Escolar Documentos
Profissional Documentos
Cultura Documentos
Vishay Semiconductors
formerly General Semiconductor
Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-0 This series is UL listed under the Recognized Component Index, file number E54214 High case dielectric strength of 1500 VRMS Ideal for printed circuit boards High forward surge current capability High surge current capability High temperature soldering guaranteed: 260C/10 seconds, 0.375 (9.5mm) lead length, 5lbs. (2.3kg) tension
Mechanical Data
Case: Molded plastic body
0.052 (1.32) 0.048 (1.22) DIA. 0.220 (5.59) 0.180 (4.57)
Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.2 oz., 5.6 g Packaging codes/options: 1/300 EA. per Bulk Tray Stack
KBL Symbols 005 Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output current at TA=50C Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method) TJ=150C Typical thermal resistance per leg (NOTE 1)
(NOTE 2)
Units V V V A A C/W C
50 35 50
Electrical Characteristics
Maximum instantaneous forward drop per leg at 4.0 A Maximum DC reverse current at rated TA= 25C DC blocking voltage per leg TA=125C
VF IR
V A mA
Notes: (1) Thermal resistance from junction to ambient with units mounted on 3.0 x 3.0 x 0.11 thick (7.5 x 7.5 x 0.3cm) Al. plate (2) Thermal resistance from junction to lead with units mounted on P.C.B. at 0.375" (9.5mm) lead length and 0.5 x 0.5" (12 x 12mm) copper pads
www.vishay.com 1
Heatsink Mounted 3.0" sq. x 0.06" Thk (7.5 x 0.15cm) Copper Plate 3.0
2.0 P.C.B. Mounting 0.375" (9.5mm) Lead Length 60 HZ Resistive or Inductive Load
1.0
1.0 Cycle
25 1 10 100
0 0 50 100 150
Temperature (C)
Number of Cycles at 60 HZ
TJ = 100C
0.1 TJ = 25C
0.1 0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0.01 0 20 40 60 80 100
Junction Capacitance, pF
200
150
100
50
0 0.1
10
100
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.