32LH20R Ma

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 32LH20R
32LH20R-MA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
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2009 LGE Internal Use Only
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by acci dental shorts of the ci rcui try that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instruments
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF

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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Al ternati vel y, obtai n and wear a commerci al l y avai l abl e
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi ni mi ze bodi l y mot i ons when handl i ng unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
onl y unti l the sol der fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of t he ci rcui t board. (Use t hi s t echni que onl y on I C
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1 General Specification
1. Application range
This spec sheet is applied to LCD TV used LP91A chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C
2) Relative Humidity : 6510%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawi ng and speci f i cat i on by part number i n
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Measurement Remark
1 Screen Size 32 wide Color Display Module Resolution: 1366*768 / 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32 TFT WXGA LCD HD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
150 W 32 HD
7 LDC Module HD 760 x 450 x 48 with inverter
(Maker : LGD) 0.17025 x 0.51075
12 EEFL
Coating 3H
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No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m
2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10
3. Color Coordinates White Wx Typ 0.279 Typ LGD 32(HD)
Wy -0.03 0.292 +0.03
RED Xr 0.636
Yr 0.335
Green Xg 0.291
Yg 0.613
Blue Xb 0.146
Yb 0.061
4. Contrast ratio 800:1 1100:1 LGD 32(HD)
5. Luminance Variation 1.3
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LGE Internal Use Only
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
8. Component Video Input (Y, PB, PR)
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
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No
Specification
Remark
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
9. RGB
9.1 Analog PC, RGB- DTV NOT SUPPORT
10. HDMI Input
10.1 PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
10.2 DTV Mode
No
Specification
Remark
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
1) Gap between Front Frame /Back cover and Middle Cabinet
2) Gap between Front Frame /Middle Cabinet
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LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
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Top View
Back Cover
Front Frame
Middle Cabinet
"b
"b
Gap b between Front Frame (Back cover) and Middle Cabinet
-> 0 b B (Side gap)
Gap a between Front Frame and Middle Cabine
-> 0 a A (Side gap)
"b
"a
Gap a between Front Frame and Middle Cabine
-> 0 a A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Back View
Side View
Side AV
Back Cover
Gap f between Back Cover and Side AV
-> 0 f 1.0
Gap g between Back Cover and Side AV
-> 0 g 1.0
11. Mechical spec.
No Item Min Typ Max Unit
1. C/ A + B/ C top gap 0.5 1 1.5 mm
2. C/ A + B/ C side gap 0.5 1 1.5 mm
3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm
*Active area
1. Active area of LCD PANEL is in bezel of cabinet
2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mm
A:Interval between left of active area and bezel
B:Interval between right of active area and bezel
C:Interval between top of active area and bezel
D:Interval between bottom of active area and beze
4)Gap between Back Cover and Side AV
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Side View
"h"
Control Braket
Back Cover
Gap h between Back Cover and Control Bracket
-> 0 h 0.8
C
B
D
A
Active Area
Bezel
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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV,
LP91A/B/C/D chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) ADC Calibration RGB / Component
(3) Input Tool-Option/Area option.
(4) Check SW Version.
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the Connect button and confirm Dialog Box
3) Click the Config. button and Change speed I2C Speed
setting : 350Khz~400Khz
4) Read and write bin file.
Cl i ck (1)Read t ab, and t hen l oad downl oad
file(XXXX.bin) by clicking Read.
- LH20/ LH30
1
Filexxx.bin
5) Click (2)Auto tab and set as below
6) Click (3)Run.
7) After downloading, you can see the (4)Pass message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4.3. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4.4. EDID D/L method
Recommend that dont connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.4.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
4.4.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool opti on i s wrong, hdmi edi d data coul d not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear OK, then compele.
4.4.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don t connect HDMI and RGB(D-SUB) cabl e when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
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4.4.4. EDID data
(1) HD MODEL
<Analog(RGB): 128bytes>
<HDMI 1 : 256Bytes>
<HDMI 2 : 256Bytes>
4.5. ADC Calibration
4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A ).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
4.5.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : RGB by using D/E (CH +/-)
and press ENTER(A ).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
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OK
OK
4.6. Input Tool-Option, Area Option.
## TOOL Option, Area Option change and AC off
Before PCBA check, you have to change the Tool option,
Area option and have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
4.6.1. Profile
: Must be changed the option value because being different
with some setting value depend on module maker, inch and
market
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment method
The input methods are same as other chassis.(Use IN-START
Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
* Refer to Job Expressi on of each mai n chassi s ass y
(EBTxxxxxxxx) for Option value
* Never push the IN-STOP KEY after completing the function
inspection.
