Sam Palermo

Analog & Mixed-Signal Center

Texas A&M University
ECEN689: Special Topics in High-Speed
Links Circuits and Systems
Spring 2012
Lecture 2: Channel Components, Wires, & Transmission Lines
Announcements
HW1 due NOW

Lab1 tomorrow in ZACH 203
Prelab 1 due tomorrow

Reference Material Posted on Website
TDR theory application note
S-parameter notes

2
Agenda
Channel Components
IC Packages, PCBs, connectors, vias, PCB Traces
Wire Models
Resistance, capacitance, inductance
Transmission Lines
Propagation constant
Characteristic impedance
Loss
Reflections
Termination examples
Differential transmission lines
3
Channel Components
4
Edge connector
Packaged SerDes
Line card trace
Backplane trace
Via stub
The Channel
Tx IC
Pkg
Line card
trace
Edge
connector
Line card
via
Backplane
via
Backplane
16 trace
Edge
connector
Line card
trace
Rx IC
Pkg
Backplane
via
Line card
via
[Meghelli (IBM) ISSCC 2006]
IC Packages
Package style depends
on application and pin
count

Packaging technology
hasnt been able to
increase pin count at
same rate as on-chip
aggregate bandwidth
Leads to I/O constrained
designs and higher data
rate per pin
5
Package Type Pin Count
Small Outline Package (SOP) 8 56
Quad Flat Package (QFP) 64 - 304
Plastic Ball Grid Array (PBGA) 256 - 420
Enhanced Ball Grid Array (EBGA)
352 - 896
Flip Chip Ball Grid Array (FC-BGA)
1089 - 2116
SOP
PBGA
QFP
FC-BGA
[Package Images - Fujitsu]
IC Package Examples
Wirebonding is most
common die attach method
Flip-chip packaging allows
for more efficient heat
removal
2D solder ball array on
chip allows for more
signals and lower signal
and supply impedance
6
Standard Wirebond Package
Flip-Chip/ Wirebond Package
Flip-Chip/ Solder Ball Package
[Package Images - Fujitsu]
IC Package Model
7
Bondwires
L ~ 1nH/mm
Mutual L K
C
couple
~
20fF/mm
Package Trace
L ~ 0.7-1nH/mm
Mutual L K
C
layer
~
80-90fF/mm
C
couple
~
40fF/mm
[Dally]
Printed Circuit Boards
Components soldered on
top (and bottom)

Typical boards have 4-8
signal layers and an
equal number of power
and ground planes

Backplanes can have
over 30 layers
8
PCB Stackup
Signals typically on top and
bottom layers

GND/Power plane pairs and
signal layer pairs alternate in
board interior

Typical copper trace thickness
0.5oz (17.5um) for signal layers
1oz (35um) for power planes
9
[Dally]
Connectors
Connectors are used
to transfer signals
from board-to-board

Typical differential
pair density between
16-32 pairs/10mm
10
[Tyco]
Connectors
Important to maintain proper differential
impedance through connector
11
Crosstalk can be an issue in the connectors
[Tyco]
Vias
Used to connect PCB layers

Made by drilling a hole through
the board which is plated with
copper
Pads connect to signal layers/traces
Clearance holes avoid power planes

Expensive in terms of signal
density and integrity
Consume multiple trace tracks
Typically lower impedance and create
stubs
12
[Dally]
Impact of Via Stubs at Connectors
13
Legacy BP has default straight vias
Creates severe nulls which kills signal integrity
Refined BP has expensive backdrilled vias
Edge connector
Packaged SerDes
Line card trace
Backplane trace
Via stub
PCB Trace Configurations
Microstrips are signal
traces on PCB outer
surfaces
Trace is not enclosed
and susceptible to
cross-talk
Striplines are
sandwiched between
two parallel ground
planes
Has increased isolation
14
[J ohnson]
Wire Models
Resistance

Capacitance

Inductance

Transmission line theory
15
Wire Resistance
Wire resistance is determined by material
resistivity, , and geometry
Causes signal loss and propagation delay
16
wh
l
A
l
R

= =
2
r
l
A
l
R

= =
[Dally]
Wire Capacitance
Wire capacitance is determined
by dielectric permittivity, ,
and geometry
Best to use lowest
r

Lower capacitance
Higher propagation velocity
17
s
w
C

=
( )
1 2
log
2
r r
C

=
( ) r s
C
log

=
( ) h s s
w
C
4 log
2
+ =
[Dally]
Wire Inductance
Wire inductance is determined by material
permeability, , and closed-loop geometry

For wire in homogeneous medium


Generally
18
= CL
H/m 10 4
7
0

= =
Wire Models
Model Types
Ideal
Lumped C, R, L
RC transmission line
LC transmission line
RLGC transmission line

