Escolar Documentos
Profissional Documentos
Cultura Documentos
Handel et a1.
[45]
[54]
[75]
Date of Patent:
Sep. 6, 1994
AND METHOD
[57]
ABSTRACI
gal-3,12%;ogml?glgnfgssanlf'vgziilways
[22] F?ed:
[51]
[52]
5,345,397
Nov 25 1991
References Cited
[56]
4,344,142
1?;
264/23
364/473
mutto
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US. Patent
Sep. 6, 1994
Sheet 3 of 9
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US. Patent
Sep. 6, 1994
Sheet 5 0f 9
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Maximum Offset
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1 80
1 60
MAX
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FIG. '7
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RES|N_HEAT
deg F
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35
45
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TIME (min)
FIG. 8
as
95
US. Patent
Sep. 6, 1994
Sheet 8 of 9
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US. Patent
Sep. 6, 1994
Sheet 9 of 9
5,345,397
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alpha
FIG. 14
5,345,397
of the cure.
ture.
determined value.
US. Pat. Nos. 4,455,268 and 4,515,545 describe sys
called prepreg containing ?bers impregnated with resin
tems for controlling the cure process of ?ber-reinforced
in a partially cured, intermediate reaction state, the
composite materials. The attenuation of an ultrasonic
B-stage. In the condition received by a manufacturer 25 wave introduced into the part being cured is used to
from the supplier, the resin reaction, or degree of cure,
determine viscosity of the part, which is compared to
is about 12 percent completed. Continued reaction of
reference viscosity data and used to control tempera
the resin occurs with passage of time and is accelerated
ture and pressure of the part in conformance with de
with increased temperature; therefore, to retard this
sired
reference values for these variables.
30
reaction, the material is stored until use below room
The
system of US. Pat. No. 4,828,472 controls heat
temperature. As the reaction advances, the resin poly
ing
elements
and pressurizing devices so that tempera
merizes, i.e., polymers form and are cross linked until
ture is equalized at various locations on the part being
the resin is no longer plastic but solid. Accordingly, the
5,345,397
15
20'
25
lag times.
EMBODIMENT
ing execution of process control algorithms. The com
puter includes a central processing unit where arithme
Referring now to FIG. 1, the apparatus includes an
tic functions and logic functions are executed. Control
autoclave 12, a pressurized chamber about 30 feet long,
signals resulting from execution of the algorithms are 55 an autoclave temperature control device including a
presented at output ports connected to process equip
suitable heating element 14, a gas-?red burner; cooling
ment that responds to the output control signals.
element 16, and fan 18. The burner is connected to a
Process data is read periodically, preferably every 30
source of natural gas or another energy source, such as
5,345,397
exceeded and then obtains all cure process data for the
5,345,397
(1)
graphite tool.
The OCCS heat phase extends from the beginning of
the cure until all temperature sensors on the part indi
X(k=1)=X(k)F(X(k))/F (X(k))
completed.
k: l
20
is illustrated in FIG. 5.
m
t is time;
DELTA t is time between successive executions of
the process control model-30 seconds;
T1 is part temperature at time t1;
T2 is part temperature at time t2+DELTA t;
resin properties;
T is temperature;
BETA is resin property.
Virtually no exothermal heat is produced in the resin
between room temperature and 210 degrees; therefore,
the OCCS calculates lag time, a measure of the effective
thickness of the part, from the start of the cure cylcle at
room temperature until the part temperature reaches 65
(BETA ALPHA)
(3)
d(ALPHA)/dT=K3 (1 ALPHA)
if ALPHA is less than 0.3
where,
(3)
5,345,397
10
(4)
25
ALPHA corresponding to
Resin heat, a function of lag time, theoretically the
total quantity of heat energy due to polymerization
present in the part. This energy is released in a narrow
range of degree of cure; therefore a single maximum
zero.
Offset=output*max offset
45
output:((alpha-doc1)/(doc2-doc1) "power
power=fall power, if docl is between alpha and doc2
power=rise power, if doc2 is between alpha and
doc3
For the Hercules resin system referred to above docl
ing schedule:
the
optimal
autoclave
temperature
equals
11
5,345,397
12
the resin
cure;
25
temperature;
repetitively determining the maximum offset in the
computer at frequent intervals;
following relationship:
13
5,345,397
14
t2+DELTA t;
TF1 is the temperature of the autoclave at time t1;
TF2 is the temperature of the autoclave at
t2+DELTA t;
B is the temperature of the autoclave heat rate;
EXP is an exponential function;
X is a lag time; and
D(ALPHA)/DT is the time rate of change of the
tz-l-DELTA t;
TF1 is the temperature of the autoclave at time t1;
TF2 is the temperature of the autoclave at
degree of cure.
t2+DELTA t;
part to be cured;
measuring the temperature of the part to be cured;
d(ALPHA)/dT=(K1+K2ALPHA) (1 -ALPHA)
(BETA ~ALPHA)
25
resin;
where,
cure;
30
following relationships:
wherein
t is time;
DELTA t is the time between successive intervals;
T1 is the temperature of the part to be cured at time
55
following relationship:
wherein
t is time;
DELTA t is the time between successive intervals;
65
T1 is the temperature of the part to be cured at time
t1;
T2 is the temperature of the part to be cured at time
t2+DELTA t;
15
5,345,397
t2+DELTA t;
(BETA -ALPHA)
where,
of cure.
t is time;
DELTA t is the time between successive intervals; 30
T1 is the temperature of the part to be cured at time
T2 is the temperature of the part to be cured at time
t2+DELTA t;
35
EXP is an exponential function;
D(ALPHA)/DT is the time rate of change of cure;
A1, A2, A3 are material properties of the resin;
DELTA AEl, DELTA AE2, DELTA AE3 are
resin properties;
R is the universal gas constant;
T is temperature; and
BETA is a resin property.
16. The method of claim 10 wherein the ambient
temperature, the temperature of the part to be cured 45
and the elapsed time are measured substantially concur
resin;
determining the optimal autoclave temperature from
the degree of cure; and
changing the ambient temperature to the optimal
ambient temperature.
19. The method of claim 18 further comprising the
steps of:
supporting the part to be cured on a support surface;
sealing the part to be cured air-tight in a space;
following relationships:
50
55
60
65