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Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description
Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
power cord
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Product Information
Disassembly Procedure
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Product Information
EL-MF877-00
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The product is a AIO-PC. The weight of this product excluding package is 5101.79 g.
The appearance of the product is as follows:
2. Disassembly Procedure
3.1 Flow Chart for Disassembly Procedure:
The disassembly procedure taken here is in accordance with the treatment requirements under the Annex II of
the WEEE Directive. In addition to considering economic and efficiency factors, manual operation and
disassembly tools have been applied to separate the components and materials from this product in order to
simulate the scenario at the treatment facility, and to achieve the objective that the separated components and
materials can be reused, recycled and recovered.
EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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EL-MF877-00
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