Condition for LC or RLGC model (vs RC)
19
L
R
f
2
0

Wire R L C >f (LC wire)
AWG24 Twisted Pair 0.08/m 400nH/m 40pF/m 32kHz
PCB Trace 5/m 300nH/m 100pF/m 2.7MHz
On-Chip Min. Width M6
(0.18m CMOS node)
40k/m 4H/m 300pF/m 1.6GHz
RLGC Transmission Line Model
20
( )
( )
( )
t
t x I
L t x RI
x
t x V

,
,
,
( )
( )
( )
t
t x V
C t x GV
x
t x I

,
,
,
0 dx As
(1)
(2)
General
Transmission
Line Equations
Time-Harmonic Transmission Line Eqs.
Assuming a traveling sinusoidal wave with angular frequency,
21
( )
( ) ( ) x I L j R
dx
x dV
+ =
( )
( ) ( ) x V C j G
dx
x dI
+ =
Differentiating (3) and plugging in (4) (and vice versa)
( )
( ) x V
dx
x V d
2
2
2
=
( )
( ) x I
dx
x I d
2
2
2
=
where is the propagation constant
( )( ) ( )
-1
m C j G L j R j + + = + =
(5)
(6)
Time-Harmonic
Transmission
Line Equations
(3)
(4)
Transmission Line Propagation Constant
Solutions to the Time-Harmonic Line Equations:
22
( ) ( ) ( )
x
r
x
f r f
e V e V x V x V x V

0 0
+ = + =

What does the propagation constant tell us?
Real part () determines attenuation/distance (Np/m)
Imaginary part () determines phase shift/distance (rad/m)
Signal phase velocity
( ) ( ) ( )
x
r
x
f r f
e I e I x I x I x I

0 0
+ = + =

where
( )( ) ( )
-1
m C j G L j R j + + = + =
(m/s) =
Transmission Line Impedance, Z
0

For an infinitely long line, the voltage/current ratio is Z
0

From time-harmonic transmission line eqs. (3) and (4)

23
( )
( )
( )
+
+
= =
0
C j G
L j R
x I
x V
Z

Driving a line terminated by Z
0
is the same as driving an
infinitely long line
[Dally]
Lossless LC Transmission Lines
If Rdx=Gdx=0
24
LC
LC j j

=
=
= + =
0
C
L
Z
LC
=
= =
0
1

No Loss!
Waves propagate w/o distortion
Velocity and impedance
independent of frequency
Impedance is purely real
[J ohnson]
Low-Loss LRC Transmission Lines
If R/L and G/C << 1
Behave similar to ideal
LC transmission line,
but
Experience resistive and
dielectric loss
Frequency dependent
propagation velocity
results in dispersion
Fast step, followed by slow
DC tail
25
( )( )

j
C
G
L
R
LC j
GZ
Z
R
LC
GL RC
j LC j
C j G L j R j
D R
+ + =
(
(

|
.
|

\
|
+
|
.
|

\
|
+ + +
|
.
|

\
| +

+ + = + =
2 2
0
0
2
1
8
1
8
1
1
2 2
1
2
2
0
0
GZ
Z
R
D
R

(
(

|
.
|

\
|
+
|
.
|

\
|
+
2 2
8
1
8
1
1
C
G
L
R
LC


1
2 2
8
1
8
1
1

|
|
.
|

\
|
(
(

|
.
|

\
|
+
|
.
|

\
|
+
C
G
L
R
LC

Resistive Loss
Dielectric Loss
Skin Effect (Resistive Loss)
High-frequency current density falls
off exponentially from conductor
surface
Skin depth, , is where current falls
by e
-1
relative to full conductor
Decreases proportional to
sqrt(frequency)
Relevant at critical frequency f
s

where skin depth equals half
conductor height (or radius)
Above f
s
resistance/loss increases
proportional to sqrt(frequency)
26

d
e J

=
( ) 2
1

= f
2
2
|
.
|

\
|
=
h
f
s

( )
2
1
|
|
.
|

\
|
=
s
DC
f
f
R f R
2
1
0
2
|
|
.
|

\
|
=
s
DC
R
f
f
Z
R

For rectangular conductor:

[Dally]
Skin Effect (Resistive Loss)
27
[Dally]
MHz f m R
s DC
43 , 7 = =
5-mil Stripguide
kHz f m R
s DC
67 , 08 . 0 = =
30 AWG Pair
2
1
0
2
|
|
.
|

\
|
=
s
DC
R
f
f
Z
R

Dielectric Absorption (Loss)

An alternating electric field
causes dielectric atoms to
rotate and absorb signal
energy in the form of heat
Dielectric loss is expressed
in terms of the loss
tangent
Loss increases directly
proportional to frequency
28
C
G
D

= tan
LC f
C L fC
GZ
D
D
D

tan
2
tan 2
2
0
=
= =
[Dally]
Total Wire Loss
29
[Dally]
Reflections & Telegraphers Eq.
30
T
i
T
Z Z
V
I
+
=
0
2
|
|
.
|

