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Copyright
September 2014
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Revision History
Revision
Number
001
September 2014
Order No.: 330786-001
Description
Initial release
Date
September 2014
Contents
Revision History..................................................................................................................3
1.0 Introduction to the Intel Xeon Processor E5-1600 and E5-2600 v3 Product
Families TMSDG....................................................................................................... 10
1.1 Definition of Terms............................................................................................... 10
2.0 LGA2011-3 Socket Overview....................................................................................... 13
2.1 Socket Components.............................................................................................. 14
2.2 Socket Land Pattern Guidance................................................................................ 18
2.3 Socket Loading Requirements.................................................................................21
2.3.1 Socket Loading Specifications.................................................................... 22
2.4 Socket Maximum temperature................................................................................ 22
2.5 Strain Guidance for Socket....................................................................................23
3.0 Independent Loading Mechanism (ILM) Specifications............................................... 24
3.1
3.2
3.3
3.4
3.5
3.6
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Package Size........................................................................................................61
Package Loading Specifications............................................................................... 62
Processor Mass Specification.................................................................................. 63
Processor Materials............................................................................................... 63
Processor Markings............................................................................................... 63
Package Handling Guidelines.................................................................................. 65
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B.12
B.13
B.14
B.15
B.16
B.17
B.18
B.19
B.20
B.21
B.22
B.23
B.24
B.25
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Figures
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Tables
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesIntroduction to the Intel
Xeon Processor E5-1600 and E5-2600 v3 Product Families TMSDG
1.0
Heatsink recommendations
Reference designs for the socket, ILM and associated back plate
1.1
Definition of Terms
Table 1.
Description
Bypass
DTS
FSC
IHS
Square ILM
September 2014
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Introduction to the Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families TMSDG
Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Term
Description
Narrow ILM
LGA2011-3 Socket
PECI
CA
CS
SA
Tcase
Tcase-Max
TCC
TCONTROL
TDP
Thermal Monitor
Thermal Profile
TIM
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesIntroduction to the Intel
Xeon Processor E5-1600 and E5-2600 v3 Product Families TMSDG
Term
Description
TLA
TSA
September 2014
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LGA2011-3 Socket OverviewIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
2.0
Socket contact density increased by 12% while maintaining 40 mil minimum via
pitch requirements. as compared to a linear array
Corresponding square pitch arrays would require a 38mil via pitch for the same
package size.
LGA2011-3 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16
grid depopulation in the center of the array and selective depopulation elsewhere.
Figure 1.
Table 2.
Attributes
Component Size
Pitch
Ball Count
2011
September 2014
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesLGA2011-3 Socket Overview
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). Internal keying posts ensure socket processor
compatibility. An external socket key ensures ILM and socket compatibility. The ILM
reference design includes a back plate; an integral feature for uniform loading on the
socket solder joints and contacts.
2.1
Socket Components
The socket has two main components, the socket body: composed of a housing solder
balls, and processor contacts, and Pick and Place (PnP) cover. The socket is delivered
as a single integral assembly. Below are descriptions of the integral parts of the
socket.
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating
capable of withstanding 260C for 40 seconds (typical reflow/rework). The socket
coefficient of thermal expansion (in the XY plane), and creep properties, are such that
the integrity of the socket is maintained for the environmental conditions listed in the
TMSDG.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems. A labeled representation of the
socket can be seen in the figure below.
Figure 2.
Solder Balls
A total of 2011 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
September 2014
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LGA2011-3 Socket OverviewIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper
(Cu) 0.5%, tin (Sn) 96.5% and a melting temperature of approximately 217C.
The immersion silver (ImAg) motherboard surface finish and solder paste alloy
must be compatible with the SAC305 alloy solder paste.
Contacts
The base material for the contacts is high strength copper alloy. For the area on
socket contacts where processor lands will mate, there is a 0.381 mm [0.015 inches]
minimum gold plating over 1.27 mm [0.05 inches] minimum nickel underplate. No
contamination by solder in the contact area is allowed during solder reflow. All socket
contacts are designed such that the contact tip lands within the substrate pad
boundary before any actuation load is applied and remain within the pad boundary at
final installation, after actuation load is applied.
The contacts are laid out in two L-shaped arrays as shown in the figure below. The
detailed view of the contacts indicate the wiping orientation of the contacts in the two
regions to be 29.6.
Figure 3.
The contact between substrate land and socket contact are offset. The following
diagram shows contact offset from solder ball location and orientation of contact tip.
September 2014
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesLGA2011-3 Socket Overview
Figure 4.
Socket Standoffs
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow. The following diagram highlights each feature of the socket-processor
stack up.
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LGA2011-3 Socket OverviewIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Figure 5.
The cover remains on the socket during reflow to help prevent contamination during
reflow. The cover can withstand 260C for 40 seconds (typical reflow/rework profile)
and the environmental conditions listed in the TMSDG.
September 2014
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesLGA2011-3 Socket Overview
The following figure diagrams the PnP and socket assembly. To reduce risk of damage
to socket contacts the pick and place (PnP) cover remains on the socket during ILM
installation.
Figure 7.
Once the ILM with its cover is installed Intel is recommending the PnP cover be
removed to help prevent damage to the socket contacts. To reduce the risk of bent
contacts the PnP Cover and ILM Cover were designed to not be compatible. Covers
can be removed without tools.
The pick and place covers are designed to be interchangeable between socket
suppliers.
2.2
September 2014
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LGA2011-3 Socket OverviewIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Note:
There is no round-off (conversion) error between socket pitch (1.016 mm) and board
pitch (40 mil) as these values are equivalent.
Figure 8.
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesLGA2011-3 Socket Overview
Table 3.
Color
Quantity
RED Pins
43
123
17 mil MD / C17
GREY Pins
1845
Notes: 1. RED Pins: Corner nCTF pads (43 total) are all designed as 20 X 17 mil oblong partially
soldermask defined pads with an SRO of 17 1 mil (shown below). The long axis of the pad is
oriented at 45 from the center of the socket. All nCTF pads require thick traces ideally oriented
at 45 toward the package corner.
2. LIGHT BLUE Pins: Edge CTF pads (total) are all designed as 20 X 17 mil oblong partially
soldermask defined pads with an SRO of 17 1 mil (shown below). The long axis of the pad is
oriented at 90 to the socket edge.
3. GREY Pins: Critical to function pins are all designed as 17 mil circular MD (Metal Defined) pads.
September 2014
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LGA2011-3 Socket OverviewIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Figure 9.
Notes:
1.
2.
The solder paste stencil aperture recommendation for Socket R (LGA2011) is: 24
mil circular aperture opening with a stencil thickness of 5 mils.
2.3
September 2014
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Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesLGA2011-3 Socket Overview
2.3.1
Table 4.
Parameter
Load Limits,
SI Units
Min
Max
Load Limits,
Imperial Units
Min
Definition
Max
Static Compressive
per Contact
15 (gf)
38 (gf)
0.53
(ozf)
1.34 (ozf)
Static Compressive
(ILM)
445 (N)
712 (N)
100 (lbf)
160 (lbf)
Static Compressive
Beginning of Life
(HS)
222 (N)
400 (N)
50 (lbf)
90 (lbf)
Static Compressive
End of Life
(HS)
178 (N)
400 (N)
40 (lbf)
90 (lbf)
Static Total
Compressive
667 (N)
1068 (N )
150 (lbf)
240 (lbf)
Dynamic
Compressive
NA
588 (N)
NA
132 (lbf)
Board Transient
Bend Strain
NA
500 (ue)
for 62
(mil);
400 (ue)
for 100
(mil)
NA
500 (ue)
for 62
(mil);
400 (ue)
for 100
(mil)
2.4
September 2014
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LGA2011-3 Socket OverviewIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
The specific via used for temperature measurement is located on the bottom of
the motherboard between pins BC1 and BE1.
Drill a hole through the back plate corresponding to the location of pins BC1 and
BE1.
2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into
the specific measurement via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature
Figure 10.
2.5
Note:
When the ILM is attached to the board, the boundary conditions change and the BFI
strain limits are not applicable. The ILM, by design, increases stiffness in and around
the socket and places the solder joints in compression. Intel does not support strain
metrology with the ILM assembled.
September 2014
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3.0
Figure 11.
Processor Stack
The ILM is physically separate from the socket body. The assembly of the ILM is
expected to occur after attaching the socket to the board. The exact assembly location
is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the
socket. Intel performs detailed studies on integration of processor package, socket
and ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be "built to print" from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
September 2014
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The ILM has two critical functions: evenly deliver and distribute the force to seat the
processor onto the socket contacts and ultimately through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and
package.
Socket LGA2011-3 has two POR (Plan of Record) ILMs:
3.1
1.
Square ILM - This ILM has 80x80mm heatsink mounting hole pattern.
2.
Narrow ILM - This ILM has 56x94mm heatsink mounting hole pattern.
Table 5.
Maximum
Minimum
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Table 7.
3.2
Table 8.
Square ILM
93x93 mm (3.6x3.7in)
3.3
Narrow ILM
80x107.5 mm (3.15x4.2in)
3.4
September 2014
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Ensuring that thermal performance of the TIM applied between the IHS and the
heatsink is achievable. TIMs, especially those based on phase change materials,
are very sensitive to applied pressure: the higher the pressure, the better the
initial performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Designs should consider the impact of shock and vibration events on
TIM performance as well as possible decrease in applied pressure over time due to
potential structural relaxation in enabled components.
The load applied by the attachment mechanism and the heatsink must comply
with the package specifications, along with the dynamic load added by the
mechanical shock and vibration requirements of the package and socket.
