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5, MAY 2011
1699
I. I NTRODUCTION
LECTRICAL capacitance tomography (ECT) is a technique to determine the dielectric permittivity distribution
in the interior of an enclosed environment through external
capacitance measurements [1]. The technique is advantageous
over other tomographic techniques in terms of its effectiveness,
portability, robustness, no exposure to radiation hazard, and low
cost. Since its invention in the 1980s, ECT has found numerous
applications, e.g., measurement of multiphase flows (gasliquid
and gassolids) in pipelines, visualization of combustion flames
in engines [2], [3], detection of leakage from buried water
pipes [4], and flow pattern identification [5], [6]. ECT enables
insight into the material distribution within a closed vessels and,
consequently, into the governing mechanism in the process,
without disturbing the process itself.
Typically, an ECT system consists of multiple electrodes
[7] that are symmetrically mounted inside or outside a cylindrical container, as illustrated in Fig. 1. During the period
of a scanning frame, an excitation signal, e.g., an alternating
current (ac) voltage, is applied to one of the electrodes, and the
Manuscript received June 19, 2010; revised December 29, 2010; accepted
January 4, 2011. Date of publication March 3, 2011; date of current version
April 6, 2011. The Associate Editor coordinating the review process for this
paper was Dr. Jiong Tang.
The authors are with the Department of Mechanical Engineering, University
of Connecticut, Storrs, CT 06269 USA (e-mail: RGao@engr.uconn.edu).
Color versions of one or more of the figures in this paper are available online
at http://ieeexplore.ieee.org.
Digital Object Identifier 10.1109/TIM.2011.2113010
M (M 1)
.
2
(1)
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 60, NO. 5, MAY 2011
Fig. 2. Grouping configurations for an ECT sensor operated in the foursegment mode.
FAN AND GAO: ENHANCEMENT OF MEASUREMENT EFFICIENCY FOR ELECTRICAL CAPACITANCE TOMOGRAPHY
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TABLE I
M EASUREMENT S EQUENCE FOR AN E IGHT-E LECTRODE
ECT S ENSOR U SING MECaP
TABLE II
C OMPARISON OF THE N UMBER OF M EASUREMENT
R EQUIRED BY D IFFERENT T ECHNIQUES
1
+3Ron . (2)
j 2f1 C12
(3)
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 60, NO. 5, MAY 2011
Fig. 6. Equivalent circuit for the measurement of capacitances C1N C(N 1)N .
a23
(4)
i3 (j2f2 )
= |H23 (j2f2 )| =
u2 (j2f2 )
1
.
=
2Ron + (Ron + Z23 )(4Ron + Z12 )/(2Ron + Z12 )
(5)
i1 2Ron
i1 2Ron
...
i1 2Ron
i1
i2 (2Ron + Z12 )
i3 (2Ron + Z13 )
......
+i2
2Ron
2Ron
1 = . . .
2Ron
1
+i3
(2Ron + Z12 )
iN +1 2Ron + Z1(N +1)
iN +1
= u1
= u1
...
= u1
=0
(6)
(2Ron + Z13 )
...
(7)
...
2Ron + Z1(N +1)
1
(8)
FAN AND GAO: ENHANCEMENT OF MEASUREMENT EFFICIENCY FOR ELECTRICAL CAPACITANCE TOMOGRAPHY
Fig. 7.
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|det[1 ]|
a1(N +1)
(11)
2Ron
2Ron
...
1 =
2Ron
2Ron
1
(2Ron + Z12 )
To gain a systematic overview of the improvement in scanning speed enabled by the developed MECaP technique, the
total number of measurement steps by using MECaP and the
traditional ac method were calculated. As shown in Fig. 7,
the results from the two methods were compared in four
different cases, where the number of the electrodes M was
assumed to be 8, 12, 16, and 44 (grouped into four sections),
respectively.
As shown in Fig. 7, when the number of simultaneously
excited electrodes N is equal to the upper limit of Nmax =
M 1, the maximum scanning speed achieved by MECaP can
(2Ron + Z13 )
...
...
(2Ron + Z1N )
1
1
1
1
0
(10)
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 60, NO. 5, MAY 2011
Fig. 9. Interelectrode impedance calculated from the simulation model. (a) Z13 . (b) (Adjacent electrodes) Z12 .
FAN AND GAO: ENHANCEMENT OF MEASUREMENT EFFICIENCY FOR ELECTRICAL CAPACITANCE TOMOGRAPHY
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(14)
(15)
Fig. 10. Relative measurement error of C23 (in percentage) when two simultaneous excitations are applied at the first measurement step.
is met, and detection of the material can follow the simplified MECaP method. Conversely, when the material permittivity and/or the diameter increase, the impedance between
the electrodes is reduced due to the increased capacitance.
The value of ZNORM can then be as low as 24, as in the
case where a 400 -mm-diameter ECT sensor is measuring
water ( = 81). In this case, the standard MECaP method, as
previously described, should be followed to avoid a measurement error due to neglect of Ron . This error can be defined
in relative terms as (Cpq(simplied) Cpq(rmN onM ECaP ) )
100%/Cpq(NonMECaP) , where Cpq(simplied) is the capacitance measured by the circuitry when using the simplified
MECaP method, as defined in (14), and Cpq(NonMECaP) is capacitance measured when using the traditional single excitation
method.
To systematically quantify measurement error, the output of
the ECT sensor was simulated using an finite element model.
Two excitation signals of 1.0 and 1.2 MHz were simultaneously applied to electrodes 1 and 2 at the first measurement
step to simulate the simplified MECaP technique. The relative
measurement error using such a simplified MECaP method, as
compared with using the standard single excitation scheme is
illustrated in Fig. 10.
It is shown that, when applying the simplified MECaP
method, the maximum measurement error, shown in Fig. 10
as the contour curves, can significantly vary, depending on the
permittivity of the materials and the dimension of the ECT sensor. When materials of low relative permittivity are measured
in a small ECT setup, small errors (e.g., on the order of less
than 0.1%) can be expected. However, when the material has a
high relative permittivity (e.g., = 81 for water), and the size of
the ECT sensor is large (e.g., D > 327 mm), the measurement
error can quickly increase to over 10%. This indicates that the
standard MECaP method presented in this paper provides a
general solution to the problem of multiple excitations in an
ECT application, whereas the simplified MECaP approach may
be seen as a special case, when the combination of material
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 60, NO. 5, MAY 2011
Fig. 11. MECaP circuit design and prototyping. (a) Functional modules of the MECaP circuitry. (b) Prototype on printed circuit board.
TABLE III
M EASUREMENT S TEPS FOR N ON -MECaP (U PPER S ECTION ; 28 S TEPS ) AND MECaP M ETHODS (L OWER S ECTION ; 11 S TEPS)
FAN AND GAO: ENHANCEMENT OF MEASUREMENT EFFICIENCY FOR ELECTRICAL CAPACITANCE TOMOGRAPHY
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Fig. 12. Experimental results. (a) Mean value of the measured capacitance in
each step. (b) Standard deviation of the measurement. (c) Measurement error of
MECaP (relative to the non-MECaP data).
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