HOT BAR REFLOW

SOLDERING
FUNDAMENTALS
A high quality Selective Soldering Technology

Content
1. HotBarReflowSolderingIntroduction
2. ApplicationRange
3. ProcessDescriptions
>FlextoPCB
>WiretoPCB
4. DesignGuidelines
5. Equipment
6. TroubleshootingGuide

page35
page67
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page2627

HBRIntroduction

WhatisHotBarReflowSoldering?
THERMODE HOLDER

Pulsedheat Thermode (HotBar)soldering,isa

joiningtechnology wheretwopretinnedpartsare
heatedtothemeltingpointofthetin.Thejoining
technologyresultsinapermanentelectro
mechanicaljoint.
Therequiredprocessenergyissuppliedbya
thermode,alsoknowasaHotBar.Thisthermodeis
pressedontheupperparttotransferthethermal
energytobothparts.
Closedloopprocesscontrolisusedtocontrolthe
timetemperatureprofile.

THERMODE

PCB

HEAT IS
CONDUCTED
FROM THE
THERMODE
TO THE
PARTS AND
SOLDER

HBRIntroduction

Howdoesitwork?
LoadPCBin
customizedfixture

Applynoncleanflux
onpads

Loadandposition
FlexonthePCB

Startsoldering
process

Thereflowtempis
keptontemperature
forapresettime

Afterapresettime
uniflowrampsupto
thereflow
temperature

Uniflowheatsupthe
thermodetopreheat
temperatureto
activateflux

Thermodemoves
downonthe
solderingarea

Thermodecools
downtothecool
temperature

thermodemovesup
fromthesoldering
area

HotBarsoldering
processiscompleted

HBRIntroduction

ThebenefitsofHotBarReflowSoldering

Suitableformassproduction

Reliableprocessing,alwaysequalprocessconditions

Costeffectiveduetothefactthatnothirdcomponentisneededto
connectflex/wiretothePCB/substrate
(connectororACAcanbeavoided)

Multipleconnectionstobemadesimultaneously.Numberofleadsdepend
onproduct,pitch,design.

Fasttemperaturerampupandcooldown

Closedlooptemperatureandprocesscontrol.

Veryaccuratepositioningoftheparts

ApplicationRange

HotBarReflowSolderingApplications

FlextoCeramic

ComponenttoPCB

FlextoPCB

WiretoPCB

ApplicationRange

HotBarReflowSolderingApplications

FlextoPCB

FlextoPCB

WiretoPCB

LeadframetoPCB

ProcessDescriptions

ProcessDescription:Preparation
InpreparationfortheHotBarReflowsolderingprocess,thefollowingpreparationstepsneed
tobetaken:
1.Thebasesubstrateislocatedinafixture,andfluxisappliedtothepads.
2.Theflexispositionedinthepartsfixture,ensuringalignmentofboth
setsofpads.
3.Aprocessstartsignalisgiventothesolderingcontrolunit.
Moreinfoabouttheparts,thefixturesandthefluxingcanbefoundfurtherinthisarticle.The
HotBarReflowSolderingprocessitselfconsists
ofthefollowingprocesssteps:heatingup,reflowandcoolingdown.Theseprocessstepsare
describedinthenextsheets.

ProcessDescriptions

ProcessDescription:Contacting
TheHotBarorthermodeismountedtoabondingheadby
meansofaquickconnectblock.Thebondingheadhasan
accurateandstablelinearguidanceforthethermode.
Movementisdonewithapneumaticcylinderoranelectrical
motor.Aninternalspringsystemgeneratedanaccurateforce.
Mostreflowjointsofthisnaturerequirefewerthan100Newton
pressure.Forceshouldbecalibratedandsettothecorrectlevel
toachievetherighttransferofthermalenergytothesolder
joint.Thebondingheadshouldhaveanaccuratecoplanarity
adjustmenttosettheflatnessofthethermodetotheproduct
accurately.Theseheadsaremodularinconstructionand
thereforeversatileforintegration.
Afterthestartsignalisgiven,thethermodeisgentlylowered
untilitseatsontheproduct.Theheadsensesthis.Forceisbuild
upuntilthepresetforceisreached.Whentherightforceis
reached,asignalispassedtothepowersupply,whichstarts
heatinguptheHotBar.