4.7. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check SW VER : V3.xx LH20
5. White Balance adjstment
5.1. Overview
(1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
(2) Pri nci pl e : To adj ust the whi te bal ance wi thout the
saturation, Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
(3) Adjustment mode : Three modes Cool / Medium / Warm
5.2. Required Equipment
(1) Remote controller for adjustment
(2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV (ch:9)
(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)
5.3. Connecting diagram of equipment for
measuring (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-White
Balance Mode.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance (for Manual
adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter 0000 (Password)
6) Select 3. W/B ADJUST
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E (CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F /G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.
12) Exit adjustment mode using EXIT key on R/C.
- 14 -
C
2009
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)
- 15 -
C
2009
Coordinate
Mode
x y
Temp uv
Cool 0.2760.002 0.2830.002 11000K 0.000
Medium 0.2850.002 0.2930.002 9300K 0.000
Warm 0.3130.002 0.3290.002 6500K 0.003
C
- 16 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 5,2V
of Power B/ D
Check short of Main B/ D
or Change Power B/ D
Pass
Check Output of
IC1001, IC1003, IC1007
Check P307 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001, IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Fail
No Raster
[B]: Process
Check LED status
On Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802
Fail
Change Inverter Connector
Or Inverter Fail
Pass
Fail
Pass
Change Module
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass
C
- 17 -
No Raster onPCSignal
Check Input source Cable And J ack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/ Output
Of IC100
Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Of J 104
Fail
Pass
Of IC800
Fail
Re-soldering or
Pass
No Raster onCOMMPONENT Signal
Check Input source
Cable And J ack
Pass
Re-soldering or
Pass
Of IC800
Fail
Re-soldering or
Check The Input/ Output
Of J K101
Fail
Pass
No Raster onHDMISignal
Check Input source
Cable And J ack
Pass
Of J K301, J K302, J K303
Fail
Re-soldering or
Pass
Pass
Of J K301, J K302, J K303
Fail
Re-soldering or
Pass
Of J K301, J K302, J K303
Fail
Re-soldering or
Pass
Of IC300, IC301, J K302
Fail
Re-soldering or
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Of IC800
Fail
Re-soldering or
C
- 18 -
No Raster OnAV (Video, S-Video)Signal No SignalOnTV(RF) Signal
Check Input source
Cable And J ack
Pass
Check Input source
Cable And J ack
Pass