Load induced onto the package and socket by the ILM may be influenced with
heatsink installed. Determining the performance for any thermal/mechanical
solution is the responsibility of the customer.
3.5
ILM Features
The ILM is defined by four basic features
1. ILM Loadplate: Formed sheet metal that when closed applies four point loads onto
the IHS seating the processor into the socket
2. ILM Frame: Single piece or assembly that mounts to PCB board and provides the
hinge locations for the levers the ILM frame also contains captive mounts for
heatsink attach. An insulator is pre applied by the vendor to the bottom side of
the ILM frame.
3.
ILM Actuation levers: Formed loading levers designed to place equal force on both
ends of the ILM load plate. Some of the load is passed through the socket body to
the board inducing a slight compression on the solder joints
4. ILM Backplate: A flat steel back plate with threaded studs to attach to the ILM
frame. A clearance hole is located at the center of the plate to allow access to test
points and backside capacitors. Two additional cut-outs on the backplate provide
clearance for backside voltage regulator components. An insulator is pre applied
by the vendor to the side with the threaded studs.
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Heatsink mounting studs on ILM frame allow for topside thermal solution attach to a
rigid structure. This eliminates the motherboard thickness dependency from the
heatsink mechanical stackup. ILM assembly provides a clamping force between the
ILM frame, backplate and board, resulting in reduced board bending leading to higher
solder joint reliability. ILM lever design provides an interlocking mechanism to ensure
proper opening or closing sequence for the operator. This has been implemented in
both square and narrow ILM.
ILM Load Plate Design
Four point loading contributes to minimizing package and socket warpage under non
uniformly distributed load. The reaction force from closing the load plate is transmitted
to the frame and through the captive fasteners to the back plate. Some of the load is
passed through the socket body to the board inducing a slight compression on the
solder joints. The load plate design is common between the two POR ILMS and is
shown in the figure below.
Figure 12.
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Figure 13.
ILM Backplate
3.6
Intel has designed and validated two ILMs compatible with Socket LGA2011-3 :
1. Square ILM - 80x80 mm heat sink mounting hole pattern.
2. Narrow ILM - 56x94 mm heat sink mounting hole pattern.
The two POR ILMs share most components, only the top plate and active lever differ
between the two assemblies.
3.6.1
Square ILM
The square ILM consists of two sub assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate. The
square ILM assembly consists of several pieces as shown and labeled in the following
diagram. The hinge lever, active lever, load plate, top plate,clevises, and the captive
fasteners. For clarity the ILM cover is not shown in this view.
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Figure 14.
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Figure 15.
Table 9.
Thickness
Material
ILM Frame
1.20 mm
1.50 mm
2.20 mm
The square ILM supports the legacy 80x80 mm heat sink mounting patterns used in
some form factors.
3.6.2
Narrow ILM
The narrow ILM consists of two sub assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate. The
ILM assembly is shown in the following figure.
September 2014
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Figure 16.
The narrow ILM assembly consists of several pieces as shown and labeled above. The
hinge lever, active lever, load plate, top plate, clevises, ILM cover, and the captive
fasteners. For clarity the ILM cover is not shown in this view. An assembled view is
shown in the following figure. The Narrow ILM maintains the structure and function of
the square ILM but utilizes separate clevises riveted onto the ILM frame.
September 2014
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Figure 17.
Table 10.
Thickness
Material
ILM Frame
1.50 mm
ILM Clevis
0.80 mm
1.50 mm
2.20 mm
The narrow ILM supports a smaller east west dimension constraint conducive for use
in space constrained form factors.
3.7
ILM Cover
Intel has developed a cover that will snap on to the ILM for the LGA2011 socket
family.
The ILM cover is intended to reduce the potential for socket contact damage from the
operator / customer fingers being close to the socket contacts to remove or install the
pick and place cover. By design the ILM cover and pick and place covers can not be
installed simultaneously. This cover is intended to be used in place of the pick and
place cover once the ILM is assembled to the board. The ILM will be offered with the
ILM cover pre assembled as well as a discrete part.
September 2014
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Figure 18.
Note:
ILM cover
Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as
a discrete component.
The ILM cover will pop off if a processor is installed in the socket.
The ILM cover for the LGA2011-3 socket will have a flammability rating of V-0 per
UL 60950-1.
Intel recommends removing the Pick and Place cover (PnP) of the socket body in
manufacturing as soon as possible at the time when ILM is being installed.
ILM Cover Attach/Removal Force
The required force to remove the ILM cover shall not exceed 7.6 N when the load is
applied by finger at the center of cover.
3.8
September 2014
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Processor Thermal Specifications and FeaturesIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
4.0
4.1
4.1.1
Processor stores the intercept and slope terms (TLA and PA) from the DTS
Thermal Profile for that particular SKU (one-time read only)
September 2014
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Figure 19.
DTS 2.0 processor Margin values can be obtained via PECI or Processor register see
documentation below as well as Intel Xeon Processor E5-1600 and E5-2600 v3
Product Families, Volume 2 of 2, Registers Datasheet and Intel Xeon Processor
E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet
Table 11.
Service
Thermal Margin
Index
Value
(IV)
(decimal)
10
Parameter
Value
(word)
0x0000
RdPkgConfig()
Data
(dword)
15:0--Package
Temperature
margin in 8.8
format, 32:16-Reserved
WrPkgConfi
g()
Data
(dword)
N/A
Description
Package temperature
margin with regards to
DTS Thermal Profile.
Positive indicates
thermal margin, and
package is less than DTS
thermal profile
Note: Refer to Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and
Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for further
details
September 2014
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Processor Thermal Specifications and FeaturesIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
Table 12.
Bus:1
Device:30
Bit
Attr
Function:0
Default
Offset:E0
Description
31:16
RSVD-P
0000h
Reserved--Protected
15:0
R0-V
0000h
Note:
Refer to Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families, Volume 2 of 2, Registers Datasheet and
Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet for full
documentation of registers and field descriptions
4.2
4.2.1
4.3
4.3.1
Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain between the minimum and maximum case temperature
(TCASE) specifications as defined in the tables in the following sub-sections. Thermal
solutions that do not provide sufficient thermal cooling may affect the long-term
reliability of the processor and system.
September 2014
Order No.: 330786-001
4.3.2
September 2014
Order No.: 330786-001
Processor Thermal Specifications and FeaturesIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
Figure 20.
4.3.3
Table 13.
Intel Xeon Processor E5-1600 and E5-2600 v3 Product Families Stack Tcase
and DTS Thermal Profiles and Correction Factors
Category
Processor
Number
Package Form
Factor (die)
TDP (W)
Core Count
Assumed Heatsink
Form Factor
C1E
Disable Offset (C)
Tcontrol
E5-2690 v3
Small
(MCC)
135
12
1U
Square
18
TC=[0.235*P]
+58.2
TDTS=[0.299
*P]+58.2
100
E5-2680 v3
Small
(MCC)
120
12
1U
Square
10
TC=[0.235*P]
+56.3
TDTS=[0.311
*P]+56.3
95
E5-2670 v3
Small
(MCC)
120
12
1U
Square
10
TC=[0.235*P]
+56.3
TDTS=[0.310
*P]+56.3
95
E5-2660 v3
Small
(MCC)
105
10
1U
Square
10
TC=[0.236*P]
+54.2
TDTS=[0.329
*P]+54.2
90
E5-2650 v3
Small
(MCC)
105
10
1U
Square
10
TC=[0.235*P]
+54.2
TDTS=[0.324
*P]+54.2
90
E5-2640 v3
Small
(LCC)
90
1U
Square
10
TC=[0.246*P]
+52.2
TDTS=[0.363
*P]+52.2
86
E5-2630 v3
Small
(LCC)
85
1U
Square
10
TC=[0.243*P]
+51.4
TDTS=[0.392
*P]+51.4
86
E5-2620 v3
Small
(LCC)
85
1U
Square
10
TC=[0.248*P]
+51.5
TDTS=[0.371
*P]+51.5
85
Standard
Advanced
Thermal Profiles
T CASE
(C)
DTS
(C)
DTS max
at TDP
Note: 5
continued...
September 2014
Order No.: 330786-001
Category
Processor
Number
Package Form
Factor (die)
TDP (W)
Core Count
Assumed Heatsink
Form Factor
C1E
Disable Offset (C)
Tcontrol
Basic
Small
(MCC)
85
1U
Square
10
TC=[0.231*P]
+51.3
TDTS=[0.325
*P]+51.3
80
E5-2603 v3
Small
(LCC)
85
1U
Square
10
TC=[0.250*P]
+51.5
TDTS=[0.353
*P]+51.5
83
E5-2699 v3
Large
(HCC)
145
18
2U
Square
18
TC=[0.175*P ]
+51.0
TDTS=[0.243
*P]+51.0
88
E5-2698 v3
Large
(HCC)
135
16
1U
Square
18
TC=[0.221*P]+
58.2
TDTS=[0.277
*P]+58.2
97
E5-2697 v3
Large
(HCC)
145
14
2U
Square
18
TC=[0.177*P]
+51.0
TDTS=[0.276
*P]+51.0
93
E5-2695 v3
Large
(HCC)
120
14
1U
Square
10
TC=[0.221*P]+
56.1
TDTS=[0.314
*P]+56.1
95
E5-2683 v3
Large
(HCC)
120
14
1U
Square
10
TC=[0.220*P]
+56.1
TDTS=[0.285
*P]+56.1
92
E5-2685 v3
Small
(MCC)
120
12
1U
Square
10
TC=[0.235*P]
+56.3
TDTS=[0.304
*P]+56.3
94
E5-2667 v3
Small
(LCC)
135
2U
Square
18
TC=[0.202*P]
+50.5
TDTS=[0.336
*P]+50.5
97
E5-2643 v3
Small
(LCC)
135
2U
Square
18
TC=[0.205*P]
+49.6
TDTS=[0.369
*P]+49.6
101
E5-2637 v3
Small
(LCC)
135
2U
Square
18
TC=[0.205*P]
+48.9
TDTS=[0.402
*P]+48.9
105
E5-2623 v3
Small
(LCC)
105
1U Square
10
TC=[0.250*P]
+53.9
TDTS=[0.433
*P]+53.9
101
Workstation Only
E5-2687W
v3
Small
(MCC)
160
10
WS
Passive
Tower
10
TC=[0.190*P]
+44.3
TDTS=
[0.299*P]
+44.3
94
E5-2650L
v3
Small
(MCC)
65
12
1U Square
10
TC=[0.232*P]
+48.5
TDTS=[0.320
*P]+48.5
71
E5-2630L
v3
Small
55
1U Square
10
TC=[0.240*P]
+47.2
TDTS=[0.372
*P]+47.2
69
Frequency Optimized
Segment Optimized
E5-2609 v3
Low Power
Thermal Profiles
Note: 3
T CASE
(C)
DTS
(C)
DTS max
at TDP
Note: 5
continued...
