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Process Simulation
Spring 2001
Devices Used in RF-Applications
Part - 1
Instructor: Dragica Vasileska
Department of Electrical Engineering
Arizona State University
EEE 533 Semiconductor Device and Process Simulation
Section Outline
1. Description of two-port networks on the example of a BJT in a commonbase and common-emitter configurations:
Low-frequency equivalent circuit description
(introduction to z, y and h-parameters)
High-frequency equivalent circuit description
2. Introduction to S-parameters from a transmission-line point of view:
Description of the incident and reflected power
Smith chart
Two-port network S- and T-parameters description and
measurement
3. Modeling of heterostructure devices:
Description of MESFETs, HBTs, HEMTs Why heterojunction
devices versus MESFETs?
Modeling of heterojunction devices using BLAZE
Simulation example: Output characteristics of a HEMT-device
4. Some advanced device concepts for high-speed device applications:
Silicon heteroepitaxy: SiGe BJTs and their modeling
two-port network
i2
u1
i1
u2
h12 i1
h22 v2
z12 i1
i1 y11
=
,
z22 i2
i2 y21
v1 A
i = C
1
y12 v1
y22 v2
B v2
D i2
(C) At RF-frequencies, one can only measure the S and Tparameters (that relate the incident to reflected power)
EEE 533 Semiconductor Device and Process Simulation
p0B
0
u
U + u
p BT (0) = p0 B exp EB = p0 B exp EB eb
VT
VT
ueb
ueb
ueb 1 ueb
= p B 0 exp
+
pB0 1 +
+ K pb0 p B 0
VT
VT 2 VT
VT
EEE 533 Semiconductor Device and Process Simulation
ie
hib
ic
Collector
hob
ueb
ucb
hrbucb
hfbie
Base
ueb
U EB
hib =
=
ie u = 0
I E U = const.
CB
cb
i
I
h fb = c
= C
ie u = 0 I E U = const.
cb
CB
ueb
U EB
hrb =
=
ucb i = 0 U CB I = const.
e
E
i
I C
hob = c
=
ucb i = 0 U CB I = const.
e
E
VT
W
*
hib
; h fb = 1 2
2L
IE
PB
1
W
DNE n0 E LPB
1+
tanh
DPB p0 B LNE
LPB
The parameters in the common-emitter and commoncollector configuration can be related to the ones for the
common-base configuration.
EEE 533 Semiconductor Device and Process Simulation
ie
ic
Collector
hib = re
ucb
ucb
i e
ueb
hob = gc
rbb
Base
Ideal
transistor
CBE
CBC
rbb
Let us now consider the
minority carrier distribution in the
base region of the transistor. This
pB ( x )
will give the expression for the
carrier transit time through the
base.
pB02
p W
p
pB01
IE AqDp B01 ; Qp = Aq B01
2
W
Q
p
Q
2
p
Qp W
= tr
Transit time for holes
IE 2Dp
through the base
0
QP
Cde =
=
= tr ge
ie
ge
Cde
i
0
0 g e
1
c =
=
= () f =
i e ge + jCde 1 + jf / f
2tr
(dB) = 20 log
(dB) = 20log
3 dB
6 dB/octave
dQp dW
dQp
2ge
WI E dW
Cdc =
=
=
=
Dp dUCB
dUCB IE = const . dW dUCB
This leads to the following results for the current amplification factor and
cut-off frequency:
j 0.22f / f
W / Lp <<1
2.44Dp
0 e
;
() = sec h
1+ jp (f ) =
1+ jf / f
W2
Lp
2.44Dp 4 / 3
0 e
;
() =
1+
2
1+ jf / f
W
2
where the parameter describes the build-in electric field, and v is the
factor describing the excess phase, both of which are calculated using:
= ln(ND 0 / NDW ); = 0.22 + 0.1
Cbc
rbb
B
g be
g bc
Cbe
gmube
gce
(a) for frequencies f > 4f1, where f1 = gbc/2Cbc, one can ignore gbc and
obtain the following expression for the current amplification factor:
i
g /g
gbe
gm
= c
=
= m be f =
2(Cbe + Cbc )
i b uce = 0 g be + j(Cbe + Cbc ) 1 + jf / f
(b) for frequencies f >> f, gbe becomes negligible, and the current
amplification factor simplifies to:
ic
gm
fT
gm
=
=
= fT =
2(Cbe + Cbc )
i b uce = 0 j(Cbe + Cbc ) jf