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192.168.1.

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255.255.255.0

4.7 WARP-L Blade


Types of WARP-L:
WARP-Lv1 S30861-Q511-X
The WARP-L blade is a general purpose processor blade and it can accept up to two
mezzanines baldes in order to specialize its functions.
The WARP-L blade is used in the eBSC equipment as a motherboard acting as a UPM
or STM-1 depending on the type of the mezzanines equipped on it.
The WARP-L blade max configuration is 14 in Upper Shelf and 12 in Lower Shelf.

WARP BLADE

4.1 SMAC Blade


Types of SMAC:
SMACv3 S30861-Q500-X
The Switching Matrix And Control (SMAC) blade provides:
The Ethernet backbone for all blades in the same shelf
Inter-shelf connections
Main Clock Generator
The SMAC blade max configuration is 1+1 in Upper Shelf and 1+1 in Lower Shelf.

SMAC BLADE

4.1.1 AM4001
The AM4001 Front is equipped with:
four AMC LEDs;
four module LEDs;
One USB 2.0 host port;
One USB 1.1 serial-to-USB port.

4.2 eIOSM Blade


Types of eIOSM:
eIOSMv3 S30861-Q505-X
The eIOSM blade is the Input/Output blade associated one by one to the SMAC blades.
The eIOSM max configuration is 1+1 in Upper Shelf and 1+1 in Lower Shelf.

eIOSM

4.3 LIET Blade


Types of LIET:
LIETv1 S30861-Q483-X100
The Line Module E1/T1 terminates PCM and L2 for Abis, Asub, Gb, Lb and X.25 / 64
Kbit/s (LIET performs the processing portion of Line Module E1/T1).
The LIET configuration is n+1 in Upper Shelf.

LIET

4.4 IOLI75 Blade


Types of IOLI75:
LIETv1 S30861-Q492-X
The IOLI75 is a Input/Output Line Interface, a module that provides the line termination.
The IOLI75 max configuration is 9 in Upper Shelf.

4.5 IOLI120 Blade


Types of IOLI120:
LIETv1 S30861-Q491-X
The IOLI120 is a Input/Output Line Interface, a module that provides the line termination.
The IOLI120 max configuration is 9 in Upper Shelf.

4.6 WARP Blade


Types of WARP:
WARPv1 S30861-Q499-X
The WARP blade is a general purpose processor blade and it can accept up to two mezzanines
baldes in order to specialize its functions.
The WARP incorporates also the hot redundancy circuitry needed on the AP and MCP
blades.
The WARP blade is used in the eBSC equipment as a motherboard acting as a MCP,
AP depending on the type of the mezzanines equipped on it.
To achieve the AP functions no mezzanines are needed.
The WARP blade max configuration is 4 in Upper Shelf and 14 in Lower Shelf.

WARP

4.7 WARP-L Blade


Types of WARP-L:
WARP-Lv1 S30861-Q511-X
The WARP-L blade is a general purpose processor blade and it can accept up to two
mezzanines baldes in order to specialize its functions.
The WARP-L blade is used in the eBSC equipment as a motherboard acting as a UPM
or STM-1 depending on the type of the mezzanines equipped on it.
The WARP-L blade max configuration is 14 in Upper Shelf and 12 in Lower Shelf.

WARP L

5.1 GEAR
Types of GEAR:
GEARv1 S30861-Q504-X
This mezzanine blade is equipped on WARP-L Blade (carrier): the assembly of the processor
blade WARP-L and two GEARs constitutes the so called UPM (User Plane
Module) functional part.
The mezzanine GEAR board hardware is composed of 2 main blocks: an Ethernet
handler and a Abis channel handler (for PCU Frame processing).

GEAR

5.2 SLIM
Types of SLIM:
SLIM v1 S30861-Q502-X
The SLIM blade is a mezzanine that can be equipped on the WARP-L Blade in order to
provide eBSC equipment with connectivity for E1/T1 traffic over channelized
STM1/OC3.
The assembly of the WARP-L with two STM-1 AMCs, which can be either both channelized
(SLIM) or mixed (SLIM+USLIM), builds up the so called LM-STM1/OC3 or LISO.

