Escolar Documentos
Profissional Documentos
Cultura Documentos
)
1*B
(a)
(b)
>i!. Electrostatic Comb"rive*Act#ate" Micromirrors (
) for 5aser*Ceam
Scannin! an" 9ositionin! (.ian! et al.$ 122@)
$. Microfa%rication
1.1 =efinition
+he technolo!ies #se" to pro"#ce min#te components is calle" microfabrication
technolo!ies$ or micromachinin!.
1./ Material removal D "eposition
8emoval'
+he 1*"imensional microstr#ct#res can be pro"#ce" by removin! part of
the base material by a physical or chemical etchin! process.
=eposition'
+hin*film "eposition techni&#es are #se" to b#il" layers of materials on
the base material.
1.1 Evol#tion
+he si!nificant amo#nt of microfabrication processes 7ere "evelope"
for the microelectronics in"#stry in the past A0 years.
* %n 12?3$ transistors () 7ere invente".
* %n 12AA$ a monolithic ( ) circ#it (i.e.$ #sin! !ermani#m or
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silicon to b#il" an entire circ#it) 7as pro"#ce" at 8CA.
* %n 12A@$ the first %C 7as pro"#ce" by Eac4 .ilby at +e)as
%nstr#ments.
* +o"ay$ #ltra lar!e scale inte!ration (5S%) can contain 10 million
transistors an" capacitors on a chip.
&. Microsystems and Microelectronics
1*@
'. The M#ltidisciplinary (at#re of Microsystem )esin and Man#fact#rin
3 nat#ral science areas are involve"'
%. Electrochemistry ()' e). electroplatin! (F in the
5%6A process)F f#el cell ().
%%. Electrohy"ro"ynamics
%%%. Molec#lar biolo!y ()
%G. 9lasma physics ()
G. Scalin! la7s
G%. H#ant#m physics ()
G%%. Molec#lar physics ()' molec#lar "ynamics (
)
p.s.' 1. H#ant#m physics' for e)ample$ st#"y the movement of electrons in
semicon"#ctor materials.
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/. Electrohy"ro"ynamics involves the "rivin! of an ionize" fl#i" by the
application of electric fiel"s.
A en!ineerin! areas'
%. Mechanical en!ineerin!
%%. Electrical en!ineerin!
%%%. Chemical en!ineerin!
%G. Material en!ineerin!
G. %n"#strial en!ineerin!
*. Microsystems and Miniat#ri+ation
Cenefits of miniat#rization'
%. +en" to move faster.
%%. Enco#nter fe7 problems in thermal "istortion an" vibration.
%%%. Ma4e them more s#itable for applications in me"icine an"
s#r!ery an" in microelectronic assemblies.
%G. =esirable in satellites an" spacecraft en!ineerin!.
G. S#itable for telecomm#nication systems.
E)amples'
* Comp#ters' a"vance" in A0 years from the vac##m*t#be technolo!y to
the %C technolo!y. smaller size$ b#t better performance.
* Cio*chips' shorter time for "isease or vir#s "etection (pl#s m#ch less
samples re&#ire").
,eference:
1. ;alli"ay$ =.$ 8esnic4$ 8.$ an" ,al4er. E.$ >#n"amentals of 9hysics' E)ten"e"
Gersion Bth e"$ ,iley$ Eohn D Sons %ncorporate"$ /000.
/. ;s#$ +ai*8an$ MEMS D Microsystems =esi!n an" Man#fact#rin!$ Mc6ra7*;ill$
/00/.
1. .ian!$ M.*;.$ Sol!aar"$ -.$ 5a#$ ..I.$ an" M#ller$ 8.S.$ 122@$ Electrostatic
comb"rive*act#ate" micromirrors for laser*beam scannin! an" positionin!$
Eo#rnal of Microelectromechanical Systems$ Gol. 3$ %ss#e 1$ pp. /3 <13.
?. .ovacs$ 6eor!e +. A.$ Micromachine" +rans"#cers So#rceboo4$ Ma6ra7*;ill
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Companies$ %nc.$ /000.
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