ProcessDescriptions

ProcessDescription:Heatingup
Bynow,theHotBarholdsdowntheproductwiththepresetforce.TheHotBarisatroomtemperature.The
soldercontrolunit,alsocalledSCUorpowersupplyhasreceivedthesstartsignalforthesoldering
process.
TheSCUsendscurrentthroughtheHotBar.TheHotBarisdesignedsothattheelectricalresistanceishighest
atthebottom(whereittouchestheproduct).Heatisgeneratedbecauseofthecombinationofcurrentand
electricalresistance.Asmallthermocoupleisweldedonthefrontofthermocouple.Thisthermocouplefeeds
backtheactualHotBartemperaturetotheSCU.Thismakesacompleteclosedloopregulationforthe
temperaturetimecycle.
Normalrisetimeformostthermodes is1.5to2seconds,
equalingaheatingrateofabout200degreesCelsiusa
second.Thenewestgenerationofsoldercontrolunitis
controllingthetemperatureallthewaythroughtheheating
upphase.WhentheREFLOWtemperatureisnearlyreached
thesoldercontrolunitneedstoslowdowntheheatingrateto
preventatemperatureovershoot.Agoodsoldercontrolunit
andHotBarcombinationwillcompensateforalldifferencesin
heatloadsthatcanoccurduringnormalproduction
circumstances.

ProcessDescriptions

ProcessDescription:Reflow
Duringthereflowperiodthefluxisactivated,theflux
cleansthesurfacesandthesolderisheateduntilitstarts
meltingonallpads.Thisnormallytakes38seconds,at
HotBartemperaturesaround300C(HotBartouchesthe
leads),400C(HotBartoucheskapton)or500C(ceramics
andMCPCBsoldering).Althoughnormalsolderwillmelt
at180C,idealsoldertemperatureisabove220Ctogeta
goodflowingandwettingbehaviorbutbelow280Cto
preventburningofthesolder.TheHotBarmustbeset
higherduetothethermaltransferlosses.Ideally,timecan
beprogrammedontheSCUin0.1sec.incrementsand
temperatureinonedegreeincrements.Usetheminimum
timeandtemperaturetoachievethedesiredjointto
minimizethepartsexposuretoheatandchanceof
damage.

ProcessDescriptions

ProcessDescription:Cooling
Whenthesolderisconnectedonallpads,theenergy
deliverytotheHotBarcanbestopped.TheHotBarwill
startcoolingdown.Thecoolingprocesscanbeshortenedby
theuseofforcedaircooling.TheSCUcanswitcharelaythat
controlstheflowofairattheendofthereflowperiodand
coolthejointandHotBarrapidly.Foroptimumprocess
control,coolingisdonetoaspecifictemperature.This
temperatureissetbelowthesoldersolidification
temperature.Therefore,assoonasthesolderbecomes
solid,theprocessisendedandajointisformed.Because
mostconnectionshavearelativelyhighheatsink,the
temperatureinthesolderislowerthanthemeasuredHot
Bartemperature,evenwhenusingforcedaircooling.
Therefore,thereleasetemperaturecanbesetto180Cin
mostcaseswithoutthechanceofreleasingthepartsbefore
solidificationhastakenplace.

ProcessDescriptions

ProcessDescription:QualityControl
Qualitycontrolbefore startingtheprocessisdoneby:
TheMiyachiEurope forcemeasurementkit,whichcontainsaprecisionloadcellwithalarge
contactareatosupporttheThermoplane Thermodeandacontrolpanelincludingareadout
display.
TheMiyachiEurope pressuresensitivepaper,especiallydesignedtooptimizetheplanarityofthe
Thermoplane Thermodeincombinationwiththeproduct.Puttingitinbetweenthermodeand
productsupportwillresultinanaccuratereadoutofplanarity.
KnowingandunderstandingthetemperatureduringallthedifferentHotBarprocessesinsidethe
materialsisessentialforoptimalresults.Theeasytousehandheldtemperaturemetercanbeused
incombinationwithultraflatthermocouples.Thethermocouplecanbesandwichedbetweenthe
parts,andtheactualprocesstemperaturecanbemeasuredinsidetheconnection.The
thermocoupleisreusable.
Qualitycontrolduringtheentireprocesscycle
ThenewPremiumHotBarMonitoringsystemcombinesMIYACHIEAPROHotBarknowhowwith
MIYACHIPECOtechnicalexpertiseallinoneunit.TheMG3HotBarmeasuresforce,temperature,
timeanddisplacement,allowingforcontinuouscontrolthroughouttheentireprocesscycle.The
compactandflexiblesystemfeatureshighqualityHotBarconnectionsandhighthroughput,all
withinaneasilyadjustableframeconstruction.
Qualitycontrolafterthebondingcycle
UsingtheMG3forHotBar,featuringfullonscreen(SPC)statisticprocesscontrol.

DesignGuidelines

FlexDesign:ConnectionType
Openwindowedflexdesign:
Thisdesignhasbothsidesofthepolyimide
materialremovedfromthejointareabuthas
supportfromtheremainingpolyimidematerial
onthesidesandalsoalongtheendofthetraces.
Thisdesigngivessomestrengthtotheassembly
andisresilienttoharsherhandling.
Asthetracesareexposed,thethermaltransfer
tothepartsisgoodandexcesssolderhasextra
spacetoflow.Thermodesizingiscriticalasit
mustfitintothewindowandallowspaceforthe
moltensoldertoflow.Thisdesignbehaves
similartotheexposedleaddesign.