SLIM

5.3 USLIM
Types of USLIM:
USLIM v1 S30861-Q510-X
The USLIM blade is a mezzanine that can be equipped on the WARP-L Blade in order
to provide eBSC equipment with connectivity for E1/T1 traffic over unchannelized
STM1/OC3.
The assembly of the WARP-L with two STM-1 AMCs, which can be either both unchannelized
(USLIM) or mixed (SLIM+USLIM), builds up the so called LM-STM1/OC3 or
LISO.
SLIM codes:
S30861-Q510-X Unchannelized STM1-Line Interface Mezzanine

USLIM

5.4 T-REX
Types of T-REX:
T-REXv1 S30861-Q503-X
The T-REX blade is a mezzanine that is to be equipped on the WARP Blade in order to
provide the following functions:
A connection to LMT with a fast ethernet port one (10/100 BASE-T)
Connection to O-Link and RC/CBC (Radio Commander / Cell Broadcast Center)
Link with a fast ethernet port one (10/100 BASE-T)
Connection to O-Link and RC/CBC Link via X.25 with two independent ports (RS422 and X.21 interface on SUB-D15 female connector)
On front panel of T-REX a led is provided to show the MCP active/standby status.

5.5 HDD
Types of HDD:
HDD80 v1 S30861-U16-X
The HDD blade is a mezzanine that is to be equipped on the WARP Blade.

HDD

6.1 LISO (LM-STM1/OC3)


Types of LISO:
LISO v1 S30861-Q500-X
This blade is the interface module supports unstructured Gb traffic to/from the PS core
network.
Each LISO blade supports 2 optical ports, which can be configured in STM-1 structured
mode (Abis/Asub; Gb Hw prepared) or STM-1 unstructured mode (only Gb). When both
ports work in STM-1 structured mode, the card supports 126 equivalent E1 lines.
The LISO funtionality is provided by a WARP-L Blade with two SLIM mezzanine.
The LISO uses a 1+1 redundancy configuration.
At most 4+4 LISO can be configured on a eBSC rack.

WARP +SLIM +SLIM

6.2 MCP (Main Control Processor)


Types of MCP:
MCP v1 xxxxxxxx
The Main Control Processor module provides the following funtionality:
O&M Central function
Communication with dependent blades
Ethernet for IP-based O-link and LMT
X.25 for legacy O-link
The MCP functionality is realized by the WARP Blade with a T-REX and a HDD mezzanine.
The MCP configuration is 1+1 in Upper Shelf or 1+1 in Lower Shelf.

WARP +T-REX +HDD

6.3 UPM (User Plane Module) pcu


Types of UPM:
UPM v1 xxxxxxx
The Several User Plane Modules support PS services.
The UPM may be also optionally configured as Central Network Service Module.
The UPM functionality is realized by the WARP-L Blade with two GEAR mezzanine.

WARP +GEAR +GEAR

6.4 AP (Application Processor)


Types of AP:
AP v1 S30861-Q499-X
The Application Processor funtionality supports distributed call processing.
The AP can be configured as:
AP-Master processor
AP-Dependent processor
The AP functionality is realized by the WARP Blade processor without mezzanine.
The AP run in 1+1 redundancy configuration.

WARP

7.1 ShMC Blade


Types of ShMC:
ShMCv1 S30861-Q506-X
The Shelf Manager Controller blade (ShMC), based on Pigeon Point Shelf Management
Mezzanine module provides the management of the shelves of eBSC.

7.2 SAP Blade


Types of SAP:
SAPv1 S30861-Q493-X
The Shelf Alarm Panel (SAP) is the unit that provides the Telco alarm interface of eBSC
shelf.
On its front plate are available the Telco alarms connector for remote monitoring, the
Telco alarm LEDs, the Telco alarm reset push button and a connector to route Telco
Minor, Major and Critical alarms signals to the rack Lamp Panel.
The SAP blade is connected, with a master I2C bus, to both ShMC but only the active
ShMCr has access to SAP.
The SAP configuration is 1 in Upper Shelf and 1 in Lower Shelf.

7.3 ACFC Blade


Types of ACFC:
ACFCv1 S30861-Q498-X
The Alarm Collector and Fan Control (ACFC) blade is the unit that provides the interface
to connect up to 21 External Alarms (environment), open door alarm included, to the
eBSC equipment and that realizes the interface to connect the two Shelf Managers with
the Fans trays to provide the control of the cooling of the shelf.
On the front panel of the blade there are the interface connectors for the External alarms
and Fan control.
The ACFC configuration is 1 in Upper Shelf.

7.4 PEM Blade


Types of PEM:
PEMv1 S30861-Q497-X
The Power Entry Module (PEM) implements the interface to the main power supply
input.
Each shelf contains two PEM to connect the two -48V main feeds provided, for redundancy.
Each main feed to the shelf comes from the rack DC Panel split on four cables pairs that
are fixed on the front of each PEM.
The PEM configuration is 1+1 in Upper Shelf and 1+1 in Lower Shelf.