Of J K101, J K201
Pass
Re-soldering or
Pass
Fail
Pass
Of IC800
Fail
Re-soldering or
Pass
Of TU500
Pass
Re-soldering or
Pass
Fail
Of IC800
Fail
Re-soldering or
No Sound
Check The Input Sourse
Of IC600
Re-soldering or
Change the defect part Fail
Pass
Pass
Check The Speaker Change Speaker
Fail
Check The Speaker Wire
Pass
Change The Source Input
Fail
C
- 19 -
BLOCK DIAGRAM
R
G
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(
8
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2
H
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M
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A
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3
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M
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S
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D
M
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3
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F
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E
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P
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(
2
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(
8
M
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)
- 20 -
3
0
0
2
0
0
2
0
0
T
2
0
0
N
8
0
1
8
0
2
8
0
3
8
0
4
8
0
5
8
0
6
5
2
0
5
3
0
5
4
0
5
5
0
4
0
0
9
0
0
1
2
0
5
1
0
5
0
0
3
1
0
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A
2
L
V
1
A
1
0
M
U
L
T
I_
P
W
_
S
W
1
0
R
859
5 6
A R 8 1 2
SU
B_SD
A
H P D _ M S T _ 3
+
1
.8
V
_
D
D
R
C
O
M
P2_PB
R
T
1
C
3
9
0
4
-T
1
1
2
Q
8
0
2
E
B
C
D
D
R
2_D
Q
M
0
1 0 0R 8 2 5
0
.0
4
7
u
F
C
828
K E Y 1
R L _ O N
M
X
2
5
L
6
4
0
5
D
M
I-1
2
G
IC
8
0
2
3
N
C
_
1
2
V
C
C
4
N
C
_
2
1
H
O
L
D
6
N
C
_
4
5
N
C
_
3
7
C
S
8
S
O
/S
IO
1
9
W
P
/A
C
C
1
0
G
N
D
1
1
N
C
_
5
1
2
N
C
_
6
1
3
N
C
_
7
1
4
N
C
_
8
1
5
S
I.S
IO
0 1
6
S
C
L
K
0
.0
1
u
F
C
8
6
4
0 . 1 u FC 8 8 2
I 2 S _ S C K
TM
D
S
2_R
X
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7 5 A U R 4
7 6 G N D _ 4
7 7 A U V R P
7 8 A U V A G
7 9 A V D D _ A U
8 0 G N D _ 5
8 1 V D D C _ 2
8 2 D D C A _ C K
8 3 D D C A _ D A
8 4 D D C D A _ C K
8 5 D D C D A _ D A
8 6 D D C D B _ C K
8 7 D D C D B _ D A
8 8 G P I O 2 0
8 9 V D D P _ 1
9 0 V D D C _ 3
9 1 U A R T 2 _ R X
9 2 U A R T 2 _ T X
9 3 D D C D C _ C K
9 4 R X C C K N
9 5 R X C C K P
9 6 D D C D C _ D A
9 7 R X C 0 N
9 8 R X C 0 P
9 9 G N D _ 6
1 0 0 R X C 1 N
1 0 1 R X C 1 P
1 0 2 A V D D _ D M
1 0 3 R X C 2 N
1 0 4 R X C 2 P
1 0 5 H O T P L U G C
1 0 6 U S B 1 _ D M
1 0 7 U S B 1 _ D P
1 0 8 S C K
1 0 9 S D I
1 1 0 S D O
1 1 1 S C Z
1 1 2 P W M 0
1 1 3 P W M 1
1 1 4 P W M 2
1 1 5 P W M 3
1 1 6 L V A 4 P
1 1 7 L V A 4 M
1 1 8 L V A 3 P
1 1 9 L V A 3 M
1 2 0 L V A C K P
1 2 1 L V A C K M
