ME 463: Micro/Nano Technology

Coordinator: Ioana Voiculescu, Assistant Professor, ME

FALL 2015

ME 463: Micro/Nano Technology. Credit 4

Catalog Data: The goal of this course is to provide the students the background to comprehend the existing
technology to fabricate microelectromechanical systems (MEMS) and nanodevices and
their applications. Students will become familiar with the principles and applications of
various generic microfabrication techniques, like photolithography, thin films deposition, and
etching, which are used in microelectronics, MEMS, and microfluidics. The course also
includes study of fabrication techniques for nanoscale structures such as e-beam lithography,
molecular beam epitaxy and self assembly monolayers. Finally MEMS applications as
pressure, acceleration, flow sensors, optical- mirror arrays, bio/chem sensors will be
introduced. Devices based on single and multi walled carbon nanotubes, nanorobotics, selfassembly of nano elements and quantum dots are presented with emphasizes on their
unique electronic and mechanical properties.
Textbook:

I. Voiculescu, Micro/Nano Technology: Class Notes, 2007

References:

MEMS
Microsystem Design, S. D. Senturia, Kluwer, 2002, ISBN: 0792372468
Micromachined Transducers Sourcebook, G.T.A. Kovacs, McGraw Hill,
1998, ISBN 0-07-290722-3
Fundamental of Microfabrication, Marc Madou, CRC Press, 1997, ISBN 0-8493-9451-1
Introduction to Microelectronic Fabrication, Richard C. Jaeger, Addison-Wesley, 1993, ISBN
0-201-14695-9 (recommended)
MEMS-a practical guide to design, analysis and applications, Edited by Jan G. Korvink and
Oliver Paul, co-published by William Andrew and Springer, 2006, ISBN: 0-8155-1497-2
MEMS Handbook, Edited by Gad-El-Hak, CRC Press, 2001.
Mechanical Microsensors, M. Elwenspoek and R. Wiegerink, Springer Verlag, 2001.
Silicon Micromachining, M. Elwenspoek and H. Jansen, Cambridge Press, 1999.
Fundamentals and Applications of Microfulidics, N.-T. Nguyen and S.
Wereley, Artech House, 2002.
Silicon Processing for the VLSI Era, S. Wolf and R. N. Tauber, Lattice Press, 2000.
NANOTECHNOLOGY
Introduction to Nanotechnology,Charles P. Poole Jr. and Frank J. Owens, Wiley Inter
Science, 2003, ISBN: 0-471-07935-9
Nanotechnology basic science and emerging technologies, Mick Wilson, Kamali
Kannangara, Geoff Smith, Michelle Simmons and Burkhard Raguse, CRC Press, 2002, ISBN:
1-58488-339-1
Foundations of Nanomechanics, Andrew N. Cleland, Springer, 2003, ISBN: 3-540-43661-8

Objectives:

1) Introducing students to basic concepts of micro and nanotechnology.

2) Discussion of micro and nanofabrication techniques; advantages and limitations.
3) Physical and chemical properties of micro and nanomaterials; understanding
how specific physical behavior and engineering design requirements change with scale.
4) Make students familiar with current research in the field and micro and
nanotechnology and enhance students appreciation of the current state and potential future
impact of micro and nanotechnology.
5) Expose the students to the cross-disciplinary intersections that occur between
mechanics and materials science, chemistry, physics, and biology when working at
the micro and nano-scale.
6) Ability to use basic techniques, skills, and fabrication tools necessary for
MEMS and nanodevices fabrication.

7) Enhance students skills in engineering report writing and oral presentation.

Prerequisites by Topics: 1. ME 356; Fluid Mechanics or ChE 341; Transport Phenomena
2. ME 462; Manufacturing Processes
Topics:

1) Introduction to basic concepts of micro and nanotechnology (1 week)

2) Silicon properties and crystallography (0.5 week)
3) MEMS fabrication: thin films deposition methods, lithography-based
micromachining, surface micromachining and bulk micromachining, nonlithographical micromachining such as LIGA. (3.5 weeks).
4) Basic physical, chemical, and biological principles in nano sciences: nanoscale
materials prepared by various methods, top-down and bottom-up nano fabrication
techniques (2 weeks)
5) Critical understanding of various transduction principles: design, production,
and characterization of MEMS devices, seensing (piezoelectric, capacitive,
magnetic, etc.), actuation (electrostatic, electromagnetic, thermal, piezoelectric) (4
weeks)
6) Applications of nano technology on electronics, biology, medicine, energy,
environment, etc. (2 weeks)
7) Tests two mid term exams (1 week)

Computer Usage: PCs are used in this course for (1) modeling of MEMS and nano
structures using COVENTOR software and (2) for reports and presentations
writing using word processing software.
Laboratory/ Design projects (including major items of equipment and instrumentation used):
1) Students are required to run 3 experiments, whose topics, major equipment and
instrumentation, and key concepts are listed below:
Experiment 1: Bulk micromachining
Aim: to realize MEMS structures of different sizes and shapes using silicon wafer and understand bulk
micromachining processing technique, anisotropic etching by observing; 1) undercutting properties, and 2)
material selectivity. The manufacturing process such as photolithography using photomasks and wet etching
form major part of the experiment. The wafer is inspected at regular intervals of 20, 40 and 60 minutes to
observe the shape of the various pits and the time various micro structures are released.
Apparatus: Silicon wafer, mask, nitric acid, TMAH, de-ionized water, UV light source, photoresist, isopropyl
alcohol.
Experiment 2: Fabrication of micro fluidic channels using polymer
Aim: to fabricate micro fluidic channels using polymer and wet etching methods, and to observe the material
selectivity, etching properties and to get a flavor of the process flow. The manufacturing process such as
photo-engraving of the polymer and handling wet etchants, form major part of the experiment. The device is
then tested for functionality.
Apparatus: Polymer, photoresist, photomask, UV light source, de-ionized water.
Experiment 3: Testing MEMS chips
Aim: to understanding electrical circuits used for MEMS devices. Understanding how to perform basic
measurements of the voltage and current on the chip.
Apparatus: CASCADE probe station, source meter
In addition to laboratory reports, mid-term exams, and homework, students are required to make group
presentations (in lieu of final exam). The topics are chosen by the students. The only restriction is that the
content should be related to MEMS, nanosensors and actuators devices.