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Mark

Paul

Todd

Rex

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Outline
q Thermal Quality Management (ThQM)
q Solder paste requirements
q Generating the Oven Recipe
q Whats needed to Profile
q Determine points to profile
q Attaching the T/Cs
q Performing the Profile

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Thermal Quality Management
To Reduce Scrap and Increase Yields
Stage 1 Define Requirements
Why do we profile?

Identify heat sensitive components

Choose soldering technology

Stage 2 Machine Recipe Development

What is the oven recipe?

Develop machine settings required for production that

meet the above requirements
Assure all solder joints experience the required
temperature profile
Assure sensitive components do not experience long
term damage

Stage 3 Collect Data

How are we doing?

Assure the temperature profile developed during

characterization is being repeated
Proof your thermal process is in control

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ThQM Definitions
Profile The graphical plot of temperature as a function of time, as
measured by one or more thermocouples at points of interest on a PCB
Recipe Oven settings required to produce the desired profile
Temp
C
Zone set point
temperature
Conveyor
speed
Convection rate
Time

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Solder paste requirements

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Solder paste requirements

RSS Ramp Soak Spike profile
RTS Ramp to Spike profile
Temp
C

RSS
RTS

Time

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Solder paste requirements

What makes a good profile
Ramp slope C/sec
Soak time sec
Spike slope C/sec

Time Above Liquidous (TAL) time sec

Peak temperature C
Cooling slope C/sec
Red = KPI
Peak
Soak

Spike

Liquidous Temp

End Temp
Begin Temp
TAL
Ramp

Cooling

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Generating the Oven Recipe

Initial recipe Where do you start?
Software generated recipe
Based on similar board profile characteristics
Based on the oven characteristics
Your own recipe experience
Use a recipe which solders a board of similar size or component density
Best to under shoot zone temperature set points rather than over shoot
Lowers the risk of destroying the board
It take less time raise the ovens temperature then to lower it

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Generating the Oven Recipe

Initial recipe What can you control?
Three basic controls
1. Zone Temperature Controls the profile slope in that zone
Higher temp increases heating rate
Lower temp reduces heating rate
2. Conveyor Speed Controls the time spent in ALL Zones
Slower speed increases the time in all zones
Faster speed decreases the time in all zones
3. Convection Rate (option) Controls the flow of heat in ALL zones
Higher rate increases heating rate at the same temp set point
Lower rate decreases heating rate at the same temp set point
Higher rate reduce temp differences between components

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Generating the Oven Recipe

Initial recipe Suggestions

Zone

Leaded

150

170

180

180

180

180

205

235

250

No-lead

150

165

180

200

205

230

245

260

270

32

in/min

Conveyor

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Whats needed to Profile

Whats needed to profile
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.

Product to profile
Thermocouples
Profiler
Thermal protective barrier
Carrier for the profiler
T/C attachment solder or tapes
Soldering iron
Solder wick
Gloves
Cooling fan

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Determine points to profile
Components at risk (J-STD-075)
Capacitors: Aluminum Electrolitic, Film, Tantalum
Crystals; Oscillators and Resonators
Fuses
Inductors and Transformers
Non-Solid State Relays
LEDs
Connectors
Switches

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Determine points to profile
Identifying the trouble spots

Conveyor
Direction

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Attaching the T/Cs

http://www.ecd.com/blog/index.php/category/thermocouple-attachment/

Methods Solder
High Temp Solder
SN10 ~ 280 C Melting point

SN5 ~ 305 C Melting point

Au80 ~ 280 C Melting point

4000.00 / lb !

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Attaching the T/Cs

http://www.ecd.com/blog/index.php/category/thermocouple-attachment/

Methods Solder
0.02

1. Wick up old solder

2. Add SN5 to T/C
3. Tape down T/C
4. Touch with solder iron
5. Add a little more solder
6. Done!

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Attaching T/Cs Where is it?
T/C
OK
PCB
T/C
OK
PCB
T/C
OK
PCB

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Attaching the T/Cs

http://www.ecd.com/blog/index.php/category/thermocouple-attachment/

Methods Tapes and glues

Aluminum Tape (Silicone adhesive)
Pro Conforms to T/C
Pro Hold its shape
Con You cant see through it

Kapton Tape (Silicone adhesive)

Pro You can see through it
Con Does not hold it shape

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Attaching the T/Cs

http://www.ecd.com/blog/index.php/category/thermocouple-attachment/

Methods Tapes and glues

Epoxy (Hi Temp)
Pro Holds well
Con Adds insulation
Con Requires curing (time or UV)

AttachEZ
Pro Conforms to T/C
Pro Reusable!
Con Semi transparent

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Attaching Thermocouples - BGAs
BGA
1. Pre-drill before BGA is placed
2. Post-drill after BGA is soldered
3. Use an existing via

PCB
Via

Epoxy Fill

T/C 36 to 40ga

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Performing the Profile

Loading the Board and Profiler

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Performing the Profile

Loading the Board and Profiler

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Performing the Profile

Off Loading the Board and Profiler

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Performing the Profile

Off Loading the Board and Profiler

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Performing the Profile

Cooling for the next run

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Performing the Profile

Checking the results

Soak

Peak
Spike

Liquidous Temp

End Temp
Begin Temp
TAL
Ramp

Cooling

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Performing the Profile

Use software tools to "predict" a better recipe
Prediction using actual product profiles is best because it
uses the actual oven recipe and its performance (Machine)
is the actual profile of components or solder joints (Assembly)
lets you adjust the profile to the desired specification (Process)
assures your predictive changes will be accurately reproduced
ECD U Classes MAP 101 or Profiling 201

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Summary

q
ThQM Thermal Quality Management
q
Solder paste requirements
q
Generate an oven recipe
q
What you need to profile
q
Determine what points to profile
q
Attach the T/Cs
q
Perform a profile

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Thank you for attending todays class
Questions? Contact: Support@ECD.com
ECD-U Class List: www.ECD.com/ECDU
ECD Sales/Support: 503-659-6100

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Common questions
Can zone temperature setting fix this problem?
Increasing the set point temp will raise both peaks
Increase convection and lower the temperature set point
Add a thermal shield to the hotter profile part
What causes components or traces to heat at different rates?
Not because of their size or thermal mass
Mostly because of their thermal resistance to heat flow
How does convection help heat different parts more equal?
It applies heat to the entire surface more or less equal
Forced air convection is a continuous source of freshly heated air