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OPA
548
OPA
548
O PA
548
High-Voltage, High-Current
OPERATIONAL AMPLIFIER
FEATURES
DESCRIPTION
The OPA548 is a low-cost, high-voltage/high-current operational amplifier ideal for driving a wide variety of loads. A
laser-trimmed monolithic integrated circuit provides excellent
low-level signal accuracy and high output voltage and current.
The OPA548 operates from either single or dual supplies for
design flexibility. In single-supply operation, the input common-mode range extends below ground.
The OPA548 is internally protected against over-temperature
conditions and current overloads. In addition, the OPA548
was designed to provide an accurate, user-selected current
limit. Unlike other designs which use a power resistor in
series with the output current path, the OPA548 senses the
load indirectly. This allows the current limit to be adjusted
from 0A to 5A with a resistor/potentiometer or controlled
digitally with a voltage-out or current-out DAC.
The Enable/Status (E/S) pin provides two functions. An input
on the pin not only disables the output stage to effectively
disconnect the load, but also reduces the quiescent current
to conserve power. The E/S pin output can be monitored to
determine if the OPA548 is in thermal shutdown.
APPLICATIONS
V+
VIN
OPA548
VO
ILIM
+
VIN
E/S
V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1997-2003, Texas Instruments Incorporated
www.ti.com
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
NOTES: (1) Stresses above these ratings may cause permanent damage.
(2) Vapor-phase or IR reflow techniques are recommended for soldering the
OPA547F surface-mount package. Wave soldering is not recommended due to
excessive thermal shock and shadowing of nearby devices.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see the Package Ordering Addendum at the end of this data sheet.
PIN CONFIGURATIONS
Top Front View
7-Lead
Stagger-Formed
TO-220 (T)
7-Lead
Straight-Formed
TO-220 (T-1)
1 2 3 4 5 6 7
7-Lead
DDPAK (FA)
Surface-Mount
1 2 3 4 5 6 7
1 2 3 4 5 6 7
OPA548
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SBOS070B
ELECTRICAL CHARACTERISTICS
At TCASE = +25C, VS = 30V and E/S pin open, unless otherwise noted.
OPA548T, F
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
INPUT BIAS CURRENT(1)
Input Bias Current(2)
vs Temperature
Input Offset Current
CONDITION
MIN
TYP
MAX
UNITS
VCM = 0, IO = 0
TA = 40C to +85C
VS = 4V to 30V
2
30
30
10
mV
V/C
V/V
VCM = 0V
TA = 40C to +85C
VCM = 0V
100
0.5
5
500
NOISE
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range: Positive
Negative
Common-Mode Rejection
Linear Operation
Linear Operation
VCM = (V) 0.1V to (V+) 3V
(V+) 3
(V) 0.1
80
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Full-Power Bandwidth
Settling Time: 0.1%
Total Harmonic Distortion + Noise, f = 1kHz
OUTPUT
Voltage Output, Positive
Negative
Positive
Negative
Maximum Continuous Current Output: dc
ac
Leakage Current, Output Disabled, dc
Output Current Limit
Current Limit Range
Current Limit Equation
Current Limit Tolerance(1)
VO = 25V, RL = 1k
VO = 25V, RL = 8
90
RL = 8
G = 1, 50Vp-p, RL = 8
G = 10, 50V Step
RL = 8, G = +3, Power = 10W
IO = 3A
IO = 3A
IO = 0.6A
IO = 0.6A
(V+) 4.1
(V) + 3.7
(V+) 2.4
(V) + 1.3
3
3
POWER SUPPLY
Specified Voltage
Operating Voltage Range
Quiescent Current
Quiescent Current, Shutdown Mode
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance, JC
7-Lead DDPAK, 7-Lead TO-220
7-Lead DDPAK, 7-Lead TO-220
Thermal Resistance, JA
7-Lead DDPAK, 7-Lead TO-220
50
nA
nA/C
nA
90
200
nV/Hz
fA/Hz
(V+) 2.3
(V) 0.2
95
V
V
dB
107 || 6
109 || 4
|| pF
|| pF
98
90
dB
dB
1
10
See Typical Characteristics
15
0.02(3)
MHz
V/s
kHz
s
%
(V+) 3.7
(V) + 3.3
(V+) 2.1
(V) + 1.0
V
V
V
V
A
Arms
A
A
mA
100
(V) + 2.4
Sourcing 20A
Sinking 5A, TJ > 160C
(V) + 2.4
(V) + 0.8
65
70
1
3
4
ILIM Connected to V, IO = 0
ILIM Connected to V, IO = 0
(V) + 3.5
(V) + 0.35
+160
+140
30
17
6
40
40
55
(V) + 0.8
V
V
A
A
s
s
V
V
C
C
30
20
V
V
mA
mA
+85
+125
+125
C
C
C
f > 50Hz
dc
2
2.5
C/W
C/W
No Heat Sink
65
C/W
NOTES: (1) High-speed test at TJ = +25C. (2) Positive conventional current flows into the input terminals. (3) See Total Harmonic Distortion+Noise vs Frequency in
the Typical Characteristics section for additional power levels. (4) See Small-Signal Overshoot vs Load Capacitance in the Typical Characteristics section.
