Simulation Modelling of MEMS Thermoelectric

Generators for Mechatronic Applications

L. Janak1, Z. Ancik2, and Z. Hadas1
1

Brno University of Technology, Faculty of Mechanical Engineering,

Technicka 2, 616 69, Brno, Czech Republic
ludek.janak@gmail.com, hadas@fme.vutbr.cz
2
Unis, a.s., Mechatronic & embedded systems, Jundrovska 33, 624 00,
Brno, Czech Republic
ancikzdenek@seznam.cz

Abstract. This paper deals with an introduction to the simulation modelling of

transient behaviour of MEMS thermoelectric generators (TEGs) for mechatronic
applications. Special emphasis is put on the simulation of recently commercially
achievable modules. At first is given the overview of prospective mechatronic
applications of MEMS TEGs and the existing commercially achievable MEMS
TEG modules are listed in a short trade review. Afterwards, the main features of
thermoelectric energy conversion are described together with the simple governing equations. In the main part of paper is presented the simulation model for
investigations of transient behaviour of MEMS TEG module. Derived model is
implemented in MATLAB/Simulink Simscape. Results given by dynamic model
are compared with results obtained by other modelling approaches and transient
behaviour of MEMS TEG is evaluated.

Introduction

Thermoelectric generators are one of the promising ways to produce the environmentally clean energy. Due to their relatively small efficiency are particularly
considered their applications in the field of thermal energy harvesting recovery
of the small amounts of waste heat to the useful electric energy [1]. The main
advantages for the use of TEGs in mechatronic applications are no movable parts
which represent low demands on maintenance.
Promising area is the use of small amounts of locally harvested energy for
powering the wireless applications, telemetry units, sensors, etc. This approach is
particularly advantageous in the places where is difficult to trace wiring or where
the battery replacement is challenging due to disassemble difficulties. Typical
cases of this kind of application are the diagnostic systems in aerospace field [2,
3], portable medical devices [4], or autonomous measurement units in process
control systems [5].
T. B ezina and R. Jabloski (eds.), Mechatronics 2013,
DOI: 10.1007/978-3-319-02294-9_34, Springer International Publishing Switzerland 2014

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L. Janak, Z. Ancik, and Z. Hadas

Wider commercial use of the MEMS thermoelectric generators is in its infancy [6]. There are only a few existing commercial solutions in the field of
MEMS TEGs and even fewer amount could be bought as a standalone solution.
Standalone MEMS solutions have been developed by Micropelt GmbH [7], Nextreme Thermal Solutions, Inc. [8], Thermo Life Energy Corp., Inc. [9], Hi-Z
Technology, Inc. [10] and Perpetua Power Source Technologies, Inc. [11]. Modules from the first two above-mentioned manufacturers Nextreme and Micropelt
which are currently easily achievable through worldwide electronics components retailers are shown in Fig. 1.

b)

a)

Fig. 1 a) Micropelt TGP-751 in package [8], b) Nextreme eTEG HV56 [9]

In this paper is presented an approach to the modelling of MEMS TEG based

on simulation model implemented in MATLAB/Simulink Simscape. The model is
capable to carry out the dynamic simulations which give us the overview of transient behaviour and other time-domain properties of MEMS TEG. The model
input data were set according to the specific case of Nextreme eTEG HV56 [12].

Basic Principles of Thermoelectricity

Physical nature of thermal energy harvesting - the Seebeck effect is based on the
diffusion of electrons through the interface between two different materials conductors or semiconductors. This diffusion is achieved by applying a heating at the
junction of two materials which make a thermocouple. Heating causes the net
changes in the materials and allows electrons to move from material where they
have lower energy into material where the energy of electrons is higher. Because
the electrical current is exactly a flow of electrons, this effect of passing electrons
from one material to another makes an electromotive force (voltage) on the
terminals of thermoelectric module [1, 13, 14]. Generated open circuit voltage is
linearly dependant on the temperature difference between hot and cold sides of
thermoelectric module:

U oc = N . . TH TC

(1)

where N is number of thermocouples, is differential Seebeck coefficient (material

constant), TH is hot-side temperature and TC is cold-side temperature [13].

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267

In practical applications is TEG operated with electric load RL (Fig. 2). TEG is,
in fact, the temperature-controlled constant voltage source with internal resistance
Ri. Thus the voltage UL on load is:
UL =

RL
R L + Ri

.U oc

(2)

Current IL in the TEG circuit can be easily calculated using Ohms law. The
maximum power point (MPP) is achieved when Ri = RL. This mode of operation is
called operation with matched load. Operation in the MPP mode with maximum
electrical power on load PL is desired in the most of applications [13].

