082BCP TL082C TL082C TL082C TL082C TL082C TL082C

TL082CP

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL082CPE4 TL082CPSR TL082CPSRG4 TL082CPW TL082CPWE4 TL082CPWG4 TL082CPWLE TL082CPWR TL082CPWRE4 TL082CPWRG4 TL082ID TL082IDE4 TL082IDG4 TL082IDR TL082IDRE4 TL082IDRG4 TL082IJG TL082IP TL082IPE4

Status
(1)

Package Type Package Pins Package Drawing Qty PDIP SO SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP P PS PS PW PW PW PW PW PW PW D D D D D D JG P P 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 50 50 2000 2000 2000 75 75 75 2500 2500 2500 50 2000 2000 150 150 150

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 T082 T082 T082

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE

Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU

N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI N / A for Pkg Type N / A for Pkg Type

TL082CP T082 T082 T082 T082 T082

TL082I TL082I TL082I TL082I TL082I TL082I

TL082IP TL082IP

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL082IPWR TL082IPWRE4 TL082IPWRG4 TL082MFK TL082MFKB

Status
(1)

Package Type Package Pins Package Drawing Qty TSSOP TSSOP TSSOP LCCC LCCC PW PW PW FK FK 8 8 8 20 20 1 2000 2000 2000

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) -40 to 85 -40 to 85 -40 to 85 -55 to 125 -55 to 125 Z082 Z082 Z082

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD

CU NIPDAU CU NIPDAU CU NIPDAU Call TI POST-PLATE

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI N / A for Pkg Type

59629851501Q2A TL082MFKB TL082MJG 9851501QPA TL082M TL084AC TL084AC TL084AC TL084AC TL084AC TL084AC TL084ACN TL084ACN TL084A TL084A TL084A

TL082MJG TL082MJGB TL084ACD TL084ACDE4 TL084ACDG4 TL084ACDR TL084ACDRE4 TL084ACDRG4 TL084ACN TL084ACNE4 TL084ACNSR TL084ACNSRE4 TL084ACNSRG4

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

CDIP CDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO SO SO

JG JG D D D D D D N N NS NS NS

8 8 14 14 14 14 14 14 14 14 14 14 14

1 1 50 50 50 2500 2500 2500 25 25 2000 2000 2000

TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

A42 A42 CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

-55 to 125 -55 to 125 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70

Addendum-Page 6

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL084BCD TL084BCDE4 TL084BCDG4 TL084BCDR TL084BCDRE4 TL084BCDRG4 TL084BCN TL084BCNE4 TL084CD TL084CDE4 TL084CDG4 TL084CDR TL084CDRE4 TL084CDRG4 TL084CJ TL084CN TL084CNE4 TL084CNSLE TL084CNSR

Status
(1)

Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP SO SO D D D D D D N N D D D D D D J N N NS NS 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 2000 25 25 50 50 50 2500 2500 2500 25 25 50 50 50 2500 2500 2500

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE OBSOLETE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) TBD Green (RoHS & no Sb/Br)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU Call TI CU NIPDAU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI N / A for Pkg Type N / A for Pkg Type Call TI Level-1-260C-UNLIM

TL084BC TL084BC TL084BC TL084BC TL084BC TL084BC TL084BCN TL084BCN TL084C TL084C TL084C TL084C TL084C TL084C

TL084CN TL084CN

TL084

Addendum-Page 7

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device TL084CNSRG4 TL084CPW TL084CPWE4 TL084CPWG4 TL084CPWLE TL084CPWR TL084CPWRE4 TL084CPWRG4 TL084ID TL084IDE4 TL084IDG4 TL084IDR TL084IDRE4 TL084IDRG4 TL084IJ TL084IN TL084INE4 TL084MFK TL084MFKB

Status
(1)

Package Type Package Pins Package Drawing Qty SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC SOIC SOIC SOIC SOIC SOIC CDIP PDIP PDIP LCCC LCCC NS PW PW PW PW PW PW PW D D D D D D J N N FK FK 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 20 20 25 25 1 1 2000 2000 2000 50 50 50 2500 2500 2500 2000 90 90 90

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -55 to 125 -55 to 125 T084 T084 T084

Device Marking
(4/5)

Samples

ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Pb-Free (RoHS) Pb-Free (RoHS) TBD TBD

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU POST-PLATE POST-PLATE

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type

TL084 T084 T084 T084

TL084I TL084I TL084I TL084I TL084I TL084I

TL084IN TL084IN TL084MFK 59629851503Q2A

Addendum-Page 8

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

Orderable Device

Status
(1)

Package Type Package Pins Package Drawing Qty

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp


(3)

Op Temp (C)

Device Marking
(4/5)

Samples

TL084 MFKB TL084MJ TL084MJB ACTIVE ACTIVE CDIP CDIP J J 14 14 1 1 TBD TBD A42 A42 N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 TL084MJ 5962-9851503QC A TL084MJB TL084Q TL084Q TL084Q TL084Q

TL084QD TL084QDG4 TL084QDR TL084QDRG4

ACTIVE ACTIVE ACTIVE ACTIVE

SOIC SOIC SOIC SOIC

D D D D

14 14 14 14

50 50 2500 2500

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU

Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM

-40 to 125 -40 to 125 -40 to 125 -40 to 125

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(4)

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 9

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2014

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL082, TL082M, TL084, TL084M :

Catalog: TL082, TL084 Automotive: TL082-Q1, TL082-Q1 Military: TL082M, TL084M


NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Military - QML certified for Military and Defense Applications

