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RDS(on)
60 m (*)
IOUT
6 A (*)
VCC
36 V (*)
)
s
(
ct
10
PROTECTION AGAINST:
LOSS OF GROUND AND LOSS OF VCC
REVERSE BATTERY PROTECTION (**)
)
(s
DESCRIPTION
The VND830ASP is a monolithic device made using
STMicroelectronics VIPower M0-3 technology. It
is intended for driving any kind of load with one
t
c
u
BLOCK DIAGRAM
d
o
r
PowerSO-10
s
b
O
Pr
PACKAGE
TUBE
T&R
e
t
e
ol
s
b
O
P
e
t
e
l
o
u
d
o
ORDER CODES
VCC
OVERVOLTAGE
VCC CLAMP
UNDERVOLTAGE
PwCLAMP 1
DRIVER 1
OUTPUT 1
ILIM1
INPUT 1
Vdslim1
LOGIC
IOUT1
INPUT 2
Ot1
CURRENT
SENSE 1
PwCLAMP 2
DRIVER 2
GND
Ot1
OVERTEMP. 1
OVERTEMP. 2
Vdslim2
Ot2
OUTPUT 2
ILIM2
IOUT2
Ot2
CURRENT
SENSE 2
September 2013
DocID9696 Rev 3
1/17
VND830ASP
ABSOLUTE MAXIMUM RATING
Symbol
VCC
-VCC
-IGND
IOUT
IR
IIN
VCSENSE
Parameter
DC Supply Voltage
Reverse Supply Voltage
DC Reverse Ground Pin Current
Output Current
Reverse Output Current
Input Current
Current Sense Maximum Voltage
Value
41
- 0.3
- 200
Internally Limited
-6
+/- 10
-3
Unit
V
V
mA
A
A
mA
V
+15
)
s
(
ct
- INPUT
4000
- CURRENT SENSE
2000
u
d
o
- OUTPUT
EMAX
Ptot
Tj
Tc
Tstg
5000
- VCC
Maximum Switching Energy
(L=1.8mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=9A)
Power Dissipation at TC=25C
Junction Operating Temperature
Case Operating Temperature
Storage Temperature
o
s
b
O
)
GROUND
INPUT2
INPUT1
C.SENSE1
C.SENSE2
s
(
t
c
u
d
o
e
t
e
ol
Pr
OUTPUT 2
OUTPUT 2
N.C.
OUTPUT 1
OUTPUT 1
5
4
3
6
7
8
9
10
1
11
VCC
s
b
O
IS
VCC
IIN1
INPUT1
VIN1
OUTPUT1
VIN2
IOUT2
INPUT2
VOUT1
ISENSE1
CURRENT SENSE 1
IIN2
OUTPUT2
CURRENT SENSE 2
GROUND
IGND
2/17
VCC
IOUT1
VSENSE1
VOUT2
ISENSE2
VSENSE2
V
V
5000
100
mJ
74
Internally Limited
- 40 to 150
- 55 to 150
W
C
C
C
r
P
e
let
VND830ASP
THERMAL DATA
Symbol
Rthj-case
Parameter
Thermal Resistance Junction-case
Value
1.2
Unit
C/W
Rthj-amb
51.2 (*)
C/W
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). Horizontal mounting and no artificial air
flow
Parameter
Operating Supply Voltage
Undervoltage Shut-down
Overvoltage Shut-down
Clamp voltage
IS
Supply Current
Min
5.5
3
36
On State Resistance
Vclamp
Test Conditions
e
t
e
ol
Max
36
5.5
60
Unit
V
V
V
m
48
12
120
55
40
m
V
A
12
25
7
50
0
5
3
mA
A
A
A
A
Max
Unit
u
d
o
Pr
41
)
s
(
ct
Typ
13
4
s
b
O
IL(off1)
IL(off2)
IL(off3)
IL(off4)
Parameter
P
e
td(on)
let
td(off)
so
)
(s
t
c
u
d
o
r
Symbol
RSENSE=3.9K
VIN=VOUT=0V; VCC=36V; Tj=125C
VIN=0V; VOUT=3.5V
VIN=VOUT=0V; VCC=13V; Tj =125C
VIN=VOUT=0V; VCC=13V; Tj =25C
Test Conditions
RL=6.5 from VIN rising edge to
VOUT=1.3V