Fig. 2 Principle of operation of TEG into the load resistance RL (current IL, voltage UL)

TEG is, in fact, a type of heat engine operating between two temperatures TH
and TC. Thus a theoretical efficiency of the thermoelectric energy conversion is
limited by the Carnots Theorem [1]. The efficiency of real TEG is exactly around
2 5 %. This reduction is caused by the materials- or design-related problems.
Enhancement of efficiency and higher integration with surrounding systems are
the tasks for MEMS and NEMS TEGs. [14]

Dynamic Model in MATLAB/Simulink Simscape

The considered dynamic model is an extension of steady-state Simscape model

published in [15]. Parts of the model describing the transient behaviour of TEG
are built-in according to the scheme of SPICE model described in [16]. Derived
model was implemented in Simscape using the objects from Electrical and Thermal folders of Foundation Library. Overview of the model is shown in Fig. 3 5.
The whole simulation model consists of the thermal and electrical part and
model of interconnections between these parts. The thermal part, shown in Fig. 3,
is composed of thermal resistances and masses of wafer and thermocouples (Rwafer,

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L. Janak, Z. Ancik, and Z. Hadas

Cwafer, Rtcs, Ctcs). Thermal materials properties are not directly offered by manufacturer and their estimation based on information from [12, 14] is necessary. Temperature dependences of the materials were neglected and their fixed values
were estimated at the room temperature. Ideal heat flow sources Qjoule, QpelC and
QpelH represent phenomena of the Peltier cooling and Joule heating which occur in
TEG.

Fig. 3 Thermal Part of Model Implemented in Simscape

Heat fluxes generated by heat flow sources are dependant on the current passing through the electrical part of TEG model. Thus the thermal and electrical parts
are interacting together. Equations describing the implementation of multi-domain
phenomena of Peltier cooling and Joule heating are shown in Fig. 4.

Fig. 4 Model of interconnections between thermal and electrical parts

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269

Finally, the electrical part of TEG is built as the constant voltage source with
internal resistance as described in the chapter 2. Output voltage is controlled by
the real temperature difference on the thermocouples. Implementation of electrical
part is shown in the Fig. 5.

Fig. 5 Electrical Part of Model

Examined time-dependant output values from above-described simulation

model include the voltage on load UL, current through the circuit IL and resulting
electrical power PL.

3.1

Comprehension of Results

Transient behaviour of MEMS TEG module was examined by applying the step
function of hot-side temperature TH. Input simulation parameters are set to the
temperature difference of 50 C and matched resistive load. Resulting step response of voltage UL is shown in Fig. 6. As could be seen in Fig. 6, the occurring
time constant is in the millisecond range. This rapidity is caused by the very small
thermal masses appearing in the MEMS TEG module.

Fig. 6 Step response of dynamic Simscape model (MEMS eTEG HV56, conditions:
Tout = 50 C, TC = 25 C, TH = 75 C, TH applied at t = 0)

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L. Janak, Z. Ancik, and Z. Hadas

The steady-state value reached by the dynamic model was compared with results of other simulation modelling approaches. Steady-state values are listed and
compared below in the Table 1. In the comparison are included results given by
the simple modelling approach using (2) and Ohms law, Analytic Model with
Constant Resistances [14, 17] and FEM analyses [15]. Obtained output values are
also compared with the datasheet values provided by manufacturer in [12].
Table 1 Comprehension of results (conditions: T = 50 C, TC = 25 C, TH = 75 C,
matched load)
Type of Model

Voltage on the
Passing current
matched load UL [V] IL [mA]

Produced electric
power PL [mW]

Simscape dynamic

0,651

41,552

Voltage source with Ri

63,784

0,688

67,412

46,379

Analytic with contact res. 0,566

62,393

39,318

FEM (ANSYS)

0,688

Datasheet value

0,6

60

36

Conclusions

The above-described dynamic model of MEMS TEG was successfully implemented in Simscape and verified by application of the trivial input conditions
constant temperature difference and matched load. Very small time constant in the
millisecond range was observed. The maximal observed difference between datasheet value and simulation was 15,4 % (PL). In the comprehension with other
simulation modelling approaches was observed the maximum difference of 15 %
in the case of voltage UL and analytic model with contact resistances. These inaccuracies could be reduced by identification of input parameters based on measurement. Better identification of input parameters and verification of models based
on MEMS TEG module measurements are the tasks for future development.
The biggest challenges for the further work in energy harvesting area are the
co-simulations with surrounding systems [18]. The Simscape model will be
chiefly used for the co-simulations of MEMS TEG with surrounding power conditioning electronics.
Acknowledgments. This work has been funded by the European Commission within the

FP7 project "Efficient Systems and Propulsion for Small Aircraft | ESPOSA", grant agreement No. ACP1-GA-2011-284859-ESPOSA. And this work has been additionally supported by the project "Complex Affordable Aircraft Engine Electronic Control (CAAEEC)"
TA02010259 under The Technology Agency of the Czech Republic.

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