1 2 2 L V A 2 P
1 2 3 L V A 2 M
1 2 4 L V A 1 P
1 2 5 L V A 1 M
1 2 6 L V A 0 P
1 2 7 L V A 0 M
1 2 8 V D D P _ 2
1
2
9
LV
B
4P
1
3
0
LVB4M
1
3
1
LV
B
3P
1
3
2
LVB3M
1
3
3
LVBC
KP
1
3
4
LVBCKM
1
3
5
LV
B
2P
1
3
6
LVB2M
1
3
7
LV
B
1P
1
3
8
LVB1M
1
3
9
LV
B
0P
1
4
0
LVB0M
1
4
1
AVD
D
_LPLL
1
4
2
G
N
D
_7
1
4
3
VD
D
C
_4
1
4
4
G
P
IO
150/I2C
_O
U
T_M
U
TE
1
4
5
G
P
IO
151/I2C
_O
U
T
_S
D
2
1
4
6
G
P
IO
152/I2C
_O
U
T
_S
D
3
1
4
7
G
N
D
_8
1
4
8
G
P
IO
51
1
4
9
G
P
IO
52
1
5
0
G
P
IO
53
1
5
1
G
P
IO
54
1
5
2
G
P
IO
55
1
5
3
G
P
IO
56
1
5
4
G
P
IO
57
1
5
5
G
P
IO
58
1
5
6
V
D
D
P
_3
1
5
7
VD
D
C
_5
1
5
8
B
_M
D
A
TA
[4]
1
5
9
B
_M
D
A
TA
[3]
1
6
0
G
N
D
_9
1
6
1
B
_M
D
A
TA
[1]
1
6
2
B
_M
D
A
TA
[6]
1
6
3
AVD
D
_D
D
R
_1
1
6
4
B
_M
D
A
TA
[11]
1
6
5
B
_M
D
A
TA
[12]
1
6
6
G
N
D
_10
1
6
7
B
_M
D
A
TA
[9]
1
6
8
B
_M
D
A
TA
[14]
1
6
9
AVD
D
_D
D
R
_2
1
7
0
B
_D
D
R
2_D
Q
M
[1]
1
7
1
B
_D
D
R
2_D
Q
M
[0]
1
7
2
G
N
D
_11
1
7
3
B
_D
D
R
2_D
Q
S
[0]
1
7
4
B
_D
D
R
2_D
Q
S
B
[0]
1
7
5
AVD
D
_D
D
R
_3
1
7
6
V
D
D
P
_4
1
7
7
G
N
D
_12
1
7
8
B
_D
D
R
2_D
Q
S
[1]
1
7
9
B
_D
D
R
2_D
Q
S
B
[1]
1
8
0
AVD
D
_D
D
R
_4
1
8
1
B
_M
D
A
TA
[15]
1
8
2
B
_M
D
A
TA
[8]
1
8
3
G
N
D
_13
1
8
4
B
_M
D
A
TA
[10]
1
8
5
B
_M
D
A
TA
[13]
1
8
6
AVD
D
_D
D
R
_5
1
8
7
B
_M
D
A
TA
[7]
1
8
8
B
_M
D
A
TA
[0]
1
8
9
B
_M
D
A
TA
[2]
1
9
0
B
_M
D
A
TA
[5]
1
9
1
B_M
C
LK
1
9
2
B_M
C
LKZ
1 9 3G N D _ 1 4
1 9 4A V D D _ M E M P L L
1 9 5M V R E F
1 9 6A _ O D T
1 9 7A _ R A S Z
1 9 8A _ C A S Z
1 9 9A _ M A D R [ 0 ]
2 0 0A _ M A D R [ 2 ]
2 0 1A _ M A D R [ 4 ]
2 0 2G N D _ 1 5
2 0 3A _ M A D R [ 6 ]
2 0 4A _ M A D R [ 8 ]
2 0 5A _ M A D R [ 1 1 ]
2 0 6A _ W E Z
2 0 7A _ B A D R [ 1 ]
2 0 8A _ B A D R [ 0 ]
2 0 9A _ M A D R [ 1 ]
2 1 0A _ M A D R [ 1 0 ]
2 1 1A V D D _ D D R _ 6
2 1 2A _ M A D R [ 5 ]
2 1 3A _ M A D R [ 9 ]
2 1 4A _ M A D R [ 1 2 ]
2 1 5A _ M A D R [ 7 ]
2 1 6A _ M A D R [ 3 ]
2 1 7A _ M C L K E
2 1 8V D D C _ 6
2 1 9I 2 S _ I N _ W S / G P I O 6 7
2 2 0I 2 S _ I N _ B C K / G P I O 6 8
2 2 1I 2 S _ I N _ S D
2 2 2I 2 S _ O U T _ M C K
2 2 3I 2 S _ O U T _ W S
2 2 4V D D P _ 5
2 2 5G N D _ 1 6
2 2 6V D D C _ 7
2 2 7I 2 S _ O U T _ B C K
2 2 8I 2 S _ O U T _ S D
2 2 9S P D I F O
2 3 0U A R T 2 _ R X / I 2 C M _ S D A
2 3 1U A R T 2 _ T X / I 2 C M _ S C K
2 3 2U A R T 1 _ R X / G P I O 8 6
2 3 3U A R T 1 _ T X / G P I O 8 7
2 3 4G N D _ 1 7
2 3 5G N D _ 1 8
2 3 6U S B 0 _ D M
2 3 7U S B 0 _ D P
2 3 8S A R 0
2 3 9S A R 1
2 4 0S A R 2
2 4 1S A R 3
2 4 2A V D D _ M P L L
2 4 3X O U T
2 4 4X I N
2 4 5G P I O 1 3 4
2 4 6G P I O 1 3 5
2 4 7G P I O 1 3 8
2 4 8G P I O 1 3 9
2 4 9G P I O 1 4 0
2 5 0I R I N
2 5 1H S Y N C 0
2 5 2V S Y N C 0
2 5 3H S Y N C 1
2 5 4V S Y N C 1
2 5 5C E C
2 5 6H W R E S E T
LGE3767A [M
ST99A88M