OPA548
SBOS070B
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TYPICAL CHARACTERISTICS
At TCASE = +25C, VS = 30V and E/S pin open, unless otherwise noted.
60
45
RL = 8
No
Load
90
20
135
180
40
140
Phase ()
80
Gain (dB)
No Load
100
10
100
1k
10k
100k
1M
VS = 30V
80
60
40
75
20
1
VS = 5V
120
10M
50
25
RCL = 14.7k
2
RCL = 57.6k
RCL = 57.6k
0
50
25
25
50
75
100
125
10
15
20
200
150
100
50
VS = 5V
14
12
10
VS = 30V
8
IQ Shutdown
VS = 5V
4
10
10
30
VS = 30V
IQ
16
20
25
18
Input Bias Current (nA)
20
20
75
30
50
25
25
50
75
100
125
Temperature (C)
125
Temperature (C)
0
30
100
RCL = 14.7k
0
75
75
RCL = 4.02k
4
Current Limit (A)
50
+ILIM
ILIM
RCL = 4.02k
25
Temperature (C)
Frequency (Hz)
OPA548
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SBOS070B
POWER-SUPPLY REJECTION
vs FREQUENCY
80
60
40
20
80
60
PSRR
40
20
0
10
100
1k
10k
100k
10
1M
1k
10k
100k
1M
Frequency (Hz)
110
AOL
400
95
AOL, PSRR (dB)
100
Frequency (Hz)
500
300
200
105
90
100
PSRR
85
95
100
CMRR
80
75
0
1
10
100
1k
10k
100k
1M
50
25
25
50
75
100
Frequency (Hz)
Temperature (C)
1.25
13
G = +3
RL = 8
GBW
20W
12
0.75
11
SR+
0.5
10
0.25
10W
0.1
THD+N (%)
90
125
+PSRR
CMRR (dB)
100
0.1W
1W
0.01
9
SR
0
75
50
25
25
50
75
100
8
125
0.001
20
Temperature (C)
1k
10k
20k
Frequency (Hz)
OPA548
SBOS070B
100
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(V+) VO
3
(V) VO
IO = +3A
IO = 3A
IO = +0.6A
1
IO = 0.6A
0
0
75
25
25
125
15
10
RCL =
Leakage Current (mA)
20
RL = 8
5
RCL = 0
0
5
Output Disabled
VE/S < (V) + 0.8V
0
1k
10k
100k
10
40
1M
30
20
10
10
20
Frequency (Hz)
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
20
14
Typical distribution
of packaged units.
16
14
12
10
8
6
4
30
40
Typical production
distribution of
packaged units.
12
Percent of Amplifiers (%)
100
10
Maximum Output
Voltage Without
Slew Rate Induced
Distortion
10
8
6
4
2
2
0
0
10 9 8 7 6 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 10
Offset Voltage (mV)
75
25
18
50
Temperature (C)
30
50
OPA548
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SBOS070B
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
50
G = +1
30
10V/div
Overshoot (%)
40
20
G = 1
10
0
0
2k
4k
6k
8k
10k
12k
14k
16k
18k
20k
5s/div
50mV/div
100mV/div
2s/div
2s/div
OPA548
SBOS070B
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APPLICATIONS INFORMATION
Figure 1 shows the OPA548 connected as a basic noninverting
amplifier. The OPA548 can be used in virtually any op amp
configuration.
Power-supply terminals should be bypassed with low series
impedance capacitors. The technique shown in Figure 7,
using a ceramic and tantalum type in parallel is recommended. In addition, we recommend a 0.01F capacitor
between V+ and V as close to the OPA548 as possible.
