DesigN Analysis - Infrastructure

Earl J. Lum
+1-650-430-2221
elum@ejlwireless.com

Huawei Technologies
WD5MMRFU88B
Model MRFU 900B V1 60W
December 2012

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TABLE OF CONTENTS
EXECUTIVE SUMMARY ....................................................................... 6

Active/Passive Component Summary ................................................................ 6

Important Note: ............................................................................................ 6

CHAPTER 1: HUAWEI BTS3900 BTS SYSTEM .......................................... 7

Overview of BTS3900 Product Offering.............................................................. 7

CHAPTER 2: MRFU MECHANICAL ANALYSIS ............................................. 9

Mechanical Analysis........................................................................................ 9

CHAPTER 3: MRFU TRX SUBSYSTEM ................................................... 15

Digital Processor and TRx PCB ........................................................................15

Area A: Baseband Signal Processing ................................................................19
Area B: Power Supply ....................................................................................22
Area C1: Dual RF Receiver LNA .......................................................................25
Area C2: VSWR Monitoring Circuit ...................................................................28
Area D: IF Receiver .......................................................................................30
Area E: RF Power Amplifier Tx Sampling Circuit .................................................33
Area F1: MRFU Transmit D/A Conversion..........................................................35
Area F2: MRFU Transmit Path .........................................................................37
MVCO1475 Frequency Synthesizer Module........................................................40
MVCO804 Frequency Synthesizer Module .........................................................42

CHAPTER 6: MRFU RF AMPLIFIER SUBSYSTEM ....................................... 44

MRFU RF Power Amplifier Heat Sink .................................................................49

CHAPTER 7: MRFU DUPLEXER CAVITY FILTER RF SUBSYSTEM ...................... 51

APPENDIX A - PASSIVE CASE SIZE ANALYSIS.......................................... 64
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS ...................... 67

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2012 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

TABLES
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1: Area A Bill of Materials ..................................................................................................... 20

2: Area B Bill of Materials ..................................................................................................... 23
3: Area C1 Bill of Materials ................................................................................................... 27
4: Area C2 Bill of Materials ................................................................................................... 29
5: Area D Bill of Materials ..................................................................................................... 32
6: Area E Bill of Materials ..................................................................................................... 34
7: Area F1 Bill of Materials.................................................................................................... 36
8: Area F2 Bill of Materials.................................................................................................... 39
9: MVCO1475 Module Bill of Materials .................................................................................... 41
10: MVCO804 Module Bill of Materials .................................................................................... 43
11: MRFU RF Power Amplifier Area A Bill of Materials ............................................................... 48
12: Duplexer Filter Area A Bill of Materials .............................................................................. 63
13: Duplexer Filter Area B Bill of Materials .............................................................................. 63
14: Passive Component Case Size Distribution by System Subsection ........................................ 65
15: Identified Passive Component Supplier Distribution by System Subsection ............................ 65
16: Active/Passive Component Distribution by System Subsection ............................................. 66
17: Active Semiconductor/Component Vendor Distribution by System Subsection ....................... 68

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2012 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