RL=6.5 from VIN falling edge to
VOUT=11.7V
b
O
0
-75
Min
Typ
30
30
See
relative
diagram
See
relative
diagram
V/s
V/s
Parameter
Input low level voltage
Low level input current
Input high level voltage
High level input current
Input hysteresis voltage
Input clamp voltage
Test Conditions
VIN=1.25V
Min
Typ
1
3.25
VIN=3.25V
IIN=1mA
IIN=-1mA
Max
1.25
10
0.5
6
6.8
-0.7
Unit
V
A
V
A
V
V
V
3/17
VND830ASP
ELECTRICAL CHARACTERISTICS (continued)
VCC - OUTPUT DIODE
Symbol
VF
Parameter
Forward on Voltage
Test Conditions
-IOUT=2A; Tj=150C
Min
Typ
Max
0.6
Unit
V
PROTECTIONS
Symbol
Ilim
TTSD
TR
THYST
Vdemag
VON
Parameter
Test Conditions
Min
6
Vcc=13V
Current limitation
5.5V<Vcc<36V
Thermal shut-down
temperature
Thermal reset temperature
Thermal hysteresis
Turn-off output voltage clamp IOUT=2A; VIN=0V; L=6mH
Output voltage drop limitation IOUT=10mA
150
Parameter
K0
IOUT/I SENSE
K1
IOUT/I SENSE
dK1/K1
K2
dK2/K2
K3
P
e
ro
IOUT/I SENSE
t
e
l
o
dK3/K3
bs
ISENSE
Max
600
1300
2000
1000
1400
1900
VSENSEH
Sense Voltage in
Overtemperature conditions
-10
+10
1280
1500
1800
Tj=25C...150C
1300
1500
1780
-6
+6
1280
1500
1680
Tj=25C...150C
1340
1500
1600
Tj=-40C...150C
VCC=5.5V; IOUT1,2=1.3A; RSENSE=10k
VCC>8V, IOUT1,2=2.5A; RSENSE=10k
VCC=13V; RSENSE=3.9k
4/17
-O
VSENSE
)
s
(
ct
200
Typ
ct
du
Min
bs
(s)
15
r
P
e
t
e
l
o
IOUT/I SENSE
Unit
A
u
d
o
Test Conditions
IOUT1 or IOUT2=0.05A; VSENSE=0.5V;
other channels open; Tj= -40C...150C
IOUT1 or IOUT2=0.25A; VSENSE=0.5V;
other channels open; Tj= -40C...150C
IOUT1 or IOUT2=0.25A; VSENSE=0.5V;
other channels open; Tj= -40C...150C
175
Max
15
135
7
15
VCC-41 VCC-48 VCC-55
50
Typ
9
C
C
V
mV
Unit
-6
+6
10
V
5.5
400
500
VND830ASP
TRUTH TABLE (per channel)
CONDITIONS
Normal operation
Overtemperature
Undervoltage
Overvoltage
INPUT
OUTPUT
SENSE
H
L
H
L
0
Nominal
H
L
L
L
VSENSEH
0
H
L
L
L
0
0
H
L
L
L
0
0
(Tj<TTSD) 0
H
L
L
H
(Tj>TTSD) VSENSEH
0
e
t
e
ol
II
-25 V
+25 V
-25 V
+25 V
-4 V
+26.5 V
-50 V
+50 V
-50 V
+50 V
-5 V
+46.5 V
Test Pulse
1
2
3a
3b
4
5
ISO T/R 7637/1
Test Pulse
s
b
O
e
t
e
ol
1
2
3a
3b
4
5
CLASS
C
E
u
d
o
s
(
t
c
Pr
I
C
C
C
C
C
C
)-
s
b
O
)
s
(
ct
u
d
o
Pr
TEST LEVELS
III
IV
-75 V
+75 V
-100 V
+75 V
-6 V
+66.5 V
-100 V
+100 V
-150 V
+100 V
-7 V
+86.5 V
< Nominal
0
Delays and
Impedance
2 ms 10
0.2 ms 10
0.1 s 50
0.1 s 50
100 ms, 0.01
400 ms, 2
IV
C
C
C
C
C
E
CONTENTS
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device is not performed as designed after exposure to disturbance
and cannot be returned to proper operation without replacing the device.
