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Preliminary data
1. General description
The TDA8947J contains four identical audio power amplifiers. The TDA8947J can be
used as: four Single-Ended (SE) channels with a fixed gain of 26 dB, two times
Bridge-Tied Load (BTL) channels with a fixed gain of 32 dB or two times SE channels
(26 dB gain) plus one BTL channel (32 dB gain) operating as a 2.1 system.
The TDA8947J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8947J
is pin compatible with the TDA8944AJ and TDA8946AJ.
The TDA8947J contains a unique protection circuit that is solely based on multiple
temperature measurements inside the chip. This gives maximum output power for all
supply voltages and load conditions with no unnecessary audio holes. Almost any
supply voltage and load impedance combination can be made as long as thermal
boundary conditions (number of channels used, external heatsink and ambient
temperature) allow it.
2. Features
Television
PC speakers
Boom box
Mini and micro audio receivers.
3. Applications
TDA8947J
Philips Semiconductors
Symbol Parameter
Conditions
supply voltage
VCC
Min
Typ
Max Unit
18
26
28
100
145
mA
10
VCC = 18 V
8.5
VCC = 22 V
14
VCC = 18 V
16
18
VCC = 22 V
29
SE; Po = 1 W
0.1
0.5
BTL; Po = 1 W
0.05 0.5
SE
25
26
27
dB
BTL
31
32
33
dB
SE; f = 1 kHz
60
dB
BTL; f = 1 kHz
65
dB
operating
[1]
no (clipping) signal
Iq
Istb
Po(SE)
SE output power
Po(BTL)
THD
Gv(max)
SVRR
[1]
VCC = 18 V; RL =
THD = 10 %; RL = 4
THD = 10 %; RL = 8
The amplifier can deliver output power with non clipping output signals into nominal loads as long as
the ratings of the IC are not exceeded.
5. Ordering information
Table 2:
Ordering information
Type
number
Package
TDA8947J
Name
Description
SOT243-1
Preliminary data
Version
2 of 24
TDA8947J
Philips Semiconductors
6. Block diagram
VCC1
3
IN1+
VCC2
16
OUT1+
60 k
IN2+
OUT2
60 k
IN3+
14
OUT3
60 k
IN4+
12
17
OUT4+
60 k
CIV
13
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
VCC
SVR
11 0.5V
CC
Vref
SGND
MODE1
MODE2
10
STANDBY ALL
MUTE ALL
ON 1+2
TDA8947J
MUTE 3+4
ON 3+4
2
GND1
15
MDB014
GND2
Preliminary data
3 of 24
TDA8947J
Philips Semiconductors
7. Pinning information
7.1 Pinning
OUT1+
GND1
VCC1
OUT2
MODE2
IN2+
SGND
IN1+
IN3+
TDA8947J
MODE1 10
SVR 11
IN4+ 12
CIV 13
OUT3 14
GND2 15
VCC2 16
OUT4+ 17
MDB015
Pin description
Symbol
Pin
Description
OUT1+
GND1
VCC1
OUT2
MODE2
IN2+
input channel 2
SGND
signal ground
IN1+
input channel 1
IN3+
input channel 3
MODE1
10
SVR
11
IN4+
12
input channel 4
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data
4 of 24
TDA8947J
Philips Semiconductors
Table 3:
Pin descriptioncontinued
Symbol
Pin
Description
CIV
13
OUT3
14
GND2
15
VCC2
16
OUT4+
17
TAB
8. Functional description
8.1 Input configuration
The input cut-off frequency is:
1
f i ( cut off ) = ----------------------------2 ( R i C i )
(1)
(2)
(3)
As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not
necessary, so the switch-on delay during charging of the input capacitors can be
minimized. This results in a good low frequency response and good switch-on
behavior.
Preliminary data
5 of 24
TDA8947J
Philips Semiconductors
8.2.1
SE: RL = 3
BTL: RL = 6 .
8.2.2
Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom,
compared to the average power output, for transferring the loudest parts without
distortion.
The Average Listening Level (ALL) music power, without any distortion, yields:
5 10
P o ( ALL )SE = --------------- = 315 mW
15.85
(4)
10 10
P o ( ALL )BTL = ------------------ = 630 mW
15.85
(5)
The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of
0 dB and 12 dB, respectively.