Addendum-Page 10

PACKAGE MATERIALS INFORMATION


www.ti.com 24-Jan-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SOIC SOIC SO SOIC SOIC SOIC SO SOIC SOIC SOIC TSSOP SOIC SOIC TSSOP SOIC SOIC SO D D D PS D D D PS D D D PW D D PW D D NS 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 330.0 12.4 12.4 12.4 16.4 12.4 12.4 12.4 16.4 12.4 12.4 12.4 12.4 12.4 12.4 12.4 16.4 16.4 16.4 6.4 6.4 6.4 8.2 6.4 6.4 6.4 8.2 6.4 6.4 6.4 7.0 6.4 6.4 7.0 6.5 6.5 8.2

B0 (mm) 5.2 5.2 5.2 6.6 5.2 5.2 5.2 6.6 5.2 5.2 5.2 3.6 5.2 5.2 3.6 9.0 9.0 10.5

K0 (mm) 2.1 2.1 2.1 2.5 2.1 2.1 2.1 2.5 2.1 2.1 2.1 1.6 2.1 2.1 1.6 2.1 2.1 2.5

P1 (mm) 8.0 8.0 8.0 12.0 8.0 8.0 8.0 12.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 12.0

W Pin1 (mm) Quadrant 12.0 12.0 12.0 16.0 12.0 12.0 12.0 16.0 12.0 12.0 12.0 12.0 12.0 12.0 12.0 16.0 16.0 16.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1

TL081ACDR TL081BCDR TL081CDR TL081CPSR TL081IDR TL082ACDR TL082ACDR TL082ACPSR TL082BCDR TL082CDR TL082CDR TL082CPWR TL082IDR TL082IDR TL082IPWR TL084ACDR TL084ACDR TL084ACNSR

2500 2500 2500 2000 2500 2500 2500 2000 2500 2500 2500 2000 2500 2500 2000 2500 2500 2000

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com 24-Jan-2014

Device

Package Package Pins Type Drawing SOIC SOIC SOIC TSSOP SOIC SOIC SOIC D D D PW D D D 14 14 14 14 14 14 14

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 330.0 16.4 16.4 16.4 12.4 16.4 16.4 16.4 6.5 6.5 6.5 6.9 6.5 6.5 6.5

B0 (mm) 9.0 9.0 9.0 5.6 9.0 9.0 9.0

K0 (mm) 2.1 2.1 2.1 1.6 2.1 2.1 2.1

P1 (mm) 8.0 8.0 8.0 8.0 8.0 8.0 8.0

W Pin1 (mm) Quadrant 16.0 16.0 16.0 12.0 16.0 16.0 16.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1

TL084BCDR TL084CDR TL084CDRG4 TL084CPWR TL084IDR TL084QDR TL084QDRG4

2500 2500 2500 2000 2500 2500 2500

*All dimensions are nominal

Device TL081ACDR TL081BCDR TL081CDR TL081CPSR TL081IDR TL082ACDR TL082ACDR TL082ACPSR TL082BCDR TL082CDR

Package Type SOIC SOIC SOIC SO SOIC SOIC SOIC SO SOIC SOIC

Package Drawing D D D PS D D D PS D D

Pins 8 8 8 8 8 8 8 8 8 8

SPQ 2500 2500 2500 2000 2500 2500 2500 2000 2500 2500

Length (mm) 340.5 340.5 340.5 367.0 340.5 367.0 340.5 367.0 340.5 340.5

Width (mm) 338.1 338.1 338.1 367.0 338.1 367.0 338.1 367.0 338.1 338.1

Height (mm) 20.6 20.6 20.6 38.0 20.6 35.0 20.6 38.0 20.6 20.6

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com 24-Jan-2014

Device TL082CDR TL082CPWR TL082IDR TL082IDR TL082IPWR TL084ACDR TL084ACDR TL084ACNSR TL084BCDR TL084CDR TL084CDRG4 TL084CPWR TL084IDR TL084QDR TL084QDRG4

Package Type SOIC TSSOP SOIC SOIC TSSOP SOIC SOIC SO SOIC SOIC SOIC TSSOP SOIC SOIC SOIC

Package Drawing D PW D D PW D D NS D D D PW D D D

Pins 8 8 8 8 8 14 14 14 14 14 14 14 14 14 14

SPQ 2500 2000 2500 2500 2000 2500 2500 2000 2500 2500 2500 2000 2500 2500 2500

Length (mm) 367.0 367.0 340.5 367.0 367.0 367.0 333.2 367.0 333.2 333.2 333.2 367.0 333.2 367.0 367.0

Width (mm) 367.0 367.0 338.1 367.0 367.0 367.0 345.9 367.0 345.9 345.9 345.9 367.0 345.9 367.0 367.0

Height (mm) 35.0 35.0 20.6 35.0 35.0 38.0 28.6 38.0 28.6 28.6 28.6 35.0 28.6 38.0 38.0

Pack Materials-Page 3

MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8)
0.400 (10,16) 0.355 (9,00) 8 5

CERAMIC DUAL-IN-LINE

0.280 (7,11) 0.245 (6,22)

4 0.065 (1,65) 0.045 (1,14)

0.063 (1,60) 0.015 (0,38)

0.020 (0,51) MIN

0.310 (7,87) 0.290 (7,37)

0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN

0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)

015

4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap TI E2E Community e2e.ti.com www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2014, Texas Instruments Incorporated Applications Automotive and Transportation Communications and Telecom Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/automotive www.ti.com/communications www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video

Você também pode gostar