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METHODOLOGY
July 28, 2009
Semiconductor Pervasion
Computer,
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Dynamic Dissipation
2
Pdyn = C L VDD
f clk
In
Out
Short-Circuit Currents
Psc = I sc VDD (
tr + t f
2
CL
Static Dissipation
ISC
GND
Pstat = I leakVDD
) f clk
Functional Mode
power consumption
SI1
CHAIN 1, SEGMENT 1
CHAIN 1, SEGMENT 2
SO1
SI2
CHAIN 2, SEGMENT 1
CHAIN 2, SEGMENT 2
SO2
CHAIN n, SEGMENT 2
SOn
SIn
CHAIN n, SEGMENT 1
Gated_clk1
SEGMENT1
Gated_clk2
SEGMENT2
0 0 0 0 1 1
RANDOM
0 1 0 0 1 0
NEED
0 0 1
SCAN_IN
CLK
SCAN OUT
Scan insertion
Pattern generation
RTL
Synthesis
UPF
/CPF
Test-ready
netlist
Scan Insertion
UPF
/CPF
Logical libraries
(Power attributes)
Multi voltage, OP conditions
ISO cell, level shifter, DRR (
Data retention registers)
DFT-inserted
netlist
Physical Implementation
Physical libraries
(Power attributes)
Power rail, voltage island,
Power switch
GDSII
Design statistics
Shift Mode
14%
Division - Automotive
Technology 90nm.
1000K design,50K flops.
8Mhz shift frequency.
33%
31%
22%
capturemode
12
10
Power
in
mW
Combo logic
47%
Sequential logic
Clock network
Hard logic
2
0
Capture Mode
Shift
5%
Capture
Test mode
20%
28%
Power Calculation
Vector less Power analysis for diff switching activity
(Capture)
Estimation of
Switching Activity
Power Spec
ATPG
set power budget
Generation of
Low Power patterns
Low Power
patterns
SDF
VCD
Validation of
generated patterns
Power Calculation
Dynamic Power analysis
(Shift and Capture)
No
Yes
Done
( x x )( y y )
Slope =
(x x)
2
Intercept = y ( slope * x )
Power in mw
0.01
0.008
0.006
0.004
0.002
Vectorless Pow er
0
0
10
20
30
Switching activity ->
40
50
60
Clock Power
1.80E-03
2.50E-03
1.60E-03
Power
2.00E-03
1.40E-03
1.20E-03
1.50E-03
1.00E-03
8.00E-04
Capture Pow er
1.00E-03
6.00E-04
Shift Pow er
5.00E-04
4.00E-04
Vectorless Pow er
2.00E-04
0.00E+00
Power
10
20
30
40
50
60
0.00E+00
0
10
(Flop)Toggling
Combinational Power
3.50E-03
4.00E-03
3.00E-03
3.50E-03
20
30
40
50
60
50
60
3.00E-03
2.50E-03
2.50E-03
2.00E-03
2.00E-03
1.50E-03
1.50E-03
1.00E-03
1.00E-03
5.00E-04
5.00E-04
0.00E+00
0.00E+00
0
10
20
30
40
50
60
(Flop)Toggling
10
20
30
40
Power
TOTAL POWER
(Flop)Toggling
Figures of merit
Test coverage - Same
Test Coverage
22.48
100
20
80
Coverage
Percentage switching
Capture Power
15
10
5
0
Pattern Inflation of 2X
Pattern Count
36.02
35
30
18.8
20
15
10
5
Number of Patterns
STD Power
40
Run Time
25
Low Power
60
STD Power
91.63
20
1.08
Low Power
91.66
70000
60784
60000
50000
40000
28296
30000
20000
10000
0
Low Power
STD Power
Low Power
STD Power
Pattern Validation
Pattern Validation
Dynamic Power of 20 patterns with worst switching activity
6
Power (mW)
5
4
3
2
1
0
0
10
15
20
Patterns
25
Silicon Success .
Application Consumer
Technology 65nm
Issue - ATPG patterns failing due to high power
Conclusion
Power has become a challenge not only in
functional mode but also in test mode.
The proposed flow, consisting of in-house and
EDA tools gives an complete automated flow for
low power test methodology.
The insertion of level shifters, isolation logic and
test control point insertion for scan signals is now
fully automated.
Low Power ATPG flow generates low power
patterns within the power specification of the
design.