Table 4:
Headroom
Power output
SE
Power dissipation
(all channels driven)
BTL
0 dB
Po = 5 W
Po = 10 W
PD = 17 W
12 dB
Po(ALL) = 315 mW
Po(ALL) = 630 mW
PD = 9 W
For heatsink calculation at the average listening level, a power dissipation of 9 W can
be used.
Preliminary data
6 of 24
TDA8947J
Philips Semiconductors
Mute The amplifier is DC-biased, but not operational (no audio output). This allows
the input coupling capacitors to be charged to avoid pop-noise. The device is in the
mute mode when 4.5 V < VMODE1 < (VCC 3.5 V).
On The amplifier is operating normally. The on mode is activated at
VMODE1 > (VCC 2.0 V). The output of channels 3 and 4 can be set to mute or on
mode.
The output channels 3 and 4 can be switched on/off by applying a proper DC voltage
to pin MODE2, under the condition that the output channels 1 and 2 are in the on
mode (see Figure 3).
Table 5:
Mode selection
Voltage on pin
MODE1
MODE2
0 to 0.8 V
0 to VCC
Channel 1 and 2
Channel 3 and 4
(sub woofer)
standby
standby
0 to VCC
mute
mute
0 to (VCC 3.5 V)
on
mute
(VCC 2 V) to VCC
on
on
all standby
0.8
channels 1+2: on
channels 3+4: on or mute
all mute
4.5
VCC3.5
VCC2.0 VCC
VMODE1
channels 3+4: on
VCC3.5
MDB016
VCC2.0 VCC
VMODE2
Preliminary data
7 of 24
TDA8947J
Philips Semiconductors
9. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
supply voltage
VCC
Conditions
Min
Max
Unit
operating
0.3
+26
0.3
+28
no (clipping) signal
[1]
VI
input voltage
0.3
VCC + 0.3 V
IORM
Tstg
storage temperature
55
+150
Tamb
ambient temperature
40
+85
Ptot
69
VCC(sc)
24
[1]
non-operating
The amplifier can deliver output power with non clipping output signals into nominal loads as long as
the ratings of the IC are not exceeded.
Thermal characteristics
Symbol Parameter
Conditions
Value
Unit
Rth(j-a)
in free air
40
K/W
Rth(j-c)
1.3
K/W
Preliminary data
8 of 24
TDA8947J
Philips Semiconductors
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
operating
[1]
18
26
no (clipping) signal
[2]
28
RL =
[3]
100
145
mA
10
Supply
VCC
Iq
Istb
Output pins
VO
VOUT
DC output voltage
[4]
[5]
170
mV
VCC 2.0 -
VCC
4.5
VCC 3.5 V
0.8
VCC 2.0 -
VCC
BTL mode
VMODE2
VCC 3.5 V
IMODE1
20
IMODE2
20
[1]
[2]
[3]
[4]
[5]
[6]
A minimum load is required at supply voltages of VCC > 22 V: RL = 3 for SE and RL = 6 for BTL.
The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not
exceeded.
With a load connected at the outputs the quiescent current will increase.
The DC output voltage, with respect to ground, is approximately 0.5VCC.
VOUT = VOUT+ VOUT
Channels 3 and 4 can only be set to mute or on by MODE2 when VMODE1 > VCC 2.0 V.
Parameter
Conditions
Min
Typ
Max
Unit
Po(SE)
SE output power
8.5
THD = 0.5 %; RL = 4
6.5
14
0.1
0.5
VCC = 22 V
THD = 10 %; RL = 4
THD
Po = 1 W
Gv
voltage gain
25
26
27
dB
Zi
input impedance
40
60
Vn(o)
150
[1]
Preliminary data
9 of 24
TDA8947J
Philips Semiconductors
Table 9:
Dynamic characteristics SEcontinued
VCC = 18 V; Tamb = 25 C; RL = 4 ; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless
otherwise specified.
Symbol
SVRR
Parameter
supply voltage ripple rejection
Vo(mute)
cs
channel separation
|Gv|
channel unbalance
[1]
[2]
[3]
Conditions
Min
Typ
Max
Unit
fripple = 1 kHz
[2]
60
dB
[2]
60
dB
[3]
150
50
60
dB
dB
Rsource = 0
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance
Rsource = 0 at the input.
Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 at the input and with a frequency range
from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which
is applied to the positive supply rail.
Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,
including noise.