Power-supply wiring should have low series impedance.
V+
10F
+
G = 1+
0.1F(2)
R1
R2
R1
VIN
OPA548
3
1
ILIM(1)
(15000)(4.75) 13750
(1)
ILIM
E/S
7
R CL =
R2
5
VO
ZL
0.1F(2)
0.01F(2)
10F
+
POWER SUPPLIES
The OPA548 operates from single (+8V to +60V) or dual
(4V to 30V) supplies with excellent performance. Most
behavior remains unchanged throughout the full operating
voltage range. Parameters which vary significantly with operating voltage are shown in the typical characteristic curves.
Some applications do not require equal positive and negative
output voltage swing. Power-supply voltages do not need to
be equal. The OPA548 can operate with as little as 8V
between the supplies and with up to 60V between the
supplies. For example, the positive supply could be set to
55V with the negative supply at 5V, or vice-versa.
TC = 25C
=5
PD
0W
=2
6W
PD
PD
=1
0W
TC = 85C
Pulse Operation Only
T = 125C
(Limit rms current to 3A) C
0.1
1
10
20
50
100
VS VO (V)
AMPLIFIER MOUNTING
Figure 4 provides recommended solder footprints for both the
TO-220 and DDPAK power packages. The tab of both packages is electrically connected to the negative supply, V. It may
be desirable to isolate the tab of the TO-220 package from its
OPA548
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SBOS070B
RESISTOR METHOD
Max IO = ILIM
ILIM =
13750
4.75V
(4.75) (15000)
Max IO = ILIM
13750 + RCL
3
RCL
D/A
0.01F
(optional, for noisy
environments)
V
RCL =
15000 (4.75V)
ILIM
13750
4.75V
ISET
13750
RESISTOR(1)
(RCL)
CURRENT
(ISET)
VOLTAGE
(VSET)
0A
1A
2.5A
3A
4A
5A
ILIM Open
57.6k
14.7k
10k
4.02k
ILIM Connected to V
0A
67A
167A
200A
267A
333A
(V) + 4.75V
(V) + 3.8V
(V) + 2.5V
(V) + 2V
(V) + 1.1V
(V)
DDPAK-7(1)
(Package Designator KTW)
TO220-7
(Package Designator KVT)
0.45
0.04
0.2
0.05
0.085
0.15
0.335
0.51
0.05
0.035
0.105
Mean dimensions in inches. Refer to end of data sheet
or www.ti.com for tolerances and detailed package
drawings.
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. For dc signals, power dissipation is equal to
the product of output current times the voltage across the
OPA548
SBOS070B
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THERMAL RESISTANCE
vs ALUMINUM PLATE AREA
Aluminum Plate Area
18
Vertically Mounted
in Free Air
Flat, Rectangular
Aluminum Plate
16
14
0.030in Al
12
0.050in Al
10
Aluminum
Plate Thickness
0.062in Al
8
0
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
50
Circuit Board Copper Area
OPA548F
Surface Mount Package
1oz copper
40
30
20
10
0
0
OPA548
Surface-Mount Package
THERMAL PROTECTION
Power dissipated in the OPA548 will cause the junction
temperature to rise. The OPA548 has thermal shutdown
circuitry that protects the amplifier from damage. The thermal
protection circuitry disables the output when the junction
temperature reaches approximately 160C, allowing the device to cool. When the junction temperature cools to approximately 140C, the output circuitry is again enabled. Depending on load and signal conditions, the thermal protection
10
circuit may cycle on and off. This limits the dissipation of the
amplifier but may have an undesirable effect on the load.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat
sink. For reliable operation, junction temperature should be
limited to 125C, maximum. To estimate the margin of safety
in a complete design (including heat sink) increase the
ambient temperature until the thermal protection is triggered.
Use worst-case load and signal conditions. For good reliability, thermal protection should trigger more than 35C above
the maximum expected ambient condition of your application. This produces a junction temperature of 125C at the
maximum expected ambient condition.
The internal protection circuitry of the OPA548 was designed
to protect against overload conditions. It was not intended to
replace proper heat sinking. Continuously running the OPA548
into thermal shutdown will degrade reliability.
