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Almit Technology Ltd

Product Information Update July 2007


Almit Technology Ltd, Unit 7 Forest Row Business Park, Station Road, Forest Row, East Sussex, RH18 5DW, UK
Tel: +44 (0)1342 822844, Fax: +44 (0)1342 824155, email: info@almit.com, www.almit.com
WWW. .COM
Start T435 No Clean Wave Soldering Flux
Introduction

Start T435 No Clean Wave Soldering Flux has been specifically formulated for the
soldering of mixed technology and conventional through hole printed circuit board
assemblies, using lead free alloys. The flux features an enhanced, thermally stable
base which is essential when higher pre-heat and solder bath temperatures are
used during the lead free soldering process.

Start T435 No Clean Wave Soldering Flux features improved performance over
other fluxes in all critical areas including solder balling, hole fill, solderability and
freedom from icicles and bridges. The flux can be used with all commonly used
lead free alloys including, the SAC family, Sn Cu and its modified derivatives. The
flux will also work equally with Sn Pb alloys. Start T435 is compatible with all PCB
finishes and solder resists, producing shiny joints, and solder ball free, minimal resi-
dues.


Features Benefits

Sn/Pb and Pb Free Compatibility Single Product Sourcing
High Thermal Stability Reduced Solder Balls
Excellent Soldering Performance Increased Yields
No Clean Technology Eliminates Washing Process


Specification

Colour Clear
Acid Value 351
Specific Gravity 0.830 @ 21C
Solids Content 4.3%
Flash Point 12C
J-STD-004 Classification 0RL0
Almit Technology Ltd, Unit 7 Forest Row Business Park, Station Road, Forest Row, East Sussex, RH18 5DW, UK
Tel: +44 (0)1342 822844, Fax: +44 (0)1342 824155, email: info@almit.com, www.almit.com
Processing Guidelines

Start T435 No Clean Wave Soldering Flux should be applied by spray fluxer, the
flux is not designed for foam application. Deposition rates of between 100 and 200
gm/cm
2
should provide the correct coverage for most board types. During pre-
heating, topside board temperatures in excess of 130C are possible but particular
attention should be paid to the board design and suitability. Conveyor speeds are
likely to be in the range of 1-2 metres/min.


Packaging

Start T435 No Clean Wave Soldering Flux is supplied in 5 litre plastic containers.



Health and Safety

A MSDS is available for this product. Please contact Almit Technology Ltd. or your
local distributor for details.


Start T435 Surface Insulation Test Results

IPC SIR Test

Test Pattern Boards 24 Hours 96 Hours 168 Hours

IPC B24 Control 6.45 x 10
9
7.85 x 10
9
6.37 x 10
9
Pattern Up 2.10 x 10
10
1.67 x 10
10
1.43 x 10
10
Pattern Down 2.25 x 10
10
4.13 x 10
9
4.68 x 10
9


IPC ECM/Telcordia EM Resistance Test

Test Pattern Boards 96 Hours 500 Hours

IPC B25A Control 9.96 x 10
10
9.03 x 10
10
Pattern Up 6.22 x 10
10
1.05 x 10
11
Pattern Down 4.57 x 10
9
5.76 x 10
10


Telcordia GR-78 SIR Test

Test Pattern Boards 24 Hours 96 Hours

IPC B25A Control 8.51 x 10
12
8.73 x 10
12
Pattern Up 2.44 x 10
11
2.82 x 10
11
0.0125 spacing Pattern Down 6.43 x 10
12
6.71 x 10
12