September 2014
Order No.: 330786-001
Tcontrol
C1E
Disable Offset (C)
Assumed Heatsink
Form Factor
Core Count
TDP (W)
Package Form
Factor (die)
Processor
Number
Category
Processor Thermal Specifications and FeaturesIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
Thermal Profiles
T CASE
(C)
DTS
(C)
DTS max
at TDP
Note: 5
(LCC)
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the
processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power
may exceed TDP for short durations. Please see Intel Turbo Boost Technology on page 49
3. This SKU is intended for dual processor workstations only and uses workstation specific use conditions for reliability
assumptions.
4. Disabling C1E will result in an automatic reduction of DTSmax so that reliability is still protected. DTSmax will be
reduced by the value shown 'C1E Disable Offset. If thermal design has not been optimized to the reduced DTSmax
value, throttling may result. Tcontrol is already an offset to DTSmax, therefore the absolute temp at which the
Tcontrol threshold is reached will shift by the same amount.
5. DTS max at TDP is 2C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal
design power and is installed in a system using microcode update 0x25 or later.
6. Tcase Minimum is 0C
Table 14.
Tcontrol
Small
(LCC)
140
WS Active
Tower
10
T C=[0.175*P]+
41.7
TDTS = [0.321*P]
+ 41.7
88
E5-1660 v3
Small
(LCC)
140
WS Active
Tower
10
TC=[0.173*P]+
41.7
TDTS = [0.352*P]
+ 41.7
92
E5-1650 v3
Small
(LCC)
140
WS Active
Tower
10
TC=[0.178*P]+
41.8
TDTS = [0.364*P]
+ 41.8
94
E5-1630 v3
Small
(LCC)
140
WS Active
Tower
10
TC=[0.177*P]+
41.4
TDTS = [0.428*P]
+ 41.4
103
E5-1620 v3
Small
(LCC)
140
WS Active
Tower
10
TC=[0.177*P]+
41.4
TDTS = [0.428*P]
+ 41.4
103
E5-1607 v3
Small
(LCC)
140
WS Active
Tower
10
TC=[0.176*P]
+41.4
TDTS=[0.423*P]
+41.4
102
E5-1603 v3
Small
140
WS Active
Tower
10
TC=[0.181*P]
+41.8
TDTS=[0.336*P]
+41.8
90
Package Form
Factor (Die SIze)
E5-1680 v3
Processor Number
Assumed Heatsink
Form Factor
DTS
max at
TDP
Core Count
Thermal Profiles
TDP (W)
1S Workstation
Category
4.3.4
TCASE
(C)
DTS
(C)
Note: 5
continued...
September 2014
Order No.: 330786-001
Tcontrol
Assumed Heatsink
Form Factor
Core Count
TDP (W)
Package Form
Factor (Die SIze)
Processor Number
Category
Thermal Profiles
TCASE
(C)
DTS
max at
TDP
DTS
(C)
Note: 5
(LCC)
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the
processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design. Processor power
may exceed TDP for short durations. Please see Intel Turbo Boost Technology on page 49
3. This SKU is intended for single processor workstations only and uses workstation specific use conditions for
reliability assumptions.
4. Minimum Tcase Specification is 0C
5. DTS max at TDP is 2C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal
design power and is installed in a system using microcode update 0x25 or later.
4.3.5
Tcontrol
TDP (W)
C1E Disable
Offset (C)
DTS Thermal
Profile
Small
TCASE
Thermal
Profile
105
12
18
TC =[0.190 *
P] + 52.0
TC =[0.190
* P] +
67.0
TDTS =
[0.257 *
P] + 52.0
80
TDTS =
[0.257 * P]
+ 67.0
95
Small
Core Count
75
12
24
TC = [0.267 *
P] + 52.0
TC =
[0.267 * P]
+ 67.0
TDTS =
[0.350 *
P] + 52.0
80
TDTS =
[0.350 * P]
+ 67.0
95
Small
Processor Number
E5-2658 v3
E5-2628L v3
Standard
E5-2648L v3
Advanced
Category
Table 15.
75
10
24
TC = [0.267 *
P] + 52.0
TC =
[0.267 * P]
+ 67.0
TDTS =
[0.352 *
P] + 52.0
80
TDTS
=[0.352 *
P] + 67.0
95
TCASE
(C)
(Nominal)
TCASE
(C)
(Short
Term)
TDTS
(C)
(Nominal
)
DTS
max at
TDP
(nomi
nal)
TDTS (C)
(Short
Term)
Note: 7
DTS
max at
TDP
(Short
Term)
Note: 7
continued...
September 2014
Order No.: 330786-001
Tcontrol
C1E Disable
Offset (C)
TDP (W)
Core Count
DTS Thermal
Profile
Small
TCASE
Thermal
Profile
75
18
TC = [0.267 *
P] + 52.0
TC =
[0.267 * P]
+ 67.0
TDTS =
[0.379 *
P] + 52.0
82
TDTS =
[0.379 * P]
+ 67.0
97
Small
Processor Number
E5-2608L v3
Basic
E5-2618L v3
Category
Processor Thermal Specifications and FeaturesIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
52
18
TC = [0.404 *
P] + 52.0
TC =
[0.404 * P]
+ 67.0
TDTS
=[0.520 *
P] + 52.0
81
TDTS
=[0.520 *
P] + 67.0
96
TCASE
(C)
(Nominal)
TCASE
(C)
(Short
Term)
TDTS
(C)
(Nominal
)
DTS
max at
TDP
(nomi
nal)
TDTS (C)
(Short
Term)
Note: 7
DTS
max at
TDP
(Short
Term)
Note: 7
Notes: 1. These values are specified at VccIN_MAX for all processor frequencies. Systems must be designed to ensure the
processor is not subjected to any static Vcc and Icc combination wherein VccIN exceeds VccIN_MAX at a specified
Icc. Please refer to the electrical loadline specifications.
2. Thermal Design Power (TDP) should be used as a target for processor thermal solution design at maximum TCASE.
Processor power may exceed TDP for short durations. Please see Intel Turbo Boost Technology on page 49.
3. Power specifications are defined at all VIDs found in the Intel Xeon Processor E5-1600 and E5-2600 v3 Product
Families, Volume 2 of 2, Registers Datasheet and Intel Xeon Processor E5-1600 and E5-2600 v3 Product
Families, Volume 1 of 2, Electrical Datasheet . Processors may be delivered under multiple VIDs for each frequency.
4. The Nominal Thermal Profile must be used for all normal operating conditions or for products that do not require
NEBS Level 3 compliance.
5. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances per year,
as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durations exceeding 360 hours
per year violate the processor thermal specifications and may result in permanent damage to the processor.
6. Minimum T case Specification is 0C
7. DTS max at TDP is 2C greater than DTS thermal profile at TDP, but applies only when part is operating at thermal
design power and is installed in a system using microcode update 0x25 or later.
4.3.6
Thermal Metrology
The minimum and maximum case temperatures (TCASE) specified are measured at the
geometric top center of the processor integrated heat spreader (IHS). The following
figures illustrate the location where TCASE temperature measurements should be
made. The figures also include geometry guidance for modifying the IHS to accept a
thermocouple probe.
September 2014
Order No.: 330786-001
Figure 21.
0.790 0.150
0.380 0.030
1.020 0.250
A
Package Center
DETAIL A
26.250
0.381 0.038
0.510 0.080
SECTION B
B
Pin 1 Indicator
25.500
Note:
September 2014
Order No.: 330786-001
Processor Thermal Specifications and FeaturesIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
Figure 22.
0.790 0.150
0.380 0.030
1.020 0.250
25.230
PACKAGE CENTER
DETAIL A
0.381 0.038
0.510 0.080
PIN 1 INDICATOR
SECTION B
22.500
Note:
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
5.0
5.1
Figure 23.
AirflowDirection
Another approach is the "spread core" layout, where neither processor is "shadowed"
by the other, as shown below.
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Figure 24.
Table 16.