OPA548
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SBOS070B
HEAT SINKING
(1)
where, JA = JC + CH + HA
(2)
2
DDPAK or TO-220
JA = 65C/W (no heat sink)
0
0
25
50
HA =
TJ TA
( JC + CH )
PD
HA =
125C 40C
(2.5C / W + 1C / W ) = 13.5C / W
5W
DDPAK
JA = 26C/W
(3 in2 one oz
copper mounting pad)
(3)
TJ = TA + PD(JC + CH + HA)
75
100
125
Output Disable
FIGURE 7. Maximum Power Dissipation vs Ambient
Temperature.
A unique feature of the OPA548 is its output disable capability. This function not only conserves power during idle periods (quiescent current drops to approximately 6mA), but also
allows multiplexing in low frequency (f < 20kHz), multichannel applications. Signals greater than 20kHz may cause
leakage current to increase in devices that are shutdown.
Figure 18 shows the two OPA548s in a switched amplifier
configuration. The on/off state of the two amplifiers is controlled by the voltage on the E/S pin.
OPA548
SBOS070B
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11
V+
5V
OPA548
2.49k
E/S
TTL
Zetex
ZVN3310
OR
HCT
V+
V+
V
CMOS or TTL
1k
OPA548
2N3906
E/S
22k
470
Zetex
ZVN3310
V+
V
5V
OPA548
E/S
1
(1)
HCT or TTL In
4N38
V
Optocoupler
12
OUTPUT PROTECTION
Reactive and EMF-generating loads can return load current to the amplifier, causing the output voltage to exceed
the power-supply voltage. This damaging condition can be
OPA548
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SBOS070B
V+
V+
R1
5k
R2
20k
R2
= 4
R1
G=
VIN
OPA548
D1
E/S
OPA548
V
Open Drain
(Output Disable)
10
(Carbon) Motor
D2
HCT
(Thermal Status
Shutdown)
0.01F
V
D1, D2 : Motorola MUR410.
V+
5V
5V
OPA548
E/S
5
7.5k
1W
1
6
(1)
Zetex
ZVN3310
TTL Out
4
4N38
Optocoupler
HCT or TTL In
4
4N38
Optocoupler
FIGURE 13. Output Disable and Thermal Shutdown Status with Dual Supplies.
avoided with clamp diodes from the output terminal to the
power supplies, as shown in Figure 14. Schottky rectifier
diodes with a 5A or greater continuous rating are recommended.
OPA548
SBOS070B
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13
R1
R2
V+
VO = VCL (1 + R2/R1)
4.75V
13750
IO =
VCL
15000 (4.75V)
13750 + RCL
ILIM
For Example:
RCL
0.01F
(Optional, for noisy
environments)
10k 4.75V
= 2V
(10k + 13750)
Desired VO = 20V, G =
20
2
= 10
R1 = 1k and R2 = 9k
1k
9k
G=1+
+5V
9k
= 10
1k
+30V
10.5k
V+
6
Output
Adjust
10k
0.12V to 2.5V
VO = 1.2V to 25V(1)
IO = 0 to 5A
OPA548
4
3
7 E/S
74HCT04
ILIM
R 250
499
V
+5V
0V to 4.75V
Thermal
Shutdown Status
(LED)
1k
Current
Limit
Adjust
20k
0.01F(2)
14
OPA548
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SBOS070B
1k
9k
5V
OUTPUT ADJUST
VREF
+30V
G = 10
+5V
VREF A
+5V
RFB A
1/2
OPA2336
IOUT A
1/2 DAC7800/1/2(3)
VO = 0.8 to 25V(1)
OPA548
10pF
74HCT04
E/S
DAC A
AGND A
ILIM
IO = 0 to 5A
R 250
V
Thermal
Shutdown Status
(LED)
VREF B
RFB B
10pF
1/2
OPA2336
IOUT B
1/2 DAC7800/1/2(3)
DAC B
0.01F(2)
DGND
AGND B
R1
R2
VIN1
OPA548
ILIM
AMP1
E/S
RCL2
RCL1
R3
VE/S
R4
VO
VIN2
AMP2
E/S
OPA548
R2
( )
R1
ILIM
R4
( )
VO
As VO increases,
ILIM decreases.
RCL
R3
OPA548
SBOS070B
www.ti.com
15
R2
4k
R1
1k
V+
0.25
800
G= 1 +
4k
1k
= 5(1)
OPA548
ILIM
V
VO
IO = 10A (peak)(2)
VIN
V+
800
0.25
OPA548
ILIM
V
R3
1k
R4
4k
NOTES: (1) Works well for G < 10. Input offset causes output current to flow between amplifiers
with G > 10. Gains (resistor ratios) of the two amplifiers should be carefully matched to ensure
equal current sharing. (2) As configured (ILIM connected to V) output current limit is set to 10A
(peak). Each amplifier is limited to 5A (peak). Other current limit values may be obtained, see
Figure 3, Adjustable Current Limit.