DesignGuidelines

FlexDesign:ConnectionType
Singlesidedflexdesign:
Thisdesignhasthepolyimideremovedon
onesideonly.HeatisconductedfromtheHot
Barthroughthesolidpolyimidesurfacetothe
exposedtracesunderneath.Thepolyimide
conductsheatthroughtheinsulationtothe
exposedtracesandpadsonthePCB.The
polyimidethicknessinthejointareaislimited
toabout50microns,enablingconduction.If
thepolyimidehastobeheatedpast400
425C,burningofpolyimideandHotBar
contaminationcanresult.Thisdesignisless
tolerantofexcesssolderonthePCBpads
becauselittleroomexistsforexcesstoflow.
Thesinglesidedflexismostsuitableforsmall
pitches.Pitchesassmallas200micron,
arrangedinoneortworows,arepossible.

DesignGuidelines

FlexDesign:ConnectionType
Exposedleadflexdesign:
Thisdesignhasbothsidesofthepolyimide
(kapton)materialremoved,leavingthetraces
freeofinsulation.TheHotBarcontactsthe
tracesdirectlyandconductsheattotheparts.If
thePCBpadsandHotBarfootprintaresized
correctly,thisdesignwillbemosttolerantto
excesssolderonthepads,assoldermayflow
intoopenareas.Duringtheprocess,solderwill
alsowettothetopofthetrace.Cautionmustbe
exercisedinparthandlingasthetracesmaybe
easilybentordamaged.Becauseofthedirect
HotBartoleadcontact,thisdesignwillhavelow
HotBartemperaturesandshortprocesstimes.
TheHotBarwillpollutewithfluxresidues,and
willrequirecleaning.Akaptonfeedermodule
(seethesectiononequipment)willsolvethese
objections.

DesignGuidelines

FlexandPCBdesign:ConnectionType
Polyimide flex types

DesignGuidelines

WireandPCBdesign:ConnectionType
ForWirePCBsolderinguptothermodelengthof40mm

PCBtrackdesignrecommendations:
PCBtrackwidth:>150%ofwirediameter
PCBtracklength:>3mm
Minimumpitch(centrecentretrack):0.8mm
Minimumspacingbetweentracks:0.4mm
Wirerecommendations
Wirestrippedlengthminimum:PCBtracklength
Pretinningofparts
EstimatedpretinningheightonthePCBtracks:5080micron(eachreflowofsolder
paste)
Eachindividualwireinthecablemustbepretinnedtoenableasolidwirepriorto
thesolderprocess

DesignGuidelines

Designguidelines
TrackandgapofPCBshouldbe
both50%ofthepitch
Trackoftheflexshouldbe80%of
thetrackofthePCB
thisallowsexcessivesoldertoflow

Flextracksshouldbeapprox.0,2
mmshorterthanPCBtracks
Visualinspectionpossible
Easyalignmentcheck
Allowexcessivesoldertoflow

DesignGuidelines

Designguidelines

Thicknessofpolyimideinsolder
areashouldbeasthinaspossible

Recommendeddiameterfor
locatingpinsshouldbeatleast1,5
mm

Locatingpinsshouldhavea
minimumdistanceof1,5mm
fromtheoutsidetracks

DesignGuidelines

Designguidelines

Groundplanesand
throughholesshouldbe
isolatedfromthetracks
withthermalneckswitha
lengthof2mmanda
widthassmallaspossible

Groundplanesinlayers
belowthesolderingarea
shouldbeminimizedin
sizeandmass

DesignGuidelines

FlexandPCBdesigns:pretinning

SoldermustbepretinnedonPCB
priortoHotBarprocess

Startpointforscreenprintingisa
150micronsthickstencilwitha
maskopeningthatresultsina
40%padcoverage.
(Afterreflowovenapprox 40%of
thesolderpasteremains)

Forsmallpitchapplicationsitis
recommendedtopretintheparts
byelectroplatingasbeingthe
mostaccuratetechnology.

HotBarReflowSolderingEquipment

MIYACHIEAPROReflowSoldering
DesktopSystems
TheMiyachiEAPRODesktopSystemsarealineof(semi)automaticsystemsdevelopedforHotbarSoldering,HeatSeal
BondingandACFLaminating.TheDesktopSeriesdeliverthesamehighbondingqualityasthelargerandmoreautomated
systems.Forallproductionenvironmentswherelaborcostsareconservative,itoffersanidealpriceperformance
(throughput)ratio.ThesystemflexibilitymakesitalsoperfectlysuitableforR&Denvironmentsand
integrationinlargersystems.