Board
Layout 2
Heatsink
Form
Factor 3
Heatsink
Description
Airflow4
(CFM) / RPM
P 4
(in H20)
CA_TTV
(C/W)5
70W
80W
85W
105W
120W
135W
140W
145W
160W
System1
1U
Spread
core,
24
DIMMs
70 x 106 x
25.5mm
(Narrow)
[STS200PNR]
Copper
base
Aluminum
fin
(Passive)
10.2
0.233
0.256
41.5
41.5
41.5
41.5
41.5
41.5
N/A
N/A
N/A
1U
SSI
EEB,
16
DIMMs
91.5 x 91.5 x
25.5mm
(Square)
[STS200P]
Copper
base
Aluminum
fin
(Passive)
15.2
0.382
0.250
47.4
48.6
49.1
51.4
53.1
54.8
N/A
N/A
N/A
2U
SSI
EEB,
16
DIMMs
91.5 x 91.5 x
64mm
(Square)
[STS200C]
Copper
base
Aluminum
fin with
Heatpipe
(Passive)
26.0
0.138
0.201
42.8
43.5
43.9
45.3
46.4
47.5
47.9
48.2
N/A
WS
SSI
EEB,
16
DIMMs
100 x 70 x
123.2mm
(Tower)
Copper
base
Aluminum
fin with
Heatpipe
(Active)
2600
RPM
Not
meaningful
for Active
Heatsink
0.197
38.2
38.5
38.7
39.3
39.7
40.1
40.3
40.5
40.9
Note:
1. 1U = 1.75" which is the outside-to-outside dimension of the server enclosure.
2. SSI Specification is found at https://ssiforum.org/.
continued...
September 2014
Order No.: 330786-001
160W
145W
140W
135W
120W
105W
85W
80W
CA_TTV
(C/W)5
P 4
(in H20)
Airflow4
(CFM) / RPM
Heatsink
Description
Heatsink
Form
Factor 3
Board
Layout 2
System1
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
3. Refer to Intel Reference Design Heat Sink on page 54. Dimensions of heat sink do not include socket or processor.
4. Airflow through the heat sink fins with zero bypass. Max target for pressure drop (P) measured in inches H2O.
5. Mean + 3 performance for a heat sink on top of the Thermal Test Vehicle (TTV). These estimates are not necessarily the
thermal performance targets needed to meet processor thermal specifications. Includes thermal performance of Honeywell*
PCM45F.
6. System ambient TSA = 35C. Increase in air temperature inside the chassis (from the front grill to the downstream, or
shadowed, processor heatsink). Includes preheat from hard drives, VRs, front processor, etc. as shown below.
5.2
The area of the surface on which the heat transfer takes place - Without any
enhancements, this is the surface of the processor package IHS. One method used
to improve thermal performance is to attach a heatsink to the IHS. A heatsink can
increase the effective heat transfer surface area by conducting heat out of the IHS
and into the surrounding air through fins attached to the heatsink base.
The conduction path from the heat source to the heatsink fins - Providing a direct
conduction path from the heat source to the heatsink fins and selecting materials
with higher thermal conductivity typically improves heatsink performance. The
length, thickness, and conductivity of the conduction path from the heat source to
the fins directly impact the thermal performance of the heatsink. In particular, the
quality of the contact between the package IHS and the heatsink base has a
higher impact on the overall thermal solution performance as processor cooling
requirements become strict. Thermal interface material (TIM) is used to fill in the
gap between the IHS and the bottom surface of the heatsink, and thereby
improves the overall performance of the thermal stackup (IHS-TIM-Heatsink).
With extremely poor heatsink interface flatness or roughness, TIM may not
adequately fill the gap. The TIM thermal performance depends on its thermal
conductivity as well as the pressure load applied to it.
The heat transfer conditions on the surface upon which heat transfer takes place Convective heat transfer occurs between the airflow and the surface exposed to
the flow. It is characterized by the local ambient temperature of the air, TLA, and
the local air velocity over the surface. The higher the air velocity over the surface,
the more efficient the resulting cooling. The nature of the airflow can also enhance
heat transfer via convection. Turbulent flow can provide improvement over
laminar flow. In the case of a heatsink, the surface exposed to the flow includes
the fin faces and the heatsink base.
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
An active heatsink typically incorporates a fan that helps manage the airflow through
the heatsink.
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis.
Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are
typically larger (and heavier) than active heatsinks due to the increase in fin surface
necessary to meet a required performance. As the heatsink fin density (the number of
fins in a given cross-section) increases, the resistance to the airflow increases; it is
more likely that the air will travel around the heatsink instead of through it, unless air
bypass is carefully managed. Using air-ducting techniques to manage bypass area is
an effective method for maximizing airflow through the heatsink fins.
5.3
5.3.1
Please note that although the processor can exceed PL1 (default TDP) for a certain
amount of time, the exponential weighted moving average (EWMA) power will never
exceed PL1.
A properly designed processor thermal solution is important to maximizing Turbo
Boost performance. However, heatsink performance (thermal resistance, CA) is only
one of several factors that can impact the amount of benefit. Other factors are
operating environment, workload and system design. With Turbo Mode enabled, the
processor may run more consistently at higher power levels, and be more likely to
operate above TCONTROL, as compared to when Turbo Mode is disabled. This may result
in higher acoustics.
5.3.2
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
more typical thermal excursions, Thermal Monitor is expected to control the processor
power level as long as conditions do not allow the processor to exceed the
temperature at which Thermal Control Circuit (TCC) activation initially occurred.
Under more severe anomalous thermal excursions when the processor temperature
cannot be controlled at or below thermal profile by TCC activation, then data integrity
is not assured. At some higher thresholds, THERMTRIP_N will enable a shut down in
an attempt to prevent permanent damage to the processor.
A designer can check anomalous power ratio of an individual part by reading register
PWR_LIMIT_MISC_INFO and dividing the value of PN_POWER_OF_SKU by the sku
TDP. Please refer to Intel Xeon Processor E5-1600 and E5-2600 v3 Product
Families, Volume 2 of 2, Registers Datasheet and Intel Xeon Processor E5-1600
and E5-2600 v3 Product Families, Volume 1 of 2, Electrical Datasheet
5.3.3
CA
CA
) is defined by:
Where:
T
CASE
LA
= Local ambient temperature before the air enters the processor heatsink (C)
TDP = TDP (W) assumes all power dissipates through the integrated heat spreader.
This inexact assumption is convenient for heatsink design.
CA = CS + SA
Where:
CS = Thermal characterization parameter of the TIM (C/W) is dependent on the
thermal conductivity and thickness of the TIM.
SA = Thermal characterization parameter from heatsink-to-local ambient (C/W) is
dependent on the thermal conductivity and geometry of the heatsink and dependent
on the air velocity through the heatsink fins.
The following figure illustrates the thermal characterization parameters.
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Figure 25.
5.4
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
5.5
5.5.1
Table 17.
4.678 (+0.367)/(-0.231mm )
6.5810.289
8.4810.279
Notes: 1. Tolerance Stackus are a Root Sum of Squares (RSS) of all components in stack calculation using
mother board surface as the reference point
2. Intel Xeon processor E5-1600 and E5-2600 v3 product families Stackup targets are inclusive
of all package sizes (large and small)
3. All packages are compatible with reference retention solutions and will meet mechanical
specifications
Figure 26.
Note:
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
The table below provides the available surface dimensions for cooling the processor
when fully seated in LGA2011-3 socket. This value is the X and Y dimensions for the
flat top of the IHS.
Table 18.
Large package
Small package
Figure 27.
5.5.2
Table 19.
Min
Max
Notes
1,2
1,4,5
Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the
processor top surface (IHS).
2. This is the minimum and maximum static force that can be applied by the heatsink retention to
the processor top surface (IHS).
3. This specification prevents excessive baseboard deflection during dynamic events.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
5. An experimentally validated test condition used a heatsink mass of 1.32 lbm (600g) with 25 G
acceleration measured on a shock table with a dynamic amplification factor of 3. This
specification can have flexibility in specific values, but the ultimate product of mass times
acceleration should not exceed this validated dynamic load (1.32 lbm x 25 G x 3= 100 lbf).
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
5.6
Ensuring thermal performance of the TIM applied between the IHS and the
heatsink. TIMs, especially those based on phase change materials, are very
sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Designs should consider the possible decrease in applied pressure over
time due to potential structural relaxation in enabled components.
Ensuring system electrical, thermal, and structural integrity under shock and
vibration events, particularly the socket solder joints. The mechanical
requirements of the attachment mechanism depend on the weight of the heatsink
and the level of shock and vibration that the system must support. The overall
structural design of the baseboard and system must be considered when designing
the heatsink attachment mechanism. Their design should provide a means for
protecting socket solder joints, as well as preventing package pullout from the
socket.
Please note that the load applied by the attachment mechanism must comply with the
processor mechanical specifications, along with the dynamic load added by the
mechanical shock and vibration requirements, as discussed in Package Loading
Specifications on page 62.
A potential mechanical solution for heavy heatsinks is the use of a supporting
mechanism such as a backer plate or the utilization of a direct attachment of the
heatsink to the chassis pan. In these cases, the strength of the supporting component
can be utilized rather than solely relying on the baseboard strength. In addition to the
general guidelines given above, contact with the baseboard surfaces should be
minimized during installation in order to avoid any damage to the baseboard.
5.7
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
Figure 28.
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
Figure 30.
5.7.1
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
5.7.2
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
5.7.3
September 2014
Order No.: 330786-001
Processor Thermal SolutionsIntel Xeon Processor E5-1600 and E5-2600 v3 Product Families
5.7.4
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesProcessor Thermal Solutions
5.7.5
5.7.6
September 2014
Order No.: 330786-001
6.0
2.
3.
4.
Package substrate
5.
Capacitors
Figure 31.