16
OPA548
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SBOS070B
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
OPA548F
OBSOLETE
DDPAK/
TO-263
KTW
OPA548F/500
ACTIVE
DDPAK/
TO-263
KTW
OPA548F/500G3
ACTIVE
DDPAK/
TO-263
KTW
OPA548FKTWT
ACTIVE
DDPAK/
TO-263
OPA548FKTWTG3
ACTIVE
OPA548T
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
TBD
Call TI
Call TI
500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
OPA548F
500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
OPA548F
KTW
50
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
OPA548F
DDPAK/
TO-263
KTW
50
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-40 to 85
OPA548F
ACTIVE
TO-220
KVT
50
Green (RoHS
& no Sb/Br)
CU SN
-40 to 85
OPA548T
OPA548T-1
ACTIVE
TO-220
KC
50
Green (RoHS
& no Sb/Br)
CU SN
-40 to 85
OPA548T
OPA548T-1G3
ACTIVE
TO-220
KC
50
Green (RoHS
& no Sb/Br)
CU SN
-40 to 85
OPA548T
OPA548TG3
ACTIVE
TO-220
KVT
50
Green (RoHS
& no Sb/Br)
CU SN
-40 to 85
OPA548T
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
www.ti.com
(3)
11-Apr-2013
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
24-Apr-2013
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPA548F/500
DDPAK/
TO-263
KTW
500
330.0
24.4
OPA548FKTWT
DDPAK/
TO-263
KTW
50
330.0
24.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.95
16.5
5.15
16.0
24.0
Q2
10.6
15.6
4.9
16.0
24.0
Q2
24-Apr-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA548F/500
DDPAK/TO-263
KTW
500
346.0
346.0
41.0
OPA548FKTWT
DDPAK/TO-263
KTW
50
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MPSF015 AUGUST 2001
KTW (R-PSFM-G7)
PLASTIC FLANGE-MOUNT
0.410 (10,41)
0.385 (9,78)
0.304 (7,72)
0.006
B
0.303 (7,70)
0.297 (7,54)
0.0625 (1,587) H
0.055 (1,40)
0.0585 (1,485)
0.300 (7,62)
0.064 (1,63)
0.045 (1,14)
0.252 (6,40)
0.056 (1,42)
0.187 (4,75)
0.370 (9,40)
0.179 (4,55)
0.330 (8,38)
H
0.296 (7,52)
0.605 (15,37)
0.595 (15,11)
0.012 (0,305)
C
0.000 (0,00)
0.019 (0,48)
0.104 (2,64)
0.096 (2,44)
0.017 (0,43)
0.050 (1,27)
C
C
0.034 (0,86)
0.022 (0,57)
0.010 (0,25) M
0.026 (0,66)
0.014 (0,36)
0~3
AM C M
0.183 (4,65)
0.170 (4,32)
4201284/A 08/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead width and height dimensions apply to the
plated lead.
D. Leads are not allowed above the Datum B.
E. Standoff height is measured from lead tip
with reference to Datum B.
F. Lead width dimension does not include dambar
protrusion. Allowable dambar protrusion shall not
cause the lead width to exceed the maximum
dimension by more than 0.003.
G. Crosshatch indicates exposed metal surface.
H. Falls within JEDEC MO169 with the exception
of the dimensions indicated.
MECHANICAL DATA
MSOT010 OCTOBER 1994
KC (R-PSFM-T7)
0.420 (10,67)
0.380 (9,65)
DIA
0.113 (2,87)
0.103 (2,62)
0.185 (4,70)
0.175 (4,46)
0.055 (1,40)
0.045 (1,14)
0.147 (3,73)
0.137 (3,48)
0.335 (8,51)
0.325 (8,25)
1.020 (25,91)
1.000 (25,40)
1
0.125 (3,18)
(see Note C)
0.030 (0,76)
0.026 (0,66)
0.010 (0,25) M
0.050 (1,27)
0.300 (7,62)
0.122 (3,10)
0.102 (2,59)
0.025 (0,64)
0.012 (0,30)
4040251 / B 01/95
NOTES: A.
B.
C.
D.
E.
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