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N
DIP14
(Plastic package)
D
SO-14
(Plastic micropackage)
Description
These circuits consist of four independent, high
gain, internally frequency compensated
operational amplifiers. They operate from a single
power supply over a wide range of voltages.
Operation from split power supplies is also
possible and the low power supply current drain is
independent of the magnitude of the power supply
voltage.
P
TSSOP-14
(Thin shrink small outline package)
Order codes
Part number
LM124N
LM124D/DT
LM224N
LM224D/DT
Temperature range
-55C, +125C
-40C, +105C
LM224PT
LM324N
LM324D/DT
LM324PT
0C, +70C
Package
Packing
DIP
SO
DIP
SO
TSSOP
(Thin shrink outline package)
DIP
SO
TSSOP
(Thin shrink outline package)
Tube
Tube or tape & reel
Tube
Tube or tape & reel
Tape & reel
Tube
Tube or tape & reel
Tape & reel
1/19
19
LM124-LM224-LM324
Symbol
VCC
Vi
Parameter
LM124
Supply voltage
Input voltage
Vid
Ptot
Power dissipation
N suffix
D suffix
(1)
Toper
Tstg
LM324
Unit
16 or 32
32
32
500
500
400
LM224
500
400
mW
50
mA
Infinite
50
50
-65 to +150
150
Rthja
103
100
83
Rthjc
31
32
33
250
Tj
ESD
MM: machine
model(6)
C/W
C/W
150
1500
+
1. Either or both input voltages must not exceed the magnitude of VCC or VCC-.
2. Short-circuits from the output to VCC can cause excessive heating if VCC > 15V. The maximum output
current is approximately 40 mA independent of the magnitude of VCC. Destructive dissipation can result
from simultaneous short-circuits on all amplifiers.
3. This input current only exists when the voltage at any of the input leads is driven negative. It is due to the
collector-base junction of the input PNP transistor becoming forward biased and thereby acting as input
diode clamps. In addition to this diode action, there is also NPN parasitic action on the IC chip. This
transistor action can cause the output voltages of the op-amps to go to the VCC voltage level (or to ground
for a large overdrive) for the time during which an input is driven negative.
This is not destructive and normal output is restored for input voltages above -0.3 V.
4. Short-circuits can cause excessive heating. Destructive dissipation can result from simultaneous shortcircuits on all amplifiers. These are typical values given for a single layer board (except for TSSOP, a twolayer board).
5. Human body model, 100 pF discharged through a 1.5 k resistor into pin of device.
6. Machine model ESD, a 200 pF cap is charged to the specified voltage, then discharged directly into the IC
with no external series resistor (internal resistor < 5 ), into pin-to-pin of device.
4/19
LM124-LM224-LM324
Electrical characteristics
Electrical characteristics
Table 2.
Symbol
Vio
Parameter
Min.
Typ.
Max.
Unit
5
7
mV
7
9
Iio
30
100
nA
Iib
20
150
300
nA
Avd
50
25
100
SVR
65
65
110
ICC
V/mV
dB
0.7
1.5
1.2
3
0.8
1.5
1.2
3
Vicm
0
0
CMR
70
60
80
Isource
20
40
VCC -1.5
VCC -2
mA
dB
70
mA
5/19
Electrical characteristics
Table 2.
Symbol
Isink
VOH
LM124-LM224-LM324
Parameter
Min.
Typ.
10
12
20
50
26
26
27
27
27
VCC = +5 V, RL = 2 k
Tamb = +25C
Tmin Tamb Tmax
3.5
3
Max.
Unit
mA
A
28
VOL
SR
Slew rate
VCC = 15 V, Vi = 0.5 to 3 V, RL = 2 k, CL = 100 pF,
unity gain
0.4
V/s
GBP
1.3
MHz
THD
0.015
40
nV
-----------Hz
DVio
30
V/C
DIio
10
200
pA/C
en
Vo1/Vo2
Channel separation
1 kHz f 20 kHZ
20
20
mV
(4)
120
dB
6/19
LM124-LM224-LM324
6.1
Package information
DIP14 package
Dimensions
Ref.
Millimeters
Min.
a1
0.51
1.39
Typ.
Inches
Max.
Min.
Typ.
Max.
0.020
1.65
0.055
0.065
0.5
0.020
b1
0.25
0.010
20
0.787
8.5
0.335
2.54
0.100
e3
15.24
0.600
7.1
0.280
5.1
0.201
L
Z
3.3
1.27
0.130
2.54
0.050
0.100
15/19