LM741

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SNOSC25B MAY 2004 REVISED OCTOBER 2004

LM741 Operational Amplifier

Check for Samples: LM741

FEATURES
1 Overload protection on the input and output
2 No latch-up when the common mode range is
exceeded

DESCRIPTION
The LM741 series are general purpose operational amplifiers which feature improved performance over industry
standards like the LM709. They are direct, plug-in replacements for the 709C, LM201, MC1439 and 748 in most
applications.
The amplifiers offer many features which make their application nearly foolproof: overload protection on the input
and output, no latch-up when the common mode range is exceeded, as well as freedom from oscillations.
The LM741C is identical to the LM741/LM741A except that the LM741C has their performance guaranteed over a
0 C to +70 C temperature range, instead of 55 C to +125 C.

CONNECTION DIAGRAM
LM741H is available per JM38510/10101

Figure 1. Metal Can Package

Figure 2. Dual-In-Line or S.O. Package

Figure 3. Ceramic Flatpak

TYPICAL APPLICATION

Figure 4. Offset Nulling Circuit

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Copyright 2004, Texas Instruments Incorporated

LM741
SNOSC25B MAY 2004
REVISED OCTOBER 2004

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or
handling to prevent
electrostatic damage
to the MOS gates.

Absolute Maximum
Ratings(1) (2)
Supply Voltage
Power Dissipation

(3)

LM741A

LM741

LM741C

22V

22V

18V

500 mW

500 mW

500 mW

Differential Input Voltage

30V

30V

30V

Input Voltage

15V

15V

15V

Continuous

Continuous

Continuous

Operating Temperature Range

55 C to +125 C

55 C to +125 C

0 C to +70 C

Storage Temperature Range

65 C to +150 C

65 C to +150 C

65 C to +150 C

150 C

150 C

100 C

260 C

260 C

260 C

300 C

300 C

300 C

215 C

215 C

215 C

215 C

215 C

215 C

(4)

Output Short Circuit Duration

Junction Temperature
Soldering Information
N-Package (10 seconds)
J- or H-Package (10
seconds)
M-Package
Vapor Phase (60
seconds)
Infrared (15 seconds)

See AN-450 Surface Mounting Methods and Their Effect on Product Reliability for other methods of soldering surface mount devices.
ESD Tolerance

(5)

400V

400V

400V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits.

(2)
(3)
(4)
(5)

For military specifications see RETS741X for LM741 and RETS741AX for LM741A.
For operation at elevated temperatures, these devices must be derated based on thermal resistance, and T j max. (listed under Absolute
Maximum Ratings). Tj = TA + (jA PD).

For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage.
Human body model, 1.5 k in series with 100 pF.

Electrical Characteristics(1)
Parameter

Conditions

LM741A
Min

Input Offset Voltage

LM741

Typ

Max

0.8

3.0

Min

Max

1.0

5.0

Min

Units

Typ

Max

2.0

6.0

TA = 25 C
RS 10 k
RS 50

AMIN

mV
mV

AMAX

RS 50

4.0

mV

RS 10 k

6.0

Average Input Offset Voltage

Drift
Input Offset Voltage

LM741C

Typ

7.5

15
TA = 25 C, VS = 20V

10

mV
V/ C

15

15

mV

Adjustment Range
Input Offset Current

TA = 25 C
T
T
AMIN

3.0

AMAX

Average Input Offset

Current Drift
Input Bias Current

20

200

70

85

500

20

200

nA

300

nA

0.5
TA = 25 C
T
T
AMIN

Input Resistance

30

30

AMIN

AMAX

80

80

0.210

AMAX

TA = 25 C, VS = 20V

nA/ C

1.0

6.0

500

80

1.5
0.3

2.0

0.3

500

nA

0.8

2.0

0.5

VS = 20V

(1) Unless otherwise specified, these specifications apply for VS = 15V, 55 C TA +125 C (LM741/LM741A). For the LM741C/LM741E,
these specifications are limited to 0 C TA +70 C.
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74
1
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SNOSC25B MAY 2004 REVISED OCTOBER 2004

Electrical Characteristics

(1)

(continued)

