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Physical Origins
and
Rate Equations
Chapter One
Sections 1.1 and 1.2
Meaning
Symbol
Units
Thermal Energy+
U or u
J or J/kg
Temperature
K or C
Heat Transfer
Heat
Heat Rate
Heat Flux
W/m2
+
U Thermal energy of system
u Thermal energy per unit mass of system
q k T
Heat flux
W/m
Thermal conductivity
W/m K
Temperature gradient
C/m or K/m
qx k
qx k
T T
dT
k 2 1
dx
L
T1 T2
L
(1.2)
q h Ts T
h : Convection heat transfer coefficient (W/m2 K)
(1.3a)
(1.5)
: Surface absorptivity 0 1
G : Irradiation W/m2
(1.7)
h r Ts Tsur
qrad
qrad
h Ts T hr Ts Tsur
q qconv
(1.8)
(1.9)
(1.10)
Process Identification
Schematic:
qconv ,1
qrad ,1
qcond ,1
qconv ,s
qrad ,s
qcond ,2
qconv ,2
qrad ,2
qs
Convection from outer surface of single (or second) pane to ambient air
Net radiation exchange between outer surface of single (or second) pane and surroundings such as the ground
Incident solar radiation during day; fraction transmitted to room is smaller for double pane
Substrate
qrad
Chip, Pelec
o
Ts = 85 C, = 0.60
= 25 C
1/4
h = 4.2(Ts- )
or
W/m2-K
qconv
L = 15 mm
Assumptions: (1) Steady-state conditions, (2) Radiation exchange between a small surface and a large enclosure, (3)
Negligible heat transfer from sides of chip or from back of chip by conduction through the substrate.
Analysis:
A L2 = 0.015m =2.2510-4 m2
2
60K
358 -298 K
4
5/4
=0.158W
=0.065W
Pelec 0.158W+0.065W=0.223W
(b) If heat transfer is by forced convection,