HotBarReflowSolderingEquipment

MIYACHIEAPROReflowSoldering
StandaloneSystems
MiyachiEuropehasa
proventrackrecordof
systemscompleted
successfullyasfullyor
semiautomatedunits.
MiyachiEurope
combinesknowledge
fromourinhousedesign
departmentwiththe
expertiseinourinhouse
applicationandresearch
labswhenscreeningthe
feasibilityofyour
application.

Enjoymaximumprocess
stabilityandexcellent
reproducibilitywithour
reliableandproven
ReflowSoldering
systems.
TypicalexamplesareLCD
repairsystems,turntable
systemsforquality
connectionsbetween
PCBs,flexfoils,LCD's
andothercomponents
andfullyautomated
productionlines.

HotBarReflowSolderingEquipment

MIYACHIEAPROReflowSolderingModules
MIYACHIEAPROprovidesarangeofHotBarModulessuitableforyourspecificapplication,suchasBonding
Headsindifferentsizesandforces,adjustableThermoplaneThermodes,InterposerModules,Calibration
Toolsandprocessmonitoringtools.ContactourSalesDepartmentformoreinformation.

TroubleshootingGuide

HotBarReflowSolderingTroubleshootingGuide
Problem

PossibleCauses

PossibleRootCauses

Opensolderjoints

Notenoughheatintheleads

Toolowprocesstemperature

PossibleSolutions
IncreaseHotBartemperature

Theseopensolderjointscanbe:

Increaseprocesstime

>random

ImproveflatnessofHotBaralignment

>alwaysleftofright

IncreaseHotBarwidth

>alwaysonespecificjoint

Improvesupportonalljoints

>alljoints

Reducesupportheatadsorbtion

>attheedgesorthecentre

Reduceamountofflux

Theseallcanhavedifferentcauses.

Increasefluxdryingtime

Pleaseconsultanexpertforthis.

Differentheatabsorbtionperlead

Improveproductdesign
Improvefixturedesign

Notenoughpressureontheleads

Notenoughforce

Increaseforce
ReduceHotBarwidth

Forcenotdistributedevenlyenough

Improvesupportonalljoints
ImproveflatnessofHotBaralignment
Improveflatnessofpart
Improvethicknessevenessofpart
CleanHotBar

Surfacenotwettableenough

Notenoughsolder

Wrongflux

Changetodifferenttypeofflux

Toolittleflux

Increaseamountofflux

Fluxtooold

Changetofresherflux

Fluxdispensedtoolongago

Applyfluxagain

Fluxnotdistributedevenly

Improvedistributionofflux

Fluxnotactivated

Increasefluxactivationtime

Toomuchoxidation

ReduceoxidationofleadsandPCB

WrongflexandPCBsurfaces

Changetoothersurfacetreatments

Notenoughsolder

Increaseamountofsolder
Improvesolderposition
Improvesoldershape

Gaptobebridgedtoolarge

Improvesupportonalljoints
IncreaseHotBarwidth
IncreaseHotBarpressure

HotBarReflowSolderingTroubleshootingGuide
Problem

PossibleCauses

PossibleRootCauses

Solderbridging

Toomuchpressureonthelead

Toomuchforce

PossibleSolutions
Reduceforce

Distributepressurebetteroveralljoints

Improveflatness
ImproveHotBaralignment

Toomuchsolder

Toomuchsolder

Reduceamountofsolder
Changepositionofsolder
Changeshapeofsolder

Notenoughspaceforthesolder

ReduceHotBarwidth
IncreasebevelHotBar
Increaseflexibilityofflex

Solderballing

Isolationsurfacetoowettable

Notenoughseperationroom

Toomuchvapourpressurefromflux

Fluxnotdry

Decreasepadwidth
Longertimeafterfluxdispensing
Longerupslope
Usefluxactivationstage

Toomuchsolderfortheavailablespace

Toomuchflux

Reduceamountofflux

Wrongflux

Changetodifferenttypeofflux

Improveavailablespace

Increasepadwidth
Increasepadlength
ReduceHotBarwidth
Increaseflexibilityofflex

Reduceamountofsolder

Reduceamountofsolder
Changepositionofsolder
Changeshapeofsolder

Toomuchvapourpressurefrompolutions

Removepolutions

Cleanpartbeforeusage

Toohightemperature

HotBartoohot

LowerHotBartemperature

Avoidpartpolution
Burning

IncreasewidthHotBar
Redcueprocesstime
Notenoughheatdissipation

Increasepressure
Increaseflatness

Wrongmaterials

Materialnottemperatureresistant

Changematerials
Changetothinnermaterials