MECH 5310/6310/6316 - Mechanics of Electronic Packaging

HW #1
Due: Thursday, February 12, 2015

For all problems, show all of your work to receive complete credit.
All questions refer to the cutaway view of a Quad Flat Pack (QFP) shown below.
Stresses, strains, and displacements are generated in the various parts of the QFP
during the chip encapsulation process and during solder reflow when the package is
surface mounted on a printed circuit board.

x3

e 3
e 1
x1

e 2

x2

C
B

1. At point A, a state of plane stress exists as shown below.

x2
45

15

x1

40
[a]
[b]

Write down the (3 x 3) stress matrix [ ij ] .

Using two-dimensional formulas from mechanics of materials, calculate the
normal and shear stresses on the rotated plane indicated.

2. For the state of plane stress at point A shown above, complete the following using
two-dimensional formulas from mechanics of materials:
[a]
[b]

Find the three principal stresses.

Find the three principal directions by first finding the principal angle p , and

[c]

then use it to express the principal directions as a set of three orthogonal unit
normal vectors.
Find the maximum shear stress for planes with normal vectors that lie in the
( x1 , x 2 ) plane.
Find the absolute maximum shear stress.

[d]

3. For the state of plane stress at point A shown above, find the three principal stresses
using the three-dimensional cubic equation approach.
4. At point B on the silicon chip, the state of stress has been measured to be:
11 50 MPa 22 25 MPa 33 15 MPa
12 15 MPa 13 30 MPa 23 15 MPa

[a]
[b]

Write down the (3 x 3) stress matrix [ ij ] .

Find the complete state of stress at point B in the rotated primed coordinate
system shown below for the angle = 60o.

x3

x1
x1

x3

x2

x2

5. For the state of stress at point B given above, find the

[a]
[b]
[c]

Stress vector
Normal stress
Shear stress

that act at point B on the plane defined by the unit normal vector
12
15
16
n
e 1
e 2
e 3 .
25
25
25
6. For the state of stress at point B given above, complete the following:
[a]
[b]

[c]

[d]
[e]

Calculate the three principal stresses using the cubic equation approach.
Using the mathematical software package of your choice (e.g. Matlab,
MathCAD, Mathematica, etc.), repeat the calculation of the three principal
stresses by solving a matrix eigenvalue (principal value) problem. Include a
printout of your work and an interpretation of the results.
Using the mathematical software package of your choice (e.g. Matlab,
MathCAD, Mathematica, etc.), calculate the three principal directions
(eigenvectors). Include a printout of your work. Interpret the results and
express your answer as a set of three orthogonal unit normal vectors.
Calculate the three angles that the first principal direction makes with the x 1, x2,
and x3 coordinate axes.
Calculate the absolute maximum shear stress.

7. Point C is on the outside surface of the encapsulant as shown. With only this
information, find the values of three of the six stress components at point C.