Notes:
Socket and baseboard are included for reference and are not part of processor
package.
Processor package land count may be greater than socket contact count
6.1
Package Size
The processor has two different form factors Small and Large. Both form factors are
compatible with socket 2011-3 (R3) and the reference ILMs. Size of IHS and
dimensions of package substrate vary between the two form factors. For detailed
drawings see Mechanical Drawings on page 77. For Sku specific identification of
package for factors see Processor Thermal Specifications on page 37. All Low Core
Count (LCC) and Mid Core Count (MCC) SKUs are Intel Xeon processor E5-1600
and E5-2600 v3 product families Small form factor. All High Core Count (HCC) SKUs
are Intel Xeon processor E5-1600 and E5-2600 v3 product families Large form
factor.
Substrate X-Y geometries for each package are:
September 2014
Order No.: 330786-001
Intel Xeon processor E5-1600 and E5-2600 v3 product families Small: 52.5mm
x 45mm
Intel Xeon processor E5-1600 and E5-2600 v3 product families Large: 52.5mm
x 51mm
Figure 32.
Figure 33.
6.2
September 2014
Order No.: 330786-001
Table 20.
Maximum
Dynamic Load
Notes:
6.3
Notes
These specifications apply to uniform compressive loading in a direction normal to the processor
IHS.
See Socket Loading Specifications on page 22 for minimum socket load to engage processor
within socket.
6.4
Processor Materials
The table below lists some of the package components and associated materials.
Table 21.
Processor Materials
Component
6.5
Material
Substrate
Substrate lands
Processor Markings
Labeling locations and information are shown for Intel Xeon processor v3 product
families Small and Large packages in the diagrams below.
September 2014
Order No.: 330786-001
Figure 34.
September 2014
Order No.: 330786-001
Figure 35.
6.6
Table 22.
Maximum Recommended
Shear
Tensile
Torque
September 2014
Order No.: 330786-001
7.0
7.1
7.1.1
7.1.2
September 2014
Order No.: 330786-001
Figure 36.
7.1.3
Figure 37.
7.1.4
September 2014
Order No.: 330786-001
7.2
7.3
Mechanical Specifications
Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones
The boxed heat sink (thermal solution) is sold separately from the boxed processor.
Clearance is required around the thermal solution to ensure unimpeded airflow for
proper cooling. Baseboard keepout zones are shown in Mechanical Drawings on page
77 which detail the physical space requirements for each of the boxed heat sinks.
None of the heat sink solutions exceed a mass of 550 grams. See Package Loading
Specifications on page 62 for processor loading specifications.
Boxed Heat Sink Support with ILM
Baseboards designed for Intel Xeon processor E5-1600 and E5-2600 v3 product
families processors should include holes that are aligned with the ILM. Please refer to
Independent Loading Mechanism (ILM) Specifications on page 24 chapter for more
information.
Boxed heat sinks will require a #2 Phillips screwdriver to attach to the ILM. The
screws should be tightened until they no longer turn easily. This is approximately 8
inch-pounds [0.90 N-m]. Exceeding this recommendation may damage the screw or
other components.
Please refer the Grantley Manufacturing Advantage Service Document.
September 2014
Order No.: 330786-001
7.4
Min
Frequency
21,000
Nominal
Frequency
Max
Frequency
25,000
Min
Typical
Steady
28,000
Max
Steady
Unit
Hz
Max
Startup
Unit
10.8
12
12
13.2
N/A
1.25
1.5
2.2
Pulses per
fan revolution
September 2014
Order No.: 330786-001
Figure 38.
Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution
Pin Number
7.5
Signal
Color
Ground
Black
Power: (+12 V)
Yellow
Green
Control: 21 - 28 KHz
Blue
September 2014
Order No.: 330786-001
Quality Reliability and Ecological RequirementsIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
8.0
8.1
Use Conditions
Intel evaluates reliability performance based on the use conditions (operating
environment) of the end product by using acceleration models.
The use condition environment definitions provided in the tables below are based on
speculative use condition assumptions, and are provided as examples only.
Based on the system enabling boundary condition, the solder ball temperature can
vary and needs to be comprehended for reliability assessment.
Use
Environment
Speculative
Stress
Condition
Example
Use
Condition
Temperature
Cycle
Use
Environment
Shipping
and
Handling
Example
7 yr.
Stress
Equivalent
Example
10 yr.
Stress
Equivalent
D T = 35 - 44C
(solder joint)
550-930 cycles
Temp Cycle
(-25C to 100C)
780-1345 cycles
Temp Cycle
(-25C to 100C)
THB/HAST
T = 25 -30C 85%RH
(ambient)
110-220 hrs
at 110C 85%RH
145-240 hrs
at 110C 85%RH
Bake
T = 95 - 105C
(contact)
Mechanical Shock
System-level
Unpackaged
Trapezoidal
25 g
velocity change is based on packaged weight
Product Weight (lbs)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
120
Example Use
Condition
Total of 12 drops
per system:
2 drops per
axis
direction
Random Vibration
System Level
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesQuality Reliability and
Ecological Requirements
Use
Environment
Handling
8.2
Unpackaged
5 Hz to 500 Hz
2.20 g RMS random
5 Hz @ 0.001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope
up)
20 Hz to 500 Hz @ 0.01 g2/Hz (flat)
Random control limit tolerance is 3 dB
Example Use
Condition
3 axes
8.2.1
8.2.2
2. Heatsink remains seated and its bottom remains mated flat against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible
tilt of the heatsink with respect to the retention hardware.
3.
4.
5.
6.
September 2014
Order No.: 330786-001
Quality Reliability and Ecological RequirementsIntel Xeon Processor E5-1600 and E5-2600
v3 Product Families
8.2.3
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors. Intel PC
Diags is an example of software that can be utilized for this test.
8.3
September 2014
Order No.: 330786-001
Intel Xeon Processor E5-1600 and E5-2600 v3 Product FamiliesQuality Reliability and
Ecological Requirements
Note:
RoHS implementation details are not fully defined and may change.
September 2014
Order No.: 330786-001
Item
Supplier PN
1U Square Heatsink
Assy with TIM
(91.5x91.5x25.5)
E89205-001
contact supplier
1U Narrow Heatsink
Assy with TIM
(70x106x25.5)
G16539-001
contact supplier
2U Active/Combo
Heatsink Assy w/TIM,
Fan Guard
E62452-004
contact supplier
G13624-001
Thermal Interface
Material (TIM)
N/A
Delta Supplier
Contact Info
Foxconn Supplier
Contact Info
Jason Tsai
Delta Products Corp
Portland, Oregon
jtsai@delta-corp.com
971-205-7074
Cary Huang
Foxconn Technology
Co, Inc.
2525 Brockton Dr.,
Suite 300
Austin, TX 78758
Phone: 512-670-2638
cary.huang@foxconn.c
om
FT1008-A
ITW Electronics
Business Asia Co., Ltd.
Chak Chakir
chak.chakir@itweba.co
m
512-989-7771
PCM45F
Honeywell
Judy Oles
judy.oles@honeywell.c
om
+1-509-252-8605
TC-5022
Dow Corning
Ed Benson
e.benson@dowcorning.
com
+1-617-803-6174
Customers can purchase the Intel LGA2011-3 sockets and reference LGA2011-3 ILMs
from the suppliers listed in the following table.
Table 24.
Item
Foxconn (Hon
Hai)
Tyco
Lotes
Amtek
Molex
LGA 2011-3
Socket POR
G64443-001
PE201127-435
5-01H
2201838-1
NA
NA
NA
LGA 2011-3
Square ILM
G63449-005
PT44L11-4711
2229339-2
AZIF0018P001C
ITLG63449001
105274-2000
LGA 2011-3
Narrow ILM
G43051-006
PT44L12-4711
2229339-1
AZIF0019P001C
ITLG43051002
105274-1000
LGA 2011-3
Backplate
E91834-001
PT44P41-4401
2134440-1
DCA-HSK-182T02
ITLE91834001
105142-7000
Eric Ling
Alex Yeh
Cathy Yang
Alvin Yap
Edmund Poh
Supplier
Contact Info
continued...
September 2014
Order No.: 330786-001
Item
Intel PN
Foxconn (Hon
Hai)
Tyco
Lotes
Amtek
Molex
eric.ling@foxco
nn.com
503-693-3509
x225
alex.yeh@te.co
m
Tel:
+886-2-21715
280
Cathy@lotes.co
m.cn
Tel:
+1-86-20-8468
6519
alvinyap@amte
k.com.cn
Tel
+(86)752-2634
562
Cathy Yu
cathy_yu@amt
ek.com.cn
Tel
+(86)752-2616
809
edmund.poh@mol
ex.com
Tel
+1-630-718-5416
September 2014
Order No.: 330786-001
September 2014
Order No.: 330786-001
B.1
Figure 39.
DWG. NO
SHT.