\
|
+

=
+
=
=
0
0
0
0 0
2
Z Z
Z Z
Z
V
I
Z Z
V
Z
V
I
I I I
T
T i
r
T
i i
r
T f r
0
0
Z Z
Z Z
V
V
I
I
k
T
T
i
r
i
r
r
+

= = =
Termination Current:
With a Thevenin-equivalent model of the line:
KCL at Termination:
Telegraphers Equation or
Reflection Coefficient
[Dally]
Termination Examples - Ideal
31
R
S
= 50
Z
0
= 50, t
d
= 1ns
R
T
= 50
0
50 50
50 50
0
50 50
50 50
5 . 0
50 50
50
1
=
+

=
=
+

=
=
|
.
|

\
|
+
=
rS
rT
i
k
k
V V V
in (step begins at 1ns)
source
termination
Termination Examples - Open
32
R
S
= 50
Z
0
= 50, t
d
= 1ns
R
T
~ (1M)
0
50 50
50 50
1
50
50
5 . 0
50 50
50
1
=
+

=
+ =
+

=
=
|
.
|

\
|
+
=
rS
rT
i
k
k
V V V
in (step begins at 1ns)
source
termination
Termination Examples - Short
33
R
S
= 50
Z
0
= 50, t
d
= 1ns
R
T
= 0
0
50 50
50 50
1
50 0
50 0
5 . 0
50 50
50
1
=
+

=
=
+

=
=
|
.
|

\
|
+
=
rS
rT
i
k
k
V V V
in (step begins at 1ns)
source
termination
Arbitrary Termination Example
34
R
S
= 400
Z
0
= 50, t
d
= 1ns
R
T
= 600
778 . 0
50 400
50 400
846 . 0
50 600
50 600
111 . 0
50 400
50
1
=
+

=
=
+

=
=
|
.
|

\
|
+
=
rS
rT
i
k
k
V V V
in (step begins at 1ns)
source
termination
0.111V
0.205V
0.278V
0.340
Lattice Diagram
35
R
S
= 400
R
T
= 600
Z
0
= 50, t
d
= 1ns
in (step begins at 1ns)
Rings up to 0.6V
(DC voltage division)
Termination Reflection Patterns
36
R
S
= 25, RT = 25
kr
S
& kr
T
< 0
Voltages Converge
R
S
= 25, RT = 100
kr
S
< 0 & kr
T
> 0
Voltages Oscillate
R
S
= 100, RT = 25
kr
S
> 0 & kr
T
< 0
Voltages Oscillate
R
S
= 100, RT = 100
kr
S
> 0 & kr
T
> 0
Voltages Ring Up
source
termination
source
termination
source
termination
source
termination
Termination Schemes
37
No Termination
Little to absorb line energy
Can generate oscillating
waveform
Line must be very short
relative to signal transition time
n = 4 - 6
Limited off-chip use

Source Termination
Source output takes 2 steps up
Used in moderate speed point-
to-point connections

LC nl nT t
trip round r
2 = >

LC l t
porch
2
Termination Schemes
38
Receiver Termination
No reflection from receiver
Watch out for intermediate
impedance discontinuities
Little to absorb reflections at driver

Double Termination
Best configuration for min
reflections
Reflections absorbed at both driver
and receiver
Get half the swing relative to
single termination
Most common termination scheme
for high performance serial links

Differential Transmission Lines
39
Differential signaling advantages
Self-referenced
Common-mode noise rejection
Increased signal swing
Reduced self-induced power-
supply noise

Requires 2x the number of
signaling pins relative to single-
ended signaling
But, smaller ratio of
supply/signal (return) pins
Total pin overhead is typically
1.3-1.8x (vs 2x)
[Hall]
Even mode
When equal voltages drive both
lines, only one mode propagates
called even more

Odd mode
When equal in magnitude, but out
of phase, voltages drive both lines,
only one mode propagates called
odd mode
Balanced Transmission Lines
Even (common) mode
excitation
Effective C = C
C

Effective L = L + M
Odd (differential) mode
excitation
Effective C = C
C
+ 2C
d

Effective L = L M
40
2
1
2
1
2
|
|
.
|

\
|
+

=
|
|
.
|

\
|
+
=
d c
odd
c
even
C C
M L
Z
C
M L
Z
[Dally]
2
, 2
even
CM odd DIFF
Z
Z Z Z = =
PI-Termination
41
1
R Z
even
=
2 || 2 ||
2 2 1
R Z R R Z
even odd
= =
|
|
.
|

\
|

=
odd even
even odd
Z Z
Z Z
R 2
2
T-Termination
42
1 2
2R R Z
even
+ =
( )
odd even
odd
Z Z R
R Z
=
=
2
1
1
2
Next Time
Channel modeling
Time domain reflectometer (TDR)
Network analysis
43