Parameter
Conditions
Po(BTL)
Min
Typ
Max
Unit
THD = 10 %; RL = 8
16
18
THD = 0.5 %; RL = 8
14
29
0.05
0.5
31
32
33
dB
VCC = 22 V
THD = 10 %; RL = 8
THD
Gv
voltage gain
Zi
input impedance
Vn(o)
SVRR
Vo(mute)
cs
channel separation
|Gv|
channel unbalance
[1]
[2]
[3]
Po = 1 W
20
30
[1]
200
fripple = 1 kHz
[2]
65
dB
[2]
65
dB
[3]
250
50
65
dB
dB
Rsource = 0
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance
Rsource = 0 at the input.
Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 at the input and with a frequency range
from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which
is applied to the positive supply rail.
Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,
including noise.
Preliminary data
10 of 24
TDA8947J
Philips Semiconductors
coc005
107
Vo
(V)
106
105
104
103
102
10
1
16
20
VMODE1 (V)
12
MCE485
60
MCE484
60
Po
(W)
Po
(W)
40
40
8
2
20
RL = 2
20
16
4
RL = 1
8
0
0
8
12
16
20
24
28
VCC (V)
a.
SE
12
16
20
24
28
VCC (V)
b.
BTL
Preliminary data
11 of 24
TDA8947J
Philips Semiconductors
MCE488
102
THD+N
(%)
THD+N
(%)
10
10
101
101
102
101
10
Po (W)
102
101
102
VCC = 18 V; f = 1 kHz; RL = 4 .
a.
MCE487
102
10
102
Po (W)
VCC = 18 V; f = 1 kHz; RL = 8 .
SE
b.
BTL
MCE489
10
THD+N
(%)
THD+N
(%)
101
101
102
10
102
103
104
f (Hz)
102
10
105
VCC = 18 V; Po = 1 W; RL = 4 .
a.
SE
MCE490
10
102
103
104
f (Hz)
105
VCC = 18 V; Po = 1 W; RL = 8 .
b.
BTL
Preliminary data
12 of 24
TDA8947J
Philips Semiconductors
MCE491
50
Po
(W)
40
40
30
30
20
20
10
10
0
8
12
16
20
24
28
VCC (V)
a.
MCE492
50
Po
(W)
12
16
20
24
28
VCC (V)
SE
b.
BTL
MCE493
20
PD
(W)
16
16
12
12
0
0
12
16
Po (W)
20
VCC = 18 V; RL = 4 .
a.
MCE494
20
PD
(W)
SE
12
16
Po (W)
20
VCC = 18 V; RL = 8 .
b.
BTL
Fig 9. Total power dissipation as function of channel output power per channel (worst case, all channels driven).
Preliminary data
13 of 24
TDA8947J
Philips Semiconductors
MCE495
cs
(dB)
cs
(dB)
20
20
40
40
60
60
80
80
100
10
102
103
104
MCE496
100
10
105
102
103
104
f (Hz)
VCC = 18 V; RL = 4 .
a.
105
f (Hz)
VCC = 18 V; RL = 8 .
SE
b.
BTL
Fig 10. Channel separation as function of frequency (no bandpass filter applied).
MCE497
0
SVRR
(dB)
SVRR
(dB)
20
20
40
40
60
60
80
10
a.
102
103
104
f (Hz)
MCE498
80
10
105
102
103
104
f (Hz)
105
Inputs short-circuited.
Inputs short-circuited.
SE
b.
BTL
Preliminary data
14 of 24
TDA8947J
Philips Semiconductors
16
IN1+ 8
Vi
1000 F
100 nF
VCC2
1 OUT1+
+
60 k
220 nF
IN2+ 6
Vi
4 OUT2
60 k
Vi
RL
4
14 OUT3
IN3+ 9
470 nF
RL
4
60 k
+
17 OUT4+
IN4+ 12
470 F
RL
8
60 k
CIV 13
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
VCC
VCC
10
k
50
k
100
k
microcontroller
270
BC547
7.5 V
BC547
22 F
2.2
F
SVR 11 0.5V
CC
Vref
47
F
SGND 7
1.5
k
MODE1 10
VCC
MODE2 5
STANDBY ALL
MUTE ALL
ON 1 + 2
MUTE 3 + 4
ON 3 + 4
TDA8947J
2
15
GND1
GND2
mdb017
Channels 1 and 2
Channels 3 and 4
LOW
on
on
HIGH
mute
mute
Preliminary data
15 of 24
TDA8947J
Philips Semiconductors
VCC
VCC1
3
220 nF
16
IN1+ 8
Vi
1000 F
100 nF
VCC2
1 OUT1+
+
60 k
220 nF
IN2+ 6
4 OUT2
Vi
60 k
60 k
Vi
RL
4
14 OUT3
IN3+ 9
470 nF
RL
4
450 F
RL
17 OUT4+
IN4+ 12
60 k
CIV 13
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
VCC
22 F
SVR 11 0.5V
CC
150 F
Vref
SGND 7
MODE1 10
MICROCONTROLLER
VCC
MODE2 5
STANDBY ALL
MUTE ALL
ON 1+2
TDA8947J
MUTE 3+4
ON 3+4
2
15
GND1
GND2
MDB018
Fig 13. Application diagram with one pin control and reduction of capacitor.