G57902
REV
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
NOTES:
(B )
1
(B )
3
SEE DETAIL
SYMBOL
B
B
B
B
FIDUCIAL
C
C
C
C
F
G
(B )
4
(B )
2
(C )
1
G
H
(C )
5
J
H
J
2
J
J
J
M
M
M
M
PIN 1
G
PIN 1
(C )
2
SECTION
(C )
3
B-B
FIDUCIAL
1
H
MILLIMETERS
52.5 0.07
51 0.07
45 0.3
45 0.1
4
1
47.5 0.1
1 C B
38.14 0.1
1 C A
49.2 0.1
49.9
3.181 0.202
5.081 0.208
50.24
43.18
25.12
21.59
0.881
1.016
0.508
0.231
0.125
E
j
j
0.2 C B-A
0.15 C G-B
0.553
0.104
3
4
0.13
0.875 0.04
0.574 0.04
60 $
2X M
2X M
0.245 C
0.125
0.203 C
SEE DETAIL
COMMENTS
2X M
IHS LID
IHS SEALANT
PACKAGE SUBSTRATE
F
F
SECTION
A-A
6X RM
TBD C
ALL LGA LANDS
0.021 SOLDER RESIST
DETAIL
SCALE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DRAWN BY
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS 0
CHECKED BY
ANGLES 0.5
DATE
DATE
MATERIAL
FINISH
TITLE
DATE
APPROVED BY
DEPARTMENT
DATE
DETAIL
2011X
SCALE 60
SIZE
A1
SCALE:
DRAWING NUMBER
G57902
REV
SHEET
OF
September 2014
Order No.: 330786-001
B.2
Figure 40.
DWG. NO
G57902
SHT.
REV
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
1
18.2
0.23 C E A
J
9.1
J
V
T
E
DETAIL
SCALE
12.8
6.4
T
C
1
0.23 C E A
M
E
SEE DETAIL
SEE DETAIL
SYMBOL
R
R
V
DETAIL
SCALE
MILLIMETERS
1.09
1.09
13
0.2
14
0.2
C
1.5 MAX ALLOWABLE
COMPONENT HEIGHT
COMMENTS
DEPARTMENT
R
September 2014
Order No.: 330786-001
SIZE
A1
SCALE:
DRAWING NUMBER
G57902
REV
SHEET
OF
B.3
Figure 41.
DWG. NO
G63360
SHT.
REV
NOTES:
1
2X C
SEE DETAIL
DF
DD
DB
CY
CV
CT
CP
CM
CK
CH
CF
CD
CB
BY
BV
BT
BP
BM
B
C
BK
BH
BF
BD
BB
AY
AV
AT
AP
AM
AK
42X
J
AH
AF
AD
AB
Y
85X
J
V
T
P
M
K
H
F
D
B
FIDUCIAL X3
TOP VIEW
(SOME DRAWING GEOMETRY
REMOVED FOR VISUAL CLARITY)
SEE DETAIL
SYMBOL
C
C
SECTION
A-A
C
G
0.245 C
0.203 C
0.125
0.125
IHS SEALANT
IHS LID
PACKAGE SUBSTRATE
J
J
F
F
MILLIMETERS
CN
CL
CJ
CG
CE
CC
CA
BW
BR
BN
BL
BJ
BE
BC
BA
AW
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
9 11 13 15 17 19 21 23 25 27 29 31
8 10 12 14 16 18 20 22 24 26 28 30 32
J
1 C E
1 C D
28.5 0.1
50.24
43.18
25.12
21.59
0.881
0.508
1.016
2X (M )
1
SYMBOL
M
M
M
M
6X R(M )
4
5
M
M
M
MILLIMETERS
0.231
0.553
COMMENTS
0.104
3
4
0.13
0.875 0.04
0.574 0.04
0.15 C E D
60 $
DETAIL B
SCALE 60
MILLIMETERS
PACKAGE A
PACKAGE B
3.181 0.202
3.101 # 0.186
5.081 0.194
5.001 # 0.177
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DRAWN BY
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS 0
CHECKED BY
ANGLES 0.5
APPROVED BY
MATERIAL
2X (M )
2
M
0.15 C E D
FIDUCIAL X2
BOTTOM VIEW
SEE NOTES
34 36 38 40 42 44 46 48 50 52 54 56 58
2X (M )
3
42.5 0.1
38.14 0.1
33 35 37 39 41 43 45 47 49 51 53 55 57
1
H
COMMENTS
AU
49.2 0.1
BG
45 0.07
F
DETAIL A
SCALE 12
BU
52.5 0.07
SYMBOL
CU
CR
57X
DC
DA
CW
PIN 1
B
DE
PIN 1
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
DEPARTMENT
DATE
DATE
TITLE
DATE
DATE
SIZE
A1
FINISH
SEE NOTES
SCALE:
DRAWING NUMBER
G63360
REV
SHEET
OF
September 2014
Order No.: 330786-001
B.4
Figure 42.
DWG. NO
G63360
SHT.
REV
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
(18.2 )
2X
(9.1 )
DF
DE
DD
DC
DB
DA
CY
CW
CV
CU
CT
CR
CP
CN
CM
CL
CK
CJ
CH
CG
CF
CE
CD
CC
CB
2X
CA
BY
BW
BV
BU
BT
BR
BP
BN
BM
BL
BK
BJ
BH
BG
BF
(12.8 )
BE
BD
BC
BB
BA
AY
(6.4 )
AW
AV
AU
AT
AR
2X
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
Y
V
T
P
M
K
H
F
D
B
AA
W
U
R
N
L
J
G
E
C
A
1
PIN #1
2X
9 11 13 15 17 19 21 23 25 27 29 31
8 10 12 14 16 18 20 22 24 26 28 30 32
SEE DETAIL
33 35 37 39 41 43 45 47 49 51 53 55 57
34 36 38 40 42 44 46 48 50 52 54 56 58
SEE DETAIL
SYMBOL
R
J b K
R
T
T
V
V
MILLIMETERS
1.09
1.09
13
0.2
14
0.2
COMMENTS
N
2
M b N
B
F
G
DETAIL D
2X
SCALE 8
DETAIL C
2X
SCALE 8
DEPARTMENT
R
September 2014
Order No.: 330786-001
SIZE
A1
SCALE:
DRAWING NUMBER
G63360
REV
SHEET
OF
B.5
.196
[4.98 ]
2.854
[72.5 ]
.920
[23.38 ]
.550
[13.98 ]
3.248
[82.5 ]
.880
[22.35 ]
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
NOTES:
DWG. NO
SHT.
REV
DESCRIPTION
DATE
9/30/11
APPR
E.B.
E.B.
E.B.
REV
E.B.
2/2/12
3/27/12
10/8/11
DIMENSIONS AND
FOR PROPER
TOLERANCES ASSOCIATED
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
DESCRIPTION
SCALE: 2:1
D KOZ_G63998_SKT-R3_BACKPLATE E
SHEET 1 OF 1
TITLE
PMCI
DEPARTMENT
PARTS LIST
9-27-11
DATE
9-27-11
E.B.
UPDATED NOTES
UPDATED KOZ
PART NUMBER
E.BUDDRIUS
SEE NOTES
5/1/13
PRELIMINARY RELEASE
REVISION HISTORY
KOZ_G63998_SKT-R3_BACKPLATE
ZONE REV
-
6B
2C
C6
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. DIMENSIONS STATED IN INCHES (MILLIMETERS)
WITH THEM.
ITEM NO
E.BUDDRIUS
DESIGNED BY
DRAWN BY
DATE
9/30/11
9-27-11
-
FINISH
SEE NOTES
DATE
E. BUDDRIUS
APPROVED BY
MATERIAL
T. AULAKH
CHECKED BY
DATE
TOP KOZ_G63998_SKT-R3_BACKPLATE
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
STIFFENING PLATE CONTACT ZONE
LEGEND
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN
ILM AND SOCKET FUNCTION.
4
QTY
September 2014
Order No.: 330786-001
B.6
SOCKET OUTLINE
FOR REFERENCE ONLY
1.811
[46]
.504
[12.8]
.717
[18.2]
2.724
[69.2]
SEE DETAIL
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
.276
ROUTE KEEPOUT, TOP LAYER
[7.01]
.256
[6.5]
OD COPPER WEAR PAD: NON-GROUNDED, SOLDER MASKED
0.0" HEIGHT PACKAGE KEEPOUT
.180
[4.57]
THROUGH ALL ROUTE KEEPOUT
ID COPPER WEAR PAD
.150
NPTH
[3.81]
QTY
NOTES:
DWG. NO
KOZ_G63999_SKT-R3_MTG-HOLES
SHT.
REV
REVISION HISTORY
DESCRIPTION
PRELIMINARY RELEASE
REV
ZONE
A5
B4
C7,A5
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. DIMENSIONS STATED IN INCHES (MILLIMETERS)
WITH THEM.
E.BUDDRIUS
E.B.
E.B.
APPR
E.B.
REV
E.B.
2/2/12
9/27/11
DATE
3/28/12
E.B.
10/7/11
8/6/12
DIMENSIONS AND
TOLERANCES ASSOCIATED
FOR PROPER
HEIGHT.
DESCRIPTION
SCALE: 3:1
D KOZ_G63999_SKT-R3_MTG-HOLES E
SHEET 1 OF 1
TITLE
PMCI
DEPARTMENT
PARTS LIST
9-27-11
DATE
9-27-11
SEE NOTES
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN
ILM AND SOCKET FUNCTION.
4
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
LEGEND
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT
ZONE 2:
1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW
PART NUMBER
E.BUDDRIUS
DESIGNED BY
DRAWN BY
DATE
9/30/11
9-27-11
-
FINISH
SEE NOTES
DATE
E. BUDDRIUS
APPROVED BY
MATERIAL
T. AULAKH
CHECKED BY
DATE
September 2014
Order No.: 330786-001
B.7
(4.169 )
[105.9]
3.701
[94]
1.299
[33]
3.150
[80]
2.205
[56]
3.091
[78.5]
(1.542 )
[39.16]
4X 115.8
4X R.234
[5.95]
.984
[25]
4X 18.6
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
3.346
[85]
3.406
[86.5]
NOTES:
SHT.
REV
ZONE
REV
UPDATED KOZ
PRELIMINARY RELEASE
8/28/12
4/12/12
3/28/12
2/2/12
10/7/11
9/30/11
DATE
E.B.