Parameter

Conditions

LM741A
Min

Input Voltage Range

TA = 25 C
T
T
AMIN

Large Signal Voltage Gain

Typ

LM741
Max

AMAX

Min

Typ

12

13

50

200

LM741C
Max

Min

Typ

12

13

Units
Max
V
V

TA = 25 C, RL 2 k
VS = 20V, VO = 15V

50

VS = 15V, VO = 10V

AMIN

AMAX

20

200

V/mV
V/mV

RL 2 k,
VS = 20V, VO = 15V

32

V/mV

VS = 15V, VO = 10V
10

V/mV
V/mV

RL 10 k

16

RL 2 k

15

VS = 5V, VO = 2V

Output Voltage Swing

25

15

VS = 20V

VS = 15V

Output Short Circuit

Current

RL 10 k

12

14

12

14

RL 2 k

10

13

10

13

25

mA

TA = 25 C
T
T

AMIN

Common-Mode
Rejection Ratio
Supply Voltage Rejection

AMIN

10

AMAX

AMIN

10

35

25

40

mA

AMAX

RS 10 k, VCM = 12V
RS 50, VCM = 12V

25

AMAX

80

95

86

96

70

90

70

90

RS 50
RS 10 k
Transient Response

77

96

77

96

dB
dB
s

TA = 25 C, Unity Gain

Rise Time

0.25

0.8

0.3

0.3

Overshoot

6.0

20

Slew Rate

dB
dB

VS = 20V to VS = 5V

Ratio

Bandwidth

(2)

TA = 25 C
TA = 25 C, Unity Gain

0.437

1.5

0.3

0.7

%
MHz

0.5

0.5

V/s

Supply Current

TA = 25 C

Power Consumption

TA = 25 C
VS = 20V

80

2.8

1.7

2.8

mA

50

85

50

85

mW
mW

150

VS = 15V
VS = 20V

LM741A

T
T

=T

=T

165
135

AMIN

AMAX

mW
mW

VS = 15V

LM741

T
T

(2)

1.7

=T

=T

60
45

AMIN

AMAX

100
75

mW
mW

Calculated value from: BW (MHz) = 0.35/Rise Time (s).

Thermal Resistance

jA (Junction to Ambient)
jC (Junction to Case)

Cerdip (J)

DIP (N)

HO8 (H)

SO-8 (M)

100 C/W

100 C/W

170 C/W

195 C/W

N/A

N/A

25 C/W

N/A

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Copyright 2004, Texas Instruments Incorporated

Product Folder Links: LM741

LM741
SNOSC25B MAY 2004 REVISED OCTOBER 2004

www.ti.com

SCHEMATIC DIAGRAM

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Copyright 2004, Texas Instruments Incorporated

Product Folder Links: LM741

PACKAGE OPTION ADDENDUM

www.ti.com

17-Nov-2012

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package Qty

Drawing

Eco Plan

Lead/Ball Finish

(2)

MSL Peak Temp

Samples

(3)

(Requires Login)

LM741CH

ACTIVE

TO-99

LMC

500

TBD

LM741CH/NOPB

ACTIVE

TO-99

LMC

500

Green (RoHS
& no Sb/Br)

POST-PLATE

POST-PLATE Level-1-NA-UNLIM
Level-1-NA-UNLIM

LM741CN

ACTIVE

PDIP

40

TBD

Call TI

Level-1-NA-UNLIM

LM741CN/NOPB

ACTIVE

PDIP

40

Green (RoHS
& no Sb/Br)

Call TI

Level-1-NA-UNLIM

LM741H

ACTIVE

TO-99

LMC

500

TBD

LM741H/NOPB

ACTIVE

TO-99

LMC

500

Green (RoHS
& no Sb/Br)

POST-PLATE Level-1-NA-UNLIM
POST-PLATE

Level-1-NA-UNLIM

Call TI

Level-1-NA-UNLIM

LM741J

ACTIVE

CDIP

NAB

40

TBD

U5B7741312

ACTIVE

TO-99

LMC

500

TBD

POST-PLATE Level-1-NA-UNLIM

U5B7741393

ACTIVE

TO-99

LMC

500

TBD

POST-PLATE Level-1-NA-UNLIM

U9T7741393

ACTIVE

PDIP

40

TBD

Call TI

Level-1-NA-UNLIM

(1)

The marketing status values are defined as

follows: ACTIVE: Product device recommended for new
designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the
latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances,including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. PbFree (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided
by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

17-Nov-2012

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceedthe total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page
2

MECHANICAL DATA

NAB0008A

J08A (Rev M)

www.ti.com