L(M
ATRIX ONLY SD DIVX_ NON RM
) ]
IC800-*1
1
RXBCKN2
RXBCKP3
RXB0N4 RXB0P5
HOTPLUGB6
RXB1N7 RXB1P8
AVDD_33_19
RXB2N10
RXB2P11
RXACKN12
RXACKP13
RXA0N14
RXA0P15
AVDD_33_216
RXA1N17
RXA1P18
GND_119
RXA2N20
RXA2P21
HOTPLUGA22
REXT23
VCLAMP24 REFP25
REFM26
BIN1P27
SOGIN128
GIN1P29
RIN1P30
BINM31
BIN0P32
GINM33
GIN0P34
SOGIN035
RINM36
RIN0P37
AVDD_33_338
GND_239
BIN2P40
GIN2P41
SOGIN242
RIN2P43
CVBS644
CVBS545
CVBS446
CVBS347
CVBS248
CVBS149
VCOM150
CVBS051
VCOM052
AVDD_33_453
CVBSOUT54
GND_355 SIF0P56
SIF0M57
VDDC_158
AUL559
AUR560
AUVRM61
AUOUTL262
AUOUTR263
AUOUTL164
AUOUTR16 5A U L 0 6 6A U R 0 6 7A U L 1 6 8A U R 1 6 9A U L 2 7 0A U R 2 7 1A U L 3 7 2A U R 3 7 3A U C O M 7 4A U L 4 7 5A U R 4 7 6G N D _ 4 7 7A U V R P 7 8A U V A G 7 9A V D D _ A U 8 0G N D _ 5 8 1V D D C _ 2 8 2D D C A _ C K 8 3D D C A _ D A 8 4D D C D A _ C K 8 5D D C D A _ D A 8 6D D C D B _ C K 8 7D D C D B _ D A 8 8G P I O 2 0 8 9V D D P _ 1 9 0V D D C _ 3 9 1U A R T 2 _ R X 9 2U A R T 2 _ T X 9 3D D C D C _ C K 9 4R X C C K N 9 5R X C C K P 9 6D D C D C _ D A 9 7R X C 0 N 9 8R X C 0 P 9 9G N D _ 6 1 0 0R X C 1 N 1 0 1R X C 1 P 1 0 2A V D D _ D M 1 0 3R X C 2 N 1 0 4R X C 2 P 1 0 5H O T P L U G C 1 0 6U S B 1 _ D M 1 0 7U S B 1 _ D P 1 0 8S C K 1 0 9S D I 1 1 0S D O 1 1 1S C Z 1 1 2P W M 0 1 1 3P W M 1 1 1 4P W M 2 1 1 5P W M 3 1 1 6L V A 4 P 1 1 7L V A 4 M 1 1 8L V A 3 P 1 1 9L V A 3 M 1 2 0L V A C K P 1 2 1L V A C K M 1 2 2L V A 2 P 1 2 3L V A 2 M 1 2 4L V A 1 P 1 2 5L V A 1 M 1 2 6L V A 0 P 1 2 7L V A 0 M 1 2 8V D D P _ 2 129 LVB4P
130 LVB4M
131 LVB3P
132 LVB3M
133 LVBCKP
134 LVBCKM
135 LVB2P
136 LVB2M
137 LVB1P
138 LVB1M
139 LVB0P
140 LVB0M
141 AVDD_LPLL
142 GND_7
143 VDDC_4
144 GPIO150/I2C_OUT_MUTE
145 GPIO151/I2C_OUT_SD2
146 GPIO152/I2C_OUT_SD3
147 GND_8
148 GPIO51
149 GPIO52
150 GPIO53
151 GPIO54
152 GPIO55
153 GPIO56
154 GPIO57
155 GPIO58
156 VDDP_3
157 VDDC_5
158 B_MDATA[4]
159 B_MDATA[3]
160 GND_9
161 B_MDATA[1]
162 B_MDATA[6]
163 AVDD_DDR_1
164 B_MDATA[11]
165 B_MDATA[12]
166 GND_10
167 B_MDATA[9]
168 B_MDATA[14]
169 AVDD_DDR_2
170 B_DDR2_DQM[1]
171 B_DDR2_DQM[0]
172 GND_11
173 B_DDR2_DQS[0]
174 B_DDR2_DQSB[0]
175 AVDD_DDR_3
176 VDDP_4
177 GND_12
178 B_DDR2_DQS[1]
179 B_DDR2_DQSB[1]
180 AVDD_DDR_4
181 B_MDATA[15]
182 B_MDATA[8]
183 GND_13
184 B_MDATA[10]
185 B_MDATA[13]
186 AVDD_DDR_5
187 B_MDATA[7]
188 B_MDATA[0]
189 B_MDATA[2]
190 B_MDATA[5]
191 B_MCLK
192 B_MCLKZ