E.B.
E.B.
E.B.
E.B.
E.B.
APPR
DWG. NO
KOZ_G64001_SKT-R3_ILM-NARROW
DESCRIPTION
REVISION HISTORY
B6
FOR PROPER
TOLERANCES ASSOCIATED
DIMENSIONS AND
B6
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. DIMENSIONS STATED IN INCHES (MILLIMETERS)
WITH THEM.
OF FINGER
HEIGHT.
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN
ILM AND SOCKET FUNCTION.
4
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
6 THIS DRAWING DEFINES THE ILM COMPONENT MECHANICAL CLEARANCE REQUIREMENT ONLY.
REV
TITLE
PMCI
DEPARTMENT
ZONE 2:
1.40MM MAX COMPONENT HEIGHT
DATE
DATE
SHEET 1 OF 1
9-27-11
DATE
9-27-11
ZONE 3:
1.60MM MAX COMPONENT HEIGHT
DESIGNED BY
E.BUDDRIUS
E.BUDDRIUS
DRAWN BY
CHECKED BY
SCALE: 2:1
KOZ_G64001_SKT-R3_ILM-NARROW
SEE NOTES
9-27-11
9/30/11
DATE
FINISH
T. AULAKH
E. BUDDRIUS
APPROVED BY
MATERIAL
SEE NOTES
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
LEGEND
7 ASSEMBLY AND SERVICEABILITY ZONE SHOWN FOR REFERENCE. SIZE, SHAPE AND HEIGHT
OR ASSEMBLY TOOL ACCESS IS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT.
September 2014
Order No.: 330786-001
B.8
.159
[4.03]
2.520
[64]
3.150
[80]
2.362
[60]
MB-TOP
60.0
125.0
R3.715
[94.35]
R3.016
[76.6]
1.565
[39.75]
3D HEIGHT RESTRICTIVE
KEEP-OUT-VOLUME ONLY
KOZ'S NOT SHOWN FOR CLARITY
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
1.565
[39.75]
R3.119
[79.23]
MB-TOP
DEPARTMENT
PMCI
125.0
DWG. NO
G66105
SHT.
REV
G66105
SCALE: 1.000
SHEET 4 OF 4
REV
September 2014
Order No.: 330786-001
B.9
(3.622)
[92]
3.150
[80]
2X 140.0
4X 154.3
4X 168.2
(3.622)
[92]
3.150
[80]
3.091
[78.5]
ILM RETENTION
HOLES, FOR
DETAILS SEE
DOCUMENT G63999
2X 1.406
[35.72]
4X R.236
[6]
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
3.346
[85]
3.394
[86.2]
NOTES:
SHT.
REV
PRELIMINARY RELEASE
3/28/12
12/29/11
DATE
E.B.
E.B.
APPR
DWG. NO
REVISION HISTORY
KOZ_G64000_SKT-R3_ILM-SQUARE
REV
8/29/12
4/12/12
E.B.
E.B.
DESCRIPTION
ZONE
B6
FOR PROPER
TOLERANCES ASSOCIATED
DIMENSIONS AND
B6
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. DIMENSIONS STATED IN INCHES (MILLIMETERS)
WITH THEM.
OF FINGER
HEIGHT.
THE MOTHERBOARD
SOLDER BUMPS.
RESTRICTIONS ARE
3. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN
ILM AND SOCKET FUNCTION.
4
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
6 THIS DRAWING DEFINES THE ILM COMPONENT MECHANICAL CLEARANCE REQUIREMENT ONLY.
7 ASSEMBLY AND SERVICEABILITY ZONE SHOWN FOR REFERENCE. SIZE, SHAPE AND HEIGHT
OR ASSEMBLY TOOL ACCESS IS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT.
LEGEND
REV
TITLE
PMCI
DEPARTMENT
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
DATE
SCALE: 2:1
SHEET 1 OF 1
12/29/11
DATE
12/29/11
ZONE 2:
1.40MM MAX COMPONENT HEIGHT
DESIGNED BY
DATE
SEE NOTES
KOZ_G64000_SKT-R3_ILM-SQUARE
FINISH
SEE NOTES
DATE
E. BUDDRIUS
APPROVED BY
MATERIAL
CHECKED BY
E.BUDDRIUS
DRAWN BY
E.BUDDRIUS
ZONE 3:
1.60MM MAX COMPONENT HEIGHT
September 2014
Order No.: 330786-001
B.10
.159
[4.03]
2.520
[64]
3.622
[92]
.630
[16]
MB_TOP
60.0
125.0
R3.011
[76.47]
125.0
R3.024
[76.82]
1.565
[39.75]
1.565
[39.75]
MB_TOP
R3.124
[79.36]
3D HEIGHT RESTRICTIVE
KEEP-OUT-VOLUME ONLY
KOZ'S NOT SHOWN FOR CLARITY
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
DEPARTMENT
PMCI
DWG. NO
G66106
SHT.
REV
G66106
SCALE: 1.000
SHEET 4 OF 4
REV
September 2014
Order No.: 330786-001
B.11
4X R0.50
[0.020]
MIN.
[
0.126
3.20
0
-0.12
+0.000
-0.004
5.20 0.10
[ 0.205 0.003
7.00 0.20
[ 0.276 0.007
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
MAX.
0.60 0.04
[ 0.0236 0.0015
SHT.
REV
REV
DWG. NO
E75155
ZONE
REVISION HISTORY
-
DESCRIPTION
C5
B6
C5
B4
NOTES:
06/19/09
DATE
06/19/09
DATE
EASD / PTMI
DEPARTMENT
TITLE
APPROVED
DATE
07/07/09
06/19/09
E75155
SCALE: 1
REV
DESIGNED BY
N. ULEN
DATE
N. ULEN
CHECKED BY
06/19/09
DRAWN BY
C. HO
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
September 2014
Order No.: 330786-001
B.12
SOLID HEIGHT
+0.30
4
0
+0.011
-0.000
0.217
5.50
FREE HEIGHT
12.70
4
[0.500]
FREE HEIGHT
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
1.100
[0.0433]
WIRE DIA.
SECTION A-A
I.D. 5.42
+0.08
4
-0.13
+0.003
-0.005
+0.08
4
-0.13
+0.003
-0.005
0.300
0.213
O.D. 7.62
DWG. NO
E86113
SHT.
REV
REVISION HISTORY
01/14/10
12/08/09
DATE
11/15/09
DATE
EASD / PTMI
DEPARTMENT
E86113
SCALE: 1
REV
TITLE
SUPPLIER FEEDBACK
APPROVED
DATE
11/15/09
11/15/09
DESCRIPTION
REV
ZONE
NOTE 3
NOTES:
DESIGNED BY
N. ULEN
DATE
N. ULEN
CHECKED BY
11/16/09
DRAWN BY
D. LLAPITAN
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
September 2014
Order No.: 330786-001
B.13
1.000
[ 0.0394 ]
0.000
[ 0.0000 ]
4.500
[ 0.1772 ]
5.50
[ 0.217 ]
4.50
[ 0.177 ]
0.000
[ 0.000 ]
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
+0.06
0
+0.002
-0.000
0.213
+0.13
0
+0.005
-0.000
0.313
+0.13
0
+0.005
-0.000
0.411
10.45
7.95
5.40
+0.002
-0.000
+0.06
0
0.372
9.45
SECTION A-A
0.5 x 45 TYP.
SHT.
DWG. NO
E97837
REV
REVISION HISTORY
REV
DESCRIPTION
-
ZONE
NOTES:
DESIGNED BY
5/5/10
DATE
5/5/10
DATE
TITLE
SCALE: 1
APPROVED
DATE
REV
5/5/10
8/12/10
E97837
EASD / PTMI
DEPARTMENT
N. ULEN
DATE
N. ULEN
CHECKED BY
5/5/10
DRAWN BY
D. LLAPITAN
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
September 2014
Order No.: 330786-001
B.14
0
-0.25
+0.000
-0.009
4.173
106.00
SEE DETAIL A
+1.00
0
+0.039
-0.000
0.538
0
-0.25
+0.000
-0.009
TOP VIEW
2.756
70.00
4X 13.66
25.50 MAX.
[1.00]
+1.00
0
+0.039
-0.000
AIRFLOW DIRECTION
0.472
4X 12.00
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
46x 1.32
[0.052]
47x 21.00
[0.827]
47x 0.20
[0.008]
DETAIL A
SCALE 6.000
REV
DWG. NO
ZONE
NOTES:
SHT.
DESCRIPTION
REV
REVISION HISTORY
E95465
DATE
03/23/10
DATE
APPROVED
DATE
REV
03/23/10
E95465
ROMLEY/GRANTLEY 1U NARROW
HS GEOMETRY
SCALE: 1
TITLE
EASD / PTMI
DEPARTMENT
03/23/10
DATE
DESIGNED BY
03/23/10
N. ULEN
CHECKED BY
N. ULEN
C. HO
DRAWN BY
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
September 2014
Order No.: 330786-001
B.15
56.00
[2.205]
0
-0.06
+0.000
-0.002
0.368
9.35
A B C
38.000.50
[1.4960.019]
0.10 [0.003]
SECTION A-A
38.000.50
[1.4960.019]
94.00
[3.701]
SEE DETAIL B
0.077 [0.0030]
AIRFLOW DIRECTION
BOTTOM VIEW
FLATNESS ZONE,
SEE NOTE 7
3.0 X 45 CHAMFER
ALL FINS
AIRFLOW DIRECTION
TOP VIEW
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DEPARTMENT
PTMI
DWG. NO
DETAIL B
SCALE 6.000
E95465
SHT.
