Escolar Documentos
Profissional Documentos
Cultura Documentos
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1.
2.
Production Plants
5.
High Current
Wirelaid
3.
Rigid-Flex
6.
Wire Bonding
4.
HDI
Thermal
Management
7.
Services
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Production Plants
Portfolio and Specialities
Data Preparation
Prototyping
Mysore
Rot am See
100
engineers
All
technologies
24
R&D
site
Series Production
Niedernhall
Multilayer
PCB from
4-20 layers
Rigid-flex
PCBs
Schopfheim
Microvia
HDI
Thermal
Management
Signal
Integrity
Foldflex
Polymer
Wirelaid
Wire
Headquarters
Asia
2 partners
for
standard technology
2 partners
for
advanced technology
Bonding
of the
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Production Plants
Investments
in Million
23,1
12,1
11,7
7,7
3,1
2008
June 2014 Page 4
2009
2010
4,3
4,1
2011
2012
2013
2014
estimated
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Individual
logistics solutions
Standardized documentation
F rom prototype to large series
WE have the expertise
HDI, Rigid-Flex,
Heatsink
40%
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Rigid-Flex
Easy testability
Increased reliability
Twinflex
Starrflex
Semiflex
Applications for:
Industrial, aerospace, automotive, vision systems,
medical technology, sensors
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Rigid-Flex
Customized solutions
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HDI Microvia
Advantages:
Miniaturization
High reliability
Flexibility in design
Independent fan out on the top and bottom side of the PCB through microvias
June 2014 Page 8
0.50 mm
Pitch
BGA Pad
275 m
clearance 35 m
solder Mask
track width inner outer layers 75 m
conductor spacing inner outer layers 75 m
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HDI Microvia
Impedances
Controlled production
Measurement
and documentation
of impedances using test coupons
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Thermal Management
Miniaturization
Cooling
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Thermal Management
Cavitie
for Opti
mal Hea
Dissipati
on
Cavities for Optimal
Heat Dissipation
Optimal
Microvias
for thermal
cooling
Aluminium Heatsink
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Wirelaid
Wirelaid + Semiflex = Powerflex
Combination
Combination
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Wire Bonding
Advantages:
Miniaturization
High reliability
Design flexibility
Simple repair
Diverse
substrate/component combinations
Improved heat dissipation of unpackaged components, in particular for LEDs, resulting in longer service life, further benefits gained when combineed with
laser cavities
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Wire Bonding
Applications:
Infrared sensors
Services
Webinars:
Prototyping:
Design
Guides:
Useful tips about technical
capabilities and Design Rules
WEdirekt:
Thank you
What
challenges
do you have?
How can we
help you?
June 2014 Page 17
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