Remark: Because of switching inductive loads, the output voltage can rise beyond
the maximum supply voltage of 28 V. At high supply voltages, it is recommended to
use (Schottky) diodes to the supply voltage and ground.
Preliminary data
16 of 24
TDA8947J
Philips Semiconductors
PF / 3002 .naJ 72
TVA
220 nF
220 nF
100 nF
BTL4/3
220 nF
BTL1/2
220 nF
220 nF
CIV
4.7 nF
220 nF
+SE3
1000 F
22
220 F
F
1000 F
1000 F
+SE2
1000 F
SVF
SE4+
MODE1
BTL3/4
MODE2
+SE1
150
F
OFF
10 k
+ Vp
IN2+
IN1+
IN3+
IN4+
VOL.Sgnd
10 k
SB ON
MUTE
ON
MCE483
13.2.2
Preliminary data
17 of 24
TDA8947J
Philips Semiconductors
Preliminary data
18 of 24
TDA8947J
Philips Semiconductors
mce499
150
Tj
(C)
Tj
(C)
(1)
(2)
(3)
(4)
(1)
(5)
100
100
50
50
(2)
(3)
(4)
(5)
0
8
a.
mce500
150
12
20
16
24
28
VCC (V)
12
16
20
24
28
VCC (V)
(1) RL = 1 .
(1) RL = 2 .
(2) RL = 2 .
(2) RL = 4 .
(3) RL = 3 .
(3) RL = 6 .
(4) RL = 4 .
(4) RL = 8 .
(5) RL = 8 .
(5) RL = 16 .
b.
Fig 15. Junction temperature as function of supply voltage for various loads with music signals.
Preliminary data
19 of 24
TDA8947J
Philips Semiconductors
SOT243-1
non-concave
Dh
Eh
B
j
E
A
L3
Q
c
v M
17
e1
bp
e2
w M
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
bp
D (1)
Dh
E (1)
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
e2
Eh
L3
Z (1)
5.08
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
e1
2.54 1.27
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-17
03-03-12
SOT243-1
Preliminary data
20 of 24
TDA8947J
Philips Semiconductors
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
Package
Soldering method
Dipping
Wave
suitable
suitable[1]
PMFP[2]
not suitable
[1]
[2]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
Preliminary data
21 of 24
TDA8947J
Philips Semiconductors
Revision history
Rev Date
01
20040206
CPCN
Description
Preliminary data
22 of 24
TDA8947J
Philips Semiconductors
Product status[2][3]
Definition
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
20. Disclaimers
Life support These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
Preliminary data
23 of 24
Philips Semiconductors
TDA8947J
4-channel audio amplifier
Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.4
8.5
9
10
11
12
13
13.1
13.2
13.2.1
13.2.2
13.3
14
14.1
15
16
16.1
16.2
16.3
16.4
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Input configuration . . . . . . . . . . . . . . . . . . . . . . 5
Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5
Output power measurement . . . . . . . . . . . . . . . 6
Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6
Supply voltage ripple rejection . . . . . . . . . . . . . 7
Built-in protection circuits . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics. . . . . . . . . . . . . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 15
Application diagrams . . . . . . . . . . . . . . . . . . . 15
Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17
Layout and grounding . . . . . . . . . . . . . . . . . . . 17
Power supply decoupling . . . . . . . . . . . . . . . . 17
Thermal behavior and heatsink calculation . . 18
Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
Quality information . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 21
Soldering by dipping or by solder wave . . . . . 21
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21
Package related soldering information . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23