REV
4.50 0.13
[ 0.177 0.005 ]
9
BASE THICKNESS
E95465
SCALE: 1.500
REV
September 2014
Order No.: 330786-001
B.16
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DWG. NO
REV
SHT.
DESCRIPTION
REV
REVISION HISTORY
E95474
E86113-001
E86111-001
E75155-001
3
-
APPROVED
DATE
REV
03/23/10
NOTES:
ZONE
1.
2.
3.
4.
5
6
7
8
E86334-001
DESCRIPTION
E95465-001
PTMI
DEPARTMENT
TITLE
E95474
ROMLEY/GRANTLEY 1U NARROW
HS ASSEMBLY
SCALE: 1.500
E95474-001
SEE NOTES
FINISH
PARTS LIST
DATE
03/23/10
TOP
DATE
PART NUMBER
03/23/10
DATE
DESIGNED BY
03/23/10
N. ULEN
CHECKED BY
N. ULEN
C. HO
SEE NOTES
MATERIAL
APPROVED BY DATE
DRAWN BY
QTY ITEM NO
September 2014
Order No.: 330786-001
B.17
SEE DETAIL A
SECTION A-A
SEE DETAIL B
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
(4X 8.06
)
[0.317]
SPRING PRELOAD
ASSEMBLY HEIGHT
DETAIL B
SCALE 6.000
DEPARTMENT
PTMI
DWG. NO
+0.20
-0.25
+0.007
-0.009
6 &
E95474
SHT.
0.039
E95474
SCALE: 1.500
REV
+0.13
1.00
0
+0.005
-0.000
ASSEMBLY DETAILS
0.059
4X 1.50
DETAIL A
SCALE 6.000
REV
September 2014
Order No.: 330786-001
B.18
0
-0.25
+0.000
-0.009
3.602
+1.00
4X 13.22
0
+0.039
0.520
-0.000
0
-0.25
+0.000
-0.009
3.602
91.50
TOP VIEW
SEE DETAIL A
AIRFLOW DIRECTION
+1.00
4X 12.00
0
+0.039
0.472
-0.000
21.00 0.25
[ 0.827 0.009
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
91.50
71X 1.272
[0.0501]
FIN PITCH
DETAIL A
SCALE 5.000
71X 1.072
[0.0422]
FIN GAP
72X 0.200
[0.0079]
FIN THICKNESS
0.500 0.250
[ 0.0197 0.0098 ]
END GAP
BOTH SIDES OF HEATSINK
10
SHT.
DWG. NO
E97838
REV
REVISION HISTORY
REV
DESCRIPTION
-
ZONE
DATE
TITLE
EASD / PTMI
DEPARTMENT
5/5/10
DATE
APPROVED
5/5/10
8/12/10
E97838
SCALE: 1
REV
ROMLEY/GRANTLEY 1U HS GEOMETRY
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9
10
DATE
SEE NOTE 8
5/5/10
DATE
DESIGNED BY
5/5/10
N. ULEN
CHECKED BY
N. ULEN
D. LLAPITAN
DRAWN BY
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
September 2014
Order No.: 330786-001
B.19
80.00
[3.150]
A B C
0
-0.06
+0.000
-0.002
0.368
9.35
[
0.10 [0.003]
38.00
[1.496]
SECTION A-A
38.00
[1.496]
80.00
[3.150]
9
SEE DETAIL B
A B
0.077 [0.0030]
FLATNESS ZONE,
SEE NOTE 7
1.00 [0.039]
AIRFLOW DIRECTION
BOTTOM VIEW
SEE DETAIL D
AIRFLOW DIRECTION
TOP VIEW
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DEPARTMENT
PTMI
DETAIL D
SCALE 6.000
DWG. NO
3.0 [0.118] X 45
ALL FINS
DETAIL B
SCALE 6.000
E97838
SHT.
4.50 0.13
[ 0.177 0.005 ]
BASE THICKNESS
REV
E97838
SCALE: 1.500
REV
September 2014
Order No.: 330786-001
B.20
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
SHT.
DWG. NO
REV
REV
E86113-001
E91775-001
E75155-001
G13624-001
ROMLEY/GRANTLEY 1U HS GEOMETRY
DELRIN RETAINER/SPACER
E97839
REVISION HISTORY
ZONE
DESCRIPTION
-
ROMLEY/GRANTLEY 1U HS ASSEMBLY
DATE
APPROVED
5/5/10
8/12/10
NOTES:
1.
2.
3.
4.
5
6
7
8
E97837-002
10
E97838-001
E97839
SCALE: 1.500
REV
ROMLEY/GRANTLEY 1U HS ASSEMBLY
TITLE
PTMI
DEPARTMENT
DESCRIPTION
E97839-002
SEE NOTES
FINISH
PARTS LIST
DATE
5/5/10
TOP
DATE
PART NUMBER
5/5/10
DATE
DESIGNED BY
5/5/10
N. ULEN
CHECKED BY
N. ULEN
D. LLAPITAN
SEE NOTES
MATERIAL
APPROVED BY DATE
DRAWN BY
QTY ITEM NO
September 2014
Order No.: 330786-001
B.21
SECTION A-A
SEE DETAIL B
(4X 9.36
)
[0.369]
SPRING PRELOAD
ASSEMBLY HEIGHT
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
SEE DETAIL A
DETAIL B
SCALE 6.000
SEE DETAIL C
ASSEMBLY DETAILS
DETAIL A
SCALE 6.000
DEPARTMENT
PTMI
DWG. NO
10
6 &
E97839
+0.13
0
+0.005
-0.000
0.039
1.00
SHT.
REV
DETAIL C
SCALE 30.000
SCALE: 1.500
E97839
0.00 0.35
[ 0.000 0.013
REV
September 2014
Order No.: 330786-001
B.22
0
-0.25
+0.000
-0.009
3.602
+1.00
0
+0.039
-0.000
0.472
4X 12.00
0
-0.25
+0.000
-0.009
TOP VIEW
3.602
91.50
+1.00
0
+0.039
-0.000
0.472
64.00 MAX.
[2.520]
AIRFLOW DIRECTION
4X 12.00
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
91.50
E95132-002
TOP
PART NUMBER
SEE NOTE 4
QTY ITEM NO
SHT.
REV
7/21/10
3/29/10
DATE
APPROVED
1
REV
DWG. NO
REVISION HISTORY
E95132
ZONE
DESCRIPTION
2B2
NOTES:
3/29/10
DATE
DESCRIPTION
EASD / PTMI
DEPARTMENT
PARTS LIST
TITLE
E95132
SCALE: 1
REV
ROMLEY/GRANTLEY 2U HS VOLUMETRIC,
DIE CAST BASES ONLY
SEE NOTE 8
DATE
ROMLEY 2U HS VOLUMETRIC
3/29/10
DATE
DESIGNED BY
3/29/10
N. ULEN
CHECKED BY
N. ULEN
D. LLAPITAN
DRAWN BY
SEE NOTES
FINISH
APPROVED BY DATE
SEE NOTES
MATERIAL
September 2014
Order No.: 330786-001
B.23
80.00
[3.150]
9
38.000.50
[1.4960.019]
SECTION A-A
38.000.50
[1.4960.019]
80.00
[3.150]
9
SEE DETAIL C
SEE DETAIL B
0.077 [0.0030]
FLATNESS ZONE,
SEE NOTE 7
AIRFLOW DIRECTION
BOTTOM VIEW
AIRFLOW DIRECTION
TOP VIEW
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DETAIL B
SCALE 10.000
10.450
[0.4114]
+0.13
0
+0.005
-0.000
0.313
DWG. NO
E95132
SHT.
SCALE: 1.500
REV
5.50
[ 0.217 ]
1.00
[ 0.039 ]
4.50 0.13
[ 0.177 0.005 ]
BASE THICKNESS
E95132
A B C
0.1 [0.00]
0.5 x 45
ALL AROUND
+0.13
0
+0.005
-0.000
0.213
5.40
7.95
DETAIL C
SCALE 6.000
DEPARTMENT
PTMI
REV
September 2014
Order No.: 330786-001
B.24
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DWG. NO
REV
SHT.
DESCRIPTION
REV
REVISION HISTORY
E95133
E86111-001
E75155-001
ROMLEY/GRANTLEY 2U HS VOLUMETRIC
3
-
ZONE
NOTES:
ROMLEY/GRANTLEY 2U HS ASSEMBLY
DATE
APPROVED
3/29/10
E86113-001
E95132-001
E95133
SCALE: 1.500
REV
ROMLEY/GRANTLEY 2U HS ASSEMBLY,
DIE CAST BASES ONLY
TITLE
PTMI
DEPARTMENT
DESCRIPTION
E95133-001
SEE NOTES
FINISH
PARTS LIST
DATE
3/29/10
TOP
DATE
PART NUMBER
3/29/10
DATE
DESIGNED BY
3/29/10
N. ULEN
CHECKED BY
N. ULEN
D. LLAPITAN
SEE NOTES
MATERIAL
APPROVED BY DATE
DRAWN BY
QTY ITEM NO
September 2014
Order No.: 330786-001
B.25
SEE DETAIL A
SECTION A-A
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
(8.56
)
[0.337]
SPRING PRELOAD
ASSEMBLY HEIGHT
DEPARTMENT
PTMI
DWG. NO
E95133
SHT.
REV
DETAIL A
SCALE 10.000
E95133
SCALE: 1.500
ASSEMBLY DETAILS
REV
September 2014
Order No.: 330786-001