5/17
VND830ASP
Figure 1: IOUT/ISENSE versus IOUT
Iout/Isense
2250
2000
m ax Tj= -40C
1750
m ax Tj=25...150C
1500
)
s
(
ct
typical value
m in Tj=25...150C
1250
u
d
o
m in Tj= -40C
r
P
e
1000
750
500
0
0.5
t
e
l
o
bs
1.5
2.5
Iout (A)
O
)
s
(
t
c
VOUT
u
d
o
90%
80%
r
P
e
dVOUT /dt(off)
dVOUT /dt(on)
let
o
s
b
tr
10%
tf
t
ISENSE
90%
INPUT
tDSENSE
td(on)
td(off)
6/17
VND830ASP
Figure 3: Waveforms
NORMAL OPERATION
INPUTn
LOAD CURRENTn
SENSEn
UNDERVOLTAGE
VCC
)
s
(
ct
VUSDhyst
VUSD
INPUTn
u
d
o
LOAD CURRENTn
SENSEn
OVERVOLTAGE
t
e
l
o
VOV
VCC
INPUTn
LOAD CURRENTn
SENSEn
)
(s
t
c
u
INPUTn
r
P
e
s
b
O
SHORT TO GROUND
d
o
r
LOAD CURRENTn
LOAD VOLTAGEn
SENSEn
P
e
s
b
O
t
e
l
o
SHORT TO VCC
INPUTn
LOAD VOLTAGEn
LOAD CURRENTn
SENSEn
<Nominal
<Nominal
OVERTEMPERATURE
Tj
TTSD
TR
INPUTn
LOAD CURRENTn
SENSEn
ISENSE=
VSENSEH
RSENSE
7/17
VND830ASP
APPLICATION SCHEMATIC
+5V
Rprot
INPUT1
VCC
Dld
Rprot
CURRENT SENSE1
Rprot
INPUT2
Rprot
CURRENT SENSE2
u
d
o
o
s
b
RGND
VGND
RSENSE2
r
P
e
let
GND
RSENSE1
)
s
(
ct
OUTPUT1
OUTPUT2
DGND
O
)
GND PROTECTION
REVERSE BATTERY
u
d
o
s
(
t
c
NETWORK
r
P
e
AGAINST
t
e
l
o
s
b
O
8/17
VND830ASP
C I/Os PROTECTION:
Calculation example:
For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V
5k Rprot 65k.
Recommended Rprot value is 10k.
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
9/17
VND830ASP
High Level Input Current
Iih (uA)
4.5
Vin=3.25V
Off state
Vcc=13V
Vin=Vout=0V
3.5
2.5
1.5
)
s
(
ct
u
d
o
75
1
-50
-25
25
50
75
100
125
150
175
-50
-25
Vicl (V)
3.6
bs
7.8
3.4
Iin=1mA
7.6
O
)
7.4
7.2
t(s
7
6.8
c
u
d
6.6
ro
P
e
6
-50
-25
t
e
l
o
25
50
75
100
125
150
175
100
125
150
175
100
125
150
175
Vcc=13V
3.2
3
2.8
2.6
2.4
2.2
2
100
125
150
-50
175
-25
25
50
Tc (C)
Tc (C)
s
b
O
75
t
e
l
o
Vih (V)
6.2
50
Tc (C)
6.4
25
r
P
e
Tc (C)
Vil (V)
Vhyst (V)
2.6
1.5
1.4
2.4
Vcc=13V
Vcc=13V
1.3
2.2
1.2
2
1.1
1.8
1
0.9
1.6
0.8
1.4
0.7
1.2
0.6
0.5
-50
-25
25
50
75
Tc (C)
10/17
100
125
150
175
-50
-25
25
50
75
Tc (C)
VND830ASP
ILIM Vs Tcase
Overvoltage Shutdown
Vov (V)
Ilim (A)
50
20
47.5
17.5
45
15
42.5
12.5
40
10
37.5
7.5
35
32.5
2.5
Vcc=13V
30
)
s
(
ct
u
d
o
0
-50
-25
25
50
75
100
125
150
175
-50
-25
25
Tc (C)
600
500
s
b
O
450
550
Vcc=13V
Rl=6.5Ohm
400
)-
450
t(s
400
c
u
d
350
300
200
e
t
e
ol
-50
-25
25
o
r
P
50
75
150
175
100
125
150
175
Vcc=13V
Rl=6.5Ohm
350
300
250
200
150
50
0
100
125
150
175
-50
-25
25
Tc (C)
50
75
Tc (C)
Ron (mOhm)
Ron (mOhm)
100
100
90
Tc=150C
90
Iout=5A
Vcc=8V & 36V
80
125
100
s
b
O
100
t
e
l
o
dVout/dt(on) (V/ms)
250
75
r
P
e
Tc (C)
500
50
80
70
Iout=5A
70
60
60
50
40
50
30
Tc=25C
40
20
Tc= -40C
30
10
20
0
-50
-25
25
50
75
Tc (C)
100
125
150
175
10
15
20
25
30
35
40
Vcc (V)
11/17
VND830ASP
Maximum turn off current versus load inductance
ILMAX (A)
100
)
s
(
ct
u
d
o
10
r
P
e
A
t
e
l
o
)-
0.1
s
(
t
c
s
b
O
10
100
L(mH)
u
d
o
Conditions:
VCC=13.5V
r
P
e
t
e
l
o
s
b
O
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
VIN, IL
Demagnetization
Demagnetization
Demagnetization
12/17
VND830ASP
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2).