1 9 3 G N D _ 1 41 9 4 A V D D _ M E M P L L1 9 5 M V R E F1 9 6 A _ O D T1 9 7 A _ R A S Z1 9 8 A _ C A S Z1 9 9 A _ M A D R [ 0 ]2 0 0 A _ M A D R [ 2 ]2 0 1 A _ M A D R [ 4 ]2 0 2 G N D _ 1 52 0 3 A _ M A D R [ 6 ]2 0 4 A _ M A D R [ 8 ]2 0 5 A _ M A D R [ 1 1 ]2 0 6 A _ W E Z2 0 7 A _ B A D R [ 1 ]2 0 8 A _ B A D R [ 0 ]2 0 9 A _ M A D R [ 1 ]2 1 0 A _ M A D R [ 1 0 ]2 1 1 A V D D _ D D R _ 62 1 2 A _ M A D R [ 5 ]2 1 3 A _ M A D R [ 9 ]2 1 4 A _ M A D R [ 1 2 ]2 1 5 A _ M A D R [ 7 ]2 1 6 A _ M A D R [ 3 ]2 1 7 A _ M C L K E2 1 8 V D D C _ 62 1 9 I 2 S _ I N _ W S / G P I O 6 72 2 0 I 2 S _ I N _ B C K / G P I O 6 82 2 1 I 2 S _ I N _ S D2 2 2 I 2 S _ O U T _ M C K2 2 3 I 2 S _ O U T _ W S2 2 4 V D D P _ 52 2 5 G N D _ 1 62 2 6 V D D C _ 72 2 7 I 2 S _ O U T _ B C K2 2 8 I 2 S _ O U T _ S D2 2 9 S P D I F O2 3 0 U A R T 2 _ R X / I 2 C M _ S D A2 3 1 U A R T 2 _ T X / I 2 C M _ S C K2 3 2 U A R T 1 _ R X / G P I O 8 62 3 3 U A R T 1 _ T X / G P I O 8 72 3 4 G N D _ 1 72 3 5 G N D _ 1 82 3 6 U S B 0 _ D M2 3 7 U S B 0 _ D P2 3 8 S A R 02 3 9 S A R 12 4 0 S A R 22 4 1 S A R 32 4 2 A V D D _ M P L L2 4 3 X O U T2 4 4 X I N2 4 5 G P I O 1 3 42 4 6 G P I O 1 3 52 4 7 G P I O 1 3 82 4 8 G P I O 1 3 92 4 9 G P I O 1 4 02 5 0 I R I N2 5 1 H S Y N C 02 5 2 V S Y N C 02 5 3 H S Y N C 12 5 4 V S Y N C 12 5 5 C E C2 5 6 H W R E S E T
3
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K
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8
1
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D S U B _ S D A
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R
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6
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8
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K
R
8
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7
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8
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6
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2
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6
"
2 0 p FC 8 1 7
2 0 p FC 8 1 6
D D R 2 _ A [ 2 ]
D
D
R
2_D
[1]
D D R 2 _ A [ 6 ]
G N D
D
D
R
2_D
[5]
D D R 2 _ A [ 1 0 ]
D
D
R
2_D
[0]
D
D
R
2_D
[10]
D D R 2 _ A [ 1 2 ]
D
D
R
2_D
[14]
D D R 2 _ A [ 0 ]
D
D
R
2_D
[6]
D D R 2 _ A [ 5 ]
D
D
R
2_D
[3]
D D R 2 _ A [ 4 ]
D
D
R
2_D
[4]
D
D
R
2_D
[12]
D D R 2 _ A [ 9 ]
D
D
R
2_D
[11]
D D R 2 _ A [ 8 ]
D
D
R
2_D
[8]
D
D
R
2_D
[7]
D
D
R
2_D
[15]
D
D
R
2_D
[9]
D D R 2 _ A [ 3 ]
D
D
R
2_D
[13]
D D R 2 _ A [ 1 1 ]
D
D
R
2_D
[2]
D D R 2 _ A [ 1 ]
D D R 2 _ A [ 7 ]
TX
C
E
4-
TX
C
E
4+
TX
C
E
3-
TX
C
E
3+
TX
C
LK
E
-
TXC
LKE+
TX
C
E
2-
TX
C
E
2+
TX
C
E
1-
TX
C
E
1+
TX
C
E
0-
TX
C
E
0+
TX
C
O
4-
TXC
O
4+
TX
C
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3-
TXC
O
3+
TXC
LKO
-
TXC
LKO
+
TX
C
O
2-
TXC
O
2+
TX
C
O
1-
TXC
O
1+
TX
C
O
0-
TXC
O
0+
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SCHEMATIC DIAGRAM
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LVDS/ CTR KEY
Feb., 2009
Printed in Korea P/NO : MFL60021515

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