EXHIBITS
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1: BTS3900 ........................................................................................................................ 7
2: MRFU Chain and Star Topology ......................................................................................... 8
3: MRFU Faceplate............................................................................................................... 9
4: MRFU Connector Port Detail ............................................................................................ 10
5: MRFU Top View ............................................................................................................. 11
6: MRFU Rear View ............................................................................................................ 11
7: MRFU Bottom View ........................................................................................................ 12
8: MRFU Side View ............................................................................................................ 12
9: RF Shield External View.................................................................................................. 13
10: RF Shield Internal View ................................................................................................ 13
11: RF Shield Internal View w/Thermal Pads Removed ........................................................... 14
12: MRFU TRx PCB vs. Power Amplifier PCB .......................................................................... 15
13: MRFU TRx PCB, Top View.............................................................................................. 16
14: MRFU TRx PCB, Bottom View......................................................................................... 17
15: MRFU TRx PCB, Top View with Power Amplifier Board Removed ......................................... 18
16: MRFU TRx PCB, Bottom View with Power Amplifier Board Removed.................................... 18
17: Area A Component Diagram .......................................................................................... 19
18: Area B Component Diagram .......................................................................................... 22
19: Area C1 Component Diagram ........................................................................................ 25
20: Area C1 Block Diagram................................................................................................. 26
21: MRFU Module Interconnection ....................................................................................... 26
22: Area C2 Component Diagram ........................................................................................ 28
23: Area D Component Diagram.......................................................................................... 30
24: Area D Block Diagram .................................................................................................. 31
25: Area E Component Diagram .......................................................................................... 33
26: Area E Block Diagram................................................................................................... 33
27: Area F1 Component Diagram ........................................................................................ 35
28: Area F2 Block Diagram ................................................................................................. 37
29: Area F2 Component Diagram ........................................................................................ 38
30: MVCO1475 Module Component Diagram ......................................................................... 40
31: MVCO804 Module Component Diagram........................................................................... 42
32: MRFU RF Amplifier PCB, Top View .................................................................................. 44
33: MRFU RF Power Amplifier PCB, Bottom View.................................................................... 45
34: MRFU RF Power Amplifier Tx Path Block Diagram ............................................................. 46
35: MRFU RF Power Amplifier Area G Component Diagram ..................................................... 47
36: MRFU RF Power Amplifier Construction, Exploded Side View .............................................. 47
37: MRFU RF Power Amplifier Secondary Heat Sink................................................................ 49
38: MRFU Secondary Heat Sink, Bottom View ....................................................................... 50
39: MRFU Secondary Heat Sink, Side View ........................................................................... 50
40: MRFU Duplexer Filter, Top View ..................................................................................... 51
41: MRFU Duplexer Filter, Front View................................................................................... 51
42: MRFU Duplexer Filter, Rear View.................................................................................... 52
43: MRFU Duplexer Filter, Bottom View ................................................................................ 52
44: MRFU Duplexer Filter, Side View .................................................................................... 53
45: MRFU Duplexer Filter, Major Components ....................................................................... 53
46: MRFU Duplexer Filter RF Connection Socket .................................................................... 54
47: MRFU Duplexer Filter Shielding, External View................................................................. 54
48: MRFU Duplexer Filter Shielding, Internal View ................................................................. 55
49: MRFU Duplexer Filter RF Shield, External View ................................................................ 55
50: MRFU Duplexer Filter RF Shield, Internal View ................................................................. 56
51: MRFU Duplexer Filter RF Paths ...................................................................................... 56
52: Duplexer Filter Tx Path Coupler Analysis ......................................................................... 57
53: Duplexer Filter Tx Path Coupler Analysis, Poles Removed.................................................. 57
54: Duplexer Filter Rx Path Coupler Analysis......................................................................... 58
55: Duplexer Filter Rx Path Coupler Analysis, Poles Removed ................................................. 58
56: Duplexer Filter Coupler Dimensions................................................................................ 59
57: Duplexer Filter Pole Element Dimensions ........................................................................ 59
58: Duplexer Filter Areas.................................................................................................... 60
59: Duplexer Filter Area A Component Diagram, PCB Top....................................................... 61
60: Duplexer Filter Area A Component Diagram, PCB Bottom.................................................. 61

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www.ejlwireless.com

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Duplexer Filter Area B Component Diagram, PCB Top....................................................... 62

Passive Component Case Size Distribution ...................................................................... 64
Identified Passive Component Market Share by Vendor .................................................... 66
Active Semiconductor Component Share......................................................................... 67
High Pin Count IC vs. Discretes ..................................................................................... 68
Active Semiconductor Market Share by Vendor ................................................................ 69
High Pin Count (64+) Active Semiconductor Market Share by Vendor................................. 70

5
Licensed to First Name Last Name, Company Name
2012 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com