s
b
O
)
(s
t
c
u
d
o
r
RTHj_amb (C/W)
P
e
55
Tj-Tamb=50C
t
e
l
o
50
s
b
O
45
40
35
30
10
13/17
VND830ASP
PowerSO-10 Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W)
1000
100
)
s
(
ct
0.5 cm2
6 cm2
u
d
o
10
r
P
e
t
e
l
o
)
(s0.1
0.1
0.0001
0.001
0.01
t
c
u
1
Time (s)
d
o
r
P
e
t
e
l
o
bs
Tj_1
100
1000
Z TH = R TH + Z THtp ( 1 )
= tp T
Thermal Parameter
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
C1
C2
R1
R2
Pd2
T_amb
14/17
10
where
Pd1
Tj_2
s
b
O
Area/island (cm2)
R1 (C/W)
R2 (C/W)
R3( C/W)
R4 (C/W)
R5 (C/W)
R6 (C/W)
C1 (W.s/C)
C2 (W.s/C)
C3 (W.s/C)
C4 (W.s/C)
C5 (W.s/C)
C6 (W.s/C)
0.5
0.15
0.8
0.7
0.8
12
37
0.0006
2.10E-03
0.013
0.3
0.75
3
22
VND830ASP
DIM.
MIN.
A
A (*)
A1
B
B (*)
C
C (*)
D
D1
E
E2
E2 (*)
E4
E4 (*)
e
F
F (*)
H
H (*)
h
L
L (*)
(*)
TYP
3.35
3.4
0.00
0.40
0.37
0.35
0.23
9.40
7.40
9.30
7.20
7.30
5.90
5.90
s
b
O
MAX.
MIN.
3.65
3.6
0.10
0.60
0.53
0.55
0.32
9.60
7.60
9.50
7.60
7.50
6.10
6.30
0.132
0.134
0.000
0.016
0.014
0.013
0.009
0.370
0.291
0.366
0.283
0.287
0.232
0.232
1.35
1.40
14.40
14.35
0.049
0.047
0.543
0.545
1.80
1.10
8
8
s
(
t
c
u
d
o
Pr
MAX.
0.144
0.142
0.004
0.024
0.021
0.022
0.0126
0.378
0.300
0.374
300
0.295
0.240
0.248
)
s
(
ct
u
d
o
r
P
e
0.050
0.053
0.055
0.567
0.565
0.002
0.047
0.031
0
2
0.070
0.043
8
8
0.10 A B
10
E2
E4
SEATING
PLANE
e
DETAIL "A"
0.25
o
s
b
O
)
0.50
1.20
0.80
0
2
TYP.
let
1.27
1.25
1.20
13.80
13.85
e
t
e
ol
inch
D
= D1 =
=
=
SEATING
PLANE
A
F
A1
A1
L
DETAIL "A"
P095A
15/17
VND830ASP
PowerSO-10 SUGGESTED PAD LAYOUT
14.6 - 14.9
CASABLANCA
10.8- 11
MUAR
6.30
C
A
A
0.67 - 0.73
10
9
9.5
2
3
0.54 - 0.6
8
7
4
5
1.27
Casablanca
Muar
50
50
1000
1000
532
532
C ( 0.1)
10.4 16.4
4.9 17.2
0.8
0.8
)
s
(
ct
u
d
o
REEL DIMENSIONS
e
t
e
ol
)
(s
s
b
O
d
o
r
600
600
330
1.5
13
20.2
24.4
60
30.4
t
c
u
TAPE DIMENSIONS
Pr
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C ( 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
P
e
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
t
e
l
o
s
b
O
W
P0 ( 0.1)
P
D ( 0.1/-0)
D1 (min)
F ( 0.05)
K (max)
P1 ( 0.1)
24
4
24
1.5
1.5
11.5
6.5
2
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
500mm min
16/17
VND830ASP
)
s
(
ct
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (ST) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
u
d
o
All ST products are sold pursuant to STs terms and conditions of sale.
r
P
e
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
t
e
l
o
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
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s
b
O
UNLESS OTHERWISE SET FORTH IN STS TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
)
(s
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ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT
PURCHASERS SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
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DocID9696 Rev 3
17/17